CN105290642B - A kind of anti-oxidant tin copper series alloy solder - Google Patents
A kind of anti-oxidant tin copper series alloy solder Download PDFInfo
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- CN105290642B CN105290642B CN201510857160.2A CN201510857160A CN105290642B CN 105290642 B CN105290642 B CN 105290642B CN 201510857160 A CN201510857160 A CN 201510857160A CN 105290642 B CN105290642 B CN 105290642B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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Abstract
The present invention relates to a kind of anti-oxidant tin copper series alloy solder, belong to technical field of welding materials.Solve the problems, such as it is the yield for how reducing welding slag and the antioxygenic property for improving solder.A kind of anti-oxidant tin copper series alloy solder is provided, the solder alloy includes the mass percent of following component：Ag：0%~1.0%；Cu：0.1%~1.0%；It is anti-oxidant to help wlding material：0.01%~3.0%；Surplus is Sn and inevitable impurity element.The anti-oxidant tin copper series alloy solder of the present invention can realize the oxide etch effect for improving anti-oxidation protection effect and preventing air and its environment to solder; improve the antioxygenic property of solder; improve welding performance; improve solderability; reduce rosin joint and the fraction defective of sealing-off; so as to reduce the generation of welding slag and oxidizing slag, make product that there is preferable mechanical performance, improve tensile strength, conductance, solderability and elongation percentage.
Description
Technical field
The present invention relates to a kind of anti-oxidant tin copper series alloy solder, belong to technical field of welding materials.
Background technology
With developing rapidly for electronics industry, the requirement more and more higher to electronic product, the solder kind used in electronic product
Class is a lot, and most existing lead-free solder is Sn-Ag, Sn-Cu, Sn-Ag-Cu alloy etc., and its shortcoming is that Sn-Cu fusing points are higher,
Ag contents are higher in Sn-Ag and Sn-Ag-Cu, cause cost of alloy higher.On the other hand, alloy is in fusion process is welded, no
It is evitable to produce metal oxide waste residue, cause substantial amounts of significant loss.If China is every year in electronics lead-free solder
The gun-metal quantity used produces 15% oxidizing slag just up to more than 10 ten thousand tons in welding process, and economic attrition reaches billions of
Member；Further, since caused oxidizing slag can form slag inclusion, oxide-film so as to causing the physics and chemistry of product in welding or fusion process
Performance reduces, and will also result in the process industrial art performance of alloy and reduces, influences the property such as weld strength, electric conductivity, solderability of solder joint
Energy.Therefore, how to solve the generation that metal oxide is prevented in fusion process is welded, and can enough makes to have preferably during welding
Weldering effect is helped to be directly connected to the development of industry.Existing routine typically provides scaling powder in addition, and conventional scaling powder is typically adopted
With being prepared into liquid soldering flux, but it is not easy to deposit using liquid soldering flux.Such as Chinese patent (Authorization Notice No.：
CN101700606B a kind of SAC mischmetal series leadless solder of low silver content) is disclosed, lead-free brazing is by following weight
The component composition of percentage：Ag：0.1%~2.0%；Cu：0.2%~2.5%；Mischmetal：0.1%~3.0%；Remaining is
Sn and the impurity element being difficult to avoid that.It improves SnAgCu alloy microscopic structures, intermetallic compound size, improves mechanics and resists
Croop property.It is that performance is excellent in the advantages of SAC mischmetal series leadless solder addition norium of low silver content
It is different, it is cheap.But still need to just can solve caused welding slag, oxygen in welding process using scaling powder in use
The problems such as slugging.
The content of the invention
The present invention is directed to above problems of the prior art, there is provided a kind of anti-oxidant tin copper series alloy solder, solves
The problem of be how to reduce welding slag yield and improve solder antioxygenic property, realize improve tensile strength, solderability with
And the effect of elongation percentage.
The purpose of the present invention is achieved by following technology, a kind of anti-oxidant tin copper series alloy solder, the alloy
Solder includes the mass percent of following component：
Ag：0%~1.0%；Cu：0.1%~1.0%；It is anti-oxidant to help wlding material：0.01%~3.0%；Surplus be Sn and
Inevitable impurity element.
The anti-oxidant tin copper series alloy solder of the present invention, due to Cu can be formed between the Cu and Sn in solder3Sn5Eutectic is micro-
Thin disperse phase and obtain very high early strength, still, when temperature is more than 100 DEG C, disperse phase can become thick, therefore, in order to
Improve the reliability of the solder of the present invention, can usually improve the performance of solder by adding Ag members, refine disperse phase, and pass through
Plasticity of the solder to the wettability of stainless steel and hard alloy and improvement solder can be improved by adding Ag；Meanwhile the Cu of addition
The mechanical performance of solder alloy can also be improved with Ag.But then, due to directly use the solder in welding process easily
Be oxidized and produce welding slag and oxidizing slag etc. influence caused by performance, by added in solder it is anti-oxidant help wlding material, improve
Anti-oxidation protection acts on and prevented the oxide etch effect of air and its environment to solder, improves the antioxygenic property of solder,
So as to the generation of the welding slag and oxidizing slag of reduction so that product has preferable performance, improve tensile strength, conductance,
Solderability and elongation percentage etc..
In above-mentioned anti-oxidant tin copper series alloy solder, preferably, the mass percent of the Cu be 0.2%~
0.8%.The performance of solder can further be improved, improve the effect of tensile strength.
In above-mentioned anti-oxidant tin copper series alloy solder, preferably, the mass percent of the Ag be 0.1%~
0.8%.The plasticity and wettability of solder can preferably be improved.
In above-mentioned anti-oxidant tin copper series alloy solder, anti-oxidant help wlding material mainly by following matter preferably, described
The raw material of amount percentage is made：
Rare earth addition：30%~70%；Organic acid：2.0%~10%；Ammonium chloride 3.0%~10%；Ammonium fluoride
1.0%~5.0%；Ethyl acetate：1.0%~5.0%；Cosolvent：20%~40%.Above-mentioned help wlding material can by adding
The generation of welding slag and oxidizing slag is reduced, improves antioxygenic property, metal is reached pure, free from admixture, anaerobic in fusion process
Compound, slag and oxide inside raw material metal can be removed, while so as to reach effective scarfing cinder, make the cost of product again
Reduce, moreover it is possible to improve the quality of product, the product for making to finally give has preferable performance.Rare earth addition described above is at least
Containing lanthanum chloride or cerium chloride, and also containing the one or more in yttrium fluoride, scandium fluoride and gadolinium fluoride.Welding can be made
During be easier melt, hence it is evident that improve welding performance, improve solderability, solder joint is full, bright, while also increases electricity
The mechanical performance of road plate weld, reduce rosin joint and the fraction defective of sealing-off.
As further preferably, the rare earth addition is the mixing of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride
Thing, and the lanthanum chloride：Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.2~0.5：0.01~0.05：0.02~
0.04.The one kind or several of organic acid described above in decanedioic acid, hexanedioic acid, stearic acid, maleic acid, salicylic acid and laurate
Kind.Synergy can be played between the ammonium chloride and ammonium fluoride of addition using binary acid, effectively remove the oxidation on pad
Layer, improve the intensity after welding and make solder joint brightness effect good.Meanwhile the addition of ammonium chloride and ammonium chloride can be played and help weldering to make
With increasing the activity of solder；The addition of ethyl acetate can play diluting effect, be advantageous to coming off for welding slag.Cosolvent is general
Using deionized water, can play a part of decontaminating oil removing.
In above-mentioned anti-oxidant tin copper series alloy solder, preferably, being also containing mass percent in the solder
0.02%~0.05% silication magnesium dust.By add magnesium silicide can improve solder can further improve tensile strength and
The effect of elongation percentage.
In above-mentioned anti-oxidant tin copper series alloy solder, preferably, also containing mass percent in the solder alloy
For 0.02%~0.04% molybdenum powder.The solderability of solder can be improved by adding molybdenum powder, improves tensile strength
Energy and the rate of spread, enable the rate of spread to reach 90% or so.
In summary, the present invention compared with prior art, has advantages below：
1. the anti-oxidant tin copper series alloy solder of the present invention, by directly added in solder it is anti-oxidant help wlding material, so as to
The oxide etch effect for improving anti-oxidation protection effect and preventing air and its environment to solder is realized, improves the antioxygen of solder
Change performance, improve welding performance, improve solderability, reduce rosin joint and the fraction defective of sealing-off, so as to reduce welding slag and oxygen
The generation of slugging, make product that there is preferable mechanical performance, improve tensile strength, conductance, solderability and elongation percentage etc..
Realize in welding process without greatly reducing cost and operational sequence using scaling powder in addition.
2. the anti-oxidant tin copper series alloy solder of the present invention, can be on the whole by adding molybdenum powder and silication magnesium dust
Tensile strength properties, elongation percentage and the rate of spread are improved, the rate of spread is reached 90% or so.
Embodiment
Below by specific embodiment, technical scheme is described in further detail, but the present invention is simultaneously
It is not limited to these embodiments.
Embodiment 1
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.1%；Cu：1.0%；It is anti-oxidant to help wlding material：3.0%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：70%；Organic acid：2.0%；Ammonium chloride 3.0%；Ammonium fluoride 1.0%；Ethyl acetate：4.0%；
Cosolvent：20%, wherein, rare earth addition is lanthanum chloride, and organic acid is decanedioic acid, and cosolvent is deionized water.
The present embodiment moderate resistance tin oxide copper series alloy solder can be prepared using following methods：
Raw material is weighed according to above-mentioned mass percent, Sn is added in smelting furnace, is made under conditions of 300 DEG C of temperature of control
It is completely melt；When then, then by temperature being raised to 320 DEG C, metal Ag is added in Sn liquid and is sufficiently stirred to form alloy liquid；Treat
After fusing completely, then Ni metal is added to be stirred continuously in above-mentioned alloy liquid it is completely melt Cu；Finally, helped anti-oxidant
The addition of wlding material on molten metal alloy surface, and be constantly stirred reaction, makes it fully molten with metal alloy liquid
Xie Hou, after cooling, that is, obtain anti-oxidant tin copper series alloy solder.
Embodiment 2
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：1.0%；Cu：0.5%；It is anti-oxidant to help wlding material：1.0%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：30%；Organic acid：10%；Ammonium chloride 10%；Ammonium fluoride 5.0%；Ethyl acetate：5.0%；Help
Solvent：40%, wherein, rare earth addition is scandium chloride, and organic acid is tartaric acid, and cosolvent is deionized water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 1, repeats no more here.
Embodiment 3
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Cu：0.8%；It is anti-oxidant to help wlding material：0.5%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：50%；Organic acid：8%；Ammonium chloride 10%；Ammonium fluoride 8.0%；Ethyl acetate：3.0%；Hydrotropy
Agent：21%, wherein, rare earth addition is gadolinium fluoride, and organic acid is stearic acid, and cosolvent is deionized water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 1, repeats no more here.
Embodiment 4
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.1%；Cu：0.8%；It is anti-oxidant to help wlding material：2.0%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：44%；Organic acid：5.0%；Ammonium chloride 3.0%；Ammonium fluoride 3.0%；Ethyl acetate：5.0%；
Cosolvent：40%, wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and the chlorination
Lanthanum：Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.5：0.01：0.02；Organic acid is tartaric acid and lauric mixing
Thing, and tartaric acid and lauric mass ratio are 1：0.2, cosolvent is deionized water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 1, repeats no more here.
Embodiment 5
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：1.0%；Cu：0.1%；It is anti-oxidant to help wlding material：0.01%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：49%；Organic acid：2.0%；Ammonium chloride 8.0%；Ammonium fluoride 10%；Ethyl acetate：1.0%；Help
Solvent：30%, wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and the lanthanum chloride：
Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.2：0.05：0.04；Organic acid is hexanedioic acid, stearic acid and lauric
Mixture, and hexanedioic acid：Stearic acid：Lauric mass ratio is 1：0.2：0.05, cosolvent is deionized water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 1, repeats no more here.
Embodiment 6
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.8%；Cu：0.6%；It is anti-oxidant to help wlding material：1.5%；Silication magnesium dust：0.02%；Remaining is for Sn and not
Evitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：42%；Organic acid：4.0%；Ammonium chloride 4.0%；Ammonium fluoride 6.0%；Ethyl acetate：4.0%；
Cosolvent：40%, wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and the chlorination
Lanthanum：Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.3：0.04：0.03；Organic acid is hexanedioic acid, cosolvent for go from
Sub- water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is as follows：
Raw material is weighed according to above-mentioned mass percent, Sn is added in smelting furnace, is made under conditions of 300 DEG C of temperature of control
It is completely melt；When then, then by temperature being raised to 320 DEG C, metal Ag is added in Sn liquid and is sufficiently stirred to form alloy liquid；Treat
After fusing completely, then Ni metal is added to be stirred continuously in above-mentioned alloy liquid it is completely melt Cu；Finally, by silication magnesium powder
It is last and it is anti-oxidant help wlding material addition on molten metal alloy surface, and be constantly stirred reaction, make itself and metal
After aluminium alloy fully melts, after cooling, that is, anti-oxidant tin copper series alloy solder is obtained.
Embodiment 7
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.5%；Cu：0.4%；It is anti-oxidant to help wlding material：2.0%；Silication magnesium dust：0.05%；Remaining is for Sn and not
Evitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：60%；Organic acid：7.0%；Ammonium chloride 3.0%；Ammonium fluoride 5.0%；Ethyl acetate：5.0%；
Cosolvent：20%, wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and the chlorination
Lanthanum：Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.2：0.04：0.02；Organic acid is laurate, cosolvent for go from
Sub- water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 6, repeats no more here.
Embodiment 8
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.8%；Cu：0.8%；It is anti-oxidant to help wlding material：2.5%；Molybdenum powder：0.02%；Remaining is Sn and can not kept away
The impurity element exempted from；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：47%；Organic acid：5.0%；Ammonium chloride 3.0%；Ammonium fluoride 10%；Ethyl acetate：5.0%；Help
Solvent：30%, wherein, rare earth addition is lanthanum chloride；Organic acid is hexanedioic acid, and cosolvent is deionized water.
The present embodiment moderate resistance tin oxide copper series alloy solder can be prepared using following methods：
Raw material is weighed according to above-mentioned mass percent, Sn is added in smelting furnace, is made under conditions of 300 DEG C of temperature of control
It is completely melt；When then, then by temperature being raised to 320 DEG C, metal Ag is added in Sn liquid and is sufficiently stirred to form alloy liquid；Treat
After fusing completely, then Ni metal is added to be stirred continuously in above-mentioned alloy liquid it is completely melt Cu, adds molybdenum powder simultaneously
Being stirred continuously melts molybdenum；Finally, the addition of wlding material is helped on molten metal alloy surface, and be stirred continuously by anti-oxidant
Hybrid reaction, after it is fully melted with metal alloy liquid, after cooling, that is, obtain anti-oxidant tin copper series alloy solder.
Embodiment 9
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.5%；Cu：1.0%；It is anti-oxidant to help wlding material：2.0%；Molybdenum powder：0.04%；Remaining is Sn and can not kept away
The impurity element exempted from；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：60%；Organic acid：7.0%；Ammonium chloride 3.0%；Ammonium fluoride 5.0%；Ethyl acetate：5.0%；
Cosolvent：20%, wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and the chlorination
Lanthanum：Cerium chloride：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.2：0.04：0.02；Organic acid is laurate, cosolvent for go from
Sub- water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 9, repeats no more here.
Embodiment 10
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.5%；Cu：1.0%；It is anti-oxidant to help wlding material：2.0%；Silication magnesium dust：0.04%；Molybdenum powder：
0.03%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：60%；Organic acid：7.0%；Ammonium chloride 3.0%；Ammonium fluoride 5.0%；Ethyl acetate：5.0%；
Cosolvent：20%；
Wherein, rare earth addition is the mixture of lanthanum chloride, cerium chloride, yttrium fluoride and gadolinium fluoride, and lanthanum chloride：Chlorination
Cerium：Yttrium fluoride：The mass ratio of gadolinium fluoride is 1：0.2：0.04：0.02；Organic acid is laurate, and cosolvent is deionized water.
The present embodiment moderate resistance tin oxide copper series alloy solder can be prepared using following methods：
Raw material is weighed according to above-mentioned mass percent, Sn is added in smelting furnace, is made under conditions of 300 DEG C of temperature of control
It is completely melt；When then, then by temperature being raised to 320 DEG C, metal Ag is added in Sn liquid and is sufficiently stirred to form alloy liquid；Treat
After fusing completely, then Ni metal is added to be stirred continuously in above-mentioned alloy liquid it is completely melt Cu, adds molybdenum powder simultaneously
Being stirred continuously melts molybdenum；Finally, will carbonization magnesium dust and it is anti-oxidant help wlding material addition in molten metal alloy surface
On, and reaction is constantly stirred, after it is fully melted with metal alloy liquid, after cooling, that is, obtain anti-oxidant tin copper system and close
Gold brazing filler metal.
Embodiment 11
The present embodiment moderate resistance tin oxide copper series alloy solder includes the mass percent of following component：
Ag：0.1%；Cu：0.8%；It is anti-oxidant to help wlding material：1.5%；Silication magnesium dust：0.02%；Molybdenum powder：
0.02%；Remaining is Sn and inevitable impurity element；
Wlding material is helped as an entirety, the anti-oxidant raw material for helping wlding material mainly by following mass percent using anti-oxidant
It is made：
Rare earth addition：37%；Organic acid：2.0%；Ammonium chloride 10%；Ammonium fluoride 10%；Ethyl acetate：1.0%；Help
Solvent：40%；
Wherein, rare earth addition is the mixture of lanthanum chloride and cerium chloride, and lanthanum chloride：The mass ratio of cerium chloride is 1：
0.3；Organic acid is hexanedioic acid, and cosolvent is deionized water.
The specific preparation method of the anti-oxidant tin copper series alloy solder of the present embodiment is consistent with embodiment 10, no longer superfluous here
State.
Comparative example 1
This comparative example is directly not add the anti-oxidant respective alloy solder for helping wlding material, in particular, this comparative example
Middle solder alloy includes the mass percent of following component：
Ag：0.1%；Cu：0.8%；Surplus is Sn and inevitable impurity element.
Solder alloy can be prepared using following methods in this comparative example：
Raw material is weighed according to above-mentioned mass percent, Sn is added in smelting furnace, is made under conditions of 300 DEG C of temperature of control
It is completely melt；When then, then by temperature being raised to 320 DEG C, metal Ag is added in Sn liquid and is sufficiently stirred to form alloy liquid；Treat
After fusing completely, then Ni metal is added to be stirred continuously in above-mentioned alloy liquid it is completely melt Cu, after cooling, that is, obtains tin
Silver system solder alloy.
Comparative example 2
This comparative example, which is similarly, does not directly add the anti-oxidant respective alloy solder for helping wlding material, mainly makes Ag's and Cu
Content reaches the upper limit and is embodied, and in particular, solder alloy includes the quality percentage of following component in this comparative example
Than：
Ag：1.0%；Cu：1.0%；Surplus is Sn and inevitable impurity element.
The specific preparation method of solder alloy is identical with comparative example 1 in this comparative example, repeats no more here.
Comparative example 3
This comparative example is with Chinese patent (Authorization Notice No.：CN101700606B the SAC mixing of low silver content disclosed in)
The corresponding proportioning of rare earth series leadless solder is embodied, and specific formula is as follows：
Ag：0.6%；Cu：0.8%；Mischmetal：0.25%；Wherein, mischmetal is La-Ce base mischmetals, wherein
Each component weight percent content is in mischmetal：La ＞ 28.0%, Ce ＞ 50%, Pr ＞ 4%, Nd ＞ 15%, Fe ＜
0.2%, P ＜ 0.01%, Sm ＜ 0.3%, Mg ＜ 0.1%, S ＜ 0.01%, Zn ＜ 0.1%；Surplus is Sn and is difficult to avoid that
Impurity element.
The SAC mischmetal series leadless solder of low silver content is prepared using following methods in this comparative example：
By potassium chloride: potassium oxide=1.7: the salt-mixture of 0.8 (mass ratio) adds smelting furnace, after being dissolved at 580 DEG C, according to
The mass percent of above-mentioned each element adds the tin of percentage by weight 98.35%；After tin is completely melt, by mass percent
0.6% Ag and the Cu of mass percent 0.8% are added among tin liquor, stirring, form alloy；It is by mass percent simultaneously
0.25% La/Ce base mischmetals are rapidly added in above-mentioned alloy liquid, and are stirred continuously, untill rare earth is completely melt；
1.5 hours are incubated at 460 DEG C, stirring, homogenizes alloy.Cooling, remove after alloy graining surface chlorination potassium, potassium oxide
Salt-mixture, that is, obtain the SAC mischmetal series leadless solder of low silver content.
Randomly select the respective alloy obtained in the comparative example for the anti-oxidant tin copper series alloy solder that above-described embodiment obtains
Solder carries out performance test, and specific test result is as shown in table 1 below.
Table 1：
From table 1 it follows that this anti-oxidant tin copper series alloy solder not only has good tensile strength and elongation percentage,
And the rate of spread is all larger.In addition, as can be seen that the silication magnesium dust and molybdenum powder that add from embodiment 10 and embodiment 11
Between there is preferable compatibility, the performance of solder can be improved on the whole.Also there is bright, the full effect of solder joint.Can
See, go for the surface-assembled of microelectronic industry.Although and it can be seen that from comparative example 1 and 2, tensile strength properties
Suitable level can be reached, but especially elongation percentage and rate of spread performance are nothing like the effect of the present invention on overall performance,
And during actual welding, when being welded using the solder of comparative example 1 and comparative example 2, easily there is welding slag and oxidizing slag
Situation, the bright property and plumpness of solder joint are all poor, and, it is necessary to aid in constantly soaking anti-oxidant scaling powder progress in welding process
Coordinate welding, operating process is excessively miscellaneous, is not easy to operate.
Specific embodiment described in the present invention is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
It is skilled to this area although having been made a detailed description to the present invention and being cited some specific embodiments
For technical staff, as long as it is obvious that can make various changes or correct without departing from the spirit and scope of the present invention.
Claims (5)
1. a kind of anti-oxidant tin copper series alloy solder, it is characterised in that the solder alloy includes the mass percent of following component：
Ag：0.1%~0.8%；Cu：0.1%~1.0%；It is anti-oxidant to help wlding material：0.01%~3.0%；Silication magnesium dust：
0.02%~0.05%；Molybdenum powder：0.02%~0.04%；Surplus is Sn and inevitable impurity element.
2. anti-oxidant tin copper series alloy solder according to claim 1, it is characterised in that described anti-oxidant to help wlding material main
It is made up of the raw material of following mass percent：
Rare earth addition：30%~70%；Organic acid：2.0%~10%；Ammonium chloride 3.0%~10%；Ammonium fluoride 1.0%~
5.0%；Ethyl acetate：1.0%~5.0%；Cosolvent：20%~40%.
3. anti-oxidant tin copper series alloy solder according to claim 2, it is characterised in that the rare earth addition at least contains
Lanthanum chloride or cerium chloride, and also containing the one or more in yttrium fluoride, scandium fluoride and gadolinium fluoride.
4. anti-oxidant tin copper series alloy solder according to claim 2, it is characterised in that the organic acid be selected from decanedioic acid,
One or more in hexanedioic acid, stearic acid, maleic acid, salicylic acid and laurate.
5. anti-oxidant tin copper series alloy solder according to claim 3, it is characterised in that the cosolvent is deionized water.
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| CN107322185A (en) * | 2017-08-19 | 2017-11-07 | 安徽鼎恒再制造产业技术研究院有限公司 | Gate valve built-up welding continuous casting casting rod and its welding procedure |
| CN114833490B (en) * | 2022-06-02 | 2024-04-05 | 云南锡业集团（控股）有限责任公司研发中心 | Method for improving oxidation resistance of tin raw material or tin-based solder |
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