CN104384747A - Cold-storage-free soldering tin paste and preparing method of cold-storage-free soldering tin paste - Google Patents
Cold-storage-free soldering tin paste and preparing method of cold-storage-free soldering tin paste Download PDFInfo
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- CN104384747A CN104384747A CN201410529403.5A CN201410529403A CN104384747A CN 104384747 A CN104384747 A CN 104384747A CN 201410529403 A CN201410529403 A CN 201410529403A CN 104384747 A CN104384747 A CN 104384747A
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- paste
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- weld
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses cold-storage-free soldering tin paste and a preparing method of the cold-storage-free soldering tin paste. The cold-storage-free soldering tin paste consists of 87.5 to 89 percent of lead-free soldering tin powder and 11 to 12.5 percent of rosin-based soldering aid paste through being metered by in percentage by mass. The rosin-based soldering aid paste comprises polylactic acid. The lead-free soldering tin powder does not contain lead, and the rosin-based soldering aid paste does not contain halogens. The prepared cold-storage-free soldering tin paste has the advantages that the welding performance is good, the reliability is higher, the post-soldering residue is less, and the like. The adopted polylactic acid replaces the traditional organic acid activating agents, the cold-storage-free characteristic is realized, the cold-storage-free soldering tin paste can be stored for more than half a year in a room temperature environment, and a great practical value is realized.
Description
Technical field
The present invention relates to the solder(ing) paste of welding electronic installation, refer to that one is exempted to refrigerate solder(ing) paste especially, the invention still further relates to a kind of preparation method exempting to refrigerate solder(ing) paste.
Background technology
Solder(ing) paste inside generally all has active material, especially organic acid for activating agent, and these active materials can play the effect of removing metal oxide film surface, and ability and the temperature of these active material release bioactive agents have relation.Temperature is lower, and active release is fainter.In order to ensure the quality of tin cream, be unlikely to just in inside, violent reaction occur when not having to use and cause tin cream internal chemical ingredient spoilage, tin cream should be preserved at low ambient temperatures, and temperature should control at 1-10 DEG C, preferably 5-10 DEG C.Temperature is too low also can have an impact to the quality of tin cream.
General, tin cream on the market can preserve about 6 months at low ambient temperatures at present, if the storage time more than 6 months, tin cream must carry out strict production test.Only have and determine that tin cream can use by the solder(ing) paste of production test.
Summary of the invention
An object of the present invention is to propose one to exempt to refrigerate solder(ing) paste, under efficiently solving common solder(ing) paste low temperature environment, storage time is short, cannot carry out the problem of storing at normal temperatures.
Another object of the present invention proposes a kind of preparation method exempting to refrigerate solder(ing) paste.
Technical scheme of the present invention is achieved in that one is exempted to refrigerate solder(ing) paste, with gross mass percentages, is made up of the Pb-free coating glass putty of 87.5-89% and the abietyl weld-aiding cream of 11-12.5%; Described abietyl weld-aiding cream comprises PLA.
Described abietyl weld-aiding cream additive PLA instead of the organic acid for activating agent in traditional weld-aiding cream, and can carry out thermal decomposition at about 200 DEG C, its product is lactic acid, not halogen-containing, and this product can play the effect of organic acid for activating agent in traditional weld-aiding cream.Highly stable, no acidic when PLA is below its heat decomposition temperature, and then the chemical reaction of elimination and solder powder alloy.
Preferably, described PLA accounts for the mass percent of described abietyl weld-aiding cream is 15-20%.
Preferably, with Pb-free solder powder mass percent, described Pb-free coating glass putty is made up of each component of following mass percent: silver (Ag) 0.5-3.5%, copper (Cu) 0.3-0.9%, chromium (Cr) 0.1-0.8%, all the other are tin (Sn).
Preferably, with abietyl weld-aiding cream mass percent, described abietyl weld-aiding cream is made up of each component of following mass percent: PLA 15-20%, organic solvent 18-23%, paste making agent 3.5-5.5%, surfactant 3-5%, corrosion inhibiter 2-5%, thixotropic agent 2-4%, glycidol ether 2-4.5%, paraffin 1.5-2.5%, all the other are modified rosin.
Wherein, described thixotropic agent is one or both the mixture in rilanit special, fatty glyceride, N, N-ethylenebis stearic amide, and its effect is the printing performance improving soldering paste.
Wherein, described paraffin is a kind of stabilizing agent, and its effect strengthens the stability that modified rosin becomes cream.
Wherein, described glycidol ether can delay the aging of solder(ing) paste, improves stability and the weldability of solder(ing) paste.
Preferably, described organic solvent is the one in the mixture of glycerine and propylene glycol monomethyl ether, glycerine and two sweet ether monobutyl ethers or glycerine and diethyl carbitol.
Preferably, described surfactant is OPEO.
Preferably, described corrosion inhibiter is triethanolamine, and effect suppresses oxidation, reduces the corrosivity of weld-aiding cream.
Preferably, described modified rosin is one or more in newtrex, Foral, perhydrogenated rosin, leadless rosin.
Preferably, described glycidyl ether compound is one or more compositions of propyl glycidyl ether, phenyl glycidyl ether and 2-ethyl ether.
The described preparation method exempting from refrigeration solder(ing) paste, comprises the following steps:
One: the preparation of Pb-free coating glass putty
Described Pb-free coating glass putty is produced by corresponding proportion by ultrasonic atomizatio equipment;
Two: the preparation of abietyl weld-aiding cream
Organic solvent and PLA are placed in the reactor of belt stirrer, are heated to 110 DEG C-130 DEG C, stir and make it mix, after treating that solid constituent dissolves completely, add modified rosin; Corrosion inhibiter, glycidyl ether compound, thixotropic agent and surfactant is added after it dissolves completely; After it mixes, add paraffin and paste making agent, stir to clarify transparence, leave standstill, be cooled to 18-25 DEG C to be abietyl weld-aiding cream;
Three: the Pb-free coating glass putty of step one is mixed in 87.5-89:11-12.5 ratio with the abietyl weld-aiding cream of step 2, after stirring fully mixing, namely become of the present invention exempting from and refrigerate solder(ing) paste.
Beneficial effect of the present invention is:
Provided by the invention exempting from refrigerates solder(ing) paste, and soldering tin powder is wherein not leaded, and abietyl weld-aiding cream is not halogen-containing, safety, environmental protection.In abietyl weld-aiding cream, use PLA to instead of traditional organic acid for activating agent, obtained solder(ing) paste can at room temperature be preserved, and has advantages such as exempting from refrigeration, good welding performance, reliability is higher, postwelding residue is less.Of the present invention exempt from refrigeration solder(ing) paste use time without the need to spended time activity recovery, easy to use; Stored at room temperature more than 6 months still can normally use, and extends the pot-life, has great practical value.
Detailed description of the invention
For understanding the present invention better; below by following examples, elaboration concrete is further done to the present invention; but unintelligible is limitation of the invention; for some nonessential improvement and adjustment that those skilled in the art does according to foregoing invention content, be also considered as dropping in protection scope of the present invention.
Embodiment 1
According to content provided by the invention, obtained the exempting from of inventor refrigerates solder(ing) paste 1, wherein the proportioning of each component and preparation process as follows:
Pb-free coating glass putty 1 is made up of each component of following mass percent: silver (Ag) 4.45g, copper (Cu) 2.67g, chromium (Cr) 8.9g, tin (Sn) 881.99g;
Abietyl weld-aiding cream 1 is made up of each component of following quality: PLA 16.5g, glycerine 8.8g, propylene glycol monomethyl ether 11g, paste making agent 3.85g, OPEO 3.3g, triethanolamine 2.2g, rilanit special 2.2g, propyl glycidyl ether 2.2g, paraffin 1.65g newtrex 58.3g;
The described preparation method exempting from refrigeration solder(ing) paste, comprises the following steps:
One: the preparation of Pb-free coating glass putty 1
Pb-free coating glass putty 1 is produced by above-mentioned formula ratio by ultrasonic atomizatio equipment.
Two: the preparation of abietyl weld-aiding cream 1
By formula ratio, glycerine, propylene glycol monomethyl ether and PLA are placed in the reactor of belt stirrer, are heated to 110 DEG C, stir and make it mix, after treating that solid constituent dissolves completely, add newtrex; Triethanolamine, propyl glycidyl ether, thixotropic agent and OPEO is added after it dissolves completely; After it mixes, add paraffin and paste making agent, stir to clarify transparence, leave standstill, be cooled to 18 DEG C to be abietyl weld-aiding cream 1;
Three: the Pb-free coating glass putty 1 of step one is mixed with the abietyl weld-aiding cream 1 of step 2, after stirring fully mixing, namely become of the present invention exempting from and refrigerate solder(ing) paste 1.
Embodiment 2
According to content provided by the invention, obtained the exempting from of inventor refrigerates solder(ing) paste 2, wherein the proportioning of each component and preparation process as follows:
Pb-free coating glass putty 2 is made up of each component of following quality: silver (Ag) 30.625g, copper (Cu) 7.875g, chromium (Cr) 7g, tin (Sn) 829.5g;
Abietyl weld-aiding cream 2 is made up of each component of following mass percent: PLA 25g, glycerine 12.5g, two sweet ether monobutyl ether 16.25g, paste making agent 6.875g, OPEO 6.25g, triethanolamine 6.25g, fatty glyceride 5g, phenyl glycidyl ether 5.625g, paraffin 3.125g, Foral 38.125g;
The described preparation method exempting from refrigeration solder(ing) paste, comprises the following steps:
One: the preparation of Pb-free coating glass putty 2
Pb-free coating glass putty 2 is produced according to the above ratio by ultrasonic atomizatio equipment.
Two: the preparation of abietyl weld-aiding cream 2
By formula ratio, glycerine, two sweet ether monobutyl ethers and PLA are placed in the reactor of belt stirrer, are heated to 130 DEG C, stir and make it mix, after treating that solid constituent dissolves completely, add Foral; Triethanolamine, phenyl glycidyl ether, thixotropic agent and OPEO is added after it dissolves completely; After it mixes, add paraffin and paste making agent, stir to clarify transparence, leave standstill, be cooled to 20 DEG C to be abietyl weld-aiding cream 2;
Three: the Pb-free coating glass putty 2 of step one is mixed with the abietyl weld-aiding cream 2 of step 2, after stirring fully mixing, namely become of the present invention exempting from and refrigerate solder(ing) paste 2.
Embodiment 3
According to content provided by the invention, obtained the exempting from of inventor refrigerates solder(ing) paste 3, wherein the proportioning of each component and preparation process as follows:
Pb-free coating glass putty 3 is made up of each component of following quality: silver (Ag) 17.6g; Copper (Cu) 5.28g; Chromium (Cr) 3.52g, tin (Sn) 853.6g;
Abietyl weld-aiding cream 3 is made up of each component of following mass percent: PLA 21g, glycerine 10.2g, diethyl carbitol 14.4g, paste making agent 5.4g, OPEO 4.8g, triethanolamine 4.2g, N, N-ethylenebis stearic amide 3.6g, phenyl glycidyl ether 1.8g, 2-ethyl ether 2.4g, paraffin 2.4g, perhydrogenated rosin 25.8g, leadless rosin 24g;
The described preparation method exempting from refrigeration solder(ing) paste, comprises the following steps:
One: the preparation of Pb-free coating glass putty 3
Pb-free coating glass putty 3 is produced by above-mentioned formula ratio by ultrasonic atomizatio equipment;
Two: the preparation of abietyl weld-aiding cream 3
By formula ratio, glycerine, diethyl carbitol and PLA are placed in the reactor of belt stirrer, are heated to 120 DEG C, stir and make it mix, after treating that solid constituent dissolves completely, add perhydrogenated rosin and leadless rosin; Triethanolamine, phenyl glycidyl ether, 2-ethyl ether, thixotropic agent and OPEO is added after it dissolves completely; After it mixes, add paraffin and paste making agent, stir to clarify transparence, leave standstill, be cooled to 25 DEG C to be abietyl weld-aiding cream 3;
Three: the Pb-free coating glass putty 3 of step one is mixed with the abietyl weld-aiding cream 3 of step 2, after being uniformly mixed, namely becoming of the present invention exempting from and refrigerate solder(ing) paste 3.
In above embodiment, rilanit special, fatty glyceride, N, N-ethylenebis stearic amide can be replaced the mixture of in above material any two kinds; Newtrex, Foral, perhydrogenated rosin, leadless rosin to can be replaced in above material two or more mixture arbitrarily.
Of the present invention exempting from refrigerates solder(ing) paste quality investigation
At room temperature preserve respectively gained in above 3 embodiments exempt from refrigerate solder(ing) paste, test its matter welding effect after 6 months.
Through result test, exempt to refrigerate solder(ing) paste 1, exempt to refrigerate solder(ing) paste 2, exempt to refrigerate solder(ing) paste 3 room temperature environment under the time that can store still can normally use all after six months.After testing, the solder(ing) paste of 3 embodiment gained has good printing performance, and printing without subsiding, bridging, draws sharp phenomenon, and physical stability, bronze mirror corrosion test, viscosity are all qualified, can meet the requirement of high-end product surface encapsulation; Soldering paste postwelding residue is water white membranoid substance, stablizes nonhygroscopic under normal temperature, without the need to cleaning, is suitable for general electronic products and high-end electronic product surface encapsulation requirement.Printed board is after welding and after powering up and carrying out moisture test, and printed board is after welding and after powering up and carrying out moisture test, and the insulaion resistance of 3 embodiments is all greater than 1.8 × 10
9Ω, the rate of spread is all more than or equal to 75%.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. exempt to refrigerate a solder(ing) paste, it is characterized in that: with gross mass percentages, be made up of the Pb-free coating glass putty of 87.5-89% and the abietyl weld-aiding cream of 11-12.5%; Described abietyl weld-aiding cream comprises PLA.
2. exempt from as claimed in claim 1 to refrigerate solder(ing) paste, it is characterized in that: the mass percent that described PLA accounts for described abietyl weld-aiding cream is 15-20%.
3. exempt from as claimed in claim 1 to refrigerate solder(ing) paste, it is characterized in that, with Pb-free solder powder mass percent, described Pb-free coating glass putty is made up of each component of following mass percent: silver (Ag) 0.5-3.5%, copper (Cu) 0.3-0.9%, chromium (Cr) 0.1-0.8%, all the other are tin (Sn).
4. exempt from as claimed in claim 1 to refrigerate solder(ing) paste, it is characterized in that, with abietyl weld-aiding cream mass percent, described abietyl weld-aiding cream is made up of each component of following mass percent: PLA 15-20%, organic solvent 18-23%, paste making agent 3.5-5.5%, surfactant 3-5%, corrosion inhibiter 2-5%, thixotropic agent 2-4%, glycidyl ether compound 2-4.5%, paraffin 1.5-2.5%, all the other are modified rosin.
5. exempt from as claimed in claim 4 to refrigerate solder(ing) paste, it is characterized in that: described organic solvent is mixture, be specially glycerine and propylene glycol monomethyl ether, glycerine and two sweet ether monobutyl ether or glycerine diethyl carbitols.
6. exempt from as claimed in claim 4 to refrigerate solder(ing) paste, it is characterized in that: described surfactant is OPEO.
7. exempt from as claimed in claim 4 to refrigerate solder(ing) paste, it is characterized in that: described corrosion inhibiter is triethanolamine.
8. exempt from as claimed in claim 4 to refrigerate solder(ing) paste, it is characterized in that: described modified rosin is one or more in newtrex, Foral, perhydrogenated rosin, leadless rosin.
9. exempt from as claimed in claim 4 to refrigerate solder(ing) paste, it is characterized in that: described glycidyl ether compound is one or more compositions in propyl glycidyl ether, phenyl glycidyl ether, 2-ethyl ether.
10. exempting from as described in any one of claim 1 to 9 refrigerates the preparation method of solder(ing) paste, it is characterized in that, comprises the following steps:
Step one: the preparation of Pb-free coating glass putty
Described Pb-free coating glass putty is produced by corresponding proportion by ultrasonic atomizatio equipment;
Step 2: the preparation of abietyl weld-aiding cream
Organic solvent and PLA are placed in the reactor of belt stirrer, are heated to 110 DEG C-130 DEG C, stir and make it mix, after treating that solid constituent dissolves completely, add modified rosin; Corrosion inhibiter, glycidyl ether compound, thixotropic agent and surfactant is added after it dissolves completely; After it mixes, add paraffin and paste making agent, stir to clarify transparence, leave standstill, be cooled to 18-25 DEG C to be abietyl weld-aiding cream;
Step 3: mixed in proportion with the abietyl weld-aiding cream of step 2 by the Pb-free coating glass putty of step one, after stirring fully mixing, namely becomes and exempts to refrigerate solder(ing) paste.
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Cited By (4)
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| CN105689914A (en) * | 2016-04-08 | 2016-06-22 | 深圳市博士达焊锡制品有限公司 | Tin paste and preparation method thereof |
| CN108381056A (en) * | 2018-03-29 | 2018-08-10 | 苏州国通科技有限公司 | A kind of solder(ing) paste and preparation method thereof |
| CN110202292A (en) * | 2019-05-19 | 2019-09-06 | 何雪连 | A kind of die bond solder paste and preparation method thereof for LED encapsulation |
| CN114505616A (en) * | 2022-03-23 | 2022-05-17 | 深圳市汉尔信电子科技有限公司 | Solder paste for microwave welding and preparation method and welding method thereof |
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| CN110202292A (en) * | 2019-05-19 | 2019-09-06 | 何雪连 | A kind of die bond solder paste and preparation method thereof for LED encapsulation |
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| CN114505616A (en) * | 2022-03-23 | 2022-05-17 | 深圳市汉尔信电子科技有限公司 | Solder paste for microwave welding and preparation method and welding method thereof |
| CN114505616B (en) * | 2022-03-23 | 2024-04-26 | 深圳市汉尔信电子科技有限公司 | Soldering paste for microwave welding and preparation method and welding method thereof |
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