CN104384747B - One kind exempts from refrigeration solder(ing) paste and preparation method thereof - Google Patents
One kind exempts from refrigeration solder(ing) paste and preparation method thereof Download PDFInfo
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- CN104384747B CN104384747B CN201410529403.5A CN201410529403A CN104384747B CN 104384747 B CN104384747 B CN 104384747B CN 201410529403 A CN201410529403 A CN 201410529403A CN 104384747 B CN104384747 B CN 104384747B
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- paste
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- weld
- abietyl
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
Exempt from refrigeration solder(ing) paste and preparation method thereof the invention discloses one kind, this exempts from refrigeration solder(ing) paste with gross mass percentages, is made up of 87.5 89% Pb-free coating glass putty and 11 12.5% abietyl weld-aiding cream；The abietyl weld-aiding cream includes PLA.The soldering tin powder is not leaded, and selected abietyl weld-aiding cream is free of halogen.Obtained refrigeration solder(ing) paste of exempting from has the advantages that good welding performance, reliability be higher, postwelding residue is less, the PLA of use instead of traditional organic acid for activating agent, the time of more than half a year can be preserved under the characteristics of with refrigeration can be exempted from, room temperature environment, is had great practical value.
Description
Technical field
The present invention relates to the solder(ing) paste of welding electronic installation, particularly relate to one kind and exempt to refrigerate solder(ing) paste, the invention further relates to
A kind of preparation method for exempting to refrigerate solder(ing) paste.
Background technology
General all active material inside solder(ing) paste, especially organic acid for activating agent, these active materials can be played
The effect of metal oxide film surface is removed, ability and the temperature of these active material release bioactive agents have relation.Temperature is lower, living
The release of property is fainter.In order to ensure the quality of tin cream, it is unlikely to just internally to occur acutely when not using
React and cause tin cream internal chemical ingredient spoilage, tin cream should be preserved at low ambient temperatures, temperature should be controlled at 1-10 DEG C,
Preferably 5-10 DEG C.Temperature is too low also to produce influence to the quality of tin cream.
General, tin cream on the market can be preserved 6 months or so at low ambient temperatures at present, if it exceeds the storage of 6 months
Tibetan time, tin cream must carry out strict production test.Only determine that tin cream be able to can be used by the solder(ing) paste of production test.
The content of the invention
It is an object of the invention to propose one kind to exempt to refrigerate solder(ing) paste, common solder(ing) paste low temperature environment is efficiently solved
Lower storage time is short, it is impossible to the problem of being stored at normal temperatures.
Another object of the present invention is to propose a kind of preparation method for exempting to refrigerate solder(ing) paste.
The technical proposal of the invention is realized in this way：One kind is exempted to refrigerate solder(ing) paste, with gross mass percentages, by
87.5-89% Pb-free coating glass putty and 11-12.5% abietyl weld-aiding cream composition；The abietyl weld-aiding cream includes poly- breast
Acid.
Described abietyl weld-aiding cream additive PLA instead of the organic acid for activating agent in traditional weld-aiding cream, Ke Yi
200 DEG C or so are thermally decomposed, and its product is lactic acid, without halogen, and the product can play organic acid in traditional weld-aiding cream and live
The effect of agent.It is highly stable when PLA is below its heat decomposition temperature, it is no acidic, and then eliminate and solder powder alloy
Chemical reaction.
It is preferred that, the mass percent that the PLA accounts for the abietyl weld-aiding cream is 15-20%.
It is preferred that, with Pb-free solder silty amount percentages, the Pb-free coating glass putty by following mass percent each group
It is grouped into：Silver (Ag) 0.5-3.5%, copper (Cu) 0.3-0.9%, chromium (Cr) 0.1-0.8%, remaining is tin (Sn).
It is preferred that, in terms of abietyl weld-aiding cream mass percent, the abietyl weld-aiding cream is by following mass percent
Each component is constituted：PLA 15-20%, organic solvent 18-23%, paste making agent 3.5-5.5%, surfactant 3-5%, inhibition
Agent 2-5%, thixotropic agent 2-4%, glycidol ether 2-4.5%, paraffin 1.5-2.5%, remaining is modified rosin.
Wherein, the thixotropic agent is one in rilanit special, fatty glyceride, N, N- ethylenebis stearic amides
Kind or two kinds of mixture, it is to improve the printing performance of soldering paste that it, which is acted on,.
Wherein, the paraffin is a kind of stabilizer, and it is the stability for strengthening modified rosin into cream that it, which is acted on,.
Wherein, described glycidol ether can delay the aging of solder(ing) paste, improve the stability and weldability of solder(ing) paste.
It is preferred that, described organic solvent is glycerine and propylene glycol monomethyl ether, glycerine and two sweet ether monobutyl ethers or third
One kind in the mixture of triol and diethyl carbitol.
It is preferred that, the surfactant is OPEO.
It is preferred that, the corrosion inhibiter is triethanolamine, and effect is to suppress oxidation, reduces the corrosivity of weld-aiding cream.
It is preferred that, described modified rosin is one kind in newtrex, hydrogenated rosin, perhydrogenated rosin, leadless rosin
Or it is a variety of.
It is preferred that, described glycidyl ether compound is propyl glycidyl ether, phenyl glycidyl ether and 2- ethyls
One or more compositions of glycidol ether.
The preparation method for exempting to refrigerate solder(ing) paste, comprises the following steps：
One：The preparation of Pb-free coating glass putty
Described Pb-free coating glass putty is produced by corresponding proportion by ultrasonic atomizatio equipment；
Two：The preparation of abietyl weld-aiding cream
Organic solvent and PLA are placed in the reactor of belt stirrer, 110 DEG C -130 DEG C are heated to, stirring mixes it
Close uniform, after solid constituent is completely dissolved, add modified rosin；Corrosion inhibiter, glycidol are added after it is completely dissolved
Ether compound, thixotropic agent and surfactant；Paraffin and paste making agent are added after it is well mixed, transparence is stirred to clarify,
Stand, it is abietyl weld-aiding cream to be cooled to 18-25 DEG C；
Three：The Pb-free coating glass putty of step one and the abietyl weld-aiding cream of step 2 are pressed into 87.5-89：11-12.5 ratio is mixed
Close, it is agitated be sufficiently mixed after, become the present invention exempt from refrigerate solder(ing) paste.
Beneficial effects of the present invention are：
What the present invention was provided exempts to refrigerate solder(ing) paste, and soldering tin powder therein is not leaded, and abietyl weld-aiding cream is free of halogen, peace
Entirely, it is environmentally friendly.In abietyl weld-aiding cream, traditional organic acid for activating agent is instead of using PLA, obtained solder(ing) paste can be in room
Temperature is lower to be preserved, and has the advantages that to exempt from that refrigeration, good welding performance, reliability be higher, postwelding residue is less.It is of the present invention to exempt from
Refrigeration solder(ing) paste need not spend time activity recovery when using, easy to use；Storage still can normally make for more than 6 months at room temperature
With extending the pot-life, have great practical value.
Embodiment
To more fully understand the present invention, further specific elaboration, but not is made to the present invention below by following examples
Limitation of the invention is can be regarded as, some made for those skilled in the art according to foregoing invention content are nonessential
Improve with adjusting, be also considered as being within the scope of the present invention.
Embodiment 1
The content provided according to the present invention, inventor, which is made, to exempt to refrigerate solder(ing) paste 1, when prepares wherein matching somebody with somebody for each component
Journey is as follows：
Pb-free coating glass putty 1 is made up of each component of following mass percent：Silver (Ag) 4.45g, copper (Cu) 2.67g, chromium
(Cr) 8.9g, tin (Sn) 881.99g；
Abietyl weld-aiding cream 1 is made up of each component of following quality：PLA 16.5g, glycerine 8.8g, propane diols list first
Ether 11g, paste making agent 3.85g, OPEO 3.3g, triethanolamine 2.2g, rilanit special 2.2g, propyl group shrink sweet
Oily ether 2.2g, paraffin 1.65g newtrexes 58.3g；
The preparation method for exempting to refrigerate solder(ing) paste, comprises the following steps：
One：The preparation of Pb-free coating glass putty 1
Pb-free coating glass putty 1 is produced by above-mentioned formula ratio by ultrasonic atomizatio equipment.
Two：The preparation of abietyl weld-aiding cream 1
By formula ratio, glycerine, propylene glycol monomethyl ether and PLA are placed in the reactor of belt stirrer, are heated to
110 DEG C, stirring is well mixed it, after solid constituent is completely dissolved, and adds newtrex；Added after it is completely dissolved
Triethanolamine, propyl glycidyl ether, thixotropic agent and OPEO；Paraffin is added after it is well mixed and into cream
Agent, stirs to clarify transparence, stands, and it is abietyl weld-aiding cream 1 to be cooled to 18 DEG C；
Three：The Pb-free coating glass putty 1 of step one is mixed with the abietyl weld-aiding cream 1 of step 2, it is agitated be sufficiently mixed after,
Become the present invention exempts from refrigeration solder(ing) paste 1.
Embodiment 2
The content provided according to the present invention, inventor, which is made, to exempt to refrigerate solder(ing) paste 2, when prepares wherein matching somebody with somebody for each component
Journey is as follows：
Pb-free coating glass putty 2 is made up of each component of following quality：Silver (Ag) 30.625g, copper (Cu) 7.875g, chromium (Cr)
7g, tin (Sn) 829.5g；
Abietyl weld-aiding cream 2 is made up of each component of following mass percent：PLA 25g, glycerine 12.5g, two is sweet
Ether monobutyl ether 16.25g, paste making agent 6.875g, OPEO 6.25g, triethanolamine 6.25g, fatty glyceride
5g, phenyl glycidyl ether 5.625g, paraffin 3.125g, hydrogenated rosin 38.125g；
The preparation method for exempting to refrigerate solder(ing) paste, comprises the following steps：
One：The preparation of Pb-free coating glass putty 2
Pb-free coating glass putty 2 is produced by ultrasonic atomizatio equipment according to the above ratio.
Two：The preparation of abietyl weld-aiding cream 2
By formula ratio, glycerine, two sweet ether monobutyl ethers and PLA are placed in the reactor of belt stirrer, are heated to
130 DEG C, stirring is well mixed it, after solid constituent is completely dissolved, and adds hydrogenated rosin；Added after it is completely dissolved
Triethanolamine, phenyl glycidyl ether, thixotropic agent and OPEO；Paraffin is added after it is well mixed and into cream
Agent, stirs to clarify transparence, stands, and it is abietyl weld-aiding cream 2 to be cooled to 20 DEG C；
Three：The Pb-free coating glass putty 2 of step one is mixed with the abietyl weld-aiding cream 2 of step 2, it is agitated be sufficiently mixed after,
Become the present invention exempts from refrigeration solder(ing) paste 2.
Embodiment 3
The content provided according to the present invention, inventor, which is made, to exempt to refrigerate solder(ing) paste 3, when prepares wherein matching somebody with somebody for each component
Journey is as follows：
Pb-free coating glass putty 3 is made up of each component of following quality：Silver (Ag) 17.6g；Copper (Cu) 5.28g；Chromium (Cr)
3.52g, tin (Sn) 853.6g；
Abietyl weld-aiding cream 3 is made up of each component of following mass percent：PLA 21g, glycerine 10.2g, two is sweet
Diethylene glycol diethyl ether 14.4g, paste making agent 5.4g, OPEO 4.8g, triethanolamine 4.2g, N, N- ethylenebis stearic acid
Acid amides 3.6g, phenyl glycidyl ether 1.8g, 2- ethyl ether 2.4g, paraffin 2.4g, perhydrogenated rosin 25.8g, nothing
Lead rosin 24g；
The preparation method for exempting to refrigerate solder(ing) paste, comprises the following steps：
One：The preparation of Pb-free coating glass putty 3
Pb-free coating glass putty 3 is produced by above-mentioned formula ratio by ultrasonic atomizatio equipment；
Two：The preparation of abietyl weld-aiding cream 3
By formula ratio, glycerine, diethyl carbitol and PLA are placed in the reactor of belt stirrer, are heated to
120 DEG C, stirring is well mixed it, after solid constituent is completely dissolved, and adds perhydrogenated rosin and leadless rosin；Treat that its is complete
Triethanolamine, phenyl glycidyl ether, 2- ethyl ethers, thixotropic agent and octyl phenol polyoxyethylene are added after fully dissolved
Ether；Paraffin and paste making agent are added after it is well mixed, transparence is stirred to clarify, stood, it is abietyl to be cooled to 25 DEG C
Weld-aiding cream 3；
Three：The Pb-free coating glass putty 3 of step one is mixed with the abietyl weld-aiding cream 3 of step 2, it is agitated it is well mixed after,
Become the present invention exempts from refrigeration solder(ing) paste 3.
In above example, rilanit special, fatty glyceride, N, N- ethylenebis stearic amides can be replaced with
Any two kinds of mixture in upper material；Newtrex, hydrogenated rosin, perhydrogenated rosin, leadless rosin can be replaced above thing
Any mixture of two or more in matter.
It is of the present invention to exempt to refrigerate solder(ing) paste quality investigation
Preserve exempting from obtained by 3 embodiments above at room temperature respectively and refrigerate solder(ing) paste, the welding of its matter is tested after 6 months
Effect.
Tested through result, exempt from refrigeration solder(ing) paste 1, exempt from refrigeration solder(ing) paste 2, exempt to store under the refrigeration room temperature environment of solder(ing) paste 3
Time still can normally use after six months.After testing, the solder(ing) paste obtained by 3 embodiments has good printing performance,
Printing is without collapsing, and bridging, the sharp phenomenon of drawing, physical stability, bronze mirror corrosion test, viscosity are qualified, can meet high-end product
Surface encapsulation requirement；Soldering paste postwelding residue is the membranoid substance of water white transparency, stablizes nonhygroscopic under normal temperature, without cleaning, is adapted to
Required in general electronic products and the encapsulation of high-end electronic product surface.Printed board is carried out after moisture test with power-up after welding,
Printed board is carried out after moisture test with power-up after welding, and the insulaion resistance of 3 embodiments is all higher than 1.8 × 109Ω, the rate of spread
It is all higher than being equal to 75%.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (10)
1. one kind is exempted to refrigerate solder(ing) paste, it is characterised in that：With gross mass percentages, by 87.5-89% Pb-free coating glass putty and
11-12.5% abietyl weld-aiding cream composition；The abietyl weld-aiding cream includes PLA.
2. as claimed in claim 1 exempt to refrigerate solder(ing) paste, it is characterised in that：The PLA accounts for the abietyl weld-aiding cream
Mass percent is 15-20%.
3. as claimed in claim 1 exempt to refrigerate solder(ing) paste, it is characterised in that described with Pb-free solder silty amount percentages
Pb-free coating glass putty is made up of each component of following mass percent：Silver (Ag) 0.5-3.5%, copper (Cu) 0.3-0.9%, chromium (Cr)
0.1-0.8%, remaining is tin (Sn).
4. as claimed in claim 1 exempt to refrigerate solder(ing) paste, it is characterised in that in terms of abietyl weld-aiding cream mass percent, institute
Abietyl weld-aiding cream is stated to be made up of each component of following mass percent：PLA 15-20%, organic solvent 18-23%, into cream
Agent 3.5-5.5%, surfactant 3-5%, corrosion inhibiter 2-5%, thixotropic agent 2-4%, glycidyl ether compound 2-4.5%,
Paraffin 1.5-2.5%, remaining is modified rosin.
5. as claimed in claim 4 exempt to refrigerate solder(ing) paste, it is characterised in that：Described organic solvent is mixture, is specially
Glycerine and propylene glycol monomethyl ether, glycerine and two sweet ether monobutyl ethers or glycerine diethyl carbitol.
6. as claimed in claim 4 exempt to refrigerate solder(ing) paste, it is characterised in that：The surfactant is octyl phenol polyoxyethylene
Ether.
7. as claimed in claim 4 exempt to refrigerate solder(ing) paste, it is characterised in that：The corrosion inhibiter is triethanolamine.
8. as claimed in claim 4 exempt to refrigerate solder(ing) paste, it is characterised in that：Described modified rosin is newtrex, hydrogenation
One or more in rosin, perhydrogenated rosin, leadless rosin.
9. as claimed in claim 4 exempt to refrigerate solder(ing) paste, it is characterised in that：Described glycidyl ether compound contracts for propyl group
One or more compositions in water glycerin ether, phenyl glycidyl ether, 2- ethyl ethers.
10. exempting from as described in any one of claim 1 to 9 refrigerates the preparation method of solder(ing) paste, it is characterised in that including following step
Suddenly：
Step one：The preparation of Pb-free coating glass putty
Described Pb-free coating glass putty is produced by corresponding proportion by ultrasonic atomizatio equipment；
Step 2：The preparation of abietyl weld-aiding cream
Organic solvent and PLA are placed in the reactor of belt stirrer, 110 DEG C -130 DEG C are heated to, stirring makes its mixing equal
It is even, after solid constituent is completely dissolved, add modified rosin；Corrosion inhibiter, glycidyl ether are added after it is completely dissolved
Compound, thixotropic agent and surfactant；Paraffin and paste making agent are added after it is well mixed, transparence is stirred to clarify, stood,
It is abietyl weld-aiding cream to be cooled to 18-25 DEG C；
Step 3:The Pb-free coating glass putty of step one is mixed in proportion with the abietyl weld-aiding cream of step 2, it is agitated fully mixed
After conjunction, become and exempt to refrigerate solder(ing) paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410529403.5A CN104384747B (en) | 2014-10-08 | 2014-10-08 | One kind exempts from refrigeration solder(ing) paste and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410529403.5A CN104384747B (en) | 2014-10-08 | 2014-10-08 | One kind exempts from refrigeration solder(ing) paste and preparation method thereof |
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| CN104384747A CN104384747A (en) | 2015-03-04 |
| CN104384747B true CN104384747B (en) | 2017-10-13 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689914B (en) * | 2016-04-08 | 2017-11-28 | 深圳市博士达焊锡制品有限公司 | A kind of tin cream and preparation method thereof |
| CN108381056B (en) * | 2018-03-29 | 2020-05-26 | 苏州国通科技有限公司 | Soldering paste and preparation method thereof |
| CN110202292B (en) * | 2019-05-19 | 2021-01-26 | 江苏博蓝锡威金属科技有限公司 | Die bonding solder paste for LED packaging and preparation method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6440228B1 (en) * | 2000-02-04 | 2002-08-27 | Senju Metal Industry Co., Ltd. | Lead-free zinc-containing solder paste |
| WO2003068447A1 (en) * | 2002-02-13 | 2003-08-21 | Honeywell International Inc. | Solder paste formulations, methods of production and uses thereof |
| JP2004141937A (en) * | 2002-10-25 | 2004-05-20 | Mitsubishi Materials Corp | Surface coated au-sn alloy powder for solder paste |
| WO2004047507A2 (en) * | 2002-11-18 | 2004-06-03 | Honeywell International Inc | Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| CN1718354A (en) * | 2005-08-04 | 2006-01-11 | 上海交通大学 | Sn-Ag-Cu-Cr alloy leadless parent metal |
| CN101327553A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Halogenide-free leadless soldering tin paste |
| CN101780606A (en) * | 2009-12-23 | 2010-07-21 | 深圳市唯特偶化工开发实业有限公司 | Washing-free lead-free halogen-free tin soldering paste |
| CN103008919B (en) * | 2012-12-13 | 2015-05-27 | 郴州金箭焊料有限公司 | Low-silver halogen-free lead-free solder paste |
| CN103264240A (en) * | 2012-12-31 | 2013-08-28 | 广东普赛特电子科技股份有限公司 | Halogen-free no-clean soldering flux and preparation method thereof |
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