CN103056556A - Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces - Google Patents

Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces Download PDF

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Publication number
CN103056556A
CN103056556A CN2012100752574A CN201210075257A CN103056556A CN 103056556 A CN103056556 A CN 103056556A CN 2012100752574 A CN2012100752574 A CN 2012100752574A CN 201210075257 A CN201210075257 A CN 201210075257A CN 103056556 A CN103056556 A CN 103056556A
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China
Prior art keywords
soldering
agent
halogen
preformed
free
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Application number
CN2012100752574A
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CN103056556B (en
Inventor
胡伟兰
刘平
杨倡进
顾小龙
钟海峰
许百胜
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Zhejiang Yatong New Materials Co ltd
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Zhejiang Asia General Soldering & Brazing Material Co Ltd
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Publication of CN103056556A publication Critical patent/CN103056556A/en
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Abstract

The invention provides a preformed soldering terminal with halogen-free soldering fluxes coated on the surfaces, and the performed soldering terminal is good in soldering performance, and the quantity of the soldering fluxes can be controlled easily. A soldering flux coating is formed by the method that the preformed soldering terminal is wetted by halogen-free liquid soldering fluxes and then dried, the halogen-free liquid soldering fluxes are composed of the following components by weight: 35-42% of carrier, 1.0-1.4% of surface wetting agent, 0.5-1.2% of leveling agent, 0.3-0.5% of active agent, 0.1-1.0% of resin film-forming agent, 0.15-1.2% of thickening agent, and the balance is organic solvents. The carrier is rosin, the surface wetting agent is T-80, TX-100 and Span60, the leveling agent is OP-10, the active agent is oxalic acid, salicylic acid and malic acid, the resin film-forming agent is polybutadiene and polyurethane, the thickening agent is hydrogenated castor oil, and the organic solvent is alcohol or ketone which is lower than 110 DEG C in boiling point. The weight of the preformed soldering terminal with the halogen-free soldering fluxes coated on the surfaces is regarded as a standard, the content of the soldering flux coating is 0.2-5.0%, and the preformed soldering terminal with the halogen-free soldering fluxes coated on the surfaces is suitable for soldering of packaging of electronic components.

Description

The surface applies the preformed soldering of halogen-free flux
Technical field
The present invention relates to welding material, particularly the surface has the preformed soldering of soldering flux coating.
Background technology
At present, most widely used welding material is solder(ing) paste in Electronic Packaging.But large for the scolding tin consumption and in the situation that method printing can not meet the demands, it then is a kind of very good and effective way that the preformed soldering that applies scaling powder with the surface replaces solder(ing) paste.
Preformed soldering has specific machining shape, is a kind of staple in the current scolder, and it has the welding registration, uses quantitatively accurately characteristics, is generally used for the occasion that shape and quality to scolder have higher requirements.This weld tabs stock size little (mm level), quality light (mg level) particularly connects for specific plug-in mounting welding and module, has extraordinary effect at the control weld size.This weld tabs is with precalculated tenor, guarantees quality and the uniformity of welding, and by accurate control braze metal content, realizes high-precision soldering in the Electronic Packaging process.Use that this weld tabs can also be avoided using that tin cream brings is inhomogeneous such as printing, bites, tin cream slump, hole, scolder balling-up, bottom surface element fixing not firm, incompletely filling, intermittently wetting, residue is more, gap, stained, skew and clean the number of drawbacks such as not thorough.
At present, the related like product scaling powder percentage composition scope of domestic patent CN201020299304.X and patent CN201010258783.5 is 0.2%~0.4%, coating and weld tabs label Thickness Ratio are 1: 30, but these indexs can't quantitatively be controlled in the product manufacturing, and some occasion is next can't to satisfy welding requirements.Also there is not producer to produce for the high preformed soldering of scaling powder percentage composition.
Summary of the invention
The present invention advocates and the trend of carrying out the halogen solder flux in the world in order to comply with, the uncontrollable problem of the shared content of soldering flux coating when solving simultaneously weld tabs production, provide a kind of surface to apply the preformed soldering of halogen-free flux, this weld tabs has environmental protection, adhesion, storage property is good, the welding high conformity, the characteristics that welding precision is high, and the shared content of soldering flux coating is controlled easily in the weld tabs production.
For addressing the above problem, the technical solution used in the present invention is to be coated with soldering flux coating on the preformed soldering surface, its special character is that described soldering flux coating is that described preformed soldering infiltrates halogen-free liquid soldering flux and forms by drying, described halogen-free liquid soldering flux forms with the component of its weighing scale by following content: carrier 35~42%, surface active agent 1.0~1.4%, homogenizing agent 0.5~1.2%, activating agent 0.3~0.5%, resin film forming agent 0.1~1.0%, thickener 0.15~1.2%, the organic solvent surplus;
Described carrier is rosin, and surperficial moistening temperature agent is T-80, TX-100 and Span60, and homogenizing agent is OP-10, activating agent is ethanedioic acid, salicylic acid and malic acid, the resin film forming agent is polybutadiene and polyurethane, and thickener is rilanit special, and organic solvent is alcohol or the ketone of boiling point below 110 ℃;
The preformed soldering weight that applies halogen-free flux take described surface is as benchmark, and described soldering flux coating content is 0.2~5.0%.
Organic solvent of the present invention is methyl alcohol, ethanol, isobutanol or acetone.
Preformed soldering of the present invention be shaped as rectangular pieces, square sheets, circular piece, ring segment or any regular, irregularly shaped.
Manufacturing of the present invention is at first prepared certain density liquid halogen-free flux according to the requirement of weld tabs surface welding-assistant coating levels, and the basis of this scaling powder is activating agent, rosin carrier and solvent.Brazing metal is prefabricated into the weld tabs with definite shape, infiltrates as requested the halogen-free liquid soldering flux of one deck on the surface of preformed soldering, by oven dry the flux in the surface liquid coating is volatilized fully again, make weld tabs of the present invention.The surface of this weld tabs is coated with equally distributed halogen-free flux coating.The manufacturing of weld tabs of the present invention can be controlled soldering flux coating shared mass fraction in weld tabs by the change of carrier in the liquid soldering flux and thickener equal size.Weld tabs of the present invention can be by the prefabricated product that obtains any specification, size, shape, to satisfy the requirement of the electronic devices and components that weld difformity, specification.
In liquid soldering flux, add film forming agent when the present invention makes scaling powder is adhered at the preformed soldering surface uniform, add in the present invention shared percentage composition of adhesion agent energy control surface soldering flux coating.
Carrier of the present invention preferred rosin based material, particularly Foral.
Surface active agent among the present invention can be selected Span-60 (sorbitan monostearate), T-80 (tween T-80, the polyoxyethylene sorbitan fatty acid ester), TX-100 (octyl phenyl APEO), be non-ionic surface active agent.
Homogenizing agent OP-10 of the present invention (APES) also belongs to non-ionic surface active agent, and it has the functions such as emulsification, even, wetting, diffusion.
Activating agent among the present invention can be aliphatic acid, and aromatic acid or amino acid except described adipic acid, salicylic acid, malic acid, can also be acetic acid, propionic acid, succinic acid, ethanedioic acid, glutaric acid, benzoic acid etc., optional one or more mixing wherein.This type of activating agent has enough weldering performances that helps, and it can decompose under welding temperature, and distillation or volatilization make the noresidue of object postwelding, without corrosion.
Described resin film forming agent is chosen polybutadiene, and one or both in the polyurethane add film forming agent and then can make the surperficial liquid soldering flux that infiltrates of weld tabs rapid film forming in heating process, the mutual adhesion of finished product weld tabs, the convenient storage and use.
Thickener of the present invention is chosen rilanit special.Adding thickener helps liquid soldering flux to stick to the preformed soldering surface.Pass through when the present invention makes add thickener content how much control the content of soldering flux coating in whole weld tabs, amount of thickener can not be too high, otherwise can affect wettability.
Organic solvent then will be chosen the low-boiling point liquid solvent, and such as volatile materials such as methyl alcohol, ethanol, isobutanol, acetone, the preferred acetone of the present invention is as organic solvent.
Weld tabs surface welding-assistant coating processes step of the present invention: corresponding liquid soldering flux is prepared in the requirement according to weld tabs surface welding-assistant content, preformed soldering is infiltrated the equally distributed liquid soldering flux liquid film of one deck in liquid soldering flux, then utilize heating, drying equipment under relevant temperature, to heat the organic solvent in the liquid soldering flux is volatilized rapidly, stay the equally distributed solid soldering flux of one deck on the weld tabs surface.
The beneficial effect that the present invention compares with existing product:
1, because the present invention adopts the technique of disposable infiltration oven dry to make weld tabs surface adhesion one deck solid soldering flux, makes metal weld tabs and air insulated, be conducive to the preservation of solder sheet, do not need storage at a constant temperature;
2, the preformed soldering of coating scaling powder in surface of the present invention is compared with tin cream, need not hand-printing, has reduced the technical ability requirement to operating personnel, improves the uniformity of welding;
3, the scaling powder content of preformed soldering surface coating of the present invention can quantitatively be controlled according to welding requirements, avoids too much welding assisted agent residuals when effectively removing the face of weld oxide layer, improves welding quality, guarantees the uniformity of welding, improves welding efficiency;
4, the scaling powder of preformed soldering surface coating of the present invention is halogen-free flux, complies with non-halogen international trend, and health and environment are not threatened more environmental protection.
The specific embodiment
Embodiment one
Under the normal temperature, following mixing of materials stirring is mixed with liquid soldering flux, then adopts the method that infiltrates to attach one deck scaling powder liquid film on the preformed soldering surface, made product in one minute through 100 ℃ of oven dry.The scaling powder mass content is 0.2% in the product.
Foral: 35%
T-80:1.0%
TX-100:0.2
Span60:0.2
OP-10:0.5%
Adipic acid: 0.15%
Salicylic acid: 0.1%
Malic acid: 0.05%
Polybutadiene film forming agent: 0.05%
Polyurethane finishing agent: 0.05%
Rilanit special: 0.15%
Acetone: surplus
Embodiment two
The preparation method is with example 1.
Foral: 36%
T-80:0.8%
TX-100:0.2%
Span60:0.2%
OP-10:0.6%
Adipic acid: 0.25%
Salicylic acid: 0.05%
Malic acid: 0.1%
Polybutadiene film forming agent: 0.15%
Polyurethane finishing agent: 0.25%
Rilanit special: 0.3%
Acetone: surplus
Method of preparation and use is seen embodiment 1, and scaling powder content is 1%.
Embodiment three
The preparation method is with example 1.
Foral: 38%
T-80:0.75%
TX-100:0.2%
Span60:0.25%
OP-10:0.8%
Adipic acid: 0.3%
Salicylic acid: 0.05%
Malic acid: 0.05%
Polybutadiene film forming agent: 0.25%
Polyurethane finishing agent: 0.25%
Rilanit special: 0.7%
Acetone: surplus
Method of preparation and use is seen embodiment 1, and scaling powder content is 2.5%.
Embodiment four
The preparation method is with example 1.
Foral: 40%
T-80:0.6%
TX-100:0.25%
Span60:0.55%
OP-10:1.05%
Adipic acid: 0.25%
Salicylic acid: 0.05%
Malic acid: 0.15%
Polybutadiene film forming agent: 0.5%
Polyurethane finishing agent: 0.25%
Rilanit special: 1.0%
Acetone: surplus
Method of preparation and use is seen embodiment 1, and scaling powder content is 4%.
Embodiment five
The preparation method is with example 1.
Foral: 42%
T-80:0.5%
TX-100:0.25%
Span60:0.25%
OP-10:1.2%
Adipic acid: 0.25%
Salicylic acid: 0.1%
Malic acid: 0.15%
Polybutadiene film forming agent: 0.5%
Polyurethane finishing agent: 0.5%
Rilanit special: 1.2%
Acetone: surplus
Method of preparation and use is seen embodiment 1, and scaling powder content is 5%.

Claims (4)

1. the surface applies the preformed soldering of halogen-free flux, be coated with soldering flux coating on the preformed soldering surface, it is characterized in that described soldering flux coating is that described preformed soldering infiltrates halogen-free liquid soldering flux and forms by drying, described halogen-free liquid soldering flux forms with the component of its weighing scale by following content: carrier 35~42%, surface active agent 1.0~1.4%, homogenizing agent 0.5~1.2%, activating agent 0.3~0.5%, resin film forming agent 0.1~1.0%, thickener 0.15~1.2%, the organic solvent surplus;
Described carrier is rosin, and surperficial moistening temperature agent is T-80, TX-100 and Span60, and homogenizing agent is OP-10, activating agent is ethanedioic acid, salicylic acid and malic acid, the resin film forming agent is polybutadiene and polyurethane, and thickener is rilanit special, and organic solvent is alcohol or the ketone of boiling point below 110 ℃;
The preformed soldering weight that applies halogen-free flux take described surface is as benchmark, and described soldering flux coating content is 0.2~5.0%.
2. weld tabs as claimed in claim 1 is characterized in that described organic solvent is methyl alcohol, ethanol, isobutanol or acetone.
3. weld tabs as claimed in claim 1, it is characterized in that described preformed soldering be shaped as rectangular pieces, square sheets, circular piece, ring segment or any regular, irregularly shaped.
4. weld tabs as claimed in claim 1 is characterized in that described preformed soldering composition includes the scolder of any composition of plumbous and lead-free solder.
CN201210075257.4A 2012-03-20 2012-03-20 Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces Active CN103056556B (en)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103521953A (en) * 2013-10-25 2014-01-22 广州汉源新材料有限公司 Coating process for preformed soldering lug soldering flux
CN103817062A (en) * 2013-12-28 2014-05-28 刘惠玲 Method for coating preformed welding piece with coating
CN104191108A (en) * 2014-08-28 2014-12-10 华南理工大学 Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof
CN104625288A (en) * 2014-12-23 2015-05-20 常熟高嘉能源科技有限公司 Solar cell welding process
CN104646865A (en) * 2014-12-26 2015-05-27 苏州龙腾万里化工科技有限公司 Novel, environment-friendly, high-temperature resistant and hot-air-leveled soldering flux
CN105921911A (en) * 2016-05-31 2016-09-07 深圳市唯特偶新材料股份有限公司 Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug
CN106783768A (en) * 2016-12-29 2017-05-31 广州汉源新材料股份有限公司 A kind of preforming nanometer silverskin
CN108247239A (en) * 2018-01-12 2018-07-06 吉安谊盛电子材料有限公司 Lead acid accumulator pole group cast welding oiliness scaling powder
CN108747090A (en) * 2018-06-21 2018-11-06 上海华庆焊材技术有限公司 One kind helping weldering glue and preparation method thereof, application
CN110116247A (en) * 2019-05-15 2019-08-13 中国电子科技集团公司第三十八研究所 A kind of method for welding of radar electric product connector
CN112122825A (en) * 2020-08-17 2020-12-25 深圳市兴鸿泰锡业有限公司 Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug
CN113441873A (en) * 2020-03-25 2021-09-28 深圳市华石电子有限公司 Soldering-assistant sheet and preparation method thereof
JP6992243B1 (en) 2021-03-31 2022-02-03 千住金属工業株式会社 Flux for flux-coated solder preforms, flux-coated solder preforms, and methods for mounting electronic components on electronic boards

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CN101327552A (en) * 2008-07-31 2008-12-24 东莞永安科技有限公司 Low solid content halogenide-free water-based type cleaning-free scaling powder
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JP3480634B2 (en) * 1995-11-16 2003-12-22 松下電器産業株式会社 Flux for soldering
JP2001300766A (en) * 2000-04-27 2001-10-30 Tamura Kaken Co Ltd Flux for soldering circuit board and circuit board
CN101214594A (en) * 2007-12-28 2008-07-09 潘惠凯 Environment-friendly type lead-free solder water-based scaling powder and preparation thereof
CN101327552A (en) * 2008-07-31 2008-12-24 东莞永安科技有限公司 Low solid content halogenide-free water-based type cleaning-free scaling powder
CN101905386A (en) * 2010-08-20 2010-12-08 芯通科技(成都)有限公司 Solder-flux combined preformed soldering tin sheet

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015058457A1 (en) * 2013-10-25 2015-04-30 广州汉源新材料有限公司 Process for coating preformed solder piece with flux
CN103521953A (en) * 2013-10-25 2014-01-22 广州汉源新材料有限公司 Coating process for preformed soldering lug soldering flux
CN103817062A (en) * 2013-12-28 2014-05-28 刘惠玲 Method for coating preformed welding piece with coating
CN103817062B (en) * 2013-12-28 2015-07-08 深圳市福摩索金属制品有限公司 Method for coating preformed welding piece with coating
CN104191108A (en) * 2014-08-28 2014-12-10 华南理工大学 Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof
CN104625288A (en) * 2014-12-23 2015-05-20 常熟高嘉能源科技有限公司 Solar cell welding process
CN104646865A (en) * 2014-12-26 2015-05-27 苏州龙腾万里化工科技有限公司 Novel, environment-friendly, high-temperature resistant and hot-air-leveled soldering flux
CN105921911A (en) * 2016-05-31 2016-09-07 深圳市唯特偶新材料股份有限公司 Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug
CN106783768B (en) * 2016-12-29 2019-04-02 广州汉源新材料股份有限公司 A kind of preforming nanometer silverskin
CN106783768A (en) * 2016-12-29 2017-05-31 广州汉源新材料股份有限公司 A kind of preforming nanometer silverskin
CN108247239B (en) * 2018-01-12 2021-01-22 吉安谊盛电子材料有限公司 Oily scaling powder for cast welding of lead-acid storage battery plate group
CN108247239A (en) * 2018-01-12 2018-07-06 吉安谊盛电子材料有限公司 Lead acid accumulator pole group cast welding oiliness scaling powder
CN108747090A (en) * 2018-06-21 2018-11-06 上海华庆焊材技术有限公司 One kind helping weldering glue and preparation method thereof, application
CN108747090B (en) * 2018-06-21 2020-12-08 上海华庆焊材技术有限公司 Welding-aid adhesive and preparation method and application thereof
CN110116247A (en) * 2019-05-15 2019-08-13 中国电子科技集团公司第三十八研究所 A kind of method for welding of radar electric product connector
CN113441873A (en) * 2020-03-25 2021-09-28 深圳市华石电子有限公司 Soldering-assistant sheet and preparation method thereof
CN113441873B (en) * 2020-03-25 2022-11-15 深圳市华石电子有限公司 Soldering-assistant sheet and preparation method thereof
CN112122825A (en) * 2020-08-17 2020-12-25 深圳市兴鸿泰锡业有限公司 Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug
CN112122825B (en) * 2020-08-17 2022-03-18 深圳市兴鸿泰锡业有限公司 Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug
JP6992243B1 (en) 2021-03-31 2022-02-03 千住金属工業株式会社 Flux for flux-coated solder preforms, flux-coated solder preforms, and methods for mounting electronic components on electronic boards
WO2022209001A1 (en) * 2021-03-31 2022-10-06 千住金属工業株式会社 Flux for flux-coated solder preform, flux-coated solder preform, and method for mounting electronic components on electronic substrate
JP2022156983A (en) * 2021-03-31 2022-10-14 千住金属工業株式会社 Flux for flux-coated solder preform, flux-coated solder preform, and method for mounting electronic components on electronic substrate
TWI809578B (en) * 2021-03-31 2023-07-21 日商千住金屬工業股份有限公司 Flux for flux-coated solder preform, flux-coated solder preform, and method for mounting electronic components on electronic board

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Inventor after: Hu Lanwei

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Inventor after: Yang Changjin

Inventor after: Gu Xiaolong

Inventor after: Zhong Haifeng

Inventor after: Xu Baisheng

Inventor before: Hu Weilan

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Address after: No. 372, Jinpeng Street, Sandun Town, Xihu District, Hangzhou, Zhejiang 310030

Patentee after: Zhejiang Yatong New Materials Co.,Ltd.

Address before: 310030 north of Xiyuan 8th Road, Sandun Xihu Science Park, Xihu District, Hangzhou City, Zhejiang Province

Patentee before: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd.