CN101905386A - Solder-flux combined preformed soldering tin sheet - Google Patents
Solder-flux combined preformed soldering tin sheet Download PDFInfo
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- CN101905386A CN101905386A CN2010102587835A CN201010258783A CN101905386A CN 101905386 A CN101905386 A CN 101905386A CN 2010102587835 A CN2010102587835 A CN 2010102587835A CN 201010258783 A CN201010258783 A CN 201010258783A CN 101905386 A CN101905386 A CN 101905386A
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Abstract
The invention discloses a solder-flux combined preformed soldering tin sheet, which has the characteristics of easy storage, convenient use and capability of effectively improving product welding process consistence and production efficiency. The technical key points are as follows: adhering a flux layer with even thickness to the surface of a preformed solder sheet (1) by utilizing an infiltration process or evenly mixing metal solder and flux, and preforming the mixture into the preformed soldering tin sheet with a certain shape, wherein the flux is a washing-free rosinyl active flux, and the mass ratio of the flux to the solder is (1-2):500. The soldering tin sheet can be preformed in shapes of round, rectangle, square, ring, rectangular frame, square frame, ring with a handle and the like. The soldering tin sheet in the invention can be used in welding of various electronic devices, specially welding of a radio frequency power amplification module.
Description
Technical field
The present invention relates to be used to weld the solder plate of electronic device, relate in particular to the solder plate of welding electronic device on printed circuit board (PCB).
Background technology
Need use scolder and scaling powder when on printed circuit board (PCB), welding electronic device.Scolder is used for dosing the metal material of weld seam when being welding, can be made into wire, paste, sheet etc. according to the welding needs; The main component of scaling powder is a rosin, has the effect of anti-oxidation, as to reduce liquid scolding tin surface tension, promotion welding.Utilize existing welding product to weld, operators'skills is had relatively high expectations, the hardened coating scaling powder easily causes too much welding assisted agent residuals, and the scolder consumption is difficult to control, thereby makes that the uniformity of product welding procedure is relatively poor, and production efficiency is low.
The hardened coating scaling powder is avoided in operation when welding in order to reduce, and a kind of solder(ing) paste that has the solder stick of rosin core and be mixed with scaling powder is arranged on the market now.Still there is the problem that is difficult to control the scolder consumption in these two kinds of products, and operators'skills is had relatively high expectations, and the uniformity of product welding procedure is relatively poor.
Summary of the invention
The present invention has overcome the deficiencies in the prior art, provide a kind of be easy to the storage, easy to use, can effectively improve product welding procedure uniformity, the preform solder plate that the scolder of enhancing productivity combines with scaling powder.
The present invention has adopted following technical scheme: scolder is prefabricated into the solder sheet with definite shape, use infiltration technology to adhere to the uniform scaling powder layer of last layer thickness on the surface of solder sheet, perhaps brazing metal is evenly mixed with scaling powder, be prefabricated into preform solder plate again with definite shape; Described scaling powder is the abietyl active scaling powder of leave, and scaling powder and scolder mass ratio are (1 ~ 2): 500.The present invention can be prefabricated into the preform solder plate of shapes such as the circle, rectangle, square, annulus, rectangle frame, square-shaped frame, band handle annulus of all size, with the needs of the electronic device that satisfies welding difformity, specification.
The invention has the beneficial effects as follows: because the present invention combines scolder with scaling powder, effectively prevented of the oxidation of airborne oxygen, reduced solder plate preserving environment requirement to solder plate; Need not to smear scaling powder by hand, reduced requirement staff's operative skill; By the part by weight of control scaling powder coating, can effectively avoid too much welding assisted agent residuals; Scolder combines with scaling powder is even, solder plate is prefabricated into the shape sheet of corresponding specification according to the welding requirements of difformity, specification electronic device, accurately use scolder and scaling powder according to actual requirement, thereby guarantee the uniformity of product welding procedure, improved operating efficiency simultaneously.The present invention can be applied to the welding of all kinds of electronic devices, is particularly useful for the welding of radio frequency power amplification module.
Description of drawings
Fig. 1 is the preform solder plate partial sectional view at the uniform scaling powder layer of surface attachment last layer thickness of solder sheet.
Fig. 2 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into circular solder plate.
Fig. 3 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into the rectangle solder plate.
Fig. 4 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into square solder plate.
Fig. 5 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into the annular solder plate.
Fig. 6 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into rectangle frame solder plate.
Fig. 7 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into the square-shaped frame solder plate.
Fig. 8 is the sectional view that preform solder plate shown in Figure 1 is prefabricated into band handle annular solder plate.
Mark among the figure: solder sheet 1 scaling powder layer 2.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is further described.
The present invention uses following two kinds of embodiment to realize.
First kind of embodiment is prefabricated into the solder sheet 1 with definite shape with scolder earlier, passes through the surface attachment one deck thickness uniform scaling powder layer 2 of the mode of infiltration in solder sheet 1 again.
Second kind of embodiment be with scolder with after scaling powder evenly mixes, be prefabricated into solder plate with definite shape.
Described scaling powder is the abietyl active scaling powder of leave, and scaling powder and scolder mass ratio are (1 ~ 2): 500; The present invention can be prefabricated into shapes such as the circle, rectangle, square, annulus, rectangle frame, square-shaped frame, band handle annulus of all size, with the needs of the electronic device that satisfies welding difformity, specification; Need not the hardened coating scaling powder thereby reach, use scaling powder and scolder, avoid too much scaling powder and solder residue, enhance productivity, and guarantee the conforming effect of product welding procedure by actual requirement.
Claims (9)
1. the preform solder plate that scolder combines with scaling powder is characterized in that, solder sheet (1) forms by scolder is prefabricated; Described solder sheet (1) surface distributed one deck uniform scaling powder layer of thickness (2).
2. the preform solder plate that combines with scaling powder according to independent claims 1 described scolder is characterized in that, described scaling powder layer (2) is attached to solder sheet (1) surface by soaking into technology.
3. the preform solder plate that combines with scaling powder according to independent claims 1 described scolder is characterized in that, described scaling powder layer (2) material is the abietyl active scaling powder of leave.
4. the preform solder plate that combines with scaling powder according to independent claims 1 described scolder is characterized in that, described scaling powder layer (2) is (1 ~ 2) with the mass ratio of solder sheet (1): 500.
5. the preform solder plate that combines with scaling powder according to independent claims 1 described scolder is characterized in that, the shape of solder sheet (1) or be round sheet; It perhaps is the rectangle sheet; It perhaps is square sheet; It perhaps is the annular sheet; It perhaps is rectangle frame sheet; It perhaps is the square-shaped frame sheet; Perhaps be band handle annular sheet.
6. the preform solder plate that scolder combines with scaling powder comprises scolder and scaling powder, it is characterized in that, is evenly mixed prefabricated again shaping with scaling powder by brazing metal.
7. the preform solder plate that combines with scaling powder according to independent claims 6 described scolders is characterized in that, described scaling powder is the abietyl active scaling powder of leave.
8. the preform solder plate that combines with scaling powder according to independent claims 6 described scolders is characterized in that, described scaling powder and scolder mass ratio are (1 ~ 2): 500.
9. the preform solder plate that combines with scaling powder according to independent claims 6 described scolders is characterized in that, the shape of described preform solder plate or be round sheet; It perhaps is the rectangle sheet; It perhaps is square sheet; It perhaps is the annular sheet; It perhaps is rectangle frame sheet; It perhaps is the square-shaped frame sheet; Perhaps be band handle annular sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102587835A CN101905386A (en) | 2010-08-20 | 2010-08-20 | Solder-flux combined preformed soldering tin sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102587835A CN101905386A (en) | 2010-08-20 | 2010-08-20 | Solder-flux combined preformed soldering tin sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101905386A true CN101905386A (en) | 2010-12-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102587835A Pending CN101905386A (en) | 2010-08-20 | 2010-08-20 | Solder-flux combined preformed soldering tin sheet |
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| CN (1) | CN101905386A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102554988A (en) * | 2012-03-16 | 2012-07-11 | 陈廷 | Manufacturing method and use of composite material |
| CN103056556A (en) * | 2012-03-20 | 2013-04-24 | 浙江亚通焊材有限公司 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
| CN103521953A (en) * | 2013-10-25 | 2014-01-22 | 广州汉源新材料有限公司 | Coating process for preformed soldering lug soldering flux |
| CN103612031A (en) * | 2013-11-14 | 2014-03-05 | 无锡市斯威克科技有限公司 | Pre-coating flux for photovoltaic solder strips |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| CN109175772A (en) * | 2018-09-14 | 2019-01-11 | 中国科学院电工研究所 | A kind of Cu@Ni@Sn preformed soldering and preparation method thereof |
| CN110102848A (en) * | 2019-06-13 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding |
| CN110560826A (en) * | 2019-08-02 | 2019-12-13 | 广州汉源新材料股份有限公司 | welded piece with soft solder layer pre-coated on surface and preparation method thereof |
Citations (5)
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|---|---|---|---|---|
| JPH0631486A (en) * | 1992-07-21 | 1994-02-08 | Tanaka Denshi Kogyo Kk | Production of composite solder ingot |
| JPH06285686A (en) * | 1993-04-08 | 1994-10-11 | Nec Kansai Ltd | Method and device for manufacturing solder containing spacer |
| US6186390B1 (en) * | 1997-12-26 | 2001-02-13 | Kabushiki Kaisha Toshiba | Solder material and method of manufacturing solder material |
| CN201432172Y (en) * | 2009-05-18 | 2010-03-31 | 雅拓莱金属制品(深圳)有限公司 | High-temperature resistant welding tin strip |
| CN201711675U (en) * | 2010-08-20 | 2011-01-19 | 芯通科技（成都）有限公司 | Preformed soldering tin plate with soldering flux coating |
-
2010
- 2010-08-20 CN CN2010102587835A patent/CN101905386A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631486A (en) * | 1992-07-21 | 1994-02-08 | Tanaka Denshi Kogyo Kk | Production of composite solder ingot |
| JPH06285686A (en) * | 1993-04-08 | 1994-10-11 | Nec Kansai Ltd | Method and device for manufacturing solder containing spacer |
| US6186390B1 (en) * | 1997-12-26 | 2001-02-13 | Kabushiki Kaisha Toshiba | Solder material and method of manufacturing solder material |
| CN201432172Y (en) * | 2009-05-18 | 2010-03-31 | 雅拓莱金属制品(深圳)有限公司 | High-temperature resistant welding tin strip |
| CN201711675U (en) * | 2010-08-20 | 2011-01-19 | 芯通科技（成都）有限公司 | Preformed soldering tin plate with soldering flux coating |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102554988A (en) * | 2012-03-16 | 2012-07-11 | 陈廷 | Manufacturing method and use of composite material |
| CN102554988B (en) * | 2012-03-16 | 2014-02-26 | 宁波高智创新科技开发有限公司 | Manufacturing method and use of composite material |
| CN103640070A (en) * | 2012-03-16 | 2014-03-19 | 陈廷 | Composite material for soldering tin operation |
| CN103056556A (en) * | 2012-03-20 | 2013-04-24 | 浙江亚通焊材有限公司 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
| CN103056556B (en) * | 2012-03-20 | 2015-03-04 | 浙江亚通焊材有限公司 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
| CN103521953A (en) * | 2013-10-25 | 2014-01-22 | 广州汉源新材料有限公司 | Coating process for preformed soldering lug soldering flux |
| CN103612031A (en) * | 2013-11-14 | 2014-03-05 | 无锡市斯威克科技有限公司 | Pre-coating flux for photovoltaic solder strips |
| CN103612031B (en) * | 2013-11-14 | 2016-01-20 | 无锡市斯威克科技有限公司 | A kind of photovoltaic welding belt pre-coated soldering flux |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| CN109175772A (en) * | 2018-09-14 | 2019-01-11 | 中国科学院电工研究所 | A kind of Cu@Ni@Sn preformed soldering and preparation method thereof |
| CN110102848A (en) * | 2019-06-13 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding |
| CN110560826A (en) * | 2019-08-02 | 2019-12-13 | 广州汉源新材料股份有限公司 | welded piece with soft solder layer pre-coated on surface and preparation method thereof |
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Address after: 610041, Sichuan high tech Zone, Chengdu Tianfu Road, South extension line, high-tech incubator Park, building 3, 6 Applicant after: Chengdu NTS Technology Co., Ltd. Address before: 610041, Sichuan, Chengdu Tianfu Road, South extension line, high-tech incubator Park, building 3, 6 Applicant before: NTS Technology (Chengdu) Co., Ltd. |
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Application publication date: 20101208 |