JPH06285686A - Method and device for manufacturing solder containing spacer - Google Patents
Method and device for manufacturing solder containing spacerInfo
- Publication number
- JPH06285686A JPH06285686A JP8167793A JP8167793A JPH06285686A JP H06285686 A JPH06285686 A JP H06285686A JP 8167793 A JP8167793 A JP 8167793A JP 8167793 A JP8167793 A JP 8167793A JP H06285686 A JPH06285686 A JP H06285686A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- spacer
- tape
- solder tape
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はスペーサ入り半田の製造
方法と装置に関するものであり、詳細には、半田の構成
部材である半田テープ内にスペーサ用粒子を安定した供
給状態で充填する手段を提供するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing spacer-containing solder, and more specifically to a means for filling spacer tape in a stable supply state in a solder tape which is a constituent member of solder. It is provided.
【０００２】[0002]
【従来の技術】先ず、本発明の背景技術としてスペーサ
入り半田の使用例を説明する。図２（Ａ）は、放熱板
（１）上に供給された定量のスペーサ入り半田（４）を
溶融状態で示す。溶融半田（４）には一定粒径のスペー
サ用粒子（６）が多数混入されている。上記粒子（６）
は、溶融半田（４）の比重より小さい比重のシリカ［Ｓ
ｉＯ2］やアルミナ［Ａｌ2Ｏ3］等の球状微粒子で、そ
の粒径は例えば約20μｍに統一されており、溶融半田
（４）の表面まで浮き上がる。2. Description of the Related Art First, an example of using solder with spacers will be described as background art of the present invention. FIG. 2A shows a fixed amount of solder (4) with spacers supplied onto the heat sink (1) in a molten state. A large number of spacer particles (6) having a constant particle diameter are mixed in the molten solder (4). The particles (6)
Is silica [S] having a specific gravity smaller than that of the molten solder (4).
Spherical fine particles of iO2], alumina [Al2O3], etc., having a uniform particle size of, for example, about 20 μm, and float up to the surface of the molten solder (4).
【０００３】図２（Ｂ）に示すように、溶融半田（４）
上にコレット（５）で支持された半導体ペレット（２）
が供給される。半導体ペレット（２）の裏面には金メッ
キ層（３）が形成されており、この金メッキ層（３）が
溶融半田（４）と馴染む。コレット（５）で半導体ペレ
ット（２）を押圧マウントし、半導体ペレット（２）と
放熱板（１）との間隔を粒子（６）の粒径に規制して一
定距離に保持する。As shown in FIG. 2B, molten solder (4)
Semiconductor pellets (2) supported on top by collets (5)
Is supplied. A gold plating layer (3) is formed on the back surface of the semiconductor pellet (2), and the gold plating layer (3) is compatible with the molten solder (4). The semiconductor pellet (2) is press-mounted with the collet (5), and the distance between the semiconductor pellet (2) and the heat sink (1) is regulated to the particle size of the particles (6) and kept at a constant distance.
【０００４】上記溶融半田（４）の原材料となるスペー
サ入り半田（４）は、従来、溶融半田槽内にスペーサ用
粒子を混入して製造していたが、槽内で粒子分布が不均
一になり易いため、それに代わって図３に示す方法で製
造されている。The spacer-containing solder (4), which is a raw material of the molten solder (4), has conventionally been manufactured by mixing spacer particles in a molten solder bath. However, the particle distribution becomes uneven in the bath. Instead, it is manufactured by the method shown in FIG.
【０００５】図３（Ａ）に示すように、第１の半田テー
プ（４Ａ）を恒速送り（Ｆ1）し、その上に設けられた
ホッパ（７）の下端開口部からスペーサ用粒子（６）を
自重落下（Ｆ2）させる。第１の半田テープ（４Ａ）上
に自重落下したスペーサ用粒子（６）は、スキージ
（８）で均一な積層厚みに馴らされる。スペーサ用粒子
（６）を上面に載置した第１の半田テープ（４Ａ）は、
恒速送り（Ｆ1）状態でホッパ（７）の設置域から移動
し、その上に第２の半田テープ（４Ｂ）を圧着すること
によって、スペーサ入り半田（４）が完成する。As shown in FIG. 3A, the first solder tape (4A) is fed at a constant speed (F1), and the spacer particles (6) are fed from the lower end opening of the hopper (7) provided thereon. ) Is dropped by its own weight (F2). The spacer particles (6) dropped on the first solder tape (4A) by their own weight are conditioned by the squeegee (8) to have a uniform laminated thickness. The first solder tape (4A) having the spacer particles (6) placed on the upper surface is
The spacer-filled solder (4) is completed by moving from the installation area of the hopper (7) in the constant speed feed (F1) state and pressing the second solder tape (4B) thereon.
【０００６】[0006]
【発明が解決しようとする課題】図３（Ａ）に示すスペ
ーサ入り半田の製造装置（10）を使用した場合、図３
（Ｂ）に示すように、第１の半田テープ（４Ａ）上に自
重落下したスペーサ用粒子（６）は、スキージ（８）で
馳らされるとき、堰止め力が作用することによって積層
厚みが不規則に変動したり、第１の半田テープ（４Ａ）
の両端からこぼれ落ちたりする危険性がある。第２の半
田テープ（４Ｂ）が圧着される前にスペーサ用粒子
（６）の積層厚みが不均一になったり、一部分がこぼれ
落ちてしまうと、スペーサ入り半田（４）の単位面積当
たりの粒子含有量が均一にならず、溶融半田として使用
した場合に、接合強度の低下や、半導体ペレット（２）
のマウント姿勢の不安定等の品質欠陥を引き起こす。When the manufacturing apparatus (10) for soldering with a spacer shown in FIG. 3 (A) is used,
As shown in (B), the spacer particles (6) that have fallen by their own weight onto the first solder tape (4A) are stacked by the blocking force acting when the spacer particles (6) are engraved by the squeegee (8). Fluctuates irregularly or the first solder tape (4A)
There is a risk of spilling from both ends. If the stacking thickness of the spacer particles (6) becomes uneven or a part of the spacer particles (6) spills before the second solder tape (4B) is pressure-bonded, the solder containing spacer (4) contains particles per unit area. If the amount is not uniform and it is used as molten solder, the joint strength may decrease and the semiconductor pellet (2)
Causes quality defects such as unstable mounting posture.
【０００７】このような問題点を解決するため、図３
（Ｂ）に二点鎖線で示すように、第１の半田テープ（４
Ａ）の恒速走行域の両側にこぼれ止めガイド（９）を付
設することも検討されているが、この方式には装置の大
型化や機構の複雑化等の別の問題点が付随する。In order to solve such a problem, FIG.
As indicated by the chain double-dashed line in (B), the first solder tape (4
It is also considered to provide spill prevention guides (9) on both sides of the constant speed traveling area of A), but this method has other problems such as an increase in size of the device and a complicated mechanism.
【０００８】[0008]
【課題を解決するための手段】上記課題の解決手段とし
て本発明は、第１の半田テープの上面両端に畝状の段部
を残した状態で当該半田テープの上面に長手方向に沿っ
てスペーサ用粒子の充填用凹溝を形成する工程と、この
凹溝内にスペーサ用粒子を充填する工程と、このスペー
サ用粒子を充填された上記第１の半田テープの上面に第
２の半田テープを圧着し、上記スペーサ用粒子を上記凹
溝内に封着する工程とを含むことを特徴とするスペーサ
入り半田の製造方法を提供するものである。As a means for solving the above problems, the present invention provides a spacer along the longitudinal direction on the upper surface of a first solder tape with ridge-shaped step portions left on both ends of the upper surface. Forming a groove for filling particles for spacers, a step of filling particles for spacers in the groove, and a second solder tape on the upper surface of the first solder tape filled with the particles for spacers. And a step of press-fitting and sealing the spacer particles in the recessed groove.
【０００９】また、本発明は、半田テープの走行域の上
流側から下流側に向って円周面の中央部分に凸状の押圧
面を形成し、かつ、この凸状押圧面の両側に凹溝を形成
してなる賦形加工用ローラと、スペーサ用粒子の供給用
ホッパと、半田テープの圧着ローラとを順次配設したこ
とを特徴とするスペーサ入り半田の製造装置を提供す
る。Further, according to the present invention, a convex pressing surface is formed in the central portion of the circumferential surface from the upstream side to the downstream side of the running area of the solder tape, and the convex pressing surface is concave on both sides. Provided is an apparatus for manufacturing spacer-containing solder, characterized in that a shaping roller having a groove formed therein, a spacer particle supply hopper, and a solder tape pressure roller are sequentially arranged.
【００１０】[0010]
【作用】スペーサ用粒子の充填に先立って第１の半田テ
ープの上面中央部分に凹溝を形成して置く。この凹溝内
に所定量のスペーサ用粒子を充填した後、上記第１の半
田テープの上面に第２の半田テープを圧着し、スペーサ
用粒子を上記凹溝内に封着する。Function: Prior to filling the spacer particles, a groove is formed in the central portion of the upper surface of the first solder tape. After filling the groove with a predetermined amount of spacer particles, a second solder tape is pressure-bonded to the upper surface of the first solder tape to seal the spacer particles in the groove.
【００１１】[0011]
【実施例】以下、図１を参照しながら本発明の実施例を
説明する。尚、以下の記述において、従来技術を示す図
２及び図３と同一の構成部材は、同一の参照番号で表示
し、重複事項に関しては説明を省略する。Embodiments of the present invention will be described below with reference to FIG. In the following description, the same components as those of FIGS. 2 and 3 showing the conventional technique are denoted by the same reference numerals, and the description of the overlapping matters will be omitted.
【００１２】本発明に係るスペーサ入り半田（26）の製
造装置（20）は、ホッパ（７）と、その上流側の第１の
半田テープ（４Ａ）の走行域に２個１組で対向配置され
た賦形加工用ローラ（21）及び圧延ローラ（24）と、ホ
ッパ（７）の下流側に２個１組で対向配置された半田テ
ープ（４Ａ）（４Ｂ）の圧着ローラ（25Ａ）（25Ｂ）か
ら構成されている。The manufacturing apparatus (20) for the solder (26) with spacers according to the present invention is arranged so that two sets are opposed to each other in the traveling area of the hopper (7) and the first solder tape (4A) on the upstream side thereof. The shaping roller (21) and rolling roller (24) and the pressure roller (25A) for the solder tapes (4A) and (4B), which are arranged in pairs at the downstream side of the hopper (7), facing each other. 25B).
【００１３】第１の半田テープ（４Ａ）を挟んで圧延ロ
ーラ（24）の上側に位置する賦形加工用ローラ（21）
は、円周面の中央部分を所定の幅寸法に亘って凸状の押
圧面（23）に形成すると共に、この凸状押圧面の両側に
凹溝（27）を形成している。上記凸状の押圧面（23）
は、圧延ローラ（24）と賦形加工用ローラ（21）の間に
送り込まれた第１の半田テープ（４Ａ）の幅方向中央部
分を圧潰することによって、その上面にスペーサ用粒子
（６）の充填用凹溝（22）を形成する。また、上記凹溝
（27）内に第１の半田テープ（４Ａ）の耳部が圧入され
ることによって第１の半田テープ（４Ａ）の幅方向両端
には、図１（Ｂ）及び（Ｃ）に示すように、スペーサ用
粒子（６）のこぼれ落ち防止手段として、畝状に延びる
段部（28）が形成される。A shaping roller (21) located above the rolling roller (24) with the first solder tape (4A) interposed therebetween.
The central portion of the circumferential surface is formed into a convex pressing surface (23) over a predetermined width dimension, and concave grooves (27) are formed on both sides of the convex pressing surface. The convex pressing surface (23)
Is a spacer particle (6) on the upper surface of the first solder tape (4A) fed between the rolling roller (24) and the shaping roller (21) by crushing the central portion in the width direction. To form a filling groove (22). In addition, by pressing the ears of the first solder tape (4A) into the recessed groove (27), the widths of both ends of the first solder tape (4A) in the width direction of FIGS. As shown in (), a step portion (28) extending like a ridge is formed as a means for preventing the spacer particles (6) from falling off.
【００１４】以下、本発明装置（20）の作動要領を説明
する。第１の半田テープ（４Ａ）を賦形加工用ローラ
（21）と圧延ローラ（24）で加圧し、凸状の押圧面（2
3）を食い込ませることによって第１の半田テープ（４
Ａ）の上面中央部分に凹溝（22）を形成する。この凹溝
（22）の賦形加工と同時に、その両側の耳部は、賦形加
工用ローラ（21）で上記凸状の押圧面（23）に隣り合っ
て形成されている凹溝（27）内に圧入される。この結
果、第１の半田テープ（４Ａ）の上面耳部には、畝状に
延びる段部（28）が賦形加工される。The operating procedure of the device (20) of the present invention will be described below. The first solder tape (4A) is pressed by the shaping roller (21) and the rolling roller (24), and the convex pressing surface (2
3) The first solder tape (4
A groove (22) is formed in the central portion of the upper surface of (A). Simultaneously with the shaping of the concave groove (22), the ears on both sides of the concave groove (22) are formed adjacent to the convex pressing surface (23) by the shaping roller (21). ) Is press-fitted in. As a result, a step portion (28) extending in a ridge shape is formed on the upper surface ear portion of the first solder tape (4A).
【００１５】凹溝（22）及び畝状段部（28）の賦形加工
を終了した第１の半田テープ（４Ａ）は、ホッパ（７）
の下端開口部に向って恒速移動し、ホッパ（７）の下方
に到達したとき、上記凹溝（22）内に所定量のスペーサ
用粒子（６）を充填される。この後、第１の半田テープ
（４Ａ）は、凹溝（22）内にスペーサ用粒子（６）を充
填された状態のまま、第２の半田テープ（４Ｂ）と重ね
合わせ状態で圧着ローラ（25Ａ）（25Ｂ）の間に押し込
まれ、図示しない加熱手段で加熱されながら圧着ローラ
（25Ａ）（25Ｂ）から圧縮荷重を受けることによって第
１及び第２の半田テープ（４Ａ）（４Ｂ）を一体に圧着
し、スペーサ用粒子（６）を凹溝（22）内に封着したス
ペーサ入り半田（26）として系外に送り出される。The first solder tape (4A) on which the shaping process of the concave groove (22) and the ridge-shaped step (28) is completed is the hopper (7).
When it reaches the lower side of the hopper (7) at a constant speed toward the opening at the lower end thereof, the recessed groove (22) is filled with a predetermined amount of spacer particles (6). After that, the first solder tape (4A) is in a state of being filled with the spacer particles (6) in the concave groove (22), and in a state of being superposed with the second solder tape (4B), the pressure roller ( The first and second solder tapes (4A) and (4B) are integrated by being pressed between 25A) and (25B) and receiving a compressive load from the pressure bonding rollers (25A) (25B) while being heated by a heating means (not shown). Then, the particles (6) for spacer are pressed out to the outside of the system as spacer-containing solder (26) sealed in the groove (22).
【００１６】[0016]
【発明の効果】本発明によれば、第１の半田テープ（４
Ａ）の上面に設けられた凹溝（22）をスペーサ用粒子
（６）の収納用凹部として機能させることによって、半
田テープ（４Ａ）の耳部からのスペーサ用粒子（６）の
こぼれ落ちが防止される。この結果、スペーサ入り半田
（26）の単位面積当たりのスペーサ用粒子（６）の充填
量が一定になり、このスペーサ入り半田（26）を半導体
ペレット（２）のマウント媒体として使用したとき、ス
ペーサ用粒子（６）の不均一分布に起因する品質欠陥の
発生防止に顕著な効果が発揮される。According to the present invention, the first solder tape (4
By preventing the recessed groove (22) provided on the upper surface of (A) from functioning as a recess for accommodating the spacer particles (6), the spacer particles (6) are prevented from spilling from the ears of the solder tape (4A). To be done. As a result, the filling amount of the spacer particles (6) per unit area of the spacer-containing solder (26) becomes constant, and when the spacer-containing solder (26) is used as a mount medium for the semiconductor pellet (2), A remarkable effect is exerted in preventing the occurrence of quality defects due to the non-uniform distribution of the working particles (6).
【図１】（Ａ）は本発明に係るスペーサ入り半田の製造
装置の全体構造を説明する正面図である。（Ｂ）は賦形
加工用ローラの側面図である。（Ｃ）は図１（Ａ）の線
II−IIに沿うスペーサ入り半田の横断面図である。FIG. 1A is a front view for explaining the overall structure of a solder-containing solder manufacturing apparatus according to the present invention. (B) is a side view of the shaping roller. (C) is the line of FIG. 1 (A)
It is a transverse cross-sectional view of the solder with a spacer along II-II.
【図２】スペーサ入り半田による半導体ペレットのマウ
ント順序の説明図である。FIG. 2 is an explanatory diagram of a mounting order of semiconductor pellets with solder with a spacer.
【図３】スペーサ入り半田製造の従来例の説明図であ
る。FIG. 3 is an explanatory diagram of a conventional example of manufacturing solder with spacers.
４Ａ 半田テープ ４Ｂ 半田テープ ６ スペーサ用粒子 ７ ホッパ 20 スペーサ入り半田の製造装置 21 賦形加工用ローラ 22 凹溝 23 凸状押圧面 24 圧延ローラ 25Ａ 圧着ローラ 25Ｂ 圧着ローラ 26 スペーサ入り半田 27 凹溝 28 畝状段部 4A Solder tape 4B Solder tape 6 Spacer particles 7 Hopper 20 Solder manufacturing equipment with spacer 21 Forming roller 22 Concave groove 23 Convex pressing surface 24 Rolling roller 25A Crimping roller 25B Crimping roller 26 Spacer solder 27 Concave groove 28 Ridged step
Claims (2)
部を残した状態で当該半田テープの上面に長手方向に沿
ってスペーサ用粒子の充填用凹溝を形成する工程と、こ
の凹溝内にスペーサ用粒子を充填する工程と、このスペ
ーサ用粒子を充填された上記第１の半田テープの上面に
第２の半田テープを圧着し、上記スペーサ用粒子を上記
凹溝内に封着する工程とを含むことを特徴とするスペー
サ入り半田の製造方法。1. A step of forming recessed grooves for filling spacer particles along the longitudinal direction on the upper surface of the solder tape while leaving ridge-shaped steps on both ends of the upper surface of the first solder tape, and The step of filling spacer particles in the groove, and the second solder tape is pressure-bonded to the upper surface of the first solder tape filled with the spacer particles to seal the spacer particles in the groove. And a step of attaching the spacer to the solder.
に向って円周面の中央部分に凸状の押圧面を形成し、か
つ、この凸状押圧面の両側に凹溝を形成してなる賦形加
工用ローラと、スペーサ用粒子の供給用ホッパと、半田
テープの圧着ローラとを順次配設したことを特徴とする
スペーサ入り半田の製造装置。2. A convex pressing surface is formed in the central portion of the circumferential surface from the upstream side to the downstream side of the running area of the solder tape, and concave grooves are formed on both sides of the convex pressing surface. An apparatus for manufacturing spacer-containing solder, comprising: a shaping roller, a spacer particle supplying hopper, and a solder tape pressure bonding roller, which are sequentially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8167793A JPH06285686A (en) | 1993-04-08 | 1993-04-08 | Method and device for manufacturing solder containing spacer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8167793A JPH06285686A (en) | 1993-04-08 | 1993-04-08 | Method and device for manufacturing solder containing spacer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06285686A true JPH06285686A (en) | 1994-10-11 |
Family
ID=13752989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8167793A Withdrawn JPH06285686A (en) | 1993-04-08 | 1993-04-08 | Method and device for manufacturing solder containing spacer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06285686A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2007125991A1 (en) * | 2006-04-28 | 2007-11-08 | Senju Metal Industry Co., Ltd. | Foam solder and electronic component |
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| JP5369682B2 (en) * | 2006-04-28 | 2013-12-18 | 千住金属工業株式会社 | Foam solder and electronic components |
| WO2007125991A1 (en) * | 2006-04-28 | 2007-11-08 | Senju Metal Industry Co., Ltd. | Foam solder and electronic component |
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| JP2008178903A (en) * | 2007-01-26 | 2008-08-07 | Mitsubishi Materials Corp | Solder sheet and power module |
| CN101905386A (en) * | 2010-08-20 | 2010-12-08 | 芯通科技（成都）有限公司 | Solder-flux combined preformed soldering tin sheet |
| JP2012246536A (en) * | 2011-05-27 | 2012-12-13 | Nippon Steel Corp | Interconnector for solar cell and method for manufacturing the interconnector, and solar cell module |
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