JPH07111202A - Method for breaking substrate material for chip parts - Google Patents

Abstract

PURPOSE:To make the bending moment applied to a substrate for obtaining multiple individual substrates for chip parts and breaking angle of the substrate nearly constant by making belts used for breaking the substrate endless by using a large-diameter roller and small-diameter rollers. CONSTITUTION:A bar-shaped substrate piece 3 cut along transversal cutting lines 2b is carried in the extent C of a carrying means A from the entrance to the extent C towards the carrying surface 5a of an upper carrying endless belt 5. The piece 3 carried in the extent C is moved in the direction shown by the arrow D while the piece 3 is held between the carrying surfaces 5a of the upper belt 5 and a lower belt 5. When the piece 3 approaches the exit from the extent C, the piece 3 is put between an upper roller 4a pressed against a lower roller 4b by means of a cylinder 6 through a connecting bar 8 and the lower roller 4b through the endless belts 5. Therefore, a constant bending moment is always applied to the piece 3 and the breaking angle of the substrate can be fixed for breaking the piece 3, because the piece 3 is broken by means of the endless belts 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of breaking a substrate material for chip parts.

[0002]

2. Description of the Related Art In general, a method of breaking a substrate material in a chip component is, for example, in the case of a chip resistor, made of ceramic or the like having a plurality of vertical stripes and horizontal stripes engraved in a grid pattern on its surface. After manufacturing the plate-shaped substrate along each of the vertical stripes, the bar-shaped substrate piece is manufactured along the horizontal stripes and broken into the individual substrates for the chip resistors.

When breaking the rod-shaped substrate piece into individual substrates, conventionally, a breaking device as shown in FIG. 7 has been used. This breaking device X ′ includes a transporting means A ′ for transporting the rod-shaped substrate piece 22 and a breaking means B ′ for breaking the rod-shaped substrate piece 22 transported by the transporting means A ′ to the individual substrate 1. It will be.

The transport means A'is composed of a roller 23 rotated by a motor (not shown), and a pair of upper and lower transport belts 24 that move with the rotation of the roller 23. Since the conveyor belt 24 conveys while sandwiching the rod-shaped substrate piece 22, the conveyor belt 2 has a predetermined range C ′,
The four transport surfaces 24a are arranged vertically so as to face each other.

As shown in FIG. 8A, the conveyor belt 24 is formed by cutting a plate-like rubber 25 made of silicone resin or the like having a predetermined thickness into an appropriate width (along the two-dot chain line in the figure). As shown in FIG. 8B, both ends 25b of the long rubber 25a are joined together by a commonly used thermocompression bonding to form a belt.

The breaking means B'is composed of the upper roller 23a.
And the lower roller 23b, and is arranged at one end (right end in the figure) of the above range C '. The upper roller 23a is
The diameter is larger than the diameter of the lower roller 23b. The upper roller 23a is a pneumatic cylinder 2
It is provided so that it can be pressed in the direction of the lower roller 23b through the connecting bar 26 by the extension force by the operation of 5.

Next, a breaking method for breaking the rod-shaped substrate piece 22 to the individual substrate 1 by using the breaking device X'will be described. First, the rod-shaped substrate piece 22 is inserted between the upper and lower conveyor belts 24a along the longitudinal direction of the rod-shaped substrate piece 22 from the other end (the left end in the figure) of the range C ′ by a belt conveyance not shown. To be done. Then, the rod-shaped substrate piece 22
Is conveyed in the D ′ direction which is the moving direction of the conveyor belt while being sandwiched by the upper and lower conveyor belts 24. Then, at one end of the range C ′ (the right end in the figure), the rod-shaped substrate piece 22
Is broken on the individual substrate 1 along the horizontal stripes as follows.

As shown in FIG. 9, when the center position of the upper roller 23a is displaced from the center position of the lower roller 23b by the dimension E'in the carrying direction, the upper roller 23a is moved to the center position of the upper roller 23a. Is pressed by the cylinder 25 toward the center position of the lower roller 23b. For this reason, the rod-shaped substrate piece 22 to be conveyed is subjected to a tangential pressing force at the contact points of the upper and lower rollers when passing between the upper and lower rollers,
Bending moment M'is added. Then, the rod-shaped substrate piece 2 which is the weakest portion against the bending moment M ′
The stress is concentrated on the second horizontal line 22b,
The individual substrate 1 is broken along b. (The chain double-dashed line indicates the individual substrate to be broken.)

[0009]

However, when the rod-shaped substrate piece 22 is broken to the individual substrate 1 by the above-mentioned method in the manufacture of the chip component such as the conventional chip resistor, the break angle becomes smaller than the standard size. Come off. For this reason,
Since the chip resistor having a defective dimension is easily manufactured, the yield is very low.

The present invention was devised under the above circumstances, and occurs when a substrate material such as a rod-shaped substrate in a chip component is broken into an individual substrate for a chip component,
An object of the present invention is to provide a method of breaking a substrate material for a chip component, which reduces dimensional defects such as a break angle and improves the yield.

[0011]

It was very difficult to clarify the cause of the dimensional defect of the break angle of the individual substrate for chip components as described above. However, the present inventors have conducted diligent research and experiments. As a result of repeated studies, a means for solving the above problems was found. That is, the present invention provides the following means.

"A substrate material for obtaining a plurality of individual substrates for chip parts by breaking is moved while being sandwiched by a pair of belts arranged substantially opposite to each other, and the substrate material is pressed through the belt. In the method of breaking the substrate material for chip parts to obtain individual substrates, in which the substrate material is broken by a large-diameter roller and a small-diameter roller, the belt is endless Breaking method. "

[0013]

According to the present invention, a substrate material for obtaining a plurality of individual substrates for chip parts is moved in a belt in an endless belt, in which the substrate material is in close contact with the belt and is clamped in a stable state. By being pressed by the large-diameter roller and the small-diameter roller, a force that constantly presses down in the direction perpendicular to the tangent line is always applied at the contact point between the large-diameter roller and the small-diameter roller. Since a constant bending moment is always applied to the plate material, stress concentrates on the specified part of the board material, which is the place where the strength against the bending moment is the weakest, and the individual board for chip components is stabilized from the board material at a specified angle. Is broken.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 6 by taking a method of breaking a rod-shaped substrate in a chip resistor as an example. First, the chip resistor is shown in Fig. 1.
A plurality of vertical streak lines 2a and horizontal streak lines 2b are engraved in a grid pattern on the surface of a plate-like substrate 2 made of ceramic as shown in (a), while an electrode and a resistive film are formed on the surface of the material substrate 2. After forming the protective film, the material substrate 2 is attached to each vertical line 2a.
1B, a bar-shaped substrate piece 3 as shown in FIG. 1 is broken, and then a conductive paste is applied to both left and right long side surface edges of the bar-shaped substrate piece 3 and then baked. A film is formed, and then, the rod-shaped substrate pieces 3 are manufactured in the order of breaking along the respective horizontal streak lines 2b into individual substrates for individual chip resistors as shown in FIG. 1C.

A rod-shaped substrate piece 3 manufactured in the order as described above.
The (substrate material) is broken into individual substrates 1 (individual substrates) for individual chip resistors by using a breaking device X as shown in FIG. The breaking device X is a carrying unit A for carrying a rod-shaped substrate piece 3 including a plurality of individual substrates 1.
And a breaking means B for breaking the rod-shaped substrate 3 into the individual substrate 1 (the same structure as the conventional one).

The conveying means A is composed of a plurality of rotating rollers 4 which rotate in a fixed direction by the operation of a motor (not shown) which has been conventionally used, and a conveying belt 5 (belt) which moves with the rotation of the rotating rollers 4. ). The rotating roller 4 is arranged at an appropriate position.
The conveyor belt 5 is manufactured as follows.

As shown in FIG. 3 (a), a plate-like body 4 made of a silicone resin having a predetermined thickness is punched out from a conventionally used press die (not shown) to form a continuous annular wire ( By cutting along the chain double-dashed line in FIG. 3 and punching out, a continuous, seamless, endless conveyor belt 5 as shown in FIG. 3B.
To get. The width of the conveyor belt 5 is equal to the thickness of the plate body 4.

In this embodiment, the seamless conveyor belt 5 is obtained by punching with a press die.
The present invention is not limited to this, and it can be obtained by extrusion type injection molding or the like. In the conveyor belt 5 thus manufactured, the conveyor belts 5 are arranged vertically so that the conveyor surfaces 5a of the conveyor belt 5 face each other in a certain range C in FIG. Further, at one end of the range C (the left end in the figure), the upper and lower conveyor belts 5 are separated from each other so as to have a width slightly smaller than the thickness 3a of the rod-shaped substrate piece 3.

In the range C, the upper and lower conveyor belts 5 are moving in the same direction D. The breaking means B (which may have the same structure as that used conventionally) may be approximately 100.
The upper roller 4a has a diameter of mm (large diameter roller) and the lower roller 4b has a diameter of about 9 mm (small diameter roller).

The upper roller 4a is arranged at one end of the range C (the right end in the figure), and with respect to the lower roller 4b.
The diameter is about 10 times or more. The upper roller 4a is connected at both ends via a rod-shaped connecting bar 8 to a pneumatic cylinder 6 and a bearing holder 7 provided with a rotatable bearing (not shown). 4b is pressed downward.

Next, a method of breaking the rod-shaped substrate piece 3 into the individual substrate 1 by using such a breaking device will be described. First, as shown in FIG. 2 again, the rod-shaped substrate piece 3 is conveyed by a conventionally-used belt conveyor (not shown), and the horizontal streak lines 2b engraved on the belt-shaped substrate piece 3 are formed on the conveyor surface 5 of the upper conveyor belt 5.
Along the long side direction of the rod-shaped substrate piece 3 toward a, it is conveyed from the range C inlet of the conveying means A into the range C. And
The rod-shaped substrate piece 3 transported into the range C moves in the D direction while being sandwiched between the transport surfaces 5 a of the upper and lower transport belts 5. That is, the rod-shaped substrate piece 3 is sandwiched between the upper and lower conveyor belts 5 which are endless without a seam in a stable state with substantially no gap and move in the D direction.

Further, when the rod-shaped substrate piece 3 moves to the vicinity of the exit of the range C, it is conveyed between the upper roller 4a and the lower roller 4b, which is pressed in the direction of the lower roller 4b by the cylinder 6 via the connecting bar 8. The rod-shaped substrate piece 3 is sandwiched by the belt 5, and a substantially constant bending moment is always applied to the rod-shaped substrate piece 3, and the individual substrate 1 is broken along the horizontal stripes engraved on the rod-shaped substrate piece 3.

That is, as shown in FIG. 4, the center position of the upper roller 4a is shifted from the center position of the lower roller 4b in the carrying direction by the dimension E in the carrying belt 5, and the upper roller 4a is Pressure is applied from the shifted center position toward the center position of the lower roller 4b. Therefore, the endless transport surface 5
The bar-shaped substrate piece 3 which is sandwiched between a and conveyed between the upper and lower rollers is constantly subjected to a force that is constantly pressed in the direction perpendicular to the tangent line at the contact points of the upper and lower rollers, so that the bending moment M is always constant. Is a portion where the strength against the bending moment M is the weakest. That is, the rod-shaped substrate piece 3
The stress is concentrated on the horizontal streak line 2b, and the individual substrate 1 is broken at a constant break angle along the horizontal streak line 2b.

In this embodiment, the method of breaking the rod-shaped substrate to the individual substrate as a break from the substrate material to the individual substrate has been described. However, the invention is not limited to this, and when breaking from the plate-shaped substrate to the rod-shaped substrate. It is also applicable to. Further, although the chip resistor is taken as an example in the present embodiment, the present invention is not limited to this, and can be widely applied to other chip parts.

Next, the conventional break method described above will be described in comparison with this embodiment. That is, in the conventional method, the rod-shaped substrate piece 3 is transported by the transport belt 9 having a seam and broken on the individual substrate 1. As shown in FIG.
The rod-shaped substrate piece 3 has a conveyor belt 9 in the vicinity of the horizontal streak line 2b.
The break may occur while riding on the upper convex joint 9a, and at this time, the bending moment applied to the rod-shaped substrate piece 3 acts more than usual (a portion other than the joint of the conveyor belt). In addition, a crack is formed at a break angle H larger than the normal break angle G and the break occurs. For this reason, in the manufacture of the chip resistors, when the chip resistors are individually broken, an individual substrate with a large break angle and dimensional defects is generated, and the yield is significantly reduced.

Data is provided below to demonstrate this. In FIG. 6, the vertical axis shows the break angle of the chip resistor, and the horizontal axis shows the conditions of each conveyor belt. As is apparent from FIG. 6, when the conveyor belt has a seam, it is understood that an individual substrate having a large break angle dimension defect occurs, and according to the present invention, such a large break angle dimension defect occurs. Therefore, the individual substrate can be broken at a stable break angle without being generated.

[0027]

As described above, according to the present invention, when a substrate, which becomes a plurality of chip parts by breaking, is broken into individual chip parts, the substrate is sandwiched by an endless conveyor belt and has a large diameter. Since the substrate is pressed by pressing the roller and the roller of small diameter via the belt, the bending moment applied to the substrate at the time of breaking can be made constant,
Since the break angle is substantially constant, dimensional defects such as the break angle can be reduced, and the yield can be significantly improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a breaking process of a chip resistor used in a substrate breaking method in a chip component of the present invention.

FIG. 2 is a schematic view showing a breaking device used in a method of breaking a substrate in a chip component of the present invention.

FIG. 3 is a perspective view showing a method of manufacturing a belt used in a method of breaking a substrate in a chip part of the present invention.

FIG. 4 is a side view of essential parts showing a state of breaking a rod-shaped substrate according to the substrate breaking method in the chip component of the present invention.

FIG. 5 is a side view of essential parts showing a break of a rod-shaped substrate using a conventional belt with a seam, which is compared with the substrate breaking method in the chip part of the present invention.

FIG. 6 is a comparative diagram showing data for comparing a break angle of a substrate by a method of breaking a substrate in a chip component of the present invention and a break angle of a substrate when a conventional belt with a joint is used.

FIG. 7 is a schematic view showing a breaking device according to a conventional substrate breaking method in a chip component.

FIG. 8 is a plan view and a perspective view showing a manufacturing process of a belt used in a conventional substrate breaking method for a chip component.

FIG. 9 is a side view of essential parts showing how a substrate is broken according to a conventional substrate breaking method in a chip component.

FIG. 10 is a side view of a chip resistor for explaining a break angle of the chip resistor according to a method of breaking a substrate in a chip component.

[Explanation of symbols]

 1 Individual Substrate 2 Plate-shaped Substrate 3 Rod-shaped Substrate Piece 4 Rotating Roller 5 Conveyor Belt 6 Cylinder 7 Bearing Holder 8 Connecting Bar 9 Conveyor Belt with Seam

Claims (1)

[Claims] 1. A substrate material for obtaining a plurality of individual substrates for chip parts by breaking is moved in a sandwiched state by a pair of belts arranged substantially opposite to each other, and the substrate material is passed through the belt. In the method of breaking a substrate material for chip components for obtaining an individual substrate, the substrate material is broken by a large-diameter roller for pressing and a small-diameter roller, wherein the belt is endless. Breaking method for substrate materials for chip parts.