JP2000156308A - Breaking method of substrate material for chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the breaking method of a substrate material for chip, with which the dimensional defects of each substrate, caused by the change of breaking angle generated when each substrate for chip from the substrate material such as a rod-like substrate piece, etc., can be decreased, and the yield of production can be improved. SOLUTION: In this breaking method wherein individual substrates are obtained by breaking rod-like substrate piece 13 using a large diameter roller 18 and a small diameter roller 19, to be used to press the rod-like substrate 13 through a conveying belt 14 while the pinched rod-like substrate piece 13 is being moved opposingly by a pair of conveying belt 14 retained by a plurality of rollers 15, 16 and 17; the conveying belt 14 is formed by laminating a rubber material and a core material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for breaking a substrate material for chip components.

[0002]

2. Description of the Related Art As a conventional method for breaking a substrate material for a chip component, a method described in Japanese Patent Application Laid-Open No. 7-111202 is known.

A method of breaking a rod-shaped substrate in a conventional chip resistor will be described with reference to FIGS.

FIGS. 5 (a) to 5 (c) are plan views showing a breaking process of a chip resistor used in a conventional method of breaking a substrate for a chip component. 5A to 5C, reference numeral 1 denotes an individual substrate. 2 is a plate-shaped substrate. Reference numeral 2a denotes a plurality of vertical stripes engraved on the plate-like substrate 2. 2b
Are a plurality of horizontal stripes engraved on the plate-like substrate 2. 3
Is a bar-shaped substrate piece.

FIG. 6 is a front view showing a breaker used in a conventional method for breaking a chip component substrate material. FIG.
In the figure, 3 is a bar-shaped substrate piece. 3a is a bar-shaped substrate piece 3
Is the thickness. Reference numeral 4 denotes a plurality of rotating rollers appropriately disposed at appropriate locations so as to be inscribed in the transport belt 5. Reference numeral 4a denotes an upper roller (large-diameter roller) attached to the connecting lever 6 so as to contact the inner surface of the upper conveyor belt 5, and the center position thereof is in the conveying direction from the center position of the lower roller (small-diameter roller) 4b. It is out of alignment. 4b is a lower roller (small diameter roller) in contact with the inner surface of the lower conveyor belt 5
It is. 5 is held by a plurality of rotating rollers 4,
In addition, a pair of upper and lower endless transport belts that travel by rotating the rotating roller 4. 5a is a conveyor belt 5
The pair of transport belts 5 are disposed such that a gap between the transport surfaces 5a is slightly smaller than the thickness of the rod-shaped substrate piece 3. Reference numeral 7 denotes a pneumatic cylinder. The cylinder 7 is connected to the other end of a rod-shaped connecting lever 6 having a bearing holder 8 rotatably disposed on the left side of the upper roller 4a. Reference numeral 8 denotes a bearing holder that is disposed inside the upper conveyor belt 5 and to the left of the upper roller 4a, and serves as a support when pressing the upper roller 4a and a fulcrum when swinging. A is a range in which the bar-shaped substrate piece 3 is sandwiched between the pair of transport belts 5.

FIGS. 7 (a) and 7 (b) are perspective views showing a method of manufacturing a conveyor belt used in a conventional method for breaking a chip component substrate material. Reference numeral 9 denotes a plate made of silicone resin, which is a raw material of the conveyor belt 5. 5 is the plate 9
Is a continuous and seamless endless conveyor belt formed by punching a press die.

FIG. 8 is a side view of a main part showing how a bar-shaped substrate is broken according to a conventional method for breaking a chip component substrate material. In FIG. 8, reference numeral 1 denotes an individual substrate. 2
“b” is a horizontal streak line engraved on the plate-like substrate 2. 3 is a bar-shaped substrate piece. 4a is an upper roller. 4b is a lower roller. Reference numeral 5 denotes a transport belt. Reference numeral 5a denotes a transport surface of the transport belt 5. E is a displacement dimension in the transport direction between the center position of the upper roller 4a and the center position of the lower roller 4b. M
Is a bending moment received by the rod-shaped substrate piece 3 in the vicinity of a contact point between the upper roller 4a and the lower roller 4b via the transport belt 5.

[0008] A conventional breaking method for a substrate material for a chip component configured as described above will be described below with respect to the breaking process.

First, a method of manufacturing a chip resistor will be described. As shown in FIG. 5A, a plurality of vertical lines 2a and horizontal lines 2b are formed on a surface of a plate-like substrate 2 made of a ceramic substrate. Engraved in the shape.

Next, an electrode, a resistor and a protective film are sequentially formed on the surface of the plate-like substrate 2. Next, the plate-shaped substrate 2 is broken along each vertical line 2a into a bar-shaped substrate piece 3 as shown in FIG. 5B, and conductive is applied to the left and right side edges of the rod-shaped substrate piece 3 in the longitudinal direction. After applying the conductive paste, firing is performed to form side terminal electrodes.

Finally, the rod-shaped substrate piece 3 is placed on each horizontal line 2
5 (c) along the individual substrates 1 for individual chip resistors.

A conventional method for breaking a substrate material for a chip component constructed and manufactured as described above will be described below.

First, in the breaker shown in FIG. 6, the horizontal line 2b engraved on the rod-shaped substrate piece 3 is conveyed to the upper conveyor belt 5 by the conventional belt conveyance (not shown). The material is supplied between the opposing transfer surfaces 5a of the upper and lower transfer belts 5 along the long side direction of the bar-shaped substrate piece 3 toward the transfer surface 5a.

Next, the supplied bar-shaped substrate piece 3 moves toward the upper roller 4a and the lower roller 4b while being sandwiched between the transport surfaces 5a of the upper and lower transport belts 5.

Finally, when the tip of the bar-shaped substrate piece 3 moves beyond the contact portion between the lower roller 4b and the lower conveyor belt 5, the upper roller 4a pressing in the direction of the lower roller 4b and the lower roller 4a are pressed. A bending moment M is applied to the rod-shaped substrate piece 3 sandwiched between the roller 4b and the upper and lower transport belts 5 via the transport belt 5.
Are added, and the horizontal line 2b engraved on the rod-shaped substrate piece 3 is added.
Along the individual substrate 1.

[0016]

In this type of chip component substrate material breaking method, when the transport belt 5 pressed during the break is caused to travel, the transport belt 5 is not defeated by the pressure during the break. However, since the conventional transport belt 5 is made of silicone resin alone, when the tension necessary for running the transport belt 5 is given, the transport belt 5 has a longer circumference due to elongation. Become. As a result, a portion where the thickness of the transport belt 5 is partially reduced occurs, and the thickness of the transport belt 5 varies, so that the rod-shaped substrate is sandwiched between the upper roller 4a and the lower roller 4b via the transport belt 5. When the individual substrate 1 is obtained by breaking the piece 3, the bending moment M with respect to the bar-shaped substrate piece 3 changes between the thick portion and the thin portion of the transport belt 5, resulting in a change in the break angle. In addition, there is a problem that the dimensional defect and chipping of the individual substrate 1 occur.

The present invention solves the above-mentioned conventional problems, and has a dimensional defect of an individual substrate due to a change in a break angle which occurs when an individual substrate for a chip component is broken from a substrate material such as a bar-shaped substrate piece in a chip component. It is an object of the present invention to provide a method for breaking a chip component substrate material that can reduce chipping and chipping and improve the yield.

[0018]

In order to achieve the above object, a method of breaking a chip component substrate material according to the present invention comprises a substrate material for obtaining a plurality of individual chip component substrates by breaking. A large-diameter roller and a small-diameter roller for pressing the substrate material via the transport belt while moving in a sandwiched state by a pair of transport belts held by a plurality of rollers so as to face each other. In the method of breaking a substrate material for a chip component to obtain an individual substrate by breaking the substrate material, the transport belt is configured by laminating a rubber material and a core body. Reduces dimensional defects and chipping of individual substrates due to changes in break angles that occur when breaking individual substrates for chip components from substrate materials such as bar-shaped substrate pieces. It is capable to improve the yield.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a substrate material for obtaining a plurality of individual substrates for chip components by breaking is stretched on a plurality of rollers so as to be substantially opposed to each other. A large-diameter roller and a small-diameter roller for pressing the substrate material through the transport belt while moving the substrate material in a sandwiched state by a pair of transport belts held thereon to obtain individual substrates. In the method for breaking a chip component substrate material, the transport belt is formed by bonding a rubber material and a core. According to this breaking method, the transport belt is formed by bonding a rubber material and a core body. Therefore, even if tension is applied to the transport belt when the transport belt is held by a plurality of rollers, the transport belt has a core, It is possible to suppress the conveyance belt circumference from becoming longer in the I, the thickness of a conventional conveyor belt as it is no longer problem that partially thinner.
Then, since the thickness variation of the entire transport belt does not occur, when the substrate material sandwiched between the pair of transport belts by the large-diameter roller and the small-diameter roller is obtained to obtain an individual substrate, Since a constant bending moment can be applied to the substrate material, and as a result, the break angle does not change as in the conventional case, it has an effect that the break can be surely made along the line of sight. It is.

According to a second aspect of the present invention, a rubber material in a conveyor belt formed by laminating a rubber material and a core is brought into contact with a substrate material to cause a break.
According to this breaking method, when the substrate material is divided while being sandwiched between the pair of conveyor belts, the elasticity of the rubber material acts, thereby preventing the substrate material from being damaged and chipped. It has.

According to a third aspect of the present invention, the conveying belt is constituted by interposing a core between rubber members. According to this breaking method, rubber members are respectively attached to the front and back surfaces of the core. Because of the combined shape, one of the rubber materials comes into contact with the substrate material, so that when the substrate material is divided while sandwiched between a pair of conveyor belts, the elasticity of the rubber material To prevent chipping due to scratches, and the other rubber material is used to prevent slippage between the conveyor belt and the roller against the load caused by the pressure when breaking. This has the effect that power can be transmitted reliably.

According to a fourth aspect of the present invention, the core body is made of polyethylene canvas. According to the breaking method, since the polyethylene canvas has a large tensile strength and is tough, the polyethylene canvas has a plurality of rollers. Even if it is held, it has the effect that the change in the circumference is small.

Hereinafter, a method for breaking a substrate material for a chip component according to an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.

FIGS. 1A to 1C are plan views showing a breaking process of a chip resistor used in a method of breaking a substrate for a chip component according to an embodiment of the present invention. FIG.
11A to 11C, reference numeral 11 denotes an individual substrate. 12
Is a plate-like substrate. Reference numeral 12a denotes a plurality of vertical lines engraved on the plate-like substrate 12. Reference numeral 12b denotes a plurality of horizontal stripes engraved on the plate-like substrate 12. 13 is a bar-shaped substrate piece.

FIG. 2 is a front view showing a breaking device used in a method for breaking a substrate for chip components according to an embodiment of the present invention. In FIG. 2, 13 is a horizontal line 12
This is a bar-shaped substrate piece placed with b as the upper surface. Reference numeral 14 denotes a pair of conveyor belts. The pair of conveyor belts 14 are provided with a polyethylene canvas as a core that suppresses belt elongation against tension, and rubber materials are bonded to the front and back surfaces of the core by thermocompression bonding or the like. It consists of. The width of the pair of transport belts 14 is wider than the width of the bar-shaped substrate pieces 13 arranged so that the transport surfaces face each other (the interval between the vertical stripes 12a). In addition, the pair of transport belts 14 are arranged such that the upper transport belt 1 has a small thickness variation of the rubber material.
4 is held by a plurality of rotating rollers 17, and the lower conveyor belt 14 is held by a driving roller 15 and a tension adjusting roller 16. 15 is a substrate material,
That is, the driving roller 15 is disposed at the end of the movement of the bar-shaped substrate piece 13, and the driving roller 15 causes the lower conveyor belt 14 to run by the frictional force between the conveyor belt 14 and the rubber material. Reference numeral 16 denotes a tension adjusting roller disposed in the vicinity of the supply of the bar-shaped substrate piece 13. The tension adjusting roller 16 presses the bar-shaped substrate piece 13 with a large-diameter roller 18 to break the lower conveying belt 14. Is applied to make the vehicle travel without slipping. Reference numeral 17 denotes a plurality of rotating rollers appropriately disposed at appropriate locations. Reference numeral 18 denotes a large-diameter roller abutting on the inside of the upper conveyor belt 14. The large-diameter roller 18 is located near the center of the opposing portion of the conveyor belt 14 and slightly less than the center position of the small-diameter roller 19. The bar-shaped substrate piece 13
Is contributed when breaking. Reference numeral 19 denotes a small-diameter roller that contacts the inside of the lower conveyor belt 14. The small-diameter roller 19 is disposed near the center of the opposing portion of the conveyor belt 14. Is contributed when breaking.

FIG. 3 is a side sectional view of the upper and lower conveyor belts used in the method of breaking a chip component substrate material according to an embodiment of the present invention. 14a is a rubber material bonded to the surface side of the core 14c. 14b is a rubber material bonded to the back side of the core 14c. A core 14c is made of polyethylene canvas. The core 14c is formed by joining both ends of a long core cut to a predetermined width by, for example, sewing.

FIG. 4 is a main part side view showing a conventional method of breaking a rod-shaped substrate material using a silicon rubber conveyor belt, which is compared with a method of breaking a substrate material for chip components according to an embodiment of the present invention. is there. In FIG. 4, reference numeral 13 denotes a bar-shaped substrate piece. Reference numeral 18 denotes a large-diameter roller. 19 is a small-diameter roller. Reference numeral 20 denotes a conveyor belt made of silicone rubber. M1 is the bending moment received by the rod-shaped substrate piece 13 near the contact point between the large-diameter roller 18 and the small-diameter roller 19 via the conveyor belt 14 or 20.

The breaking process of the chip component substrate material breaking method according to one embodiment of the present invention will be described below.

First, a method of manufacturing a chip resistor will be described. As shown in FIG. 1A, a plurality of vertical lines 12a and horizontal lines 12b are formed on a surface of a plate-shaped substrate 12 made of a ceramic substrate. Engraved in the shape.

Next, an electrode, a resistor and a protective film are sequentially formed on the surface of the plate-like substrate 12. Next, the plate-shaped substrate 12 is broken along each vertical line 12a into a bar-shaped substrate piece 13 as shown in FIG. 1B, and conductive is applied to the left and right side edges of the rod-shaped substrate piece 13 in the longitudinal direction. After applying the conductive paste, firing is performed to form side terminal electrodes.

Finally, the rod-shaped substrate pieces 13 are manufactured in the order in which the rod-shaped substrate pieces 13 are broken along individual horizontal lines 12b to individual substrates 11 for individual chip resistors as shown in FIG. 1 (c).

The breaking method of the chip component substrate material according to the embodiment of the present invention constructed and manufactured as described above will be described below.

First, in the breaker shown in FIG. 2, the driving roller is set with the horizontal line 12b engraved on the rod-shaped substrate piece 13 facing upward by a conventional belt conveyance (not shown). 15 and the upper surface of the lower conveyor belt 14 held by the tension adjusting roller 16.

Next, the rod-shaped substrate piece 13 supplied to the lower transport belt 14 is transported by the lower transport belt 14 traveling as the drive roller 15 rotates. At the same time, the upper conveyor belt 14 is
The vehicle runs by rotating.

Next, the bar-shaped substrate piece 13 supplied to the upper surface of the lower transport belt 14 is sandwiched between the upper and lower transport belts 14 while being transported.

Next, the rod-shaped substrate piece 13 is conveyed while being sandwiched between the upper and lower conveyor belts 14 and moves toward the large-diameter roller 18 and the small-diameter roller 19.

Finally, when the leading end of the bar-shaped substrate piece 13 moves beyond the contact portion between the small-diameter roller 19 and the lower conveyor belt 14, the large-diameter roller 19 pressing in the direction of the small-diameter roller 19 moves. The rod-shaped substrate piece 1 sandwiched between the roller 18 and the small-diameter roller 19 via the upper and lower transport belts 14.
A substantially constant bending moment M1 is always applied to 3 and the individual substrate 11 is broken along the horizontal line 12b engraved on the bar-shaped substrate piece 13. In this case, in the case of the conveyor belt 20 made of silicon rubber shown in FIG. 4, a locally thin portion (indicated by a broken line in the figure) is generated due to thickness variation, and the bending moment applied to the bar-shaped substrate piece 13 changes to reduce the break angle. However, in one embodiment of the present invention, the upper and lower conveyor belts 14 are
Since this is configured by interposing a polyethylene canvas core 14c between the rollers b, such a thing hardly occurs, and as a result, the large-diameter roller 18 and the small-diameter roller 19 are transported via a transport belt. At the contact point, a force that constantly pushes down in a direction perpendicular to the tangent line is applied stably, and as a result, a stable bending moment M1 is applied. It is possible to break the individual substrate 11 at a fixed break angle along the horizontal line 12b of 13 without causing chipping of the substrate material.

Here, in the conventional example, the breaking is performed by the endless silicon rubber transfer belt 20, but the transfer belt 14 according to the embodiment of the present invention has the rubber members 14a, 14a.
4b, it is hardly affected by tension because the core 14c made of polyethylene canvas is interposed between 4b, so that the conveyor belt 14 is stable on the rod-shaped substrate piece 13 regardless of the presence or absence of the seam. A bending moment M1 can be applied.

In the above-described embodiment of the present invention, the method of breaking from the rod-shaped substrate piece 13 to the individual substrate 11 has been described. However, the present invention is not limited to this. 13 can also be applied. In the embodiment of the present invention, a chip resistor has been described as an example. However, the present invention is not limited to this, and can be applied to a case where another chip component is broken.

[0040]

As described above, in the method of breaking a substrate for chip components according to the present invention, a plurality of substrate members for obtaining a plurality of individual substrates for chip components by breaking are provided. While moving in a state of being sandwiched by a pair of transport belts held by rollers, the substrate material is broken by a large-diameter roller and a small-diameter roller for pressing the substrate material via the transport belt and individually. In the method for breaking a chip component substrate material for obtaining a substrate, the transport belt is formed by bonding a rubber material and a core. According to this breaking method, the transport belt is bonded to a rubber material and a core. The transport belt has a core even if tension is applied to the transport belt when the transport belt is held on a plurality of rollers because the transport belt is held together More, because this circumferential length of the conveyor belt by the core body can be prevented from being increased, the thickness of a conventional conveyor belt as it is no longer problem that partially thinner. And by this, since the thickness variation of the entire conveyor belt does not occur, when the substrate material sandwiched between the pair of conveyor belts by the large-diameter roller and the small-diameter roller is obtained to obtain an individual substrate,
A constant bending moment can be applied to the substrate material during a break, and as a result, the break angle does not change as in the past, so that it is possible to reliably break along the line of sight. It has an effect.

[Brief description of the drawings]

FIGS. 1A to 1C are plan views showing a breaking process of a chip resistor used in a method of breaking a substrate for a chip component according to an embodiment of the present invention.

FIG. 2 is a front view showing a breaking device used for a method of breaking a chip component substrate material according to an embodiment of the present invention.

FIG. 3 is a side sectional view of a conveyor belt used in a method for breaking a substrate for chip components according to an embodiment of the present invention.

FIG. 4 is a side view of a main part showing a method for breaking a rod-shaped substrate material using a conventional silicon rubber transport belt, which is compared with a method for breaking a chip material substrate material according to an embodiment of the present invention.

5 (a) to 5 (c) are plan views showing a breaking process of a chip resistor used in a conventional method for breaking a substrate material for a chip component.

FIG. 6 is a front view showing a breaker used in a conventional method for breaking a chip component substrate material.

FIGS. 7A and 7B are perspective views showing a method of manufacturing a transport belt used in a conventional method for breaking a chip component substrate material.

FIG. 8 is a main part side view showing a state in which a rod-shaped substrate is broken according to a conventional method of breaking a chip component substrate material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Individual board 12 Plate-shaped board 13 Bar-shaped board piece 14 Conveying belt 14a, 14b Rubber material 14c Core 15 Drive roller 16 Tension adjustment roller 17 Rotation roller 18 Large diameter roller 19 Small diameter roller

Claims (4)

[Claims] A substrate material for obtaining a plurality of individual substrates for chip components by breaking is moved while being sandwiched by a pair of transport belts stretched by a plurality of rollers so as to be substantially opposed to each other. In a method of breaking a substrate material for chip components for breaking the substrate material by a large-diameter roller and a small-diameter roller for pressing the substrate material via the transport belt to obtain an individual substrate,
A method of breaking a substrate for a chip component, wherein the conveyor belt is formed by laminating a rubber material and a core. 2. The chip component substrate material according to claim 1, wherein the rubber material in the conveyor belt formed by laminating the rubber material and the core is brought into contact with the substrate material to cause a break. Break method. 3. The method according to claim 1, wherein the conveyor belt is formed by interposing a core between rubber materials. 4. The method according to claim 1, wherein the core is made of polyethylene canvas.