JP2016207943A - Tabular object dividing device, processing device and tabular object dividing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tabular object dividing device capable of efficiently dividing a tabular object, a processing device and a tabular object dividing method.SOLUTION: A cover sheet C that does not have elasticity is stuck to a tabular object unit U and a tabular object W in the tabular object unit U that passes a first support part 711 and a second support part 712 is pressed in a Z axis direction by a pressing part 731. Since there is a step between the first support part 711 and the pressing part 731, when the tabular object W passes the first support part 711, the tabular object W can be efficiently divided along a predetermined dividing line at a support point of the first support part 711.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a plate-like object dividing device, a processing device, and a plate-like object dividing method.

  Cutting devices and laser processing devices are used for dividing semiconductor devices, optical device wafers, resin package substrates, ceramic substrates, glass substrates, and the like. Particularly in recent years, semiconductor wafers and optical device wafers have been known to be processed by dividing them into individual device chips by applying an external force using a modified layer formed inside the wafer as a starting point by irradiation with a laser beam ( Patent Documents 1 and 2).

  However, in an optical device wafer composed of a sapphire substrate or a SiC substrate, the application of an external force by a suction force as described in Patent Documents 1 and 2 has a small stress and is difficult to break. Therefore, division by a so-called guillotine method in which the pressing blade is pressed against the substrate is performed (Patent Document 3).

JP 2014-232763 A JP 2014-120508 A JP 2014-103340 A

  However, since the division method by the guillotine method divides line by line, in the case of a small chip device having a size of 0.3 mm or the like, the number of lines is large and it takes a long time to divide. It was.

  Then, this invention is made | formed in view of the above, Comprising: It provides the dividing device of a plate-shaped object which can divide | segment a plate-shaped object efficiently, a processing apparatus, and the dividing method of a plate-shaped object. Objective.

  In order to solve the above-described problems and achieve the object, the present invention provides a dicing tape in which a plate-like object having division start points formed along a predetermined division line that intersects each other and partitions a plurality of devices is formed at the opening of the annular frame. A plate-like object dividing device for dividing the plate-like object along the division starting point of a plate-like object unit supported via a bar-like member extending in the X direction longer than the diameter of the plate-like object The support means for supporting the plate unit from the dicing tape side, and the support means and the plate unit in the Y direction perpendicular to the X direction, which is the direction in which the support part extends. The moving unit that moves and the bar-shaped pressing portion that moves relative to the supporting unit and extends in the X direction presses the plate unit that has passed through the supporting unit in the Z direction perpendicular to the X direction and the Y direction. Pressing means and passing through the support means Characterized in that it comprises adjustment means for adjusting the direction of the dividing line of the platelet parallel to the X direction.

  In the plate-like object dividing apparatus, it is preferable that the support means includes a pair of support portions that allow passage while holding the plate-like object unit from the front and back sides.

  Further, in the plate-like material dividing device, a cover sheet attaching means for attaching an area protruding from the outer periphery of the plate-like material to the dicing tape while covering the exposed surface of the plate-like material with a non-stretchable cover sheet. It is preferable to provide.

  Further, in order to solve the above-described problems and achieve the object, the processing apparatus according to the present invention includes a dividing starting point along a planned dividing line on a plate-like object that includes a planned dividing line that intersects each other and partitions a plurality of devices. It is characterized by comprising processing means for forming a plate and a dividing device for the plate-like material.

  Further, in order to solve the above-described problems and achieve the object, the present invention provides a plate-like object in which a division starting point is formed along a planned division line that intersects each other and divides a plurality of devices into the opening of the annular frame. A method of dividing a plate-like object of a plate-like object unit supported by a dicing tape, wherein the cover sheet protruding from the outer periphery of the plate-like object is covered while covering the surface of the plate-like object with a non-stretchable cover sheet Covering the cover sheet, a cover sheet attaching step for forming a plate-like product unit with a cover sheet sandwiched between the dicing tape and the cover sheet, and the supporting means and the pressing means of the dividing device. A splitting step for passing the sheet-like plate unit with the sheet and splitting the plate-like material along the split starting point, and the cover sheet adhered to the dicing tape is Limiting the expansion area of the tape, the plate-like material, characterized in that it is divided by passing through following the said supporting means and the pressing pressure means.

  In the plate-like material dividing method, it is preferable that in the dividing step, the pressing means presses the plate-like product unit with the cover sheet from the cover sheet side.

  According to the plate-like object dividing device, the processing device, and the plate-like object dividing method of the present invention, the plate-like object unit that has passed through the supporting means is provided with a pressing means that presses the plate-like object in the Z-axis direction by the bar-shaped pressing portion. As a result, the plate-like object can be efficiently divided.

FIG. 1 is a perspective view illustrating a configuration example of a laser processing apparatus according to the first embodiment. FIG. 2 is a perspective view illustrating a configuration example of a workpiece unit according to the first embodiment. FIG. 3 is a perspective view illustrating a configuration example of a workpiece unit with a cover sheet according to the first embodiment. FIG. 4 is a perspective view illustrating a configuration example of the dividing device according to the first embodiment. FIG. 5 is an explanatory diagram illustrating an example of functions of the dividing device according to the first embodiment. FIG. 6 is a perspective view illustrating a configuration example of a cover sheet sticking unit according to the first embodiment. FIG. 7 is a flowchart illustrating an operation example of the dividing apparatus according to the first embodiment. FIG. 8 is a perspective view illustrating a configuration example of the dividing device according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A configuration example of a laser processing apparatus including the plate-like object dividing device according to the first embodiment will be described. FIG. 1 is a perspective view illustrating a configuration example of a laser processing apparatus according to the first embodiment. FIG. 2 is a perspective view illustrating a configuration example of a workpiece unit according to the first embodiment. FIG. 3 is a perspective view illustrating a configuration example of a workpiece unit with a cover sheet according to the first embodiment. FIG. 4 is a perspective view illustrating a configuration example of the dividing device according to the first embodiment. FIG. 5 is an explanatory diagram illustrating an example of functions of the dividing device according to the first embodiment. FIG. 6 is a perspective view illustrating a configuration example of a cover sheet sticking unit according to the first embodiment.

  The laser processing apparatus 1 is a processing apparatus that processes a plate-like object W on which a plurality of devices D are formed. As shown in FIG. 1, the laser processing apparatus 1 includes a chuck table 10, a laser beam irradiation means 20, an X-axis moving means 30, a Y-axis moving means 40, a cassette elevator 60, a dividing device 70A, and a conveying means. 80 and control means 90 are provided.

  The plate-like object W is a semiconductor device formed on a substrate such as silicon or gallium arsenide, or an optical device formed on a substrate such as sapphire or SiC. A semiconductor wafer, an optical device wafer, an inorganic material substrate, Various processing materials such as a ductile resin material substrate, a ceramic substrate, and a glass substrate. On the surface of the plate-like object W, devices D are formed in each region partitioned in a grid pattern by the division lines L that intersect each other.

  As shown in FIG. 2, the plate-like object W is bonded to the dicing tape T attached so as to close the opening Fa of the annular frame F, and the device D side of the plate-like object W is attached via the dicing tape T. It is supported by an annular frame F. In this way, the plate-like object W supported by the annular frame F via the dicing tape T is referred to as a plate-like object unit U. The dicing tape T has expandability.

  On the outer periphery of the annular frame F, two flat surfaces Fd and Fe facing in parallel and two flat surfaces Fb and Fc facing in a direction orthogonal to the two flat surfaces Fe and Fd are formed. These four flat surfaces Fb to Fe serve as reference surfaces when the plate-like object unit U is positioned. The plate-like object W is supported so that the division line L is parallel to the flat surfaces Fd and Fe or the flat surfaces Fb and Fc.

  As shown in FIG. 3, a cover sheet C is attached to the plate unit U by a cover sheet attaching means 75 of a dividing device 70 </ b> A described later. The cover sheet C is formed larger than the outer diameter of the plate-like object W and smaller than the opening Fa of the annular frame F. The cover sheet C is formed of a transparent material that does not have elasticity. For example, the cover sheet C is formed from PET, polyethylene, polypropylene, or the like. The elongation percentage of the cover sheet C is preferably 10% or less. Here, the elongation rate represents the elongation with respect to the original length as a ratio when the maximum deformation amount immediately before the material breaks is defined as elongation. The cover sheet C can be easily adjusted in the direction of the division planned line L by using a transparent sheet.

  Here, the X-axis direction (X direction) is a direction in which the plate-like object W held on the chuck table 10 is processed and fed. The Y-axis direction (Y direction) is a direction in which the laser beam irradiation means 20 is indexed and fed to the plate-like object W held on the chuck table 10 and orthogonal to the X-axis direction on the same horizontal plane. The Z-axis direction (Z direction) is a direction orthogonal to the X-axis direction and the Y-axis direction, which is the vertical direction in the first embodiment.

  The chuck table 10 holds the plate-like object W, and is disposed on the base 2a of the apparatus main body 2 so as to be movable in the X-axis direction. Here, the apparatus main body 2 is composed of a rectangular parallelepiped base 2a and a wall 2b erected in the Z-axis direction from the end of the base 2a in the Y-axis direction. The chuck table 10 is formed in a disc shape and includes a holding surface 11 and a clamp portion 12. The chuck table 10 is rotated around a rotation axis orthogonal to the center of the holding surface 11 by a rotating means (not shown). The holding surface 11 is an upper end surface in the vertical direction of the chuck table 10 and is formed flat with respect to a horizontal plane. The holding surface 11 is made of, for example, porous ceramic, and sucks and holds the plate-like object W of the on-board object unit U by a negative pressure of a vacuum suction source (not shown). The clamp portion 12 sandwiches the annular frame F of the on-board unit U, and sandwiches the annular frame F from above and below.

  The laser beam irradiation means 20 is a processing means, and forms a modified layer on the plate-like object W as a division starting point. Here, the modified layer means a region where the density, refractive index, mechanical strength and other physical characteristics are different from those of the surrounding, and includes a melt-treated region, a crack region, and a dielectric breakdown region. A refractive index change region, a region where these regions are mixed, and the like. The laser beam irradiating means 20 is disposed at the tip of the support column 2c extending in the Y-axis direction from above the wall 2b of the apparatus main body 2. The laser beam irradiation means 20 irradiates a laser beam having a wavelength that passes through the plate-like object W along the planned division line L of the plate-like object W held on the chuck table 10, and the modified layer is formed inside the plate-like object W. Form.

  The X-axis moving means 30 is disposed on the base 2a of the apparatus main body 2, and relatively moves the chuck table 10 and the laser beam irradiation means 20 in the X-axis direction. For example, the X-axis moving means 30 is fixed to a pair of guide rails 31 extending in the X-axis direction, a ball screw 32 arranged in parallel to the guide rail 31, and a nut (not shown) screwed to the ball screw 32. An X-axis moving base 33 slidably disposed on the guide rail 31 and a pulse motor (not shown) that rotates the ball screw 32 are provided. The X-axis moving means 30 moves the X-axis moving base 33 that supports the chuck table 10 in the X-axis direction by rotating the ball screw 32 with a pulse motor.

  The Y-axis moving means 40 is disposed on the base 2a of the apparatus main body 2 and relatively moves the chuck table 10 and the laser beam irradiation means 20 in the Y-axis direction. For example, the Y-axis moving means 40 is fixed to a pair of guide rails 41 extending in the Y-axis direction, a ball screw 42 disposed in parallel to the guide rail 41, and a nut (not shown) screwed to the ball screw 42. A Y-axis moving base 43 slidably disposed on the guide rail 41 and a pulse motor 44 for rotating the ball screw 42 are provided. The Y-axis moving means 40 moves the Y-axis moving base 43 that supports the X-axis moving means 30 in the Y-axis direction by rotating the ball screw 42 by the pulse motor 44.

  The cassette elevator 60 accommodates the plate-like object unit U, and includes a cassette 61 that accommodates the plurality of plate-like object units U, and an elevator unit (not shown) that raises and lowers the cassette 61 in the Z-axis direction.

  The dividing device 70A divides the plate-like object W of the plate-like object unit U in which the modified layer is formed along the planned division line L. As shown in FIG. 4, the dividing device 70A includes a supporting means 71, a unit moving means 72, a pressing means 73, an adjusting means 74, a cover sheet attaching means 75 (see FIG. 6), and a driving means (not shown). And.

  The support means 71 includes a first support part 711 and a second support part 712. The 1st support part 711 and the 2nd support part 712 are bar-shaped members, and the cross section orthogonal to a longitudinal direction is formed circularly. The first support part 711 and the second support part 712 are formed to be longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and to extend in the X-axis direction. ing. The 1st support part 711 and the 2nd support part 712 are arrange | positioned facing each other, and allow passage while pinching the plate-like object W stuck to the dicing tape T from the front and back. The first support portion 711 is rotatably disposed and supports the plate-like object W from the dicing tape T side. The second support portion 712 is rotatably arranged and supports the plate-like object W from the cover sheet C side opposite to the dicing tape T. The first support part 711 and the second support part 712 rotate as the plate-like object unit U moves.

  The first support portion 711 and the second support portion 712 are disposed at different positions in the Y-axis direction. This is because the device D (chip) divided at the support point P1 of the first support portion 711 is pressed to the dicing tape T side. For example, as shown in FIG. 5, the second support portion 712 is disposed on the side (one side in the Y-axis direction) side of pulling out the plate-like object unit U from the first support portion 711. For example, the axial center position 712a of the second support portion 712 is located in the direction in which the plate-like object unit U is pulled out by the distance H from the axial center position 711a of the first support portion 711. The distance H is a distance shorter than the interval between the division lines L, for example. When the plate unit U is pulled out to one side in the Y-axis direction, the second support portion 712 presses the device D (chip) divided at the support point P1 of the first support portion 711 from the cover sheet C side. The peeling from the dicing tape T is suppressed.

  The unit moving means 72 is a moving means for moving the supporting means 71 and the pressing means 73 and the plate-like object unit U relative to each other. For example, the unit moving means 72 includes a holding portion 721 that holds the annular frame F of the plate-like object unit U, and a moving mechanism (not shown) that moves the holding portion 721 to one side in the Y-axis direction. The unit moving means 72 holds the annular frame F of the plate-like object unit U by the holding portion 721, and is in a plate shape together with the holding portion 721 by the moving mechanism while the positions of the first and second support portions 711 and 712 are fixed. The object unit U is moved horizontally to one side in the Y-axis direction.

  The pressing means 73 presses the plate-like object W from the cover sheet C side in the Z-axis direction, and includes a pressing portion 731. The pressing portion 731 is a bar-shaped member, and a cross section perpendicular to the longitudinal direction is formed in a circular shape. The pressing portion 731 is longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and is disposed so as to extend in the X-axis direction. The pressing portion 731 is disposed on the downstream side of the first support portion 711 and the second support portion 712. The pressing point P2 by the pressing part 731 is disposed at a position lower in the Z-axis direction than the position of the supporting point P1 by the first supporting part 711 or the position of the second supporting part 712. The pressing portion 731 covers the plate-like object W that has passed between the first support portion 711 and the second support portion 712 in a state where the pressing portion 731 is fixed without rotating with the movement of the plate-like object unit U. Press in the Z-axis direction from the side.

  When the plate-like object W is pressed in the Z-axis direction by the pressing portion 731 while being supported by the first support portion 711 and the second support portion 712, as shown in FIG. Divided. For example, when the plate-like object W is pressed by the pressing portion 731, the movement direction is changed in the pressing direction (one of the Z-axis directions) by the angle θ with respect to the horizontal direction at the support point P1 of the first support portion 711. Be changed. Thereby, the plate-like object W is divided | segmented along the division | segmentation scheduled line L in which the modified layer was formed in the support point P1 of the 1st support part 711. FIG.

  The drive means moves the support means 71 and the plate unit U relative to each other. Further, the driving means moves the pressing means 73 and the plate-like unit U relative to each other. For example, the driving unit moves the second support portion 712 and the pressing portion 731 from the cover sheet C side of the plate-like object unit U in the direction approaching or separating from the plate-like object unit U (Z-axis direction). Further, the driving means moves the first support portion 711 from the dicing tape T side of the plate-like object unit U in the direction approaching or separating from the plate-like object unit U (Z-axis direction). The driving means can adjust the push-in amount by adjusting the position of the pressing portion 731 with respect to the support means 71 in the Z-axis direction, and can divide the plate-like object W that is difficult to divide.

  The adjusting means 74 adjusts the position of the plate-like object unit U in the width direction (X-axis direction). For example, the adjusting means 74 adjusts the direction of the division line L of the plate-like object W passing between the first support portion 711 and the second support portion 712 in parallel with the X-axis direction. The adjusting unit 74 includes a pair of rod-shaped guide members 741 extending in the Y-axis direction and a driving unit (not shown) that drives the guide member 741. The pair of guide members 741 includes a guide surface 741a that abuts against the flat surfaces Fd and Fe in the width direction of the annular frame F. The pair of guide members 741 are moved by the driving means in a direction in which the guide members 741 approach or separate from each other (X-axis direction), and the interval between the guide surfaces 741a is adjusted to be approximately the same as the length in the width direction of the annular frame F.

  The cover sheet sticking means 75 sticks the cover sheet C to the plate unit U as shown in FIG. The cover sheet sticking means 75 includes a sandwiching portion 751 that sandwiches and holds the cover sheet C, and a drive unit (not shown) that drives the sandwiching portion 751. A plurality of cover sheets C are stacked and stored in a storage portion (not shown). The cover sheet sticking means 75 takes out the cover sheet C laminated in the accommodating portion by holding the single sheet by the holding portion 751. Then, the cover sheet attaching means 75 covers the cover sheet C on the plate-like object W whose width direction (X-axis direction) has been adjusted by the adjusting means 74 and attaches the cover sheet C to the dicing tape T. For example, the cover sheet adhering means 75 adheres the area of the cover sheet C protruding from the outer periphery of the plate-like object W to the dicing tape T while covering the exposed surface of the plate-like object W with the cover sheet C.

  Since the main purpose of the cover sheet C is to suppress expansion of the dicing tape T other than the area where the plate-like object W is adhered, the area where the cover sheet C is adhered to the dicing tape T is It is preferable to occupy a certain area. It is preferable that at least a region where the first and second support portions 711 and 712 and the pressing portion 731 are in contact with each other is covered with the cover sheet C. For example, in the area of the opening Fa of the annular frame F and the area of the dicing tape T excluding the area where the plate-like object W is adhered, the area where the cover sheet C is adhered occupies more than half. To do.

  The conveying means 80 conveys the plate-like object unit U. For example, the conveyance means 80 conveys the plate-like object unit U in which the plate-like object W is laser processed from the chuck table 10 to the dividing device 70A.

  The control means 90 controls each component of the laser processing apparatus 1. For example, the control unit 90 is connected to a drive circuit (not shown) that drives the pulse motors of the X-axis moving unit 30 and the Y-axis moving unit 40 and controls the drive circuit in the X-axis direction and the Y-axis direction of the chuck table 10. Determine the position. Further, the control means 90 controls the dividing device 70A, and attaches the cover sheet C to the plate-like object unit U to divide the plate-like object W.

  Next, an operation example of the laser processing apparatus will be described. FIG. 7 is a flowchart illustrating an operation example of the dividing device 70A according to the first embodiment.

  First, the control means 90 holds the plate-like object unit U by the chuck table 10 (step S1). For example, the control means 90 controls a conveying means (not shown), takes out the plate-like object unit U to be processed from the cassette 61 and conveys it to the chuck table 10. The chuck table 10 holds the plate-like object unit U by suction. The control unit 90 performs alignment on the plate-like object W held on the chuck table 10.

  Next, the control means 90 controls the laser beam irradiation means 20 to form a modified layer on the plate-like object W along the scheduled division line L (step S2). When the reforming layer is formed for all the division lines L, the control unit 90 controls the conveying unit 80 and conveys the plate unit U to the dividing device 70A.

  The dividing device 70A attaches the cover sheet C to the plate-like object unit U (Step S3; cover sheet attaching step). For example, the cover sheet adhering means 75 of the dividing device 70 </ b> A holds the cover sheet C accommodated in the accommodating portion by the sandwiching portion 751 and takes it out so that the cover sheet C is covered with the plate-like object W and the cover sheet C is diced. Adhere to tape T. The cover sheet sticking means 75 forms a plate-like product unit U with a cover sheet in which the plate-like material W is sandwiched between the dicing tape T and the cover sheet C.

  Next, the control means 90 controls the dividing device 70A to divide the plate-like object W (step S4; dividing step). For example, the dividing device 70 </ b> A adjusts the plate-like object unit U with the cover sheet in the state where the width direction (X-axis direction) of the plate-like object unit U is adjusted by the adjusting means 74. And the plate-like object W is divided by passing along the first support portion 711 and the pressing portion 731 while being horizontally passed in the Y-axis direction and pressed by the pressing portion 731. At this time, since the cover sheet C adhered to the dicing tape T limits the expansion area of the dicing tape T, the expansion of the dicing tape T in the portion where the plate-like object W is adhered is promoted effectively. Can be divided. When the division of the plate-like object W is completed for one channel, the control means 90 changes the direction of the plate-like object unit 90 by 90 ° by a moving means (not shown). Then, the dividing device 70 </ b> A adjusts the width direction (X-axis direction) of the plate-like unit U by the adjusting means 74 and passes the plate-like unit U between the first support portion 711 and the second support portion 712. The plate-like object W is further divided into one channel along the planned division line L by being pressed by the pressing portion 731. Next, the control means 90 stores the divided plate-like object W in the cassette 61 by a conveying means (not shown).

  As described above, according to the dividing device 70A and the plate-shaped object dividing method according to the first embodiment, the plate-shaped object W of the plate-shaped object unit U that has passed through the first support portion 711 and the second support portion 712 is pressed. The portion 731 is pressed in the Z-axis direction. Since the first support portion 711 and the pressing portion 731 have a step, when the plate-like object W passes through the first support portion 711, the plate-like object W is scheduled to be divided at the support point P1 of the first support portion 711. Can be efficiently divided.

  Further, by sticking the non-stretchable cover sheet C to the dicing tape T around the outer periphery of the plate-like object W, the expansion area of the dicing tape T is limited, and only the portion where the plate-like object W is attached is dicing tape T. Expands. As a result, the pressing force by the pressing portion 731 acts at the support point P1 of the first support portion 711 so that the dicing tape T is expanded and the division of the plate-like object W can be promoted. Further, the dicing tape T is expanded by the pressing point P2 by the pressing part 731 acting without the pressing force by the pressing part 731 escaping. Thereby, when the plate-shaped object W is not divided | segmented by the support point P1, the plate-shaped object W can be reliably divided | segmented because the plate-shaped object W passes the press point P2.

  In particular, an optical device wafer (sapphire or SiC) is very hard compared to silicon, and is effective because chipping hardly occurs even in a splitting method in which an external force is strongly applied like the splitting device 70A.

  In addition, by arranging the dividing device 70A in a device for forming a modified layer serving as a starting point for division, such as the laser processing device 1, the processing from the processing to the division of the plate-like object W can be completed in one device. it can.

  Further, since the cover sheet C presses the plate-like object W against the dicing tape T, the plate-like object W can be prevented from peeling from the dicing tape T when the plate-like object W is divided.

[Embodiment 2]
Next, the dividing device according to the second embodiment will be described. FIG. 8 is a perspective view illustrating a configuration example of the dividing device according to the second embodiment. As shown in FIG. 8, the dividing device 70B includes a supporting means 71b, a pressing means 73b, an adjusting means 74, a cover sheet attaching means (not shown), a driving means (not shown), and a Y direction moving means (not shown). I have. In the state where the plate-like object unit U is fixed, the dividing device 70B moves the support means 71b and the pressing means 73b to the other side in the Y-axis direction by the Y-direction moving means, thereby dividing the plate-like object W. Different from the first embodiment. The description of the same reference numerals as those in Embodiment 1 is omitted.

  The support means 71b includes a bar-shaped first support portion 711b and a bar-shaped second support portion 712b. The first support part 711b and the second support part 712b are formed to be longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and to extend in the X-axis direction. ing. The 1st support part 711b and the 2nd support part 712b are arrange | positioned facing each other, and allow passage while pinching the plate-like object unit U stuck to the dicing tape T from the front and back. The 1st support part 711b is rotatably arrange | positioned and supports the plate-shaped object unit U from the dicing tape T side. The second support part 712b is rotatably arranged and supports the plate-like object unit U from the cover sheet C side opposite to the dicing tape T.

  The pressing means 73b includes a bar-shaped pressing portion 731b that presses the plate-like object W in the Z-axis direction from the cover sheet C side. The pressing portion 731b is longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and is disposed so as to extend in the X-axis direction. The pressing portion 731b is disposed on the downstream side of the first support portion 711b and the second support portion 712b. The pressing point by the pressing part 731b is disposed at a position lower in the Z-axis direction than the supporting point by the first supporting part 711b or the position of the second supporting part 712b. The pressing portion 731b presses the plate-like object W that has passed between the first support portion 711b and the second support portion 712b in the Z-axis direction from the cover sheet C side.

  The driving means moves the second support portion 712b and the pressing portion 731b in the direction (Z-axis direction) approaching or separating from the plate unit U from the cover sheet C side of the plate unit U. Further, the driving means moves the first support portion 711b from the dicing tape T side of the plate-like object unit U in a direction (Z-axis direction) approaching or separating from the plate-like object unit U.

  The Y-direction moving means is a moving means for moving the support means 71b and the pressing means 73b and the plate-like object unit U relative to each other. For example, the Y-direction moving unit moves the support unit 71b and the pressing unit 73b to the other side in the Y-axis direction while fixing the position of the plate unit U. For example, the Y-direction moving means is configured such that the first support portion 711b and the second support portion 712b sandwich the plate-like object unit U and the pressing portion 731b presses the plate-like object unit U. 711b, the 2nd support part 712b, and the press part 731b are moved to the other side of a Y-axis direction. At this time, the 1st support part 711b and the 2nd support part 712b rotate with the movement to the other side of a Y-axis direction, and the press part 731b is not rotated.

  As described above, according to the dividing device 70B and the plate-like object dividing method according to the second embodiment, with the position of the plate-like object unit U fixed, the support means 71b and the pressing means 73b are moved in the other direction in the Y-axis direction. Move to the side. This has the same effect as that of the first embodiment, and the plate unit U is not moved to one side in the Y-axis direction at the time of division. Therefore, a space for moving the plate unit U becomes unnecessary, and the laser processing apparatus 1 Can be miniaturized.

[Modification]
Next, modifications of the first and second embodiments will be described. Although the cover sheet C is used to limit the expansion area of the dicing tape T, the use of the cover sheet C is not essential. That is, the plate-like object W of the plate-like object unit U may be divided by the support means 71 and the pressing means 73 without attaching the cover sheet C to the plate-like object unit U.

  In addition, when the dicing tape T has a strong adhesive force and there is no possibility that the divided plate-like object W is separated from the dicing tape T when passing through the support means 71, the support means 71 may not be a pair. 2 The support part 712 can be made unnecessary.

  Further, when the adhesive strength of the dicing tape T is strong and there is no fear that the plate-like object W divided when passing through the support means 71 is peeled off from the dicing tape T, the plate-like object W is removed from the dicing tape T by the cover sheet C. Therefore, an annular cover sheet that does not cover the plate-like object W may be used.

  Moreover, although the 1st, 2nd support part 711,712 demonstrated the structure rotated, it is not necessary to rotate. Moreover, although the structure which does not rotate the press part 731 was demonstrated, you may rotate.

  Moreover, although the shape of the 1st, 2nd support parts 711,712 and the press part 731 demonstrated the example whose cross section is circular, it is not limited to this. For example, the shapes of the first and second support portions 711 and 712 and the pressing portion 731 may be polygonal or elliptical in cross section. When the cross section of the 1st support part 711 is a polygon, the division | segmentation precision of the plate-shaped object W can be adjusted by changing the angle of the support surface which supports the plate-shaped object W. FIG.

  Moreover, the dividing devices 70A and 70B may include a cover sheet peeling unit (not shown) that peels the cover sheet C. For example, after dividing the plate-like object W along all the planned division lines L, the cover sheet peeling means peels the cover sheet C from the dicing tape T while sandwiching the end of the cover sheet C.

  Moreover, although the dicing tape T needs to have expandability, the expandability may be lower than a normal dicing tape.

  Further, the relative position in the Y-axis direction between the support means 71 and the pressing means 73 may be adjusted according to the chip size into which the plate-like object W is divided. For example, if the chip size is large, the position of the pressing portion 731 is set at a position away from the support means 71 in the Y-axis direction. If the chip size is small, the position of the pressing portion 731 is close to the support means 71 in the Y-axis direction. Set to position.

  Further, the guide member 741 of the adjusting means 74 may be a member that includes a support surface that supports the plate-like object unit U in the Z-axis direction and that has a L-shaped cross section perpendicular to the longitudinal direction.

  Further, the planned division line L may be imaged by an imaging means (not shown), and the orientation of the guide member 741 may be adjusted in a direction orthogonal to the planned division line L. Since L is positioned in a predetermined direction, when the plate-like object W is transported from the chuck table 10 to the guide member 741, the direction is adjusted so that the support means 71 and the pressing means 73 and the scheduled division line L are orthogonal to each other. And may be conveyed.

  Further, the laser beam has a wavelength having an absorptivity with respect to the plate-like object W, and a laser processing groove may be formed on the incident surface of the laser beam to form a division starting point.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 10 Chuck table 20 Laser beam irradiation means 30 X-axis moving means 40 Y-axis moving means 60 Cassette elevator 70A, 70B Dividing apparatus 71, 71b Support means 711,711b 1st support part 712,712b 2nd support part 72 unit Moving means 721 Holding parts 73, 73b Pressing means 731, 731b Pressing part 74 Adjusting means 741 Guide member 741a Guide surface 75 Cover sheet attaching means 80 Conveying means W Plate-like object F Ring frame T Dicing tape U Plate-like object unit C Cover Sheet

Claims (6)

A plate-like object of a plate-like object unit in which a plate-like object having a division start point formed along a predetermined division line that intersects each other and divides a plurality of devices is supported by an opening of an annular frame via a dicing tape. A plate-like object dividing device for dividing along a dividing starting point,
A support means for supporting the plate unit from the dicing tape side with a bar-like support portion extending in the X direction longer than the diameter of the plate member;
Moving means for relatively moving the support means and the plate-like object unit in the Y direction orthogonal to the X direction, which is the direction in which the support portion extends;
A pressing means for pressing the plate-like object unit that has passed through the supporting means in the Z direction perpendicular to the X direction and the Y direction, in a bar-shaped pressing portion that moves relative to the supporting means and extends in the X direction;
An apparatus for dividing a plate-like object, comprising: an adjusting unit that adjusts the direction of the division line of the plate-like object passing through the support means in parallel with the X direction.   2. A plate-like object dividing apparatus according to claim 1, wherein said support means comprises a pair of support portions that allow passage of the plate-like object unit from the front and back sides.   The plate-like object according to claim 1 or 2, further comprising a cover sheet attaching means for attaching an area protruding from the outer periphery of the plate-like object to the dicing tape while covering the exposed surface of the plate-like object with a non-stretchable cover sheet. Splitting device.   A processing means for forming a division starting point along the division line on a plate-like object having division division lines that intersect with each other to partition a plurality of devices, and the plate-like object according to any one of claims 1 to 3 A processing apparatus comprising a dividing device. A plate-like object dividing method in which a plate-like object formed by dividing start points along a predetermined dividing line that intersects each other and divides a plurality of devices is supported by an opening of an annular frame via a dicing tape. There,
A cover sheet with a cover sheet that covers the surface of the plate-like object with a non-stretchable cover sheet, sticks the cover sheet protruding from the outer periphery of the plate-like object to the dicing tape, and sandwiches the plate-like object between the dicing tape and the cover sheet A cover sheet attaching step for forming a unit,
The support means and the pressing means of the dividing device according to any one of claims 1 to 3 or the processing device according to claim 4 are passed through a plate-like object unit with a cover sheet, and along the dividing starting point. And a dividing step of dividing the plate-like object,
The cover sheet attached to the dicing tape defines an expansion area of the dicing tape, and the plate-like object is divided by passing along the support means and the pressing means, and is divided into plates How to divide things.   6. The plate-like object dividing method according to claim 5, wherein in the dividing step, the pressing means presses the plate-like object unit with the cover sheet from the cover sheet side.

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