JP6539487B2 - Apparatus for dividing plate-like object, processing apparatus and method for dividing plate-like object - Google Patents

Description

  The present invention relates to a device for dividing a plate-like object, a processing device, and a method for dividing a plate-like object.

  Cutting devices and laser processing devices are used to divide semiconductor devices, optical device wafers, resin package substrates, ceramic substrates, glass substrates and the like. Particularly in recent years, in semiconductor wafers and optical device wafers, there is known a processing method in which a modified layer formed inside the wafer is used as a division starting point by laser beam irradiation, and external force is applied to divide into individual device chips ( Patent documents 1, 2).

  However, in the case of an optical device wafer made of a sapphire substrate or a SiC substrate, it is difficult to cause a small stress so that it is difficult to break by application of an external force by a suction force as described in Patent Documents 1 and 2. Then, the division | segmentation by the so-called guillotine system which presses a press blade on a board | substrate is implemented (patent document 3).

JP, 2014-232763, A JP, 2014-120508, A JP, 2014-103340, A

  However, in the guillotine division method, since division is performed for each line, in the case of a small chip device having a size of 0.3 mm or the like, the number of lines is large and the time required for division is long. It had become.

  Then, this invention is made in view of the above, Comprising: It is providing the division | segmentation apparatus of a plate-shaped article which can divide a plate-like article efficiently, a processing apparatus, and the dividing method of a plate-like article. To aim.

In order to solve the problems described above and to achieve the object, the present invention provides a dicing tape in which a plate-like object in which division starting points are formed along predetermined dividing lines which cross each other and define a plurality of devices is an opening of an annular frame. A dividing device for dividing the plate-like material along the dividing origin of the plate-like material unit supported via the bar, the bar-like device extending in the X direction longer than the diameter of the plate-like material The support means for supporting the plate-like material unit from the dicing tape side, and the support means and the plate-like material unit in the Y direction orthogonal to the X direction in which the support means extends. The plate-like material unit that has passed through the support means is pressed in the Z direction orthogonal to the X direction and the Y direction by the moving means for moving and the bar-like pressing part relatively moved with the support means and extending in the X direction Pressing means and the support means Comprising an adjusting means for adjusting the direction of the dividing line of the platelet parallel to the X direction, and the support means is to permit the passage while sandwiching the plate-like material unit from the front and back and the Y direction in the A pair of support portions arranged at positions offset from each other by a distance shorter than the spacing of the planned dividing lines, and the other support portion supporting the plate-like unit of the pair of support portions from the dicing tape side The support portion is characterized in that it is disposed on the pressing portion side in the Y direction .

  Further, in the apparatus for dividing a plate-like object, a cover sheet attaching means for attaching a region which is protruded at the outer periphery of the plate-like object to a dicing tape while covering the exposed surface of the plate-like object with a non-stretchable cover sheet. It is preferable to have.

  Further, in order to solve the problems described above and to achieve the object, the processing apparatus according to the present invention is a dividing starting point along a dividing line into a plate having dividing dividing lines which intersect with each other to divide a plurality of devices. And a dividing device for the plate-like object.

  Furthermore, in order to solve the problems described above and achieve the object, the present invention is directed to a plate-like object in which division origins are formed along planned division lines which cross each other and define a plurality of devices. A dividing method of a plate-like object of a plate-like object unit supported via a dicing tape, which covers the surface of the plate-like object with a non-stretchable cover sheet and dicing the cover sheet protruding outside the plate-like object A cover sheet attaching step of attaching to a tape and forming a plate-like object unit with a cover sheet sandwiching a plate-like object with a dicing tape and a cover sheet, covering the supporting means of the dividing device and the pressing means And a dividing step of passing the sheet with a sheet-like unit and dividing the sheet along the dividing origin, and the cover sheet attached to the dicing tape is the dicing Limiting the expansion area of the tape, the plate-like material, characterized in that it is divided by passing through following the said supporting means and the pressing pressure means.

  Further, in the method of dividing the plate-like object, preferably, in the dividing step, the pressing means presses the plate-like object unit with the cover sheet from the side of the cover sheet.

  According to the apparatus for dividing a plate-like object, the processing apparatus, and the method for dividing a plate-like object of the present invention, the plate-like object unit passing through the support means is provided with pressing means for pressing the bar-like pressing unit in the Z axis direction. Thus, the plate-like object can be efficiently divided.

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus according to a first embodiment. FIG. 2 is a perspective view showing a configuration example of the workpiece unit according to the first embodiment. FIG. 3 is a perspective view showing an example of the configuration of a workpiece unit with a cover sheet according to the first embodiment. FIG. 4 is a perspective view showing a configuration example of the dividing device according to the first embodiment. FIG. 5 is an explanatory view of a function example of the dividing device according to the first embodiment. FIG. 6 is a perspective view showing a configuration example of a cover sheet bonding means according to the first embodiment. FIG. 7 is a flowchart illustrating an operation example of the dividing device according to the first embodiment. FIG. 8 is a perspective view showing a configuration example of a dividing device according to a second embodiment.

  A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or modifications of the configuration can be made without departing from the scope of the present invention.

Embodiment 1
The structural example of the laser processing apparatus provided with the dividing device of the plate-shaped object which concerns on Embodiment 1 is demonstrated. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus according to a first embodiment. FIG. 2 is a perspective view showing a configuration example of the workpiece unit according to the first embodiment. FIG. 3 is a perspective view showing an example of the configuration of a workpiece unit with a cover sheet according to the first embodiment. FIG. 4 is a perspective view showing a configuration example of the dividing device according to the first embodiment. FIG. 5 is an explanatory view of a function example of the dividing device according to the first embodiment. FIG. 6 is a perspective view showing a configuration example of a cover sheet bonding means according to the first embodiment.

  The laser processing apparatus 1 is a processing apparatus that processes a plate-like object W in which a plurality of devices D are formed. As shown in FIG. 1, the laser processing apparatus 1 includes a chuck table 10, a laser beam application means 20, an X axis movement means 30, a Y axis movement means 40, a cassette elevator 60, a dividing device 70A, and a conveying means. 80 and control means 90.

  The plate-like object W is one in which a semiconductor device is formed on a substrate such as silicon or gallium arsenide, or an optical device is formed on a substrate such as sapphire or SiC. It is various processing materials such as ductile resin material substrate, ceramic substrate and glass substrate. On the surface of the plate-like object W, the device D is formed in each area | region divided in the grid shape by the division intended line L which mutually cross | intersects.

  As shown in FIG. 2, the device D side of the plate W is attached to the dicing tape T attached so as to close the opening Fa of the annular frame F, as shown in FIG. It is supported by an annular frame F. As described above, one in which the plate-like object W is supported by the annular frame F via the dicing tape T is referred to as a plate-like object unit U. The dicing tape T has expandability.

  The outer periphery of the annular frame F is formed with two flat surfaces Fd, Fe facing in parallel and two flat surfaces Fb, Fc facing in a direction orthogonal to the two flat surfaces Fe, Fd. These four flat surfaces Fb to Fe become reference surfaces when positioning the plate-like object unit U. The plate-like object W is supported such that the intended dividing line L is parallel to the flat surface Fd, Fe or the flat surface Fb, Fc.

  As shown in FIG. 3, a cover sheet C is attached to the plate-like material unit U by a cover sheet attaching means 75 of a dividing device 70A described later. The cover sheet C is formed to be larger than the outer diameter of the plate-like object W and smaller than the opening Fa of the annular frame F. The cover sheet C is formed of a transparent and non-stretchable material. For example, the cover sheet C is formed of PET, polyethylene, polypropylene or the like. The elongation of the cover sheet C is preferably 10% or less. Here, the elongation percentage is a ratio of the elongation to the original length, where the maximum amount of deformation immediately before the material breaks is the elongation. By using a transparent sheet for the cover sheet C, the adjustment of the direction of the planned dividing line L becomes easy.

  Here, the X-axis direction (X direction) is a direction in which the sheet W held by the chuck table 10 is processed and fed. The Y-axis direction (Y-direction) is a direction in which the laser beam application means 20 is indexed and fed to the plate-like material W which is orthogonal to the X-axis direction on the same horizontal plane and held by the chuck table 10. The Z-axis direction (Z direction) is a direction orthogonal to the X-axis direction and the Y-axis direction, and is a vertical direction in the first embodiment.

  The chuck table 10 holds the plate-like object W, and is disposed on the base 2 a of the apparatus main body 2 so as to be movable in the X-axis direction. Here, the apparatus main body 2 is configured of a rectangular parallelepiped base 2a and a wall 2b erected in the Z-axis direction from an end of the base 2a in the Y-axis direction. The chuck table 10 is formed in a disk shape, and includes a holding surface 11 and a clamp portion 12. The chuck table 10 is rotated about an axis of rotation orthogonal to the center of the holding surface 11 by rotating means (not shown). The holding surface 11 is the upper end surface of the chuck table 10 in the vertical direction, and is formed flat with respect to the horizontal surface. The holding surface 11 is made of, for example, a porous ceramic or the like, and sucks and holds the plate-like material W of the plate-like unit U by negative pressure of a vacuum suction source (not shown). The clamp part 12 clamps the annular frame F of the plate object unit U, and clamps the annular frame F from above and below.

  The laser beam irradiation means 20 is a processing means, and forms a modified layer which becomes a division starting point on the plate-like object W. Here, the modified layer means a region in which density, refractive index, mechanical strength, and other physical characteristics are different from those in the surrounding region, and a melt processing region, a crack region, and a dielectric breakdown region. , A refractive index change region, a region in which these regions are mixed, and the like. The laser beam application means 20 is disposed at the tip of a support column 2c which extends in the Y-axis direction from above the wall 2b of the apparatus body 2. The laser beam application means 20 applies a laser beam of a wavelength that transmits the plate W along the planned dividing line L of the plate W held on the chuck table 10, so that the reformed layer is formed inside the plate W Form

  The X-axis moving means 30 is disposed on the base 2 a of the apparatus main body 2 and moves the chuck table 10 and the laser beam application means 20 relative to each other in the X-axis direction. For example, the X-axis moving means 30 is fixed to a pair of guide rails 31 extending in the X-axis direction, a ball screw 32 disposed parallel to the guide rail 31, and a nut (not shown) screwed on the ball screw 32. An X-axis movement base 33 slidably disposed on the guide rail 31 and a pulse motor (not shown) for rotating the ball screw 32 are provided. The X-axis movement means 30 moves the X-axis movement base 33 supporting the chuck table 10 in the X-axis direction by rotating the ball screw 32 with a pulse motor.

  The Y-axis moving means 40 is disposed on the base 2 a of the apparatus body 2 and moves the chuck table 10 and the laser beam application means 20 relative to each other in the Y-axis direction. For example, the Y-axis moving means 40 is fixed to a pair of guide rails 41 extending in the Y-axis direction, a ball screw 42 disposed parallel to the guide rail 41, and a nut (not shown) screwed on the ball screw 42. A Y-axis movement base 43 slidably disposed on the guide rail 41 and a pulse motor 44 for rotating the ball screw 42 are provided. The Y-axis movement means 40 moves the Y-axis movement base 43 supporting the X-axis movement means 30 in the Y-axis direction by rotating the ball screw 42 by the pulse motor 44.

  The cassette elevator 60 accommodates the plate-like material unit U, and includes a cassette 61 accommodating a plurality of plate-like material units U, and raising and lowering means (not shown) for raising and lowering the cassette 61 in the Z-axis direction.

  The dividing device 70A divides the plate-like material W of the plate-like material unit U in which the modified layer is formed along the planned dividing line L. The dividing device 70A, as shown in FIG. 4, includes a supporting means 71, a unit moving means 72, a pressing means 73, an adjusting means 74, a cover sheet sticking means 75 (see FIG. 6), and a driving means not shown. And have.

  The support means 71 includes a first support portion 711 and a second support portion 712. The first support portion 711 and the second support portion 712 are bar-shaped members, and the cross section orthogonal to the longitudinal direction is formed in a circular shape. The first support 711 and the second support 712 are formed to be longer than the diameter of the plate W and shorter than the diameter of the opening Fa of the annular frame F, and extend in the X-axis direction. ing. The first support portion 711 and the second support portion 712 are disposed to face each other, and allow passage of the plate-like object W attached to the dicing tape T while holding the plate-like object W from the front and back. The first support portion 711 is rotatably disposed, and supports the plate-like object W from the dicing tape T side. The second support portion 712 is rotatably disposed, and supports the plate-like object W from the side of the cover sheet C opposite to the dicing tape T. The first support 711 and the second support 712 rotate with the movement of the plate-like object unit U.

  The first support 711 and the second support 712 are disposed at different positions in the Y-axis direction. This is because the device D (chip) divided at the support point P1 of the first support portion 711 is pressed to the dicing tape T side. For example, as shown in FIG. 5, the second support portion 712 is disposed on the side of the first support portion 711 in the direction in which the plate-like unit U is pulled out (one side in the Y-axis direction). For example, the axial center position 712 a of the second support portion 712 is located in the direction in which the plate-like object unit U is pulled out by the distance H from the axial center position 711 a of the first support portion 711. The distance H is, for example, a distance shorter than the interval of the dividing lines L. When the plate-like material unit U is pulled out to one side in the Y-axis direction, the second support portion 712 presses the device D (chip) divided at the support point P1 of the first support portion 711 from the cover sheet C side. Peeling off from the dicing tape T is suppressed.

  The unit moving means 72 is a moving means, and moves the support means 71 and the pressing means 73 relative to the plate-like material unit U. For example, the unit moving means 72 includes a holding portion 721 for holding the annular frame F of the plate-like unit U, and a moving mechanism (not shown) for moving the holding portion 721 to one side in the Y axis direction. The unit moving means 72 holds the annular frame F of the plate-like unit U by the holding portion 721 and fixes the positions of the first and second support portions 711 and 712. The object unit U is moved horizontally to one side in the Y-axis direction.

  The pressing means 73 presses the plate-like material W from the cover sheet C side in the Z-axis direction, and includes a pressing portion 731. The pressing portion 731 is a bar-like member, and a cross section orthogonal to the longitudinal direction is formed in a circular shape. The pressing portion 731 is formed to be longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and extend in the X-axis direction. The pressing portion 731 is disposed downstream of the first support portion 711 and the second support portion 712. The pressing point P2 by the pressing portion 731 is disposed at a position lower in the Z-axis direction than the position of the support point P1 by the first support portion 711 or the second support portion 712. The pressing portion 731 is a cover sheet C that has passed through the space between the first support portion 711 and the second support portion 712 in a state where the pressing portion 731 is fixed without being rotated with the movement of the plate-like object unit U. Press in the Z-axis direction from the side.

  As shown in FIG. 5, the plate-like object W is supported by the first support portion 711 and the second support portion 712, and is pressed in the Z-axis direction by the pressing portion 731 along the planned dividing line L. Split up. For example, when the plate-like object W is pressed by the pressing portion 731, the moving direction in the pressing direction (one of the Z-axis directions) is an angle θ with respect to the horizontal direction at the support point P1 of the first support portion 711 Be changed. Thereby, the plate-like object W is divided | segmented along the scheduled dividing line L in which the modified layer was formed in the supporting point P1 of the 1st support part 711. FIG.

  The drive means moves the support means 71 and the plate-like-object unit U relative to each other. Further, the drive means moves the pressing means 73 and the plate-like unit U relative to each other. For example, the drive means moves the second support portion 712 and the pressing portion 731 from the cover sheet C side of the plate-like unit U in a direction (Z-axis direction) approaching or separating from the plate-like unit U. Further, the driving means moves the first support portion 711 from the dicing tape T side of the plate-like material unit U in a direction (Z-axis direction) approaching or separating from the plate-like material unit U. In addition, by adjusting the position of the pressing portion 731 with respect to the support means 71 in the Z-axis direction, the drive means can adjust the pressing amount and divide the plate-like material W which is difficult to divide.

  The adjusting means 74 adjusts the position in the width direction (X-axis direction) of the plate-like object unit U. For example, the adjusting unit 74 adjusts the direction of the planned dividing line L of the plate-like object W passing between the first support 711 and the second support 712 in parallel with the X-axis direction. The adjustment means 74 includes a pair of rod-like guide members 741 extending in the Y-axis direction, and a drive means (not shown) for driving the guide members 741. The pair of guide members 741 includes guide surfaces 741 a that abut on the flat surfaces Fd and Fe in the width direction of the annular frame F. The pair of guide members 741 are moved by the drive means in the direction (X-axis direction) in which they approach or separate from each other, and the distance between the guide surfaces 741a is adjusted to be substantially the same as the length in the width direction of the annular frame F.

  The cover sheet sticking means 75 sticks the cover sheet C to the plate-like material unit U as shown in FIG. The cover sheet sticking means 75 includes a holding unit 751 holding the cover sheet C in a sandwiching manner, and a driving unit (not shown) driving the holding unit 751. A plurality of cover sheets C are stacked and stored in a storage unit (not shown). The cover sheet sticking means 75 takes out the cover sheet C stacked in the housing portion by holding it by the one sheet holding portion 751. Then, the cover sheet attaching unit 75 covers the cover sheet C on the plate-like object W whose width direction (X-axis direction) is adjusted by the adjusting unit 74 and attaches the cover sheet C to the dicing tape T. For example, the cover sheet attaching unit 75 adheres the area of the cover sheet C protruding from the outer periphery of the plate W to the dicing tape T while covering the exposed surface of the plate W with the cover sheet C.

  Since the main purpose of the cover sheet C is to suppress the expansion of the dicing tape T other than the area where the plate-like object W is adhered, the area where the cover sheet C is adhered to the dicing tape T is Preferably, it occupies a certain area. It is preferable that at least a region where the first and second support portions 711 and 712 and the pressing portion 731 contact is covered with a cover sheet C. For example, in the area of the opening Fa of the annular frame F, in the area of the dicing tape T excluding the area where the plate-like object W is attached, the area to which the cover sheet C is attached occupies half or more. Do.

  The transport means 80 transports the plate-like material unit U. For example, the transport means 80 transports the plate-like object unit U obtained by laser processing the plate-like object W from the chuck table 10 to the dividing device 70A.

  The control means 90 controls each component of the laser processing apparatus 1. For example, the control means 90 is connected to a drive circuit (not shown) for driving the pulse motor of the X axis moving means 30 and the Y axis moving means 40 and controls the drive circuit to control the chuck table 10 in the X axis direction and Y axis direction. Determine the position. Further, the control means 90 controls the dividing device 70A to stick the cover sheet C to the plate-like material unit U to divide the plate-like material W.

  Next, an operation example of the laser processing apparatus will be described. FIG. 7 is a flowchart showing an operation example of the dividing device 70A according to the first embodiment.

  First, the control means 90 holds the plate-like object unit U by the chuck table 10 (step S1). For example, the control means 90 controls the conveying means (not shown), takes out the plate-like object unit U to be processed from the cassette 61 and conveys it to the chuck table 10. The chuck table 10 sucks and holds the plate-like material unit U. The control means 90 performs alignment on the plate-like object W held by the chuck table 10.

  Next, the control means 90 controls the laser beam application means 20 to form a modified layer on the plate-like material W along the planned dividing line L (step S2). The control means 90 will control the conveyance means 80, and will convey the plate-like article unit U to the dividing device 70A, if a modification layer is formed to all division planned lines L.

  The dividing device 70A sticks the cover sheet C to the plate-like material unit U (step S3; cover sheet sticking step). For example, the cover sheet sticking means 75 of the dividing device 70A pinches and takes out the cover sheet C stored in the storage portion by the holding portion 751, and covers the sheet C with the cover sheet C while dicing the cover sheet C. Stick to tape T. The cover sheet sticking means 75 forms a plate-like object unit U with a cover sheet in which the plate-like article W is sandwiched between the dicing tape T and the cover sheet C.

  Next, the control means 90 controls the dividing device 70A to divide the plate-like material W (step S4; dividing step). For example, in a state in which the dividing device 70A adjusts the width direction (X-axis direction) of the plate-like material unit U by the adjusting means 74, the plate-like material unit U with the cover sheet is a first support portion 711 and a second support portion 712. And the plate portion W is divided by passing along the first support portion 711 and the pressing portion 731 and passing the first support portion 711 and the pressing portion 731. At this time, since the cover sheet C attached to the dicing tape T limits the expansion area of the dicing tape T, the expansion of the dicing tape T in the portion where the plate-like object W is adhered is promoted, effectively It can be divided. When the division of the plate W is completed for one channel, the control means 90 changes the direction of the plate unit U by 90 ° by the moving means (not shown). Then, the dividing device 70A adjusts the width direction (X-axis direction) of the plate-like material unit U by the adjusting means 74, and passes the plate-like material unit U between the first support portion 711 and the second support portion 712. Then, the plate-like object W is further divided into one channel along the planned dividing line L by being pressed by the pressing portion 731. Next, the control means 90 accommodates the divided plate-like objects W in the cassette 61 by the conveying means (not shown).

  As described above, according to the dividing device 70A and the method of dividing the plate-like object according to the first embodiment, the plate-like object W of the plate-like object unit U having passed through the first support portion 711 and the second support portion 712 is pressed. The portion 731 presses in the Z-axis direction. Since the first support portion 711 and the pressing portion 731 have a step, when the plate-like object W passes through the first support portion 711, the plate-like object W is divided at the support point P1 of the first support portion 711 Can be divided efficiently.

  Further, by sticking the cover sheet C having no stretchability to the dicing tape T at the outer periphery of the plate-like object W, the expansion area of the dicing tape T is limited, and only the portion where the plate-like object W is attached Extend. Thereby, at the support point P1 of the first support portion 711, the pressing force by the pressing portion 731 acts without escape and the dicing tape T can be expanded, and the division of the plate-like object W can be promoted. Further, also at the pressing point P2 by the pressing unit 731, the pressing force by the pressing unit 731 acts without escape and the dicing tape T is expanded. Thereby, when the plate-like object W is not divided | segmented by the support point P1, the plate-like object W can be reliably divided | segmented because the plate-like object W passes the press point P2.

  Further, in particular, since an optical device wafer (sapphire or SiC) is very hard compared to silicon, it is effective because a chipping method hardly occurs even in a dividing method such as the dividing device 70A where an external force is strongly applied.

  Further, by arranging the dividing device 70A in the device for forming the modified layer that becomes the dividing start point like the laser processing device 1, the processing from the processing of the plate-like object W to the division can be completed in one device. it can.

  Further, since the cover sheet C presses the plate-like object W against the dicing tape T, peeling of the plate-like object W from the dicing tape T can be suppressed when the plate-like object W is divided.

Second Embodiment
Next, the dividing device according to the second embodiment will be described. FIG. 8 is a perspective view showing a configuration example of a dividing device according to a second embodiment. The dividing device 70B, as shown in FIG. 8, includes supporting means 71b, pressing means 73b, adjusting means 74, cover sheet sticking means not shown, driving means not shown, and Y direction moving means not shown. Have. The dividing device 70B moves the support means 71b and the pressing means 73b to the other side in the Y-axis direction by the Y-direction moving means in a state in which the plate-like material unit U is fixed, thereby dividing the plate-like material W. It differs from the first embodiment. Description of the same reference numerals as those of the first embodiment is omitted.

  The support means 71 b includes a bar-shaped first support 711 b and a bar-shaped second support 712 b. The first support portion 711b and the second support portion 712b are formed to be longer than the diameter of the plate-like object W and shorter than the diameter of the opening Fa of the annular frame F, and extend in the X-axis direction. ing. The first support portion 711b and the second support portion 712b are disposed to face each other, and allow passage of the plate-like material unit U attached to the dicing tape T while holding the plate-like material unit U from the front and back. The first support portion 711b is rotatably disposed, and supports the plate-like material unit U from the dicing tape T side. The second support portion 712 b is rotatably disposed, and supports the plate-like material unit U from the side of the cover sheet C opposite to the dicing tape T.

  The pressing means 73 b is provided with a bar-like pressing portion 731 b for pressing the plate-like object W in the Z-axis direction from the cover sheet C side. The pressing portion 731 b is formed to be longer than the diameter of the plate-like member W and shorter than the diameter of the opening portion Fa of the annular frame F, and extend in the X-axis direction. The pressing portion 731 b is disposed downstream of the first support portion 711 b and the second support portion 712 b. The pressing point by the pressing portion 731b is disposed at a position lower in the Z-axis direction than the support point by the first support portion 711b or the position of the second support portion 712b. The pressing portion 731b presses the plate-like material W which has passed between the first support portion 711b and the second support portion 712b from the cover sheet C side in the Z-axis direction.

  The driving means moves the second support portion 712 b and the pressing portion 731 b from the cover sheet C side of the plate-like unit U in a direction (Z-axis direction) approaching or separating from the plate-like unit U. The driving means moves the first support 711b from the dicing tape T side of the plate-like unit U in a direction (Z-axis direction) approaching or separating from the plate-like unit U.

  The Y-direction moving means is a moving means, and moves the support means 71 b and the pressing means 73 b relative to the plate-like material unit U. For example, the Y direction moving means moves the support means 71b and the pressing means 73b to the other side in the Y axis direction with the position of the plate-like material unit U fixed. For example, the Y-direction moving unit holds the plate-like material unit U by the first support 711 b and the second support 712 b, and presses the plate-like material U by the pressing unit 731 b. 711b, the second support portion 712b, and the pressing portion 731b are moved to the other side in the Y-axis direction. At this time, the first support portion 711b and the second support portion 712b rotate with the movement to the other side in the Y-axis direction, and the pressing portion 731b does not rotate.

  As described above, according to the dividing device 70B and the method of dividing the plate-like object according to the second embodiment, the support means 71b and the pressing means 73b are fixed in the other Y-axis direction with the position of the plate-like material unit U fixed. It is moved to the side. As a result, the same effect as that of the first embodiment is obtained, and since the plate-like object unit U is not moved to one side in the Y-axis direction at the time of division, the space for moving the plate-like object unit U becomes unnecessary. Can be miniaturized.

[Modification]
Next, modifications of the first and second embodiments will be described. Although the cover sheet C is used to limit the expansion area of the dicing tape T, the use of the cover sheet C is not essential. That is, the plate-like object W of the plate-like material unit U may be divided by the support means 71 and the pressing means 73 without sticking the cover sheet C to the plate-like material unit U.

  Further, when the adhesive force of the dicing tape T is strong and there is no fear that the plate-like material W divided when passing through the support means 71 is separated from the dicing tape T, the support means 71 may not be a pair, The second support portion 712 can be eliminated.

  In addition, when the adhesive force of the dicing tape T is strong and there is no fear that the plate-like product W divided when passing through the support means 71 peels off from the dicing tape T, the cover material C is used for dicing the plate-like product W Since it is not necessary to hold down to this, the annular cover sheet which does not cover the plate-like object W may be used.

  Moreover, although the 1st, 2nd support part 711, 712 demonstrated the structure to rotate, it is not necessary to rotate. Moreover, although the pressing part 731 demonstrated the structure which is not rotated, you may rotate it.

  The shapes of the first and second support portions 711 and 712 and the pressing portion 731 have been described as being circular in cross section, but are not limited thereto. For example, the shapes of the first and second support portions 711 and 712 and the pressing portion 731 may be polygonal or elliptical in cross section. When the cross section of the first support portion 711 is a polygon, the division accuracy of the plate-like object W can be adjusted by changing the angle of the support surface that supports the plate-like object W.

  Further, the dividing devices 70A and 70B may include cover sheet peeling means (not shown) for peeling the cover sheet C. For example, after dividing the plate-like object W along all planned dividing lines L, the cover sheet peeling means holds the end portion of the cover sheet C and peels the cover sheet C from the dicing tape T.

  In addition, the dicing tape T needs to have expandability, but the expandability may be lower than that of a normal dicing tape.

  Further, the relative position of the support means 71 and the pressing means 73 in the Y-axis direction may be adjusted according to the chip size for dividing the plate-like object W. For example, if the chip size is large, the position of the pressing portion 731 is set apart from the support means 71 in the Y-axis direction, and if the chip size is small, the position of the pressing portion 731 is close to the support means 71 in the Y-axis direction Set to position.

  Moreover, the guide member 741 of the adjustment means 74 may be a member having a support surface for supporting the plate-like unit U in the Z-axis direction, and having an L-shaped cross section orthogonal to the longitudinal direction.

  Alternatively, the planned dividing line L may be imaged by an imaging unit (not shown), and the direction of the guide member 741 may be adjusted in the direction orthogonal to the planned dividing line L. Since L is positioned in a predetermined direction, when transporting the plate-like object W from the chuck table 10 to the guide member 741, the direction is adjusted so that the support means 71 or the pressing means 73 and the planned dividing line L are orthogonal to each other. And may be transported.

  Further, the laser beam is a wavelength having an absorbability to the plate-like object W, and a laser processing groove may be formed on the incident surface of the laser beam to form a division starting point.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 10 Chuck table 20 Laser beam irradiation means 30 X-axis movement means 40 Y-axis movement means 60 Cassette elevators 70A, 70B Divider 71, 71b Support means 711, 711b First support part 712, 712b Second support part 72 Unit Moving means 721 Holding portion 73, 73b Pressing means 731, 731b Pressing portion 74 Adjustment means 741 Guide member 741a Guide surface 75 Cover sheet sticking means 80 Conveying means W Plate-like object F Annular frame T Dicing tape U Plate-like object unit C Cover Sheet

Claims (5)

The plate-like object of a plate-like material unit in which a plate-like material having a division starting point formed along predetermined dividing lines which cross each other and define a plurality of devices is supported through openings in an annular frame via dicing tape. A dividing device for a plate-like object which divides along a dividing origin,
A supporting means for supporting the plate-like material unit from the dicing tape side by a bar-like support extending in the X direction longer than the diameter of the plate-like material;
Moving means for relatively moving the support means and the plate-like unit in the Y direction orthogonal to the X direction which is the extending direction of the support portion;
Pressing means for pressing the plate-like material unit having passed through the supporting means in the Z direction orthogonal to the X direction and the Y direction by a bar-like pressing portion relatively moved with the supporting means and extending in the X direction;
Adjusting means for adjusting the direction of the intended dividing line of the plate-like material passing through the support means in parallel with the X direction ,
The support means comprises a pair of support portions which allow passage while sandwiching the plate-like material unit from the front and back, and which are arranged at positions mutually offset in the Y direction at a distance shorter than the spacing of the planned dividing lines.
The plate-like material unit of the pair of support portions is supported on the dicing tape side, whereas the other support portion is disposed on the pressing portion side in the Y direction with respect to the one support portion. Divider of objects. The plate-like article according to claim 1, further comprising: a cover sheet attaching means for attaching a region protruding on the outer periphery of the plate-like article to a dicing tape while covering the exposed surface of the plate-like article with a non-stretchable cover sheet. Splitter. 3. A plate-like object dividing device according to claim 1 or 2 , and a processing means for forming a division starting point along the line to be divided on a plate-like object provided with division intended lines which intersect with one another to divide a plurality of devices. Processing device provided with In a method of dividing a plate-like object of a plate-like object unit in which a plate-like object having a division starting point formed along predetermined dividing lines intersecting mutually and dividing a plurality of devices is supported through openings of annular frames There,
A cover sheet with a cover sheet in which the cover sheet protruding on the outer periphery of the plate is attached to a dicing tape while covering the surface of the plate with a non-stretchable cover sheet, and the plate is sandwiched between the dicing tape and the cover sheet. A cover sheet attaching step of forming a rod unit;
A dividing device according to claim 1 or claim 2 or the supporting means of the processing device according to claim 3 and the pressing means are passed through a plate-like unit with a cover sheet, and plate-like along the dividing starting point A dividing step of dividing an object;
A plate-like member characterized in that the cover sheet attached to the dicing tape limits the expansion area of the dicing tape, and the plate-like material is divided by passing through the support means and the pressing means. How to divide things. 5. The method according to claim 4 , wherein the pressing step presses the cover sheet-attached plate-like unit from the cover sheet side in the dividing step.

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