JP2012222198A - Breaking device and breaking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a breaking device and a breaking method capable of enhancing the area efficiency and the yield.SOLUTION: The breaking device 1 that breaks a substrate 10 on which a plurality of chip areas are formed by a breaking line 10a along the breaking line 10a comprises a first abutting part which abuts against one surface of the substrate 10, a second abutting part which abuts against the other surface of the substrate 10 to face the first abutting part, and a blade 3 which cuts the substrate 10 by imparting a flexural stress onto the breaking line 10a of the substrate 10 held between the first and second abutting parts. The other end of the chip area held between the first and second abutting parts and having one broken end is cut by means of the blade 3.

Description

  The present invention relates to a braking apparatus and a braking method for dividing a semiconductor substrate or the like.

  A conventional braking device that divides a semiconductor substrate or the like is disclosed in Patent Document 1. FIG. 7 is an enlarged side sectional view of the periphery of the blade of the braking device. On the lower surface of the substrate 10, ruled lines that become the division lines 10a are formed in a lattice shape by a diamond blade or the like. As a result, a plurality of chip regions are formed on the substrate 10. In FIG. 7, for the sake of convenience of explanation, a division line 10 a is drawn from the lower surface to the upper surface of the substrate 10.

  A protective sheet 12 is attached to the lower surface of the substrate 10. An adhesive sheet 11 is attached to the upper surface of the substrate 10. The adhesive sheet 11 is stretched around an annular holding frame (not shown). The adhesive sheet 11, the protective sheet 12, and the holding frame constitute the substrate holding unit 2 that holds the substrate 10.

  The braking device 1 is provided with a blade 3 extending in a direction perpendicular to the paper surface. Further, the braking device 1 is provided with a receiving portion 4 on which the substrate holding portion 2 is placed. The receiving portion 4 is disposed below the blade 3 with a predetermined space.

  The substrate holding part 2 is placed on the receiving part 4 with the protective sheet 12 facing down. Thereafter, as indicated by an arrow A, the blade 3 is pressed onto the planned dividing line 10 a of the substrate 10 from above the adhesive sheet 11. Then, the blade 3 applies a bending stress in the direction of arrow A on the planned dividing line 10a, thereby cutting the substrate 10 along the planned dividing line 10a. This cutting operation is sequentially performed along all the planned dividing lines 10a, and individual chips are divided and formed from the chip region of the substrate 10.

  At this time, when the substrate holding unit 2 is placed on the receiving unit 4, the substrate 10 is warped to cause a float between the substrate holding unit 2 and the receiving unit 4. When this floating occurs, it is difficult to accurately align the blade 3 on the planned dividing line 10a. Therefore, air is blown from above the substrate 10 toward the substrate 10 to prevent floating between the substrate holding unit 2 and the receiving unit 4.

JP 2007-55197 A (pages 6 to 8, FIGS. 6 and 9)

  However, simply preventing the floating between the substrate holding part 2 and the receiving part 4 by air injection reduces the area efficiency of the substrate and the yield of chip division. This will be specifically described below. In FIG. 7, the chip area C3 and the chip area C4 are already cut by the blade 3 on the planned dividing line 10a. The chip area C1 and the chip area C2 have not been cut yet. The blade 3 descends as shown by an arrow A on the planned dividing line 10a between the chip area C2 and the chip area C3 and is about to be cut. That is, one end (chip area C4 side) of the chip area C3 has been divided, and the other end (chip area C2 side) is about to be cut. A two-dot chain line 71 is an imaginary line passing through the center of the blade 3 and the planned dividing line 10a to be cut.

  Then, the blade 3 applies a bending stress in the direction of arrow A on the planned dividing line 10a at the other end of the chip region C3 whose one end has been divided. At this time, the air jetted from above has a weak force to press the divided one end side against the bending stress by the blade 3, so that the one end side is lifted from the receiving portion 4. Accordingly, since the division accuracy is lowered, it is necessary to increase the division margin, and there is a problem that the area efficiency of the substrate 10 is lowered. In addition, cracks and chipping of the cut chip increase due to lifting from the receiving portion 4. As a result, there is a problem that the yield decreases.

  An object of the present invention is to provide a braking device and a braking method capable of improving area efficiency and yield.

  In order to achieve the above object, the present invention provides a first contact that abuts against one surface of the substrate in a braking device that divides a substrate in which a plurality of chip regions are formed along the planned dividing line along the planned dividing line. A second contact portion that contacts the other surface of the substrate opposite to the first contact portion, and on the planned dividing line of the substrate sandwiched between the first contact portion and the second contact portion. A blade that cuts by applying a bending stress, and is sandwiched between the first contact portion and the second contact portion, and the other end of the chip region that has been divided at one end is cut by the blade. .

  According to this configuration, the individual chips are divided by the blade applying bending stress on the planned dividing line of the substrate. At this time, the first contact portion and the second contact portion are in contact with the substrate and sandwich the substrate. The first contact portion and the second contact portion have one end sandwiching the divided chip region, and the other end of the chip region is cut by a blade.

  According to the present invention, in the braking device configured as described above, a plurality of first abutting portions and a plurality of second abutting portions are provided, and the tip regions on both sides of the division line to be cut by the blade are defined as the first abutting portions. And it is preferable to pinch | interpose with a 2nd contact part. According to this configuration, the substrate is sandwiched between the plurality of first contact portions and second contact portions. The chip regions on both sides of the planned dividing line cut by the blade are sandwiched between the first contact portion and the second contact portion.

  According to the present invention, in the braking device configured as described above, the first contact portion is disposed on the same side as the blade with respect to the substrate, and the second contact portion is disposed on the opposite side of the blade, and the blade The distance between the center of the blade and the second contact portion in the direction parallel to the substrate is preferably equal to or less than the distance between the center of the blade and the first contact portion in the direction parallel to the substrate.

  According to the present invention, in the braking device configured as described above, it is preferable that a surface of the first contact portion that faces the blade is an inclined surface that is inclined so as to approach the substrate side as the blade is approached.

  According to the present invention, in the braking device configured as described above, the length of the first contact portion in the direction parallel to the longitudinal direction of the blade is the length of the second contact portion in the direction parallel to the longitudinal direction of the blade. Or less.

  According to the present invention, in the braking device configured as described above, it is preferable that the first abutting portion has a curved corner formed by a surface opposite to the blade and the abutting surface of the substrate.

  In the braking device configured as described above, preferably, the width of the first contact portion and the second contact portion is equal to or greater than the width of the tip region.

  According to the present invention, in the braking device having the above-described configuration, the plurality of blades are sequentially arranged on the opposite side with respect to the substrate and arranged side by side, and the tip region cut by the blade disposed at one end is first. It is preferable to be sandwiched between the contact portion and the second contact portion.

  According to the present invention, in the braking device configured as described above, the three blades are provided, the first contact portion is disposed on the same side as the blades at both ends with respect to the substrate, and the second contact portion is disposed at the center. It is preferable that the distance between the center of the central blade and the second contact portion in the direction parallel to the substrate is smaller than twice the width of the chip region.

  According to the present invention, in the braking device configured as described above, a first imaging unit is provided on an opposite side to the blade with respect to the substrate and images the planned division line, and is arranged on the same side as the blade. The contact part or the second contact part is preferably formed of a transparent material.

  In the braking device configured as described above, it is preferable that the braking device includes an illumination unit that is provided on the same side as the blade and illuminates the substrate.

  In the braking device configured as described above, preferably, the first contact portion or the second contact portion disposed on the same side as the blade guides illumination light.

  According to the present invention, in the braking device configured as described above, a first imaging unit is provided on an opposite side to the blade with respect to the substrate and images the planned division line, and is arranged on the same side as the blade. The contact portion or the second contact portion is preferably formed of a self-luminous material.

  The present invention also provides a braking method for dividing a substrate in which a plurality of chip regions are formed by a predetermined dividing line along the predetermined dividing line, the first abutting portion being brought into contact with one surface of the substrate and the other surface. The second contact portion is brought into contact with the tip region, one end of the chip area is sandwiched between the first contact portion and the second contact portion, and a bending stress is applied by a blade on the planned division line at the other end. The other end is cut off.

  According to the present invention, in the braking method configured as described above, the substrate preferably has a diameter of 4 inches or more.

  According to the present invention, since the other end of the chip region that is sandwiched between the first contact portion and the second contact portion and one end of which has been divided is cut by the blade, lifting of the one end side is prevented, and the accuracy of the division is improved. To do. Accordingly, the division margin is reduced and the area efficiency of the substrate is improved. Further, by preventing the floating, cracks and chipping of the cut chips can be reduced and the yield of the chips can be improved.

Side surface sectional drawing of the braking device of 1st Embodiment of this invention. The bottom view of the board | substrate holding part of the braking device of 1st Embodiment of this invention. Sectional view along line XX in FIG. Side surface sectional drawing to which the blade periphery of the braking device of 1st Embodiment of this invention was expanded. Side surface sectional drawing to which the blade periphery of the braking device of 2nd Embodiment of this invention was expanded. Side surface sectional drawing to which the blade periphery of the braking device of 3rd Embodiment of this invention was expanded. Side cross-sectional view enlarging the periphery of a conventional braking device blade

  A first embodiment of the present invention will be described below with reference to the drawings. For convenience of explanation, the same reference numerals are given to the same parts as in the conventional example shown in FIG. FIG. 1 is a side sectional view showing the braking device 1.

  In the braking device 1, an L-shaped angle 25 is erected on the rear portion of the base 22. Two mounting bases 21, 21 are provided on the base 22. A receiving portion 4 (second abutting portion) is attached to the upper portion of each mounting base 21. The two receiving portions 4 and 4 are provided with a predetermined space 23 in the front-rear direction. The receiving part 4 is in contact with the lower surface of the protective sheet 12 of the substrate holding part 2. The length of the receiving portion 4 in the left-right direction (the length in the direction perpendicular to the paper surface of FIG. 1) is formed to be longer than the diameter of the substrate 10, but the length does not hinder the movement of the holding frame fixing portion 6 described later. It has become. Further, the width in the front-rear direction of the receiving portion 4 (the length in the direction parallel to the left-right direction in FIG. 1) is also a size that does not hinder the movement of the holding frame fixing portion 6.

  Above the central portion of the space 23, a blade 3 that applies bending stress to the substrate 10 is mounted so as to be movable in the vertical direction by a blade movable shaft 3a supported by an angle 25. The blade 3 is disposed above the receiving portion 4 with a predetermined gap. A substrate holding portion 2 described later is disposed in the gap. The longitudinal direction of the blade 3 is the left-right direction (the direction perpendicular to the paper surface of FIG. 1). Further, the length of the receiving portion 4 is substantially the same as the length of the blade 3 in the longitudinal direction.

  The holding frame fixing part 6 is formed in an annular shape in plan view, and holds the substrate holding part 2 and fixes it to the braking device 1. The holding frame fixing part 6 can be rotated in a horizontal plane by a rotation mechanism (not shown). Moreover, it can move to the front-back direction by a back-and-forth movement mechanism (not shown). Thereby, adjustment (alignment) which moves the board | substrate holding | maintenance part 2 and aligns the braid | blade 3 on the division | segmentation planned line 10a can be performed.

  At the front and rear of the blade 3, presser portions 5 (first contact portions) facing the receiving portions 4 are configured to be movable up and down by a presser portion movable shaft 5 a supported by an angle 25. The holding part 5 comes into contact with the board holding part 2, and the board 10 is sandwiched between the holding part 5 and the receiving part 4. The length of the holding portion 5 (the length in the direction parallel to the longitudinal direction of the blade 3) is not less than the diameter of the substrate 10 and not more than the length of the receiving portion 4 (the length in the direction parallel to the longitudinal direction of the blade 3). It has become. Thereby, the board | substrate 10 can be pinched reliably and the movement of the holding frame fixing | fixed part 6 is not prevented. Further, the width of the presser portion 5 (the length in the direction perpendicular to the longitudinal direction of the blade 3) is equal to or greater than the width of the tip region and is less than the width of the receiving portion 4 (the length in the direction perpendicular to the longitudinal direction of the blade 3). It has become. Thereby, the board | substrate 10 can be pinched | interposed, without preventing the movement of the holding frame fixing | fixed part 6. FIG.

  The surface of the presser portion 5 that faces the blade 3 is an inclined surface 5b (see FIG. 4) that is inclined so as to approach the substrate 10 as the blade 3 is approached. Thereby, interference with the blade 3 can be prevented. In addition, the pressing portion 5 has a curved surface 5c (see FIG. 4) where a corner between the surface opposite to the blade 3 and the contact surface of the substrate 10 is formed. Accordingly, the adhesive sheet 11 can be prevented from being caught when the substrate holding unit 2 is moved in a state where the presser unit 5 is in contact with the substrate holding unit 2. The presser part 5 is made of a material transparent to visible light such as quartz. Thereby, illumination light or natural light from the illumination unit 8 (described later) irradiated to the presser unit 5 is easily guided to the imaging unit 7 without being blocked by the presser unit 5.

  An illumination unit 8 is provided above the substrate holding unit 2 so as to sandwich the blade 3 in the front-rear direction. The illumination unit 8 is supported at an angle 25 by a support member 8a, and illuminates the tip of the blade 3 and the substrate 10. A large number of light emitting diodes (not shown) are arranged in the illumination unit 8 along the longitudinal direction of the blade 3.

  An imaging unit 7 is disposed below the space 23. The imaging unit 7 images the planned division line 10 a of the substrate 10 illuminated by the illumination unit 8. The imaged data is used for the aforementioned adjustment (alignment). For example, a CCD (charge coupled device) camera can be used as the imaging unit 7.

  FIG. 2 is a bottom view of the substrate holding part 2 of the braking device 1. FIG. 3 is a sectional view taken along line XX of FIG. The substrate holding unit 2 places the substrate 10 in an annular holding frame 13, and fixes the substrate 10 with an adhesive sheet 11 that is attached to cover one surface of the holding frame 13. As a result, the holding frame 13 is held together with the adhesive sheet 11 by the holding frame fixing portion 6. A protective sheet 12 is attached to the other surface of the substrate 10. The pressure-sensitive adhesive sheet 11 is formed of a synthetic resin having transparent elasticity such as polyvinyl chloride or polyolefin, and an acrylic pressure-sensitive adhesive is applied to the pressure-sensitive adhesive surface. The protective sheet 12 is formed in a substantially square shape in plan view with a transparent resin such as polyethylene.

  In addition, there is no limitation in particular in the material of the adhesive sheet 11, You may use the material which does not have elasticity, such as polyethylene. Moreover, you may use materials other than an acrylic also as an adhesive. For example, you may use adhesives, such as rubber type, silicone type, and polyvinyl ether. However, when the imaging unit 7 is disposed below the substrate holding unit 2 and light is transmitted from above the substrate holding unit 2 as in the present embodiment, the material of the adhesive sheet 11 is preferably transparent. .

  Moreover, there is no limitation in particular in the material of the protection sheet 12, For example, you may use materials, such as a polypropylene and a polystyrene. Although not shown, the protective sheet 12 may be omitted and the lower surface of the substrate 10 may be brought into direct contact with the upper surface of the receiving portion 4.

  The substrate 10 is made of, for example, a semiconductor substrate, and an element such as an LED (Light Emitting Diode) is formed by arranging a transparent electrode, p-type and n-type electrodes on a nitride semiconductor layer stacked on a sapphire substrate. At this time, for example, the adhesive sheet 11 is attached to the element forming surface of the substrate 10, and the protective sheet 12 is attached to the back surface of the substrate 10.

  Before the adhesive sheet 11 and the protective sheet 12 are adhered, the substrate 10 is irradiated with laser from the sapphire substrate surface side to the inside of the substrate 10 using a laser processing apparatus (not shown). As a result, the modified layer to be the division lines 10 a is formed in a lattice shape, and a plurality of chip regions are formed on the substrate 10. Starting from this modified layer, the substrate 10 is divided to manufacture individual chips. In FIG. 3, for the sake of convenience of explanation, a division line 10 a is drawn from the lower surface to the upper surface of the substrate 10. The method for forming the planned dividing line 10a is not particularly limited. For example, a marking groove or the like may be formed as the planned dividing line 10a using a method such as diamond scribe or a dicing blade.

  Next, the operation of the braking device 1 will be described. As shown in FIG. 1, the substrate holding unit 2 is fixed to the braking device 1 by the holding frame 13 of the substrate holding unit 2 being sandwiched by the holding frame fixing unit 6. At this time, the protective sheet 12 of the substrate holding unit 2 comes into contact with the upper surface of the receiving unit 4. In this state, the illumination unit 8 is operated based on an operation signal from a control unit (not shown). The illumination light emitted from the illumination unit 8 irradiates the tip of the blade 3 and passes through the adhesive sheet 11, the substrate 10 and the protective sheet 12.

  The presser unit 5 is lowered by the presser unit movable shaft 5a based on the operation signal from the control unit. Then, the substrate holding part 2 is sandwiched between the holding part 5 and the receiving part 4. Thereby, the float between the board | substrate holding | maintenance part 2 and the receiving part 4 is prevented, and the curvature of the board | substrate 10 is corrected.

  Next, the imaging unit 7 images the planned division line 10 a of the substrate 10. Based on the captured image data, a displacement amount (displacement amount) of the planned dividing line 10a with respect to the tip of the blade 3 is calculated as numerical data by an image processing device (not shown).

  Based on the numerical data, an operation signal is output from the control unit to the forward / backward moving mechanism and the rotating mechanism. And the board | substrate holding | maintenance part 2 is moved so that the holding frame fixing | fixed part 6 act | operates and a displacement amount becomes zero. Thereby, the division | segmentation planned line 10a is moved to the position corresponding to the front-end | tip of the braid | blade 3. FIG. That is, adjustment is made so that the longitudinal direction of the blade 3 is positioned immediately above the planned dividing line 10a.

  The image data picked up by the image pickup unit 7 is displayed on the monitor (not shown) from the control unit on the monitor. Thereby, the user can easily confirm the displacement amount (deviation amount).

  After the adjustment is performed so that the displacement amount (displacement amount) becomes zero as described above, an operation signal is output from the control unit to the blade drive shaft 3a. Then, the blade 3 descends on the planned dividing line 10a to apply bending stress. Thereby, the board | substrate 10 is cut | disconnected along the division | segmentation planned line 10a.

  Thereafter, the substrate holding unit 2 is moved in the front-rear direction (direction orthogonal to the longitudinal direction of the blade 3) by the front-rear moving mechanism, and similarly cut by the blade 3 on the next planned dividing line 10a. By repeating this, the division work on the division line 10a arranged in the front-rear direction is completed.

  After the completion, the substrate holding unit 2 is rotated 90 degrees on the upper surface of the receiving unit 4 by the rotation mechanism. Then, the dividing work is sequentially performed along the planned dividing line 10a as described above. As a result, the substrate 10 on which a plurality of chip regions are formed in a lattice shape is divided and cut for each chip.

  FIG. 4 is an enlarged side sectional view of the periphery of the blade 3 of the braking device 1 of FIG. The substrate holding unit 2 is installed between the holding unit 5 and the receiving unit 4, and the substrate 10 is divided by the blade 3. The two pressing portions 5 and 5 are in contact with the upper surface of the substrate holding portion 2 and are arranged to face each other with a predetermined space. This space is provided to such an extent that the blade 3 does not interfere with the presser portion 5 when the blade 3 is lowered onto the planned dividing line 10a. Further, the two receiving portions 4, 4 are in contact with the lower surface of the substrate holding portion 2 and are disposed to face each other with a predetermined space 23. This space 23 is provided so as not to hinder the division of the substrate 10 by the blade 3.

  The chip region C4 has already been cut by the blade 3 on the planned dividing line 10a. The chip area C1 and the chip area C2 have not been cut yet. The blade 3 descends as shown by an arrow A on the planned dividing line 10a between the chip area C2 and the chip area C3 and is about to be cut. That is, one end (chip area C4 side) of the chip area C3 has been divided, and the other end (chip area C2 side) is about to be cut by the blade 3 from now on. In FIG. 4, for the sake of convenience of explanation, a division line 10 a is drawn from the lower surface to the upper surface of the substrate 10. A two-dot chain line 41 is an imaginary line passing through the center of the blade 3 and the planned dividing line 10a to be cut.

  When the blade 3 is pushed along the planned dividing line 10a as indicated by the arrow A, the chip area C3 separated from the chip area C4 is likely to be lifted from the receiving portion 4 as compared with the chip area C2 connected to the chip area C1. However, the chip region C <b> 3 is sandwiched between the pressing part 5 and the receiving part 4. Thereby, when the chip region C3 and the chip region C2 are cut by the blade 3, it is possible to suppress the chip region C3 from being lifted from the receiving portion 4. Therefore, area efficiency and yield can be improved.

  In addition, the chip area C <b> 2 is also sandwiched between the pressing part 5 and the receiving part 4. In other words, the chip regions C <b> 2 and C <b> 3 on both sides of the planned dividing line 10 a to be cut by the blade 3 are sandwiched between the pressing portion 5 and the receiving portion 4. Thereby, since the floating from the receiving part 4 is further suppressed, the division accuracy is further improved and the division margin can be further reduced. Therefore, the area efficiency of the substrate 10 is further improved. Moreover, since the floating from the receiving part 4 is further suppressed, cracks and chipping of the cut chips are further reduced. As a result, the yield is further improved. When dividing, the position of the presser 5 is adjusted in advance so that the distance D3 between the center of the blade 3 and the presser 5 in the direction parallel to the substrate 10 is smaller than the width D1 of the chip region.

  In FIG. 4, a minute gap may be formed between the substrate holding part 2 and the receiving part 4 in a state where the warpage of the substrate 10 is corrected. Even in this case, when the blade 3 is away from the substrate 10, the holding portion 5 contacts the substrate 10, and when the blade 3 applies bending stress to the substrate 10, the receiving portion 4 contacts the substrate 10. Further, since the gap is very small, the lift of the chip area can be small. Therefore, even in this case, the area efficiency and the yield are improved as described above.

  The distance D2 between the center of the blade 3 and the receiving portion 4 in the direction parallel to the substrate 10 is smaller than the distance D3 between the center of the blade 3 and the holding portion 5 in the direction parallel to the substrate 10. Thereby, the tip region to which bending stress is applied by the blade 3 is reliably supported by the receiving portion 4. Therefore, since the division accuracy is further improved, the division margin can be further reduced, and the area efficiency of the substrate 10 is further improved. Moreover, since the floating from the receiving part 4 is further suppressed, cracks and chipping of the cut chips are further reduced. As a result, the yield is further improved. Even when the distance D2 between the center of the blade 3 and the receiving portion 4 in the direction parallel to the substrate 10 is equal to or less than the distance D3 between the center of the blade 3 and the holding portion 5 in the direction parallel to the substrate 10, the above effect is obtained.

  Further, the width L2 of the pressing portion 5 and the width L1 of the receiving portion 4 are larger than the width D1 of the chip region. As a result, the chip region can be reliably sandwiched between the presser portion 5 and the receiving portion 4. Even when the width L2 of the pressing portion 5 and the width L1 of the receiving portion 4 are equal to or larger than the width D1 of the chip region, the above-described effect is exhibited.

  In the present embodiment, two receiving portions 4 and two pressing portions 5 are provided on both sides of the blade 3, but three or more pressing portions 5 and receiving portions 4 may be provided. Thereby, the area efficiency and the yield can be improved, and the warpage of the substrate 10 can be further corrected.

  According to the present embodiment, the blade 3 cuts the other end of the chip region which is sandwiched between the presser portion 5 (first contact portion) and the receiving portion 4 (second contact portion) and has one end divided. Thereby, since the floating from the receiving part 4 is suppressed, the division | segmentation precision can improve and a division | segmentation margin can be reduced. Therefore, the area efficiency of the substrate 10 is improved. Further, since lifting from the receiving portion 4 is suppressed, cracks and chipping of the cut chips are reduced. Therefore, the yield is improved.

  A plurality of pressing portions 5 and receiving portions 4 are provided, and the chip regions on both sides of the planned dividing line 10 a to be cut by the blade 3 are sandwiched between the pressing portions 5 and the receiving portions 4. Thereby, since the floating from the receiving part 4 is further suppressed, the division accuracy is further improved and the division margin can be further reduced. Therefore, the area efficiency of the substrate 10 is further improved. Moreover, since the floating from the receiving part 4 is further suppressed, cracks and chipping of the cut chips are further reduced. As a result, the yield is further improved. Moreover, since the presser part 5 transmits light, alignment can be easily performed. When natural light can be used, the illumination unit 8 may be omitted.

  Next, a second embodiment will be described. The present embodiment is different from the first embodiment in that the pressing portion 5 above the chip region C2 is omitted from the first embodiment, and the pressing portion 5 is disposed only above the chip region C3. Other parts are the same as those in the first embodiment. FIG. 5 is an enlarged side cross-sectional view of the periphery of the blade 3 of the braking device 1 of the present embodiment. A two-dot chain line 51 is an imaginary line passing through the center of the blade 3 and the division line 10a to be cut.

  Also in this embodiment, the chip region C3 is sandwiched between the presser part 5 (first contact part) and the receiving part 4 (second contact part). Thereby, there exists an effect similar to 1st Embodiment. In addition, since only one pressing portion 5 is required, the manufacturing cost of the braking device 1 can be reduced and the braking device 1 can be simplified. Further, the illumination light of the illumination unit 8 can pass through the substrate holding unit 2 from the chip region C2 side and can enter the imaging unit 7 through the space 23. Thereby, it is not always necessary to form the presser portion 5 with a light-transmitting material. Therefore, the room for selection of the material of the presser portion 5 is widened.

  Also in this embodiment, the distance D2 between the center of the blade 3 and the receiving portion 4 in the direction parallel to the substrate 10 is equal to or less than the distance D3 between the center of the blade 3 and the holding portion 5 in the direction parallel to the substrate 10. preferable. Moreover, it is preferable that the width L2 of the holding part 5 and the width L1 of the receiving part 4 are equal to or larger than the width D1 of the chip region.

Next, a third embodiment will be described. FIG. 6 is an enlarged side cross-sectional view of the periphery of the blade 3 of the braking device 1 of the present embodiment. In the present embodiment, three blades 3 of the first embodiment are provided, and these three blades 3 are sequentially arranged on the opposite side with respect to the substrate 10 and arranged in parallel.
The receiving part 4 (first contact part) is in contact with the lower surface of the substrate holding part 2. Further, the presser part 5 (second contact part) is in contact with the upper surface of the substrate holding part 2. The imaging unit 7 may be provided below the substrate 10 so as to face the blade 3 above the substrate 10, or may be provided above the substrate 10 so as to face the blade 3 below the substrate 10. Two-dot chain lines 61, 62, and 63 are imaginary lines that pass through the center of each blade 3 and on each division line 10a to be cut. Other parts are the same as those in the first embodiment.

  The surface of the receiving portion 4 that faces the blade 3 is an inclined surface 4b that is inclined so as to approach the substrate 10 as the blade 3 is approached. Thereby, interference with the blade 3 can be prevented. The receiving portion 4 has a curved surface 4c with a corner between the surface opposite to the blade 3 and the contact surface of the substrate 10. Thereby, when the board | substrate holding | maintenance part 2 is moved in the state which the receiving part 4 contact | abutted to the board | substrate holding | maintenance part 2, the entrainment of the protective sheet 12 can be prevented. The receiving portion 4 is made of a material transparent to visible light such as quartz. Thereby, the illumination light or natural light from the illuminating unit 8 irradiated on the receiving unit 4 is easily guided to the imaging unit 7 without being blocked by the receiving unit 4.

  The chip region C6 has already been cut by the blade 3 on the planned dividing line 10a. The chip area C1 and the chip area C2 have not been cut yet. Then, the blade 3 has arrows B and A on the planned dividing line 10a between the chip area C2 and the chip area C3, between the chip area C3 and the chip area C4, and between the chip area C4 and the chip area C5. , Approaching like C and trying to cut. The chip region C5 cut by the blade 3 disposed at one end is sandwiched between the pressing portion 5 and the receiving portion 4. Thereby, since the lifting from the presser portion 5 is suppressed, the division accuracy can be improved and the division margin can be reduced. Therefore, the area efficiency of the substrate 10 is improved. Further, cracks and chipping of the cut chip are reduced. As a result, the yield is improved.

  By the way, the chip regions C3 and C4 are not sandwiched between the pressing portion 5 and the receiving portion 4. Therefore, when the blade 3 descends as indicated by the arrow A and cuts between the chip area C3 and the chip area C4 along the planned dividing line 10a, one end of the chip area C3 (chip area C2 side) and the chip area C4 One end (chip region C5 side) tends to float from the receiving portion 4. However, the chip region C2 adjacent to the chip region C3 and the chip region C5 adjacent to the chip region C4 are sandwiched between the receiving part 4 and the pressing part 5. Therefore, the floating of the substrate 10 is reduced as compared with the conventional example.

  According to this embodiment, the same effects as those of the first and second embodiments can be obtained. Since a plurality of blades 3 are provided, a plurality of chip regions can be divided at a time by applying a bending stress by simultaneously bringing the plurality of blades 3 into contact with the substrate holding unit 2. Therefore, it is possible to speed up the division work.

  Further, three blades are provided, and the receiving portion 4 (first contact portion) is disposed on the same side as the blades 3 at both ends with respect to the substrate 10 and the presser portion 5 (second contact portion) is disposed at the center blade 3. The distance D3 in the direction parallel to the substrate 10 between the center of the central blade 3 and the pressing portion 5 is smaller than twice the width D1 of the chip region. Thus, the blade 3 can reliably cut at three places at a time while reducing the lift of the chip area.

  In the first to third embodiments described above, the substrate holding unit 2 is mounted in the horizontal direction and the blade 3 applies bending stress from above or below. However, the substrate holding unit 2 is mounted in the vertical direction. Alternatively, the blade 3 may be configured to apply bending stress from the side.

  Further, the substrate on which an element such as an LED (Light Emitting Diode) is formed as the substrate 10 has been described as an example. However, a plurality of semiconductor element regions such as laser diodes and MEMS (Micro Electro Mechanical Systems) regions are formed in a lattice shape. Substrates may also be used. Further, a substrate used for a semiconductor such as a sapphire substrate, a gallium nitride substrate, or a SiC substrate that is particularly difficult to divide may be used. Moreover, the board | substrate for light emitting element accommodation packages, such as a ceramic and glass, may be sufficient. It is preferable that the diameter of the substrate 10 is 4 inches or more because more chips can be manufactured from one substrate. Since the substrate 10 is sandwiched between the pressing portion 5 and the receiving portion 4, even if the substrate has a diameter of 4 inches or more, the warp can be surely corrected and the area efficiency and the yield can be improved.

  Although not shown, the illumination unit 8 may be disposed on the same side as the imaging unit 7 with respect to the substrate 10. Thereby, even if it is a board | substrate which does not permeate | transmit light easily, the division | segmentation planned line 10a can be imaged reliably. However, since the illumination light may be reflected by the substrate 10 or the protective sheet 12 and imaging may be difficult, it is preferable to dispose the illumination unit 8 on the side opposite to the imaging unit 7 with respect to the substrate 10 as in the present embodiment.

  In the first and second embodiments, the surface of the presser portion 5 that faces the blade 3 is the inclined surface 5b that is inclined so as to approach the substrate 10 as the blade 3 is approached. However, the present invention is not limited to this. . The surface facing the blade 3 of the pressing portion 5 may be a plane perpendicular to the substrate 10. Thereby, the processing of the presser part 5 becomes easy. However, the inclined surface 5b is preferable from the viewpoint of preventing interference with the blade 3. The same applies to the receiving part 4 of the third embodiment.

  The pressing portion 5 may have a curved corner formed between the surface facing the blade 3 and the contact surface of the substrate 10. Thereby, entrainment of the adhesive sheet 11 can be prevented. In this case, the curved surface facing the blade 3 is not in contact with the substrate 10. Therefore, the width L2 of the presser portion 5 described above is a width excluding the curved surface portion of the width of the presser portion 5. Further, the distance D3 in the direction parallel to the substrate 10 between the center of the blade 3 and the pressing portion 5 is the distance in the direction parallel to the substrate 10 between the center of the blade 3 and the contact surface of the holding portion 5 with the substrate 10. The same applies to the receiving part 4 of the third embodiment.

  The presser part 5 is formed of a material having translucency. Thereby, the light passes through the presser unit 5 and is guided to the imaging unit 7. At this time, the illumination unit 8 may be omitted. Alternatively, the illumination unit 8 may be disposed on the side of the presser unit 5 so that the emitted light is incident on the presser unit 5 and guided by the presser unit 5 to emit the illumination light. Moreover, the pressing part 5 may be formed of a self-luminous material. Thereby, the illumination part 8 can be omitted. As the self-luminous material, for example, an organic EL (Electro Luminescence) material can be used. The polymer organic EL uses an anode ITO (Indium Tin Oxide) electrode for the glass substrate, PEDOT (poly (ethylenedioxy) thiophene) for the hole injection layer, PPV (polyphenylene vinylene) for the light emitting layer, and a magnesium silver alloy for the electrode. It can be manufactured in a laminated structure. Since a light emitting layer can be flexibly produced on glass, plastic, etc. using a known printing technique, the degree of freedom in designing the presser part 5 having self-luminous properties is improved.

  The present invention can be used for a braking apparatus and a braking method for dividing a semiconductor substrate or the like.

DESCRIPTION OF SYMBOLS 1 Braking apparatus 2 Board | substrate holding part 3 Blade 3a Blade movable shaft 4 Receiving part 4b Inclined surface 4c Curved surface 5 Pressing part 5a Holding part movable shaft 5b Inclined surface 5c Curved surface 6 Holding frame fixing | fixed part 7 Imaging part 8 Illumination part 10 Substrate 10a Division | segmentation Planned line 11 Adhesive sheet 12 Protective sheet 13 Holding frame 21 Mounting base 22 Base 23 Space 25 Angle 41, 51, 61, 62, 63, 71 Virtual line C1, C2, C3, C4, C5, C6 Chip area L1 receiving part 4 width L2 width of holding part 5 D1 width of chip area D2 distance in the direction parallel to the substrate 10 between the center of the blade 3 and the receiving part 4 D3 direction parallel to the substrate 10 in the center of the blade 3 and the holding part 5 Distance of

Claims (15)

In the braking device that divides the substrate on which the plurality of chip regions are formed by the planned dividing line along the planned dividing line,
A first contact portion that contacts one surface of the substrate; a second contact portion that contacts the other surface of the substrate opposite to the first contact portion; and a first contact portion and a second contact portion. A blade for applying a bending stress on the planned division line of the sandwiched substrate and cutting it;
A braking device characterized in that it is sandwiched between the first contact portion and the second contact portion and the other end of the tip region which has been divided at one end is cut by the blade.   A plurality of first contact portions and a plurality of second contact portions are provided, and the chip regions on both sides of the planned dividing line to be cut by the blade are sandwiched between the first contact portion and the second contact portion. The braking device according to claim 1.   A first contact portion is disposed on the same side as the blade with respect to the substrate, a second contact portion is disposed on the opposite side of the blade, and the substrate between the center of the blade and the second contact portion is disposed on the substrate. The braking device according to claim 1, wherein a distance in a parallel direction is equal to or less than a distance in a direction parallel to the substrate between the center of the blade and the first contact portion.   The braking device according to claim 3, wherein a surface of the first contact portion facing the blade is an inclined surface that is inclined so as to approach the substrate side as the blade is approached.   The length of the first contact portion in the direction parallel to the longitudinal direction of the blade is equal to or less than the length of the second contact portion in the direction parallel to the longitudinal direction of the blade. The braking device according to claim 4.   The braking device according to any one of claims 3 to 5, wherein the first abutting portion has a curved corner formed by the surface opposite to the blade and the abutting surface of the substrate. .   The braking device according to any one of claims 1 to 6, wherein the width of the first contact portion and the second contact portion is equal to or greater than the width of the tip region.   A plurality of the blades are sequentially arranged on the opposite side of the substrate and arranged side by side, and the chip region cut by the blade disposed at one end is sandwiched between the first contact portion and the second contact portion. The braking device according to claim 1.   The three blades are provided, the first contact portion is disposed on the same side as the blades at both ends with respect to the substrate, and the second contact portion is disposed on the same side as the central blade. 9. The braking device according to claim 8, wherein a distance between the center of the substrate and the second contact portion in a direction parallel to the substrate is smaller than twice the width of the chip region.   An imaging unit that is provided on the opposite side to the blade with respect to the substrate and captures the planned dividing line, and the first contact portion or the second contact portion disposed on the same side as the blade is a transparent material The braking device according to any one of claims 1 to 9, wherein the braking device is formed of.   The braking device according to claim 10, further comprising an illumination unit that is provided on the same side as the blade with respect to the substrate and illuminates the substrate.   The braking device according to claim 11, wherein the first contact portion or the second contact portion disposed on the same side as the blade guides illumination light.   An image pickup unit that is provided on the opposite side of the blade with respect to the blade and picks up the planned dividing line, and the first contact portion or the second contact portion arranged on the same side as the blade is a self-luminous material. The braking device according to claim 1, wherein the braking device is formed by: In a braking method for dividing a substrate on which a plurality of chip regions are formed by a predetermined division line along the predetermined division line,
The first contact portion is brought into contact with one surface of the substrate and the second contact portion is brought into contact with the other surface, and one end of the chip area is sandwiched between the first contact portion and the second contact portion. A braking method comprising: applying a bending stress to the dividing line at the other end by a blade and cutting the other end.   The braking method according to claim 14, wherein the substrate has a diameter of 4 inches or more.

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