CN114083703B - Splitting device and method for improving chip splitting yield - Google Patents
Splitting device and method for improving chip splitting yield Download PDFInfo
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- CN114083703B CN114083703B CN202111160677.8A CN202111160677A CN114083703B CN 114083703 B CN114083703 B CN 114083703B CN 202111160677 A CN202111160677 A CN 202111160677A CN 114083703 B CN114083703 B CN 114083703B
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 230000001681 protective effect Effects 0.000 claims abstract description 170
- 239000007771 core particle Substances 0.000 claims abstract description 56
- 238000003825 pressing Methods 0.000 claims abstract description 51
- 238000005520 cutting process Methods 0.000 claims abstract description 45
- 230000007306 turnover Effects 0.000 claims description 14
- 210000000078 claw Anatomy 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 10
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 193
- 238000004804 winding Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 235000014820 Galium aparine Nutrition 0.000 description 2
- 240000005702 Galium aparine Species 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Dicing (AREA)
Abstract
The disclosure provides a splitting device and a splitting method for improving the splitting yield of chips, and belongs to the technical field of light emitting diodes. In the wafer breaking device, the wafer moving component can realize the normal movement of the wafer between the components which are mutually spaced. The film pasting component comprises a wafer film pasting platform, a protective film placing platform and a protective film moving component, wherein the protective film moving component is used for adsorbing and moving a protective film to the wafer film pasting platform and pasting the protective film to a wafer. The stable adhesion between the protective film and the surface of the wafer is realized, and the movement of core particles is reduced. The wafer moving part moves the wafer attached with the protective film onto the splitting platform, and the first driving component drives the pressing plate to press the core particles, so that the interference between the core particles and the cutting channels is reduced. The second driving component drives the splitting cutter to split two adjacent core particles along a cutting path on the wafer. The increase of the film pasting component and the matching of the pressing plate can reduce the displacement of the core particles in the splitting process and improve the yield of the finally obtained core particles.
Description
Technical Field
The disclosure relates to the technical field of light emitting diodes, and in particular relates to a splitting device and method for improving the splitting yield of chips.
Background
The LED is a common light source device, is widely applied to the aspects of remote control, vehicle sensing, closed-circuit television and the like, and the LED chip is a basic structure for preparing the LED.
The preparation process of the light-emitting diode chip comprises the steps of growing an epitaxial layer on a wafer, forming a plurality of groups of structures of n electrodes and p electrodes on the epitaxial layer to obtain a wafer, placing the wafer on a bearing film, cutting the epitaxial layer on the wafer by laser to form cutting channels, dividing the epitaxial layer into a plurality of core particles, wherein each core particle is provided with one n electrode and one p electrode. And then, sticking a protective film on the surface of the core particle, pressing the protective film down through a splitting mechanism, and splitting a cutting channel to realize complete separation between the core particles. And then carrying out series of operations such as packaging and the like to obtain the complete light-emitting diode.
In the process of dividing an epitaxial layer and forming a cutting channel by laser, part of adjacent core particles can be divided completely by the laser, but part of adjacent core particles cannot be divided completely, the separated core particles are easy to move in position under the action of stress and interfere the cutting channel, the core particles are possibly damaged in the splitting process, the protective film is pasted on the other hand, the protective film is pasted manually, the position of the core particles is easy to move due to uneven stress, and finally the yield of the core particles obtained by splitting is not ideal.
Disclosure of Invention
The embodiment of the disclosure provides a splitting device and a splitting method for improving the chip splitting yield, which can reduce the displacement of core particles in the splitting process and improve the finished product yield of the finally obtained core particles. The technical scheme is as follows:
the embodiment of the disclosure provides a splitting device for improving the chip splitting yield, which comprises a wafer moving part, a film pasting part and a splitting part, wherein the wafer moving part, the film pasting part and the splitting part are mutually distributed at intervals, the wafer moving part is used for controlling a wafer to move into the film pasting part or the splitting part,
the film pasting component comprises a wafer film pasting platform, a protective film placing platform and a protective film moving component, wherein the wafer film pasting platform and the protective film placing platform are mutually distributed at intervals, the protective film placing platform is used for placing a protective film, the protective film moving component is used for adsorbing and moving the protective film to the wafer film pasting platform and pasting the protective film to a wafer,
the wafer splitting component comprises a wafer splitting platform, a first driving component, a second driving component, a pressing plate and a splitting knife, wherein the wafer splitting platform is spaced from the wafer film pasting platform, the first driving component is connected with the wafer splitting platform and connected with the pressing plate, the first driving component is connected with the pressing plate, the second driving component is connected with the splitting knife, the pressing plate and the splitting knife are opposite to the wafer splitting platform, the pressing plate is provided with a cutter stretching hole, the splitting knife is inserted into the cutter stretching hole, the first driving component is used for driving the pressing plate to move towards or away from the wafer splitting platform, and the second driving component is used for driving the splitting knife to move towards or away from the wafer splitting platform.
Optionally, the protection film moving assembly includes drive unit, mounting panel and suction nozzle, drive unit with the wafer pad pasting platform or with the protection film place the platform link to each other, drive unit with the mounting panel links to each other and is used for the drive the mounting panel removes to the wafer pad pasting platform or the top of protection film place the platform, the suction nozzle with the mounting panel links to each other, just the adsorption plane of suction nozzle is on a parallel with the surface of wafer pad pasting platform and the surface of protection film place the platform.
Optionally, the protection film moving component comprises a plurality of suction nozzles, the suction nozzles are distributed on the mounting plate at intervals, and the suction planes of the suction nozzles are all in the same plane.
Optionally, the film pasting component further comprises a protective film winding and unwinding component and a protective film cutting component, the protective film winding and unwinding component comprises a winding and unwinding motor and a protective film to be cut, the winding and unwinding motor is spaced from the protective film placing platform, the protective film cutting component is located between the winding and unwinding motor and the protective film placing platform, one end of the protective film to be cut is wound on an output shaft of the winding and unwinding motor, the other end of the protective film to be cut is located on the protective film placing platform, and the protective film cutting component is used for cutting the protective film to be cut on the protective film placing platform and the protective film to be cut on the winding and unwinding motor.
Optionally, the pad pasting part still includes the upset subassembly, the upset subassembly includes upset motor and jack catch, the upset subassembly with the wafer pad pasting platform links to each other, the output shaft of upset motor with the jack catch links to each other, the jack catch is used for pressing from both sides tightly and is located wafer on the wafer pad pasting platform.
Optionally, the splitting device for improving the chip splitting yield further comprises a thickness measuring component, wherein the thickness measuring component is used for measuring the thickness of the wafer, and the splitting component is used for splitting the wafer according to the thickness of the wafer.
The embodiment of the disclosure provides a splitting method for improving the chip splitting yield, wherein the splitting method is realized by adopting a splitting device for improving the chip splitting yield, and the splitting method comprises the following steps:
providing a wafer with a carrying film adhered to one side of the wafer, wherein the wafer is provided with a plurality of cutting channels;
the wafer moving part in the splitting device moves the wafer to a wafer film pasting platform;
the protective film moving assembly in the splitting device adsorbs and moves the protective film on the protective film placing platform to the wafer for attaching, and the protective film is attached to one surface of the wafer, which is away from the bearing film;
a wafer moving part in the splitting device moves the wafer to a splitting platform, and the protective film is contacted with the splitting platform;
a first driving component in the splitting device drives the pressing plate to press down and tightly press the bearing film;
and a second driving component in the splitting device drives the splitting cutter to press down at the position corresponding to the cutting channel so as to deform the bearing film and separate adjacent core particles.
Optionally, the splitting method includes:
after the first driving component in the splitting device drives the pressing plate to press and tightly press the bearing film for 5-20 ms, the second driving component in the splitting device drives the splitting knife to press at the position corresponding to the cutting channel.
Optionally, the height of the first driving component in the splitting device for driving the pressing plate to press downwards decreases along with the increase of the thickness of the wafer.
Optionally, the height of the second driving component in the splitting device for driving the splitting knife to press downwards is reduced along with the increase of the thickness of the wafer.
The technical scheme provided by the embodiment of the disclosure has the beneficial effects that:
the wafer moving component can realize the normal movement of the wafer among the components which are spaced mutually so as to realize the basic preparation required by wafer splitting and the normal running of the splitting. The film pasting component comprises a wafer film pasting platform, a protective film placing platform and a protective film moving component, wherein the placing platform, the wafer film pasting platform and the protective film placing platform are distributed at intervals, the protective film placing platform is used for placing a protective film, and the protective film moving component is used for adsorbing and moving the protective film to the wafer film pasting platform and pasting the protective film to a wafer. The stable adhesion between the protective film and the surface of the wafer can be realized, the influence on the position of the core particle in the wafer obtained after laser scribing is reduced, the stable scribing of the cutting path on the subsequent wafer is ensured, and the yield of the finally obtained core particle is improved. After the sticking of the protective film to the wafer is completed, the wafer moving component can move the wafer to which the protective film is stuck to the splitting platform, and the first driving component drives the pressing plate to move towards or away from the wafer splitting platform so as to press the core particles and stabilize the positions of the core particles by one step by the splitting knife, ensure the stability of the positions of the cutting channels and reduce the interference of the positions between the core particles and the cutting channels. After the pressing plate presses the core particles, the second driving assembly drives the splitting cutter to move towards or away from the wafer splitting platform, and two adjacent core particles are split along the cutting path on the wafer. The increase of the film pasting component and the matching of the pressing plate can reduce the displacement of the core particles in the splitting process and improve the yield of the finally obtained core particles.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a top view of a breaking device for improving the yield of chip breaking according to an embodiment of the disclosure;
FIG. 2 is a schematic structural view of a film-sticking component provided by an embodiment of the present disclosure;
FIG. 3 is a schematic structural view of a cleaving member provided by an embodiment of the present disclosure;
FIG. 4 is a schematic structural view of a flip assembly provided by an embodiment of the present disclosure;
FIG. 5 is a schematic structural view of a thickness measurement component provided by an embodiment of the present disclosure;
FIG. 6 is a flowchart of a breaking method for improving chip breaking yield according to an embodiment of the present disclosure;
FIG. 7 is a schematic illustration of a thickness measurement process provided by an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of the platen, riving knife and wafer mating relationship provided by embodiments of the present disclosure;
fig. 9 is a schematic diagram of a wafer cleaving state according to an embodiment of the present disclosure.
Detailed Description
For the purposes of clarity, technical solutions and advantages of the present disclosure, the following further details the embodiments of the present disclosure with reference to the accompanying drawings.
Fig. 1 is a top view of a splitting device for improving chip splitting yield according to an embodiment of the present disclosure, and referring to fig. 1, it can be seen that the embodiment of the present disclosure provides a splitting device for improving chip splitting yield, where the splitting device for improving chip splitting yield includes a wafer moving component 1, a film pasting component 2 and a splitting component 3, the wafer moving component 1, the film pasting component 2 and the splitting component 3 are distributed at intervals, and the wafer moving component 1 is used for controlling a wafer to move into the film pasting component 2 or the splitting component 3. Note that, each component shown in fig. 1 is a simplified component, and is mainly used for representing the positional relationship between each component.
Fig. 2 is a schematic structural diagram of a film pasting component provided in an embodiment of the disclosure, referring to fig. 2, it can be seen that the film pasting component 2 includes a wafer film pasting platform 21, a protective film placing platform 22 and a protective film moving assembly 23, the placing platform, the wafer film pasting platform 21 and the protective film placing platform 22 are distributed at intervals, the protective film placing platform 22 is used for placing a protective film, and the protective film moving assembly 23 is used for adsorbing and moving the protective film to the wafer film pasting platform 21 and pasting the protective film to a wafer.
Fig. 3 is a schematic structural diagram of a splitting component provided in an embodiment of the present disclosure, referring to fig. 3, it can be seen that the splitting component 3 includes a wafer splitting platform 31, a first driving component 32, a second driving component 33, a pressing plate 34 and a splitting knife 35, the wafer splitting platform 31 is spaced from the wafer film attaching platform 21, the first driving component 32 is connected to the wafer splitting platform 31, the first driving component 32 and the second driving component 33 are connected to the pressing plate 34, the second driving component 33 is connected to the splitting knife 35, the pressing plate 34 and the splitting knife 35 are opposite to the wafer splitting platform 31, the pressing plate 34 has a knife extending hole 341, the splitting knife 35 is inserted in the knife extending hole 341, the first driving component 32 is used for driving the pressing plate 34 to move toward or away from the wafer splitting platform 31, and the second driving component 33 is used for driving the splitting knife 35 to move toward or away from the wafer splitting platform 31.
The wafer moving component 1 can realize the normal movement of the wafer among the components which are spaced from each other so as to realize the basic preparation required by wafer splitting and the normal running of the splitting. The film pasting component 2 comprises a wafer film pasting platform 21, a protective film placing platform 22 and a protective film moving component 23, wherein the placing platform, the wafer film pasting platform 21 and the protective film placing platform 22 are distributed at intervals, the protective film placing platform 22 is used for placing a protective film, and the protective film moving component 23 is used for adsorbing and moving the protective film to the wafer film pasting platform 21 and pasting the protective film to a wafer. The stable adhesion between the protective film and the surface of the wafer can be realized, the influence on the position of the core particle in the wafer obtained after laser scribing is reduced, the stable scribing of the cutting path on the subsequent wafer is ensured, and the yield of the finally obtained core particle is improved. After the attachment of the protective film to the wafer is completed, the wafer moving component 1 can move the wafer attached with the protective film to the splitting platform 31, and the first driving component 32 drives the pressing plate 34 to move towards or away from the wafer splitting platform 31, so that the splitting knife 35 compresses the core particles and stabilizes the positions of the core particles in one step, the stability of the positions of the cutting channels is ensured, and the interference between the core particles and the positions of the cutting channels is reduced. After the pressing plate 34 presses the core particles, the second driving assembly 33 drives the splitting knife 35 to move towards or away from the wafer splitting platform 31, so that two adjacent core particles are split along the cutting path on the wafer. The addition of the film sticking component 2 and the cooperation of the pressing plate 34 can reduce the displacement of the core particles in the splitting process and improve the yield of the finally obtained core particles.
It should be noted that the platforms provided in this disclosure are all placed on the ground or a fixed structure, and the surface of each platform is parallel to the horizontal plane of the area where the platform is located. In the wafer after laser cutting, the dicing channels of the wafer actually cut the wafer into a plurality of mutually-spaced core particles, part of adjacent core particles are completely separated, and the other part of core particles are not completely separated, so that all the core particles need to be completely cut and separated by matching with the splitting component 3, and the yield of the finally-obtained core particles is improved. The laser diced wafer is identified in this disclosure as 100, the protective film as 200, and the carrier film 300.
Optionally, the protective film moving assembly 23 includes a driving unit 231, a mounting plate 232 and a suction nozzle 233, the driving unit 231 is connected to the wafer film attaching platform 21 or the protective film placing platform 22, the driving unit 231 is connected to the mounting plate 232 and is used for driving the mounting plate 232 to move to the upper side of the wafer film attaching platform 21 or the protective film placing platform 22, the suction nozzle 233 is connected to the mounting plate 232, and the adsorption plane of the suction nozzle 233 is parallel to the surface of the wafer film attaching platform 21 and the surface of the protective film placing platform 22.
The driving unit 231 is supported or installed on the wafer film pasting platform 21 or the protective film placing platform 22, only the driving unit 231 can control the mounting plate 232 and the suction nozzle 233 on the mounting plate 232 to move, the suction nozzle 233 adsorbs the protective film on the protective film placing platform 22 and moves to the wafer film pasting platform 21, the protective film is pasted to the wafer on the surface of the wafer film pasting platform 21, and stable film pasting of the wafer is achieved.
Illustratively, the largest area of the mounting plate 232 may be parallel to the surfaces of the wafer film lamination stage 21 and the protective film placement stage 22, and the suction nozzles 233 are mounted on the side of the mounting plate 232 facing the wafer film lamination stage 21 or the protective film placement stage 22. Can ensure the stable adhesion of the protective film.
Illustratively, the driving unit 231 may include a telescopic cylinder, a driving motor, a ball screw mechanism, and at least two guide rods, the driving motor may be connected to the wafer film attaching platform 21 or the protective film placing platform 22, the motor drives a nut in the ball screw to move in an axial direction, the axial direction of the nut is parallel to the surface of the wafer film attaching platform 21, the guide rods are slidably inserted on the nut, and the guide rods are fixed to the wafer film attaching platform 21 or the protective film placing platform 22, so that the nut moves only in the axial direction without rotation. The stable movement of the nut can be ensured. The nut and the mounting plate 232 are respectively connected to two ends of the telescopic cylinder, the nut can control the telescopic cylinder and the mounting plate 232 to move between the wafer film attaching platform 21 and the protective film placing platform 22 through axial movement, and the telescopic cylinder can achieve approaching or separating between the mounting plate 232 and the wafer film attaching platform 21 or the protective film placing platform 22.
The telescoping cylinder 2311, the drive motor 2312 and the ball screw mechanism 2313 are identified in fig. 2.
Alternatively, the protective film moving assembly 23 includes a plurality of suction nozzles 233, the plurality of suction nozzles 233 are spaced apart from each other on the mounting plate 232, and suction planes of the plurality of suction nozzles 233 are all in the same plane.
The plurality of suction nozzles 233 can ensure stable adsorption of the protective film, and ensure that the protective film can be stably adsorbed and moved onto the wafer.
In other implementations provided by the present disclosure, the protective film moving assembly 23 may also be configured to include only the driving unit 231 and the mounting plate 232, and the surface of the mounting plate 232 is coated with an adsorption glue to adsorb the protective film. The present disclosure is not limited in this regard.
It should be noted that, the protective film itself has a certain viscosity, and after the protective film is attached to the surface of the wafer, the suction nozzle 233 may be heated or the suction nozzle 233 may be pressurized to separate the suction nozzle 233 from the protective film. And the adhesion between the protective film and the wafer is not affected. Or the auxiliary tool can be used for pressing the protective film and the wafer and separating the protective film from the wafer, so that the adhesion between the wafer and the protective film is not affected.
Optionally, the film pasting component 2 further includes a protective film winding and unwinding component 24 and a protective film cutting component 25, the protective film winding and unwinding component 24 includes a winding and unwinding motor 241 and a protective film 242 to be cut, the winding and unwinding motor 241 is spaced from the protective film placing platform 22, the protective film cutting component 25 is located between the winding and unwinding motor 241 and the protective film placing platform 22, one end of the protective film 242 to be cut is wound on an output shaft of the winding and unwinding motor 241, the other end of the protective film 242 to be cut is located the protective film placing platform 22, and the protective film cutting component 25 is used for cutting the protective film 242 to be cut located on the protective film placing platform 22 and the protective film 242 to be cut located on the winding and unwinding motor 241.
The output shaft of the winding and unwinding motor 241 can collect or release the protective film 242 to be cut, and then the protective film 242 to be cut is cut by the protective film cutting assembly 25. The protective film 242 to be cut on the protective film placing platform 22 can be cut and separated and moved to the wafer to obtain the protective film to be attached, so that the protective film can be obtained quickly and the purity of the protective film can be improved. The addition of the protective film winding and unwinding assembly 24 and the protective film cutting assembly 25 can control the effective winding and unwinding of the protective film on the protective film placing platform 22, is convenient for controlling the size of the protective film, and can be suitable for wafers with different sizes.
In one implementation provided by the present disclosure, the protective film cutting assembly 25 may include a cutter driving member 251 (typically a motor or a telescopic cylinder, etc. structure) and a film cutter 252, where the cutter driving member 251 may be spaced apart from the protective film placement platform 22, and the cutter driving member 251 drives the film cutter 252 to move in a vertical direction and cut the protective film. In other implementations provided by the present disclosure, the protective film cutting assembly 25 may also be configured as a driving assembly and a scissors, and cutting of the protective film may also be implemented, which is not limited by the present disclosure.
Fig. 4 is a schematic structural diagram of a turnover assembly provided in an embodiment of the disclosure, referring to fig. 4, it can be seen that the film pasting component 2 further includes a turnover assembly 26, the turnover assembly 26 includes a turnover motor 261 and a claw 262, the turnover assembly 26 is connected with the wafer film pasting platform 21, an output shaft of the turnover motor 261 is connected with the claw 262, and the claw 262 is used for clamping a wafer on the wafer film pasting platform 21.
The turnover motor 261 can control the clamping turnover to turn over the wafer clamped by the clamping jaw 262, and one surface of the wafer, which is not covered by the bearing film, can be exposed for covering the protective film. Avoiding the influence on the position of the core particle on the wafer which can occur by manual overturning.
In one implementation provided by the present disclosure, the jaws 262 may also be provided in a suction nozzle 233 configuration or a clip-like configuration. The present disclosure is not limited in this regard.
Illustratively, the wafer cleaving assembly 3 may further include a wafer handling assembly and a wafer support plate (not shown), the wafer handling assembly being located on the wafer cleaving platform 31, the wafer handling assembly being coupled to the wafer support plate. The wafer sliding assembly can control the wafer supporting plate to slide in two directions which are mutually perpendicular and are parallel to the horizontal plane. To change the position of the wafer relative to the cleaver 35, the cleaver 35 can cleave the dicing streets at different positions.
It should be noted that the wafer sliding assembly may be configured to move in two directions like the protective film moving assembly 23, and thus will not be described herein.
Optionally, the splitting device for improving the chip splitting yield further comprises a thickness measuring component 4, the thickness measuring component is used for measuring the thickness of the wafer, and the splitting component 3 is used for splitting the wafer according to the thickness of the wafer.
The thickness measuring part 4 is increased, the thickness of the wafer after laser cutting can be obtained, the splitting part 3 can control the splitting and the pressing force of the wafer according to the thickness of the wafer, the damage to the protective film is avoided, and the stable splitting is ensured.
Fig. 5 is a schematic structural diagram of a thickness measurement component 4 according to an embodiment of the present disclosure, referring to fig. 5, the thickness measurement component 4 may include a thickness measurement platform 41, a wafer placement plate 42, a placement plate driving assembly 43, a measurement bracket 44 and a laser thickness gauge 45, where the thickness measurement platform 41, the wafer film pasting platform 21 and the measurement bracket 44 are spaced apart from each other, the wafer placement plate 42 is slidably located on the thickness measurement platform 41, and the placement plate driving assembly 43 is used for driving the wafer placement plate 42 to slide along a direction parallel to a horizontal plane. The laser thickness gauge 45 is connected to the measurement bracket 44, and the laser thickness gauge 45 faces the wafer placing plate 42.
The wafer can be placed on the wafer placing plate 42, the thickness of the wafer can be measured by the laser thickness gauge 45, and the thickness of different positions of the wafer can be measured by matching with the placing plate driving assembly 43, so that the thickness of the wafer can be more accurate.
Optionally, the thickness measuring component 4 further includes a lifting rod, wherein the lifting rod is parallel to the gravity direction, and two ends of the lifting rod are respectively connected with the measuring bracket 44 and the laser thickness gauge 45. The thickness of the wafer can be detected at different heights, so that the thickness of the wafer can be more accurate.
In one implementation provided in the present disclosure, the thickness measuring component 4 may further include a CCD (Charge-coupled Device) detector 46 for detecting the profile and integrity of the wafer, so as to facilitate positioning of the laser thickness gauge 45. The measurement efficiency can be improved.
In one implementation provided by the present disclosure, the wafer moving component 1 may be a manipulator, which may implement stable gripping and stable movement of the diced wafer in various directions.
In other implementations provided in the present disclosure, the wafer moving component 1 may also be configured to include a clamping member for gripping a wafer, a lifting assembly, and a moving assembly that moves in two directions perpendicular to each other, where the lifting assembly and the moving assembly are used to drive movement of the clamping member. The stable movement of the wafer can also be controlled. The lifting assembly and the moving assembly can adopt a telescopic cylinder or a screw rod structure or a telescopic motor structure, and the lifting assembly and the moving assembly are not limited by the disclosure.
It should be noted that, the motors involved in the present disclosure may be servo motors. The moving precision of each part in the splitting device can be improved, so that the cutting precision of the finally obtained core particles can be effectively controlled, and the yield of the core particles is improved.
Fig. 6 is a flowchart of a splitting method for improving the chip splitting yield according to an embodiment of the present disclosure, and referring to fig. 6, it can be seen that an embodiment of the present disclosure provides a splitting method for improving the chip splitting yield, where the splitting method is implemented by using a splitting device for improving the chip splitting yield as described above, and the splitting method includes:
s101: a wafer with a carrier film adhered to one side of the wafer is provided, and the wafer is provided with a plurality of cutting channels.
In step S101, a wafer may be obtained by growing an epitaxial layer on a die; after the carrier film is adhered on the flat wafer, the dicing streets are laser scribed.
On the premise that the breaking device includes a thickness measuring component, after the step S101 is performed, the thickness of the wafer may be detected by the thickness measuring component and the average thickness of the wafer may be obtained before the step S102 is performed. The average thickness of the wafer may provide a reference for the subsequent breaking process. The laser thickness gauge can calculate the average value of the thickness of the wafer after detecting and obtaining the multi-point thickness data on the wafer.
Fig. 7 is a schematic diagram of a thickness measurement process provided by an embodiment of the present disclosure, and an arrow in fig. 7 shows a moving direction of the laser thickness gauge 45 in a process of detecting a thickness.
S102: the wafer moving part in the splitting device moves the wafer to the wafer film pasting platform.
The wafer moving part can move the wafer after the thickness measurement to the wafer film attaching platform.
S103: and the protective film moving assembly in the splitting device adsorbs and moves the protective film on the protective film placing platform to the wafer for adhesion, and the protective film is adhered to one surface of the wafer, which is away from the bearing film.
After the wafer moves to the wafer film pasting platform, in step S103, the surface of the wafer can be turned over by the turning component in the film pasting component, and then the normal pasting of the protective film is performed.
S104: the wafer moving part in the splitting device moves the wafer to the splitting platform and the protective film is contacted with the splitting platform.
S105: the first driving component in the splitting device drives the pressing plate to press down and tightly press the bearing film.
Optionally, step S105 includes: after the first driving component in the splitting device drives the pressing plate to press the bearing film for 5-20 ms, the second driving component in the splitting device drives the splitting knife to press the position corresponding to the cutting channel.
The stable compaction of the bearing film can be realized, and the splitting is performed after the cutting channel is stable, so that the position stability of the obtained core particle is improved.
Optionally, the height of the pressing plate pressed by the first driving component in the splitting device decreases with the increase of the thickness of the wafer. After the thickness of the wafer is increased, the pressing height of the pressing plate is controlled to be reduced, so that the bearing film is prevented from being damaged by excessive pressing of the pressing plate, and the yield of the finally obtained core particles is effectively improved.
It should be noted that, in one implementation provided by the present disclosure, the thickness of the wafer may be 50-100 μm.
Illustratively, the height of the platen press is reduced by 1 μm to 20 μm for each 1 μm to 20 μm increase in the thickness of the wafer. After the thickness of the wafer is increased, the pressing height of the pressing plate is controlled to be reduced, so that the bearing film is prevented from being damaged by excessive pressing of the pressing plate, and the yield of the obtained core particles can be improved.
The thickness of the wafer ranges from 1 μm to 20 μm, and the height of the pressing plate pressed down ranges from 1 μm to 20 μm. After the splitting knife completes cutting the channel, the first driving component keeps the state that the pressing plate presses the bearing film for 5-20 ms, and then the first driving component drives the pressing plate to separate from the bearing film. It can be ensured that the core particles have been stably split.
Fig. 8 is a schematic diagram of the matching relationship between the pressing plate, the splitting knife and the wafer according to the embodiment of the disclosure, and referring to fig. 8, it can be seen that the pressing plate presses the carrier film, and the splitting knife does not split the dicing streets at this time.
S106: the second driving component in the splitting device drives the splitting knife to press down at the position corresponding to the cutting channel so as to deform the bearing film and separate adjacent core particles.
Optionally, the height of the second driving component in the splitting device for driving the splitting knife to press down decreases with the increase of the thickness of the wafer. The yield of the core particles finally obtained is effectively improved. Illustratively, the height of the riving knife is reduced by 1 μm to 20 μm for each 1 μm to 20 μm increase in the thickness of the wafer. The yield of the obtained core particles can be improved.
The thickness of the wafer ranges from 1 μm to 20 μm, and the height of the pressing down of the splitting blade ranges from 1 μm to 20 μm. It can be ensured that the core particles have been stably split.
The thicknesses in step S105 and step S106 refer to the average thickness of the wafer.
The technical effects of the splitting method shown in fig. 6 may refer to the technical effects of the splitting device shown in fig. 1, and thus will not be described herein.
Fig. 9 is a schematic diagram of a wafer splitting state provided by an embodiment of the disclosure, and it can be seen in fig. 9 that core particles have been separated under the action of a splitting knife.
While the present disclosure has been described above by way of example, and not by way of limitation, any person skilled in the art will recognize that many modifications, adaptations, and variations of the present disclosure can be made to the present embodiments without departing from the scope of the present disclosure.
Claims (9)
1. The splitting device for improving the chip splitting yield is characterized by comprising a wafer moving part, a film pasting part and a splitting part, wherein the wafer moving part, the film pasting part and the splitting part are mutually distributed at intervals, the wafer moving part is used for controlling a wafer to move into the film pasting part or the splitting part,
the film pasting component comprises a wafer film pasting platform, a protective film placing platform and a protective film moving component, wherein the wafer film pasting platform and the protective film placing platform are distributed at intervals, the protective film placing platform is used for placing a protective film, the protective film moving component is used for adsorbing and moving the protective film to the wafer film pasting platform and pasting the protective film to a wafer, the film pasting component further comprises a turnover component, the turnover component comprises a turnover motor and a claw, the turnover component is connected with the wafer film pasting platform, an output shaft of the turnover motor is connected with the claw, and the claw is used for clamping a wafer positioned on the wafer film pasting platform; the overturning motor is used for overturning the wafer clamped by the clamping jaw, and exposing one surface of the wafer, which is not covered by the bearing film, to be exposed so as to cover the protective film;
the splitting component comprises a wafer splitting platform, a first driving component, a second driving component, a pressing plate and a splitting knife, wherein the wafer splitting platform is spaced from the wafer film pasting platform, the first driving component is connected with the wafer splitting platform, the first driving component is connected with the pressing plate, the second driving component is connected with the splitting knife, the pressing plate and the splitting knife are opposite to the wafer splitting platform, the pressing plate is provided with a cutter stretching hole, the splitting knife is inserted into the cutter stretching hole, the first driving component is used for driving the pressing plate to move towards or away from the wafer splitting platform, the second driving component is used for driving the splitting knife to move towards or away from the wafer splitting platform, and the splitting knife is used for enabling a bearing film to deform and enable adjacent core particles to be separated under the driving of the second driving component at the position corresponding to the cutting channel.
2. The breaking device for improving the chip breaking yield according to claim 1, wherein the protective film moving assembly comprises a driving unit, a mounting plate and a suction nozzle, the driving unit is connected with the wafer film attaching platform or the protective film placing platform, the driving unit is connected with the mounting plate and is used for driving the mounting plate to move to the position above the wafer film attaching platform or the protective film placing platform, the suction nozzle is connected with the mounting plate, and an adsorption plane of the suction nozzle is parallel to the surface of the wafer film attaching platform and the surface of the protective film placing platform.
3. The die breaking device for improving die breaking yield according to claim 2, wherein the protective film moving assembly comprises a plurality of suction nozzles, the plurality of suction nozzles are distributed on the mounting plate at intervals, and the suction planes of the plurality of suction nozzles are all in the same plane.
4. The splitting device for improving the chip splitting yield according to any one of claims 1 to 3, wherein the film pasting component further comprises a protective film collecting and releasing component and a protective film cutting component, the protective film collecting and releasing component comprises a collecting and releasing motor and a protective film to be cut, the collecting and releasing motor is spaced from the protective film placing platform, the protective film cutting component is located between the collecting and releasing motor and the protective film placing platform, one end of the protective film to be cut is wound on an output shaft of the collecting and releasing motor, the other end of the protective film to be cut is located on the protective film placing platform, and the protective film cutting component is used for cutting the protective film to be cut located on the protective film placing platform and the protective film to be cut located on the collecting and releasing motor.
5. A splitting device for improving chip splitting yield according to any of claims 1-3, further comprising a thickness measuring unit for measuring the thickness of the wafer, and the splitting unit is for splitting the wafer according to the thickness of the wafer.
6. A splitting method for improving the chip splitting yield, characterized in that the splitting method is implemented by adopting the splitting device for improving the chip splitting yield according to any one of claims 1 to 5, and the splitting method comprises the following steps:
providing a wafer with a carrying film adhered to one side of the wafer, wherein the wafer is provided with a plurality of cutting channels;
the wafer moving part in the splitting device moves the wafer to a wafer film pasting platform;
the protective film moving assembly in the splitting device adsorbs and moves the protective film on the protective film placing platform to the wafer for attaching, and the protective film is attached to one surface of the wafer, which is away from the bearing film;
a wafer moving part in the splitting device moves the wafer to a splitting platform, and the protective film is contacted with the splitting platform;
a first driving component in the splitting device drives the pressing plate to press down and tightly press the bearing film;
and a second driving component in the splitting device drives the splitting cutter to press down at the position corresponding to the cutting channel so as to deform the bearing film and separate adjacent core particles.
7. The dicing method for improving the yield of chip dicing according to claim 6, wherein the dicing method comprises:
after the first driving component in the splitting device drives the pressing plate to press and tightly press the bearing film for 5-20 ms, the second driving component in the splitting device drives the splitting knife to press at the position corresponding to the cutting channel.
8. The method of claim 6, wherein the first driving assembly of the breaking device drives the pressing plate to decrease with the thickness of the wafer.
9. The method of claim 6, wherein the height of the second driving component in the splitting device for driving the splitting blade to press down decreases with the thickness of the wafer.
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| CN114083703A (en) | 2022-02-25 |
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