CN114454367A

CN114454367A - Silicon rod cutting method, device and system

Info

Publication number: CN114454367A
Application number: CN202110956954.XA
Authority: CN
Inventors: 戴鑫辉; 周波; 郭世锋; 周聪
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2021-07-13
Filing date: 2021-08-19
Publication date: 2022-05-10
Also published as: CN114454368A; CN114454363A; CN114454370A; CN114454362A; CN114454359A; CN114454359B; CN114454366A; CN114454365A

Abstract

The embodiment of the application provides a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system, wherein the method comprises the following steps: cutting the silicon rod by using first cutting surfaces parallel to the length direction of the silicon rod, wherein the number of the first cutting surfaces is two, and the two first cutting surfaces are parallel to obtain a middle rod with two parallel planes and an arc surface connected between the two planes, and an edge leather with a plane and an arc surface; cutting the silicon rod by using second cutting surfaces parallel to the length direction of the silicon rod, wherein the number of the second cutting surfaces is at least three, and the at least three second cutting surfaces are parallel to each other; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface. The silicon rod cutting method, the silicon rod cutting equipment and the silicon rod cutting system can overcome the defect of cutting a small structure by a large structure in the traditional scheme.

Description

Silicon rod cutting method, device and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 micrometers or 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer, but in the laser scribing process, damage and defect states can be generated on the cross section of the small silicon wafer, and the conversion efficiency of the finally processed heterojunction battery is seriously influenced.

The silicon rods are larger and larger in size from 166mm to 182mm, then to 210mm, and may reach 230mm or even 250mm in the future, so that the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is too high in requirement and extremely easy to break.

Disclosure of Invention

In order to solve one of the technical defects, embodiments of the present application provide a silicon rod cutting method, apparatus and system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting method including:

cutting the silicon rod by using first cutting surfaces parallel to the length direction of the silicon rod, wherein the number of the first cutting surfaces is two, and the two first cutting surfaces are parallel to obtain a middle rod with two parallel planes and an arc surface connected between the two planes, and an edge leather with a plane and an arc surface;

cutting the silicon rod by using second cutting surfaces parallel to the length direction of the silicon rod, wherein the number of the second cutting surfaces is at least three, and the at least three second cutting surfaces are parallel to each other; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface.

According to a second aspect of embodiments of the present application, there is provided a cutting apparatus to which the above silicon rod cutting method is applied, including:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device is provided with a wire cutting wheel set;

the cutting wire wound on the cutting wire wheel set is used for cutting the silicon rod. .

According to a third aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising: a cutting device as described above; and grinding equipment for grinding the small silicon rod.

In the embodiment, the silicon rod is cut through the first cut surface and the second cut surface sequentially to directly obtain the small silicon rod with a smaller cross section area, the production efficiency is high, the small silicon rod is subsequently sliced to directly obtain the small silicon chip meeting the size requirement of the silicon chip to be used for preparing the small heterojunction battery, the step of laser scribing is not needed, the product quality of the small silicon chip is improved, and the conversion efficiency of the heterojunction battery is further ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

fig. 3 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application;

fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 5 is a schematic view illustrating a configuration of a wire wheel set in a silicon rod cutting apparatus according to an embodiment of the present disclosure;

fig. 6 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 8 is a schematic view of a wire wheel and a cutting wire structure of a long wire cutting manner in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 9 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 10 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 11 is a front view of the apparatus of FIG. 10;

FIG. 12 is a left side view of the apparatus shown in FIG. 10;

FIG. 13 is a schematic view of the construction of the cutting reel of the apparatus of FIG. 10;

fig. 14 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 15 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 16 is a schematic view showing the structure of a wire cutting device in the cutting apparatus shown in fig. 15;

fig. 17 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 18 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 19 is a schematic structural view of a cutting reel of the cutting apparatus of FIG. 18;

FIG. 20 is a schematic view of the cutting device of FIG. 18 in which the cutting wire wheel cuts the intermediate bar;

fig. 21 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 22 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 23 is a schematic view of a wire cutting device in the cutting apparatus shown in FIG. 22;

fig. 24 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 25 is a schematic view of a still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 26 is a first structural schematic view of a wire cutting device in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 27 is a second structural schematic view of a wire cutting device in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 28 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 29 is a cross-sectional view of a clamping mechanism in a cutting device according to an embodiment of the present application;

fig. 30 is a schematic structural view of another carrier table in the cutting apparatus according to the embodiment of the present application;

FIG. 31 is a cross-sectional view of a cutting reel in the cutting apparatus provided in the embodiments of the present application;

FIG. 32 is a first schematic structural view illustrating a clamping device of the cutting apparatus according to the embodiment of the present disclosure gripping the edge leather;

fig. 33 is a second schematic structural view illustrating that a clamping device of the cutting apparatus provided in the embodiment of the present application grabs the edge leather;

FIG. 34 is a schematic structural view of a silicon rod grinding apparatus provided in an embodiment of the present application;

fig. 35 is a schematic structural view of the grinding apparatus shown in fig. 34 in which small silicon rods are clamped on the sliding table device;

fig. 36 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 34;

fig. 37 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 34.

Reference numerals:

a 1-silicon rod; a 2-middle rod; a 4-small silicon rod; a 5-small raw material pieces; a 6-offcut; a 61-arc top; a 62-corner; a 63-flaw-piece bar;

b 1-first cut plane; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface;

1-a base; 11-a movable base; 12-a stage drive mechanism; 13-a vertical base;

2-a bearing platform; 211-1-a main load bearing portion; 211-2-an auxiliary carrier; 221-a limiting mechanism; 23-a clamping mechanism; 321-a clamp drive member mechanism; 232-telescopic rod; 233-clamping head; 251-flat plate type abutting plates; 252-L-shaped abutment plates; 261-preset opening;

301-main support; 302-reel support; 31-a cutting wire wheel; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism; 37-wire wheel driver; 38-auxiliary reel;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 424-headgear clip; 425-tailstock chuck;

51-a fixture; 52-a clamping jaw; 521-a mounting part; 522-jaw body.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting method, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

Fig. 1 is a flowchart of a silicon rod cutting method according to an embodiment of the present disclosure, and fig. 2 is a schematic view of a silicon rod cutting method according to an embodiment of the present disclosure. As shown in fig. 1 and fig. 2, the cutting method provided in this embodiment includes:

step 101, cutting the silicon rod by using first cutting surfaces parallel to the length direction of the silicon rod, wherein the number of the first cutting surfaces is two, and the two first cutting surfaces are parallel to obtain a middle rod with two parallel planes and an arc surface connected between the two planes, and an edge leather with a plane and an arc surface.

In this embodiment, the silicon rod is a single crystal silicon rod, and has a cylindrical shape, and the length direction of the silicon rod is the central line direction of the cylindrical shape, which may also be referred to as the axial direction.

The silicon rod a1 is cut by two parallel first cut surfaces b1, wherein the first cut surface b1 at the upper part cuts off the top edge skin material, the first cut surface b1 at the lower part cuts off the bottom edge skin material, and the rest of the middle rod a2 has two opposite upper and lower planes and an arc surface between the two planes, as shown in the angle shown in fig. 2.

After the step 101, a middle rod a2 is obtained, and an upper and a lower two edge leather materials are obtained, wherein the edge leather materials have a plane and an arc surface, and the plane is connected with the arc surface.

102, cutting the silicon rod by using second cut surfaces parallel to the length direction of the silicon rod, wherein the number of the second cut surfaces is at least three, and the at least three second cut surfaces are parallel to each other; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface.

The number of the second cut surfaces b2 is at least three, which are perpendicular to the first cut surfaces b1, and the three second cut surfaces b2 are parallel to each other and spaced apart from each other by a certain distance. As shown in fig. 2, the left second cut surface b2 cuts off the left side offcut, the right second cut surface b2 cuts off the right side offcut, and the middle second cut surface b2 cuts the middle portion into at least two small silicon rods a4 having rectangular cross sections.

After

steps

101 and 102, at least two small silicon rods a4 and four edge trims are obtained, wherein the edge trims have a plane and an arc surface connected with the plane.

In the traditional scheme, a cylindrical silicon rod is cut into a square rod with a rectangular cross section, then the square rod is cut to obtain a large silicon wafer with a large size, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, at least three second cutting surfaces are adopted to cut the silicon rod in the step 102, so that the small silicon rod a4 with a smaller cross section area is directly obtained, and the small silicon rod a4 is subsequently sliced to directly obtain a small silicon wafer meeting the size requirement of the silicon wafer for preparing a small heterojunction battery, so that the step of laser scribing is not needed, the product quality of the small silicon wafer is improved, and the conversion efficiency of the heterojunction battery is further ensured.

The cutting step of the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the above technical solution, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground.

One implementation is as follows: referring to the above steps, the small silicon rod a4 having a rectangular cross section and four surfaces parallel to the longitudinal direction thereof as side surfaces was obtained. After obtaining the small silicon rod a4, four side surfaces of the small silicon rod a4 were ground, and then the edge angle between two adjacent side surfaces in the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces, resulting in a ground small silicon rod a 4'.

The side face of the small silicon rod is ground, so that the surface of the small silicon rod is smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming is not needed in a laser scribing mode, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods are ground to form a chamfer surface, so that the cutting line can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

In the scheme, when the number of the second cut surfaces b2 is three, two second cut surfaces positioned at the outer side are symmetrically arranged at two sides of the central line of the silicon rod, and the ratio of the cross sectional areas of the obtained two small silicon rods a4 is 1:1-1: 6. The number and specific cutting position of the third cut surface b3 can be determined according to the size of the small silicon rod a4 and the size of the small silicon wafer to be produced, so as to meet the preparation requirements of small batteries with different specifications and sizes. In this embodiment, the number of the second cut surfaces b2 is three, and the second cut surface b2 located at the middle passes through the center line of the middle rod a2, so that the cross-sectional areas of the two small silicon rods s4 are equal.

In the above solution, the distance between the two second cut surfaces b2 located at the outer side is smaller than the surface width of the first cut surface b1 formed by cutting the silicon rod a 1. So that the silicon rod is contacted with the plane of the middle rod a2 through the second tangent plane b2 instead of the joint of the plane of the middle rod a2 and the cambered surface, the cutting process is stable and accurate, and the size precision of the small silicon rod a4 is ensured.

One implementation is as follows: the number of the second cut surfaces b2 is three, the distance between the two second cut surfaces b2 positioned at the outer side is equal to the distance between the two first cut surfaces b1, and the length-width ratio of the cross section of the obtained small silicon rod a4 is 2: 1.

Furthermore, the offcut obtained by cutting in the

steps

101 and 102 can be cut to obtain a silicon rod with a smaller cross section, and the silicon rod can be utilized, so that the waste of raw materials is reduced.

Fig. 3 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application. As shown in fig. 3, the edge skin a6 is cut by a third cut surface b3 parallel to the length direction of the edge skin, and the third cut surface b3 is parallel to the bottom surface of the edge skin a6 to cut off the arc-shaped top a61 of the edge skin.

Cutting the edge leather a6 by a fourth cut surface b4 parallel to the length direction of the edge leather, wherein the fourth cut surface b4 is vertical to the bottom surface of the edge leather a 6; the number of the fourth cut surfaces b4 is two, and the four cut surfaces b4 are symmetrically arranged on two sides of the flaw-piece material a6 to cut off corner portions a62 on two sides of the flaw-piece material a6, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

The sequence of cutting off the arc-shaped top a61 and the corner a62 of the edge leather can be interchanged, namely: the arc-shaped top part a61 can be cut off firstly, and then the corner part a62 can be cut off; the corner a62 may be cut off first, and then the arc top a61 may be cut off.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod is cut by applying the cutting method.

Fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application. As shown in fig. 4, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 and wire cutting device all set up on base 1.

The carrying platform 2 is used for carrying the silicon rod a1, the silicon rod a1 is placed on the carrying platform 2, and a part for fixing and limiting the silicon rod a1 can be further arranged on the carrying platform 2 to limit the silicon rod a1 to move in the cutting process. The silicon rod a1 can be flatly placed on the bearing platform 2, and also can be vertically placed on the bearing platform 2, specifically, the silicon rod a1 is flatly placed on the bearing platform 2, and the length direction of the silicon rod a1 extends along the horizontal direction; the silicon rod a1 is placed vertically on the susceptor 2, and the length direction of the silicon rod a1 extends in the vertical direction. When the silicon rod a1 is placed in different manners, the configuration and cutting manner of the wire cutting apparatus are also different.

The wire cutting device and the carrier 2 can be moved relatively in the longitudinal direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the main support is fixedly arranged on the base, and the wire wheel support moves relative to the main support under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed on the base 1, and the bearing table 2 moves relative to the linear cutting device under the driving action of the driving mechanism.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wheel set is wound on a cutting wire for cutting the silicon rod.

Fig. 5 is a schematic view illustrating a configuration of a wire wheel set in a silicon rod cutting apparatus according to an embodiment of the present disclosure. As shown in fig. 4 and 5, the susceptor 2 is disposed on the base 1, and the silicon rod a1 is vertically placed on the susceptor 2. And an annular cutting line is wound on a cutting line wheel in the line cutting device, and the cutting line wheel moves up and down to cut the silicon rod. Specifically, the wire cutting apparatus includes: the device comprises a main support 301, a wire wheel support 302 and a support driving mechanism, wherein the main support 301 is fixedly arranged on a base 1, and the wire wheel support 302 moves up and down relative to the main support 301 under the driving action of the support driving mechanism.

The number of the reel supports 302 is two, and the two are arranged side by side with a certain gap left. The opposite surfaces of the two reel supports 302 are respectively provided with a cutting line wheel set, and the cutting line wheel set comprises at least two cutting reels 31. Each cutting drum 31 on one drum support 302 is wound with a circular cutting line, and when the drum support 302 moves downward, the silicon rod a1 is cut by the cutting line passed by the bottom two cutting drums 31 to form a first cut surface. The cutting lines on the two reel supports 302 are arranged in parallel, and the horizontal positions of the two reel supports 302 are adjusted to form two first tangent planes to execute the step 101.

In the cutting process, two cutting devices can be adopted, wherein the cutting line wheel set in one cutting device is used as a first cutting line wheel set, and the silicon rod is cut by the first cutting line to obtain an intermediate rod. Then, the intermediate rod is conveyed to another cutting apparatus, and the cutting wire wheel set in the apparatus is used as a second cutting wire wheel set, so that the small silicon rod a4 is obtained by cutting the intermediate rod with the second cutting surface.

Or one cutting device is provided with two cutting stations which are respectively provided with a first cutting line wheel set and a second cutting line wheel set, and after the silicon rod is cut on the first station through the first cutting line wheel set to obtain the middle rod, the middle rod is moved to the second station and cut through the second cutting line wheel set to obtain the small silicon rod a 4.

Alternatively, one cutting device is provided with both the first cutting wire wheel set and the second cutting wire wheel set. The silicon rods are cut through the first cutting wire wheel group to obtain the middle rods, and then the middle rods are cut through the second cutting wire wheel group to obtain the small silicon rods a 4.

Fig. 6 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application. As shown in fig. 6, the susceptor 2 is disposed on a movable base 11, and the susceptor driving mechanism 12 is used to drive the susceptor 2 and the movable base 11 to move up and down together, so as to drive the silicon rod a1 thereon to move up and down. The wire cutting device is fixed on the base 1, is fixed, and cuts the silicon rod a1 when the silicon rod a1 goes up and down.

The stage driving mechanism 12 may include: driving motor, drive mechanism, lead screw and nut. The transmission mechanism is connected between the driving motor and the lead screw, and transmits the torque obtained by the driving motor to the lead screw to drive the lead screw to rotate. The nut is fixedly connected with the movable base 11, and the screw rod is matched with the nut to convert the rotating moment into the vertical linear motion of the movable base 11. The above-described manner is not the only implementation manner of the carrier driving mechanism 12, and those skilled in the art can also implement the above-described manner in other manners.

Fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application, and fig. 8 is a schematic structural view of a wire wheel and a cutting line in a long wire cutting manner in the silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the apparatus shown in fig. 4 is that the cutting apparatus shown in fig. 7 employs a long wire cutting method. As shown in fig. 7 and 8, the wire cutting apparatus further includes: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single long wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used for uniformly winding the cutting wire on the wire winding mechanism 36 or the wire releasing mechanism 34.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the pay-off mechanism 34 also functions as a take-up mechanism 36, and the take-up mechanism 36 also functions as the pay-off mechanism 34 to reciprocate the cutting wire 31.

Fig. 8 shows a specific arrangement of the cutting drum 31: the lower part is provided with four cutting wire wheels 31 which are horizontally arranged to form two groups. The four cutting line wheels 31 arranged on the upper part have the functions of adjusting the tension and guiding the cutting lines. The cutting lines are sequentially wound on the two groups of cutting line wheels 31, and two first cutting planes can be formed at the same time to cut the silicon rod. The top wheels with several centers of rotation perpendicular to the cutting wheel 31 serve to change the direction of the cutting line and to guide the transition. It will be appreciated that fig. 10 illustrates one arrangement of the reels and the winding pattern, as an example only, but not the only pattern.

Fig. 9 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the apparatus shown in fig. 8 is that: in the cutting apparatus shown in fig. 9, the carrier 2 is disposed on the movable base 11, the carrier 2 and the movable base 11 are driven by the carrier driving mechanism 12 to move up and down, and the wire cutting apparatus is fixed on the base 1.

The apparatus shown in fig. 9 also employs a long-line cutting method, wherein the pay-off mechanism 35, the take-up mechanism 36 and the traverse mechanism 35 are all disposed on the base 1, and the silicon rod is cut by forming a first cut surface in the winding method shown in fig. 10.

Further, the cutting apparatus further comprises: the silicon rod cutting device comprises a sleeve capable of moving vertically and a boundary leather clamping jaw, wherein the sleeve is used for being sleeved on the outer side of a silicon rod, the boundary leather clamping jaw is inserted between a boundary leather material and the cut silicon rod from the top, and a clamping force is applied to the boundary leather material by the boundary leather clamping jaw and the sleeve. The edge leather clamping jaws and the sleeve clamp the edge leather and move the edge leather to an edge leather recovery area.

Fig. 10 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application, fig. 11 is a front view of the apparatus shown in fig. 10, fig. 12 is a left side view of the apparatus shown in fig. 10, and fig. 13 is a schematic structural view of a cutting reel in the apparatus shown in fig. 10. Fig. 10 to 13 show a horizontal cutting scheme: the susceptor 2 is disposed on the base 1, the silicon rod a1 is disposed on the susceptor 2 in the horizontal direction, and the both ends of the silicon rod a1 are pressed and fixed by a pressing device disposed on the susceptor 2. The wire cutting device includes: main support 301 and reel support 302, main support 301 is fixedly arranged on base 1, and reel support 302 can horizontally move relative to main support 301.

The four cutting wire wheels 31 arranged on the wheel bracket 302 are divided into two groups, and the two cutting wire wheels 31 in each group are wound with annular cutting wires 32 to form a first tangent plane for cutting the silicon rod.

Further, be provided with the tight mechanism 33 in limit cladding material top on plummer 2, its quantity is four, and evenly distributed is in the periphery of silicon rod, and the inside clamp is tight carries out the limit cladding material that the cutting formed to the silicon rod through first tangent plane or second tangent plane, avoids the direct drop of limit cladding material.

Fig. 14 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Unlike fig. 10, in the cutting apparatus shown in fig. 14, the carrier 2 can slide horizontally along a slide rail provided on the base 1, and the reel holder 302 is fixed to the base 1. The rest of the scheme is the same as in fig. 12.

Fig. 15 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application, and fig. 16 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 15. Unlike fig. 10, the cutting apparatus shown in fig. 15 employs a long wire cutting method, namely: the wire cutting apparatus further includes: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set.

As shown in fig. 16, the four cutting wire wheels 31 are divided into two groups, each group of two cutting wire wheels 31 are arranged along the vertical direction, and the cutting wires sequentially pass around the two cutting wire wheels 31 along the vertical direction to form a first tangent plane to cut the silicon rod.

Fig. 17 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Different from fig. 15, in the cutting apparatus shown in fig. 17, the carrier 2 can slide horizontally along a slide rail provided on the base 1, and the reel holder 302 is fixed on the base 1. The rest of the scheme is the same as in fig. 15.

The cutting device shown in fig. 4-17 above can also be used to cut leather, for example: the arc-shaped top of the edging is cut off around the cutting line arranged on the cutting line wheel 31, and then the corner part of the edging is cut off.

The cutting device provided in the above is used for cutting the silicon rod by the first cutting plane. Several cutting devices for cutting through the second section are provided below.

Fig. 18 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application, fig. 19 is a schematic structural view of a cutting reel in the cutting apparatus shown in fig. 18, and fig. 20 is a schematic structural view of an intermediate rod cut by the cutting reel in the cutting apparatus shown in fig. 18. As shown in fig. 18 to 20, the cutting apparatus includes: base 1, set up plummer and wire cutting device on base 1. The intermediate bar a2 is arranged in a horizontal direction on a carrier table for carrying the intermediate bar a2, which is not shown in fig. 18.

The wire cutting device includes: and the reel bracket 302 extends along the vertical direction and can slide relative to the base 1 by being matched with a sliding rail arranged on the base 1. The number of the reel supports 302 is two, and the reel supports are arranged side by side. The opposite sides of the two reel supports 302 are provided with cutting reels 31. The cutting wire wheels 31 are divided into three groups, and the three cutting wire wheels 31 are sequentially arranged at intervals along the horizontal direction. The annular cutting lines sleeved on each group of cutting line wheels 31 respectively form second tangent planes to cut the intermediate rod a 2.

A specific implementation manner is as follows: each group comprises four cutting wire wheels 31, and the two cutting wire wheels 31 positioned at the front ends are arranged up and down. The cutting lines wound on the four cutting line wheels 31 are roughly quadrangular, the cutting lines at the top and the bottom extend horizontally, and the cutting line at the front end extends vertically to cut the middle rod.

Among three groups of cutting line wheels, the cutting line wheel 31 that is located the rear end staggers from beginning to end, sets up a line wheel driver 37 to each group of cutting line wheel 31, and its output is connected with the action wheel, and the line of cut still around locating this action wheel, through line wheel driver 37 drive action wheel rotation, and then drives the line of cut and rotate on cutting line wheel 31.

Fig. 21 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Fig. 21 shows a vertical cutting apparatus, in which a vertical base 13 is vertically disposed on a base 1, the vertical base 13 is provided with a slide rail extending vertically, and a reel support 302 is matched with the slide rail to slide up and down. The intermediate rod a2 is vertically arranged on the base 1 or the bearing platform, and cuts the intermediate rod a2 when the reel bracket 302 moves up and down. The cutting wire wheel 31 can be realized as described above.

Fig. 22 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application, and fig. 23 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 22. Fig. 22 and 23 show a long wire cutting method, in which a wire cutting device and a carrier are installed on a base 1, and a middle bar a2 is installed on the carrier in a horizontal direction. The main support 301 is fixedly arranged on the base 1, and the reel support 302 can horizontally slide relative to the main support 301.

The wire cutting apparatus further includes: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set.

The six cutting wire wheels are divided into three groups, and each group comprises two cutting wire wheels 31. Two cutting wire wheels 31 in each group are arranged up and down, and three groups are arranged side by side along the horizontal direction. In addition, six auxiliary wire wheels 38 are adopted to respectively guide the cutting wires wound on the three groups of cutting wire wheels 31, the auxiliary wire wheels 38 are respectively arranged at the top or the bottom of the cutting wire wheels 31 and are flush with the top and the bottom of the cutting wire wheels 31, and the rotation center of the auxiliary wire wheels 38 extends vertically. After being paid out from the pay-off mechanism 34, the cutting wire 32 sequentially passes through the wire arrangement mechanism 35 and one auxiliary wire wheel 38 and then winds to the cutting wire wheels 31 on the left group, then winds to the cutting wire wheels 31 on the lower group vertically downwards, then winds to the cutting wire wheels 31 on the lower group in the middle group through the auxiliary wire wheel 38, then winds to the cutting wire wheels 31 on the upper group vertically upwards, and winds until being wound out from the cutting wire wheels 31 on the lower group on the right group, and winds to the wire winding mechanism 36 through the wire arrangement mechanism 35.

Fig. 24 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Different from fig. 22, the apparatus shown in fig. 24 is a vertical cutting mode, and adopts the vertical base 13 to be arranged on the base 1, the reel bracket 302 moves up and down relative to the vertical base 13, and the middle rod a2 is vertically arranged on the base 1, and the middle rod is cut by the up and down movement of the reel bracket 302.

On the basis of the technical scheme, the reel bracket 302 can be further fixed on the base 1, and the bearing platform 2 drives the middle rod to move relative to the reel bracket 302, so that cutting can be realized, and the cutting method can be referred to specifically.

The cutting wire mentioned in this embodiment is a diamond wire, and is used for cutting a single crystal silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers from large silicon wafers in the prior art are overcome.

The length L of the small silicon rod is greater than the width W and the height H thereof, and the longitudinal direction of the small silicon rod is understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the step of "cutting the intermediate rod" and the step of "cutting the small silicon rod" may be performed simultaneously or separately according to the form and arrangement position of the cutting reel.

When the step of cutting the intermediate rod and the step of cutting the silicon rod are separately performed, the step of cutting the intermediate rod is performed first, and then the step of cutting the silicon rod is performed.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are simultaneously sliced, so that the efficiency is higher.

In some embodiments of the present application, the method further comprises the steps of trimming the leather: and cutting the four pieces of edge leather in a direction with the section parallel to the axis of the silicon rod, wherein each piece of edge leather can be cut to obtain an outer edge leather and at least one middle edge leather. The outer side leather and the middle side leather are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the present application, the step of "cutting the middle rod" and the step of "cutting the edge skin material" may be performed simultaneously and before the step of "cutting the silicon rod" according to the form and the arrangement position of the cutting wire wheel.

In some embodiments of the present application, the thicknesses of the outer side leather and the middle leather are equal or different, so as to meet the processing requirements of different subsequent products.

This embodiment also provides a device for cutting edge cladding, as shown in fig. 25, the cutting device includes: the wire cutting machine comprises a base 1, a bearing table 2 and a wire cutting device, wherein the bearing table 2 and the wire cutting device move relatively, the bearing table 2 can move relative to the base, and the wire cutting device can also move relative to the base. The edge leather can be horizontally placed on the bearing table 2 or vertically placed on the bearing table. The wire cutting device may be an annular cutting wire, or a single long wire, as described above.

The wire cutting apparatus includes a gate-shaped reel holder 302 on which a plurality of sets of cutting reels 32 are disposed. Fig. 12 is provided with four stations, and four edge leather materials can be cut simultaneously. For one station, the cutting device comprises a group of cutting wire wheels, at least two cutting wire wheels 32 are arranged horizontally or vertically, and cutting lines arranged on the two cutting wire wheels 32 are wound to form a cutting surface along horizontal extension or vertical extension so as to cut off the arc-shaped top or corner of the edge leather. Fig. 26 shows the horizontal arrangement. When one station comprises two groups of cutting wire wheels, two corner parts of the edge leather can be cut off simultaneously by winding the cutting wires arranged on the two groups of cutting wire wheels. Figure 27 shows two sets of cutting wheels for cutting off the corners of the trim material.

For the above-mentioned plummer 2, this embodiment further provides a specific implementation manner: fig. 28 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application. Fig. 28 shows four stations for cutting four trimmings simultaneously. For one of the stations, the carrier 2 has a preset opening 261, giving way to the cutting line. The preset opening 261 divides the front end of the bearing table into a main bearing part 211-1 and an auxiliary bearing part 211-2, and the main bearing part 211-1 and the auxiliary bearing part 211-2 are used for bearing the to-be-cut edge leather which is horizontally placed together.

When the edge leather material is required to be cut, the edge leather material is fixed on the bearing table in a flat mode, and at the moment, the edge leather material is located on the main bearing part, the auxiliary bearing part and the two preset openings. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the preset opening, and cutting is started from one end face of the edge leather until the end face of the other end is cut.

It can be understood that after the corner portion of the edge leather is firstly cut off, in the process of cutting off the arc-shaped top portion, the edge leather side with the corner portion cut off can be placed on the bearing table, and then the bearing table does not need to be provided with a preset opening.

Fig. 29 is a cross-sectional view of a clamping mechanism in a cutting device provided in an embodiment of the present application. As shown in fig. 25 and 29, the carrier table is further provided with a stopper mechanism 221 and a clamping mechanism 23. The clamping mechanism comprises a clamping driving mechanism 231, an expansion link 232 and a clamping head 233, one end of the expansion link is fixed on the side face of the clamping driving mechanism, and the other end of the expansion link, which can expand and contract, is fixed on the clamping head and the clamping head 233 is arranged opposite to the limiting mechanism. The clamping driving mechanism is used for driving the telescopic rod to stretch and adjust the distance between the clamping head 233 and the limiting mechanism 221 so as to place the edge leather between the clamping head and the limiting mechanism, and the limiting mechanism 221 and the clamping head 233 are used for being pushed against the end faces of the two ends of the edge leather to fix the edge leather.

Further, the bearing device further comprises: the flat plate type abutting plate 251 is fixedly arranged on the upper surfaces of the main bearing part 211-1 and the auxiliary bearing part 211-2, the upper surface of the main bearing part 211-1 is tightly attached to the plate surface of the flat plate type abutting plate fixed on the main bearing part, and the upper surface of the auxiliary bearing part 211-2 is tightly attached to the plate surface of the flat plate type abutting plate fixed on the auxiliary bearing part.

The flat plate type abutting plate 251 is a full-length flat plate type abutting plate, and one flat plate type abutting plate is fixed on each of the main bearing part 211-1 and the auxiliary bearing part 211-2. Or at least two flat plate type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

The carrier table is made of rigid material in order to support the edge leather and the components mounted thereon. The edge skin material of the brittle and hard material is brittle and hard. In order to avoid hard-to-hard contact between the edge leather of the brittle and hard material and the bearing table of the rigid material, an elastic flat-plate type abutting plate is arranged. When the bottom surface of the edge leather material with the arc-shaped end surface is placed on the elastic flat plate type leaning plate, the buffer is provided for the edge leather material, and the protection effect is achieved on the edge leather material.

Fig. 30 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application. As shown in FIG. 30, the L-shaped abutment plate 252 is fixed to at least the upper surface of one of the sub-bearing portions 211-2, the lateral arm of the L-shaped abutment plate 252 is fixed to the upper surface of the sub-bearing portion 211-2, and the sub-bearing portion 211-2 is flush with the end of the lateral arm of the L-shaped abutment plate fixed thereto. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be adapted. The L-shaped abutting plate can stably bear the edge leather with two adjacent vertical planes.

Fig. 31 is a cross-sectional view of a cutting reel in the cutting device according to the embodiment of the present application. As shown in fig. 31, the embodiment provides a structure of a cutting reel, a plurality of wire slots 311 arranged in parallel are arranged at the outer edge of the cutting reel, a cutting wire 32 is embedded in one of the wire slots 311, the cutting wire 32 is limited in the wire slot 311, and the cutting wire is prevented from being separated from the cutting reel in the rotating process. In addition, because the sliding friction exists between the cutting line and the wire groove 311, a lot of diamonds are distributed on the cutting line, so that the wire groove is seriously worn. After one wire groove is worn, other wire grooves can be directly used, the cutting wire wheel does not need to be frequently replaced, the maintenance is convenient, and the material and the maintenance cost are saved.

Fig. 32 is a first structural schematic view of the clamping device in the cutting apparatus provided in the embodiment of the present application gripping the edge leather, and fig. 33 is a second structural schematic view of the clamping device in the cutting apparatus provided in the embodiment of the present application gripping the edge leather. As shown in fig. 32 and 33, the cutting apparatus provided in this embodiment further includes a clamping device for grabbing the offcut material, and placing the offcut material on the carrier or leaving the carrier.

Specifically, the clamping device includes: the clamping device comprises a fixing piece 51 and two oppositely arranged clamping jaws 52, wherein at least one clamping jaw 52 is slidably arranged on the lower bottom surface of the fixing piece 51, so that the distance between the two clamping jaws 52 can be adjusted to adapt to the edge leather materials with different widths.

When the edge leather needs to be clamped, adjusting the distance between the two clamping jaws to be larger than the width of the edge leather, and moving the position of the clamping device to enable the two clamping jaws to be respectively positioned at two sides of the width direction of the edge leather; and then, adjusting the distance between the two clamping jaws to be smaller until the width direction of the edge leather is clamped. The cutting equipment that this application embodiment provided, realization that can be convenient through clamping device carries out the centre gripping to the side cladding, provides the advantage for the removal of side cladding.

Specifically, the holding jaw 52 includes: a vertical mounting plate 521 and a jaw body 522. At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed to the inner surface of the mounting plate 521. The jaws themselves are not of unitary construction, but are formed as two separate pieces of mounting plate and jaw body. The vertical mounting plate is a mounting base of the clamping jaw body and is a base on which the clamping jaw can move. Two independent parts of mounting panel and clamping jaw body, at the in-process of clamping jaw body centre gripping raw material stick, the wearing and tearing of clamping jaw body are very serious, only need to change clamping jaw body can, the mounting panel need not be changed.

The cutting equipment for the edge leather can cut the edge leather with the arc-shaped end face. The cutting process comprises the following steps: firstly, cutting corner parts at two ends of a boundary leather material to form the boundary leather material with the end surface in a rectangular and arc combined shape; then, the arc on the top of the edge leather with the end face in the shape of the combination of the rectangle and the arc is cut to form a rectangular rod with the end face in the rectangle.

Before cutting the edge leather material, after the edge leather material is placed on the bearing table, laser marking positioning is firstly carried out through a laser positioning device, and the edge leather material is guaranteed to be placed at a proper and correct position. The bottom or the lateral part of plummer are provided with induction system, and whether the opposite side cladding is installed and is targetting in place and detect, and only after whole detection condition satisfied, the tight mechanism in top just can move the opposite side cladding and carry out the top tightly, compress tightly fixed limit cladding together with stop gear.

Before the cutting device cuts the arc top, the flaw-piece material is placed on the bearing device, then the material inductive switch is triggered, and the flaw-piece material is detected to be placed in position. At the moment, the laser positioner and the lateral sensing device fixed on the auxiliary bearing part of the bearing device are used for marking and positioning the leather materials, so that the leather materials are placed at the correct position, and the leather materials are positioned under all detection conditions. And starting the clamping mechanism to start extending movement, and finishing the positioning and clamping process of the edge leather.

As shown in fig. 25, a laser alignment device 38 and a spray lubrication device 39 are also included.

The laser alignment device is arranged above the flaw-piece cutting table, so that the function of accurately installing and feeding the flaw-piece is realized. Set up a plurality of laser generator on the laser alignment device, install before the boundary material cutting bed at the boundary material, laser generator opens the linear laser of formation, projects on load-carrying device. When the edge leather is installed on the bearing device, alignment is firstly carried out through linear laser, so that a rectangular block made of brittle and hard materials is formed after cutting and is just the size needed. Wherein, the position and the distance of each laser generator can be adjusted, and are specifically determined according to different flaw-piece material specifications.

The specific working process of the laser alignment device is as follows: finding out the center line of the two wheels by using a tool or a measuring tool (a vernier caliper or a steel plate ruler). And adjusting the position of the focused laser marker to enable the laser emitted by the laser marker to be aligned to the middle line of the two wheels, and fixing the laser marker. Finding out the center line position on the edge leather material and marking. And adjusting the position of the edge leather material during feeding to enable the central line of the edge leather material to be aligned with the laser emitted by the laser line marker.

Spray lubricating arrangement and constantly spray cutting fluid toward vertical buddha's warrior attendant line in cutting process, promote the quality after the cutting of boundary leather material. The spraying and lubricating device is normally required to be installed above the edge leather cutting table, cutting liquid is continuously sprayed to the vertical diamond wire in the cutting process, the cutting liquid can vertically and directly flow to the position point of the edge leather to be cut, and the purpose of cooling and lubricating is achieved.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied back, the tight mechanism in top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod with stop gear together.

Further, a position detection device is adopted for detecting the position of the silicon rod, and the cutting wire wheel is controlled to move to the target cutting position according to the position of the silicon rod. The position of the silicon rod is detected through the position detection device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the target cutting position to cut the silicon rod.

The apparatus structure for cutting edge cladding material provided by this embodiment may also be applied to cutting the silicon rod, for example: the line wheel structure, the detection device, the induction system, the spray lubrication system, the laser alignment system and the like can be used for the equipment.

Further, the embodiment also provides a grinding device for grinding the small silicon rod in the above steps. As shown in fig. 34 to 37, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. Wherein, the feeding assembly 42 is arranged in the feeding area 401, and the small silicon rods to be ground are assembled on the feeding assembly 42 from the feeding area 401, and then delivered to the grinding area 402. The grinding assembly 43 is disposed in the grinding region 402 for grinding the surface and/or corners of the small silicon rod.

Taking grinding of the small silicon rod a4 as an example, fig. 35 and 36 show the implementation manner of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is as follows: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; alternatively, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Taking the second scheme as an example: the small silicon rod a4 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 with respect to the slide table is adjusted to clamp the small silicon rod a 4. The small silicon rod a4 is moved to the model area 402 by the moving slide table to be ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged in opposite directions, the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the small silicon rod a4 from both ends.

As shown in fig. 37, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rods for 45 degrees, and grinding the edges and corners of the small silicon rods; and then the other three edges and corners are ground by sequentially rotating 90 degrees.

The grinding unit 43 is provided with a grinding wheel for grinding the small silicon rod a 4. The grinding wheels comprise a rough grinding wheel and a fine grinding wheel, and the rough grinding and the fine grinding are respectively carried out on the small silicon rod a 4.

In the above-described embodiment, the small silicon rod is ground, typically by grinding its side surface, and in special cases also by grinding its end surface.

The present embodiment also provides a silicon rod cutting system, including: the cutting device for cutting the silicon rod with the first cutting surface to obtain the intermediate rod, the cutting device for cutting the intermediate rod with the second cutting surface to obtain the small silicon rod, and the grinding device for grinding the small silicon rod may further include a cutting device for cutting the edge skin material. And cutting the silicon rod by each cutting device according to the assembly line operation to obtain small silicon wafers.

Claims

1. A method for cutting a silicon rod, comprising:

2. The method according to claim 1, wherein two second cut surfaces located on the outer side are arranged on both sides of the center line of the silicon rod; the number of the second sections is three, so that two small silicon rods are obtained; the ratio of the cross sectional areas of the two small silicon rods is 1:1-1: 6.

3. The method as claimed in claim 2, characterized in that the number of the second sections is three, the second section lying in the middle passing through the center of the silicon rod, resulting in two small silicon rods with equal cross-sectional areas.

4. The method of claim 1, wherein the distance between the two second cut surfaces located at the outer side is equal to the distance between the two first cut surfaces.

5. The method of any of claims 1-4, further comprising:

and slicing the small silicon rods along the length direction of the small silicon rods by using a section vertical to the length direction of the small silicon rods to obtain a plurality of small raw material pieces.

6. The method of claim 5, further comprising, prior to slicing the small silicon rods:

grinding four side surfaces of the small silicon rod, wherein the side surfaces of the small silicon rod are surfaces parallel to the length direction of the small silicon rod;

and grinding the edge angle between two adjacent side surfaces in the small silicon rod to form a chamfer surface between the two side surfaces.

7. The method of claim 1, further comprising:

cutting the edge leather material by a third cut surface parallel to the length direction of the edge leather material, wherein the third cut surface is parallel to the bottom surface of the edge leather material so as to cut off the arc-shaped top of the edge leather material;

cutting the edge leather material by a fourth cut surface parallel to the length direction of the edge leather material, wherein the fourth cut surface is vertical to the bottom surface of the edge leather material; the number of the fourth tangent planes is two, and the fourth tangent planes are symmetrically arranged on two sides of the edge skin material so as to cut off corner parts on two sides of the edge skin material, and the edge skin silicon rod with a rectangular cross section is obtained.

8. A cutting apparatus to which the method for cutting the silicon rod as set forth in any one of claims 1 to 7 is applied, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the cutting wire wound on the cutting wire wheel set is used for cutting the silicon rod.

9. The cutting apparatus of claim 8, wherein the carrier is fixedly disposed on a base; the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to the base under the driving action of the bracket driving mechanism; the cutting wire wheel set is arranged on the wire wheel bracket;

or the wire cutting device is fixed on the base; the bearing table moves relative to the linear cutting device under the driving action of the driving mechanism.

10. The cutting apparatus according to claim 9, wherein the silicon rod is arranged vertically on a carrier table; the wire wheel bracket and the bearing table move relatively along the vertical direction;

or the silicon rod is horizontally arranged on the bearing table, and the wire wheel support and the bearing table horizontally move relatively.

11. The cutting apparatus of claim 9, wherein the cutting line is looped between the wheels of the cutting line wheel set;

or, the wire cutting device further comprises: the device comprises a pay-off mechanism, a take-up mechanism and a wire arranging mechanism; the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the winding displacement mechanism and the cutting line wheel set.

12. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any of claims 8 to 11, for cutting the silicon rod with a first cut to obtain an intermediate rod; or for cutting the intermediate rod with the second cutting surface to obtain a small silicon rod; and the number of the first and second groups,

and grinding equipment for grinding the small silicon rod.