CN114454360A

CN114454360A - Silicon rod cutting method, device and system

Info

Publication number: CN114454360A
Application number: CN202110953433.9A
Authority: CN
Inventors: 王新辉; 薛俊兵; 杨保聚; 周聪
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-05-10

Abstract

The embodiment of the application provides a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system, wherein the method comprises the following steps: cutting the silicon rod by a first cut parallel to the length direction of the silicon rod to obtain two semi-rods with a bottom surface and a cambered surface connected with the bottom surface; the ratio of the cross-sectional areas of the two half bars is greater than 1: 3; synchronously cutting the semi-rod by a second cut surface and a third cut surface which are parallel to the length direction of the silicon rod, wherein the second cut surface is parallel to the first cut surface; the number of the third tangent planes is two, and the third tangent planes are vertical to the second tangent planes so as to obtain the small silicon rod with the rectangular section and the first class of edge leather with a plane and an arc surface connected with the plane.

Description

Silicon rod cutting method, device and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 micrometers or 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer, but in the laser scribing process, damage and defect states can be generated on the cross section of the small silicon wafer, and the conversion efficiency of the finally processed heterojunction battery is seriously influenced.

The size of the silicon rod is larger and larger at present, from 166mm to 182mm, then to 210mm, and may reach 230mm or even 250mm in the future, the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is required to be too high and is easy to break.

Disclosure of Invention

In order to solve one of the technical defects, embodiments of the present application provide a silicon rod cutting method, apparatus and system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting method including:

cutting the silicon rod by a first cut parallel to the length direction of the silicon rod to obtain two semi-rods with a bottom surface and a cambered surface connected with the bottom surface; the ratio of the cross-sectional areas of the two half bars is greater than 1: 3;

synchronously cutting the semi-rod by a second cut surface and a third cut surface which are parallel to the length direction of the silicon rod, wherein the second cut surface is parallel to the first cut surface; the number of the third tangent planes is two, and the third tangent planes are vertical to the second tangent planes so as to obtain the small silicon rod with the rectangular section and the first class of edge leather with a plane and an arc surface connected with the plane.

According to a second aspect of embodiments of the present application, there is provided a cutting apparatus to which the above silicon rod cutting method is applied, including:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device is provided with a wire cutting wheel set;

the cutting wire wound on the cutting wire wheel set is used for cutting the silicon rod.

According to a third aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising:

the cutting device is used for cutting the silicon rod by the first cutting surface to obtain a half rod; or cutting the arc top of the half-bar by a second section; or cutting the edge corner part of the half bar by using the third section to obtain a small silicon bar;

in the embodiment, the silicon rod is cut by the first section to obtain two half rods, the half rods are cut by the second section and the third section to obtain two small silicon rods with smaller cross sectional areas and edge leather, and the small silicon rods are subsequently sliced to directly obtain small silicon wafers meeting the size requirement of the silicon wafers for preparing small heterojunction batteries without the step of laser scribing, so that the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

FIG. 3 is a cross-sectional view of a half bar being cut in a method provided by an embodiment of the present application;

fig. 4 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application;

fig. 5 is a schematic view of a silicon rod cutting apparatus according to an embodiment of the present application;

FIG. 6 is a schematic view of a wire cutting device in the cutting apparatus shown in FIG. 5;

FIG. 7 is a schematic view illustrating a structure of the wire cutting apparatus of FIG. 6 cutting a silicon rod;

fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 9 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 10 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 11 is a schematic structural view of still another silicon rod cutting apparatus provided in the embodiments of the present application;

fig. 12 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 13 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 14 is a schematic view of a wire cutting device in the cutting apparatus shown in FIG. 13;

FIG. 15 is a schematic view of the wire cutting apparatus of FIG. 14 for cutting a half bar;

fig. 16 is a schematic view of a still another silicon rod cutting apparatus provided in the example;

fig. 17 is a schematic view of a still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 18 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 19 is a schematic view of a still another silicon rod cutting apparatus provided in the example of the present application;

fig. 20 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 21 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 22 is a cross-sectional view of a clamping mechanism in a cutting device provided in accordance with an embodiment of the present application;

fig. 23 is a schematic structural diagram of another carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 24 is a cross-sectional view of a cutting reel in the cutting apparatus provided in the embodiments of the present application;

fig. 25 is a first schematic structural diagram of a clamping device in the cutting apparatus according to the embodiment of the present disclosure for clamping a half bar or an edge strip;

fig. 26 is a second schematic structural diagram illustrating a structure of a clamping device in the cutting apparatus according to the embodiment of the present application for clamping a half bar or an edge trim;

fig. 27 is a schematic structural diagram of a grinding apparatus provided in an embodiment of the present application;

FIG. 28 is a schematic structural view of a square bar clamped on a slide table device in the grinding apparatus shown in FIG. 27;

fig. 29 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 27;

fig. 30 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 27.

Reference numerals:

a 1-silicon rod; a 2-half bar; a 4-small silicon rods; a 5-small raw material pieces; a 6-offcut; a 61-arc top; a 62-corner; a 63-flaw-piece bar;

b 1-first cut plane; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface; b 5-fifth tangent plane;

1-a base; 11-a movable base;

2-a bearing platform; 211-1-a primary load bearing portion; 211-2-an auxiliary carrier; 221-a first limiting mechanism; 23-a clamping mechanism; 321-a clamp drive member mechanism; 232-telescopic rod; 233-clamping head; 251-flat plate type abutting plates; 252-L-shaped abutment plates; 261-a first preset opening;

301-main support; 302-reel support; 302-1-wire wheel mounting seat; 31-a cutting wire wheel; 311-wire chase; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 424-headgear clip; 425-tailstock chuck; 426-grinding the fixed seat; 427-a collet; 431-grinding head;

51-a fixture; 52-a jaw; 521-a mounting part; 522-jaw body.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting method, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

Fig. 1 is a flowchart illustrating a method for slicing a silicon rod according to an embodiment of the present disclosure, fig. 2 is a schematic diagram illustrating a method for slicing a silicon rod according to an embodiment of the present disclosure, and fig. 3 is a cross-sectional view illustrating slicing of a half rod according to the method according to the embodiment of the present disclosure. As shown in fig. 1 to fig. 3, the cutting method provided in this embodiment includes:

step 101, cutting the silicon rod by a first tangent plane parallel to the length direction of the silicon rod to obtain two semi-rods with a bottom surface and an arc surface connected with the bottom surface; the ratio of the cross-sectional areas of the two half-rods is greater than 1: 3.

In this embodiment, the silicon rod is a single crystal silicon rod, and has a cylindrical shape, and the length direction of the silicon rod is the central line direction of the cylindrical shape, which may also be referred to as the axial direction.

The silicon rod a1 is cut by the first section b1, and the first section b1 cuts the silicon rod into an upper half rod a2 and a lower half rod a2, wherein each half rod a2 has a plane and an arc surface connected with the plane, as shown in the angle shown in fig. 2.

Step 102, synchronously cutting the semi-rod by a second cut surface and a third cut surface which are parallel to the length direction of the silicon rod, wherein the second cut surface is parallel to the first cut surface; the number of the third tangent planes is two, and the third tangent planes are vertical to the second tangent planes so as to obtain the small silicon rod with the rectangular section and the first class of edge leather with a plane and an arc surface connected with the plane.

After obtaining the half rod a2, the half rod a2 is cut through the second section b2 and the third section b3, and a small silicon rod and a side cladding material with rectangular sections are obtained. Specifically, the second cut b2 is parallel to the first cut b1, and the curved top a21 of the half bar a2 is cut off. The third section b3 is perpendicular to the second section b2, the number of the third sections b3 is two, and the corner portions a22 at the two ends of the half rod a2 are cut off to obtain the small silicon rod a 4.

In the traditional scheme, a cylindrical silicon rod is cut into a large square rod with a rectangular cross section, a large silicon wafer with a large size is obtained by cutting, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, through the steps, the silicon rod is cut by the first cutting surface to obtain two half rods, then the half rods are cut by the second cutting surface and the third cutting surface to obtain two small silicon rods with smaller cross sectional areas and edge leather, and then the small silicon rod a4 is cut into slices to directly obtain small silicon wafers meeting the silicon wafer size requirement for preparing small heterojunction batteries.

The cutting step of the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the above technical solution, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground. Referring to the above steps, the small silicon rod a4 having a rectangular cross section and four surfaces parallel to the longitudinal direction thereof as side surfaces was obtained. After the small silicon rod a4 was obtained, four side surfaces of the small silicon rod a4 were ground, and then an edge angle between two adjacent side surfaces in the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces.

The side face of the small silicon rod is ground, so that the surface of the small silicon rod is smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming is not needed in a laser scribing mode, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods are ground to form a chamfer surface, so that the cutting line can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

In the present embodiment, the first cut surface b1 passes through the center line of the silicon rod a1, and the cross-sectional areas of the two small half rods a2 are equal.

In the above solution, the distance between the two third cut surfaces b3 is smaller than the width of the surface formed by the second cut surface b2 cutting the half-rod a 2. So that the third tangent plane b3 contacts with the plane of the half rod a2, but not with the junction of the plane of the half rod a2 and the cambered surface, the cutting process is stable and accurate, and the size precision is ensured.

Furthermore, the edge skin material obtained by cutting can be cut to obtain a silicon rod with a smaller sectional area, and the silicon rod can be utilized to reduce waste of raw materials.

Fig. 4 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application. As shown in fig. 4, the edge skin a6 is cut by a fourth cut surface b4 parallel to the length direction of the edge skin, and the fourth cut surface b4 is parallel to the bottom surface of the edge skin a6 to cut off the arc-shaped top a61 of the edge skin.

Cutting the edge leather a6 by a fifth cut surface b5 parallel to the length direction of the edge leather, wherein the fifth cut surface b5 is vertical to the bottom surface of the edge leather a 6; the number of the fifth cut surfaces b5 is two, and the fifth cut surfaces b5 are symmetrically arranged on two sides of the flaw-piece material a6 to cut off corner portions a62 on two sides of the flaw-piece material a6, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

The above-mentioned order of cutting off limit cladding material arc top and corner portion can be exchanged, promptly: the arc-shaped top part can be cut off firstly, and then the corner part can be cut off; or the corner part can be cut off firstly, and then the arc-shaped top part can be cut off.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod cutting method is applied to cut the silicon rod made of the hard and brittle material.

Fig. 5 is a schematic structural view of a silicon rod cutting apparatus according to an embodiment of the present application, fig. 6 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 5, and fig. 7 is a schematic structural view of the wire cutting device shown in fig. 6 cutting a silicon rod. As shown in fig. 5 to 7, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 and wire cutting device all set up on base 1.

The carrying platform 2 is used for carrying the silicon rod a1, the silicon rod a1 is placed on the carrying platform 2, and a part for fixing and limiting the silicon rod a1 can be further arranged on the carrying platform 2 to limit the silicon rod a1 to move in the cutting process. The silicon rod a1 can be flatly placed on the bearing platform 2, and also can be vertically placed on the bearing platform 2, specifically, the silicon rod a1 is flatly placed on the bearing platform 2, and the length direction of the silicon rod a1 extends along the horizontal direction; the silicon rod a1 is placed vertically on the susceptor 2, and the length direction of the silicon rod a1 extends in the vertical direction. When the silicon rod a1 is placed in different manners, the configuration and cutting manner of the wire cutting apparatus are also different.

The wire cutting device and the carrier 2 can be moved relatively in the longitudinal direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the wire wheel support moves relative to the base 1 under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed on the base 1, and the bearing table 2 moves relative to the linear cutting device under the driving action of the driving mechanism.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wheel set is wound on a cutting wire for cutting the silicon rod.

In a specific implementation, as shown in fig. 5 to 7, the cutting device includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 is fixed to be set up on base 1, and silicon rod a1 level is placed on plummer 2, and the both ends of plummer 2 are provided with stop gear and jacking mechanism respectively, from both ends tight silicon rod a 1.

The wire cutting device includes: a reel support 302 and a cutting reel 31. The reel holder 302 is a gate-shaped holder, two legs of which are slidably provided on the base 1, and the reel holder 302 is movable in the longitudinal direction of the silicon rod a 1. The cutting wire wheel 31 is fixed on the wire wheel bracket 302 through a wire wheel mounting seat 302-1. At least one set of cutting wheels 31 can be arranged on the wheel support 302 for cutting at least one silicon rod a 1. Each group comprises at least two cutting wire wheels 31 which are arranged along the horizontal direction, and the cutting wires 32 are wound on the two cutting wire wheels 31 along the horizontal direction to form a loop to cut the silicon rods a1, so as to obtain half rods.

It can be understood that the annular cutting line is at least around establishing on two cutting line wheels, can also around establishing on tension pulley and action wheel, and the output at the wire wheel driver is connected to the action wheel, drives the action wheel through the wire wheel driver and rotates, and then drives the cutting line and rotate around each line wheel.

Fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 5 is that: in the cutting apparatus shown in fig. 8, the reel holder 302 is fixed on the base 1, and the plummer 2 slides along the slide rail provided on the base 1, thereby driving the silicon rod to move relative to the cutting reel.

Fig. 9 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 8 is that: the cutting apparatus shown in fig. 9 cuts the square bar using a long wire cutting method. Specifically, set up paying out machine structure 34, admission machine structure 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission machine structure 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single long line is around locating between paying out machine structure 35, admission machine structure 36, winding displacement mechanism 35 and the line of cut wheelset.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the pay-off mechanism 34 also functions as a take-up mechanism 36, and the take-up mechanism 36 also functions as the pay-off mechanism 34 to reciprocate the cutting wire 31.

Fig. 10 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Fig. 10 provides a vertical cutting mode, in which a vertical base 11 is disposed on the base 1, and the vertical base 11 is provided with a slide rail extending vertically. The reel holder 302 moves vertically relative to the slide rail, and the carrier 2 is fixed to the base 1. The silicon rod is cut by moving the wire wheel support 302 up and down.

Fig. 11 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 10 is that: in the cutting apparatus shown in fig. 11, the reel bracket 302 is fixed on the vertical base 11, and the plummer 2 slides along the slide rail arranged on the vertical base 11, so as to drive the silicon rod to move relative to the cutting reel.

Fig. 12 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 10 and 11 is that: the cutting apparatus shown in fig. 12 cuts the square bar using a long wire cutting method. Specifically, set up paying out machine structure 34, admission machine structure 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission machine structure 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single long line is around locating between paying out machine structure 35, admission machine structure 36, winding displacement mechanism 35 and the line of cut wheelset.

Further, the cutting apparatus further comprises: the silicon rod cutting device comprises a sleeve capable of moving vertically and a boundary leather clamping jaw, wherein the sleeve is used for being sleeved on the outer side of a silicon rod, the boundary leather clamping jaw is inserted between a boundary leather material and the cut silicon rod from the top, and a clamping force is applied to the boundary leather material by the boundary leather clamping jaw and the sleeve. The edge leather clamping jaws and the sleeve clamp the edge leather and move the edge leather to an edge leather recovery area.

The cutting device provided in the above only employs the first cutting line wheel set for achieving the cutting of the silicon rod by the first cut. The present embodiment further provides several specific cutting apparatuses for cutting the semi-rod, as shown in fig. 13 to fig. 20, the apparatuses for cutting the semi-rod are substantially the same as the apparatuses for cutting the silicon rod, except that the number and the layout of the cutting reels 31 disposed on the reel bracket 302 are different, and the first cutting reel set and the second cutting reel set are specifically adopted to cut the arc-shaped top and the corner of the semi-rod.

Specifically, as shown in fig. 14 and 15, the reel holder 302 is provided with two stations capable of cutting two half bars. To one of them station, be provided with six cutting wire wheels: 31-1, 31-2, 31-3, 31-4, 31-5 and 31-6, each wire wheel is arranged on the wire wheel bracket 302 through a wire wheel mounting bracket 302-1, the wire wheel mounting bracket is L-shaped, one end of the wire wheel mounting bracket is connected to the wire wheel bracket, and the other end of the wire wheel mounting bracket is provided with a cutting wire wheel.

Taking the angle shown in fig. 15 as an example only, the cutting reels 31-1 and 31-2 are a set, and the cutting line 32 wound thereon extends in the horizontal direction to cut the half bar a2 as a second cut surface. The cutting wheels 31-3 and 31-4 are a group, and the cutting lines 32 wound on the cutting wheels extend along the vertical direction and are used as second cutting planes for cutting the half bars a 2. The cutting wheels 31-5 and 31-6 are a group, and the cutting line 32 wound on the cutting wheels extends along the vertical direction and is used as another second section to cut the half bar a 2.

For the above-mentioned plummer 2, this embodiment further provides a specific implementation manner: fig. 21 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application. Figure 21 shows four stations for cutting four half bars or trimmings simultaneously. For one of the stations, the carrier 2 has a first preset opening 261, giving way to the cutting line. The first preset opening 261 divides the front end of the bearing table into a main bearing part 211-1 and an auxiliary bearing part 211-2, and the main bearing part 211-1 and the auxiliary bearing part 211-2 are used for bearing the flat semi-rod or edge leather to be cut together.

When the semi-bar or the flaw-piece material is required to be cut, the semi-bar or the flaw-piece material is fixed on the bearing table in a flat mode, and at the moment, the semi-bar or the flaw-piece material is located on the main bearing part, the auxiliary bearing part and the two first preset openings. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the first preset opening, and starts to cut from the end face of one end of the half bar or the flaw-piece material until the end face of the other end is cut.

It can be understood that after the corner portions of the half bars or the edge leather are cut off, the half bars or the edge leather with the cut-off corner portions can be placed on the bearing table in the process of cutting off the arc-shaped top, and the bearing table does not need to be provided with the preset openings.

Fig. 22 is a cross-sectional view of a clamping mechanism in a cutting device provided in an embodiment of the present application. As shown in fig. 21 and 22, the carrier table is further provided with a first limit mechanism 221 and a clamping mechanism 23. The clamping mechanism comprises a clamping driving mechanism 231, an expansion link 232 and a clamping head 233, one end of the expansion link is fixed on the side face of the clamping driving mechanism, and the other end of the expansion link, which can expand and contract, is fixed on the clamping head and the clamping head 233 is arranged opposite to the first limiting mechanism. The clamping driving mechanism is used for driving the telescopic rod to stretch and adjust the distance between the clamping head 233 and the first limiting mechanism 221 so as to place the half rod or the edge leather material between the clamping head and the first limiting mechanism, and the first limiting mechanism 221 and the clamping head 233 are used for pushing the end faces of two ends of the half rod or the edge leather material to fix the half rod or the edge leather material.

Further, the bearing device further comprises: and the flat-plate-type abutting plate 251 is fixedly arranged on the upper surfaces of the main bearing part 211-1 and the auxiliary bearing part 211-2, the upper surface of the main bearing part 211-1 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the main bearing part, and the upper surface of the auxiliary bearing part 211-2 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the auxiliary bearing part.

The flat plate type abutting plate 251 is a full-length flat plate type abutting plate, and one flat plate type abutting plate is fixed on each of the main bearing part 211-1 and the auxiliary bearing part 211-2. Or at least two flat plate type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

The carrier table is required to be of a rigid material in order to carry the half-rods, the edging material and the plurality of components mounted thereon. The semi-stick or the edge skin material of the brittle and hard material is brittle and hard. In order to avoid hard-to-hard contact between the semi-rod or the edge leather material of the brittle and hard material and the bearing platform of the rigid material, an elastic flat-plate type abutting plate is arranged. When the bottom surface of the semi-rod or the edge leather material with the arc-shaped end surface is placed on the elastic flat plate type abutting plate, the buffer is provided for the semi-rod or the edge leather material, and the semi-rod or the edge leather material is protected.

Fig. 23 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application. As shown in FIG. 23, the L-shaped abutment plate 252 is fixed to at least the upper surface of one of the sub-bearing portions 211-2, the lateral arm of the L-shaped abutment plate 252 is fixed to the upper surface of the sub-bearing portion 211-2, and the sub-bearing portion 211-2 is flush with the end of the lateral arm of the L-shaped abutment plate fixed thereto. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be adapted. The L-shaped abutting plate can stably bear half bars or edge leather materials with two adjacent vertical planes.

Fig. 24 is a cross-sectional view of a cutting reel in the cutting apparatus provided in the embodiment of the present application. As shown in fig. 24, in the structure of the cutting wheel provided in this embodiment, a plurality of parallel wire slots 311 are disposed on the outer edge of the cutting wheel, the cutting wire 32 is embedded in one of the wire slots 311, and the cutting wire 32 is limited in the wire slot 311, so as to avoid being separated from the cutting wheel during the rotation process. In addition, because the sliding friction exists between the cutting line and the wire groove 311, a lot of diamonds are distributed on the cutting line, so that the wire groove is seriously worn. After one wire groove is worn, other wire grooves can be directly used, the cutting wire wheel does not need to be frequently replaced, the maintenance is convenient, and the material and the maintenance cost are saved.

Fig. 25 is a first structural schematic view of the clamping device in the cutting apparatus provided by the embodiment of the present application for clamping the half bar or the edge leather, and fig. 26 is a second structural schematic view of the clamping device in the cutting apparatus provided by the embodiment of the present application for clamping the half bar or the edge leather. As shown in fig. 25 and 26, the cutting apparatus provided in this embodiment further includes a clamping device for grabbing the half-bar or the flaw-piece material, and placing the half-bar or the flaw-piece material on or off the carrier.

Specifically, the clamping device includes: the clamping device comprises a fixing piece 51 and two oppositely arranged clamping jaws 52, wherein at least one clamping jaw 52 is slidably arranged on the lower bottom surface of the fixing piece 51, so that the distance between the two clamping jaws 52 can be adjusted to adapt to semi-rods or edge leather materials with different widths.

When a semi-rod or a flaw-piece material needs to be clamped, adjusting the distance between the two clamping jaws to be larger than the width of the semi-rod or the flaw-piece material, and moving the position of the clamping device to enable the two clamping jaws to be respectively positioned at two sides of the width direction of the semi-rod or the flaw-piece material; and then, adjusting the distance between the two clamping jaws to be smaller until the width direction of the half bar or the edge leather material is clamped. The cutting equipment that this application embodiment provided, realization that can be convenient through clamping device carries out the centre gripping to half stick or flaw-piece material, provides the advantage for the removal of half stick or flaw-piece material.

Specifically, the holding jaw 52 includes: a vertical mounting plate 521 and a jaw body 522. At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed to the inner surface of the mounting plate 521. The jaws themselves are not of unitary construction, but are formed as two separate pieces of mounting plate and jaw body. The vertical mounting plate is a mounting base of the clamping jaw body and is a base on which the clamping jaw can move. Two independent parts of mounting panel and clamping jaw body, at the in-process of clamping jaw body centre gripping raw material stick, the wearing and tearing of clamping jaw body are very serious, only need to change clamping jaw body can, the mounting panel need not be changed.

The cutting wire mentioned in this embodiment is a diamond wire, and is used for cutting a single crystal silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers from large silicon wafers in the prior art are overcome.

The length L of the small silicon rod is greater than the width W and the height H thereof, and the longitudinal direction of the half rod and the small silicon rod can be understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the step of "cutting the half rod" and the step of "cutting the silicon rod" may be performed simultaneously or separately according to the form and the arrangement position of the cutting reel. When the step of "cutting the half rod" and the step of "cutting the silicon rod" are separately performed, the step of "cutting the half rod" is performed first, and then the step of "cutting the silicon rod" is performed.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are cut simultaneously, so that the efficiency is higher.

In some embodiments of the present application, the processing method further comprises the steps of trimming the leather: and cutting the edge leather materials in the direction of which the section is parallel to the axis of the silicon rod, wherein each edge leather material can be cut to obtain an outer edge leather material and at least one middle edge leather material. The outer side leather and the middle side leather are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the present application, the step of "cutting half rod" and the step of "cutting edge skin material" may be performed simultaneously and before the step of "cutting small silicon rod", according to the form and the arrangement position of the cutting wire wheel.

In some embodiments of the present application, the thicknesses of the outer side leather and the middle leather are equal or different, so as to meet the processing requirements of different subsequent products.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied, the tight mechanism in top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod together with stop gear.

Further, the position of the silicon rod is detected through the sensing device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the preset cutting position to cut the silicon rod.

The apparatus structure for cutting a semi-rod or a flaw-piece material provided in this embodiment may also be applied to cutting the silicon rod, for example: the line wheel structure, the detection device, the induction system, the spray lubrication system, the laser alignment system and the like can be used for the equipment.

Further, the present embodiment also provides a grinding apparatus for grinding the square rod or the small silicon rod in the above steps. As shown in fig. 27 to 30, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. The feeding assembly 42 is disposed in the feeding area 401, and a square rod or a small silicon rod to be ground is assembled on the feeding assembly 42 from the feeding area 401 and then delivered to the grinding area 402. The grinding assembly 43 is disposed in the grinding region 402 for grinding the surface and/or corners of a square or small silicon rod.

Taking grinding of the square bar a3 as an example, fig. 28 and 29 show the implementation of the loading assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; alternatively, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Take the second scheme as an example: the square rod a3 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 relative to the sliding table is adjusted to clamp the square rod a 3. The square bar a3 is moved to the model area 402 by moving the slide table and ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged oppositely, the square rod a3 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the square rod a3 from two ends.

As shown in fig. 30, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rods for 45 degrees, and grinding the edges and corners of the small silicon rods; and then sequentially rotating by 90 degrees to grind the other three edges and corners.

The grinding unit 43 is provided with a grinding wheel for grinding the square bar a 3. The grinding wheels include a rough grinding wheel and a finish grinding wheel, which perform rough grinding and finish grinding, respectively, on the square bar a 3.

In the above-described embodiment, the square or small silicon rod is ground, typically by grinding the side surface thereof, and in special cases also by grinding the end surface thereof.

The present embodiment also provides a silicon rod cutting system, including: the cutting device for cutting the silicon rod by the first section to obtain the half rod, the cutting device for cutting the half rod by the second section and the third section to obtain the small silicon rod and the grinding device for grinding the small silicon rod further comprise a cutting device for cutting the edge skin material. And cutting the silicon rod by each cutting device according to the assembly line operation to obtain small silicon wafers.

Claims

1. A method for cutting a silicon rod, comprising:

synchronously cutting the half rod by a second section and a third section which are parallel to the length direction of the silicon rod, wherein the second section is parallel to the first section; the number of the third tangent planes is two, and the third tangent planes are vertical to the second tangent planes so as to obtain the small silicon rod with the rectangular section and the first class of edge leather with a plane and an arc surface connected with the plane.

2. The method of claim 1, wherein the first cut plane passes through the center of the silicon rod, and the two half rods have equal cross-sectional areas.

3. The method of claim 2, wherein the distance between the third cut surfaces is less than or equal to the width of the surface formed by the second cut surface for cutting the half bar.

4. The method of claim 1, further comprising:

and slicing the small silicon rods along the length direction of the small silicon rods by using a section vertical to the length direction of the small silicon rods to obtain a plurality of small raw material pieces.

5. The method of claim 4, further comprising, prior to slicing the small silicon rods:

grinding four side surfaces of the small silicon rod, wherein the side surfaces of the small silicon rod are surfaces parallel to the length direction of the small silicon rod;

and grinding the edge angle between two adjacent side surfaces in the small silicon rod to form a chamfer surface between the two side surfaces.

6. The method of claim 1, further comprising:

cutting the first class of edge leather materials by a fourth tangent plane parallel to the length direction of the silicon rod, wherein the fourth tangent plane is parallel to the plane of the first class of edge leather materials so as to cut off the arc-shaped top of the first class of edge leather materials;

and cutting the first class of edge leather by using a fifth tangent plane parallel to the length direction of the silicon rod, wherein the fifth tangent plane is vertical to the plane of the first class of edge leather so as to cut off the corner part of the first class of edge leather and obtain the edge leather rod with a rectangular cross section.

7. A cutting apparatus to which the silicon rod cutting method according to any one of claims 1 to 6 is applied, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device is provided with a first cutting wire wheel set;

the cutting line wound on the first cutting line wheel set is used for cutting the silicon rod along the first cutting surface or the second cutting surface.

8. The cutting apparatus of claim 7, wherein the wire cutting device further comprises: and the second cutting line wheel set is wound on the cutting line on the second cutting line wheel set and is used for cutting the half-stick along a third section.

9. The cutting apparatus according to claim 7 or 8, wherein the carrier is fixedly arranged on a base; the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to the base under the driving action of the bracket driving mechanism; the cutting wire wheel set is arranged on the wire wheel bracket;

or, the wire cutting device is fixed on the base; the bearing table moves relative to the base under the driving action of the driving mechanism.

10. The cutting apparatus according to claim 7 or 8, wherein the silicon rod is arranged vertically on a carrier table; the wire wheel bracket moves vertically relative to the base;

or the silicon rod is arranged on the bearing table along the horizontal direction, and the wire wheel support moves horizontally relative to the base.

11. The cutting apparatus according to claim 7 or 8, wherein the cutting wire is looped between the pulleys of the set of cutting wires;

or, the wire cutting device further comprises: the wire winding device comprises a wire unwinding mechanism, a wire winding mechanism and a wire arranging mechanism; the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the winding displacement mechanism and the cutting line wheel set.

12. A silicon rod cutting system, comprising:

the cutting device as claimed in any of claims 7 to 11, for cutting a silicon rod with a first cut to give a half-rod; or cutting the arc top of the half-bar by a second section; or cutting the edge corner part of the half bar by using the third section to obtain a small silicon bar;

and grinding equipment for grinding the small silicon rod.