CN214394870U - Silicon rod processing equipment - Google Patents

Silicon rod processing equipment Download PDF

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Publication number
CN214394870U
CN214394870U CN202022111095.8U CN202022111095U CN214394870U CN 214394870 U CN214394870 U CN 214394870U CN 202022111095 U CN202022111095 U CN 202022111095U CN 214394870 U CN214394870 U CN 214394870U
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Prior art keywords
silicon rod
cutting
clamping
wheel
driving
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CN202022111095.8U
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Chinese (zh)
Inventor
苏静洪
李鑫
钱春军
曹奇峰
卢建伟
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Tiantong Rijin Precision Technology Co ltd
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Tiantong Rijin Precision Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Abstract

The application discloses silicon rod processing equipment, wherein a first processing position and a second processing position are arranged on the silicon rod processing equipment, so that silicon rod processing operation can be simultaneously carried out on the two processing positions, and the silicon rod processing efficiency is improved; meanwhile, the cutting device of the silicon rod processing equipment can be switched among different processing areas through the first switching mechanism, the grinding device can be switched among different processing areas through the second switching mechanism, the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the cutting and grinding operation can be realized at any processing area, and the transfer path of the silicon rod among different processes is simplified; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation.

Description

Silicon rod processing equipment
Technical Field
The application relates to the technical field of silicon workpiece processing, in particular to silicon rod processing equipment.
Background
At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.
In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form a single crystal silicon rod; then, processing operations such as surface grinding, chamfering and the like are carried out on each single crystal silicon rod, so that the surface of each single crystal silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, slicing the single crystal silicon rod by using a slicing machine to obtain the single crystal silicon slice.
However, in general, in the related art, operations required for each process operation (for example, cutting and squaring, grinding, chamfering, and the like) are independently arranged, the corresponding processing devices are distributed in different production units or different production areas of a production workshop or a production workshop, the conversion of workpieces performing different process operations requires carrying and allocating, and a pretreatment operation may be required before each process operation is performed, so that the process is complicated, the efficiency is low, the quality of the silicon rod processing operation is easily affected, more manpower or transfer equipment is required, the potential safety hazard is great, in addition, the flow links among the operation equipment of each process are many, the risk of workpiece damage is increased in the workpiece transfer process, disqualification caused by non-production factors is easily generated, the yield of products and unreasonable loss caused by the existing processing mode are reduced, is a major improvement subject faced by each company.
Disclosure of Invention
In view of the above drawbacks of the related art, an object of the present invention is to provide a silicon rod processing apparatus to solve the problems of complicated process and low efficiency in processing a silicon rod in the prior art.
To achieve the above and other related objects, the present application discloses in a first aspect a silicon rod processing apparatus comprising: the silicon rod processing platform is provided with a first processing region and a second processing region; the first silicon rod clamp is arranged on the first processing platform and used for clamping a silicon rod and driving the clamped silicon rod to move along a first direction; wherein the first direction is parallel to the axis direction of the silicon rod; the second silicon rod clamp is arranged on the second processing platform and used for clamping the silicon rod and driving the clamped silicon rod to move along the first direction; the cutting device is arranged on the first conversion mechanism and used for cutting the silicon rod on the first processing position or the second processing position of the silicon rod processing platform to form a cut silicon rod; the first conversion mechanism drives the cutting device to convert the position between a first processing area and a second processing area; the first conversion mechanism is arranged at a first mounting position on the silicon rod processing platform; the grinding device is arranged on the second conversion mechanism and is used for grinding the cut silicon rod on the first processing area or the second processing area of the silicon rod processing platform; the second switching mechanism drives the grinding device to switch positions between the first processing area and the second processing area; the second conversion mechanism is arranged at a second mounting position on the silicon rod processing platform.
The application also discloses a silicon rod processing method in the second aspect, is applied to in the silicon rod processing equipment, silicon rod processing equipment is including frame, cutting device, grinder, first silicon rod anchor clamps and the second silicon rod anchor clamps that have silicon rod processing platform, wherein, first switching mechanism is located to cutting device, grinder locates the second switching mechanism, first silicon rod anchor clamps and second silicon rod anchor clamps correspond respectively and locate the first processing position and the second processing position of silicon rod processing platform, including following step: the cutting device is positioned at the first processing area and the grinding device is positioned at the second processing area; loading a first silicon rod to be cut on a first silicon rod clamp on the first processing position; enabling the first silicon rod clamp to clamp the first silicon rod to be cut and move along the first direction so as to enable the cutting device to feed and cut relative to the first silicon rod to be cut, and obtaining a first cut silicon rod with a quasi-rectangular cross section; wherein the first direction is parallel to the axis direction of the silicon rod; the first switching mechanism drives the cutting device to switch from the first processing area to the second processing area, and the second switching mechanism drives the grinding device to switch from the second processing area to the first processing area; enabling the first silicon rod clamp to clamp the first cut silicon rod and move along a first direction so as to be matched with a grinding device to grind the first cut silicon rod, and obtaining a first ground silicon rod; enabling the second silicon rod clamp to load a second silicon rod to be cut and clamping the second silicon rod to be cut to move along the first direction so as to enable the cutting device to feed and cut relative to the second silicon rod to be cut, and obtaining a second cut silicon rod with a quasi-rectangular cross section; unloading the first ground silicon rod clamped by the first silicon rod clamp and loading a third silicon rod to be cut; the first switching mechanism drives the cutting device to switch from the second processing area to the first processing area, and the second switching mechanism drives the grinding device to switch from the first processing area to the second processing area; and enabling the cutting device at the first processing location to cut the third silicon rod to be cut so as to obtain a third cut silicon rod, and enabling the grinding device at the second processing location to grind the second cut silicon rod so as to obtain a second ground silicon rod.
To sum up, the silicon rod processing equipment of this application has following beneficial effect: the silicon rod processing equipment is provided with a first processing area and a second processing area, so that silicon rod processing operation can be simultaneously carried out on the two processing areas, and the silicon rod processing efficiency is improved; meanwhile, the first conversion mechanism and the second conversion mechanism respectively drive the cutting device and the grinding device to convert the processing positions where the cutting device and the grinding device are located, so that the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the cutting and grinding operation can be realized at any processing position, and the transfer path of the silicon rod among different working procedures is simplified; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation.
Drawings
The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The brief description of the drawings is as follows:
fig. 1 is a schematic view showing the configuration of a silicon rod processing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of a first conversion mechanism of the silicon rod processing apparatus according to an embodiment of the present disclosure.
Fig. 3 is a schematic view of a second conversion mechanism of the silicon rod processing apparatus according to an embodiment of the present application.
Fig. 4 is a schematic structural view of a cutting device of the silicon rod processing apparatus according to an embodiment of the present invention.
Fig. 5 is a schematic structural view of a cutting device of the silicon rod processing apparatus according to an embodiment of the present invention.
Fig. 6 is an enlarged schematic view of a portion a of fig. 5.
Fig. 7 is a schematic view showing a part of the structure of the silicon rod processing apparatus according to the present invention in one embodiment.
Fig. 8a and 8b show a silicon rod clamp of the silicon rod processing device according to the present application in different view directions in one embodiment.
Fig. 9 is a schematic view showing a partial structure of the silicon rod clamp in fig. 8 a.
Fig. 10 is a schematic view showing a partial configuration of a silicon rod processing apparatus according to an embodiment of the present invention.
Fig. 11 is a schematic structural view of a flaw-piece supporting mechanism in an embodiment of the silicon rod processing apparatus according to the present invention.
Fig. 12 is a schematic view showing a configuration of a part of the silicon rod processing apparatus according to the present application in one embodiment.
Fig. 13 is an enlarged view of fig. 8B at B.
Fig. 14 is a schematic view showing the configuration of a silicon rod truncating device in one embodiment of the silicon rod processing apparatus of the present application.
Fig. 15a and 15b are schematic structural diagrams of a loading device of a silicon rod processing apparatus according to the present application in different view directions in one embodiment.
Fig. 16 is a schematic view showing a part of the structure of a loading device of the silicon rod processing apparatus according to the present invention.
Detailed Description
The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.
In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.
Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first silicon rod clamp may be referred to as a second silicon rod clamp, and similarly, a second silicon rod clamp may be referred to as a first silicon rod clamp, without departing from the scope of the various described embodiments. Both the first and the second silicon rod clamp are described as one silicon rod clamp, but they are not the same silicon rod clamp unless the context clearly indicates otherwise. The similar situation also comprises a first machining area and a second machining area, or a first clamping block and a second clamping block, or a first conversion mechanism and a second conversion mechanism, and a first mounting position and a second mounting position.
Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
In the related art for processing a silicon rod, several steps such as cutting, grinding, chamfering, and the like are involved.
In general, most of conventional silicon rods have a cylindrical structure, and are cut by a silicon rod cutting device so that the silicon rods have a quasi-rectangular (including a quasi-square) cross section after cutting, and the processed silicon rods have a quasi-rectangular (including a quasi-cubic) shape as a whole.
Taking a single crystal silicon rod as an example, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting an original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form the silicon single crystal rod with the rectangular-like cross section. Among them, patent publications such as CN105856445A, CN105946127A, and CN105196433A are referred to as a specific embodiment of forming a multi-stage short silicon rod by cutting an original long silicon rod with a silicon rod cutting machine, and patent publication such as CN105818285A is referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section by cutting a cut short silicon rod with a silicon rod cutting machine. However, the process for forming the single crystal silicon rod is not limited to the foregoing technique, and in alternative examples, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. Among them, a specific embodiment of the above-described method for forming a long single crystal silicon rod having a substantially rectangular shape by squaring an initial long silicon rod using an all-silicon-rod squarer is disclosed in patent publication CN106003443A, for example.
After the cylindrical silicon single crystal rod is cut into the quasi-rectangular silicon rod by the squaring equipment, the quasi-rectangular silicon rod can be ground, chamfered and the like by the grinding equipment.
The inventors of the present application have found that in the related art of the processing operation for the silicon rod, the processing devices such as the squaring and the polishing (for example, the surface polishing and the chamfering) are disposed separately and independently from each other, and the conversion of the silicon rod to perform different process operations requires the transfer and preparation and the pretreatment before the processing, which causes problems such as complicated processes and low efficiency.
In view of this, the present application provides a silicon rod processing apparatus and a silicon rod processing method, which integrate a plurality of processing devices in one apparatus through apparatus modification, so as to automatically realize the cutting and grinding (such as surface grinding and chamfering) of the silicon rod, and seamlessly connect the processing operations, thereby saving labor cost, improving production efficiency, and improving the quality of the silicon rod processing operations.
The silicon rod processing equipment comprises a base, a first processing unit and a second processing unit, wherein the base is provided with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing position and a second processing position; the first silicon rod clamp is arranged on the first processing platform and used for clamping a silicon rod and driving the clamped silicon rod to move along a first direction; wherein the first direction is parallel to the axis direction of the silicon rod; the second silicon rod clamp is arranged on the second processing platform and used for clamping the silicon rod and driving the clamped silicon rod to move along the first direction; the cutting device is arranged on the first conversion mechanism and used for cutting the silicon rod on the first processing position or the second processing position of the silicon rod processing platform to form a cut silicon rod; the first conversion mechanism is arranged at a first installation position on the silicon rod processing platform and drives the cutting device to convert the position between a first processing position and a second processing position; the grinding device is arranged on the second conversion mechanism and is used for grinding the cut silicon rod on the first processing area or the second processing area of the silicon rod processing platform; the second switching mechanism is arranged at a second mounting position on the silicon rod processing platform and drives the grinding device to switch positions between the first processing area and the second processing area.
In order to facilitate the explanation of the structural layout and the working mode in the silicon rod processing equipment, a first direction and a second direction are defined, wherein the first direction is the direction of a silicon rod axis (also referred to as a silicon rod axis in the present application) horizontally placed in the silicon rod processing equipment, and the first direction, the second direction and the plumb line direction are perpendicular to each other.
According to the silicon rod processing equipment provided by the application, the cutting device can be switched between the first processing area and the second processing area through the first switching mechanism, the grinding device can be switched between the first processing area and the second processing area through the second switching mechanism, and the silicon rod can finish the cutting and squaring operation procedures in any processing area through the coordination of the cutting device, the grinding device, the first silicon rod clamp and the second silicon rod clamp, so that the procedures of circulation among different procedures are simplified, the equipment is simplified, and the equipment space is reduced; meanwhile, different processing areas on the silicon rod processing equipment can simultaneously carry out processing operations of different procedures, and the processing efficiency is improved beneficially.
Fig. 1 is a schematic structural view of a silicon rod processing apparatus according to an embodiment of the present disclosure.
As shown in the figure, the silicon rod processing apparatus comprises a machine base 10, a cutting device 20, a grinding device 30, a first silicon rod clamp 11, a second silicon rod clamp 12. It should be noted that the silicon rod processing apparatus may optionally comprise further components, for example the view shown in fig. 1, but without being limiting to the silicon rod processing apparatus of the present application.
The machine base 10 serves as a main body part of the silicon rod processing equipment and is used for providing a working platform, and in one example, the machine base 10 is large in size and weight so as to provide a larger mounting surface and firmer overall stability. It should be understood that the machine base 10 may serve as a base for different structures or components of the silicon rod processing equipment for performing processing operations, and the specific structure of the machine base 10 may be changed based on different functional requirements or structural requirements; in some examples, the machine base 10 includes a fixing structure or a limiting structure such as a base, a rod, a column, a frame, etc. for receiving various components of the silicon rod processing apparatus, and the machine base 10 is described herein.
Meanwhile, in some examples, the stand 10 may be an integral base, and in other examples, the stand 10 may include a plurality of independent bases.
The machine base 10 is provided with a silicon rod processing platform, and a first processing area and a second processing area are arranged on the silicon rod processing platform. The first processing area and the second processing area are areas which can be used for cutting, squaring and grinding the silicon rod.
Here, the first silicon rod clamp 11 and the second silicon rod clamp 12 are clamping devices respectively corresponding to the first processing region and the second processing region, and are configured to control movement of the silicon rod, and the silicon rod is clamped and driven to move along a first direction, so that the silicon rod can move along the first direction relative to the cutting device 20 or the grinding device 30, and preset cutting operation and grinding operation are achieved. In an actual scene, at least one silicon rod clamp can be arranged on the first processing position and the second processing position so that the first processing position and the second processing position on the silicon rod processing platform can carry out silicon rod processing operation, and therefore production efficiency is improved.
The cutting device 20 is used for cutting the silicon rod on the first processing region or the second processing region of the silicon rod processing platform to form a cut silicon rod. Here, the cutting device 20 is provided at a first mounting position on the silicon rod processing platform by the first conversion mechanism 43. It should be noted that the area of the silicon rod processing platform is not limited to the physical area of the machine base 10, for example, when the machine base 10 is U-shaped or two bases are disposed in parallel and opposite to each other, the silicon rod processing platform may be, for example, a circumscribed rectangle of the machine base 10, or the silicon rod processing platform includes a receiving space in the machine base 10. The first conversion mechanism 43 may be disposed on the machine base 10; alternatively, the first converting mechanism 43 and the cutting device 20 may be disposed in a hollow area (or a receiving space) of the housing 10, and in this arrangement, the first converting mechanism 43 and the cutting device 20 may be independent from the housing 10, for example, as an independent sale unit. The first switching mechanism 43 drives the cutting device 20 to switch positions between the first processing area and the second processing area, so that any processing area can perform cutting operation.
The grinding device 30 is used for grinding the cut silicon rod at the first processing region or the second processing region of the silicon rod processing platform. The grinding device 30 is disposed at a second mounting position on the silicon rod processing platform by the second switching mechanism 40. Similarly, the second conversion mechanism 40 can be disposed on the stand 10 or disposed in the accommodating space of the stand 10, and in this arrangement, the second conversion mechanism 40 and the grinding device 30 can also be independent from the stand 10, for example, as an independent sale unit. The second switching mechanism 40 drives the polishing device 30 to switch positions between the first processing area and the second processing area, so that any one of the processing areas can perform polishing operation.
Here, the silicon rod processing apparatus may control the processing regions where the cutting device 20 and the grinding device 30 are respectively located, so that the first processing region and the second processing region may respectively perform the cutting operation and the grinding operation at the same time, thereby improving the processing efficiency.
It should be understood that the first mounting position and the second mounting position are not the same position, and correspondingly, the first conversion mechanism 43 and the second conversion mechanism 40 are disposed at different positions of the silicon rod processing platform. The first and second mounting positions should be such that the cutting device 20 and the grinding device 30 do not interfere with each other during the transition between processing positions. In some embodiments, the first and second mounting locations can be disposed between the first and second processing locations. In one implementation, the first mounting position and the second mounting position may be further disposed in a central region between the first processing region and the second processing region. For example, when the first processing region and the second processing region are parallel and symmetrically disposed, the first mounting position and the second mounting position may be disposed on a symmetrical line of the first processing region and the second processing region.
The cutting device and the grinding device are driven by the first conversion mechanism and the second conversion mechanism respectively, so that the positions of the cutting device and the grinding device can be converted between the first processing area and the second processing area relatively independently.
In some embodiments, the first switching mechanism comprises a first rotating shaft along which the cutting device is rotated by a preset angle to switch the position between the first processing location and the second processing location; the second switching mechanism comprises a second rotating shaft, and the grinding device rotates by a preset angle along the second rotating shaft so as to switch the position between the first machining area and the second machining area.
In one implementation, the cutting device is rotated by a preset angle along the first rotating shaft to switch the position between the first processing zone and the second processing zone, and compared with the mode of switching the processing zones by the linear displacement mechanism, in the implementation provided by the application, the structure of the first switching mechanism and the occupied equipment space can be simplified; similarly, the grinding device can simplify the structure of the second conversion mechanism and reduce the equipment space of the second conversion mechanism by rotating a preset angle along the second rotating shaft to switch between different processing areas.
Referring to fig. 1 and 2 in combination, fig. 2 is a partial schematic structural view of a silicon rod processing apparatus according to an embodiment of the present disclosure.
In one embodiment, the first conversion mechanism 43 includes: a support 430 for positioning the cutting device 20; a rotation driving source 432 for driving the cutting device 20 to rotate along the first rotation axis 431 relative to the frame 430 to switch the position between the first processing position and the second processing position.
The bracket 430 may serve as a base of the first converting mechanism 43, and the cutting device 20 may be movably disposed on the bracket 430 based on the first rotating shaft 431, and may be driven by the rotating driving source 432 to rotate along the first rotating shaft 431 relative to the bracket 430. The rotation drive source 432 is, for example, a motor having a power output shaft, which is connectable to the first rotation shaft 431.
In some examples, the bracket 430 may be configured to include two opposite frame bodies, where the two frame bodies may be respectively connected to the first rotating shaft 431, and a gap between the two frame bodies may be used as a moving space for the cutting device 20 to rotate, i.e., the cutting device 20 may not collide with the frame bodies during rotation.
In one embodiment, the second conversion mechanism further includes a rotation driving mechanism for driving the grinding device to rotate, and the rotation driving mechanism includes: the driving gear is coupled to the power driving source; and the driven gear is meshed with the driving gear and is connected with the first rotating shaft.
Referring to fig. 3, a partial structure of a second conversion mechanism of a silicon rod processing apparatus according to an embodiment of the present disclosure is shown.
The driving gear is driven by the driving source 423 to rotate, so as to drive the engaged driven gear 422 to rotate, the driven gear 422 can be used for carrying or connecting the grinding device and the cutting device, or the driven gear 422 can be provided to be integrated with a housing or a cylinder body for connecting the grinding device and the cutting device, for example, the gear teeth of the driven gear 422 are provided on the housing of the second conversion mechanism; the driven gear 422 can drive the grinding device and the cutting device to rotate, in this example, the second rotating shaft 41 can be a wheel axle of the driven gear 422, or the second rotating shaft 41 is connected to the driven gear 422 along the wheel axle direction of the driven gear 422.
In another example, the rotation driving mechanism is a driving motor (not shown) coupled to the second rotating shaft for controlling the first rotating shaft to rotate by a preset angle to switch the grinding device between the first processing area and the second processing area.
It should be noted that in each example provided in the present application, the specific structure of the second rotating shaft is not limited to a shaft body, for example, the second rotating shaft may also be a cylinder, a barrel or a housing for connecting the grinding device, for example, in the embodiment shown in fig. 1, the second rotating shaft is a housing for arranging the grinding device, and it should be understood that the second rotating shaft only needs to rotate along the shaft when the second rotating shaft rotates, so as to realize the switching between the first processing area and the second processing area.
The first conversion mechanism and the second conversion mechanism can relatively independently drive the corresponding cutting device and the grinding device, and the directions of the first rotating shaft and the second rotating shaft can be set to be the same direction or different directions.
In some embodiments, the first axis of rotation is disposed in a first direction and the second axis of rotation is disposed in a plumb line direction; the first processing area and the second processing area are arranged on two opposite sides of the second direction, wherein the first direction, the second direction and the plumb line direction are pairwise perpendicular.
Referring to fig. 1, fig. 2 and fig. 3, the first rotating shaft 431 is disposed in the first direction, and the second rotating shaft 41 is disposed in the plumb line direction, under the configuration, only a certain distance is required between the first installation position and the second installation position of the first converting mechanism 43 and the second converting mechanism 40, which correspond to each other, in the first direction, so as to prevent the cutting device 20 and the grinding device 30 from interfering with each other in the process of converting the machining area.
When the first processing location and the second processing location are parallel and opposite to each other, in an actual processing scene, the cutting device 20 is rotated along the first rotating shaft 431 by a preset angle of, for example, 180 °, so that switching between the two processing locations can be realized. The grinding device 30 is rotated along the second rotating shaft 41 by a predetermined angle, for example, 180 °, to switch between the two machining positions. In one embodiment, in order to make the layout of the silicon rod processing apparatus more compact, the direction in which the grinding device 30 rotates along the second rotating shaft 41 when the processing location is switched is a direction away from the cutting device 20, i.e., the distance between the cutting device 20 and the grinding device 30 in the first direction is reduced; taking the view state shown in fig. 1 as an example, when the grinding device 30 is located in the second processing region, when the grinding device 30 needs to switch the processing region, the rotation direction of the grinding device 30 along the second rotating shaft 41 is clockwise in the top view corresponding to fig. 1.
It should be understood that the grinding device 30 of the silicon rod processing apparatus needs to be configured with a grinding tool for grinding, and generally, the grinding device 30 has a relatively large weight, and the second rotating shaft 41 is arranged in the direction of the plumb line, so that the height of the center of gravity of the grinding device 30 is not changed during the process that the grinding device 30 is driven to rotate, thereby improving the stability of the conversion process, and being beneficial to reducing the work of driving the grinding device 30 by the second conversion mechanism and maintaining the service life of the second rotating shaft 41.
Defining the first direction as the length direction of the base and the silicon rod processing platform, enabling the first rotating shaft 431 corresponding to the cutting device 20 to be arranged in the first direction, and enabling the position of the cutting device 20 in the first direction to be unchanged in the process of converting the processing zone position, that is, enabling the length of the base or the silicon rod processing platform in the first direction to be reduced or realizing more reasonable layout, for example, when the silicon rod processing platform is further provided with a feeding zone position or a waiting zone position and the like for the silicon rod to be cut along the length direction, the feeding zone position or the waiting zone position can be arranged adjacent to the cutting device 20.
In the silicon rod processing equipment of this application, including a plurality of cutting wheels in the cutting device and around in a plurality of cutting wheels are with the cutting coping saw that forms, through first silicon rod anchor clamps or second silicon rod anchor clamps drive the silicon rod and move along first direction, from this can with cutting device can set up to the relative feeding that can realize between cutting coping saw and the silicon rod for the fixed state when carrying out the cutting operation. In the conventional silicon rod processing equipment, a cutting wire saw needs to move in space to cut a silicon rod to be cut, so that a driving device and a guide structure need to be configured for a cutting wheel and a cutting wire to realize feeding of the cutting wire saw relative to the silicon rod; the structure of the cutting device can be simplified, the cutting wheel can be fixed on a main body of the cutting device, such as a cutting frame, and a guide structure and a driving device which enable the cutting wheel to move along the axis direction of the silicon rod can be omitted, so that the structure of the cutting device and the occupied equipment space can be reduced.
In certain embodiments, the cutting device comprises: a cutting frame and at least one wire cutting unit; wherein, at least one line cutting unit is located the cutting frame, line cutting unit includes: the cutting wire is wound around the cutting wheels and the transition wheels to form at least one cutting wire saw.
The cutting frame is connected to first conversion mechanism, the cutting frame is used for setting up the wire-electrode cutting unit, and here, the concrete structure of cutting frame can be based on the arrangement demand of cutting wheel and transition wheel and set as different forms, for example for cylinder, roof beam body, grillage.
In some embodiments, the plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or the plurality of cutting wheels and transition wheels are mounted on the cutting frame through a bracket, a connecting plate, or a mounting frame, and herein, the carrier for mounting the plurality of cutting wheels and transition wheels may be in different forms, which is not limited in this application.
Referring to fig. 4, a schematic view of a cutting device of a silicon rod processing apparatus according to an embodiment of the present disclosure is shown.
In one implementation, the wire-cutting support 23 is disposed on the cutting frame 21 through a limiting structure such as a guide rail or a guide pillar, wherein the guide rail or the guide pillar is disposed along a perpendicular line of a wheel surface of the cutting wheel 221 in the wire-cutting unit 22, so that the disposed wire-cutting unit 22 has a degree of freedom to move along the perpendicular line of the wheel surface of the cutting wheel; with this arrangement, the wire cutting support 23 can be moved by the driving source in the direction perpendicular to the tread of the cutting wheel 221.
When the wire-cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel 221, correspondingly, the cutting wire saw in the wire-cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel, and the cutting wire saw is moved away from or close to the axis of the silicon rod, so that the cutting amount or the cutting position of the silicon rod can be adjusted.
The cutting wheel 221 is provided with at least one cutting line groove for winding the cutting line 223, and the cutting line groove can limit the position of the cutting line 223 so as to control the cutting precision. Any of the cutting wires is formed by winding the cutting wire 223 between two cutting wheels 221, and the position of the two cutting wheels 221 and the position relationship between the cutting wheels 221 can be used to determine the direction of the cutting wire.
The transition wheel 222 is used to divert or guide the cutting line 223, or the transition wheel 222 may be used to adjust the tension of the cutting line 223.
In the silicon rod processing equipment of this application, at the cutting process, the drive the line of cut is followed the line of winding direction and is moved in order to realize the feeding of relative cutting coping saw along silicon rod axis direction by silicon rod anchor clamps drive silicon rod promptly first direction removal, wherein, second direction or plumb line direction can be located to the cutting coping saw.
It should be noted that the cutting wire saw is oriented only in a direction orthogonal to the axis direction of the silicon rod to achieve cutting, and therefore, in a specific scenario, the cutting wire saw is oriented in a vertical plane of the first direction, so as to facilitate control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, and to facilitate description of the arrangement of the structure and components of the cutting device of the present application, the following embodiments are described by taking the example that the cutting wire saw is oriented in the second direction or the direction of the plumb line.
In one embodiment, the wire cutting unit includes: cutting a line; the first cutting wheel and the second cutting wheel are arranged on the cutting frame, and cutting wires are wound on the first cutting wheel and the second cutting wheel to form a cutting wire saw; the wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel; the first transition wheel is adjacent to the first cutting wheel, and the cutting lines of the first cutting wheel and the first transition wheel are positioned in a plane where a first cutting line groove for winding the cutting lines is positioned in the first cutting wheel in the state of pulling the cutting lines; the second transition wheel is arranged adjacent to the second cutting wheel, and the cutting lines of the second cutting wheel and the second transition wheel are positioned in a plane where a second cutting line groove for winding the cutting lines in the second cutting wheel is positioned in the state of drawing the cutting lines; at least one third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and only the cutting wire saw in the cutting device is intersected with the cutting accommodating space.
The direction of the wheel surface of the cutting wheel and the direction of the cutting wire saw have a corresponding relation, and it should be understood that the wheel surface of the cutting wheel is parallel to the plane of any cutting wire groove in the cutting wheel, and the cutting wire saw should be located in the plane of the cutting wire groove for winding the cutting wire for controlling the cutting precision and the stability of the cutting process; meanwhile, in the cutting process, the force application direction of the silicon rod to the cutting line needs to be parallel to the cutting line groove, namely the wheel surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the axis direction of the silicon rod in the squaring operation.
In the cutting device of this application, the cutting coping saw is located second direction or plumb line direction, and is corresponding, the cutting wheel face is on a parallel with second direction and silicon rod axis direction promptly the cutting wheel face is located the horizontal plane direction, or the cutting wheel face is on a parallel with plumb line direction and silicon rod axis direction.
Referring to fig. 5 and 6, fig. 5 is a schematic structural diagram of a wire cutting unit of the cutting device of the present application in an embodiment, and fig. 6 is an enlarged schematic diagram of a point a in fig. 5.
In the example shown in fig. 5, the cutting device includes two-wire cutting units 22 disposed opposite to each other to form two parallel cutting wires. Referring to fig. 6, each wire cutting unit 22 includes a first cutting wheel 221a and a second cutting wheel 221b, and a cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b to form a cutting wire saw.
The first cutting wheel 221a comprises at least one first cutting line groove, and the plane of any first cutting line groove is parallel to the wheel surface of the first cutting wheel; the second cutting wheel 221b comprises at least one second cutting line groove, and the plane of any second cutting line groove is parallel to the wheel surface of the second cutting wheel.
The wheel surface of the first cutting wheel 221a is parallel to or coplanar with the wheel surface of the second cutting wheel 221b, so that when the cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b, the corresponding first cutting wire groove and second cutting wire groove for winding the cutting wire 223 are located in the same plane, and thus, the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire 223 are located at the same time. It will be appreciated that the cutting wire 223 is in operation during the cutting action and thus is defined by the spatial position in which it is located, in the present embodiment the cutting wire 223 is wound between the first cutting wheel 221a and the second cutting wheel 221b, i.e. is a cutting wire.
It will be appreciated that when the cutting line 223 is wound around either cutting wheel, it is intended that the cutting line 223 on both sides of the cutting wheel lie in the plane of the cutting line groove in the cutting wheel in which the cutting line 223 is wound.
When the cutting wire 223 is wound around the first cutting wheel 221a, the cutting wire 223 at one end of the first cutting wire groove is wound around the second cutting wheel 221b to form a cutting wire saw, and the cutting wire 223 at the other end of the first cutting wire groove is wound around the first transition wheel 222 a. The first transition wheel 222a is disposed adjacent to the first cutting wheel 221a, and the cutting line 223 wound around the first cutting wheel 221a is positioned in a plane of the first cutting line groove for winding the cutting line 223 in the first cutting wheel 221a in a state where the cutting line 223 wound around the first cutting wheel 221a is drawn.
When the cutting wire 223 is wound around the second cutting wheel 221b, the cutting wire 223 at one end of the second cutting wire groove is wound around the first cutting wheel 221a to form a cutting wire saw, and the cutting wire 223 at the other end of the second cutting wire groove is wound around the second transition wheel 222 b. The second transition wheel 222b is disposed adjacent to the second cutting wheel 221b, and the cutting line 223 wound around the second cutting wheel 221b is positioned in a plane of a second cutting line groove for winding the cutting line 223 in the second cutting wheel 221b in a state that the cutting line 223 wound around the second cutting wheel 221b is drawn.
The first transition wheel 222a and the second transition wheel 222b respectively have at least one wire guide groove for drawing the cutting wire 223. The first transition wheel 222a and the second transition wheel 222b are respectively disposed adjacent to the first cutting wheel 221a and the second cutting wheel 221b, where the adjacent arrangement may be a left side, a right side, an upper side, a lower side, and the like, which is not limited in this application.
It should be understood that when the cutting line 223 is wound around any cutting wheel or transition wheel, the direction of the cutting line 223 wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire slot or wire guide.
The at least one third transition wheel 222c is arranged between the first transition wheel 222a and the second transition wheel 222b, and is used for drawing the cutting line 223 between the first transition wheel 222a and the second transition wheel 222b, so that a cutting accommodating space is formed in the unit to be cut, the cutting accommodating space can accommodate the silicon rod to be cut, and only the cutting wire saw in the cutting device intersects with the cutting accommodating space.
In the cutting operation, the silicon rod clamp drives the clamped silicon rod to feed along the axis direction of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is the movement range of the silicon rod to be cut in the process that the silicon rod to be cut is in contact with the cutting line 223 from the beginning to move to the cutting line 223 to penetrate through the silicon rod to form the flaw-piece.
The cutting accommodation space can accommodate a silicon rod to be cut and only the cutting wire saw in the cutting device intersects with the cutting accommodation space. It should be understood that during the cutting process, collisions of the silicon rod clamp and the held silicon rod to be cut in motion with other components of the silicon rod processing apparatus, including the cutting line 223 (here the cutting line 223 but the cutting wire saw), are issues to be avoided; meanwhile, in order to achieve cutting, the cutting wire saw is relatively fed with respect to the silicon rod during the movement of the silicon rod clamp holding the silicon rod, and therefore, it should be ensured that the silicon rod and the cutting wire saw are included and included only in the cutting accommodating space.
The first transition wheel 222a, the second transition wheel 222b, and at least one third transition wheel 222c may be used to draw the cutting line 223 in the direction of the cutting line 223, and the cutting line 223 between the first transition wheel 222a and the second transition wheel 222b is drawn by the third transition wheel 222c to form the cutting accommodating space.
In certain embodiments, the first transition wheel 222a, the second transition wheel 222b and the at least one third transition wheel 222c are used to pull the cutting line 223 in a direction away from the silicon rod to be cut. It should be understood that the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a, and the cutting line 223 between the second cutting wheel 221b and the second transition wheel 222b are located in a plane in which the first cutting line groove (or the second cutting line groove) for winding the cutting line 223 is located. In order to form the cutting accommodating space, in one implementation manner, the lengths of the cutting lines 223 between the first cutting wheel 221a and the first transition wheel 222a and between the second cutting wheel 221b and the second transition wheel 222b can be made to be long enough, for example, longer than the length of the silicon rod to be cut, but the cutting frame occupies too much equipment space under the arrangement, and the layout is not reasonable.
In certain embodiments, the first transition wheel 222a, the second transition wheel 222b, and the at least one third transition wheel 222c are used to pull the cutting line 223 away from the cutting accommodating space.
Embodiments are provided in which the cutting accommodating space is formed by the first, second and third transition wheels 222a, 222b and 222 c. In one implementation, a wheel surface of at least one of the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c forms an included angle with a wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, so that the cutting line 223 deviates from a plane where the first cutting line groove (or the second cutting line groove) for winding the cutting line 223 is located.
Taking the example that the cutting device includes two wire cutting units arranged oppositely, as shown in fig. 5, the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c are arranged to be inclined toward a direction away from the cutting accommodating space, or the transition wheels are arranged on the cutting frame at a side away from the cutting accommodating space, so that the cutting line 223 can be far away from the cutting accommodating space, and in this layout, the equipment space required by the wire cutting units can be effectively reduced, and the overall equipment layout of the silicon rod processing equipment is facilitated.
Here, for any one of the wire cutting units, the direction away from the cutting accommodating space is a vector of a perpendicular direction of the wheel surface of the cutting wheel, and taking the embodiment shown in fig. 6 as an example, the directions away from the cutting accommodating space corresponding to two opposite wire cutting units are opposite, and are respectively directions shown by arrows in the figure.
In some embodiments, the tread of the first transition wheel 222a may be at an angle to the tread direction of the first cutting wheel 221a, and the tread of the second transition wheel 222b may be at an angle to the tread direction of the second cutting wheel 221 b. The first transition wheel 222a is only arranged in a direction that the cutting line 223 at the other end of the first cutting wheel 221a is positioned in an intersection line of a plane where the first cutting line groove for winding the cutting line 223 is positioned and a plane where the wire groove for winding the cutting line 223 in the first transition wheel 222a is positioned; and the second transition wheel 222b is only arranged in a direction that the cutting line 223 at the other end of the second cutting wheel 221b is positioned in an intersection line of a plane where the second cutting line groove for winding the cutting line 223 is positioned and a plane where the wire groove for winding the cutting line 223 in the second transition wheel 222b is positioned.
By arranging the first transition wheel 222a and the second transition wheel 222b to form an included angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, the included angle is in a direction that the first transition wheel 222a or the second transition wheel 222b inclines away from the cutting accommodating space, which is beneficial to reducing the number of the third transition wheels 222c required and reducing the length of the wire-cutting support in the first direction.
In some embodiments, the cutting line 223 is wound in an end-to-end manner between the first cutting wheel 221a, the second cutting wheel 221b, the first transition wheel 222a, the second transition wheel 222b, and the third transition wheel 222c to form a closed loop cutting line 223.
The cutting wheel and the transition wheel in the wire-cutting unit are wound by an annular cutting wire, in which case the cutting device can dispense with a wire drum, and the annular cutting wire can be cut by operation of a drive device.
In the existing cutting device, a cutting line is wound from a pay-off drum to a position between a cutting wheel and a transition wheel in a line cutting unit and wound from the line cutting unit to a take-up drum, the cutting line is driven to run in a cutting operation, and the running process of the cutting line is an acceleration process and a deceleration process which are alternately carried out; in the cutting device of the present application, the circular cutting line in the line cutting unit can be kept running at a high speed, and at the same time, the circular cutting line can be run in the same running direction in the cutting work. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the annular cutting line can effectively reduce the total length of the cutting line required by the line cutting unit and reduce the production cost.
In some embodiments, the wire cutting unit comprises two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, one third transition wheel, the other third transition wheel, the first transition wheel and the first cutting wheel to form an endless cutting wire in an end-to-end connection.
Referring to fig. 6, taking the first cutting wheel 221a as an example of the starting point of the winding of the circular cutting line 223, the cutting line 223 is wound from the first cutting wheel 221a to the second cutting wheel 221b, and a cutting wire saw is formed between the two cutting wheels; the cutting line 223 is sequentially wound from the second cutting wheel 221b to the second transition wheel 222b, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a, thereby forming endless windings in an end-to-end relationship, and at the same time, the cutting accommodating space is formed in the wire cutting unit by the drawing guide of the plurality of transition wheels to the cutting line 223.
Of course, it should be understood that the positions where the first, second and third transition wheels 222a, 222b and 222c are disposed with respect to the cutting wheels and the inclination directions of the wheel surfaces are not limited to the illustrated embodiment, and the cutting accommodation space may be formed only when the cutting line 223 is wound between the plurality of cutting wheels and transition wheels of the wire cutting unit. Meanwhile, the third transition wheels 222c of the wire cutting unit may also be arranged in three, four, etc., which is not limited in this application.
In some embodiments, the cutting device further comprises a cutting line driving device for driving the cutting line to operate so as to cut the silicon rod.
The principle of linear cutting is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of linear cutting is achieved. The string drive is used to carry out the string run.
In some embodiments, such as the embodiment shown in fig. 4, the cutting wire driving device 224 is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel, so that the cutting wire can be driven by the wound cutting wheel to move along the winding direction. Of course, in a specific implementation, the string driving device may also be another driving source, such as a hydraulic motor, only when the string is driven to operate, and the application is not limited.
In some embodiments, a tension detection mechanism is further included in the cutting device. In the process of wire cutting, the tension of the cutting wire influences the yield and the processing precision in the process of cutting, and the tension detection mechanism detects the tension and adjusts the tension of the cutting wire to reach a set certain threshold value, and keeps a constant value or a certain range allowed by taking the constant value as a numerical center in the process of cutting.
In one embodiment, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for tension adjustment of the cutting wire when the guided traction of the cutting wire is achieved.
The tensioning wheel is used for adjusting the tension of the cutting line, and the line breakage probability of the cutting line can be reduced so as to reduce consumable materials. In cutting operations, the action of the string is very important, but even the best strings have a limited extension and wear resistance, i.e. the string tapers off during continuous operation until it is finally torn off. Therefore, the existing wire cutting equipment is generally provided with a wire tension compensation mechanism for compensating the extension degree of the cutting wire in the reciprocating motion, and the tensioning wheel is an implementation means.
In some embodiments of the application, the tension detection mechanism comprises at least: a tension sensor, a servo motor and a screw rod; the tension sensor is arranged on the transition wheel, continuously senses the tension value of the cutting line on the transition wheel, and sends out a driving signal when the tension value is smaller than a preset value; the servo motor is electrically connected with the tension sensor and is used for starting to work after receiving a driving signal sent by the tension sensor; one end of the screw rod is connected with the tensioning wheel, the other end of the screw rod is connected with the servo motor, and the transition wheel is pulled to perform unidirectional displacement when the servo motor works so as to adjust the tension of the cutting line.
In certain embodiments, the cutting device further comprises: and the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving the plurality of cutting wheels in the linear cutting unit to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels. The cutting device can realize the switching of the cutting line between different cutting grooves of the cutting wheel based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or the processing specification) relative to the silicon rod.
In some implementations, please refer to fig. 4, fig. 5, and fig. 6, which take a wire cutting unit 22 of the cutting device as an example for description, the wire cutting unit 22 includes a plurality of cutting wheels 221 and transition wheels 222. The carrier for carrying the plurality of cutting wheels 221 and the transition wheel 222 is, for example, the wire-cutting support 23 shown in fig. 5, the distance adjusting mechanism (not shown) can be used for driving the wire-cutting support 23 to move along the perpendicular direction of the wheel surface of the cutting wheel 221 as a whole, the transition wheel 222 and the cutting wheel 221 jointly follow the wire-cutting support 23 to move along the perpendicular direction of the wheel surface of the cutting wheel 221, in this state, the plurality of cutting wheels 221 and the transition wheel 222 are relatively static, that is, the positional relationship between the transition wheel 222 and the cutting wheel 221 is unchanged. In this case, the pitch adjusting mechanism is used to adjust the cutting position of the at least one wire cutting unit 22 relative to the silicon rod.
In some implementations, each cutting wheel has at least two cutting line slots, different cutting line slots being parallel to each other and having a cutting offset between them in the direction of the perpendicular to the wheel face of the cutting wheel. When the distance adjusting mechanism is used for driving the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the position of the cutting wire wound on the wire grooves on the cutting wheels can be changed. In one implementation, the plurality of cutting wheels in the wire cutting unit may be attached to a carriage, for example, wherein the carriage is movably disposed on the wire cutting support and driven by the pitch adjustment mechanism to move in a direction perpendicular to the wheel faces of the cutting wheels.
When the at least one distance adjusting mechanism is used for changing the cutting line to wind around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in an actual scene, the cutting line grooves corresponding to the cutting lines before and after groove changing can be predetermined, for example, the position of the cutting line before groove changing is the cutting line groove a1, the cutting line after groove changing is wound around the cutting line groove a2, the displacement of the plurality of cutting wheels in the at least one distance adjusting mechanism driving line cutting unit to move is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set as the cutting offset between the cutting line groove a1 and the cutting line groove a2, and therefore, the distance adjusting mechanism can be used for changing the cutting line from the cutting line groove a1 to the cutting line groove a 2; it should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit are moved along the perpendicular direction of the wheel surfaces of the cutting wheels by the at least one distance adjusting mechanism is the direction in which the cutting wire groove a2 points to the cutting wire groove a1, and the cutting position of the cutting wire saw in space is unchanged after the groove is changed, so that the silicon rod can be cut according to the preset cutting amount without the step of further calibrating the positions of the cutting wheels or other components, and the groove changing process is simplified.
To further illustrate the implementation manner of the at least one distance adjusting mechanism for moving the plurality of cutting wheels in the linear cutting unit relative to the cutting frame along the direction perpendicular to the wheel surfaces of the cutting wheels, the following embodiments are provided in the present application. When the number of the wire cutting units in the cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed correspondingly.
In one embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit; and the driving source is used for driving the screw rod to rotate.
The single-wire cutting unit is a wire cutting unit, and the single-wire cutting unit in the wire cutting device comprises a plurality of cutting wheels, and the cutting wire is wound on the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjusting mechanism is provided with a far end and a near end, in a specific implementation mode, for example, the near end of the screw rod can be connected to a driving source and driven by the driving source to rotate, the far end of the screw rod is connected to the single-wire cutting unit through threads, the screw rod can rotate based on the transmission of the driving source and converts the rotation of the screw rod into axial displacement through threaded connection by virtue of the connection mode of the two ends of the screw rod, and the axial displacement direction is the arrangement direction of the screw rod, namely the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by driving the screw rod to rotate by the driving source in the distance adjusting mechanism, and the cutting wheel of the single-wire cutting unit can move forwards or backwards in the orthogonal direction of the wheel surface of the cutting wheel by driving the screw rod to rotate in different rotating directions.
In another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the extensible member can set up to body of rod structure and body of rod extending direction be the orthogonal direction of cutting wheel face promptly, the extensible member can be followed its extending direction concertina movement under the drive of driving source, extensible member one end can be connected to the driving source, the telescopic free end is associated the single line cutting unit, can drive under the driving source effect the cutting wheel of single line cutting unit removes in the orthogonal direction of cutting wheel face. The extensible member is for example electric telescopic handle, if the connecting rod for being connected to the cylinder taper rod again, the driving source can be regarded as to the cylinder, and this application does not do the restriction. The telescopic rod can be associated to the single-wire cutting unit in a linear connection or in an indirect connection, for example, can be directly connected to the wire cutting support or cutting wheel support of the single-wire cutting unit, or can be indirectly connected to the single-wire cutting unit through the support or the bearing. It should be understood that the expansion or contraction of the telescopic member may correspond to the advance or retraction of the single-wire cutting unit in the direction orthogonal to the wheel face of the cutting wheel.
Here, in the embodiments provided in the present application, the association may be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above embodiments, the telescopic rod may associate the wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation of the association is not limited thereto, but is intended to realize a transmission in the second direction.
In yet another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving gear rotates under the driving of the driving source, the rack meshed with the driving gear correspondingly moves along the step direction of the rack, in this example, the rack is matched with the driving gear, the rotating motion driven by the driving source can be converted into linear conveying along the direction of the rack, the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel, and the cutting wheel of the single-wire cutting unit can be driven to move along the orthogonal direction of the wheel surface of the cutting wheel. Meanwhile, the rotating direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the wheel surfaces of the cutting wheels.
In an embodiment, the cutting device comprises a first wire cutting unit and a second wire cutting unit which are arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move along the orthogonal direction of the wheel face of the cutting wheel, and the distance between the at least one cutting wire saw in the first wire cutting unit and the at least one cutting wire saw in the second wire cutting unit is adjusted or the cutting wire is changed to wind around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.
The at least one distance adjusting mechanism can be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit so as to drive the plurality of cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit to move along the orthogonal direction of the wheel surfaces of the cutting wheels.
In one embodiment, the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate. The manner in which the lead screw and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the wheel surface of the cutting wheel is similar to that in the foregoing embodiment, and the first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism may be regarded as a single wire cutting unit, which is not described herein again. It should be understood that the arrangement of the pitch adjustment mechanism on any one wire cutting unit can realize the increase and decrease of the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit, and the wire cutting device can cut silicon rods into different specifications.
In another embodiment, the pitch adjustment mechanism comprises: a telescopic member disposed in an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second cutting unit provided with the distance adjusting mechanism may be regarded as a single-wire cutting unit, and specific implementation manners may refer to the foregoing embodiments, and details are not described here.
In yet another embodiment, the pitch adjustment mechanism comprises: a rack bar along an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving source can control the rack to linearly move along the direction of the rack through the transmission gear and the rack which are meshed with each other, and the first linear cutting unit or the second linear cutting unit which is related to the rack can drive the plurality of cutting wheels to move along the orthogonal direction of the wheel surfaces of the cutting wheels through the rack.
In one embodiment, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit and the second wire cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel. In one embodiment, the bidirectional screw is a double-threaded screw, the two ends of the bidirectional screw are respectively provided with threads with opposite thread directions, the driving source can be arranged at any one end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft, and by means of the threads with opposite thread directions at the two ends of the bidirectional screw, when the bidirectional screw is driven to rotate by the driving source, the motion at the two ends of the bidirectional screw is converted into axial linear motion with opposite directions, wherein the axial direction is the orthogonal direction of the wheel face of the cutting wheel of the bidirectional screw. Under the drive of the driving source, the cutting wheels respectively corresponding to the first wire cutting unit and the second wire cutting unit can move in the opposite direction or move in the opposite direction.
In some embodiments, the pitch mechanism is a servo motor provided to the at least one wire cutting unit. In an actual scene, a servo motor is arranged on at least one linear cutting unit or each linear cutting unit of the linear cutting device, and the servo motor controls the displacement of the corresponding linear cutting unit in the orthogonal direction of the wheel surface of the cutting wheel. The linear cutting unit can predetermine the cutting offset of the groove or the adjustment quantity of the cutting position of the cutting line transformation, and the plurality of cutting wheels in the linear cutting unit are driven to move along the orthogonal direction of the wheel surfaces of the cutting wheels by the accurate positioning function of the servo motor with the preset displacement. For example, a single-wire cutting unit is arranged in the wire cutting device, and a servo motor is arranged on the single-wire cutting unit to drive the single-wire cutting unit to move along the orthogonal direction of the wheel surface of the cutting wheel; for another example, the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit is driven by a corresponding servo motor to move relatively independently along the orthogonal direction of the wheel surface of the cutting wheel. In some examples, the servo motor may be replaced by a traveling motor and a traveling screw, and it should be understood that the distance adjusting mechanism is a driving device for driving a plurality of cutting wheels in the cutting unit to move relative to the cutting frame, and the specific form thereof is not limited in this application.
In certain embodiments, the first silicon rod clamp is disposed at the first processing location via a first guiding structure, wherein the first guiding structure is a transfer rail or a guide pillar disposed along a first direction; the second silicon rod clamp is arranged at the second processing position through a second guide structure, wherein the second guide structure is a transfer guide rail or a guide pillar arranged along the first direction.
Referring to fig. 7, a schematic view of a portion of the silicon rod processing apparatus in one embodiment is shown. As shown, either the first or the second silicon rod clamp and its corresponding guiding structure.
For the convenience of the description of the silicon rod processing apparatus of the present application, in the following embodiments provided herein, the term "guiding structure" may refer to either of the first guiding structure or the second guiding structure; the term "silicon rod clamp" may denote either the first or the second silicon rod clamp; that is, the first and second guiding structures and the first and second silicon rod clamps may be distinguished according to the positions of the processing regions, and are similar in specific structure. Of course, the first silicon rod clamp corresponds to a first guiding structure and the second silicon rod clamp corresponds to a second guiding structure; similarly, "processing zone" can refer to either the first processing zone or the second processing zone.
The first guiding structure and the corresponding first silicon rod holder are explained below as an example. In the embodiment shown in fig. 7, the guide means 131 comprises a transfer rail arranged in a first direction, i.e. in the direction of the silicon rod axis, for arranging a corresponding silicon rod holder 11 such that the silicon rod holder 11 is movable along the first transfer rail.
It should be understood that the specific form of the guiding structure 131 is not limited to the embodiment shown in fig. 7, and the guiding structure 131 can be used for arranging the corresponding silicon rod clamp 11 and forming the freedom degree of movement along the axis direction of the silicon rod; in particular implementations, the guide structure 131 includes, but is not limited to, a guide post, a beam, a rail, a channel, and the like.
The length of the guide means 131 determines the displacement range of the corresponding silicon rod clamp 11 in the direction of the silicon rod axis, which can be used at least for the cutting and grinding. In the silicon rod processing equipment, the cutting device and the grinding device do not move along the axis direction of the silicon rod in the cutting state or the grinding state, and the silicon rod clamp 11 drives the silicon rod clamped by the clamp to move along the axis direction of the silicon rod so as to realize the feeding of the cutting line or the grinding tool relative to the silicon rod; correspondingly, the length of the guide structure 131 at least ensures that the displacement range of the corresponding silicon rod clamp 11 can be opened and ground.
In some examples, the guiding structure 131 is configured to have a length equal to that of the base 10, such that when different regions, such as a loading region, a unloading region, a processing region, etc., are respectively disposed in the base 10 along the axis direction of the silicon rod, the silicon rod clamp 11 can drive the clamped silicon rod to move to respectively butt joint with the loading region, the unloading region and the processing region.
It should be understood that in the silicon rod processing device of the present application, the silicon rod held by the silicon rod clamp is moved to realize cutting, and during the cutting process, the silicon rod clamp and the components (including the cutting line) in the cutting device should not collide with each other, and then the specific structure of the silicon rod clamp is related to the cutting device.
In certain embodiments, the at least one cutting wire saw is disposed in a second direction, either the first or second silicon rod clamp comprising: the clamping arm mounting seat is arranged on the corresponding transfer guide rail or guide pillar; the power source is used for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide pillar; the pair of clamping parts are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; the clamping arms are arranged in the horizontal plane direction, and each clamping arm is provided with a near end connected to the clamping arm mounting seat and a far end connected to the clamping part; the clamping arm driving mechanism is used for driving at least one of the pair of clamping arms to move along a first direction so as to adjust the distance between the pair of clamping arms along the first direction.
Referring to fig. 1, fig. 8a and 8b, wherein fig. 8a and 8b are a top view and a perspective view of any one of the silicon rod clamps and the corresponding guiding structure, respectively.
For ease of understanding, the silicon rod holder 11 and the guiding structure 121 located in the first processing zone are described below.
The cutting device 20 comprises two wire cutting units which are oppositely arranged, two parallel cutting wire saws are arranged in the cutting device 20 along the second direction, and two opposite tangent planes along the horizontal plane direction are formed on the surface of the silicon rod to be cut in the process of feeding the silicon rod relative to the cutting wire saws.
The silicon rod clamp 11 comprises a pair of clamping arms 113 for clamping two end surfaces of a silicon rod, wherein the distal ends of the clamping arms 113 are connected with clamping portions 114 for contacting the end surfaces of the silicon rod, the proximal ends of the clamping arms 113 are connected to a clamping arm mounting seat 111, the clamping arm mounting seat 111 is movably arranged on the guide structure and moves along the guide structure under the driving of a power source 112, and thus the clamping arms 113 and the clamping portions 114 at the distal ends of the clamping arms 113 are driven to move along the guide structure; the power source 112 is, for example, a servo motor, and the application is not limited thereto. The silicon rod clamp 11 further comprises a clamping arm driving mechanism 115 for driving at least one of the pair of clamping arms 113 to move in a first direction to adjust a distance between the pair of clamping arms 113 in the first direction, so that the clamping portions 114 respectively connected to the distal ends of the pair of clamping arms 113 can move closer to or away from each other by the clamping arm driving mechanism 115 to perform a clamping or releasing action on the silicon rod. It should be understood that the silicon rod axis is along a first direction, and in order to clamp the silicon rod on two end surfaces of the silicon rod, the distal ends of the pair of clamping arms 113 are respectively opposite to the corresponding clamping portions 114 along the first direction. The pair of clamping arms 113 are arranged along the horizontal direction, and when the power source 112 drives the clamping arm mounting base 111 to drive the clamping arms 113 and the silicon rods clamped by the clamping arms to move along the guide structure, the clamping arms 113 in motion can avoid the cutting wire saw. In other possible implementations, the pair of clamping arms 113 may also be arranged at an angle to the horizontal plane, and the range of movement of the clamping arms 113 is away from the cutting wire saw only during the process of ensuring that the silicon rod clamp 11 is moved to effect cutting.
In some embodiments, the clamp arm drive mechanism 115 includes a lead screw disposed in a first direction and associated with either one of the pair of clamp arms 113; and a driving source for driving the associated clamp arm 113 to move in the first direction.
The lead screw of the clamping arm driving mechanism is provided with a far end and a near end, in a specific implementation mode, for example, the near end of the lead screw can be connected to a driving source and driven by the driving source to rotate, the far end of the lead screw is connected to any one of the pair of clamping arms in a threaded mode, the lead screw can rotate based on the transmission of the driving source and converts the rotation of the lead screw into axial displacement by virtue of the threaded connection through the connection mode of the two ends of the lead screw, and the axial displacement direction is the arrangement direction of the lead screw, namely a first direction; the clamping arms connected with the far ends of the screw rods can move in the first direction by driving the screw rods to rotate through the driving sources, and the screw rods are driven to rotate in the rotating directions to change, so that the related clamping arms can move forwards or backwards in the first direction.
In some embodiments, the clamp arm drive mechanism comprises: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the pair of clamping arms; and the driving source is used for driving the screw rod to rotate so that the pair of clamping arms move towards or away from each other along the first direction.
Referring to fig. 8a and 8b in combination, in one implementation, the two-way screw of the clamping arm driving mechanism 115 is connected to the pair of clamping arms 113 at two ends, and the two-way screw is a double-threaded screw with opposite thread directions at the two ends, the driving source can be disposed at any end of the two-way screw or connected to the two-way screw (for example, in the state shown in fig. 8 b) to drive the two-way screw to rotate along the screw axis, and the two-way screw is driven to rotate by the driving source through the opposite threads at the two ends, so that the two-way screw moves along the screw axis and the first direction in opposite directions. Under the driving of the driving source, the pair of clamping arms 113 can move towards or away from each other in the first direction.
In one embodiment, the clamping arm mounting seat 111 may be a plurality of mounting seats connected by the clamping arm driving mechanism 115, and in the embodiment shown in fig. 8a and 8b, any one of the pair of clamping arms 113 corresponds to one clamping arm mounting seat 111, and the driving source is disposed on the clamping arm mounting seat 111 between the pair of clamping arms 113, where any one of the clamping arms 113 can move along the guiding structure 131; when the silicon rod clamp needs to move integrally along the guide structure 131, for example, the driving source of the clamping arm driving mechanism 115 may control the pair of clamping arms 131 to be relatively stationary, at this time, the connecting action of the clamping arm driving mechanism 115 may make the different clamping arm mounts 111 relatively stationary, and the power source of the silicon rod clamp may drive any one of the clamping arm mounts 111 to move along the guide structure 131, so as to realize the integral movement of the silicon rod clamp.
In yet another implementation, the clamp arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack and the second rack are respectively linked with a clamping arm, the driving gear is connected to a power output shaft (not shown) of the driving motor and meshed with the first rack and the second rack, the driving gear is used for driving the pair of clamping arms to move oppositely to perform clamping action when rotating in the forward direction and driving the pair of clamping arms to move backwards to perform releasing action when rotating in the reverse direction.
In certain embodiments, either one of the first and second silicon rod clamps further comprises a clamping portion rotating mechanism for driving the clamping portion to rotate.
In one implementation manner of this embodiment, the clamping portion 114 corresponding to the pair of clamping arms 113 is provided with a rotatable structure, such as a rotatable base, and the clamping portion rotating mechanism 116 can be configured to drive the clamping portion 114 corresponding to at least one clamping arm 113 to rotate. The clamping part rotating mechanism 116 drives the clamping part 114 to rotate around the first direction as an axis, thereby rotating the clamped silicon rod along the axis of the silicon rod. In the cutting and grinding operation, the holding part rotating mechanism 116 drives the silicon rod to rotate along the axis thereof, so that the position relation of the held silicon rod relative to the cutting wire saw can be adjusted, the cutting surface of the silicon rod by the cutting device can be determined, and the position relation of the held silicon rod relative to the grinding device can be adjusted to determine the grinding surface relative to the silicon rod, namely, the silicon rod clamp can be matched with the cutting device and the grinding device to realize the selection and control of different cutting surfaces and grinding surfaces of the silicon rod.
In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod. In one embodiment, the projection of the clamping portion may be further connected to the clamping portion base by a spring in the first direction, whereby a multi-point floating contact may be formed, so that the silicon rod clamp may adapt to the flatness of the silicon rod end surface when clamping the silicon rod end surface for clamping the silicon rod. In some examples, the clamping end of the clamping portion for contacting the end surface of the silicon rod may also be connected to the clamping portion base by a universal mechanism, such as a universal ball, the clamping portion thereby being adaptable for clamping end surfaces of silicon rods having different inclinations.
In some embodiments, a pair of clamping portions of the silicon rod clamp are provided as rigid structures for contacting the silicon rod portion, so as to prevent the clamped silicon rod from being disturbed during the cutting operation and the grinding operation to affect the processing precision.
Referring to fig. 9, an enlarged view of the clamping portion of the silicon rod clamp of fig. 8a is shown. As shown in fig. 9, the clamping portion 114 includes a rotatable base and a series of protruding contacts 1141 disposed on the base, each of the contacts 1141 having a contact plane. The circular truncated cone rotates under the driving of the clamping part rotating mechanism 116, and in an implementation manner of this embodiment, the protruding length of the contact 1141 is adjustable in the position in the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact 1141 can be adjusted according to the end surface of the silicon rod for each contact surface and the end surface of the silicon rod to be in a tight contact state.
In an embodiment of the present application, one of the clamping portions corresponding to the pair of clamping arms may further be provided with a pressure sensor to adjust a protruding length of a contact based on the detected pressure state, or, alternatively, the clamping arm driving mechanism may be controlled based on detection data of the pressure sensor to determine a distance between the pair of clamping arms in the first direction. Generally, in the process of clamping a silicon rod, a pair of clamping arms of a silicon rod clamp are driven by a clamping arm driving mechanism to approach each other along a first direction until a clamping part is contacted with the end surface of the silicon rod to be clamped, and when the clamping end is provided with a plurality of contact points and the pressure value of partial contact points contacting with the end surface of the contacted silicon rod is detected to be less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact points (generally towards the approaching direction of the end surface of the silicon rod); or, in the process of clamping the silicon rod, the clamping arm driving mechanism drives the end surfaces of the pair of clamping arms facing the two ends of the silicon rod to approach each other so as to realize clamping, after the clamping end is contacted with the end surface of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the clamping arm driving mechanism controls the pair of clamping arms to stop moving oppositely, so that the clamping state of the silicon rod can be maintained.
In certain embodiments, the at least one cutting wire saw is disposed in a direction along the plumb line. In some embodiments, wherein the cutting wire saw is disposed in a direction of the plumb line, either the first or second silicon rod clamp comprises: the clamping arm mounting seat is arranged on the corresponding transfer guide rail or guide pillar; the power source is used for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide pillar; the pair of clamping parts are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; a pair of clamping arms arranged in a plane perpendicular to the second direction, wherein each clamping arm is provided with a near end connected to the clamping arm mounting seat and a far end connected to the clamping part; the clamping arm driving mechanism is used for driving at least one of the pair of clamping arms to move along the first direction so as to adjust the distance between the pair of clamping arms in the first direction.
Here, the clamp arm mounting seat, the pair of clamping portions, and the clamp arm driving mechanism of the silicon rod clamp may refer to the foregoing embodiments, and detailed descriptions thereof are omitted. It should be noted that the pair of clamping arms of the silicon rod clamp are arranged in a plane perpendicular to the second direction, so that the clamped silicon rod contacts the cutting wire saw and the pair of clamping arms is separated from the cutting wire saw during the movement of the clamped silicon rod along the guide structure. In other possible implementations, the pair of clamping arms may be arranged in other directions, and the movement range of the clamping arms is separated from the cutting wire saw only when the silicon rod clamp is ensured to move to realize cutting.
In some embodiments in which the cutting wire saw is arranged in the direction of the plumb line, either one of the first and second silicon rod clamps further comprises a clamp rotating mechanism for driving the clamp to rotate; for specific implementation, reference may be made to the foregoing embodiments, which are not described herein again.
In some embodiments where the cutting wiresaw is positioned in a direction along the plumb line, the clamp arm drive mechanism comprises: the screw rod is arranged along a first direction and is associated with any one of the pair of clamping arms; the driving source is used for driving the associated clamping arm to move along a first direction; for specific implementation, reference may be made to the foregoing embodiments, which are not described herein again.
In some embodiments where the cutting wiresaw is positioned in a direction along the plumb line, the clamp arm drive mechanism comprises: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the pair of clamping arms; the driving source is used for driving the screw rod to rotate so that the pair of clamping arms move towards or away from each other along a first direction; for specific implementation, reference may be made to the foregoing embodiments, which are not described herein again.
And cutting is realized by coordinating the relative movement between the cutting device and the corresponding silicon rod clamp in the first processing area and the second processing area. In some examples, a feeding location and a discharging location are further provided in the silicon rod processing apparatus, for example, as shown in fig. 1, when the feeding location and the processing location are disposed adjacent to each other along a first direction, the silicon rod clamp always clamps the silicon rod to be cut from the feeding location and then transfers the silicon rod to be cut to the processing location along the arrow direction shown in the figure.
It should be understood that during cutting, the silicon rod is at one side facing the axis of the cutting wheel relative to the feeding direction of the cutting wire saw, so as to prevent the cutting wire from being pulled out of the cutting wire groove during cutting, and in the embodiment shown in fig. 1, the silicon rod clamp should drive the silicon rod to be cut to feed relative to the cutting wire saw in the direction of the arrow shown in the figure so as to realize cutting.
In some implementation scenarios, the pitch adjustment mechanism may also be configured to move the cutting wire saw to avoid the silicon rod to be cut, for example, when the cutting device includes two wire cutting units disposed opposite to each other, two sides may be formed on the surface of the silicon rod in one cutting, the silicon rod clamp needs to drive the silicon rod to rotate along the axis thereof by a certain angle, and then the cutting wire saw performs a second cutting on the silicon rod to obtain a cut silicon rod with a rectangular or quasi-rectangular cross section. After having carried out the cutting for the first time, the silicon rod anchor clamps drive the silicon rod of centre gripping and shift in order to get back to the one side that closes on the material loading position along first direction, roll adjustment mechanism can drive the cutting coping saw and remove in order to avoid interfering with each other with the silicon rod along the direction of keeping away from the silicon rod, works as the one side that closes on the material loading position is got back to the position of silicon rod, and the silicon rod is relative the direction of feed of cutting coping saw is the one side towards cutting wheel axle center, can carry out the second side cutting based on the position of cutting amount readjustment cutting coping saw that predetermines the silicon rod, obtains the silicon rod after the cutting from this.
In some embodiments, the silicon rod processing apparatus further comprises a flaw-piece discharge area, and the flaw-piece discharge area can be arranged adjacent to the processing area along the first direction. Referring to fig. 10, a schematic view of a portion of a silicon rod processing apparatus according to an embodiment of the present disclosure is shown. In this case, in order to facilitate the transfer of the flaw-piece, the silicon rod holder may be moved in a direction toward the flaw-piece discharging area (i.e., in the direction of the arrow shown in fig. 10) with respect to the cutting wire saw, so that the flaw-piece discharging process may be simplified or the structure for discharging the flaw-piece may be simplified.
In certain embodiments, the silicon rod processing apparatus further comprises a flaw-piece supporting mechanism for supporting the flaw-piece formed by cutting against the outer side of the silicon rod.
In the actual production, the flaw-piece formed by cutting is removed, so that the silicon rod after cutting is prevented from colliding with the flaw-piece in the process of transportation, and meanwhile, the flaw-piece is removed, so that the silicon rod can be recycled. In the silicon rod processing equipment of this application, the silicon rod that treats that the silicon rod anchor clamps centre gripping is horizontal state, and the flaw-piece that forms from this cutting is also horizontal. In this example, the edge skin needs to be supported during cutting to assist in the removal of the edge skin; simultaneously, be horizontal silicon rod and no longer receive the clamping-force of silicon rod anchor clamps at the flaw-piece that forms in the cutting, before the line saw does not run through the silicon rod completely, the connection part of flaw-piece and silicon rod probably receives the moment effect that the gravity of flaw-piece formed and splits (also can be called and collapses the limit), so, the flaw-piece supporting mechanism of this application still can be through the bearing the flaw-piece is in order to prevent to collapse the limit.
In some embodiments, the flaw-piece holding mechanism comprises: a holding assembly comprising: the supporting part is abutted and supports the flaw-piece; the cylinder or the hydraulic pump comprises a telescopic part which is connected with the bearing part so as to control the bearing part to be far away from or abut against the flaw-piece; an installation part for connecting the bearing component to the cutting frame.
The support assembly may be connected to the cutting frame by the mounting portion, which in some examples may be detachably connected to the cutting frame, and the mounting portion may be located at different positions on the cutting frame based on the need for the silicon rod support position.
The supporting component comprises a supporting part which is used for contacting and abutting against the silicon rod to realize the supporting function of the flaw-piece, and it should be noted that in each embodiment of the application, the supporting function is to apply a force to the flaw-piece to maintain the stable state of the flaw-piece, taking the cutting wire saw as an example in the second direction, the flaw-piece formed by cutting is positioned on the upper side or the lower side of the silicon rod, and at the moment, the supporting part can provide a supporting force to the flaw-piece on the lower side of the silicon rod to prevent the flaw-piece from breaking, so that the flaw-piece can be maintained in the stable state; and when the cutting wire saw is arranged in the direction of the plumb line, the cutting edge skin is positioned at the side (left side or/and right side) of the silicon rod, the supporting part can be arranged into a structure matched with the cambered surface at the outer side of the silicon rod so as to provide supporting force for the edge skin, or the supporting part is abutted against the edge skin so that the edge skin is subjected to upward friction force to maintain a stable state. The cylinder or the hydraulic pump of the bearing component is a driving source for driving the bearing part to be far away from or abut against the flaw-piece, in one implementation mode, the telescopic part of the cylinder or the hydraulic pump is connected with the bearing part, the telescopic direction of the telescopic part is, for example, the direction far away from or close to the axis of the silicon rod, and therefore the connected bearing part is driven to be far away from or abut against the flaw-piece.
The supporting part can be arranged into different structures to realize the supporting function, for example, the supporting part can be a supporting plate and is provided with an arc surface used for contacting the flaw-piece, or the supporting part is a supporting plate provided with a folded edge to prevent the flaw-piece from rolling, for example, the section of the supporting plate is in an open inverted trapezoid shape; it should be understood that there are a variety of implementations of a bearing that can be used to implement a flaw piece bearing, and that this application is not intended to be limiting.
For the realization with the stable bearing of the flaw-piece that the cutting formed in order to prevent the flaw-piece fracture, or for simplifying the flaw-piece and unload the transportation, this application still provides following implementation:
in one example, the bearing part comprises at least two bearing blocks which are arranged at intervals along the first direction and are provided with bearing surfaces used for contacting and bearing the side leather. The bearing surface of the bearing block can be provided with a cambered surface to adapt to the supported flaw-piece, or can be provided with contact planes with different levelness to prevent the flaw-piece from rolling.
It should be understood that in some processing scenarios, the supporting of the flaw-piece can be realized by one supporting block; here, this application still provides the embodiment of realizing the flaw-piece bearing through two at least bearing blocks that set up along the first direction interval, through setting up can realize the bearing to the flaw-piece that the silicon rod cutting of different length specifications formed between two at least bearing blocks along the interval or the span of first direction, and simultaneously, the bearing piece that sets up by the interval carries out the bearing to the flaw-piece and can makes the flaw-piece receive the effort of supporting portion in different length direction (be first direction), is favorable to preventing that the cutting coping saw from not running through the silicon rod in front of the skin fracture. After the cutting wire saw penetrates through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used for supporting the edge skin to prevent the edge skin from inclining to fall.
In yet another example, the bearing portion includes: at least two supporting rods arranged along the first direction and used for contacting and supporting the flaw-piece; the connecting parts are arranged on two opposite sides of the cutting frame in the first direction to correspond to two opposite ends of the bearing rods and are used for connecting the at least two bearing rods and the telescopic parts.
Fig. 11 is a schematic view showing a partial structure of a silicon rod processing apparatus according to an embodiment of the present disclosure. As shown in the figure, the supporting portion includes two supporting rods 5111 arranged at intervals along the second direction, and the rod body of the supporting rods 5111 is along the first direction.
Here, the supporting function of the flaw-piece can be realized by the at least two supporting rods 5111, and it should be understood that the flaw-piece can be supported by positioning the center of gravity of the flaw-piece formed by cutting between the at least two supporting rods 5111; meanwhile, any one of the supporting rods 5111 is in line contact with the supporting flaw piece, and under the arrangement, the friction force of the supporting part in contact with the flaw piece can be reduced.
The connecting portions 5112 are respectively arranged on two sides of the bearing rod 5111, so that the bearing rod 5111 is stressed symmetrically when the bearing portion is stressed far away from or close to the silicon rod, and the structural stability of the bearing portion is improved. In the embodiment shown in fig. 11, the connecting portion 5112 is respectively connected to the supporting rod 5111 and the telescopic portion 512, wherein one end of the telescopic portion 512 is connected to the cutting frame through the mounting portion, and the free end of the telescopic movement is connected to the connecting portion 5112 to drive the supporting portion to move along the telescopic direction of the telescopic portion 512.
In the example of FIG. 11, the receiver is controlled to move in the direction of the plumb line to move away from or toward the flaw-piece; it should be understood that when the cutting device is used to cut a different wire saw orientation, or when the support portion is different in structure, the corresponding telescoping portion 512 of the flaw-piece support mechanism can be disposed in different orientations to accommodate the need for supporting a flaw-piece. For example, when the cutting wire saw of the cutting device is oriented along the plumb line, the extension portion 512 can be configured to extend and retract along a second direction, for example, such that the support portion moves in the second direction to approach or move away from the flaw-piece. It is right the direction of the controlled motion of bearing portion, this application does not do the restriction, only as the order bearing portion realizes can to the bearing effect of flaw-piece.
The number of the flaw-piece supporting mechanisms can be set corresponding to the supporting requirement of the flaw-pieces, for example, when the cutting device comprises a cutting wire saw, a flaw-piece is correspondingly formed in one cutting operation, and a flaw-piece supporting mechanism can be arranged on the cutting frame to support the flaw-piece; for another example, when the cutting device includes two parallel cutting wire saws, two edge skins are correspondingly formed in one cutting operation, and two edge skin supporting mechanisms can be disposed on the cutting frame to respectively support the edge skins on two sides of the silicon rod.
In some embodiments, the silicon rod processing equipment further comprises a flaw-piece dislocation mechanism disposed in the first processing region and the second processing region, and configured to push the flaw-piece in a first direction to separate the flaw-piece from the flaw-piece supporting mechanism. The cutting device can be switched between a first processing position, namely a second processing position, by a first switching mechanism, in one example, the flaw-piece dislocation mechanism can be respectively arranged in the first processing position and the second processing position, and after the cutting device is transferred to any processing position, the flaw-piece dislocation mechanism on the processing position can push the flaw-piece formed after cutting to help realize the unloading of the flaw-piece.
In other embodiments, the flaw-piece dislocation mechanism can be arranged on the cutting frame, and the flaw-piece dislocation mechanism can rotate under the driving of the first conversion mechanism along with the cutting frame, so that the flaw-piece formed after cutting can be pushed at any processing position. In some embodiments, when the cutting wire saw is disposed in the cutting device along the second direction, the edge skin supporting mechanism can be disposed on the upper side and the lower side of the cutting frame, respectively, so that the cutting device has a corresponding edge skin dislocation mechanism capable of pushing the edge skin for the lower edge skin formed by cutting the silicon rod in the process of converting the machining region.
It should understand, treat that cutting silicon rod axis direction is along first direction, and the flaw-piece that forms in the cutting also follows first direction under by the bearing state, flaw-piece dislocation mechanism can follow first direction and promote the flaw-piece so that the relative flaw-piece supporting mechanism motion of flaw-piece to make the flaw-piece break away from flaw-piece supporting mechanism and can carry out subsequent transportation flow to the flaw-piece.
In one implementation, the flaw-piece dislocation mechanism comprises an air cylinder or a hydraulic pump, wherein a telescopic rod of the air cylinder or the hydraulic pump is arranged along a first direction.
Referring to fig. 10 and 11, as shown in the drawings, the flaw-piece dislocation mechanism 54 is disposed on the silicon rod processing platform, the flaw-piece dislocation mechanism 54 is a cylinder 541 having a telescopic rod, and the telescopic rod is disposed along a first direction and aligned to the flaw-piece end surface. After the cutting wire saw penetrates through the silicon rod to form an independent flaw-piece, the flaw-piece dislocation mechanism 54 moves along the first direction to abut against the end face of the flaw-piece and pushes the flaw-piece to move, so that the flaw-piece can be separated from the flaw-piece supporting mechanism or separated from the cut silicon rod. Here, the extension range of the telescopic rod of the flaw-piece aligning mechanism 54 may be determined based on the length specification of the silicon rod, or based on the span of the supporting portion in the flaw-piece supporting mechanism in the first direction, so as to ensure that the flaw-piece can be detached.
In certain embodiments, the silicon rod processing device further comprises a flaw-piece conveying structure for receiving the flaw-pieces formed by cutting and conveying the flaw-pieces to a discharge area. Here, the discharge zone is the flaw-piece discharge zone.
In one embodiment, the edge skin conveying structures are respectively arranged in the first processing area and the second processing area, so that the edge skin formed by cutting the silicon rod by the cutting device switched to any one processing area can be conveyed by the edge skin conveying structure corresponding to the processing area, and the transfer of the edge skin can be reduced.
With continued reference to fig. 10, the direction and position of the edge strip feeding mechanism 52 can be determined by the positional relationship between the cutting area and the edge strip discharge area. In the silicon rod processing device of the present application, the cutting zone is a first processing zone and a second processing zone. In an embodiment, the flaw-piece unloading area and the cutting area are adjacently arranged along a first direction, and here, the flaw-piece conveying structure can be arranged along the first direction and respectively butt-jointed with the silicon rod clamps corresponding to the first processing area and the second processing area, so that after the silicon rod clamped by the silicon rod clamps is cut to form a flaw-piece, the flaw-piece is pushed along the first direction to be separated from the cut silicon rod or the flaw-piece bearing mechanism and then is transferred to the flaw-piece conveying structure corresponding to the processing area, and therefore the transfer path of the flaw-piece can be simplified.
In certain embodiments, the flaw-piece conveying mechanism is a chain conveying mechanism, a double speed chain mechanism, or a conveyor belt mechanism.
In one embodiment, the flaw-piece delivery mechanism comprises: the conveying part is used for bearing the flaw-piece; and the conveying driving source is used for driving the conveying part to move so as to convey the flaw-piece.
In one embodiment, the hide delivery mechanism 52 includes: a conveying part 521 for carrying the flaw-piece; a conveying driving source 522 for driving the conveying part 521 to move to convey the edge leather.
In some examples, in order to avoid the flaw-piece from being worn by collision during the conveying process, in some embodiments, the conveying part 521 is provided with a buffer pad for contacting with the flaw-piece, or the conveying part 521 is made of a buffer material. The cushion or cushioning material is, for example, rubber, silicone or other material having elastic deformation, damping or cushioning properties.
As shown in fig. 10, the conveying unit 521 may be disposed along a first direction and may transport the loaded edge leather along the first direction under the driving of the conveying driving source 522. The conveying driving source 522 is, for example, a motor, and is configured to drive the conveying unit 521 to move and control the conveying speed of the conveying unit 521.
In the silicon rod processing equipment of this application, make the silicon rod anchor clamps drive the silicon rod of centre gripping and remove in order to cut formation back silicon rod along the first direction after, through second change mechanism drive grinder converts to cutting back silicon rod place processing position, and grinder can grind the operation to cutting back silicon rod.
In certain embodiments, the grinding apparatus comprises at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are located in opposing horizontal planes; and the grinding tool advancing and retreating mechanism is used for driving at least one of the pair of grinding tools to move along the direction of the plumb line.
Referring to fig. 12, a schematic structural view of a portion of the silicon rod processing apparatus according to an embodiment of the present disclosure is shown. The pair of grinding tools 301 are disposed opposite to each other in the direction of the perpendicular line to form two opposite grinding surfaces in the direction of the horizontal plane. In certain implementations, the abrasive article 301 includes a grinding wheel and a rotating shaft. In certain embodiments, the grinding wheel is circular and has a through hole disposed in the middle. The grinding wheel is connected to the rotating shaft to rotate along the rotating shaft in a controlled mode, so that the side face of the silicon rod to be cut can be contacted in a rotating state to achieve grinding. It should be understood that in a possible embodiment, the grinding device 30 may also include a grinding tool 301, but the grinding time is increased in this arrangement.
The grinding wheel has certain granularity and roughness, and is formed by consolidating abrasive particles and a binding agent, so as to form a surface with the abrasive particles to contact and grind the side surface of the cut silicon rod. The grinding wheel has certain abrasive particle size and abrasive particle density, and the abrasive materials can be set into abrasive particles with hardness larger than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding a silicon rod.
In an embodiment of the present application, the grinding device 30 further includes a cooling device (not shown) to cool the grinding tool 301, so as to reduce damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and the service life of the grinding wheel. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole. In some embodiments, the grinding wheel is provided with a shield around its circumference to prevent cooling water from entering the rotary drive motor. One end of the cooling water pipe is connected with a cooling water source, the other end of the cooling water pipe is connected to the surface of the protective cover of the grinding wheel, the diversion groove is arranged on the protective cover and serves as a contact point of the protective cover and the cooling water pipe, and the diversion hole is formed in the cooling groove. The cooling water pumped by the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel and is guided to the contact surface of the grinding wheel and the ground silicon rod for cooling, and the cooling water in the diversion hole rotated by the grinding wheel enters the grinding wheel for sufficient cooling under the centrifugal action during grinding of the grinding wheel.
The grinding tool advancing and retreating mechanism 302 is configured to drive at least one grinding tool 301 of the at least one pair of grinding tools 301 to move along the direction of the plumb line, so as to adjust the grinding amount of the cut silicon rod. In some embodiments, the sharpener advancing and retracting mechanism 302 comprises: a driving and reversing guide rail provided in the second conversion mechanism along the plumb line direction, for setting the grinding wheel 301; a driving source for driving at least one of the grinding stones 301 to move along the advancing and retreating guide rails.
In one implementation, the sharpener advancing and retracting mechanism 302 includes a sliding guide, a drive motor, and a ball screw (not shown). The sliding guide rail is arranged on the second conversion mechanism along the direction of the plumb line, the grinding tool 301 is provided with a guide groove matched with the sliding guide rail along the direction of the plumb line, and the ball screw is arranged along the sliding guide rail and is in shaft connection with the driving motor. In other possible implementations, the driving source may also be configured as an air cylinder, a hydraulic pump, etc., and the telescopic direction thereof is configured as a plumb line direction; still alternatively, the driving source may be provided as a lead screw assembly including a lead screw connected to the grinder 301 to move the grinder 301 along the slide guide under the driving of the rotary driving source, and a rotary driving source.
In some embodiments, the grinding tool advancing and retreating mechanism includes a bidirectional screw rod and a driving source, wherein two sides of the bidirectional screw rod are provided with threads with opposite turning directions, the bidirectional screw rod is arranged along the direction of the plumb line, and two sides of the bidirectional screw rod are respectively connected to a grinding tool.
Generally, a grinding tool is in a fatigue state during use, uneven wear of different areas of the surface of the grinding tool causes uneven or reduced flatness of the surface of the grinding tool, and the surface of the grinding tool may be contaminated with silicon rod chips or grinding tool chips, so that the surface state of the grinding tool is not changed after long-term grinding operation, and the grinding performance is reduced. In order to prolong the service life of the grinding tool, tools such as a grinding stone and the like can be adopted to correct the surface of the grinding tool, or the grinding tool can be replaced after the grinding tool reaches the fatigue life.
The silicon rod processing equipment further provides a grinding repair device which can be used for grinding and repairing a grinding tool so as to ensure that the grinding tool can achieve required precision after being used for grinding the silicon rod, wherein the grinding repair device comprises an installation main body and at least one grinding part; the grinding part is arranged on the mounting main body and used for grinding the corresponding grinding tool.
In certain embodiments, either the first or second silicon rod clamp further comprises a grinding repair device for dressing a grinding tool in the corresponding grinding device.
Referring to fig. 13, which is an enlarged schematic view of B in fig. 8B, as shown in the figure, the grinding repair device is disposed on the silicon rod clamp, that is, the mounting body 321 of the grinding repair device is disposed on one of the clamping arms of the silicon rod clamp, and the thinning portion 322 of the grinding repair device is disposed on a side of the mounting body 321 facing the grinding tool. For example, in the embodiment shown in fig. 13, the thinning portions 322 are respectively located at the upper side and the lower side of the clamping arm and respectively face the upper side and the lower side of the grinding tool. The mounting body 321 and the thinning portion 322 thereon are driven by a corresponding silicon rod clamp (a first silicon rod clamp or a second silicon rod clamp) to reciprocate along a first direction.
In other embodiments, an installation body of the grinding and repairing device may be disposed on a base of the silicon rod processing apparatus, a thinning portion of the grinding and repairing device may be disposed on the installation body, and the grinding and repairing device may further include a driving unit for driving the installation body and the thinning portion thereon to reciprocate in a predetermined direction.
Referring to fig. 12 and 13, the grinding portion 322 of the grinding repair device has a surface for contacting with a grinding tool, and in some embodiments, the grinding portion 322 has high adhesion, wear resistance, and hardness for grinding the grinding tool.
In certain embodiments, the thinning 322 is oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.
In some embodiments, when the at least one grinding portion grinds the corresponding at least one grinding tool, the at least one grinding tool is driven by the driving motor to rotate.
Compared with the traditional grinding mode, the grinding tool is usually contacted with a grinding device such as an oilstone to realize grinding in a rotating state, so that the surface of the oilstone has high and low points, and the flatness of the surface of the grinding tool after the grinding is finished is not good; in the embodiment provided by the application, the grinding part such as the oilstone in the grinding and repairing device provided by the application grinds in the reciprocating motion, the plane formed by the oilstone in the reciprocating motion is different from the plane of the oilstone in the static state, and the surface of the oilstone (namely the plane for grinding) in the reciprocating motion has no height point, so that the surface of the grinding tool can be leveled, and the grinding quality is improved; moreover, the grinding efficiency is related to the rotating speed of the workpieces during grinding, and the grinding part in a reciprocating motion state corresponds to the grinding tool in a rotating state, so that relative motion can be generated between the grinding tool and the grinding part, the grinding process is easy to realize, and the grinding efficiency is improved.
In some embodiments, the grinding surface of the grinding portion is rectangular, circular, oval, annular, regular polygon or other customized shapes, and it should be understood that the grinding and repairing can be realized only when the grinding portion is made of a preset material meeting the grinding requirement and can realize surface contact with the grinding tool, and the above shapes are only optional examples, and the application is not limited thereto.
In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod processing equipment.
The grinding repair device is intended to repair a grinding surface of a grinding tool, and after the grinding repair is performed through a grinding portion, a surface layer of the grinding tool is ground and removed. In the subsequent surface grinding of the silicon rod, the silicon rod side is ground with a new grinding surface. It should be noted here that in the operation of grinding the silicon rod, it is necessary to control the grinding amount of the silicon rod, which may be predetermined based on the specification of the silicon rod processing apparatus and the specification of the silicon rod, for example, in the silicon rod processing apparatus, the grinding tool may be generally moved in a feeding manner with respect to the silicon rod, and in the control system of the silicon rod processing apparatus, the initial position at which the grinding surface of the grinding tool is located may be used as a known input value (or may be calculated from a plurality of input values), whereby the feeding of the grinding tool with respect to the silicon rod may be controlled based on the preset grinding amount. However, after the grinding tool is ground by the grinding repair device, the initial position of the grinding surface is changed, so that the silicon rod processing equipment needs to know the specification of the grinding tool in grinding repair, so as to correct the actual position of the grinding surface, and thus the grinding amount of the silicon rod can be controlled according to a preset value in subsequent processing.
Here, the sensor device in the grinding repair apparatus of the example of the present application may be used to determine the size (mainly, the thickness) of the grinding tool after the grinding repair is completed. The sensor device can determine the size of the ground tool after grinding by determining the distance between the sensor and the ground surface or the distance between two ground surfaces of a pair of oppositely arranged ground tools.
In one implementation, the sensing device is a touch sensor having a probe head for contacting the abrading surface. In a practical scenario, the grinding tool of the silicon rod processing apparatus may move relative to the thinning portion, and the feeding movement may be driven by a servo motor, for example, where the servo motor may control a feeding amount of the grinding tool, but in the grinding and repairing process, the feeding amount determined by the servo motor control is not equal to a layer thickness of the grinding tool ground in the thinning process, or it may be understood that an accurate grinding amount of the grinding and repairing process cannot be obtained by the feeding control device of the grinding tool, that is, an actual size specification of the grinding tool needs to be obtained by measurement.
In the case where the grinding and repairing apparatus is provided with two opposite grinding portions, the contact sensor may be provided with two detecting heads at both ends thereof, respectively, for contacting two opposite grinding surfaces of the pair of grinding tools. The contact sensor can be arranged on the installation main body, and the connecting line of the detecting heads at the two ends of the contact sensor is parallel to the direction of the plumb line. In the measuring process, the servo motor can drive the grinding tool to approach the detecting heads, the contact sensor can acquire and record the distance between the detecting heads at two ends, the grinding tool stops moving when contacting the detecting heads and records the position data of the servo motor, the size of the grinding tool after grinding and repairing can be determined again based on the position data of the servo motor and the detecting head data of the contact sensor, and the silicon rod processing equipment can take the measured and determined size of the grinding tool as input data in the control system.
In some examples, a telescopic spring is further arranged on the detection head of the touch sensor, and when the detection head contacts an object, the detection head can be driven to retract under the driving of the telescopic spring, so that the detection head can be protected, and the detection head is prevented from being damaged by touching.
In some examples, the sensing device may be configured as a probe-type displacement sensor.
In some embodiments, the sensing device may be a distance measuring sensor, and a distance detecting direction of the distance measuring sensor may be set to be perpendicular to a grinding surface of the grinding tool, so as to obtain a specification of the grinding tool after grinding and repairing, and the distance measuring sensor may be, for example, an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, or the like.
In a general silicon wafer manufacturing process, taking a monocrystalline silicon product as an example, the general operation procedures may include cutting an original long silicon rod by using a silicon rod cutting machine to form a plurality of short silicon rods; after the truncation is finished, performing squaring and cutting on the truncated short silicon rod to form a cut silicon rod; then, processing operations such as rounding, surface grinding and the like are carried out on each cut silicon rod, so that the surface of the silicon rod is shaped to meet the requirements of corresponding flatness and dimensional tolerance; and subsequently, slicing the single crystal silicon rod by using a slicing machine to obtain the single crystal silicon slice. Taking a polycrystalline silicon product as an example, generally, the general working procedure may include first squaring a primary silicon ingot (large-sized silicon ingot) using a silicon ingot squarer to form a secondary silicon ingot (small-sized silicon ingot); after the squaring is finished, cutting off the secondary silicon ingot by using a silicon ingot cutting machine to form a polycrystalline silicon rod; then, processing operations such as chamfering, barreling and the like are carried out on each polycrystalline silicon rod, so that the surface of each polycrystalline silicon rod is shaped to meet the requirements of corresponding flatness and dimensional tolerance; and subsequently, slicing the polycrystalline silicon rod by using a slicing machine to obtain the polycrystalline silicon slice.
The silicon rod with a rectangular or quasi-rectangular cross section is obtained by grinding after cutting, and meanwhile, chamfering is needed to be carried out on the silicon rod so that transition between different edges of the cross section of the silicon rod is smooth, edge breakage and lattice defects are prevented from being generated, internal stress of the crystal rod is released, and formation of a complete silicon wafer in subsequent slicing is facilitated.
In some embodiments, when different sides of the cut silicon rod are ground or edges are chamfered by the silicon rod processing apparatus, the silicon rod held by the silicon rod holder is driven to rotate by the holding part rotating mechanism of the silicon rod holder. The silicon rod section is rectangle or quasi-rectangle after cutting usually, when grinding different sides, the ground face switching of grinding the relative silicon rod of grinding apparatus can be realized to certain angle such as 90 degrees of clamping part slewing mechanism control silicon rod rotation, when carrying out the chamfer to different edges, accessible control clamping part rotates certain angle such as 45 degrees, realization such as 135 degrees. Under the condition that the grinding surface that the grinding device provided is the plane, when carrying out the chamfer to the silicon rod, the silicon rod that the clamping part slewing mechanism steerable was held rotates different angles and carries out chamfer realization many times, for example, accomplish the grinding back of a side to the silicon rod, to an edge that this side is adjacent and the edge relative with this edge, accessible rotation certain angle for example 40 °, 45 °, 50 equidistance angle carry out chamfer many times, obtain the silicon rod that passes through more slick and sly at different side junctures. The chamfering method can refer to patent publications such as CN108942570A, and the silicon rod is driven to rotate by a certain angle, and the grinding tool is matched with the silicon rod to feed relative to the silicon rod so as to grind the edge of the cut silicon rod. In this example, by controlling the relative movement between the silicon rod clamp and the grinding device, the grinding device can grind and chamfer the cut silicon rod.
In some embodiments, in order to reduce the wear on the grinding tool, the silicon rod processing equipment further comprises a chamfering device for grinding the edge of the cut silicon rod. In general, the chamfering work for the silicon rod easily causes a large loss of the grinding tool, and here, the grinding surface and the chamfering of the silicon rod are performed by the grinding whetstone and the chamfering whetstone of the chamfering device, respectively, so that the service life of the grinding whetstone can be increased.
In some embodiments, the chamfering device is connected to the second switching mechanism, and is configured to switch between the first processing area and the second processing area under the driving of the second switching mechanism to chamfer the cut silicon rod held by the first silicon rod clamp or the second silicon rod clamp.
In some embodiments, the chamfering device is disposed beside the grinding device, so that the chamfering device and the grinding device are located in the same processing region at the same time. For example, the cutting device corresponds to the second processing area when the grinding device and the chamfering device correspond to the first processing area, or the cutting device corresponds to the first processing area when the grinding device and the chamfering device correspond to the second processing area.
In this example, in an actual processing scene, after the silicon rod clamp drives the clamped silicon rod to move so as to complete the cutting operation, the second switching mechanism drives the processing area where the grinding device and the chamfering device are switched, so as to chamfer and grind the cut silicon rod.
Here, the order of the chamfering step and the polishing step is not limited, and for example, the silicon rod after cutting may be polished and then chamfered, or the silicon rod may be chamfered and then polished. In an implementation scenario, the grinding operation and the chamfering operation can be performed respectively by controlling the position relationship between the chamfering device and the grinding device relative to the silicon rod clamp, for example, when the grinding device grinds and grinds the cut silicon rod, the chamfering device is made to retreat to avoid collision with the cut silicon rod. The chamfering device can be arranged on the second conversion mechanism by a displacement mechanism in a second direction, for example, and thus moves in the second direction to avoid the silicon rod during the grinding operation; or, through control the chamfer grinding apparatus of chamfer device moves in order to dodge the silicon rod along the plumb line, and this application does not do the restriction.
In some embodiments, the chamfering apparatus comprises: at least one pair of chamfer grinding tools having chamfer grinding surfaces located in a horizontal plane; and the chamfering grinding tool advancing and retreating mechanism is used for driving at least one of the pair of chamfering grinding tools to move along the direction of the plumb line.
The chamfering grinding tool advancing and retreating mechanism is used for driving at least one chamfering grinding tool in the chamfering grinding tools to move up and down along the direction of a plumb line, and the direction of the plumb line is perpendicular to the horizontal plane. Therefore, the relative distance between two chamfering grinding tools in at least one pair of chamfering grinding tools in the direction of the plumb line can be adjusted, and the feeding amount of the chamfering grinding tools for grinding the silicon rod edge is controlled to determine the grinding amount of the silicon rod edge.
In certain implementations, the chamfer grinder advancing and retracting mechanism includes: the advance and retreat guide rails are arranged on the second conversion mechanism along the direction of the plumb line and used for arranging the at least one pair of chamfer grinding tools; and the advancing and retreating driving unit is used for driving at least one chamfering grinding tool in the pair of chamfering grinding tools to move along the advancing and retreating guide rail.
In one implementation mode, the chamfer grinding tool advance and retreat guide rail is arranged on the second conversion mechanism of the chamfer grinding tool along the plumb line direction, and the bottom of the chamfer grinding tool is provided with a guide groove structure or a guide block structure which is matched with the advance and retreat guide rail along the plumb line direction. The advance and retreat driving unit includes, for example, a ball screw provided along the advance and retreat guide rail, and a driving motor coupled to the ball screw in association with the corresponding chamfering tool.
The position of the chamfering grinding tool in the direction of the plumb line can be adjusted by the chamfering grinding tool advancing and retreating mechanism. In some processing scenarios, when the chamfering device and the grinding device are disposed adjacent to each other, for example, in an embodiment where the chamfering device and the grinding device correspond to the same processing location, the chamfering tool and the grinding tool are adjusted by the chamfering tool advancing and retreating mechanism, so as to prevent the chamfering operation and the grinding operation from interfering with each other, for example, when the grinding device grinds the side surface of the silicon rod, the pair of chamfering tools are moved away from each other to avoid the silicon rod.
With continued reference to fig. 12, the chamfering tool 311 may be configured as a chamfering wheel, for example, the chamfering wheel may be configured as an R-corner wheel; the chamfer grinding tool 311 may alternatively be a grinding wheel formed by a different manufacturing method, such as a plating method grinding wheel, a sintering method grinding wheel.
The grinding wheel of the chamfering grinding tool 311 is, for example, formed by consolidating abrasive grains and a binder to form a surface having abrasive grains to contact and grind the cut silicon rod edges; the grinding wheel has certain abrasive particle size and abrasive particle density, and abrasive materials of the grinding wheel can be set into abrasive particles with hardness larger than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding a silicon rod.
Generally, the chamfering grinding tool 311 is a grinding wheel with a circular grinding surface, the chamfering grinding tool 311 can grind the edge of the silicon rod with different chord edges, it should be understood that the silicon rod clamp and the silicon rod clamped by the silicon rod clamp can move in a first direction, and the silicon rod edge can be made to correspond to different chord edges of the chamfering grinding tool 311 by controlling the position of the chamfering grinding tool 311 in a second direction. In some embodiments, the grinding wheel of the chamfering grinding tool 311 may be preset to realize the chamfered chord edge, whereby the relative position of the chamfering device and the silicon rod clamp in the second direction is determined when the chamfering device is mounted to the second conversion mechanism, so that the contact length of the silicon rod edge and the grinding wheel in the chamfering operation can be controlled in advance.
In one implementation, the chamfering grinding tool 311 includes a grinding wheel and a rotating shaft, the rotating shaft is connected with the grinding wheel and linked with the driving source to drive the grinding wheel to rotate along the rotating shaft under the driving of the driving source, so that the grinding surface of the grinding wheel in a rotating state is in contact with the edge of the cut silicon rod, and the chamfering of the cut silicon rod can be realized.
The advancing and retreating mechanism is used for driving the chamfering grinding tool 311 to move along the direction of the plumb line, so that the position relation between the chamfering grinding tool 311 and the cut silicon rod can be adjusted, and the grinding amount and the grinding position for chamfering the cut silicon rod can be determined. Meanwhile, the position of the chamfering grinding tool 311 in the direction of the plumb line is adjusted by the advancing and retreating mechanism, so that the silicon rod clamp, the clamped silicon rod and the chamfering grinding tool 311 can be prevented from interfering with each other in the grinding process of the grinding device.
It is understood that, in general, after a silicon single crystal rod having a circular cross section is cut into a silicon rod having a rectangular or quasi-rectangular cross section, it is necessary to perform side grinding and chamfering of edges, or side grinding and rounding of the silicon rod. The inventor of the present application finds that, for a common cut silicon rod with a side length of about 210mm, the subsequent processes usually need to be performed are grinding and chamfering, and for a common cut silicon rod with a side length of about 158mm, the subsequent processes usually need to be performed are grinding and rounding. Therefore, the chamfering device is suitable for different process requirements, can be used for chamfering, and can also be used for rounding.
In an operation mode, when the chamfering device is used for chamfering the cut silicon rod, taking the two opposite side surfaces of the cut silicon rod in the horizontal plane as an initial position as an example, the clamping part rotating mechanism of the silicon rod clamp drives the clamping part and the clamped silicon rod to rotate by a certain angle, for example, 40 degrees clockwise, so that the advancing and retreating mechanism drives the chamfering grinding tool 311 to feed relative to the silicon rod along the direction of the plumb line to realize the contact and grinding of the silicon rod, and the silicon rod clamp drives the silicon rod to move along the first direction to realize the edge grinding; the silicon rod can then be rotated, for example, by 5 ° in the clockwise direction each time for a plurality of edge grindings, in order to obtain a silicon rod with a smoother edge transition. When the chamfering device comprises a pair of chamfering grinding tools 311 which are oppositely arranged, the pair of chamfering grinding tools 311 can chamfer a pair of opposite edges of the cut silicon rod; after chamfering one pair of opposite edges of the cut silicon rod, the silicon rod may be rotated, for example, by 45 ° by the holder rotating mechanism to chamfer the other pair of opposite edges of the silicon rod.
In another operation mode, when the chamfering device is used for rounding the cut silicon rod, the silicon rod clamp can drive the clamped silicon rod to rotate along the axis of the silicon rod, and the edge of the silicon rod in the rotating state is contacted with the chamfering grinding tool 311, so that rounding of each edge of the cut silicon rod is realized.
Here, the silicon rod clamp in the silicon rod processing equipment of the application can realize cutting and grinding by moving along the guide structure on the processing position where the silicon rod clamp is located after clamping the silicon rod, wherein the cutting position and the grinding position can be respectively converted to the processing positions where the silicon rod to be cut and the cut silicon rod are located by the first conversion mechanism and the second conversion mechanism, respectively, after the cutting and the grinding are completed, the ground silicon rod is unloaded, so that the silicon rod clamp can be loaded with the silicon rod to be cut, and the processing operation can be continued. In the examples provided herein, the cutting zone is the location of the cutting device, and the polishing zone is the location of the polishing device.
In some embodiments, the silicon rod processing equipment of this application still includes silicon rod discharge apparatus for unloading the silicon rod after will grinding, so be of value to the linking of process circulation, reduce silicon rod processing equipment and to the silicon rod cutting and grind the waiting time after finishing, adopt this automatic discharge's mode still can be used to reduce or avoid grinding back silicon rod collision in transit to collide with the damage.
With continued reference to fig. 1, in certain embodiments, the silicon rod unloading apparatus 80 includes: the conveying belt 811 is used for carrying the ground silicon rods; and the discharging driving source (not shown) is used for driving the conveying belt 811 to move so as to drive the ground silicon rods carried by the conveying belt to move along the first direction.
The conveying belt 811 may be configured to have a bearing plane to accommodate the ground silicon rod with a flat side, and in some embodiments, to avoid the impact between the conveying belt 811 and the surface of the silicon rod, the conveying belt 811 may be configured to be made of a flexible material or an elastic material, or a buffer layer may be added on the surface of the conveying belt 811; the buffer layer or the flexible material is, for example, rubber, silica gel or other materials with elastic deformation, damping property or buffering property.
The silicon rod moves along first direction after the drive source drive conveyer belt 811 moves in order to drive the grinding that bears, in order to with silicon rod transports processing position district after grinding, here, the district of unloading of silicon rod for following first direction neighbour locate the processing position district after grinding, through conveyer belt 811 drives the silicon rod and can make the silicon rod transported out silicon rod processing platform along first direction motion.
In some examples, when the silicon rod processing apparatus has both the silicon rod unloading device 80 and the edge bark conveying mechanism 52, the silicon rod unloading device 80 and the edge bark conveying mechanism 52 may be disposed at both ends of the silicon rod processing apparatus in the first direction, for example, so that the edge bark may be prevented from interfering with the ground silicon rod during the conveying process; meanwhile, the flaw-piece is usually loaded to a flaw-piece cylinder for reuse after being removed, the ground silicon rod is transported to other processing equipment for subsequent processing such as slicing after being removed, and the corresponding subsequent processes can be respectively performed on the flaw-piece and the ground silicon rod after being discharged by distinguishing the discharging areas corresponding to the flaw-piece and the ground silicon rod respectively.
In certain embodiments, the silicon rod unloading device 80 is provided to the silicon rod processing platform by a displacement mechanism 82 for movement between a first processing position and a second processing position driven by the displacement mechanism 82.
The silicon rod unloading device 80 is used for receiving the ground silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp. It should be understood that when the first silicon rod clamp clamps the ground silicon rod, the first silicon rod clamp clamps the cut silicon rod, that is, the silicon rod is processed in different states in the first processing region and the second processing region at the same time, so that the silicon rod unloading device 80 receives the ground silicon rod in one processing region during one unloading.
As mentioned above, the silicon rod unloading device 80 unloads the ground silicon rods at a processing region in one unloading process, and in some embodiments, the silicon rod unloading device 80 is driven by the shifting mechanism 82 to correspond to the first processing region and the second processing region, respectively, so that the silicon rods at two processing regions can be unloaded by one silicon rod unloading device 80.
The displacement mechanism 82 can be provided on the silicon rod processing platform, for example, by guide columns or guide rails in the second direction, and the displacement mechanism 82 is used to carry the silicon rod discharge device 80 and is moved in the second direction by a drive source, so that it can be movably docked to different processing locations.
The silicon rod clamp and the clamped ground silicon rod are fixed in position in the second direction, the silicon rod unloading device 80 is moved to a position in the second direction to align with the silicon rod clamp, the ground silicon rod is clamped by the silicon rod clamp to move in the first direction to correspond to the silicon rod unloading device 80 in the first direction, for example, a projection of the ground silicon rod on a horizontal plane is dropped on the conveyor belt 811, and the ground silicon rod is released by the silicon rod clamp, so that the conveyor belt 811 of the silicon rod unloading device 80 receives the ground silicon rod.
In some embodiments, the silicon rod unloading device 80 is provided to the displacement mechanism 82 by a lifting mechanism 83, wherein the lifting mechanism 83 comprises: the lifting guide structure is arranged on the shifting mechanism 82 and is connected with the silicon rod unloading device 80; and the lifting driving source is used for driving the silicon rod unloading device 80 to move up and down along the lifting guide structure.
In an actual processing scene, when the silicon rod processing equipment is used for processing silicon rods with different specifications, such as different diameters, the side lengths of the ground silicon rods obtained correspondingly may be different. In the process that the conveying belt 811 receives the ground silicon rods, the conveying belt 811 is positioned below the ground silicon rods and the height difference between the conveying belt 811 and the ground silicon rods is reduced as much as possible, and the lifting mechanism 83 can be used for unloading the ground silicon rods with different specifications.
The silicon rod loading and unloading device is provided to the shift mechanism 82 through a lifting guide structure, and moves along the lifting guide structure by a lifting drive source. In one implementation mode, the silicon rod handling device is arranged at the free end of the lifting guide structure, and the lifting guide structure is driven by the lifting drive source to move telescopically along the direction of the plumb line so as to drive the silicon rod handling device at the free end to move up and down. In a further implementation, the lifting drive source is used for driving the movement along the lifting guide structure, in this case, the lifting drive source is, for example, a cylinder or a hydraulic pump, wherein the telescopic end of the cylinder or the hydraulic pump is connected to the silicon rod loading and unloading device; or the lifting driving source, such as a motor, is provided to the silicon rod loading and unloading device to drive the silicon rod loading and unloading device to move along the lifting guide structure.
Generally, the silicon rod to be cut held by the silicon rod clamp is based on a silicon rod with a certain length specification obtained after cutting the silicon rod, and in actual production, an original long silicon rod needs to be cut first to obtain the silicon rod to be cut which can be used for cutting. The starting long silicon rod is, for example, a rod-shaped single crystal silicon grown from the melt by the czochralski method or the suspension float zone method, a single crystal silicon rod of a length of approximately 5000mm (for example, 5360mm specification, etc.) which is customary in silicon rod processing. After the original silicon single crystal rod is cut off, the silicon rod clamp can clamp the cut silicon rod, and therefore subsequent cutting and grinding operations are carried out.
In certain embodiments, the silicon rod processing apparatus of the present application further comprises a silicon rod truncating device, wherein the silicon rod truncating device comprises a silicon rod carrying device for carrying a single crystal silicon rod; and the cutting frame comprises a cutting wire saw which is relatively arranged on the silicon rod bearing device and can lift up and down and is used for cutting the silicon single crystal rod to form the silicon rod to be cut.
In some embodiments, the silicon rod carrying device is a chain conveying mechanism, a speed multiplying chain mechanism, or a belt mechanism.
Referring to fig. 14, a schematic view of a portion of a silicon rod processing apparatus according to the present application is shown.
In one example, the silicon rod carrier 61 is a chain conveyor driven by a motor. The chain conveying mechanism comprises: two opposite endless chains and a sprocket for driving the two endless chains. The two annular chains are arranged in the first direction in parallel and oppositely, chain wheels are arranged at two ends of each annular chain respectively, and gear teeth of the chain wheels are meshed with the chains and drive the chains to run when the chains rotate. The sprocket is driven to rotate, for example, by a power take-off shaft of a motor.
In one implementation, the sprockets are disposed at both ends of each of the endless chains, and the two endless chains disposed opposite to each other are parallel to each other, and the sprocket at the same end is used as a driving sprocket. The driving chain wheels of the two endless chains respectively have axes on the same horizontal axis. The driving chain wheel can be in power coupling with a motor shaft, namely a power output shaft, and is meshed with chain wheels of the two annular chains, so that the conveying speed of the chains is controlled by the driving motor, and the axial conveying speed of the single crystal silicon rod on the silicon rod bearing device can be controlled.
In one implementation, each endless chain may also have a plurality of bearing blocks disposed thereon. In some embodiments of the present application, the bearing blocks on the two endless chains are a row of wedge blocks fixed on the chains at intervals to serve as a direct support for the silicon rod to be cut or the cut silicon rod section, and limit the freedom of movement of the borne silicon single crystal rod to be limited to the movement direction of the conveying mechanism of the bearing device, i.e. ensure that the silicon rod and the chain conveying mechanism are relatively static and the silicon rod does not move relatively during cutting. The surface of the wedge-shaped block, which is used for contacting the silicon rod to be cut or the cut silicon rod section, can be arranged in an arc shape so as to conform to the arc-shaped surface of the silicon rod; in some embodiments of the present application, the wedge block is made of a rubber material having elasticity, or is made of silica gel or other materials having elastic deformation or buffering characteristics, so as to protect the surface of the silicon rod in contact with the wedge block from being scratched or collided.
In other feasible examples, the silicon rod carrying device can also be provided with a speed doubling chain mechanism, a belt mechanism or the like; the speed multiplying chain mechanism or the belt mechanism may be arranged in a first direction and have a stop means, such as a wedge, for the silicon rod with a circular cross-section to prevent the supported silicon rod from rolling.
It should be understood that the silicon rod carrying device can be used for carrying the silicon rod and limiting the movement direction of the silicon rod so as to control the relative position between the silicon rod and the cutting and cutting frame.
As shown in fig. 14, the silicon rod carrying device 61 conveys the silicon rod along the axis direction of the silicon rod, the cutting frame 62 comprises a liftable cutting wire saw, and the silicon rod carrying device 61 conveys the silicon rod to the lower part of the cutting wire saw through control, so that the long silicon rod can be cut into the silicon rod to be cut with the preset length specification, wherein the length specification is determined by the conveying distance of the silicon rod carrying device 61.
The cutting frame 62 is disposed on the base, which comprises a lifting support and a plurality of cutting wheels 621 and transition wheels disposed on the lifting support, wherein the cutting line winds the cutting wheels 621 and the transition wheels to form a cutting wire saw along the second direction. The lifting support 623 is arranged on a guide column in the lifting direction and is driven by a lifting driving source to move so as to enable the cutting wire saw to move up and down, and meanwhile, the cutting wire saw is aligned with the silicon rod bearing device in the first direction, so that the cutting wire saw can be oppositely arranged on the silicon rod bearing structure to be cut off.
In one implementation, the lifting support 623 includes, for example, two cutting wheels 621 thereon for forming a cutting wire in the second direction; the lifting support 623 has a hollow region therein, for example, in an inverted U shape, and the hollow region can accommodate the cross section of the silicon rod, so as to ensure that the lifting support 623 does not collide with the silicon rod when the lifting support 623 is lowered to the cutting wire saw to cut the silicon rod.
In one example, the lifting driving source is a screw assembly including a screw and a motor, one end of the screw is connected to the lifting support 623, and the other end of the screw is connected to the motor and driven by the motor to move the lifting support 623 along the guide post. The specific form of the elevation driving source is not limited thereto, and in another example, the elevation driving source is, for example, a cylinder assembly.
After the cutting frame 62 cuts the long silicon rod to form a silicon rod to be cut with a preset length specification, the silicon rod clamp can load the silicon rod to be cut; of course, the silicon rod to be cut can also be cut by a separate silicon rod cutting device.
The displacement range of the silicon rod clamps is limited by the corresponding guide structures, and any one of the silicon rod clamps needs to be loaded with a silicon rod to be cut at the corresponding processing position. In view of this, the silicon rod to be cut needs to be transported to a position where the silicon rod clamp can realize clamping in advance.
In certain embodiments, the silicon rod processing apparatus further comprises a feeding device for transporting a silicon rod to be cut to a first processing location or a second processing location, so that the first silicon rod clamp or the second silicon rod clamp loads a silicon rod to be cut. The feeding device can be provided with a freedom degree of movement along a second direction so as to move the silicon rod clamp corresponding to any processing position.
In certain embodiments, the loading device comprises at least one clamping assembly, wherein the clamping assembly comprises: the material taking arm is suspended above the silicon rod processing platform through an installation part, and the top frame comprises a guide structure arranged along a second direction so that the installation part has the freedom degree of moving along the second direction; the clamping part is arranged at the bottom end of the material taking arm and used for clamping the silicon rod to be cut.
Please refer to fig. 1, fig. 15a, and fig. 15b in combination, wherein fig. 15a and fig. 15b are respectively schematic structural diagrams of a feeding device of the present application in different view directions in an embodiment.
The top frame 13 can be disposed on the machine base, for example, on a column disposed between the first machining location and the second machining location, and in some examples, the column can be considered as a part of the machine base.
The top frame 13 includes the guide structure 131 that the second direction set up, guide structure 131 is used for setting up installation department 72 makes installation department 72 removes along the second direction under guide structure 131's limiting displacement, is connected to the arm 711 of getting of installation department 72 can remove along the second direction.
The clamping part 712 is arranged at the bottom end of the material taking arm 711 and is used for clamping the silicon rod to be cut. Here, the number of the clamping members 712 corresponds to the number of the take-off arms 711, and the feeding device comprises at least one clamping assembly, and in an example, when the feeding device comprises a single clamping assembly, the clamping members 712 may be, for example, arranged to have a preset length in a first direction so as to achieve a stable clamping of the silicon rod to be cut. In another example, a plurality of clamping assemblies are included in the feeding device, and the clamping members 712 corresponding to the plurality of clamping assemblies have a spacing in the first direction, so that the center of gravity of the silicon rod to be cut can be located between the plurality of clamping members 712 to realize stable clamping of the silicon rod to be cut.
In some embodiments, the mounting portion 72 includes a translation mechanism 721 disposed along a first direction for positioning the pick arm 711 such that the pick arm 711 has freedom to move along the first direction.
The first direction translation mechanism 721 is, for example, a translation guide rail, the material taking arm 711 moves along the translation guide rail to drive the clamping part 712 at the lower end of the material taking arm 711 to move along the first direction, so as to adjust the clamping position of the clamping part 712 relative to the silicon rod to be cut, in an example where the feeding device has a plurality of clamping components, the first direction translation mechanism can adjust the distance between the plurality of clamping parts 712 in the first direction, and the feeding device can be suitable for clamping silicon rods to be cut with different length specifications.
In some embodiments, the clamp 712 includes: the clamping device comprises a first clamping block 7121 and a second clamping block 7122 which are arranged oppositely, wherein the first clamping block 7121 and the second clamping block 7122 are provided with clamping arc surfaces; and a clamping block driving mechanism (not shown) for driving the first clamping block 7121 and the second clamping block 7122 to open and close.
The clamping arc surfaces of the first clamping block and the second clamping block can be adapted to the silicon rod to be cut, the section of which is circular, and in one implementation mode, the clamping arc surfaces are arc surfaces arranged on the clamping blocks towards the clamping space; in another implementation manner, the clamping arc surface, i.e., the clamping block, follows the radian of the surface of the silicon rod and is arranged on the contact planes in different directions, so that the silicon rod with the arc surface can be clamped.
In some examples, the clamp arm drive mechanism comprises: an opening and closing gear, a rack, and a driving source (not shown); the driving source is connected with the gear driving piece and used for driving the gear driving piece to move.
The clamping block drives the first clamping block and the second clamping block to perform opening and closing movement, so that the silicon rod to be cut is clamped and released.
In one implementation, the clamp block driving mechanism includes: the first rack is linked with the first clamping block; the second rack is linked with the second clamping block; the clamping cylinder is arranged on the first rack or the second rack and is used for pushing the first rack or the second rack to move in the rack extending direction; and the transmission gear is meshed with the first rack and the second rack and is used for driving the first clamping block and the second clamping block to move oppositely to execute a closing action when rotating in the forward direction and driving the first clamping block and the second clamping block to move oppositely to execute an opening action when rotating in the reverse direction.
The first rack and the second rack are arranged on two sides of the transmission gear, and based on the basic rule that gears or gears and racks are meshed, when the transmission gear rotates, linear speeds of tooth parts on two sides of the gears move in opposite directions, so that the first rack and the second rack can move in opposite directions. Correspondingly, the first clamping part and the second clamping part which are linked with the first rack and the second rack show opposite approaching or mutual departing movement. If the clamping cylinder pushes the first rack or the second rack to move so as to drive the transmission gear to rotate, when the transmission gear is in a forward rotation state, the first rack and the second rack approach to each other so as to drive the first clamping block and the second clamping block to approach to each other and execute a closing action; when the transmission gear is in a reverse rotation state, the first rack and the second rack are mutually far away to drive the first clamping part and the second clamping part to be mutually far away to execute a releasing action.
In another implementation, the grip block driving mechanism includes: the first rack is linked with the first clamping block; the second rack is linked with the second clamping block; and the driving gear is connected to a power output shaft of the driving motor, meshed with the first rack and the second rack and used for driving the first clamping block and the second clamping block to move oppositely to execute a closing action when rotating forwards and driving the first clamping block and the second clamping block to move oppositely to execute an opening action when rotating reversely.
The first rack and the second rack can be meshed with two sides of the driving gear, so that linear velocity directions of the first rack and the second rack are opposite when the driving gear rotates, the driving gear is driven to rotate by the driving motor, the first rack and the second rack move oppositely when the driving gear rotates positively to drive the first clamping block and the second clamping block to move oppositely to execute a closing action, and the first rack and the second rack move oppositely to drive the first clamping block and the second clamping block to move oppositely to execute an opening action when the driving gear is driven to rotate reversely.
In yet another implementation, the grip block driving mechanism includes: the opening and closing gear is arranged on the first clamping block and the second clamping block; the opposite two ends of the rack are respectively provided with insections which correspond to the meshing of the opening and closing gears on the first clamping block and the second clamping block; and the driving source is connected to the rack and is used for driving the rack to move forward and backward along the direction of the rack.
The rack is located between the first clamping block and the second clamping block, the two outer side surfaces of the clamping blocks facing to the two sides in the rack are respectively provided with insections corresponding to the meshing of the opening and closing gears on the first clamping block and the second clamping block, and the driving source can be a driving motor or an air cylinder. Thus, according to the above implementation manner, in practical application, when clamping of the clamping block is to be realized, the driving motor or the cylinder serving as the driving source drives the rack serving as the gear driving member to move upwards, the rack drives the opening and closing gears meshed at two sides to perform outward rotation, and the opening and closing gears drive the clamping block (the opening and closing gears are connected with the clamping block through the rotating shaft) to perform downward movement in the outward rotation process so as to be switched from a released state to a clamped state; on the contrary, when the clamping block needs to be loosened, the driving motor (or the air cylinder) serving as a driving source drives the rack serving as a gear driving part to move downwards, the rack drives the opening and closing gears meshed at two sides to do internal rotation, and the opening and closing gears drive the clamping block (the opening and closing gears are connected with the clamping block through the rotating shaft) to do upward movement in the internal rotation process so as to be changed from the clamping state to the loosening state. Of course, the above is only an example, and is not intended to limit the operating state of the silicon rod clamping member, and actually, the above-mentioned "up", "outward rotation", "downward", "inward rotation", "upward", and "unclamping" and "clamping" state changes may be changed in other ways according to the structure and operation manner of the clamping block, and the structure of the clamping block driving mechanism.
In yet another implementation, the grip block driving mechanism includes: two ends of the bidirectional screw rod are in threaded connection with the first clamping block and the second clamping block; and the driving source is used for driving the screw rod to rotate so as to enable the first clamping block and the second clamping block to move towards or away from each other.
The bidirectional screw rod is arranged along a second direction and is in threaded connection with the first clamping block and the second clamping block; the driving source drives the screw rod to rotate so that the first clamping block and the second clamping block move towards or away from each other along a second direction. In one embodiment, the bidirectional screw is a double-threaded screw, the two ends of the bidirectional screw are respectively provided with threads with opposite thread directions, the driving source can be disposed at either end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft, and by means of the threads with opposite thread directions at the two ends of the bidirectional screw, when the bidirectional screw is driven to rotate by the driving source, the motion at the two ends of the bidirectional screw is converted into axial linear motion with opposite directions, and the axial direction is the second direction of the bidirectional screw. Under the driving of the driving source, the first clamping block and the second clamping block can move oppositely or oppositely to clamp or release the silicon rod to be cut.
In some embodiments, the material taking arm 711 is disposed on the mounting portion 72 in a liftable manner. When the clamping assembly realizes clamping, the first clamping block 7121 and the second clamping block 7122 are required to be respectively located at two opposite sides of the silicon rod, so that the silicon rod is located in a clamping space between the first clamping block 7121 and the second clamping block 7122. In the process of moving the clamping assembly to enable the silicon rod to be located in the clamping space, the clamping block is required to be prevented from colliding with the silicon rod. In an implementation manner, the material taking arm 711 is arranged in a liftable manner in the mounting portion 72, before the clamping part corresponding to the material taking arm 711 approaches to the silicon rod to be cut in the second direction, the lifting height of the material taking arm 711 is controlled to enable the clamping part to be located above the silicon rod to be cut, and after the first clamping block 7121 and the second clamping block 7122 are located at two sides of the silicon rod to be cut, the material taking arm 711 can be enabled to drive the clamping part to descend so that the silicon rod to be cut is located in the clamping space, and in this state, the first clamping block 7121 and the second clamping block 7122 are driven to approach to each other in an opposite direction, so that the silicon rod to be cut can be clamped.
In some scenes, the diameter silicon rods of the silicon rods to be cut are different, the axial heights of the silicon rods are different when the silicon rods are located at the pre-loading position, the material taking arm drives the clamping piece to move in the lifting direction, and the corresponding axial heights of the silicon rods can be aligned to the preset clamping position.
In some embodiments of the present application, the feeding device is suspended above the base, and under such a configuration, a position for placing the silicon rod to be cut can be set on the silicon rod processing platform of the corresponding base, so that the occupied area of the base on the space can be reduced.
In some embodiments, the silicon rod processing equipment further comprises a predetermined loading mechanism arranged along the first direction and used for bearing the silicon rod to be cut so that the loading device can convey the silicon rod to be cut to the first processing position or the second processing position from the predetermined loading mechanism. With continuing reference to fig. 14, in an example, when the silicon rod processing apparatus includes the cutting and slicing frame 62, the predetermined loading mechanism 74 may be aligned with the silicon rod carrying device in a first direction, so that the silicon rod carrying device conveys the silicon rod to the predetermined loading mechanism 74 along the axial direction, and the silicon rod to be sliced, which is obtained after the silicon rod is cut by the cutting and slicing frame 62 and can be used for cutting, is located on the predetermined loading mechanism 74; in other examples, the predetermined loading mechanism 74 may also be used to carry a silicon rod cutting apparatus for cutting the obtained silicon rod to be cut.
The predetermined loading mechanism 74 has a bearing portion to limit the silicon rod to be cut to be stably placed, and in one implementation manner, the bearing portion includes two rows of parallel and opposite rollers arranged along a first direction, so that the silicon rod to be cut is not easy to roll on the bearing portion; meanwhile, when the predetermined loading mechanism 74 corresponds to the silicon rod carrying device of the silicon rod cutting device, the silicon rod to be cut is in rolling friction with the carrying part when moving along the first direction relative to the predetermined loading mechanism 74, so that the silicon rod is conveniently conveyed.
In one implementation, the predetermined loading mechanism 74 may be disposed between the first processing location and the second processing location, and the control system of the silicon rod processing apparatus may read the position of the predetermined loading mechanism 74, so as to control the displacement distance required by the loading device to transport the silicon rod to the corresponding first silicon rod clamp or second silicon rod clamp after the silicon rod is clamped by the predetermined loading mechanism 74. For example, when the first and second processing locations are arranged on opposite sides of the second direction, in this case the distance of movement of the loading means from the predetermined loading mechanism 74 to the corresponding silicon rod clamp in the second direction may be controlled.
In the silicon rod processing equipment, the silicon rod is clamped by the silicon rod clamp to move along the axis direction of the silicon rod, and in order to ensure that the silicon rod clamp keeps stable in the process of clamping the silicon rod and driving the silicon rod clamp to move, the silicon rod clamp needs to be clamped at a position aligned with the axis of the silicon rod; meanwhile, the cutting amount or the grinding amount of the silicon rod in cutting or grinding operation is determined by the relative position of the cutting wire saw or the grinding tool and the silicon rod, the silicon rod clamp is clamped at the position aligned with the axis of the silicon rod, the silicon rod processing equipment can acquire the position of the axis of the silicon rod, the silicon rod can be processed by the preset cutting amount or grinding amount, and the change of the height of the center of gravity of the silicon rod clamp in the process of driving the silicon rod to rotate along the axis is avoided or reduced.
The feeding device is used for conveying the silicon rod to be cut to the first silicon rod clamp or the second silicon rod clamp, in actual operation, the clamping position corresponding to the silicon rod clamp only has the freedom degree adjusted along the first direction, clamping of the silicon rod clamp is achieved at the position where the clamping part of the silicon rod clamp is aligned with the axis of the silicon rod, and the silicon rod clamp can clamp the silicon rod at the preset loading position by adjusting the spatial position where the silicon rod clamped by the silicon rod clamp through the feeding device.
In an embodiment of the present application, the predetermined loading position is a position where an axial position of the silicon rod held by the loading device is aligned with a center of the holding portion of the silicon rod clamp.
In an implementation scene, the positions of the center lines of the first clamping block and the second clamping block in the feeding device in the second direction can be acquired by the control system, in this state, when the silicon rod to be cut is in a state of being clamped by the feeding device, the position of the axis of the silicon rod in the second direction can be acquired, and the axis of the silicon rod can be ensured to be aligned with the clamping part of the silicon rod clamp in the second direction by controlling the moving distance of the feeding device in the second direction; in order to clamp the silicon rod clamp at a position where the clamping portion is aligned with the axis of the silicon rod, it is necessary to control the position of the axis of the silicon rod in the direction of the plumb line to be aligned with the clamping portion. To this end, in certain embodiments of the present application, the loading device further comprises a sensing means for detecting a silicon rod held by the holding means of the loading device or by the first or second silicon rod clamp to determine that the first or second silicon rod clamp holds a silicon rod at a predetermined loading position.
The sensor device can be used, for example, to detect the height of a silicon rod held by the holding device, and thus to determine the position of the silicon rod axis in the direction of the plumb line. It should be understood that the silicon rod clamp has only a freedom of movement along its guide and a freedom of rotation of the clamping portion along the central axis, the position of the centre of the clamping portion of the silicon rod clamp in the direction of the plumb line is a defined value. The height of the axis of the silicon rod is obtained on the basis of the measurement of the sensor, so that the lifting movement of the take-off arm in the direction of the plumb line can be controlled to lift the position of the silicon rod in the direction of the axis of the silicon rod into alignment with the clamping part of the silicon rod clamp in the direction of the plumb line.
Fig. 13 is a schematic view showing a partial structure of a silicon rod processing apparatus according to an embodiment of the present disclosure.
In one implementation manner, the sensor is configured to detect the highest point height of the silicon rod in the clamping state. It should be understood that the first holding block and the second holding block in the holding member are symmetrical, and when the silicon rod is in the held state, the axis of the silicon rod is the same as the position of the center line (or the symmetrical plane) of the two holding blocks in the second direction, and the highest point of the surface of the silicon rod is the same as the position of the axis of the silicon rod in the second direction. In an actual scenario, the sensor may be set to a centerline position between the first clamping block and the second clamping block.
In certain embodiments, the sensing device is a contact sensor or a ranging sensor.
The telescopic direction corresponding to the contact sensor or the distance measuring direction corresponding to the distance measuring sensor can be set to be along the direction of the plumb line, so that the height of the highest point of the surface of the silicon rod clamped by the clamping piece is determined.
Referring to fig. 16, a schematic view of a part of a loading device of a silicon rod processing apparatus according to an embodiment of the present disclosure is shown.
Here, the contact sensor 73 may be disposed with one end disposed at the bottom end of the material taking arm 711 or at the clamping member and the other end being a free end moving up and down toward the silicon rod, the free end being provided with a probe to contact the silicon rod. In the measuring process, the detecting head can be controlled to move close to the silicon rod, the detecting head stops moving when contacting with the surface of the silicon rod and records corresponding position data, the contact sensor 73 can know and record the height of the detecting head when contacting with the silicon rod, the highest point height of the surface of the silicon rod can be determined based on the detecting head data of the contact sensor 73, and the height of the highest point can be compared with the reference height to determine the height of the silicon rod to be adjusted.
The reference height may be, for example, a highest point height of a reference silicon rod prestored in the silicon rod processing equipment control system, the reference silicon rod is a silicon rod with a known diameter value, the axis height of the corresponding reference silicon rod may be determined by adjusting the highest point height of the reference silicon rod in a state where the clamping member clamps the reference silicon rod, and the axis position of the reference silicon rod is aligned with the center of the clamping portion of the silicon rod clamp in the height direction, at this time, the highest point height of the reference silicon rod may be used as a reference height. And comparing the detection data with the reference height, and determining the displacement adjustment amount of the silicon rod in the lifting direction according to the difference between the highest point height of the silicon rod clamped by the clamping part in the current state and the reference height.
Still alternatively, the reference height may be determined by the predetermined loading mechanism, and when the silicon rod to be cut is clamped by the loading device from the predetermined loading mechanism, the position of the lowest point of the silicon rod is a determined value, that is, the height determined by the bearing surface of the predetermined loading mechanism, in this case, diameter data of the silicon rod clamped by the corresponding clamping member may be obtained based on the detection data of the contact sensor 73, so that the amount of displacement of the silicon rod in the lifting direction may be determined to enable the silicon rod clamp to clamp the silicon rod at the predetermined loading position.
In some examples, the probe of the touch sensor 73 is further provided with a retractable spring, and when the probe contacts an object, the retractable spring can be retracted under the driving of the retractable spring, so that the probe can be protected and the probe can be prevented from being damaged by touching.
In some examples, the sensing device may be configured as a probe-type displacement sensor.
In some embodiments, the sensing device may be a distance measuring sensor, and a distance detecting direction of the distance measuring sensor may be set to a plumb line direction, and the distance measuring sensor may be, for example, an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, or the like.
The sensing device can be used for measuring in the state that the silicon rod to be cut is clamped by the clamping part, or measuring in the state that the silicon rod to be cut is clamped by the silicon rod clamp.
For example, the displacement adjustment amount for the silicon rod is determined by comparing the highest point height of the silicon rod held by the silicon rod holder with the reference height in an actual scene, using the highest point height of the reference silicon rod in a state where the silicon rod holder is held at a predetermined loading position as the reference height.
Referring to fig. 15a, fig. 15b and fig. 16, for example, after the silicon rod held by the loading device is moved to a second direction to align with the silicon rod clamp, the pair of clamping arms of the silicon rod clamp are moved toward each other to clamp the silicon rod on two end surfaces of the silicon rod; enabling a first clamping block 7121 and a second clamping block 7122 of a clamping part of the feeding device to move back and forth to release the silicon rod, enabling the sensors 73 to move telescopically to detect the height of the silicon rod to be cut clamped by the silicon rod clamp, and comparing the measured height of the highest point of the silicon rod clamped by the silicon rod clamp with a reference height to determine the displacement adjustment amount of the silicon rod; when the highest point height of the silicon rod is the reference height, the silicon rod clamp is determined to clamp the silicon rod at the preset loading position, so that the material taking arm 711 and the clamping piece can be lifted to the specified position, and the silicon rod clamp can drive the silicon rod to move along the guide structure to perform subsequent cutting operation; when the height difference exists between the height detected by the 73 sensors and the reference height, the first clamping block 7121 and the second clamping block 7122 of the clamping piece of the feeding device move oppositely to clamp the silicon rod, then the pair of clamping arms of the silicon rod clamp move oppositely to release the silicon rod, and the feeding device drives the silicon rod to move up and down by the displacement determined by the height difference; after the lifting adjustment, the pair of clamping arms of the silicon rod clamp move in opposite directions to be close to two end faces of the silicon rod and clamp the silicon rod, the clamping piece releases the silicon rod, the material taking arm 711 and the clamping piece are made to ascend to the designated position, and the silicon rod clamp can drive the silicon rod to move along the guide structure so as to execute the subsequent cutting operation.
In order to facilitate understanding of the processing flow of the silicon rod processing device of the present application in a practical scenario, the present application further provides the following examples:
at the initial moment, when the cutting device is positioned at the first processing position and the grinding device is positioned at the second processing position, the silicon rod to be cut is conveyed to the silicon rod processing platform so that the first silicon rod clamp at the first processing position can clamp the silicon rod to be cut; in some implementations, the silicon rod to be cut can be obtained by cutting a long silicon rod by a cutting frame in a silicon rod processing device, and in other implementations, the silicon rod to be cut can also be obtained by processing the silicon rod cutting device;
in order to clamp the silicon rod to be cut by the silicon rod clamp, in some implementations, the silicon rod is conveyed to a clamping position corresponding to the silicon rod clamp at the processing position by a feeding device, and in some feasible embodiments, the feeding device can convey the silicon rod to be cut to a predetermined loading position corresponding to the silicon rod clamp after clamping the silicon rod to be cut from a predetermined loading mechanism;
the first silicon rod clamp clamps the silicon rod to be cut at the preset loading position and then moves along the axis direction of the silicon rod at the first processing position, so that a cutting wire saw in the cutting device feeds relative to the silicon rod to be cut to realize cutting; the processing position can be provided with a guide structure in the axis direction of the silicon rod so that the silicon rod clamp can move along the guide structure under the driving of a power source; the cutting device can be matched with the silicon rod clamp and the silicon rod clamped by the silicon rod clamp to move, for example, the position of the cutting wire saw is adjusted to avoid the silicon rod clamp from clamping the silicon rod subjected to primary cutting and returning to the initial position, the silicon rod clamp drives the clamped silicon rod to rotate for a certain angle, and then the silicon rod is fed relative to the cutting wire saw from the initial position to perform secondary cutting until the cut silicon rod with a rectangular or quasi-rectangular cross section is formed; wherein the initial position is, for example, a predetermined loading position of the silicon rod clamp, wherein the initial position is a position at which cutting can be achieved by moving the silicon rod towards the cutting wire saw; in certain embodiments, a flaw-piece conveying mechanism may also be configured in the silicon rod processing apparatus to convey the flaw-pieces formed by cutting out from the working area;
after the cut silicon rod is obtained through processing, the first conversion mechanism drives the cutting device to be converted from a first processing position to a second processing position, the second conversion mechanism drives the grinding device to be converted to the first processing position, the first silicon rod clamp can drive the clamped cut silicon rod to move along the guide structure in the state, the grinding device drives the grinding tool to move along the direction of the plumb line so as to grind the side surface of the cut silicon rod, and the first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod so as to switch the grinding surface of the grinding device on the silicon rod, so that the ground silicon rod can be obtained;
in the process of grinding operation at the first processing location, the second silicon rod clamp can load another silicon rod to be cut, and here, the implementation manner of loading the silicon rod to be cut by the second silicon rod clamp can refer to the manner of loading the silicon rod to be cut by the first silicon rod clamp, and the cutting device switched to the second processing location can also cut the silicon rod clamped by the second silicon rod clamp;
unloading the ground silicon rod at the first processing position, loading another silicon rod to be cut on the first silicon rod clamp, driving the cutting device to be switched from the second processing position to the first processing position by the first switching mechanism, cutting the silicon rod to be cut clamped by the first silicon rod clamp by the cutting device, and simultaneously switching the grinding device to the second processing position by the second switching mechanism to grind the cut silicon rod clamped by the second silicon rod clamp; in some embodiments, the discharging of the ground silicon rods can be further realized by arranging a silicon rod discharging device in the silicon rod processing equipment, wherein the silicon rod discharging device can be further configured to be movable between the first processing area and the second processing area so as to meet the requirements of discharging at different moments and respectively butt the first processing area and the second processing area;
by repeating the process, the silicon rod processing equipment can simultaneously carry out silicon rod processing operation on the two processing positions, so that the silicon rod processing efficiency is improved; meanwhile, the processing positions held by the cutting device are converted through the first conversion mechanism, the processing positions where the grinding device is located are converted through the second conversion mechanism, the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the squaring, cutting and grinding operation can be realized at any processing position, and the transfer path of the silicon rod among different working procedures is simplified; meanwhile, at the same time, the cutting device and the grinding device can be positioned at different processing positions, and different processing procedures can be simultaneously carried out on the silicon rod processing platform; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation.
The application also provides a silicon rod processing method in the second aspect, is applied to in the silicon rod processing equipment, silicon rod processing equipment is including frame, cutting device, grinder, first silicon rod anchor clamps and the second silicon rod anchor clamps that have silicon rod processing platform, wherein, first switching mechanism is located to cutting device, first mounting position of silicon rod processing platform is located to first switching mechanism, grinder locates the second switching mechanism, the second mounting position of silicon rod processing platform is located to the second switching mechanism, first silicon rod anchor clamps and second silicon rod anchor clamps correspond respectively and locate the first processing position and the second processing position of silicon rod processing platform, including following step:
in step S10, the cutting device is located at the first processing location and the grinding device is located at the second processing location;
at the initial moment, when the cutting device is positioned at the first processing position and the grinding device is positioned at the second processing position, the first silicon rod to be cut is conveyed to the silicon rod processing platform so as to be clamped by the first silicon rod clamp at the first processing position; in some implementations, the silicon rod to be cut can be obtained by cutting a long silicon rod by a cutting frame in a silicon rod processing device, and in other implementations, the silicon rod to be cut can also be obtained by processing the silicon rod cutting device;
in step S11, a first silicon rod clamp at the first processing location is loaded with a first silicon rod to be cut;
in order to clamp the silicon rod to be cut by the silicon rod clamp, in some implementations, the silicon rod is conveyed to a clamping position corresponding to the silicon rod clamp at the processing location by a feeding device, and in some feasible embodiments, the feeding device can convey the silicon rod to be cut to a predetermined loading position corresponding to the silicon rod clamp after clamping the silicon rod to be cut from a predetermined loading mechanism.
In step S12, the first silicon rod clamp is caused to clamp the first silicon rod to be cut and moved in the first direction to cause the cutting device to feed and cut the first silicon rod to be cut, thereby obtaining a first cut silicon rod having a cross-section similar to a rectangle; wherein the first direction is parallel to the axis direction of the silicon rod;
the first silicon rod clamp clamps the silicon rod to be cut at the preset loading position and then moves along the axis direction of the silicon rod at the first processing position, so that a cutting wire saw in the cutting device feeds relative to the silicon rod to be cut to realize cutting; here, a guiding structure in the silicon rod axis direction may be disposed on the processing location to enable the silicon rod clamp to move along the guiding structure under the driving of a power source, and the guiding structure is, for example, a guide pillar or a guide rail; the cutting device can be matched with the silicon rod clamp and the silicon rod clamped by the silicon rod clamp to move, for example, the position of the cutting wire saw is adjusted to avoid the silicon rod clamp from clamping the silicon rod subjected to primary cutting and returning to the initial position, the silicon rod clamp drives the clamped silicon rod to rotate for a certain angle, and then the silicon rod is fed relative to the cutting wire saw from the initial position to perform secondary cutting until the cut silicon rod with a rectangular or quasi-rectangular cross section is formed; wherein the initial position is, for example, a predetermined loading position of the silicon rod clamp, wherein the initial position is a position at which cutting can be achieved by moving the silicon rod towards the cutting wire saw; in certain embodiments, a flaw-piece conveying mechanism may also be configured in the silicon rod processing apparatus to convey the flaw-pieces formed by cutting out from the working area.
In step S13, the first switching mechanism drives the cutting device to switch from the first processing area to the second processing area, and the second switching mechanism drives the grinding device to switch from the second processing area to the first processing area;
in some embodiments, the first switching mechanism includes a first rotating shaft, and switching of the processing area where the cutting device is located can be achieved by driving the cutting device to rotate along the first rotating shaft by a preset angle; the second switching mechanism comprises a second rotating shaft, and switching of the processing area of the grinding device can be realized by driving the grinding device to rotate by a preset angle along the second rotating shaft;
in a scene, when the first machining area and the second machining area are arranged on two opposite sides of a second direction, the first rotating shaft can be arranged in the first direction, and the second rotating shaft is arranged in the direction of the plumb line; and the first direction, the second direction and the plumb line direction are pairwise perpendicular.
In step S14, moving a first cut silicon rod in a first direction by a first silicon rod clamp to grind the first cut silicon rod in cooperation with a grinding device, so as to obtain a first ground silicon rod; enabling the second silicon rod clamp to load a second silicon rod to be cut and clamping the second silicon rod to be cut to move along the first direction so as to enable the cutting device to feed and cut relative to the second silicon rod to be cut, and obtaining a second cut silicon rod with a quasi-rectangular cross section;
after the first cut silicon rod is obtained through processing, the second switching mechanism drives the grinding device to be switched from the first processing position to the second processing position, the first silicon rod clamp can drive the clamped first cut silicon rod to move along the guide structure in the state, the grinding device drives the grinding tool to move along the plumb line direction and is matched with the first silicon rod clamp to move in the first direction, therefore, the side face of the first cut silicon rod is ground, the first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod, the grinding face of the grinding device to the silicon rod can be switched, and therefore the first ground silicon rod can be obtained.
In the process of grinding operation in the first processing location, the second silicon rod clamp can be loaded with the second silicon rod to be cut, the implementation manner that the second silicon rod clamp is loaded with the second silicon rod to be cut can refer to the manner that the first silicon rod clamp is loaded with the first silicon rod to be cut, and the cutting device switched to the second processing location can also cut the second silicon rod to be cut clamped by the second silicon rod clamp so as to obtain the second cut silicon rod.
In step S15, unloading the first ground silicon rod held by the first silicon rod clamp and loading a third silicon rod to be cut; the first switching mechanism drives the cutting device to switch from the second processing area to the first processing area, and the second switching mechanism drives the grinding device to switch from the first processing area to the second processing area;
discharging the first ground silicon rod at the first processing position, wherein the first silicon rod clamp can be loaded with a third silicon rod to be cut, the first switching mechanism drives the cutting device to switch from the second processing position to the first processing position, the cutting device can cut the third silicon rod to be cut clamped by the first silicon rod clamp, meanwhile, the second switching mechanism drives the grinding device to switch from the first processing position to the second processing position, and the grinding device can grind the second cut silicon rod clamped by the second silicon rod clamp; in some embodiments, the discharging of the first ground silicon rod may also be achieved by providing a silicon rod discharging device in the silicon rod processing apparatus, which may also be configured to be movable between the first processing zone and the second processing zone to accommodate the need for discharging at different times to dock the first processing zone and the second processing zone, respectively.
In step S16, the cutting device in the first processing location cuts the third silicon rod to be cut to obtain a third cut silicon rod, and the grinding device in the second processing location grinds the second cut silicon rod to obtain a second ground silicon rod.
The implementation manner of cutting the third silicon rod to be cut by the cutting device at the first processing location can refer to the implementation manner of cutting the first silicon rod to be cut or the second silicon rod to be cut by the cutting device in the previous step; similarly, the grinding device can grind the second cut silicon rod in reference to the grinding device for the first cut silicon rod.
By repeating the process, the silicon rod processing equipment can simultaneously carry out silicon rod processing operation on the two processing positions, so that the silicon rod processing efficiency is improved; meanwhile, the processing position where the cutting device is located is converted through the first conversion mechanism, the processing position where the grinding device is located is converted through the second conversion mechanism, the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the squaring, cutting and grinding operation can be realized at any processing position, and the transfer path of the silicon rod among different working procedures is simplified; meanwhile, at the same time, the cutting device and the grinding device can be positioned at different processing positions, and different processing procedures can be respectively carried out on the silicon rod processing platform; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims (64)

1. A silicon rod processing apparatus, comprising:
the silicon rod processing platform is provided with a first processing region and a second processing region;
the first silicon rod clamp is arranged on the first processing platform and used for clamping a silicon rod and driving the clamped silicon rod to move along a first direction; wherein the first direction is parallel to the axis direction of the silicon rod;
the second silicon rod clamp is arranged on the second processing platform and used for clamping the silicon rod and driving the clamped silicon rod to move along the first direction;
the cutting device is arranged on the first conversion mechanism and used for cutting the silicon rod on the first processing position or the second processing position of the silicon rod processing platform to form a cut silicon rod; the first conversion mechanism is arranged at a first installation position on the silicon rod processing platform and drives the cutting device to convert the position between a first processing position and a second processing position;
the grinding device is arranged on the second conversion mechanism and is used for grinding the cut silicon rod on the first processing area or the second processing area of the silicon rod processing platform; the second switching mechanism is arranged at a second mounting position on the silicon rod processing platform and drives the grinding device to switch positions between the first processing area and the second processing area.
2. The silicon rod processing apparatus as recited in claim 1, wherein the first switching mechanism comprises a first rotary shaft along which the cutting device is rotated by a preset angle to switch positions between the first processing zone location and the second processing zone location; the second switching mechanism comprises a second rotating shaft, and the grinding device rotates by a preset angle along the second rotating shaft so as to switch the position between the first machining area and the second machining area.
3. The silicon rod processing apparatus as set forth in claim 2, wherein the first axis of rotation is disposed in a first direction and the second axis of rotation is disposed in a direction of a plumb line; the first processing area and the second processing area are arranged on two opposite sides of the second direction, wherein the first direction, the second direction and the plumb line direction are pairwise perpendicular.
4. The silicon rod processing apparatus as recited in claim 2, wherein the second conversion mechanism further comprises a rotary drive mechanism for driving the grinding device in rotation, the rotary drive mechanism comprising:
the driving gear is coupled to the power driving source;
and the driven gear is meshed with the driving gear and is connected to the second rotating shaft.
5. The silicon rod processing apparatus as recited in claim 2, wherein the first conversion mechanism comprises:
the bracket is used for arranging the cutting device;
and the rotating driving source is used for driving the cutting device to rotate along the first rotating shaft relative to the bracket so as to switch the position between the first processing position and the second processing position.
6. The silicon rod processing apparatus as set forth in claim 1, wherein the cutting device comprises:
a cutting frame;
at least one wire cutting unit is located the cutting frame, the wire cutting unit includes: the cutting wire is wound around the plurality of cutting wheels and the transition wheels to form at least one cutting wire saw.
7. The silicon rod processing apparatus as recited in claim 6, wherein the wire cutting unit comprises:
cutting a line;
the first cutting wheel and the second cutting wheel are arranged on the cutting frame, and cutting wires are wound on the first cutting wheel and the second cutting wheel to form a cutting wire saw; the wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel;
the first transition wheel is adjacent to the first cutting wheel, and the cutting lines of the first cutting wheel and the first transition wheel are positioned in a plane where a first cutting line groove for winding the cutting lines is positioned in the first cutting wheel in the state of pulling the cutting lines;
the second transition wheel is arranged adjacent to the second cutting wheel, and the cutting lines of the second cutting wheel and the second transition wheel are positioned in a plane where a second cutting line groove for winding the cutting lines in the second cutting wheel is positioned in the state of drawing the cutting lines;
the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for pulling the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the wire cutting unit, the cutting accommodating space can accommodate a silicon rod to be cut, and only the cutting wire saw in the cutting device is intersected with the cutting accommodating space.
8. The silicon rod processing apparatus as recited in claim 7, wherein the first transition wheel, the second transition wheel, and at least one third transition wheel are used to pull the cutting wire away from the cutting accommodation space.
9. The silicon rod processing apparatus as recited in claim 7, wherein the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel, and the third transition wheel to form an end-to-end closed loop cutting line.
10. The silicon rod processing apparatus as recited in claim 7, wherein the wire cutting unit includes two third transition wheels therein, and wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form an endless closed loop cutting wire.
11. The silicon rod processing apparatus as recited in claim 7, wherein the cutting device further comprises a cutting wire drive device for driving the cutting wire to operate to cut a silicon rod.
12. The silicon rod processing apparatus as recited in claim 11, wherein the cutting wire drive is a motor having a power take-off shaft and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel.
13. The silicon rod processing apparatus as recited in claim 6, wherein the wire cutting unit further comprises:
the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving the plurality of cutting wheels in the linear cutting unit to move along the direction vertical to the wheel surfaces of the cutting wheels, wherein the wheel surfaces of the cutting wheels are arranged in the horizontal plane direction or the vertical plane direction parallel to the first direction.
14. The silicon rod processing apparatus as recited in claim 13, wherein the cutting device comprises a single-wire cutting unit, the pitch adjustment mechanism comprising:
the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit;
and the driving source is used for driving the screw rod to rotate.
15. The silicon rod processing apparatus as recited in claim 13, wherein the cutting device comprises a single-wire cutting unit, the pitch adjustment mechanism comprising:
the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit;
and the driving source is used for driving the telescopic piece to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.
16. The silicon rod processing apparatus as recited in claim 13, wherein the cutting device comprises a first wire cutting unit and a second wire cutting unit disposed in parallel and in opposition, at least one of the first wire cutting unit and the second wire cutting unit being driven by the pitch adjustment mechanism to move in an orthogonal direction along a wheel face of the cutting wheel.
17. The silicon rod processing apparatus as set forth in claim 16 wherein the pitch mechanism comprises:
the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit;
and the driving source is used for driving the screw rod to rotate.
18. The silicon rod processing apparatus as set forth in claim 16 wherein the pitch mechanism comprises:
the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the first wire cutting unit or the second wire cutting unit;
and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.
19. The silicon rod processing apparatus as set forth in claim 16 wherein the pitch mechanism comprises:
the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first linear cutting unit and the second linear cutting unit;
and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel.
20. The silicon rod processing apparatus as recited in claim 6, wherein the first silicon rod clamp is provided at the first processing location by a first guiding structure, wherein the first guiding structure is a transfer rail or a guide pillar arranged in a first direction; the second silicon rod clamp is arranged at the second processing position through a second guide structure, wherein the second guide structure is a transfer guide rail or a guide pillar arranged along the first direction.
21. The silicon rod processing apparatus as recited in claim 20, wherein the cutting wire saw is in a second direction, and wherein either one of the first and second silicon rod clamps comprises:
the clamping arm mounting seats are arranged on the corresponding transfer guide rails;
the power source is used for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide pillar;
the pair of clamping parts are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod;
the clamping arms are arranged in the horizontal plane and are provided with near ends connected to the clamping arm mounting seats and far ends connected to the clamping parts;
the clamping arm driving mechanism is used for driving at least one of the pair of clamping arms to move along the first direction so as to adjust the distance between the pair of clamping arms in the first direction.
22. The silicon rod processing apparatus as recited in claim 21, wherein either one of the first and second silicon rod clamps further comprises a clamping portion rotating mechanism for driving the clamping portion to rotate.
23. The silicon rod processing apparatus as set forth in claim 21, wherein the clamping arm drive mechanism comprises:
the screw rod is arranged along a first direction and is associated with any one of the pair of clamping arms;
and the driving source is used for driving the associated clamping arm to move along the first direction.
24. The silicon rod processing apparatus as set forth in claim 21, wherein the clamping arm drive mechanism comprises:
the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the pair of clamping arms;
and the driving source is used for driving the screw rod to rotate so that the pair of clamping arms move towards or away from each other along the first direction.
25. The silicon rod processing apparatus as recited in claim 20, wherein the at least one cutting wire saw is disposed in a direction of a plumb line, and wherein either one of the first and second silicon rod clamps comprises:
the clamping arm mounting seat is arranged on the corresponding transfer guide rail or guide pillar;
the power source is used for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide pillar;
the pair of clamping parts are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod;
the clamping arms are arranged in a plane perpendicular to the second direction and are provided with near ends connected to the clamping arm mounting seats and far ends connected to the clamping parts;
the clamping arm driving mechanism is used for driving at least one of the pair of clamping arms to move along the first direction so as to adjust the distance between the pair of clamping arms in the first direction.
26. The silicon rod processing apparatus as recited in claim 25, wherein either one of the first and second silicon rod clamps further comprises a clamping portion rotating mechanism for driving the clamping portion to rotate.
27. The silicon rod processing apparatus as set forth in claim 25, wherein the clamping arm drive mechanism comprises:
the screw rod is arranged along a first direction and is associated with any one of the pair of clamping arms;
and the driving source is used for driving the associated clamping arm to move along the first direction.
28. The silicon rod processing apparatus as set forth in claim 25, wherein the clamping arm drive mechanism comprises:
the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the pair of clamping arms;
and the driving source is used for driving the screw rod to rotate so that the pair of clamping arms move towards or away from each other along the first direction.
29. The silicon rod processing apparatus as recited in claim 6, further comprising a flaw-piece supporting mechanism for abutting against an outer side of the silicon rod and supporting the flaw-piece formed by the cutting.
30. The silicon rod processing apparatus as set forth in claim 29, wherein the flaw-piece supporting mechanism comprises:
a holding assembly comprising: the supporting part is controlled to abut against and support the flaw-piece; the cylinder or the hydraulic pump comprises a telescopic part which is connected with the bearing part so as to control the bearing part to be far away from or abut against the flaw-piece;
an attachment portion for connecting the support assembly to the cutting device.
31. The silicon rod processing apparatus as set forth in claim 30 wherein the susceptor comprises:
at least two bearing blocks are arranged at intervals along the first direction and are provided with bearing surfaces used for contacting and bearing the side leather.
32. The silicon rod processing apparatus as set forth in claim 30 wherein the susceptor comprises:
at least two supporting rods arranged along the first direction and used for contacting and supporting the flaw-piece;
the connecting parts are arranged on two opposite sides of the cutting frame in the first direction to correspond to two opposite ends of the bearing rods and are used for connecting the at least two bearing rods and the telescopic parts.
33. The silicon rod processing apparatus as set forth in claim 29, further comprising a flaw-piece dislocation mechanism disposed in the first and second processing sections for pushing the flaw-piece in a first direction to disengage the flaw-piece from the flaw-piece support mechanism.
34. The silicon rod processing apparatus as recited in claim 33, wherein the flaw-piece misalignment mechanism comprises an air cylinder or a hydraulic pump, wherein a telescoping rod of the air cylinder or hydraulic pump is disposed in a first direction.
35. The silicon rod processing apparatus as recited in claim 1 or 29, further comprising a flaw-piece conveying mechanism for receiving the flaw-pieces formed by the cutting and transporting the flaw-pieces to a discharge area.
36. The silicon rod processing apparatus as set forth in claim 35, wherein the flaw-piece conveying mechanism comprises:
the conveying part is used for bearing the flaw-piece;
and the conveying driving source is used for driving the conveying part to move along a first direction so as to convey the edge leather.
37. The silicon rod processing apparatus as set forth in claim 1, wherein the grinding device comprises:
at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are parallel and are oppositely arranged;
and the grinding tool advancing and retreating mechanism is used for driving at least one of the pair of grinding tools to move along the direction of the plumb line.
38. The silicon rod processing apparatus as set forth in claim 37, wherein the grinder advancing and retracting mechanism comprises:
the advance and retreat guide rail is arranged on the second conversion mechanism along the direction of the plumb line and used for arranging the grinding tool;
a driving source for driving at least one of the grinding tools to move along the advancing and retreating guide rail.
39. The silicon rod processing apparatus of claim 37, wherein either the first or second silicon rod clamp further comprises a grinding repair device for dressing a grinding tool in the corresponding grinding device.
40. The silicon rod processing apparatus as set forth in claim 39, wherein the abrasive repair device comprises:
the mounting main body is arranged on the silicon rod clamp and used for reciprocating along a first direction under the driving of the silicon rod clamp;
and the grinding part is arranged on the mounting main body and is used for detecting or grinding the grinding tool of the grinding device.
41. The silicon rod processing apparatus as recited in claim 40, comprising two thinning portions disposed on opposite sides of the mounting body.
42. The silicon rod processing apparatus as recited in claim 1, further comprising chamfering means for grinding the edges of the cut silicon rods.
43. The silicon rod processing apparatus as set forth in claim 42, wherein the chamfering device comprises:
at least one pair of chamfering grinding tools, wherein chamfering grinding surfaces of the pair of chamfering grinding tools are parallel and are oppositely arranged;
and the chamfering grinding tool advancing and retreating mechanism is used for driving at least one of the pair of grinding tools to move along the direction of the plumb line.
44. The silicon rod processing apparatus as recited in claim 43, wherein the chamfering device is connected to the second switching mechanism for switching between a first processing location and a second processing location under the drive of the second switching mechanism to chamfer the cut silicon rods held by the first or second silicon rod clamps.
45. The silicon rod processing apparatus as set forth in claim 44, wherein the chamfer grinder advancing and retreating mechanism comprises:
the advance and retreat guide rails are arranged on the second conversion mechanism along the direction of the plumb line and used for arranging the at least one pair of chamfer grinding tools;
and the advancing and retreating driving unit is used for driving at least one chamfering grinding tool in the pair of chamfering grinding tools to move along the advancing and retreating guide rail.
46. The silicon rod processing apparatus as recited in claim 1, further comprising a silicon rod unloading device for receiving the ground silicon rods held by the first and second silicon rod clamps.
47. The silicon rod processing apparatus as claimed in claim 46, wherein the silicon rod discharge device comprises:
the conveying belt is used for bearing the ground silicon rods;
and the discharging driving source is used for driving the conveyor belt to move so as to drive the ground silicon rod carried by the conveyor belt to move along the first direction.
48. The silicon rod processing apparatus as claimed in claim 46, wherein the silicon rod discharge device is provided on the silicon rod processing platform by means of a displacement mechanism for movement between a first processing position and a second processing position driven by the displacement mechanism.
49. The silicon rod processing apparatus as claimed in claim 48, wherein the silicon rod unloading device is provided to the displacement mechanism by means of a lifting mechanism, wherein the lifting mechanism comprises:
the lifting guide structure is arranged on the shifting mechanism and is connected with the silicon rod unloading device;
and the lifting driving source is used for driving the silicon rod discharging device to move up and down along the plumb line direction.
50. The silicon rod processing apparatus as recited in claim 1, further comprising a silicon rod truncating device comprising:
the silicon rod bearing device is used for bearing the single crystal silicon rod;
and the cutting-off frame comprises a cutting wire saw which is capable of lifting relative to the silicon rod bearing device and is used for cutting off the single crystal silicon rod to form a silicon rod to be cut.
51. The silicon rod processing apparatus as claimed in claim 50, wherein the silicon rod carrier is a chain conveyor mechanism, a double-speed chain mechanism or a belt mechanism.
52. The silicon rod processing apparatus as recited in claim 50, wherein the silicon rod chopping device and the grinding device are respectively located at opposite ends of the cutting device in the first direction.
53. The silicon rod processing apparatus as claimed in claim 1 or 50, characterized in that it further comprises a feeding device for transporting a silicon rod to be cut to a first processing location or a second processing location, in order to load the first silicon rod clamp or the second silicon rod clamp with a silicon rod to be cut.
54. The silicon rod processing apparatus as recited in claim 53, further comprising a predetermined loading mechanism disposed along the first direction for carrying the silicon rod to be cut such that the loading device delivers the silicon rod to be cut from the predetermined loading mechanism to the first processing location or the second processing location.
55. The silicon rod processing apparatus as recited in claim 53, wherein the loading device comprises at least one clamping assembly, wherein the clamping assembly comprises:
the material taking arm is suspended above the silicon rod processing platform through an installation part, and the top frame comprises a guide structure arranged along a second direction so that the installation part has the freedom degree of moving along the second direction;
the clamping part is arranged at the bottom end of the material taking arm and used for clamping the silicon rod to be cut.
56. The silicon rod processing apparatus as recited in claim 55, wherein the mounting portion comprises a translation mechanism disposed along the first direction for configuring the take-off arm to have freedom of movement along the first direction.
57. The silicon rod processing apparatus as recited in claim 55, wherein the clamping member comprises:
the clamping device comprises a first clamping block and a second clamping block which are oppositely arranged, wherein the first clamping block and the second clamping block are provided with clamping cambered surfaces;
and the clamping block driving mechanism is used for driving the first clamping block and the second clamping block to open and close.
58. The silicon rod processing apparatus as set forth in claim 57 wherein the clamping block drive mechanism comprises:
the first rack is linked with the first clamping block;
the second rack is linked with the second clamping block;
the clamping cylinder is arranged on the first rack or the second rack and is used for pushing the first rack or the second rack to move in the rack extending direction;
and the transmission gear is meshed with the first rack and the second rack and is used for driving the first clamping block and the second clamping block to move oppositely to execute a closing action when rotating in the forward direction and driving the first clamping block and the second clamping block to move oppositely to execute an opening action when rotating in the reverse direction.
59. The silicon rod processing apparatus as set forth in claim 57 wherein the clamping block drive mechanism comprises:
the first rack is linked with the first clamping block;
the second rack is linked with the second clamping block;
and the driving gear is connected to a power output shaft of the driving motor, meshed with the first rack and the second rack and used for driving the first clamping block and the second clamping block to move oppositely to execute a closing action when rotating forwards and driving the first clamping block and the second clamping block to move oppositely to execute an opening action when rotating reversely.
60. The silicon rod processing apparatus as set forth in claim 57 wherein the clamping block drive mechanism comprises:
the opening and closing gear is arranged on the first clamping block and the second clamping block;
the opposite two ends of the rack are respectively provided with insections which correspond to the meshing of the opening and closing gears on the first clamping block and the second clamping block;
and the driving source is used for driving the rack to move forwards and backwards along the direction of the rack.
61. The silicon rod processing apparatus as set forth in claim 57 wherein the clamping block drive mechanism comprises:
two ends of the bidirectional screw rod are in threaded connection with the first clamping block and the second clamping block;
and the driving source is used for driving the screw rod to rotate so as to enable the first clamping block and the second clamping block to move towards or away from each other.
62. The silicon rod processing apparatus as recited in claim 55, wherein the take-off arm is elevatably disposed at the mounting portion.
63. The silicon rod processing apparatus as recited in claim 53, wherein the loading device further comprises a sensing device for detecting a silicon rod held by the first or second silicon rod clamp to determine that the first or second silicon rod clamp holds a silicon rod at a predetermined loading position.
64. The silicon rod processing apparatus as claimed in claim 63, wherein the sensor device is a contact sensor or a distance measuring sensor.
CN202022111095.8U 2020-08-28 2020-09-23 Silicon rod processing equipment Active CN214394870U (en)

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