WO2022041864A1

WO2022041864A1 - Cutting apparatus and silicon rod processing device

Info

Publication number: WO2022041864A1
Application number: PCT/CN2021/094824
Authority: WO
Inventors: 苏静洪; 卢建伟; 钱春军; 曹奇峰; 李鑫
Original assignee: 天通日进精密技术有限公司
Priority date: 2020-08-28
Filing date: 2021-05-20
Publication date: 2022-03-03

Abstract

A cutting apparatus and a silicon rod processing device. The cutting apparatus is provided with at least one wire cutting unit (22). In each wire cutting unit (22), by means of the arrangement of a cutting wheel (221) and a transition wheel (222), a cutting line (223) is caused to wind between the cutting wheel (221) and the transition wheel (222) by using a means of connecting end-to-end, and the wire cutting units (22) hence form a cutting accommodation space that may be used for the square cutting of a silicon rod. The overall structure of the cutting apparatus is simplified, helping to reduce costs of the apparatus. Meanwhile, the annular cutting line (223) may prevent the acceleration and deceleration process of the cutting line (223) from affecting cutting accuracy during the process of being operated to cut, so that cutting accuracy is improved, and it is beneficial to simplify a subsequent process.

Description

Cutting device and silicon rod processing equipment

technical field

The present application relates to the technical field of silicon workpiece processing, in particular to a cutting device and silicon rod processing equipment.

Background technique

In the field of photovoltaic power generation, common crystalline silicon solar cells are fabricated on high-quality silicon wafers, which are cut from solar silicon material by wire saws. At present, the wire cutting technology represented by diamond wire has the characteristics of high production efficiency, low operation cost and high operation accuracy, and is widely used in the production of silicon material cutting, and the silicon material can be, for example, monocrystalline silicon material or polycrystalline silicon material , the silicon material cutting operation includes but is not limited to cutting operation, square rooting operation, slicing operation and the like.

Taking the application of wire cutting technology to the squaring operation of single crystal silicon rods as an example, the silicon rods to be cut are first placed and positioned, and then the wire cutting device is used to enter from one end face of the silicon rods to be cut and feed along the length of the silicon rods. Until the cutting wire saw penetrates from the other end face of the silicon rod to be cut, so as to realize the cutting of four parallel axial sections in the circumferential direction of the silicon rod, wherein the commonly used wire cutting devices include single-wire cutting devices and multi-wire cutting devices .

The principle of the cutting process is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. In this process, there are problems that the overall length of the cutting wire is too long to cause uneven tension in the cutting wire, and the cutting wire runs reciprocatingly so that the cutting wire is reciprocally transferred (wound) between the take-up reel and the pay-off reel , When the running direction of the cutting line is switched, it usually experiences the process of running acceleration and deceleration, which may form a certain waviness on the cutting surface or make the cutting surface flat.

SUMMARY OF THE INVENTION

In view of the above-mentioned shortcomings of the related art, the purpose of the present application is to provide a cutting device and a silicon rod processing equipment to solve the problem of low cutting precision existing in the prior art.

In order to achieve the above object and other related objects, the present application discloses, in a first aspect, a cutting device for silicon rod processing, comprising: a cutting frame and at least a wire cutting unit, wherein the wire cutting unit includes: a cutting wire; A cutting wheel and a second cutting wheel are arranged on the cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting line is wound around the first cutting wheel and the second cutting wheel a cutting wheel to form a cutting wire saw; a first transition wheel, arranged beside the first cutting wheel, is used for pulling the cutting wire around the first cutting wheel to make the cutting around the first cutting wheel The line is coplanar on the plane where the first cutting line groove of the first cutting wheel is located; the second transition wheel is arranged on the side of the second cutting wheel, and is used for pulling the cutting line around the second cutting wheel to Make the cutting line around the second cutting wheel coplanar on the plane where the second cutting line groove of the second cutting wheel is located; at least one third transition wheel is arranged on the first transition wheel and the second transition wheel is used to pull the cutting line between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the to-be-wire cutting unit; wherein, the cutting line is wound around the The first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel form an end-to-end closed-loop cutting line.

The present application discloses a silicon rod processing equipment in a second aspect, which is characterized by comprising: a machine base having a silicon rod processing platform; Cut the silicon rod to be cut.

To sum up, in one embodiment, the cutting device of the present application has the following beneficial effects: the cutting device has at least one line cutting unit, and in the line cutting unit, by determining the arrangement of the cutting wheel and the transition wheel, the cutting line Winding between the cutting wheel and the transition wheel in an end-to-end manner, the overall structure of the cutting device can be simplified, which is beneficial to reduce the cost of the device; The acceleration and deceleration processes of the cutting line are prevented from affecting the cutting precision, so that the cutting precision is improved, which is beneficial to simplify the subsequent process.

Description of drawings

The invention to which this application relates is set forth with particularity characteristic of the appended claims. The features and advantages of the inventions involved in this application can be better understood by reference to the exemplary embodiments described in detail hereinafter and the accompanying drawings. A brief description of the drawings is as follows:

FIG. 1 shows a schematic structural diagram of the cutting device of the present application in an embodiment.

FIG. 2 shows a schematic structural diagram of the cutting device of the present application in an embodiment.

FIG. 3 is a schematic structural diagram of a wire cutting unit of the cutting device of the present application in an embodiment.

4a and 4b respectively show a front view and a three-dimensional schematic view of a wire cutting unit of the cutting device of the present application in an embodiment.

FIG. 5 is a schematic diagram showing a part of the structure of the cutting device of the present application in one embodiment.

FIG. 6 is a schematic diagram showing a part of the structure of the silicon rod processing equipment of the present application in an embodiment.

7a and 7b are respectively a top view and a three-dimensional schematic view of any silicon rod holder in the silicon rod processing apparatus shown in FIG. 6 .

FIG. 8 is a schematic structural diagram of the cutting device of the present application in an embodiment.

FIG. 9 shows a simplified structural schematic diagram of the silicon rod processing equipment of the present application in an embodiment.

FIG. 10 is a schematic diagram showing a part of the structure of the silicon rod processing equipment of the present application in an embodiment.

FIG. 11 is a schematic structural diagram of an embodiment of the silicon rod processing equipment of the present application.

FIG. 12 is a schematic diagram showing a part of the structure of the silicon rod processing equipment shown in FIG. 11 .

FIG. 13 shows a schematic structural diagram of the silicon rod processing equipment of the present application in an embodiment.

detailed description

The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It is to be understood that other embodiments may be utilized and mechanical, structural, electrical, as well as operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered limiting, and the scope of embodiments of the present application is limited only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. Spatially related terms, such as "upper," "lower," "left," "right," "below," "below," "lower," "above," "upper," etc., may be used in the text for ease of description The relationship of one element or feature shown in the figures to another element or feature.

Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first cutting wheel may be referred to as a second cutting wheel, and similarly, a second cutting wheel may be referred to as a first cutting wheel, without departing from the scope of the various described embodiments. The first cutting wheel and the second cutting wheel are both describing one cutting wheel, but unless the context clearly indicates otherwise, they are not the same cutting wheel. Similar situations also include the first transition wheel, the second transition wheel and the third transition wheel, or the first rack and the second rack, and so on.

Also, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context dictates otherwise. It should be further understood that the terms "comprising", "comprising" indicate the presence of stated features, steps, operations, elements, components, items, kinds, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, assemblies, items, categories, and/or groups. The terms "or" and "and/or" as used herein are to be construed to be inclusive or to mean any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

In industrial production, crystalline silicon is usually processed into the form of silicon wafers and then used for product manufacturing. Among them, the originally obtained silicon rods include single crystal silicon rods and polycrystalline silicon rods. The method grows rod-shaped single crystal silicon from the melt, such as single crystal silicon rods with a length of 5000mm or 5360mm, or a single crystal silicon rod with a length of about 800mm, which is common in the processing of silicon rods. Precipitation technology such as chemical vapor deposition technology allows silicon to precipitate silicon rods on the surface of silicon core wires.

As described in the background art, in the existing manufacturing process of silicon wafers, generally, polycrystalline silicon brittle materials are first pulled into single crystal silicon rods, and then a square machine is used to square them; at this time, the cutting mechanism advances along the length direction of the silicon rods. Four parallel planes are cut out in the circumferential direction of the silicon rod, so that the cross-section of the silicon rod is similar to a rectangle; required silicon.

In the common implementation of square root cutting, the steel wire or diamond wire is guided by a wire wheel (transition wheel), a wire saw or a wire mesh is formed on the cutting roller (cutting wheel), and the workpiece to be processed passes through the worktable. The rise and fall of the wire saw or the rise and fall of the wire mesh realizes the feeding of the workpiece. Under the action of the pressure pump, the cooling water automatic spraying device installed on the equipment sprays cold water on the steel wire or diamond wire and the cutting part of the workpiece, and the reciprocating operation of the steel wire or diamond wire generates cutting to remove the material to be processed once. Cut into multiple pieces at the same time. Compared with traditional saw blade, grinding wheel and inner circle cutting, wire cutting technology has the advantages of high efficiency, high productivity and high precision.

Generally, the arrangement of the cutting wheel and the transition wheel in the cutting device is complicated, the corresponding winding method is complicated, and the required cutting line is too long, so that there may be a problem of uneven tension in the cutting line, and it is difficult to control the cutting force and cutting speed. This leads to the problem that the cutting accuracy is lowered; furthermore, in the existing cutting device, the cutting wire needs to reciprocate so that the cutting wire is reciprocally wound between the wire take-up reel and the pay-off reel as the wire storage reel, and the cutting wire needs to undergo acceleration. The process of deceleration and deceleration makes the cutting speed uneven, which may result in a decrease in the accuracy of the cutting surface, such as a reduction in flatness, and the formation of surface ripples.

In view of this, the present application provides a cutting device, which can be applied to silicon rod processing equipment. In the cutting device of the present application, the cutting wheel and the transition wheel in the wire cutting unit are arranged and the looped cutting wire is wound. During the process, the cutting line can run in one direction and at high speed, which is beneficial to improve the cutting accuracy. At the same time, the wire storage drum can be omitted from the cutting device. The simplified structure of the cutting device can reduce the production cost and reduce the equipment space occupied by the cutting device. , which is beneficial to flexibly arrange the cutting device in the silicon rod processing equipment, so as to cooperate with other components in the silicon rod processing equipment to complete the processing operation.

In the embodiments provided in this application, in order to clarify the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. For example, the longitudinal extension direction of the silicon rod processing equipment provided with the cutting device, that is, the axis line (axis) direction of the silicon rod when the silicon rod is placed thereon is defined as the first direction (ie, the front-rear direction), The width extension direction of the silicon rod processing equipment, that is, the left-right direction is defined as the second direction (that is, the left-right direction), and the re-perpendicular direction is defined as the third direction (that is, the vertical direction, the vertical direction, the up-down direction or the vertical direction). lift direction).

In any of the embodiments provided in this application, the end faces of the silicon rods refer to two faces in the length direction of the silicon rods, that is, two faces opposite to each other along the first direction. For example, the two end faces of the silicon rods to be cut are circular. Or quasi-circular, the sides of the silicon rod are arc surfaces; for the cut silicon rod, its two end faces are rectangular or quasi-rectangular, and the sides of the silicon rod are usually four rectangular in the length direction of the silicon rod. side.

The cutting device includes: a cutting frame and at least one wire cutting unit; wherein, the at least one wire cutting unit is provided on the cutting frame, and the wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, the A cutting wire is wound around the plurality of cutting wheels and transition wheels to form at least one cutting wire saw.

In some embodiments, a plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or, the plurality of cutting wheels and transition wheels are arranged on a bracket, a connecting plate, or a mounting frame through a bracket, a connecting plate, or a mounting frame. The cutting frame, here, the carrier for arranging a plurality of cutting wheels and transition wheels can be in different forms, which is not limited in this application.

In the embodiment provided in this application, the cutting device includes: a cutting frame and at least a wire cutting unit, wherein the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting The frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; the first transition wheel, set On the side of the first cutting wheel, for pulling the cutting line around the first cutting wheel to make the cutting line around the first cutting wheel coplanar with the first cutting of the first cutting wheel The plane where the wire groove is located; the second transition wheel is arranged beside the second cutting wheel and is used for pulling the cutting line around the second cutting wheel to make the cutting line around the second cutting wheel coplanar On the plane where the second cutting wire groove of the second cutting wheel is located; at least one third transition wheel is arranged between the first transition wheel and the second transition wheel, used for pulling the first transition wheel and the The cutting line between the second transition wheels, so that a cutting accommodating space is formed in the to-be-wired cutting unit; wherein, the cutting line is wound around the first cutting wheel, the second cutting wheel, and the first transition wheel , between the second transition wheel and the third transition wheel to form an end-to-end closed-loop cutting line.

Please refer to FIG. 1 , which is a simplified schematic diagram of an embodiment of the cutting device of the present application.

In the embodiment shown in FIG. 1 , the wire cutting unit 22 is disposed on the cutting frame 21 by a wire cutting support 23 . Here, the wire cutting support 23 is used as a carrier for associating a plurality of cutting wheels 221 and transition wheels 222 in the wire cutting unit 22 with the cutting frame 21 , and the specific form of the wire cutting support 23 can be a beam body, a plate Shelves, brackets, etc.

In an implementation manner, the wire cutting support 23 is provided on the cutting frame 21 through a limit structure such as a guide rail or a guide post, wherein the guide rail or guide post is along the vertical direction of the wheel surface of the cutting wheel 221 in the wire cutting unit 22 . The wire cutting unit 22 is set in the direction of the line, so that the set wire cutting unit 22 has the freedom to move along the vertical direction of the cutting wheel surface; under this setting, the wire cutting support 23 can move along the cutting wheel under the action of the driving source. 221 The orthogonal direction of the wheel surface moves.

When the wire cutting unit 22 moves along the vertical direction of the wheel surface of the cutting wheel 221, correspondingly, the cutting wire saw in the wire cutting unit 22 moves along the vertical direction of the cutting wheel surface, and the cutting wire saw is The distance from or close to the axis of the silicon rod can be realized, so that the cutting amount or cutting position of the silicon rod can be adjusted.

The cutting wheel 221 is provided with at least one cutting wire groove for winding the cutting wire 223, and the cutting wire groove can define the position of the cutting wire 223 to control the cutting precision. Any of the cutting wire saws is formed by winding the cutting wire 223 between two cutting wheels 221 , and the positions of the two cutting wheels 221 and the positional relationship between the cutting wheels 221 can be used to determine the direction of the cutting wire saw.

The transition wheel 222 is used to reverse or guide the cutting line 223 , or, the transition wheel 222 can be used to adjust the tension of the cutting line 223 .

The direction of the cutting wheel surface has a corresponding relationship with the direction of the cutting wire saw. It should be understood that the cutting wheel surface is parallel to the plane where any cutting wire groove in the cutting wheel is located, in order to control the cutting accuracy and the stability of the cutting process , the cutting wire saw should be located in the plane of the cutting wire groove used for winding the cutting wire; at the same time, during the cutting process, the direction of the force applied by the silicon rod to the cutting wire should be parallel to the cutting wire groove, that is The surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the axial direction of the silicon rod (ie, the first direction) in the squaring operation.

It should be understood that the cutting device can be applied in the silicon rod processing equipment, and the cutting device can be arranged in the silicon rod processing equipment in different directions. The present application defines the direction in which the silicon rods are placed in the silicon rod processing equipment as the first direction. When the cutting device is installed in the silicon rod processing equipment, the cutting wire saw is usually perpendicular to the first direction. In order to facilitate the control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, as well as to facilitate the description of the structure of the cutting device and the arrangement of the components of the present application, the following embodiment uses the cutting wire saw to be set in the second direction or the heavy vertical line. direction as an example.

In the cutting device of the present application, when the cutting wire saw is located in the second direction or the re-perpendicular direction, correspondingly, the cutting wheel surface is parallel to the second direction and the axial direction of the silicon rod, that is, the cutting wheel surface It is located in the direction of the horizontal plane, or in the vertical plane parallel to the direction of the heavy vertical line and the axis of the silicon rod and parallel to the first direction.

In each embodiment provided in this application, the cutting wheel surface is a reference plane, and the reference plane is parallel to any cutting line groove on the cutting wheel. The cutting wheel surface is mainly used to illustrate the layout of the cutting wheel (also equivalent to the plane direction of the cutting wire groove on the cutting wheel), the specific position of the reference plane, for example, which cutting wire groove on the cutting wheel specifically corresponds to, is not limited in this application.

Please refer to FIG. 2 and FIG. 3 in conjunction, wherein FIG. 2 shows a schematic diagram of the structure of the cutting device of the present application in an embodiment, and FIG. 3 shows the structure of the wire cutting unit in the cutting device of the present application in an embodiment. Schematic.

In the embodiment shown in FIG. 2 , the cutting device includes two wire cutting units 22 arranged opposite to each other to form two parallel cutting wire saws. The embodiment shown in FIG. 3 can be represented as the structure of a wire cutting unit 22. The wire cutting unit 22 includes a first cutting wheel 221a and a second cutting wheel 221b, and a cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b. The second cutting wheel 221b forms a cutting wire saw.

The first cutting wheel 221a includes at least one first cutting line groove, and the plane where any of the first cutting line grooves is located is parallel to the surface of the first cutting wheel wheel; that is, the cutting line groove on the first cutting wheel All can be referred to as the first cutting line slot.

The second cutting wheel 221b includes at least one second cutting line groove, and the plane where any of the second cutting line grooves is located is parallel to the surface of the second cutting wheel; that is, the cutting line groove on the second cutting wheel Both can be referred to as the second cutting wire slot.

The wheel surface of the first cutting wheel 221a and the wheel surface of the second cutting wheel 221b are parallel or coplanar, so that when the cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b, the The corresponding first and second cutting wire grooves for winding the cutting wire 223 are located in the same plane, so that the direction of the cutting wire saw can be simultaneously located at the first cutting wire groove for winding the cutting wire 223 and the second cutting wire groove. The second cutting slot is in the plane. It should be understood that the cutting wire 223 is in a running state during the cutting action, so the cutting wire saw is defined by its spatial position. In the embodiment of the present application, it is wound around the first cutting wheel 221a and the second cutting wheel 221b The cutting line 223 in between is the cutting wire saw.

It should be understood that when the cutting wire 223 is wound around any cutting wheel, the cutting wires 223 on both sides of the cutting wheel should be located in the plane of the cutting wire groove for winding the cutting wire 223 in the cutting wheel.

When the cutting wire 223 is wound around the first cutting wheel 221a, the cutting wire 223 at one end of the first cutting wire groove is wound to the second cutting wheel 221b to form a cutting wire saw, and the cutting wire at the other end of the first cutting wire groove 223 wraps around the first transition wheel 222a. The first transition wheel 222a is adjacent to the first cutting wheel 221a, and in the state of pulling the cutting line 223 wound around the first cutting wheel 221a, the cutting line 223 wound around the first cutting wheel 221a is positioned at The first cutting wire groove in the first cutting wheel 221a for winding the cutting wire 223 is located in the plane.

When the cutting wire 223 is wound around the second cutting wheel 221b, the cutting wire 223 at one end of the second cutting wire groove is wound to the first cutting wheel 221a to form a cutting wire saw, and the cutting wire at the other end of the second cutting wire groove 223 wraps around the second transition wheel 222b. The second transition wheel 222b is adjacent to the second cutting wheel 221b, and in the state of pulling the cutting line 223 wound around the second cutting wheel 221b, the cutting line 223 wound around the second cutting wheel 221b is located at the The second cutting wire groove for winding the cutting wire 223 in the second cutting wheel 221b is in a plane.

The first transition wheel 222 a and the second transition wheel 222 b respectively have at least one wire groove for pulling the cutting wire 223 . The first transition wheel 222a and the second transition wheel 222b are respectively disposed adjacent to the first cutting wheel 221a and the second cutting wheel 221b, and here, the adjacent arrangement may be left, right, upper, lower side, etc., this application does not limit.

It should be understood that when the cutting wire 223 is wound around any cutting wheel or transition wheel, the direction of the cutting wire 223 wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire groove.

The at least one third transition wheel 222c is disposed between the first transition wheel 222a and the second transition wheel 222b for pulling the cutting line between the first transition wheel 222a and the second transition wheel 222b 223, so that a cutting accommodating space is formed in the to-be-wire-cutting unit, and the cutting accommodating space is determined by the moving range of the silicon rod to be cut relative to the cutting wire saw during the cutting process.

During the cutting operation, the cutting wire saw and the silicon rod need to be moved relatively in the cutting direction, that is, the first direction to realize the square cutting of the silicon rod by the cutting wire saw. For example, the cutting device can be arranged on the silicon rod. Processing equipment, in some examples, the wire cutting unit feeds the silicon rod to achieve cutting, for example, the cutting frame can be movably provided on the processing platform of the silicon rod processing equipment and can move along the axis of the silicon rod to drive the cutting Wire saw feeding and cutting; in some other examples, the cutting frame can be set or installed in a fixed position of the silicon rod processing equipment, and the silicon rod is clamped by the silicon rod clamp and driven to feed the silicon rod relative to the cutting wire saw to realize cutting. The silicon rod holder described here can also be a silicon rod holder, a silicon rod clamp, a silicon rod positioning member, etc., which are used to determine the position of the silicon rod and can load (or carry, clamp, limit) the silicon rod. Stick it.

Taking the embodiment in which the silicon rod processing equipment has a silicon rod clamp to drive the silicon rod to move in the first direction as an example, during the cutting operation, the silicon rod clamp drives the clamped silicon rod along the axis of the silicon rod relative to the cutting wire saw. In the direction of feeding, the cutting accommodating space is the movement range of the silicon rod from when the silicon rod to be cut first contacts the cutting line 223 to when the cutting line 223 penetrates the silicon rod to form an edge skin.

The cutting accommodating space can accommodate the silicon rod to be cut, and only the cutting wire saw in the cutting device intersects the cutting accommodating space. It should be understood that during the cutting process, the silicon rod holder and the held silicon rod to be cut collide with other components in the silicon rod processing equipment including the cutting wire 223 (the cutting wire 223 here is excluding the cutting wire saw) during movement. It is a problem that needs to be avoided; at the same time, in order to realize cutting, the cutting wire saw and the silicon rod are fed relative to each other during the movement of the silicon rod holder to clamp the silicon rod. Therefore, when the silicon rod is in the cutting accommodating space, that is, the silicon rod During the process of feeding the rod relative to the cutting wire saw until the cutting is completed, it should be avoided that the components in the silicon rod processing equipment interfere with each other when the silicon rod to be cut and the cutting device are in relative motion. Line contact, the silicon rod holder collides with the cutting device, the silicon rod holder contacts the cutting line, etc.

The first transition wheel 222a, the second transition wheel 222b and at least one third transition wheel 222c can be used to pull the cutting line 223 in the direction, and the third transition wheel 222c pulls the first transition wheel 222a and the second transition wheel 222c. The cutting line 223 between the transition wheels 222b forms the cutting accommodating space.

In some embodiments, the first transition wheel 222a, the second transition wheel 222b and the at least one third transition wheel 222c are used to draw the cutting wire 223 away from the silicon rod to be cut. It should be understood that the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a, and the cutting line 223 between the second cutting wheel 221b and the second transition wheel 222b are located for winding the cutting line 223 The first cutting line groove (or the second cutting line groove) of . In order to form the cutting accommodating space, in an implementation manner, the lengths of the cutting lines 223 between the first cutting wheel 221a and the first transition wheel 222a and between the second cutting wheel 221b and the second transition wheel 222b can be made Long enough, for example, longer than the length of the silicon rod to be cut, but under this setting, the cutting frame occupies too much equipment space, and the layout is unreasonable.

In some embodiments, the first transition wheel 222a, the second transition wheel 222b, and at least one third transition wheel 222c are used to draw the cutting wire 223 away from the cutting accommodation space.

The present application provides an embodiment in which the cutting accommodating space is formed by the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c. In one implementation, between the wheel surface of at least one of the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c and the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b A certain angle is formed, so that the cutting line 223 deviates from the plane where the first cutting line groove (or the second cutting line groove) for winding the cutting line 223 is located, in order to optimize the overall structural layout of the cutting device and the silicon rod processing equipment , the deviated direction can be selected as a direction away from the cutting accommodating space.

Taking the cutting device including two oppositely arranged wire cutting units as an example, in the embodiment shown in FIG. 3 , the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c are arranged as The cutting line 223 can be kept away from the cutting accommodating space by inclining in the direction away from the cutting accommodating space, or setting the transition wheel on the side of the cutting frame away from the cutting accommodating space. The equipment space required by the wire cutting unit is effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod processing equipment.

Here, for any of the wire cutting units, the direction away from the cutting accommodating space is the vector of the vertical direction of the cutting wheel surface. Taking the embodiment shown in FIG. 2 as an example, two opposite wire cutting The corresponding directions of the units away from the cutting accommodating space point in opposite directions, which are respectively the directions shown by the arrows in the figure.

In some embodiments, the wheel surface of the first transition wheel 222a and the direction of the wheel surface of the first cutting wheel 221a may form a certain angle, and the wheel surface of the second transition wheel 222b and the wheel surface of the second cutting wheel 221b may form a certain angle. The face direction can be at a certain angle. The direction in which the first transition wheel 222a is arranged is only when the cutting wire 223 at the other end of the first cutting wheel 221a is located in the plane where the first cutting wire groove for winding the cutting wire 223 is located and the first transition wheel 222a for The wire grooves for winding the cutting wire 223 are in the intersection of the planes; and the direction of the second transition wheel 222b is set only when the cutting wire 223 at the other end of the second cutting wheel 221b is positioned for winding the cutting wire 223 The plane where the second cutting wire groove is located and the plane where the wire groove for winding the cutting wire 223 in the second transition wheel 222b is located can be in the intersection line.

By arranging the first transition wheel 222a and the second transition wheel 222b to form a certain angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, the direction of the angle is to make the first transition The wheel 222a or the second transition wheel 222b is inclined toward the direction away from the cutting accommodating space, which is beneficial to reduce the required number of the third transition wheel 222c, and is beneficial to reduce the amount of the wire cutting support at the first the length of the direction.

Therefore, the present application does not limit the angle formed by the first transition wheel and the first cutting wheel, and the angle formed by the second transition wheel and the second cutting wheel. For example, other transformations can also be made for the positional relationship and angle of the placement of the cutting wheel and the transition wheel.

Please refer to FIG. 4 a and FIG. 4 b , which are respectively a front view and a three-dimensional schematic diagram of the wire cutting unit of the cutting device of the present application in another embodiment.

In the embodiment shown in Figures 4a and 4b, the wire cutting unit has a first cutting wheel 221a, a second cutting wheel 221b, a first transition wheel 222a, a second transition wheel 222b, and two third transition wheels 222c . Wherein, when the first transition wheel 222a is pulling the cutting line 223 wound around the first cutting wheel 221a, the cutting line 223 wound around the first cutting wheel 221a is located in the first cutting wheel 221a for winding The first cutting line groove of the cutting line 223 is located in the plane, and at the same time, the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a is also located in the first transition wheel for winding the cutting line 223. The wire groove is in the plane; the second transition wheel 222b is in the state of pulling the cutting line 223 wound around the second cutting wheel 221b so that the cutting line 223 wound around the second cutting wheel 221b is located at the second cutting wheel 221b The second cutting wire groove for winding the cutting wire 223 is located in the plane, and at the same time, the cutting wire 223 between the second cutting wheel 221b and the second transition wheel 222b is also located in the second transition wheel for winding The wire groove of the cutting line 223 is in the plane.

In the cutting device, the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form an end-to-end closed-loop cutting line .

Please continue to refer to FIG. 2, the cutting wheel and the transition wheel in the wire cutting unit are wound by an annular cutting wire. In this example, the cutting device can save the wire storage drum, and the annular cutting wire is driven by the driving device. Run to achieve cutting.

In the existing cutting device, the cutting wire is wound from the pay-off drum to between the cutting wheel and the transition wheel in the wire cutting unit, and from the wire cutting unit to the wire take-up drum. During the cutting operation, the cutting wire Driven to run, the running process of the cutting wire is an alternate acceleration and deceleration process; in the cutting device of the present application, the annular cutting wire in the wire cutting unit can keep running at high speed, and at the same time, the annular cutting wire can run at the same time during the cutting operation. direction run. In this way, the wire cutting unit of the present application can realize high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the annular cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit, reducing production costs.

In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the second transition wheel, and the first cutting wheel in turn. There are three transition wheels, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end annular cutting line.

Please refer to FIG. 3 , taking the first cutting wheel 221 a as the starting point of the winding of the annular cutting line 223 as an example, the cutting line 223 is wound from the first cutting wheel 221 a to the second cutting wheel 221 b , forming two cutting lines. Cutting wire saw between wheels; the cutting wire 223 is wound from the second cutting wheel 221b to the second transition wheel 222b, a third transition wheel 222c, another third transition wheel 222c, a first transition wheel 222a, a first transition wheel 222b The cutting wheel 221a thus forms an end-to-end annular winding, and at the same time, through the pulling and guiding of the cutting wire 223 by a plurality of transition wheels, the cutting accommodating space is formed in the wire cutting unit.

Of course, it should be understood that the positions of the first transition wheel 222a, the second transition wheel 222b, and the third transition wheel 222c relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the illustrated embodiment, only The cutting accommodating space may be formed when the cutting wire 223 is wound between the plurality of cutting wheels and transition wheels of the wire cutting unit. At the same time, the third transition wheel 222c of the wire cutting unit can also be set to three, four, etc., which is not limited in this application.

For another example, in the embodiment shown in FIGS. 4a and 4b, it is assumed that the first cutting wheel 221a is the starting point of the winding, and the cutting wire 223 is wound around the first cutting wheel 221a, the second cutting wheel 221b, and the second transition wheel in turn. 222a, a third transition wheel 222c, another third transition wheel 222c, a first transition wheel 222a, and a first cutting wheel 221a to form an end-to-end annular cutting line.

In some embodiments, the cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.

The principle of wire cutting is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. Here, the cutting wire driving device is used to realize the running of the cutting wire.

In certain embodiments, the cutting wire driving device is an electric motor having a power take-off shaft, and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel. For example, in the embodiment shown in FIG. 1 , the wire cutting unit is provided with a motor 224 connected to the cutting wheel, so that the cutting wire can be driven by the wound cutting wheel to run along the winding direction. Of course, in other specific implementation manners, the cutting wire driving device may also be another driving source, such as a hydraulic motor, only when the cutting wire is driven to run, which is not limited in this application.

In some embodiments, the cutting device further includes a tension detection mechanism. In the wire cutting process, the tension of the cutting wire affects the yield and processing accuracy of the cutting. The tension detection mechanism performs tension detection and adjusts so that the tension of the cutting wire reaches a certain threshold set and maintains a constant value or a constant value during cutting. The constant value is a certain range allowed by the center of the value.

In an implementation manner, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for adjusting the tension of the cutting wire when realizing the guiding and pulling of the cutting wire.

The tensioning wheel is used to adjust the tension of the cutting line, which can reduce the probability of breaking the cutting line and reduce the consumables. In the cutting operation, the role of the cutting wire is very important, but even the best cutting wire has limited elongation and wear resistance, which means that the cutting wire will gradually become thinner during continuous operation until it is finally broken. . Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire when it travels back and forth.

In some embodiments of the application, the tension detection mechanism at least includes: a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel, and continuously senses the tension value of the cutting wire on the transition wheel , and send a drive signal when the tension value is less than the preset value; the servo motor is electrically connected to the tension sensor to start working after receiving the drive signal sent by the tension sensor; one end of the screw rod is connected to the The other end of the tensioning wheel is connected to the servo motor, and when the servo motor works, the transition wheel is pulled to perform one-way displacement, so as to adjust the tension of the cutting line.

In some embodiments, the cutting device further comprises: at least one distance adjusting mechanism, which is arranged on the at least one wire cutting unit and is used to drive the plurality of cutting wheels in the wire cutting unit to be perpendicular to the cutting frame along a vertical direction. The direction of the cutting wheel face is moved. The cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or cutting amount) relative to the silicon rod.

In some implementations, please refer to FIG. 2 and FIG. 3 , taking a wire cutting unit 22 in the cutting device as an example for description. The wire cutting unit 22 includes a plurality of cutting wheels 221 and transition wheels 222 . The carrier for carrying the plurality of cutting wheels 221 and the transition wheels 222 is, for example, the wire cutting support 23 shown in FIG. 3 , and the distance adjustment mechanism (not shown) can be used to drive the whole wire cutting support 23 Moving along the vertical direction of the surface of the cutting wheel 221, the transition wheel 222 and the cutting wheel 221 together follow the wire cutting support 23 to move along the vertical direction of the surface of the cutting wheel 221. In this state, the multiple The cutting wheels 221 and the transition wheels 222 are relatively stationary, that is, the positional relationship between the transition wheels 222 and the cutting wheels 221 remains unchanged. At this time, the distance adjusting mechanism is used to adjust the cutting position of the at least one wire cutting wire saw relative to the silicon rod in the at least one wire cutting unit 22 .

In some implementations, each cutting wheel has at least two cutting line grooves, different cutting line grooves are parallel to each other and there is a cutting offset in the vertical direction of the cutting wheel surface between different cutting line grooves. When the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the positions of the wire grooves on which the cutting wire is wound around the cutting wheels can be changed. In one implementation, a plurality of cutting wheels in the wire cutting unit can be connected to a bracket, for example, wherein the bracket is movably arranged on the wire cutting support and is driven by the distance adjustment mechanism to follow the direction of the cutting wheel surface. Move in the vertical direction.

When the at least one distance adjusting mechanism is used to realize the changing of the cutting line around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in the actual scene, the corresponding cutting lines before and after the groove changing can be determined in advance. Cutting wire groove, for example, the position of the cutting wire before the groove change is the cutting wire groove a1, after the groove changing, the cutting wire is wound around the cutting wire groove a2, based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2. The displacement amount that the at least one distance adjusting mechanism drives the movement of the plurality of cutting wheels in the wire cutting unit, that is, the displacement amount is set as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize cutting Replacing the wire cutting wire groove a1 to the cutting wire groove a2; it should be noted that the at least one distance adjustment mechanism drives the multiple cutting wheels in the wire cutting unit to move in the direction of the vertical line of the cutting wheel surface. The wire groove a2 points to the direction of the cutting wire groove a1. After the groove is changed, the cutting position of the cutting wire saw in the space remains unchanged, and the step of further calibrating the position of the cutting wheel or other components is omitted, and the preset cutting amount can be The silicon rods are cut so that the slot changing process is simplified.

In order to further illustrate the manner in which the at least one distance adjusting mechanism realizes the movement of the plurality of cutting wheels in the wire cutting unit relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel, the present application provides the following embodiments. When the number of wire cutting units in the cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed accordingly.

In one embodiment, the cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a screw rod, which is arranged in an orthogonal direction to the surface of the cutting wheel and is threadedly connected to the single-wire cutting unit; a driving source for Drive the screw to rotate.

Here, the single wire cutting unit is a wire cutting unit. The single wire cutting unit in the wire cutting device includes a plurality of cutting wheels, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the The single-wire cutting unit, by means of the connection at both ends of the screw rod, can rotate based on the drive source transmission and convert the rotation of the screw rod into axial displacement by means of a threaded connection. The axial displacement direction is the setting direction of the screw rod. The orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by driving the lead screw by the driving source in the distance adjustment mechanism. Then, the cutting wheel of the single wire cutting unit can move forward or backward in the orthogonal direction of the cutting wheel surface.

In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; a driving source, which uses The telescopic element is driven to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the telescopic piece can be configured as a rod body structure, and the extending direction of the rod body is the orthogonal direction of the wheel surface of the cutting wheel. The drive source, the retractable free end is associated with the single wire cutting unit, and can drive the cutting wheel of the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface under the action of the driving source. The telescopic element is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as a driving source, which is not limited in this application. The way the telescopic rod is connected to the single-wire cutting unit can be a linear connection or an indirect connection, for example, it can be directly connected to the wire-cutting support or cutting wheel support of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing. The single wire cutting unit. It should be understood that the expansion or contraction of the telescopic element can correspond to the advance or retreat of the single-wire cutting unit along the orthogonal direction of the cutting wheel surface.

Here, in the embodiments provided in the present application, the association can be realized by, for example, one or more of snapping, screw locking, gluing, and welding. For example, in the above-mentioned embodiments, the telescopic rod can be The wire cutting unit is associated with one or more ways of snapping, screwing, gluing, and welding; of course, the realization of the association is not limited to this, and is intended to be realized in the second direction transmission.

In yet another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack, which is arranged on the single-wire cutting unit along an orthogonal direction to the surface of the cutting wheel; a transmission gear, which is connected to the The rack is meshed; the driving source is used to drive the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves along the step direction of the rack accordingly. The rotational motion of the drive is converted into wire transportation along the direction of the rack, and the rack is arranged on the single-wire cutting unit along the orthogonal direction of the cutting wheel surface, so that the cutting wheel of the single-wire cutting unit can be driven along the cutting wheel. Orthogonal direction of the face. At the same time, the rotation direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the cutting wheel surface.

In one embodiment, the cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit passes through the at least one wire cutting unit. The distance adjustment mechanism is driven to move in the orthogonal direction of the surface of the cutting wheel, and is used to adjust the wire secant line between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit The saw spacing, or the changing cutting wire, is wound around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

The at least one distance adjusting mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or to be associated with the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the connected or associated wire cutting unit. The plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit move in orthogonal directions of the cutting wheel surfaces.

In one embodiment, the distance adjusting mechanism includes: a screw rod, which is arranged in the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit or the second wire cutting unit; to drive the screw to rotate. The manner in which the screw rod and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to that in the previous embodiment, and all the cutting wheels driven by the distance adjusting mechanism The first cutting unit or the second wire cutting unit may be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by setting the distance adjusting mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased, and the wire cutting device can be Cut silicon rods into different sizes.

In another embodiment, the distance adjusting mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source for driving The telescopic element performs telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism may be regarded as a single wire cutting unit, and the specific implementation can refer to the foregoing embodiments, which will not be repeated here.

In yet another embodiment, the distance adjusting mechanism comprises: a rack, along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, connected with the The rack is meshed; the driving source is used to drive the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move linearly in the direction of the rack, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the teeth The strip drives the plurality of cutting wheels to move in orthogonal directions to the surfaces of the cutting wheels.

In one embodiment, the distance adjusting mechanism includes: a bidirectional screw rod, which is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit and the second wire cutting unit; and a driving source, It is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the surface of the cutting wheel.

In one embodiment, the two-way screw is a double-threaded screw, the two ends of the two-way screw are respectively provided with threads and the thread directions are opposite, and the driving source can be provided at either end of the two-way screw In order to drive the two-way screw to rotate along the screw shaft, with the threads in opposite directions at both ends of the two-way screw, when the two-way screw is rotated under the drive of the driving source, the movement of the two ends of the two-way screw is converted into the axial line in the opposite direction. Movement, the axial direction is the orthogonal direction of the cutting wheel surface of the bidirectional screw rod. Driven by the driving source, the plurality of cutting wheels corresponding to the first wire cutting unit and the second wire cutting unit respectively can move toward each other or move toward each other.

In yet another embodiment, the distance adjusting mechanism includes: a first rack, arranged along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit; a second rack, along the cutting wheel surface set in the orthogonal direction and associated with the second wire cutting unit; a transmission gear meshing with the first rack and the second rack; a driving source for driving the transmission gear to rotate to make the first wire The cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.

In an embodiment, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, and the transmission gear is connected to a driving source such as a power of a servo motor The output shaft (not shown) meshes with the first rack and the second rack, and is used to drive the first wire cutting unit and the second wire cutting unit to move toward each other when rotating in the forward direction. The closing action is performed, and the first wire cutting unit and the second wire cutting unit are driven to move backwards during the reverse rotation. The first rack and the second rack can be engaged on both sides of the transmission gear, so that when the transmission gear rotates, the linear speeds at the first rack and the second rack are in opposite directions, and the drive motor drives the transmission. When the gear rotates, the first rack and the second rack move toward each other when the transmission gear rotates forward, which drives the first wire cutting unit and the second wire cutting unit to move toward each other, and when the transmission gear is driven to rotate in the reverse direction, the first rack and the second tooth The strip moves back to drive the first wire cutting unit and the second wire cutting unit to move back. Here, the transmission gear may be shaft-connected to a power take-off shaft of a drive source, or may be indirectly connected to the power take-off shaft, eg, shaft-connected to a rotating portion connected to the power take-off shaft.

In some embodiments, the distance adjusting mechanism is a servo motor provided in the at least one wire cutting unit. In a practical scenario, a servo motor is provided on at least one wire cutting unit of the wire cutting device or each wire cutting unit, and the servo motor controls the displacement of the corresponding wire cutting unit in the orthogonal direction of the cutting wheel surface. The wire cutting unit can pre-determine the cutting offset for changing grooves or the adjustment amount for changing the cutting position of the cutting wire, and the precise positioning function of the servo motor drives the plurality of cutting wheels in the wire cutting unit to a preset displacement. Movement in the direction orthogonal to the face of the cut-off wheel. For example, the wire cutting device is provided with a single wire cutting unit, and the single wire cutting unit is provided with a servo motor to drive the single wire cutting unit to move in the orthogonal direction of the wheel surface of the cutting wheel; in another example, the wire cutting device A first wire cutting unit and a second wire cutting unit are provided in the middle, and the first wire cutting unit or/and the second wire cutting unit are driven by the corresponding servo motors to move relatively independently along the orthogonal direction of the cutting wheel surface. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the distance adjustment mechanism is a driving device that drives a plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame. Form This application is not limited.

In certain embodiments, the cutting device of the present application further includes a side skin supporting mechanism for abutting against the outside of the silicon rod and supporting the cutting edge skin.

In the coordinate system defined in this application, the first direction is a horizontal direction, that is, the silicon rod to be processed is placed horizontally in the silicon rod processing equipment. It should be noted that the cutting device of the present application does not exclude the situation of cutting vertical silicon rods. When the relative silicon rods are relatively fed in the direction of the heavy vertical line, the cutting device can of course also be used for cutting the vertical silicon rod. Alternatively, the wire cutting unit is arranged on a cutting frame with a displacement mechanism along the vertical direction. Specifically, it can be determined according to the processing needs of the silicon rod processing equipment for the silicon rod. An example of cutting a bar will be described.

In the silicon rod processing equipment of the present application, the silicon rod to be cut is in a horizontal state, and the edge skin formed by cutting is also in a horizontal state. In this example, the edge skin needs to be supported during cutting to assist in the removal of the edge skin; at the same time, the edge skin formed by the horizontal silicon rod during cutting is no longer subjected to the clamping force of the silicon rod clamp. Before the cutting wire saw completely penetrates the silicon rod, the connecting part between the edge skin and the silicon rod may be broken by the moment formed by the gravity of the edge skin (also called edge chipping). In this way, the edge skin supporting mechanism also Edge chipping can be prevented by supporting the edge skin.

In some embodiments, the edge skin supporting mechanism includes: at least one supporting component, and at least one mounting portion for connecting the at least one supporting component to the cutting device. Wherein, the support assembly includes: a support part, controlled to abut against and support the edge skin; a driving unit, connected to the support part to control the support part to move away from or abut against the edge skin.

In some examples, the cutting device in the silicon ingot processing equipment can switch the cutting position during the processing of the silicon ingot. For example, the silicon ingot processing platform is provided with a first processing area and a second processing area, and the cutting device uses A conversion mechanism is provided on the machine base, and can be switched between the first processing position and the second processing position under the driving of the conversion mechanism. Under this arrangement, the support assembly is disposed on the cutting device through the mounting portion, so that the support assembly remains relatively stationary relative to the cutting assembly when the cutting device changes the processing position. In some examples, the mounting portion is detachably connected to the cutting frame, and the mounting portion can be arranged at different positions on the cutting device based on the need for supporting the edge skin. The position of the support assembly on the cutting device can be determined based on the specific structure of the wire cutting unit in the cutting device. For example, in the embodiment shown in FIG. seat.

The supporting component includes a supporting portion, which is used for contacting and abutting against the silicon rod to achieve a supporting effect on the edge skin. It should be noted that, in each embodiment of the present application, the supporting portion is The supporting action is to apply force to the edge skin to maintain a stable state. Taking the cutting wire saw as an example, the edge skin formed by cutting is located on the upper or lower side of the silicon rod. The supporting portion can provide support for the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, thereby maintaining the edge skin in a stable state; The formed edge skin is located on the side (left or/and right side) of the silicon rod, and the supporting portion can be set to a structure compatible with the outer arc surface of the silicon rod to provide support for the edge skin, or by abutting against the edge skin. The edge skin is maintained in a stable state so that the edge skin is subjected to upward frictional force.

The driving unit is used for driving the bearing portion away from or against the side skin. The directions of moving away from or abutting against the edge skin can be in multiple directions, for example, abutting the edge skin means that the supporting portion moves from a state of being separated from the edge skin to a state of contacting the edge skin under the driving of the driving unit, and The specific movement direction of the supporting portion is not limited in this application.

In an implementation manner, the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the bearing part to move away from or against the supporting part; Said edge skin.

The telescopic part can be telescopically moved under the driving of a cylinder or a hydraulic pump, so that the telescopic part is connected to the supporting part, and the telescopic direction of the telescopic part is, for example, a direction away from or close to the axis of the silicon rod, thereby driving the connected supporting part. The support part is away from or abuts against the side skin.

In yet another implementation, the drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The screw assembly can be threadedly connected with the bearing part at one end, the driving motor drives the screw to rotate to make the bearing part move along the direction of the screw, and the rotation direction of the screw is controlled by the driving motor to control The support part is close to or away from the edge skin.

The supporting portion can be set in different structures to achieve the supporting effect. For example, the supporting portion can be a supporting plate and has an arc surface for contacting the edge skin, or the supporting portion has a folded surface. A support plate that prevents the edge skin from rolling, for example, the support plate has a trapezoidal groove structure (where the notch is a trapezoidal lower bottom); it should be understood that the support part that can be used to support the edge skin has many This can be implemented, which is not limited in this application.

In order to securely support the edge skin formed by cutting to prevent the edge skin from breaking, or to simplify the unloading and transportation of the edge skin, the application also provides the following implementation methods:

In one example, the support portion includes at least two support blocks, which are spaced apart along the first direction and have a bearing surface for contacting and bearing the edge skin. The bearing surface of the supporting block can be set to have an arc surface to adapt to the supported edge skin, or can be set to be composed of contact planes with different levels to prevent the edge skin from rolling.

It should be understood that in some processing scenarios, the edge skin can be supported by one support block; here, the present application also provides that the edge skin can be realized by at least two support blocks arranged at intervals along the first direction In the supporting embodiment, by setting the interval or span between the at least two supporting blocks along the first direction, the supporting of the edge skin formed by cutting silicon rods of different lengths and specifications can be realized. The provided support block supports the edge skin so that the edge skin can be subjected to the force of the support part in different length directions (ie, the first direction), thereby helping to prevent the cutting wire saw from breaking through the front edge skin of the silicon rod. After the wire saw is cut through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used to support the edge skin to prevent the edge skin from tilting and falling over.

Meanwhile, in the embodiment in which the support portion includes two support blocks, the support assembly may further include two drive units, and any one of the drive units corresponds to a support block, for example, each support The support block is connected to a drive unit. During the cutting process, the two drive units of the support assembly can respectively drive the corresponding support block, so that the support portion is completely close to the edge skin to realize support.

Please refer to FIG. 5 , which is a schematic diagram showing a partial structure of the cutting device of the present application in an embodiment. As shown in the figure, the support portion includes two support rods 5111 arranged at intervals along the second direction, and the rod bodies of the support rods 5111 are along the first direction.

Here, the at least two support rods 5111 can be used to support the edge skin. It should be understood that the center of gravity of the edge skin formed by cutting is located between the at least two support rods 5111 At the same time, any of the supporting rods 5111 is in line contact with the supported edge skin, and under this setting, the frictional force between the support portion and the edge skin can be reduced.

The connecting parts 5112 are located at both ends of the support rod 5111 in the longitudinal direction (ie, the first direction). At the same time, any one of the connecting parts 5112 connects a drive unit and the support rod. The at least two support rods 5111 The whole is approaching or moving away from the edge of the silicon rod driven by the drive units on both sides. There are connecting parts and driving units on both sides of the supporting rod. Both ends of the supporting rod 5111 can be driven to move by the driving unit. It can also be used as a support for bearing the gravity of the side skin, which is beneficial to improve the structural stability of the bearing part; when the center of gravity of the supported side skin in the first direction is located in the two driving units (or two connecting parts) Between, it is easy to realize the stable support of the edge skin.

At the same time, the driving units at both ends of the support rod 5111 can also be used as supports for associating the support rod 5111 and the connecting portion 5112 to the cutting device. In the embodiment shown in FIG. 5 , the driving units are connected through the mounting portion. In the cutting device, the free end of the telescopic movement is connected to the connecting portion 5112 to drive the entire supporting portion to move along the telescopic direction driven by the driving unit. In the example shown in FIG. 5 , the driving unit is an air cylinder 512 having a telescopic portion, and the telescopic portion of the air cylinder 512 is connected to the connecting portion 5112 .

In the example shown in FIG. 5 , the supporting portion is controlled to move in the direction of the heavy vertical line to move away from or close to the edge skin; it should be understood that when the direction of the cutting wire saw in the cutting device is different, or when the The structures of the supporting parts are different, and the corresponding driving units in the side skin supporting mechanism can be arranged in different directions to meet the needs of supporting the side skins. For example, when the cutting wire saw in the cutting device is in the direction of the heavy vertical line, the driving unit can be set, for example, the direction of its telescopic movement is the second direction, so that the supporting part moves in the second direction to move closer to or away from the Said edge skin. The direction of the controlled movement of the supporting portion is not limited in the present application, and it is only required that the supporting portion can support the edge skin.

The number of the supporting components can be set according to the need for supporting the edge skin. For example, when the cutting device includes a cutting wire saw, a corresponding edge skin is formed in one cutting operation, and the cutting device A support component can be provided to support the edge skin; for another example, when the cutting device includes two parallel cutting wire saws, the two edge skins are formed correspondingly in one cutting operation, and the cutting device can Two supporting components are arranged to respectively support the edge skins on both sides of the silicon rod.

In some embodiments, the edge skin discharging mechanism further comprises a edge skin dislocation mechanism, which is provided in the cutting device and is used for pushing the edge skin along a first direction to separate the edge skin from the edge skin support. Bodies or cut silicon rods.

In some embodiments, the edge and skin dislocation mechanism is provided on the machine base or the cutting device at a predetermined interval relative to the cutting wire saw along a first direction, wherein the first direction is parallel to the axial direction of the silicon rod. It should be understood that when the cutting wire saw penetrates the silicon rod, an edge skin independent of the silicon rod can be formed. At this time, an end surface of the edge skin supported by the supporting component is aligned with the cutting wire saw in the first direction. Therefore, when the edge skin dislocation mechanism is set in the silicon rod processing equipment, the preset interval in the first direction between the edge skin dislocation mechanism and the cutting wire saw is predetermined, that is, the edge skin dislocation mechanism and the cutting wire saw are determined in advance. The interval between the end faces of the edge skin to be pushed, in the actual processing scene, when the edge skin dislocation mechanism moves a certain distance in the first direction, based on this distance and the preset edge skin dislocation mechanism and the cutting wire saw in the first direction. By setting the interval, the distance that the edge skin dislocation mechanism actually pushes the end face of the edge skin can be known, so that the displacement amount of the edge skin dislocation mechanism moving in the first direction can be controlled based on the requirement of the pushing distance of the edge skin.

It should be understood that the axial direction of the silicon rod to be cut is along the first direction, and the edge skin formed during cutting is also along the first direction in the supported state. The edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin. The skin moves relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transfer process can be performed on the edge skin.

In some embodiments, the side skin dislocation mechanism includes: a power source; and a telescopic rod, which is arranged along the first direction and is used for telescopic movement driven by the power source to push the side skin.

In an implementation manner, the power source of the side skin dislocation mechanism is an air cylinder or a hydraulic pump, wherein the telescopic rod of the air cylinder or the hydraulic pump is arranged along the first direction. For example, in the embodiment shown in FIG. 5 , the cutting device is provided with two parallel wire cutting units, and the cutting device includes two edge and skin dislocation mechanisms, which are respectively provided on the upper wire cutting unit and the lower wire cutting unit of the cutting frame. In the side line cutting unit, the edge skin dislocation mechanism is an air cylinder 541 with a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the edge skin end surface. After the cutting wire saw penetrates the silicon rod to form an independent edge skin, the edge skin dislocation mechanism moves in the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin support mechanism or Detach the silicon rod after cutting. Here, the telescopic range of the telescopic rod of the side skin dislocation mechanism can be determined based on the length specification of the silicon rod, or based on the span of the support part of the support component in the first direction, so as to control the side skin in the first direction. The pushed stroke in the first direction ensures that the edge skin can be disengaged.

Of course, it should be understood that the specific structure and position of the edge-skin dislocation mechanism are not limited to the embodiment shown in FIG. 5 . For example, in some examples, the edge-skin dislocation mechanism can also be provided in the silicon rod processing equipment. Machine base.

An example is given to illustrate a processing scenario in which the cutting device of the present application is applied to a silicon rod processing equipment. The annular cutting line of any wire cutting unit is in a driven state, so that the cutting wire saw and the silicon rod are relatively fed along the first direction to cut the surface of the silicon rod to form an axial section; in some scenarios, the edge skin formed by cutting The edge skin can be supported by the edge skin supporting mechanism in the cutting device to prevent the edge skin from collapsing, and the edge skin can also be pushed by the edge skin dislocation mechanism in the first direction to push the cutting wire saw through the edge skin formed after the silicon rod, so as to assist the edge skin to be timely removed. Uninstall.

Here, in the cutting device provided in the first aspect of the present application, by determining the layout of the cutting wheel and the transition wheel, the cutting line is wound between the cutting wheel and the transition wheel in an end-to-end manner. The overall structure of the cutting device It can be simplified, which is beneficial to reduce the cost of the device; at the same time, the ring-shaped cutting line can avoid the influence of the acceleration and deceleration process of the cutting line on the cutting accuracy during the process of running to perform the cutting, so that the cutting accuracy is improved, which is beneficial to simplify the follow-up. process.

In a second aspect, the present application further provides a silicon rod processing equipment, including a machine base and the cutting device according to any one of the embodiments provided in the first aspect of the present application.

The machine base, as the main part of the silicon rod processing equipment, has a silicon rod processing platform. In an example, the size and weight of the machine base are larger to provide a larger installation surface and a firmer overall machine stability. Spend. It should be understood that the machine base can be used as a base for different structures or components in the silicon ingot processing equipment, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes a fixing structure or a limiting structure for receiving different components in the silicon rod processing equipment, such as a base, a rod body, a column body, a frame body, etc., which are all machine bases described in this application.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

The silicon rod processing platform may be provided with a processing device for processing the silicon rod, such as squaring or grinding, and different locations may be provided thereon, for example, the processing location corresponding to the squaring cutting performed by the cutting device, corresponding to the The unloading area for unloading the edge skin formed by cutting, etc., transports the silicon rod to the waiting area corresponding to the silicon rod processing device, so as to facilitate the processing operation of the silicon rod processing device. The shape of the silicon rod processing platform can be determined according to the machine base, or can be jointly determined according to the processing needs of the machine base and the silicon rod processing device.

The cutting device includes a wire cutting unit, and the wire cutting unit has a cutting wire saw for cutting the horizontal silicon rod to be cut. It should be understood that the horizontal silicon rod to be cut is in the square During the cutting process, it is always in a horizontal state, and here, the silicon rod to be cut is, for example, in a supported or clamped state. For example, in an example, the silicon rod to be cut is clamped by a silicon rod holder and moved in a first direction under the driving of the silicon rod holder, so that the wire saw in the wire cutting unit advances relative to the silicon rod to be cut. Cut to achieve silicon rods.

In certain embodiments, the silicon rod processing equipment further includes at least one silicon rod holder for holding the silicon rod and driving the silicon rod to move along the axis of the silicon rod to make the silicon rod relative to the cutting wire saw of the cutting device feed. The silicon rod clamps described here are also called silicon rod clamps, silicon rod clamps, silicon rod positioning members, etc., which are used to determine the position of the silicon rod and can load (or carry, clamp, limit) the silicon rod. Stick it.

Regarding the silicon rod holder, it is used to clamp the silicon rod at both ends of the silicon rod, and in some embodiments, the silicon rod holder can be provided on the silicon rod processing platform to guide the first direction The structure is used to drive the clamped silicon rod to move in the first direction.

Please refer to FIG. 6, FIG. 7a, FIG. 7b, wherein, FIG. 6 is a schematic structural diagram of the silicon rod processing equipment of the present application in one embodiment; A top view and a three-dimensional schematic diagram of any silicon rod holder and its corresponding guide structure.

The silicon rod processing equipment is provided with a cutting device 20, a first silicon rod holder 11, and a second silicon rod holder 12, wherein the first silicon rod holder 11 is located in the first processing area of the silicon rod processing platform. The first guide structure 131 and the second silicon rod holder 12 are arranged on the second guide structure 132 on the second processing area of the silicon rod processing platform. Regarding the guide structure, it may be a structure that can be used to provide a degree of freedom of displacement in the first direction, such as a transfer guide rail, a guide post, a beam, a guide groove, or the like.

In some embodiments, any one of the first silicon rod holder or the second silicon rod holder includes: a clamping arm mounting seat, which is arranged on the corresponding transfer guide rail or guide column; a power source for driving the The clamping arm mounting base moves along the corresponding transfer guide rail or guide column; a pair of clamping parts are arranged opposite to each other along the first direction for clamping the two end faces of the silicon rod; a pair of clamping arms, wherein each clamping arm a proximal end connected to the clamping arm mounting seat and a distal end connected to the clamping part; a clamping arm driving mechanism for driving at least one of a pair of clamping arms to move along a first direction to adjust the one The spacing of the clamping arms along the first direction.

For ease of understanding, the following description will be made with reference to the silicon rod holder 11 and the guide structure 131 located at the first processing position.

The silicon rod holder 11 includes a pair of clamping arms 113 for clamping the two end faces of the silicon rod, wherein the distal end of the clamping arms 113 is connected with a clamping portion 114 for contacting the end faces of the silicon rod. The proximal end of 113 is connected to the clamp arm mounting seat 111, the clamp arm mounting seat 111 is movably arranged on the guide structure and moves along the guide structure under the drive of the power source 112, thereby driving the clamp arm 113 and the clamp arm 113 to move away from the guide structure. The clamping portion 114 at the end moves along the guide structure; the power source 112 is, for example, a servo motor, which is not limited in this application. The silicon rod holder 11 further includes a clamping arm driving mechanism 115 for driving at least one of the pair of clamping arms 113 to move along the first direction to adjust the distance between the pair of clamping arms 113 along the first direction, as described above The clamping portions 114 respectively connected to the distal ends of the pair of clamping arms 113 can approach or move away from each other under the action of the clamping arm driving mechanism 115 to perform clamping or releasing action on the silicon rod. It should be understood that, the axis of the silicon rod is along the first direction, in order to realize the clamping of the silicon rod on the two end faces of the silicon rod, the clamping parts 114 corresponding to the distal ends of the pair of clamping arms 113 are along the first direction. Set up in one direction relative to each other. The pair of clamping arms 113 are arranged in the horizontal direction. When the power source 112 drives the clamping arm mounting base 111 to drive the clamping arms 113 and the silicon rods clamped by them to move along the guide structure, the clamping arm 113 moves along the guide structure. Arm 113 can avoid the cutting wire saw. In some other feasible implementation manners, the pair of clamping arms 113 can also be set to have a certain angle with the horizontal plane, and the movement of the clamping arms 113 can only be ensured when the silicon rod holder 11 is moved to realize the cutting process. The range is separate from the cutting wire saw.

In some embodiments, the clamping arm driving mechanism includes a lead screw disposed along a first direction and associated with any one of the pair of clamping arms; a driving source for driving the associated clamping arm along the first direction move.

In some other implementations, the clamping arm driving mechanism includes: a bidirectional screw rod disposed along the first direction and threadedly connected to the pair of clamping arms at both ends; a driving source for driving the wire The lever is rotated to move the pair of clamp arms toward each other or toward each other in the first direction.

In some embodiments, any one of the first silicon rod holder and the second silicon rod holder further includes a clamping part rotation mechanism for driving the clamping part to rotate.

In an implementation of this embodiment, the clamping portions 114 corresponding to the pair of clamping arms 113 are provided with a rotatable structure such as a rotatable base, and the clamping portion rotation mechanism 116 can be configured to drive at least one clamp The clamping portion 114 corresponding to the arm 113 rotates. The clamping part rotation mechanism 116 drives the clamping part 114 to rotate with the first direction as the axis, so that the clamped silicon rod rotates along the axis of the silicon rod. During the cutting and grinding operations, by driving the silicon rod to rotate along its axis through the clamping portion rotating mechanism 116, the positional relationship of the clamped silicon rod relative to the dicing wire saw can be adjusted. The cutting surface of the rod, and the positional relationship of the clamped silicon rod relative to the grinding device can be adjusted to determine the grinding surface relative to the silicon rod, that is, the silicon rod holder can cooperate with the cutting device and the grinding device to achieve different cutting of the silicon rod Selection and control of surface and grinding surface.

In some embodiments, the clamping part has a multi-point contact clamping head. It should be understood that the contact mode between the multi-point contact clamping head and the end face of the silicon rod is not limited to point contact, so For example, the clamping portion has a plurality of protruding portions for contacting the end face of the silicon rod, wherein each protruding portion and the end face of the silicon rod can be in surface contact. In an implementation manner, the protruding part of the clamping part can also be connected to the base of the clamping part through a spring along the first direction, so that a multi-point floating contact can be formed, so that the silicon rod clamp can be clamped in the clamping part. The end face of the silicon rod can be adapted to the flatness of the end face of the silicon rod to clamp the silicon rod. In some examples, the clamping end of the clamping part for contacting the end face of the silicon rod can also be connected to the clamping part base by a universal mechanism such as a universal ball, and the clamping part can thus be adapted to clamp a End faces of silicon rods with different inclinations.

It should be noted that the direction in which the pair of clamping arms is arranged is related to the cutting device. When the silicon rod clamp drives the clamped silicon rod to move in the first direction, so that the silicon rod is fed relative to the cutting wire saw. During the process, the collision or interference between the silicon rod holder and the cutting device should be avoided; for example, when the cutting wire saw in the cutting device is set to follow the direction of the re-perpendicular line, the clamping arm of the silicon ingot holder can be set to the direction of the re-perpendicular line. , when the cutting wire saw is set along the horizontal direction, the clamping arm of the silicon rod holder can be set in the horizontal plane.

In other embodiments, the cutting device can be movably disposed on the silicon rod processing platform, for example, disposed on the translation mechanism in the first direction, so that the cutting wire saw in the wire cutting unit can move along the first direction Move to feed and cut the clamped silicon rod. The translation mechanism includes, for example, a guide rail and a drive, and the guide rail can be used to set the cutting frame of the cutting device.

Please refer to FIG. 8 , which is a schematic structural diagram of an embodiment of the cutting device of the present application. In the embodiment shown in the figure, the cutting device includes a wire cutting unit and a cutting frame. Wherein, the cutting frame 21 has a guide groove 24 adapted to the guide rail, so that the cutting frame 21 can be movably arranged on the guide rail arranged on the silicon rod processing platform. The wire cutting unit includes a plurality of cutting wheels, transition wheels, an annular cutting wire wound around the plurality of cutting wheels and transition wheels, and a wire cutting support 23 movably arranged on the cutting frame. The cutting device can move along the guide rail to adjust the cutting position relative to the silicon rod, of course, in the embodiment shown in FIG. In this embodiment, the direction in which the guide groove 24 is arranged is the second direction; it should be understood that in other embodiments, the structure of the cutting device can be changed, for example, the guide groove at the bottom of the cutting frame or other limiting positions If the structure is set along the first direction, the cutting device can be driven to move to realize the feeding and cutting of the silicon rod.

Cutting can be performed by relatively moving the cutting device and the silicon rod held by the silicon rod holder in the first direction. In some embodiments, the cutting device further includes a side skin supporting mechanism, which can assist in cutting Work to form a complete edging. The cutting device can also be provided with an edge skin dislocation mechanism, so that the cut edge skin can be released from the supported state, and then be transported to the unloading area.

In certain embodiments, the silicon rod processing equipment further includes a side skin conveying mechanism, which is used for receiving the cut edge skin and transferring the edge skin to the unloading area. Here, the discharge area is the side skin discharge area.

In one embodiment, the position of the edge skin conveying structure in the second direction can be set to be aligned with the cutting device in the silicon rod processing equipment, so that the edge skin formed by cutting the silicon rod can be conveyed by the corresponding edge skin conveying structure. to be transported, thereby reducing the transfer of the edge skin.

The direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin discharge area.

In one embodiment, the edge skin discharge area and the cutting area are disposed adjacent to each other along the first direction, and here, the edge skin conveying structure may be disposed along the first direction and be connected to the cutting device, so that the After the silicon rod is cut to form the edge skin, the edge skin is pushed along the first direction to be separated from the cut silicon rod or the supporting component, and then transferred to the edge skin conveying structure, thereby simplifying the transport path of the edge skin. The number of the edge skin conveying mechanisms can also be determined according to the number, structure or working mode of the cutting devices in the silicon rod processing equipment. For example, when the silicon rod processing equipment is provided with different processing locations, a plurality of processing locations There is a cutting device on it, and the edge skin conveying mechanism can be correspondingly set on a plurality of processing areas to correspond to the cutting device; for another example, when the cutting device can perform square cutting on a plurality of silicon rods at the same time, the edge skin The conveying mechanism can be set in multiples, so that each side skin conveying mechanism corresponds to a silicon rod.

In some embodiments, the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move to convey the edge skin.

Please refer to FIG. 9 , which shows a simplified structural schematic diagram of the silicon rod processing apparatus of the present application in an embodiment. As shown in the figure, the conveying part 521 can be arranged along a first direction, and is driven by the conveying driving source 522 to convey the carried side skins along the first direction. The moving direction of the conveying part 521 can be set to be in a direction toward the edge skin discharge area (the direction of the arrow shown in FIG. 7 ), so as to transport the carried edge skin to the edge skin discharge area.

The conveying driving source 522 is, for example, a motor, which is used to drive the conveying part 521 to move and control the conveying speed of the conveying part 521 .

In some examples, in order to prevent the edge skin from being worn by collision during the conveying process, in some embodiments, the conveying part 521 is provided with a buffer pad for contacting the edge skin, or, the conveying part 521 is provided with a buffer pad for contacting the edge skin. The portion 521 is made of a buffer material. The cushioning pad or cushioning material is, for example, elastic rubber, silicone or other materials with elastic deformation, damping properties or cushioning properties. In this way, the risk of breakage of the side skin during transportation is reduced, which is beneficial to the reuse of the side skin.

In some embodiments, the silicon rod processing equipment further includes a grinding device for grinding the silicon rod after square cutting by the cutting device.

In some implementations, the abrasive tool includes a grinding wheel and a rotating shaft. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is connected to the rotating shaft for controlled rotation along the rotating shaft, thereby contacting the side surface of the cut silicon rod in a rotating state to achieve grinding. It should be understood that, in a feasible implementation manner, the grinding device may also include a grinding tool, but in this setting, the grinding time is increased.

The grinding wheel has a certain particle size and roughness, for example, is formed by the consolidation of abrasive grains and a bonding agent, so as to form a surface with abrasive grains to contact and grind the side surface of the silicon rod after cutting. The grinding wheel has a certain size and density of abrasive grains, and its abrasives can be set as alumina, silicon carbide, diamond, cubic boron nitride and other abrasive grains whose hardness is greater than that of silicon materials according to the needs of grinding silicon rods.

In some embodiments, the abrasive tool can also be arranged in the form of a rough grinding tool and a fine grinding tool. For example, the abrasive tool can be arranged to include a rough grinding wheel and a fine grinding wheel. At least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding. The wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding The wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel. Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding. The wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.

In some examples, the at least one grinding tool includes two opposite grinding wheels and corresponding grinding wheel rotation shafts, which can be used to grind two opposite sides of the silicon rod at the same time, so as to improve the efficiency of grinding operations.

The grinding surface of the abrasive tool can be arranged in a vertical plane or in a horizontal plane. For example, when the grinding surface of the abrasive tool is arranged in a vertical plane (ie, in a plane parallel to the third direction), the abrasive tool can grind the side surface of the cut silicon rod that is located in the vertical plane; When the grinding surface of the grinding tool is set in a horizontal plane, the grinding tool can grind the upper and lower sides of the cut silicon rod.

Please refer to FIG. 10 , which shows a schematic structural diagram of a part of the structure of the silicon rod processing equipment of the present application in an embodiment. In the embodiment shown in FIG. 10 , a pair of grinding tools 301 of the grinding device 30 are arranged opposite to each other along the direction of the heavy vertical line, and the two grinding surfaces corresponding to the pair of grinding tools 301 are parallel and oppositely arranged, wherein , the grinding surface of any grinding tool 301 is along a horizontal plane direction.

The grinding device can also be provided with an abrasive tool advancing and retreating mechanism, and the abrasive tool advancing and retreating mechanism 302 is used to drive at least one grinding tool 301 of the at least one pair of grinding tools 301 to move in the direction of the heavy vertical line to adjust Grinding amount of the cut silicon rod. In some embodiments, the abrasive tool advancing and retreating mechanism 302 includes: an advancing and retreating guide rail, which is provided on the first conversion mechanism along the direction of the re-perpendicular line, and is used to set the abrasive tool 301; a driving source, which is used to drive the At least one of the grinding tools 301 moves along the advancing and retreating guide rails.

In an implementation manner, the grinding tool advancing and retracting mechanism 302 includes a sliding guide rail, a driving motor, and a ball screw (not shown in the figure). The sliding guide rail is arranged on the first conversion mechanism along the direction of the re-perpendicular line. The sliding guide rail is arranged and axially connected with the driving motor. In other feasible implementation manners, the driving source can also be set as an air cylinder, a hydraulic pump, etc., and its telescopic direction can be set as a heavy vertical direction; or, the driving source can be set as a screw assembly, the The screw assembly includes a screw and a rotation driving source, wherein the screw is connected to the grinding tool 301 to make the grinding tool 301 move along the sliding guide rail under the driving of the rotating driving source.

In some embodiments, the grinding tool advancing and retracting mechanism includes a bidirectional screw rod and a drive source, two sides of the bidirectional screw rod are provided with threads with opposite directions of rotation, and the bidirectional screw rod is arranged in the direction of the re-perpendicular line and connected on both sides respectively. To a grinding tool, in this setting, the driving source drives the bidirectional screw to rotate, and the grinding tools at both ends of the two-way screw approach or move away from each other in the direction of the heavy vertical line, so that the grinding tool can be adjusted relative to the silicon Rod grinding position and grinding amount.

In the embodiment in which the grinding surface of the abrasive tool is set in the vertical surface, the advance and retreat guide rail is set in the vertical direction of the grinding surface, which is a horizontal line direction; In the embodiment in the horizontal plane, the advancing and retreating guide rails are arranged in the direction of the heavy vertical line. The advancing and retreating guide rails can be used to set the at least one abrasive tool, and the advancing and retreating driving unit drives the abrasive tools to move along the advancing and retreating guide rails.

In the embodiment in which the silicon rod processing equipment includes a cutting device and a grinding device, the cutting device, the grinding device and the silicon rod clamping or carrying device (such as a silicon rod holder) cooperate to complete the opening of the silicon rod to be processed. Square cutting and grinding operations. In order to illustrate the overall layout and process conversion mode of the silicon rod processing equipment, the application also provides the following examples:

In certain embodiments, the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further includes: a transposition mechanism, connected to the cutting device and the grinding device, comprising: The indexing rotating shaft is driven to rotate by a preset angle, so that the cutting device and the grinding device can switch positions between the first processing area and the second processing area.

Please continue to refer to 6, the silicon rod processing equipment includes a machine base 10 and a cutting device 20 and a grinding device 30 on the silicon rod processing platform of the machine base 10 . The cutting device 20 and the grinding device 30 are connected to the transposition mechanism 40 and disposed on both sides of the transposition mechanism, so that the cutting device 20 and the grinding device 30 correspond to different processing positions respectively.

The transposition mechanism 40 includes a transposition shaft arranged in the direction of the heavy vertical line, so that the cutting device 20 and the grinding device 30 are driven to rotate to switch the processing position during the process of the cutting device 20 and the grinding device. The height of the center of gravity of the 30 remains unchanged, thereby improving the stability of the switching process, which is beneficial to the safety of the equipment, and is beneficial to reducing the torque or force that the transposition mechanism 40 is used to drive the cutting device 20 and the grinding device 30 to switch the processing position. . In the embodiment in which the transposition shaft is arranged on the re-perpendicular line, the grinding device 40 may be configured to include: at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are parallel and opposite to each other and an abrasive tool advancing and retreating mechanism for driving at least one of the pair of grinding tools to move in the direction of the heavy vertical line, so as to control the feeding amount of the grinding tool relative to the silicon rod, that is, the grinding amount.

Regarding the transposition mechanism 40 , in one embodiment, the transposition mechanism 40 further includes a rotary drive mechanism for driving the cutting device 20 and the grinding device 30 to rotate. The rotary drive mechanism is, for example, connected to a shaft. A drive motor for the transposition shaft; in another embodiment, the rotational drive mechanism includes: a driving gear, which is connected to a power drive source; a driven gear, which is engaged with the driving gear and connected to the transposition shaft , the driving gear rotates under the drive of the driving source, thereby driving the meshed driven gear to rotate, and the driven gear can be used to carry or connect the grinding device 30 and the cutting device 20 to drive the grinding device 30 and the The cutting device 20 switches between the first processing position and the second processing position.

In a processing scenario, the processing flow performed by the silicon rod processing equipment is as follows:

Load the first silicon rod into the first silicon rod holder, the first silicon rod holder can drive the first silicon rod to move in the first direction to feed the cutting wire saw to realize cutting, and the first silicon rod holder can drive the first silicon rod to move. A silicon rod is moved back in the first direction so that the silicon rod is fed relative to the cutting wire saw for several times until the surface of the silicon rod forms four cut planes, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

Wherein, during the cutting process, the first silicon rod moves in the cutting accommodating space of the wire cutting unit, and the annular cutting wire wound in the wire cutting unit is driven to run to cut the silicon rod; in some cases, the cutting device The edge skin supporting mechanism can also be used to support the edge skin formed by cutting to help obtain a complete edge skin. In the cutting device, the supported edge skin can also be pushed out by the edge skin dislocation mechanism so that the edge skin can be transferred. To the edge skin conveying mechanism of the silicon rod processing equipment, to transfer the cut edge skin to the edge skin discharge area.

After processing to obtain the cut first silicon rod, the transposition mechanism drives the cutting device and the grinding device to switch positions between the first processing position and the second processing position, and the grinding device is turned to the first processing position. Processing area, in this state, the first silicon rod holder can drive the clamped first silicon rod after cutting to move in the first direction, and the grinding device drives the grinding tool to move in the direction of the heavy vertical line to contact After cutting the side of the first silicon rod to achieve grinding, the first silicon rod holder drives the silicon rod to rotate along the axis of the silicon rod to switch the grinding surface of the grinding device relative to the silicon rod, thereby obtaining the ground silicon rod.

During the grinding operation in the first processing area, the second silicon rod holder can load the second silicon rod to be processed, and similarly, the second silicon rod holder can drive the second silicon rod The direction is reversed to make the silicon rod feed relative to the cutting wire saw for many times until the surface of the silicon rod forms four cutting planes, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained; The cutting process of the second silicon rod is similar to that of cutting the first silicon rod.

The ground silicon rods in the first processing area are unloaded, the first silicon rod clamp can load another third silicon rod to be cut, and the cutting device and the grinding device are driven by the transposition mechanism to switch positions, and the cutting device is The third silicon rod held by the first silicon rod holder can be cut; the grinding device can grind the cut second silicon rod held by the second silicon rod holder.

By repeating the above process in this way, the silicon rod processing equipment can perform processing operations of different processes at the same time, and realize the effective connection of the flow of different processes through the transposition mechanism; wherein, the cutting device can be operated at a high speed through a ring-shaped ring. The cutting line performs square cutting on the silicon rod, which is beneficial to obtain a high-precision cut silicon rod, so that the subsequent grinding process is also simplified.

The silicon rod processing equipment of the present application can also be modified in other ways. In some embodiments, the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further includes: a first processing area. The conversion mechanism is arranged at the first installation position on the silicon rod processing platform and is connected to the cutting device, and includes a first rotating shaft, which drives the first rotating shaft to rotate a preset angle so that the cutting device is in the first processing position and the second processing position. The second switching mechanism is set at the second installation position on the silicon rod processing platform and connected to the grinding device, and includes a second rotating shaft, which drives the second rotating shaft to rotate a preset angle to make the grinding device in the The position is switched between the first processing location and the second processing location.

Please refer to FIG. 11 , which is a schematic structural diagram of an embodiment of the silicon rod processing equipment of the present application.

In this embodiment, the silicon rod processing equipment includes: a machine base 10 , a silicon rod holder, a cutting device 41 and a grinding device 33 . The silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further includes: a first conversion mechanism 43 and a second conversion mechanism 45 .

The first installation position and the second installation position are not the same position. Correspondingly, the first conversion mechanism 43 and the second conversion mechanism 45 are arranged at different positions of the silicon rod processing platform. The first installation position and the second installation position should satisfy that the cutting device 23 and the grinding device 33 do not interfere with each other during the process of changing the processing location. In some embodiments, the first installation location and the second installation location may be located between the first processing location and the second processing location. In an implementation manner, the first installation position and the second installation position may also be set in a middle area between the first processing area and the second processing area. For example, when the first processing area and the second processing area are arranged in parallel and symmetrically, the first installation position and the second installation position may be arranged on the symmetry line of the first processing area and the second processing area.

The first conversion mechanism and the second conversion mechanism can relatively independently drive the corresponding cutting device and grinding device. Here, the directions of the first rotating shaft and the second rotating shaft can be set to the same direction or different directions.

In some embodiments, the first rotating shaft is arranged in the first direction, the second rotating shaft is arranged in the re-perpendicular direction; the first processing area and the second processing area are arranged on opposite sides of the second direction , wherein the first direction, the second direction, and the re-perpendicular direction are perpendicular to each other.

Please refer to FIG. 12 , which is a schematic diagram of a part of the structure of the silicon rod processing equipment shown in FIG. 11 .

In one embodiment, the first conversion mechanism 43 includes: a bracket 430 for setting the cutting device; a rotation driving source 432 for driving the cutting device to rotate relative to the bracket 430 along the first rotation shaft 431 to rotate The position is switched between the first processing area and the second processing area. In the embodiment shown in FIG. 11 , the cutting frame 411 of the cutting device is connected to the first rotating shaft 431 , and at least one line cutting unit disposed on the cutting frame 411 rotates along the first rotating shaft along with the cutting frame 411 . The bracket 430 can be used as the base of the first conversion mechanism 43 , and the cutting device can be movably arranged on the bracket 430 based on the first rotating shaft 431 , and can rotate relative to the bracket 430 along the first rotating shaft 431 under the driving of the rotation driving source 432 . . The rotational drive source 432 is, for example, a motor having a power take-off shaft, and the power take-off shaft can be axially connected to the first rotating shaft 431 .

Regarding the second conversion mechanism, in an embodiment, the second conversion mechanism further includes a rotation driving mechanism for driving the grinding device to rotate and shift, and the rotation driving mechanism is, for example, pivotally connected to the conversion mechanism. In another embodiment, the rotation driving mechanism includes: a driving gear, which is connected to a power driving source; a driven gear, which is engaged with the driving gear and connected to the shifting shaft, and the The driving gear rotates under the drive of the driving source, thereby driving the engaged driven gear to rotate, and the driven gear can be used to carry or connect the grinding device to drive the grinding device in the first processing area and the second processing area. switch between.

In each embodiment in which the cutting device is connected to the first conversion mechanism and the grinding device is connected to the second conversion mechanism, first silicon rods may be disposed on the first processing area and the second processing area, respectively. The clamp and the second silicon rod clamp are used to clamp the silicon rod in the processing area and drive the silicon rod to move in the first direction, so that the to-be-cut silicon rod is fed relative to the cutting wire saw to realize cutting, and the to-be-grinded silicon rod is fed. The silicon rod moves relative to the grinding device along the first direction so that the grinding surface of the grinding tool covers the entire side surface of the silicon rod.

Taking the cutting device at the first processing location as an example at the initial moment, the first silicon rod is loaded into the first silicon rod holder, and the first silicon rod holder can drive the first silicon rod to move in the first direction to saw relative to the cutting wire. In order to achieve cutting, the first silicon rod holder can drive the first silicon rod to move back in the first direction, so that the silicon rod is fed relative to the cutting wire saw for many times until the surface of the silicon rod forms four cut surfaces, that is, the cross section is rectangular. or quasi-rectangular cut silicon rods.

After processing and obtaining the cut first silicon rod, the first conversion mechanism drives the cutting device to rotate along the first rotating shaft by a preset angle to switch from the first processing position to the second processing position, and the cutting device is It is transferred to the second processing position, and at the same time, the second conversion mechanism drives the grinding device to rotate along the second axis by a preset angle to switch to the first processing position. In this state, the first silicon rod holder can be Drive the clamped and cut first silicon rod to move in the first direction, the grinding device drives the grinding tool to move in the direction of the heavy vertical line to contact the side of the cut silicon rod to achieve grinding, and is driven by the first silicon rod clamp The grinding surface of the grinding device relative to the silicon rod can be switched by rotating the silicon rod along the axis of the silicon rod, thereby obtaining the ground silicon rod.

During the grinding operation in the first processing area, the second silicon rod holder can load the second silicon rod to be cut; similarly, the second silicon rod holder can drive the second silicon rod The direction is reversed to move the silicon rod relative to the cutting wire saw for several times until the surface of the silicon rod forms four cutting planes, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

unloading the ground silicon rods in the first processing area, the first silicon rod holder can load the third silicon rod to be cut, and the cutting device is driven by the first conversion mechanism to switch the processing area, and The second switching mechanism drives the grinding device to switch the processing position, and the cutting device can cut the third silicon rod clamped by the first silicon rod holder.

Please refer to FIG. 13 , which shows a schematic structural diagram of the silicon rod processing equipment of the present application in another embodiment.

In some implementations, the positions of the cutting device and the grinding device are shifted by a linear motion mechanism.

As shown in the figure, the silicon rod processing equipment includes a machine base, a cutting device 25, a grinding device 35, and a silicon rod loading and unloading device (not shown in the figure).

The silicon ingot processing platform is provided with a first processing area and a second processing area, and the silicon ingot processing equipment further includes: a cutting conversion mechanism 61 having a cutting conversion guide rail 611 for driving the cutting device 25 along the cutting conversion guide rail 611 Move to switch positions between the first processing position and the second processing position; the grinding conversion mechanism 63 has a grinding conversion guide rail 631, and drives the grinding tool in the grinding device 35 to move along the grinding conversion guide rail 631 to move in the first processing Switch positions between the location and the second processing location.

In an embodiment of the present application, the cutting conversion mechanism 61 is used to drive the cutting frame 251 of the cutting device 25 and at least one wire cutting unit thereon to switch between the first processing position and the second processing position.

The first processing area and the second processing area are both arranged along the first direction and located on opposite sides of the silicon rod processing platform in the second direction. The cutting conversion guide rail 611 of the cutting conversion mechanism 61 passes through the first processing area and the second processing area in the second direction, and the grinding conversion guide rail 631 of the grinding conversion mechanism 63 passes through the grinding conversion guide rail 631 in the second direction. A first processing location and a second processing location. Wherein, the cutting conversion guide rail 611 and the grinding conversion guide rail 631 are both arranged along the second direction, and are respectively arranged on opposite sides of the silicon rod processing platform in the first direction.

In this example, using the cutting conversion mechanism 61, the cutting frame 251 and at least one wire cutting unit thereon can be driven to move in the second direction to switch between the first processing position and the second processing position, for example , use the cutting conversion mechanism 61 to drive the cutting frame 251 and at least one line cutting unit on it to move in the second direction to convert from the first processing position to the second processing position, or use the cutting conversion mechanism 61 The cutting frame 251 and the at least one wire cutting unit on the cutting frame 251 are driven to move in the second direction to switch from the second processing position to the first processing position.

In the silicon rod processing equipment described in this embodiment, for any processing position, such as the silicon rod on the first processing position, the cutting frame 251 and at least one line cutting unit on the cutting frame 251 are driven by the cutting conversion mechanism 61 Move along the second direction until the cutting unit is located at the first processing area, and after the cutting device 25 squares the silicon rod at the first processing area, move the cut silicon rod along the first direction until it is aligned with the desired position in the first direction. The grinding device 35 makes the grinding conversion mechanism 63 drive the grinding tool to move to the first processing area along the second direction, so that the cut silicon rod can be ground.

Regarding the grinding conversion mechanism, in one embodiment, the grinding device is provided with at least one pair of grinding tools and at least one grinding tool switching mechanism. The abrasive tool conversion mechanism includes: an abrasive tool conversion guide rail and an abrasive tool conversion drive unit.

As shown in FIG. 13 , the grinding tool conversion guide rail 631 is arranged along the second direction for setting the grinding tool. In some embodiments, the grinding tool conversion guide rail 631 is arranged on the silicon rod processing platform along the second direction, and the at least one pair of grinding tools is mounted on the grinding tool conversion guide rail 631 by, for example, a slider.

The grinding tool conversion driving unit (not shown in the figure) is used for driving the pair of grinding grinding tools to move along the grinding tool conversion guide rail to switch between the first processing area and the second processing area. In some embodiments, the grinding tool conversion driving unit includes: a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and is parallel to the grinding tool conversion guide rail.

The grinding tool has a grinding tool mounting seat, and the driving gear is arranged on the grinding tool mounting seat and meshes with the moving rack, so as to drive the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The drive source is used to drive the drive gear. In an implementation manner of the present application, the drive gear is provided on the abrasive tool mounting seat, the drive gear is driven to rotate by a drive source, and the gear teeth of the drive gear mesh with the moving rack, conforming to the The moving rack travels, whereby at least one pair of abrasives connected to the drive gear produces a corresponding movement on the abrasive transition rails.

In some embodiments, the grinding tool conversion drive unit may be disposed on the grinding tool mounting seat, and includes a moving screw and a driving source, wherein the moving screw is disposed along the second direction and is connected with the one For the grinding tools, the driving source is used to drive the moving screw to rotate, so as to make the associated pair of grinding tools move along the grinding tool conversion guide rail.

In some embodiments, the grinding tool conversion driving unit may further control the position of each grinding tool in the pair of grinding tools in the second direction, thereby controlling the grinding of the grinding tool relative to the silicon rod Feed rate.

In each embodiment in which the cutting device is connected to the cutting conversion mechanism and the grinding device is connected to the grinding conversion mechanism, a first silicon rod holder and a second silicon rod holder can be respectively provided on the first processing area and the second processing area. Two silicon rod clamps are used to clamp the silicon rod at the processing area and drive the silicon rod to move in the first direction, so that the silicon rod to be cut is fed relative to the cutting wire saw to achieve cutting, and the silicon rod to be ground is relatively The grinding device moves along the first direction so that the grinding surface of the grinding tool covers the entire side surface of the silicon rod.

The cutting device is converted from the first processing position to the second processing position by the cutting conversion mechanism, and the grinding device is converted to the first processing position by the grinding conversion mechanism.

Drive the first silicon rod holder and the first silicon rod held by it to move along the first direction, so that the grinding device can grind the first silicon rod; at the same time, the second silicon rod holder is loaded with another material to be cut. For the second silicon rod, the second silicon rod clamp and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device cuts the second silicon rod to form a rectangular or quasi-rectangular cross-section. A silicon rod; wherein, the cutting process of the cutting device for the second silicon rod is similar to the aforementioned cutting process for the first silicon rod.

Unload the first silicon rod that has completed the grinding operation, convert the cutting device from the second processing position to the first processing position by the cutting conversion mechanism, and convert the grinding device from the first processing position to the first processing position by the grinding conversion mechanism. The second processing area. In this way, the grinding device can grind the silicon rod after cutting in the second processing area, and the first silicon rod holder is loaded with the third silicon rod, and the cutting device can perform the cutting operation in the first processing area. The corresponding cutting process can refer to The cutting process of the first silicon rod is not repeated here.

The subsequent processing process is similar to the above steps. Repeatedly, the silicon rod processing equipment can perform cutting and grinding operations at the same time, automate the flow of different processes and simplify the transport path, which effectively improves processing efficiency; among them, the cutting device can run at high speed. The ring-shaped cutting line is used to square the silicon rod, which is beneficial to obtain a high-precision cut silicon rod, so that the subsequent grinding process is also simplified.

The above-mentioned embodiments merely illustrate the principles and effects of the present application, but are not intended to limit the present application. Anyone skilled in the art can make modifications or changes to the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in this application should still be covered by the claims of this application.

Claims

A cutting device for processing silicon rods, comprising: a cutting frame and at least a wire cutting unit, wherein the wire cutting unit comprises:

Cutting line;

The first cutting wheel and the second cutting wheel are arranged on the cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting line is wound around the first cutting wheel and the second cutting wheel. two cutting wheels to form a cutting wire saw;

A first transition wheel, located beside the first cutting wheel, is used for pulling the cutting line around the first cutting wheel to make the cutting line around the first cutting wheel coplanar with the first cutting wheel The plane where the first cutting groove of the cutting wheel is located;

A second transition wheel, arranged beside the second cutting wheel, is used for pulling the cutting line wound around the second cutting wheel so that the cutting line wound around the second cutting wheel is coplanar with the second cutting wheel The plane where the second cutting groove of the cutting wheel is located;

At least one third transition wheel, arranged between the first transition wheel and the second transition wheel, is used for pulling the cutting line between the first transition wheel and the second transition wheel, so as to make the to-be-to-be-transition wheel A cutting accommodating space is formed in the wire cutting unit;

Wherein, the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form an end-to-end closed-loop cutting line.
The cutting device according to claim 1, wherein the first transition wheel, the second transition wheel, and the at least one third transition wheel are used for pulling the cutting wire away from the cutting accommodating space.
The cutting device according to claim 1, wherein the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, A second transition wheel, a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel form an end-to-end closed-loop cutting line.
The cutting device according to claim 1, further comprising a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.
The cutting device according to claim 4, wherein the cutting wire driving device is a motor, and has a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel.
The cutting device according to claim 1, characterized in that it further comprises at least one distance adjusting mechanism, which is arranged on the at least one wire cutting unit and is used for driving a plurality of cutting wheels and a plurality of transition wheel edges in the wire cutting unit. Move perpendicular to the face of the cut-off wheel.
The cutting device according to claim 6, wherein the cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:

a screw rod, arranged along the orthogonal direction of the surface of the cutting wheel and threadedly connected with the single-wire cutting unit;

The driving source is used for driving the lead screw to rotate.
The cutting device according to claim 6, wherein the cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:

a telescopic piece, arranged along the orthogonal direction of the surface of the cutting wheel and associated with the single-wire cutting unit;

The driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.
The cutting device according to claim 6, wherein the cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:

a rack, arranged on the single-wire cutting unit along the orthogonal direction of the cutting wheel surface;

A transmission gear meshes with the rack; a driving source is used to drive the transmission gear to rotate.
The cutting device according to claim 6, wherein the cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit One is driven by the distance adjustment mechanism to move in the orthogonal direction of the cutting wheel surface.
The cutting device according to claim 10, wherein the distance adjusting mechanism comprises:

a screw rod, arranged along the orthogonal direction of the wheel surface of the cutting wheel and threadedly connected with the first wire cutting unit or the second wire cutting unit;

The driving source is used for driving the lead screw to rotate.
The cutting device according to claim 10, wherein the distance adjusting mechanism comprises:

a telescopic piece, arranged along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit;

The driving source is used for driving the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel.
The cutting device according to claim 10, wherein the distance adjusting mechanism comprises:

A bidirectional screw rod is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected with the first wire cutting unit and the second wire cutting unit,

The driving source is used for driving the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
The cutting device according to claim 10, wherein the distance adjusting mechanism comprises:

a first rack, disposed along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit;

a second rack, arranged along the orthogonal direction of the cutting wheel surface and associated with the second wire cutting unit;

a transmission gear meshing with the first rack and the second rack;

The driving source is used for driving the transmission gear to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
The cutting device according to claim 1, further comprising an edge skin supporting mechanism for abutting against the outside of the silicon rod and supporting the edge skin formed by cutting.
The cutting device according to claim 15, wherein the edge skin supporting mechanism comprises:

At least one supporting component, the supporting component includes:

a supporting portion, controlled against and supporting the edge skin;

a driving unit, connected to the support part to control the support part to move away from or abut against the side skin;

At least one mounting part is used for connecting the at least one supporting component to the cutting device.
The cutting device according to claim 1 or 15, further comprising an edge skin dislocation mechanism, which is provided on the cutting device and is used to push the edge skin along a first direction to separate the edge skin from the edge skin. Edge skin support mechanism or cut silicon rod.
The cutting device according to claim 17, wherein the edge skin dislocation mechanism comprises:

power source;

The telescopic rod is arranged along the first direction and is used for telescopic movement driven by the power source to push the side skin.
A silicon rod processing equipment, characterized in that, comprising:

Machine base with silicon rod processing platform;

The cutting device according to any one of claims 1 to 18, used for cutting the silicon rod to be cut.
The silicon rod processing equipment according to claim 19, further comprising an edge skin conveying mechanism for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area.
The silicon rod processing equipment according to claim 20, wherein the edge skin conveying mechanism comprises:

a conveying part for carrying the edge skin;

The conveying driving source is used for driving the conveying part to move to convey the edge skin.
The silicon rod processing equipment according to claim 19, further comprising at least one silicon rod holder for holding the silicon rod and driving the silicon rod to move along the axial direction of the silicon rod to make the silicon rod relative to the cutting device. Cutting wire saw feed.
The silicon rod processing equipment according to claim 19, further comprising a grinding device for grinding the silicon rod cut by the cutting device.
The silicon rod processing equipment according to claim 23, wherein the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further comprises:

A transposition mechanism, connected with the cutting device and the grinding device, includes a transposition rotating shaft, and drives the transposition rotating shaft to rotate a preset angle so that the cutting device and the grinding device are located between the first processing position and the second processing position Convert location.
The silicon rod processing equipment according to claim 23, wherein the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further comprises:

The first conversion mechanism, which is arranged at the first installation position on the silicon rod processing platform and is connected to the cutting device, includes a first rotating shaft, and drives the first rotating shaft to rotate a preset angle so that the cutting device can be positioned between the first processing position and the second cutting device. Switch positions between the two processing locations;

The second conversion mechanism, which is arranged at the second installation position on the silicon rod processing platform and connected to the grinding device, includes a second rotating shaft, and drives the second rotating shaft to rotate by a preset angle so that the grinding device is in the first processing position and the second rotating shaft. Switch positions between the two processing locations.
The silicon rod processing equipment according to claim 23, wherein the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment further comprises:

a cutting switching mechanism, having a cutting switching guide rail, and driving the cutting device to move along the cutting switching guide rail to switch positions between the first processing position and the second processing position;

The grinding conversion mechanism has a grinding conversion guide rail, and drives the grinding tools in the grinding device to move along the grinding conversion guide rail to switch positions between the first processing area and the second processing area.