CN210256793U

CN210256793U - Large-size silicon carbide wafer diamond wire cutting machine tool

Info

Publication number: CN210256793U
Application number: CN201920833017.3U
Authority: CN
Inventors: 徐晨影; 华卫东
Original assignee: Taizhou Chenhong Nc Equipment Manufacturing Co ltd
Current assignee: Taizhou Chenhong Nc Equipment Manufacturing Co ltd
Priority date: 2019-06-04
Filing date: 2019-06-04
Publication date: 2020-04-07
Anticipated expiration: 2029-06-04

Abstract

A large-size silicon carbide wafer diamond wire cutting machine tool comprises a base (1) and a door-shaped upright post (12) provided with a wire guide assembly, and is characterized in that the base (1) at two sides of the door-shaped upright post (12) is respectively provided with a wire conveying component (2), and a sliding block is arranged on a guide rail and driven by a servo motor to realize stepping wire releasing or wire receiving; a Y-direction herringbone upright post (3) is arranged in the center of the base (1), and the Y-direction herringbone upright post (3) is driven by a Y-direction driving mechanism (4) to perform front and back feeding movement; a Z-direction sliding plate is arranged on the Y-direction herringbone upright post (3), the Z-direction sliding plate is driven by a Z-direction driving mechanism (5) arranged on the upper part of the Y-direction herringbone upright post (3) to move up and down, a workpiece clamping mechanism (7) is arranged on a C-axis driving mechanism (6), and the C-axis driving mechanism (6) drives a processed workpiece on the workpiece clamping mechanism (7) to rotate or swing. The utility model discloses simple structure, it is convenient to make, and processingquality is reliable and stable, and is efficient.

Description

Large-size silicon carbide wafer diamond wire cutting machine tool

Technical Field

The utility model relates to a wire cut electrical discharge machining bed, especially a wire cut electrical discharge machining bed of trade silk cycle length, specifically speaking are jumbo size carborundum wafer diamond wire cut electrical discharge machining bed.

Background

Silicon carbide is a polymorphic compound. Under the high temperature of 560 ℃, the silicon carbide wafer can still work and operate without a cooling device, and has irreplaceable advantages in extreme environment applications such as aerospace, military industry, nuclear energy and the like.

The silicon carbide wafer is a third-generation semiconductor material, has the advantages of large forbidden band width, high critical breakdown field strength, high thermal conductivity and the like, and is an ideal material for manufacturing high-voltage and high-power semiconductor devices. High quality and large diameter silicon carbide single crystals are very important, but wafer processing plays a role in determining the surface quality of wafers, wherein the cutting of bulk single crystals into wafers with small warpage, uniform thickness and small loss of knife gaps is very important, otherwise, the subsequent grinding and polishing work is extremely difficult. Since SiC has a mohs hardness of 9.2, next to diamond (which has a mohs hardness of 10), the difficulty of processing is great. When the diameter of the crystal reaches 2 inches, the conventional internal circular cutting machine does not work effectively, and a silicon carbide wafer of a certain thin size cannot be cut and processed. Diamond wire cutting techniques must be employed. The wire winding cylinder rotating at high speed and rotating in a reciprocating way drives the diamond wire to do reciprocating motion, the diamond wire is tensioned by two tensioning wire wheels (springs or pneumatic), and two guide wheels are additionally arranged to ensure the cutting precision and the surface shape. The diamond wire control platform is controlled to continuously feed towards the direction of the diamond wire control platform through an automatic control working platform, or the diamond wire control platform is controlled to continuously feed towards the direction of the working platform, so that grinding is generated between the diamond wire and an object to be cut, and cutting is formed. In the cutting process, because the diameter of the diamond wire is small and the diamond wire has elasticity, an opening angle is formed between the cut object and the two guide wheels positioned on the left and the right of the cut object by the diamond wire, and the diamond wire is in a micro-arc shape. The force applied to the article being cut is thus combined with the relative motion between the diamond wire and the article being cut, so that the cut is continuously performed.

The prior art adopts a reciprocating sand line feeding or workpiece feeding mode between two main guide wheels in a processing area, so that the sand line in the processing area is easy to drift or shake, and the silicon carbide surface cut and processed is uneven and has stripes with different depths, which brings great difficulty to grinding and polishing work and leads to the fact that material scrapping cannot be finished in serious subsequent procedures. 2. The storage capacity of the diamond sand wire on the wire storage cylinder is limited, generally less than 300 meters, the diamond wire with insufficient length participates in cutting processing, the cutting edge of the sand wire is not enough to cut the whole wafer, the diamond wire needs to be replaced again, the processing efficiency is influenced, and secondary cutting is brought after the diamond wire is replaced because the diameter of the sand wire which is not replaced and processed is larger than the diameter of the sand wire which is used for processing, more serious stripes with different depths are brought, and the processing quality and efficiency are influenced. 3. The wire-conveying main motor is generally matched with a frequency converter for speed regulation, the speed regulation range is small, the motor output torque is small in low frequency, the tension of a diamond sand wire fluctuates in speed reduction and commutation, the processing manufacturability flexibility is insufficient, and wafer edge breakage is easily caused when the wire-conveying main motor is close to cutting processing.

SUMMERY OF THE UTILITY MODEL

The utility model aims at designing a stable, long jumbo size silicon carbide wafer diamond wire cut electrical discharge machining bed of silk thread length of cutting to current wire cut electrical discharge machining bed because of line of cut length is not enough, the unstable problem of processingquality easily appears.

The technical scheme of the utility model is that:

a large-size silicon carbide wafer diamond wire cutting machine tool comprises a base 1, wherein a door-shaped upright post 12 is installed in the center of the base 1, and a wire guide assembly is installed on the door-shaped upright post 12, and the large-size silicon carbide wafer diamond wire cutting machine tool is characterized in that wire conveying components 2 are respectively installed on the bases 1 on two sides of the door-shaped upright post 12, a diamond wire is led out from the wire conveying component on one side, passes through the wire guide assembly and then is collected by the wire conveying component on the other side, the wire conveying components 2 are installed on a sliding block, and the sliding block is installed on a guide rail and driven by a; a Y-direction herringbone upright post 3 is arranged in the center of the base 1, and the Y-direction herringbone upright post 3 is driven by a Y-direction driving mechanism 4 to perform front and back feeding movement; the Y-direction herringbone upright post 3 is provided with a Z-direction sliding plate, the Z-direction sliding plate is driven by a Z-direction driving mechanism 5 arranged at the upper part of the Y-direction herringbone upright post 3 to move up and down, the Z-direction sliding plate is provided with a C-axis driving mechanism 6, the C-axis driving mechanism 6 is provided with a workpiece clamping mechanism 7, and the C-axis driving mechanism 6 drives a processed workpiece on the workpiece clamping mechanism 7 to rotate or swing.

The wire conveying component 2 consists of a wire conveying main shaft motor and a wire barrel which are both arranged on a sliding block and move synchronously, the sliding block is arranged on a guide rail and driven by a lead screw, and the lead screw is driven by a servo motor.

The diamond wire on the wire cylinder is wound in a single-guide mode or in multiple layers, and the length of the diamond wire is 1000-10000 m.

The guide wire assembly comprises a transition guide wheel 8, a tension wheel 9, a tension detection wheel 10 and a main guide wheel 11 which are arranged on the door-shaped upright post.

The utility model has the advantages that:

the utility model discloses a can twine several kilometers to the gold stone line of a ten thousand meters on two fortune silk device silk section of thick bamboos on one layer, adopt asymptotic formula to walk a silk mode, set for certain volume number according to the technology and be the sand line of length (if 1000 volume numbers) between two silk sections with the number of times of settlement (if 50) reciprocating motion, when reaching the reciprocal number of times of settlement, the diamond sand line of participating in the cutting is in order to set for volume number (if 2 volumes) winding no longer participates in cutting process on B silk section of thick bamboo, a silk section of thick bamboo is placed the diamond line of not participating in the cutting and is in the volume number (if 2 volumes) of settlement, participate in next cutting process, the almost diamond wire of final consume twines on B fortune silk section of thick bamboo. And if the wire is broken in the processing process, removing the sand line on the wire winding B conveying device, and re-arranging the sand line on the wire barrel A which does not participate in processing and cutting to re-process and cut. The loss of broken wire and sand line is negligible, the loss is reduced, the flatness is improved by the asymptotic wire-moving, which brings positive influence to the next procedure. The wire conveying spindle motor adopts a high-power servo motor, so that the tension is ensured to be stable during speed reduction and reversing, the wire conveying speed can be adjusted near the end of cutting processing, and the optimal cutting process state is achieved.

The C-axis drives the workpiece to rotate, so that the machining efficiency is improved, the cutting and the trimming cutter are organically integrated together, the surface quality is improved, and finally, the workpiece can be cut and machined in a swinging mode according to the set value, because the diameter of the cutting part of the workpiece is reduced along with the cutting, the strength is reduced, the final cutting stage is easy to break, the subsequent process is influenced, and the workpiece is seriously scrapped.

The diamond wire cutting tension can be set, adjusted and fed back to the control system in real time, and the tension of the sand wire in the processing area and the stability of the sand wire are guaranteed. This is a necessary condition for ensuring the quality of the cut.

The utility model discloses simple structure, it is convenient to make, and processingquality is reliable and stable, and is efficient.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a rear view of fig. 1.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

As shown in fig. 1-2.

The utility model provides a jumbo size carborundum wafer diamond wire cut electrical discharge machining bed, it includes base 1, and door shape stand 12 is installed at the center of base 1, installs the seal wire subassembly on the door shape stand 12, and the seal wire subassembly includes symmetrical arrangement's transition guide pulley 8, take-up pulley 9, tension detection wheel 10 and leading wheel 11, and the structure of each part in the seal wire subassembly all is the same with prior art, can directly adorn relevant part on the existing equipment the utility model discloses a on the lathe, as shown in figure 1. The base 1 at two sides of the door-shaped upright post 12 is respectively provided with a wire conveying part 2, the wire conveying part 2 generally comprises a wire conveying main shaft motor and a wire barrel, and diamond wires on the wire barrel are wound in single-guide or multi-layer mode, and the length of the diamond wires is 1000-10000 meters. The wire conveying main shaft motor and the wire barrel are both arranged on a sliding block to move synchronously, the sliding block is arranged on a guide rail and driven by a lead screw, and the lead screw is driven by a servo motor. The wire releasing cylinder moves along a straight line while rotating, so that the silk thread keeps an ideal wire releasing state, is more suitable for releasing and conveying the silk thread of the multi-layer wound wire cylinder, prevents the phenomena of silk breakage and silk disorder, and corrects the phenomena in time when the phenomena occur. The diamond silk thread is led out from the silk conveying part at one side, passes through the wire guide assembly and then is collected by the silk conveying part at the other side, the silk conveying part 2 is installed on the sliding block, and the sliding block is installed on the guide rail and driven by the servo motor to realize stepping silk releasing or silk collecting; a Y-direction herringbone upright post 3 is arranged in the center of the base 1, and as shown in figure 2, the Y-direction herringbone upright post 3 is driven by a Y-direction driving mechanism 4 to perform front and back feeding movement; the Y-direction driving mechanism 4 generally comprises a motor, a belt wheel, a lead screw and a nut, can adopt the same existing Y-direction driving structure, and can also be designed and manufactured by self. The Y-direction herringbone column 3 is provided with a Z-direction sliding plate, the Z-direction sliding plate is driven by a Z-direction driving mechanism 5 (generally, a driving structure is composed of a motor and a lead screw nut, and can be realized by adopting the prior art) arranged at the upper part of the Y-direction herringbone column 3 to move up and down, the Z-direction sliding plate is provided with a C-axis driving mechanism 6 (equivalent to a main shaft and composed of a main shaft motor and a main shaft head with a chuck or a clamping fixture), the C-axis driving mechanism 6 is provided with a workpiece clamping mechanism 7 (namely, the main shaft is provided with the clamping mechanism 7), and the C-axis driving mechanism 6 drives a processed workpiece on the workpiece clamping mechanism 7 to rotate or swing.

As shown in the figure 1-2, AB double-conveying wires are arranged on two sides of the base, and the wire cylinder can be wound with diamond wires in multiple layers. The Y-direction herringbone sliding column is located in the center of the base, the Y-direction driving mechanism drives the upright column to feed forwards and backwards, a Z-direction sliding plate is arranged in front of the upright column, the Z-direction driving mechanism drives the Z-direction sliding plate to feed upwards and downwards, a workpiece clamping mechanism is arranged on the Z-direction sliding plate, and the C-axis driving mechanism drives the workpiece clamping mechanism to rotate or swing. Two fixed upright posts are symmetrically arranged on bases on two sides of the sliding post, a main processing guide wheel assembly, a tension detection guide wheel assembly, a transition guide wheel assembly, a tension guide wheel device and a feedback device are arranged on the fixed upright posts.

During processing, will be located the winding multilayer diamond wire on a fortune silk device silk section of thick bamboo of base one side A earlier, can set for according to the line footpath and arrange the silk clearance, later with the diamond wire through the transition guide pulley, the take-up pulley, the tension detects the wheel, the leading wheel, the tension detects the wheel, the take-up pulley, transition guide pulley to another side silk section of thick bamboo, the work piece is arranged in on the C axle work piece fixed plate, add the fortune silk of opening during processing, set for Y to and Z to the position, the C axle drives the work piece rotation with certain rotational speed according to setting for, the Z axle drives the work piece displacement according to the speed of setting for, the diamond wire produces relative motion with the work piece with the linear motion.

The utility model discloses the part that does not relate to all is the same with prior art or can adopt prior art to realize.

Claims

1. A large-size silicon carbide wafer diamond wire cutting machine tool comprises a base (1), wherein a door-shaped upright post (12) is installed at the center of the base (1), and a wire guide assembly is installed on the door-shaped upright post (12), and the large-size silicon carbide wafer diamond wire cutting machine tool is characterized in that a wire conveying component (2) is installed on each of the bases (1) on two sides of the door-shaped upright post (12), a diamond wire is led out from the wire conveying component on one side, passes through the wire guide assembly and then is collected by the wire conveying component on the other side, the wire conveying component (2) is installed on a sliding block, and the sliding block is installed on a guide rail and driven by; a Y-direction herringbone upright post (3) is arranged in the center of the base (1), and the Y-direction herringbone upright post (3) is driven by a Y-direction driving mechanism (4) to perform front and back feeding movement; a Z-direction sliding plate is arranged on a Y-direction herringbone upright post (3), the Z-direction sliding plate is driven by a Z-direction driving mechanism (5) arranged on the upper part of the Y-direction herringbone upright post (3) to move up and down, a C-axis driving mechanism (6) is arranged on the Z-direction sliding plate, a workpiece clamping mechanism (7) is arranged on the C-axis driving mechanism (6), and the C-axis driving mechanism (6) drives a processed workpiece on the workpiece clamping mechanism (7) to rotate or swing.

2. A large-size silicon carbide wafer diamond wire cutting machine tool according to claim 1, characterized in that the wire-carrying part (2) consists of a wire-carrying spindle motor and a wire barrel, which are all mounted on a slide block for synchronous movement, the slide block is mounted on a guide rail and driven by a lead screw, and the lead screw is driven by a servo motor.

3. The large-size silicon carbide wafer diamond wire cutting machine tool as claimed in claim 2, wherein the diamond wire on the wire cylinder is wound in single-guide or multi-layer mode, and the length is 1000-10000 m.

4. The large-size silicon carbide wafer diamond wire cutting machine tool according to claim 1, wherein the wire guiding assembly comprises a transition guide wheel (8), a tension wheel (9), a tension detection wheel (10) and a main guide wheel (11) which are arranged on a portal-shaped upright column.