WO2022057296A1

WO2022057296A1 - Integrated silicon rod cutting-grinding machine

Info

Publication number: WO2022057296A1
Application number: PCT/CN2021/094827
Authority: WO
Inventors: 卢建伟; 苏静洪; 李鑫; 钱春军; 曹奇峰
Original assignee: 天通日进精密技术有限公司
Priority date: 2020-09-16
Filing date: 2021-05-20
Publication date: 2022-03-24

Abstract

An integrated silicon rod cutting-grinding machine. A silicon rod cutting device (4) and a silicon rod grinding device (5) are respectively arranged in a first processing area and a second processing area on a silicon rod processing platform. A first transfer device (2) and a second transfer device (3) pass simultaneously through the first processing area and the second processing area. The first transfer device and the second transfer device are respectively equipped with a silicon rod clamp and a driving mechanism. The first transfer device, the second transfer device, the silicon rod cutting device and the silicon rod grinding device are controlled in a coordinated fashion such that the silicon rod cutting device in the first processing area and the silicon rod grinding device in the second processing area are both in a working state at the same moment. Silicon rods are squared and ground in an integrated operation of multiple processes, and the productivity and the product processing quality are improved.

Description

Silicon rod cutting and grinding machine

technical field

The present application relates to the technical field of silicon workpiece processing, in particular to an integrated machine for cutting and grinding silicon rods.

Background technique

At present, with the attention and opening of the society to the utilization of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, common crystalline silicon solar cells are fabricated on high-quality silicon wafers, which are cut and subsequently processed by a multi-wire saw from a pulled or cast silicon ingot.

The existing manufacturing process of silicon wafers, taking monocrystalline silicon products as an example, generally, the rough operation process can include: first, use a silicon rod cutting machine to cut off the original long silicon rods to form multi-section short silicon rods; After that, the cut-off short silicon rods are squared by a silicon rod squarer to form rectangular cut silicon rods; The surface shaping of the rod meets the corresponding flatness and dimensional tolerance requirements; the silicon rod is then sliced with a slicing machine to obtain a single crystal silicon wafer.

However, in general, in the related art, the operations required for each process operation (such as square cutting, grinding, chamfering, etc.) are arranged independently, and the corresponding processing devices are scattered in different production units or production workshops Or in different production areas of the production workshop, the conversion of workpieces that perform different processes needs to be transported and deployed, and pre-processing may be required before each process is performed, so the process is complicated, low in efficiency, and easy to affect the silicon rod. The quality of the processing operation requires more manpower or transfer equipment, and there are great potential safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during the workpiece transfer process, and is prone to non-production factors. It reduces the qualified rate of products and the unreasonable loss caused by the existing processing methods, which is a major improvement problem faced by each company.

SUMMARY OF THE INVENTION

In view of the above-mentioned deficiencies of the related art, the purpose of the present application is to provide an integrated machine for cutting and grinding a silicon rod and a method for cutting and grinding a silicon rod, which are used to solve the inefficiency of each process operation and the processing of silicon rods that exist in the prior art. Poor work performance, etc.

In order to achieve the above purpose and other related purposes, the present application discloses a silicon rod cutting and grinding integrated machine, comprising:

The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;

The first transfer device, located in the first transfer channel, includes a first silicon rod holder and a first transfer drive mechanism, and the first transfer drive mechanism is used to drive the first silicon rod holder and the silicon rod edge it clamps. moving in the first direction and transferring between the first processing location and the second processing location;

A second transfer device, located in the second transfer channel, includes a second silicon rod holder and a second transfer drive mechanism, the second transfer drive mechanism is used to drive the second silicon rod holder and the silicon rod edge it holds. moving in the first direction and transferring between the first processing location and the second processing location;

The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The silicon rod to be cut held by the second transfer device is cut; and

The silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cut silicon rod held by the second transfer device is subjected to a grinding operation.

In some embodiments of the present application, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device is arranged through a first mounting frame Above the silicon rod processing platform and the second transfer device is arranged above the silicon rod processing platform through a second mounting frame.

In some embodiments of the present application, the first silicon rod holder includes: a first clamping arm mounting seat; at least one pair of first clamping arms, opposite to the first clamping arm mounting seat along a first direction , for clamping the two end faces of the silicon rod; wherein, any one of the at least one pair of first clamping arms is provided with a clamping part; the first clamping arm driving mechanism is used to drive at least one At least one of the pair of first clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of the first clamp arms.

In some embodiments of the present application, the first transfer driving mechanism includes: a first transfer guide rail, arranged along a first direction, for setting the first clamp arm mounting seat; a first transfer driving unit for The first clamp arm mounting seat and at least a pair of first clamp arms are driven to move along the first transfer guide rail.

In some embodiments of the present application, the first transfer driving unit includes: a moving rack, arranged along a first direction; a driving gear, which is disposed on the first clamp arm mounting seat and meshes with the moving rack a drive source for driving the drive gear to move the associated first clamp arm mount and at least a pair of the first clamp arms along the first transfer guide rail.

In some embodiments of the present application, the first transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the first clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of first clamp arms along the first transfer rail.

In some embodiments of the present application, the at least one pair of the first clamping arms is a rotating structure; the first silicon rod clamp further includes a first clamping arm rotating mechanism, and the first clamping arm rotating mechanism is located at At least one of the at least one pair of first clamping arms is used to drive the clamping part of the at least one first clamping arm to rotate.

In some embodiments of the present application, the second silicon rod holder includes: a second clamping arm mounting seat; at least a pair of second clamping arms, opposite to the second clamping arm mounting seat along a first direction , used for clamping the two end faces of the silicon rod; wherein, any second clamping arm in the at least a pair of second clamping arms is provided with a clamping part; the second clamping arm driving mechanism is used to drive at least one At least one of the pair of second clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of second clamp arms.

In some embodiments of the present application, the second transfer driving mechanism includes: a second transfer guide rail, arranged along a first direction, for setting the second clamp arm mounting seat; a second transfer driving unit, for The second clamp arm mounting base and at least a pair of second clamp arms are driven to move along the second transfer guide rail.

In some embodiments of the present application, the second transfer driving unit includes: a moving rack, disposed along a first direction; a driving gear, disposed on the second clamp arm mounting seat and engaged with the moving rack a drive source for driving the drive gear to move the associated second clamp arm mount and at least a pair of the second clamp arms along the second transfer guide rail.

In some embodiments of the present application, the second transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the second clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of second clamp arms along the second transfer rail.

In some embodiments of the present application, the at least one pair of second clamping arms is a rotating structure; the second silicon rod clamp further includes a second clamping arm rotating mechanism, and the second clamping arm rotating mechanism is located in At least one of the at least one pair of second clamping arms is used to drive the clamping part of the at least one second clamping arm to rotate.

In some embodiments of the present application, the silicon rod cutting device includes: a cutting frame; at least one wire cutting unit is provided on the cutting frame; the wire cutting unit includes: at least two cutting wheels, a transition wheel, and a cutting wire, which is wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; a cutting conversion mechanism for driving the cutting frame and the at least one wire cutting unit on the first Switch between the transfer channel and the second transfer channel.

In some embodiments of the present application, the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel a cutting wheel to form a cutting wire saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is used for cutting The state of the wire makes the cutting lines of the first cutting wheel and the first transition wheel lie in the plane of the first cutting wire groove for winding the cutting wire in the first cutting wheel; the second transition wheel is adjacent to the second cutting wheel wheel, in the state of pulling the cutting line, the cutting line of the second cutting wheel and the second transition wheel is located in the plane of the second cutting wire groove for winding the cutting line in the second cutting wheel; at least one third transition wheel, set Between the first transition wheel and the second transition wheel, it is used for pulling the cutting line between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the wire cutting unit , the cutting accommodating space can accommodate the silicon rod, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space.

In some embodiments of the present application, the first transition wheel, the second transition wheel, and the at least one third transition wheel are used to draw the cutting wire away from the cutting accommodation space.

In certain embodiments of the present application, the cutting wire is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form an end-to-end connection Closed loop cutting line.

In some embodiments of the present application, the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, and the second transition wheel in sequence , a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end closed-loop cutting line.

In some embodiments of the present application, the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod to be cut.

In some embodiments of the present application, the cutting wire driving device is an electric motor having a power take-off shaft, and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel.

In some embodiments of the present application, the silicon rod cutting device further comprises: at least one distance adjustment mechanism, which is arranged in the at least one wire cutting unit and is used to drive at least two cutting wheels in the wire cutting unit to be opposite to each other. The cutting frame moves in a direction perpendicular to the surface of the cutting wheel.

In some embodiments of the present application, the silicon rod cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: a screw rod, which is disposed along the orthogonal direction of the cutting wheel surface and is threadedly connected to the single-wire cutting unit ; Drive source for driving the screw to rotate.

In some embodiments of the present application, the silicon rod cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: a telescopic element, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit; The driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.

In some embodiments of the present application, the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit It is driven to move in the orthogonal direction of the wheel surface of the cutting wheel by the distance adjustment mechanism.

In some embodiments of the present application, the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; a driving source, Used to drive the screw to rotate.

In some embodiments of the present application, the distance adjustment mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source, which uses The telescopic element is driven to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

In some embodiments of the present application, the distance adjustment mechanism includes: a bidirectional screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected with the first wire cutting unit and the second wire cutting unit; a driving source is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.

In some embodiments of the present application, the cutting conversion mechanism includes: a cutting conversion guide rail, arranged along a second direction, for setting the cutting frame; the second direction is perpendicular to the first direction; the cutting conversion The driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.

In some embodiments of the present application, the cutting conversion driving unit includes: a moving rack, arranged along the second direction; a driving gear, which is arranged on the cutting frame and meshes with the moving rack; for driving the drive gear to move the associated cutting frame and its at least one line cutting unit along the cutting conversion guide rail.

In some embodiments of the present application, the cutting conversion driving unit includes: a moving screw rod, which is arranged in the second direction and is associated with the cutting frame; a driving source for driving the moving screw rod to rotate so as to make the The associated cutting carriage and its at least one line of cutting units move along the cutting transition rails.

In certain embodiments of the present application, the integrated silicon rod cutting and grinding machine further includes a side skin discharge device, and the edge skin discharge device includes a side skin support mechanism for abutting against the outside of the silicon rod and supporting Cut the formed hem.

In some embodiments of the present application, the side panel supporting mechanism includes: a supporting part; and a driving unit connected to the supporting part to control the supporting part to move away from or abut against the side panel.

In some embodiments of the present application, the bearing portion includes: at least two bearing blocks, which are arranged at intervals along the first direction and have bearing surfaces for contacting and bearing the edge skin.

In some embodiments of the present application, the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the cutting frame The opposite sides in the first direction correspond to the opposite ends of the at least two support rods, and are used for connecting the at least two support rods and the drive unit.

In some embodiments of the present application, the supporting portion includes at least two supporting wheel sets spaced along the first direction, wherein the supporting wheel set includes: at least two supporting wheels, The at least two supporting wheels are arranged at intervals for contacting and supporting the edge skin; the supporting base is used for disposing the at least two supporting wheels and connecting with the driving unit.

In some embodiments of the present application, the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the distance of the bearing part or against the edge skin.

In some embodiments of the present application, the driving unit includes: a driving motor; a screw assembly, connected to the bearing part, and driven to move by the driving motor to control the bearing part to move away from or against the side skin.

In some embodiments of the present application, the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin The edge skin is separated from the edge skin supporting mechanism.

In some embodiments of the present application, the side skin dislocation mechanism includes: a push top; an air cylinder or a hydraulic pump for driving the push top to push a telescopic rod of the side skin along a first direction along a first direction set up.

In some embodiments of the present application, the edge skin unloading device further includes a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area.

In some embodiments of the present application, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move in a first direction to convey the edge skin Skin.

In some embodiments of the present application, the silicon rod grinding device includes: a grinding tool mounting seat; at least one pair of grinding tools, which are arranged oppositely on the grinding tool mounting seat; and a grinding tool advancing and retreating mechanism for driving the At least one abrasive tool in the at least one pair of abrasive tools moves along a second direction, wherein the second direction is perpendicular to the first direction; an abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move in the first direction Switch between a transfer channel and a second transfer channel.

In certain embodiments of the present application, any one of the at least one pair of abrasive tools includes a coarse grinding wheel and a fine grinding wheel that are nested in each other.

In some embodiments of the present application, the rough grinding wheel is nested inside the fine grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism; or, The fine grinding wheel is nested inside the rough grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.

In some embodiments of the present application, the abrasive tool conversion mechanism includes: an abrasive tool conversion guide rail, arranged along the second direction, for setting the abrasive tool mounting seat; an abrasive tool conversion drive unit for driving the abrasive tool The abrasive tool mount and its at least one pair of abrasive tools move along the abrasive tool transfer rail.

In some embodiments of the present application, the grinding tool conversion drive unit includes: a moving rack, arranged along the second direction; a driving gear, disposed on the grinding tool mounting seat and meshing with the moving rack; driving A source for driving the drive gear to move the associated abrasive tool mount and its at least one pair of abrasive tools along the abrasive tool transfer rail.

In some embodiments of the present application, the grinding tool conversion driving unit includes: a moving screw, which is arranged in the second direction and is associated with the grinding tool mounting seat; a driving source for driving the moving screw to rotate to move the associated abrasive tool mounting seat and at least one pair of abrasive tools along the abrasive tool conversion guide rail.

In some embodiments of the present application, the silicon rod grinding device further includes: at least one pair of chamfering grinding tools, which are arranged on the grinding tool mounting seat opposite to each other.

In some embodiments of the present application, any one of the first silicon rod holder and the second silicon rod holder further includes: a grinding and repairing device for grinding at least one of the corresponding silicon rod grinding devices to abrasives.

In some embodiments of the present application, the integrated silicon rod cutting and grinding machine further comprises: a silicon rod transferring device, which is arranged at the loading area of the silicon rod processing platform, and is used for transferring the silicon rod to be processed to the The first processing location of the silicon rod processing platform.

In some embodiments of the present application, the silicon rod transfer device includes: a silicon rod bearing structure for carrying the silicon rod to be processed; a centering adjustment mechanism for adjusting the position of the silicon rod to be processed to The axis line is corresponding to the predetermined center line; the feeding driving mechanism is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.

In some embodiments of the present application, the centering adjustment mechanism includes a vertical lifting mechanism, which is used to drive the silicon rod supporting structure and the supported silicon rods to perform vertical lifting and lowering motions, so as to make the The axis line of the silicon rod to be processed is vertically aligned with the predetermined center line.

In some embodiments of the present application, the vertical lifting mechanism includes: a vertical lifting guide rail, which is provided on the bearing base; a sliding block, which is arranged on the bearing member; and a vertical lifting driving unit.

In some embodiments of the present application, the vertical lift mechanism includes: a vertical lift guide rod for setting the silicon rod supporting structure; a vertical lift driving unit for driving the silicon rod supporting structure along the The vertical lift guide rod moves up and down.

In some embodiments of the present application, the vertical lift driving unit comprises: a driving motor and a screw assembly vertically arranged and driven by the driving motor, or, a driving motor and a vertically arranged and driven screw assembly Motor driven rack and pinion drive assembly.

In some embodiments of the present application, the silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that it is located at the position of the silicon rod supporting structure. Centered area.

In some embodiments of the present application, the centering adjustment mechanism includes: a bracket, arranged on the machine base or the silicon rod bearing structure; an adjustment guide rail, arranged on the bracket along a first direction; at least two two ejectors, respectively disposed on opposite sides of the bracket; an adjustment drive unit for driving the at least two ejectors to move toward each other along the adjustment guide rails to push the silicon rod to be placed on the silicon rod The central area of the load-bearing structure.

In some embodiments of the present application, the adjustment driving unit comprises: a driving motor and a screw assembly arranged in a first direction and driven by the driving motor, or a driving motor and a driving motor and a driving motor arranged in the first direction and driven by the The rack and pinion drive assembly driven by the drive motor.

In some embodiments of the present application, the silicon rod transfer device further includes a silicon rod clamping mechanism provided on the silicon rod supporting structure.

In some embodiments of the present application, the silicon rod clamping mechanism includes: a clamp mounting member, disposed on the silicon rod supporting structure along a first direction; at least two silicon rod clamping members, along the The distance setting of the fixture mounting pieces is described above.

In some embodiments of the present application, the silicon rod clamping member includes: a clamping arm mounting seat, which is arranged on the clamping arm mounting member; two clamping arms, which are movably arranged on the clamping arm mounting seat; The arm driving mechanism is used to drive the two clamping arms to open and close.

In some embodiments of the present application, the clamping arm driving mechanism includes: an opening and closing gear, which is provided on the clamping arm mounting seat; two racks, each of which is associated with a clamping arm and is The opening and closing gears are engaged; the driving source is associated with the opening and closing gears, and is used for driving the opening and closing gears to rotate.

In some embodiments of the present application, in the silicon rod clamping mechanism, at least one silicon rod clamping member of the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving it along the The clamp mounts are moved to adjust the spacing of the at least two silicon rod clamps.

In some embodiments of the present application, the distance adjustment driving mechanism is a screw adjustment mechanism, a chain conveying mechanism, a double-speed chain mechanism, or a transmission belt mechanism.

In some embodiments of the present application, the feeding drive mechanism includes: a feeding guide rod or a feeding guide rail, arranged along the second direction, for setting the silicon rod supporting structure; a feeding driving unit for The silicon rod carrying structure is driven to move along the feed guide rod or feed rail.

In some embodiments of the present application, the silicon rod transfer device further includes a crystal wire detection unit.

In some embodiments of the present application, the integrated silicon rod cutting and grinding machine further comprises: a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rods from the Unloading of the ingot processing platform.

The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, and are provided with At the same time, the first transfer device and the second transfer device running through the first processing area and the second processing area are respectively equipped with a silicon rod clamp and a driving mechanism for the first and second transfer devices. The silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the integration of the multi-process of silicon rod squaring and grinding operation, improve production efficiency and the quality of product processing operations.

Description of drawings

The invention to which this application relates is set forth with particularity characteristic of the appended claims. The features and advantages of the inventions involved in this application can be better understood by reference to the exemplary embodiments described in detail hereinafter and the accompanying drawings. A brief description of the drawings is as follows:

FIG. 1 is a schematic structural diagram of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a first viewing angle.

FIG. 2 is a schematic structural diagram of the integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a second viewing angle.

FIG. 3 shows a top view of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application.

FIG. 4 is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application.

FIG. 5 is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.

FIG. 6 is an enlarged schematic view of B in FIG. 5 .

FIG. 7 is a schematic diagram showing the structure of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.

FIG. 8 is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.

FIG. 9 is an enlarged schematic view of A in FIG. 1 .

detailed description

The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical, structural, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered limiting, and the scope of embodiments of the present application is limited only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. Spatially related terms, such as "upper," "lower," "left," "right," "below," "below," "lower," "above," "upper," etc., may be used in the text for ease of description The relationship of one element or feature shown in the figures to another element or feature.

Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first transfer device could be referred to as a second transfer device, and similarly, a second transfer device could be referred to as a first transfer device without departing from the scope of the various described embodiments. Both the first transfer device and the second transfer device are describing a transfer device, but unless the context clearly indicates otherwise, they are not the same transfer device. Similar situations also include the first transfer guide rail and the second transfer guide rail, the first processing area and the second processing area, the first transfer driving mechanism and the second transfer driving mechanism, the first silicon rod holder and the second silicon rod holder, and the like.

Also, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context dictates otherwise. It should be further understood that the terms "comprising", "comprising" indicate the presence of stated features, steps, operations, elements, components, items, kinds, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, assemblies, items, categories, and/or groups. The terms "or" and "and/or" as used herein are to be construed to be inclusive or to mean any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

In the related processing technology for silicon rods, several processes such as square root cutting, surface grinding, and chamfering are involved.

Generally, most of the existing silicon rods have a cylindrical structure, and the silicon rods are cut by the silicon rod cutting equipment, so that the cross-section of the silicon rods is rectangular-like (including square-like) after the cutting process, and the processed silicon rods are The rod is in the shape of a cuboid as a whole.

Taking the single crystal silicon rod as an example, the formation process of the single crystal silicon rod may include: firstly use a silicon rod cutting machine to cut the original long silicon rod to form a multi-section short silicon rod; after the cutting is completed, use the silicon rod to square The machine performs a square root operation on the truncated short silicon rod to form a single crystal silicon rod with a rectangular cross-section. Among them, the specific implementation method of using a silicon rod cutting machine to cut off the original long silicon rod to form a multi-segment short silicon rod can refer to patent publications such as CN105856445A, CN105946127A, and CN105196433A. For specific embodiments of forming a single-crystal silicon rod with a rectangular-like cross section after squaring the short silicon rod, reference may be made to patent publications such as CN105818285A. However, the formation process of the single crystal silicon rod is not limited to the above-mentioned technology. In an optional example, the formation process of the single crystal silicon rod may also include: firstly, using a full silicon rod cutting machine to perform a squaring operation on the original long silicon rod to A long single crystal silicon rod with a rectangular-like cross section is formed; after the squaring is completed, a silicon rod cutting machine is used to cut the long single crystal silicon rod after the square cutting to form a short crystal silicon rod. Wherein, for the specific implementation of the above-mentioned use of an all-silicon ingot squarer to perform the squaring operation on an original long silicon rod to form a rectangular-like long single crystal silicon rod, reference may be made to patent publications such as CN106003443A.

After the cylindrical monocrystalline silicon rod is squared and cut to form a rectangular-like silicon rod by using a square-cutting device, grinding equipment can be used to grind and chamfer the rectangular-like silicon rod.

The inventors of the present application have found that in the related processing technology for silicon rods, the processing devices such as squaring and grinding (such as surface grinding, chamfering, etc.) are dispersed and arranged independently of each other. The conversion of silicon rods requires transportation and preparation and preprocessing before processing, which has problems such as complicated procedures and low efficiency.

In view of this, the present application proposes an integrated machine for cutting and grinding silicon rods and a method for cutting and grinding silicon rods. Through equipment modification, a plurality of processing devices are assembled in one device, which can automatically realize the square cutting and grinding of silicon rods. The seamless connection between various processing operations saves labor costs, improves production efficiency, and improves the quality of silicon ingot processing operations.

In the embodiments provided in this application, in order to clarify the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. The length extension direction of the silicon rod cutting and grinding machine, that is, the length direction when the silicon rod is placed on it, is defined as the first direction (ie, the front-rear direction or the transfer direction), and the width extension direction of the silicon rod cutting and grinding machine is also called. The left-right direction is defined as the second direction (ie, the left-right direction or the feeding direction), and the vertical direction, that is, the vertical direction, the vertical direction, the vertical direction, or the lifting direction is defined as the third direction.

In one aspect, the present application discloses an integrated silicon rod cutting and grinding machine. The silicon rod cutting and grinding integrated machine of the present application is used to perform squaring and grinding operations on silicon rods, that is, the cross section is circular (or approximately circular). ) silicon rods are cut to form quasi-rectangular (including quasi-square) silicon rods, and grinding operations are performed on silicon rods with quasi-rectangular (including quasi-square) cross-sections, wherein most of the silicon rods can be, for example, single crystals For the silicon rod or polycrystalline silicon rod, in the embodiments of the present application, a single crystal silicon rod is used as an example for description.

Please refer to FIG. 1 to FIG. 3 , wherein, FIG. 1 shows a schematic structural diagram of the integrated silicon rod cutting and grinding machine of the present application from a first perspective in an embodiment, and FIG. 2 shows the integrated silicon rod cutting and grinding machine of the present application in A schematic view of the structure from a second viewing angle in an embodiment, FIG. 3 shows a top view of the integrated silicon rod cutting and grinding machine of the present application in an embodiment. As shown in the figure, the integrated silicon rod cutting and grinding machine includes a machine base 1 , a first transfer device 2 , a second transfer device 3 , a silicon rod cutting device 4 , and a silicon rod grinding device 5 .

The machine base has a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the machine base. As shown in the figure, in the first implementation of this embodiment, the machine base 1 is of a rectangular structure, the processing platform is designed to be a rectangle conforming to the shape of the machine base 1, and the first processing area and the second processing area respectively correspond to the square root processing area. With the grinding processing area, as shown in the figure, the first processing area and the second processing area are arranged on the front and rear sides of the silicon rod processing platform, and can be processed independently on the first processing area and the second processing area. Loaded monocrystalline silicon rods.

The first transfer device is arranged in the first transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the first transfer channel. The second transfer device is arranged in the second transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the second transfer channel.

The first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the mounting frame is arranged on the machine base to form a vertical frame structure, and the upper surface of the frame is higher than the The silicon rod processing platform carries the first transfer device and the second transfer device. In some embodiments of the present application, as shown in FIG. 1 , a mounting frame is provided above the silicon rod processing platform, and the first transfer device 2 and the second transfer device 3 are arranged in parallel on the mounting frame. the left and right sides of the frame. The support structure of the installation frame is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, and the support structure of the installation frame is on the outer edge of the rectangle. The frame is approximately the same in shape and size as the base 1 . In some embodiments of the present application, a first mounting frame and a second mounting frame are provided above the silicon rod processing platform, and the first mounting frame and the second mounting frame are provided on the silicon rod Opposite sides of the processing platform along the second direction, wherein the first transfer device is arranged above the silicon rod processing platform through a first installation frame, and the second transfer device is arranged through the second installation frame. above the silicon rod processing platform. The shape and size of the first installation frame and the second installation frame are the same or approximately the same, for example, the shape of the first installation frame and the second installation frame is a rectangle.

Regarding the first transfer device, in this application, the first transfer device provided in the first transfer channel includes a first silicon rod holder and a first transfer drive mechanism. Wherein, the first silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the first silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped. The first transfer driving mechanism is used for driving the first silicon rod holder and the silicon rod held by it to move along a first direction and transfer between the first processing area and the second processing area. Wherein, the first rotation driving mechanism further includes a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction for setting the first silicon rod holder, the first transfer guide The driving unit is used for driving the first silicon rod holder and the silicon rod held by it to move along the first transfer guide rail.

The first silicon rod holder includes a first clamping arm mounting seat, and at least a pair of first clamping arms is arranged on the first clamping arm mounting seat, and the at least one pair of first clamping arms face each other along a first direction It is arranged on the first clamping arm mounting seat and is used for clamping the two end faces of the silicon rod. At least one first clamping arm in the at least one pair of first clamping arms can be driven along the first clamping arm drive mechanism. The first direction moves to adjust the clamping distance between the at least one pair of the first clamping arms.

Please refer to FIG. 4 , which is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application. In some embodiments of the present application, as shown in FIG. 4 , the first silicon rod holder 21 as a whole presents a first clamping arm mounting seat 211 disposed above, and the part outside the first clamping arm mounting seat 211 Including the first clamp arm 213 in a suspended state, the first clamp arm mounting seat 211 is mounted on the mounting frame, and the first clamp arm 213 is located under the hollow part of the mounting frame from the first clamp arm mounting seat 211 The cantilever is extended to realize that the silicon rod (eg, the silicon rod to be cut 101 or the cut silicon rod) held by the first clamping arm 213 is on the processing surface of the silicon rod processing platform.

The first clamp arm mounting seat is arranged on the first transfer guide rail. In an implementation of this embodiment, a guide groove structure matching the first transfer guide rail is provided at the bottom of the first clamp arm mounting seat. , the first transfer guide rail is arranged along the first direction, and the length of the first transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the first silicon rod holder between the two working areas. In an implementation of this embodiment, the first transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

The first clamp arm mounting seat is also provided with a first guide structure along the first direction, and the at least one pair of first clamp arms are arranged on the first clamp arm mounting seat through the first guide structure and can be generated in the first direction movement. In practical applications, the first guide structure may be, for example, a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod.

The at least one pair of first clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.

For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, and its length direction is placed along the first direction, and the end faces are the sections at both ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. .

The first clamping arm hangs down from the first clamping arm mounting seat, and a clamping portion is included under the first clamping arm for directly contacting and clamping the silicon rod. As shown in FIG. 4 , one end of the first clamping arm 213 is connected to the first clamping arm mounting seat 211 , and the other end of the first clamping arm 213 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 215. The first clamp arm mounting seat 211 is movably arranged on the first transfer guide rail and moves along the first transfer guide rail driven by the first transfer drive unit, thereby driving the first clamp arm 213 along the first transfer guide rail. A transfer rail moves.

The first silicon rod holder further includes a first clamping arm driving mechanism, and the first clamping arm driving mechanism can drive at least one first clamping arm of the at least one pair of first clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged first clamping arms, so that the clamping parts of the at least one pair of first clamping arms can approach each other or move closer to each other under the action of the first clamping arm driving mechanism away to perform a gripping or releasing action on the silicon rod. For example, the clamping parts of the two first clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the first clamping arm to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the first clamping arm driving mechanism to release the processed silicon rods.

In some embodiments of the present application, the first clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other. In an implementation of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end is connected to a first clamp arm, so that the at least one pair of the first clamp arms is in the first clamp arm. In one direction, the guide rails of the first clamp arm mounting seat are away from each other or approach each other.

In some embodiments of the present application, the first clamping arm driving mechanism includes a screw rod and a driving source, wherein the first screw rod is arranged along a first direction and is connected to any one of the pair of first clamping arms. A first clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated first clamp arm moves in a first direction.

The screw rod of the first clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the first clamping arms of the pair of first clamping arms, and the screw rod can rotate based on the drive source transmission by means of the connection between the two ends of the screw rod The rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source. The connected first clamp arm moves in the first direction, and the rotation direction of the lead screw is driven to change, so that the associated first clamp arm can move forward or backward in the first direction.

In some embodiments of the present application, the first clamping arm driving mechanism includes: a bidirectional screw rod, which is arranged in a first direction and is threadedly connected to the at least one pair of the first clamping arms at both ends; a driving source, which uses The at least one pair of the first clamping arms is driven to rotate toward or away from each other along the first direction.

In an implementation manner, the bidirectional screw rod of the first clamping arm driving mechanism is threadedly connected with the pair of first clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends. , the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft. The motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source. Driven by the driving source, the pair of first clamping arms can move toward or away from each other in a first direction.

In one embodiment, the first clamp arm mounting seat may be a plurality of mounting seats connected by the first clamp arm driving mechanism, and any one of the pair of first clamp arms corresponds to a mounting seat, The driving source is arranged between a pair of first clamping arms, where any of the first clamping arms can move along the guide structure; when the first silicon rod holder needs to move along the guide structure as a whole, for example, it can be The driving source of the first clamping arm driving mechanism controls the pair of first clamping arms to be relatively stationary. At this time, the connection of the first clamping arm driving mechanism can make different mounting seats relatively stationary. The power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the first silicon rod clamp.

In yet another implementation manner, the first clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a first clamping arm, so The drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation. The first clamping arms are moved toward each other to perform a clamping action, and the pair of first clamping arms are driven to move backwards to perform a releasing action during reverse rotation.

In an embodiment of the present application, the first clamping arm has a rotary structure. For example, the first silicon rod holder further includes a first clamping arm rotating mechanism for driving the first clamping arm to rotate. In an implementation of this embodiment, any one clamping part of the at least one pair of first clamping arms or two clamping parts of a pair of first clamping arms is provided with a rotatable structure, and a rotatable structure is provided in the first clamping part. Driven by the rotation mechanism of the clamping arm, the clamping part of the first clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation. For example, in some examples, the rotation mechanism of the first clamp arm may be, for example, a rotating motor, and the clamping portions of the two first clamp arms of the pair of first clamp arms are both provided with rotatable structures, and the two first clamp arms are provided with rotatable structures. The clamping part of a clamping arm or the clamping part of one of the first clamping arms is connected to the output shaft of the rotating motor. For example, the clamping parts of the two first clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected The clamping part of the corresponding first clamping arm is driven to rotate, or, the clamping part of one of the first clamping arms is connected to a rotating motor, and the clamping part of the corresponding first clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other first clamping arm is also driven to rotate according to the trend.

In some implementations of this embodiment, the clamping portions of the at least one pair of the first clamping arms have a contact surface for clamping the silicon rod. When the clamping ends of the silicon rods are two end faces at both ends of the elongated structure, the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line. Contact surfaces. The contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.

In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction. The axis line of the rotating shaft is connected to the first clamping arm rotating mechanism.

In an embodiment of the present application, the clamping portion of the first clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after it is in close contact with the end face of the silicon rod. The end face of the silicon rod is relatively stationary. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.). During switching of the silicon rod, such as switching of cutting positions or switching of grinding surfaces, the clamping portion is driven by the rotation mechanism of the first clamping arm to rotate along the center of the circular frustum.

In one embodiment, the clamping portion of the first clamping arm includes a rotatable truncated cone and a series of protruding contacts disposed on the truncated cone, each of the contacts having a contact plane. The circular platform is driven by the first clamping arm rotating mechanism to rotate. In an implementation of this embodiment, the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted. During the process, for the silicon rod with low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state. The protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.

In an embodiment of the present application, the clamping portion of the first silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state. Usually, in the process of clamping the silicon rod, a pair of first clamping arms of the first silicon rod clamp are driven by the first clamping arm driving mechanism to approach each other along the first direction, and the clamping portion reaches the edge of the clamping portion. The contact surface is in contact with the end surface of the silicon rod to be clamped. When the clamping part is provided with a plurality of contacts and detects that the pressure value of some contacts in contact with the end surface of the contacted silicon rod is less than a set value or When setting the area, the clamping degree can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of first clamping arms of the first silicon rod clamp The clamping parts are all set as a contact surface. In the process of clamping the silicon rod, the first clamping arm driving mechanism drives the end faces of the pair of first clamping arms toward the two ends of the silicon rod to approach each other to achieve. After the clamping part is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the first clamping arm driving mechanism controls and stops the relative movement of the pair of first clamping arms. .

The first clamp arm rotation mechanism can be arranged on one of the pair of first clamp arms (the other first clamp arm only has a rotation function) to drive the clamp of the pair of first clamp arms. The holding part rotates with the clamped silicon rod; or the first clamp arm rotation mechanism is arranged on each first clamp arm of a pair of first clamp arms, and controls the movement of the pair of first clamp arms in coordination with the movement. The two clamping parts rotate in the same angle and direction. In some implementations, the first clamp arm rotation mechanism may be configured as a drive motor.

When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the first clamping arm rotation mechanism. Usually, when cutting a single crystal silicon rod, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.

When the silicon rod cutting and grinding integrated machine is used to grind different sides of the silicon rod or to chamfer the edges, the first clamping arm rotating mechanism drives the clamping part to rotate to achieve this. Usually, when grinding different sides of a single crystal silicon rod that has been squared, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved. When chamfering different edges , which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a flat surface, when chamfering the silicon rod, the first clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles. Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. For the method of realizing chamfering, reference may be made to patent publications such as CN108942570A. By driving the silicon rod to rotate by a certain angle, the grinding tool cooperates with the lateral feed in the second direction to realize the grinding of the edges and corners.

In an embodiment of the present application, the first silicon rod holder is a lift-type silicon rod holder. In an implementation manner, the first silicon rod holder includes a lifting guide rail and a driving device in the lifting direction, and the first clamping arm of the first silicon rod holder and the first clamping arm mounting seat carry a first clamping arm. The clamp arm guide can move along the lift guide in the third direction (ie, the direction of the heavy vertical line), which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line , to select the cut surface of the silicon rod and the cutting area of the silicon rod cutting device for cutting, or the ground surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting guide rail is arranged on the upright surface of the first clamping arm mounting seat, and the first clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail A driving mechanism for the lifting movement of the first clamping arm; the driving mechanism includes a traveling screw and a traveling motor, and the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor. The first clamp arm moves in a third direction. In another implementation manner, each first clamping arm cantilever of the pair of first clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.

Regarding the first transfer drive mechanism, the first transfer drive mechanism includes: a first transfer guide rail and a first transfer drive unit, wherein the first transfer guide rail is arranged along a first direction for setting the first transfer guide A clamp arm mounting seat, the first transfer driving unit is used to drive the first clamp arm mounting seat and at least a pair of first clamp arms to move along the first transfer guide rail.

The first transfer driving unit includes a first moving rack, a first driving gear and a first driving source. The first moving rack is arranged along a first direction and is parallel to the first transfer guide rail. In one embodiment, the first moving rack is fixed on the upper surface, side surface or lower surface of the mounting frame, and is set to approximately the same first direction dimension as the first transfer guide rail, which is the same as the first transfer guide rail. The guide rails are arranged in parallel and adjacent.

The first driving gear is arranged on the first silicon rod holder and meshes with the first moving rack, so as to drive the first silicon rod holder to move along the first transfer guide rail. The first drive source is used to drive the first drive gear. In an implementation manner of the present application, the first drive gear is disposed on the first clamping arm mounting seat of the first silicon rod holder, the first drive gear is driven to rotate by a first drive source, and the first drive gear is rotated by a first drive source. The teeth of a driving gear mesh with the first moving rack and travel in accordance with the first moving rack, so that the first silicon rod clamp connected to the first driving gear moves correspondingly on the first transfer rail. .

In an embodiment of the present application, the first transfer driving unit may be disposed on the first silicon rod holder, and includes a first moving screw and a first driving source, wherein the first moving screw is along the The first direction is arranged and associated with the first clamp arm mounting seat, and the first driving source is used to drive the first moving screw to rotate so as to make the associated first clamp arm mounting seat and at least a pair of first A clamp arm moves along the first transfer rail.

In an implementation manner of this embodiment, the first driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected to the first driving gear to control the motion state of the first driving gear, and then the The first driving source controls the movement of the first silicon rod holder and the silicon rod held by it in a first direction.

Regarding the second transfer device, in the present application, the second transfer device provided in the second transfer channel includes a second silicon rod holder and a second transfer drive mechanism. Wherein, the second silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the second silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped. The second transfer driving mechanism is used for driving the second silicon rod holder and the silicon rod held by it to move along the first direction and to transfer between the second processing area and the second processing area. Wherein, the second rotational drive mechanism further includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along the first direction for setting the second silicon rod holder, the second transfer guide The driving unit is used for driving the second silicon rod holder and the silicon rod held by it to move along the second transfer guide rail.

The second silicon rod holder includes a second clamping arm mounting seat, and at least a pair of second clamping arms is arranged on the second clamping arm mounting seat, and the at least one pair of second clamping arms face each other along the first direction It is arranged on the second clamping arm mounting seat and is used to clamp the two end faces of the silicon rod. At least one second clamping arm in the at least one pair of second clamping arms can be driven along the second clamping arm by the second clamping arm driving mechanism. The first direction moves to adjust the clamping distance between the at least one pair of second clamping arms.

In some embodiments of the present application, as shown in FIG. 4 , the second silicon rod holder 31 is shown as a whole with the second clamping arm mounting seat 311 disposed above, and the part outside the second clamping arm mounting seat 311 Including the second clamp arm 313 in a suspended state, the second clamp arm mounting seat 311 is mounted on the mounting frame, and the second clamp arm 313 is located under the hollow part of the mounting frame from the second clamp arm mounting seat 311 The cantilever is extended to realize that the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod) held by the second clamping arm 313 is on the processing surface of the silicon rod processing platform.

The second clamp arm mounting seat is arranged on the second transfer guide rail. In an implementation of this embodiment, the bottom of the second clamp arm mounting seat is provided with a guide groove structure matching the second transfer guide rail. , the second transfer guide rail is arranged along the first direction, and the length of the second transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the second silicon rod holder between the two working areas. In an implementation of this embodiment, the second transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

The second clamp arm mounting seat is also provided with a second guide structure along the first direction, and the at least one pair of second clamp arms is disposed on the second clamp arm mounting seat through the second guide structure and can be generated in the first direction movement. In practical applications, the second guide structure may be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod.

The at least one pair of second clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.

The second clamping arm hangs down from the second clamping arm mounting seat, and a clamping portion is included under the second clamping arm for directly contacting and clamping the silicon rod. As shown in FIG. 4 , one end of the second clamping arm 313 is connected to the second clamping arm mounting seat 311 , and the other end of the second clamping arm 313 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 315. The second clamp arm mounting seat 311 is movably arranged on the second transfer guide rail and moves along the second transfer guide rail under the driving of the second transfer drive unit, thereby driving the second clamp arm 313 along the second transfer guide rail. Two transfer rails move.

The second silicon rod holder further includes a second clamping arm driving mechanism, and the second clamping arm driving mechanism can drive at least one second clamping arm of the at least one pair of second clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged second clamping arms, so that the clamping parts of the at least one pair of second clamping arms can approach each other under the action of the second clamping arm driving mechanism or away to perform a gripping or releasing action on the silicon rod. For example, the clamping portions of the two second clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the second clamping arms to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation is completed, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the second clamping arm driving mechanism to release the processed silicon rods.

In some embodiments of the present application, the second clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other. In an implementation of this embodiment, one end of each rack in the pair of racks is engaged with the driving gear, and the other end is connected with a second clamping arm, so that the at least one pair of the second clamping arms is in the first In one direction, the guide rails of the second clamp arm mounting seat are away from each other or approach each other.

In some embodiments of the present application, the second clamp arm driving mechanism includes a screw rod and a drive source, wherein the first screw rod is disposed along a first direction and is connected to any one of the pair of second clamp arms A second clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated second clamp arm moves in a first direction.

The screw rod of the second clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the pair of second clamping arms, and the screw rod can be rotated based on the drive source transmission by means of the connection between the two ends of the screw rod The rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source. When the connected second clamping arm moves in the first direction, and the rotation direction of the lead screw is driven and rotated, the associated second clamping arm can move forward or backward in the first direction.

In some embodiments of the present application, the second clamp arm driving mechanism includes: a bidirectional screw rod, disposed along the first direction and threadedly connected to the at least one pair of second clamp arms at both ends; a drive source, using to drive the screw to rotate so that the at least one pair of second clamping arms move toward or away from each other along the first direction.

In one implementation, the bidirectional screw rod of the second clamping arm driving mechanism is threadedly connected to the pair of second clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends. , the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft. The motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source. Driven by the driving source, the pair of second clamping arms can move toward or away from each other in the first direction.

In one embodiment, the second clamp arm mounting seat may be a plurality of mounting seats connected by the second clamp arm driving mechanism, and any one of the pair of second clamp arms corresponds to a mounting seat, The driving source is arranged between a pair of second clamping arms, where any second clamping arm can move along the guide structure; when the second silicon rod holder needs to move along the guide structure as a whole, for example, it can be The driving source of the second clamping arm driving mechanism controls the pair of second clamping arms to be relatively stationary. At this time, the connection of the second clamping arm driving mechanism can make different mounting seats relatively stationary, and the second clamping arm is relatively stationary. The power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the second silicon rod clamp.

In yet another implementation manner, the second clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a second clamping arm, so The drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation. The second clamping arms are moved toward each other to perform the clamping action, and the pair of second clamping arms are driven to move back to perform the releasing action during the reverse rotation.

In an embodiment of the present application, the second clamping arm has a rotary structure. For example, the second silicon rod holder further includes a second clamping arm rotating mechanism for driving the second clamping arm to rotate. In an implementation of this embodiment, any one clamping part of the at least one pair of second clamping arms or two clamping parts of a pair of second clamping arms is provided with a rotatable structure, and the second clamping part is rotatable. Driven by the clamping arm rotation mechanism, the clamping part of the second clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation. For example, in some examples, the rotation mechanism of the second clamping arm may be, for example, a rotating motor, the clamping parts of the two second clamping arms in the pair of second clamping arms are both provided with rotatable structures, and the two second clamping arms are provided with rotatable structures. The clamping parts of the two clamping arms or the clamping part of one of the second clamping arms are connected to the output shaft of the rotating motor. For example, the clamping parts of the two second clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected The clamping part of the corresponding second clamping arm is driven to rotate, or, the clamping part of one of the second clamping arms is connected to a rotating motor, and the clamping part of the corresponding second clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other second clamping arm is also driven to rotate according to the trend.

In some implementations of this embodiment, the clamping portions of the at least one pair of second clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rods are two end faces at both ends of the elongated structure, the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line. Contact surfaces. The contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.

In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction. The axis line of the rotating shaft is connected to the second clamping arm rotating mechanism.

In an embodiment of the present application, the clamping portion of the second clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after being abutted against the end face of the silicon rod. The end face of the silicon rod is relatively stationary. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.). During switching of the silicon rod, such as switching of cutting positions or switching of grinding surfaces, the clamping portion is driven by the second clamping arm rotating mechanism to rotate along the center of the circular frustum.

In one embodiment, the clamping portion of the second clamping arm includes a rotatable circular cone and a series of protruding contacts disposed on the circular cone, each of the contacts having a contact plane. The circular platform is rotated under the driving of the second clamping arm rotating mechanism. In an implementation of this embodiment, the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted. During the process, for the silicon rod with low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state. The protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.

In an embodiment of the present application, the clamping portion of the second silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of second clamping arms of the second silicon rod clamp approach each other along the first direction under the driving of the second clamping arm driving mechanism, and the clamping portion reaches the edge of the clamping portion. The contact surface is in contact with the end surface of the silicon rod to be clamped. When the clamping part is provided with a plurality of contacts and detects that the pressure value of some contacts in contact with the end surface of the contacted silicon rod is less than a set value or When setting the area, the degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of second clamping arms of the second silicon rod clamp The clamping parts are all set as a contact surface, and in the process of clamping the silicon rod, the end faces of the pair of second clamping arms toward the two ends of the silicon rod are driven by the second clamping arm driving mechanism to approach each other to achieve, in the process of clamping the silicon rod. After the clamping part is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the second clamping arm driving mechanism controls and stops the relative movement of the pair of second clamping arms. .

The second clamping arm rotation mechanism can be arranged on one second clamping arm of a pair of second clamping arms (the other second clamping arm only has a rotation function) to drive the clamping of the pair of second clamping arms. The holding part rotates with the clamped silicon rod; or the second clamp arm rotation mechanism is arranged on each second clamp arm of a pair of second clamp arms, and controls the movement of the pair of second clamp arms in coordination with the movement. The two clamping parts rotate in the same angle and direction. In some implementations, the second clamp arm rotation mechanism may be configured as a drive motor.

When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the second clamping arm rotation mechanism. Usually, when cutting a single crystal silicon rod, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.

When the silicon rod cutting and grinding integrated machine is used to grind different sides of the silicon rod or to chamfer the edges, the clamping part is driven to rotate by the second clamping arm rotating mechanism. Usually, when grinding different sides of a single crystal silicon rod that has been squared, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved. When chamfering different edges , which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a flat surface, when chamfering the silicon rod, the second clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles. Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. For the method of realizing chamfering, reference may be made to patent publications such as CN108942570A. By driving the silicon rod to rotate by a certain angle, the grinding tool cooperates with the lateral feed in the second direction to realize the grinding of the edges and corners.

In an embodiment of the present application, the second silicon rod holder is a lift-type silicon rod holder. In an implementation manner, the second silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, and the second clamp arm of the second silicon rod clamp and the second clamp arm mounting seat carry a second clamp arm. The clamping arm guide rail can move in the third direction along the lifting guide rail, which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line, so as to select the cutting of the silicon rod. The face and silicon rod cutting device is used to cut the cutting area or select the ground surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting guide rail is arranged on the upright surface of the second clamping arm mounting seat, and the second clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail A driving mechanism for the lifting movement of the second clamping arm; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor. The second clamp arm moves in a third direction. In another implementation manner, each second clamping arm cantilever of the pair of second clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.

Regarding the second transfer drive mechanism, the second transfer drive mechanism includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along a first direction for setting the second transfer guide rail. A clamp arm mounting seat, the second transfer driving unit is used to drive the second clamp arm mounting seat and at least a pair of second clamp arms to move along the second transfer guide rail.

The second transfer driving unit includes a second moving rack, a second driving gear and a second driving source. The second moving rack is arranged along the first direction and is parallel to the second transfer guide rail. In one embodiment, the second moving rack is fixed on the upper surface, the side surface or the lower surface of the installation frame, and is set to approximately the same first direction dimension as the second transfer guide rail, which is the same as the second transfer guide rail. The guide rails are arranged in parallel and adjacent.

The second driving gear is arranged on the second silicon rod holder and meshes with the second moving rack, so as to drive the second silicon rod holder to move along the second transfer guide rail. The second drive source is used to drive the second drive gear. In an implementation manner of the present application, the second driving gear is disposed on the second clamping arm mounting seat of the second silicon rod holder, the second driving gear is driven to rotate by a second driving source, and the first The teeth of the two driving gears mesh with the second moving rack, and travel in accordance with the second moving rack, so that the second silicon rod clamp connected to the second driving gear moves accordingly on the second transfer rail. .

In an embodiment of the present application, the second transfer driving unit may be disposed on the second silicon rod holder, and includes a second moving screw and a second driving source, wherein the second moving screw is along the The first direction is set and associated with the second clamp arm mounting seat, and the second driving source is used to drive the second moving screw to rotate so as to make the associated second clamp arm mounting seat and its at least a pair of first The two clamp arms move along the second transfer guide rail.

In an implementation manner of this embodiment, the second driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected with the second driving gear to control the motion state of the second driving gear, and then the The second driving source controls the movement of the second silicon rod holder and the silicon rod clamped in the first direction.

Combined with the aforementioned first transfer device, the second transfer guide rail in the second transfer device and the first transfer guide rail in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp of the first transfer device and The second silicon rod holders of the second transfer device move on mutually parallel paths defined by the first transfer guide rail and the second transfer guide rail, respectively. When the first silicon rod holder and the silicon rod held by it are transferred from different processing positions, the second silicon rod holder and the silicon rod held by it can also be transferred between different processing positions, and the said The movements of the first silicon rod holder and the second silicon rod holder are independent of each other, and the first transfer guide rail and the second transfer guide rail, which limit the movement range thereof, are respectively arranged in different spatial positions without interfering with each other. In an embodiment of the present application, the top view of the stand and the mounting frame of the integrated silicon rod cutting and grinding machine are both shown as regular rectangles, and the first transfer guide rail and the second transfer guide rail are both along the The arrangement in the first direction is parallel and symmetrical, and the symmetry line is the center line of the machine base in the first direction.

It can be seen from the above that the first transfer device and the second transfer device are used to control the motion of the silicon rod. For example, the first transfer device is used to clamp the silicon rod and drive the silicon rod to move in the first direction. The second transfer device clamps the silicon rod and drives the silicon rod to move in the first direction, so that any silicon rod can move along the first direction relative to the silicon rod cutting device located in the first processing area or the grinding device located in the second processing area. Directional movement to achieve preset cutting or grinding jobs.

In the integrated silicon rod cutting and grinding machine of the present application, the silicon rod cutting device is provided at the first processing area of the silicon rod processing platform, and is used for the first transfer channel to be clamped by the first transfer device. The silicon rod held by the second transfer channel or the silicon rod held by the second transfer device performs the cutting operation.

The silicon rod cutting device includes a plurality of cutting wheels and a cutting wire saw formed around the plurality of cutting wheels, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp Therefore, the silicon rod cutting device can be set in a fixed state when performing the cutting operation, so as to realize the relative feeding between the cutting wire saw and the silicon rod. In the traditional integrated silicon rod cutting and grinding machine, it is necessary to move the cutting wire saw in the space to realize the cutting of the silicon rod to be cut. Therefore, it is necessary to configure a driving device and a guiding structure for the cutting wheel and the cutting wire to realize the relative relationship between the cutting wire saw. Silicon rod feeding; here, the structure of the silicon rod cutting device of the present application can be simplified, the cutting wheel can be fixed on the main body of the silicon rod cutting device, such as a cutting frame, and the cutting wheel can be omitted to be along the axis of the silicon rod. The moving guide structure and the driving device can reduce the structure of the silicon rod cutting device and the equipment space occupied.

The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cutting operation is performed on the silicon rod to be cut held by the second transfer device.

In some embodiments, the silicon rod cutting device includes: a cutting frame, at least one wire cutting unit, and a cutting conversion mechanism; wherein, the at least one wire cutting unit is provided on the cutting frame, and the cutting conversion mechanism uses The cutting frame and at least one wire cutting unit thereon are switched between the first transfer channel and the second transfer channel.

The at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the plurality of cutting wheels and the transition wheel to form at least one A cutting wire saw.

The cutting frame is used to set the wire cutting unit. Here, the specific structure of the cutting frame can be set in different forms based on the arrangement requirements of the cutting wheel and the transition wheel, such as a column, a beam, and a plate frame.

In some embodiments, a plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or, the plurality of cutting wheels and transition wheels are arranged through a bracket, a connecting plate, or a mounting frame. Regarding the cutting frame, the carrier for arranging a plurality of cutting wheels and transition wheels can be in different forms, which is not limited in this application.

Please refer to FIG. 5 , which is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.

In some embodiments, as shown in the embodiment shown in FIG. 5 , the silicon rod cutting device 4 includes: a cutting frame 41 , at least a wire cutting unit 43 , and a cutting conversion mechanism, wherein the wire cutting unit 43 uses a wire The cutting support 430 is provided on the cutting frame 41 . Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc.

In an implementation manner, the wire cutting support is arranged on the cutting frame through a guide structure such as a guide rail or a guide post, wherein the guide rail or guide post is arranged along the vertical direction of the wheel surface of the cutting wheel in the wire cutting unit, so as to The set wire cutting unit has the freedom to move along the vertical direction of the cutting wheel surface; under this setting, the wire cutting support can move along the orthogonal direction of the cutting wheel surface under the action of the driving source .

When the wire cutting unit moves along the vertical direction of the cutting wheel surface, correspondingly, the cutting wire saw in the wire cutting unit moves along the vertical direction of the cutting wheel surface, and the cutting wire saw is relatively The distance or closeness of the axis of the silicon rod can adjust the cutting amount or cutting position of the silicon rod.

The cutting wheel is provided with at least one cutting wire groove for winding the cutting wire, and the cutting wire groove can define the position of the cutting wire to control the cutting precision. Any of the cutting wire saws are formed by winding a cutting wire between two cutting wheels, and the positions of the two cutting wheels and the positional relationship between the cutting wheels can be used to determine the direction of the cutting wire saw.

The transition wheel is used for reversing or guiding the cutting line, or the transition wheel can be used for adjusting the tension of the cutting line.

In the integrated silicon rod cutting and grinding machine of the present application, during the cutting process, the cutting line is driven to run along the winding direction, and the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod along the axis of the silicon rod. The center line direction, ie, the first direction, is moved to realize the feeding relative to the cutting wire saw, wherein the cutting wire saw can be set in the second direction or the re-perpendicular direction.

It should be noted that the cutting wire saw can be cut only when the direction of the cutting wire is perpendicular to the axial direction of the silicon rod. Therefore, in a specific scenario, the direction of the cutting wire saw is on the vertical plane of the first direction. In order to facilitate the control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, as well as to facilitate the description of the structure of the silicon rod cutting device and the arrangement of the components of the present application, the following embodiment uses a cutting wire saw to be set in the No. The two-direction or the double-perpendicular direction is taken as an example for description.

In one embodiment, the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form Cutting wire saw; wherein, the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is ordered in the state of pulling the cutting wire The cutting lines of the first cutting wheel and the first transition wheel are located in the plane of the first cutting wire groove for winding the cutting line in the first cutting wheel; the second transition wheel, adjacent to the second cutting wheel, is in the traction The state of the cutting line makes the cutting line of the second cutting wheel and the second transition wheel located in the plane of the second cutting wire groove used for winding the cutting line in the second cutting wheel; at least one third transition wheel is arranged on the first A transition wheel and a second transition wheel are used for pulling the cutting wire between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the wire cutting unit, and the cutting The accommodating space can accommodate the silicon rod to be cut, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space.

The direction of the cutting wheel surface has a corresponding relationship with the direction of the cutting wire saw. It should be understood that the cutting wheel surface is parallel to the plane where any cutting wire groove in the cutting wheel is located, in order to control the cutting accuracy and the stability of the cutting process. , the cutting wire saw should be located in the plane of the cutting wire groove used for winding the cutting wire; at the same time, during the cutting process, the direction of the force applied by the silicon rod to the cutting wire should be parallel to the cutting wire groove, that is The surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the direction of the axis of the silicon rod in the squaring operation.

In the silicon rod cutting device of the present application, the cutting wire saw is located in the second direction or the re-perpendicular direction. Correspondingly, the cutting wheel surface is parallel to the second direction and the silicon rod axis direction, that is, the cutting The wheel surface is located in the direction of the horizontal plane, or the cutting wheel surface is parallel to the direction of the heavy vertical line and the axis of the silicon rod, that is, the cutting wheel surface is located in the vertical plane direction.

The silicon rod cutting device includes two wire cutting units arranged opposite each other, and each wire cutting unit has at least one cutting wire saw. Therefore, the two wire cutting units form at least two parallel cutting wire saws. In the example shown in FIG. 5 , the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction.

Please refer to FIG. 6 . FIG. 6 is an enlarged schematic view of B in FIG. 5 . In the example shown in FIG. 5 , any one of the wire cutting units 43 includes a first cutting wheel 431 and a second cutting wheel 433 , and a cutting wire 438 is wound around the first cutting wheel 431 and the second cutting wheel 433 to form A cutting wire saw 439.

The first cutting wheel includes at least one first cutting line groove, and the plane where any of the first cutting line grooves is located is parallel to the surface of the first cutting wheel wheel; the second cutting wheel includes at least one second cutting line The plane where any of the second cutting line grooves is located is parallel to the surface of the second cutting wheel.

The wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel, so that when the cutting wire is wound on the first cutting wheel and the second cutting wheel, it is respectively used for winding The first cutting wire groove and the second cutting wire groove of the cutting wire are located in the same plane, so that the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire are at the same time. Inside. It should be understood that the cutting wire is in a running state during the cutting action, so the cutting wire saw is defined by its spatial position. The cutting wire is the cutting wire saw.

It should be understood that when the cutting wire is wound around any cutting wheel, the cutting wires on both sides of the cutting wheel should all be located in the plane of the cutting wire groove for winding the cutting wire in the cutting wheel.

When the cutting wire is wound around the first cutting wheel, the cutting wire at one end of the first cutting wire slot is wound to the second cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the first cutting wire slot is wound to the The first transition wheel. As shown in FIG. 6 , the first transition wheel 432 is adjacent to the first cutting wheel 431 , and is ordered to go around the first cutting wheel 431 in a state of pulling the cutting line around the first cutting wheel 431 . The cutting line is located in the plane where the first cutting line groove for winding the cutting line in the first cutting wheel 431 is located.

When the cutting wire is wound around the second cutting wheel, the cutting wire at one end of the second cutting wire groove is wound to the first cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the second cutting wire groove is wound to the Second transition wheel. As shown in FIG. 6 , the second transition wheel 434 is adjacent to the second cutting wheel 433 , and is ordered to go around the second cutting wheel 433 in the state of pulling the cutting line around the second cutting wheel 433 The cutting line is located in the plane of the second cutting line groove in the second cutting wheel 433 for winding the cutting line.

The first transition wheel and the second transition wheel respectively have at least one wire groove for pulling the cutting wire. The first transition wheel and the second transition wheel are respectively arranged adjacent to the first cutting wheel and the second cutting wheel, and here, the adjacent arrangement can be the left side, the right side, the upper side, the lower side, etc. Applications are not limited.

It should be understood that when the cutting wire is wound around any cutting wheel or transition wheel, the direction of the cutting wire wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire groove.

As shown in FIG. 6 , the at least one third transition wheel 436 is disposed between the first transition wheel 432 and the second transition wheel 434 for pulling the first transition wheel 432 and the second transition wheel 434 434, so that a cutting accommodating space is formed in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and the silicon rod cutting device has only the cutting wire saw and the The cutting accommodation spaces intersect.

During the cutting operation, the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod to feed along the axis of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is the silicon rod to be cut. The range of motion of the silicon rod from the start of contact with the cutting line to the movement to the process when the cutting line runs through the silicon rod to form a skin.

The cutting accommodating space can accommodate the silicon rod to be cut, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space. It should be understood that, during the cutting process, the first silicon rod holder or the second silicon rod holder and the silicon rod to be cut held by the first silicon rod holder and the other parts of the integrated silicon rod cutting and grinding machine include the cutting line (herein) during movement. The collision of the cutting wire (removing the cutting wire saw) is a problem that needs to be avoided; at the same time, in order to achieve cutting, the cutting wire saw and the silicon rod are relatively fed during the movement of the first silicon rod clamp or the second silicon rod clamp to clamp the silicon rod, so , it should be ensured that the cutting accommodating space includes and only includes silicon rods and cutting wire saws.

The first transition wheel, the second transition wheel, and the at least one third transition wheel can all be used to pull the cutting line, and the third transition wheel is used to pull the cutting between the first transition wheel and the second transition wheel. line to form the cut receiving space.

In some embodiments, the first transition wheel, the second transition wheel and the at least one third transition wheel are used for pulling the cutting wire away from the silicon rod to be cut. It should be understood that the cutting line between the first cutting wheel and the first transition wheel and the cutting line between the second cutting wheel and the second transition wheel are located in the first cutting line groove ( or the second cutting slot) in the plane. In order to form the cutting accommodating space, in an implementation manner, the lengths of the cutting lines between the first cutting wheel and the first transition wheel and between the second cutting wheel and the second transition The length of the silicon rod is cut, but under this setting, the cutting frame occupies too much equipment space and the layout is unreasonable.

In some embodiments, the first transition wheel, the second transition wheel, and at least one third transition wheel are used to draw the cutting wire away from the cutting receiving space.

The present application provides an embodiment in which the cutting accommodating space is formed by the first transition wheel, the second transition wheel and the third transition wheel. In an implementation manner, the wheel surface of at least one of the first transition wheel, the second transition wheel and the third transition wheel forms a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel, In order to make the cutting line deviate from the plane of the first cutting line groove (or the second cutting line groove) used for winding the cutting line, in order to optimize the overall structural layout of the silicon rod cutting device and the silicon rod cutting and grinding machine, the deviation The direction of can be selected as the direction away from the cutting accommodating space.

Taking the silicon rod cutting device including two oppositely arranged wire cutting units as an example, in the embodiment shown in FIG. 6 , the first transition wheel 432 , the second transition wheel 434 and the third transition wheel 436 It is set to be inclined in the direction away from the cutting accommodation space, or each transition wheel is arranged on the side of the cutting frame away from the cutting accommodation space, so that the cutting line can be kept away from the cutting accommodation space. Under this layout The equipment space required by the wire cutting unit can be effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod cutting and grinding integrated machine.

Here, for any of the wire cutting units, the direction away from the cutting accommodating space is the vector of the vertical direction of the cutting wheel surface. Taking the embodiment shown in FIG. 5 as an example, two opposite wire cutting The corresponding directions of the units 43 away from the cutting accommodating space point in opposite directions, which are respectively the directions shown by the arrows in the figure.

In some embodiments, the wheel surface of the first transition wheel and the direction of the wheel surface of the first cutting wheel may form a certain angle, and the wheel surface of the second transition wheel and the direction of the wheel surface of the second cutting wheel may form a certain angle a certain angle. The direction in which the first transition wheel is arranged is only when the cutting line at the other end of the first cutting wheel is located in the plane where the first cutting line groove for winding the cutting line is located and the wire used for winding the cutting line in the first transition wheel. And the direction of the setting of the second transition wheel is only when the cutting line at the other end of the second cutting wheel is located in the plane where the second cutting line groove for winding the cutting line is located and the second cutting line. In the second transition wheel, the wire groove used for winding the cutting wire is located in the intersection of the plane.

By arranging the first transition wheel and the second transition wheel to form a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel, the direction of the angle is to make the first transition wheel or the second transition wheel The transition wheel is inclined toward the direction away from the cutting accommodating space, which is beneficial to reduce the required number of the third transition wheel and the length of the wire cutting support in the first direction.

In some embodiments, the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel in an end-to-end manner to form a closed loop Cutting line. As shown in FIG. 6 , the cutting line 438 is a closed-loop cutting line.

The cutting wheel and the transition wheel in the wire cutting unit are wound by an annular cutting wire. In this example, the wire storage drum can be omitted from the silicon rod cutting device, and the annular cutting wire can be realized by running the driving device. cut.

In the existing silicon rod cutting device, the cutting wire is wound from the pay-off drum to between the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting operation, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the annular cutting wire in the wire cutting unit can maintain continuous high-speed running, and at the same time, the annular cutting wire can run in the same running direction during the cutting operation. In this way, the wire cutting unit of the present application can realize high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the annular cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit, reducing production costs.

In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the second transition wheel, and the first cutting wheel in turn. There are three transition wheels, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end annular cutting line.

Please refer to FIG. 6 , taking the first cutting wheel 431 as the starting point of the winding of the annular cutting wire as an example, the cutting wire is wound from the first cutting wheel 431 to the second cutting wheel 433 and is formed between the two cutting wheels The cutting wire saw 439; the cutting wire is wound from the second cutting wheel 433 to the second transition wheel 434, a third transition wheel 436, another third transition wheel 436, a first transition wheel 432, and a first cutting wheel. 431 , thereby forming an end-to-end annular winding, and at the same time, through the pulling and guiding of the cutting wire by a plurality of transition wheels, the cutting accommodating space is formed in the wire cutting unit.

Of course, it should be understood that the positions of the first transition wheel, the second transition wheel and the third transition wheel relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the embodiment shown in the figure, only when cutting The cutting accommodating space may be formed when the wire is wound between the plurality of cutting wheels and the transition wheel of the wire cutting unit. At the same time, the third transition wheel of the wire cutting unit can also be set to three, four, etc., which is not limited in this application.

In some embodiments, the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.

The principle of wire cutting is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. Here, the cutting wire driving device is used to realize the running of the cutting wire.

In some embodiments, the cutting wire driving device is a motor with a power take-off shaft and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel, so that the cutting wire can be wound by The cutting wheel is driven to run along the winding direction. Of course, in a specific implementation manner, the cutting wire driving device may also be another driving source, such as a hydraulic motor, only when the cutting wire is driven to run, which is not limited in this application.

In some embodiments, the silicon rod cutting device further includes a tension detection mechanism. In the wire cutting process, the tension of the cutting wire affects the yield and processing accuracy of the cutting. The tension detection mechanism performs tension detection and adjusts so that the tension of the cutting wire reaches a certain threshold set and maintains a constant value or a constant value during cutting. The constant value is a certain range allowed by the center of the value.

In an implementation manner, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for adjusting the tension of the cutting wire when realizing the guiding and pulling of the cutting wire.

The tensioning wheel is used to adjust the tension of the cutting line, which can reduce the probability of breaking the cutting line and reduce the consumables. In the cutting operation, the role of the cutting wire is very important, but even the best cutting wire has limited elongation and wear resistance, which means that the cutting wire will gradually become thinner during continuous operation until it is finally broken. . Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire when it travels back and forth.

In some embodiments of the application, the tension detection mechanism at least includes: a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel, and continuously senses the tension of the cutting wire on the transition wheel value, and send out a drive signal when the tension value is less than the preset value; the servo motor is electrically connected to the tension sensor to start working after receiving the drive signal sent by the tension sensor; one end of the lead screw is connected to The other end of the tension wheel is connected to the servo motor, and when the servo motor works, the transition wheel is pulled to perform one-way displacement, so as to adjust the tension of the cutting line.

In some embodiments, the silicon rod cutting device further includes: at least one distance adjusting mechanism, which is provided in the at least one wire cutting unit and is used to drive a plurality of cutting wheels in the wire cutting unit relative to the edge of the cutting frame. Move perpendicular to the face of the cut-off wheel. The silicon rod cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod.

In some implementations, please refer to FIG. 5 and FIG. 6 , taking a wire cutting unit in the silicon rod cutting device as an example for description, and the wire cutting unit includes a plurality of cutting wheels and transition wheels. The carrier for carrying the plurality of cutting wheels and transition wheels is, for example, the wire cutting support 430 shown in FIG. 5 , and the distance adjustment mechanism can be used to drive the wire cutting support 430 as a whole along the vertical line of the cutting wheel surface moving in the direction, the transition wheel and the cutting wheel together follow the wire cutting support to move along the vertical direction (ie, the second direction) of the cutting wheel surface, in this state, the plurality of cutting wheels and transition wheels It is relatively static, that is, the positional relationship between the transition wheel and the cutting wheel does not change. At this time, the distance adjusting mechanism is used to adjust the cutting position of the at least one wire cutting wire saw relative to the silicon rod in the at least one wire cutting unit.

In some implementations, each cutting wheel has at least two cutting line grooves, different cutting line grooves are parallel to each other and there is a cutting offset in the vertical direction of the cutting wheel surface between different cutting line grooves. When the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the positions of the wire grooves on which the cutting wire is wound around the cutting wheels can be changed. In one implementation, a plurality of cutting wheels in the wire cutting unit can be connected to a bracket, for example, wherein the bracket is movably arranged on the wire cutting support and is driven by the distance adjustment mechanism to follow the direction of the cutting wheel surface. Move in the vertical direction.

When the at least one distance adjusting mechanism is used to realize the changing of the cutting line around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in the actual scene, the corresponding cutting lines before and after the groove changing can be determined in advance. Cutting wire groove, for example, the position of the cutting wire before the groove change is the cutting wire groove a1, after the groove changing, the cutting wire is wound around the cutting wire groove a2, based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2. The displacement amount that the at least one distance adjusting mechanism drives the movement of the plurality of cutting wheels in the wire cutting unit, that is, the displacement amount is set as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize cutting Replacing the wire cutting wire groove a1 to the cutting wire groove a2; it should be noted that the at least one distance adjustment mechanism drives the multiple cutting wheels in the wire cutting unit to move in the direction of the vertical line of the cutting wheel surface. The wire groove a2 points to the direction of the cutting wire groove a1. After the groove is changed, the cutting position of the cutting wire saw in the space remains unchanged, and the step of further calibrating the position of the cutting wheel or other components is omitted, and the preset cutting amount can be The silicon rods are cut so that the slot changing process is simplified.

In order to further illustrate the manner in which the at least one distance adjusting mechanism realizes the movement of the plurality of cutting wheels in the wire cutting unit relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel, the present application provides the following embodiments. When the number of wire cutting units in the silicon rod cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed accordingly.

In one embodiment, the wire silicon rod cutting device includes a single wire cutting unit; the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the single wire cutting unit; a driving source , used to drive the screw to rotate.

Here, the single wire cutting unit is a wire cutting unit, and the single wire cutting unit in the wire silicon rod cutting device includes a plurality of cutting wheels, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the Single wire cutting unit, by means of the connection at both ends of the screw rod, the screw rod can rotate based on the drive source transmission and convert the rotation of the screw rod into the displacement of the axis line by means of threaded connection, and the axial displacement direction is the setting of the screw rod The direction is the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by the rotation of the lead screw driven by the driving source in the distance adjustment mechanism, and the rotation direction of the lead screw is driven to rotate. If different, the cutting wheel of the single-wire cutting unit can be advanced or retreated in the orthogonal direction of the cutting wheel surface.

In another embodiment, the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic member, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit; a driving source , which is used to drive the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel. Here, the telescopic piece can be configured as a rod body structure, and the extending direction of the rod body is the orthogonal direction of the wheel surface of the cutting wheel. The drive source, the retractable free end is associated with the single wire cutting unit, and can drive the cutting wheel of the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface under the action of the driving source. The telescopic element is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as a driving source, which is not limited in this application. The way the telescopic rod is connected to the single-wire cutting unit can be a linear connection or an indirect connection, for example, it can be directly connected to the wire-cutting support or cutting wheel support of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing. The single wire cutting unit. It should be understood that the expansion or contraction of the telescopic element can correspond to the advance or retreat of the single-wire cutting unit along the orthogonal direction of the cutting wheel surface.

Here, in the embodiments provided in the present application, the association can be realized by, for example, one or more of snapping, screw locking, gluing, and welding. For example, in the above-mentioned embodiments, the telescopic rod can be The wire cutting unit is associated with one or more ways of snapping, screwing, gluing, and welding; of course, the realization of the association is not limited to this, and is intended to be realized in the second direction transmission.

In yet another embodiment, the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack, which is arranged on the single-wire cutting unit along the orthogonal direction of the surface of the cutting wheel; a transmission gear, and The rack is meshed; a driving source is used to drive the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves along the step direction of the rack accordingly. The rotational motion of the drive is converted into wire transportation along the direction of the rack, and the rack is arranged on the single-wire cutting unit along the orthogonal direction of the cutting wheel surface, so that the cutting wheel of the single-wire cutting unit can be driven along the cutting wheel. Orthogonal direction of the face. At the same time, the rotation direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the cutting wheel surface.

In one embodiment, the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit passes through the At least one distance adjustment mechanism is driven to move in the orthogonal direction of the wheel surface of the cutting wheel, and is used to adjust the wire between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit The secant saw spacing, or the changing cutting wire is wound around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

The at least one distance adjusting mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or to be associated with the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the connected or associated wire cutting unit. The plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit move in orthogonal directions of the cutting wheel surfaces.

In one embodiment, the distance adjusting mechanism includes: a screw rod, which is arranged in the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit or the second wire cutting unit; to drive the screw to rotate. The manner in which the screw rod and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to that in the previous embodiment, and all the cutting wheels driven by the distance adjusting mechanism The first cutting unit or the second wire cutting unit may be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by setting the distance adjustment mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased. The silicon rod can be cut into different specifications.

In another embodiment, the distance adjusting mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source for driving The telescopic element performs telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism may be regarded as a single wire cutting unit, and the specific implementation can refer to the foregoing embodiments, which will not be repeated here.

In yet another embodiment, the distance adjusting mechanism comprises: a rack, along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, connected with the The rack is meshed; the driving source is used to drive the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move linearly in the direction of the rack, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the teeth The strip drives the plurality of cutting wheels to move in orthogonal directions to the surfaces of the cutting wheels.

In one embodiment, the distance adjusting mechanism includes: a bidirectional screw rod, which is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit and the second wire cutting unit; and a driving source, It is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the surface of the cutting wheel. In one embodiment, the two-way screw is a double-threaded screw, two ends of the two-way screw are respectively provided with threads and the thread directions are opposite, and the driving source can be arranged at either end of the two-way screw to Drive the two-way screw to rotate along the screw shaft. With the threads in opposite directions at both ends of the two-way screw, when the two-way screw is rotated under the drive of the driving source, the movement of the two ends of the two-way screw is converted into the axial line movement in the opposite direction. , the axial direction is the orthogonal direction of the cutting wheel surface of the bidirectional screw rod. Driven by the driving source, the plurality of cutting wheels corresponding to the first wire cutting unit and the second wire cutting unit respectively can move toward each other or move toward each other.

In some embodiments, the distance adjusting mechanism is a servo motor provided in the at least one wire cutting unit. In an actual scene, a servo motor is set on at least one wire cutting unit or each wire cutting unit of the wire silicon rod cutting device, and the servo motor controls the corresponding wire cutting unit in the orthogonal direction of the cutting wheel surface. displacement. The wire cutting unit can pre-determine the cutting offset for changing grooves or the adjustment amount for changing the cutting position of the cutting wire, and the precise positioning function of the servo motor drives the plurality of cutting wheels in the wire cutting unit to a preset displacement. Movement in the direction orthogonal to the face of the cut-off wheel. For example, the wire silicon rod cutting device is provided with a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface; The silicon rod cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit are driven by the corresponding servo motors to be relatively independent along the positive direction of the cutting wheel surface. Move in the opposite direction. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the distance adjustment mechanism is a driving device that drives a plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame. Form This application is not limited.

In an embodiment of the present application, the cutting switching mechanism is used to drive the cutting frame and at least one wire cutting unit on it to switch between the first transfer channel and the second transfer channel.

In the embodiment of the present application, the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction. The width dimension of the bar processing platform. The first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction. The second transfer passage passes through the first processing location and the second processing location in the first direction. In the embodiment of the present application, the silicon rod cutting device is provided with a cutting conversion mechanism, and by using the cutting conversion mechanism, the cutting frame and the at least one line cutting unit on the cutting frame can be driven to move in the second direction, so as to move in the second direction in the first To switch between a transfer channel and a second transfer channel, for example, the cutting frame and at least one wire cutting unit on it are driven by the cutting conversion mechanism to move in the second direction to switch from the first transfer channel to the second transfer channel Alternatively, the cutting frame and the at least one wire cutting unit on the cutting frame are driven to move in the second direction by the cutting conversion mechanism to be converted from the second transfer passage to the first transfer passage.

In one embodiment, the cutting conversion mechanism includes: a cutting conversion guide rail and a cutting conversion driving unit.

The cutting conversion guide rail is arranged along the second direction for setting the cutting frame. In some embodiments, the cutting conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the cutting frame is erected on the cutting conversion guide rail through, for example, a sliding block.

A cutting conversion driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.

In some embodiments, the cutting conversion driving unit includes: a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and is parallel to the cutting conversion guide rail. Wherein, the moving rack is fixed on the silicon rod processing platform, is set to approximately the same second direction dimension as the cutting conversion guide rail, and is parallel to and adjacent to the cutting conversion guide rail.

The driving gear is arranged on the cutting frame and meshes with the moving rack, so as to drive the cutting frame to move along the cutting conversion guide rail. The drive source is used to drive the drive gear. In an implementation manner of the present application, the driving gear is provided on the cutting frame, the driving gear is driven to rotate by a driving source, and the gear teeth of the driving gear mesh with the moving rack to conform to the movement The rack travels, whereby the cutting frame connected to the drive gear and at least one cutting unit thereon produce a corresponding movement on the cutting transition rail.

In some embodiments, the cutting conversion drive unit may be disposed on the cutting frame, and includes a moving screw and a drive source, wherein the moving screw is disposed along the second direction and associated with the cutting frame, The driving source is used for driving the moving screw to rotate so that the associated cutting frame and at least one cutting unit on it move along the cutting conversion guide rail.

The integrated silicon rod cutting and grinding machine of the present application may further include an edge skin discharging device, which is used for discharging the edge skin formed by cutting the silicon rod by the silicon rod cutting device.

The edge skin discharging device may include a edge skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the edge skin formed by cutting.

It should be understood that, no matter it is the first transfer device or the second transfer device, the silicon rod clamped by the first silicon rod holder in the first transfer device or the second silicon rod holder in the second transfer device is horizontal, That is, the axis line of the silicon rod is consistent with the first direction. Therefore, the edge skin formed by cutting the silicon rod by the silicon rod cutting device is also horizontal, and the edge skin unloading mechanism supports the edge skin to assist in unloading the edge skin.

The edge skin supporting mechanism comprises: a support part; and a driving unit connected with the support part to control the support part to move away from or abut against the edge skin.

In some examples, the silicon rod cutting device in the integrated silicon rod cutting and grinding machine can switch the cutting position during the processing of the silicon rod. For example, the silicon rod processing platform is provided with a first processing area and a second processing area , the silicon rod cutting device is arranged on the base by a cutting conversion mechanism, and can switch positions between the first processing area and the second processing area under the driving of the cutting conversion mechanism. Under this arrangement, the edge skin supporting mechanism can, for example, be provided on the silicon rod cutting device through a mounting portion, so that the edge skin supporting mechanism remains relatively stationary relative to the cutting assembly when the silicon rod cutting device changes the processing position. . In some examples, the mounting portion is detachably connected to the cutting frame, and the mounting portion can be arranged at different positions on the silicon rod cutting device based on the requirement of the position for supporting the silicon rod.

The position of the edge skin supporting mechanism on the silicon rod cutting device can be determined based on the specific structure of the wire cutting unit in the silicon rod cutting device. Please refer to FIG. 5 , which is a schematic structural diagram of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine in one embodiment. As shown in FIG. 5 , the silicon rod cutting device includes a cutting frame 41 and a wire cutting unit 43 , and the wire cutting unit 43 is provided on the cutting frame 41 by a wire cutting support 430 . Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc. In this example, the edge skin supporting mechanism can be provided on the wire cutting support 430 through the mounting portion.

In other examples, for example, when the position of the silicon rod cutting device in the first direction remains unchanged, the edge skin supporting mechanism may be provided on the machine base through the mounting portion, for example, the mounting portion It is a support column or bracket for setting the edge skin supporting mechanism, so that the supporting part in the edge skin supporting mechanism can realize the supporting of the edge skin under the driving of the driving unit.

The edge skin supporting mechanism includes a support portion, which is used for contacting and abutting against the silicon rod to achieve a supporting effect on the edge skin. It should be noted that, in each embodiment of the present application, the The supporting function is to apply force to the edge skin to maintain a stable state. Taking the cutting wire saw as an example in the horizontal direction (ie, the second direction), the edge skin formed by cutting is located on the silicon rod. The upper side, the lower side, or the upper side and the lower side, at this time, the support part can provide a supporting force to the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, so that the edge skin can be maintained in a stable state; Or when the cutting wire saw is set in the direction of the heavy vertical line, the edge skin formed by cutting is located beside the silicon rod (the left side, the right side, or the left side and the right side), and the supporting part can be set to be connected with the silicon rod. The structure of the outer arc surface of the rod is adapted to provide a support force to the edge skin, or to maintain a stable state by abutting against the edge skin so that the edge skin is subjected to frictional force. In the example shown in FIG. 5 , the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction. The edge skins formed by cutting are located on the left and right sides of the silicon rod, and the supporting portion can be set to a structure adapted to the outer arc surface of the silicon rod to provide a supporting force for the edge skin, or by abutting against the edge skin to provide support for the edge skin. The edge skin is subjected to friction to maintain a stable state.

The driving unit is used for driving the bearing portion away from or against the side skin. The directions of moving away from or abutting against the edge skin can be in multiple directions, for example, abutting the edge skin means that the supporting portion moves from a state of being separated from the edge skin to a state of contacting the edge skin under the driving of the driving unit, and The specific movement direction of the supporting portion is not limited in this application.

In an implementation manner, the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the bearing part to move away from or against the supporting part; Said edge skin.

The telescopic part can be telescopically moved under the driving of a cylinder or a hydraulic pump, so that the telescopic part is connected to the supporting part, and the telescopic direction of the telescopic part is, for example, a direction away from or close to the axis of the silicon rod, thereby driving the connected supporting part. The support part is away from or abuts against the side skin.

In yet another implementation, the drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The screw assembly can be threadedly connected with the bearing part at one end, the driving motor drives the screw to rotate to make the bearing part move along the direction of the screw, and the rotation direction of the screw is controlled by the driving motor to control The support part is close to or away from the edge skin.

The supporting portion can be set in different structures to achieve the supporting effect. For example, the supporting portion can be a supporting plate and has an arc surface for contacting the edge skin, or the supporting portion has a folded surface. A support plate that prevents the edge skin from rolling, for example, the support plate has a trapezoidal groove structure (where the notch is a trapezoidal lower bottom); it should be understood that the support portion that can be used to support the edge skin has many This can be implemented, which is not limited in this application.

In order to securely support the edge skin formed by cutting to prevent the edge skin from breaking, or to simplify the unloading and transportation of the edge skin, the application also provides the following implementation methods:

In one embodiment, the supporting portion includes at least two supporting blocks, which are arranged at intervals along the first direction and have a bearing surface for contacting and bearing the edge skin. The bearing surface of the supporting block can be set to have an arc surface to adapt to the supported edge skin, or can be set to be composed of contact planes with different levels to prevent the edge skin from rolling. Wherein, in some implementations, one drive unit may be configured for each support block.

It should be understood that, in some processing scenarios, the edge skin can be supported by one supporting block; here, the present application also provides that the edge skin can be realized by at least two supporting blocks arranged at intervals along the first direction In the supporting embodiment, by setting the interval or span between the at least two supporting blocks along the first direction, the supporting of the edge skin formed by cutting silicon rods of different lengths and specifications can be realized. The provided support block supports the edge skin so that the edge skin can be subjected to the force of the support part in different length directions (ie, the first direction), thereby helping to prevent the cutting wire saw from breaking through the front edge skin of the silicon rod. After the wire saw is cut through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used to support the edge skin to prevent the edge skin from tilting and falling over.

In some embodiments, the supporting part of the side skin discharge mechanism is a supporting wheel set, wherein there may be at least two supporting wheel sets, and at least two of the supporting wheel sets are along the first The directions are arranged at intervals or spans, and each of the supporting wheel sets includes: at least two supporting wheels, the at least two supporting wheels are arranged at intervals along the second direction, and are used for contacting to support the edge skin a supporting base, connected to the driving unit, for setting the at least two supporting wheels to drive the at least two supporting wheels away from or abutting against the edge skin.

In another embodiment, the edge skin supporting mechanism includes at least two supporting parts, and the at least two supporting parts are disposed on the silicon rod cutting device or the machine base at intervals along the first direction. Wherein, the supporting part is a supporting wheel set, and any of the supporting wheel sets includes at least two supporting wheels, which are arranged at intervals along the second direction, so that the center of gravity of the supported side skin can be in the second direction. The location is between the at least two support wheels. The support wheel is used for contacting and supporting the edge skin, and the tangential direction of the support wheel in contact with the silicon rod edge skin is along the first direction.

In some implementations, the support wheel can roll along the axis of the support wheel, and the axis of the support wheel is arranged in the second direction. Under this setting, when the cutting wire saw penetrates the silicon rod to form an independent edge skin, and when the edge skin is to be subsequently transported, when the edge skin moves relative to the supporting wheel set along the first direction, the edge skin and the support There is rolling friction between the wheels, which facilitates the subsequent conveying of the edge skin along the first direction.

The edge skin supporting mechanism further includes a driving unit, and the driving unit is used for driving the supporting wheel set to move away from or against the edge skin. The cutting wire saw of the rod cutting device is arranged in the second direction, and the driving unit drives the supporting wheel set to move in the direction of the heavy vertical line to abut against and support the edge skin during the cutting process. The driving unit is, for example, an air cylinder or a driving motor, etc., the air cylinder or driving motor is connected to the supporting base of the supporting wheel set to drive the whole supporting wheel set to move up and down in the direction of the heavy vertical line.

In yet another embodiment, the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the edges of the supporting rods The opposite ends in the first direction are used for connecting the at least two supporting rods and the driving unit.

Please refer to FIG. 5 and FIG. 6 , which are schematic diagrams showing a part of the structure of an embodiment of the side skin supporting mechanism of the present application. As shown in the figure, the support portion 611 includes two support rods 6111 arranged at intervals along the second direction, and the rod bodies of the support rods 6111 are along the first direction.

Here, the at least two support rods 6111 can be used to support the edge skin. It should be understood that the center of gravity of the edge skin formed by cutting is located between the at least two support rods 6111 At the same time, any of the supporting rods 6111 is in line contact with the supported edge skin, and under this setting, the frictional force between the supporting portion 611 and the edge skin can be reduced. .

The connecting parts 6113 are located on both sides of the support rod 6111, so that the support rod 6111 is symmetrical in force when the support part 611 is away from or close to the silicon rod, which is beneficial to improve the structural stability of the support part. . In the embodiment shown in FIG. 5 and FIG. 6 , the connecting portion 6113 is respectively connected to the supporting rod 6111 and the driving unit, wherein the driving unit 613 is connected to the wire cutting support through the mounting portion. The free end of the base 430 or the cutting frame 41 , which can be telescopically moved, is connected to the connecting portion 6113 to drive the entire supporting portion 611 to move in the telescopic direction driven by the driving unit 613 . In the example shown in FIGS. 5 and 6 , the driving unit 613 is an air cylinder having a telescopic portion, and the telescopic portion of the air cylinder 613 is connected to the connecting portion 6113 .

In the example shown in FIG. 5 and FIG. 6 , the supporting portion 611 is controlled to move in the second direction to move away from or close to the edge skin. It should be understood that when the direction of the cutting wire saw in the silicon rod cutting device is different, or when the structure of the supporting portion is different, the driving unit in the corresponding edge skin supporting mechanism can be arranged in different directions to adapt to In order to support the needs of the edge skin. For example, when the cutting wire saw in the silicon rod cutting device is in the direction of the heavy vertical line, the driving unit can be set, for example, the direction of its telescopic movement is the second direction, so that the supporting portion moves in the second direction to approach or away from the edge. For example, when the cutting wire saw in the silicon rod cutting device is along the second direction, the driving unit can be set, for example, to set the direction of its telescopic movement to be the third direction (ie, the direction of the heavy vertical line), so that the supporting portion can be moved along the second direction. Movement in the third direction to approach or move away from the edge skin. The direction of the controlled movement of the supporting portion is not limited in the present application, and it is only required that the supporting portion can support the edge skin.

The number of the supporting parts can be set according to the need for supporting the edge skin. For example, when the silicon rod cutting device includes a cutting wire saw, the edge skin is formed correspondingly in one cutting operation. A support part can be provided on the rod cutting device to support the opposite side skin; another example, when the silicon rod cutting device includes two parallel cutting wire saws, the two side skins are formed correspondingly in one cutting operation, The silicon rod cutting device can be provided with two supporting parts to respectively support the edge skins on both sides of the silicon rod.

In some embodiments, the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin Disengage the edge skin support mechanism.

In some embodiments, the edge and skin dislocation mechanism is disposed on the machine base or the silicon rod cutting device at a predetermined interval relative to the cutting wire saw along a first direction, wherein the first direction is parallel to the axis of the silicon rod direction. It should be understood that when the cutting wire saw penetrates the silicon rod, an edge skin independent of the silicon rod can be formed. At this time, an end surface of the edge skin supported by the supporting portion is aligned with the cutting wire saw in the first direction. By determining the distance between the edge skin dislocation mechanism and the cutting wire saw in the first direction, the distance that the edge skin is pushed can be determined by the displacement amount of the edge skin dislocation mechanism moving in the first direction.

The edge skin dislocation mechanism can be set on the machine base or the silicon rod cutting device, and in a specific scenario, it can be determined based on the silicon rod cutting and grinding integrated machine. For example, if the position of the silicon rod cutting device in the first direction does not change during the processing of the silicon rod, the edge and skin dislocation mechanism can be arranged on either the machine base or the silicon rod cutting device; when the silicon rod is cut and ground into one piece The position of the silicon rod cutting device in the machine in the first direction is not a fixed value in different processing states or cutting processes. For example, the silicon rod cutting device moves along the first direction to realize feeding and cutting of the silicon rod, and the edge skin can be cut. The dislocation mechanism is set in the silicon rod cutting device.

It should be understood that the axial direction of the silicon rod to be cut is along the first direction, and the edge skin formed during cutting is also along the first direction in the supported state. The edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin The skin moves relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transfer process can be performed on the edge skin.

In some embodiments, the side skin dislocation mechanism includes: a power source; and a telescopic rod, which is arranged along the first direction and is used for telescopic movement driven by the power source to push the side skin.

In an implementation manner, the power source of the side skin dislocation mechanism is an air cylinder or a hydraulic pump, wherein the telescopic rod of the air cylinder or the hydraulic pump is arranged along the first direction. For example, in the embodiment shown in FIG. 5 or FIG. 6 , the silicon rod cutting device is provided with two parallel wire cutting units, and the edge skin discharging device includes two edge skin dislocation mechanisms, which are respectively installed in the cutting device. The left side line cutting unit and the right side line cutting unit of the frame, the edge skin dislocation mechanism is an air cylinder with a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the edge skin end surface. After the cutting wire saw penetrates the silicon rod to form an independent edge skin, the edge skin dislocation mechanism moves in the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin support mechanism or Detach the silicon rod after cutting. Here, the telescopic range of the telescopic rod of the edge-skin dislocation mechanism may be determined based on the length specification of the silicon rod, or determined based on the span of the support part in the edge-skin support mechanism in the first direction, so as to control the edge and skin The travel of the skin being pushed in the first direction ensures that the edge skin can be disengaged.

Of course, it should be understood that the specific structure and position of the edge and skin dislocation mechanism are not limited to the embodiments shown in FIG. 5 and FIG. 6 . For example, in some examples, the edge skin dislocation mechanism may also be provided on the silicon rod. The base of the cutting and grinding machine. At the same time, the edge skin dislocation mechanism can be applied to different types of support parts. Generally, the edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin disengage from the support part. The specific form of the supporting portion is not necessarily limited to the embodiment shown in FIG. 5 and FIG. 6 .

In some embodiments, the edge skin unloading device further comprises a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area. Here, the discharge area is the side skin discharge area.

In one embodiment, the position of the edge skin conveying structure in the second direction can be set to be aligned with the silicon rod cutting device in the integrated silicon rod cutting and grinding machine, so that the edge skin formed by cutting the silicon rod can be formed by the corresponding edge skin. The edge skin conveying structure is conveyed, thereby reducing the transfer of the edge skin.

The direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin discharge area.

In one embodiment, the edge skin discharge area and the cutting area are disposed adjacent to the first direction, and here, the edge skin conveying structure can be disposed along the first direction, and is connected to the silicon rod cutting device, So that after the silicon rod is cut to form the edge skin, the edge skin is pushed in the first direction to be separated from the cut silicon rod or the edge skin support mechanism and then transferred to the edge skin conveying structure, which can simplify the transportation of the edge skin path. The number of the edge skin conveying mechanisms may also be determined according to the number, structure or working mode of the silicon rod cutting devices in the integrated silicon rod cutting and grinding machine. For example, when the integrated silicon rod cutting and grinding machine is provided with different processing locations , wherein a plurality of processing areas are provided with silicon rod cutting devices, and the edge skin conveying mechanism can be correspondingly set on a plurality of processing areas to correspond to the silicon rod cutting devices; another example, when the silicon rod cutting devices can simultaneously A silicon rod is squared and cut, and there are multiple edge skin conveying mechanisms, so that each edge skin conveying mechanism corresponds to one silicon rod.

In some embodiments, the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move to convey the edge skin.

The conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried side skins along the first direction. The moving direction of the conveying part can be set to be toward the direction of the edge skin discharge area, so as to transport the carried edge skin to the edge skin discharge area.

The conveying driving source is, for example, a motor, which is used to drive the conveying part to move and control the conveying speed of the conveying part.

In some examples, in order to prevent the edge skin from being worn due to collision during the conveying process, in some embodiments, the conveying part is provided with a buffer pad for contacting the edge skin, or, the conveying part Made of cushioning material. The cushioning pad or cushioning material is, for example, elastic rubber, silicone or other materials with elastic deformation, damping properties or cushioning properties. In this way, the risk of breakage of the side skin during transportation is reduced, which is beneficial to the reuse of the side skin.

Here, the present application provides an embodiment in which the integrated silicon rod cutting and grinding machine is provided with an edge strip discharging device, and the edge strip discharging device includes an edge strip supporting mechanism, and the supporting part is driven by a driving source to abut the edge strip to realize For the support of the edge skin, in the process of square-cutting the horizontal silicon rod, the edge skin support mechanism can prevent the edge skin from collapsing through the supporting function of the support part. The support portion can be used to receive the edge skin to prevent the edge skin from falling, so that a complete edge skin can be formed to assist in the subsequent process of edge skin transfer; in some examples, the edge skin discharge device is also provided with edge skin dislocation The mechanism can be used to push the edge skin along the first direction to make the edge skin detach from the support part, and the edge skin can also be transported from the support part to the unloading area by the edge skin conveying mechanism, so as to realize the unloading of the edge skin removal and subsequent transfer.

The integrated silicon rod cutting and grinding machine in the embodiment of the present application further includes a silicon rod grinding device, and the silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the silicon rod on the first transfer channel. Grinding is performed on the cut silicon rod held by the first transfer device or the cut silicon rod held by the second transfer device on the second transfer channel.

The silicon rod grinding device includes at least a pair of grinding tools, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp, so that the silicon rod grinding device can be ground during grinding. During operation, it can be set to a fixed state to realize the relative feeding between the abrasive tool and the silicon rod.

In one embodiment, the silicon rod grinding device includes a grinding tool mounting seat, at least one pair of grinding tools, a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.

The grinding tool mounting seat is used to set at least one pair of grinding tools. Here, the specific structure of the grinding tool mounting seat can be set in different forms based on the arrangement requirements of the grinding tools, for example, a beam body, a plate frame, and the like.

In some embodiments, the at least one pair of abrasive tools is erected on the abrasive tool mounting seat, or, the at least one pair of abrasive tools is erected on the abrasive tool mounting seat through a bracket, a connecting plate, or a mounting frame, Here, the carrier for arranging the at least one pair of abrasives can be in different forms, which is not limited in this application.

The abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction, so as to adjust the distance between two abrasive tools in the at least one pair of abrasive tools in the second direction The relative distance, and then control the feed amount during the grinding process also determines the grinding amount. According to the grinding requirements, one or two grinding tools in at least one pair of grinding tools are driven to move a predetermined distance in the second direction by the grinding tool advancing and retracting mechanism, and the feeding amount is adjusted. In this way, the first silicon rod holder or The second silicon rod holder drives the silicon rod to move in the first direction and contacts with at least one pair of grinding tools of the silicon rod grinding device and feeds relatively to realize the grinding of the silicon rod.

The abrasive tool conversion mechanism is used to drive the abrasive tool mounting seat and at least a pair of abrasive tools on it to switch between the first transfer channel and the second transfer channel, so that the at least one pair of abrasive tools is connected to the first transfer channel. The silicon rod held by the first silicon rod holder is subjected to grinding operation or the silicon rod held by the second silicon rod holder on the second transfer channel is ground.

Please refer to FIG. 7 , which is a schematic structural diagram of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application. 1 and 7 , as shown in FIGS. 1 and 7 , the silicon rod grinding device 5 includes a grinding tool mounting seat 51 , at least one pair of grinding tools 53 , a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.

The grinding tool mounting seat 51 is arranged on the second processing area of the silicon rod processing platform, and is used to install at least one pair of grinding tools 53 . In certain embodiments, the tool mount 51 spans the width dimension of the silicon rod processing platform in the second direction.

The at least one pair of grinding tools 53 are disposed on the grinding tool mounting seat 51 , and the at least one pair of grinding tools appear to be opposite to each other in the second direction. In some implementations, any one of the grinding tools 53 can be mounted on the grinding tool mounting seat 51 through a grinding tool support.

In certain embodiments, any one of the abrasive tools includes a rotating shaft and a grinding wheel. The grinding wheel has a certain particle size and roughness, and the two grinding wheels arranged opposite to each other are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod.

In the embodiments of the present application, any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other. For example, the rough grinding wheel is nested within the fine grinding wheel, or, the fine grinding wheel is nested within the rough grinding wheel.

In some embodiments, please refer to FIG. 8 , which is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application. As shown in FIG. 8 , the grinding tool 53 includes a grinding head seat 531 and a rough grinding wheel 533 and a fine grinding wheel 535 arranged on the grinding head seat 531 , wherein the rough grinding wheel 533 is nested in the fine grinding wheel In the wheel 535, the fine grinding wheel 535 is larger than the rough grinding wheel 533, the fine grinding wheel 535 is circular and the middle is empty (ie, a ring structure), and the rough grinding wheel 533 can be The circular structure or the rough grinding wheel 533 may be circular with a hollow center (ie, a ring structure). Generally, whether it is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The grinding wheel has a certain grain size and density, and there are pores in the grinding wheel. The abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding. The wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding The wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel. Alternatively, when the rough grinding wheel is nested in the fine grinding wheel, a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding. The wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.

In certain embodiments, the fine grinding wheel is nested within the rough grinding wheel, the rough grinding wheel is larger than the fine grinding wheel, and the rough grinding wheel is circular with an empty center (ie , ring structure), the fine grinding wheel may be a circular structure or the fine grinding wheel may be circular with an empty center (ie, a ring structure). Generally, whether it is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The grinding wheel has a certain grain size and density, and there are pores in the grinding wheel. The abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding. The wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding The wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel. Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding. The wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.

The abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction. The abrasive tool advancing and retracting mechanism controls at least one abrasive tool in the at least one pair of abrasive tools to move along the second direction, so as to adjust the relative distance between the two abrasive tools in the at least one pair of abrasive tools in the second direction, Further, controlling the feed amount during the grinding process also determines the grinding amount.

For example, each pair of grinding tools is equipped with a grinding tool advancing and retracting mechanism. In one embodiment, the grinding tool advancing and retreating mechanism includes an advancing and retreating guide rail and an advancing and retreating drive unit. In the embodiment shown in FIG. 1 and FIG. 3 , the advancing and retreating mechanism of the abrasive tool includes an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawings), wherein the advancing and retreating guide rail is arranged on the abrasive tool along the second direction. On the first mounting side of the mounting seat, the bottom of the grinding tool is provided with a guide groove structure or a guide block structure along the second direction that cooperates with the advancing and retreating guide rails. The advancing and retreating driving unit may further include, for example, a ball screw and a driving motor, the ball screw is arranged along the advancing and retreating guide rail, and the ball screw is associated with a corresponding grinding tool and is axially connected with the driving motor.

In an embodiment of the present application, one of the at least one pair of abrasives is configured with a ball screw and a drive motor, the ball screw is disposed along the second direction and is associated with the one abrasive. In this way, the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools. The grinding distance between them (or adjust the grinding feed), or, use the drive motor to drive the ball screw to rotate in the opposite direction so that the grinding tool associated with the ball screw is along the back of the advance and retreat guide rail. Move to another grinding tool opposite to increase the grinding distance between the two grinding tools.

In an embodiment of the present application, each abrasive tool in the at least one pair of abrasive tools is configured with a ball screw and a drive motor, and for each abrasive tool, the ball screw and the ball screw are arranged along the The second direction is disposed and associated with the abrasive tool. In this way, the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools. The grinding distance between them (or adjust the grinding feed), or, use the drive motor to drive the ball screw to rotate in the opposite direction so that the grinding tool associated with the ball screw is along the back of the advance and retreat guide rail. Move to another grinding tool opposite to increase the grinding distance between the two grinding tools.

In an embodiment of the present application, two grinding tools in the at least one pair of grinding tools share a ball screw and a driving motor. Direction setting, the body of the bidirectional screw rod is provided with two threads with opposite directions of rotation. The two-way screw rotates, so that the two grinding tools associated with the two-way screw move toward or away from each other along the advancing and retreating guide rails based on a certain cooperative relationship. For example, if the drive motor drives the two-way screw to rotate in the forward direction, then the two associated abrasives are driven to move toward each other along the heavy vertical line (that is, move closer to each other), reducing the grinding distance between the two abrasives (or adjusting the grinding distance). Feed amount), or, the drive motor drives the screw to rotate in the opposite direction, then the two associated abrasives are driven to move away from each other (ie, move away from each other) along the heavy vertical line, increasing the difference between the two abrasives. grinding distance between.

In an embodiment of the present application, the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.

In the embodiment of the present application, the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction. The width dimension of the bar processing platform. The first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction. The second transfer passage passes through the first processing location and the second processing location in the first direction. In the embodiment of the present application, the silicon rod grinding device includes a grinding tool mounting seat and at least one pair of grinding tools disposed on the grinding tool mounting seat, and the at least one grinding tool can be driven by the grinding tool conversion mechanism. moving the pair of abrasive tools in the second direction to switch between the first transfer channel and the second transfer channel, for example, using the grinding conversion mechanism to drive the at least one pair of abrasive tools on the abrasive tool mount in the second direction Move to be converted from the first transfer channel to the second transfer channel, or, use the grinding conversion mechanism to drive the at least one pair of grinding tools to move on the grinding tool mounting seat in the second direction to be converted from the second transfer channel to on the first transfer channel.

In one embodiment, the grinding tool conversion mechanism includes: a grinding tool conversion guide rail and a grinding tool conversion driving unit.

The grinding tool conversion guide rail is arranged along the second direction for setting the grinding tool. In some embodiments, the grinding tool conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the at least one pair of grinding tools is mounted on the grinding tool conversion guide rail through a slider, for example.

An abrasive tool conversion driving unit is used for driving the at least one pair of abrasive tools to move along the abrasive tool conversion guide rail.

In some embodiments, the grinding tool conversion driving unit includes: a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and is parallel to the grinding tool conversion guide rail. Wherein, the moving rack is fixed on the silicon rod processing platform, is set to approximately the same first direction dimension as the grinding tool conversion guide rail, and is parallel to and adjacent to the grinding tool conversion guide rail.

The driving gear is arranged on the grinding tool mounting seat and meshes with the moving rack, so as to drive the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The drive source is used to drive the drive gear. In an implementation manner of the present application, the drive gear is provided on the abrasive tool mounting seat, the drive gear is driven to rotate by a drive source, and the gear teeth of the drive gear mesh with the moving rack, conforming to the The moving rack travels, whereby at least one pair of abrasives connected to the drive gear produces a corresponding movement on the abrasive transition rails.

In some embodiments, the grinding tool conversion drive unit may be disposed on the grinding tool mounting seat, and includes a moving screw and a driving source, wherein the moving screw is disposed along the second direction and is connected with the at least A pair of abrasive tools is associated, and the driving source is used to drive the moving screw to rotate so as to make the associated at least one pair of abrasive tools move along the abrasive tool conversion guide rail.

As mentioned above, the abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool of the at least one pair of abrasive tools to move in the second direction, and the abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move along the second direction. It is converted between the first transfer channel and the second transfer channel in the second direction. Therefore, in some embodiments, the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism can be combined into one, that is, a set of The driving mechanism realizes the functions of the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism.

When the grinding tool is used to grind the silicon rod located at the second processing area, the grinding tool in the at least one pair of grinding tools is driven by the grinding tool advancing and retracting mechanism of the grinding tool to move in the second direction, so as to determine the grinding tool. The feed amount for grinding the grinding surface of the tool and the silicon rod, the at least one pair of grinding tools is driven by the grinding tool traveling mechanism to move along the horizontal line until the entire silicon rod is passed through, and the grinding tool traveling mechanism can also drive the grinding tool if necessary. At least one pair of abrasive tools reciprocates along the horizontal line to ensure sufficient grinding of the silicon rod in the length direction. The feed amount for grinding the grinding surface. In the embodiment shown in FIG. 1 and FIG. 3 , at least one pair of the abrasives is disposed opposite to each other along the second direction, and the grinding surfaces of the at least one pair of abrasives are located in opposite vertical planes , wherein the vertical plane is perpendicular to the horizontal line, and when grinding the silicon rod (the cut silicon rod 102 shown in FIG. 3 ), the grinding wheel advancing and retreating mechanism is used to drive the at least one pair of grinding tools. At least one grinding tool moves up and down along the second direction to adjust the feed amount, so as to grind the left and right sides of the silicon rod along the second direction.

In an embodiment of the present application, the silicon rod grinding device can also be used to perform a chamfering operation on the silicon rod.

In some embodiments, any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other, and the silicon rod can be chamfered by the fine grinding wheel.

In some embodiments, the silicon rod grinding device further includes a chamfering device, and the chamfering device further includes at least a pair of chamfering grinders and a chamfering grinder advancing and retreating mechanism. Each chamfering grinder in the at least one pair of chamfering grinders is arranged adjacent to the grinder, and two chamfering grinders in the at least one pair of chamfering grinders are oppositely arranged on the grinder installation On the seat, the grinding surfaces of the at least one pair of chamfering grinders are located in opposite vertical planes, that is, the grinding surfaces of the two chamfering grinders in the at least one pair of chamfering grinders are respectively located in the first vertical plane. face inward and second vertical face inward.

Regarding the chamfering grinder, in some implementations, the chamfering grinder includes a chamfering grinding wheel and a rotating motor connected to the chamfering grinding wheel. The chamfering grinding wheel has a certain particle size and roughness, and the two oppositely arranged chamfering grinding wheels in the at least one pair of chamfering grinding tools are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod, in some embodiments , the chamfering grinding wheel is circular. Since the chamfering grinder is used to chamfer the edge of the silicon rod, the amount of grinding required for the edge of the silicon rod is smaller than that of the side surface of the silicon rod. Therefore, the chamfering grinding wheel used as a chamfering grinder The size of the can be set to be smaller than the size of the rough grinding wheel as a rough grinding tool (or the fine grinding wheel as a fine grinding tool). The chamfering grinding wheel is formed by the consolidation of abrasive grains and a binding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The chamfering grinding wheel has a certain size and density of abrasive grains, and at the same time, the chamfering grinding wheel has pores. The abrasive of the chamfering grinding wheel can be set to abrasive grains whose hardness is greater than that of silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. The rotating motor is connected with the chamfering grinding wheel through a rotating shaft, and is used for driving the chamfering grinding wheel to rotate at a predetermined rotational speed.

The chamfering grinder advancing and retracting mechanism is used to drive at least one chamfering grinder of the at least one pair of chamfering grinders to move in the second direction. The chamfering grinder advancing and retreating mechanism controls at least one chamfering grinder in the at least one pair of chamfering grinders to move along the second direction, so as to adjust one of the two chamfering grinders in the at least one pair of chamfering grinders. The relative distance between them in the second direction, and then controlling the feed amount during the grinding process, also determines the grinding amount.

When using the chamfering grinder to perform chamfering work on the silicon rod located at the second processing area, the chamfering grinder in the at least one pair of chamfering grinders is driven by the chamfering grinder advancing and retracting mechanism of the chamfering grinder. The grinding tool moves in the second direction to determine the feed amount of the chamfering tool and the edge of the silicon rod. The silicon rod is driven by the first silicon rod holder or the second silicon rod holder to move in the first direction until the whole silicon rod is completely Through the chamfering grinding tool, if necessary, the first silicon rod holder or the second silicon rod holder can drive the silicon rod to reciprocate in the first direction to ensure that it is fully ground in the length direction of the silicon rod. The clamping part rotating mechanism in the silicon rod clamp or the second silicon rod clamp drives the clamping part to rotate to drive the clamped silicon rod to rotate a declination angle, and at least a pair of oppositely arranged at least one pair is driven by the chamfering tool advancing and retreating mechanism The chamfering grinder moves in the second direction to determine the feed amount of the chamfering grinder and the edge grinding of the silicon rod.

In an embodiment of the present application, at least one of the first silicon rod holder and the second silicon rod holder may be further configured with a grinding repair device for grinding the corresponding grinding tool, that is, grinding the corresponding rough grinding The rough grinding tool in the device, the finishing grinding tool in the corresponding finishing grinding device, or the rough grinding grinding tool in the corresponding rough grinding device and the finishing grinding tool in the finishing grinding device. Using the grinding and repairing device, by grinding and repairing the grinding tool, it can be ensured that the grinding tool can achieve the required precision after the grinding tool is used for grinding the silicon rod.

In an implementation manner, the grinding and repairing device includes an installation body and at least one grinding part, the installation body can be set on the silicon rod holder, the at least one grinding part is set on the installation body, and is used for for grinding the corresponding at least one grinding tool. Please refer to FIG. 4 , the mounting body 56 of the grinding and repairing device is disposed on at least one clamping arm of the silicon rod holder, for example, the first clamping arm 213 of the first silicon rod holder 21 or the second clamping arm 213 of the second silicon rod holder 31 The clamping arm 313 is provided with a grinding part 58 on two opposite sides of the mounting body 56 respectively. Taking the use of the grinding and repairing device for grinding the fine grinding tools in the fine grinding device as an example, the fine grinding device includes a pair of fine grinding tools, and the opposite pair of fine grinding tools are arranged along the second direction. Move to the outside of the grinding part, and drive the silicon rod holder to move along the horizontal line to make the two repair parts on both sides of the installation body reciprocate along the first direction. In this state, a pair of The refining abrasives approach (eg, along the second direction) the dressing portion toward each other to contact the surface of the dressing portion to achieve grinding.

The grinding part can be, for example, a whetstone. Here, the whetstone is, for example, diamond whetstone, boron carbide whetstone, refined whetstone, common whetstone, and the like. The whetstone can adjust the surface of the grinding tool in contact with the grain size of the whetstone surface. In the grinding process, the surface of the whetstone contacts the grinding tool, and the surface of the grinding tool is trimmed to a uniform particle size and the flatness and verticality of the grinding tool plane are improved.

In an embodiment of the present application, the silicon rod grinding device further includes a cooling device to cool the at least one pair of grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and use of the grinding wheel. life. In an implementation of this embodiment, the cooling device includes a cooling water pipe, a guide groove and a guide hole. In some embodiments, the outer periphery of the grinding wheel is provided with a protective cover for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected to the cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is arranged on the protective cover as a contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling tank. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water pumped through the cooling water pipe is directed to the guide grooves and guide holes on the surface of the grinding wheel, and is guided directly to the grinding wheel and the ground silicon rod. The contact surface of the grinding wheel is cooled. During the grinding of the grinding wheel, the cooling water from the rotating guide hole of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.

In an embodiment of the present application, the integrated silicon rod cutting and grinding machine further includes a silicon rod transfer device, which is arranged at the loading area of the silicon rod processing platform and is used for transferring the silicon rod to be processed to the silicon rod The first processing location of the processing platform.

In the present application, the silicon rod transfer device can move the silicon rod to be processed from the loading area to the first processing area and can make the silicon rod complete the centering operation before the cutting operation.

Please refer to FIG. 9 , which is an enlarged schematic view of A in FIG. 1 . The silicon rod cutting and grinding integrated machine includes a silicon rod transfer device, and the silicon rod transfer device includes: a silicon rod bearing structure, a centering adjustment mechanism, and a feeding drive mechanism.

The silicon rod supporting structure is used to carry the silicon rod to be processed. In an embodiment of the present application, the silicon rod supporting structure is used to carry the silicon rod to be processed. In the embodiment shown in FIG. 9 , the silicon rod carrying structure 71 includes a carrying base and a first loading part and a second loading part oppositely arranged along the second direction, wherein the first loading part and the second loading part cooperate to use In order to carry the silicon rods to be processed, and each of the first loading part and the second loading part can be provided with a plurality of rollers arranged in the first direction, so that a row of rollers on the first loading part and the second loading part A row of rollers on the upper part is used to carry the silicon rods together. In other embodiments, the silicon rod supporting structure may be, for example, a plate-like structure as a whole, such as a rectangular supporting plate, the rectangular supporting plate may be provided with a certain arc or a depression, and the rectangular supporting plate may There are pillow strips, which can be made of flexible materials, such as rubber, acrylic, plastic, etc., in order to protect the loaded silicon rods.

The silicon rod transfer device disclosed in the present application can adjust the position of the silicon rod carried by the silicon rod carrying structure through the centering adjustment structure, so that the axis line of the silicon rod corresponds to the predetermined center line.

As mentioned above, the centering operation specifically refers to making the axis line of the silicon rod and the clamping center line of the first silicon rod holder or the second silicon rod holder on the same straight line, that is, the The axis line coincides with the clamping center line of the first silicon rod holder or the second silicon rod holder. In an implementation manner, the first silicon rod holder is the same as the second silicon rod holder, and the clamping centerline of the first silicon rod holder and the clamping centerline of the second silicon rod holder are in the direction of the re-perpendicular line Consistent. In another implementation manner, the first silicon rod holder and the second silicon rod holder may be different, and the clamping center line of the first silicon rod holder and the clamping center line of the second silicon rod holder are on the heavy vertical line inconsistent in direction.

In practical applications, taking the first silicon rod holder as an example, the clamping centerline of the first silicon rod holder (or the clamping centerline of the second silicon rod holder) can be pre-determined, and based on the clamping centerline of the first silicon rod holder The center line (or the clamping center line of the second silicon rod holder) determines a predetermined center line, wherein the predetermined center line and the clamping center line of the first silicon rod holder (or the clamping center line of the second silicon rod holder) centerline) are the same in the direction of the re-perpendicular line (ie, the height is the same). Therefore, the centering adjustment mechanism is used to adjust the position of the silicon rod to be processed so that its axis line corresponds to the predetermined center line, and is used to adjust the position of the silicon rod to be processed in the direction of the heavy vertical line So that its axis line is consistent with the predetermined center line in the direction of the heavy vertical line.

Regarding the centering adjustment mechanism, in an embodiment of the present application, the centering adjustment mechanism includes a vertical lifting mechanism for driving the silicon rod bearing structure and the silicon rods it carries to perform vertical lifting and lowering motions So that the axis line of the silicon rod is aligned with the predetermined center line in the direction of the heavy vertical line.

In some embodiments, the vertical lift mechanism as the centering adjustment mechanism further comprises: a vertical lift guide rail, a sliding block, and a vertical lift drive unit.

The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rail. The above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure. When using the vertical lift drive unit, the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod bearing structure to move up along the vertical lift guide rail, or the drive motor drives the connected The screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a descending action along the vertical lifting guide rail.

Of course, other changes can be made to the vertical lift drive unit. For example, in one embodiment, the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor. When using the vertical lift drive unit, the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod supporting structure to move up along the vertical lift guide rail, or , the drive motor drives the drive gear to rotate in the reverse direction, and then drives the lift rack and its connected silicon rod bearing structure to perform a descending action along the vertical lift guide rail.

In some embodiments, the vertical lift mechanism includes: a vertical lift guide rod and a vertical lift drive unit.

The vertical lift guide rod can be arranged on the bearing base of the silicon rod carrying structure along the direction of the heavy vertical line. For example, the silicon rod transfer device further includes a mounting structure, and the vertical lift guide rod is arranged on the mounting structure. on and through the carrier base of the silicon rod carrier structure. In order to ensure the stability of the lifting and lowering movement of the silicon rod loading support structure along the vertical lifting guide rods, the number of the vertical lifting guide rods can be multiple, for example, the vertical lifting guide rods can be four, corresponding to The four corners of the bearing base in the silicon rod bearing structure. Of course, the number of vertical lift guide rods can also be other, for example, three, five, six, or more, taking three as an example, the three vertical lift guide rods can be arranged in the form of an isosceles triangle, for example , taking five as an example, the five vertical lift guide rods can be based on the layout of the aforementioned four vertical lift guide rods, and another vertical lift guide rod can be added in the central area, and so on.

The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rod. The above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure. When using the vertical lift drive unit, the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod supporting structure to move up along the vertical lift guide rod, or the drive motor drives the connection The screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a downward movement along the vertical lifting guide rod.

Of course, other changes can be made to the vertical lift drive unit. For example, in one embodiment, the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor. When using the vertical lift drive unit, the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod bearing structure to move up along the vertical lift guide rod, Alternatively, the driving motor drives the driving gear to rotate in the opposite direction, and then drives the lifting rack and its connected silicon rod supporting structure to perform a downward movement along the vertical lifting guide rod.

In addition, the vertical lift drive unit may further include an auxiliary lift assembly, and the auxiliary lift assembly further includes a cylinder and a lift rod connected to the cylinder, wherein the cylinder may be arranged on the installation structure, and the lift rod is connected to the cylinder. Connected and associated with the carrier base in the silicon rod carrier structure. The association between the lifting mandrel and the bearing base in the silicon rod bearing structure can be implemented in various ways. For example, in one implementation, the lifting mandrel is connected to the bearing base, and in another The lifting top rod is kept in contact with the bearing base. In this way, when the vertical lift drive unit is used, the adjusted auxiliary lift assembly can assist the carrying base to perform the lifting action along the vertical lift guide rod, thereby ensuring the stability of the carrying base in the lifting action.

In the present application, using the aforementioned vertical lifting mechanism as the centering adjustment mechanism, by driving the silicon rod carried by the silicon rod supporting structure to perform vertical lifting motion, the axis line of the silicon rod can be aligned with the predetermined center line. Aligned in the direction of the heavy vertical line, wherein the predetermined center line can be obtained according to the clamping center of the first silicon rod holder or the clamping center of the second silicon rod holder. Generally, due to the clamping of the first silicon rod holder The center or the clamping center of the second silicon rod clamp is determined, so the predetermined center line is also determined (if the clamping center line of the first silicon rod clamp and the clamping center line of the second silicon rod clamp If the vertical line direction is inconsistent, it may include a first predetermined center line corresponding to the clamping center line of the first silicon rod holder and a second predetermined center line corresponding to the clamping center line of the second silicon rod holder). In this way, when using the vertical lifting mechanism, in order to ensure the lifting value of the silicon rod carried by the driving silicon rod bearing structure in the direction of the heavy vertical line, it is also necessary to determine the current size of the silicon rod in the direction of the heavy vertical line or the size of the silicon rod. The height difference between the clamping center of the first silicon rod holder or the clamping center of the second silicon rod holder in the direction of the heavy vertical line. Therefore, in an embodiment of the present application, the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line.

The silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the center area of the silicon rod supporting structure in the first direction .

As shown in FIG. 9 , the silicon rod transfer device may further include a centering adjustment mechanism 73, and the centering adjustment mechanism 73 may include: a bracket 731, an adjustment guide rail 733 arranged on the bracket, relatively arranged on both sides of the bracket and capable of The two ejectors 735 that move relatively on the adjustment guide rail and the ejection drive unit, wherein the adjustment guide rail 733 is arranged along the first direction, and the two ejection members 735 are arranged on the adjustment guide rail and are respectively arranged opposite to each other. On both sides of the bracket, the ejector drive unit further includes a bidirectional screw and a drive source, wherein the bidirectional screw is arranged along the first direction and two ejectors are screwed at both ends, and the drive source is connected to the drive source. The two-way screw connection is used to drive the two-way screw to rotate so that the two ejectors 735 move toward each other or move toward each other along the first direction. When the centering adjustment mechanism disclosed in the embodiment is used, the driving source drives the bidirectional screw to rotate in the forward direction, so that the two ejectors are along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) Move toward each other to perform the closing action, or make the driving source drive the two-way screw to rotate in the opposite direction, so that the two ejectors move opposite to each other along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) to perform the closing operation. open action. The control source may be, for example, a servo motor.

It can be seen from the above that the position of the silicon rod carried on the silicon rod carrying structure in the first direction is pushed up by the two ejector members by using the centering adjustment mechanism, so that the silicon rod is adjusted to the center area of the silicon rod carrying structure.

As mentioned above, the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line. As shown in the figure, in the embodiment of the present application, the centering adjustment mechanism includes a height detector, and the height detector is configured on the centering adjustment mechanism. For example, a height detector is arranged on the adjustment guide rail of the centering adjustment mechanism, which can be controlled by a control source (eg, a servo motor) to perform movement along the vertical direction and the first direction and/or the second direction. In one implementation, the height detector may be, for example, a touch sensor or a ranging sensor. Taking a touch sensor as an example, the touch sensor has a probe head for making contact with a silicon rod. In some embodiments, the probe head of the contact sensor can also be provided with a telescopic spring. When the probe head contacts the silicon rod, it can retreat under the drive of the telescopic spring, which can be used to protect the probe head and avoid detection. The head is damaged by hard touching or pressing.

It can be seen from the above that using the height detector, the height of the silicon rod can be obtained after multi-point detection of the silicon rod, and then the position information of the axis line of the silicon rod in the direction of the heavy vertical line can be obtained, so as to facilitate the subsequent use of centering. The adjustment mechanism adjusts accordingly.

The silicon rod transfer device also includes a silicon rod clamping mechanism, the silicon rod clamping mechanism is arranged on the silicon rod carrying structure, and is used for clamping the silicon rod carried by the silicon rod carrying structure, and makes the axial center of the silicon rod. The line corresponds to the centerline of the silicon rod carrying structure. In an embodiment of the present application, the silicon rod clamping mechanism includes: a clamp mounting member and a silicon rod clamping member.

As shown in FIG. 9 , the silicon rod clamping mechanism 75 includes a clamp mounting member 751 and a silicon rod clamping member 753 .

The fixture mounting member 751 is disposed on the silicon rod supporting structure 71 along the first direction.

The silicon rod clamping member 753 is arranged on the clamping member 751 . Wherein, there may be at least two silicon rod clamping members, and the at least two silicon rod clamping members may be arranged along the distance between the fixture mounting members. In some embodiments, each silicon rod clamping member may further include: a clamping arm mounting seat, two clamping arms, and a clamping arm driving mechanism. Wherein, the clamping arm mounting seat is arranged on the clamp mounting member, and the two clamping arms are movably arranged on the clamping arm mounting seat and are oppositely arranged along the second direction, and the clamping arm driving mechanism is used for to drive the two clamping arms to open and close.

In this way, when the silicon rod to be processed is placed on the silicon rod supporting structure, the clamping arms in the two silicon rod clamping members in the silicon rod clamping mechanism are released, and the silicon rod to be processed is located in each silicon rod. Between the two clamping arms in the rod clamping piece, for each silicon rod clamping piece, the clamping arm driving mechanism in the silicon rod clamping piece is used to drive the two clamping arms for clamping action, so that the silicon rod is clamped. clamped.

In some implementations, the clamp arm driving mechanism may include: an opening and closing gear disposed on the clamp arm mounting seat; two racks, each of which is associated with a corresponding clamp arm and is associated with the opener The closing gear is meshed; the driving source is associated with the opening and closing gear, and is used to drive the opening and closing gear to rotate. Wherein, two racks are arranged in parallel, and the opening and closing gear is located between the two racks, and the side of the rack facing the opening and closing gear is provided with teeth. The drive source may be, for example, a servo motor.

In this way, when the two clamping arms are driven by the clamping arm driving mechanism to perform the opening and closing action, the opening and closing gear is driven by the driving source to rotate in the forward direction, thereby driving the two racks meshing with the opening and closing gears and their associated gears. The two clamping arms move toward each other to perform the clamping action, or the driving source drives the opening and closing gear to rotate in the opposite direction, which in turn drives the two racks meshing with the opening and closing gear and the two associated clamping arms to move back to open. action.

Of course, the above-mentioned clamping arm driving mechanism is not limited to this. In other embodiments, the clamping arm driving mechanism can still make other changes. For example, the clamping arm driving mechanism can also use a screw adjustment mechanism, a chain Conveying mechanism, or double-speed chain mechanism, etc.

In addition, in the silicon rod clamping mechanism, at least one silicon rod clamping member in the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving the at least one silicon rod clamping member along the The clamp mount moves to adjust the spacing of the at least two silicon rod clamps.

In one example, the at least two silicon rod clamps are motor-driven chain conveyor mechanisms. The chain conveying mechanism includes: an endless chain and a sprocket for driving the endless chain. The endless chain is arranged along the first direction, and two ends of the endless chain are respectively provided with sprockets, the teeth of the sprockets are engaged with the chain, and drive the chain to run when rotating. One of the two sprockets is used as the drive sprocket, the drive sprocket can be dynamically coupled to the motor shaft, that is, the power output shaft, and the drive sprocket meshes with the sprockets of the two endless chains, and is then driven by the drive. The motor controls the conveying speed of the chain, that is, the speed at which the at least one silicon rod clamping piece on the fixture mounting piece moves can be controlled.

In some other feasible examples, the distance adjustment driving mechanism may also be configured as a double-speed chain mechanism, a transmission belt mechanism, or the like.

The silicon rod transfer device further includes a feeding driving mechanism, which is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.

The feeding drive mechanism is arranged below the silicon rod bearing structure, and includes: a feeding guide rod or a feeding guide rail, and a feeding driving unit, wherein the feeding guide rod or the feeding guide rail is arranged along the second direction for The silicon rod bearing structure is provided, and the feed guide rod or the feed guide rail is arranged across the machine base along the second direction. The feeding and driving unit is used to drive the silicon rod supporting structure to move along the feeding guide rod or the feeding guide rail. In an implementation, the feeding and driving unit includes: a driving motor and a second A lead screw assembly arranged in a direction and driven by a drive motor, the drive motor can be arranged at one end of the lead screw assembly, and the lead screw assembly is controlled by the drive motor and is screwed with the silicon rod bearing structure. In this way, when the feeding drive mechanism is used, the lead screw assembly is driven by the drive motor to rotate in the forward direction, and then the silicon rod bearing structure connected with the lead screw assembly is driven along the feeding guide rod or the feeding guide rail (along the first Two directions) move toward the first processing area, or, the drive motor drives the screw assembly to rotate in the opposite direction, and then drives the silicon rod supporting structure connected with the screw assembly along the feed guide rod or feed guide rail (in the second direction). ) moves towards the loading and unloading area, so that the silicon rods carried by the silicon rod carrying structure are transferred between the loading and unloading area and the first processing area.

The silicon rod transfer device further includes a crystal line detection unit for performing crystal line detection on the silicon rod to be processed to determine the crystal line position of the silicon rod. As shown in FIG. 9 , the crystal wire detection unit 77 can be arranged on the silicon ingot supporting structure or the silicon ingot clamping mechanism. Taking the silicon ingot clamping mechanism as an example, the crystal wire detection unit 77 can be arranged on the silicon ingot clamping mechanism. The clamping member 753, for example, on the clamping arm mounting seat or clamping arm of the silicon rod clamping member 753.

In practical applications, when the aforementioned silicon rod transfer device is used, the specific operation process may roughly include: the silicon rod carrying structure is located at the initial position of the loading and unloading area, and the silicon rod to be processed is placed on the silicon rod carrying structure; The adjusting mechanism adjusts the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the central area of the silicon rod supporting structure in the first direction, and at the same time, the silicon rod clamping mechanism is used to clamp the silicon rod The silicon rod carried by the rod bearing structure makes the axis line of the silicon rod correspond to the center line of the silicon rod bearing structure; the silicon rod is detected by a height detector, and it is obtained that the axis line of the silicon rod is in the direction of the heavy vertical line According to the position information of the axis line of the silicon rod in the direction of the heavy vertical line and the clamping center line of the first silicon rod holder or the second silicon rod holder at the first processing location in the direction of the heavy vertical line position information, determine the difference between the two, and use the vertical lifting mechanism to drive the silicon rod bearing structure and the silicon rod carried by it to perform lifting and lowering in the direction of the heavy vertical line, so that the axis line of the silicon rod and the first processing area are The clamping centerlines of the first silicon rod clamp or the second silicon rod clamp are aligned in the direction of the heavy vertical line; the feeding drive mechanism is used to drive the silicon rod carrying structure and the silicon rods it carries to move along the second direction to the second position. a processing area, so that the first silicon rod clamp or the second silicon rod clamps the silicon rod at the first processing position; the first silicon rod clamp or the second silicon rod clamp is used to drive the silicon rod to rotate at a predetermined speed to make the crystal The line detection unit performs crystal line detection on the silicon rod to determine the crystal line position of the silicon rod. According to the determined crystal line position of the silicon rod, the first silicon rod clamp or the second silicon rod clamp adjusts the clamped silicon rod in place. , complete the loading of silicon rods.

In an embodiment of the present application, the integrated silicon rod cutting and grinding machine further includes a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rod from the silicon rod. The processing platform is unloaded.

The direction and position of the silicon rod unloading device can be determined by the positional relationship of the workpiece unloading area.

In one embodiment, the workpiece unloading areas are disposed adjacent to each other along the first direction. Here, the silicon rod unloading device can be disposed along the first direction, and is connected to the silicon rod grinding device, so that the silicon rod can be After being ground, the ground silicon rod is transported out in the first direction. The number of the silicon rod unloading devices can also be determined according to the number, structure or working mode of the silicon rod grinding devices or the transfer channels in the integrated silicon rod cutting and grinding machine, for example, in the embodiment shown in FIG. 1 and FIG. 3 . middle,

When the integrated silicon rod cutting and grinding machine is provided with a first transfer channel and a second transfer channel, the silicon rod grinding device can be switched between different transfer channels and perform grinding operations on the silicon rods on the different transfer channels. In this embodiment, the silicon rod unloading devices can be set to two corresponding to the transfer channels, and each silicon rod unloading device is connected to one transfer channel, so that each silicon rod unloading device can be connected to the corresponding transfer channel. The silicon rod is unloaded, or, in another embodiment, as shown in the silicon rod cutting device and the silicon rod grinding device, only one silicon rod unloading device is provided, and the silicon rod unloading device can be used for example by an unloading conversion mechanism. The transfer channel and the second transfer channel are switched, so that the silicon rod unloading device can unload the silicon rods on different transfer channels.

In certain embodiments, the silicon rod unloading device may employ a silicon rod conveying device.

The silicon rod conveying device can be, for example, a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the silicon rod conveying mechanism includes: a conveying part for carrying the silicon rod; and a conveying driving source for driving the conveying part to move to convey the silicon rod.

The conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried silicon rods along the first direction. The moving direction of the conveying part may be set to be toward the workpiece unloading area, so as to transport the carried silicon rods to the workpiece unloading area.

In some examples, in order to prevent the silicon rods from being worn due to collision during the conveying process, in some embodiments, the conveying part is provided with a buffer pad for contacting the silicon rods, or the conveying part is Made of cushioning material. The cushioning pad or cushioning material is, for example, elastic rubber, silica gel, or other materials with elastic deformation, damping properties or cushioning properties, so as to reduce the risk of damage of the silicon rod being transported.

In certain embodiments, the silicon rod unloading device may employ a silicon rod pinch device.

The silicon rod clamping device includes: a clamping part for clamping the silicon rod; and a conveying driving source for driving the clamping part to move to convey the silicon rod.

The clamping portion may be disposed along the first direction for clamping two end faces of the silicon rod, and transporting the carried silicon rod along the first direction under the driving of the conveying driving source.

The conveying driving source is, for example, a motor, which is used to drive the gripping part to move and control the conveying speed of the gripping part.

Here, the silicon rod cutting and grinding integrated machine disclosed in this application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, A first transfer device and a second transfer device are provided that penetrate the first processing area and the second processing area at the same time, and the silicon rod clamp and the driving mechanism are respectively configured for the first and second transfer devices, and the first and second transfer devices are controlled by coordination. The transfer device, the silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the multi-process of squaring and grinding the silicon rod It can improve the production efficiency and the quality of product processing operations.

When using the integrated silicon rod cutting and grinding machine in the embodiment shown in FIG. 1 and FIG. 2 to process the silicon rod, the specific process can be roughly as follows:

The first silicon rod is placed on the silicon rod transfer device 7 located at the loading and unloading area.

The first silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the first silicon rod is clamped by the first silicon rod holder 2 located on the first transfer channel in the first processing area to complete the loading. Wherein, the axis line of the first silicon rod and the clamping center line of the first silicon rod holder 2 are on the same straight line. At this time, the silicon rod cutting device 4 is located on the first transfer channel, and the silicon rod grinding device 5 is located on the second transfer channel.

The first silicon rod holder 2 and the first silicon rod held by it are driven to move along the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the first silicon rod. When the first silicon rod is cut by the silicon rod cutting device, the first silicon rod is first cut by two parallel cutting wire saws formed in the silicon rod cutting device, so that the first silicon rod is cut for the first time. The two opposite side cut planes are cut, remove the edge skin left by the cutting, drive the first silicon rod holder to return to the initial position along the first direction, and use the first silicon rod holder to rotate the first silicon rod 90° to adjust the cutting Continue to drive the first silicon rod clamp and the first silicon rod held by it to move in the first direction, so that the silicon rod cutting device cuts the remaining two side sections of the first silicon rod, and removes the remaining two sides of the cutting. The edge skin is formed to form a silicon rod with a rectangular cross-section, and the square of the silicon rod is completed.

The silicon rod cutting device 4 is switched from the first transfer channel to the second channel and the silicon rod grinding device 5 is switched from the second transfer channel to the first channel.

The second silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the second silicon rod is clamped by the second silicon rod holder 3 located on the second transfer channel in the first processing area to complete the loading. Wherein, the axis line of the second silicon rod and the clamping center line of the second silicon rod holder 3 are on the same straight line.

The first silicon rod holder 2 and the first silicon rod held by it are driven to move along the first direction, so that the silicon rod grinding device 5 is used to grind the first silicon rod. In some embodiments, the grinding operation includes a rough grinding operation and a fine grinding operation. For example, the first silicon rod is first subjected to the rough grinding operation by the rough grinding tool in the silicon rod grinding device, and then the silicon rod grinding device is used for rough grinding. The fine grinding tool in the first silicon rod performs fine grinding work. In certain embodiments, the grinding operation includes a rough grinding operation, a fine grinding operation, and a chamfering operation. For example, the first silicon rod is roughly ground by the rough grinding tool in the silicon rod grinding device, and then the first silicon rod is finely ground by the fine grinding tool in the silicon rod grinding device. The fine grinding tool or the chamfering tool in the rod grinding device performs the chamfering operation on the first silicon rod. At the same time, the second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 cuts the second silicon rod to form a silicon rod with a rectangular cross-section. Complete the square of the silicon rod.

Unload the first silicon rod that has completed the grinding operation, switch the silicon rod cutting device 2 from the second transfer channel to the first transfer channel, and switch the silicon rod grinding device 3 from the first transfer channel to the second transfer channel.

The third silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the third silicon rod is clamped by the first silicon rod holder located on the first transfer channel in the first processing area to complete the loading.

The second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod grinding device 5 is used to grind the second silicon rod. At this time, the first silicon rod holder 2 and the third silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the third silicon rod.

Repeat the above operation process to complete the multi-process integrated operation of silicon rod squaring and grinding.

The above-mentioned embodiments merely illustrate the principles and effects of the present application, but are not intended to limit the present application. Anyone skilled in the art can make modifications or changes to the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in this application should still be covered by the claims of this application.

Claims

A silicon rod cutting and grinding integrated machine is characterized in that, comprising:

The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;

The first transfer device, located in the first transfer channel, includes a first silicon rod holder and a first transfer drive mechanism, and the first transfer drive mechanism is used to drive the first silicon rod holder and the silicon rod edge it clamps. moving in the first direction and transferring between the first processing location and the second processing location;

A second transfer device, located in the second transfer channel, includes a second silicon rod holder and a second transfer drive mechanism, the second transfer drive mechanism is used to drive the second silicon rod holder and the silicon rod edge it holds. moving in the first direction and transferring between the first processing location and the second processing location;

The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The silicon rod to be cut held by the second transfer device is cut; and

The silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cut silicon rod held by the second transfer device is subjected to a grinding operation.
The integrated silicon rod cutting and grinding machine according to claim 1, wherein the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device The transfer device is disposed above the silicon rod processing platform through a first mounting frame, and the second transfer device is disposed above the silicon rod processing platform through a second mounting frame.
The integrated silicon rod cutting and grinding machine according to claim 1, wherein the first silicon rod holder comprises:

The first clamp arm mounting seat;

At least a pair of first clamping arms are oppositely arranged on the first clamping arm mounting seat along the first direction, and are used for clamping two end faces of the silicon rod; wherein, the at least one pair of the first clamping arms any one of the first clamping arms is provided with a clamping portion; and

A first clamping arm driving mechanism for driving at least one first clamping arm of at least one pair of first clamping arms to move along the first direction to adjust the clamping distance between the at least one pair of first clamping arms .
The integrated silicon rod cutting and grinding machine according to claim 3, wherein the first transfer driving mechanism comprises:

a first transfer guide rail disposed along a first direction for setting the first clamp arm mount; and

The first transfer driving unit is used for driving the first clamp arm mounting seat and its at least one pair of first clamp arms to move along the first transfer guide rail.
The integrated silicon rod cutting and grinding machine according to claim 4, wherein the first transfer driving unit comprises:

the first moving rack, arranged along the first direction;

a first drive gear, disposed on the first clamp arm mounting seat and engaged with the moving rack; and

A first drive source for driving the drive gear to move the associated first clamp arm mount and its at least one pair of first clamp arms along the first transfer rail.
The integrated silicon rod cutting and grinding machine according to claim 4, wherein the first transfer driving unit comprises:

a first moving screw disposed along a first direction and associated with the first clamp arm mount; and

The first driving source is used for driving the first moving screw to rotate so as to make the associated first clamping arm mounting seat and its at least one pair of first clamping arms move along the first transfer guide rail.
The integrated silicon rod cutting and grinding machine according to claim 3, wherein the at least one pair of the first clamping arms is a rotating structure; the first silicon rod clamp further comprises a first clamping arm rotating mechanism, the The first clamping arm rotation mechanism is arranged on at least one first clamping arm of the at least one pair of first clamping arms, and is used for driving the clamping part of the at least one first clamping arm to rotate.
The integrated silicon rod cutting and grinding machine according to claim 1, wherein the second silicon rod holder comprises:

The second clamp arm mounting seat;

At least a pair of second clamping arms are oppositely arranged on the mounting seat of the second clamping arms along the first direction, and are used for clamping two end faces of the silicon rod; wherein, the at least one pair of the second clamping arms any one of the second clamping arms is provided with a clamping portion; and

A second clamping arm driving mechanism for driving at least one second clamping arm of at least one pair of second clamping arms to move along the first direction to adjust the clamping distance between the at least one pair of second clamping arms .
The integrated silicon rod cutting and grinding machine according to claim 8, wherein the second transfer driving mechanism comprises:

a second transfer rail disposed along the first direction for setting the second clamp arm mount; and

The second transfer driving unit is used for driving the second clamp arm mounting seat and its at least a pair of second clamp arms to move along the second transfer guide rail.
The integrated silicon rod cutting and grinding machine according to claim 9, wherein the second transfer driving unit comprises:

the second moving rack, arranged along the first direction;

a second drive gear, disposed on the second clamp arm mounting seat and engaged with the moving rack; and

A second drive source for driving the drive gear to move the associated second clamp arm mount and at least a pair of the second clamp arms along the second transfer rail.
The integrated silicon rod cutting and grinding machine according to claim 9, wherein the second transfer driving unit comprises:

a second moving screw disposed along the first direction and associated with the second clamp arm mount; and

The second driving source is used for driving the moving screw to rotate so as to move the associated second clamping arm mounting seat and its at least a pair of second clamping arms along the second transfer guide rail.
The integrated silicon rod cutting and grinding machine according to claim 8, wherein the at least one pair of second clamping arms is a rotary structure; the second silicon rod clamp further comprises a second clamping arm rotating mechanism, the The second clamping arm rotation mechanism is provided on at least one second clamping arm in the at least one pair of second clamping arms, and is used for driving the clamping part of the at least one second clamping arm to rotate.
The integrated silicon rod cutting and grinding machine according to claim 1, wherein the silicon rod cutting device comprises:

cutting frame;

At least one wire cutting unit is arranged on the cutting frame; the wire cutting unit includes: at least two cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the at least two cutting wheels and the transition wheel to forming at least one cutting wire saw; and

A cutting conversion mechanism is used to drive the cutting frame and at least one wire cutting unit on it to switch between the first transfer channel and the second transfer channel.
The integrated silicon rod cutting and grinding machine according to claim 13, wherein the wire cutting unit comprises:

Cutting line;

The first cutting wheel and the second cutting wheel are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein, the wheel surface of the first cutting wheel and the The surfaces of the second cutting wheel are parallel or coplanar;

The first transition wheel is adjacent to the first cutting wheel, and in the state of pulling the cutting line, the first cutting wheel and the cutting line of the first transition wheel are located in the first cutting wheel for winding the first cutting line of the cutting line in the plane of the groove;

The second transition wheel is adjacent to the second cutting wheel, and in the state of pulling the cutting wire, the second cutting wheel and the cutting wire of the second transition wheel are located in the second cutting wheel for winding the second cutting wire of the cutting wire in the plane of the slot; and

At least one third transition wheel, arranged between the first transition wheel and the second transition wheel, is used for pulling the cutting line between the first transition wheel and the second transition wheel, so as to make the line A cutting accommodating space is formed in the cutting unit.
The integrated silicon rod cutting and grinding machine according to claim 14, wherein the first transition wheel, the second transition wheel, and the at least one third transition wheel are used for pulling the cutting wire away from the cutting container space.
The integrated silicon rod cutting and grinding machine according to claim 14, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel between them to form an end-to-end closed-loop cutting line.
The integrated silicon rod cutting and grinding machine according to claim 16, wherein the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second Two cutting wheels, a second transition wheel, a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel to form a closed-loop cutting line connected end to end.
The integrated silicon rod cutting and grinding machine according to claim 14, wherein the silicon rod cutting device further comprises a cutting wire driving device for driving the cutting wire to run to cut the silicon rod to be cut.
The integrated silicon rod cutting and grinding machine according to claim 18, wherein the cutting wire driving device is a motor, and has a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel wheel.
The integrated silicon rod cutting and grinding machine according to claim 14, wherein the silicon rod cutting device further comprises:

At least one distance adjusting mechanism is provided in the at least one wire cutting unit, and is used for driving at least two cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel.
The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:

a screw rod, arranged along the orthogonal direction of the surface of the cutting wheel and threadedly connected with the single-wire cutting unit; and

The driving source is used for driving the lead screw to rotate.
The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:

a telescopic piece arranged in a direction orthogonal to the surface of the cutting wheel and associated with the single-wire cutting unit; and

The driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.
The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, the first wire cutting unit and the second wire cutting unit At least one of the two wire cutting units is driven by the distance adjustment mechanism to move in the orthogonal direction of the cutting wheel surface.
The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:

a screw rod, arranged along the orthogonal direction of the cutting wheel surface and threadedly connected with the first wire cutting unit or the second wire cutting unit; and

The driving source is used for driving the lead screw to rotate.
The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:

a telescopic piece arranged in the orthogonal direction of the surface of the cutting wheel and associated with the first wire cutting unit or the second wire cutting unit; and

The driving source is used for driving the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel.
The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:

A bidirectional screw rod, disposed along the orthogonal direction of the cutting wheel surface and threadedly connected with the first wire cutting unit and the second wire cutting unit; and

The driving source is used for driving the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
The integrated silicon rod cutting and grinding machine according to claim 13, wherein the cutting conversion mechanism comprises:

a cutting conversion guide rail arranged along a second direction for setting the cutting frame; the second direction is perpendicular to the first direction; and

A cutting conversion driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 27, wherein the cutting conversion drive unit comprises:

Move the rack, set along the second direction;

a driving gear, provided on the cutting frame and engaged with the moving rack; and

A driving source for driving the driving gear to move the associated cutting frame and its at least one line cutting unit along the cutting conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 27, wherein the cutting conversion drive unit comprises:

a moving screw disposed along the second direction and associated with the cutting frame; and

The driving source is used for driving the moving screw to rotate so as to make the associated cutting frame and its at least one line cutting unit move along the cutting conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 13, further comprising an edge skin discharge device, wherein the edge skin discharge device comprises a edge skin support mechanism for abutting against the outside of the silicon rod and supporting the edge skin Cut the formed hem.
The integrated silicon rod cutting and grinding machine according to claim 30, wherein the edge skin supporting mechanism comprises:

The Receipt Department; and

The driving unit is connected to the supporting portion to control the supporting portion to move away from or abut against the side skin.
The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises:

At least two bearing blocks, spaced along the first direction, have bearing surfaces for contacting and bearing the edge skins.
The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises:

at least two support bars disposed along the first direction for contacting and supporting the edge skin; and

Two connecting parts, respectively located on opposite sides of the cutting frame in the first direction to correspond to opposite ends of the at least two support rods, for connecting the at least two support rods and the drive unit connect.
The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises at least two supporting wheel sets spaced along the first direction, wherein the supporting wheel sets comprise :

at least two support wheels, the at least two support wheels are spaced apart for contacting and supporting the edge skin; and

The supporting base is used for disposing the at least two supporting wheels and connecting with the driving unit.
The integrated silicon rod cutting and grinding machine according to claim 31, wherein the driving unit comprises:

Cylinders or hydraulic pumps; and

The telescopic part is connected to the supporting part, and is driven by the cylinder or the hydraulic pump to telescopically move so as to control the supporting part to move away from or abut against the side skin.
The integrated silicon rod cutting and grinding machine according to claim 31, wherein the driving unit comprises:

drive motor; and

The screw assembly is connected to the bearing portion, and is driven and moved by the driving motor to control the bearing portion to move away from or abut against the edge skin.
The integrated machine for cutting and grinding silicon rods according to claim 30, characterized in that, the edge skin unloading device further comprises a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device and is used for moving along the first direction. Push the edge skin to disengage the edge skin from the edge skin support mechanism.
The integrated silicon rod cutting and grinding machine according to claim 34, wherein the edge and skin dislocation mechanism comprises:

push the top; and

A cylinder or a hydraulic pump is used for driving the push top to push the side skin along the first direction. The telescopic rod is arranged along the first direction.
The integrated silicon rod cutting and grinding machine according to claim 1 or 30, wherein the edge skin unloading device further comprises a edge skin conveying mechanism for receiving the cut edge skin and transferring the edge skin to a unloading area.
The integrated silicon rod cutting and grinding machine according to claim 39, wherein the edge skin conveying mechanism comprises:

a conveying part for carrying the edge skin; and

The conveying driving source is used for driving the conveying part to move in a first direction to convey the edge skin.
The integrated silicon rod cutting and grinding machine according to claim 1, wherein the silicon rod grinding device comprises:

Abrasive mount;

at least one pair of grinding tools, oppositely arranged on the grinding tool mounting seat;

an abrasive tool advancing and retracting mechanism for driving at least one abrasive tool in the at least one pair of abrasive tools to move in a second direction, wherein the second direction is perpendicular to the first direction; and

A grinding tool switching mechanism is used for driving the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.
The integrated silicon rod cutting and grinding machine according to claim 41, wherein any one of the at least one pair of grinding tools comprises a rough grinding wheel and a fine grinding wheel which are nested in each other.
The integrated silicon rod cutting and grinding machine according to claim 42, wherein the rough grinding wheel is nested inside the fine grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel A telescopic drive mechanism is provided; or, the fine grinding wheel is nested inside the rough grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
The integrated silicon rod cutting and grinding machine according to claim 41, wherein the grinding tool conversion mechanism comprises:

an abrasive tool conversion guide rail disposed along the second direction for positioning the abrasive tool mount; and

The abrasive tool conversion driving unit is used for driving at least one pair of abrasive tools to move along the abrasive tool conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 44, wherein the grinding tool conversion drive unit comprises:

move the rack, set along the second direction;

a drive gear, disposed on the grinding tool mounting seat and engaged with the moving rack; and

A driving source for driving the driving gear to move the associated abrasive tool mounting seat and at least one pair of abrasive tools along the abrasive tool conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 44, wherein the grinding tool conversion drive unit comprises:

a moving lead screw disposed in a second direction and associated with the abrasive tool mount; and

The driving source is used for driving the moving screw to rotate so as to move the associated grinding tool mounting seat and at least a pair of grinding tools along the grinding tool conversion guide rail.
The integrated silicon rod cutting and grinding machine according to claim 41, wherein the silicon rod grinding device further comprises: at least one pair of chamfering grinding tools, which are arranged on the grinding tool mounting seat opposite to each other.
The integrated silicon rod cutting and grinding machine according to claim 41, wherein any one of the first silicon rod holder and the second silicon rod holder further comprises: a grinding and repairing device for grinding the corresponding At least one pair of grinding tools in the silicon rod grinding device.
The integrated machine for cutting and grinding silicon rods according to claim 1, further comprising: a silicon rod transferring device, which is arranged at the loading area of the silicon rod processing platform, and is used for transferring the silicon rods to be processed to the said silicon rod processing platform. The first processing location of the silicon rod processing platform.
The integrated silicon rod cutting and grinding machine according to claim 49, wherein the silicon rod transfer device comprises:

The silicon rod bearing structure is used to carry the silicon rod to be processed;

a centering adjustment mechanism for adjusting the position of the silicon rod to be processed so that its axis line corresponds to a predetermined center line; and

A feeding driving mechanism is used for driving the silicon rod supporting structure and the silicon rod to be processed carried by the silicon rod supporting structure to move from the loading area to the first processing area along the second direction.
The integrated machine for cutting and grinding silicon rods according to claim 50, wherein the centering adjustment mechanism comprises a vertical lifting mechanism, which is used to drive the silicon rod carrying structure and the silicon rods to be processed. The vertical lifting and lowering movement is performed so that the axis line of the silicon rod to be processed is vertically aligned with the predetermined center line.
The integrated silicon rod cutting and grinding machine according to claim 51, wherein the vertical lifting mechanism comprises:

a vertical lifting guide rail, arranged on the bearing base;

a slider, provided on the bearing member; and

Vertical lift drive unit.
The integrated silicon rod cutting and grinding machine according to claim 51, wherein the vertical lifting mechanism comprises:

a vertical lift guide for setting the silicon rod bearing structure; and

The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rod.
The integrated silicon rod cutting and grinding machine according to claim 52 or 53, wherein the vertical lifting and lowering driving unit comprises: a driving motor and a screw assembly vertically arranged and driven by the driving motor, or driving A motor and a rack and pinion drive assembly vertically disposed and driven by the drive motor.
The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transferring device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the located in the central area of the silicon rod carrying structure.
The integrated silicon rod cutting and grinding machine according to claim 55, wherein the centering adjustment mechanism comprises:

a bracket, arranged on the machine base or the silicon rod bearing structure;

an adjusting guide rail, arranged on the bracket along the first direction;

At least two ejectors are respectively arranged on opposite sides of the bracket;

An adjustment driving unit for driving the at least two ejectors to move toward each other along the adjustment guide rail to eject the silicon rod to be placed in the central area of the silicon rod support structure.
The integrated silicon rod cutting and grinding machine according to claim 56, wherein the adjustment driving unit comprises: a driving motor and a screw assembly arranged along the first direction and driven by the driving motor, or, a driving motor and A rack and pinion drive assembly disposed along the first direction and driven by the drive motor.
The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transferring device further comprises a silicon rod clamping mechanism provided on the silicon rod carrying structure.
The integrated silicon rod cutting and grinding machine according to claim 58, wherein the silicon rod clamping mechanism comprises:

a fixture mounting member disposed on the silicon rod bearing structure along the first direction; and

At least two silicon rod clamps are arranged along the distance between the clamp mounts.
The integrated silicon rod cutting and grinding machine according to claim 59, wherein the silicon rod clamping member comprises:

a clamping arm mounting seat, arranged on the fixture mounting piece;

two clamp arms, movably arranged on the clamp arm mounting seat; and

The clamping arm driving mechanism is used to drive the two clamping arms to open and close.
The integrated silicon rod cutting and grinding machine according to claim 60, wherein the clamping arm driving mechanism comprises:

The opening and closing gear is arranged on the mounting seat of the clamping arm;

two racks, each associated with a clamp arm and in mesh with the opening and closing gear; and

A driving source, associated with the opening and closing gear, is used to drive the opening and closing gear to rotate.
The integrated silicon rod cutting and grinding machine according to claim 59, characterized in that, in the silicon rod clamping mechanism, at least one silicon rod clamping member of the at least two silicon rod clamping members is provided with a distance adjustment drive and a mechanism for driving it to move along the clamp mounting member to adjust the distance between the at least two silicon rod clamping members.
The integrated silicon rod cutting and grinding machine according to claim 62, wherein the distance adjustment driving mechanism is a screw adjustment mechanism, a chain conveying mechanism, a double-speed chain mechanism, or a transmission belt mechanism.
The integrated silicon rod cutting and grinding machine according to claim 50, wherein the feeding driving mechanism comprises:

a feed guide rod or feed rail, arranged along the second direction, for arranging the silicon rod carrying structure; and

A feeding driving unit is used for driving the silicon rod supporting structure to move along the feeding guide rod or the feeding guide rail.
The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transfer device further comprises a crystal line detection unit.
The integrated machine for cutting and grinding silicon rods according to claim 1, further comprising: a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rods from the Unloading of the ingot processing platform.