CN214419231U

CN214419231U - Cutting device and silicon rod processing equipment

Info

Publication number: CN214419231U
Application number: CN202022455411.3U
Authority: CN
Inventors: 苏静洪; 卢建伟; 钱春军; 曹奇峰; 李鑫
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2020-08-28
Filing date: 2020-10-29
Publication date: 2021-10-19
Anticipated expiration: 2030-10-29
Also published as: CN114102888A

Abstract

The application discloses a cutting device and silicon rod processing equipment; the cutting device is provided with at least one wire cutting unit, the wire cutting unit enables a cutting wire to wind between the cutting wheel and the transition wheel in an end-to-end mode by determining the arrangement mode of the cutting wheel and the transition wheel, and the wire cutting unit forms a cutting accommodating space for cutting the silicon rod in a working mode, so that the whole structure of the cutting device can be simplified, and the cost of the device is reduced; meanwhile, the annular cutting line can avoid the influence of the acceleration and deceleration processes of the cutting line on the cutting precision in the process of running to execute cutting, so that the cutting precision is improved, and the subsequent procedures are facilitated to be simplified.

Description

Cutting device and silicon rod processing equipment

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a cutting device and silicon rod processing equipment.

Background

In the field of photovoltaic power generation, a common crystalline silicon solar cell is fabricated on a high-quality silicon wafer cut from a solar silicon material by wire sawing. At present, wire cutting techniques represented by diamond wires are widely used in cutting silicon materials, such as single crystal silicon materials or polycrystalline silicon materials, because of their characteristics of high production efficiency, low operation cost, high operation precision, etc., and the cutting operations of silicon materials include, but are not limited to, cutting-off operations, squaring operations, slicing operations, etc.

Taking the wire cutting technology applied to the operation of cutting the silicon single crystal rod as an example, the silicon single crystal rod to be cut is placed and positioned, then the wire cutting device enters from one end face of the silicon single crystal rod to be cut and is fed along the length direction of the silicon single crystal rod until the cutting wire saw penetrates out from the other end face of the silicon single crystal rod to be cut, and therefore four shaft tangent planes which are parallel in pairs are cut in the circumferential direction of the silicon single crystal rod, wherein the commonly used wire cutting device comprises a single wire cutting device and a multi-wire cutting device.

The principle of the cutting process is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of wire cutting is achieved. In the process, the problem that the tension in the cutting line is uneven due to the fact that the whole length of the cutting line is too long exists, the cutting line runs in a reciprocating mode when running, the cutting line is enabled to be transferred (wound) in a reciprocating mode between the take-up drum and the pay-off drum, and the process of running acceleration and deceleration is usually experienced when the running direction of the cutting line is switched, so that certain waviness can be formed on a cutting surface or the flatness of the cutting surface is not high.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned disadvantages of the related art, an object of the present application is to provide a cutting device and a silicon rod processing apparatus, so as to solve the problem of low cutting precision in the prior art.

To achieve the above and other related objects, the present application discloses in a first aspect a cutting device for silicon rod processing, comprising: cutting frame and at least a wire cutting unit, wherein, wire cutting unit includes: cutting a line; the cutting wire saw comprises a first cutting wheel and a second cutting wheel which are arranged on a cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and a cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; the first transition wheel is arranged beside the first cutting wheel and used for pulling the cutting line wound on the first cutting wheel so that the cutting line wound on the first cutting wheel is coplanar with the plane of the first cutting line groove of the first cutting wheel; the second transition wheel is arranged beside the second cutting wheel and used for pulling the cutting line wound on the second cutting wheel so that the cutting line wound on the second cutting wheel is coplanar with the plane of the second cutting line groove of the second cutting wheel; the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the unit to be cut by the cutting line; the cutting line is wound among the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed loop cutting line connected end to end.

The present application discloses in a second aspect a silicon rod processing apparatus, characterized by comprising: the base is provided with a silicon rod processing platform; the cutting device according to any one of the embodiments of the first aspect of the present application, for cutting a silicon rod to be cut.

In summary, the cutting device of the present application has the following beneficial effects in one embodiment: the cutting device is provided with at least one wire cutting unit, and the wire cutting unit enables the cutting wire to wind between the cutting wheel and the transition wheel in an end-to-end mode by determining the arrangement mode of the cutting wheel and the transition wheel, so that the whole structure of the cutting device can be simplified, and the reduction of the device cost is facilitated; meanwhile, the annular cutting line can avoid the influence of the acceleration and deceleration processes of the cutting line on the cutting precision in the process of running to execute cutting, so that the cutting precision is improved, and the subsequent procedures are facilitated to be simplified.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The brief description of the drawings is as follows:

fig. 1 is a schematic structural diagram of a cutting device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a cutting device according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a wire cutting unit of the cutting device according to an embodiment of the present invention.

Fig. 4a and 4b are a front view and a perspective view of a wire cutting unit of the cutting device of the present application in one embodiment.

Fig. 5 is a partial schematic structural view of the cutting device of the present application in one embodiment.

Fig. 6 is a schematic view showing a part of the structure of the silicon rod processing apparatus according to an embodiment of the present invention.

Fig. 7a and 7b show a top view and a perspective view, respectively, of any one of the silicon rod clamps of the silicon rod processing apparatus shown in fig. 6.

Fig. 8 is a schematic structural diagram of a cutting device according to an embodiment of the present invention.

Fig. 9 is a simplified schematic diagram of the silicon rod processing apparatus according to the present application in one embodiment.

Fig. 10 is a schematic view showing a partial configuration of a silicon rod processing apparatus according to an embodiment of the present invention.

Fig. 11 is a schematic view showing the configuration of the silicon rod processing apparatus according to the present application in one embodiment.

Fig. 12 is a schematic view showing a partial configuration of the silicon rod processing apparatus shown in fig. 11.

Fig. 13 is a schematic view showing a configuration of a silicon rod processing apparatus according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, the first cutting wheel may be referred to as the second cutting wheel, and similarly, the second cutting wheel may be referred to as the first cutting wheel, without departing from the scope of the various described embodiments. The first cutting wheel and the second cutting wheel are both describing one cutting wheel, but they are not the same cutting wheel unless the context clearly indicates otherwise. Similar situations also include a first transition wheel, a second transition wheel and a third transition wheel, or a first rack and a second rack, etc.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Crystalline silicon is usually processed into a silicon wafer form in industrial production and then used for product manufacturing, wherein originally obtained silicon rods comprise a monocrystalline silicon rod and a polycrystalline silicon rod, the monocrystalline silicon rod is a rod-shaped monocrystalline silicon grown from a melt by using a czochralski method or a suspension zone melting method, for example, a monocrystalline silicon rod with a length specification of 5000mm or 5360mm, or a monocrystalline silicon rod with a length of about 800mm, etc., which are commonly used in silicon rod processing, and the polycrystalline silicon is a silicon rod obtained by precipitating silicon on the surface of a silicon core wire by using a precipitation technology such as a chemical vapor deposition technology.

As described in the background art, in the conventional manufacturing process of silicon wafers, a polycrystalline silicon brittle material is generally pulled to form a single crystal silicon rod, and then a squarer is used to perform squaring; at the moment, the cutting mechanism feeds along the length direction of the silicon rod and cuts four planes which are parallel in pairs along the circumferential direction of the silicon rod, so that the cross section of the silicon rod is in a similar rectangle shape; and after the evolution is finished, slicing the silicon rod after evolution along the length direction by adopting a multi-line slicing machine to obtain the required silicon wafer.

In a conventional cutting embodiment, the steel wire or diamond wire is guided by a wire guide wheel (transition wheel), a wire saw or a wire web is formed on a cutting roller (cutting wheel), and the workpiece to be machined is fed by raising and lowering a table or raising and lowering the wire saw or wire web. Under the action of a pressure pump, a cooling water automatic spraying device assembled on the equipment sprays cold water to cutting parts of the steel wire or the diamond wire and the workpiece, and the steel wire or the diamond wire reciprocates to cut the material to be processed into a plurality of pieces at one time. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the linear cutting technology has the advantages of high efficiency, high productivity, high precision and the like.

Generally, the cutting wheel and the transition wheel in the cutting device are arranged in a complex manner, the corresponding winding manner is complex, the required cutting line is too long, so that the problem of uneven tension possibly exists in the cutting line, and the problem of reduced cutting precision caused by difficulty in controlling the cutting force and the cutting speed; furthermore, in the conventional cutting apparatus, the cutting wire is required to be reciprocated to wind the cutting wire between the take-up drum and the pay-off drum, which are wire storage drums, and thus the cutting wire is required to undergo acceleration and deceleration processes, which causes uneven cutting speed, thereby possibly causing a reduction in precision of the cutting surface, such as a reduction in flatness, formation of surface waviness, and the like.

In view of the above, the present application provides a cutting device, which can be applied to silicon rod processing equipment, in the cutting device of the present application, by the arrangement manner of the cutting wheel and the transition wheel in the wire cutting unit and the winding manner of the annular cutting line, the cutting line can be operated unidirectionally and at high speed in the cutting process, which is beneficial to improving the cutting precision, and meanwhile, a wire storage cylinder can be omitted in the cutting device, the structure of the cutting device is simplified, which can reduce the production cost, and meanwhile, the occupied equipment space of the cutting device is reduced, which is beneficial to flexibly arranging the cutting device in the silicon rod processing equipment, so as to cooperate with other components in the silicon rod processing equipment to complete the processing operation.

In the embodiments provided herein, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, and the first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other two by two. For example, a length extending direction of the silicon rod processing apparatus provided with the cutting device, that is, a direction of an axis (axis) of a silicon rod when the silicon rod is placed thereon, is defined as a first direction (that is, a front-rear direction), a width extending direction of the silicon rod processing apparatus, that is, a left-right direction, is defined as a second direction (that is, a left-right direction), and a plumb line direction is defined as a third direction (that is, a vertical direction, an up-down direction, or a lifting direction).

In any embodiment provided herein, the end surfaces of the silicon rod refer to two opposite surfaces along the length direction of the silicon rod, that is, along the first direction, for example, the two end surfaces of the silicon rod to be cut are circular or quasi-circular, and the side surfaces of the silicon rod are arc surfaces; the cut silicon rod has a rectangular or quasi-rectangular shape at its two ends, i.e. four sides of the silicon rod in the longitudinal direction, which are generally rectangular.

The cutting device includes: a cutting frame and at least one wire cutting unit; wherein, at least one line cutting unit is located the cutting frame, line cutting unit includes: the cutting wire is wound around the cutting wheels and the transition wheels to form at least one cutting wire saw.

In some embodiments, the plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or the plurality of cutting wheels and transition wheels are mounted on the cutting frame through a bracket, a connecting plate, or a mounting frame, and herein, the carrier for mounting the plurality of cutting wheels and transition wheels may be in different forms, which is not limited in this application.

In an embodiment provided herein, the cutting device comprises: cutting frame and at least a wire cutting unit, wherein, wire cutting unit includes: cutting a line; the cutting wire saw comprises a first cutting wheel and a second cutting wheel which are arranged on a cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and a cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; the first transition wheel is arranged beside the first cutting wheel and used for pulling the cutting line wound on the first cutting wheel so that the cutting line wound on the first cutting wheel is coplanar with the plane of the first cutting line groove of the first cutting wheel; the second transition wheel is arranged beside the second cutting wheel and used for pulling the cutting line wound on the second cutting wheel so that the cutting line wound on the second cutting wheel is coplanar with the plane of the second cutting line groove of the second cutting wheel; the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the unit to be cut by the cutting line; the cutting line is wound among the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed loop cutting line connected end to end.

Please refer to fig. 1, which is a simplified schematic diagram of a cutting apparatus according to an embodiment of the present application.

In the embodiment shown in fig. 1, the wire cutting unit 22 is mounted on the cutting frame 21 by a wire cutting support 23. Here, the wire cutting support 23 serves as a carrier for associating the plurality of cutting wheels 221 and the transition wheel 222 in the wire cutting unit 22 with the cutting frame 21, and the wire cutting support 23 may be in the form of a beam, a plate frame, a bracket, or the like.

In one implementation, the wire-cutting support 23 is disposed on the cutting frame 21 through a limiting structure such as a guide rail or a guide pillar, wherein the guide rail or the guide pillar is disposed along a perpendicular line of a wheel surface of the cutting wheel 221 in the wire-cutting unit 22, so that the disposed wire-cutting unit 22 has a degree of freedom to move along the perpendicular line of the wheel surface of the cutting wheel; with this arrangement, the wire cutting support 23 can be moved by the driving source in the direction perpendicular to the tread of the cutting wheel 221.

When the wire-cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel 221, correspondingly, the cutting wire saw in the wire-cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel, and the cutting wire saw is moved away from or close to the axis of the silicon rod, so that the cutting amount or the cutting position of the silicon rod can be adjusted.

The cutting wheel 221 is provided with at least one cutting line groove for winding the cutting line 223, and the cutting line groove can limit the position of the cutting line 223 so as to control the cutting precision. Any of the cutting wires is formed by winding the cutting wire 223 between two cutting wheels 221, and the position of the two cutting wheels 221 and the position relationship between the cutting wheels 221 can be used to determine the direction of the cutting wire.

The transition wheel 222 is used to divert or guide the cutting line 223, or the transition wheel 222 may be used to adjust the tension of the cutting line 223.

The direction of the wheel surface of the cutting wheel and the direction of the cutting wire saw have a corresponding relation, and it should be understood that the wheel surface of the cutting wheel is parallel to the plane of any cutting wire groove in the cutting wheel, and the cutting wire saw should be located in the plane of the cutting wire groove for winding the cutting wire for controlling the cutting precision and the stability of the cutting process; meanwhile, in the cutting process, the force application direction of the silicon rod to the cutting line needs to be parallel to the cutting line groove, namely the wheel surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the axis direction (namely the first direction) of the silicon rod in the squaring operation.

It is to be understood that the cutting device can be used in a silicon rod processing apparatus, in which the cutting device can be arranged in different orientations. The direction in which the silicon rod is placed in the silicon rod processing device is defined as a first direction, and the cutting wire saw is usually required to be perpendicular to the first direction when the cutting device is placed in the silicon rod processing device. In order to facilitate control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, and to facilitate description of the structure and arrangement of the components of the cutting apparatus of the present application, the following embodiments are described by taking the cutting wire saw disposed in the second direction or the perpendicular bisector direction as an example.

In the cutting device of this application, work as the cutting coping saw is located second direction or plumb line direction, and is corresponding, the cutting wheel face is on a parallel with second direction and silicon rod axis direction promptly the cutting wheel face is located the horizontal plane direction, perhaps the cutting wheel face is on a parallel with plumb line direction and silicon rod axis direction and is on a parallel with the plumb line of first direction in.

In the embodiments provided by the present application, the wheel surface of the cutting wheel is a reference surface, the reference surface is parallel to any cutting line slot on the cutting wheel, the wheel surface of the cutting wheel is mainly used for explaining the direction in which the cutting wheel is arranged (which is also equivalent to the planar direction of the cutting line slot on the cutting wheel), and the specific position of the reference surface, for example, which cutting line slot on the cutting wheel specifically corresponds, is not limited in the present application.

Please refer to fig. 2 and fig. 3 in combination, wherein fig. 2 is a schematic structural diagram of a cutting apparatus of the present application in an embodiment, and fig. 3 is a schematic structural diagram of a wire cutting unit in the cutting apparatus of the present application in an embodiment.

In the embodiment shown in fig. 2, the cutting device includes two wire cutting units 22 disposed opposite to each other to form two parallel cutting wires. The embodiment shown in fig. 3 can be represented as a structure of a wire cutting unit 22, wherein the wire cutting unit 22 comprises a first cutting wheel 221a and a second cutting wheel 221b, and a cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b to form a cutting wire saw.

The first cutting wheel 221a comprises at least one first cutting line groove, and the plane of any first cutting line groove is parallel to the wheel surface of the first cutting wheel; that is, the cutting line grooves on the first cutting wheel may be referred to as first cutting line grooves.

The second cutting wheel 221b comprises at least one second cutting line groove, and the plane of any second cutting line groove is parallel to the wheel surface of the second cutting wheel; that is, the cutting line slots on the second cutting wheel may be referred to as second cutting line slots.

The wheel surface of the first cutting wheel 221a is parallel to or coplanar with the wheel surface of the second cutting wheel 221b, so that when the cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b, the corresponding first cutting wire groove and second cutting wire groove for winding the cutting wire 223 are located in the same plane, and thus, the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire 223 are located at the same time. It will be appreciated that the cutting wire 223 is in operation during the cutting action and thus is defined by the spatial position in which it is located, in the present embodiment the cutting wire 223 is wound between the first cutting wheel 221a and the second cutting wheel 221b, i.e. is a cutting wire.

It will be appreciated that when the cutting line 223 is wound around either cutting wheel, it is intended that the cutting line 223 on both sides of the cutting wheel lie in the plane of the cutting line groove in the cutting wheel in which the cutting line 223 is wound.

When the cutting wire 223 is wound around the first cutting wheel 221a, the cutting wire 223 at one end of the first cutting wire groove is wound around the second cutting wheel 221b to form a cutting wire saw, and the cutting wire 223 at the other end of the first cutting wire groove is wound around the first transition wheel 222 a. The first transition wheel 222a is disposed adjacent to the first cutting wheel 221a, and the cutting line 223 wound around the first cutting wheel 221a is positioned in a plane of the first cutting line groove for winding the cutting line 223 in the first cutting wheel 221a in a state where the cutting line 223 wound around the first cutting wheel 221a is drawn.

When the cutting wire 223 is wound around the second cutting wheel 221b, the cutting wire 223 at one end of the second cutting wire groove is wound around the first cutting wheel 221a to form a cutting wire saw, and the cutting wire 223 at the other end of the second cutting wire groove is wound around the second transition wheel 222 b. The second transition wheel 222b is disposed adjacent to the second cutting wheel 221b, and the cutting line 223 wound around the second cutting wheel 221b is positioned in a plane of a second cutting line groove for winding the cutting line 223 in the second cutting wheel 221b in a state that the cutting line 223 wound around the second cutting wheel 221b is drawn.

The first transition wheel 222a and the second transition wheel 222b respectively have at least one wire guide groove for drawing the cutting wire 223. The first transition wheel 222a and the second transition wheel 222b are respectively disposed adjacent to the first cutting wheel 221a and the second cutting wheel 221b, where the adjacent arrangement may be a left side, a right side, an upper side, a lower side, and the like, which is not limited in this application.

It should be understood that when the cutting line 223 is wound around any cutting wheel or transition wheel, the direction of the cutting line 223 wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire slot or wire guide.

The at least one third transition wheel 222c is arranged between the first transition wheel 222a and the second transition wheel 222b, and is used for pulling the cutting line 223 between the first transition wheel 222a and the second transition wheel 222b, so that a cutting accommodating space is formed in the unit to be cut, and the cutting accommodating space is determined by a movable range of the silicon rod to be cut in the cutting process relative to the cutting wire saw.

In the cutting operation, the cutting wire saw and the silicon rod need to be relatively moved in a cutting direction, i.e. a first direction, so as to perform the cutting of the silicon rod by the cutting wire saw, for example, the cutting device may be disposed on the silicon rod processing equipment, in some examples, the cutting unit is fed relative to the silicon rod so as to perform the cutting, for example, the cutting frame may be movably disposed on a processing platform of the silicon rod processing equipment and may be moved along an axis direction of the silicon rod so as to drive the cutting wire saw to perform the cutting; in still other examples, the cutting frame may be disposed or mounted at a fixed position of the silicon rod processing apparatus, and the silicon rod is clamped by the silicon rod clamp and is driven to advance relative to the cutting wire saw to achieve cutting. The silicon rod clamp can also be a silicon rod clamping part, a silicon rod positioning part and the like, and is used for determining the position of the silicon rod and loading (or bearing, clamping and limiting) the silicon rod.

Taking an embodiment that a silicon rod clamp is arranged in the silicon rod processing equipment to drive the silicon rod to move in the first direction as an example, in the cutting operation, the silicon rod clamp drives the clamped silicon rod to feed along the axis direction of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is a movement range of the silicon rod to be cut in the process that the silicon rod to be cut penetrates through the silicon rod from the starting contact with the cutting line 223 to the moving to the cutting line 223 to form the edge skin.

The cutting accommodation space can accommodate a silicon rod to be cut and only the cutting wire saw in the cutting device intersects with the cutting accommodation space. It should be understood that during the cutting process, the collision of the silicon rod clamp and the held silicon rod to be cut with other parts of the silicon rod processing apparatus including the cutting line 223 (here the cutting line 223 excludes the cutting wire saw) in motion is a problem to be avoided; meanwhile, in order to achieve cutting, the cutting wire saw and the silicon rod are relatively fed in the silicon rod clamp silicon rod moving process, therefore, when the silicon rod is in the cutting accommodating space, namely the silicon rod is relatively fed by the cutting wire saw until the cutting is completed, mutual interference of parts in the silicon rod processing equipment when the silicon rod to be cut and the cutting device are in a relative motion state, such as contact of the silicon rod to be cut with a cutting line except the cutting wire saw, collision of the silicon rod clamp and the cutting device, contact of the silicon rod clamp with the cutting line, and the like, should be avoided.

The first transition wheel 222a, the second transition wheel 222b, and at least one third transition wheel 222c may be used to draw the cutting line 223 in the direction of the cutting line 223, and the cutting line 223 between the first transition wheel 222a and the second transition wheel 222b is drawn by the third transition wheel 222c to form the cutting accommodating space.

In certain embodiments, the first transition wheel 222a, the second transition wheel 222b and the at least one third transition wheel 222c are used to pull the cutting wire 223 away from the silicon rod to be cut. It should be understood that the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a, and the cutting line 223 between the second cutting wheel 221b and the second transition wheel 222b are located in a plane in which the first cutting line groove (or the second cutting line groove) for winding the cutting line 223 is located. In order to form the cutting accommodating space, in one implementation manner, the lengths of the cutting lines 223 between the first cutting wheel 221a and the first transition wheel 222a and between the second cutting wheel 221b and the second transition wheel 222b can be made to be long enough, for example, longer than the length of the silicon rod to be cut, but the cutting frame occupies too much equipment space under the arrangement, and the layout is not reasonable.

In certain embodiments, the first transition wheel 222a, the second transition wheel 222b, and the at least one third transition wheel 222c are used to pull the cutting line 223 away from the cutting accommodating space.

Embodiments are provided in which the cutting accommodating space is formed by the first, second and

third transition wheels

222a, 222b and 222 c. In one implementation, a wheel surface of at least one of the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c forms an included angle with a wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, so that the cutting line 223 deviates from a plane where the first cutting line groove (or the second cutting line groove) for winding the cutting line 223 is located.

Taking the example that the cutting device includes two wire cutting units arranged oppositely, as shown in the embodiment shown in fig. 3, the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c are arranged to be inclined toward the direction away from the cutting accommodating space, or the transition wheels are arranged on the side of the cutting frame away from the cutting accommodating space, so that the cutting line 223 can be far away from the cutting accommodating space, and in this layout, the equipment space required by the wire cutting units can be effectively reduced, and the overall equipment layout of the silicon rod processing equipment is facilitated.

Here, for any one of the wire cutting units, the direction away from the cutting accommodating space is a vector of a perpendicular direction of the wheel surface of the cutting wheel, and taking the embodiment shown in fig. 2 as an example, the directions away from the cutting accommodating space corresponding to two opposite wire cutting units are opposite, and are respectively directions shown by arrows in the figure.

In some embodiments, the tread of the first transition wheel 222a may be at an angle to the tread direction of the first cutting wheel 221a, and the tread of the second transition wheel 222b may be at an angle to the tread direction of the second cutting wheel 221 b. The first transition wheel 222a is only arranged in a direction that the cutting line 223 at the other end of the first cutting wheel 221a is positioned in an intersection line of a plane where the first cutting line groove for winding the cutting line 223 is positioned and a plane where the wire groove for winding the cutting line 223 in the first transition wheel 222a is positioned; and the second transition wheel 222b is only arranged in a direction that the cutting line 223 at the other end of the second cutting wheel 221b is positioned in an intersection line of a plane where the second cutting line groove for winding the cutting line 223 is positioned and a plane where the wire groove for winding the cutting line 223 in the second transition wheel 222b is positioned.

By arranging the first transition wheel 222a and the second transition wheel 222b to form an included angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, the included angle is in a direction that the first transition wheel 222a or the second transition wheel 222b inclines away from the cutting accommodating space, which is beneficial to reducing the number of the third transition wheels 222c required and reducing the length of the wire-cutting support in the first direction.

Therefore, the application is not limited to the included angle formed by the first transition wheel and the first cutting wheel and the included angle formed by the second transition wheel and the second cutting wheel. For example, other changes can be made to the positional relationship and angle of the cutting wheel and transition wheel placement.

Please refer to fig. 4a and 4b, which are a front view and a perspective view of a wire cutting unit of the cutting device of the present application in another embodiment, respectively.

In the embodiment shown in fig. 4a and 4b, the wire cutting unit has a first cutting wheel 221a, a second cutting wheel 221b, a first transition wheel 222a, a second transition wheel 222b, and two third transition wheels 222 c. Wherein the first transition wheel 222a makes the cutting line 223 wound around the first cutting wheel 221a in a plane of a first cutting line groove for winding the cutting line 223 in the first cutting wheel 221a in a state that the cutting line 223 wound around the first cutting wheel 221a is drawn, and at the same time, the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a is also in a plane of a wire groove for winding the cutting line 223 in the first transition wheel; the second transition wheel 222b causes the cutting line 223 wound around the second cutting wheel 221b to be positioned in a plane of the second cutting line groove for winding the cutting line 223 in the second cutting wheel 221b in a state that the cutting line 223 wound around the second cutting wheel 221b is drawn, and simultaneously, the cutting line 223 between the second cutting wheel 221b and the second transition wheel 222b is also positioned in a plane of the wire groove for winding the cutting line 223 in the second transition wheel.

In the cutting device, the cutting line is wound among the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed loop cutting line connected end to end.

With continued reference to fig. 2, the cutting wheel and the transition wheel of the wire cutting unit are wound by a circular cutting wire, in which case the wire storage drum is omitted from the cutting device, and the circular cutting wire is driven by the driving device to realize cutting.

In the existing cutting device, a cutting line is wound from a pay-off drum to a position between a cutting wheel and a transition wheel in a line cutting unit and wound from the line cutting unit to a take-up drum, the cutting line is driven to run in a cutting operation, and the running process of the cutting line is an acceleration process and a deceleration process which are alternately carried out; in the cutting device of the present application, the circular cutting line in the line cutting unit can be kept running at a high speed, and at the same time, the circular cutting line can be run in the same running direction in the cutting work. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the annular cutting line can effectively reduce the total length of the cutting line required by the line cutting unit and reduce the production cost.

In some embodiments, the wire cutting unit comprises two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, one third transition wheel, the other third transition wheel, the first transition wheel and the first cutting wheel to form an endless cutting wire in an end-to-end connection.

Referring to fig. 3, taking the first cutting wheel 221a as an example of the starting point of the winding of the circular cutting line 223, the cutting line 223 is wound from the first cutting wheel 221a to the second cutting wheel 221b, and a cutting wire saw is formed between the two cutting wheels; the cutting line 223 is sequentially wound from the second cutting wheel 221b to the second transition wheel 222b, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a, thereby forming endless windings in an end-to-end relationship, and at the same time, the cutting accommodating space is formed in the wire cutting unit by the drawing guide of the plurality of transition wheels to the cutting line 223.

Of course, it should be understood that the positions where the first, second and

third transition wheels

222a, 222b and 222c are disposed with respect to the cutting wheels and the inclination directions of the wheel surfaces are not limited to the illustrated embodiment, and the cutting accommodation space may be formed only when the cutting line 223 is wound between the plurality of cutting wheels and transition wheels of the wire cutting unit. Meanwhile, the third transition wheels 222c of the wire cutting unit may also be arranged in three, four, etc., which is not limited in this application.

For another example, in the embodiment shown in fig. 4a and 4b, assuming that the first cutting wheel 221a is a winding start point, the cutting line 223 is sequentially wound around the first cutting wheel 221a, the second cutting wheel 221b, the second transition wheel 222a, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a to form an endless cutting line.

In some embodiments, the cutting device further comprises a cutting line driving device for driving the cutting line to operate so as to cut the silicon rod.

The principle of linear cutting is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of linear cutting is achieved. The string drive is used to carry out the string run.

In some embodiments, the cutting wire drive is a motor having a power take-off shaft and the power take-off shaft is coupled to the first cutting wheel or the second cutting wheel. For example, in the embodiment shown in fig. 1, the wire cutting unit is provided with a motor 224 connected to the cutting wheel, so that the cutting wire can be driven by the wound cutting wheel to travel in the winding direction. Of course, in other specific implementations, the string driving device may also be another driving source, such as a hydraulic motor, only when the string is driven to operate, and the application is not limited.

In some embodiments, a tension detection mechanism is further included in the cutting device. In the process of wire cutting, the tension of the cutting wire influences the yield and the processing precision in the process of cutting, and the tension detection mechanism detects the tension and adjusts the tension of the cutting wire to reach a set certain threshold value, and keeps a constant value or a certain range allowed by taking the constant value as a numerical center in the process of cutting.

In one embodiment, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for tension adjustment of the cutting wire when the guided traction of the cutting wire is achieved.

The tensioning wheel is used for adjusting the tension of the cutting line, and the line breakage probability of the cutting line can be reduced so as to reduce consumable materials. In cutting operations, the action of the string is very important, but even the best strings have a limited extension and wear resistance, i.e. the string tapers off during continuous operation until it is finally torn off. Therefore, the existing wire cutting equipment is generally provided with a wire tension compensation mechanism for compensating the extension degree of the cutting wire in the reciprocating motion, and the tensioning wheel is an implementation means.

In some embodiments of the application, the tension detection mechanism comprises at least: a tension sensor, a servo motor and a screw rod; the tension sensor is arranged on the transition wheel, continuously senses the tension value of the cutting line on the transition wheel, and sends out a driving signal when the tension value is smaller than a preset value; the servo motor is electrically connected with the tension sensor and is used for starting to work after receiving a driving signal sent by the tension sensor; one end of the screw rod is connected with the tensioning wheel, the other end of the screw rod is connected with the servo motor, and the transition wheel is pulled to perform unidirectional displacement when the servo motor works so as to adjust the tension of the cutting line.

In certain embodiments, the cutting device further comprises: and the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving the plurality of cutting wheels in the linear cutting unit to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels. The cutting device can realize the switching of the cutting line between different cutting grooves of the cutting wheel based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or cutting amount) relative to the silicon rod.

In some implementations, please refer to fig. 2 and fig. 3, which take a wire cutting unit 22 of the cutting device as an example, the wire cutting unit 22 includes a plurality of cutting wheels 221 and transition wheels 222. The carrier for carrying the plurality of cutting wheels 221 and the transition wheel 222 is, for example, the wire-cutting support 23 shown in fig. 3, the distance adjusting mechanism (not shown) can be used for driving the wire-cutting support 23 to move along the perpendicular direction of the wheel surface of the cutting wheel 221 as a whole, the transition wheel 222 and the cutting wheel 221 jointly follow the wire-cutting support 23 to move along the perpendicular direction of the wheel surface of the cutting wheel 221, in this state, the plurality of cutting wheels 221 and the transition wheel 222 are relatively static, that is, the positional relationship between the transition wheel 222 and the cutting wheel 221 is unchanged. In this case, the pitch adjusting mechanism is used to adjust the cutting position of the at least one wire cutting unit 22 relative to the silicon rod.

In some implementations, each cutting wheel has at least two cutting line slots, different cutting line slots being parallel to each other and having a cutting offset between them in the direction of the perpendicular to the wheel face of the cutting wheel. When the distance adjusting mechanism is used for driving the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the position of the cutting wire wound on the wire grooves on the cutting wheels can be changed. In one implementation, the plurality of cutting wheels in the wire cutting unit may be attached to a carriage, for example, wherein the carriage is movably disposed on the wire cutting support and driven by the pitch adjustment mechanism to move in a direction perpendicular to the wheel faces of the cutting wheels.

When the at least one distance adjusting mechanism is used for changing the cutting line to wind around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in an actual scene, the cutting line grooves corresponding to the cutting lines before and after groove changing can be predetermined, for example, the position of the cutting line before groove changing is the cutting line groove a1, the cutting line after groove changing is wound around the cutting line groove a2, the displacement of the plurality of cutting wheels in the at least one distance adjusting mechanism driving line cutting unit to move is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set as the cutting offset between the cutting line groove a1 and the cutting line groove a2, and therefore, the distance adjusting mechanism can be used for changing the cutting line from the cutting line groove a1 to the cutting line groove a 2; it should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit are moved along the perpendicular direction of the wheel surfaces of the cutting wheels by the at least one distance adjusting mechanism is the direction in which the cutting wire groove a2 points to the cutting wire groove a1, and the cutting position of the cutting wire saw in space is unchanged after the groove is changed, so that the silicon rod can be cut according to the preset cutting amount without the step of further calibrating the positions of the cutting wheels or other components, and the groove changing process is simplified.

To further illustrate the implementation manner of the at least one distance adjusting mechanism for moving the plurality of cutting wheels in the linear cutting unit relative to the cutting frame along the direction perpendicular to the wheel surfaces of the cutting wheels, the following embodiments are provided in the present application. When the number of the wire cutting units in the cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed correspondingly.

In an embodiment, the cutting device comprises a single-wire cutting unit; the roll adjustment mechanism includes: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit; and the driving source is used for driving the screw rod to rotate.

The single-wire cutting unit is a wire cutting unit, and the single-wire cutting unit in the wire cutting device comprises a plurality of cutting wheels, and the cutting wire is wound on the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjusting mechanism is provided with a far end and a near end, in a specific implementation mode, for example, the near end of the screw rod can be connected to a driving source and driven by the driving source to rotate, the far end of the screw rod is connected to the single-wire cutting unit in a threaded mode, the screw rod can rotate based on the transmission of the driving source and converts the rotation of the screw rod into axial displacement by means of threaded connection, and the axial displacement direction is the setting direction of the screw rod, namely the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by driving the screw rod to rotate by the driving source in the distance adjusting mechanism, and the cutting wheel of the single-wire cutting unit can move forwards or backwards in the orthogonal direction of the wheel surface of the cutting wheel by driving the screw rod to rotate in different rotating directions.

In another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the extensible member can set up to body of rod structure and body of rod extending direction be the orthogonal direction of cutting wheel face promptly, the extensible member can be followed its extending direction concertina movement under the drive of driving source, extensible member one end can be connected to the driving source, the telescopic free end is associated the single line cutting unit, can drive under the driving source effect the cutting wheel of single line cutting unit removes in the orthogonal direction of cutting wheel face. The extensible member is for example electric telescopic handle, if the connecting rod for being connected to the cylinder taper rod again, the driving source can be regarded as to the cylinder, and this application does not do the restriction. The telescopic rod can be associated to the single-wire cutting unit in a linear connection or in an indirect connection, for example, can be directly connected to the wire cutting support or cutting wheel support of the single-wire cutting unit, or can be indirectly connected to the single-wire cutting unit through the support or the bearing. It should be understood that the expansion or contraction of the telescopic member may correspond to the advance or retraction of the single-wire cutting unit in the direction orthogonal to the wheel face of the cutting wheel.

Here, in the embodiments provided in the present application, the association may be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above embodiments, the telescopic rod may associate the wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation of the association is not limited thereto, but is intended to realize a transmission in the second direction.

In yet another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving gear rotates under the driving of the driving source, the rack meshed with the driving gear correspondingly moves along the step direction of the rack, in this example, the rack is matched with the driving gear, the rotating motion driven by the driving source can be converted into linear conveying along the direction of the rack, the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel, and the cutting wheel of the single-wire cutting unit can be driven to move along the orthogonal direction of the wheel surface of the cutting wheel. Meanwhile, the rotating direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the wheel surfaces of the cutting wheels.

In an embodiment, the cutting device comprises a first wire cutting unit and a second wire cutting unit which are arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move along the orthogonal direction of the wheel face of the cutting wheel, and the distance between the at least one cutting wire saw in the first wire cutting unit and the at least one cutting wire saw in the second wire cutting unit is adjusted or the cutting wire is changed to wind around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

The at least one distance adjusting mechanism can be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit so as to drive the plurality of cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit to move along the orthogonal direction of the wheel surfaces of the cutting wheels.

In one embodiment, the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate. The manner in which the lead screw and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the wheel surface of the cutting wheel is similar to that in the foregoing embodiment, and the first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism may be regarded as a single wire cutting unit, which is not described herein again. It should be understood that the arrangement of the pitch adjustment mechanism on any one wire cutting unit can realize the increase and decrease of the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit, and the wire cutting device can cut silicon rods into different specifications.

In another embodiment, the pitch adjustment mechanism comprises: a telescopic member disposed in an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second cutting unit provided with the distance adjusting mechanism may be regarded as a single-wire cutting unit, and specific implementation manners may refer to the foregoing embodiments, and details are not described here.

In yet another embodiment, the pitch adjustment mechanism comprises: a rack bar along an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving source can control the rack to linearly move along the direction of the rack through the transmission gear and the rack which are meshed with each other, and the first linear cutting unit or the second linear cutting unit which is related to the rack can drive the plurality of cutting wheels to move along the orthogonal direction of the wheel surfaces of the cutting wheels through the rack.

In one embodiment, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit and the second wire cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel.

In one embodiment, the bidirectional screw is a double-threaded screw, the two ends of the bidirectional screw are respectively provided with threads with opposite thread directions, the driving source can be arranged at any one end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft, and when the bidirectional screw is driven by the driving source to rotate, the motion at the two ends of the bidirectional screw is converted into axial linear motion with opposite directions, wherein the axial direction is the orthogonal direction of the wheel face of the cutting wheel of the bidirectional screw. Under the drive of the driving source, the cutting wheels respectively corresponding to the first wire cutting unit and the second wire cutting unit can move in the opposite direction or move in the opposite direction.

In yet another embodiment, the pitch adjustment mechanism comprises: a first rack arranged along the orthogonal direction of the wheel surface of the cutting wheel and associated with the first wire cutting unit; the second rack is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the second wire cutting unit; the transmission gear is meshed with the first rack and the second rack; and the driving source is used for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move in opposite directions or move in opposite directions along the orthogonal direction of the wheel surface of the cutting wheel.

In one embodiment, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, and the transmission gear is connected to a power output shaft (not shown) of a driving source such as a servo motor, and is engaged with the first rack and the second rack, so as to drive the first wire cutting unit and the second wire cutting unit to move towards each other to perform a closing motion when rotating in a forward direction, and drive the first wire cutting unit and the second wire cutting unit to move back when rotating in a reverse direction. The first rack and the second rack can be meshed with two sides of the transmission gear, so that linear velocity directions of the first rack and the second rack are opposite when the transmission gear rotates, the transmission gear is driven to rotate by the driving motor, the first rack and the second rack move oppositely when the transmission gear rotates positively to drive the first wire cutting unit and the second wire cutting unit to move oppositely, and the first rack and the second rack move oppositely to drive the first wire cutting unit and the second wire cutting unit to move oppositely when the transmission gear is driven to rotate reversely. Here, the transmission gear may be connected to a power take-off shaft of the drive source, or may be indirectly connected to the power take-off shaft, for example, connected to a rotating portion connected to the power take-off shaft.

In some embodiments, the pitch mechanism is a servo motor provided to the at least one wire cutting unit. In an actual scene, a servo motor is arranged on at least one linear cutting unit or each linear cutting unit of the linear cutting device, and the servo motor controls the displacement of the corresponding linear cutting unit in the orthogonal direction of the wheel surface of the cutting wheel. The linear cutting unit can predetermine the cutting offset of the groove or the adjustment quantity of the cutting position of the cutting line transformation, and the servo motor is used for accurately positioning to drive the plurality of cutting wheels in the linear cutting unit to move along the orthogonal direction of the wheel surfaces of the cutting wheels by the preset displacement. For example, a single-wire cutting unit is arranged in the wire cutting device, and a servo motor is arranged on the single-wire cutting unit to drive the single-wire cutting unit to move along the orthogonal direction of the wheel surface of the cutting wheel; for another example, the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit is driven by a corresponding servo motor to move relatively independently along the orthogonal direction of the wheel surface of the cutting wheel. In some examples, the servo motor may be replaced by a traveling motor and a traveling screw, and it should be understood that the distance adjusting mechanism is a driving device for driving a plurality of cutting wheels in the cutting unit to move relative to the cutting frame, and the specific form thereof is not limited in this application.

In certain embodiments, the cutting device of the present application further comprises a flaw-piece supporting mechanism for supporting the flaw-piece formed by cutting against the outer side of the silicon rod.

In the coordinate system defined in the present application, the first direction is a horizontal direction, i.e. the silicon rod to be processed is placed horizontally in the silicon rod processing device. It should be noted that the cutting device of the present application is not excluded from being used for cutting a vertical silicon rod, for example, when the cutting wire saw is relatively feedable in the direction of the plumb line by changing the orientation of the cutting device and the silicon rod loading means such as the silicon rod holder so that the silicon rod can be relatively fed with respect to the cutting wire saw, but the cutting device may of course be used for cutting a vertical silicon rod, for example, the cutting device may be provided on a guide rail or a guide post in the plumb line direction, or the wire cutting unit may be provided on a cutting frame having a displacement mechanism in the plumb line direction. Specifically, the processing requirements of the silicon rod processing equipment on the silicon rod can be determined, and for convenience of explaining the structure of the cutting device, the following embodiments will be described by taking the cutting device as an example for cutting the silicon rod in a horizontal shape in the silicon rod processing equipment.

In the silicon rod processing equipment, the silicon rod to be cut is in a horizontal state, and the flaw-piece formed by cutting is also in a horizontal state. In this example, the edge skin needs to be supported during cutting to assist in the removal of the edge skin; meanwhile, the edge skin formed in the cutting process of the horizontal silicon rod is not subjected to the clamping force of the silicon rod clamp any more, and before the cutting wire saw does not completely penetrate through the silicon rod, the connecting part of the edge skin and the silicon rod is broken (also called edge breakage) under the action of the moment formed by the gravity of the edge skin.

In some embodiments, the flaw-piece holding mechanism comprises: at least one supporting component and at least one mounting part, wherein the at least one supporting component is connected with the cutting device. Wherein the holding assembly comprises: the supporting part is controlled to abut against and support the flaw-piece; and the driving unit is connected with the bearing part to control the bearing part to be far away from or abut against the flaw-piece.

In some examples, the cutting device in the silicon rod processing equipment can convert the cutting position during the silicon rod processing process, for example, a first processing position and a second processing position are arranged on the silicon rod processing platform, the cutting device is arranged on the base by a conversion mechanism, and the cutting device can be driven by the conversion mechanism to convert the position between the first processing position and the second processing position. In this arrangement, the support member is mounted to the cutting device by a mounting portion such that the support member remains relatively stationary with respect to the cutting device when the cutting device is switched between processing positions. In some examples, the mounting portion is removably attachable to the cutting frame, and the mounting portion can be located at different positions on the cutting device based on the support requirements for the edging. The position of the supporting component on the cutting device can be determined based on the specific structure of the wire cutting unit in the cutting device, such as the embodiment shown in fig. 1, and the supporting component is arranged on the wire cutting support through the mounting part.

The supporting component comprises a supporting part which is used for contacting and abutting against the silicon rod to realize the supporting function of the flaw-piece, and it should be noted that in each embodiment of the application, the supporting function is to apply force to the flaw-piece to maintain the stable state of the flaw-piece, taking the cutting wire saw as an example when arranged in the horizontal line direction, the flaw-piece formed by cutting is positioned at the upper side or the lower side of the silicon rod, and at the moment, the supporting part can provide supporting force to the flaw-piece at the lower side of the silicon rod to prevent the flaw-piece from breaking, so that the flaw-piece can be maintained in the stable state; and when the cutting wire saw is arranged in the direction of the plumb line, the cutting edge skin is positioned at the side (left side or/and right side) of the silicon rod, the supporting part can be arranged into a structure matched with the cambered surface at the outer side of the silicon rod so as to provide supporting force for the edge skin, or the supporting part is abutted against the edge skin so that the edge skin is subjected to upward friction force to maintain a stable state.

The driving unit is used for driving the bearing part to be far away from or abut against the flaw-piece. The direction away from or against the flaw-piece may be a plurality of directions, for example, the direction against the flaw-piece is a state in which the supporting portion moves from a state of being away from the flaw-piece to a state of contacting the flaw-piece under the driving of the driving unit, and the specific moving direction of the supporting portion is not limited in this application.

In one implementation, the driving unit includes: a cylinder or hydraulic pump; the telescopic part is connected with the bearing part and is driven by the cylinder or the hydraulic pump to do telescopic motion so as to control the bearing part to be far away from or abut against the flaw-piece.

The telescopic part can be driven by an air cylinder or a hydraulic pump to perform telescopic motion, the telescopic part is connected with the bearing part, and the telescopic direction of the telescopic part is, for example, the direction far away from or close to the axis of the silicon rod, so that the connected bearing part is driven to be far away from or abut against the flaw-piece.

In yet another implementation, the drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The screw rod assembly can be in threaded connection with the bearing part at one end, the driving motor drives the screw rod to rotate so that the bearing part moves along the direction of the screw rod, and the driving motor controls the screw rod to rotate, so that the bearing part can be controlled to be close to or far away from the flaw-piece.

The supporting part can be set to be different structures to realize the supporting function, for example, the supporting part can be a supporting plate and is provided with an arc surface used for contacting the flaw-piece, or the supporting part is a supporting plate provided with a folded edge to prevent the flaw-piece from rolling, for example, the section of the supporting plate is in a trapezoidal groove structure (the groove opening is the lower bottom of the trapezoid); it should be understood that there are a variety of implementations of a bearing that can be used to implement a flaw piece bearing, and that this application is not intended to be limiting.

For the realization with the stable bearing of the flaw-piece that the cutting formed in order to prevent the flaw-piece fracture, or for simplifying the flaw-piece and unload the transportation, this application still provides following implementation:

in one example, the bearing part comprises at least two bearing blocks which are arranged at intervals along the first direction and are provided with bearing surfaces used for contacting and bearing the side leather. The bearing surface of the bearing block can be provided with a cambered surface to adapt to the supported flaw-piece, or can be provided with contact planes with different levelness to prevent the flaw-piece from rolling.

It should be understood that in some processing scenarios, the supporting of the flaw-piece can be realized by one supporting block; here, this application still provides the embodiment of realizing the flaw-piece bearing through two at least bearing blocks that set up along the first direction interval, through setting up can realize the bearing to the flaw-piece that the silicon rod cutting of different length specifications formed between two at least bearing blocks along the interval or the span of first direction, and simultaneously, the bearing piece that sets up by the interval carries out the bearing to the flaw-piece and can makes the flaw-piece receive the effort of supporting portion in different length direction (be first direction), is favorable to preventing that the cutting coping saw from not running through the silicon rod in front of the skin fracture. After the cutting wire saw penetrates through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used for supporting the edge skin to prevent the edge skin from inclining to fall.

Meanwhile, in an embodiment where the supporting portion includes two supporting blocks, the supporting assembly may further include two driving units, and any one of the driving units corresponds to one of the supporting blocks, for example, each supporting block is connected to one driving unit.

Please refer to fig. 5, which is a partial structural diagram of a cutting apparatus according to an embodiment of the present disclosure. As shown in the figure, the supporting portion includes two supporting rods 5111 arranged at intervals along the second direction, and the rod body of the supporting rods 5111 is along the first direction.

Here, the supporting function of the flaw-piece can be realized by the at least two supporting rods 5111, and it should be understood that the flaw-piece can be supported by positioning the center of gravity of the flaw-piece formed by cutting between the at least two supporting rods 5111; meanwhile, any one of the supporting rods 5111 is in line contact with the supporting flaw piece, and under the arrangement, the friction force of the supporting part in contact with the flaw piece can be reduced.

The connecting portions 5112 are respectively disposed at two ends of the support rod 5111 in the length direction (i.e., the first direction), meanwhile, any one of the connecting portions 5112 is connected to a driving unit and the support rod, and the at least two support rods 5111 are integrally driven by the driving units at two sides to be close to or far away from the silicon rod flaw-piece. The two sides of the bearing rod are provided with the connecting parts and the driving units, the two ends of the bearing rod 5111 can be driven by the driving units to move, and the connecting parts and the driving units on the two sides can also be used as supports for bearing the gravity of the flaw-piece in the process of being driven to move and bearing the flaw-piece, so that the structural stability of the bearing part can be improved; when the position of the gravity center of the supported flaw-piece in the first direction is positioned between the two driving units (or the two connecting parts), the stable support of the flaw-piece is easy to realize.

Meanwhile, the driving units at the two ends of the support rod 5111 can also be used as a support for associating the support rod 5111 and the connecting portion 5112 with the cutting device, as shown in fig. 5, the driving units are connected to the cutting device through the mounting portions, and the free end of the telescopic motion is connected to the connecting portion 5112 to drive the support portion to move integrally along the telescopic direction driven by the driving units. In the example shown in fig. 5, the driving unit is a cylinder 512 having a telescopic portion, and the telescopic portion of the cylinder 512 is connected to the connecting portion 5112.

In the example of fig. 5, the support is controlled to move in the direction of the plumb line to move away from or close to the flaw-piece; it will be appreciated that when the cutting apparatus is used to cut a wire saw in different orientations, or when the support portions are configured differently, the drive units of the corresponding flaw piece support mechanism may be configured in different orientations to accommodate the need to support a flaw piece. For example, when the cutting wire saw of the cutting device is oriented along the plumb line, the driving unit may be configured to extend and retract in a second direction, so that the supporting portion moves in the second direction to approach or separate from the flaw-piece. It is right the direction of the controlled motion of bearing portion, this application does not do the restriction, only as the order bearing portion realizes can to the bearing effect of flaw-piece.

The number of the supporting components can be set corresponding to the supporting requirement of the side skin, for example, when the cutting device comprises a cutting wire saw, a side skin is correspondingly formed in one cutting operation, and a supporting component can be arranged on the cutting device to support the side skin; for another example, when the cutting device includes two parallel cutting wire saws, two edges are correspondingly formed in one cutting operation, and two supporting members may be disposed on the cutting device to respectively support the edges on two sides of the silicon rod.

In some embodiments, the flaw-piece discharging mechanism further comprises a flaw-piece misplacing mechanism arranged on the cutting device and used for pushing the flaw-piece along a first direction to enable the flaw-piece to be separated from the flaw-piece supporting mechanism or the cut silicon rod.

In certain embodiments, the flaw-piece aligning mechanism is disposed on the base or the cutting device at a predetermined interval in a first direction with respect to the cutting wire saw, wherein the first direction is parallel to the axis of the silicon rod. It should be understood that the formation of the edge skin independent of the silicon rod is possible when the cutting wire saw is passed through the silicon rod, wherein an end face of the edge skin held by the holding member is aligned with the cutting wire saw in the first direction. Consequently, locating boundary skin dislocation mechanism during silicon rod processing equipment, predetermined between boundary skin dislocation mechanism and the cutting coping saw at the interval of predetermineeing of first direction, the interval between the boundary skin terminal surface of boundary skin dislocation mechanism and required top has been confirmed promptly, in the actual processing scene, when boundary skin dislocation mechanism moves certain distance in the first direction, based on this distance and the predetermined interval of boundary skin dislocation mechanism and cutting coping saw in the first direction, can learn the distance that the actual opposite side skin terminal surface of boundary skin dislocation mechanism promoted, so can be based on the displacement volume of the needs control boundary skin dislocation mechanism of opposite side skin promotion distance along the motion of first direction.

It should understand, treat that cutting silicon rod axis direction is along first direction, and the flaw-piece that forms in the cutting also follows first direction under by the bearing state, flaw-piece dislocation mechanism can follow first direction and promote the flaw-piece so that the relative flaw-piece supporting mechanism motion of flaw-piece to make the flaw-piece break away from flaw-piece supporting mechanism and can carry out subsequent transportation flow to the flaw-piece.

In some embodiments, the flaw-piece dislocation mechanism comprises: a power source; the telescopic rod is arranged along the first direction and used for telescopic motion under the driving of a power source to push the edge leather.

In one implementation, the power source of the flaw-piece dislocation mechanism is an air cylinder or a hydraulic pump, wherein a telescopic rod of the air cylinder or the hydraulic pump is arranged along a first direction. For example, in the embodiment shown in fig. 5, two parallel wire cutting units are arranged in the cutting device, the cutting device includes two flaw-piece dislocation mechanisms respectively arranged in the upper wire cutting unit and the lower wire cutting unit of the cutting frame, the flaw-piece dislocation mechanism is a cylinder 541 having a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the end face of the flaw-piece. After the cutting wire saw runs through the silicon rod to form independent flaw-piece, move along the first direction through the flaw-piece dislocation mechanism and lean on to the flaw-piece terminal surface and promote the flaw-piece motion, the flaw-piece can break away from flaw-piece supporting mechanism or break away from the silicon rod after the cutting from this. Here, the extension range of the telescopic rod of the flaw-piece dislocation mechanism may be determined based on the length specification of the silicon rod or based on the span of the supporting part of the supporting component in the first direction, so as to control the stroke of the flaw-piece pushed in the first direction to ensure that the flaw-piece can be separated.

Of course, it should be understood that the specific structure and location of the edge skin misalignment mechanism are not limited to the embodiment shown in fig. 5, and for example, in some examples, the edge skin misalignment mechanism may also be disposed on the base of the silicon rod processing apparatus.

For example, the cutting device of the present application is applied to a processing scenario of silicon rod processing equipment, in the silicon rod processing equipment, a silicon rod clamp is made to clamp a silicon rod and drive the silicon rod to move along a first direction, an annular cutting line of any line cutting unit in the cutting device is in a driven operation state, and a cutting wire saw and the silicon rod are relatively fed along the first direction to cut the surface of the silicon rod to form an axial section; in some scenes, the flaw-piece formed by cutting can be supported by a flaw-piece supporting mechanism in the cutting device so as to prevent the flaw-piece from breaking, and the flaw-piece formed after the cutting wire saw penetrates through the silicon rod can be pushed by the flaw-piece dislocation mechanism along the first direction so as to assist the flaw-piece to be timely unloaded.

In the cutting device provided by the first aspect of the present application, the cutting line is wound between the cutting wheel and the transition wheel in an end-to-end manner by determining the arrangement manner of the cutting wheel and the transition wheel, so that the overall structure of the cutting device can be simplified, which is beneficial to reducing the device cost; meanwhile, the annular cutting line can avoid the influence of the acceleration and deceleration processes of the cutting line on the cutting precision in the process of running to execute cutting, so that the cutting precision is improved, and the subsequent procedures are facilitated to be simplified.

The present application also provides, in a second aspect, a silicon rod processing apparatus comprising a machine base and a cutting device according to any one of the embodiments provided in the first aspect of the present application.

The base serves as a main body part of the silicon rod processing equipment and is provided with a silicon rod processing platform, and in one example, the size and the weight of the base are large so as to provide a larger mounting surface and firmer stability of the whole machine. It should be understood that the machine base can serve as a base for different structures or components of the silicon rod processing device for carrying out processing operations, and the specific structure of the machine base can be changed based on different functional or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure, such as a base, a rod body, a column body, a frame body and the like, for receiving different parts in the silicon rod processing equipment.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

The silicon rod processing platform can be provided with a processing device for processing the silicon rod, such as squaring cutting or grinding, and different regions can be arranged on the silicon rod processing platform, such as a processing region corresponding to the cutting device for squaring cutting, an unloading region corresponding to the flaw-piece formed by cutting for unloading, and the like, and the silicon rod is conveyed to a waiting region corresponding to the silicon rod processing device, so that the silicon rod processing device can perform processing operation. The shape of the silicon rod processing platform can be determined according to the machine base or can be determined according to the processing requirements of the machine base and the silicon rod processing device.

The cutting device comprises a wire cutting unit, wherein a cutting wire saw is arranged in the wire cutting unit to cut a horizontal silicon rod to be cut in an incision manner, and it is understood that the horizontal silicon rod to be cut is always in a horizontal state in the incision process, and the silicon rod to be cut is, for example, in a supported or clamped state. For example, in one example, the silicon rod to be cut is clamped by the silicon rod clamp and moves along a first direction under the driving of the silicon rod clamp, so that the cutting wire saw in the wire cutting unit is fed and cut relative to the silicon rod to be cut to realize the cutting of the silicon rod.

In certain embodiments, the silicon rod processing apparatus further comprises at least one silicon rod clamp for clamping and moving the silicon rod along the axis of the silicon rod to advance the silicon rod relative to the cutting wire saw of the cutting device. The silicon rod clamp described here is also referred to as a silicon rod clamping part, a silicon rod positioning part, etc., and is used to determine the position of the silicon rod and to load (or carry, clamp, limit) the silicon rod.

Regarding the silicon rod clamp, it is used to clamp a silicon rod at two end faces of the silicon rod, and in some embodiments, the silicon rod clamp may be disposed on a first-direction guiding structure on a silicon rod processing platform to drive the clamped silicon rod to move in a first direction.

Referring to fig. 6 in combination, fig. 7a and 7b, wherein fig. 6 is a schematic structural view of a silicon rod processing apparatus according to an embodiment of the present disclosure; fig. 7a and 7b respectively show a top view and a perspective view of any one of the silicon rod clamps and the corresponding guiding structure of the silicon rod processing apparatus described in fig. 6.

The silicon rod processing equipment is provided with a cutting device 20, a first silicon rod clamp 11 and a second silicon rod clamp 12, wherein the first silicon rod clamp 11 is arranged on a first guide structure 131 of a first processing position of the silicon rod processing platform, and the second silicon rod clamp 12 is arranged on a second guide structure 132 of a second processing position of the silicon rod processing platform. As for the guide structure, it may be a transfer guide, a guide pillar, a beam, a guide groove, or the like, which may be used to provide a degree of freedom of displacement in the first direction.

In certain embodiments, either of the first or second silicon rod clamps comprises: the clamping arm mounting seat is arranged on the corresponding transfer guide rail or guide pillar; the power source is used for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide pillar; the pair of clamping parts are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; a pair of clip arms, wherein each clip arm has a proximal end connected to the clip arm mount and a distal end connected to the gripping portion; the clamping arm driving mechanism is used for driving at least one of the pair of clamping arms to move along a first direction so as to adjust the distance between the pair of clamping arms along the first direction.

For the sake of understanding, the silicon rod holder 11 and the guiding structure 131 located in the first processing zone are explained below.

The silicon rod clamp 11 comprises a pair of clamping arms 113 for clamping two end surfaces of a silicon rod, wherein the distal ends of the clamping arms 113 are connected with clamping portions 114 for contacting the end surfaces of the silicon rod, the proximal ends of the clamping arms 113 are connected to a clamping arm mounting seat 111, the clamping arm mounting seat 111 is movably arranged on the guide structure and moves along the guide structure under the driving of a power source 112, and thus the clamping arms 113 and the clamping portions 114 at the distal ends of the clamping arms 113 are driven to move along the guide structure; the power source 112 is, for example, a servo motor, and the application is not limited thereto. The silicon rod clamp 11 further comprises a clamping arm driving mechanism 115 for driving at least one of the pair of clamping arms 113 to move in a first direction to adjust a distance between the pair of clamping arms 113 in the first direction, so that the clamping portions 114 respectively connected to the distal ends of the pair of clamping arms 113 can move closer to or away from each other by the clamping arm driving mechanism 115 to perform a clamping or releasing action on the silicon rod. It should be understood that the silicon rod axis is along a first direction, and in order to clamp the silicon rod on two end surfaces of the silicon rod, the distal ends of the pair of clamping arms 113 are respectively opposite to the corresponding clamping portions 114 along the first direction. The pair of clamping arms 113 are arranged along the horizontal direction, and when the power source 112 drives the clamping arm mounting base 111 to drive the clamping arms 113 and the silicon rods clamped by the clamping arms to move along the guide structure, the clamping arms 113 in motion can avoid the cutting wire saw. In other possible implementations, the pair of clamping arms 113 may also be arranged at an angle to the horizontal plane, and the range of movement of the clamping arms 113 is away from the cutting wire saw only during the process of ensuring that the silicon rod clamp 11 is moved to effect cutting.

In certain embodiments, the clamp arm drive mechanism includes a lead screw disposed in a first direction and associated with either one of the pair of clamp arms; and the driving source is used for driving the associated clamping arm to move along the first direction.

In other embodiments, the clamp arm drive mechanism comprises: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the pair of clamping arms; and the driving source is used for driving the screw rod to rotate so that the pair of clamping arms move towards or away from each other along the first direction.

In certain embodiments, either one of the first and second silicon rod clamps further comprises a clamping portion rotating mechanism for driving the clamping portion to rotate.

In one implementation manner of this embodiment, the clamping portion 114 corresponding to the pair of clamping arms 113 is provided with a rotatable structure, such as a rotatable base, and the clamping portion rotating mechanism 116 can be configured to drive the clamping portion 114 corresponding to at least one clamping arm 113 to rotate. The clamping part rotating mechanism 116 drives the clamping part 114 to rotate around the first direction as an axis, thereby rotating the clamped silicon rod along the axis of the silicon rod. In the cutting and grinding operation, the holding part rotating mechanism 116 drives the silicon rod to rotate along the axis thereof, so that the position relation of the held silicon rod relative to the cutting wire saw can be adjusted, the cutting surface of the silicon rod by the cutting device can be determined, and the position relation of the held silicon rod relative to the grinding device can be adjusted to determine the grinding surface relative to the silicon rod, namely, the silicon rod clamp can be matched with the cutting device and the grinding device to realize the selection and control of different cutting surfaces and grinding surfaces of the silicon rod.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod. In one embodiment, the projection of the clamping portion may be further connected to the clamping portion base by a spring in the first direction, whereby a multi-point floating contact may be formed, so that the silicon rod clamp may adapt to the flatness of the silicon rod end surface when clamping the silicon rod end surface for clamping the silicon rod. In some examples, the clamping end of the clamping portion for contacting the end surface of the silicon rod may also be connected to the clamping portion base by a universal mechanism, such as a universal ball, the clamping portion thereby being adaptable for clamping end surfaces of silicon rods having different inclinations.

It should be noted that the direction in which the pair of clamping arms are arranged is related to the cutting device, and the silicon rod clamp and the cutting device should be prevented from colliding or interfering with each other in the process that the silicon rod clamp drives the clamped silicon rod to move along the first direction so as to feed the silicon rod relative to the cutting wire saw; for example, when the cutting wire saw is disposed in the direction of the plumb line in the cutting apparatus, the grip arms of the silicon rod clamp may be disposed in the direction of the plumb line, and when the cutting wire saw is disposed in the horizontal direction, the grip arms of the silicon rod clamp may be disposed in the horizontal plane.

In further embodiments, the cutting device is movably arranged on the silicon rod processing platform, for example on a translation mechanism in a first direction, whereby a cutting wire saw in the wire cutting unit is movable in the first direction for feeding and cutting the clamped silicon rod. The translation mechanism comprises, for example, a guide rail and a drive, and the guide rail can be used for arranging a cutting frame of the cutting device.

Referring to fig. 8, a schematic structural diagram of a cutting apparatus according to an embodiment of the present disclosure is shown, wherein the cutting apparatus includes a wire cutting unit and a cutting frame. The cutting frame 21 has a guide groove 24 adapted to a guide rail, so that the cutting frame 21 can be movably disposed on the guide rail disposed on the silicon rod processing platform. The wire cutting unit comprises a plurality of cutting wheels, transition wheels, annular cutting wires wound around the cutting wheels and the transition wheels, and a wire cutting support 23 movably arranged on the cutting frame. The cutting device can move along the guide rail to adjust the cutting position relative to the silicon rod, but the cutting device can also move along a second direction relative to the cutting frame 21 through the driving wire to adjust the cutting position in the embodiment shown in fig. 8, namely, the direction in which the guide groove 24 is arranged is the second direction in the embodiment; it should be understood that in other embodiments, the configuration of the cutting device may be modified, for example, by providing a guide groove or other limiting structure at the bottom of the cutting frame in the first direction, and the cutting device may be driven to move to achieve feed cutting of the silicon rod.

The cutting may be performed by relatively moving the cutting device and the silicon rod held by the silicon rod holder in a first direction, and in some embodiments, the cutting device further comprises a flaw-piece supporting mechanism, which may assist in the cutting operation to form a complete flaw-piece. Still can be equipped with the flaw-piece dislocation mechanism among the cutting device to the flaw-piece that the messenger cuts and obtains breaks away from the state by the bearing, then is transported to the district of unloading.

In certain embodiments, the silicon rod processing apparatus further comprises a flaw-piece conveying mechanism for receiving the flaw-pieces formed by cutting and conveying the flaw-pieces to a discharge area. Here, the discharge zone is the flaw-piece discharge zone.

In one embodiment, the position of the edge skin transport structures in the second direction may be arranged in alignment with the cutting devices in the silicon rod processing apparatus, so that the edge skin formed by cutting the silicon rod may be transported by the corresponding edge skin transport structures, whereby transport of the edge skin may be reduced.

The direction and the position of the edge leather conveying mechanism can be determined by the position relation between the cutting area and the edge leather discharging area.

In one embodiment, the edge skin discharge area and the cutting area are arranged adjacent to each other in a first direction, and the edge skin conveying structure can be arranged in the first direction and butt-jointed with the cutting device, so that after the silicon rod is cut to form the edge skin, the edge skin is pushed in the first direction to be separated from the cut silicon rod or the supporting component, and then is transferred to the edge skin conveying structure, and therefore, the transfer path of the edge skin can be simplified. The number of the flaw-piece conveying mechanisms can also be determined according to the number, structure or working mode of the cutting devices in the silicon rod processing equipment, for example, when different processing areas are arranged in the silicon rod processing equipment, wherein the cutting devices are arranged on a plurality of the processing areas, and the flaw-piece conveying mechanisms can be correspondingly arranged on the plurality of the processing areas so as to correspond to the cutting devices; for another example, when the cutting device can perform the cutting operation on a plurality of silicon rods simultaneously, the number of the edge skin conveying mechanisms is multiple, so that each edge skin conveying mechanism corresponds to one silicon rod.

In certain embodiments, the flaw-piece conveying mechanism is a chain conveying mechanism, a double speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the flaw-piece delivery mechanism comprises: the conveying part is used for bearing the flaw-piece; and the conveying driving source is used for driving the conveying part to move so as to convey the flaw-piece.

Fig. 9 is a simplified structural schematic diagram of a silicon rod processing apparatus according to an embodiment of the present disclosure. As shown, the conveying unit 521 may be disposed along a first direction, and may transport the loaded edge leather along the first direction under the driving of the conveying driving source 522. The direction of movement of the conveyor 521 may be arranged in a direction towards the pelt discharge area (as indicated by the arrow in figure 7 a) in order to transport the loaded pelt to the pelt discharge area.

The conveying driving source 522 is, for example, a motor, and is configured to drive the conveying unit 521 to move and control the conveying speed of the conveying unit 521.

In some examples, in order to avoid the flaw-piece from being worn by collision during the conveying process, in some embodiments, the conveying part 521 is provided with a buffer pad for contacting with the flaw-piece, or the conveying part 521 is made of a buffer material. The cushion or cushioning material is, for example, rubber, silicone or other material having elastic deformation, damping or cushioning properties. Therefore, the damage risk of conveying the flaw-piece is reduced, and the flaw-piece reusing is facilitated.

In some embodiments, the silicon rod processing apparatus further comprises a grinding device for grinding the silicon rod after the cutting device has cut.

In certain implementations, the abrasive article includes a grinding wheel and a rotating shaft. In certain embodiments, the grinding wheel is circular and has a through hole disposed in the middle. The grinding wheel is connected to the rotating shaft to be controlled to rotate along the rotating shaft, so that the side surface of the cut silicon rod can be contacted in a rotating state to realize grinding. It will be appreciated that in a possible embodiment, the grinding means may also comprise a grinding wheel, but grinding takes an increased time in this arrangement.

The grinding wheel has certain granularity and roughness, and is formed by consolidating abrasive particles and a binding agent, so as to form a surface with the abrasive particles to contact and grind the side surface of the cut silicon rod. The grinding wheel has certain abrasive particle size and abrasive particle density, and the abrasive materials can be set into abrasive particles with hardness larger than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding a silicon rod.

In certain embodiments, the abrasive article may also be provided in the form of a rough abrasive article nested with a finish abrasive article, for example the abrasive article may be provided to include a rough abrasive wheel and a finish abrasive wheel. At least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism. For example, when the finish grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on a silicon rod by using the finish grinding wheel. Or when the accurate grinding wheel is nested in the rough grinding wheel, the accurate grinding wheel can be provided with a telescopic driving mechanism, when the rough grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to contract and recess in the rough grinding wheel so as to utilize the rough grinding wheel to carry out the rough grinding operation on the silicon rod, and when the accurate grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to extend out and protrude out of the rough grinding wheel so as to utilize the protruding accurate grinding wheel to carry out the accurate grinding operation on the silicon rod.

In some examples, the at least one grinding tool comprises two grinding wheels arranged oppositely and corresponding grinding wheel rotating shafts, and can be used for grinding two opposite side surfaces of the silicon rod simultaneously so as to improve the efficiency of grinding operation.

The grinding surface of the grinding tool can be arranged in a vertical plane or a horizontal plane. For example, when the grinding tool has a grinding surface disposed in a vertical plane (i.e., a plane parallel to the third direction), the grinding tool can grind the side surface of the cut silicon rod in the vertical plane; when the grinding surface of the grinding tool is arranged in the horizontal plane, the grinding tool can grind the upper and lower side surfaces of the cut silicon rod.

Referring to fig. 10, a schematic structural view of a portion of the silicon rod processing apparatus according to an embodiment of the present disclosure is shown. In the embodiment shown in fig. 10, a pair of grinding tools 301 of the grinding device 30 are disposed opposite to each other along the direction of the plumb line, and two grinding surfaces of the pair of grinding tools 301 are disposed in parallel and opposite to each other, wherein the grinding surface of any one of the grinding tools 301 is along a horizontal plane direction.

The grinding device may further include a grinder advancing and retreating mechanism, and the grinder advancing and retreating mechanism 302 is configured to drive at least one grinding grinder 301 of the at least one pair of grinding grinders 301 to move along the perpendicular bisector direction, so as to adjust a grinding amount of the cut silicon rod. In some embodiments, the sharpener advancing and retracting mechanism 302 comprises: the advance and retreat guide rail is arranged on the first conversion mechanism along the direction of the plumb line and used for arranging the grinding tool 301; a driving source for driving at least one of the grinding stones 301 to move along the advancing and retreating guide rails.

In one implementation, the sharpener advancing and retracting mechanism 302 includes a sliding guide, a drive motor, and a ball screw (not shown). Sliding guide locates along the plumb line direction first conversion mechanism, grind grinding apparatus 301 be provided with sliding guide complex is along the guide slot of plumb line direction, ball follows sliding guide sets up and with driving motor coupling. In other possible implementations, the driving source may also be configured as an air cylinder, a hydraulic pump, etc., and the telescopic direction thereof is configured as a plumb line direction; still alternatively, the driving source may be provided as a lead screw assembly including a lead screw connected to the grinder 301 to move the grinder 301 along the slide guide under the driving of the rotary driving source, and a rotary driving source.

In some embodiments, the grinding tool advancing and retreating mechanism includes a bidirectional screw rod and a driving source, wherein two sides of the bidirectional screw rod are provided with threads with opposite turning directions, the bidirectional screw rod is arranged along the direction of the plumb line, and two sides of the bidirectional screw rod are respectively connected to a grinding tool.

In the embodiment that the grinding surface of the grinding tool is arranged in the vertical plane, the advancing and retreating guide rail is arranged in the vertical line direction of the grinding surface, namely in the horizontal line direction; in an embodiment in which the grinding surface of the grindstone is provided in a horizontal plane, the advance/retreat guide rail is provided in a plumb line direction. The advance and retreat guide rail can be used for arranging the at least one grinding tool, and the advance and retreat driving unit drives the grinding tool to move along the advance and retreat guide rail.

In the embodiment in which the silicon rod processing apparatus comprises a cutting device and a grinding device, the cutting device, the grinding device and a silicon rod clamping or carrying device (e.g. a silicon rod clamp) cooperate to perform the cutting and grinding operation for the silicon rod to be processed. In order to illustrate the overall layout and the process conversion mode of the silicon rod processing equipment, the application further provides the following embodiments:

in certain embodiments, a first processing location and a second processing location are provided on the silicon rod processing platform, and the silicon rod processing apparatus further comprises: the transposition mechanism is connected with the cutting device and the grinding device and comprises a transposition rotating shaft, and the transposition rotating shaft is driven to rotate by a preset angle so as to enable the cutting device and the grinding device to switch positions between a first machining position and a second machining position.

With reference to fig. 6, the silicon rod processing apparatus includes a base 10, and a cutting device 20 and a grinding device 30 disposed on a silicon rod processing platform of the base 10. The cutting device 20 and the grinding device 30 are connected to the transposition mechanism 40 and are disposed on two sides of the transposition mechanism, so that the cutting device 20 and the grinding device 30 correspond to different processing positions respectively.

The transposition mechanism 40 comprises a transposition rotating shaft arranged in the direction of the plumb line, so that in the process that the cutting device 20 and the grinding device 30 are driven to rotate to switch the processing area, the height of the gravity center of the cutting device 20 and the grinding device 30 is not changed, the stability of the switching process can be improved, the equipment safety is benefited, and the moment or force borne by the transposition mechanism 40 for driving the cutting device 20 and the grinding device 30 to switch the processing area is reduced. In the embodiment in which the index rotation shaft is disposed in the plumb line, the grinding device 40 may be configured to include: at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are parallel and are oppositely arranged; and a grinding tool advancing and retreating mechanism for driving at least one of the pair of grinding tools to move in the direction of the plumb line, so as to control the feeding amount, i.e. the grinding amount, of the grinding tool relative to the silicon rod.

Regarding the index mechanism 40, in an embodiment, the index mechanism 40 further includes a rotation driving mechanism for driving the cutting device 20 and the grinding device 30 to rotate, for example, a driving motor coupled to the index shaft; in another embodiment, the rotational drive mechanism comprises: the driving gear is coupled to the power driving source; and the driven gear is meshed with the driving gear and connected with the transposition rotating shaft, the driving gear rotates under the driving of a driving source, so that the meshed driven gear is driven to rotate, and the driven gear can be used for bearing or connecting the grinding device 30 and the cutting device 20 so as to drive the grinding device 30 and the cutting device 20 to switch between a first processing area and a second processing area.

In a processing scenario, the silicon rod processing device executes the following processing procedures:

the method comprises the steps that a first silicon rod is loaded to a first silicon rod clamp, the first silicon rod clamp can drive the first silicon rod to move along a first direction so as to feed relative to a cutting wire saw to realize cutting, the first silicon rod clamp can drive the first silicon rod to move in a first direction in a recovering mode so that the silicon rod can feed relative to the cutting wire saw for multiple times until four sections are formed on the surface of the silicon rod, and the cut silicon rod with a rectangular or similar rectangular section is obtained.

Wherein, in the cutting process, the first silicon rod moves in the cutting accommodating space of the wire cutting unit, and the annular cutting wire wound in the wire cutting unit is driven to operate to cut the silicon rod; in some cases, the flaw-piece supporting mechanism in the cutting device can be also used for supporting the flaw-pieces formed by cutting to assist in obtaining the complete flaw-pieces, and the flaw-pieces supported by the cutting device can be pushed out by the flaw-piece dislocation mechanism to enable the flaw-pieces to be transferred to the flaw-piece conveying mechanism of the silicon rod processing equipment so as to transfer the flaw-pieces formed by cutting to the flaw-piece discharging area.

After the first cut silicon rod is obtained through processing, the transposition mechanism drives the cutting device and the grinding device to switch positions between a first processing position and a second processing position, the grinding device is switched to the first processing position, the first silicon rod clamp can drive the clamped first cut silicon rod to move along a first direction in the state, the grinding device drives the grinding tool to move along the direction of the plumb line to contact with the side face of the first cut silicon rod to realize grinding, the first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod to switch the grinding face of the grinding device relative to the silicon rod, and therefore the ground silicon rod can be obtained.

In the process of grinding operation at the first processing position, the second silicon rod clamp can load a second silicon rod to be processed, and similarly, the second silicon rod clamp can drive the second silicon rod to move in a first direction so that the silicon rod can be fed relative to the cutting wire saw for multiple times until four sections are formed on the surface of the silicon rod, namely, the cut silicon rod with a rectangular or quasi-rectangular section is obtained; the cutting device here performs a cutting operation on the second silicon rod located in the second processing region in a similar manner to the cutting of the first silicon rod.

Discharging the ground silicon rods at the first processing position, loading a third silicon rod to be cut by the first silicon rod clamp, driving the cutting device and the grinding device to switch positions by the transposition mechanism, and cutting the third silicon rod clamped by the first silicon rod clamp by the cutting device; the grinding device may grind the cut second silicon rod held by the second silicon rod clamp.

By repeating the process, the silicon rod processing equipment can perform processing operation of different procedures at the same time, and the transposition mechanism realizes effective connection of different procedure flows; the cutting device performs cutting by the annular cutting line capable of running at high speed, so that the silicon rod after cutting with high precision can be obtained, and the subsequent grinding process is simplified.

The silicon rod processing equipment of this application still can do other transformations, and in some embodiments, be equipped with first processing position and second processing position on the silicon rod processing platform, silicon rod processing equipment still includes: the first conversion mechanism is arranged at a first installation position on the silicon rod processing platform, is connected with the cutting device, and comprises a first rotating shaft, and drives the first rotating shaft to rotate by a preset angle so as to convert the position of the cutting device between a first processing position and a second processing position; the second switching mechanism is arranged at a second mounting position on the silicon rod processing platform and connected with the grinding device, comprises a second rotating shaft and drives the second rotating shaft to rotate by a preset angle so as to enable the grinding device to switch positions between the first processing area and the second processing area.

Fig. 11 is a schematic structural view of a silicon rod processing apparatus according to an embodiment of the present disclosure.

In this embodiment, the silicon rod processing apparatus comprises: a machine base 10, a silicon rod clamp, a cutting device 41 and a grinding device 33. Be equipped with first processing position and second processing position on the silicon rod processing platform, silicon rod processing equipment still includes: a first conversion mechanism 43 and a second conversion mechanism 45.

The first mounting position and the second mounting position are not the same, and the first conversion mechanism 43 and the second conversion mechanism 45 are correspondingly arranged at different positions of the silicon rod processing platform. The first and second mounting positions should be such that the cutting device 23 and the grinding device 33 do not interfere with each other during the transition to the machining zone. In some embodiments, the first and second mounting locations can be disposed between the first and second processing locations. In one implementation, the first mounting position and the second mounting position may be further disposed in a central region between the first processing region and the second processing region. For example, when the first processing region and the second processing region are parallel and symmetrically disposed, the first mounting position and the second mounting position may be disposed on a symmetrical line of the first processing region and the second processing region.

The first conversion mechanism and the second conversion mechanism can relatively independently drive the corresponding cutting device and the grinding device, and the directions of the first rotating shaft and the second rotating shaft can be set to be the same direction or different directions.

In some embodiments, the first axis of rotation is disposed in a first direction and the second axis of rotation is disposed in a plumb line direction; the first processing area and the second processing area are arranged on two opposite sides of the second direction, wherein the first direction, the second direction and the plumb line direction are pairwise perpendicular.

Referring to fig. 12, a schematic view of a portion of the silicon rod processing apparatus shown in fig. 11 is shown.

In one embodiment, the first conversion mechanism 43 includes: a support 430 for positioning the cutting device; a rotation driving source 432 for driving the cutting device to rotate along the first rotation axis 431 relative to the frame 430 to switch the position between the first processing position and the second processing position. In the embodiment shown in fig. 11, the cutting frame 411 of the cutting device is connected to the first rotating shaft 431, and at least one wire cutting unit provided on the cutting frame 411 rotates along the first rotating shaft along with the cutting frame 411. The bracket 430 may serve as a base of the first converting mechanism 43, and the cutting device may be movably disposed on the bracket 430 based on the first rotating shaft 431, and may be driven by the rotating driving source 432 to rotate along the first rotating shaft 431 relative to the bracket 430. The rotation drive source 432 is, for example, a motor having a power output shaft, which is connectable to the first rotation shaft 431.

With regard to the second conversion mechanism, in an embodiment, the second conversion mechanism further includes a rotation driving mechanism for driving the grinding device to rotate and shift, for example, a driving motor coupled to the shift rotating shaft; in another embodiment, the rotational drive mechanism comprises: the driving gear is coupled to the power driving source; the driven gear is meshed with the driving gear and connected with the transposition rotating shaft, the driving gear rotates under the driving of the driving source, the meshed driven gear is driven to rotate, and the driven gear can be used for bearing or connecting the grinding device to drive the grinding device to switch between a first machining area and a second machining area.

The cutting device is connected to the first conversion mechanism, the grinding device is connected to each embodiment of the second conversion mechanism, a first silicon rod clamp and a second silicon rod clamp can be respectively arranged on the first processing area and the second processing area, and are used for clamping a silicon rod and driving the silicon rod to move along a first direction on the processing area, so that the silicon rod to be cut is fed relative to the cutting wire saw to realize cutting, and the silicon rod to be ground moves relative to the grinding device along the first direction to enable the grinding surface of the grinding tool to cover the whole side surface of the silicon rod.

taking the initial moment as an example that the cutting device is located at the first processing location, a first silicon rod is loaded to a first silicon rod clamp, the first silicon rod clamp can drive the first silicon rod to move along the first direction so as to feed relative to the cutting wire saw to realize cutting, the first silicon rod clamp can drive the first silicon rod to return and move in the first direction so that the silicon rod is fed relative to the cutting wire saw for multiple times until four sections are formed on the surface of the silicon rod, and the cut silicon rod with a rectangular or similar rectangular section is obtained.

After the cut first silicon rod is obtained through processing, the first conversion mechanism drives the cutting device to rotate for a preset angle along the first rotating shaft so as to be switched from the first processing position to the second processing position, the cutting device is switched to the second processing position, meanwhile, the second conversion mechanism drives the grinding device to rotate for a preset angle along the second rotating shaft so as to be switched to the first processing position, in this state, the first silicon rod clamp can drive the clamped cut first silicon rod to move along the first direction, the grinding device drives the grinding tool to move along the direction of the plumb line so as to contact the side face of the cut silicon rod to realize grinding, the first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod so as to switch the grinding face of the grinding device relative to the silicon rod, and therefore the ground silicon rod can be obtained.

In the process of grinding operation at the first processing position, the second silicon rod clamp can be used for loading a second silicon rod to be cut; similarly, the second silicon rod clamp can drive the second silicon rod to move back in the first direction so that the silicon rod is fed relative to the cutting wire saw for multiple times until four sections are formed on the surface of the silicon rod, and the cut silicon rod with a rectangular or quasi-rectangular section is obtained.

And discharging the ground silicon rod at the first processing position, loading a third silicon rod to be cut on the first silicon rod clamp, driving the cutting device to convert the processing position by the first conversion mechanism, driving the grinding device to convert the processing position by the second conversion mechanism, and cutting the third silicon rod clamped by the first silicon rod clamp by the cutting device.

Fig. 13 is a schematic structural view of a silicon rod processing apparatus according to another embodiment of the present disclosure.

In certain implementations, the cutting device and the grinding device are switched in position by a linear motion mechanism.

As shown, the silicon rod processing apparatus includes a base, a cutting device 25, a grinding device 35, and a silicon rod loading and unloading device (not shown).

Be equipped with first processing position and second processing position on the silicon rod processing platform, silicon rod processing equipment still includes: a cutting switching mechanism 61 having a cutting switching guide 611, driving the cutting device 25 to move along the cutting switching guide 611 to switch the position between the first processing location and the second processing location; and a grinding conversion mechanism 63 having a grinding conversion rail 631, wherein the grinding tool in the grinding device 35 is driven to move along the grinding conversion rail 631 to convert the position between the first processing area and the second processing area.

In an embodiment of the present application, the cutting switching mechanism 61 is used for driving the cutting frame 251 of the cutting device 25 and at least one wire cutting unit thereon to switch between the first processing position and the second processing position.

The first processing area and the second processing area are arranged along a first direction and are located on two opposite sides of the silicon rod processing platform in a second direction. The cutting conversion rail 611 of the cutting conversion mechanism 61 passes through the first and second processing locations in the second direction, and the grinding conversion rail 631 of the grinding conversion mechanism 63 passes through the first and second processing locations in the second direction. The cutting conversion guide rail 611 and the grinding conversion guide rail 631 are arranged along the second direction and are respectively arranged on two opposite sides of the silicon rod processing platform in the first direction.

In this example, the cutting frame 251 and the at least one wire cutting unit thereon may be driven to move in the second direction by the cutting switching mechanism 61 to switch between the first processing location and the second processing location, for example, the cutting switching mechanism 61 may be used to drive the cutting frame 251 and the at least one wire cutting unit thereon to move in the second direction to switch from the first processing location to the second processing location, or the cutting switching mechanism 61 may be used to drive the cutting frame 251 and the at least one wire cutting unit thereon to move in the second direction to switch from the second processing location to the first processing location.

In the silicon rod processing apparatus described in this embodiment, for a silicon rod in any one processing region, for example, the first processing region, the cutting switching mechanism 61 is used to drive the cutting frame 251 and at least one wire cutting unit thereon to move along the second direction until the cutting unit is located in the first processing region, after the cutting device 25 cuts the silicon rod at the first processing region in the opening direction, the cut silicon rod is moved along the first direction to be aligned with the grinding device 35 in the first direction, and the grinding switching mechanism 63 is used to drive the grinding tool to move along the second direction to the first processing region, so that the cut silicon rod can be ground.

Regarding the grinding conversion mechanism, in one embodiment, the grinding device is provided with at least one pair of grinding tools and at least one tool conversion mechanism. The grinder conversion mechanism includes: the grinding tool conversion guide rail and the grinding tool conversion driving unit.

As shown in fig. 13, the grinder transfer rail 631 is disposed in a second direction for setting the grinding grinder. In certain embodiments, the abrasive tool transfer rail 631 is disposed on the silicon rod processing platform in a second direction, and the at least one pair of abrasive tools is mounted on the abrasive tool transfer rail 631 by, for example, a slider or the like.

The grinder converting driving unit (not shown) is used for driving the pair of grinding grinders to move along the grinder converting guide rail so as to switch between the first processing area and the second processing area. In certain embodiments, the grinder conversion drive unit comprises: a movable rack, a driving gear and a driving source. The movable rack is arranged along a second direction and is parallel to the grinding tool conversion guide rail.

The grinding tool is provided with a grinding tool mounting seat, and the driving gear is arranged on the grinding tool mounting seat, is meshed with the movable rack and is used for driving the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The drive source is used for driving the drive gear. In an implementation of the present application, the driving gear is disposed on the grinder mounting seat, the driving gear is driven to rotate by the driving source, the gear teeth of the driving gear are engaged with the moving rack to travel in compliance with the moving rack, and at least one pair of grinders connected with the driving gear generates corresponding movement on the grinder conversion guide rail.

In some embodiments, the grinder converting driving unit may be disposed on the grinder mounting seat, and include a moving screw rod disposed in the second direction and associated with the pair of grinders, and a driving source for driving the moving screw rod to rotate to move the associated pair of grinders along a grinder converting rail.

In certain embodiments, the grinder-conversion-drive unit may further control a position of each of the pair of grinders in the second direction, thereby controlling a grinding feed amount of the grinders with respect to the silicon rod.

In each embodiment that the cutting device is connected with the cutting and converting mechanism, and the grinding device is connected with the grinding and converting mechanism, the first processing region and the second processing region can be respectively provided with a first silicon rod clamp and a second silicon rod clamp which are used for clamping a silicon rod on the processing region and driving the silicon rod to move along a first direction, so that the silicon rod to be cut is fed relative to the cutting wire saw to realize cutting, and the silicon rod to be ground moves relative to the grinding device along the first direction to enable the grinding surface of the grinding tool to cover the whole side surface of the silicon rod.

The cutting device is switched from the first processing area to the second processing area by the cutting switching mechanism, and the grinding device is switched to the first processing area by the grinding switching mechanism.

Driving the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp to move along a first direction, and enabling the grinding device to grind the first silicon rod; meanwhile, the second silicon rod clamp is used for loading another second silicon rod to be cut, the second silicon rod clamp and the second silicon rod clamped by the second silicon rod clamp are driven to move along the first direction, and the silicon rod cutting device is used for cutting the second silicon rod to form a silicon rod with a rectangular or quasi-rectangular cross section; wherein the cutting process of the second silicon rod by the cutting device is similar to the cutting process of the first silicon rod.

The first silicon rod which is finished with the grinding operation is unloaded, the cutting device is switched from the second processing area to the first processing area by the cutting switching mechanism, and the grinding device is switched from the first processing area to the second processing area by the grinding switching mechanism. Therefore, the silicon rods after being cut in the second processing area can be ground by the grinding device, the third silicon rod is loaded on the first silicon rod clamp, the cutting operation can be carried out by the cutting device in the first processing area, the corresponding cutting process can refer to the cutting process of the first silicon rod, and the description is omitted here.

The subsequent processing process is similar to the steps, and the steps are repeated, so that the silicon rod processing equipment can simultaneously carry out cutting operation and grinding operation, different process flows are automatically realized, the transfer path is simplified, and the processing efficiency is effectively improved; the cutting device performs cutting by the annular cutting line capable of running at high speed, so that the silicon rod after cutting with high precision can be obtained, and the subsequent grinding process is simplified.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. A cutting device for silicon rod processing, comprising: cutting frame and at least a wire cutting unit, wherein, wire cutting unit includes:

cutting a line;

the cutting wire saw comprises a first cutting wheel and a second cutting wheel which are arranged on a cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and a cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw;

the first transition wheel is arranged beside the first cutting wheel and used for pulling the cutting line wound on the first cutting wheel so that the cutting line wound on the first cutting wheel is coplanar with the plane of the first cutting line groove of the first cutting wheel;

the second transition wheel is arranged beside the second cutting wheel and used for pulling the cutting line wound on the second cutting wheel so that the cutting line wound on the second cutting wheel is coplanar with the plane of the second cutting line groove of the second cutting wheel;

the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the wire cutting unit;

the cutting line is wound among the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed loop cutting line connected end to end.

2. The cutting device of claim 1, wherein the first transition wheel, second transition wheel, and at least a third transition wheel are configured to pull the cutting line away from the cutting accommodation.

3. The cutting device of claim 1, wherein the wire cutting unit comprises two third transition wheels, and wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel and the first cutting wheel to form a closed loop cutting wire connected end to end.

4. The cutting device according to claim 1, further comprising a cutting wire driving device for driving the cutting wire to operate to cut the silicon rod.

5. The cutting device according to claim 4, characterized in that the cutting wire drive is a motor having a power take-off shaft and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel.

6. The cutting device according to claim 1, further comprising at least one distance adjusting mechanism disposed on the at least one wire cutting unit for driving the plurality of cutting wheels and the plurality of transition wheels in the wire cutting unit to move in a direction perpendicular to the wheel surface of the cutting wheels.

7. The cutting device according to claim 6, characterized in that it comprises a single-wire cutting unit, said pitch adjustment mechanism comprising:

the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit;

and the driving source is used for driving the screw rod to rotate.

8. The cutting device according to claim 6, characterized in that it comprises a single-wire cutting unit, said pitch adjustment mechanism comprising:

the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit;

and the driving source is used for driving the telescopic piece to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

9. The cutting device according to claim 6, characterized in that it comprises a single-wire cutting unit, said pitch adjustment mechanism comprising:

the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel;

the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate.

10. The cutting device according to claim 6, characterized in that the cutting device comprises a first and a second wire cutting unit arranged in parallel and opposite, at least one of the first and second wire cutting unit being driven by the pitch adjustment mechanism to move in orthogonal direction of the wheel face of the cutting wheel.

11. The cutting device of claim 10, wherein the pitch mechanism comprises:

the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit;

and the driving source is used for driving the screw rod to rotate.

12. The cutting device of claim 10, wherein the pitch mechanism comprises:

the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the first wire cutting unit or the second wire cutting unit;

and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

13. The cutting device of claim 10, wherein the pitch mechanism comprises:

a bidirectional screw rod which is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit and the second wire cutting unit,

and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel.

14. The cutting device of claim 10, wherein the pitch mechanism comprises:

a first rack arranged along the orthogonal direction of the wheel surface of the cutting wheel and associated with the first wire cutting unit;

the second rack is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the second wire cutting unit;

the transmission gear is meshed with the first rack and the second rack;

and the driving source is used for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move in opposite directions or move in opposite directions along the orthogonal direction of the wheel surface of the cutting wheel.

15. The cutting device according to claim 1, further comprising a flaw-piece supporting mechanism for abutting against an outer side of the silicon rod and supporting the flaw-piece formed by cutting.

16. The cutting device of claim 15, wherein the flaw-piece supporting mechanism comprises:

at least one holding assembly, said holding assembly comprising:

the supporting part is controlled to abut against and support the flaw-piece;

the driving unit is connected with the bearing part to control the bearing part to be far away from or abut against the flaw-piece;

and the mounting part is used for connecting the at least one bearing component with the cutting device.

17. The cutting device according to claim 1 or 15, further comprising a flaw-piece displacing mechanism disposed on the cutting device for pushing the flaw-piece in a first direction to separate the flaw-piece from the flaw-piece supporting mechanism or the cut silicon rod.

18. The cutting device of claim 17, wherein the flaw-piece misalignment mechanism comprises:

a power source;

the telescopic rod is arranged along the first direction and used for telescopic motion under the driving of a power source to push the edge leather.

19. A silicon rod processing apparatus, comprising:

the base is provided with a silicon rod processing platform;

the cutting device as claimed in any of claims 1 to 18, for cutting silicon rods to be cut.

20. The silicon rod processing apparatus as set forth in claim 19, further comprising a flaw-piece conveyor mechanism for receiving the flaw-pieces formed by the cutting and transporting the flaw-pieces to a discharge area.

21. The silicon rod processing apparatus as set forth in claim 20, wherein the flaw-piece conveying mechanism comprises:

the conveying part is used for bearing the flaw-piece;

and the conveying driving source is used for driving the conveying part to move so as to convey the flaw-piece.

22. The silicon rod processing apparatus as recited in claim 19, further comprising at least one silicon rod holder for holding and moving the silicon rod in the direction of the silicon rod axis for feeding the silicon rod relative to the cutting wire saw of the cutting device.

23. The silicon rod processing apparatus as recited in claim 19, further comprising a grinding device for grinding the silicon rod after the cutting device has cut it.

24. The silicon rod processing apparatus as recited in claim 23, wherein the silicon rod processing platform is provided with a first processing location and a second processing location, the silicon rod processing apparatus further comprising:

the transposition mechanism is connected with the cutting device and the grinding device and comprises a transposition rotating shaft, and the transposition rotating shaft is driven to rotate by a preset angle so as to enable the cutting device and the grinding device to switch positions between a first machining position and a second machining position.

25. The silicon rod processing apparatus as recited in claim 23, wherein the silicon rod processing platform is provided with a first processing location and a second processing location, the silicon rod processing apparatus further comprising:

the first conversion mechanism is arranged at a first installation position on the silicon rod processing platform, is connected with the cutting device, and comprises a first rotating shaft, and drives the first rotating shaft to rotate by a preset angle so as to convert the position of the cutting device between a first processing position and a second processing position;

the second switching mechanism is arranged at a second mounting position on the silicon rod processing platform and connected with the grinding device, comprises a second rotating shaft and drives the second rotating shaft to rotate by a preset angle so as to enable the grinding device to switch positions between the first processing area and the second processing area.

26. The silicon rod processing apparatus as recited in claim 23, wherein the silicon rod processing platform is provided with a first processing location and a second processing location, the silicon rod processing apparatus further comprising:

a cutting switching mechanism having a cutting switching guide rail, the cutting mechanism being driven to move along the cutting switching guide rail to switch positions between a first processing location and a second processing location;

and the grinding conversion mechanism is provided with a grinding conversion guide rail, and drives the grinding tool in the grinding device to move along the grinding conversion guide rail so as to convert the position between the first processing area and the second processing area.