CN114750311A

CN114750311A - Method for cutting silicon rod by single wire and double wires, cutting equipment and cutting system

Info

Publication number: CN114750311A
Application number: CN202210421496.4A
Authority: CN
Inventors: 于文文; 范国强; 夏金玲; 王叶兰
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2022-04-21
Filing date: 2022-04-21
Publication date: 2022-07-15

Abstract

The embodiment of the application provides a method, cutting equipment and a cutting system for cutting a silicon rod by a single wire and a double wire, wherein the method comprises the following steps: cutting the silicon rod through a cutting line along the length direction of the silicon rod, and forming a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod; the silicon rod is cut once along the length direction of the silicon rod through two cutting lines, a second side surface and a third side surface are formed after cutting, the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod; and cutting the silicon rod through two cutting lines along the length direction of the silicon rod, wherein the formed cutting plane is parallel and/or vertical to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained. According to the method for cutting the silicon rod by the single wire and the double wires, the silicon rod with a small size can be directly obtained, a silicon wafer is formed by slicing, the requirement on the small-size silicon wafer is met, and the yield can be improved.

Description

Method for cutting silicon rod by single wire and double wires, cutting equipment and cutting system

Technical Field

The application relates to a hard material cutting technology, in particular to a method, cutting equipment and a cutting system for single-wire double-wire cutting of a silicon rod.

Background

With the development of heterojunction cells, the demand for small silicon wafers is increasing, and the demand for thin wafers is also large. The thickness of the silicon wafer is from 180 micrometers to 150 micrometers, the future market even needs the silicon wafer with the thickness of 100 micrometers, the thinner the silicon wafer is, the greater the cutting difficulty is, and the cutting quality is difficult to ensure.

In the traditional scheme, a cylindrical silicon single crystal rod is usually cut into a square rod, then the square rod is cut into a large silicon wafer, and then the large silicon wafer is scribed and cut by adopting a laser technology to form a small silicon wafer, but the cross section of the small silicon wafer is damaged and defective in the laser scribing process, so that the conversion efficiency of the finally processed heterojunction battery is seriously influenced.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides a method, a cutting device and a cutting system for cutting a silicon rod by a single wire and a double wire.

According to a first aspect of embodiments of the present application, there is provided a method for single-wire double-wire cutting of a silicon rod, comprising:

cutting the silicon rod through a cutting line along the length direction of the silicon rod, and forming a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod;

the silicon rod is cut once along the length direction of the silicon rod through two cutting lines, a second side surface and a third side surface are formed after cutting, the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod;

and cutting the silicon rod through two cutting lines along the length direction of the silicon rod, wherein the formed cutting plane is parallel and/or vertical to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained.

According to a second aspect of embodiments of the present application, there is provided a cutting apparatus applying the above method for single-wire, double-wire cutting of a silicon rod, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises a wire wheel support and a single wire cutting wheel set and/or a double wire cutting wheel set arranged on the wire wheel support, wherein a cutting wire is wound on the single wire cutting wheel set and is used for cutting the silicon rod through the cutting wire; the double-wire cutting wheel set is wound with two mutually perpendicular or parallel cutting wires and is used for cutting the silicon rod through the two cutting wires.

According to a second aspect of embodiments of the present application, there is provided a cutting system for single-wire double-wire cutting of a silicon rod, comprising:

a cutting device as described above; and grinding equipment for grinding the silicon rod.

According to the technical scheme provided by the embodiment of the application, the silicon rod is cut along the length direction of the silicon rod through a cutting line, a first side surface is formed after cutting, and the width of the first side surface is smaller than the diameter of the silicon rod; then, cutting the silicon rod for one time along the length direction of the silicon rod through two cutting lines to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod; and cutting the silicon rod along the length direction of the silicon rod through two cutting lines, wherein the formed cutting surfaces are parallel and/or vertical to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained. The size of the small silicon rod can better meet the requirement of the heterojunction battery, the silicon wafer is not required to be cut by laser, the yield of the silicon wafer is improved, and the conversion efficiency of the heterojunction battery is further guaranteed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod by a single wire and two wires according to an embodiment of the present disclosure;

fig. 2 is a flowchart of a method for cutting a silicon rod by a single wire and two wires according to a second embodiment of the present application;

FIG. 3 is a schematic structural view of a single-wire double-wire cut silicon rod provided in the second embodiment of the present application;

FIG. 4 is a schematic view of another single-wire double-wire cutting silicon rod structure provided in the second embodiment of the present application;

fig. 5 is a flowchart of a method for cutting a silicon rod by a single wire double wire according to a third embodiment of the present application;

FIG. 6 is a schematic view of a single-wire double-wire cutting silicon rod structure provided in the third embodiment of the present application;

fig. 7 is a flowchart of a method for cutting a silicon rod by a single wire and two wires according to a fourth embodiment of the present application;

FIG. 8 is a schematic view of a single-wire double-wire cutting silicon rod structure provided in the fourth embodiment of the present application;

FIG. 9 is a flowchart illustrating a method for cutting a silicon rod with a single wire by two wires according to a fourth embodiment of the present application;

FIG. 10 is a schematic view of a single-wire double-wire cutting silicon rod structure provided in the fourth embodiment of the present application;

fig. 11 is a schematic structural diagram of a vertical cutting apparatus provided in the fifth embodiment of the present application;

fig. 12 is a schematic structural diagram of a linear cutting device of a vertical cutting apparatus according to a fifth embodiment of the present application;

fig. 13 is a schematic structural diagram illustrating a silicon rod being cut by a single-wire cutting wheel set in the vertical cutting apparatus according to the fifth embodiment of the present application;

fig. 14 is a schematic view illustrating a structure of a double-wire parallel cutting wheel set for cutting a silicon rod in a vertical cutting apparatus according to a fifth embodiment of the present application;

fig. 15 is a schematic structural diagram illustrating a double-wire vertical cutting wheel set cutting a silicon rod in the vertical cutting apparatus according to the fifth embodiment of the present application;

fig. 16 is a schematic structural diagram of a horizontal cutting apparatus provided in the fifth embodiment of the present application;

fig. 17 is a schematic structural diagram of a linear cutting device of a horizontal cutting apparatus according to a fifth embodiment of the present application;

fig. 18 is a schematic view illustrating a structure of a single-wire cutting wheel set for cutting a silicon rod in a horizontal cutting apparatus according to a fifth embodiment of the present application;

fig. 19 is a schematic structural view illustrating a silicon rod being cut by a double-line parallel cutting wheel set in the horizontal cutting apparatus according to the fifth embodiment of the present application;

fig. 20 is a schematic view of a structure in which a two-wire vertical cutting wheel set cuts a silicon rod in a horizontal cutting apparatus according to a fifth embodiment of the present application.

Reference numerals:

1-a silicon rod; 11-a first side; 12-a second side; 2-a square bar; 3-small silicon rods; 31-daughter silicon rods; 4-a silicon wafer; 41-sub-silicon wafer; 51-a first cut line; 52-second cut line; 53-third cut line; 54-a fourth cut line; 55-a fifth cut line; 56-sixth cutting line; 61-a base; 62-a frame; 7-a bearing platform; 8-a wire cutting device; 81-wire wheel bracket; 82-a cutting wheel; 83-cutting line.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a method for cutting a silicon rod by a single wire and a double wire, which is used for cutting a single crystal silicon rod or a polycrystalline silicon rod. The cross-section of the silicon rod may be circular, elliptical or irregular. In this embodiment, a silicon rod with a circular cross section is taken as an example for explanation, the silicon rod is cylindrical and has two circular end surfaces and a circumferential side surface located between the two end surfaces, and a center line of the silicon rod passes through centers of the two end surfaces and is perpendicular to the two end surfaces. The length direction of the silicon rod is parallel to the central line of the silicon rod.

The silicon rod can be cut by cutting equipment such as a squaring machine, and cutting lines are arranged on the cutting equipment and used for cutting the silicon rod. The cutting wire may be specifically a diamond wire on which a plurality of fine-grained diamonds are provided.

Fig. 1 is a flowchart of a method for cutting a silicon rod by a single wire and two wires according to an embodiment of the present disclosure. As shown in fig. 1, the method for cutting a silicon rod by a single wire and a double wire according to the present embodiment includes:

step 101, cutting the silicon rod through a cutting line along the length direction of the silicon rod to form a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod.

In the cutting process, the extension direction of the cutting line for applying cutting force to the silicon rod is parallel to the end surface of the silicon rod. The silicon rod is cut along the length direction of the silicon rod by a cutting line to form a first side surface. The first side surface is parallel to the length direction of the silicon rod. The width of the first side face is smaller than the diameter of the silicon rod, namely: the intersection line of the first side surfaces and the end surface of the silicon rod is a chord of the end surface, and the two first side surfaces do not pass through the central line of the silicon rod.

102, cutting the silicon rod once along the length direction of the silicon rod through two cutting lines to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod.

The two cutting lines are parallel and are vertically crossed with the first side surface. The two parallel lines do not pass through the center line of the silicon rod.

And 103, cutting the silicon rod along the length direction of the silicon rod through two cutting lines, wherein the formed cutting surfaces are parallel and/or vertical to the first side surface, and thus obtaining two small silicon rods with rectangular cross sections.

The two cutting lines in the step are parallel and/or perpendicular to the first side surface, and two small silicon rods with rectangular cross sections are obtained after the silicon rods are cut. Each small silicon rod has two bottom surfaces which are respectively part of the bottom surface of the silicon rod, and the small silicon rod has four side surfaces, and each side surface is a plane.

According to the technical scheme provided by the embodiment, the silicon rod is cut along the length direction of the silicon rod through a cutting line, a first side surface is formed after cutting, and the width of the first side surface is smaller than the diameter of the silicon rod; then, cutting the silicon rod for one time through two cutting lines along the length direction of the silicon rod to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod; and cutting the silicon rod along the length direction of the silicon rod through two cutting lines, wherein the formed cutting surfaces are parallel and/or vertical to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained. The size of the small silicon rod can better meet the requirement of the heterojunction battery, the silicon wafer is not required to be cut by laser, the yield of the silicon wafer is improved, and the conversion efficiency of the heterojunction battery is further guaranteed.

In addition, according to the scheme provided by the embodiment, at least two large-size edge leather materials are obtained after cutting, and each edge leather material is provided with a plane and an arc surface. And subsequently, the side cladding is cut to obtain a silicon rod with smaller size, and then the silicon rod is cut to obtain a small silicon wafer with smaller size so as to meet the requirements of different heterojunction batteries, raw materials can be better utilized, the waste of the raw materials is reduced, and the production cost is reduced.

The ratio of the cross-sectional areas of the two small silicon rods is greater than or equal to 1:3, for example, 1:3, 1:2, or 1: 1. When the ratio of the cross-sectional areas of the two small silicon rods is 1:1, it is equivalent to that the cross-sectional areas of the two small silicon rods are equal.

Furthermore, one small silicon rod can be cut along the length direction of the silicon rod through one cutting line, and the small silicon rod is cut into two sub-silicon rods with rectangular cross sections, so that the silicon rod with a smaller cross section area is obtained to meet the requirements of heterojunction batteries with different sizes. The cross-sectional areas of the sub-silicon rods and the small silicon rods may be the same or different.

For example: when the ratio of the cross-sectional areas of the two small silicon rods is 1:2, the cross-sectional area equivalent to one small silicon rod is 2 times that of the other small silicon rod. And cutting the small silicon rod with the larger cross section area to obtain two sub silicon rods, wherein the cross section areas of the two sub silicon rods are equal and are equal to the cross section area of the small silicon rod with the smaller area.

Further, after the small silicon rods are obtained through cutting, grinding is conducted on each side face of each small silicon rod, then four edges of each small silicon rod are ground to form a chamfer, and then the small silicon rods are cut along the length direction perpendicular to the silicon rods to obtain a plurality of silicon wafers. The silicon wafer is used for manufacturing and forming a heterojunction cell. This process may be accomplished by a cutting device such as a microtome.

In the step 103, the silicon rod is cut along the length direction of the silicon rod by the two cutting lines, and the silicon rod can be cut once by the two cutting lines; it is also possible to make two cuts, each with one cutting line. The different cutting modes are explained in detail below by means of several examples.

Example two

Based on the above, the present embodiment provides a method for cutting a silicon rod by a single wire and a double wire, and particularly provides an embodiment for cutting a silicon rod by two cutting wires based on step 103.

Fig. 2 is a flowchart of a method for cutting a silicon rod by using a single wire and a double wire according to a second embodiment of the present application, and fig. 3 is a schematic structural diagram of a silicon rod by using a single wire and a double wire according to a second embodiment of the present application. As shown in fig. 2 and 3, the method for cutting a silicon rod by a single wire and two wires according to the present embodiment includes:

step 201, cutting the silicon rod through a cutting line along the length direction of the silicon rod to form a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod.

The cutting line in this step is the first cutting line 51, and the first cutting line 51 does not pass through the central line of the silicon rod. The first side surface 11 is formed after cutting by the first cutting line 51.

202, cutting the silicon rod once through the two cutting lines along the length direction of the silicon rod to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod.

The cut lines in this step are the second cut line 52 and the third cut line 53, respectively. The second cut line 52 and the third cut line 53 are parallel and both intersect perpendicularly with the first side 11. The second cutting line 52 and the third cutting line 53 are respectively located at both sides of the center line of the silicon rod.

The second side 12 is cut by the second cut line 52, and the second side 12 is perpendicular to the first side 11. A third side (not shown) is formed by cutting through a third cut line 53, and the third side is perpendicular to the first side 11.

And 203, cutting the silicon rod once along the length direction of the silicon rod through two cutting lines, wherein the formed cutting surfaces are parallel to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained.

The cut lines in this step are the fourth cut line 54 and the fifth cut line 55, respectively. The fourth cut line 54 and the fifth cut line 55 are parallel and both intersect the second side 12 perpendicularly. The fourth cutting line 54 and the first side surface 11 are respectively located at two sides of the fifth cutting line 55, and the fifth cutting line 55 is closer to the center line of the silicon rod, or may pass through the center line of the silicon rod.

After the cutting in the steps, two small silicon rods 3 with rectangular cross sections and four edge leather materials are obtained, wherein the edge leather materials are provided with a plane and an arc surface.

When the fourth cutting line 54 is positioned symmetrically to the first side 11 on both sides of the fifth cutting line 55, the cross-sectional areas of the two small silicon rods 3 are equal.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are symmetrically arranged with respect to the center line of the silicon rod. So that the shapes and the sizes of the edge leather materials cut by the first cutting line 51 and the fourth cutting line 54 are the same, two edge leather materials can be taken out by adopting the edge leather clamping jaws of the same type. And follow-up opposite side cladding is retrieved and is cut once more, and two pieces of border cladding accessible cutting equipment of same specification cut, need not to change cutting equipment or adjust specific cutting position to improve cutting efficiency. Similarly, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, the technical effect is similar, and the shape and the size of the obtained four pieces of edge skin materials are the same.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are symmetrically arranged relative to the central line of the silicon rod, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, and the fifth cutting line 55 passes through the central line of the silicon rod, so that the cross-sectional areas of the two small silicon rods 3 are the same, and the sizes of the four pieces of the obtained edge leather are the same.

In step 202, a cut is made by using two cut lines on the wire cutting device as the second cut line 52 and the third cut line. After the cutting in step 202 is finished, the silicon rod is driven to rotate 90 ° by the rotating mechanism, and then the positions of the cutting lines are adjusted, and then the cutting lines on the line cutting device are used as the fourth cutting line 54 and the fifth cutting line 55 for cutting.

After obtaining the small silicon rods 3, the following steps may also be performed:

and step 204, grinding each side surface of the small silicon rod.

And step 205, grinding four edges of the small silicon rod along the length direction to form a chamfer.

And step 206, cutting the small silicon rods along the length direction perpendicular to the silicon rods to obtain a plurality of silicon wafers.

On the basis of the above scheme, one of the small silicon rods may be cut before step 204, the small silicon rod is cut into two sub-silicon rods with rectangular cross-sectional areas, and then the sub-silicon rods are also ground and sliced to obtain sub-silicon wafers.

The embodiment provides a scheme: fig. 4 is a schematic structural view of another single-wire double-wire cut silicon rod provided in the second embodiment of the present application. Taking the view angle of fig. 4 as an example, in step 203, the fifth cutting line 55 is above the center line of the silicon rod. After step 203, two small silicon rods 3 with different cross-sectional areas are obtained. The small silicon rod 3 having a small cross-sectional area is cut along the length direction of the silicon rod by the sixth cutting line 56, and two sub silicon rods 31 having a rectangular cross-section are obtained. And then, the sub-silicon rod 31 is also sliced to obtain a sub-silicon wafer 41.

One implementation is as follows: the ratio of the cross-sectional areas of the small silicon rod 3 and the two sub-silicon rods 31 is 1: 1: 1. the obtained small silicon wafer 4 and the sub silicon wafer 41 have the same size, and large-scale production is facilitated. Of course, the position of each cutting line can be adjusted according to the size of the silicon chip to meet the requirements of various sizes of the silicon chips.

The order of the

above steps

202 and 203 can be interchanged, i.e.: it is also possible to perform the cutting by means of parallel fourth cut lines 54 and fifth cut lines 55 and then by means of parallel second cut lines 52 and third cut lines 53.

According to the technical scheme provided by the embodiment, the two cutting lines are adopted for the second cutting and the third cutting, so that the cutting steps can be reduced, the cutting efficiency is higher, and the time and the equipment cost for the steps of control, detection, approval and the like in the cutting process can be reduced. In addition, one cutting line is adopted for the first cutting, so that the flexibility is high, the silicon rod cutting device can adapt to silicon rods with different specifications, and the cutting sequence can be timely adjusted along with production arrangement. And the single-wire cutting mode also makes the wiring mode of the cutting wire on the cutting equipment simpler, reduces the structural complexity and control complexity of the cutting equipment, has lower part damage rate and further reduces the maintenance cost.

EXAMPLE III

On the basis of the above embodiments, the present embodiment provides another method for cutting a silicon rod by a single wire and a double wire, and particularly provides another embodiment for cutting the silicon rod once by two cutting wires based on step 103.

Fig. 5 is a flowchart of a method for cutting a silicon rod by using a single wire and a double wire according to a third embodiment of the present application, and fig. 6 is a schematic structural diagram of a silicon rod by using a single wire and a double wire according to a third embodiment of the present application. As shown in fig. 5 and 6, the method for cutting a silicon rod by a single wire and two wires according to the present embodiment includes:

and 301, cutting the silicon rod along the length direction of the silicon rod through a cutting line to form a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod.

The cutting line in this step is the first cutting line 51, and the first cutting line 51 does not pass through the center line of the silicon rod. The first side surface 11 is formed after cutting by the first cutting line 51.

And 302, cutting the silicon rod once through the two cutting lines along the length direction of the silicon rod to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod.

Step 303, cutting the silicon rod once through two cutting lines along the length direction of the silicon rod, wherein one cutting line is vertically intersected with the first side surface; and the other cutting line is vertically intersected with the second side surface and the third side surface to obtain two small silicon rods with rectangular cross sections.

The cut lines in this step are the fourth cut line 54 and the fifth cut line 55, respectively. The fourth cutting line 54 is perpendicularly intersected with the second side surface 12, and the fourth cutting line 54 and the first side surface 11 are respectively positioned on two sides of the central line of the silicon rod.

The fifth cutting line 55 perpendicularly intersects the first side surface 11, and the fifth cutting line 55 is closer to the center line of the silicon rod and may also pass through the center line of the silicon rod.

After the cutting in the steps, two small silicon rods 3 with rectangular cross sections and three edge leather materials are obtained, wherein the edge leather materials are provided with a plane and an arc surface.

When the fifth cutting line 55 is positioned right in the middle of the second side 12 and the third side, the cross-sectional areas of the two small silicon rods 3 are equal.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are arranged symmetrically with respect to the center line of the silicon rod. So that the shapes and the sizes of the edge leather materials cut by the first cutting line 51 and the fourth cutting line 54 are the same, two edge leather materials can be taken out by adopting the edge leather clamping jaws of the same type. And follow-up opposite side cladding is retrieved and is cut once more, and two pieces of border cladding accessible cutting equipment of same specification cut, need not to change cutting equipment or adjust specific cutting position to improve cutting efficiency. Similarly, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, the technical effect is similar, and the shape and the size of the obtained edge leather are the same.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are symmetrically arranged relative to the center line of the silicon rod, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the center line of the silicon rod, and the fifth cutting line 55 passes through the center line of the silicon rod, so that the cross-sectional areas of the two small silicon rods 3 are the same, and the sizes of the obtained edge coverings are the same.

and step 304, grinding each side surface of the small silicon rod.

And 305, grinding four edges of the small silicon rod along the length direction to form a chamfer.

And step 306, cutting the small silicon rods along the length direction perpendicular to the silicon rods to obtain a plurality of silicon wafers.

On the basis of the above scheme, one of the small silicon rods may be cut before step 304, the small silicon rod is cut into two sub-silicon rods with rectangular cross-sectional areas, and then the sub-silicon rods are also ground and sliced to obtain sub-silicon wafers.

The embodiment provides a scheme: taking the view of fig. 6 as an example, in step 303, the fifth cutting line 55 is on the left side of the center line of the silicon rod. After step 303, two small silicon rods 3 with different cross-sectional areas are obtained. And cutting the small silicon rod 3 with a smaller cross-sectional area along the length direction of the silicon rod through the sixth cutting line 56 to obtain two sub silicon rods with rectangular cross sections. And then, slicing the sub silicon rod to obtain a sub silicon wafer.

One implementation is as follows: the cross-sectional area ratio of the small silicon rod 3 to the two sub-silicon rods is 1: 1: 1. the obtained small silicon chip 4 and the sub silicon chip have the same size, and large-scale production is facilitated. Of course, the position of each cutting line can be adjusted according to the size of the silicon chip to meet the requirements of various sizes of the silicon chips.

The order of the

above steps

302 and 303 may be interchanged, i.e.: it is also possible to perform the cutting by means of the perpendicular fourth cut line 54 and the fifth cut line 55 and then by means of the parallel second cut line 52 and the third cut line 53.

Example four

On the basis of the above embodiments, the present embodiment provides another method for cutting a silicon rod by a single wire and a double wire, and particularly provides an embodiment in which two cuts are performed based on step 103.

Fig. 7 is a flowchart illustrating a method for cutting a silicon rod by using a single wire and a double wire according to a fourth embodiment of the present disclosure, and fig. 8 is a schematic structural diagram illustrating a method for cutting a silicon rod by using a single wire and a double wire according to a fourth embodiment of the present disclosure. As shown in fig. 7 and 8, the method for cutting a silicon rod by a single wire and two wires according to the present embodiment includes:

step 401, cutting the silicon rod along the length direction of the silicon rod by a cutting line to form a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod.

Step 402, cutting the silicon rod once along the length direction of the silicon rod through two cutting lines to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod.

The cut lines in this step are the second cut line 52 and the third cut line 53, respectively. The second cut line 52 and the third cut line 53 are parallel and both intersect perpendicularly with the first side 11. The second cutting line 52 and the third cutting line 53 are respectively located at both sides of the central line of the silicon rod.

And step 403, cutting the silicon rod along the length direction of the silicon rod through a cutting line, wherein the formed cutting surface is parallel to the first side surface and is respectively positioned on two sides of the central line of the silicon rod with the first side surface, and thus a square rod with a rectangular cross section is obtained.

The cut line in this step is a fourth cut line 54, the fourth cut line 54 perpendicularly intersecting the second side 12. And the fourth cutting line 54 and the first side surface 11 are respectively positioned at two sides of the central line of the silicon rod. The cut bar 2 is rectangular in cross section.

And step 404, cutting the square rod along the length direction of the silicon rod through a cutting line to obtain two small silicon rods with rectangular cross sections.

The cutting line in this step is a fifth cutting line 55, and the fifth cutting line 55 can be perpendicular to any side surface of the square rod 2 for cutting, so as to obtain two small silicon rods 3 with rectangular cross sections.

After the cutting of the steps, four pieces of edge leather materials are obtained, and each edge leather material is provided with a plane and an arc surface.

When the fifth cutting line 55 is located exactly in the middle between the second side 12 and the third side, the cross-sectional areas of the two small silicon rods 3 are equal.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are arranged symmetrically with respect to the center line of the silicon rod. So that the shapes and the sizes of the edge leather materials cut by the first cutting line 51 and the fourth cutting line 54 are the same, two edge leather materials can be taken out by adopting the edge leather clamping jaws of the same type. And follow-up opposite side cladding is retrieved and is cut once more, and two pieces of border cladding accessible cutting equipment of same specification cut, need not to change cutting equipment or adjust specific cutting position to improve cutting efficiency. Similarly, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, the technical effect is similar, and the shape and the size of the obtained four pieces of edge skin materials are the same.

One implementation is as follows: the first cutting line 51 and the fourth cutting line 54 are symmetrically arranged relative to the central line of the silicon rod, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, and the fifth cutting line 55 passes through the central line of the silicon rod, so that the cross-sectional areas of the two small silicon rods 3 are the same, and the sizes of the obtained four pieces of edge leather are the same.

step 405, grinding each side of the small silicon rod.

And 406, grinding four edges of the small silicon rod along the length direction to form chamfers.

And 407, cutting the small silicon rods along the length direction perpendicular to the silicon rods to obtain a plurality of silicon wafers.

On the basis of the above scheme, one of the small silicon rods may be cut before step 405, the small silicon rod is cut into two sub-silicon rods with rectangular cross-sectional areas, and then the sub-silicon rods are also ground and sliced to obtain sub-silicon wafers.

The present embodiment provides a solution: taking the view of fig. 8 as an example, in step 404, the fifth cutting line 55 is on the left side of the center line of the silicon rod. After step 404, two small silicon rods 3 with different cross-sectional areas are obtained. And cutting the small silicon rod 3 with the smaller cross section area along the length direction of the silicon rod through a sixth cutting line to obtain two sub silicon rods with rectangular cross sections. And then, slicing the sub silicon rod to obtain a sub silicon wafer.

Taking the view angle of fig. 8 as an example, in step 405, the square rod 2 is cut at the same time by using the sixth cutting line and the fifth cutting line 55 in parallel, so as to obtain three small silicon rods with rectangular cross sections. By adjusting the positions of the sixth cutting line and the fifth cutting line 55, the cross-sectional areas of the three small silicon rods can be adjusted. For example: the cross-sectional areas of the three small silicon rods may be equal.

The order of the

above steps

402 and 403, 404 can be interchanged, that is: it is also possible to cut successively through the fourth cut line 54 and the fifth cut line 55 and then through the parallel second cut line 52 and the third cut line 53. The order of

steps

403, 404 may also be interchanged, i.e.: it is also possible to cut first through the fifth cut line 55 and then through the fourth cut line 54.

According to the technical scheme provided by the embodiment, the two parallel cutting lines are adopted for the second cutting, so that the cutting steps can be reduced, the cutting efficiency is higher, and the time and the equipment cost required by the steps of control, detection, approval and the like in the cutting process can be reduced. In addition, the front and the back are matched with three times of single-line cutting, so that the silicon rod cutting machine has higher flexibility, can adapt to silicon rods with different specifications, and can also adjust the cutting sequence in time along with production arrangement. And the single-wire cutting mode also makes the wiring mode of the cutting wire on the cutting equipment simpler, reduces the structural complexity and control complexity of the cutting equipment, has lower part damage rate and further reduces the maintenance cost.

In addition, the square rod with the rectangular cross section is obtained after the third cutting, and in the fourth single-line cutting step, the cutting line can be perpendicular to any side face of the square rod for cutting, so that the square rod does not need to be rotated or moved, and the square rod can be directly cut, and the cutting efficiency can be improved.

EXAMPLE five

On the basis of the above embodiments, the present embodiment provides another method for cutting a silicon rod by a single wire and a double wire, and particularly provides another embodiment for performing two times of cutting based on step 103.

Fig. 9 is a flowchart of a method for single-wire double cutting of a silicon rod according to a fourth embodiment of the present application, and fig. 10 is a schematic structural diagram of a single-wire double cutting of a silicon rod according to the fourth embodiment of the present application. As shown in fig. 9 and 10, the method for cutting a silicon rod by a single wire and two wires according to the present embodiment includes:

step 501, cutting the silicon rod through a cutting line along the length direction of the silicon rod to form a first side surface after cutting, wherein the width of the first side surface is smaller than the diameter of the silicon rod.

The cutting line in this step is the first cutting line 51, and the first cutting line 51 does not pass through the central line of the silicon rod. The first side surface 11 is formed after being cut by the first cutting line 51.

And 502, cutting the silicon rod for one time through two cutting lines along the length direction of the silicon rod to form a second side surface and a third side surface after cutting, wherein the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod.

Step 503, cutting the silicon rod through a cutting line along the length direction of the silicon rod, wherein the formed cutting surface is parallel or vertical to the first side surface, and the width of the cutting surface is smaller than that of the first side surface.

The cut line in this step is a fourth cut line 54, the fourth cut line 54 perpendicularly intersecting the second side 12. The fourth cutting line 54 is located closer to the center line of the silicon rod, and may also pass through the center line of the silicon rod.

And step 504, cutting the silicon rod along the length direction of the silicon rod through one cutting line, wherein the formed cutting surface is vertically intersected with the second side surface and the third side surface, and the cutting surface and the first side surface are respectively positioned on two sides of the central line of the silicon rod to obtain two small silicon rods with rectangular cross sections.

The cut line in this step is a fifth cut line 55, and the fifth cut line 55 perpendicularly intersects the second side face 12. The fifth cut line 55 and the first side 11 are respectively located at both sides of the fourth cut line 54.

After the cutting in the steps, two small silicon rods 3 with rectangular cross sections are obtained, and four pieces of edge leather are also obtained, wherein the edge leather has a plane and an arc surface.

When the fifth cutting lines 55 are symmetrically distributed with respect to the first side 11 at the fourth cutting lines 54, the cross-sectional areas of the two small silicon rods 3 are equal.

One implementation is as follows: the first cutting line 51 and the fifth cutting line 55 are symmetrically arranged with respect to the center line of the silicon rod. So that the shapes and the sizes of the edge leather materials obtained by cutting through the first cutting line 51 and the fifth cutting line 55 are the same, two edge leather materials can be taken out by adopting the edge leather clamping jaws of the same type. And follow-up opposite side cladding is retrieved and is cut once more, and two pieces of border cladding accessible cutting equipment of same specification cut, need not to change cutting equipment or adjust specific cutting position to improve cutting efficiency. Similarly, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, the technical effect is similar, and the shape and the size of the obtained four pieces of edge skin materials are the same.

One implementation is as follows: the first cutting line 51 and the fifth cutting line 55 are symmetrically arranged relative to the central line of the silicon rod, the second cutting line 52 and the third cutting line 53 are also symmetrically arranged relative to the central line of the silicon rod, and the fourth cutting line 54 passes through the central line of the silicon rod, so that the cross-sectional areas of the two small silicon rods 3 are the same, and the sizes of the obtained four pieces of edge skin materials are the same.

and 505, grinding each side surface of the small silicon rod.

And step 506, grinding four edges of the small silicon rod along the length direction to form chamfers.

And 507, cutting the small silicon rods along the length direction perpendicular to the silicon rods to obtain a plurality of silicon wafers.

On the basis of the above scheme, one of the small silicon rods may be cut before step 505, the small silicon rod is cut into two sub-silicon rods with rectangular cross-sectional areas, and then the sub-silicon rods are also ground and sliced to obtain sub-silicon wafers.

The embodiment provides a scheme: taking the view of fig. 10 as an example, in step 503, the fourth cutting line 54 is above the centerline of the silicon rod. After step 504, two small silicon rods 3 with different cross-sectional areas are obtained. And cutting the small silicon rod 3 with the smaller cross section area along the length direction of the silicon rod through a sixth cutting line to obtain two sub silicon rods with rectangular cross sections. And then, slicing the sub silicon rod to obtain a sub silicon wafer.

Taking the view angle of fig. 10 as an example, in step 503, the silicon rod is cut simultaneously by using the sixth cutting line and the fourth cutting line 54, so as to obtain three small silicon rods with rectangular cross sections. By adjusting the positions of the sixth cutting line and the fourth cutting line 54, the cross-sectional areas of the three small silicon rods can be adjusted. For example: the cross-sectional areas of the three small silicon rods may be equal.

The order of the

above steps

502 and 503, 504 can be interchanged, that is: it is also possible to cut successively through the fourth cut line 54 and the fifth cut line 55 and then through the parallel second cut line 52 and the third cut line 53. The order of

steps

503, 504 may also be interchanged, i.e.: it is also possible to cut first by the fifth cut line 55 and then by the fourth cut line 54.

According to the technical scheme provided by the embodiment, the two parallel cutting lines are adopted for the second cutting, so that the cutting steps can be reduced, the cutting efficiency is higher, and the time and the equipment cost required by the steps of control, detection, approval and the like in the cutting process can be reduced. In addition, the front and back parts are matched with three times of single-line cutting, so that the flexibility is high, the silicon rod cutting machine is suitable for silicon rods with different specifications, and the cutting sequence can be timely adjusted along with production arrangement. And moreover, the single-wire cutting mode also enables the wiring mode of the cutting wires on the cutting equipment to be simpler, the structural complexity and the control complexity of the cutting equipment are reduced, the damage rate of parts is lower, and the maintenance cost is further reduced.

In addition, in the third step, a fourth cutting line 54 is used for cutting near the central line of the silicon rod, and a small silicon rod is obtained first. The small silicon rod can be taken out firstly to carry out the subsequent production process, so that the two processes are carried out synchronously, and the production efficiency is improved. And if the production plan is changed after the cutting of one small silicon rod is finished, the position of the cutting line can be flexibly adjusted, and the cutting position can be adjusted to obtain small silicon rods with other sizes, so that the waste of raw materials is reduced.

EXAMPLE six

On the basis of the above embodiments, the present embodiment further provides a cutting apparatus, which can be used for executing the method provided in any of the above. The cutting apparatus provided by the present embodiment may include: base, plummer and wire cutting device. Wherein, plummer and wire cutting device all set up on the base. The bearing platform is used for bearing the silicon rod, and the wire cutting device and the bearing platform can move relatively along the length direction of the silicon rod.

The wire cutting device comprises a wire wheel support and a single wire cutting wheel set, a double wire parallel cutting wheel set and/or a double wire cutting wheel set arranged on the wire wheel support. The single-wire cutting wheel set is wound with a cutting line and is used for cutting the silicon rod through the cutting line. The double-line parallel cutting wheel set is wound with two parallel cutting lines and is used for cutting the silicon rod through the two parallel cutting lines. The double-line vertical cutting wheel set is wound with two mutually vertical cutting lines and is used for cutting the silicon rod through the two vertical cutting lines.

Further, the cutting apparatus further comprises: and the rotating mechanism is arranged on the base and used for driving the bearing platform to rotate around the central line of the silicon rod.

Further, the cutting apparatus further comprises: and the translation mechanism is arranged on the base and is used for driving the wire cutting device or the bearing table to move in a plane vertical to the length direction of the silicon rod.

According to the arrangement direction of the silicon rod, the cutting equipment can be divided into a vertical type cutting equipment and a horizontal type cutting equipment, wherein in the vertical type cutting equipment, the central line of the silicon rod is vertically placed on the bearing table, the linear cutting device or the bearing table vertically moves, and the silicon rod is cut through the cutting line. The translation mechanism is used for driving the wire cutting device to move horizontally.

In the horizontal cutting equipment, the central line of the silicon rod is arranged on the bearing table along the horizontal direction, the linear cutting device or the bearing table moves along the horizontal direction, and the silicon rod is cut through the cutting line. The translation mechanism is used for driving the wire cutting device to move horizontally and/or vertically.

Fig. 11 is a schematic structural diagram of a vertical cutting apparatus provided in the fifth embodiment of the present application. As shown in fig. 11, the cutting apparatus provided in the present embodiment includes: a base, a bearing table 7 and a wire cutting device 8.

Wherein, the base includes base 61 and frame 62, and base 61 is a foundation structure, and frame 62 is a platelike structure, along vertical being fixed in on base 61. The bearing table 7 and the wire cutting device 8 are arranged on the frame 62, the bearing table 7 comprises an upper top seat and a lower top seat, and the silicon rod 1 is vertically arranged between the two top seats to be fixed. One scheme is as follows: the top seat is provided with a rotating mechanism for driving the silicon rod 1 to rotate along the central line.

The frame 62 is provided with a guide rail, and the bearing table 7 can move up and down relative to the frame 62 by matching with the guide rail. Alternatively, the wire cutting device 8 is moved up and down relative to the frame 62 in cooperation with the guide rail. So that the wire cutting device 8 can be moved in the longitudinal direction of the silicon rod relative to the silicon rod 1 for cutting the silicon rod 1.

Fig. 12 is a schematic structural view of a linear cutting device of a vertical cutting apparatus according to a fifth embodiment of the present application, and fig. 13 is a schematic structural view of a single linear cutting wheel set cutting a silicon rod in the vertical cutting apparatus according to the fifth embodiment of the present application. As shown in fig. 12 and 13, the wire cutting device 8 includes a pulley support 81 and a single wire cutting wheel set disposed on the pulley support 81, and a cutting wire 83 is wound on the single wire cutting wheel set. The cutting is performed by one cutting line 83 in one cutting step. The reel support 81 is of a substantially square frame structure, a group of single-wire cutting wheel sets is arranged in the inner space of the reel support, each single-wire cutting wheel set comprises at least two cutting wheels 82, and the cutting lines 83 are wound on the cutting wheels 82.

Fig. 14 is a schematic structural view illustrating a silicon rod being cut by a double-line parallel cutting wheel set in the vertical cutting apparatus according to the fifth embodiment of the present application. As shown in fig. 14, in another scheme, a double-line parallel cutting wheel group is arranged on the reel bracket 81, and includes two groups of cutting wheels 82, each group includes at least two cutting wheels 82, one cutting line 83 is wound on one group of cutting wheels 82, and the cutting lines 83 on the two groups of cutting wheels 82 are parallel. The cutting is performed in one cutting step by one cutting line 83 or two parallel cutting lines 83.

Fig. 15 is a schematic structural diagram illustrating a double-wire vertical cutting wheel set cutting a silicon rod in the vertical cutting apparatus provided in the fifth embodiment of the present application. As shown in fig. 15, in another scheme, a double-line vertical cutting wheel set is arranged on the wire wheel support 81 and comprises two sets of cutting wheels 82, each set comprises at least two cutting wheels 82, one cutting line 83 is wound on one set of cutting wheels 82, and the cutting lines 83 on the two sets of cutting wheels 82 are vertical. The cutting is performed in one cutting step by two perpendicular cutting lines 83.

The position of the cutting wheel 82 on the wire wheel support 81 can be fixed or the cutting wheel 82 can be moved on the wire wheel support 81 to meet the cutting requirements of different positions.

The other implementation mode comprises the following steps: the wire cutting device 8 can be provided with three wire wheel brackets, one of which is provided with a single wire cutting wheel set, the other is provided with a double wire parallel cutting wheel set, and the other is provided with a double wire vertical cutting wheel set. The three wire wheel supports are arranged side by side, and the corresponding wire wheel supports and the silicon rod can be controlled to move relatively to cut according to a specific cutting sequence.

Taking the solution of the second embodiment as an example, the first cutting line 51 is cut by the single-line cutting wheel set, the second cutting line 52 and the third cutting line 53 are cut by the double-line parallel cutting wheel set, and the fourth cutting line 54 and the fifth cutting line 55 are cut by the double-line parallel cutting wheel set.

Taking the third embodiment as an example, the first cutting line 51 is cut by the single-line cutting wheel set, the second cutting line 52 and the third cutting line 53 are cut by the double-line parallel cutting wheel set, and the fourth cutting line 54 and the fifth cutting line 55 are cut by the double-line vertical cutting wheel set.

Taking the solutions of the fourth and fifth embodiments as examples, the first cutting line 51 is cut by the single-line cutting wheel set, the second cutting line 52 and the third cutting line 53 are cut by the double-line parallel cutting wheel set, and the fourth cutting line 54 and the fifth cutting line 55 are cut by the single-line cutting wheel set sequentially.

In the implementation process, the silicon rod can be driven to rotate by matching with the rotating mechanism or driven to move by matching with the driving wire cutting device of the translation mechanism or the position of the cutting wheel can be adjusted by matching with the silicon rod according to the requirement, so that the silicon rod is cut. For example: in the fourth embodiment, after the fourth cutting line 54 is used, the silicon rod is driven to rotate 90 degrees by the rotating mechanism, then the cutting wheel is driven to move towards the center line of the silicon rod, and after the cutting wheel is adjusted to the position, the cutting is carried out by the fifth cutting line 55 through the single-line cutting wheel set.

Fig. 16 is a schematic structural diagram of a horizontal cutting apparatus provided in the fifth embodiment of the present application. As shown in fig. 16, the present embodiment provides a cutting apparatus including: a base, a bearing table 7 and a wire cutting device 8.

Wherein, the base includes base 61 and frame 62, and base 61 is a foundation structure, and frame 62 has a roof and a plurality of stand, and the stand is fixed in on base 61 along vertical, and the roof is connected in the top of each stand. The plummer 7 sets up on frame 62, and the plummer 7 includes two footsteps, and silicon rod 1 is fixed along the level setting between two footsteps. One scheme is as follows: the top seat is provided with a rotating mechanism for driving the silicon rod 1 to rotate along the central line.

One implementation is as follows: the frame 62 is provided with a guide rail, and the bearing platform 7 is matched with the guide rail and can horizontally move relative to the frame 62. In another mode: the base 61 is provided with a guide rail, and the wire cutting device 8 moves horizontally relative to the frame 62 in cooperation with the guide rail. So that the wire cutting device 8 can be moved in the longitudinal direction of the silicon rod relative to the silicon rod 1 for cutting the silicon rod 1.

Fig. 17 is a schematic structural view of a linear cutting device of a horizontal cutting apparatus according to a fifth embodiment of the present application, and fig. 18 is a schematic structural view of a single linear cutting wheel set cutting a silicon rod in the horizontal cutting apparatus according to the fifth embodiment of the present application. As shown in fig. 17 and 18, the wire cutting device 8 includes a reel support 81 and a single wire cutting wheel set disposed on the reel support 81, and a cutting wire 83 is wound on the single wire cutting wheel set. The cutting is performed by one cutting line 83 in one cutting step. The wire wheel support 81 comprises two oppositely-arranged 'n' -shaped frames, a group of single-wire cutting wheel sets are arranged in the inner space of the wire wheel support, each single-wire cutting wheel set comprises at least two cutting wheels 82, and cutting wires 83 are wound on the cutting wheels 82.

Fig. 19 is a schematic structural view illustrating a silicon rod being cut by a double-line parallel cutting wheel set in the horizontal cutting apparatus according to the fifth embodiment of the present application. As shown in fig. 19, the reel support 81 is provided with a double-line parallel cutting wheel set, which includes two sets of cutting wheels 82, each set includes at least two cutting wheels 82, one cutting wheel 82 is wound with a cutting line 83, and the cutting lines 83 on the two sets of cutting wheels 82 are parallel. The cutting is performed in one cutting step by one cutting line 83 or two parallel cutting lines 83.

Fig. 20 is a schematic view of a structure in which a two-wire vertical cutting wheel set cuts a silicon rod in a horizontal cutting apparatus according to a fifth embodiment of the present application. As shown in fig. 20, in another alternative, the reel bracket 81 is provided with a double-line vertical cutting wheel set, which comprises two groups of cutting wheels 82, each group comprises at least two cutting wheels 82, one cutting wheel 82 is wound with a cutting line 83, and the cutting lines 83 on the two groups of cutting wheels 82 are vertical. The cutting is performed in one cutting step by two perpendicular cutting lines 83.

The cutting wheel 82 is adjustable in position on the wire wheel support 81, and is provided with a guide mechanism and a driving mechanism for driving the cutting wheel 82 to move.

The other realization mode is as follows: the wire cutting device 8 can be provided with three wire wheel supports, one of which is provided with a single wire cutting wheel set, the other is provided with a double wire parallel cutting wheel set, and the other is provided with a double wire perpendicular cutting wheel set. The three wire wheel supports are arranged side by side, and the corresponding wire wheel supports and the silicon rod can be controlled to move relatively to cut according to a specific cutting sequence.

The cutting equipment provided by the embodiment adopts the two cutting lines to cut synchronously, can reduce cutting steps, has higher cutting efficiency, and is beneficial to reducing the time and equipment cost required by the steps of control, detection, approval and the like in the cutting process. In addition, the silicon rod cutting device can be matched with single-wire cutting, has higher flexibility, can adapt to silicon rods with different specifications, and can also adjust the cutting sequence in time along with production arrangement. And the single-wire cutting mode also makes the wiring mode of the cutting wire on the cutting equipment simpler, reduces the structural complexity and control complexity of the cutting equipment, has lower part damage rate and further reduces the maintenance cost.

In addition, the present embodiment also provides a cutting system for single-wire double-wire cutting of a silicon rod, including: any one of the above cutting apparatuses and a grinding apparatus for grinding a silicon rod. The cutting equipment and the cutting system provided by the embodiment have the same technical effects as the cutting method.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; may be mechanically, electrically or otherwise in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A method for single-wire, twin-wire cutting of a silicon rod, comprising:

the silicon rod is cut for one time through the two cutting lines along the length direction of the silicon rod, a second side surface and a third side surface are formed after cutting, the second side surface and the third side surface are vertically intersected with the first side surface, and the second side surface and the third side surface are respectively positioned on two sides of the central line of the silicon rod;

2. The method of claim 1, wherein the cutting of the silicon rod along its length direction by two cutting lines, in particular comprising:

the silicon rod is cut once along the length direction thereof by two cutting lines.

3. The method according to claim 2, characterized in that the silicon rod is cut once along its length by two cutting lines, in particular:

and cutting the silicon rod once along the length direction of the silicon rod through two cutting lines, wherein the formed cutting surfaces are parallel to the first side surface, and thus two small silicon rods with rectangular cross sections are obtained.

4. The method according to claim 2, characterized in that the silicon rod is cut once along its length by two cutting lines, in particular:

cutting the silicon rod once along the length direction of the silicon rod through two cutting lines, wherein one cutting line is vertically intersected with the first side surface; and the other cutting line is vertically intersected with the second side surface and the third side surface to obtain two small silicon rods with rectangular cross sections.

5. The method of claim 1, wherein the cutting of the silicon rod along its length direction by two cutting lines, in particular comprising:

the silicon rod is cut twice along its length direction by two cutting lines, each time by one cutting line.

6. The method of claim 5 wherein cutting the silicon rod twice along its length by two cutting lines comprises:

cutting the silicon rod along the length direction of the silicon rod through a cutting line, wherein the formed cutting surface is parallel to the first side surface and is respectively positioned on two sides of the central line of the silicon rod with the first side surface, and a square rod with a rectangular cross section is obtained;

and cutting the square rod along the length direction of the silicon rod by a cutting line to obtain two small silicon rods with rectangular cross sections.

7. The method of claim 5 wherein cutting the silicon rod twice along its length by two cutting lines comprises:

cutting the silicon rod through a cutting line along the length direction of the silicon rod, wherein the formed cutting surface is parallel to or vertical to the first side surface, and the width of the cutting surface is smaller than that of the first side surface;

and cutting the silicon rod through a cutting line along the length direction of the silicon rod, wherein the formed cutting surface is vertically intersected with the second side surface and the third side surface, and the cutting surface and the first side surface are respectively positioned at two sides of the central line of the silicon rod to obtain two small silicon rods with rectangular cross sections.

8. The process according to any one of claims 1 to 7, characterized in that the ratio of the cross-sectional areas of the two small silicon rods is greater than or equal to 1: 3.

9. The method of any one of claims 1-7, further comprising:

and cutting one small silicon rod along the length direction of the silicon rod through one cutting line, and cutting the small silicon rod into two sub silicon rods with rectangular cross sections.

10. The method of any one of claims 1-7, further comprising:

grinding each side surface of the small silicon rod;

grinding each edge extending along the length direction of the silicon rod in the small silicon rod to form a chamfer;

and cutting the small silicon rods along the length direction vertical to the silicon rods to obtain a plurality of silicon wafers.

11. A cutting apparatus using the method for single-wire, double-wire cutting of a silicon rod according to any one of claims 1 to 10, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises a wire wheel support, and a single wire cutting wheel set, a double wire parallel cutting wheel set and/or a double wire cutting wheel set which are arranged on the wire wheel support, wherein a cutting wire is wound on the single wire cutting wheel set and is used for cutting the silicon rod through the cutting wire; the double-line parallel cutting wheel set is wound with two parallel cutting lines and is used for cutting the silicon rod through the two parallel cutting lines; the double-line vertical cutting wheel set is wound with two mutually perpendicular cutting lines and is used for cutting the silicon rod through the two perpendicular cutting lines.

12. The cutting apparatus of claim 11, further comprising:

the rotating mechanism is arranged on the base and used for driving the bearing table to rotate around the central line of the silicon rod; and/or the presence of a gas in the gas,

and the translation mechanism is arranged on the base and is used for driving the wire cutting device to move in a plane vertical to the length direction of the silicon rod.

13. The cutting apparatus according to claim 12, wherein the silicon rod is arranged vertically on the carrier table; the linear cutting device moves vertically to cut the silicon rod through the cutting line; the translation mechanism is used for driving the wire cutting device to move horizontally.

14. The cutting apparatus according to claim 12, wherein the silicon rod is arranged in a horizontal direction on the susceptor; the linear cutting device moves along the horizontal direction to cut the silicon rod through the cutting line; the translation mechanism is used for driving the wire cutting device to move horizontally and/or vertically.

15. A cutting system for single-wire, double-wire cutting of silicon rods, comprising:

the cutting apparatus of any one of claims 11-14; and the number of the first and second groups,

and grinding equipment for grinding the silicon rod.