CN214394871U

CN214394871U - Silicon rod cutting and grinding integrated machine

Info

Publication number: CN214394871U
Application number: CN202022257081.7U
Authority: CN
Inventors: 卢建伟; 苏静洪; 李鑫; 钱春军; 曹奇峰
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2020-09-16
Filing date: 2020-10-12
Publication date: 2021-10-15
Anticipated expiration: 2030-10-12
Also published as: CN114261028A

Abstract

The application discloses silicon rod surely grinds all-in-one, silicon rod surely grinds all-in-one and has gathered silicon rod cutting device and grinder and set up silicon rod cutting device and grinder respectively at the first processing position and the second processing position of silicon rod processing platform, and be provided with and run through first transfer device and the second transfer device in first processing position and second processing position simultaneously, it is first, the second transfer device disposes silicon rod anchor clamps and actuating mechanism respectively, it is first through coordinated control, second transfer device and silicon rod cutting device and grinder, make the silicon rod cutting device who is located first processing position and the grinder that is located second processing position all be in operating condition at the same moment, thereby accomplish the integration operation of the evolution of silicon rod and grinding multiple processes, improve the quality of production efficiency and product processing operation.

Description

Silicon rod cutting and grinding integrated machine

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding all-in-one machine.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the cutting is finished, cutting the cut short silicon rods by using a silicon rod cutting machine to form rectangular cut silicon rods; then, processing operations such as surface grinding, chamfering and the like are carried out on each cut silicon rod, so that the surface of the silicon rod is shaped to meet the requirements of corresponding flatness and dimensional tolerance; and subsequently, slicing the silicon rod by using a slicing machine to obtain the monocrystalline silicon piece.

However, in general, in the related art, operations required for each process operation (such as cutting, grinding, chamfering, and the like) are independently arranged, the corresponding processing devices are distributed in different production units or different production areas of a production workshop or a production shop, the conversion of workpieces performing different process operations requires transportation and allocation, and a pretreatment operation may be required before each process operation is performed, so that the process is complicated, the efficiency is low, the quality of the silicon rod processing operation is easily affected, more manpower or transfer equipment is required, the potential safety hazard is great, in addition, many flow links exist among the operation equipment of each process, the risk of workpiece damage is increased in the workpiece transfer process, disqualification caused by non-production factors is easily generated, the yield of products and unreasonable loss caused by the existing processing mode are reduced, is a major improvement subject faced by each company.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned disadvantages of the related art, an object of the present invention is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between each process operation and poor silicon rod processing operation effect in the related art.

To achieve the above and other related objects, the present application discloses a silicon rod cutting and grinding all-in-one machine, comprising:

the base is provided with a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area;

the first transfer device is arranged on the first transfer passage and comprises a first silicon rod clamp and a first transfer driving mechanism, and the first transfer driving mechanism is used for driving the first silicon rod clamp and a silicon rod clamped by the first silicon rod clamp to move along a first direction and transfer between a first processing area and a second processing area;

the second transfer device is arranged on the second transfer channel and comprises a second silicon rod clamp and a second transfer driving mechanism, and the second transfer driving mechanism is used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the first direction and transfer between the first processing area and the second processing area;

the silicon rod cutting device is arranged at a first processing position of the silicon rod processing platform and is used for cutting the silicon rod to be cut on the first transfer channel and clamped by the first transfer device or the silicon rod to be cut on the second transfer channel and clamped by the second transfer device; and

and the silicon rod grinding device is arranged at a second processing position of the silicon rod processing platform and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or the cut silicon rod clamped by the second transfer device on the second transfer channel.

In certain embodiments of the present application, the first transfer device and the second transfer device are mounted above the silicon rod processing platform by a mounting frame, or alternatively, the first transfer device is mounted above the silicon rod processing platform by a first mounting frame and the second transfer device is mounted above the silicon rod processing platform by a second mounting frame.

In certain embodiments of the present application, the first silicon rod clamp comprises: a first clamp arm mounting seat; the pair of first clamping arms are oppositely arranged on the first clamping arm mounting seats along a first direction and used for clamping two end faces of the silicon rod; wherein, any one of the at least one pair of first clamping arms is provided with a clamping part; the first clamping arm driving mechanism is used for driving at least one first clamping arm in the at least one pair of first clamping arms to move along the first direction so as to adjust the clamping distance between the at least one pair of first clamping arms.

In certain embodiments of the present application, the first transfer drive mechanism comprises: the first transfer guide rail is arranged along a first direction and is used for arranging the first clamping arm mounting seat; and the first transfer driving unit is used for driving the first clamping arm mounting seat and at least one pair of first clamping arms to move along the first transfer guide rail.

In certain embodiments of the present application, the first transfer drive unit comprises: the movable rack is arranged along a first direction; the driving gear is arranged on the first clamping arm mounting seat and is meshed with the movable rack; and the driving source is used for driving the driving gear to enable the associated first clamping arm mounting seat and at least one pair of first clamping arms to move along the first transfer guide rail.

In certain embodiments of the present application, the first transfer drive unit comprises: the movable screw rod is arranged along a first direction and is associated with the first clamping arm mounting seat; and the driving source is used for driving the movable screw rod to rotate so as to enable the associated second clamping arm mounting seat and at least one pair of first clamping arms to move along the first transfer guide rail.

In certain embodiments of the present application, the at least one pair of first clamp arms are of a rotating configuration; the first silicon rod clamp further comprises a first clamping arm rotating mechanism, and the first clamping arm rotating mechanism is arranged on at least one first clamping arm of the at least one pair of first clamping arms and used for driving the clamping part of the at least one first clamping arm to rotate.

In certain embodiments of the present application, the second silicon rod clamp comprises: a second clamp arm mounting seat; the second clamping arms are oppositely arranged on the second clamping arm mounting seats along the first direction and are used for clamping two end faces of the silicon rod; any one of the at least one pair of second clamping arms is provided with a clamping part; and the second clamping arm driving mechanism is used for driving at least one second clamping arm in the at least one pair of second clamping arms to move along the first direction so as to adjust the clamping distance between the at least one pair of second clamping arms.

In certain embodiments of the present application, the second transfer drive mechanism comprises: the second transfer guide rail is arranged along the first direction and is used for arranging the second clamping arm mounting seat; and the second transfer driving unit is used for driving the second clamping arm mounting seat and at least one pair of second clamping arms thereof to move along the second transfer guide rail.

In certain embodiments of the present application, the second transfer drive unit comprises: the movable rack is arranged along a first direction; the driving gear is arranged on the second clamping arm mounting seat and is meshed with the movable rack; and the driving source is used for driving the driving gear to enable the associated second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer guide rail.

In certain embodiments of the present application, the second transfer drive unit comprises: the movable screw rod is arranged along a first direction and is associated with the second clamping arm mounting seat; and the driving source is used for driving the movable screw rod to rotate so as to enable the associated second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer guide rail.

In certain embodiments of the present application, the at least one pair of second clamp arms are of a rotating configuration; the second silicon rod clamp further comprises a second clamping arm rotating mechanism, and the second clamping arm rotating mechanism is arranged on at least one second clamping arm in the at least one pair of second clamping arms and used for driving the clamping part of the at least one second clamping arm to rotate.

In certain embodiments of the present application, the silicon rod cutting device comprises: a cutting frame; at least one wire cutting unit arranged on the cutting frame; the wire cutting unit includes: the cutting wire is wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; and the cutting switching mechanism is used for driving the cutting frame and at least one wire cutting unit on the cutting frame to switch between the first transfer channel and the second transfer channel.

In certain embodiments of the present application, the wire cutting unit comprises: cutting a line; the first cutting wheel and the second cutting wheel are arranged on the cutting frame, and cutting wires are wound on the first cutting wheel and the second cutting wheel to form a cutting wire saw; the wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel; the first transition wheel is adjacent to the first cutting wheel, and the cutting lines of the first cutting wheel and the first transition wheel are positioned in a plane where a first cutting line groove for winding the cutting lines in the first cutting wheel is positioned in the state of drawing the cutting lines; the second transition wheel is arranged adjacent to the second cutting wheel, and the cutting lines of the second cutting wheel and the second transition wheel are positioned in a plane where a second cutting line groove for winding the cutting lines in the second cutting wheel is positioned in the state of drawing the cutting lines; and the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for pulling the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod, and only the cutting wire saw intersects with the cutting accommodating space in the silicon rod cutting device.

In certain embodiments of the present application, the first transition wheel, the second transition wheel, and at least a third transition wheel are used to pull the cutting line away from the cutting accommodation space.

In certain embodiments of the present application, the cutting line is wrapped between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel, and the third transition wheel to form an endless closed loop cutting line.

In some embodiments of the present application, two third transition wheels are included in the wire cutting unit, wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a closed loop cutting wire connected end to end.

In certain embodiments of the present application, the silicon rod cutting device further comprises a cutting line driving device for driving the cutting line to operate to cut the silicon rod to be cut.

In certain embodiments of the present application, the cutting wire drive is a motor having a power take-off shaft and the power take-off shaft is coupled to the first cutting wheel or the second cutting wheel.

In certain embodiments of the present application, the silicon rod cutting apparatus further comprises: and the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving at least two cutting wheels in the linear cutting unit to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels.

In certain embodiments of the present application, the silicon rod cutting device comprises a single-wire cutting unit, and the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit; and the driving source is used for driving the screw rod to rotate.

In certain embodiments of the present application, the silicon rod cutting device comprises a single-wire cutting unit, and the pitch adjustment mechanism comprises: the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; and the driving source is used for driving the telescopic piece to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

In certain embodiments of the present application, the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit being driven by the pitch adjustment mechanism to move along an orthogonal direction of a wheel face of the cutting wheel.

In certain embodiments of the present application, the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate.

In certain embodiments of the present application, the pitch adjustment mechanism comprises: the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

In certain embodiments of the present application, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first linear cutting unit and the second linear cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel.

In certain embodiments of the present application, the cut conversion mechanism comprises: the cutting conversion guide rail is arranged along the second direction and is used for arranging the cutting frame; the second direction is perpendicular to the first direction; and the cutting conversion driving unit is used for driving the cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail.

In certain embodiments of the present application, the cutting transition driving unit includes: the movable rack is arranged along the second direction; the driving gear is arranged on the cutting frame and meshed with the movable gear rack; and the driving source is used for driving the driving gear to enable the associated cutting frame and at least one wire cutting unit thereof to move along the cutting conversion guide rail.

In certain embodiments of the present application, the cutting transition driving unit includes: a mobile screw rod arranged along a second direction and associated with the cutting frame; and the driving source is used for driving the movable screw rod to rotate so as to enable the associated cutting frame and at least one wire cutting unit to move along the cutting conversion guide rail.

In certain embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises a flaw-piece discharging device, wherein the flaw-piece discharging device comprises a flaw-piece supporting mechanism for supporting the outer side of the silicon rod and supporting the flaw-piece formed by cutting.

In certain embodiments of the present application, the flaw-piece holding mechanism comprises: a bearing part; and the driving unit is connected with the bearing part to control the bearing part to be far away from or abut against the flaw-piece.

In certain embodiments of the present application, the bearing portion comprises: at least two bearing blocks are arranged at intervals along the first direction and are provided with bearing surfaces used for contacting and bearing the side leather.

In certain embodiments of the present application, the bearing portion comprises: at least two supporting rods arranged along the first direction and used for contacting and supporting the flaw-piece; the two connecting parts are arranged on two opposite sides of the cutting frame in the first direction to correspond to two opposite ends of the at least two bearing rods and are used for connecting the at least two bearing rods and connected with the driving unit.

In some embodiments of the present application, the bearing portion includes at least two bearing wheel sets spaced apart along the first direction, wherein the bearing wheel sets include: the at least two supporting wheels are arranged at intervals and are used for contacting and supporting the flaw-piece; and the bearing base is used for arranging the at least two bearing wheels and is connected with the driving unit.

In certain embodiments of the present application, the driving unit includes: a cylinder or hydraulic pump; the telescopic part is connected with the bearing part and is driven by the cylinder or the hydraulic pump to do telescopic motion so as to control the bearing part to be far away from or abut against the flaw-piece.

In certain embodiments of the present application, the driving unit includes: a drive motor; and the screw rod assembly is connected with the bearing part and is driven by the driving motor to move so as to control the bearing part to be far away from or abut against the flaw-piece.

In some embodiments of the present application, the flaw-piece discharging device further comprises a flaw-piece dislocation mechanism disposed on the base or the silicon rod cutting device, for pushing the flaw-piece along a first direction to separate the flaw-piece from the flaw-piece supporting mechanism.

In certain embodiments of the present application, the flaw-piece dislocation mechanism comprises: pushing the top; and the cylinder or the hydraulic pump is used for driving the ejection part to eject the telescopic rod of the edge leather along the first direction.

In certain embodiments of the present application, the flaw-piece discharge apparatus further comprises a flaw-piece conveying mechanism for receiving the flaw-pieces formed by cutting and transporting the flaw-pieces to a discharge area.

In certain embodiments of the present application, the flaw-piece delivery mechanism comprises: the conveying part is used for bearing the flaw-piece; and the conveying driving source is used for driving the conveying part to move along a first direction so as to convey the edge leather.

In certain embodiments of the present application, the silicon rod abrading apparatus comprises: a grinding tool mounting base; at least one pair of grinding tools which are oppositely arranged on the grinding tool mounting seat; a grinding tool advancing and retreating mechanism for driving at least one grinding tool of the at least one pair of grinding tools to move along a second direction, wherein the second direction is perpendicular to the first direction; and the grinding tool switching mechanism is used for driving the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel.

In certain embodiments of the present application, any one of the at least one pair of grinding tools comprises a rough grinding wheel and a finish grinding wheel nested within one another.

In certain embodiments of the present application, the rough grinding wheel is nested within the finish grinding wheel, and at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic drive mechanism; or the accurate grinding wheel is nested in the rough grinding wheel, and at least one of the rough grinding wheel and the accurate grinding wheel is provided with a telescopic driving mechanism.

In certain embodiments of the present application, the grinder conversion mechanism comprises: the grinding tool conversion guide rail is arranged along the second direction and is used for arranging the grinding tool mounting seat; and the grinding tool conversion driving unit is used for driving the grinding tool mounting seat and at least one pair of grinding tools to move along the grinding tool conversion guide rail.

In certain embodiments of the present application, the grinder conversion drive unit comprises: the movable rack is arranged along the second direction; the driving gear is arranged on the grinding tool mounting seat and is meshed with the movable rack; a driving source for driving the driving gear to move the associated grinder mounting seat and at least one pair of grinders thereof along the grinder transfer rail.

In certain embodiments of the present application, the grinder conversion drive unit comprises: the movable screw rod is arranged along a second direction and is associated with the grinding tool mounting seat; and the driving source is used for driving the movable screw rod to rotate so as to enable the associated grinding tool mounting seat and at least one pair of grinding tools to move along the grinding tool conversion guide rail.

In certain embodiments of the present application, the silicon rod abrading apparatus further comprises: and at least one pair of chamfering grinding tools are oppositely arranged on the grinding tool mounting seat.

In certain embodiments of the present application, any one of the first and second silicon rod clamps further comprises: and the grinding repair device is used for grinding at least one pair of grinding tools in the corresponding silicon rod grinding device.

In certain embodiments of the present application, the silicon rod slicing and grinding all-in-one machine further comprises: and the silicon rod transferring device is arranged at the loading position of the silicon rod processing platform and used for transferring the silicon rod to be processed to the first processing position of the silicon rod processing platform.

In certain embodiments of the present application, the silicon rod transfer device includes: the silicon rod bearing structure is used for bearing a silicon rod to be processed; the centering adjusting mechanism is used for adjusting the position of the silicon rod to be processed so that the axis line of the silicon rod corresponds to a preset center line; and the feeding driving mechanism is used for driving the silicon rod bearing structure and the silicon rod to be processed borne by the silicon rod bearing structure to move from the loading zone to the first processing zone along the second direction.

In some embodiments of the present application, the centering adjustment mechanism includes a vertical lifting mechanism for driving the silicon rod carrying structure and the carried silicon rod to be processed to make a vertical lifting motion so that an axis of the silicon rod to be processed is vertically aligned with a predetermined center line.

In certain embodiments of the present application, the vertical lift mechanism comprises: the vertical lifting guide rail is arranged on the bearing base; the sliding block is arranged on the bearing part; and a vertical lifting driving unit.

In certain embodiments of the present application, the vertical lift mechanism comprises: the vertical lifting guide rod is used for arranging the silicon rod bearing structure; and the vertical lifting driving unit is used for driving the silicon rod bearing structure to move up and down along the vertical lifting guide rod.

In certain embodiments of the present application, the vertical lift drive unit comprises: the driving motor and the vertical screw rod assembly are arranged and driven by the driving motor, or the driving motor and the vertical gear rack transmission assembly are arranged and driven by the driving motor.

In certain embodiments of the present application, the silicon rod transfer device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction to be located in a centering region of the silicon rod carrying structure.

In certain embodiments of the present application, the centering adjustment mechanism comprises: the support is arranged on the base or the silicon rod bearing structure; the adjusting guide rail is arranged on the bracket along a first direction; the at least two ejection pieces are respectively arranged on two opposite sides of the bracket; and the adjusting and driving unit is used for driving the at least two pushing pieces to move oppositely along the adjusting guide rail so as to push the silicon rod to be arranged in the central area of the silicon rod bearing structure.

In certain embodiments of the present application, the adjustment drive unit comprises: the driving motor and the screw rod assembly are arranged along the first direction and driven by the driving motor, or the driving motor and the gear rack transmission assembly are arranged along the first direction and driven by the driving motor.

In certain embodiments of the present application, the silicon rod transfer device further comprises a silicon rod clamping mechanism provided on the silicon rod carrying structure.

In certain embodiments of the present application, the silicon rod clamping mechanism comprises: the clamp mounting piece is arranged on the silicon rod bearing structure along a first direction; at least two silicon rod clamping members arranged at a distance along the clamp mounting.

In certain embodiments of the present application, the silicon rod clamp comprises: the clamping arm mounting seat is arranged on the clamp mounting piece; the two clamping arms are movably arranged on the clamping arm mounting seats; and the clamping arm driving mechanism is used for driving the two clamping arms to open and close.

In certain embodiments of the present application, the clamp arm drive mechanism comprises: the opening and closing gear is arranged on the clamping arm mounting seat; two racks, each rack is associated with one clamping arm and meshed with the opening and closing gear; and the driving source is associated with the opening and closing gear and is used for driving the opening and closing gear to rotate.

In certain embodiments of the present application, in the silicon rod clamping mechanism, at least one of the at least two silicon rod clamping members is provided with a spacing adjustment drive mechanism for driving it to move along the clamp mount for adjusting the spacing of the at least two silicon rod clamping members.

In certain embodiments of the present application, the pitch adjustment drive mechanism is a lead screw adjustment mechanism, a chain conveying mechanism, a double speed chain mechanism, or a belt mechanism.

In certain embodiments of the present application, the feed drive mechanism comprises: the feeding guide rods or the feeding guide rails are distributed along the second direction and are used for arranging the silicon rod bearing structures; and the feeding driving unit is used for driving the silicon rod bearing structure to move along the feeding guide rod or the feeding guide rail.

In certain embodiments of the present application, the silicon rod transfer device further includes a crystal line detection unit.

In certain embodiments of the present application, the silicon rod slicing and grinding all-in-one machine further comprises: and the silicon rod unloading device is arranged in a workpiece unloading area of the silicon rod processing platform and is used for unloading the ground silicon rod from the silicon rod processing platform.

The application discloses silicon rod surely grinds all-in-one has gathered silicon rod cutting device and grinder and has set up silicon rod cutting device and grinder respectively at the first processing position and the second processing position district of silicon rod processing platform, and be provided with first transfer device and the second transfer device that runs through first processing position and second processing position district simultaneously, it is first, silicon rod anchor clamps and actuating mechanism are configured respectively to the second transfer device, it is first through coordination control, second transfer device and silicon rod cutting device and grinder, make the silicon rod cutting device that is located first processing position and the grinder that is located the second processing position district all be in operating condition at the same moment, thereby accomplish the integration operation of the square of silicon rod and grinding multiple processes, improve the quality of production efficiency and product processing operation.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The brief description of the drawings is as follows:

fig. 1 is a schematic structural view of a silicon rod cutting and grinding all-in-one machine according to an embodiment of the present disclosure at a first viewing angle.

Fig. 2 is a schematic structural view of the silicon rod cutting and grinding all-in-one machine in the present application at a second viewing angle in one embodiment.

Fig. 3 shows a top view of a silicon rod slicing and grinding all-in-one machine according to the present application in one embodiment.

Fig. 4 is a schematic view showing the structure of the first silicon rod clamp or the second silicon rod clamp in the silicon rod slicing and grinding all-in-one machine of the present application.

Fig. 5 is a schematic view of a silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine according to an embodiment of the invention.

Fig. 6 is a schematic structural view of the wire cutting unit of fig. 5.

Fig. 7 is a schematic structural view of a silicon rod grinding device in the silicon rod cutting and grinding all-in-one machine according to the present application.

FIG. 8 is a sectional view of the grinding tool of the silicon rod grinding device in the silicon rod slicing and grinding all-in-one machine according to the present application.

Fig. 9 is an enlarged schematic view of a portion a of fig. 1.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first transfer device may be referred to as a second transfer device, and similarly, the second transfer device may be referred to as a first transfer device, without departing from the scope of the various described embodiments. The first transfer device and the second transfer device are each described as a certain transfer device, but they are not the same transfer device unless the context clearly indicates otherwise. The similar situation also comprises a first transfer guide rail and a second transfer guide rail, a first processing area and a second processing area, a first transfer driving mechanism and a second transfer driving mechanism, a first silicon rod clamp and a second silicon rod clamp and the like.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the related art for processing a silicon rod, several steps such as cutting, grinding, chamfering, and the like are involved.

In general, most of conventional silicon rods have a cylindrical structure, and are cut by a silicon rod cutting device so that the silicon rods have a quasi-rectangular (including a quasi-square) cross section after cutting, and the entire processed silicon rods have a quasi-rectangular parallelepiped shape.

Taking a single crystal silicon rod as an example, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting an original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form the silicon single crystal rod with the rectangular-like cross section. Among them, patent publications such as CN105856445A, CN105946127A, and CN105196433A are referred to as a specific embodiment of forming a multi-stage short silicon rod by cutting an original long silicon rod with a silicon rod cutting machine, and patent publication such as CN105818285A is referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section by cutting a cut short silicon rod with a silicon rod cutting machine. However, the process for forming the single crystal silicon rod is not limited to the foregoing technique, and in alternative examples, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. Among them, a specific embodiment of the above-described method for forming a long single crystal silicon rod having a quasi-rectangular shape by squaring an original long silicon rod using an all-silicon-rod squarer is disclosed in patent publication CN106003443A, for example.

After the cylindrical silicon single crystal rod is cut into the quasi-rectangular silicon rod by the squaring equipment, the quasi-rectangular silicon rod can be ground, chamfered and the like by the grinding equipment.

The inventors of the present application have found that in the related art of the processing operation for the silicon rod, the processing devices such as the squaring and the polishing (for example, the surface polishing and the chamfering) are disposed separately and independently from each other, and the conversion of the silicon rod to perform different process operations requires the transfer and preparation and the pretreatment before the processing, which causes problems such as complicated processes and low efficiency.

In view of this, the application provides a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method, through equipment transformation, a plurality of processing devices are integrated in one equipment, cutting and grinding of a silicon rod can be automatically achieved, seamless connection between processing operations is achieved, labor cost is saved, production efficiency is improved, and quality of silicon rod processing operations is improved.

In the embodiments provided herein, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, and the first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other two by two. The length extending direction of the silicon rod slicing and grinding all-in-one machine, that is, the length direction when the silicon rod is placed thereon, is defined as a first direction (i.e., a front-back direction or a transfer direction), the width extending direction of the silicon rod slicing and grinding all-in-one machine, that is, a left-right direction, is defined as a second direction (i.e., a left-right direction or a feeding direction), and the vertical direction, that is, a vertical direction, a plumb line direction, an up-down direction or a lifting direction, is defined as a third direction.

The present application discloses, in one aspect, a silicon rod cutting and grinding all-in-one machine, which is used for performing an operation of squaring and grinding a silicon rod, that is, a silicon rod with a circular (or approximately circular) cross section is cut to form a silicon rod with a rectangular-like (including a square-like) cross section, and a silicon rod with a rectangular-like (including a square-like) cross section is ground, where a plurality of silicon rods may be, for example, single crystal silicon rods or polycrystalline silicon rods, and in the embodiments of the present application, a single crystal silicon rod is taken as an example for explanation.

Referring to fig. 1 to 3, fig. 1 is a schematic view showing a structure of a silicon rod slicing and grinding all-in-one machine of the present application at a first viewing angle in one embodiment, fig. 2 is a schematic view showing a structure of the silicon rod slicing and grinding all-in-one machine of the present application at a second viewing angle in one embodiment, and fig. 3 is a schematic view showing a top view of the silicon rod slicing and grinding all-in-one machine of the present application in one embodiment. As shown in the figure, the silicon rod cutting and grinding all-in-one machine comprises a machine base 1, a first transfer device 2, a second transfer device 3, a silicon rod cutting device 4 and a silicon rod grinding device 5.

The base is provided with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the base. As shown in the figure, in one implementation manner of this embodiment, the base 1 is a rectangular structure, the processing platform is designed to be rectangular in compliance with the shape of the base 1, and the first processing region and the second processing region thereof correspond to the squaring processing region and the grinding processing region respectively.

The first transfer device is arranged on the first transfer channel and used for carrying the silicon rod to be transferred between the first processing area and the second processing area through the first transfer channel. The second transfer device is arranged on the second transfer channel and used for carrying the silicon rod to be transferred between the first processing area and the second processing area through the second transfer channel.

The first transfer device and the second transfer device are arranged above the silicon rod processing platform through an installation frame, the installation frame is arranged on the base and is of a vertical frame structure, and the upper surface of the frame is higher than the silicon rod processing platform and bears the first transfer device and the second transfer device. In certain embodiments of the present application, as shown in fig. 1, a mounting frame is disposed above the silicon rod processing platform, and the first transfer device 2 and the second transfer device 3 are disposed in parallel on the left and right sides of the mounting frame. The support structure of the installation frame is arranged on the upper surface of the machine base 1, in the embodiment shown in the figure, the upper surface of the machine base 1 is rectangular, the support structure of the installation frame is arranged on the outer edge of the rectangle, and the shape and the size of the installation frame are approximately the same as those of the machine base 1. In certain embodiments of the present disclosure, a first mounting frame and a second mounting frame are disposed above the silicon rod processing platform, and the first mounting frame and the second mounting frame are disposed at opposite sides of the silicon rod processing platform along a second direction, wherein the first transfer device is mounted above the silicon rod processing platform through the first mounting frame, and the second transfer device is mounted above the silicon rod processing platform through the second mounting frame. The first mounting frame and the second mounting frame have the same shape and size and are approximately the same, for example, the first mounting frame and the second mounting frame have a rectangular shape.

As for the first transfer device, in the present application, the first transfer device provided to the first transfer channel comprises a first silicon rod clamp and a first transfer drive mechanism. The first silicon rod clamp is used for clamping a silicon rod, and the silicon rod is clamped by the first silicon rod clamp and then is horizontal, namely, the axis of the silicon rod is clamped in a mode that the axis of the silicon rod is consistent with the first direction. The first transfer driving mechanism is used for driving the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp to move along a first direction and transfer between a first processing area and a second processing area. The first rotary driving mechanism further comprises a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction and used for arranging the first silicon rod clamp, and the first transfer driving unit is used for driving the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail.

The first silicon rod clamp comprises a first clamping arm mounting seat, at least one pair of first clamping arms are arranged on the first clamping arm mounting seat in an opposite mode along a first direction and used for clamping two end faces of a silicon rod, and at least one first clamping arm in the at least one pair of first clamping arms can move along the first direction through a first clamping arm driving mechanism so as to adjust a clamping distance between the at least one pair of first clamping arms.

Fig. 4 is a schematic structural view of a first silicon rod clamp or a second silicon rod clamp in the silicon rod slicing and grinding integrated machine according to the present application. In some embodiments of the present application, as shown in fig. 4, the first silicon rod clamp 21 is integrally represented as a first clamping arm mounting seat 211 disposed above, the first clamping arm mounting seat 211 includes a first clamping arm 213 at an outer portion thereof in an overhanging state, the first clamping arm mounting seat 211 is mounted on the mounting frame, and the first clamping arm 213 extends from the first clamping arm mounting seat 211 in a hollow portion of the mounting frame in an overhanging manner, so as to enable a silicon rod (e.g., a silicon rod 101 to be cut or a silicon rod that has been cut) clamped by the first clamping arm 213 to be located on a processing surface of the silicon rod processing platform.

The first clamping arm mounting seat is arranged on a first transfer guide rail, in an implementation manner of this embodiment, a guide groove structure matched with the first transfer guide rail is arranged at the bottom of the first clamping arm mounting seat, the first transfer guide rail is arranged along a first direction, and the length range of the first transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure that the silicon rod clamped by the first silicon rod clamp is transferred between the two working areas. In one implementation of this embodiment, the first transfer rail is disposed across a full length of the mounting frame in the first direction.

The first clamping arm mounting seat is further provided with a first guide structure along the first direction, and the at least one pair of first clamping arms are arranged on the first clamping arm mounting seat through the first guide structure and can move in the first direction. In practical applications, the first guide structure may be, for example, a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod.

The at least one pair of first clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod.

For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, the length direction of the silicon rod is placed along the first direction, and the end faces are sections at two ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure (the cross section of the silicon rod is rectangular or similar to rectangular) with a certain length, the length direction of the silicon rod is placed along the first direction, and the end surfaces are the cross sections of two ends in the length direction.

The first clamping arm is drooping from the first clamping arm mounting seat, and a clamping part is arranged below the first clamping arm and used for directly contacting and clamping the silicon rod. As shown in fig. 4, one end of the first clamping arm 213 is connected to the first clamping arm mounting seat 211, and the other end of the first clamping arm 213 is connected to a clamping portion 215 for contacting an end surface of a silicon rod (e.g., the silicon rod 101 to be cut or the cut silicon rod). The first clamping arm mounting seat 211 is movably disposed on the first transfer rail and moves along the first transfer rail under the driving of the first transfer driving unit, so as to drive the first clamping arm 213 to move along the first transfer rail.

The first silicon rod clamp further comprises a first clamping arm driving mechanism, wherein the first clamping arm driving mechanism can drive at least one first clamping arm of the at least one pair of first clamping arms to move along the first direction so as to adjust the clamping distance between the pair of oppositely arranged first clamping arms, so that the clamping parts of the at least one pair of first clamping arms can approach or separate from each other under the action of the first clamping arm driving mechanism, and the silicon rod is clamped or released. For example, the clamping portions of two first clamping arms oppositely arranged along the first direction are driven by the first clamping arm driving mechanism to be relatively close to and clamp the silicon rod, the silicon rod is transferred among different working areas and is processed in a clamping state, and after the processing operation is finished, the silicon rod is transferred to the bearing position and then is driven by the first clamping arm driving mechanism to be mutually far away so as to release the processed silicon rod.

In certain embodiments of the present application, the first clamp arm drive mechanism includes a drive motor, a drive gear, and a pair of racks. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In an implementation manner of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end of each of the pair of racks is connected to a first clamping arm, so that the at least one pair of first clamping arms are away from or close to each other along the first clamping arm mounting seat guide rail in the first direction.

In certain embodiments of the present application, the first clamp arm driving mechanism includes a lead screw disposed in a first direction and associated with any one of the pair of first clamp arms, and a driving source connected to the lead screw for driving the lead screw to rotate so that the associated first clamp arm moves in the first direction.

The screw rod of the first clamping arm driving mechanism has a distal end and a proximal end, in a specific implementation manner, for example, the proximal end of the screw rod can be connected to the driving source and driven by the driving source to rotate, the distal end of the screw rod is connected to any one of the pair of first clamping arms by threads, by means of the connection manner of the two ends of the screw rod, the screw rod can rotate based on the transmission of the driving source and convert the rotation of the screw rod into axial displacement by means of the threaded connection, and the axial displacement direction is the arrangement direction of the screw rod, namely the first direction; the first clamping arm connected with the far end of the screw rod can move in the first direction by driving the screw rod to rotate through the driving source, and the screw rod can move forwards or backwards in the first direction by changing the rotary direction of the driving rotation.

In certain embodiments of the present application, the first clamp arm drive mechanism comprises: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the at least one pair of first clamping arms; the driving source is used for driving the screw rod to rotate so that the at least one pair of first clamping arms move towards or away from each other along the first direction.

In one implementation, the two-way screw rod of the first clamp arm driving mechanism is in threaded connection with the pair of first clamp arms at two ends, and the two-way screw rod is a double-threaded screw rod with opposite thread directions at the two ends, the driving source can be disposed at any one end of the two-way screw rod or connected to the two-way screw rod to drive the two-way screw rod to rotate along the screw rod shaft, and by means of the threads with opposite thread directions at the two ends of the two-way screw rod, when the two-way screw rod rotates under the driving of the driving source, the motion at the two ends of the two-way screw rod is converted into linear motion with opposite directions along the axial direction and the first direction of the screw rod. Under the drive of the driving source, the pair of first clamping arms can move towards each other or back to back in the first direction.

In one embodiment, the first clamp arm mounting seat may be a plurality of mounting seats connected by the first clamp arm driving mechanism, any one of the pair of first clamp arms corresponds to a mounting seat, and the driving source is provided between the pair of first clamp arms, where any one of the first clamp arms is movable along the guide structure; when the first silicon rod clamp needs to integrally move along the guide structure, for example, the driving source of the first clamp arm driving mechanism can control the pair of first clamp arms to relatively stand still, at this time, the different mounting seats can be relatively stand still by the connection action of the first clamp arm driving mechanism, and the power source of the first silicon rod clamp can drive any mounting seat to move along the guide structure, so that the first silicon rod clamp can integrally move.

In yet another implementation, the first clamp arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack and the second rack are respectively linked with a first clamping arm, the driving gear is connected to a power output shaft (not shown) of the driving motor and meshed with the first rack and the second rack, the driving gear is used for driving the pair of first clamping arms to move oppositely to perform clamping action when rotating in the forward direction and driving the pair of first clamping arms to move backwards to perform releasing action when rotating in the reverse direction.

In an embodiment of the present application, the first clamp arm is of a rotary type, for example, the first silicon rod clamp further comprises a first clamp arm rotating mechanism for driving the first clamp arm to rotate. In an implementation manner of this embodiment, any one clamping portion of the at least one pair of first clamping arms or two clamping portions of the pair of first clamping arms is provided with a rotatable structure, and the clamping portion of the first clamping arm is driven by the first clamping arm rotating mechanism to rotate around the longitudinal direction of the silicon rod, i.e., the first direction, as an axis, so that the clamped silicon rod correspondingly rotates around the first direction as an axis. For example, in some examples, the first clamping arm rotating mechanism may be, for example, a rotating motor, the clamping portions of two first clamping arms in the pair of first clamping arms are both provided with a rotatable structure, and the clamping portion of the two first clamping arms or the clamping portion of one of the two first clamping arms is connected to an output shaft of the rotating motor, for example, the clamping portions of the two first clamping arms are respectively connected to a rotating motor, and the two rotating motors respectively drive the clamping portion of the corresponding first clamping arm to rotate, or the clamping portion of one of the first clamping arms is connected to a rotating motor, and the rotating motor drives the clamping portion of the corresponding one of the first clamping arms to rotate, and the clamping portion of the other first clamping arm is also driven to rotate along with the force of friction through the conduction of the clamped silicon rod.

In certain embodiments of this embodiment, the clamping portions of the at least one pair of first clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are at both end surfaces at both ends of the elongated structure, the contact surface of the clamping portion may be set to a contact surface in a direction of a plumb line or a contact surface including a plane in a direction of a plumb line. The contact surface is arranged on a rotatable platform, and the section of the platform can be set to be a customized regular geometric figure or an irregular geometric figure.

In an embodiment of the present application, the rotatable platform may be configured as a whole hinged by a hinge device with a locking function, and may rotate along an axis in a first direction. The axis of the rotating shaft is connected with the first clamping arm rotating mechanism.

In an embodiment of the application, the clamping portion of the first clamping arm may be configured as a rotatable circular truncated cone, and a circular plane of the circular truncated cone contacts with the end surface of the silicon rod and remains relatively stationary with the end surface of the silicon rod after clinging to the end surface of the silicon rod. The clamping part also comprises a locking structure, and the clamping part is in a locking state when the silicon rod is subjected to corresponding processing operation (the processing operation can be cutting, surface grinding, chamfering and the like). In the switching of the silicon rod, such as cutting position switching or grinding surface switching, the clamping part is driven by the first clamping arm rotating mechanism to rotate along the circle center of the circular truncated cone.

In one embodiment, the clamping portion of the first clamping arm includes a rotatable circular table and a series of protruding contacts disposed on the circular table, each of the contacts having a contact plane. The round platform is driven by the first clamping arm rotating mechanism to rotate, in an implementation mode of the embodiment, the protruding length of the contact is adjustable in the position of the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact can be adjusted according to the end face of the silicon rod for the silicon rod with lower end face flatness, and each contact face and the end face of the silicon rod are in a tight state. The protruding length is a length in a first direction from a circular plane of the circular truncated cone to a contact plane of the contact.

In an embodiment of the present application, the clamping portion of the first silicon rod clamp is provided with a pressure sensor to adjust a protruding length of a contact based on the detected pressure state. In general, during the silicon rod clamping process, a pair of first clamping arms of the first silicon rod clamp are driven by a first clamping arm driving mechanism to approach each other along a first direction until a contact surface of the clamping portion contacts with an end surface of a silicon rod to be clamped, and when the clamping portion is provided with a plurality of contact points and a pressure value of partial contact points contacting with the end surface of the contacted silicon rod is detected to be less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact points (generally towards the approach direction of the end surface of the silicon rod); or each clamping portion of the pair of first clamping arms of the first silicon rod clamp is provided with a contact surface, in the process of clamping the silicon rod, the first clamping arm driving mechanism drives the end surfaces, facing the two ends of the silicon rod, of the pair of first clamping arms to approach each other so as to realize the purpose, after the clamping portions contact the end surfaces of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the first clamping arm driving mechanism controls and stops the opposite movement of the pair of first clamping arms.

The first clamping arm rotating mechanism can be arranged on one first clamping arm in the pair of first clamping arms (the other first clamping arm only has a rotating function) so as to drive the clamping parts of the pair of first clamping arms and the clamped silicon rod to rotate; or the first clamping arm rotating mechanism is arranged on each first clamping arm of the pair of first clamping arms and controls the two clamping parts of the pair of first clamping arms to rotate in the same angle and direction in a coordinated motion mode. In some implementations, the first clamp arm rotation mechanism can be configured as a drive motor.

When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the first clamping arm rotating mechanism so as to realize cutting. When the silicon rod is cut, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, so that one side surface or two opposite side surfaces of the silicon rod can be cut by the silicon rod cutting device.

When the silicon rod cutting and grinding all-in-one machine grinds surfaces of different side surfaces of the silicon rod or chamfers edges of the silicon rod, the first clamping arm rotating mechanism drives the clamping part to rotate so as to achieve the purpose. Generally, when different sides of the cut single crystal silicon rod are ground, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, and when different edges are chamfered, the first clamping arm rotating mechanism can control the clamping part to rotate by a certain angle, such as 45 degrees and 135 degrees. Under the condition that the grinding surface that the grinding device provided is the plane, when carrying out the chamfer to the silicon rod, the steerable clamping part of first arm lock slewing mechanism carries out many times chamfer rather than the rotatory different angle of silicon rod of centre gripping and realizes, for example, to the silicon rod after accomplishing the grinding of a side, to an edge that this edge is relative with this edge of adjacent edge in this side, accessible rotation certain angle for example 40 °, 45 °, 50 carry out many times chamfer, obtain the silicon rod that passes through more slick and sly in different side junctures. The angles are all rotational angles from the initial position of grinding. For the chamfering method, refer to patent publications such as CN108942570A, etc., and the grinding tool is used to grind the edge angle by driving the silicon rod to rotate a certain angle and performing the transverse feeding in the second direction.

In an embodiment of the present application, the first silicon rod clamp is an elevating silicon rod clamp. In one implementation, the first silicon rod clamp includes a lifting guide rail and a driving device in a lifting direction, the first clamp arm of the first silicon rod clamp and the clamp arm guide rail carrying the first clamp arm on the first clamp arm mounting seat are movable in a third direction (i.e., a plumb line direction) along the lifting guide rail, and can be used to control the relative positions of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the plumb line direction, so as to select a cutting area where a cut surface of the silicon rod and the silicon rod cutting device are used for cutting or select a grinding area where a ground surface of the silicon rod and the grinding tool are used for grinding. In an implementation manner of this embodiment, the lifting guide rail is disposed on an upright surface of the first clamp arm mounting seat, and the first clamp arm is correspondingly provided with a guide slot matched with the lifting guide rail and a driving mechanism for driving the first clamp arm to perform a lifting motion; the driving mechanism comprises a traveling lead screw and a traveling motor, the traveling lead screw is arranged along the lifting guide rail and connected with the traveling motor, and the first clamping arm is driven to move in a third direction under the driving of the traveling motor. In another implementation manner, each first clamping arm cantilever of the pair of first clamping arms is provided as a telescopic device, and is driven by the telescopic driving mechanism to perform lifting motion simultaneously.

With respect to the first transfer drive mechanism, the first transfer drive mechanism includes: the first transfer driving unit is used for driving the first clamping arm mounting seat and at least one pair of first clamping arms thereof to move along the first transfer guide rail.

The first transfer driving unit includes a first moving rack, a first driving gear, and a first driving source. The first moving rack is arranged along a first direction and is parallel to the first transfer guide rail. In one embodiment, the first moving rack is fixed on the upper surface, the side surface or the lower surface of the mounting frame, is arranged to be approximately the same as the first transfer guide rail in a first direction dimension, and is arranged in parallel and adjacent to the first transfer guide rail.

The first driving gear is arranged on the first silicon rod clamp, is meshed with the first moving rack and is used for driving the first silicon rod clamp to move along the first transfer guide rail. The first drive source is used for driving the first drive gear. In an implementation of the present application, the first driving gear is disposed on the first clamping arm mounting seat of the first silicon rod clamp, the first driving gear is driven by the first driving source to rotate, the gear teeth of the first driving gear and the first moving rack are meshed to conform to the first moving rack to advance, and the first silicon rod clamp connected with the first driving gear accordingly moves correspondingly on the first transferring guide rail.

In an embodiment of the present application, the first transfer driving unit may be disposed on the first silicon rod clamp, and include a first moving screw and a first driving source, wherein the first moving screw is disposed along a first direction and is associated with the first clamp arm mount, and the first driving source is configured to drive the first moving screw to rotate so as to move the associated first clamp arm mount and at least one pair of first clamp arms thereof along the first transfer guide rail.

In one implementation manner of this embodiment, the first driving source may be configured as a driving motor, a power output shaft of the driving motor is coupled to the first driving gear to control a motion state of the first driving gear, and then the first driving source controls the first silicon rod clamp to move in a first direction with respect to the silicon rod clamped by the first silicon rod clamp.

As for the second transfer device, in the present application, the second transfer device provided to the second transfer passage includes a second silicon rod clamp and a second transfer driving mechanism. The second silicon rod clamp is used for clamping a silicon rod, and the silicon rod is clamped by the second silicon rod clamp and then is horizontal, namely, the axis of the silicon rod is clamped in a mode that the axis of the silicon rod is consistent with the first direction. The second transfer driving mechanism is used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the first direction and transfer between the second processing area and the second processing area. The second rotating driving mechanism further comprises a second transfer guide rail and a second transfer driving unit, wherein the second transfer guide rail is arranged along a first direction and used for arranging the second silicon rod clamp, and the second transfer driving unit is used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail.

The second silicon rod clamp comprises a second clamping arm mounting seat, at least one pair of second clamping arms is arranged on the second clamping arm mounting seat in an opposite mode along a first direction and used for clamping two end faces of a silicon rod, and at least one second clamping arm in the at least one pair of second clamping arms can move along the first direction through a second clamping arm driving mechanism so as to adjust the clamping distance between the at least one pair of second clamping arms.

In some embodiments of the present application, as shown in fig. 4, the second silicon rod clamp 31 is integrally represented as a second clamping arm mounting seat 311 disposed above, an outer portion of the second clamping arm mounting seat 311 includes a second clamping arm 313 in an overhanging state, the second clamping arm mounting seat 311 is mounted on the mounting frame, and the second clamping arm 313 extends from the second clamping arm mounting seat 311 in a hollow portion of the mounting frame in an overhanging manner, so as to enable a silicon rod (e.g., a silicon rod 101 to be cut or a silicon rod that has been cut) clamped by the second clamping arm 313 to be located on a processing surface of the silicon rod processing platform.

The second clamp arm mounting seat is arranged on a second transfer guide rail, in an implementation manner of this embodiment, a guide groove structure matched with the second transfer guide rail is arranged at the bottom of the second clamp arm mounting seat, the second transfer guide rail is arranged along a first direction, and a length range of the second transfer guide rail in the first direction at least covers positions of the first working area and the second working area in the first direction, so as to ensure that the silicon rod clamped by the second silicon rod clamp is transferred between the two working areas. In one implementation of this embodiment, the second transfer rail is configured to span a full length of the mounting frame in the first direction.

The second clamping arm mounting seat is also provided with a second guide structure along the first direction, and the at least one pair of second clamping arms are arranged on the second clamping arm mounting seat through the second guide structure and can move in the first direction. In practical applications, the second guide structure may be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod.

The at least one pair of second clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod.

The second clamping arm is drooping from the second clamping arm mounting seat, and a clamping part is arranged below the second clamping arm and used for directly contacting and clamping the silicon rod. As shown in fig. 4, one end of the second clamping arm 313 is connected to the second clamping arm mounting seat 311, and the other end of the second clamping arm 313 is connected to a clamping portion 315 for contacting an end surface of a silicon rod (e.g., the silicon rod 101 to be cut or the cut silicon rod). The second clamping arm mounting seat 311 is movably disposed on the second transfer guide rail and moves along the second transfer guide rail under the driving of the second transfer driving unit, so as to drive the second clamping arm 313 to move along the second transfer guide rail.

The second silicon rod clamp further comprises a second clamping arm driving mechanism, wherein the second clamping arm driving mechanism can drive at least one second clamping arm in the at least one pair of second clamping arms to move along the first direction so as to adjust the clamping distance between the pair of oppositely arranged second clamping arms, so that the clamping parts of the at least one pair of second clamping arms can approach or separate from each other under the action of the second clamping arm driving mechanism, and the silicon rod is clamped or released. For example, the clamping portions of the two second clamp arms oppositely arranged along the first direction are driven by the second clamp arm driving mechanism to be relatively close to and clamp the silicon rod, the silicon rod is transferred among different working areas and is processed in a clamping state, and after the processing operation is finished, the silicon rod is transferred to the bearing position and then is driven by the second clamp arm driving mechanism to be mutually far away so as to release the processed silicon rod.

In certain embodiments of the present application, the second clamp arm drive mechanism includes a drive motor, a drive gear, and a pair of racks. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In an implementation manner of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end of each of the pair of racks is connected to a second clamping arm, so that the at least one pair of second clamping arms are away from or close to each other along the second clamping arm mounting seat guide rail in the first direction.

In certain embodiments of the present application, the second clamp arm driving mechanism includes a lead screw disposed in the first direction and associated with any one of the pair of second clamp arms, and a driving source connected to the lead screw for driving the lead screw to rotate so that the associated second clamp arm moves in the first direction.

The screw rod of the second clamping arm driving mechanism has a distal end and a proximal end, in a specific implementation manner, for example, the proximal end of the screw rod can be connected to the driving source and driven by the driving source to rotate, the distal end of the screw rod is connected to any one of the pair of second clamping arms by a screw thread, by means of the connection manner of the two ends of the screw rod, the screw rod can rotate based on the transmission of the driving source and convert the rotation of the screw rod into axial displacement by means of the screw thread connection, and the axial displacement direction is the arrangement direction of the screw rod, namely the first direction; the second clamping arm connected with the far end of the screw rod can move in the first direction by driving the screw rod to rotate through the driving source, and the screw rod can move forwards or backwards in the first direction by changing the rotary direction of the driving rotation.

In certain embodiments of the present application, the second clamp arm drive mechanism includes: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the at least one pair of second clamping arms; and the driving source is used for driving the screw rod to rotate so that the at least one pair of second clamping arms move towards or away from each other along the first direction.

In one implementation, the two-way screw rod of the second clamp arm driving mechanism is in threaded connection with the pair of second clamp arms at two ends, and the two-way screw rod is a double-threaded screw rod with opposite thread directions at the two ends, the driving source can be disposed at any one end of the two-way screw rod or connected to the two-way screw rod to drive the two-way screw rod to rotate along the screw rod shaft, and by means of the threads with opposite thread directions at the two ends of the two-way screw rod, when the two-way screw rod rotates under the driving of the driving source, the motion at the two ends of the two-way screw rod is converted into linear motion with opposite directions along the axial direction and the first direction of the screw rod. Under the drive of the driving source, the pair of second clamping arms can move towards each other or back to back in the first direction.

In one embodiment, the second clamp arm mounting seat may be a plurality of mounting seats connected by the second clamp arm driving mechanism, any one of the pair of second clamp arms corresponds to a mounting seat, and the driving source is disposed between the pair of second clamp arms, where any one of the second clamp arms is movable along the guide structure; when the second silicon rod clamp needs to integrally move along the guide structure, for example, the driving source of the second clamp arm driving mechanism may control the pair of second clamp arms to relatively stand still, at this time, the connection function of the second clamp arm driving mechanism may make different mounting seats relatively stand still, and the power source of the second silicon rod clamp may drive any mounting seat to move along the guide structure, so that the second silicon rod clamp may integrally move.

In yet another implementation, the second clamp arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack and the second rack are respectively linked with a second clamping arm, the driving gear is connected to a power output shaft (not shown) of the driving motor and meshed with the first rack and the second rack, the driving gear is used for driving the pair of second clamping arms to move oppositely to perform clamping action when rotating in the forward direction and driving the pair of second clamping arms to move backwards to perform releasing action when rotating in the reverse direction.

In an embodiment of the present application, the second clamp arm is of a rotary type, for example, the second silicon rod clamp further includes a second clamp arm rotating mechanism for driving the second clamp arm to rotate. In an implementation manner of this embodiment, any one clamping portion of the at least one pair of second clamping arms or two clamping portions of the pair of second clamping arms is provided with a rotatable structure, and the clamping portion of the second clamping arm is driven by the second clamping arm rotating mechanism to rotate around the longitudinal direction of the silicon rod, i.e., the first direction, as an axis, so that the clamped silicon rod correspondingly rotates around the first direction as an axis. For example, in some examples, the second clamping arm rotating mechanism may be, for example, a rotating motor, the clamping portions of two of the pair of second clamping arms are each provided with a rotatable structure, and the clamping portion of the two second clamping arms or the clamping portion of one of the two second clamping arms is connected to an output shaft of the rotating motor, for example, the clamping portions of the two second clamping arms are respectively connected to a rotating motor, and the two rotating motors respectively drive the clamping portion of the corresponding second clamping arm to rotate, or the clamping portion of one of the second clamping arms is connected to a rotating motor, and the rotating motor drives the clamping portion of the corresponding second clamping arm to rotate, and the clamping portion of the other second clamping arm is also driven to rotate by friction force and conduction of the silicon rod being clamped.

In certain embodiments of this embodiment, the clamping portions of the at least one pair of second clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are at both end surfaces at both ends of the elongated structure, the contact surface of the clamping portion may be set to a contact surface in a direction of a plumb line or a contact surface including a plane in a direction of a plumb line. The contact surface is arranged on a rotatable platform, and the section of the platform can be set to be a customized regular geometric figure or an irregular geometric figure.

In an embodiment of the present application, the rotatable platform may be configured as a whole hinged by a hinge device with a locking function, and may rotate along an axis in a first direction. The axis of the rotating shaft is connected with the second clamping arm rotating mechanism.

In an embodiment of the application, the clamping portion of the second clamping arm may be configured as a rotatable circular truncated cone, and a circular plane of the circular truncated cone contacts with the end surface of the silicon rod and remains relatively stationary with the end surface of the silicon rod after clinging to the end surface of the silicon rod. The clamping part also comprises a locking structure, and the clamping part is in a locking state when the silicon rod is subjected to corresponding processing operation (the processing operation can be cutting, surface grinding, chamfering and the like). In the switching of the silicon rod, such as cutting position switching or grinding surface switching, the clamping part is driven by the second clamping arm rotating mechanism to rotate along the circle center of the circular truncated cone.

In one embodiment, the clamping portion of the second clamping arm includes a rotatable circular table and a series of protruding contacts disposed on the circular table, each of the contacts having a contact plane. The round platform is driven by the second clamping arm rotating mechanism to rotate, in an implementation mode of the embodiment, the protruding length of the contact is adjustable in the position in the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact can be adjusted according to the end face of the silicon rod for each contact face and the end face of the silicon rod to be in a tight state. The protruding length is a length in a first direction from a circular plane of the circular truncated cone to a contact plane of the contact.

In an embodiment of the present application, the clamping portion of the second silicon rod clamp is provided with a pressure sensor to adjust a protruding length of a contact based on the detected pressure state. In general, during the process of clamping the silicon rod, a pair of second clamping arms of the second silicon rod clamp are driven by a second clamping arm driving mechanism to approach each other along a first direction until a contact surface of the clamping portion contacts with an end surface of the silicon rod to be clamped, and when the clamping portion is provided with a plurality of contact points and a pressure value of partial contact points contacting with the end surface of the contacted silicon rod is detected to be less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact points (generally towards the approaching direction of the end surface of the silicon rod); or each clamping portion of the pair of second clamping arms of the second silicon rod clamp is provided with a contact surface, in the process of clamping the silicon rod, the second clamping arm driving mechanism drives the end surfaces, facing the two ends of the silicon rod, of the pair of second clamping arms to approach each other so as to realize the purpose, after the clamping portions contact the end surfaces of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the second clamping arm driving mechanism controls and stops the opposite movement of the pair of second clamping arms.

The second clamping arm rotating mechanism can be arranged on one of the pair of second clamping arms (the other second clamping arm only has a rotating function) so as to drive the clamping parts of the pair of second clamping arms and the clamped silicon rod to rotate; or the second clamping arm rotating mechanism is arranged on each of the pair of second clamping arms and controls the two clamping parts of the pair of second clamping arms to rotate in the same angle and direction in a coordinated motion mode. In some implementations, the second clamp arm rotation mechanism can be configured as a drive motor.

When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the second clamping arm rotating mechanism so as to realize cutting. When the silicon rod is cut, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, so that one side surface or two opposite side surfaces of the silicon rod can be cut by the silicon rod cutting device.

When the silicon rod cutting and grinding all-in-one machine grinds surfaces of different side surfaces of the silicon rod or chamfers edges of the silicon rod, the second clamping arm rotating mechanism drives the clamping part to rotate so as to achieve the purpose. Generally, when different sides of the cut silicon single crystal rod are ground, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, and when different edges are chamfered, the clamping part can be controlled to rotate by a certain angle, such as 45 degrees and 135 degrees. Under the condition that the grinding surface that the grinding device provided is the plane, when carrying out the chamfer to the silicon rod, the steerable clamping part of second arm lock slewing mechanism carries out many times chamfer rather than the rotatory different angle of silicon rod of centre gripping and realizes, for example, to the silicon rod after accomplishing the grinding of a side, to an edge that this edge is relative with this edge of adjacent edge in this side, accessible rotation certain angle for example 40 °, 45 °, 50 carry out many times chamfer, obtain the silicon rod that passes through more slick and sly in different side junctures. The angles are all rotational angles from the initial position of grinding. For the chamfering method, refer to patent publications such as CN108942570A, etc., and the grinding tool is used to grind the edge angle by driving the silicon rod to rotate a certain angle and performing the transverse feeding in the second direction.

In an embodiment of the present application, the second silicon rod clamp is an elevating silicon rod clamp. In one implementation manner, the second silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, the second clamp arm of the second silicon rod clamp and the clamp arm guide rail on the second clamp arm mounting seat, which bears the second clamp arm, can move in the third direction along the lifting guide rail, and can be used to control the relative positions of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the plumb line, so as to select a cutting area where a cut surface of the silicon rod and the silicon rod cutting device are used for cutting or select a grinding area where a ground surface of the silicon rod and the grinding tool are used for grinding. In an implementation manner of this embodiment, the lifting guide rail is disposed on an upright surface of the second clamp arm mounting seat, and the second clamp arm is correspondingly provided with a guide slot matched with the lifting guide rail and a driving mechanism for driving the second clamp arm to perform a lifting motion; the driving mechanism comprises a traveling lead screw and a traveling motor, the traveling lead screw is arranged along the lifting guide rail and connected with the traveling motor, and the second clamping arm is driven by the traveling motor to move in a third direction. In another implementation manner, each second clamping arm cantilever of the pair of second clamping arms is provided as a telescopic device, and is driven by the telescopic driving mechanism to perform lifting motion simultaneously.

With regard to the second transfer drive mechanism, the second transfer drive mechanism includes: the second transfer driving unit is used for driving the second clamping arm mounting seat and at least one pair of second clamping arms thereof to move along the second transfer guide rail.

The second transfer driving unit includes a second moving rack, a second driving gear, and a second driving source. The second moving rack is arranged along the first direction and is parallel to the second transfer guide rail. In one embodiment, the second moving rack is fixed on the upper surface, the side surface or the lower surface of the mounting frame, is arranged to have approximately the same first directional dimension as the second transfer guide, and is arranged in parallel and adjacent to the second transfer guide.

The second driving gear is arranged on the second silicon rod clamp, meshed with the second moving rack and used for driving the second silicon rod clamp to move along the second transfer guide rail. The second drive source is used for driving the second drive gear. In an implementation of the present application, the second driving gear is disposed on the second clamping arm mounting seat of the second silicon rod clamp, the second driving gear is driven by the second driving source to rotate, the gear teeth of the second driving gear and the second moving rack are meshed to conform to the second moving rack to advance, and the second silicon rod clamp connected with the second driving gear generates corresponding movement on the second transfer guide rail.

In an embodiment of the present application, the second transfer driving unit may be disposed on the second silicon rod clamp, and include a second moving screw disposed along a first direction and associated with the second clamp arm mount, and a second driving source for driving the second moving screw to rotate so as to move the associated second clamp arm mount and at least one pair of second clamp arms thereof along the second transfer guide.

In one implementation manner of this embodiment, the second driving source may be configured as a driving motor, a power output shaft of the driving motor is coupled to the second driving gear to control a motion state of the second driving gear, and then the second driving source controls the second silicon rod clamp to move in the first direction with respect to the silicon rod clamped by the second silicon rod clamp.

In combination with the aforementioned first transfer device, the second transfer guide in the second transfer device and the first transfer guide in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp of the first transfer device and the second silicon rod clamp of the second transfer device move on mutually parallel paths defined by the first transfer guide and the second transfer guide, respectively. When the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp are transferred from different processing regions, the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp can also be transferred from different processing regions, and the first silicon rod clamp and the second silicon rod clamp move independently from each other, so that the first transfer guide rail and the second transfer guide rail which limit the movement ranges of the first silicon rod clamp and the second silicon rod clamp are respectively arranged at different spatial positions and are not interfered with each other. In an embodiment of the application, the top views of the base of the silicon rod cutting and grinding all-in-one machine and the mounting frame are all shown as regular rectangles, the first transfer guide rail and the second transfer guide rail are arranged along the first direction and are arranged in parallel and symmetrically, and the symmetry line is the central line axial lead of the base in the first direction.

As can be seen from the above, the first transfer device and the second transfer device are used for controlling the movement of the silicon rod, for example, the first transfer device is used for clamping the silicon rod and driving the silicon rod to move along the first direction, and the second transfer device is used for clamping the silicon rod and driving the silicon rod to move along the first direction, so that any one silicon rod can move along the first direction relative to the silicon rod cutting device located at the first processing location or the grinding device located at the second processing location, so as to implement the preset cutting operation or grinding operation.

In the silicon rod cutting and grinding all-in-one machine of this application, silicon rod cutting device locates silicon rod processing platform's first processing position department for to on the first transfer passageway by on the silicon rod or the second transfer passageway that first transfer device was held by the silicon rod that the second transfer device was held carries out the cutting operation.

Including a plurality of cutting wheels in the silicon rod cutting device and around in the cutting coping saw of a plurality of cutting wheels in order to form, through first silicon rod anchor clamps or second silicon rod anchor clamps drive the silicon rod and move along first direction, can from this with silicon rod cutting device can set up to the relative feeding between cutting coping saw and the silicon rod to the stationary state when carrying out the cutting operation. In the traditional silicon rod cutting and grinding all-in-one machine, a cutting wire saw needs to move in space to cut a silicon rod to be cut, so that a driving device and a guide structure need to be configured for a cutting wheel and a cutting line to realize feeding of the cutting wire saw relative to the silicon rod; here, the structure of the silicon rod cutting device according to the present invention may be simplified, the cutting wheel may be fixed to a main body of the silicon rod cutting device, for example, a cutting frame, and a guide structure and a driving device for moving the cutting wheel in the direction of the axis of the silicon rod may be omitted, so that the structure of the silicon rod cutting device and the occupied equipment space may be reduced.

The silicon rod cutting device is arranged at a first processing position of the silicon rod processing platform and used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or the silicon rod to be cut clamped by the second transfer device on the second transfer channel.

In certain embodiments, the silicon rod cutting apparatus comprises: a cutting frame, at least one wire cutting unit, and a cutting switching mechanism; the cutting conversion mechanism is used for driving the cutting frame and the at least one wire cutting unit on the cutting frame to convert between a first transfer channel and a second transfer channel.

At least one wire cutting unit is located the cutting frame, wire cutting unit includes: the cutting wire is wound around the cutting wheels and the transition wheels to form at least one cutting wire saw.

The cutting frame is used for arranging the wire cutting unit, and the specific structure of the cutting frame can be set to different forms based on the arrangement requirements of the cutting wheels and the transition wheels, such as columns, beams and plate frames.

In some embodiments, the plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or the plurality of cutting wheels and transition wheels are mounted on the cutting frame through a bracket, a connecting plate, or a mounting frame, and herein, the carrier for mounting the plurality of cutting wheels and transition wheels may be in various forms, which is not limited in this application.

Fig. 5 is a schematic view of a silicon rod cutting device in an embodiment of the silicon rod cutting and grinding integrated machine according to the present application.

In certain embodiments, as exemplified in fig. 5, the silicon rod cutting device 4 comprises: the cutting device comprises a cutting frame 41, at least one wire cutting unit 43 and a cutting conversion mechanism, wherein the wire cutting unit 43 is arranged on the cutting frame 41 through a wire cutting support 430. Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the wire cutting support 430 may be in the form of a beam, a plate frame, a bracket, or the like.

In one implementation, the wire-cutting support is disposed on the cutting frame through a guide structure such as a guide rail or a guide pillar, wherein the guide rail or the guide pillar is disposed along a perpendicular line of a wheel surface of a cutting wheel in the wire-cutting unit, so that the disposed wire-cutting unit has a degree of freedom to move along the perpendicular line of the wheel surface of the cutting wheel; under the arrangement, the wire cutting support can move along the orthogonal direction of the wheel surface of the cutting wheel under the action of the driving source.

When the wire cutting unit moves along the vertical line direction of the wheel surface of the cutting wheel, correspondingly, the cutting wire saw in the wire cutting unit moves along the vertical line direction of the wheel surface of the cutting wheel, the cutting wire saw is away from or close to the axis of the silicon rod, and therefore the cutting amount or the cutting position of the silicon rod can be adjusted.

The cutting wheel is provided with at least one cutting line groove for winding cutting lines, and the cutting line groove can limit the position of the cutting lines so as to control the cutting precision. Any cutting wire saw is formed by winding a cutting wire between two cutting wheels, and the positions of the two cutting wheels and the position relation between the two cutting wheels can be used for determining the direction of the cutting wire saw.

The transition wheel is used for reversing or guiding the cutting line, or the transition wheel can be used for adjusting the tension of the cutting line.

In the silicon rod surely grinds all-in-one of this application, at the cutting process, the drive the line of cut is followed wire winding direction and is moved, and the silicon rod that drives the centre gripping by first silicon rod anchor clamps or second silicon rod anchor clamps is first direction removal in order to realize the feeding of relative cutting coping saw along silicon rod axial lead direction promptly, wherein, second direction or plumb line direction can be located to the cutting coping saw.

It should be noted that the cutting wire saw is oriented only in a direction orthogonal to the axis of the silicon rod, so that the cutting wire saw is oriented in a vertical plane of the first direction in a specific scenario, and the following embodiments are described with the cutting wire saw disposed in the second direction or the direction of the plumb line for the convenience of controlling the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, and for the convenience of describing the arrangement of the components and the structure of the silicon rod cutting device of the present application.

In one embodiment, the wire cutting unit includes: cutting a line; the first cutting wheel and the second cutting wheel are arranged on the cutting frame, and cutting wires are wound on the first cutting wheel and the second cutting wheel to form a cutting wire saw; the wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel; the first transition wheel is adjacent to the first cutting wheel, and the cutting lines of the first cutting wheel and the first transition wheel are positioned in a plane where a first cutting line groove for winding the cutting lines is positioned in the first cutting wheel in the state of pulling the cutting lines; the second transition wheel is arranged adjacent to the second cutting wheel, and the cutting lines of the second cutting wheel and the second transition wheel are positioned in a plane where a second cutting line groove for winding the cutting lines in the second cutting wheel is positioned in the state of drawing the cutting lines; at least one third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing a cutting line between the first transition wheel and the second transition wheel so as to enable a cutting accommodating space to be formed in the line cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and only the cutting wire saw is intersected with the cutting accommodating space in the silicon rod cutting device.

The direction of the wheel surface of the cutting wheel and the direction of the cutting wire saw have a corresponding relation, and it should be understood that the wheel surface of the cutting wheel is parallel to the plane of any cutting wire groove in the cutting wheel, and the cutting wire saw should be located in the plane of the cutting wire groove for winding the cutting wire for controlling the cutting precision and the stability of the cutting process; meanwhile, in the cutting process, the force application direction of the silicon rod to the cutting line needs to be parallel to the cutting line groove, namely the wheel surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the axis line direction of the silicon rod in the squaring operation.

In the silicon rod cutting device of this application, the cutting coping saw is located second direction or plumb line direction, correspondingly, the cutting wheel face is on a parallel with second direction and silicon rod axial lead direction promptly the cutting wheel face is located the horizontal plane direction, perhaps the cutting wheel face is on a parallel with plumb line direction and silicon rod axial lead direction promptly the cutting wheel face is located the plane direction that hangs down.

The silicon rod cutting device comprises two oppositely arranged wire cutting units, each wire cutting unit is provided with at least one cutting wire saw, and therefore, the two wire cutting units at least form two cutting wire saws which are parallel. In the example shown in fig. 5, the silicon rod cutting device includes two wire cutting units 43 arranged oppositely in the second direction, each wire cutting unit 43 has a cutting wire 439, and the cutting wire 439 can be arranged in the direction of the plumb line, so that the two cutting wires 439 belonging to the two wire cutting units 43 are arranged in the direction of the plumb line.

Please refer to fig. 6, which is a schematic structural diagram of the wire cutting unit shown in fig. 5. In the example shown in fig. 6, any one of the wire cutting units 43 includes a first cutting wheel 431 and a second cutting wheel 433, and a cutting wire 438 is wound around the first cutting wheel 431 and the second cutting wheel 433 to form a cutting wire saw 439.

The first cutting wheel comprises at least one first cutting line groove, and the plane of any first cutting line groove is parallel to the wheel surface of the first cutting wheel; the second cutting wheel comprises at least one second cutting line groove, and the plane where any second cutting line groove is located is parallel to the wheel surface of the second cutting wheel.

The wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel, so that when the cutting line is wound on the first cutting wheel and the second cutting wheel, the first cutting line groove and the second cutting line groove which are used for winding the cutting line are respectively and correspondingly located in the same plane, and therefore the direction of the cutting wire saw can be located in the plane where the first cutting line groove and the second cutting line groove which are used for winding the cutting line are located at the same time. It will be understood that the cutting wire is in operation during the cutting action and therefore the cutting wire saw is defined by the spatial position in which it is located, in the embodiment of the application the cutting wire is wound between the first cutting wheel and the second cutting wheel, i.e. the cutting wire saw.

It will be understood that when the cutting line is wound around any cutting wheel, the cutting line on both sides of the cutting wheel should lie in the plane of the cutting line groove in the cutting wheel in which the cutting line is wound.

When the cutting wire is wound on the first cutting wheel, the cutting wire at one end of the first cutting wire groove is wound on the second cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the first cutting wire groove is wound on the first transition wheel. As shown in fig. 6, the first transition wheel 432 is adjacent to the first cutting wheel 431, and the cutting line wound around the first cutting wheel 431 is positioned in a plane of the first cutting line groove for winding the cutting line in the first cutting wheel 431 in a state that the cutting line wound around the first cutting wheel 431 is drawn.

When the cutting wire is wound on the second cutting wheel, the cutting wire at one end of the second cutting wire groove is wound on the first cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the second cutting wire groove is wound on the second transition wheel. As shown in fig. 6, the second transition wheel 434 is disposed adjacent to the second cutting wheel 433, and the cutting line wound around the second cutting wheel 433 is positioned in a plane where the second cutting line groove for winding the cutting line in the second cutting wheel 433 is located in a state where the cutting line wound around the second cutting wheel 433 is drawn.

The first transition wheel and the second transition wheel are respectively provided with at least one wire guide groove for drawing the cutting wire. The first transition wheel and the second transition wheel are respectively arranged adjacent to the first cutting wheel and the second cutting wheel, wherein the adjacent arrangement can be a left side, a right side, an upper side, a lower side and the like, and the application is not limited.

It should be understood that when the cutting line is wound around any cutting wheel or transition wheel, the direction of the cutting line wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting line groove or wire groove.

As shown in fig. 6, the at least one third transition wheel 436 is disposed between the first transition wheel 432 and the second transition wheel 434, and is used for drawing the cutting wire between the first transition wheel 432 and the second transition wheel 434, so that a cutting accommodating space is formed in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and only the cutting wire saw in the silicon rod cutting device intersects with the cutting accommodating space.

In the cutting operation, the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod to feed along the axis line direction of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is the movement range of the silicon rod to be cut in the process that the silicon rod to be cut penetrates through the silicon rod from the beginning to contact with the cutting line to the moving direction of the cutting line to form the edge skin.

The cutting accommodation space can accommodate a silicon rod to be cut and only the cutting wire saw is intersected with the cutting accommodation space in the silicon rod cutting device. It should be understood that during the cutting process, collisions of the first or second silicon rod clamp and the silicon rod to be cut held thereby with other parts of the silicon rod slicing and grinding machine, including the cutting wire (the cutting wire here excluding the cutting wire saw), in motion are a problem to be avoided; meanwhile, in order to achieve cutting, the cutting wire saw and the silicon rod are relatively fed during the movement of the first or second silicon rod clamp holding the silicon rod, and therefore, it should be ensured that the silicon rod and the cutting wire saw are included and included only in the cutting accommodation space.

The first transition wheel, the second transition wheel and at least one third transition wheel can be used for realizing the traction of the cutting line direction, and the cutting line between the first transition wheel and the second transition wheel is dragged by the third transition wheel to form the cutting accommodating space.

In certain embodiments, the first transition wheel, the second transition wheel and the at least one third transition wheel are used to pull the cutting wire in a direction away from the silicon rod to be cut. It is understood that the cutting line between the first cutting wheel and the first transition wheel and the cutting line between the second cutting wheel and the second transition wheel are both located in the plane of the first cutting slot (or the second cutting slot) for winding the cutting line. In order to form the cutting accommodating space, in one implementation mode, the lengths of the cutting lines between the first cutting wheel and the first transition wheel and between the second cutting wheel and the second transition wheel can be made to be long enough, for example, larger than the length of the silicon rod to be cut, but the arrangement of the cutting frame occupies too much equipment space, and the layout is not reasonable.

In certain embodiments, the first transition wheel, second transition wheel, and at least a third transition wheel are used to pull the cutting line away from the cutting accommodation space.

Embodiments are provided for forming the cutting accommodation space by the first, second and third transition wheels. In one implementation manner, an included angle is formed between a wheel surface of at least one of the first transition wheel, the second transition wheel and the third transition wheel and a wheel surface of the first cutting wheel or the second cutting wheel, so that the cutting line deviates from a plane where the first cutting line groove (or the second cutting line groove) for winding the cutting line is located.

Taking the example that the silicon rod cutting device includes two wire cutting units arranged oppositely, as shown in fig. 6, the first transition wheel 432, the second transition wheel 434 and the third transition wheel 436 are arranged to be inclined toward a direction away from the cutting accommodating space, or the transition wheels are arranged on the cutting frame at a side away from the cutting accommodating space, so that the cutting line can be away from the cutting accommodating space, and in this layout, the equipment space required by the wire cutting units can be effectively reduced, and the overall equipment layout of the silicon rod cutting and grinding all-in-one machine is facilitated.

Here, for any one of the wire cutting units, the direction away from the cutting accommodating space is a vector of a perpendicular direction of the wheel surface of the cutting wheel, and taking the embodiment shown in fig. 5 as an example, the directions away from the cutting accommodating space corresponding to the two opposite wire cutting units 43 are opposite, and are respectively directions shown by arrows in the figure.

In some embodiments, the tread of the first transition wheel may be at an angle to the tread direction of the first cutting wheel, and the tread of the second transition wheel may be at an angle to the tread direction of the second cutting wheel. The direction of the first transition wheel is only required to be set when the cutting line at the other end of the first cutting wheel is positioned in the intersecting line of the plane of the first cutting line groove for winding the cutting line and the plane of the wire guide groove for winding the cutting line in the first transition wheel; and the direction of the second transition wheel is only required to be within the intersection line of the plane of the second cutting line groove for winding the cutting line and the plane of the wire guide groove for winding the cutting line in the second transition wheel.

Through with first transition wheel and second transition wheel set up to be with be certain contained angle between the wheel face of first cutting wheel or second cutting wheel, the contained angle direction is for making first transition wheel or second transition wheel orientation keep away from the direction slope of cutting accommodation space is favorable to reducing required the quantity of third transition wheel to and be favorable to reducing the length of wire-electrode cutting support in first direction.

In some embodiments, the cutting line is wrapped in an end-to-end fashion between the first cutting wheel, second cutting wheel, first transition wheel, second transition wheel, and third transition wheel to form a closed loop cutting line. As shown in fig. 6, the cut line 438 is a closed loop cut line.

In this case, the silicon rod cutting device may omit the wire storage drum, and the cutting wheel and the transition wheel in the wire cutting unit may be wound by an annular cutting wire, which may be cut by operating the driving device.

In the conventional silicon rod cutting device, a cutting line is wound from a pay-off drum to a position between a cutting wheel and a transition wheel in a line cutting unit, and is wound from the line cutting unit to a take-up drum, and the cutting line is driven to run during a cutting operation, wherein the running process of the cutting line is an acceleration process and a deceleration process which are alternately performed. In the silicon rod cutting device of the present application, the annular cutting line in the wire cutting unit can be kept running continuously at a high speed, and at the same time, the annular cutting line can be run in the same running direction in the cutting operation. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the annular cutting line can effectively reduce the total length of the cutting line required by the line cutting unit and reduce the production cost.

In some embodiments, the wire cutting unit comprises two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, one third transition wheel, the other third transition wheel, the first transition wheel and the first cutting wheel to form an endless cutting wire in an end-to-end connection.

Referring to fig. 6, taking the first cutting wheel 431 as an example of a starting point of the winding of the circular cutting wire, the cutting wire is wound from the first cutting wheel 431 to the second cutting wheel 433, and a cutting wire saw 439 is formed between the two cutting wheels; the cutting line is sequentially wound from the second cutting wheel 433 to the second transition wheel 434, a third transition wheel 436, another third transition wheel 436, the first transition wheel 432 and the first cutting wheel 431, thereby forming endless coils in an end-to-end relationship, and at the same time, the cutting accommodating space is formed in the wire cutting unit by the traction guide of the plurality of transition wheels to the cutting line.

Of course, it should be understood that the positions where the first, second and third transition wheels are disposed with respect to the cutting wheels and the inclination direction of the wheel surface are not limited to the illustrated embodiment, and the cutting accommodation space may be formed only when the cutting wire is wound between the plurality of cutting wheels and the transition wheels of the wire cutting unit. Meanwhile, the third transition wheels of the wire cutting unit can be arranged to be three, four and the like, and the application is not limited.

In some embodiments, the silicon rod cutting device further comprises a cutting line driving device for driving the cutting line to operate so as to cut the silicon rod.

The principle of linear cutting is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of linear cutting is achieved. The string drive is used to carry out the string run.

In some embodiments, the cutting wire driving device is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel, so that the cutting wire can be driven by the wound cutting wheel to move along the winding direction. Of course, in a specific embodiment, the string driving device may also be another driving source, such as a hydraulic motor, only when the string is driven to operate, and the application is not limited thereto.

In certain embodiments, a tension detection mechanism is further included in the silicon rod cutting device. In the process of wire cutting, the tension of the cutting wire influences the yield and the processing precision in the process of cutting, and the tension detection mechanism detects the tension and adjusts the tension of the cutting wire to reach a set certain threshold value, and keeps a constant value or a certain range allowed by taking the constant value as a numerical center in the process of cutting.

In one embodiment, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for tension adjustment of the cutting wire when the guided traction of the cutting wire is achieved.

The tensioning wheel is used for adjusting the tension of the cutting line, and the line breakage probability of the cutting line can be reduced so as to reduce consumable materials. In cutting operations, the action of the string is very important, but even the best strings have a limited extension and wear resistance, i.e. the string tapers off during continuous operation until it is finally torn off. Therefore, the existing wire cutting equipment is generally provided with a wire tension compensation mechanism for compensating the extension degree of the cutting wire in the reciprocating motion, and the tensioning wheel is an implementation means.

In certain embodiments of the application, the tension detection mechanism comprises at least: a tension sensor, a servo motor and a screw rod; the tension sensor is arranged on the transition wheel, continuously senses the tension value of the cutting line on the transition wheel, and sends out a driving signal when the tension value is smaller than a preset value; the servo motor is electrically connected with the tension sensor and is used for starting to work after receiving a driving signal sent by the tension sensor; one end of the screw rod is connected with the tensioning wheel, the other end of the screw rod is connected with the servo motor, and the transition wheel is pulled to perform unidirectional displacement when the servo motor works so as to adjust the tension of the cutting line.

In certain embodiments, the silicon rod cutting apparatus further comprises: and the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving the plurality of cutting wheels in the linear cutting unit to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels. The silicon rod cutting device can realize the switching of the cutting line between different cutting grooves of the cutting wheel based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or the processing specification) relative to the silicon rod.

In some implementations, referring to fig. 5 and 6, a wire cutting unit in a silicon rod cutting device is taken as an example, and the wire cutting unit includes a plurality of cutting wheels and transition wheels. The carrier for carrying the plurality of cutting wheels and transition wheels, such as the wire-cutting support 430 shown in fig. 5, the distance adjusting mechanism can be used to drive the wire-cutting support 430 to move along the perpendicular direction of the wheel surface of the cutting wheel as a whole, and the transition wheels and the cutting wheels jointly follow the wire-cutting support to move along the perpendicular direction of the wheel surface of the cutting wheel (i.e., the second direction), in this state, the plurality of cutting wheels and the transition wheels are relatively static, i.e., the positional relationship between the transition wheels and the cutting wheels is unchanged. At this time, the distance adjusting mechanism is used for adjusting the cutting position of the at least one wire cutting saw in the at least one wire cutting unit relative to the silicon rod.

In some implementations, each cutting wheel has at least two cutting line slots, different cutting line slots being parallel to each other and having a cutting offset between them in the direction of the perpendicular to the wheel face of the cutting wheel. When the distance adjusting mechanism is used for driving the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the position of the cutting wire wound on the wire grooves on the cutting wheels can be changed. In one implementation, the plurality of cutting wheels in the wire cutting unit may be attached to a carriage, for example, wherein the carriage is movably disposed on the wire cutting support and driven by the pitch adjustment mechanism to move in a direction perpendicular to the wheel faces of the cutting wheels.

When the at least one distance adjusting mechanism is used for changing the cutting line to wind around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in an actual scene, the cutting line grooves corresponding to the cutting lines before and after groove changing can be predetermined, for example, the position of the cutting line before groove changing is the cutting line groove a1, the cutting line after groove changing is wound around the cutting line groove a2, the displacement of the plurality of cutting wheels in the at least one distance adjusting mechanism driving line cutting unit to move is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set as the cutting offset between the cutting line groove a1 and the cutting line groove a2, and therefore, the distance adjusting mechanism can be used for changing the cutting line from the cutting line groove a1 to the cutting line groove a 2; it should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit are moved along the perpendicular direction of the wheel surfaces of the cutting wheels by the at least one distance adjusting mechanism is the direction in which the cutting wire groove a2 points to the cutting wire groove a1, and the cutting position of the cutting wire saw in space is unchanged after the groove is changed, so that the silicon rod can be cut according to the preset cutting amount without the step of further calibrating the positions of the cutting wheels or other components, and the groove changing process is simplified.

To further illustrate the implementation manner of the at least one distance adjusting mechanism for moving the plurality of cutting wheels in the linear cutting unit relative to the cutting frame along the direction perpendicular to the wheel surfaces of the cutting wheels, the following embodiments are provided in the present application. When the number of the wire cutting units in the silicon rod cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed correspondingly.

In an embodiment, the wire silicon rod cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit; and the driving source is used for driving the screw rod to rotate.

The single-wire cutting unit is a wire cutting unit, and the single-wire cutting unit in the silicon rod cutting device comprises a plurality of cutting wheels, and the cutting wire is wound on the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjusting mechanism is provided with a far end and a near end, in a specific implementation mode, for example, the near end of the screw rod can be connected to a driving source and driven by the driving source to rotate, the far end of the screw rod is connected to the single-wire cutting unit through threads, the screw rod can rotate based on the transmission of the driving source and converts the rotation of the screw rod into axial lead displacement through threaded connection by virtue of the connection mode of the two ends of the screw rod, and the axial displacement direction is the arrangement direction of the screw rod, namely the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by driving the screw rod to rotate by the driving source in the distance adjusting mechanism, and the cutting wheel of the single-wire cutting unit can move forwards or backwards in the orthogonal direction of the wheel surface of the cutting wheel by driving the screw rod to rotate in different rotating directions.

In another embodiment, the wire silicon rod cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the extensible member can set up to body of rod structure and body of rod extending direction be the orthogonal direction of cutting wheel face promptly, the extensible member can be followed its extending direction concertina movement under the drive of driving source, extensible member one end can be connected to the driving source, the telescopic free end is associated the single line cutting unit, can drive under the driving source effect the cutting wheel of single line cutting unit removes in the orthogonal direction of cutting wheel face. The extensible member is for example electric telescopic handle, if the connecting rod for being connected to the cylinder taper rod again, the driving source can be regarded as to the cylinder, and this application does not do the restriction. The telescopic rod can be associated to the single-wire cutting unit in a linear connection or in an indirect connection, for example, can be directly connected to the wire cutting support or cutting wheel support of the single-wire cutting unit, or can be indirectly connected to the single-wire cutting unit through the support or the bearing. It should be understood that the expansion or contraction of the telescopic member may correspond to the advance or retraction of the single-wire cutting unit in the direction orthogonal to the wheel face of the cutting wheel.

Here, in the embodiments provided in the present application, the association may be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above embodiments, the telescopic rod may associate the wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation of the association is not limited thereto, but is intended to realize a transmission in the second direction.

In a further embodiment, the wire silicon rod cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving gear rotates under the driving of the driving source, the rack meshed with the driving gear correspondingly moves along the step direction of the rack, in this example, the rack is matched with the driving gear, the rotating motion driven by the driving source can be converted into linear conveying along the direction of the rack, the rack is arranged on the single-wire cutting unit along the orthogonal direction of the wheel surface of the cutting wheel, and the cutting wheel of the single-wire cutting unit can be driven to move along the orthogonal direction of the wheel surface of the cutting wheel. Meanwhile, the rotating direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the wheel surfaces of the cutting wheels.

In one embodiment, the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit which are arranged in parallel and opposite to each other, wherein at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move along the orthogonal direction of the wheel surface of the cutting wheel, and the distance between the at least one cutting wire saw in the first wire cutting unit and the at least one cutting wire saw in the second wire cutting unit is adjusted or the cutting wire is changed to wind around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

The at least one distance adjusting mechanism can be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit so as to drive the plurality of cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit to move along the orthogonal direction of the wheel surfaces of the cutting wheels.

In one embodiment, the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate. The manner in which the lead screw and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the wheel surface of the cutting wheel is similar to that in the foregoing embodiment, and the first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism may be regarded as a single wire cutting unit, which is not described herein again. It should be understood that the arrangement of the distance adjusting mechanism on any one wire-cutting unit can realize the increase and decrease of the distance between the parallel cutting wire saws formed between the first wire-cutting unit and the second wire-cutting unit, and the silicon rod can be cut into different specifications by the wire-silicon rod cutting device.

In another embodiment, the pitch adjustment mechanism comprises: a telescopic member disposed in an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second cutting unit provided with the distance adjusting mechanism may be regarded as a single-wire cutting unit, and specific implementation manners may refer to the foregoing embodiments, and details are not described here.

In yet another embodiment, the pitch adjustment mechanism comprises: a rack bar along an orthogonal direction of a cutting wheel face and associated with the first wire cutting unit or the second wire cutting unit; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving source can control the rack to linearly move along the direction of the rack through the transmission gear and the rack which are meshed with each other, and the first linear cutting unit or the second linear cutting unit which is related to the rack can drive the plurality of cutting wheels to move along the orthogonal direction of the wheel surfaces of the cutting wheels through the rack.

In one embodiment, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit and the second wire cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel. In one embodiment, the bidirectional screw is a double-threaded screw, the two ends of the bidirectional screw are respectively provided with threads with opposite thread directions, the driving source can be arranged at any one end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft, and by means of the threads with opposite thread directions at the two ends of the bidirectional screw, when the bidirectional screw is driven to rotate by the driving source, the motion at the two ends of the bidirectional screw is converted into axial linear motion with opposite directions, wherein the axial direction is the orthogonal direction of the wheel face of the cutting wheel of the bidirectional screw. Under the drive of the driving source, the cutting wheels respectively corresponding to the first wire cutting unit and the second wire cutting unit can move in the opposite direction or move in the opposite direction.

In some embodiments, the pitch mechanism is a servo motor provided to the at least one wire cutting unit. In an actual scene, a servo motor is arranged on at least one linear cutting unit or each linear cutting unit of the linear silicon rod cutting device, and the servo motor controls the displacement of the corresponding linear cutting unit in the orthogonal direction of the wheel surface of the cutting wheel. The linear cutting unit can predetermine the cutting offset of the groove or the adjustment quantity of the cutting position of the cutting line transformation, and the plurality of cutting wheels in the linear cutting unit are driven to move along the orthogonal direction of the wheel surfaces of the cutting wheels by the accurate positioning function of the servo motor with the preset displacement. For example, a single-wire cutting unit is arranged in the linear silicon rod cutting device, and a servo motor is arranged on the single-wire cutting unit to drive the single-wire cutting unit to move along the orthogonal direction of the wheel surface of the cutting wheel; for another example, the linear silicon rod cutting device is provided with a first linear cutting unit and a second linear cutting unit, and the first linear cutting unit or/and the second linear cutting unit is driven by a corresponding servo motor to relatively independently move along the orthogonal direction of the wheel surface of the cutting wheel. In some examples, the servo motor may be replaced by a traveling motor and a traveling screw, and it should be understood that the distance adjusting mechanism is a driving device for driving a plurality of cutting wheels in the cutting unit to move relative to the cutting frame, and the specific form thereof is not limited in this application.

In an embodiment of the present application, the cutting switching mechanism is configured to drive the cutting frame and at least one wire cutting unit thereon to switch between a first transfer path and a second transfer path.

In an embodiment of the present application, the silicon rod processing platform is provided with a first processing location and a second processing location along a first direction in sequence, and the first processing location and the second processing location cross the width dimension of the silicon rod processing platform in a second direction. The first transfer device and the second transfer device are arranged in parallel along a first direction, wherein a first transfer channel in the first transfer device penetrates through the first processing area and the second processing area along the first direction, and a second transfer channel in the second transfer device penetrates through the first processing area and the second processing area along the first direction. In an embodiment of the present application, the silicon rod cutting device is provided with a cutting conversion mechanism by which the cutting frame and at least one wire cut unit thereon may be driven to move in the second direction to be converted between the first transfer passage and the second transfer passage, for example, by which the cutting conversion mechanism may be driven to move in the second direction to be converted from the first transfer passage to the second transfer passage, or may be driven to move in the second direction to be converted from the second transfer passage to the first transfer passage.

In one embodiment, the cut conversion mechanism comprises: a cutting conversion guide rail and a cutting conversion driving unit.

The cutting conversion guide rail is arranged along the second direction and used for arranging the cutting frame. In certain embodiments, the cutting transition rail is arranged on the silicon rod processing platform in the second direction, and the cutting frame is mounted on the cutting transition rail by means of, for example, a slide block.

And the cutting conversion driving unit is used for driving the cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail.

In some embodiments, the cutting transition drive unit comprises: a movable rack, a driving gear and a driving source. The movable rack is arranged along a second direction and is parallel to the cutting conversion guide rail. The movable rack is fixed on the silicon rod processing platform, is set to be the same as the cutting conversion guide rail in a second direction, and is parallel to and adjacent to the cutting conversion guide rail.

The driving gear is arranged on the cutting frame, is meshed with the movable rack and is used for driving the cutting frame to move along the cutting conversion guide rail. The drive source is used for driving the drive gear. In an implementation of the present application, the driving gear is disposed on the cutting frame, the driving gear is driven by the driving source to rotate, the gear teeth of the driving gear and the moving rack are engaged to conform to the moving rack, and the cutting frame connected with the driving gear and at least one cutting unit thereon generate corresponding movement on the cutting conversion guide rail.

In some embodiments, the cutting-conversion driving unit may be disposed on the cutting frame, and include a moving screw rod disposed in the second direction and associated with the cutting frame, and a driving source for driving the moving screw rod to rotate to move the associated cutting frame and at least one cutting unit thereon along the cutting-conversion guide rail.

The silicon rod cutting and grinding all-in-one machine can further comprise a flaw-piece discharging device, and the flaw-piece discharging device is used for discharging flaw-pieces formed by cutting operation on the silicon rods through the silicon rod cutting device.

The flaw-piece discharging device can comprise a flaw-piece supporting mechanism used for supporting the outer side of the silicon rod and supporting and cutting the flaw-piece.

It should be understood that whether the first transfer device or the second transfer device, the silicon rod held by the first silicon rod holder in the first transfer device or the second silicon rod holder in the second transfer device is horizontal, i.e. the axis of the silicon rod coincides with the first direction. Therefore, the flaw-piece formed by cutting the silicon rod by using the silicon rod cutting device is also horizontal, and the flaw-piece unloading mechanism supports the flaw-piece to assist in unloading the flaw-piece.

The flaw-piece supporting mechanism comprises: a bearing part; and the driving unit is connected with the bearing part to control the bearing part to be far away from or abut against the flaw-piece.

In some examples, the silicon rod cutting device in the silicon rod cutting and grinding integrated machine can convert the cutting position during the silicon rod processing process, for example, a first processing position and a second processing position are arranged on the silicon rod processing platform, the silicon rod cutting device is arranged on the machine base by a cutting conversion mechanism, and the position can be converted between the first processing position and the second processing position under the driving of the cutting conversion mechanism. In this arrangement, the edge bearing means can be provided, for example, by a mounting portion on the silicon rod cutting device, so that the edge bearing means remains relatively stationary relative to the cutting assembly when the silicon rod cutting device is switched into the processing position. In some examples, the mounting portion is detachably connected to the cutting frame, and the mounting portion may be provided at different positions on the silicon rod cutting device based on the need for the silicon rod supporting position.

The position of the flaw-piece supporting mechanism on the silicon rod cutting device can be determined based on the specific structure of the line cutting unit in the silicon rod cutting device. Fig. 5 is a schematic structural view of a silicon rod cutting device in the silicon rod cutting and grinding integrated machine according to an embodiment. As shown in fig. 5, the silicon rod cutting apparatus includes a cutting frame 41 and a wire cutting unit 43, wherein the wire cutting unit 43 is disposed on the cutting frame 41 by a wire cutting support 430. Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the wire cutting support 430 may be in the form of a beam, a plate frame, a bracket, or the like. In this case, the flaw-piece supporting mechanism may be provided to the wire cutting support 430 by the mounting portion.

In other examples, for example, when the position of the silicon rod cutting device in the first direction is kept unchanged, the flaw-piece supporting mechanism may be disposed on the base through the mounting portion, for example, the mounting portion is a supporting pillar or a bracket, and is configured to support the flaw-piece supporting mechanism so that the supporting portion of the flaw-piece supporting mechanism can support the flaw-piece under the driving of the driving unit.

The flaw-piece supporting mechanism comprises a supporting part, the supporting part is used for contacting and abutting against the silicon rod to realize a supporting effect on the flaw-piece, it should be noted that in each embodiment of the application, the supporting effect is to apply a force to the flaw-piece to maintain the flaw-piece in a stable state, and taking the cutting wire saw as an example when being arranged in a horizontal line direction (i.e. a second direction), the flaw-piece formed by cutting is positioned at the upper side, the lower side or the upper side and the lower side of the silicon rod, at this time, the supporting part can provide a supporting force for the flaw-piece at the lower side of the silicon rod to prevent the flaw-piece from being broken, so that the flaw-piece can be maintained in a stable state; and when the cutting wire saw is arranged in the direction of the plumb line, the cutting edge skin is positioned at the side (left side, right side or left side and right side) of the silicon rod, the supporting part can be arranged into a structure matched with the cambered surface at the outer side of the silicon rod so as to provide supporting force for the edge skin, or the supporting part is abutted against the edge skin so as to enable the edge skin to be subjected to friction force and maintain a stable state. In the example shown in fig. 5, the silicon rod cutting device includes two wire cutting units 43 arranged oppositely in the second direction, each wire cutting unit 43 has a cutting wire 439, and the cutting wire 439 can be arranged in the direction of the plumb line, so that the two cutting wires 439 belonging to the two wire cutting units 43 are arranged in the direction of the plumb line. The edges formed by cutting are positioned at the left side and the right side of the silicon rod, and the supporting part can be arranged into a structure matched with the cambered surface of the outer side of the silicon rod so as to provide supporting force for the edges, or the supporting part is abutted against the edges so as to enable the edges to be subjected to friction force to maintain a stable state.

The driving unit is used for driving the bearing part to be far away from or abut against the flaw-piece. The direction away from or against the flaw-piece may be a plurality of directions, for example, the direction against the flaw-piece is a state in which the supporting portion moves from a state of being away from the flaw-piece to a state of contacting the flaw-piece under the driving of the driving unit, and the specific moving direction of the supporting portion is not limited in this application.

In one implementation, the driving unit includes: a cylinder or hydraulic pump; the telescopic part is connected with the bearing part and is driven by the cylinder or the hydraulic pump to do telescopic motion so as to control the bearing part to be far away from or abut against the flaw-piece.

The telescopic part can be driven by an air cylinder or a hydraulic pump to perform telescopic motion, the telescopic part is connected with the bearing part, and the telescopic direction of the telescopic part is, for example, the direction far away from or close to the axis of the silicon rod, so that the connected bearing part is driven to be far away from or abut against the flaw-piece.

In yet another implementation, the drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The screw rod assembly can be in threaded connection with the bearing part at one end, the driving motor drives the screw rod to rotate so that the bearing part moves along the direction of the screw rod, and the driving motor controls the screw rod to rotate, so that the bearing part can be controlled to be close to or far away from the flaw-piece.

The supporting part can be set to be different structures to realize the supporting function, for example, the supporting part can be a supporting plate and is provided with an arc surface used for contacting the flaw-piece, or the supporting part is a supporting plate provided with a folded edge to prevent the flaw-piece from rolling, for example, the section of the supporting plate is in a trapezoidal groove structure (the groove opening is the lower bottom of the trapezoid); it should be understood that there are a variety of implementations of a bearing that can be used to achieve a flaw piece bearing, and that this application is not intended to be limiting.

For the realization with the stable bearing of the flaw-piece that the cutting formed in order to prevent the flaw-piece fracture, or for simplifying the flaw-piece and unload the transportation, this application still provides following implementation:

in one embodiment, the supporting part comprises at least two supporting blocks which are arranged at intervals along the first direction and are provided with a supporting surface used for contacting and supporting the flaw-piece. The bearing surface of the bearing block can be provided with a cambered surface to adapt to the supported flaw-piece, or can be provided with contact planes with different levelness to prevent the flaw-piece from rolling. Wherein, in some implementations, one said drive unit may be configured for each holding block.

It should be understood that in some processing scenarios, the supporting of the flaw-piece can be realized by one supporting block; here, this application still provides the embodiment of realizing the flaw-piece bearing through two at least bearing blocks that set up along the first direction interval, through setting up can realize the bearing to the flaw-piece that the silicon rod cutting of different length specifications formed between two at least bearing blocks along the interval or the span of first direction, and simultaneously, the bearing piece that sets up by the interval carries out the bearing to the flaw-piece and can makes the flaw-piece receive the effort of supporting portion in different length direction (be first direction), is favorable to preventing that the cutting coping saw from not running through the silicon rod in front of the skin fracture. After the cutting wire saw penetrates through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used for supporting the edge skin to prevent the edge skin from inclining to fall.

In some embodiments, the supporting portion of the flaw-piece discharging mechanism is a supporting wheel set, wherein the supporting wheel set may be at least two, at least two of the supporting wheel sets are disposed along an interval or a span of the first direction, and each of the supporting wheel sets includes: the at least two supporting wheels are arranged at intervals along the second direction and are used for contacting to support the flaw-piece; the bearing base is connected with the driving unit and used for arranging the at least two bearing wheels to drive the at least two bearing wheels to be far away from or abut against the flaw-piece.

In another embodiment, the flaw-piece supporting mechanism comprises at least two supporting parts, and the at least two supporting parts are arranged on the silicon rod cutting device or the machine base at intervals along a first direction. The supporting part is a supporting wheel set, the supporting wheel set comprises at least two supporting wheels, the supporting wheels are arranged at intervals along the second direction, and therefore the center of gravity of the supported flaw-piece can be located between the at least two supporting wheels in the second direction. The supporting wheel is used for contacting and supporting the flaw-piece, and the tangential direction of the supporting wheel contacting with the silicon rod flaw-piece is along the first direction.

In some implementations, the support wheel is rollable along a support wheel axis, the support wheel axis being disposed in the second direction. Under this setting, when the cutting coping saw runs through the silicon rod and forms independent flaw-piece, when will carrying out follow-up the transportation with the flaw-piece, when the flaw-piece is along first direction and bearing wheelset relative movement, be rolling friction between flaw-piece and the bearing wheel, then be convenient for realize following-up the transport to the flaw-piece along first direction.

The flaw-piece supporting mechanism further comprises a driving unit, the driving unit is used for driving the bearing wheel set to move so as to be far away from or abut against the flaw-piece, in an implementation mode, when the cutting wire saw of the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine is arranged in the second direction, the driving unit drives the bearing wheel set to move along the direction of the plumb line so as to abut against and bear the flaw-piece in the cutting process. The driving unit is, for example, an air cylinder or a driving motor, and the air cylinder or the driving motor is connected to the bearing base of the bearing wheel set to drive the bearing wheel set to move up and down integrally along the direction of the plumb line.

In yet another embodiment, the bearing portion includes: at least two supporting rods arranged along the first direction and used for contacting and supporting the flaw-piece; the two connecting parts are respectively arranged at two opposite ends of the bearing rods along the first direction and are used for connecting the at least two bearing rods and the driving unit.

Please refer to fig. 5 and 6, which are partial schematic structural views of the edge supporting mechanism of the present application in one embodiment. As shown in the figure, the supporting portion 611 includes two supporting rods 6111 arranged at intervals along the second direction, and the rod body of the supporting rod 6111 is along the first direction.

Here, the at least two support rods 6111 can support the flaw-piece, and it should be understood that the flaw-piece can be supported by positioning the center of gravity of the flaw-piece formed by cutting between the at least two support rods 6111; meanwhile, any one of the support rods 6111 is in line contact with the supporting flaw-piece, and under the arrangement, the friction force of the contact between the support part 611 and the flaw-piece can be reduced.

The connecting portions 6113 are respectively arranged on two sides of the supporting rod 6111, so that the supporting rod 6111 is stressed symmetrically when the supporting portion 611 is stressed far away from or close to the silicon rod, and the structural stability of the supporting portion is improved. In the embodiment shown in fig. 5 and 6, the connecting portion 6113 is respectively connected to the supporting rod 6111 and the driving unit, wherein the driving unit 613 is connected to the wire cutting support 430 or the cutting frame 41 through the mounting portion, and the free end of the telescopic motion is connected to the connecting portion 6113 to drive the supporting portion 611 to move along the telescopic direction driven by the driving unit 613 as a whole. In the example shown in fig. 5 and 6, the driving unit 613 is a cylinder having a telescopic portion, and the telescopic portion of the cylinder 613 is connected to the connecting portion 6113.

In the example shown in fig. 5 and 6, the bearing 611 is controlled to move in a second direction to move away from or closer to the rimmed skin. It should be understood that when the direction of the cutting wire saw is different in the silicon rod cutting device, or when the structure of the supporting part is different, the driving unit in the corresponding flaw-piece supporting mechanism can be arranged in different directions to meet the need of supporting the flaw-pieces. For example, when the cutting wire saw in the silicon rod cutting device is oriented in the direction of the plumb line, the driving unit may be configured such that the direction of the telescopic movement thereof is a second direction, so that the holder portion is moved in the second direction to be close to or away from the flaw-piece. For example, when the cutting wire saw in the silicon rod cutting device is in the second direction, the driving unit may be set such that the direction of the telescopic movement thereof is the third direction (i.e., the plumb line direction) to move the susceptor in the third direction to be close to or away from the flaw-piece. It is right the direction of the controlled motion of bearing portion, this application does not do the restriction, only as the order bearing portion realizes can to the bearing effect of flaw-piece.

The number of the supporting parts can be set corresponding to the requirement of supporting the flaw-piece, for example, when the silicon rod cutting device comprises a cutting wire saw, a flaw-piece is correspondingly formed in one cutting operation, and the silicon rod cutting device can be provided with a supporting part to support the flaw-piece; for another example, when the silicon rod cutting device includes two parallel cutting wire saws, two fillets are correspondingly formed in one cutting operation, and two supporting portions may be disposed on the silicon rod cutting device to respectively support the fillets on two sides of the silicon rod.

In some embodiments, the flaw-piece discharging device further comprises a flaw-piece dislocation mechanism arranged on the base or the silicon rod cutting device and used for pushing the flaw-piece along a first direction to separate the flaw-piece from the flaw-piece supporting mechanism.

In certain embodiments, the flaw-piece aligning mechanism is disposed on the base or the silicon rod cutting device at a predetermined interval in a first direction with respect to the cutting wire saw, wherein the first direction is parallel to the axis of the silicon rod. It should be understood that a separate skin can be formed from the silicon rod as the cutting wire saw penetrates the silicon rod, and at this time, a position of an end face of the skin supported by the support portion in the first direction is aligned with the cutting wire saw, and the distance between the skin displacing mechanism and the cutting wire saw in the first direction is determined, i.e., the distance by which the skin is pushed can be determined by the displacement amount of the skin displacing mechanism moving in the first direction.

The flaw-piece dislocation mechanism can be arranged on the base or the silicon rod cutting device, and can be determined based on the silicon rod cutting and grinding all-in-one machine in a specific scene. For example, the position of the silicon rod cutting device in the first direction is not changed in the silicon rod processing process, and the flaw-piece dislocation mechanism can be arranged on any one of the base or the silicon rod cutting device; when the position of the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine in the first direction is not constant in different processing states or cutting processes, for example, the silicon rod cutting device moves along the first direction to realize feeding and cutting of the silicon rod, the flaw-piece dislocation mechanism can be arranged on the silicon rod cutting device.

It should understand ground, treat that cutting silicon rod axis direction is along first direction, and the flaw-piece that forms in the cutting is also followed first direction under by the bearing state, flaw-piece dislocation mechanism can be followed first direction and promoted the flaw-piece so that the relative flaw-piece supporting mechanism motion of flaw-piece to make the flaw-piece break away from flaw-piece supporting mechanism and can carry out subsequent transportation procedure to the flaw-piece.

In some embodiments, the flaw-piece dislocation mechanism comprises: a power source; the telescopic rod is arranged along the first direction and used for telescopic motion under the driving of a power source to push the edge leather.

In one implementation, the power source of the flaw-piece dislocation mechanism is an air cylinder or a hydraulic pump, wherein a telescopic rod of the air cylinder or the hydraulic pump is arranged along a first direction. For example, in the embodiment shown in fig. 5 or 6, two parallel linear cutting units are arranged in the silicon rod cutting device, the flaw-piece discharging device includes two flaw-piece dislocation mechanisms respectively arranged on the left linear cutting unit and the right linear cutting unit of the cutting frame, the flaw-piece dislocation mechanism is an air cylinder with a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the end face of the flaw-piece. After the cutting wire saw runs through the silicon rod to form independent flaw-piece, move along the first direction through the flaw-piece dislocation mechanism and lean on to the flaw-piece terminal surface and promote the flaw-piece motion, the flaw-piece can break away from flaw-piece supporting mechanism or break away from the silicon rod after the cutting from this. The telescopic range of the telescopic rod of the flaw-piece dislocation mechanism can be determined based on the length specification of the silicon rod or the span of the supporting part in the first direction in the flaw-piece supporting mechanism so as to control the stroke of the flaw-piece pushed in the first direction to ensure that the flaw-piece can be separated.

Of course, it should be understood that the specific structure and position of the edge skin malposition mechanism are not limited to the embodiments shown in fig. 5 and 6, for example, in some examples, the edge skin malposition mechanism may also be disposed on the base of the silicon rod slicing and grinding machine. Meanwhile, the flaw-piece dislocation mechanism can be applied to different types of bearing parts, generally, the flaw-piece dislocation mechanism can push the flaw-piece along the first direction to make the flaw-piece separate from the bearing part, and the specific form of the bearing part is not necessarily limited by the embodiments shown in fig. 5 and 6.

In certain embodiments, the flaw-piece discharge apparatus further comprises a flaw-piece conveying mechanism for receiving the flaw-pieces formed by cutting and transporting the flaw-pieces to a discharge area. Here, the discharge zone is the flaw-piece discharge zone.

In one embodiment, the position of the edge skin conveying mechanism in the second direction can be arranged to be aligned with the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine, so that the edge skin formed by cutting the silicon rod can be conveyed by the corresponding edge skin conveying mechanism, thereby reducing the transportation of the edge skin.

The direction and the position of the edge leather conveying mechanism can be determined by the position relation between the cutting area and the edge leather discharging area.

In one embodiment, the edge skin unloading area and the cutting area are arranged adjacent to each other in a first direction, and the edge skin conveying structure can be arranged in the first direction and butt-jointed with the silicon rod cutting device, so that after the silicon rod is cut to form an edge skin, the edge skin is pushed in the first direction to be separated from the cut silicon rod or the edge skin supporting mechanism and then transferred to the edge skin conveying structure, and therefore the transfer path of the edge skin can be simplified. The number of the flaw-piece conveying mechanisms can also be determined according to the number, structure or working mode of the silicon rod cutting devices in the silicon rod cutting and grinding all-in-one machine, for example, when different processing positions are arranged in the silicon rod cutting and grinding all-in-one machine, wherein silicon rod cutting devices are arranged on a plurality of the processing positions, and the flaw-piece conveying mechanisms can be correspondingly arranged on the plurality of the processing positions to correspond to the silicon rod cutting devices; for another example, when the silicon rod cutting device can perform cutting on a plurality of silicon rods simultaneously, the number of the edge skin conveying mechanisms is multiple, so that each edge skin conveying mechanism corresponds to one silicon rod.

In certain embodiments, the flaw-piece conveying mechanism is a chain conveying mechanism, a double speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the flaw-piece delivery mechanism comprises: the conveying part is used for bearing the flaw-piece; and the conveying driving source is used for driving the conveying part to move so as to convey the flaw-piece.

The conveying part can be arranged along a first direction and is driven by the conveying driving source to convey the carried edge leather along the first direction. The direction of movement of the transport section may be arranged in a direction towards the pelt discharge area for transporting the loaded pelt to the pelt discharge area.

The conveying driving source is, for example, a motor for driving the conveying portion to move and controlling the conveying speed of the conveying portion.

In some examples, in order to avoid the flaw-piece from being worn by collision during transportation, in some embodiments, the transportation part is provided with a buffer pad for contacting with the flaw-piece, or the transportation part is made of a buffer material. The cushion or cushioning material is, for example, rubber, silicone or other material having elastic deformation, damping or cushioning properties. Therefore, the damage risk of conveying the flaw-piece is reduced, and the flaw-piece reusing is facilitated.

The application provides an embodiment with a flaw-piece discharging device in a silicon rod cutting and grinding all-in-one machine, the flaw-piece discharging device comprises a flaw-piece supporting mechanism, a supporting part is driven by a driving source to abut against a flaw-piece so as to support the flaw-piece, the flaw-piece supporting mechanism can avoid edge breakage of the flaw-piece by the supporting effect of the supporting part of the flaw-piece supporting mechanism in the process of cutting the horizontal silicon rod in an opening manner, meanwhile, the supporting part can be used for supporting the flaw-piece so as to prevent the flaw-piece from falling, and therefore, a complete flaw-piece can be formed to assist in realizing a subsequent flaw-piece transferring process; in some examples, the flaw-piece discharging device is further provided with a flaw-piece dislocation mechanism which can be used for pushing the flaw-piece along the first direction to enable the flaw-piece to be separated from the supporting part, and the flaw-piece separated from the supporting part can be transferred to the discharging area through the flaw-piece conveying mechanism, so that the flaw-piece can be discharged and subsequently transferred.

The silicon rod cutting and grinding all-in-one machine in the embodiment of the application further comprises a silicon rod grinding device, wherein the silicon rod grinding device is arranged at a second processing position of the silicon rod processing platform and used for grinding the cut silicon rod clamped by the second transfer device on the first transfer channel or the cut silicon rod clamped by the first transfer device on the second transfer channel.

The silicon rod grinding device comprises at least one pair of grinding tools, the silicon rod is driven to move along a first direction through the first silicon rod clamp or the second silicon rod clamp, and therefore the silicon rod grinding device can be set to be in a fixed state when grinding operation is carried out, and relative feeding between the grinding tools and the silicon rod can be achieved.

In one embodiment, the silicon rod grinding apparatus includes a grinder mounting seat, at least one pair of grinders, a grinder advancing and retreating mechanism, and a grinder switching mechanism.

The grinding tool mounting seat is used for arranging at least one pair of grinding tools, and the specific structure of the grinding tool mounting seat can be set into different forms based on the arrangement requirement of the grinding tools, such as a beam body, a plate frame and the like.

In some embodiments, the at least one pair of grinding tools is mounted to the grinding tool mounting base, or the at least one pair of grinding tools is mounted to the grinding tool mounting base through a bracket, a connecting plate, or a mounting frame, and herein, the carrier for mounting the at least one pair of grinding tools may be in various forms, and the present application is not limited thereto.

The grinding tool advancing and retreating mechanism is used for driving at least one grinding tool in the at least one pair of grinding tools to move along the second direction so as to adjust the relative distance between two grinding tools in the at least one pair of grinding tools in the second direction, and further the feeding amount in the grinding process is controlled, namely the grinding amount is determined. According to the grinding requirement, one grinding tool or two grinding tools in at least one pair of grinding tools are driven to move for a preset distance along the second direction through a grinding tool advancing and retreating mechanism, the feeding amount is adjusted, and therefore, the silicon rod is driven to move along the first direction through the first silicon rod clamp or the second silicon rod clamp and is in contact with at least one pair of grinding tools of the silicon rod grinding device and is relatively fed, so that the silicon rod is ground.

The grinding tool switching mechanism is used for driving the grinding tool mounting seat and at least one pair of grinding tools on the grinding tool mounting seat to switch between the first transfer channel and the second transfer channel, so that the at least one pair of grinding tools can grind the silicon rod clamped by the first silicon rod clamp on the first transfer channel or grind the silicon rod clamped by the second silicon rod clamp on the second transfer channel.

Fig. 7 is a schematic structural view of a silicon rod grinding device in a silicon rod cutting and grinding integrated machine according to the present application. Referring to fig. 1 and 7, as shown in fig. 1 and 7, the silicon rod grinding apparatus 5 includes a grinder mounting seat 51, at least one pair of grinders 53, a grinder advancing and retreating mechanism, and a grinder switching mechanism.

The grinding tool mounting seat 51 is arranged on the second processing position of the silicon rod processing platform and is used for arranging at least one pair of grinding tools 53. In certain embodiments, the grinder mount 51 spans the width dimension of the silicon rod processing platform in the second direction.

The at least one pair of grinders 53 are provided on the grinder mount 51, and the at least one pair of grinders are present to be disposed oppositely in the second direction. In certain implementations, any of the grinders 53 can be mounted to the grinder mounting block 51 by a grinder mount.

In certain embodiments, any of the abrasive articles comprises a rotatable shaft and a grinding wheel. The grinding wheels have certain granularity and roughness, and the two grinding wheels which are oppositely arranged are respectively provided for two symmetrical grinding surfaces of the clamped silicon rod.

In an embodiment of the present application, any one of the at least one pair of grinding tools includes a rough grinding wheel and a finish grinding wheel nested with each other. For example, the rough grinding wheel is nested within the finish grinding wheel, or the finish grinding wheel is nested within the rough grinding wheel.

In certain embodiments, referring to fig. 8, a cross-sectional view of a grinding tool of a silicon rod grinding device in a silicon rod slicing and grinding machine of the present application is shown. As shown in fig. 8, the grinding tool 53 includes a tool head base 531, and a rough grinding wheel 533 and a finish grinding wheel 535 provided on the tool head base 531, wherein the rough grinding wheel 533 is nested inside the finish grinding wheel 535, the finish grinding wheel 535 is larger than the rough grinding wheel 533, the finish grinding wheel 535 is circular and hollow in the middle (i.e., circular ring structure), the rough grinding wheel 533 may be circular or the rough grinding wheel 533 may be circular and hollow in the middle (i.e., circular ring structure). Generally, whether the grinding wheel is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by consolidating abrasive particles and a binding agent, and a surface formed with an abrasive particle part is in contact with the surface of a silicon rod to be ground for rotation. The grinding wheel has certain abrasive grain size and abrasive grain density, and meanwhile, the grinding wheel is provided with air holes. The abrasive of the grinding wheel can be set into abrasive grains with hardness higher than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding the silicon rod. The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the rough grinding wheel is nested in the finish grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on the silicon rod by using the finish grinding wheel. Or when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel can be provided with a telescopic driving mechanism, when rough grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to contract and recess in the rough grinding wheel so as to carry out rough grinding operation on a silicon rod by using the rough grinding wheel, and when fine grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to extend out and protrude out of the rough grinding wheel so as to carry out fine grinding operation on the silicon rod by using the protruding fine grinding wheel.

In some embodiments, the finish grinding wheel is nested within the rough grinding wheel, the rough grinding wheel being larger than the finish grinding wheel, the rough grinding wheel being circular and hollow in the middle (i.e., an annular structure), the finish grinding wheel being either circular or hollow in the middle (i.e., an annular structure). Generally, whether the grinding wheel is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by consolidating abrasive particles and a binding agent, and a surface formed with an abrasive particle part is in contact with the surface of a silicon rod to be ground for rotation. The grinding wheel has certain abrasive grain size and abrasive grain density, and meanwhile, the grinding wheel is provided with air holes. The abrasive of the grinding wheel can be set into abrasive grains with hardness higher than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding the silicon rod. The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the finish grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on a silicon rod by using the finish grinding wheel. Or when the accurate grinding wheel is nested in the rough grinding wheel, the accurate grinding wheel can be provided with a telescopic driving mechanism, when the rough grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to contract and recess in the rough grinding wheel so as to utilize the rough grinding wheel to carry out the rough grinding operation on the silicon rod, and when the accurate grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to extend out and protrude out of the rough grinding wheel so as to utilize the protruding accurate grinding wheel to carry out the accurate grinding operation on the silicon rod.

The grinding tool advancing and retreating mechanism is used for driving at least one grinding tool in the at least one pair of grinding tools to move along a second direction. The grinding tool advancing and retreating mechanism controls at least one grinding tool in the at least one pair of grinding tools to move along the second direction so as to adjust the relative distance between the two grinding tools in the at least one pair of grinding tools in the second direction, and further, the feeding amount in the grinding process is controlled, namely, the grinding amount is determined.

For example, each pair of grinders is provided with a grindstone advancing and retreating mechanism. In one embodiment, the grinder advancing and retreating mechanism includes an advancing and retreating guide rail and an advancing and retreating driving unit. In the embodiment shown in fig. 1 and 3, the sharpener advancing and retreating mechanism comprises an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawings), wherein the advancing and retreating guide rail is arranged on the first mounting side of the sharpener mounting seat along the second direction, and the bottom of the sharpener is provided with a guide groove structure or a guide block structure which is matched with the advancing and retreating guide rail along the second direction. The advancing/retreating drive unit may further include, for example, a ball screw provided along the advancing/retreating guide rail, and a drive motor coupled to the ball screw in association with the corresponding grindstone.

In an embodiment of the present application, one of the at least one pair of grinders is provided with a ball screw disposed in the second direction and associated with the one of the grinders, and a drive motor. In this manner, the ball screw is driven by the driving motor to rotate in a forward direction so that the one grinder associated with the ball screw moves along the advance and retreat rail toward the other grinder disposed oppositely to reduce the grinding pitch between the two grinders (or adjust the feed amount of grinding), or the ball screw is driven by the driving motor to rotate in a reverse direction so that the one grinder associated with the ball screw moves along the advance and retreat rail away from the other grinder disposed oppositely to increase the grinding pitch between the two grinders.

In an embodiment of the present application, each grinder of the at least one pair of grinders is provided with a ball screw disposed in the second direction and associated with the grinder for each grinder, and a drive motor. In this manner, the ball screw is driven by the driving motor to rotate in a forward direction so that the one grinder associated with the ball screw moves along the advance and retreat rail toward the other grinder disposed oppositely to reduce the grinding pitch between the two grinders (or adjust the feed amount of grinding), or the ball screw is driven by the driving motor to rotate in a reverse direction so that the one grinder associated with the ball screw moves along the advance and retreat rail away from the other grinder disposed oppositely to increase the grinding pitch between the two grinders.

In an embodiment of the application, two grinding tools of the at least one pair of grinding tools share a ball screw and a driving motor, the ball screw may be, for example, a bidirectional screw, the bidirectional screw is disposed along the second direction, two threads with opposite turning directions are disposed on a shaft of the bidirectional screw, the two threads are respectively associated with the two grinding tools, and the driving motor is associated with the bidirectional screw, and the driving motor drives the bidirectional screw to rotate, so that the two grinding tools associated with the bidirectional screw move in opposite directions or back to back along the advance and retreat guide rails based on a certain synergistic relationship. For example, when the driving motor drives the bidirectional screw rod to rotate forward, the two associated grinding tools are driven to move towards each other along the plumb line (i.e., to approach each other), so as to reduce the grinding distance between the two grinding tools (or to adjust the feeding amount of grinding), or when the driving motor drives the screw rod to rotate reversely, the two associated grinding tools are driven to move back and forth along the plumb line (i.e., to move away from each other), so as to increase the grinding distance between the two grinding tools.

In one embodiment of the present application, the grinder switching mechanism is configured to drive the at least one pair of grinders to switch between the first transfer path and the second transfer path along the grinder mounting seat.

In an embodiment of the present application, the silicon rod processing platform is provided with a first processing location and a second processing location along a first direction in sequence, and the first processing location and the second processing location cross the width dimension of the silicon rod processing platform in a second direction. The first transfer device and the second transfer device are arranged in parallel along a first direction, wherein a first transfer channel in the first transfer device penetrates through the first processing area and the second processing area along the first direction, and a second transfer channel in the second transfer device penetrates through the first processing area and the second processing area along the first direction. In an embodiment of the present application, the silicon rod grinding apparatus includes a grinder mounting seat and at least one pair of grinders disposed on the grinder mounting seat, and the at least one pair of grinders may be driven to move in the second direction by the grinder switching mechanism to switch between the first transfer passage and the second transfer passage, for example, the at least one pair of grinders may be driven to move on the grinder mounting seat in the second direction by the grinding switching mechanism to switch from the first transfer passage to the second transfer passage, or the at least one pair of grinders may be driven to move on the grinder mounting seat in the second direction by the grinding switching mechanism to switch from the second transfer passage to the first transfer passage.

In one embodiment, the grinder transfer mechanism comprises: the grinding tool conversion guide rail and the grinding tool conversion driving unit.

The grinding tool conversion guide rail is arranged along the second direction and used for arranging the grinding tool. In certain embodiments, the abrasive tool transfer rail is disposed on the silicon rod processing platform along the second direction, and the at least one pair of abrasive tools is mounted on the abrasive tool transfer rail by, for example, a slide block or the like.

And the grinding tool conversion driving unit is used for driving the at least one pair of grinding tools to move along the grinding tool conversion guide rail.

In certain embodiments, the grinder conversion drive unit comprises: a movable rack, a driving gear and a driving source. The movable rack is arranged along a second direction and is parallel to the grinding tool conversion guide rail. The movable rack is fixed on the silicon rod processing platform, is set to be approximately the same as the grinding tool conversion guide rail in a first direction, and is parallel to and adjacent to the grinding tool conversion guide rail.

The driving gear is arranged on the grinding tool mounting seat, is meshed with the movable rack and is used for driving the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The drive source is used for driving the drive gear. In an implementation of the present application, the driving gear is disposed on the grinder mounting seat, the driving gear is driven to rotate by the driving source, the gear teeth of the driving gear are engaged with the moving rack to travel in compliance with the moving rack, and at least one pair of grinders connected with the driving gear generates corresponding movement on the grinder conversion guide rail.

In some embodiments, the grinder converting driving unit may be disposed on the grinder mounting base, and include a moving screw rod disposed in the second direction and associated with the at least one pair of grinders, and a driving source for driving the moving screw rod to rotate to move the associated at least one pair of grinders along a grinder converting rail.

As described above, the grinder advancing-retracting mechanism is configured to drive at least one of the at least one pair of grinders to move in the second direction, and the grinder switching mechanism is configured to drive the at least one pair of grinders to switch between the first transfer passage and the second transfer passage in the second direction, so that, in some embodiments, the grinder advancing-retracting mechanism and the grinder switching mechanism may be integrated into one, that is, a set of driving mechanisms may be used to perform the functions of the grinder advancing-retracting mechanism and the grinder switching mechanism.

When the silicon rod at the second processing position is ground by the grinding tool, the grinding tool in the at least one pair of grinding tools is driven by the grinding tool advancing and retracting mechanism of the grinding tool to move along the second direction so as to determine the grinding feed amount of the grinding tool and the grinding surface of the silicon rod, the at least one pair of grinding tools is driven by the grinding tool advancing mechanism to move along the horizontal line until the whole silicon rod is completely penetrated, if necessary, the at least one pair of grinding tools can be driven by the grinding tool advancing mechanism to reciprocate along the horizontal line so as to ensure that the silicon rod is fully ground in the length direction, and meanwhile, the at least one pair of grinding tools oppositely arranged is driven by the grinding tool advancing and retracting mechanism to move in the second direction so as to determine the grinding feed amount of the grinding tool and the grinding surface of the silicon rod. In the embodiment shown in fig. 1 and 3, at least one pair of the grinding tools are arranged oppositely along the second direction, and the grinding surfaces of the at least one pair of grinding tools are positioned in opposite vertical surfaces, wherein the vertical surfaces are perpendicular to the horizontal line, when the silicon rod (the cut silicon rod 102 shown in fig. 3) is ground, at least one grinding tool of the at least one pair of grinding tools is driven to move up and down along the second direction by the grinding tool advancing and retreating mechanism so as to adjust the feeding amount, so that the left side surface and the right side surface of the silicon rod along the second direction are ground.

In an embodiment of the present application, the silicon rod grinding device may be further used to perform chamfering operation on a silicon rod.

In certain embodiments, any one of the at least one pair of grinding tools comprises a rough grinding wheel and a finish grinding wheel nested one within the other, and the silicon rod can be chamfered using the finish grinding wheel.

In some embodiments, the silicon rod grinding apparatus further comprises a chamfering apparatus, and the chamfering apparatus further comprises at least one pair of a chamfering tool and a chamfering tool advancing and retreating mechanism. Each chamfer grinding tool of the at least one pair of chamfer grinding tools is adjacently arranged on the grinding tool, two chamfer grinding tools of the at least one pair of chamfer grinding tools are oppositely arranged on the grinding tool mounting seat, and the grinding surfaces of the at least one pair of chamfer grinding tools are positioned in opposite vertical surfaces, namely the grinding surfaces of the two chamfer grinding tools of the at least one pair of chamfer grinding tools are respectively positioned in a first vertical surface and a second vertical surface.

With respect to the chamfer grinder, in certain implementations, the chamfer grinder includes a chamfer grinding wheel and a rotating motor coupled to the chamfer grinding wheel. The chamfering grinding wheels have certain granularity and roughness, two chamfering grinding wheels oppositely arranged in the at least one pair of chamfering grinding tools are respectively provided for two symmetrical grinding surfaces of the clamped silicon rod, and in certain embodiments, the chamfering grinding wheels are circular. Since the chamfering tool is used to chamfer the edge of the silicon rod, the amount of grinding required for the edge of the silicon rod is small relative to the side surface of the silicon rod, and therefore, the size of the chamfering wheel serving as the chamfering tool can be set smaller than the size of the rough grinding wheel serving as the rough grinding tool (or the finish grinding wheel serving as the finish grinding tool). The chamfering grinding wheel is formed by consolidating abrasive particles and a binding agent, and the surface with the abrasive particle part is formed to be in contact rotation with the surface of the silicon rod to be ground. The chamfering grinding wheel has certain abrasive grain size and abrasive grain density, and meanwhile, the chamfering grinding wheel is provided with air holes. The grinding material of the chamfering grinding wheel can be set into abrasive particles with hardness larger than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding the silicon rod. The rotating motor is connected with the chamfering grinding wheel through a rotating shaft and is used for driving the chamfering grinding wheel to rotate at a preset rotating speed.

The chamfering tool advancing and retreating mechanism is used for driving at least one chamfering tool in the at least one pair of chamfering tools to move along a second direction. The chamfering tool advancing and retreating mechanism controls at least one chamfering tool in the at least one pair of chamfering tools to move along the second direction, so that the relative distance between the two chamfering tools in the at least one pair of chamfering tools in the second direction is adjusted, and the feeding amount in the grinding process is controlled to determine the grinding amount.

When the chamfering grinding tool is used for chamfering the silicon rod positioned at the second processing position, the chamfering grinding tool advancing and retreating mechanism of the chamfering grinding tool drives the chamfering grinding tool in at least one pair of chamfering grinding tools to move along the second direction so as to determine the feeding amount of the grinding of the chamfering grinding tool and the silicon rod edge, the first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move along the first direction until the whole silicon rod completely passes through the chamfering grinding tool, if necessary, the first silicon rod clamp or the second silicon rod clamp can drive the silicon rod to reciprocate along the first direction so as to ensure that the silicon rod is fully ground in the length direction, in addition, the clamping part rotating mechanism in the first silicon rod clamp or the second silicon rod clamp can drive the clamping part to rotate so as to drive the clamped silicon rod to rotate by a deflection angle, and the chamfering grinding tool advancing and retreating mechanism drives at least one pair of chamfering grinding tools oppositely arranged to move in the second direction, so as to determine the feeding amount of the grinding of the chamfering grinding tool and the silicon rod edge.

In an embodiment of the present application, at least one of the first and second silicon rod clamps may further be provided with a grinding repair device for grinding the corresponding grinding tool, i.e., grinding the rough grinding tool in the corresponding rough grinding device, grinding the finish grinding tool in the corresponding finish grinding device, or grinding the rough grinding tool in the corresponding rough grinding device and the finish grinding tool in the finish grinding device. By utilizing the grinding repair device, the grinding tool is ground and repaired, so that the grinding tool can achieve required precision after being used for grinding the silicon rod.

In one implementation, the grinding repair device includes an installation body and at least one grinding portion, the installation body may be disposed on a silicon rod clamp, and the at least one grinding portion is disposed on the installation body and configured to grind the corresponding at least one grinding tool. Referring to fig. 4, an installation body 56 of the grinding repair device is disposed on at least one clamping arm of a silicon rod clamp, for example, a first clamping arm 213 of a first silicon rod clamp 21 or a second clamping arm 313 of a second silicon rod clamp 31, and a grinding portion 58 is disposed on two opposite sides of the installation body 56. Taking the grinding repair device for grinding the finish grinding tools in the finish grinding device as an example, the finish grinding device comprises a pair of finish grinding tools, the pair of finish grinding tools which are oppositely arranged are moved to the outer side of the grinding part along the second direction, the silicon rod clamp is driven to move along the horizontal line so as to enable the two repair parts on the two sides of the mounting body to reciprocate along the first direction, and in this state, the pair of finish grinding tools in the finish grinding device can be oppositely close to (for example, along the second direction) the grinding part until the pair of finish grinding tools contacts the surface of the grinding part, so that grinding is realized.

The thinning may be, for example, an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In an embodiment of the application, the silicon rod grinding device further comprises a cooling device to cool the at least one pair of grinding tools, so that damage to a surface layer of the silicon rod during grinding is reduced, and grinding efficiency and service life of the grinding wheel are improved. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole. In some embodiments, the grinding wheel is provided with a shield around its circumference for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected with a cooling water source, the other end of the cooling water pipe is connected to the surface of the protective cover of the grinding wheel, the diversion groove is arranged on the protective cover and serves as a contact point of the protective cover and the cooling water pipe, and the diversion hole is formed in the cooling groove. The cooling water pumped by the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel and is guided to the contact surface of the grinding wheel and the ground silicon rod for cooling, and the cooling water in the diversion hole rotated by the grinding wheel enters the grinding wheel for sufficient cooling under the centrifugal action during grinding of the grinding wheel.

In an embodiment of the application, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transfer device, which is arranged in the loading location of the silicon rod processing platform and used for transferring a silicon rod to be processed to the first processing location of the silicon rod processing platform.

In the present application, the silicon rod transfer device may move a silicon rod to be processed from the loading location to the first processing location and may enable the silicon rod to complete a centering operation before a cutting operation is performed.

Please refer to fig. 9, which is an enlarged view of a portion a in fig. 1. The silicon rod cutting and grinding all-in-one machine comprises a silicon rod transfer device, and the silicon rod transfer device comprises: silicon rod bearing structure, centering adjustment mechanism, and feed drive mechanism.

The silicon rod bearing structure is used for bearing a silicon rod to be processed. In an embodiment of the present application, the silicon rod carrying arrangement is used for carrying a silicon rod to be processed. In the embodiment shown in fig. 9, the silicon rod carrying arrangement 71 comprises a carrying base and a first loading part and a second loading part arranged opposite to each other in a second direction, wherein the first loading part and the second loading part cooperate for carrying a silicon rod to be processed, and each of the first loading part and the second loading part may be provided with a plurality of rollers arranged in the first direction, such that a row of rollers on the first loading part and a row of rollers on the second loading part together serve to carry a silicon rod. In other embodiments, the silicon rod carrying structure may be a plate-shaped structure as a whole, such as a rectangular carrying plate, which may have a certain curvature or a recess, and a pillow strip may be disposed on the rectangular carrying plate, and the pillow strip may be made of a flexible material to protect the carried silicon rod, and the flexible material may be rubber, acrylic, plastic, or the like.

According to the silicon rod transfer device disclosed by the application, through the centering adjustment structure, the position of the silicon rod carried by the silicon rod carrying structure can be adjusted, so that the axis line of the silicon rod corresponds to the preset central line.

As mentioned above, the centering operation specifically refers to that the axis of the silicon rod is aligned with the clamping center line of the first or second silicon rod clamp, that is, the axis of the silicon rod coincides with the clamping center line of the first or second silicon rod clamp. In one implementation, the first and second silicon rod clamps are identical, such that the clamping center line of the first silicon rod clamp coincides with the clamping center line of the second silicon rod clamp in the direction of the plumb line. In another implementation, the first and second silicon rod clamps may be different, and the clamping center line of the first silicon rod clamp and the clamping center line of the second silicon rod clamp are not coincident in the direction of the plumb line.

In practical applications, taking the first silicon rod clamp as an example, the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp) may be predetermined, and the predetermined center line may be determined based on the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp), wherein the predetermined center line is the same as (i.e., is in height with) the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp) in the direction of the plumb line. Therefore, the centering adjustment mechanism for adjusting the position of the silicon rod to be processed such that the axis line thereof corresponds to the predetermined center line is for adjusting the position of the silicon rod to be processed in the direction of the plumb line such that the axis line thereof coincides with the predetermined center line in the direction of the plumb line.

Regarding the centering adjustment mechanism, in an embodiment of the present application, the centering adjustment mechanism includes a vertical lifting mechanism for driving the silicon rod carrying structure and the silicon rod carried thereby to perform a vertical lifting motion so that the axis of the silicon rod is aligned with the predetermined center line in the direction of the plumb line.

In some embodiments, the vertical lifting mechanism as the centering adjustment mechanism further comprises: the vertical lifting guide rail, the sliding block and the vertical lifting driving unit.

The vertical lifting driving unit is used for driving the silicon rod bearing structure to move up and down along the vertical lifting guide rail. In the above-mentioned vertical lifting drive unit, including driving motor and the lead screw subassembly by driving motor drive, driving motor can set up on mounting structure, and the lead screw subassembly is connected with driving motor and the bearing base among the silicon rod bearing structure. When the vertical lifting driving unit is used, the screw rod assembly in driving connection with the driving motor rotates forwards to drive the silicon rod bearing structure to ascend along the vertical lifting guide rail, or the screw rod assembly in driving connection with the driving motor rotates reversely to drive the silicon rod bearing structure to descend along the vertical lifting guide rail.

Of course, the vertical lifting driving unit may also be modified, for example, in an embodiment, the vertical lifting driving unit may also include a driving motor and a rack and pinion transmission assembly driven by the driving motor, wherein the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be disposed on the mounting structure, the lifting rack is disposed along the direction of the plumb line and connected to the bearing base of the silicon rod bearing structure, and the driving gear is engaged with the lifting rack and controlled by the driving motor. When the vertical lifting driving unit is used, the driving motor drives the driving gear to rotate in the forward direction, and then drives the lifting rack and the silicon rod bearing structure connected with the lifting rack to do lifting action along the vertical lifting guide rail, or the driving motor drives the driving gear to rotate in the reverse direction, and then drives the lifting rack and the silicon rod bearing structure connected with the lifting rack to do descending action along the vertical lifting guide rail.

In some embodiments, the vertical lift mechanism comprises: a vertical lifting guide rod and a vertical lifting driving unit.

The vertical lifting guide rod can be arranged on the bearing base of the silicon rod bearing structure along the direction of the plumb line, for example, the silicon rod transferring device further comprises an installation structure, and the vertical lifting guide rod is arranged on the installation structure and penetrates through the bearing base of the silicon rod bearing structure. In order to ensure the stability of the silicon rod loading and supporting structure capable of performing lifting movement along the vertical lifting guide rods, the number of the vertical lifting guide rods may be plural, for example, four vertical lifting guide rods may be provided, which correspond to four corners of the supporting base in the silicon rod supporting structure. Of course, the vertical lifting guide rods may be in other numbers, for example, three, five, six, or more, taking three as an example, three vertical lifting guide rods may be arranged in an isosceles triangle manner, taking five as an example, five vertical lifting guide rods may be additionally provided in the central region on the basis of the layout of the four vertical lifting guide rods, and the like.

The vertical lifting driving unit is used for driving the silicon rod bearing structure to move up and down along the vertical lifting guide rod. In the above-mentioned vertical lifting drive unit, including driving motor and the lead screw subassembly by driving motor drive, driving motor can set up on mounting structure, and the lead screw subassembly is connected with driving motor and the bearing base among the silicon rod bearing structure. When the vertical lifting driving unit is used, the driving motor drives the connected screw rod assembly to rotate positively, so that the silicon rod bearing structure is driven to move upwards along the vertical lifting guide rod, or the driving motor drives the connected screw rod assembly to rotate reversely, so that the silicon rod bearing structure is driven to move downwards along the vertical lifting guide rod.

Of course, the vertical lifting driving unit may also be modified, for example, in an embodiment, the vertical lifting driving unit may also include a driving motor and a rack and pinion transmission assembly driven by the driving motor, wherein the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be disposed on the mounting structure, the lifting rack is disposed along the direction of the plumb line and connected to the bearing base of the silicon rod bearing structure, and the driving gear is engaged with the lifting rack and controlled by the driving motor. When the vertical lifting driving unit is used, the driving motor drives the driving gear to rotate forwardly, and then drives the lifting rack and the silicon rod bearing structure connected with the lifting rack to do lifting action along the vertical lifting guide rod, or the driving motor drives the driving gear to rotate reversely, and then drives the lifting rack and the silicon rod bearing structure connected with the lifting rack to do descending action along the vertical lifting guide rod.

In addition, the vertical lifting driving unit can further comprise an auxiliary lifting assembly, the auxiliary lifting assembly further comprises a cylinder and a lifting ejector rod connected with the cylinder, the cylinder can be arranged on the mounting structure, and the lifting ejector rod is connected with the cylinder and is associated with a bearing base in the silicon rod bearing structure. The association of the lifting mandril with the bearing base in the silicon rod bearing structure can be realized in various ways, for example, in one way, the lifting mandril is connected with the bearing base, and in another way, the lifting mandril is kept in contact with the bearing base. Therefore, when the vertical lifting driving unit is used, the adjusted auxiliary lifting assembly can assist the bearing base to lift along the vertical lifting guide rod, and the stability of the lifting action of the bearing base can be ensured.

In the present application, by using the aforementioned vertical elevating mechanism as the centering adjustment mechanism, the axis of the silicon rod can be aligned with the predetermined center line in the direction of the plumb line by driving the silicon rod supported by the silicon rod supporting structure to perform vertical elevating movement, wherein the predetermined centre line may be obtained from the centre of clamping of the first silicon rod clamp or the centre of clamping of the second silicon rod clamp, generally, since the clamping center of the first silicon rod clamp or the clamping center of the second silicon rod clamp is determined, the predetermined center line is also determined (if the clamping center line of the first silicon rod clamp does not coincide with the clamping center line of the second silicon rod clamp in the direction of the plumb line, a first predetermined center line corresponding to the clamping center line of the first silicon rod clamp and a second predetermined center line corresponding to the clamping center line of the second silicon rod clamp may be included). In this way, when the vertical lifting mechanism is used, in order to ensure a lifting value of the silicon rod carried by the silicon rod carrying structure in the direction of the plumb line, the current dimension of the silicon rod in the direction of the plumb line or the height difference between the silicon rod and the clamping center of the first silicon rod clamp or the clamping center of the second silicon rod clamp in the direction of the plumb line needs to be determined. Therefore, in an embodiment of the present application, the centering adjustment mechanism further includes a height detector for detecting position information of the axis of the silicon rod carried by the silicon rod carrying structure in the direction of the plumb line.

The silicon rod transfer device further comprises a centering adjusting mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the silicon rod is located in a centering area of the silicon rod carrying structure in the first direction.

As shown in fig. 9, the silicon rod transfer device may further include a centering adjustment mechanism 73, and the centering adjustment mechanism 73 may include: the support 731, the configuration are at the regulation guide rail 733 on the support, arrange relatively two ejector parts 735 that just can be relative movement on adjusting the guide rail in support both sides and ejector drive unit, wherein, adjust guide rail 733 and set up along first direction, two ejector parts 735 are located and are adjusted on the guide rail and respectively arrange relatively in the both sides of support, ejector drive unit more includes two-way lead screw and driving source, wherein, two-way lead screw sets up along first direction and two ejector part threaded connection respectively at both ends, the driving source is connected with two-way lead screw for the drive two-way lead screw rotates so that two ejector parts 735 move in opposite directions or move back to back along first direction. When the centering adjustment mechanism disclosed in the embodiment is used, the driving source is made to drive the bidirectional screw rod to rotate in the forward direction, so that the two ejector pieces move in the opposite directions along the adjustment guide rail (the adjustment guide rail is arranged in the first direction) to perform a folding action, or the driving source is made to drive the bidirectional screw rod to rotate in the reverse direction, so that the two ejector pieces move in the opposite directions along the adjustment guide rail (the adjustment guide rail is arranged in the first direction) to perform an unfolding action. The control source may be, for example, a servo motor.

In view of the above, the centering adjustment mechanism is utilized to push the position of the silicon rod carried on the silicon rod carrying structure in the first direction through the two pushing members, so that the silicon rod is adjusted to the centering region of the silicon rod carrying structure.

As described above, the centering adjustment mechanism further includes a height detector for detecting position information of the axis of the silicon rod carried by the silicon rod carrying structure in the direction of the plumb line. As shown, in the embodiments of the present application, the centering adjustment mechanism includes a height detector disposed on the centering adjustment mechanism. For example, the height detector is arranged on an adjustment rail of the centering adjustment mechanism, which can be moved in the plumb line direction and in the first direction and/or the second direction by a control source (e.g. a servomotor). In one implementation, the height detector may be, for example, a contact sensor or a distance measuring sensor. In the case of a contact sensor, the contact sensor has a probe head for contacting the silicon rod. In some embodiments, the probe of the contact sensor may further include a retractable spring, and when the probe contacts the silicon rod, the retractable spring may be driven to retract, so as to protect the probe and prevent the probe from being damaged by hard touch or pressing.

Therefore, by using the height detector, the height of the silicon rod can be obtained by detecting multiple points of the silicon rod, and then the position information of the axis of the silicon rod in the direction of the plumb line can be obtained, so that the centering and adjusting mechanism can be conveniently and subsequently utilized to adjust accordingly.

The silicon rod transfer device further comprises a silicon rod clamping mechanism, wherein the silicon rod clamping mechanism is arranged on the silicon rod bearing structure and used for clamping the silicon rod borne by the silicon rod bearing structure, and the axis of the silicon rod corresponds to the center line of the silicon rod bearing structure. In an embodiment of the present application, the silicon rod clamping mechanism comprises: a clamp mounting and a silicon rod clamping part.

As shown in fig. 9, the silicon rod clamping mechanism 75 comprises a clamp mount 751 and a silicon rod clamping member 753.

The clamp mount 751 is disposed on the silicon rod carrying structure 71 along a first direction.

The silicon rod clamping member 753 is provided on the clamp mounting member 751. Wherein the silicon rod clamping means may be at least two, which may be arranged at a distance along the clamp mounting. In certain embodiments, each silicon rod clamping member further may comprise: the clamping arm comprises a clamping arm mounting seat, two clamping arms and a clamping arm driving mechanism. The clamp arm mounting seat is arranged on the clamp mounting part, the two clamp arms are movably arranged on the clamp arm mounting seat and oppositely arranged along a second direction, and the clamp arm driving mechanism is used for driving the two clamp arms to open and close.

Therefore, when a silicon rod to be processed is placed on the silicon rod bearing structure, the clamping arms in the two silicon rod clamping parts in the silicon rod clamping mechanism are loosened, the silicon rod to be processed is positioned between the two clamping arms in each silicon rod clamping part, and the two clamping arms are driven to clamp each silicon rod clamping part by the clamping arm driving mechanism in the silicon rod clamping part, so that the silicon rod is clamped.

In certain implementations, the clamp arm drive mechanism can include: the opening and closing gear is arranged on the clamping arm mounting seat; each rack is associated with the corresponding clamping arm and meshed with the opening and closing gear; and the driving source is associated with the opening and closing gear and is used for driving the opening and closing gear to rotate. The two racks are arranged in parallel, the opening and closing gear is located between the two racks, and teeth are arranged on the surface, facing the opening and closing gear, of the racks. The drive source may be, for example, a servo motor.

So, when utilizing arm lock actuating mechanism drive two arm lock do open and shut when moving, drive the gear forward rotation that opens and shuts by the driving source, then drive two racks and two arm lock associated with two racks that open and shut the gear meshing and move in opposite directions and do the clamping action, perhaps, drive the gear antiport that opens and shuts by the driving source, then drive two racks and two arm lock associated with two racks that open and shut the gear meshing and move back to the back and move and open the action.

Of course, the above-mentioned clamping arm driving mechanism is not limited thereto, and in other embodiments, the clamping arm driving mechanism may be modified in other ways, for example, the clamping arm driving mechanism may also adopt a screw rod adjusting mechanism, a chain conveying mechanism, or a double speed chain mechanism.

In addition, in the silicon rod clamping mechanism, at least one of the at least two silicon rod clamping members is provided with a spacing adjustment drive mechanism for driving the at least one silicon rod clamping member to move along the clamp mounting for adjusting the spacing of the at least two silicon rod clamping members.

In one example, the at least two silicon rod clamping members are chain conveyors driven by a motor. The chain conveying mechanism comprises: an endless chain and a sprocket for driving the endless chain. The annular chain is arranged along a first direction, chain wheels are respectively arranged at two ends of the annular chain, and gear teeth of the chain wheels are meshed with the chain and drive the chain to run when rotating. One of the two chain wheels is used as a driving chain wheel, the driving chain wheel can be in power coupling with a motor shaft, namely a power output shaft, the driving chain wheel is meshed with the chain wheels of the two annular chains, and then the conveying speed of the chains is controlled by a driving motor, namely the moving speed of at least one silicon rod clamping piece on the clamp mounting piece can be controlled.

In other possible examples, the spacing adjustment driving mechanism may also be provided as a double speed chain mechanism, a belt mechanism, or the like.

The silicon rod transfer device further comprises a feeding driving mechanism, and the feeding driving mechanism is used for driving the silicon rod bearing structure and the silicon rod to be processed borne by the silicon rod bearing structure to move from the loading position to the first processing position along the second direction.

The feeding driving mechanism is arranged below the silicon rod bearing structure and comprises: the silicon rod loading device comprises a feeding guide rod or a feeding guide rail and a feeding driving unit, wherein the feeding guide rod or the feeding guide rail is arranged along a second direction and is used for arranging the silicon rod loading structure, and the feeding guide rod or the feeding guide rail is arranged on a base in a crossing mode along the second direction. The feed drive unit is configured to drive the silicon rod carrying structure to move along the feed guide or feed rail, and in one implementation, the feed drive unit comprises: the silicon rod bearing structure comprises a driving motor and a screw rod assembly which is arranged along the second direction and driven by the driving motor, wherein the driving motor can be arranged at one end of the screw rod assembly, and the screw rod assembly is controlled by the driving motor and is in threaded connection with the silicon rod bearing structure. So, when using when feeding actuating mechanism, by driving motor drive lead screw subassembly forward rotation, then drive the silicon rod bearing structure who is connected with the lead screw subassembly and move towards first processing position along feeding guide arm or feeding guide rail (along the second direction), perhaps, drive lead screw subassembly antiport by driving motor, then drive the silicon rod bearing structure who is connected with the lead screw subassembly and move towards the loading and unloading position along feeding guide arm or feeding guide rail (along the second direction), thereby transfer the silicon rod that silicon rod bearing structure bore between loading and unloading position and first processing position.

The silicon rod transfer device further comprises a crystal line detection unit for carrying out crystal line detection on the silicon rod to be processed so as to determine the crystal line position of the silicon rod. As shown in fig. 9, the crystal line detecting unit 77 may be disposed on a silicon rod carrying mechanism or a silicon rod clamping mechanism, for example, the crystal line detecting unit 77 may be disposed on a silicon rod clamping member 753, for example, a clamp arm mounting seat or a clamp arm of the silicon rod clamping member 753.

In practical applications, when the silicon rod transfer device is used, the specific operation process may substantially include: the silicon rod bearing structure is positioned at the initial position of the loading and unloading position, and a silicon rod to be processed is placed on the silicon rod bearing structure; adjusting the position of the silicon rod to be processed in the first direction by using a centering adjusting mechanism so as to enable the silicon rod to be positioned in a centering area of the silicon rod bearing structure in the first direction, and simultaneously clamping the silicon rod borne by the silicon rod bearing structure by using a silicon rod clamping mechanism, so that the axis of the silicon rod corresponds to the central line of the silicon rod bearing structure; detecting the silicon rod by using a height detector to obtain position information of an axis of the silicon rod in the direction of the plumb line, determining a difference value of the axis of the silicon rod and the position information of a clamping center line of the first silicon rod clamp or the second silicon rod clamp in the direction of the plumb line according to the position information of the axis of the silicon rod in the direction of the plumb line and the position information of the clamping center line of the first silicon rod clamp or the second silicon rod clamp in the first processing position, and driving the silicon rod bearing structure and the silicon rod borne by the silicon rod bearing structure to perform lifting motion along the direction of the plumb line by using a vertical lifting mechanism so that the axis of the silicon rod is aligned with the clamping center line of the first silicon rod clamp or the second silicon rod clamp in the first processing position in the direction of the plumb line; the feeding driving mechanism is used for driving the silicon rod bearing structure and the silicon rod borne by the silicon rod bearing structure to move to a first processing position along a second direction, so that the silicon rod is clamped by a first silicon rod clamp or a second silicon rod at the first processing position; and driving the silicon rod to rotate at a preset rotating speed by utilizing the first silicon rod clamp or the second silicon rod clamp, enabling the crystal line detection unit to carry out crystal line detection on the silicon rod so as to determine the crystal line position of the silicon rod, and adjusting the clamped silicon rod in place by the first silicon rod clamp or the second silicon rod clamp according to the determined crystal line position of the silicon rod to finish loading of the silicon rod.

In an embodiment of the application, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod unloading device, which is arranged in a workpiece unloading area of the silicon rod processing platform and used for unloading the ground silicon rod from the silicon rod processing platform.

The direction and position of the silicon rod unloading device can be determined by the positional relationship of the workpiece unloading area.

In one embodiment, the workpiece discharge areas are arranged adjacent to each other in a first direction, wherein the silicon rod unloading device can be arranged in the first direction and can be abutted against the silicon rod grinding device, so that the ground silicon rods are transported out in the first direction after being ground. The number of the silicon rod unloading devices may also be determined in accordance with the number, configuration or operation of the silicon rod grinding devices or transfer channels in the silicon rod slicing and grinding all-in-one machine, for example, in the embodiment shown in fig. 1 and 3,

when the silicon rod slicing and grinding all-in-one machine is provided with the first transfer channel and the second transfer channel, the silicon rod grinding device can be switched on different transfer channels and grind silicon rods on different transfer channels, in one embodiment, the silicon rod unloading devices can be two corresponding to the transfer channels, each silicon rod unloading device is butted with one transfer channel, so that each silicon rod unloading device can unload the silicon rod on the corresponding transfer channel, or in another embodiment, as shown in the silicon rod cutting device and the silicon rod grinding device, only one silicon rod unloading device is provided, and the silicon rod unloading device can be switched between the first transfer channel and the second transfer channel through an unloading switching mechanism, for example, so that the silicon rod unloading device can unload the silicon rods on different transfer channels.

In certain embodiments, the silicon rod unloading device may employ a silicon rod conveying device.

The silicon rod conveying device can be, for example, a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

In one embodiment, the silicon rod transfer mechanism comprises: the conveying part is used for bearing the silicon rod; and the conveying driving source is used for driving the conveying part to move so as to convey the silicon rod.

The conveying part may be disposed in a first direction, and conveys the carried silicon rods in the first direction by being driven by the conveying driving source. The movement direction of the conveying part can be set to be towards the direction of the workpiece discharging area so as to convey the carried silicon rod to the workpiece discharging area.

In some examples, in order to avoid the silicon rods from being worn by collision during transportation, in some embodiments, the transportation part is provided with a buffer pad for contacting with the silicon rods, or the transportation part is made of a buffer material. The buffer pad or buffer material is made of elastic rubber, silica gel or other materials with elastic deformation, damping characteristics or buffer characteristics, so as to reduce the breakage risk of silicon rod conveying.

In certain embodiments, the silicon rod unloading device may employ a silicon rod gripping device.

The silicon rod clamping and conveying device comprises: a clamping portion for clamping the silicon rod; and the conveying driving source is used for driving the clamping part to move so as to convey the silicon rod.

The clamping part can be arranged along a first direction and used for clamping two end faces of the silicon rod and conveying the carried silicon rod along the first direction under the driving of the conveying driving source.

The conveying driving source is, for example, a motor for driving the movement of the nip and controlling the conveying speed of the nip.

Here, the silicon rod cutting and grinding all-in-one machine disclosed in the present application is integrated with the silicon rod cutting device and the grinding device, and the silicon rod cutting device and the grinding device are respectively disposed at the first processing location and the second processing location of the silicon rod processing platform, and the silicon rod cutting device and the grinding device are provided with the first transfer device and the second transfer device which simultaneously penetrate through the first processing location and the second processing location, respectively configure the silicon rod clamp and the driving mechanism for the first transfer device and the second transfer device, and through coordinately controlling the first transfer device, the second transfer device, the silicon rod cutting device and the grinding device, so that the silicon rod cutting device located at the first processing location and the grinding device located at the second processing location are both in a working state at the same time, thereby completing the integrated operation of the silicon rod cutting and grinding multiple processes, and improving the production efficiency and the quality of the product processing operation.

When the silicon rod cutting and grinding integrated machine in the embodiment shown in fig. 1 and 2 is used for silicon rod processing operation, the specific process may be roughly as follows:

the first silicon rod is placed in the silicon rod transfer device 7 located at the loading and unloading location.

The first silicon rod is transferred to the first processing location by the silicon rod transfer device 7, and the first silicon rod is held by the first silicon rod holder 2 located on the first transfer path in the first processing location to complete loading. Wherein, the axis of the first silicon rod and the clamping center line of the first silicon rod clamp 2 are on the same straight line. At this time, the silicon rod cutting device 4 is located on the first transfer passage, and the silicon rod grinding device 5 is located on the second transfer passage.

The first silicon rod clamp 2 and the first silicon rod clamped by the first silicon rod clamp are driven to move along a first direction, so that the silicon rod cutting device 4 cuts the first silicon rod. When the silicon rod cutting device is used for cutting the first silicon rod, firstly, the first silicon rod is cut for the first time by two parallel cutting wire saws formed in the silicon rod cutting device, so that two opposite side sections in the first silicon rod are cut, the flaw-pieces left after cutting are removed, the first silicon rod clamp is driven to retreat to the initial position along the first direction, the first silicon rod clamp is utilized to rotate the first silicon rod for 90 degrees so as to adjust the cutting surface, the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp are continuously driven to move along the first direction, the silicon rod cutting device is used for cutting the two remaining side sections of the first silicon rod, the flaw-pieces left after cutting are removed, the silicon rod with the rectangular cross section is formed, and the silicon rod cutting operation is completed.

The silicon rod cutting device 4 is switched from the first transfer channel to the second transfer channel and the silicon rod grinding device 5 is switched from the second transfer channel to the first transfer channel.

The second silicon rod is transferred to the first processing location by the silicon rod transfer device 7, and the second silicon rod is held by the second silicon rod clamp 3 located on the second transfer passage in the first processing location to complete loading. Wherein, the axis of the second silicon rod and the clamping center line of the second silicon rod clamp 3 are on the same straight line.

The first silicon rod clamp 2 and the first silicon rod clamped by the first silicon rod clamp are driven to move along a first direction, so that the silicon rod grinding device 5 grinds the first silicon rod. In some embodiments, the grinding operation includes a rough grinding operation and a finish grinding operation, for example, a first silicon rod is first rough ground by a rough grinding tool in the silicon rod grinding apparatus, and then finish ground by a finish grinding tool in the silicon rod grinding apparatus. In certain embodiments, the grinding operation includes a rough grinding operation, a finish grinding operation, and a chamfering operation. For example, the first silicon rod is first coarsely ground by a coarse grinding tool in the silicon rod grinding device, then finely ground by a fine grinding tool in the silicon rod grinding device, and finally chamfered by a fine grinding tool or a chamfering tool in the silicon rod grinding device. Meanwhile, the second silicon rod clamp 3 and the second silicon rod clamped by the second silicon rod clamp are driven to move along the first direction, so that the silicon rod cutting device 4 cuts the second silicon rod to form a silicon rod with a rectangular cross section, and the cutting of the silicon rod is completed.

The first silicon rod after the grinding operation is unloaded, the silicon rod cutting device 2 is switched from the second transfer channel to the first transfer channel and the silicon rod grinding device 3 is switched from the first transfer channel to the second transfer channel.

The third silicon rod is transferred to the first processing location by the silicon rod transfer device 7, and the third silicon rod is held by the first silicon rod clamp located on the first transfer passage in the first processing location to complete loading.

The second silicon rod clamp 3 and the second silicon rod clamped by the second silicon rod clamp are driven to move along the first direction, so that the silicon rod grinding device 5 grinds the second silicon rod. At this time, the first silicon rod clamp 2 and the third silicon rod clamped by the first silicon rod clamp are driven to move along the first direction, so that the silicon rod cutting device 4 cuts the third silicon rod.

And repeating the operation flow to finish the integrated operation of the multiple procedures of squaring and grinding the silicon rod.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. The utility model provides a silicon rod surely grinds all-in-one which characterized in that includes:

2. The silicon rod cutting and grinding all-in-one machine as recited in claim 1, wherein the first transfer device and the second transfer device are mounted above the silicon rod processing platform through a mounting frame, or wherein the first transfer device is mounted above the silicon rod processing platform through a first mounting frame and the second transfer device is mounted above the silicon rod processing platform through a second mounting frame.

3. The silicon rod slicing and grinding all-in-one machine as set forth in claim 1, wherein the first silicon rod clamp comprises:

a first clamp arm mounting seat;

the pair of first clamping arms are oppositely arranged on the first clamping arm mounting seats along a first direction and used for clamping two end faces of the silicon rod; wherein, any one of the at least one pair of first clamping arms is provided with a clamping part; and

the first clamping arm driving mechanism is used for driving at least one first clamping arm in the at least one pair of first clamping arms to move along the first direction so as to adjust the clamping distance between the at least one pair of first clamping arms.

4. The silicon rod cutting and grinding all-in-one machine as recited in claim 3, wherein the first transfer drive mechanism comprises:

the first transfer guide rail is arranged along a first direction and is used for arranging the first clamping arm mounting seat; and

and the first transfer driving unit is used for driving the first clamping arm mounting seat and at least one pair of first clamping arms to move along the first transfer guide rail.

5. The silicon rod cutting and grinding all-in-one machine as recited in claim 4, wherein the first transfer drive unit comprises:

the first moving rack is arranged along a first direction;

the first driving gear is arranged on the first clamping arm mounting seat and meshed with the movable rack; and

and the first driving source is used for driving the driving gear to enable the associated first clamping arm mounting seat and at least one pair of first clamping arms to move along the first transfer guide rail.

6. The silicon rod cutting and grinding all-in-one machine as recited in claim 4, wherein the first transfer drive unit comprises:

the first movable screw rod is arranged along a first direction and is associated with the first clamping arm mounting seat; and

and the first driving source is used for driving the first movable screw rod to rotate so as to enable the associated first clamping arm mounting seat and at least one pair of first clamping arms thereof to move along the first transfer guide rail.

7. The silicon rod slicing and grinding all-in-one machine as set forth in claim 3, wherein the at least one pair of first clamp arms are rotary structures; the first silicon rod clamp further comprises a first clamping arm rotating mechanism, and the first clamping arm rotating mechanism is arranged on at least one first clamping arm of the at least one pair of first clamping arms and used for driving the clamping part of the at least one first clamping arm to rotate.

8. The silicon rod slicing and grinding all-in-one machine as set forth in claim 1, wherein the second silicon rod clamp comprises:

a second clamp arm mounting seat;

the second clamping arms are oppositely arranged on the second clamping arm mounting seats along the first direction and are used for clamping two end faces of the silicon rod; any one of the at least one pair of second clamping arms is provided with a clamping part; and

and the second clamping arm driving mechanism is used for driving at least one second clamping arm in the at least one pair of second clamping arms to move along the first direction so as to adjust the clamping distance between the at least one pair of second clamping arms.

9. The silicon rod slicing and grinding all-in-one machine as set forth in claim 8, wherein the second transfer drive mechanism comprises:

the second transfer guide rail is arranged along the first direction and is used for arranging the second clamping arm mounting seat; and

and the second transfer driving unit is used for driving the second clamping arm mounting seat and at least one pair of second clamping arms thereof to move along the second transfer guide rail.

10. The silicon rod cutting and grinding all-in-one machine as set forth in claim 9, wherein the second transfer drive unit comprises:

the second moving rack is arranged along the first direction;

the second driving gear is arranged on the second clamping arm mounting seat and is meshed with the movable rack; and

and the second driving source is used for driving the driving gear to enable the associated second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer guide rail.

11. The silicon rod cutting and grinding all-in-one machine as set forth in claim 9, wherein the second transfer drive unit comprises:

the second movable screw rod is arranged along the first direction and is associated with the second clamping arm mounting seat; and

and the second driving source is used for driving the movable screw rod to rotate so as to enable the associated second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer guide rail.

12. The silicon rod slicing and grinding all-in-one machine as set forth in claim 8, wherein the at least one pair of second clamp arms are rotary structures; the second silicon rod clamp further comprises a second clamping arm rotating mechanism, and the second clamping arm rotating mechanism is arranged on at least one second clamping arm in the at least one pair of second clamping arms and used for driving the clamping part of the at least one second clamping arm to rotate.

13. The silicon rod cutting and grinding all-in-one machine as recited in claim 1, wherein the silicon rod cutting device comprises:

a cutting frame;

at least one wire cutting unit arranged on the cutting frame; the wire cutting unit includes: the cutting wire is wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; and

and the cutting switching mechanism is used for driving the cutting frame and at least one wire cutting unit on the cutting frame to switch between the first transfer channel and the second transfer channel.

14. The silicon rod cutting and grinding all-in-one machine as set forth in claim 13, wherein the wire cutting unit comprises:

cutting a line;

the first cutting wheel and the second cutting wheel are arranged on the cutting frame, and cutting wires are wound on the first cutting wheel and the second cutting wheel to form a cutting wire saw; the wheel surface of the first cutting wheel is parallel to or coplanar with the wheel surface of the second cutting wheel;

the first transition wheel is adjacent to the first cutting wheel, and the cutting lines of the first cutting wheel and the first transition wheel are positioned in a plane where a first cutting line groove for winding the cutting lines in the first cutting wheel is positioned in the state of drawing the cutting lines;

the second transition wheel is arranged adjacent to the second cutting wheel, and the cutting lines of the second cutting wheel and the second transition wheel are positioned in a plane where a second cutting line groove for winding the cutting lines in the second cutting wheel is positioned in the state of drawing the cutting lines; and

and the third transition wheel is arranged between the first transition wheel and the second transition wheel and used for drawing the cutting line between the first transition wheel and the second transition wheel so as to form a cutting accommodating space in the line cutting unit.

15. The silicon rod slicing and grinding all-in-one machine as recited in claim 14, wherein the first transition wheel, the second transition wheel, and at least one third transition wheel are used for drawing the cutting line away from the cutting accommodating space.

16. The silicon rod cutting and grinding all-in-one machine as recited in claim 14, wherein the cutting line is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed loop cutting line in an end-to-end relationship.

17. The silicon rod cutting and grinding all-in-one machine as recited in claim 16, wherein the wire cutting unit comprises two third transition wheels, and the cutting wire is sequentially wound around the first cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel and the first cutting wheel to form a closed loop cutting wire which is connected end to end.

18. The silicon rod cutting and grinding all-in-one machine as recited in claim 14, wherein the silicon rod cutting device further comprises a cutting line driving device for driving the cutting line to operate to cut the silicon rod to be cut.

19. The silicon rod cutting and grinding all-in-one machine as claimed in claim 18, wherein the cutting line driving device is a motor, has a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel.

20. The silicon rod cutting and grinding all-in-one machine as recited in claim 14, wherein the silicon rod cutting device further comprises:

and the distance adjusting mechanism is arranged on the at least one linear cutting unit and used for driving at least two cutting wheels in the linear cutting unit to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels.

21. The silicon rod cutting and grinding all-in-one machine as recited in claim 20, wherein the silicon rod cutting device comprises a single-wire cutting unit, and the pitch adjustment mechanism comprises:

the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the single-line cutting unit; and

and the driving source is used for driving the screw rod to rotate.

22. The silicon rod cutting and grinding all-in-one machine as recited in claim 20, wherein the silicon rod cutting device comprises a single-wire cutting unit, and the pitch adjustment mechanism comprises:

the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the single-wire cutting unit; and

and the driving source is used for driving the telescopic piece to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

23. The silicon rod cutting and grinding all-in-one machine as recited in claim 20, wherein the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit which are arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit is driven by the distance adjusting mechanism to move along the orthogonal direction of the wheel face of the cutting wheel.

24. The silicon rod cutting and grinding all-in-one machine as recited in claim 23, wherein the pitch adjustment mechanism comprises:

the screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and

and the driving source is used for driving the screw rod to rotate.

25. The silicon rod cutting and grinding all-in-one machine as recited in claim 23, wherein the pitch adjustment mechanism comprises:

the telescopic piece is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is associated with the first wire cutting unit or the second wire cutting unit; and

and the driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.

26. The silicon rod cutting and grinding all-in-one machine as recited in claim 23, wherein the pitch adjustment mechanism comprises:

the bidirectional screw rod is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is in threaded connection with the first linear cutting unit and the second linear cutting unit; and

and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the opposite direction or in the opposite direction along the orthogonal direction of the wheel surface of the cutting wheel.

27. The silicon rod cutting and grinding all-in-one machine as recited in claim 13, wherein the cutting conversion mechanism comprises:

the cutting conversion guide rail is arranged along the second direction and is used for arranging the cutting frame; the second direction is perpendicular to the first direction; and

28. The silicon rod cutting and grinding all-in-one machine as set forth in claim 27, wherein the cutting conversion drive unit comprises:

the movable rack is arranged along the second direction;

the driving gear is arranged on the cutting frame and meshed with the movable gear rack; and

and the driving source is used for driving the driving gear to enable the associated cutting frame and at least one wire cutting unit thereof to move along the cutting conversion guide rail.

29. The silicon rod cutting and grinding all-in-one machine as set forth in claim 27, wherein the cutting conversion drive unit comprises:

a mobile screw rod arranged along a second direction and associated with the cutting frame; and

and the driving source is used for driving the movable screw rod to rotate so as to enable the associated cutting frame and at least one wire cutting unit to move along the cutting conversion guide rail.

30. The silicon rod cutting and grinding all-in-one machine as recited in claim 13, further comprising an edge skin unloading device, wherein the edge skin unloading device comprises an edge skin supporting mechanism for supporting the outer side of the silicon rod and supporting the edge skin formed by cutting.

31. The silicon rod cutting and grinding all-in-one machine as recited in claim 30, wherein the flaw-piece supporting mechanism comprises:

a bearing part; and

and the driving unit is connected with the bearing part to control the bearing part to be far away from or abut against the flaw-piece.

32. The silicon rod cutting and grinding all-in-one machine as set forth in claim 31, wherein the bearing portion comprises:

at least two bearing blocks are arranged at intervals along the first direction and are provided with bearing surfaces used for contacting and bearing the side leather.

33. The silicon rod cutting and grinding all-in-one machine as set forth in claim 31, wherein the bearing portion comprises:

at least two supporting rods arranged along the first direction and used for contacting and supporting the flaw-piece; and

the two connecting parts are arranged on two opposite sides of the cutting frame in the first direction to correspond to two opposite ends of the at least two bearing rods and are used for connecting the at least two bearing rods and connected with the driving unit.

34. The silicon rod cutting and grinding all-in-one machine as recited in claim 31, wherein the bearing portion comprises at least two bearing wheel sets spaced apart along the first direction, wherein the bearing wheel sets comprise:

the at least two supporting wheels are arranged at intervals and are used for contacting and supporting the flaw-piece; and

and the bearing base is used for arranging the at least two bearing wheels and is connected with the driving unit.

35. The silicon rod cutting and grinding all-in-one machine as set forth in claim 31, wherein the driving unit comprises:

a cylinder or hydraulic pump; and

the telescopic part is connected with the bearing part and is driven by the cylinder or the hydraulic pump to do telescopic motion so as to control the bearing part to be far away from or abut against the flaw-piece.

36. The silicon rod cutting and grinding all-in-one machine as set forth in claim 31, wherein the driving unit comprises:

a drive motor; and

and the screw rod assembly is connected with the bearing part and is driven by the driving motor to move so as to control the bearing part to be far away from or abut against the flaw-piece.

37. The silicon rod cutting and grinding all-in-one machine as recited in claim 30, wherein the flaw-piece discharging device further comprises a flaw-piece dislocation mechanism disposed on the base or the silicon rod cutting device for pushing the flaw-piece in a first direction to separate the flaw-piece from the flaw-piece supporting mechanism.

38. The silicon rod cutting and grinding all-in-one machine as recited in claim 34, wherein the flaw-piece misalignment mechanism comprises:

pushing the top; and

and the cylinder or the hydraulic pump is used for driving the ejection part to eject the telescopic rod of the edge leather along the first direction.

39. The silicon rod cutting and grinding all-in-one machine as recited in claim 30, wherein the flaw-piece discharging device further comprises a flaw-piece conveying mechanism for receiving the flaw-pieces formed by cutting and conveying the flaw-pieces to a discharging area.

40. The silicon rod cutting and grinding all-in-one machine as set forth in claim 39, wherein the flaw-piece conveying mechanism comprises:

the conveying part is used for bearing the flaw-piece; and

and the conveying driving source is used for driving the conveying part to move along a first direction so as to convey the edge leather.

41. The silicon rod slicing and grinding all-in-one machine as set forth in claim 1, wherein the silicon rod grinding device comprises:

a grinding tool mounting base;

at least one pair of grinding tools which are oppositely arranged on the grinding tool mounting seat;

a grinding tool advancing and retreating mechanism for driving at least one grinding tool of the at least one pair of grinding tools to move along a second direction, wherein the second direction is perpendicular to the first direction; and

and the grinding tool switching mechanism is used for driving the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.

42. The silicon rod slicing and grinding all-in-one machine as claimed in claim 41, wherein any one of the at least one pair of grinding tools comprises a rough grinding wheel and a finish grinding wheel nested with each other.

43. The silicon rod slicing and grinding all-in-one machine as claimed in claim 42, wherein the rough grinding wheel is nested inside the finish grinding wheel, and at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism; or the accurate grinding wheel is nested in the rough grinding wheel, and at least one of the rough grinding wheel and the accurate grinding wheel is provided with a telescopic driving mechanism.

44. The silicon rod slicing and grinding all-in-one machine as set forth in claim 41, wherein the grinder transfer mechanism comprises:

the grinding tool conversion guide rail is arranged along the second direction and is used for arranging the grinding tool mounting seat; and

and the grinding tool conversion driving unit is used for driving at least one pair of grinding tools to move along the grinding tool conversion guide rail.

45. The silicon rod slicing and grinding all-in-one machine as set forth in claim 44, wherein the grinder conversion drive unit comprises:

the movable rack is arranged along the second direction;

the driving gear is arranged on the grinding tool mounting seat and is meshed with the movable rack; and

a driving source for driving the driving gear to move the associated grinder mounting seat and at least one pair of grinders thereof along the grinder transfer rail.

46. The silicon rod slicing and grinding all-in-one machine as set forth in claim 44, wherein the grinder conversion drive unit comprises:

the movable screw rod is arranged along a second direction and is associated with the grinding tool mounting seat; and

and the driving source is used for driving the movable screw rod to rotate so as to enable the associated grinding tool mounting seat and at least one pair of grinding tools to move along the grinding tool conversion guide rail.

47. The silicon rod slicing and grinding all-in-one machine as set forth in claim 41, wherein the silicon rod grinding device further comprises: and at least one pair of chamfering grinding tools are oppositely arranged on the grinding tool mounting seat.

48. The silicon rod slicing and grinding all-in-one machine as set forth in claim 41, wherein any one of the first and second silicon rod clamps further comprises: and the grinding repair device is used for grinding at least one pair of grinding tools in the corresponding silicon rod grinding device.

49. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, further comprising: and the silicon rod transferring device is arranged at the loading position of the silicon rod processing platform and used for transferring the silicon rod to be processed to the first processing position of the silicon rod processing platform.

50. The silicon rod cutting and grinding all-in-one machine as set forth in claim 49, wherein the silicon rod transfer device comprises:

the silicon rod bearing structure is used for bearing a silicon rod to be processed;

the centering adjusting mechanism is used for adjusting the position of the silicon rod to be processed so that the axis line of the silicon rod corresponds to a preset center line; and

and the feeding driving mechanism is used for driving the silicon rod bearing structure and the silicon rod to be processed borne by the silicon rod bearing structure to move from the loading zone to the first processing zone along the second direction.

51. The silicon rod slicing and grinding all-in-one machine as claimed in claim 50, wherein the centering adjustment mechanism comprises a vertical lifting mechanism for driving the silicon rod carrying structure and the carried silicon rod to be processed to make vertical lifting movement so that the axis of the silicon rod to be processed is vertically aligned with the predetermined center line.

52. The silicon rod cutting and grinding all-in-one machine as set forth in claim 51, wherein the vertical lifting mechanism comprises:

the vertical lifting guide rod is used for arranging the silicon rod bearing structure; and

and the vertical lifting driving unit is used for driving the silicon rod bearing structure to move up and down along the vertical lifting guide rod.

53. The silicon rod cutting and grinding all-in-one machine as recited in claim 52, wherein the vertical lift drive unit comprises: the driving motor and the vertical screw rod assembly are arranged and driven by the driving motor, or the driving motor and the vertical gear rack transmission assembly are arranged and driven by the driving motor.

54. The silicon rod slicing and grinding all-in-one machine as recited in claim 50, wherein the silicon rod transfer device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so as to be located in a centering region of the silicon rod carrying structure.

55. The silicon rod slicing and grinding all-in-one machine as set forth in claim 54, wherein the centering adjustment mechanism comprises:

the support is arranged on the base or the silicon rod bearing structure;

the adjusting guide rail is arranged on the bracket along a first direction;

the at least two ejection pieces are respectively arranged on two opposite sides of the bracket;

and the adjusting and driving unit is used for driving the at least two pushing pieces to move oppositely along the adjusting guide rail so as to push the silicon rod to be arranged in the central area of the silicon rod bearing structure.

56. The silicon rod cutting and grinding all-in-one machine as recited in claim 55, wherein the adjustment drive unit comprises: the driving motor and the screw rod assembly are arranged along the first direction and driven by the driving motor, or the driving motor and the gear rack transmission assembly are arranged along the first direction and driven by the driving motor.

57. The silicon rod cutting and grinding all-in-one machine as recited in claim 50, wherein the silicon rod transfer device further comprises a silicon rod clamping mechanism disposed on the silicon rod carrying structure.

58. The silicon rod slicing and grinding all-in-one machine as set forth in claim 57, wherein the silicon rod clamping mechanism comprises:

the clamp mounting piece is arranged on the silicon rod bearing structure along a first direction; and

at least two silicon rod clamping members arranged at a distance along the clamp mounting.

59. The silicon rod slicing and grinding all-in-one machine as recited in claim 58, wherein the silicon rod clamping member comprises:

the clamping arm mounting seat is arranged on the clamp mounting piece;

the two clamping arms are movably arranged on the clamping arm mounting seats; and

and the clamping arm driving mechanism is used for driving the two clamping arms to open and close.

60. The silicon rod slicing and grinding all-in-one machine as set forth in claim 59, wherein the clamping arm drive mechanism comprises:

the opening and closing gear is arranged on the clamping arm mounting seat;

two racks, each rack is associated with one clamping arm and meshed with the opening and closing gear; and

and the driving source is associated with the opening and closing gear and is used for driving the opening and closing gear to rotate.

61. The silicon rod slicing and grinding all-in-one machine as claimed in claim 58, wherein in the silicon rod clamping mechanism, at least one of at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving it to move along the clamp mounting member to adjust the spacing of the at least two silicon rod clamping members.

62. The silicon rod slicing and grinding all-in-one machine as claimed in claim 61, wherein the spacing adjustment driving mechanism is a screw rod adjusting mechanism, a chain conveying mechanism, a double speed chain mechanism, or a transmission belt mechanism.

63. The silicon rod slicing and grinding all-in-one machine as set forth in claim 50, wherein the feed drive mechanism comprises:

the feeding guide rods or the feeding guide rails are distributed along the second direction and are used for arranging the silicon rod bearing structures; and

and the feeding driving unit is used for driving the silicon rod bearing structure to move along the feeding guide rod or the feeding guide rail.

64. The silicon rod cutting and grinding all-in-one machine as recited in claim 50, wherein the silicon rod transfer device further comprises a crystal line detection unit.

65. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, further comprising: and the silicon rod unloading device is arranged in a workpiece unloading area of the silicon rod processing platform and is used for unloading the ground silicon rod from the silicon rod processing platform.