CN218365782U - Square silicon rod cutting and grinding integrated machine - Google Patents

Abstract

The application discloses side silicon rod surely grinds all-in-one, including frame, cutting device and grinder, utilize cutting device can dissect the former side silicon rod of horizontal place and form first party silicon rod and second side silicon rod after the operation, utilizes grinder can carry out the grinding operation of cutting plane to dissecting the first party silicon rod and the second side silicon rod that the back formed to accomplish the integration operation to half cutting and grinding multiple operation of former side silicon rod, improve the quality of production efficiency and product processing operation.

Description

Square silicon rod cutting and grinding integrated machine

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a square silicon rod cutting and grinding all-in-one machine.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting off the original long silicon rod to form a plurality of sections of short silicon rods; after the cutting is finished, cutting the cut short silicon rods by using a silicon rod cutting machine to form square silicon rods with rectangular-like sections; then grinding the square silicon rod after cutting into a plane, rounding/chamfering and other grinding operations so that the surface of the silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, carrying out slicing operation on the square silicon rod to obtain a silicon wafer.

The silicon wafer obtained by the slicing operation can be used for manufacturing a photovoltaic module, and the photovoltaic module can be used for converting light energy into electric energy.

In order to improve the conversion efficiency of the photovoltaic module, the shingled module is produced. The laminated assembly is characterized in that a plurality of battery pieces are connected in series in a front-back laminated mode, no gap exists between the battery pieces, and no welding strip shields the battery pieces, so that more battery pieces can be accommodated in the same area of the assembly, and the effective power generation area is enlarged. In the related art, to obtain a silicon wafer for manufacturing a tile stack assembly, a silicon rod for slicing and forming the silicon wafer needs to be manufactured first, and the silicon rod is usually manufactured by cutting and grinding a square silicon rod manufactured in the original process again, so how to provide a device which has a simple structure, is convenient to operate, and can manufacture a corresponding silicon rod quickly and efficiently is an urgent issue to be solved.

SUMMERY OF THE UTILITY MODEL

In view of the various defects of the related art, the present application aims to disclose a square silicon rod cutting and grinding all-in-one machine, which is used for solving the problems of complex structure, inconvenient operation, low efficiency and the like in the prior related art.

To achieve the above and other related objects, the present application discloses a square silicon rod cutting and grinding all-in-one machine, comprising: the base is provided with a silicon rod processing platform; the silicon rod processing platform comprises a cutting area and a grinding area which are arranged along a first direction; the cutting device is arranged at a cutting position of the silicon rod processing platform; the cutting device comprises at least one cutting wire saw, and the at least one cutting wire saw is used for cutting the original square silicon rod horizontally placed at the cutting area to form a first square silicon rod and a second square silicon rod; the original silicon rod is a silicon rod with a rectangular-like cross section, and the axis of the original silicon rod is consistent with the first direction; and the grinding device is arranged at a grinding zone of the silicon rod processing platform and used for grinding cutting surfaces of the first square silicon rod and the second square silicon rod which are horizontally placed at the grinding zone, and the axial lead of the first square silicon rod and the axial lead of the second square silicon rod are consistent with the first direction.

In certain embodiments of the present application, the at least one cutting wire saw disposed along the second direction, the at least one cutting wire saw configured to cut the horizontally disposed bulk silicon rod at the cutting location to form a first silicon rod and a second silicon rod comprises the at least one cutting wire saw configured to cross-cut the horizontally disposed bulk silicon rod at the cutting location to form a first silicon rod and a second silicon rod stacked up and down; the second direction is perpendicular to the first direction and forms a horizontal plane with the first direction.

In certain embodiments of the present application, the at least one cutting wire saw is disposed in a vertical direction, and the at least one cutting wire saw is configured to perform a slicing operation on the horizontally disposed bulk silicon rod at the cutting location to form a first silicon rod and a second silicon rod comprises the at least one cutting wire saw configured to perform a vertical cutting operation on the horizontally disposed bulk silicon rod at the cutting location to form a left and right stacked first silicon rod and second silicon rod; the vertical direction is perpendicular to the first direction.

In certain embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises: and the silicon rod side clamping mechanism is arranged at the cutting area of the silicon rod processing platform and is used for clamping the side of the original silicon rod.

In certain embodiments of the present application, the silicon rod side clamping mechanism comprises: the side clamping support; the clamping pieces on the two sides are arranged on the two opposite sides of the side clamping support along a second direction; a side clamping space is formed between the at least two side clamping pieces; and the side clamping driving unit is used for driving at least one of the at least two side clamping pieces to move along a second direction so as to adjust the side clamping space.

In certain embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transfer device for transferring the first square silicon rod and the second square silicon rod located at the cutting location to the grinding location.

In certain embodiments of the present application, the cutting device comprises: the cutting frame is movably arranged on the base along a first direction; the cutting support is movably arranged on the cutting frame along the vertical direction; the cutting wheels are arranged on the cutting support; and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw.

In certain embodiments of the present application, the cutting device includes a cutting carriage advancing mechanism comprising: the first traveling guide rail is arranged on the base along a first direction and used for arranging the cutting frame; and the first travel driving unit is used for driving the cutting frame to move along the first travel guide rail.

In some embodiments of the present application, the cutting support is movably disposed on the cutting frame via a cutting lift mechanism.

In certain embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises a grooving device, the grooving device comprising: the slotting support is movably arranged on the cutting frame of the cutting device along a second direction; and the grooving grinding wheel is arranged on the grooving support and is used for grooving the periphery of a preset cutting position in the original square silicon rod horizontally placed at the cutting position.

In certain embodiments of the present application, the slotted device includes a slotted bracket translation mechanism, comprising: the translation guide rail is arranged on the cutting frame of the cutting device along a second direction; and the translation driving unit is used for driving the slotted support and at least one slotted grinding wheel on the slotted support to move along a second direction.

In certain embodiments of the present application, the at least one grooved grinding wheel comprises a chamfer grinding rough grinding wheel, a chamfer grinding fine grinding wheel, or a chamfer grinding rough grinding wheel and a chamfer grinding fine grinding wheel disposed in a first direction.

In some embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further includes at least two silicon rod end clamping mechanisms, and the at least two silicon rod end clamping mechanisms are arranged in parallel in the grinding zone of the silicon rod processing platform along the second direction.

In certain embodiments of the present application, the grinding apparatus comprises: the grinding frame is movably arranged on the machine base along a first direction; the grinding support is movably arranged on the grinding frame along a second direction and a vertical direction; and the plane grinding wheel is arranged on the grinding support and is used for carrying out surface grinding operation on the first square silicon rod and the second square silicon rod.

In some embodiments of the present application, the grinding support is movably disposed on the grinding frame via a grinding lift mechanism and movably disposed on the grinding frame via a grinding support translation mechanism.

In some embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further includes a silicon rod transfer device, the silicon rod transfer device is disposed on the grinding frame of the grinding device and moves along a first direction along with the grinding frame; the silicon rod transfer device comprises: the transferring clamp comprises a clamping seat, at least one pair of clamping arms arranged at two opposite ends of the clamping seat and a clamping arm driving mechanism, wherein the at least one pair of clamping arms is provided with a clamping part and a clamping part rotating mechanism; the transfer rotating mechanism is used for driving the transfer clamp to rotate along the vertical direction; the transferring and translating mechanism is used for driving the transferring clamp to move on the grinding frame along a second direction; and the transfer lifting mechanism is used for driving the transfer clamp to lift and move in the vertical direction on the grinding frame.

In some embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises at least two silicon rod end clamping mechanisms, and the at least two silicon rod end clamping mechanisms are arranged in the grinding zone of the silicon rod processing platform along the first direction.

In certain embodiments of the present application, the grinding apparatus comprises: the grinding frame is movably arranged on the machine base along a first direction; the grinding support is movably arranged on the grinding frame along the vertical direction; and the plane grinding wheel is arranged on the grinding support and is used for carrying out surface grinding operation on the first square silicon rod and the second square silicon rod.

In some embodiments of the present application, the grinding support is movably disposed on the grinding frame via a grinding lifting mechanism.

In some embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further includes a silicon rod transfer device, the silicon rod transfer device is disposed on the grinding frame of the grinding device and moves along a first direction along with the grinding frame; the silicon rod transfer device comprises: the transfer clamp comprises a clamping seat, at least one pair of clamping arms arranged at two opposite ends of the clamping seat and a clamping arm driving mechanism, wherein a clamping part and a clamping part rotating mechanism are arranged on the at least one pair of clamping arms; the transferring and rotating mechanism is used for driving the transferring clamp to rotate along the vertical direction; and the transferring lifting mechanism is used for driving the transferring clamp to lift and move in the grinding frame along the vertical direction.

In certain embodiments of the present application, the grinding apparatus includes a grinding carriage travel mechanism comprising: the second advancing guide rail is arranged on the machine base along the first direction and is used for arranging the grinding rack; and the second travelling driving unit is used for driving the grinding rack to move along the second travelling guide rail.

In certain embodiments of the present application, the silicon rod end clamping mechanism comprises: the end part clamps the support; at least two end clamping pieces arranged at two opposite ends of the end clamping support along a first direction; an end clamping space is arranged between the at least two end clamping pieces; an end clamp driving unit for driving at least one of the at least two end clamps to move in a first direction to adjust the end clamp space.

In certain embodiments of the present application, the square silicon rod slicing and grinding all-in-one machine further comprises a silicon rod loading device.

In some embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises a silicon rod carrying device, and the silicon rod carrying device is arranged on the cutting frame of the cutting device and moves along with the cutting frame along the first direction.

In certain embodiments of the present application, the silicon rod handling device comprises: the carrying clamp comprises at least two clamping jaws which can be opened and closed; and the conveying lifting mechanism is used for driving the conveying clamp to lift and move on the cutting frame along the vertical direction.

In certain embodiments of the present application, the square silicon rod cutting and grinding all-in-one machine further comprises a silicon rod unloading device.

The application discloses side silicon rod surely grinds all-in-one, including frame, cutting device and grinder, wherein, cutting device and grinder set up around the first direction, utilize former side silicon rod that cutting device can place the horizontal place forms first side silicon rod and second side silicon rod after dissecting the operation, utilizes grinder can carry out the grinding operation of cutting plane to first side silicon rod and the second side silicon rod that dissects the back formation to accomplish the integration operation to half cutting and grinding multiple operation of former side silicon rod, improve the quality of production efficiency and product processing operation.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which the present application relates will be better understood by reference to the exemplary embodiments and drawings described in detail below. Brief description of the drawingsthe following:

fig. 1 and 2 are schematic views showing the silicon rod slicing and grinding all-in-one machine of the present application at different viewing angles in one embodiment.

Fig. 3 is a top view of an embodiment of a silicon rod slicing and grinding machine according to the present application.

Fig. 4a and 4b are views showing the state of the chamfer grinding rough grinding wheel and the chamfer grinding fine grinding wheel in the grooving apparatus of fig. 3.

Fig. 5 to 10 are schematic views of a state in which the silicon rod slicing and grinding all-in-one machine of the present application is applied.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, the first square silicon rod may be referred to as a second square silicon rod, and similarly, the second square silicon rod may be referred to as a first square silicon rod, and the first direction may be referred to as a second direction, and similarly, the second direction may be referred to as a first direction, without departing from the scope of the various described embodiments.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "a, B or C" or "a, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In order to improve the conversion efficiency of the photovoltaic module, the shingled module is produced. The laminated assembly is characterized in that a plurality of battery pieces are connected in series in a front-back laminated mode, no gap exists between the battery pieces, and no welding strip shields the battery pieces, so that more battery pieces can be accommodated in the same area of the assembly, and the effective power generation area is enlarged. In the related art, to obtain a silicon wafer for manufacturing a tile stack assembly, a silicon rod for slicing and forming the silicon wafer is manufactured, and the silicon rod is usually manufactured by cutting and grinding a square silicon rod manufactured in the prior art again.

In the related art for processing a silicon rod, several steps such as cutting, grinding, rounding, chamfering, and the like are involved.

Generally, most of conventional silicon rods have a cylindrical structure, and the silicon rods are cut by a silicon rod cutting device so that the cross section of the silicon rods after cutting process is similar to a rectangle (including a similar square), while the cut silicon rods are overall similar to a cuboid (including a similar cube). The quasi-rectangle comprises a rectangle with adjacent sides orthogonal or included angles within a preset angle range, a rectangle with round corners between the adjacent sides, a rectangle with short connecting edges between the adjacent sides, and the like.

Taking a single crystal silicon rod as an example, in some related technologies, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the short silicon rod by using a silicon rod cutting machine to form the silicon single crystal rod with the rectangular-like cross section. Among them, patent publications such as CN105856445A, CN105946127A, and CN105196A can be referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section after a cutting operation of an original long silicon rod by using a silicon rod cutting machine, and patent publications such as CN105818285A can be referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section after a cutting operation of a short silicon rod by using a silicon rod cutting machine. However, the process for forming the single crystal silicon rod is not limited to the foregoing techniques, and in an alternative example, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. In the above, for a specific embodiment of forming a long single crystal silicon rod having a quasi-rectangular shape by squaring an original long silicon rod using an all-silicon-rod squaring machine, for example, patent publication No. CN003443A is cited.

After the cylindrical silicon single crystal rod is subjected to squaring and cutting by using the squaring equipment to form the silicon rod with the rectangular-like cross section, the silicon rod with the rectangular-like cross section can be subjected to surface grinding, rounding/chamfering and other operations by using grinding equipment. For a specific implementation manner of the above-mentioned grinding equipment for performing operations such as surface grinding, rounding and chamfering on the quasi-rectangular silicon rod, reference may be made to patent publications such as CN 105835247A.

The inventor of the application finds that in the prior art, no good special equipment for cutting and grinding operation of the silicon rod of the original side exists, but in the existing equipment technology, operation required by each process operation (for example, semi-cutting, grinding and the like) is independently arranged, corresponding processing equipment is dispersed in different production units or different production areas of production workshops, and conversion of workpieces for executing different process operations needs to be carried out and allocated, and pretreatment operation may be required before executing each process operation.

In view of the above, the present application provides a square silicon rod cutting and grinding all-in-one machine, which is used for performing cutting operation on an original silicon rod to form a first silicon rod and a second silicon rod, and the grinding device can perform grinding operation on a cutting surface of the first silicon rod and the second silicon rod formed after cutting, so as to complete integrated operation of multiple processes of half-cutting and grinding on the original silicon rod, and the machine has a simple overall structure, improves production efficiency, saves cost, and improves product processing operation quality.

In the embodiments provided in the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other, wherein the first direction and the second direction can form a horizontal plane, and the third direction is a vertical direction perpendicular to the horizontal plane, which can also be referred to as a vertical direction, a weight line direction, an up-down direction, or a lifting direction.

In any embodiment provided by the present application, the square silicon rod refers to a silicon rod with a cross section shaped like a rectangle formed after a silicon rod with a circular cross section is subjected to cutting, squaring and grinding operations, and the rectangle includes a rectangle with four right angles, a rectangle with folded edges at four corners, a to-be-rounded rectangle, and the like. The end parts of the silicon rods refer to two opposite ends along the length direction of the axis of the silicon rods, the end surfaces of the end parts refer to two opposite surfaces along the length direction of the silicon rods, and the side surfaces of the silicon rods refer to other four surfaces of the silicon rods except the two end surfaces. For example, for a pristine silicon rod, the end of the pristine silicon rod is rectangular-like and the side of the pristine silicon rod is rectangular, the length of the rectangle being dependent on the length of the pristine silicon rod.

In an embodiment, the silicon rod may be, for example, a single crystal silicon rod, i.e., a rod-shaped single crystal silicon grown from a melt by using a czochralski method or a suspension float zone method, such as a single crystal silicon rod with a length of about 5000mm (e.g., 5360mm specification, etc.) or a single crystal silicon rod with a length of about 800mm, which is commonly used in silicon rod processing, or a polysilicon rod, i.e., a silicon rod with silicon deposited on the surface of a silicon core wire by using a deposition technique such as a chemical vapor deposition technique, but is not limited thereto.

The application discloses side silicon rod surely grinds all-in-one includes: the base is provided with a silicon rod processing platform; the silicon rod processing platform comprises a cutting area and a grinding area which are arranged along a first direction; the cutting device is arranged at a cutting position of the silicon rod processing platform; the cutting device comprises at least one cutting wire saw, and the at least one cutting wire saw is used for cutting the original square silicon rod horizontally placed at the cutting position to form a first square silicon rod and a second square silicon rod; the primary silicon rod is a silicon rod with a rectangular-like cross section, and the axis of the primary silicon rod is consistent with the first direction; and the grinding device is arranged at a grinding zone of the silicon rod processing platform and used for grinding cutting surfaces of the first square silicon rod and the second square silicon rod which are horizontally placed at the grinding zone, and the axial lead of the first square silicon rod and the axial lead of the second square silicon rod are consistent with the first direction.

The silicon rod slicing device comprises a cutting device, a grinding device and a cutting device, wherein the cutting device can be used for splitting an original silicon rod into two parts to form a first silicon rod and a second silicon rod, and the grinding device can be used for grinding the cutting surfaces of the first silicon rod and the second silicon rod formed after splitting.

In some embodiments, the slicing operation is a transverse cutting operation, that is, in the cutting device, the at least one cutting wire saw is arranged along the second direction, so that, when the slicing operation is performed by using the cutting device, the original silicon rod is horizontally placed in the cutting area along the first direction with the axis line, the at least one cutting wire saw arranged along the second direction is driven to advance along the first direction, and the transverse cutting operation is performed on the original silicon rod horizontally placed at the cutting area to form the first silicon rod and the second silicon rod which are stacked up and down.

In some embodiments, the slicing operation is a vertical slicing operation, that is, in the cutting device, the at least one cutting wire saw is arranged along the vertical direction, so that when the slicing operation is performed by using the cutting device, the raw silicon rod is horizontally placed in the cutting area along the first direction with the axis line, the at least one cutting wire saw arranged along the vertical direction is driven to advance along the first direction, and the raw silicon rod horizontally placed in the cutting area is vertically sliced to form a first silicon rod and a second silicon rod which are stacked left and right.

In the following examples, the cutting operation will be described in detail by taking the example of the cross cutting operation.

Referring to fig. 1 to 3, fig. 1 and 2 are schematic views showing a cutting and grinding integrated machine of the present application at different viewing angles in one embodiment, and fig. 3 is a top view of the cutting and grinding integrated machine of the present application in one embodiment. As shown in fig. 1 to 3, the silicon rod slicing and grinding all-in-one machine of the present application comprises: a machine base 11, a cutting device 12, a silicon rod transfer device 13 and a silicon rod grinding device 14.

The silicon rod cutting and grinding all-in-one machine of the application is explained in detail below.

The base 11 serves as a main body part of the square silicon rod cutting and grinding all-in-one machine and is used for providing a silicon rod processing platform. In practical application, the size and the weight of the base are both large so as to provide a large mounting surface and firm overall stability. It should be understood that the machine base can be used as a seat body of different structures or components for executing processing operation in the square silicon rod cutting and grinding all-in-one machine, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure, such as a base, a column, a frame body and the like, for receiving different components in the square silicon rod cutting and grinding all-in-one machine.

Also, in some examples, the housing may be a unitary base, and in some examples, the housing may include a plurality of separate bases.

The base is provided with a silicon rod processing platform, and the silicon rod processing platform can be divided into a plurality of functional areas according to the specific operation content of silicon rod processing operation. For example, in certain embodiments, the silicon rod processing platform comprises a cutting section and a grinding section. In certain embodiments, the silicon rod processing platform comprises a cutting section, a grinding section, and an unloading section. In certain embodiments, the silicon rod processing platform comprises a waiting zone, a cutting zone, a grinding zone, and an unloading zone. It should be noted that, in the examples provided in the present application, the functional zone is defined by the stroke path and the range of the processing device at the functional zone, for example, the cutting device of the square silicon rod cutting and grinding all-in-one machine is disposed at the cutting zone, and the range of the cutting zone is the range occupied by the cutting device in the process of completing the cutting operation; similarly, the grinding device of the square silicon rod cutting and grinding all-in-one machine is arranged at the grinding zone bit, and the range of the grinding zone bit is the range occupied by the grinding device in the process of finishing the grinding operation. The shape of the silicon rod processing platform can be determined according to the machine base or can be determined according to the processing requirements of the machine base and the cutting device and the grinding device together. In the embodiment shown in fig. 1 to 3, a silicon rod processing platform is provided on the machine base 1, and the silicon rod processing platform is provided with functional areas such as a waiting area, a cutting area and a grinding area. And the cutting area is provided with a cutting device for performing transverse cutting operation on the original square silicon rod positioned at the cutting area so as to form a first square silicon rod and a second square silicon rod. And the grinding zone is provided with a grinding device for grinding the cutting surface of the silicon rod positioned at the grinding zone.

In the embodiments shown in fig. 1 to 3, each functional region is a strip-shaped arrangement arranged in sequence along a first direction, wherein in the following description, the first direction refers to a length direction of the square silicon rod cutting and grinding integrated machine, and a second direction is perpendicular to the first direction and can form a horizontal plane with the first direction, that is, the second direction refers to a width direction of the square silicon rod cutting and grinding integrated machine. For example, when the square silicon rod cutting and grinding all-in-one machine comprises a cutting area and a grinding area, the cutting area and the grinding area are sequentially arranged along a first direction. When the square silicon rod cutting and grinding all-in-one machine comprises a waiting zone bit, a cutting zone bit, a grinding zone bit and an unloading zone bit, the waiting zone bit, the cutting zone bit, the grinding zone bit and the unloading zone bit are sequentially arranged along a first direction.

The cutting device 12 is arranged at the cutting area of the silicon rod processing platform and is used for transversely cutting the original square silicon rod horizontally placed at the cutting area to form a first square silicon rod and a second square silicon rod which are stacked up and down.

In the present application, the processed workpiece object is a square silicon rod (in the following description, the square silicon rod to be processed is referred to as a primary silicon rod to be distinguished from a subsequent cut-and-ground processed square silicon rod), which has been formed after the related cutting operation and grinding operation, that is, the primary silicon rod is a silicon rod having a quasi-rectangular cross section including a rectangle having four right angles, a rectangle having four corners with folded edges or a to-be-rounded arc, or the like.

In the related art for processing a silicon rod, several steps such as cutting, grinding, rounding, chamfering, and the like are involved.

Generally, most of the conventional silicon rods are cylindrical, and the silicon rods are cut by a silicon rod cutting device so that the silicon rods have a rectangular-like (including a square-like) cross section after cutting, and the cut silicon rods have a rectangular-like (or cubic-like) overall shape. The quasi-rectangle comprises a rectangle with adjacent sides orthogonal or included angles within a preset angle range, a rectangle with round corners between the adjacent sides, a rectangle with short connecting edges between the adjacent sides, and the like.

Taking a single crystal silicon rod as an example, in some related technologies, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the short silicon rod by using a silicon rod cutting machine to form the silicon single crystal rod with the rectangular-like cross section. Among them, as a specific embodiment of forming a multi-stage short silicon rod by cutting an initial long silicon rod using a silicon rod cutting machine, for example, patent publications such as CN105856445A, CN105946127A, and CN105196A are cited, and as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section after cutting a short silicon rod using a silicon rod squarer, patent publications such as CN105818285A are cited. However, the process for forming the single crystal silicon rod is not limited to the foregoing techniques, and in an alternative example, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. Among them, a specific embodiment of the above method for forming a long single crystal silicon rod having a substantially rectangular shape by cutting an initial long silicon rod using an all-silicon-rod cutting machine is disclosed in patent publication No. CN003443A, for example.

After the cylindrical silicon single crystal rod is subjected to squaring and cutting by using the squaring equipment to form the silicon rod with the rectangular-like cross section, the silicon rod with the rectangular-like cross section can be subjected to surface grinding, rounding/chamfering and other operations by using grinding equipment. Specific implementation manners of the grinding equipment for performing operations such as surface grinding, rounding and chamfering on the quasi-rectangular silicon rod can be referred to patent publications such as CN 105835247A.

In addition, the silicon rod cutting operation and the grinding operation can be performed in the same silicon rod processing equipment, for example, a silicon rod cutting and grinding all-in-one machine which can perform the cutting operation and the grinding operation on the silicon rod with a circular cross section at the same time, and finally the original silicon rod described in the present application is formed. For a specific implementation manner of the silicon rod slicing and grinding machine, performing the cutting operation and the grinding operation on the initial silicon rod with a circular cross section to form the original square silicon rod with a similar rectangular cross section, for example, patent publications such as CN112297264A and CN112297263A can be referred to.

Therefore, the primary silicon rod mentioned in the present application has the following characteristics: the cross section of the primary silicon rod is rectangular-like, four sides of the primary silicon rod are subjected to surface grinding treatment, and edge structures (such as edge corners, edge connecting surfaces and the like) of the four sides of the primary silicon rod are subjected to chamfering/rounding treatment.

As shown in the drawings, in the present application, the primary silicon rod is disposed at the cutting location of the silicon rod processing platform in a horizontal manner, and when the primary silicon rod is disposed, the primary silicon rod is disposed along the length direction of the square silicon rod cutting and grinding all-in-one machine, that is, the axis line of the primary silicon rod is consistent with the first direction.

For making the primary silicon rod can be placed firmly in cutting position department, this application side silicon rod surely grinds all-in-one includes silicon rod avris clamping mechanism for press from both sides tight primary silicon rod. As shown in fig. 1 to 3, the square silicon rod cutting and grinding all-in-one machine comprises a silicon rod side clamping mechanism 129 arranged at a cutting position of the silicon rod processing platform.

The silicon rod side clamping mechanism 129 is intended to clamp the side of the stock silicon rod.

The number of the silicon rod side clamping mechanisms 129 may be one or more. For example, in certain embodiments, the number of the silicon rod side-clamping mechanisms may be one, for example, and this one silicon rod side-clamping mechanism is located in the central region of the cutting area for clamping the side of the primary silicon rod at an intermediate position. In certain embodiments, the number of the silicon rod side-clamping mechanisms is two or more, and the plurality of silicon rod side-clamping mechanisms may be sequentially disposed in the cutting region along a first direction for clamping different positions of the side of the primary silicon rod.

In certain embodiments, the silicon rod side clamping mechanism comprises: a side clamping support, at least two side clamping pieces and a side clamping driving unit. As shown in fig. 2, the silicon rod side clamping mechanism 129 may comprise a side clamping support 1291, at least two side clamping members 1292, and a side clamping drive unit 1293.

The lateral clamping support 1291 is fixed to the silicon rod machining platform. The side clamping supports 1291 may serve not only as a base for mounting other components (e.g., the side clamps 1292 and the side clamping drive units 1293), but also as a carrier for the primary silicon rod.

At least two side clamping members 1292 are respectively disposed on opposite sides of the side clamping support 1291 along a second direction. Side clamping spaces are provided between the at least two side clamping members 1292.

The number of side clamps 1292 may be two or more. For example, in some embodiments, the number of side clamps may be, for example, two, forming a pair of side clamps disposed on opposite sides of the side clamp mount in the second direction. In some embodiments, the number of side clamps may be, for example, four, forming two pairs of side clamps, with the two side clamps of either pair of side clamps being disposed on opposite sides of the side clamp mount in the second direction. However, this is not a limitation, and the side clamps may also be arranged in other than pairs, for example, in some embodiments the number of side clamps may be, for example, three, with two of the three side clamps on one side and the other side on the other side.

Also, the dimensions of the side clamps are not limited, and in certain embodiments, the dimensions of each of the side clamps included are the same, e.g., in embodiments where two side clamps are included to form a pair of side clamps or four side clamps are included to form two pairs of side clamps, in certain embodiments, the dimensions of each of the side clamps included may not be exactly the same, e.g., in the previously described embodiments including two sides, the dimensions of the two side clamps may not be the same, and in the previously described embodiments including three side clamps, the dimensions of the two side clamps on the same side may be relatively smaller and the dimensions of the third side clamp on the other side may be relatively larger.

Furthermore, the side clips may be partially movable, i.e. at least one of the sides of the side clip may be designed to be movable, for example, the side clip of one of the two sides of the side clip may be fixed and the side clip of the other side of the side clip may be movable, or both of the two sides of the side clip may be movable. In some embodiments, as illustrated in the two-sided clamp 1292, one of the two-sided clamps is fixed as a backrest and the other side clamp is movable in a second direction. In some embodiments, both side clamping members are movable, both movable in the second direction.

A side clamping drive unit 1293 is provided for driving at least one of the at least two side clamping members 1292 in a second direction to adjust the side clamping space.

As described above, in some embodiments, the first side clamping member of the two side clamping members is fixed as a backrest, and the second side clamping member is movable, so that the second side clamping member can be driven by the side clamping driving unit to move toward the first side clamping member in the second direction to reduce the side clamping space therebetween or move away from the first side clamping member in the second direction to enlarge the side clamping space therebetween. In some embodiments, the two side clamping members are movable, and the side clamping driving unit can drive the two side clamping members to move towards each other along the second direction to reduce the side clamping space between the two side clamping members or move away from each other along the second direction to increase the side clamping space between the two side clamping members.

With respect to the side gripping drive unit, in some embodiments, the side gripping drive unit may comprise a drive cylinder or a drive hydraulic cylinder, for example a drive cylinder, in a fixed arrangement with an extension rod associated with which one or both side gripping members are available. In this manner, the movable (one or both) side clamping members can be driven by the drive cylinder to move in the second direction.

In some embodiments, the side clamping driving unit may include a lead screw and a driving motor, wherein the lead screw is associated with the movable (one or two) side clamping members, and the driving motor drives the lead screw to rotate forward and backward to drive the movable (one or two) side clamping members to move in the second direction. When the two side clamping pieces are movable, the screw rod can be designed into a bidirectional screw rod, the bidirectional screw rod can be called a left-handed screw rod and a right-handed screw rod, one end of the screw rod is a left-handed screw thread, and the other end of the screw rod is a right-handed screw thread. Therefore, the driving motor is used for driving the bidirectional screw rod to rotate forwards and backwards to drive the two side clamping pieces to move in opposite directions or move in opposite directions along the second direction.

The cutting device is arranged at a cutting position of the silicon rod processing platform and used for transversely cutting the original square silicon rod horizontally placed at the cutting position to form a first square silicon rod and a second square silicon rod which are stacked up and down.

In certain embodiments, the cutting device comprises: a cutting frame, a cutting support, a plurality of cutting wheels, and a cutting line. In the embodiment shown in fig. 1 to 3, the cutting device 12 comprises: a cutting frame 121, a cutting support 122, a plurality of cutting wheels 123, and a cutting wire 124, wherein the cutting wire 124 is wound around the plurality of cutting wheels to form at least one cutting wire saw 125. Wherein we can also refer to the combination of the cutting support, the plurality of cutting wheels, and the cutting line as a wire cutting unit.

The cutting frame 121 is movably disposed on the base along a first direction. In the square silicon rod cutting and grinding all-in-one machine, the cutting frame moves relative to the base along a first direction through a cutting frame advancing mechanism.

In some embodiments, the cutting frame advancing mechanism comprises: a first travel rail and a first travel drive unit. As shown, the cutting frame advancing mechanism may include: a first travel rail 1261 and a first travel drive unit.

The first travel rail 1261 is disposed on the base 11 along a first direction, and is used for disposing the cutting frame 121. In practice, the length of the first travel rail 1261 in the first direction covers at least the entire cutting zone to ensure the transfer of the cutting device within the cutting zone.

The first travel driving unit is used for driving the cutting frame 121 to move along the first travel rail 1261. As shown in the drawing, the cutting device is provided with one first traveling driving unit on each of two opposite sides in the second direction, and the cutting frame 121 and the wire cutting unit (e.g., the cutting support 122, the plurality of cutting wheels 123, the cutting wire 124, etc.) provided thereon in the cutting device can be driven to smoothly move along the first traveling rail 1261 by the two first traveling driving units on the two sides.

With respect to the first travel drive unit, in some embodiments, the first travel drive unit comprises: a first travel rack 1262, and a first drive gear 1264 and a first drive motor 1266. The first traveling rack 1262 is disposed on the base along a first direction, and as shown in the figure, the first traveling rack 1262 is disposed on a side of the base 11 along the first direction. The first driving gear 1264 is associated with the cutting frame 121 of the cutting device and is engaged with the first traveling rack 1262, and the first driving motor 1266 is used for driving the first driving gear 1264 to rotate so as to move the associated cutting frame 121 along the first traveling rack 1262. The first drive motor 1266 may be, for example, a servo motor. In order to drive the cutting frame 121 to move smoothly in the first direction, a first traveling rack 1262 is disposed at each of opposite sides of the base in the second direction, and correspondingly, a first driving gear 1264 and a first driving motor 1266 are disposed at each of opposite sides of the cutting frame 121 in the second direction. In practical applications, the first driving gear 1264 driven by the first driving motor 1266 rotates in a forward direction and a reverse direction to drive the first traveling rack 1262 of the cutting frame 121 to move relative to the base 11 along the first direction. For example, the first driving motor 1266 drives the first driving gear 1264 to rotate forward, and drives the first traveling rack 1262 of the cutting frame 121 to move forward along the first direction (the forward movement refers to the movement facing the grinding zone); the first drive motor 1266 drives the first drive gear 1264 in reverse, which drives the first travel rack 1262 in a first direction to move the cutting frame 121 in a rearward direction (rearward movement refers to movement away from the grinding zone location).

In addition, the first travel driving unit may also adopt other structures, for example, in some embodiments, the first travel driving unit may include: the device comprises a first traveling screw rod and a first driving motor. The first advancing screw rod is arranged along a first direction and is associated with a cutting frame of the cutting device, the first driving motor is associated with the first advancing screw rod, and the first advancing screw rod is driven by the first driving motor to rotate forwards and reversely so as to drive a first advancing guide rail of the cutting frame along the first direction to move relative to the machine base. For example, the first driving motor drives the first travelling screw to rotate forward, and drives the cutting frame to move forward along the first travelling guide rail in the first direction (forward movement refers to movement towards the grinding zone location); the first driving motor drives the first travelling wire rod to rotate reversely, and drives the cutting frame to move backwards along the first travelling guide rail in the first direction (the backward movement refers to the movement away from the grinding zone bit).

The cutting support is movably arranged on the cutting frame along the vertical direction. In the square silicon rod cutting and grinding all-in-one machine of the present application, the cutting support 122 is movably disposed on the cutting frame 121 through a cutting lifting mechanism.

In some embodiments, the cutting elevating mechanism may include a first elevating guide rail provided on the cutting frame in a vertical direction, and a first elevating driving unit, which may include a first elevating screw rod associated with the cutting support and a first elevating motor. The first lifting motor and the first lifting screw rod can be used for driving the cutting support to vertically lift and move along the first lifting guide rail. For example, the first lifting motor drives the first lifting screw rod to rotate forwards, and drives the cutting support to vertically lift along the first lifting guide rail; the first lifting motor drives the first lifting screw rod to rotate reversely, and the cutting support is driven to vertically descend and move along the first lifting guide rail. In some embodiments, the cutting lifting mechanism may include a first lifting rail, a first lifting slider, and a first lifting driving unit, wherein the first lifting slider may be disposed on the cutting support and correspond to the first lifting rail, and the structure and function of the first lifting rail and the first lifting driving unit may be referred to in the foregoing description.

In some embodiments, the cutting lifting mechanism may include a first lifting rail and a first lifting driving unit, wherein the first lifting rail is disposed on the cutting frame along the vertical direction, the first lifting driving unit may include a first lifting rack, a first lifting gear and a first lifting motor, the first lifting rack is disposed on the cutting frame along the vertical direction, the first lifting gear is associated with the cutting support and is engaged with the first lifting rack, and the first lifting motor is configured to drive the first lifting gear to rotate so as to lift and move the associated cutting support along the first lifting rack. For example, the first lifting motor drives the first lifting gear to rotate forward, and drives the cutting support to move vertically upwards along the first lifting rack; the first lifting motor drives the first lifting gear to rotate reversely, and the cutting support is driven to vertically descend and move along the first lifting rack.

The cutting support is located to a plurality of cutting wheels, the cutting line wind in a plurality of cutting wheels are in order to form at least one cutting coping saw, at least one cutting coping saw is laid along the second direction.

In some embodiments, the cutting device may further comprise a guide wheel for effecting transitional guidance of the cutting line. The guide wheel may not be limited to one. The guide wheel serves for deflecting or guiding the cutting wire (so that, in general, the guide wheel may also be referred to as deflecting wheel or transition wheel), or else the guide wheel may serve for adjusting the tension of the cutting wire (the guide wheel acting to adjust the tension may also be referred to as tension wheel). Thus, the cutting wire is wound around the plurality of cutting wheels and the wire guide wheel to form at least one cutting wire saw.

In some embodiments, the plurality of cutting wheels and guide wheels are connected to the cutting support, or the plurality of cutting wheels and guide wheels are disposed on the cutting support through a bracket, a connecting plate, or a mounting frame, the cutting support is used as a carrier for associating the plurality of cutting wheels and guide wheels with the cutting support, and the cutting support may be in a form of a beam, a plate frame, a bracket, or the like, which is not limited in this application.

The cutting wheel is provided with at least one cutting line groove for winding cutting lines, and the cutting line groove can limit the position of the cutting lines so as to control the cutting precision. The cutting wire saw is formed between two cutting wheels after the cutting wires are wound on the two cutting wheels which are oppositely arranged, and the positions of the two cutting wheels and the position relation between the cutting wheels can be used for determining the trend of the cutting wire saw.

In practical applications, the cutting device may include at least two cutting wheels, and the two cutting wheels may be combined into one cutting wheel set, i.e., one cutting wheel set is formed by two cutting wheels opposite to each other along the second direction.

The cutting lines are sequentially wound around the cutting wheels to form a cutting line net. In practical application, the cutting wheels are arranged in a manner that the wheel surfaces of the cutting wheels are horizontally placed, and the cutting lines are sequentially wound behind the two cutting wheels to form a cutting fret saw along the second direction.

In some embodiments, the cutting device further comprises a take-up and pay-off unit. For example, the take-up and pay-off unit may include a pay-off reel and a take-up reel, which may be disposed on the base or the cutting frame.

In certain embodiments, the cutting line is wound around the plurality of cutting wheels to form a closed loop of cutting line that is end-to-end. In this case, the cutting device can dispense with a yarn storage drum or the like, and the closed-loop cutting line can be cut by operating the cutting line drive. The closed-loop cutting line can avoid the influence of the acceleration and deceleration processes of the cutting line on the cutting precision in the process of being operated to execute cutting, so that the cutting precision is improved, the problems that the cutting surface is corrugated and the like caused by the operation reversing or the operation speed of the cutting line in the existing cutting mode are solved, and meanwhile, the total length of the cutting line required by the cutting device can be effectively reduced, and the production cost is reduced.

In addition, the cutting device also comprises a cutting line driving device which is used for driving the cutting line to operate so as to cut the silicon rod.

The principle of linear cutting is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of linear cutting is achieved. The string drive is used to carry out the string run.

In some embodiments, the cutting line driving device is a servo motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel or the related guide wheel, so that the cutting line can be driven by the wound cutting wheel to run along the winding direction. Of course, in a particular embodiment, the string drive can also be another drive source, for example a hydraulic motor, only when it is effected to move the string, without this application being restricted thereto.

In certain embodiments, a tension adjustment mechanism is further included in the cutting device. In the process of wire cutting, the tension of the cutting wire influences the yield and the processing precision in cutting, and the tension adjusting mechanism detects the tension and adjusts the tension to enable the tension of the cutting wire to reach a set certain threshold value and keep a constant value or a certain range allowed by taking the constant value as a numerical center in cutting.

In some embodiments, the tension adjustment mechanism is associated with a guide wheel, which in the wire cutting unit simultaneously acts as a tension wheel for the tension adjustment of the cutting wire when the guided traction of the cutting wire is achieved.

The tensioning wheel is used for adjusting the tension of the cutting line, and the line breaking probability of the cutting line can be reduced so as to reduce consumable materials. In open cutting operations, the effect of the cutting line is of great importance, but even the best cutting lines have a limited extension and wear resistance, i.e. the cutting line tapers during continued operation until it is finally pulled apart. Therefore, the existing wire cutting equipment is generally provided with a wire tension compensation mechanism for compensating the extension degree of the cutting wire in the reciprocating motion, and the tensioning wheel is an implementation means.

In some embodiments, taking a tension wheel as an example of the guide wheel, the tension adjusting mechanism at least comprises: a tension sensor, a servo motor and a screw rod; the tension sensor is arranged on the guide wheel, continuously senses the tension value of the cutting line on the guide wheel, and sends out a driving signal when the tension value is smaller than a preset value; the servo motor is electrically connected with the tension sensor and is used for starting to work after receiving a driving signal sent by the tension sensor; one end of the screw rod is connected with the guide wheel, the other end of the screw rod is connected with the servo motor, and the guide wheel is pulled to perform unidirectional displacement when the servo motor works so as to adjust the tension of the cutting line.

In certain embodiments, the tension adjustment mechanism comprises: the tension driving unit is used for driving the connecting rod assembly to actuate so as to drive the guide wheel to generate position change to adjust the tension of the closed loop cutting line.

Of course, the tension adjusting mechanism can be changed in other ways, and is not described in detail herein.

In certain embodiments, the cutting device further comprises: and the distance adjusting mechanism is used for driving the cutting wheels to move relative to the cutting frame along the direction vertical to the wheel surfaces of the cutting wheels. The cutting device can realize the switching of the cutting line between different cutting grooves of the cutting wheel based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or the processing specification) relative to the silicon rod.

In some implementations, the carrier for carrying the cutting wheels and the guide wheels is, for example, a cutting support, the distance adjusting mechanism may be configured to drive the cutting support to move along a perpendicular direction of the wheel surface of the cutting wheel as a whole, and the guide wheels and the cutting wheels jointly follow the cutting support to move along the perpendicular direction (i.e., a vertical direction) of the wheel surface of the cutting wheel, in this state, the cutting wheels and the guide wheels are relatively stationary, i.e., the positional relationship between the guide wheels and the cutting wheels is unchanged. At this time, the distance adjusting mechanism is used for adjusting the cutting position of the at least one wire cutting saw in the at least one wire cutting unit relative to the silicon rod.

In some implementations, each cutting wheel has at least two cutting slots, with different cutting slots being parallel to each other and having a cutting offset between them in the direction of the perpendicular to the wheel face of the cutting wheel. When the distance adjusting mechanism is used for driving a plurality of cutting wheels in the wire cutting unit to move relative to the cutting support, the position of the cutting wire wound on the wire grooves on the cutting wheels can be changed. In certain implementations, multiple cutting wheels may be attached to a carriage, for example, wherein the carriage is movably mounted to the cutting support and is driven by the pitch adjustment mechanism to move in a direction perpendicular to the cutting wheel faces.

When the at least one distance adjusting mechanism is used for changing the cutting line to wind around the cutting line grooves of the plurality of cutting wheels, in an actual scene, the cutting line grooves corresponding to the cutting lines before and after the groove changing can be predetermined, for example, the position of the cutting line before the groove changing is the cutting line groove a1, the cutting line after the groove changing is wound around the cutting line groove a2, the displacement of the at least one distance adjusting mechanism for driving the plurality of cutting wheels to move is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set to the cutting offset between the cutting line groove a1 and the cutting line groove a2, and the distance adjusting mechanism can be used for changing the cutting line from the cutting line groove a1 to the cutting line groove a 2; it should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit are moved in the direction along the perpendicular line of the wheel surfaces of the cutting wheels by the at least one distance adjusting mechanism is the direction in which the cutting wire groove a2 points to the cutting wire groove a1, and the cutting position of the cutting wire saw in space after groove replacement is unchanged, so that the step of further calibrating the positions of the cutting wheels or other components is omitted, the silicon rod can be cut according to the preset cutting amount, and the groove replacement process is simplified.

In some embodiments, the pitch adjustment mechanism comprises: the screw rod is arranged along the orthogonal direction of the wheel surfaces of the cutting wheels and is in threaded connection with the mounting structures of the plurality of cutting wheels; and the screw rod driving source is used for driving the screw rod to rotate. In some embodiments, the pitch adjustment mechanism comprises: the telescopic piece is arranged along the orthogonal direction of the cutting wheel surface and is associated with the mounting structures of the plurality of cutting wheels; and the telescopic piece driving source is used for driving the telescopic piece to do telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel. In some embodiments, the pitch adjustment mechanism comprises: the distance adjusting rack is arranged along the orthogonal direction of the wheel surfaces of the cutting wheels and is associated with the mounting structures of the cutting wheels; the transmission gear is meshed with the distance adjusting rack; and the gear driving source is used for driving the transmission gear to rotate.

In certain embodiments, the cutting device further comprises: and the wire saw adjusting mechanism is used for adjusting the wire length of the cutting wire saw so as to be matched with the part to be cut of the square silicon rod to be cut (namely the end surface of the square silicon rod). For example, when the to-be-cut part of the square silicon rod to be cut is large, the wire length of the cutting wire saw can be increased; when the part to be cut of the square silicon rod to be cut is small, the length of the cutting wire saw can be shortened.

In the embodiment shown in fig. 1 to 3, a grooving operation is performed before the cutting device is used to perform a transverse cutting operation on the original silicon rod horizontally placed at the cutting region.

This application side silicon rod surely grinds all-in-one still includes the fluting device and includes: the slotting device comprises a slotting support and at least one slotting grinding wheel, wherein the slotting support is movably arranged on a cutting frame of the cutting device along a second direction, and the at least one slotting grinding wheel is arranged on the slotting support and is used for slotting the periphery of a preset cutting position in an original square silicon rod horizontally placed at a cutting position.

As shown, the slotting device 15 comprises: a grooved holder 151 and at least one grooved grinding wheel.

The slotted bracket 151 is movably disposed on the cutting frame 121 of the cutting device 12 along a second direction.

In some embodiments, the slotted bracket 151 is movably disposed on the cutting frame 121 of the cutting device 12 in the second direction by a slotted bracket translation mechanism.

In certain embodiments, the slotted bracket translation mechanism may include a translation guide rail 152 and a translation drive unit 154. In some embodiments, the slotted bracket translation mechanism may comprise: a translation guide rail 152, a translation slider 156 corresponding to the translation guide rail 152, and a translation drive unit 154.

The translation guide rail 152 is disposed on the cutting frame 121 of the cutting device 12 along the second direction.

The translation driving unit 154 may include a translation screw rod disposed in the second direction and associated with the slotted bracket, and a translation driving motor associated with the translation screw rod. The translation driving motor is used for driving the translation screw rod to rotate forwards and backwards so as to drive the slotted support 151 and at least one slotted grinding wheel on the slotted support to move left and right along the translation guide rail 152 along a second direction. For example, the translation driving motor drives the translation screw rod to rotate forward, and drives the slotted support 151 and at least one slotted grinding wheel thereon to move leftward along the translation guide rail along a second direction; the translation driving motor drives the translation screw rod to rotate reversely, and drives the slotted support 151 and at least one slotted grinding wheel thereon to move rightwards along the translation guide rail along a second direction.

In some embodiments, the translation driving unit may also include a translation rack disposed along the second direction, a translation gear disposed on the slotted bracket and engaged with the translation rack, and a translation driving motor associated with the translation gear and configured to drive the translation gear to rotate so as to move the associated slotted bracket to the left and right along the translation rack. For example, the translation driving motor drives the translation gear to rotate forwards, and drives the slotted bracket to move leftwards along the translation rack in the second direction; the translation driving motor drives the translation gear to rotate reversely, and drives the slotted support to move towards the right in the second direction along the translation rack.

The at least one grooved grinding wheel is arranged on the grooved support.

In certain embodiments, the at least one grooving grinding wheel comprises a chamfer grinding rough grinding wheel for performing rough grooving operations on the periphery of a predetermined cutting position in a horizontally disposed stock silicon rod at the cutting zone location. In some embodiments, the at least one grooving grinding wheel comprises a chamfer grinding finishing grinding wheel for finishing grooving the periphery of a predetermined cutting position in the horizontally disposed stock silicon rod at the cutting zone location. In some embodiments, the at least one grooving grinding wheel comprises a chamfering grinding rough grinding wheel and a chamfering grinding fine grinding wheel, and is used for performing rough grooving operation and fine grooving operation on the periphery of a predetermined cutting position in the horizontally placed square silicon rod at the cutting zone position. In contrast, the abrasive grain size of the chamfer grinding finish wheel is smaller than that of the chamfer grinding rough wheel, and the abrasive grain density of the chamfer grinding finish wheel is greater than that of the chamfer grinding rough wheel.

Taking the example that the at least one grooving grinding wheel includes a chamfering grinding rough grinding wheel and a chamfering grinding fine grinding wheel, as shown in the drawing, the at least one grooving grinding wheel in the grooving device 15 includes a chamfering grinding rough grinding wheel 153 and a chamfering grinding fine grinding wheel 155,

the chamfering grinding rough grinding wheel 153 and the chamfering grinding fine grinding wheel 155 are arranged in the front and back direction along a first direction, wherein the chamfering grinding rough grinding wheel 153 is arranged in the front, and the chamfering grinding fine grinding wheel 155 is arranged in the back, namely, the chamfering grinding rough grinding wheel 153 is closer to a grinding zone relative to the chamfering grinding fine grinding wheel 155.

In addition, in an embodiment where the at least one grooving grinding wheel includes a chamfering grinding rough grinding wheel and a chamfering grinding fine grinding wheel, the chamfering grinding rough grinding wheel and the chamfering grinding fine grinding wheel are disposed on a mounting structure, and the mounting structure may be coupled to the grooving holder through, for example, a coupling structure, where an axial line of the coupling structure coincides with a vertical direction. By utilizing the switching structure, the chamfering grinding rough grinding wheel and the chamfering grinding fine grinding wheel can be adjusted. For example, referring to fig. 4a and 4b, which are schematic views illustrating states of a chamfering grinding rough grinding wheel and a chamfering grinding fine grinding wheel in the grooving apparatus of fig. 3, with reference to fig. 3, 4a and 4b, when the adapter 150 is rotated counterclockwise, the front chamfering grinding rough grinding wheel 153 may be biased inward and the rear chamfering grinding fine grinding wheel 155 may be biased outward, so that the chamfering grinding rough grinding wheel 153 may be used to perform a rough chamfering grinding operation on the primary silicon rod 100 (as shown in fig. 4 a); when the adaptor 150 rotates clockwise, the former chamfer grinding rough grinding wheel 153 may be biased outward and the latter chamfer grinding fine grinding wheel 155 may be biased inward, so that the chamfer grinding fine grinding wheel 155 may perform a fine chamfer grinding operation on the primary silicon rod 100.

When the grooving operation is performed on the original silicon rod by using the grooving device, firstly, according to the position of the original silicon rod, the cutting support is lifted by the cutting lifting mechanism to adjust the height position of the grooving grinding wheel in the grooving device, and the grooving support of the grooving device is translated by the grooving support translation mechanism along the second direction to adjust the position (i.e. left and right positions) of the grooving grinding wheel in the grooving device in the second direction; then, the cutting frame is driven by a cutting frame advancing mechanism to move towards the original silicon rod at the cutting position along a first direction, in the moving process, the grooving grinding wheel performs grooving operation on one side surface of the original silicon rod, if the grooving grinding wheel comprises a chamfer grinding rough grinding wheel and a chamfer grinding fine grinding wheel, the previous chamfer grinding rough grinding wheel performs rough chamfer grinding operation (namely rough grooving operation) on one side surface of the original silicon rod, and then the subsequent chamfer grinding fine grinding wheel performs fine chamfer grinding operation (namely fine grooving operation) on the one side surface of the original silicon rod; performing grooving operation until the grooving grinding wheel passes through the original silicon rod (covers the length of the original silicon rod in the first direction) and moves out, namely finishing the grooving operation of one side surface of the original silicon rod; then, the cutting frame is driven by the cutting frame advancing mechanism to move away from the original silicon rod at the cutting position along a first direction so as to return to the initial position, the slotting support of the slotting device is translated along a second direction by the slotting support translation mechanism so as to adjust the position (namely, the left and right positions) of the slotting grinding wheel in the slotting device in the second direction, and after the position is adjusted, the grinding wheel is ground by a chamfer angle to correspond to the other side surface of the original silicon rod (for example, the side surface of the original silicon rod on the right side along the second direction); and driving the cutting frame to move towards the original silicon rod at the cutting position along the first direction through the cutting frame advancing mechanism so as to perform slotting operation on the other side surface of the original silicon rod until the slotting grinding wheel moves over the original silicon rod (covers the length of the original silicon rod in the first direction) and moves out, namely completing the slotting operation on the other side surface of the original silicon rod. After the grooving operation of the two side surfaces of the primary silicon rod is completed, the cutting frame is driven by the cutting frame advancing mechanism to move away from the primary silicon rod at the cutting position along the first direction so as to return to the initial position.

When the cutting device is used for transversely cutting the original silicon rod, firstly, the cutting support is lifted through the cutting lifting mechanism to adjust the height position of the cutting wire saw, and after the cutting wire saw is adjusted to the position, the cutting wire saw corresponds to the groove center of a groove formed in the original silicon rod after the grooving operation is performed by the grooving device; and then, driving the cutting frame to move towards the original-direction silicon rod at the cutting position along the first direction through a cutting frame advancing mechanism, in the moving process, enabling the cutting wire saw to contact and enter the end face of the original-direction silicon rod to perform transverse cutting operation, continuously moving the cutting frame and performing transverse cutting operation through the cutting wire saw until the cutting wire saw passes through the original-direction silicon rod (covering the length of the original-direction silicon rod in the first direction) and moves out of the original-direction silicon rod, namely finishing the transverse cutting groove operation of the original-direction silicon rod, and enabling the original-direction silicon rod to form a first-direction silicon rod and a second-direction silicon rod which are stacked up and down after the transverse cutting operation. If the cutting position of the cutting line is exactly the middle position of the original silicon rod in height (that is, the groove formed by the grooving operation of the original silicon rod by the grooving device is exactly the middle position of the original silicon rod in height), the original silicon rod is half-cut into a first silicon rod and a second silicon rod with the same specification through the transverse cutting operation. If the cutting position of the cutting line is not the middle position of the original silicon rod in height, the original silicon rod is cut into a first silicon rod and a second silicon rod with different specifications (different thicknesses in the vertical direction) through the transverse cutting operation. After the transverse cutting operation of the original silicon rod is completed, the cutting frame is driven by the cutting frame advancing mechanism to move away from the cutting position along the first direction so as to return to the initial position.

The grinding device is arranged at a grinding zone of the silicon rod processing platform and is used for grinding cutting surfaces of the first silicon rod and the second silicon rod which are horizontally placed at the grinding zone.

As shown in the figures, in the cutting section, the original silicon rod is cut by the cutting device to form a first silicon rod and a second silicon rod, and in the grinding section, the first silicon rod and the second silicon rod are horizontally disposed at the grinding section of the silicon rod processing platform, and when disposed, the first silicon rod and the second silicon rod are disposed along the length thereof, that is, the axial line of the first silicon rod (i.e., the length direction of the first silicon rod) is consistent with the first direction, and the axial line of the second silicon rod (i.e., the length direction of the second silicon rod) is consistent with the first direction.

In order to enable the first silicon rod and the second silicon rod to be stably placed at the grinding position, the silicon rod cutting and grinding all-in-one machine comprises a silicon rod end part clamping mechanism for clamping the end part of the first silicon rod or the second silicon rod.

As shown in fig. 1 to 3, the square silicon rod cutting and grinding integrated machine includes a silicon rod end clamping mechanism 149, which is disposed in a cutting section of the silicon rod processing platform.

The silicon rod end clamping mechanism 149 is intended to clamp an end of the first or second square silicon rod.

As described above, after the cutting device performs the cross cutting operation on the original square silicon rod horizontally placed at the cutting location, the first square silicon rod and the second square silicon rod which are stacked up and down can be formed, and therefore, the square silicon rod cutting and grinding all-in-one machine can include two silicon rod end clamping mechanisms for clamping the first square silicon rod and the second square silicon rod respectively.

The arrangement of the two silicon rod end clamping devices can be realized in different ways. In certain implementations, the two silicon rod end clamping structures are arranged in parallel at the grinding location of the silicon rod processing platform along the second direction. In certain implementations, the two silicon rod end clamping structures are disposed forward and backward along a first direction at a grinding location of the silicon rod processing platform.

With respect to the silicon rod end clamping mechanism, in certain embodiments, the silicon rod end clamping mechanism comprises: an end clamp support, at least two end clamps, and an end clamp drive unit. As shown in fig. 1 and 2, the silicon rod end clamping mechanism 149 may comprise: an end clamp mount 1491, at least two end clamps 1492, and an end clamp drive unit 1493.

And the end part clamping support 1491 is fixed on the silicon rod processing platform. The end clamp supports 1491 can serve not only as a base part for mounting further components (for example, the end clamps 1492 and the end clamp drive units 1493) but also as a carrier part for the first or second silicon rod.

At least two end clamping members 1492 are provided at opposite ends of the end clamping support 1491 in a first direction. An end clamping space is arranged between the at least two end clamping pieces.

In practical applications, taking two end clamps as an example, the end clamps in the silicon rod end clamping mechanism may be partially movable, i.e., the end clamp arranged at least one end may be designed to be movable, for example, the end clamp disposed at one of the two ends is fixed and the end clamp disposed at the other end is movable, or both the end clamps disposed at the two ends are movable. In some embodiments, taking the two end clamps 1492 as an example, one of the two end clamps is fixed as a cam and the other end clamp is movable in a first direction. In some embodiments, the end clamps are movable, both movable in the first direction.

An end clamp drive unit 1493 is used to drive at least one of the at least two end clamps 1492 to move in a first direction to adjust the end clamp space.

As previously discussed, in some embodiments, a first of the end clamps is fixed as a hill and the second end clamp is movable, and the end clamp drive unit is operable to move the second end clamp in a first direction toward the first end clamp to reduce the end clamp space therebetween or in a first direction away from the first end clamp to expand the end clamp space therebetween. In some embodiments, the end clamps are movable, and the end clamp driving unit can drive the end clamps to move toward each other in a first direction to reduce the end clamping space therebetween or move away from each other in the first direction to enlarge the end clamping space therebetween.

With respect to the end clamp drive unit, in some embodiments, the end clamp drive unit may comprise a drive cylinder or a drive hydraulic cylinder, e.g., a drive cylinder, that is fixedly disposed with a telescoping rod associated with which one or both end clamps are available. In this manner, the drive cylinder may be used to drive the movable end clamp(s) in a first direction.

In some embodiments, the end clamp drive unit may include a lead screw associated with the movable end clamp(s) and a drive motor for driving the lead screw in forward and reverse rotation to drive the movable end clamp(s) in a first direction. When the two end clamping pieces are movable, the screw rod can be designed into a bidirectional screw rod, the bidirectional screw rod can be called a left-handed screw rod and a right-handed screw rod, one end of the bidirectional screw rod is also called a left-handed screw tooth, and the other end of the bidirectional screw rod is called a right-handed screw tooth. Therefore, the driving motor is used for driving the bidirectional screw rod to rotate forwards and backwards so as to drive the two end clamping pieces to move in opposite directions or back to back along the first direction.

The grinding device is arranged at a grinding zone position of the silicon rod processing platform and used for grinding cutting surfaces of a first square silicon rod and a second square silicon rod which are horizontally placed at the grinding zone position, wherein the cutting surfaces refer to surfaces generated when the cutting device transversely cuts the original square silicon rod at the cutting zone position, for the first square silicon rod and the second square silicon rod which are stacked up and down, the cutting surfaces of the first square silicon rod are bottom surfaces which are in contact with the second square silicon rod, and the cutting surfaces of the second square silicon rod are top surfaces which are in contact with the first square silicon rod. The cutting surfaces of the first silicon rod and the second silicon rod are ground, so that the cutting surfaces of the first silicon rod and the second silicon rod meet the requirements of corresponding flatness and dimensional tolerance.

In certain embodiments, the grinding apparatus comprises: a grinding frame, a grinding support and at least one plane grinding wheel. In the embodiment shown in fig. 1 to 3, the grinding device 14 comprises: a grinding frame 141, a grinding support 142, and at least one flat grinding wheel 143, by which the first and second square silicon rods can be ground.

In certain embodiments, the at least one planar grinding wheel may comprise a planar rough grinding wheel, a planar finish grinding wheel, or a combination of a planar rough grinding wheel and a planar finish grinding wheel.

Taking the combination of the rough-grinding-surface grinding wheel and the finish-grinding-surface grinding wheel as an example, in some implementations, the rough-grinding-surface grinding wheel and the finish-grinding-surface grinding wheel are separate components, wherein the rough-grinding-surface grinding wheel and the finish-grinding-surface grinding wheel can be arranged along a first direction, wherein the rough-grinding-surface grinding wheel is arranged in front of the finish-grinding-surface grinding wheel, and the finish-grinding-surface grinding wheel is arranged behind the finish-grinding-surface grinding wheel, i.e., the rough-grinding-surface grinding wheel performs the finish-grinding operation on the finish-grinding surface grinding wheel after the finish-grinding operation on the rough-surface grinding wheel. In certain implementations, the flat rough grinding wheel and the flat finish grinding wheel are nested within one another. For example, the flat rough grinding wheel is nested within the flat finish grinding wheel, or the flat finish grinding wheel is nested within the flat rough grinding wheel.

In view of the difference in the layout arrangement of the first silicon rod and the second silicon rod at the grinding location, the grinding device has different arrangement.

In some embodiments, as shown in fig. 1 to 3, the two silicon rod end clamping structures 149 are arranged side by side in the second direction at the grinding location of the silicon rod processing platform. Correspondingly, in the polishing apparatus 14, the polishing holder 141 is movably disposed on the machine base 11 along a first direction, the polishing support 142 is movably disposed on the polishing holder 141 along a second direction and a vertical direction, and the at least one flat grinding wheel 143 is disposed on the polishing support 142.

In the square silicon rod slicing and grinding all-in-one machine of the present application, the grinding device 14 is moved relative to the machine base 11 in a first direction by a grinding frame advancing mechanism.

In certain embodiments, the grinding carriage travel mechanism comprises: a second travel rail and a second travel drive unit. As shown, the cutting frame advancing mechanism may include: a second travel rail 1441, and a second travel driving unit.

The second moving guide 1441 is disposed on the machine base 11 along a first direction, and is used for disposing the grinding frame 141. In practical applications, the length of the second travel guide 1441 in the first direction at least covers the whole milling area to ensure the transfer of the milling device within the milling area.

The second travel driving unit is used for driving the grinding frame 141 to move along the second travel rail 1441. As shown in the drawing, two opposite sides of the polishing apparatus in the second direction are respectively provided with a second travel driving unit, and the polishing frame 141 and the wire cutting unit (e.g., the polishing support 142, the flat grinding wheel 143, etc.) provided thereon in the polishing apparatus can be driven to smoothly move along the second travel guide 1441 by the two second travel driving units on the two sides.

With respect to the second travel drive unit, in some embodiments, the second travel drive unit includes: a second travel rack 1442, and a second drive gear 1444 and a second drive motor 1446. The second moving rack 1442 is disposed on the base along a first direction, and as shown in the figure, the second moving rack 1442 is disposed on a side of the base 11 along the first direction. The second driving gear 1444 is associated with the grinding carriage 141 of the grinding device and meshes with the second travelling rack 1442, and the second driving motor 1446 is used for driving the second driving gear 1444 to rotate so as to move the associated grinding carriage 141 along the first travelling rack. The second drive motor 1446 may be, for example, a servo motor. In order to drive the grinding frame 141 to move smoothly in the first direction, a second traveling rack 1442 is respectively disposed at opposite sides of the housing in the second direction, and correspondingly, a second driving gear 1444 and a second driving motor 1446 are respectively disposed at opposite sides of the grinding frame 141 in the second direction. In practical applications, the second driving gear 1444 driven by the second driving motor 1446 to rotate forward and backward can drive the second traveling rack 1442 of the grinding rack 141 to move along the first direction relative to the machine base 11. For example, the second driving motor 1446 drives the second driving gear 1444 to rotate forward, and drives the second traveling rack 1442 of the grinding rack 141 to move forward along the first direction (forward movement refers to movement away from the cutting zone); the second driving motor 1446 drives the second driving gear 1444 to rotate reversely, and drives the grinding rack 141 to move backward along the second moving rack 1442 in the first direction (the backward movement refers to a movement facing the cutting zone location).

In addition, the second travel driving unit may also adopt other structures, for example, in some embodiments, the second travel driving unit may include: a second travel screw and a second drive motor. The second travelling screw rod is arranged along the first direction and is associated with the grinding frame 141 of the grinding device, the second driving motor is associated with the second travelling screw rod, and the second travelling screw rod is driven by the second driving motor to rotate forwards and backwards so as to drive the second travelling guide rail of the grinding frame 141 to move along the first direction relative to the machine base. For example, the second driving motor drives the second traveling screw rod to rotate forward, and drives the grinding rack 141 to move forward along the second traveling guide rail in the first direction (forward movement refers to movement away from the cutting zone location); the second driving motor drives the second traveling screw rod to rotate reversely, and drives the grinding frame 141 to move backward along the first traveling rail in the first direction (backward movement refers to movement toward the cutting area).

Further, with respect to the aforementioned cutting frame traveling mechanism and grinding frame traveling mechanism, wherein the cutting frame traveling mechanism has a first traveling rail and a first traveling rack arranged along the first direction, and the grinding frame traveling mechanism has a second traveling rail and a second traveling rack arranged along the first direction, in some implementations, the first traveling rail and the second traveling rail can be merged, that is, a traveling rail arranged along the first direction is arranged on the machine base, and the length of the traveling rail can cover the cutting area and the grinding area, wherein the section of the traveling rail in the range of the cutting area serves as the first traveling rail, and the section of the traveling rail in the range of the grinding area serves as the second traveling rail. Likewise, the first traveling rack and the second traveling rack can be combined, that is, a traveling rack along the first direction is arranged on the machine base, and the length of the traveling rack can cover the cutting zone and the grinding zone, wherein the section of the traveling rack in the range of the cutting zone serves as the first traveling rack, and the section of the traveling rack in the range of the grinding zone serves as the second traveling rack.

In addition, the grinding-stand traveling mechanism may also adopt other structures, for example, the second traveling driving unit in the grinding-stand traveling mechanism may include: a second travel screw and a second drive motor. The second travelling screw rod is arranged along the first direction and is associated with the grinding frame of the grinding device, the second driving motor is associated with the first travelling screw rod, and the second driving motor drives the second travelling screw rod to rotate forwards and backwards to drive the second travelling guide rail of the grinding frame to move relative to the machine base along the first direction. For example, the second driving motor drives the second travelling screw rod to rotate forward, and drives the grinding frame to move forward along a second travelling guide rail in the first direction (forward movement refers to movement away from the cutting area); the second driving motor drives the second advancing screw rod to rotate reversely, and drives the grinding frame to move backwards along a second advancing guide rail in the first direction ((the backward movement refers to the movement facing the cutting area).

As shown, the grinding support 142 is movably disposed on the grinding frame via a grinding lifting mechanism 145 and movably disposed on the grinding frame 141 via a grinding support translation mechanism 146. As shown in fig. 1, the polishing support 142 is configured with a polishing lifting mechanism 145 and a polishing support translation mechanism 146 via an adapter structure (e.g., adapter plate, adapter frame, etc.).

In some embodiments, the grinding lifting mechanism may include a second lifting rail provided on the grinding shelf (or the adapting structure) in a vertical direction, and a second lifting driving unit, which may include a second lifting screw and a second lifting motor, the second lifting screw being associated with the grinding support. The second lifting motor and the second lifting screw rod can drive the grinding support to vertically lift and move along the second lifting guide rail. For example, the second lifting motor drives the second lifting screw rod to rotate forward, and drives the grinding support to vertically lift along the second lifting guide rail; and the second lifting motor drives the second lifting screw rod to rotate reversely, and drives the grinding support to vertically descend and move along the second lifting guide rail. In some embodiments, the grinding elevating mechanism may include a second elevating guide rail, a second elevating slider, and a second elevating driving source, wherein the second elevating slider may be disposed on the grinding support and correspond to the second elevating guide rail, and the structure and function of the second elevating guide rail and the second elevating driving source may be referred to in the foregoing description.

In some embodiments, the grinding elevating mechanism may include a second elevating rail and a second elevating driving unit, wherein the second elevating rail is disposed on the grinding rack (or the adapting structure) along the vertical direction, the second elevating driving unit may include a second elevating rack, a second elevating gear and a second elevating motor, the second elevating rack is disposed on the grinding rack (or the adapting structure) along the vertical direction, the second elevating gear is associated with the grinding support and is engaged with the second elevating rack, and the second elevating motor is configured to drive the second elevating gear to rotate so as to enable the associated grinding support to move up and down along the second elevating rack. For example, the second lifting motor drives the second lifting gear to rotate forward, and drives the grinding support to move vertically upwards along the second lifting rack; and the second lifting motor drives the second lifting gear to rotate reversely, so as to drive the grinding support to vertically descend and move along the second lifting rack.

In certain embodiments, the grinding carriage translation mechanism may include a translation guide and a translation drive unit. In some embodiments, the grinding carriage translation mechanism may include a translation rail, a translation slide corresponding to the translation rail, and a translation drive unit. The translation guide rail is arranged on a grinding frame of the grinding device along a second direction. The translation sliding block can be arranged on the grinding support (or the switching structure) and corresponds to the translation guide rail.

In certain embodiments, the translation drive unit may include a translation screw disposed along the second direction and associated with the grinding support (or adapter structure), and a translation drive motor associated with the translation screw. And the translation driving motor is used for driving the translation screw rod to rotate forwards and backwards so as to drive the grinding support (or the switching structure) and at least one plane grinding wheel on the grinding support to move left and right along the translation guide rail along the second direction. For example, the translation driving motor drives the translation screw rod to rotate forward, and drives the grinding support (or the switching structure) and at least one plane grinding wheel thereon to move leftward along the translation guide rail along the second direction; the driving motor drives the translation screw rod to rotate reversely, and drives the grinding support and at least one plane grinding wheel on the grinding support to move rightwards along the translation guide rail along the second direction.

In some embodiments, the translation driving unit may also include a translation rack disposed along the second direction, a translation gear disposed on the grinding support (or the adapter structure) and engaged with the translation rack, and a translation driving motor associated with the translation gear for driving the translation gear to rotate so as to move the associated grinding support (or the adapter structure) to the left and right along the translation rack. For example, the translation driving motor drives the translation gear to rotate forward, and drives the grinding support (or the switching structure) to move towards the left in the second direction along the translation rack; the translation driving motor drives the translation gear to rotate reversely, and drives the grinding support (or the switching structure) to move towards the right in the second direction along the translation rack.

In certain embodiments, the two silicon rod end clamping means are arranged in a first direction in front of and behind the grinding zone of the silicon rod processing platform. Correspondingly, in the grinding device, the grinding frame is movably arranged on the machine base along a first direction, the grinding support is movably arranged on the grinding frame along a vertical direction, and the at least one plane grinding wheel is arranged on the grinding support.

In the square silicon rod cutting and grinding all-in-one machine, the grinding device moves relative to the machine base along a first direction through a grinding frame advancing mechanism.

In certain embodiments, the grinding carriage travel mechanism comprises: a second travel rail and a second travel drive unit.

The second advancing guide rail is arranged on the machine base along the first direction and used for arranging the grinding frame. In practical applications, the length range of the second traveling guide rail in the first direction at least covers the whole grinding zone, so as to ensure the transfer of the grinding device in the grinding zone.

The second travelling driving unit is used for driving the grinding rack to move along the second travelling guide rail. As shown in the figure, two opposite sides of the grinding device along the second direction are respectively provided with a second travelling driving unit, and the grinding frame and the wire cutting unit (such as a grinding support, a plane grinding wheel and the like) arranged on the grinding frame in the grinding device can be driven to smoothly move along the second travelling guide rail through the two second travelling driving units on the two sides.

With respect to the second travel drive unit, in some embodiments, the second travel drive unit includes: a second travel rack, and a second drive gear and a second drive motor. The second advancing rack is arranged on the base along a first direction, and as shown in the figure, the second advancing rack is arranged on the side of the base along the first direction. The second driving gear is associated with the grinding rack of the grinding device and meshed with the second travelling rack, and the second driving motor is used for driving the second driving gear to rotate so as to enable the associated grinding rack to move along the first travelling rack. The second drive motor may be, for example, a servo motor. In order to drive the grinding frame to move along the first direction smoothly, a second advancing rack is respectively arranged on two opposite sides of the machine base along the second direction, and correspondingly, a second driving gear and a second driving motor are respectively arranged on two opposite sides of the grinding frame along the second direction. In practical application, the second driving gear is driven by the second driving motor to rotate positively and negatively so as to drive the second travelling rack of the grinding rack to move along the first direction relative to the machine base. For example, the second driving motor drives the second driving gear to rotate forward, and drives the second traveling rack of the grinding rack to move forward along the first direction (the forward movement refers to the movement away from the cutting zone location); the second driving motor drives the second driving gear 1444 to rotate reversely, and drives the grinding rack to move backwards along the second traveling rack in the first direction (backwards movement refers to movement facing the cutting zone).

In addition, the second travel drive unit may also take other configurations, for example, in some embodiments, the second travel drive unit may include: a second travel screw and a second drive motor. The second advancing screw rod is arranged along the first direction and is associated with the grinding frame of the grinding device, the second driving motor is associated with the second advancing screw rod, and the second advancing screw rod is driven by the second driving motor to rotate forwards and backwards so as to drive the second advancing guide rail of the grinding frame to move along the first direction relative to the machine base. For example, the second driving motor drives the second travelling screw rod to rotate forward, and drives the grinding frame to move forward along a second travelling guide rail in the first direction (forward movement refers to movement away from the cutting area); the second driving motor drives the second travelling screw rod to rotate reversely, and drives the grinding frame to move backwards along the first travelling guide rail in the first direction (the backward movement refers to the movement facing a cutting area).

Further, with respect to the aforementioned cutting frame traveling mechanism and grinding frame traveling mechanism, wherein the cutting frame traveling mechanism has a first traveling rail and a first traveling rack arranged along the first direction, and the grinding frame traveling mechanism has a second traveling rail and a second traveling rack arranged along the first direction, in some implementations, the first traveling rail and the second traveling rail can be merged, that is, a traveling rail arranged along the first direction is arranged on the machine base, and the length of the traveling rail can cover the cutting area and the grinding area, wherein the section of the traveling rail in the range of the cutting area serves as the first traveling rail, and the section of the traveling rail in the range of the grinding area serves as the second traveling rail. Likewise, the first travelling rack and the second travelling rack can be combined, that is, a travelling rack along the first direction is arranged on the machine base, and the length of the travelling rack can cover the cutting area and the grinding area, wherein the section of the travelling rack in the range of the cutting area is used as the first travelling rack, and the section of the travelling rack in the range of the grinding area is used as the second travelling rack.

In addition, the grinding-stand traveling mechanism may also adopt other structures, for example, the second traveling driving unit in the grinding-stand traveling mechanism may include: a second travel screw and a second drive motor. The second travelling screw rod is arranged along a first direction and is associated with a grinding frame of the grinding device, the second driving motor is associated with the first travelling screw rod, and the second driving motor drives the second travelling screw rod to rotate forwards and backwards to drive a second travelling guide rail of the grinding frame to move relative to the machine base along the first direction. For example, the second driving motor drives the second travelling screw rod to rotate forwards, and drives the grinding frame to move forwards along a second travelling guide rail in the first direction (the forward movement refers to the movement away from the cutting area); the second driving motor drives the second advancing screw rod to rotate reversely, and drives the grinding frame to move backwards along a second advancing guide rail in the first direction ((the backward movement refers to the movement facing the cutting area).

In the square silicon rod cutting and grinding all-in-one machine, the grinding support is movably arranged on the grinding frame through a grinding lifting mechanism.

In some embodiments, the grinding lifting mechanism may include a second lifting rail and a second lifting driving unit, wherein the second lifting rail is disposed on the grinding frame along the vertical direction, and the second lifting driving unit may include a second lifting screw and a second lifting motor, and the second lifting screw is associated with the grinding support. The second lifting motor and the second lifting screw rod can drive the grinding support to vertically lift and move along the second lifting guide rail. For example, the second lifting motor drives the second lifting screw rod to rotate forward, so as to drive the grinding support to vertically move upwards along the second lifting guide rail; and the second lifting motor drives the second lifting screw rod to rotate reversely, so as to drive the grinding support to vertically descend and move along the second lifting guide rail. In some embodiments, the lapping lifting mechanism may include a second lifting rail, a second lifting slider, and a second lifting driving source, wherein the second lifting slider may be disposed on the lapping carrier and correspond to the second lifting rail, and the structures and functions of the second lifting rail and the second lifting driving source may be referred to in the foregoing description.

In some embodiments, the grinding lifting mechanism may include a second lifting rail and a second lifting driving unit, wherein the second lifting rail is disposed on the grinding rack along the vertical direction, the second lifting driving unit may include a second lifting rack, a second lifting gear and a second lifting motor, the second lifting rack is disposed on the grinding rack along the vertical direction, the second lifting gear is associated with the grinding support and engaged with the second lifting rack, and the second lifting motor is configured to drive the second lifting gear to rotate so as to lift and move the associated grinding support along the second lifting rack. For example, the second lifting motor drives the second lifting gear to rotate forward, and drives the grinding support to move vertically upwards along the second lifting rack; and the second lifting motor drives the second lifting gear to rotate reversely, so as to drive the grinding support to vertically descend and move along the second lifting rack.

In this application, square silicon rod surely grinds all-in-one still includes silicon rod transfer device for will be located first party silicon rod and the second party silicon rod of cutting position department are transported according to the preface extremely grind the position.

In the embodiment shown in fig. 1 to 3, the silicon rod transfer device 13 is disposed on the grinding rack 141 of the grinding device 14, and moves along a first direction with the grinding rack 141.

In some embodiments, the two silicon rod end clamping structures are arranged at the grinding location of the silicon rod processing platform side by side in the second direction. Correspondingly, the silicon rod transfer device 13 comprises: the transfer clamp 131 comprises a clamp seat 1311, at least one pair of clamping arms 1312 arranged at two opposite ends of the clamp seat 1311 and a clamping arm driving mechanism, wherein a clamping part and a clamping part rotating mechanism are arranged on the at least one pair of clamping arms 1312; a transfer rotation mechanism 132 for driving the transfer jig 131 to rotate in the vertical direction; the transfer translation mechanism 133 is used for driving the transfer clamp 131 to move on the grinding rack 141 along a second direction; the transferring and lifting mechanism 134 is used for driving the transferring clamp 131 to vertically move on the grinding frame 141.

The clamping arm driving mechanism is used for driving at least one clamping arm in the at least one pair of clamping arms to move so as to adjust the clamping distance between the pair of clamping arms.

In certain embodiments, the clamp arm drive mechanism may comprise: the screw rod is arranged along the length direction of the clamping seat and is associated with at least one clamping arm in the pair of clamping arms; and the driving source is used for driving the screw rod to rotate so as to enable the associated at least one clamping arm to move along the length direction of the clamping seat.

In certain embodiments, the clamp arm drive mechanism may comprise: the two-way screw rod is arranged along the length direction of the clamping seat and is connected with the pair of clamping arms at two ends; and the driving source is used for driving the bidirectional screw rod to rotate so as to enable the pair of clamping arms to move in the first direction in a face-to-face mode or move in a back-to-back mode.

The clamping arm driving mechanism is not limited to the above structure, and the clamping arm driving mechanism can also adopt structures such as a telescopic rod, a driving cylinder or a driving hydraulic cylinder.

And two clamping arms in the pair of clamping arms are provided with clamping parts. In this application, the clamping part is of a rotary design, for example, the transfer clamp further comprises a clamping part rotating mechanism for driving the clamping part on the clamping arm in the transfer clamp to rotate.

In some embodiments, the clamping portion of the clamping arm can be driven to rotate by a clamping portion rotating mechanism, and the silicon rod to be clamped rotates along a certain axis (the axis can be the clamping center of the clamping portion). For example, the rotary drive source is associated with at least one of the two clamping portions provided on the two clamping arms, for example, the rotary drive source is associated with one of the clamping portions. The rotary drive source may be, for example, a rotary motor. The rotating motor is used for driving the associated clamping part to rotate, so that the clamped first silicon rod or the clamped second silicon rod can be driven to rotate, and the side surface of the clamped first silicon rod or the clamped second silicon rod can be adjusted.

In some embodiments, the clamping portion has a multi-point contact type clamping head

The transferring and rotating mechanism is used for driving the transferring clamp to rotate along the vertical direction. In some embodiments, the transfer rotation mechanism may include a rotation drive source with a rotating shaft, which may be, for example, a rotation motor, associated with the holder of the transfer fixture. By means of the transfer rotating mechanism, the transfer fixture can be driven to adjust the position, for example, the clamping seat of the transfer fixture can be switched between the first direction and the second direction, so that (the axis line of) the first silicon rod or the second silicon rod clamped by the transfer fixture can be switched between the first direction and the second direction.

The transfer translation mechanism is used for driving the transfer clamp to move in the grinding frame along a second direction.

In certain embodiments, the transfer translation mechanism may include a transfer translation rail and a transfer translation drive unit. In some embodiments, the transfer translation mechanism may include a transfer translation rail, a transfer translation slider corresponding to the transfer translation rail, and a transfer translation drive unit.

The transfer translation guide rail is arranged on the grinding frame of the grinding device along the second direction.

The transfer translation sliding block is arranged on the transfer clamp and corresponds to the transfer translation guide rail.

In certain embodiments, the transport translation drive unit may include: transport the translation rack and transport the translation gear and transport translation driving motor, transport the translation rack and lay in along the second direction the cutting frame, transport the translation gear and locate transport on the anchor clamps and with transport translation rack toothing, transport translation driving motor and be used for the drive transport translation gear revolve so that the transport anchor clamps of relevance remove along transporting the translation rack. For example, the transfer translation driving motor drives the transfer translation gear to rotate forward, and drives the transfer fixture to move leftward along the transfer translation rack in the second direction; the transfer translation driving motor drives the transfer translation gear to rotate reversely, and the transfer clamp is driven to move towards the right along the second direction along the transfer translation rack.

In some embodiments, the transfer translation drive unit may comprise a transfer translation screw arranged along the second direction and associated with the transfer gripper, and a transfer translation drive motor associated with the transfer translation screw. And driving the transfer translation screw rod to rotate forwards and backwards by utilizing the transfer translation driving motor so as to drive the transfer clamp to move left and right along the transfer translation guide rail along the second direction. For example, the transfer translation driving motor drives the transfer translation screw rod to rotate forward, and drives the transfer clamp to move leftward along the transfer translation guide rail along the second direction; the transfer translation driving motor drives the transfer translation screw rod to rotate reversely, and the transfer clamp is driven to move rightwards along the second direction along the transfer translation guide rail.

The transferring and lifting mechanism is used for driving the transferring clamp to lift and move in the grinding frame along the vertical direction.

In some embodiments, the transfer lifting mechanism may include a transfer lifting rail provided on the grinding stand in a vertical direction and a transfer lifting driving unit, which may include a transfer lifting screw associated with the transfer jig and a transfer lifting motor. Utilize transport elevator motor and transport lift lead screw can drive transport anchor clamps along transport lift guide makes vertical elevating movement. For example, the transferring lifting motor drives the transferring lifting screw rod to rotate forwards, and drives the transferring clamp to vertically move upwards along the transferring lifting guide rail; transport elevator motor drive transport the reversal of lift lead screw, the drive transport anchor clamps along transport elevating guide does vertical decline and removes. In some embodiments, the transfer lifting mechanism may include a transfer lifting rail, a transfer lifting slider, and a transfer lifting driving unit, wherein the transfer lifting slider may be disposed on the transfer fixture and corresponding to the transfer lifting rail, and the structure and function of the transfer lifting rail and the transfer lifting driving unit may be as described above.

When the silicon rod transfer device shown in fig. 1 to 3 is used for transferring a first silicon rod and a second silicon rod at a cutting position to a grinding position, a grinding frame advancing mechanism is used for driving a grinding frame and a silicon rod transfer device thereon to move to the cutting position along a first direction; driving the transferring clamp to rotate along the vertical direction by using a transferring and rotating mechanism, so that the transferring clamp rotates from the second direction to the first direction; the transfer lifting mechanism is used for descending the transfer clamp, and the clamp arm driving mechanism is used for driving the clamp arm in the transfer clamp to move so as to clamp the two opposite ends of the first square silicon rod above the first square silicon rod and the second square silicon rod which are stacked up and down; the transferring clamp is lifted by using the transferring lifting mechanism, and the grinding frame advancing mechanism is used for driving the grinding frame and the silicon rod transferring device on the grinding frame to move to a grinding position along a first direction; driving the transferring clamp to move on the grinding frame along a second direction by using a transferring translation mechanism and driving the transferring clamp to rotate along a vertical direction by using a transferring rotation mechanism so that the transferring clamp is rotated from a first direction to a second direction, and at the moment, enabling the position of the transferring clamp to correspond to a first silicon rod end clamping structure at a grinding position; the transfer lifting mechanism is used for descending the transfer clamp, the clamp arm in the transfer clamp is driven to move through the clamp arm driving mechanism, and the first silicon rod is placed on the first silicon rod end portion clamping structure. It should be noted that, for the square silicon rod after the transverse cutting, the surface to be ground in the grinding area is the cutting surface for performing the transverse cutting operation in the cutting area, so that, for the first silicon rod, the cutting surface is the bottom surface thereof, and therefore, before the first silicon rod is placed on the first silicon rod end clamping structure, the bottom surface of the first silicon rod needs to be turned up. In the present embodiment, the clamping part rotating mechanism is used to drive the clamping part to rotate, for example, 180 °, and the cut surface of the first silicon rod which is originally located at the bottom is turned over to be called as the top. The turning operation may be performed when the cutting section is just clamping the first silicon rod or when the transfer fixture is moved to the grinding section before the first silicon rod end clamping structure, which is not limited to this.

Subsequently, transferring the second square silicon rod, and driving the grinding frame and the silicon rod transfer device on the grinding frame to move to a cutting position along the first direction by using the grinding frame advancing mechanism; driving the transferring clamp to rotate along the vertical direction by using a transferring and rotating mechanism, so that the transferring clamp rotates from the second direction to the first direction; the transfer lifting mechanism is used for descending the transfer clamp, and the clamp arm driving mechanism is used for driving the clamp arm in the transfer clamp to act so as to clamp the two opposite ends of the remaining second silicon rod; the transferring clamp is lifted by using the transferring lifting mechanism, and the grinding frame travelling mechanism is used for driving the grinding frame and the silicon rod transferring device on the grinding frame to move to a grinding position along a first direction; driving the transferring clamp to move on the grinding frame along the second direction by using a transferring translation mechanism and driving the transferring clamp to rotate along the vertical direction by using a transferring rotation mechanism so as to enable the transferring clamp to rotate along the second direction from the first direction, wherein the position of the transferring clamp can be enabled to correspond to a second silicon rod end clamping structure at the grinding position; and the transferring clamp descends by using the transferring lifting mechanism, and the clamping arms in the transferring clamp are driven to move by the clamping arm driving mechanism, so that the first silicon rod is placed on the end part clamping structure of the second silicon rod. Because the cutting surface of the second square silicon rod is essentially on top, the second square silicon rod does not need to be turned over.

In certain embodiments, the two silicon rod end clamping means are arranged in a first direction in front of and behind the grinding zone of the silicon rod processing platform. Correspondingly, the silicon rod transfer device comprises: the transfer clamp comprises a clamping seat, at least one pair of clamping arms arranged at two opposite ends of the clamping seat and a clamping arm driving mechanism, wherein a clamping part and a clamping part rotating mechanism are arranged on the at least one pair of clamping arms; the transfer rotating mechanism is used for driving the transfer clamp to rotate along the vertical direction; and the transfer lifting mechanism is used for driving the transfer clamp to lift and move in the vertical direction on the grinding frame.

The clamping arm driving mechanism is used for driving at least one clamping arm in the at least one pair of clamping arms to move so as to adjust the clamping distance between the pair of clamping arms.

In certain embodiments, the clamp arm drive mechanism may comprise: the screw rod is arranged along the length direction of the clamping seat and is associated with at least one clamping arm in the pair of clamping arms; and the driving source is used for driving the screw rod to rotate so as to enable the associated at least one clamping arm to move along the length direction of the clamping seat.

In certain embodiments, the clamp arm drive mechanism may comprise: the two-way screw rod is arranged along the length direction of the clamping seat and is connected with the pair of clamping arms at two ends; and the driving source is used for driving the bidirectional screw rod to rotate so as to enable the pair of clamping arms to move towards or away from each other along the first direction.

The clamping arm driving mechanism is not limited to the above structure, and the clamping arm driving mechanism can also adopt a telescopic rod and a driving cylinder or a driving hydraulic cylinder and the like.

And two clamping arms in the pair of clamping arms are provided with clamping parts. In this application, the clamping part is of a rotary design, for example, the transfer clamp further comprises a clamping part rotating mechanism for driving the clamping part on the clamping arm in the transfer clamp to rotate.

In some embodiments, the clamping portion of the clamping arm can be driven to rotate by a clamping portion rotating mechanism, and the clamped silicon rod rotates along a certain axis (the axis can be the clamping center of the clamping portion). For example, the rotary drive source is associated with at least one of the two clamping portions provided on the two clamping arms, for example, the rotary drive source is associated with one of the clamping portions. The rotation drive source may be, for example, a rotary motor. The rotating motor is utilized to drive the associated clamping part to rotate, so that the clamped first square silicon rod or the clamped second square silicon rod can be driven to rotate, and the side surface of the clamped first square silicon rod or the clamped second square silicon rod can be adjusted.

In some embodiments, the clamping portion has a multi-point contact type clamping head

The transferring and rotating mechanism is used for driving the transferring clamp to rotate along the vertical direction.

In some embodiments, the transfer rotation mechanism may include a rotation drive source, such as a rotation motor, with a shaft associated with the holder of the transfer fixture. By means of the transfer rotating mechanism, the transfer fixture can be driven to adjust the position, for example, so that the clamping seat of the transfer fixture is switched between the first direction and the second direction, so that (the axial center line of) the first silicon rod or the second silicon rod clamped by the transfer fixture is switched between the first direction and the second direction.

The transferring and lifting mechanism is used for driving the transferring clamp to lift and move in the grinding frame along the vertical direction.

In some embodiments, the transfer lifting mechanism may include a transfer lifting rail provided on the grinding stand in a vertical direction and a transfer lifting driving unit, which may include a transfer lifting screw associated with the transfer jig and a transfer lifting motor. Utilize transport elevator motor and transport lift lead screw can drive transport anchor clamps along transport lift guide makes vertical elevating movement. For example, the transferring lifting motor drives the transferring lifting screw rod to rotate forwards, and drives the transferring clamp to vertically move upwards along the transferring lifting guide rail; the transportation lifting motor drives the transportation lifting screw rod to rotate reversely, and the transportation clamp is driven to move along the transportation lifting guide rail to vertically descend. In some embodiments, the transfer lifting mechanism may include a transfer lifting rail, a transfer lifting slider, and a transfer lifting driving source, wherein the transfer lifting slider may be disposed on the transfer fixture and corresponding to the transfer lifting rail, and the structure and function of the transfer lifting rail and the transfer lifting driving source may be as described above.

Subsequently, the grinding device can be used for grinding the cutting surfaces of the first silicon rod and the second silicon rod, namely, the grinding device is used for grinding the cutting surfaces of the first silicon rod and the second silicon rod through a plane grinding wheel in the grinding device.

After the grinding operation of the cutting surface is finished, the cutting surface of the first square silicon rod is ground, and the edge connecting surface adjacent to the cutting surface is also subjected to chamfering/rounding treatment, and the cutting surface of the second square silicon rod is ground, and the edge connecting surface adjacent to the cutting surface is also subjected to chamfering/rounding treatment.

In the silicon rod cutting and grinding all-in-one machine of the application, a silicon rod unloading device 16 is further included. The silicon rod unloading device is, for example, a conveyer belt device, and comprises a conveyer belt, the conveyer belt is wound on two conveyer rollers which are arranged oppositely in front and back, at least one conveyer roller of the two conveyer rollers is connected with a conveyer driving source, and the driving source can be, for example, a servo motor. The first silicon rod and the second silicon rod which finish the grinding operation of the cutting surface can be unloaded by utilizing the silicon rod unloading device.

In the silicon rod cutting and grinding all-in-one machine of the application, a silicon rod loading device 17 is further included. The silicon rod loading device is, for example, a conveyor belt device, and comprises a conveyor belt wound on two conveying rollers arranged oppositely in front and back, at least one of the two conveying rollers is connected with a conveying driving source in a rolling mode, and the driving source can be, for example, a servo motor. By using the silicon rod unloading device, the original silicon rod can be loaded.

In this application side silicon rod surely grinds all-in-one, still include silicon rod handling device 18 for carry former side silicon rod extremely silicon rod processing platform's cutting position.

In certain embodiments, the silicon rod handling device 18 is disposed on the cutting frame 121 of the cutting device 12, and moves with the cutting frame 121 in a first direction.

The silicon rod handling device includes: a carrying clamp 181, which comprises at least two clamping jaws capable of opening and closing; and the conveying lifting mechanism 182 is used for driving the conveying clamp to lift and move on the cutting frame along the vertical direction.

The conveying lifting mechanism is used for driving the conveying clamp to lift and move on the cutting frame along the vertical direction.

In some embodiments, the handling lifting mechanism may include a transfer lifting rail provided on the cutting frame in a vertical direction, and a transfer lifting driving unit, which may include a transfer lifting screw associated with the handling jig and a transfer lifting motor. Utilize transport elevator motor and transport lift lead screw can drive transport anchor clamps along transport riser guide does vertical elevating movement. For example, the transfer lifting motor drives the transfer lifting screw rod to rotate forwards, and drives the conveying clamp to move vertically upwards along the transfer lifting guide rail; the transportation lifting motor drives the transportation lifting screw rod to rotate reversely, and the transportation clamp is driven to move along the transportation lifting guide rail to vertically descend. In some embodiments, the transporting lifting mechanism may include a transporting lifting rail, a transporting lifting slider, and a transporting lifting driving unit, wherein the transporting lifting slider may be disposed on the transporting fixture and corresponding to the transporting lifting rail, and the structure and function of the transporting lifting rail and the transporting lifting driving unit may be as described above.

Furthermore, in the silicon rod cutting and grinding all-in-one machine of the present application, in an optional embodiment, a silicon rod cleaning device may be further included. The silicon rod cleaning device can be arranged on the base and used for cleaning the silicon rod. In the silicon rod cleaning apparatus, generally, after the silicon rod is subjected to the above-described processing operation, cutting scraps generated during the processing operation adhere to the surface of the silicon rod, and thus, the silicon rod needs to be cleaned as necessary. Generally, the silicon rod cleaning device comprises a cleaning brush head and a cleaning solution spraying device matched with the cleaning brush head, wherein during cleaning, the cleaning solution spraying device sprays cleaning solution towards the silicon rod, and meanwhile, the cleaning brush head is driven by a motor to act on the silicon rod to complete cleaning operation. In practice, the cleaning liquid may be pure water, for example, and the cleaning brush head may be a rotary brush head, for example.

The following describes an implementation process of the square silicon rod cutting and grinding all-in-one machine in the foregoing embodiments with reference to the accompanying drawings:

firstly, a silicon rod loading device 17 and a silicon rod carrying device 18 are utilized to place an original silicon rod to be processed at a cutting position, and the side of the original silicon rod is clamped by a silicon rod side clamping mechanism, wherein the axis line of the original silicon rod is consistent with the first direction. Resulting in the state shown in fig. 5.

And (3) utilizing a slotting device 15 arranged on the cutting frame to perform slotting operation on the original silicon rod at the cutting position. Resulting in the state shown in fig. 6.

The cutting device 12 is used for performing transverse cutting operation on the original silicon rod at the cutting position, so that the original silicon rod is transversely cut to form a first silicon rod and a second silicon rod which are vertically stacked. Resulting in the state shown in fig. 7.

The silicon rod transfer device 13 is used for sequentially transferring the first silicon rod and the second silicon rod to the grinding position, and the silicon rod end clamping mechanism at the grinding position is used for clamping and positioning. Resulting in the state shown in fig. 8.

The grinding device 14 is used to sequentially grind the cutting surface of the first silicon rod and the second silicon rod located at the grinding region. Resulting in the state shown in fig. 9.

Finally, the silicon rod transfer device 13 is used to transfer the first silicon rod and the second silicon rod after the grinding operation of the cutting surface is completed to the silicon rod unloading device 16 and then unload the silicon rods. Resulting in the state shown in fig. 10.

The square silicon rod cutting and grinding all-in-one machine disclosed by the embodiment comprises a machine base, a cutting device and a grinding device, wherein the cutting device and the grinding device are arranged in the front and back direction of a first direction, the cutting device can transversely cut horizontally placed original silicon rods to form the first silicon rods and the second silicon rods which are stacked up and down, and the grinding device can grind cutting surfaces of the first silicon rods and the second silicon rods which are formed after transverse cutting, so that integrated operation of semi-cutting and grinding multiple processes of the original silicon rods is completed, and the production efficiency and the quality of product processing operation are improved.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the present application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims (26)

1. The utility model provides a square silicon rod surely grinds all-in-one which characterized in that includes:

the base is provided with a silicon rod processing platform; the silicon rod processing platform comprises a cutting area and a grinding area which are arranged along a first direction;

the cutting device is arranged at a cutting position of the silicon rod processing platform; the cutting device comprises at least one cutting wire saw, and the at least one cutting wire saw is used for cutting the original square silicon rod horizontally placed at the cutting position to form a first square silicon rod and a second square silicon rod; the original silicon rod is a silicon rod with a rectangular-like cross section, and the axis of the original silicon rod is consistent with the first direction; and

the grinding device is arranged at a grinding zone position of the silicon rod processing platform and used for grinding cutting surfaces of a first silicon rod and a second silicon rod which are horizontally placed at the grinding zone position, and the axial leads of the first silicon rod and the second silicon rod are consistent with the first direction.

2. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 1, wherein the at least one cutting wire saw is arranged along the second direction, and the at least one cutting wire saw is used for slicing the horizontally placed primary silicon rod at the cutting position to form the first square silicon rod and the second square silicon rod comprises the at least one cutting wire saw is used for transversely cutting the horizontally placed primary silicon rod at the cutting position to form the first square silicon rod and the second square silicon rod which are stacked up and down; the second direction is perpendicular to the first direction and forms a horizontal plane with the first direction.

3. The square silicon rod cutting and grinding all-in-one machine according to claim 1, wherein the at least one cutting wire saw is arranged in a vertical direction, and the at least one cutting wire saw is used for cutting the horizontally placed primary silicon rod at the cutting position to form a first square silicon rod and a second square silicon rod; the vertical direction is perpendicular to the first direction.

4. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 2 or 3, further comprising: and the silicon rod side clamping mechanism is arranged at the cutting area of the silicon rod processing platform and is used for clamping the side of the original silicon rod.

5. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 4, wherein the silicon rod side clamping mechanism comprises:

the side clamping support;

the clamping pieces at two sides are arranged on two opposite sides of the side clamping support along a second direction; a side clamping space is formed between the at least two side clamping pieces; and

and the side clamping driving unit is used for driving at least one of the at least two side clamping pieces to move along a second direction so as to adjust the side clamping space.

6. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 1, further comprising a silicon rod transfer device for transferring the first and second square silicon rods located at the cutting location to the grinding location.

7. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 1, wherein the cutting device comprises:

the cutting frame is movably arranged on the base along a first direction;

the cutting support is movably arranged on the cutting frame along the vertical direction;

the cutting wheels are arranged on the cutting support; and

and the cutting wire is wound on the plurality of cutting wheels to form at least one cutting wire saw.

8. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 7, wherein the cutting device comprises a cutting frame advancing mechanism comprising:

the first traveling guide rail is arranged on the base along a first direction and is used for arranging the cutting frame; and

and the first travel driving unit is used for driving the cutting frame to move along the first travel guide rail.

9. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 7, wherein the cutting support is movably arranged on the cutting frame through a cutting lifting mechanism.

10. The square silicon rod cutting and grinding all-in-one machine as recited in claim 1, further comprising a grooving apparatus, the grooving apparatus comprising:

the slotting support is movably arranged on the cutting frame of the cutting device along a second direction; and

and the slotting grinding wheel is arranged on the slotting support and is used for slotting the periphery of a preset cutting position in the horizontally placed original square silicon rod at the cutting position.

11. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 10, wherein the notching device comprises a notching support translation mechanism, comprising:

the translation guide rail is arranged on a cutting frame of the cutting device along a second direction; and

and the translation driving unit is used for driving the slotted support and at least one slotted grinding wheel on the slotted support to move along a second direction.

12. The square silicon rod slicing and grinding all-in-one machine according to claim 10, wherein the at least one grooving grinding wheel comprises a chamfering grinding rough grinding wheel, a chamfering grinding fine grinding wheel, or a chamfering grinding rough grinding wheel and a chamfering grinding fine grinding wheel arranged in the first direction.

13. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 1, further comprising at least two silicon rod end clamping mechanisms, wherein the at least two silicon rod end clamping mechanisms are arranged in parallel in the second direction in the grinding region of the silicon rod processing platform.

14. The square silicon rod slicing and grinding all-in-one machine as set forth in claim 13, wherein the grinding device comprises:

the grinding frame is movably arranged on the machine base along a first direction;

the grinding support is movably arranged on the grinding frame along a second direction and a vertical direction; and

and the plane grinding wheel is arranged on the grinding support and is used for carrying out surface grinding operation on the first square silicon rod and the second square silicon rod.

15. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 14, wherein the grinding support is movably disposed on the grinding frame by a grinding lifting mechanism and movably disposed on the grinding frame by a grinding support translation mechanism.

16. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 14, further comprising a silicon rod transfer device, wherein the silicon rod transfer device is arranged on a grinding rack of the grinding device and moves along a first direction along with the grinding rack; the silicon rod transfer device comprises:

the transfer clamp comprises a clamping seat, at least one pair of clamping arms arranged at two opposite ends of the clamping seat and a clamping arm driving mechanism, wherein a clamping part and a clamping part rotating mechanism are arranged on the at least one pair of clamping arms;

the transferring and rotating mechanism is used for driving the transferring clamp to rotate along the vertical direction;

the transfer translation mechanism is used for driving the transfer clamp to move on the grinding frame along a second direction; and

and the transfer lifting mechanism is used for driving the transfer clamp to lift and move in the vertical direction on the grinding frame.

17. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 1, further comprising at least two silicon rod end clamping mechanisms, wherein the at least two silicon rod end clamping mechanisms are arranged at the grinding position of the silicon rod processing platform in the first direction in a front-back manner.

18. The square silicon rod slicing and grinding all-in-one machine as set forth in claim 17, wherein the grinding device comprises:

the grinding frame is movably arranged on the machine base along a first direction;

the grinding support is movably arranged on the grinding frame along the vertical direction; and

and the plane grinding wheel is arranged on the grinding support and is used for carrying out surface grinding operation on the first square silicon rod and the second square silicon rod.

19. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 18, wherein the grinding support is movably arranged on the grinding frame through a grinding lifting mechanism.

20. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 18, further comprising a silicon rod transfer device, wherein the silicon rod transfer device is arranged on the grinding frame of the grinding device and moves along a first direction along with the grinding frame; the silicon rod transfer device comprises:

the transfer clamp comprises a clamping seat, at least one pair of clamping arms arranged at two opposite ends of the clamping seat and a clamping arm driving mechanism, wherein a clamping part and a clamping part rotating mechanism are arranged on the at least one pair of clamping arms;

the transfer rotating mechanism is used for driving the transfer clamp to rotate along the vertical direction; and

and the transfer lifting mechanism is used for driving the transfer clamp to lift and move in the vertical direction on the grinding frame.

21. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 14 or 18, wherein the grinding means comprises a grinding frame advancing mechanism comprising:

the second advancing guide rail is arranged on the machine base along the first direction and is used for arranging the grinding frame; and

and the second travelling driving unit is used for driving the grinding rack to move along the second travelling guide rail.

22. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 13 or 17, wherein the silicon rod end clamping mechanism comprises:

the end part clamps the support;

at least two end clamping pieces arranged at two opposite ends of the end clamping support along a first direction; an end clamping space is arranged between the at least two end clamping pieces; and

an end clamp driving unit for driving at least one of the at least two end clamps to move in a first direction to adjust the end clamp space.

23. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 1, further comprising a silicon rod loading device.

24. The square silicon rod cutting and grinding all-in-one machine as claimed in claim 1, further comprising a silicon rod carrying device, wherein the silicon rod carrying device is arranged on the cutting frame of the cutting device and moves along the first direction along with the cutting frame.

25. The square silicon rod slicing and grinding all-in-one machine as set forth in claim 24, wherein the silicon rod handling device comprises:

the carrying clamp comprises at least two clamping jaws which can be opened and closed; and

and the conveying lifting mechanism is used for driving the conveying clamp to lift and move on the cutting frame along the vertical direction.

26. The square silicon rod slicing and grinding all-in-one machine as claimed in claim 1, further comprising a silicon rod unloading device.

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