CN208215714U

CN208215714U - Silicon ingot cutting equipment

Info

Publication number: CN208215714U
Application number: CN201820736408.9U
Authority: CN
Inventors: 卢建伟; 李鑫
Original assignee: Shanghai Nissin Machine Tool Co Ltd
Current assignee: Shanghai Nissin Machine Tool Co Ltd
Priority date: 2018-05-17
Filing date: 2018-05-17
Publication date: 2018-12-11
Anticipated expiration: 2028-05-17

Abstract

The application discloses a kind of silicon ingot cutting equipment, including workpiece revolving platform, Workpiece tilting device and the first cutter device, utilize Workpiece tilting device, the first silicon cube on workpiece revolving platform can be overturn and on the first workbench for being transported in the first cutter device, cutting operation is implemented to the first silicon cube to form the second silicon cube according to the crystal orientation of the first silicon cube using the first cutter unit in the first cutter device, relative to the relevant technologies, silicon ingot cutting equipment disclosed in the present application, in cutting operation, the crystal orientation situation of the first silicon cube is fully considered, to may make cutting forms the second silicon cube can reduce the risks such as cracking, with more preferably performance.

Description

Silicon ingot cutting equipment

Technical field

This application involves silicon ingots to cut field, more particularly to a kind of silicon ingot cutting equipment.

Background technique

When manufacturing various semiconductor devices or photovoltaic device, by half comprising hard brittle materials such as silicon, sapphire or ceramics Conductor work piece cut is the structure of specification.Since semiconductor workpiece cutting is the important procedure for restricting subsequent finished product, thus It is also higher and higher to its job requirements.Currently, multi-wire cutting technology is since with high production efficiency, operating cost is low, operation is smart The features such as high is spent, is widely used in the semiconductor workpiece cutting production of industry.

The production process of existing silicon wafer, by taking polysilicon product as an example, generally, rough flow chart can include: first make Evolution operation is carried out to first grade silicon ingot (large scale silicon ingot) with silicon ingot cutting equipment to form time grade silicon ingot (small size silicon ingot)；It opens After side, reuses silicon ingot shear and truncation processing is carried out to form polycrystalline silicon rod or polysilicon block to secondary grade silicon ingot；It is right again The corresponding grinding operation of each polycrystalline silicon rod progress (such as: flour milling, chamfering, barreling etc.), so that the surface shaping of polycrystalline silicon rod Reach corresponding flatness and size tolerance requirements；It is subsequent to reuse slicer slice operation is carried out to polycrystalline silicon rod, then it obtains Polysilicon chip.

In certain silicon ingot cutting techniques, common multi-thread evolution equipment uses the square net of cross gauze composition, by On silicon ingot is cut into multiple silico briquettes down.Although such cutting mode can an excision forming, complicated winding mode And slower feed velocity, the winding mode that greatly affected the cutting efficiency of equipment and complexity also greatly consume biography cutting The service life of wheel and diamond wire.In addition, silico briquette can not be directly taken out after silicon ingot is cut into multiple silico briquettes, generally, After gauze must being cut, will cutting rack rise playback after could take out silico briquette, subsequent, must there is operator to fill again Line, wiring difficulty is big again for equipment, and the operating time is long, and extreme influence working efficiency causes enterprise at high cost.

In addition, in other silicon ingot cutting techniques, when cutting to silicon ingot, the crystal orientation of silicon ingot is not considered, therefore, The cutting finished product (such as silicon rod or silico briquette) that cutting is formed is also easy to produce the risks such as cracking.

Utility model content

In view of the missing of the relevant technologies described above, the purpose of the application is to disclose a kind of silicon ingot cutting equipment, is used for It solves silicon ingot evolution cutting operation inefficiency in the related technology and cuts the problems such as finished product is also easy to produce cracking.

To achieve the above object and other purposes, the first aspect of the application disclose a kind of silicon ingot cutting equipment, comprising: work Part revolving platform, for carrying at least one first silicon cube；First cutter device is adjacent to the workpiece revolving platform, including One workbench and the first cutter unit, wherein first cutter unit has multiple first cutting line segments；Workpiece turning dress It sets, is set between the workpiece revolving platform and first cutter device, for by the first silicon side on the workpiece revolving platform Body is overturn and is transported to first workbench, so that multiple first cutting line segments in first cutter unit are used for Cutting operation is implemented to the first silicon cube according to the crystal orientation of the first silicon cube, forms multiple second silicon cubes.

Silicon ingot cutting equipment disclosed in the present application, including workpiece revolving platform, Workpiece tilting device and the first cutter device, Using Workpiece tilting device, the first silicon cube on workpiece revolving platform can be overturn and be transported in the first cutter device On first workbench, using the first cutter unit in the first cutter device according to the crystal orientation of the first silicon cube and to the first silicon cube Implement cutting operation to form the second silicon cube, relative to the relevant technologies, silicon ingot cutting equipment disclosed in the present application is made in cutting In industry, the crystal orientation situation of the first silicon cube has been fully considered, so that cutting may make to form the second silicon cube and can reduce cracking etc. Risk has more preferably performance.

In the certain embodiments of the application first aspect, first cutter unit has multiple the be oppositely arranged One cutting wheel group and the first cutting line, first cutting line are sequentially around in each first in the multiple first cutting wheel group Cutting wheel forms multiple first cutting line segments.

In the certain embodiments of the application first aspect, in first workbench and first cutter unit At least one is arranged to can be mobile relative to another one.

In the certain embodiments of the application first aspect, first cutter unit is located at first workbench Side；First cutter unit includes the upper cutting rack being oppositely arranged and lower cutting rack, the upper cutting rack and lower cutting rack On be equipped with multiple first cutting wheels, one on first cutting wheel on the upper cutting rack of same position and lower cutting rack First cutting wheel forms a first cutting wheel group；The workbench is equipped with and multiple first cutting line segments corresponding multiple first Cutting seam.

In the certain embodiments of the application first aspect, in first workbench and first cutter unit At least one be equipped with translational drive mechanism.

In the certain embodiments of the application first aspect, the Workpiece tilting device includes: bracket；Axis is connected to described The clamping piece of bracket, for clamping the first silicon cube；The overturning driving being connected between the bracket and the clamping piece Mechanism, for driving the clamping piece and its first clamped silicon cube to make flip-flop movement.

In the certain embodiments of the application first aspect, the clamping piece includes: clamping ontology and is set to institute relatively State two clamping parts on clamping ontology.

In the certain embodiments of the application first aspect, at least one of described two clamping parts are arranged to can phase It is mobile to another one.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes feeding device, is used for First silicon cube is transferred on the workpiece revolving platform by feeding area.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes charging positioning device, For carrying out positioning calibration before being transferred on the workpiece revolving platform by the feeding device to the first silicon cube.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes being adjacent to the workpiece Second cutter device of revolving platform, comprising: the second workbench, for carrying silicon ingot；Second cutter unit has multiple second to cut Secant section；Wherein, multiple second cutting line segments in second cutter unit are for the crystal orientation according to the silicon ingot and to institute It states silicon ingot and implements cutting operation, form multiple first silicon cubes.

In the certain embodiments of the application first aspect, second cutter unit has multiple the be oppositely arranged Two cutting wheel groups and the second cutting line, second cutting line are sequentially around in each second in the multiple second cutting wheel group Cutting wheel forms multiple second cutting line segments.

In the certain embodiments of the application first aspect, in second workbench and second cutter unit At least one is arranged to can be mobile relative to another one.

In the certain embodiments of the application first aspect, second cutter unit is set to second workbench Top；Second cutter unit includes the left cutting rack and right cutting rack being oppositely arranged, the left cutting rack and the right cut It cuts and is equipped with multiple second cutting wheels on frame, in second cutting wheel on the left cutting rack of same position and right cutting rack One the second cutting wheel forms a second cutting wheel group；Second workbench is equipped with corresponding with multiple second cutting line segments Multiple second cutting seams.

In the certain embodiments of the application first aspect, in second workbench and second cutter unit At least one is equipped with lift drive mechanism.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes workpiece transporter, For multiple first silicon cubes to be transported to the workpiece revolving platform by second workbench.

In the certain embodiments of the application first aspect, the workpiece transporter includes: workpiece picking and placing unit；It moves Motivation structure, for driving the workpiece picking and placing unit mobile, with using the workpiece picking and placing unit by multiple first silicon cubes by Second workbench is transported to workpiece revolving platform.

In the certain embodiments of the application first aspect, the mobile mechanism includes: along the second workbench to work The traveling mobile unit of part revolving platform；Lifting moving unit；Telescopic moving unit；Mobile control unit is moved with the traveling Unit, the lifting moving unit and telescopic moving unit connection, are used for: being believed according to the position of multiple first silicon cubes It ceases and controls the lifting moving unit and the telescopic moving unit and drive the workpiece picking and placing unit movement multiple to extract First silicon cube controls after the traveling mobile unit drives the workpiece picking and placing unit to be moved to workpiece revolving platform described in control Lifting moving unit and the telescopic moving unit drive the workpiece picking and placing unit mobile to put multiple first silicon cubes In on workpiece revolving platform.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes that trimming leather jacket is set, and is used It is removed in the flaw-piece for generating the silicon ingot after second cutter device implements cutting operation.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes feeding transfer device, For silicon ingot to be transferred to second workbench by feeding area.

In the certain embodiments of the application first aspect, the feeding transfer device includes: loading guide, is layed in Between feeding area and second workbench；Transfer bed is set on the loading guide.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes charging positioning device, The charging positioning device includes: side surface positioning device, the side set on the feeding area；Position adjusts component, is set to described To be contacted with the silicon ingot carried on the table top of transfer bed.

In the certain embodiments of the application first aspect, it is universal ball end or circle rotation that the position, which adjusts component, Formula adjusts head.

In the certain embodiments of the application first aspect, the silicon ingot cutting equipment further includes material containing vehicle, and being used for will The silicon ingot is transported on the transfer bed of the feeding transfer device after delivering to feeding area.

Detailed description of the invention

Fig. 1 is shown as schematic perspective view of the silicon ingot cutting equipment under a certain visual angle in one embodiment of the application.

Fig. 2 is shown as the structural schematic diagram of Workpiece tilting device.

Fig. 3 is shown as silicon ingot cutting equipment in one embodiment of the application in the flow diagram for implementing cutting operation.

Fig. 4 is shown as schematic perspective view of the silicon ingot cutting equipment under a certain visual angle in one embodiment of the application.

Fig. 5 is shown as schematic perspective view of the silicon ingot cutting equipment under another visual angle in one embodiment of the application.

Fig. 6 is shown as the side view of silicon ingot cutting equipment in one embodiment of the application.

Fig. 7 is shown as the top view of silicon ingot cutting equipment in one embodiment of the application.

Fig. 8 is shown as silicon ingot cutting equipment in one embodiment of the application in the flow diagram for implementing cutting operation.

Specific embodiment

Presently filed embodiment is illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book understands other advantages and effect of the application easily.

In the following description, with reference to attached drawing, attached drawing describes several embodiments of the application.It should be appreciated that also can be used Other embodiments, and can be carried out without departing substantially from spirit and scope mechanical composition, structure, electrically with And operational change.Following detailed description should not be considered limiting, and the range of embodiments herein Only limited by the claims for the patent announced.Term used herein is merely to describe specific embodiment, and be not It is intended to limit the application.The term of space correlation, for example, "upper", "lower", "left", "right", " following ", " lower section ", " lower part ", " top ", " top " etc. can be used in the text in order to an elements or features and another element or spy shown in explanatory diagram The relationship of sign.

Although term first, second etc. are used to describe various elements herein in some instances, these elements It should not be limited by these terms.These terms are only used to distinguish an element with another element.For example, first turn It can be referred to as the second steering swing to swinging, and similarly, the second steering, which is swung, can be referred to as the first steering swing, and The range of various described embodiments is not departed from.

Show referring to Fig. 1, being shown as stereochemical structure of the silicon ingot cutting equipment under a certain visual angle in one embodiment of the application It is intended to.In the embodiment shown in fig. 1, the silicon ingot cutting equipment includes: base 1 and the work turnover on base 1 Platform 2, the first cutter device 3 and Workpiece tilting device.

Base 1 is the main element of silicon ingot cutting equipment.Preferably, the volume and weight of base 1 are larger, to provide more Big mounting surface and more firm complete machine stable degree.In actual application, base 1 may include pedestal and the peace on pedestal Assembling structure, the mounting structure can such as installation frame, including installation column and installation crossbeam etc..According to cutting process, base 1 The functional areas such as the turnover area being set in sequence and the first cutting area can be included at least.

Workpiece revolving platform 2 can be located at the turnover area of base 1, for carrying multiple first silicon cubes 11.In the present embodiment, Using workpiece revolving platform 2, these the first silicon cubes can be temporarily disposed before the first silicon cube 11 is sent into the first cutter device 3 11。

For the first silicon cube 11 to be cut to be transferred on workpiece revolving platform 2, the application silicon ingot cutting equipment is also It (is not shown in the drawings) including feeding device, for the first silicon cube 11 to be transferred to workpiece revolving platform 2 by feeding area.

In some embodiments, the feeding device may be, for example, skip car, and the skip car can be along on preset Expect that guide rail is advanced, the skip car has a support face, and multiple first silicon cubes 11 of feeding are waited for for support.To make smoothly And smoothly the first silicon cube xx is transferred on workpiece revolving platform 2, the support face can be designed for lift, in this way, in reality In the application of border, support the feeding devices of multiple first silicon cubes 11 advance to turnover area along loading guide and make more A first silicon cube 11 is located at the top of workpiece revolving platform 2；Decline the support face of the feeding device, drives multiple first silicon sides Body 11 declines and is placed on workpiece revolving platform 2.

In some embodiments, the feeding device may be, for example, that workpiece grabs support mechanism, and the workpiece is grabbed in support mechanism Including being oppositely arranged and telescopic at least two supporting plate, in this way, in practical applications, can first be received by least two supporting plates Support lives multiple first silicon cubes 11, multiple 11 to weeks of first silicon cube of mobile at least two supporting plates and its institute's support after contracting Turn area and multiple first silicon cubes 11 is made to be located at the top of workpiece revolving platform 2, decline at least two supporting plates, drives multiple the One silicon cube 11 declines and is placed on workpiece revolving platform 2.

The application silicon ingot cutting equipment further includes charging positioning device, for filling to the first silicon cube 11 by the feeding It sets and carries out positioning calibration before being transferred on workpiece revolving platform 2.

First cutter device is used to implement cutting operation to the first silicon cube, forms the second silicon cube.In the present embodiment, First cutter device 3 may include the first workbench 31 and the first cutter unit 33.First workbench 31 is located at the first cutting area, uses In carrying the first silicon cube 11, the first cutter unit 33 has the multiple first cutting wheel groups being oppositely arranged and the first cutting line, First cutting line, which is sequentially around in each first cutting wheel 333 in the multiple first cutting wheel group and forms multiple first, to be cut Secant section 334.In the present embodiment, first workbench 31 and the first cutter unit 33 are arranged to relatively in the first cutter device 3 Translation can implement cutting operation to the first silicon cube according to the crystal orientation of the first silicon cube using the first cutter device 3, for example, First cutter device 3 is cut along the crystal orientation of the first silicon cube 11.

In the present embodiment, originally, the crystal orientation of the multiple first silicon cubes 11 carried by workpiece revolving platform 2 is vertical Direction, and first workbench 31 and the first cutter unit 33 are arranged to relative translation in the first cutter device 3, therefore, to reality It now remains to cut the first silicon cube 11 along the crystal orientation of the first silicon cube 11, certainly will need to carry out the first silicon cube 11 Overturn operation.In the application silicon ingot cutting equipment, workpiece is additionally provided between workpiece revolving platform 2 and the first cutter device 3 and is turned over Rotary device 4.Using Workpiece tilting device 4, the first silicon cube 11 on workpiece revolving platform 2 can be overturn and be transported to first Workbench 31.

As shown in Fig. 2, being shown as the structural schematic diagram of Workpiece tilting device.In conjunction with Fig. 1 and Fig. 1, Workpiece tilting device 4 is wrapped It includes: bracket 41, clamping piece 43 and turnover driving mechanism 45.

Bracket 41 is set on the mounting structure of base 1, such as on the installation crossbeam of installation frame.In addition, bracket 41 Lifting moving can be realized by a lift drive mechanism.Bracket 41 can also be realized by a translational drive mechanism and is moved in translation.

43 axis of clamping piece is connected to bracket 41, for clamping the first silicon cube 11.In the present embodiment, clamping piece 43 can more wrap Include clamping ontology 431 and opposite two clamping parts 433,435 being set on clamping ontology 431.In some embodiments, two At least one of clamping part 433,435 is movable design, that is, at least one of two clamping parts 433,435 are arranged to It can be mobile relative to another one.In this way, the clamping spacing between adjustable two clamping parts 433,435, to adapt to different first silicon The size of cube 11.Such as, it will be assumed that adjacent to that 433 (example of clamping part of bracket 41 in two clamping parts 433,435 Such as, it can will be known as the first clamping part adjacent to bracket 41 clamping part 433, will be far from another clamping part in bracket 41 435 are known as the second clamping part) it is set as movable.In some embodiments, at least one in two clamping parts 433,435 Person is equipped with extension type element.Such as, it will be assumed that adjacent to that clamping part of bracket 41 in two clamping parts 433,435 433 (for example, can will adjacent to bracket 41 clamping part 433 be known as the first clamping part, will be far from bracket 41 another Clamping part 435 is known as the second clamping part) it is equipped with the grip block with telescoping mechanism, the telescoping mechanism may be, for example, with piston The cylinder or oil cylinder of bar, the grip block are implemented flexible under the driving of the telescoping mechanism.

Turnover driving mechanism 45 is connected between bracket 41 and clamping piece 43, for driving clamping piece 43 and its clamped The first silicon cube 11 make flip-flop movement.In the present embodiment, turnover driving mechanism 45 can such as air cylinder structure or cylinder structure, The cylinder body of the air cylinder structure or cylinder structure is to be articulated with bracket 41, and the piston rod of the air cylinder structure or cylinder structure is hinge It is connected to the clamping ontology 431 of clamping piece 43.

It should be noted that being moved in translation to meet Workpiece tilting device 4 can clamp to each on silicon ingot revolving platform 7 First silicon cube 11, silicon ingot revolving platform 7 may be, for example, hollow design, and in some embodiments, silicon ingot revolving platform 7 may include phase To two mounting structures (Workpiece tilting device 4 is located between two mounting structures) of setting, two mounting structures are all had One supporting part, so that two supporting parts for belonging to two mounting structures may make up one for carrying the first silicon cube 11 Support face.

When implementing overturning operation to the first silicon cube 11 using Workpiece tilting device 4, specifically can include: firstly, according to The position of first silicon cube 11 to be flipped on workpiece revolving platform 2, driving arm 41 is mobile, so that clamping piece 43 is close to be flipped The first silicon cube 11 and clamping piece 43 in be away from a clamping part 435 of bracket 41 and be located at the first silicon cube 11 to be flipped Lower section.Above-mentioned steps are more can include: the decline movement of driving arm 41, so that being away from the second folder of bracket 41 in clamping piece 43 Hold the lower section that portion 435 is located at the first silicon cube 11 to be flipped, the bottom surface of the second clamping part 435 and the first silicon cube 11 has one Gap；Driving arm 41 is moved in translation, so that clamping of the clamping piece 43 in the first silicon cube 11 to be flipped, clamping piece 43 The side of ontology 431 and the first silicon cube 11 has a gap, to avoid clamping ontology 431 because directly contacting or colliding the first silicon Cube 11 and generate damage.Alternatively, driving arm 41 is moved in translation, so that clamping piece 43 is close to the first silicon cube to be flipped 11, the side of the clamping ontology 431 in clamping piece 43 and the first silicon cube 11 has a gap, to avoid clamp ontology 431 because It directly contacts or collides the first silicon cube 11 and generate damage；The decline movement of driving arm 41, so that being away from clamping piece 43 Second clamping part 435 of bracket 41 is located at the lower section of the first silicon cube 11 to be flipped, the second clamping part 435 and the first silicon cube 11 bottom surface has a gap.Then, driving arm 41 rises movement, so that being away from the second folder of bracket 41 in clamping piece 43 Hold the bottom surface that portion 435 touches the first silicon cube 11；Drive 433 direction of the first clamping part in clamping piece 43 adjacent to bracket 41 Second clamping part 435 moves so that the first clamping part 433 contacts and press on the top surface of the first silicon cube 11, utilizes the first folder The cooperation for holding portion 433 and the second clamping part 435 is clamped the first silicon cube 11.Then, driving is used as turnover driving mechanism 45 air cylinder structure or cylinder structure overturns clamping piece 43 and its first clamped silicon cube 11, in the present embodiment, overturning Angle is, for example, 90 °.Finally, still can be by the movement of driving arm 41 (translational movement and lifting moving), by the first silicon of overturning Cube 11 is transported on the first workbench 31；It is subsequent, clamping piece is discharged, driving arm 41 playbacks.Thus, it can be seen that utilizing Workpiece tilting device 4 is transported to the first workbench 31 after the first silicon cube 11 on workpiece revolving platform 2 being overturn 90 °, so that First silicon cube 11 is changed to horizontal direction (that is, crystal orientation is by original by original vertical direction along bottom surface to top surface after 90 ° of overturning First vertical direction is changed to horizontal direction).

When the first silicon cube 11 on workpiece revolving platform 2 is overturn using Workpiece tilting device 4 and is transported to first After workbench 31, i.e., cutting operation is implemented to the first silicon cube 11 using the first cutter device 3, that is, along the first silicon side The crystal orientation of body 11 implements cutting operation, forms multiple second silicon cubes 12.

In practical applications, during implementing cutting operation, be by it is multiple first cutting line segments 334 with it is to be cut The relative displacement of the first silicon cube 11 contacted and the first silicon cube 11 and cut during relative displacement by the first cutting line segment 334 Cut the first silicon cube 11.Therefore, in the application silicon ingot cutting equipment, in the first workbench 31 and the first cutter unit 33 extremely Few one is arranged to can be mobile relative to another one.That is, in one embodiment, the first workbench 31 is fixed setting, and the One cutter unit 33 is set as to move relative to the first workbench 31.In another embodiment, the first cutter unit 33 To be fixedly installed, and the first workbench 31 is set as to move relative to the first cutter unit 33.In yet another embodiment, First workbench 31 is movable setting, and the first cutter unit 33 is also movable setting, the first cutter unit 33 and the first work Make platform 31 to be mutually shifted.

In the present embodiment, the first cutter unit 33 is set to the side of the first workbench 31.First cutter unit 33 includes The upper cutting rack 331 and lower cutting rack 332 being oppositely arranged are equipped on the upper cutting rack 331 and the lower cutting rack multiple First cutting wheel 333, first cutting wheel on the upper cutting rack 331 of same position are cut with one first on lower cutting rack Wheel one the first cutting wheel group of composition is cut, each first in the multiple first cutting wheel group is sequentially around in by the first cutting line Cutting wheel 333 forms multiple first cutting line segments 334.In practical applications, the first cutting line is sequentially around in each first cutting Wheel 333, which forms multiple first cutting line segments 334, specifically can be used under type realization such as: assuming that is be arranged on upper cutting rack 331 is more A first cutting wheel 333 can be respectively designated as U₁、U₂、U₃、……、U_n-1、U_n, multiple first be arranged on lower cutting rack 332 cut L can be respectively designated as by cutting wheel 333₁、L₂、L₃、……、L_n-1、L_n, wherein the first cutting wheel U₁With the first cutting wheel L₁Composition one First cutting wheel group, the first cutting wheel U₂With the first cutting wheel L₂Form a first cutting wheel group ... ..., the first cutting wheel U_n With the first cutting wheel L_nForm a first cutting wheel group.First cutting line is single continuous cutting line, by the first cutting When line winding, with the first cutting wheel U from the upper cutting rack 331₁For beginning, the first cutting line can be according to U₁、L₁、L₂、U₂、 U₃、L₃、……、U_n-1、L_n-1、L_n、U_nWinding sequence sequentially wind.In addition, from the foregoing, it will be observed that the first cutting wheel U₁With the first cutting Take turns L₁Form a first cutting wheel group, the first cutting wheel U₂With the first cutting wheel L₂A first cutting wheel group ... ... is formed, First cutting wheel U_nWith the first cutting wheel L_nA first cutting wheel group is formed, therefore, the first cutting line of winding is just by vertically Direction (such as up and down direction) is oppositely arranged multiple first cutting wheel groups and forms multiple first cuttings line segments 334, and each the One cutting line section 334 is to be oppositely arranged along the vertical direction.In addition, the line spacing between two neighboring first cutting line segment 334 It is determined by the spacing between two neighboring first cutting wheel group.If the spacing phase between two the first cutting wheel groups of arbitrary neighborhood Together, then, the line spacing between all two neighboring first cutting line segments 334 is all the same.But be not limited thereto, other can It selects in embodiment, for example, the line spacing between each first cutting line segment 334 can require according to the first silicon cube evolution and is arranged It is unequal.In this way, this multiple first cutting line segment 334 is alternatively arranged and is parallel to each other, the first cutting gauze can be formed.It can Selection of land, the first cutting line may be, for example, diamond wire.

Since the first cutter unit 33 is set to the side of the first workbench 31, the first workbench 31 and the first cutting At least one of unit 33 is equipped with translational drive mechanism.In the present embodiment, the first workbench 31 is equipped with translational drive mechanism. The translational drive mechanism can further comprise: translating rails, translator slider and driven in translation source, wherein the translation is led Rail can be arranged along translation direction and (be arranged along Y-direction), and the translator slider is set on two cutting racks and leads with the translation Rail matches.For the stability for making the translation displacement of the first workbench 31, it can configure two translating rails, the two translating rails It is located at the opposite sides of corresponding first workbench 31.The driven in translation source then may include the rolling along translation direction setting Ballscrew and servo motor, ball-screw have the characteristics that high-precision, invertibity and efficient, in this way, by servo motor with The cooperation of ball-screw, it is ensured that the first workbench 31 translates the precision of displacement in a transverse direction.Certainly, the driven in translation Source can also make other selections, for example, in some embodiments, the driven in translation source may include translation rack rails, driving gear And pan drive motor, wherein the translation rack rails is arranged and (is arranged along Y-direction) along translation direction, the driving gear and institute Translation rack rails engagement is stated, the pan drive motor is for driving the driving gear.In this way, by the driven in translation source, Two cutting racks in the first cutter unit can be driven to carry out translation displacement in a transverse direction along the translating rails.

Particularly, in some embodiments, in two cutting racks being oppositely arranged in first cutter unit extremely Few one can be made to be biased to movement relative to another one.By taking the first cutter unit 33 as an example, upper cutting rack 331 setting up and down and incision Cutting at least one of frame 332 can make to be biased to movement.In specific implementation, in the upper cutting rack 331 and lower cutting rack 332 At least one can be realized by offset driving mechanism be biased to it is mobile (that is, upper cutting rack 331 descends cutting rack 332 to be biased to relatively Mobile perhaps lower cutting rack 332 makees to be biased to movement or upper cutting rack 331 relative to upper cutting rack 331 and lower cutting rack 332 is equal It can be biased to move).Using above-mentioned offset driving mechanism, it can be achieved that by the upper cutting rack 331 being oppositely arranged and lower cutting rack 332 At least one be designed as can relative to another one be biased to move so that upper cutting rack 331 and lower cutting rack 332 are relative to first It is front and back setting (spacing and lower cutting rack 332 and first between upper cutting rack 331 and the first silicon cube 11 for silicon cube 11 Spacing between silicon cube 11 is not identical, that is, multiple first cutting line segments 334 and the first silicon being set around in the first cutting wheel group The cutting angle of cube 11 is in the acute angle or obtuse angle of on-right angle), thus in cutting operation, in any first cutting line segment 334 Line segment is cut positioned at preceding part and first contacts the first silicon cube 11 than being located at posterior part cutting line segment, then subsequent First cutting line segment 334 from when the first silicon 11 outlet of cube, be then in the first cutting line segment 334 be located at posterior part cutting line Section is than leaving the first silicon cube 11 and outlet after being located at preceding part cutting line segment, in this way, line segment is cut in preceding part 11 surface of the first silicon cube of outlet can prevent, avoid at least reducing the situation for chipping occur, farthest protect The surface of first silicon cube 11 improves the cut quality of the first silicon cube 11.Further, in practical applications, Ke Yigen Required according to cutting technique and adjust the mutual front and back setting of two cutting racks in due course, for example, cutting technique require in require the The cutting requirement of the cutting surfaces of the front (or rear portion) of one silicon cube 11 is higher, then by the front relative to the first silicon cube 11 The cutting wheel group at (or rear portion) is arranged in preceding and is arranged relative to the cutting wheel group of the rear portion of workpiece to be cut (or front) rear. Further more, since the cutting angle of the first cutting line segment 334 and the first silicon cube 11 is in the acute angle or obtuse angle of on-right angle, the first cutting Line segment 334 not will receive the frontal compression of the first silicon cube 11, slow down the damage of the first cutting line, extend the first cutting line Service life.

In addition, in some embodiments, in two cutting racks being oppositely arranged in first cutter unit at least One can make separate or close movement relative to another one.By taking the first cutter unit 33 as an example, upper cutting rack 331 setting up and down It can make separate or close movement at least one of lower cutting rack 332.In specific implementation, the upper cutting rack 331 It can be realized by coil holder driving mechanism at least one of lower cutting rack 332 far from or close to (that is, upper cutting rack 331 is opposite Lower cutting rack 332 makees the relatively upper cutting rack 331 of separate or close perhaps lower cutting rack 332 and makees separate or close or upper cutting Frame 331 and lower cutting rack 332 can be separate or close).Using above-mentioned coil holder driving mechanism, it can be achieved that will be oppositely arranged on cut It cuts at least one of frame 331 and lower cutting rack 332 to be designed as to be biased to move relative to another one, so that upper cutting rack 331 Spacing between lower cutting rack 332 changes, the Cutting Length for cutting line segments 334 so as to adjust multiple first, so as to The first silicon cube 11 of different specification size is adapted to, and makes the Cutting Length and to be cut first of the first cutting line segment 334 Silicon cube 11 is adapted and (avoids the first cutting line segment 334 too long or too short), improves cutting efficiency and cut quality.

Certainly, for the first cutter unit 33, on two cutting racks or base 1 also settable corresponding conducting wire, winding, Silk, tension mechanism etc. are arranged, for realizing the guiding of the first cutting line, tension adjustment and winding, row's silk etc., about conducting wire, volume Around, row's silk, the setting such as tension mechanism, details are not described herein.

First workbench 31 be it is horizontally disposed, be used for the first silicon of horizontal bearing cube 11.In the present embodiment, such as preceding institute It states, the first cutter unit 33 is set to the side of the first workbench 31,33 relative translation of the first workbench 31 and the first cutter unit It is mobile, therefore, to enable the first cutter unit 33 to be cut along the crystal orientation of the first silicon cube 11, when the first workbench 31 When horizontal bearing the first silicon cube 11, the crystal orientation of the first silicon cube 11 should be and be moved in translation consistent horizontal direction.

First workbench 31 is equipped with to be cut with the first cutting line segments 334 corresponding multiple first multiple in the first cutter unit 33 Slot 311.In practical applications, the first workbench 31 includes parallel arrangement of multiple bearing assemblies, the two neighboring carrying Cutting gap is installed between component as the first cutting seam 311, the width of the cutting gap is greater than the first cutting line segment 334 line footpath.In this way, the first cutter device 3, when implementing cutting operation to the first silicon cube 11, the first cutting line segment 334 can First silicon cube 11 is cut in the case of falling into the first cutting seam 311, is realizing the same of the first silicon cube 11 cutting When, protection the first cutting line segment 334 can be played the role of, the first cutting line segment 334 and the first workbench 31 is avoided to generate friction And it damages.

When implementing cutting operation to the first silicon cube 11 using the first cutter device 3, first carried by the first workbench 31 First silicon cube 11 to be cut, so that the first silicon cube 11 to be cut from crystal orientation is and is moved in translation consistent level side To in multiple first cuttings line segments 334 using translational drive mechanism the first workbench 31 of driving towards the first cutter unit 33 Mobile, multiple first cutting line segments 334 correspond to respective first cutting seam 311 and enter 31 inside of the first workbench and to first The the first silicon cube 11 carried on workbench 31 carries out cutting until (the multiple first cutting line segments of completely cut off first silicon cube 11 334 implement to cut along the crystal orientation of the first silicon cube 11 to the first silicon cube 11), multiple second silicon cubes 12 are formed, it is subsequent, to Multiple second silicon cubes 12 of formation are transferred out of the first workbench 31 and then pass through translational drive mechanism for the first workbench 31 make the translation far from the first cutter unit 33 to reset.Wherein, during implementing cutting operation, the first cutting line segment 334 It is always positioned in the first cutting seam 311.

Illustrate referring to Fig. 3, being shown as silicon ingot cutting equipment in one embodiment of the application in the process for implementing cutting operation Figure.It can comprise the following steps that as shown in figure 3, the silicon ingot cutting equipment implements cutting operation

First silicon cube is transplanted on workpiece revolving platform by step S101.

The first silicon cube on workpiece revolving platform is overturn using Workpiece tilting device and is transported to the first work by step S103 Make on platform.

Step S105, using the first cutter unit according to the crystal orientation of the first silicon cube and to the first silicon on the first workbench Cube implements cutting operation, forms multiple second silicon cubes.In step s105, using the first cutter unit according to the first silicon side The crystal orientation of body and on the first workbench the first silicon cube implement cutting operation, comprising: utilize the first cutter unit and first The relative movement of workbench is cut by multiple first cutting line segments in the first cutter unit along the crystal orientation of the first silicon cube It cuts, forms multiple second silicon cubes.

From the foregoing, it will be observed that during implementing silicon ingot cutting operation, it first will be on workpiece revolving platform by Workpiece tilting device First silicon cube is overturn and is transported to the first cutter device, after by the first cutter device according to the crystal orientation of the first silicon cube and Cutting operation is implemented to the first silicon cube, forms the second silicon cube, in this way, not only can be in the case of removing cutting cutting gauze from The automation evolution operation for completing silicon ingot, improves silicon ingot evolution efficiency and has fully considered silicon ingot even more in evolution operation Crystal orientation situation, to may make evolution to form the second silicon cube and can have more preferably performance, for example, the second silicon side can be reduced Body generates the risks such as cracking.

Fig. 4 is please referred to Fig. 7, wherein Fig. 4 is shown as in one embodiment of the application silicon ingot cutting equipment under a certain visual angle Schematic perspective view, Fig. 5 is shown as stereochemical structure of the silicon ingot cutting equipment under another visual angle in one embodiment of the application Schematic diagram, Fig. 6 are shown as the side view of silicon ingot cutting equipment in one embodiment of the application, and Fig. 7 is shown as one embodiment of the application The top view of middle silicon ingot cutting equipment.

In Fig. 4 into embodiment illustrated in fig. 7, the silicon ingot cutting equipment includes: base 1, work revolving platform 2, is located at work The first cutter device 3 and the second cutter device 5 of 2 opposite sides of part revolving platform and be located at workpiece revolving platform 2 and first cutting Workpiece tilting device between device 3.

Base 1 is the main element of silicon ingot cutting equipment.Preferably, the volume and weight of base 1 are larger, to provide more Big mounting surface and more firm complete machine stable degree.In actual application, base 1 may include pedestal and the peace on pedestal Assembling structure, the mounting structure can such as installation frame, including installation column and installation crossbeam etc..According to evolution process, base 1 The functional areas such as the second cutting area, turnover area and the first cutting area can be sequentially equipped with.

Second cutter device is used to implement cutting operation to silicon ingot, forms the first silicon cube.In the present embodiment, is utilized Two cutter devices can implement cutting operation according to the crystal orientation of silicon ingot and to silicon ingot, for example, the second cutter device is along silicon ingot What crystal orientation was cut.

In the present embodiment, the second cutter device 5 may include the second workbench 51 and the second cutter unit 53.Second work Platform 51 has the multiple second cutting wheel groups being oppositely arranged and the second cutting line for carrying silicon ingot 10, the second cutter unit 53, Second cutting line, which is sequentially around in each second cutting wheel 533 in the multiple second cutting wheel group and forms multiple second, to be cut Secant section 534, wherein multiple second cutting line segments 534 in the second cutter unit 53 are right for the crystal orientation according to silicon ingot 10 Silicon ingot 10 implements cutting operation, forms multiple first silicon cubes.In practical applications, during implementing cutting operation, it is By the relative displacement of multiple second cutting line segments 534 and silicon ingot to be cut by the second cutting line segment 534 contact silicon ingot and Silicon ingot 10 is cut during relative displacement.Therefore, in the silicon ingot cutting equipment of the application, the second workbench 51 and the second cutting At least one of unit 53 is arranged to can be mobile relative to another one.That is, in one embodiment, the second workbench 51 is solid Fixed setting, and the second cutter unit 53 is set as to move relative to the second workbench 51.In another embodiment, second Cutter unit 53 is fixed setting, and the second workbench 51 is set as to move relative to the second cutter unit 53.At another In embodiment, the second workbench 51 is movable setting, and the second cutter unit 53 is also movable setting, the second cutter unit 53 and second workbench 51 be mutually shifted.

As shown in Figures 4 to 7, in the present embodiment, the second cutter unit 53 is set to the top of the second workbench 51.It is described Second cutter unit includes the left cutting rack 531 (cutting rack before alternatively referred to as) being oppositely arranged and right cutting rack 532 is (alternatively referred to as Cutting rack afterwards), left cutting rack 531 and right cutting rack 532 along X to being oppositely arranged, the left cutting rack 531 and the right cutting rack Multiple second cutting wheels 533 are equipped on 532, second cutting wheel on the left cutting rack 531 of same position is cut with right cut Second cutting wheel on frame 532 forms a second cutting wheel group, is sequentially around in the multiple second by the second cutting line Each second cutting wheel 533 in cutting wheel group forms multiple second cutting line segments 534.In practical applications, the second cutting line It is sequentially around in each second cutting wheel 533 and forms multiple second cuttings line segments 534 and under type realization such as specifically can be used: assuming that left Multiple second cutting wheels 533 being arranged on cutting rack 531 can be respectively designated as F₁、F₂、F₃、……、F_n-1、F_n, right cutting rack 532 Multiple second cutting wheels 533 of upper setting can be respectively designated as R₁、R₂、R₃、……、R_n-1、R_n, wherein the second cutting wheel F₁With Two cutting wheel R₁Form a second cutting wheel group, the second cutting wheel F₂With the second cutting wheel R₂Form second cutting wheel Group ... ..., the second cutting wheel F_nWith the second cutting wheel R_nForm a second cutting wheel group.Second cutting line is single continuous Cutting line, when by the second cutting line winding, with the second cutting wheel F from the left cutting rack₁For beginning, the second cutting line It can be according to F₁、R₁、R₂、F₂、F₃、R₃、……、F_n-1、R_n-1、R_n、F_nWinding sequence sequentially wind.In addition, from the foregoing, it will be observed that second Cutting wheel F₁With the second cutting wheel R₁Form a second cutting wheel group, the second cutting wheel F₂With the second cutting wheel R₂Composition one Second cutting wheel group ... ..., the second cutting wheel F_nWith the second cutting wheel R_nA second cutting wheel group is formed, therefore, the of winding Two cutting lines are just oppositely arranged multiple second cutting wheel groups by (such as left and right directions) in transverse direction and form multiple second cuttings Line segment 534, and each second cutting line segment 534 is to be oppositely arranged in left-right direction.In addition, two neighboring second cutting line What the line spacing between section 534 was determined by the spacing between two neighboring second cutting wheel group.If arbitrary neighborhood two second are cut The spacing cut between wheel group is identical, then, the line spacing between all two neighboring second cutting line segments 534 is all the same.But simultaneously It is not limited, in other alternative embodiments, for example, the line spacing between each second cutting line segment 534 can be according to silicon ingot Evolution requires and is set as unequal.In this way, this multiple second cutting line segment 534 is alternatively arranged and is parallel to each other, can be formed Second cutting gauze.Optionally, the second cutting line may be, for example, diamond wire.

Since the second cutter unit 53 is set to the top of the second workbench 51, the second workbench 51 and the second cutting At least one of unit 53 is equipped with lift drive mechanism.In the present embodiment, the second cutter unit 53 is equipped with elevator drive machine Structure.The lift drive mechanism can further comprise: riser guide, lifting slider and lifting driving source, wherein the lifting (in the present embodiment, the lifting direction is Z-direction) can be arranged along lifting direction in guide rail, such as along the installation of installation frame Column setting, the lifting slider are set on two cutting racks and match with the riser guide.To make the second cutting list The stability of first 53 lifting and translocatings, can configure two riser guides, the two riser guides are located at corresponding cutting rack Opposite sides.The lifting driving source then may include the ball-screw and servo motor being arranged along the vertical direction, ball-screw tool There are high-precision, invertibity and efficient feature, in this way, passing through the cooperation of servo motor and ball-screw, it is ensured that the second cutting The precision of the lifting and translocating in the vertical direction of unit 53.Certainly, the lifting driving source can also make other selections, for example, In certain embodiments, the lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein described (in the present embodiment, the lifting rack rails is arranged along Z-direction), the driving gear and institute is arranged along vertical mode in lifting rack rails Lifting rack rails engagement is stated, the lifting driving motor is for driving the driving gear.In this way, by the lifting driving source, Two cutting racks in the second cutter unit can be driven to carry out lifting and translocating in the vertical direction along the riser guide.

Particularly, in some embodiments, in two cutting racks being oppositely arranged in second cutter unit extremely Few one can be made to be biased to movement relative to another one.By taking the second cutter unit 53 in schema as an example, the left cutting rack of left and right settings At least one of 531 and right cutting rack 532 can be made to be biased to movement.In specific implementation, the left cutting rack 531 and right cut Cutting at least one of frame 532 can realize that deviation is mobile (that is, the relatively right cutting rack of left cutting rack 531 by offset driving mechanism 532, which make to be biased to move perhaps right cutting rack 532, makees to be biased to movement or left cutting rack 531 and right cut relative to left cutting rack 531 Cutting frame 532 can be biased to move).Using above-mentioned offset driving mechanism, it can be achieved that by the left cutting rack 531 being oppositely arranged and right cut It cuts at least one of frame 532 to be designed as to be biased to move relative to another one, so that left cutting rack 531 and right cutting rack 532 It is (spacing and right cutting rack 532 and silicon ingot 10 between left cutting rack 531 and silicon ingot 10 setting up and down for silicon ingot 10 Between spacing it is not identical, that is, be set around in the second cutting wheel group it is multiple second cutting line segments 534 and silicon ingot cutting angle In the acute angle or obtuse angle of on-right angle), so that the part being located under in any second cutting line segment 534 is cut in cutting operation Secant section first contacts silicon ingot 10 in upper part cutting line segment than being located at, then cutting line segment 534 from silicon ingot subsequent second It when 10 outlet, is then located in the second cutting line segment 534 in upper part cutting line segment than being located at the part cutting line under Silicon ingot 10 is left and outlet after section, in this way, 10 surface of silicon ingot of the part cutting line segment outlet under can prevent, avoid at least It is the reduction of the situation for chipping occur, the surface of silicon ingot 10 is farthest protected, improves the cut quality of silicon ingot 10.Into one Step ground can require according to cutting technique in practical applications and adjust mutual setting up and down, the example of two cutting racks in due course Such as, cutting technique require in require silicon ingot 10 top (or bottom) cutting surfaces cutting requirement it is higher, then will be relative to Lower and relative to the bottom of workpiece to be cut (or top) cutting is arranged in the cutting wheel group at the top (or bottom) of silicon ingot 10 Wheel group is arranged upper.Further more, since the cutting angle of the second cutting line segment 534 and silicon ingot 10 is in the acute angle or obtuse angle of on-right angle, Second cutting line segment 534 not will receive the frontal compression of silicon ingot 10, slows down the damage of the second cutting line, extends the second cutting The service life of line.

In addition, in some embodiments, in two cutting racks being oppositely arranged in second cutter unit at least One can make separate or close movement relative to another one.By taking the second cutter unit 53 as an example, the left cutting rack 531 of left and right settings It can make separate or close movement at least one of right cutting rack 532.In specific implementation, the left cutting rack 531 It can be realized by coil holder driving mechanism at least one of right cutting rack 532 far from or close to (that is, left cutting rack 531 is opposite Right cutting rack 532 makees the relatively left cutting rack 531 of separate or close perhaps right cutting rack 532 and makees separate or close or left cut to cut Frame 531 and right cutting rack 532 can be separate or close).Using above-mentioned coil holder driving mechanism, it can be achieved that the left cut that will be oppositely arranged It cuts at least one of frame 531 and right cutting rack 532 to be designed as to be biased to move relative to another one, so that left cutting rack 531 Spacing between right cutting rack 532 changes, the Cutting Length for cutting line segments 534 so as to adjust multiple second, so as to The silicon ingot 10 of different specification size is adapted to, and makes the Cutting Length of the second cutting line segment 534 suitable with 10 phase of silicon ingot to be cut With (avoiding the second cutting line segment 534 too long or too short), cutting efficiency and cut quality are improved.

Certainly, for the second cutter unit 53, on two cutting racks or base 1 also settable corresponding conducting wire, winding, Silk, tension mechanism etc. are arranged, for realizing the guiding of the second cutting line, tension adjustment and winding, row's silk etc., about conducting wire, volume Around, row's silk, the setting such as tension mechanism, details are not described herein.

Second workbench 51 be it is horizontally disposed, be used for horizontal bearing silicon ingot 10.In the present embodiment, as previously mentioned, second Cutter unit 53 is set to the top of the second workbench 51, and the second workbench 51 and 53 OQ t of the second cutter unit are mobile, because This, to enable the second cutter unit 53 to be cut along the crystal orientation of silicon ingot 10, when 51 horizontal bearing silicon ingot of the second workbench When 10, the crystal orientation of silicon ingot 10 be should be and the consistent vertical direction of lifting moving.In the present embodiment, the crystal orientation of silicon ingot 10 can be such as It is the normal normal (that is, along direction of bottom surface to the top surface of silicon ingot 10) along the bottom surface of silicon ingot 10, therefore, when the second work When 51 horizontal bearing silicon ingot 10 of platform, the bottom surface of silicon ingot 10 is resisted against the second workbench 51.

In addition, the second workbench 51 is equipped with corresponding multiple with the second cuttings line segments 534 multiple in the second cutter unit 53 Second cutting seam 511.In practical applications, the second cutting seam 511 is notching construction, the width with certain depth and notch Degree is greater than the line footpath of the second cutting line segment 534, in this way, the second cutting line segment 534 can be fallen into after cutting out silicon ingot 10 completely In second cutting seam 511, while realizing that silicon ingot 10 is cut, protection the second cutting line segment 534 can be played the role of, avoid the Two cutting line segments 534 and the second workbench 51 generate friction and damage.

When implementing cutting operation to silicon ingot 10 using the second cutter device 5, first carried by the second workbench 51 to be cut Silicon ingot 10 so that the crystal orientation of silicon ingot 10 to be cut be and the consistent vertical direction of lifting moving, recycle elevator drive machine Structure declines the second cutter unit 53, is contacted during decline by multiple second cutting line segments 534 in the second cutter unit 53 Start after to silicon ingot 10 cutting until completely through silicon ingot 10 (it is multiple second cutting line segments 534 along silicon ingot 10 crystal orientation to silicon Ingot 10 implements cutting), multiple first silicon cubes 11 are formed, at this point, multiple second cutting line segments 534 stay in corresponding second It is subsequent in cutting seam 511, to which the multiple first silicon cubes 11 formed are transferred out of the second workbench 51 and then pass through lifting Driving mechanism rises the second cutter unit to reset.

To make on the second workbench 51 of 10 feeding of silicon ingot to be cut to the second cutter device 5, the application silicon ingot Cutting equipment further includes material containing vehicle 6 and feeding transfer device 7.

Material containing vehicle 6 is used for the delivery of silicon ingot 10 to feeding area.In the present embodiment, material containing vehicle 6 may be, for example, AGV (Automated Guided Vehicle) trolley, AGV trolley are equipped with electricity magnetically or optically equal homing guidances device, can be along setting Fixed guide path traveling, is able to achieve unmanned carrying.

Feeding transfer device 7 is used to silicon ingot 10 being transferred to the second workbench 51 by feeding area.In the present embodiment, on Expect transfer device 7 more can include: loading guide 71 and the transfer bed 73 on loading guide 71.

Loading guide 71 is layed in the feeding area and second cutting area, and (the second workbench 51 is located at the second cutting Area) between, specifically, loading guide 71 is layed in the lower section of the feeding area and the second workbench 51 and is arranged along Y-direction.It is full Movement of the laying and transfer bed 73 of sufficient loading guide 71 on loading guide 71, the second workbench 51 are hollow design, In certain embodiments, the second workbench 51 may include be oppositely arranged two mounting structures (loading guide 71 i.e. be located at two Between mounting structures), two mounting structures all have a supporting part, so that belonging to two supports of two mounting structures Portion may make up one for carrying the support face of silicon ingot 10.In addition, being so that transfer bed 73 can realize stably translational in loading guide 71, double Guide Rail Designs can be used in loading guide 71, that is, use two loading guides 71, the two loading guides 71 are arranged parallel.

Transfer bed 73 can carry silicon ingot 10.In the present embodiment, transfer bed 73 can also configure hoisting mechanism, for be lifted or Decline the silicon ingot 10 of carrying.

Before by 10 feeding of silicon ingot to the second workbench 51, can also position correction be carried out to silicon ingot 10.For this purpose, the application Silicon ingot cutting equipment further includes charging positioning device, and the charging positioning device includes side surface positioning device 81 and position adjusting group Part (is not shown) in the drawings.Side surface positioning device 81 is set to the side of the feeding area.In the present embodiment, side localization machine Structure 81 includes two supporting beams, movable in each supporting beam that several are arranged towards the top of the feeding area middle section Structure out.The position adjusts component and is set on the table top of transfer bed 73 to contact with the silicon ingot 10 carried.In the present embodiment In, it is that universal ball end or machine with rotary circular adjust head that the position, which adjusts component,.In some embodiments, in transfer bed 73 Settable multiple universal ball ends or machine with rotary circular adjust head on table top.For example, five can be arranged on the table top of transfer bed 73 Universal ball end, wherein four universal ball ends are uniformly distributed, one regular figure of composition (such as: square, rectangle, diamond shape etc.) Four angles, another universal ball end are then located at center.

When implementing the feeding operation of silicon ingot 10, first silicon ingot 10 is delivered to feeding area by material containing vehicle 6；Again by transfer bed 73 Feeding area is moved to along loading guide 71 and (above process can also be such that transfer bed first positioned at the lower section of silicon ingot 10 73 are moved to feeding area along loading guide 71, then are delivered silicon ingot 10 to feeding area by material containing vehicle 6 and silicon ingot 10 is located at The top of transfer bed 73)；Transfer bed 73 is lifted using hoisting mechanism, touches silicon ingot 10 until jacking silicon ingot 10；Utilize feeding Positioning device carries out positioning calibration to silicon ingot, by side surface positioning device according to predetermined amount driving ejecting structure ejection, by the top Structure ejection silicon ingot 10 out, the opposite transfer bed under the ejection of ejecting structure and under the assistance of position adjusting component of silicon ingot 10 73 movements, to adjust position；The second workbench 51 of the second cutting area is moved to along loading guide by transfer bed 73；Transfer Platform 73 is declined using hoisting mechanism, is driven silicon ingot 10 to decline and is placed on the second workbench 51, completes the feeding of silicon ingot 10 simultaneously Cutting operation is implemented to silicon ingot 10 using the second cutter device 5.

After using material containing vehicle 6 and feeding transfer device 7 by 10 feeding of silicon ingot to the second workbench 51 to be cut, Cutting operation is implemented to silicon ingot 10 using the second cutter device 5, that is, the crystal orientation along silicon ingot 10 implements cutting operation, shape At multiple first silicon cubes 11.

The application silicon ingot cutting equipment further includes workpiece revolving platform 2 and workpiece transporter 9, wherein workpiece transporter 9 For multiple first silicon cubes 11 to be transported to workpiece revolving platform 2 by the second workbench 51.

Workpiece revolving platform 2 can turnover area between the second cutter device 5 and the first cutter device 3, it is more for carrying A first silicon cube 11.In the present embodiment, workpiece revolving platform 2 is i.e. as between the second cutter device 5 and the first cutter device 3 Turnover device, using workpiece revolving platform 2, it is right by the second cutter device 5 temporarily to dispose before being sent into the second cutter device Silicon ingot 10 implements the multiple first silicon cubes 11 formed after cutting operation.

Workpiece transporter 9 is set between the second cutter device 5 and workpiece revolving platform 2, is used for multiple first silicon cubes 11 are transported on workpiece revolving platform 2 by the second workbench 51.In the present embodiment, workpiece transporter 9 is more can include: workpiece takes Put unit and mobile mechanism, wherein the mobile mechanism is for driving the workpiece picking and placing unit mobile, to utilize the workpiece Multiple first silicon cubes 11 are transported to workpiece revolving platform 2 by the second workbench 51 by picking and placing unit.

The workpiece picking and placing unit is for picking and placing multiple first silicon cubes 11.In the present embodiment, the workpiece picks and places single Member may include two extracting pieces being oppositely arranged, and two extracting pieces can be linked together by a connection structure.Each The extracting piece is substantially L-shaped, it may include a support portion and the supporting part set on the support plate bottom, two be oppositely arranged A extracting piece can surround a support space.

The mobile mechanism is more can include: along the traveling mobile unit of the second workbench to workpiece revolving platform, lifting is moved Moving cell, telescopic moving unit and mobile control unit.Wherein, the mobile control unit and the traveling mobile unit, The lifting moving unit and telescopic moving unit connection execute corresponding movement for controlling each mobile unit. The control that the mobile control unit executes can include: the lifting is controlled according to the location information of multiple first silicon cubes 11 Mobile unit and the telescopic moving unit drive the workpiece picking and placing unit mobile to extract multiple first silicon cubes 11；Control The traveling mobile unit controlled after driving the workpiece picking and placing unit to be moved to workpiece revolving platform 2 the lifting moving unit and The telescopic moving unit drives the workpiece picking and placing unit mobile multiple first silicon cubes 11 are placed in workpiece revolving platform 2 On.

The location information according to multiple first silicon cubes 11 and control the lifting moving unit and the flexible shifting Moving cell drives the workpiece picking and placing unit mobile to extract multiple first silicon cubes 11, specifically can include: ensure the workpiece Two extracting pieces in picking and placing unit are located at the outside of multiple first silicon cubes 11, if it is not, stretching as described in so first control Mobile unit drives two extracting pieces in the workpiece picking and placing unit to be moved outwardly (far from the first silicon cube 11), so that described Extracting piece is located at the outside of multiple first silicon cubes 11, that is, the extracting piece will not interfere with multiple first silicon cubes 11；Control The lifting moving unit drives two extracting piece declines until the supporting part of the extracting piece will be lower than multiple first silicon cubes 11 bottom；Controlling the telescopic moving unit drives two extracting pieces to be moved inwardly (close to the first silicon cube 11) until described The supporting part of extracting piece and multiple first silicon cubes 11 have satisfactory overlapping region, generally, the branch of the extracting piece The side for holding portion and multiple first silicon cubes 11 has a gap, to avoid the support portion because directly contacting or colliding multiple the One silicon cube 11 and generate damage；Controlling the lifting moving unit drives two extracting pieces to rise until the extracting piece is held The contact of support portion and support live the bottom of multiple first silicon cubes 11, continue to control two extracting pieces of the lifting moving unit drive Rise, rises so that two extracting pieces extract multiple first silicon cubes 11 and be detached from the second workbench 51.

The control traveling mobile unit controls institute after driving the workpiece picking and placing unit to be moved to workpiece revolving platform 2 Stating lifting moving unit and the telescopic moving unit drives the workpiece picking and placing unit mobile with by multiple first silicon cubes 11 It is placed on workpiece revolving platform 2, specifically can include: control the traveling mobile unit and drive the workpiece picking and placing unit and its mention The multiple first silicon cubes 11 taken are moved in turnover area the top for corresponding to workpiece revolving platform 2；Control the lifting moving unit It drives two extracting piece declines to arrive workpiece revolving platform 2 until multiple first silicon cubes 11 contradict, continues to control the lifting moving Unit drives two extracting piece declines, and the bottom of supporting part and multiple first silicon cubes 11 in two extracting pieces is detached from, at this point, Multiple first silicon cubes are placed on workpiece revolving platform 2 completely；Controlling the telescopic moving unit drives the workpiece to pick and place Two extracting pieces in unit are moved outwardly (far from the first silicon cube 11), so that the extracting piece is located at multiple first silicon cubes 11 outside, that is, the extracting piece will not interfere with multiple first silicon cubes 11；It controls the lifting moving unit and drives two Extracting piece rises.

In practical applications, the traveling mobile unit may include traveling guide rail, traveling sliding block and traveling driving source, In, the traveling guide rail can be horizontally disposed with along direction of travel and (be arranged along Y-direction), such as set along the installation crossbeam of installation frame It sets, the traveling sliding block is set to the bottom of the connection structure of the workpiece picking and placing unit and matches with the traveling guide rail. The stability shifted to make the workpiece picking and placing unit advance can configure two traveling guide rails, the two traveling guide rails difference On two installation crossbeams being oppositely arranged.In some embodiments, the traveling driving source then may include along traveling side To the ball-screw and servo motor of setting.In some embodiments, the traveling driving source may include traveling rack rails, driving Gear and traveling driving motor, wherein the traveling rack rails is arranged and (is arranged along Y-direction) along direction of travel, the driving gear It is engaged with the traveling rack rails, the traveling driving motor is for driving the driving gear.

The telescopic moving unit may include telescopic rail, flexible sliding block and flexible driving source, wherein described stretch is led Rail can (i.e. along X to setting) horizontally disposed along telescopic direction in the bottom of the connection structure of the workpiece picking and placing unit, it is described to stretch Contracting sliding block is set on the first mounting surface of an exchanging structure and matches with the telescopic rail, wherein the exchanging structure can For example, triangle exchanging structure.For the stability for making the flexible displacement of the workpiece picking and placing unit, match for each extracting piece Two telescopic rails are set, the two telescopic rails are located at the opposite sides of the connection structure.In some embodiments, The flexible driving source then may include the ball-screw and servo motor along telescopic direction setting.In some embodiments, institute Stating flexible driving source may include flexible rack rails, driving gear and telescopic drive motor, wherein the flexible rack rails is along telescopic direction Setting (i.e. along X to setting), the driving gear is engaged with the flexible rack rails, described in the telescopic drive motor is used to driving Drive gear.

The lifting moving unit may include riser guide, lifting slider and lifting driving source, wherein the lifting is led Rail can be vertically arranged along lifting direction and (be arranged along Z-direction) the second mounting surface of exchanging structure in the workpiece picking and placing unit On, the lifting slider is set in the extracting piece and matches with the riser guide, wherein the exchanging structure can example For example triangle exchanging structure.For the stability for making the workpiece picking and placing unit lifting and translocating, configured for each extracting piece Two riser guides, the two riser guides are located at the opposite sides of the exchanging structure.In some embodiments, institute Stating lifting driving source then may include the ball-screw and servo motor along the setting of lifting direction.In some embodiments, described Lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein the lifting rack rails is set along lifting direction It sets and (is arranged along Z-direction), the driving gear is engaged with the lifting rack rails, and the lifting driving motor is for driving the drive Moving gear.

In this way, multiple first silicon cubes 11 can be transported to workpiece week by the second workbench 51 using workpiece transporter 9 On turntable 2.

The application silicon ingot cutting equipment may also include trimming leather jacket and set 21, for generate silicon ingot 10 after cutting operation Flaw-piece removal.Silicon ingot is being implemented using the second cutter device 5 silicon ingot 10 can be cut into multiple first silicon sides in cutting operation Body 11, wherein the two sides of silicon ingot 10 just will form flaw-piece, each flaw-piece contains a side of silicon ingot 10.The flaw-piece It can collect and recycle again.

In the present embodiment, trimming leather jacket, which sets 21, can include at least sucker, and the flaw-piece is sucked using the sucker and incites somebody to action It is transferred out.In some embodiments, the trimming leather jacket of the application silicon ingot cutting equipment configuration is set 21 and can be cut set on second It cuts between area and turnover area, after implementing cutting operation to silicon ingot using the second cutter device 5,21 can be set first with trimming leather jacket In sucker by the first neighbouring flaw-piece 111 (the first flaw-piece 11 is located at the front end of silicon ingot, adjacent to the sucker) be sucked and will It is transferred out, and multiple first silicon cubes 11 are transported to workpiece turnover by the second workbench 51 by workpiece transporter 9 to be utilized By the second neighbouring flaw-piece 112, (the second flaw-piece 112 is located at the rear end of silicon ingot, through transporting on platform 2 and then using the sucker Afterwards, the second flaw-piece 112 is adjacent to the sucker) it is sucked and is transferred out.In some embodiments, the application silicon ingot is cut Cut that equipment is configurable to can configure two suckers, the two suckers are located at the rear and front end of the second cutting area, when utilizing second After cutter device 5 implements cutting operation to silicon ingot, so that it may using the two sucker suckers respectively by corresponding first flaw-piece, 111 He Second flaw-piece 112 is sucked and is transferred out.In some embodiments, the application silicon ingot cutting equipment is configurable Two suckers, the two suckers are located at the rear and front end in the area Zhou Zhuan, when using workpiece transporter 9 by multiple first silicon sides After body 11 is transported on workpiece revolving platform 2 by the second workbench 51, so that it may respectively will be corresponding using the two sucker suckers First flaw-piece 111 and the second flaw-piece 112 are sucked and are transferred out.

In some embodiments, the trimming leather jacket, which is set, may also include flaw-piece structure for conveying, the flaw-piece structure for conveying It may be, for example, flaw-piece conveyer belt, in this way, flaw-piece can be discharged to the flaw-piece conveyer belt after flaw-piece is sucked in the sucker, by The flaw-piece is transferred out by the flaw-piece conveyer belt.

In some embodiments, the trimming leather jacket, which is set, may also include scrap-collecting box, and the scrap-collecting box is located at Outside base, in this way, flaw-piece can be delivered to after flaw-piece is sucked in the sucker in the scrap-collecting box of outside.

In some embodiments, the trimming leather jacket, which is set, may also include flaw-piece structure for conveying and scrap-collecting box, wherein The scrap-collecting box is located at outside base, and the flaw-piece structure for conveying is between the sucker and the scrap-collecting box, institute Stating flaw-piece structure for conveying may be, for example, flaw-piece conveyer belt, in this way, can discharge flaw-piece to described after flaw-piece is sucked in the sucker On flaw-piece conveyer belt, the flaw-piece is transferred in the scrap-collecting box by the flaw-piece conveyer belt.

First cutter device is used to implement cutting operation to the first silicon cube, forms the first silicon cube.In the present embodiment, Cutting operation can be implemented to the first silicon cube according to the crystal orientation of the first silicon cube using the first cutter device, for example, first cuts Cutting device is cut along the crystal orientation of the first silicon cube.

In the present embodiment, the first cutter device 3 may include the first workbench 31 and the first cutter unit 33.First work Platform 31 is located at the first cutting area, and for carrying the first silicon cube 11, the first cutter unit 33 has multiple first be oppositely arranged Cutting wheel group and the first cutting line, what first cutting line was sequentially around in the multiple first cutting wheel group each first cuts It cuts wheel 333 and forms multiple first cutting line segments 334, wherein multiple first cutting line segments 334 in the first cutter unit 33 are used for Cutting operation is implemented to the first silicon cube 11 according to the crystal orientation of the first silicon cube 11, forms multiple first silicon cubes.In reality It is by multiple first cutting line segments 334 and the first silicon cube 11 to be cut during implementing cutting operation in Relative displacement the first silicon cube 11 is contacted by the first cutting line segment 334 and cuts during relative displacement the first silicon cube 11.Therefore, in the application silicon ingot cutting equipment, at least one of the first workbench 31 and the first cutter unit 33 are arranged to It can be mobile relative to another one.That is, in one embodiment, the first workbench 31 is fixed setting, and the first cutter unit 33 It is set as to move relative to the first workbench 31.In another embodiment, the first cutter unit 33 is fixed setting, and First workbench 31 is set as to move relative to the first cutter unit 33.In yet another embodiment, the first workbench 31 For movable setting, the first cutter unit 33 is also movable setting, and the first cutter unit 33 and the first workbench 31 mutually move It is dynamic.

As previously mentioned, using the second cutter device 5 cutting operation, example can be implemented to silicon ingot 10 according to the crystal orientation of silicon ingot 10 Such as, the second cutter device 5 is cut along the crystal orientation of silicon ingot 10.Specifically, in the present embodiment, the crystal orientation of silicon ingot 10 E.g. along the normal normal (that is, along direction of bottom surface to the top surface of silicon ingot 10) of the bottom surface of silicon ingot 10, therefore, silicon ingot 10 Be by bottom surface contact in a manner of be placed in the second cutter device 5 the second workbench 51 on (that is, 51 support of the second workbench silicon The ground of ingot 10), multiple second cuttings line segments 534 in the second cutter device 5 are from top to bottom carried out along the crystal orientation of silicon ingot 10 Cutting.First workbench 31 and the first cutter unit 33 are arranged to relative translation in first cutter device 3, therefore, to reality It now remains to cut the first silicon cube 11 along the crystal orientation of the first silicon cube 11, certainly will need to carry out the first silicon cube 11 Overturn operation.In the application silicon ingot cutting equipment, workpiece is additionally provided between workpiece revolving platform 2 and the first cutter device 3 and is turned over Rotary device 4.Using Workpiece tilting device 4, the first silicon cube 11 on workpiece revolving platform 2 can be overturn and be transported to first Workbench 31.

Fig. 2 above-mentioned is please referred to, the structural schematic diagram of Workpiece tilting device is shown as.In conjunction with Fig. 2 and Fig. 7, workpiece turning Device 4 includes: bracket 41, clamping piece 43 and turnover driving mechanism 45.

The application silicon ingot cutting equipment, including work revolving platform, positioned at the first cutting dress of workpiece revolving platform opposite sides It sets and the second cutter device and the Workpiece tilting device between workpiece revolving platform and the first cutter device, wherein utilize Second cutter device implements cutting operation according to the crystal orientation of polycrystal silicon ingot and to polycrystal silicon ingot to form the first silicon cube, utilizes work The first silicon cube on workpiece revolving platform is overturn and is transported to the first cutter device by part turnover device, utilizes the first cutting Device implements cutting operation to the first silicon cube according to the crystal orientation of the first silicon cube to form the second silicon cube.Relative to correlation Technology, silicon ingot cutting equipment disclosed in the present application not only can complete the automatic of silicon ingot in the case of removing from and cutting cutting gauze The side's of melting operation improves silicon ingot evolution efficiency, even more in evolution operation, has fully considered the crystal orientation situation of silicon ingot, thus Evolution may make to form the second silicon cube and there can be more preferably performance, for example, can reduce the second silicon cube generates cracking etc. Risk.

It is carried out below for the whole flow process that silicon ingot cutting equipment of the Fig. 4 into Fig. 7 is applied to the operation of silicon ingot evolution detailed Illustrate, it should be noted that, herein, the crystal orientation of silicon ingot 10 is, for example, the normal normal along the bottom surface of silicon ingot 10 (that is, along silicon The direction of the bottom surface of ingot 10 to top surface).

Silicon ingot 10 is delivered to feeding area, at this point, the bottom surface of silicon ingot 10 againsts material containing vehicle 6 by material containing vehicle 6.

Transfer bed 73 by being located at feeding area rises and jacking silicon ingot 10, at this point, silicon ingot 10 is detached from material containing vehicle 6.

Positioning calibration is carried out to silicon ingot using charging positioning device, drives ejection knot according to predetermined amount by side surface positioning device Structure ejection, by the ejecting structure ejection silicon ingot 10, silicon ingot 10 is under the ejection of ejecting structure and the position adjusts component Lower opposite transfer bed 73 is assisted to act, to adjust position.

Silicon ingot 10 is transferred to 51 top of the second workbench by transfer bed 73, transfer bed 73 declines so that silicon ingot 10 to be placed in On second workbench 51, the bottom surface of silicon ingot 10 againsts the second workbench 51, and the crystal orientation of silicon ingot 10 is upper and lower vertical direction.

Cutting operation is implemented to silicon ingot 10 using the second cutter device 5, specifically, declines the second cutter unit 53, by the Multiple second cutting line segments 534 in two cutter units 53 start cutting until completely after touching silicon ingot 10 during decline Through silicon ingot 10 (multiple second cutting line segments 534 are implemented to cut along the crystal orientation of silicon ingot 10 to silicon ingot 10), multiple first is formed Silicon cube 11, at this point, multiple second cutting line segments 534 stay in corresponding second cutting seam 511.

It is set using the trimming leather jacket between the second cutting area and turnover area by neighbouring the first flaw-piece (the first flaw-piece position In the front end of silicon ingot 10) it is transferred out.

Multiple first silicon cubes 11 are transported on workpiece revolving platform 2 by the second workbench 51 using workpiece transporter 9.

In the second cutting area, rises the second cutter unit 53 to reset, the next of feeding area will be located at by transfer bed 73 Silicon ingot 10 is transferred on the second workbench 51；In turnover area, the trimming leather jacket between the second cutting area and turnover area is utilized It sets and is transferred out neighbouring the second flaw-piece (rear end that the second flaw-piece is located at silicon ingot 10)；In the first cutting area, turned over using workpiece At least one first silicon cube 11 on workpiece revolving platform 2 is overturn and is transported to the first workbench 31 by rotary device 4 On.

In the first cutting area, cutting operation is implemented to the first silicon cube 11 using the first cutter device 3, specifically, driving Multiple first cutting line segments 334 of first workbench 31 towards the first cutter unit 33 are mobile, and multiple first cutting line segments 334 are right Respective first cutting seam 311 is answered to enter 31 inside of the first workbench and to the first silicon cube carried on the first workbench 31 11 carry out cutting until (crystal orientation of multiple first cutting line segments 334 along the first silicon cube 11 of completely cut off first silicon cube 11 First silicon cube 11 is implemented to cut), form multiple second silicon cubes 12.It is right using the second cutter device 5 in the second cutting area Next silicon ingot 10 implements cutting operation, specifically, declines the second cutter unit 53, by multiple the in the second cutter unit 53 Two cutting line segments 534 start cutting until completely through next silicon ingot 10 after touching next silicon ingot 10 during decline (multiple second cutting line segments 534 are implemented to cut along the crystal orientation of next silicon ingot 10 to next silicon ingot 10), forms multiple the One silicon cube 11, at this point, multiple second cutting line segments 534 stay in corresponding second cutting seam 511.

It is subsequent by multiple second silicon cubes 12 of formation by unloading and transferring away on the first workbench 31, it continues with At least one first silicon cube 11 on workpiece revolving platform 2 is overturn and is transported to the first work by Workpiece tilting device 4 On platform 31, so that the first cutter device 3 implements cutting operation to the first silicon cube 11.

From the foregoing, it will be observed that not only may make silicon ingot to cut in the first time of evolution operation using the application silicon ingot cutting equipment Be to be cut along the crystal orientation of silicon ingot in second cutting, it can be ensured that the product quality that evolution is formed can reduce by the Two silicon cubes generate the risks such as cracking, while relative to the prior art for implementing evolution to silicon ingot using the double-deck cutting gauze, can Remove cutting cutting gauze from and the problems such as by manually threading again.Further more, the application silicon ingot cutting equipment, the first cutter device and Second cutter device can realize automation and pipelining, substantially increase the efficiency of silicon ingot evolution.

Illustrate referring to Fig. 8, being shown as silicon ingot cutting equipment in one embodiment of the application in the process for implementing cutting operation Figure.It can comprise the following steps that as shown in figure 8, the silicon ingot cutting equipment implements cutting operation

Silicon ingot is placed on the second workbench by step S201.

Step S203 implements cutting to the silicon ingot on the second workbench according to the crystal orientation of silicon ingot using the second cutter unit Operation forms multiple first silicon cubes.In step S203, using the first cutter unit according to the crystal orientation of the silicon ingot and to Silicon ingot on one workbench implements cutting operation, comprising: using the relative movement of the first cutter unit and the first workbench, by the Multiple first cutting line segments in one cutter unit are cut along the crystal orientation of silicon ingot, form multiple first silicon cubes.

Multiple first silicon cubes are transported on workpiece revolving platform by step S205.

The first silicon cube on workpiece revolving platform is overturn using Workpiece tilting device and is transported to the first work by step S207 Make on platform.

Step S209, using the first cutter unit according to the crystal orientation of the first silicon cube and to the first silicon on the first workbench Cube implements cutting operation, forms multiple second silicon cubes.In step S209, using the first cutter unit according to the first silicon side The crystal orientation of body and on the first workbench the first silicon cube implement cutting operation, comprising: utilize the first cutter unit and first The relative movement of workbench is cut by multiple first cutting line segments in the first cutter unit along the crystal orientation of the first silicon cube It cuts, forms multiple second silicon cubes.

From the foregoing, it will be observed that during implementing silicon ingot cutting operation, first by the second cutter device according to the crystalline substance of polycrystal silicon ingot Implement cutting operation to and to polycrystal silicon ingot, forms the first silicon cube, it afterwards will be on workpiece revolving platform using Workpiece tilting device First silicon cube is overturn and is transported to the first cutter device, then by the first cutter device according to the crystal orientation of the first silicon cube and Cutting operation is implemented to the first silicon cube, forms the second silicon cube, in this way, not only can be in the case of removing cutting cutting gauze from The automation evolution operation for completing silicon ingot, improves silicon ingot evolution efficiency and has fully considered silicon ingot even more in evolution operation Crystal orientation situation, to may make evolution to form the second silicon cube and can have more preferably performance, for example, the second silicon side can be reduced Body generates the risks such as cracking.

The principles and effects of the application are only illustrated in above-described embodiment, not for limitation the application.It is any ripe Know the personage of this technology all can without prejudice to spirit herein and under the scope of, carry out modifications and changes to above-described embodiment.Cause This, those of ordinary skill in the art is complete without departing from spirit disclosed herein and institute under technical idea such as At all equivalent modifications or change, should be covered by claims hereof.

Claims

1. a kind of silicon ingot cutting equipment characterized by comprising

Workpiece revolving platform, for carrying at least one first silicon cube；

First cutter device is adjacent to the workpiece revolving platform, including the first workbench and the first cutter unit, wherein described First cutter unit has multiple first cutting line segments；And

Workpiece tilting device is set between the workpiece revolving platform and first cutter device, for the workpiece to have enough to meet the need The first silicon cube on platform is overturn and is transported to first workbench, for multiple in first cutter unit One cutting line section is used for the crystal orientation according to the first silicon cube and implements cutting operation to the first silicon cube, is formed multiple Second silicon cube.

2. silicon ingot cutting equipment according to claim 1, which is characterized in that first cutter unit, which has, to be oppositely arranged Multiple first cutting wheel groups and the first cutting line, first cutting line be sequentially around in the multiple first cutting wheel group Each first cutting wheel forms multiple first cutting line segments.

3. silicon ingot cutting equipment according to claim 2, which is characterized in that first workbench and first cutting At least one of unit is arranged to can be mobile relative to another one.

4. silicon ingot cutting equipment according to claim 2, which is characterized in that first cutter unit is located at described first The side of workbench；First cutter unit includes the upper cutting rack being oppositely arranged and lower cutting rack, the upper cutting rack and Multiple first cutting wheels are equipped on lower cutting rack, first cutting wheel on the upper cutting rack of same position and lower cutting rack On first cutting wheel form a first cutting wheel group；The workbench is equipped with corresponding with multiple first cutting line segments Multiple first cutting seams.

5. silicon ingot cutting equipment according to claim 4, which is characterized in that cut in first workbench and described first At least one of unit is cut equipped with translational drive mechanism.

6. silicon ingot cutting equipment according to claim 1, which is characterized in that the Workpiece tilting device includes:

Bracket；

Axis is connected to the clamping piece of the bracket, for clamping the first silicon cube；And

The turnover driving mechanism being connected between the bracket and the clamping piece, for driving the clamping piece and its clamped The first silicon cube make flip-flop movement.

7. silicon ingot cutting equipment according to claim 6, which is characterized in that the clamping piece includes: clamping ontology and phase To two clamping parts being set on the clamping ontology.

8. silicon ingot cutting equipment according to claim 7, which is characterized in that at least one of described two clamping parts are set Being set to can be mobile relative to another one.

9. silicon ingot cutting equipment according to claim 1, which is characterized in that further include feeding device, be used for the first silicon Cube is transferred on the workpiece revolving platform by feeding area.

10. silicon ingot cutting equipment according to claim 9, which is characterized in that further include charging positioning device, for institute It states the first silicon cube and carries out positioning calibration before being transferred on the workpiece revolving platform by the feeding device.

11. silicon ingot cutting equipment according to claim 1, which is characterized in that further include being adjacent to the workpiece revolving platform The second cutter device, comprising: the second workbench, for carrying silicon ingot；Second cutter unit has multiple second cutting lines Section；Wherein, multiple second cutting line segments in second cutter unit are for the crystal orientation according to the silicon ingot and to the silicon Ingot implements cutting operation, forms multiple first silicon cubes.

12. silicon ingot cutting equipment according to claim 11, which is characterized in that second cutter unit has opposite set The multiple second cutting wheel groups set and the second cutting line, second cutting line are sequentially around in the multiple second cutting wheel group Each second cutting wheel formed it is multiple second cutting line segments.

13. silicon ingot cutting equipment according to claim 12, which is characterized in that second workbench and described second is cut At least one of unit is cut to be arranged to move relative to another one.

14. silicon ingot cutting equipment according to claim 12, which is characterized in that second cutter unit is set to described the The top of two workbench；Second cutter unit includes the left cutting rack and right cutting rack being oppositely arranged, the left cutting rack With multiple second cutting wheels are equipped on the right cutting rack, second cutting wheel on the left cutting rack of same position and right Second cutting wheel on cutting rack forms a second cutting wheel group；Second workbench is equipped with and multiple second cuttings The corresponding multiple second cutting seams of line segment.

15. silicon ingot cutting equipment according to claim 14, which is characterized in that second workbench and described second is cut At least one of unit is cut equipped with lift drive mechanism.

16. silicon ingot cutting equipment according to claim 11, which is characterized in that further include workpiece transporter, being used for will Multiple first silicon cubes are transported to the workpiece revolving platform by second workbench.

17. silicon ingot cutting equipment according to claim 16, which is characterized in that the workpiece transporter includes:

Workpiece picking and placing unit；And

Mobile mechanism, for driving the workpiece picking and placing unit mobile, to utilize the workpiece picking and placing unit by multiple first silicon Cube is transported to workpiece revolving platform by the second workbench.

18. silicon ingot cutting equipment according to claim 17, which is characterized in that the mobile mechanism includes:

Along the traveling mobile unit of the second workbench to workpiece revolving platform；

Lifting moving unit；

Telescopic moving unit；And

Mobile control unit is connect with the traveling mobile unit, the lifting moving unit and the telescopic moving unit, For: the lifting moving unit is controlled according to the location information of multiple first silicon cubes and the telescopic moving unit drives The workpiece picking and placing unit is mobile to extract multiple first silicon cubes, controls the traveling mobile unit and the workpiece is driven to pick and place Unit controls the lifting moving unit after being moved to workpiece revolving platform and the telescopic moving unit drives the workpiece to pick and place Unit is mobile multiple first silicon cubes to be placed on workpiece revolving platform.

19. silicon ingot cutting equipment according to claim 11, which is characterized in that further include that trimming leather jacket is set, be used for institute State the flaw-piece removal that silicon ingot generates after second cutter device implements cutting operation.

20. silicon ingot cutting equipment according to claim 11, which is characterized in that further include feeding transfer device, being used for will Silicon ingot is transferred on second workbench by feeding area.

21. silicon ingot cutting equipment according to claim 20, which is characterized in that the feeding transfer device includes:

Loading guide is layed between feeding area and second workbench；And

Transfer bed is set on the loading guide.

22. silicon ingot cutting equipment according to claim 21, which is characterized in that further include charging positioning device, it is described on Expect that positioning device includes:

Side surface positioning device, the side set on the feeding area；And

Position adjusts component, to contact with the silicon ingot carried on the table top of the transfer bed.

23. silicon ingot cutting equipment according to claim 22, which is characterized in that it is universal ball end that the position, which adjusts component, Or machine with rotary circular adjusts head.

24. silicon ingot cutting equipment according to claim 21, which is characterized in that further include material containing vehicle, be used for the silicon Ingot is transported on the transfer bed of the feeding transfer device after delivering to feeding area.