CN113799278A

CN113799278A - Wire cutting device and silicon rod processing equipment

Info

Publication number: CN113799278A
Application number: CN202010544531.2A
Authority: CN
Inventors: 苏静洪; 吴张琪; 梁文; 卢建伟; 潘雪明; 曹奇峰; 钱春军
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2020-06-15
Filing date: 2020-06-15
Publication date: 2021-12-17
Also published as: WO2021254082A1

Abstract

The application discloses a linear cutting device and silicon rod processing equipment; the wire cutting device comprises at least one distance adjusting mechanism and is arranged on at least one wire cutting unit, under the action of the distance adjusting mechanism, a plurality of cutting wheels of the at least one wire cutting unit in the wire cutting device can be driven to move along the second direction and wind at least one cutting wire saw formed by the plurality of cutting wheels, so that the cutting position in the second direction can be changed under the action of the distance adjusting mechanism, and or based on that the plurality of cutting wheels move the changeable cutting wires in the second direction and wind the wire groove positions of the plurality of cutting wheels, based on that the distance adjusting mechanism realizes that the process of changing the position of the cutting wire or the groove is simple and easy, is easy to realize and is convenient to operate, and the operation efficiency is improved.

Description

Wire cutting device and silicon rod processing equipment

Technical Field

The application relates to the technical field of silicon rod processing, in particular to a linear cutting device and silicon rod processing equipment.

Background

In the field of photovoltaic power generation, a common crystalline silicon solar cell is fabricated on a high-quality silicon wafer cut from a solar silicon material by wire sawing. At present, wire cutting techniques represented by diamond wires are widely used in cutting silicon materials, such as single crystal silicon materials or polycrystalline silicon materials, because of their characteristics of high production efficiency, low operation cost, high operation precision, etc., and the cutting operations of silicon materials include, but are not limited to, cutting-off operations, squaring operations, slicing operations, etc.

Take the operation of the evolution of wire-electrode cutting technique applied to single crystal silicon rod as an example, will wait to cut the silicon rod and vertically place and fix a position earlier, reuse wire cutting device from waiting to cut the top of silicon rod get into and follow silicon rod length direction downfeed until waiting to cut the bottom of silicon rod and wear out after to cut four two liang of parallel axle tangent planes in silicon rod circumference, wherein, wire cutting device commonly used includes single line cutting device and multi-thread cutting device.

In the related wire cutting device, a plurality of cutting wheels are either respectively arranged on the rotating shaft and then fixed through the mounting bracket or a plurality of cutting wheels are arranged on the same main shaft and then fixed through the mounting bracket, generally, once the cutting wheels are installed in place, the positions and the mutual relations of the cutting wheels cannot be easily changed, therefore, when the wire groove of one cutting wheel is worn, the wire groove needs to be integrally replaced, and the position of the cutting wheel or other components (such as transition wheels and the like) needs to be adjusted and needs to be calibrated again when the wire groove is replaced, so that the whole process is very complicated and the efficiency is low.

For this reason, designs are successively provided in the industry, which enable the wire chase to be replaced by a cutting wheel, for example, adjusting shims (such as chinese patent documents CN205588494U and CN205522032U) are provided when the cutting wheel is installed, wherein the thickness of the adjusting shims is equal to the distance between two adjacent wire chases, so that the wire chases can be replaced by increasing or decreasing the adjusting shims, for example, the wire chases can be replaced by the next adjacent wire chases by increasing or decreasing one adjusting shim. However, in such a structure, steps such as loosening screws, adding or removing adjustment pads, retightening screws, and finally calibrating are still required, and there are still problems such as troublesome operation and low efficiency.

Disclosure of Invention

In view of the above disadvantages of the related art, an object of the present application is to provide a wire cutting device and a silicon rod processing apparatus, so as to solve the problems of the prior art that the groove replacement process is complicated and the efficiency is not high after the wire cutting device is worn.

To achieve the above and other related objects, there is disclosed herein a wire cutting device of a silicon rod processing apparatus, the silicon rod processing apparatus including: the base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; the wire cutting device includes: the cutting frame is arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

The present application also discloses in a second aspect a silicon rod processing apparatus comprising: the base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; a wire cutting apparatus according to any embodiment of the first aspect of the present application.

To sum up, the wire cutting device and the silicon rod processing equipment that this application provided have following beneficial effect: the wire cutting device comprises at least one distance adjusting mechanism and is arranged on at least one wire cutting unit, under the action of the distance adjusting mechanism, a plurality of cutting wheels of the at least one wire cutting unit in the wire cutting device can be driven to move along the second direction, and at least one cutting wire saw formed by the plurality of cutting wheels can be wound on the second direction, so that the cutting position of the cutting wire saw can be changed under the action of the distance adjusting mechanism, and or the position of the wire groove of the plurality of cutting wheels can be changed based on the fact that the plurality of cutting wheels move in the second direction, the process of changing the position of the cutting wire or changing the groove is simple and easy, the operation is easy to realize and convenient, and the operation efficiency is improved.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The drawings are briefly described as follows:

Fig. 1 is a schematic view showing the structure of the silicon rod loading and unloading device according to an embodiment of the present invention.

Fig. 2a shows a partial structural view of the silicon rod handling device in a state of holding a silicon rod to be cut in one embodiment.

Fig. 2b shows a bottom view of a part of the structure of the silicon rod handling device in a state of holding a silicon rod to be cut in one embodiment.

Fig. 3a shows a partial configuration of the silicon rod handling device in a state of holding a cut silicon rod in one embodiment.

Fig. 3b shows a bottom view of a part of the arrangement of the silicon rod handling device in a state in which the silicon rod handling device in one embodiment grips a cut silicon rod.

Fig. 4 is a schematic view showing a configuration of a silicon rod holder in one embodiment of the silicon rod loading and unloading apparatus of the present application.

Fig. 5 is a schematic view showing the structure of the silicon rod loading and unloading device according to an embodiment of the present invention.

Fig. 6 is a schematic structural view of a lifting drive mechanism in one embodiment of the silicon rod loading and unloading device of the present application.

Fig. 7a to 7b show the silicon rod handling device in an embodiment with the elevation drive mechanism in different states.

Fig. 8a to 8d show schematic views of the silicon rod handling device according to the present application in different transfer states in one embodiment.

Fig. 9 is a schematic view showing the configuration of a silicon rod movement device of the silicon rod processing apparatus according to an embodiment of the present invention.

Fig. 10 is a schematic structural view of an elastic pushing rod structure of the silicon rod processing apparatus according to an embodiment of the present invention.

Fig. 11 is a schematic view showing a partial configuration of a silicon rod transfer device of the silicon rod processing apparatus according to an embodiment of the present invention.

Fig. 12 is a schematic view showing the configuration of a silicon rod transfer device of the silicon rod processing apparatus according to the present application in one embodiment.

Fig. 13 is a schematic structural view of the silicon rod pressing device according to an embodiment of the present disclosure.

Fig. 14a is a schematic structural view of the silicon rod pressing device according to an embodiment of the present application.

Fig. 14B-14c show enlarged views of B in fig. 14a in different locked states.

Fig. 15 is an enlarged schematic view of a portion a of fig. 13.

Fig. 16 is a schematic structural diagram of a wire cutting apparatus according to an embodiment of the present invention.

Fig. 17 is a schematic view of a wire cutting device according to the present application, which is applied to a silicon rod extracting apparatus according to an embodiment.

Fig. 18 is a schematic view of the wire cutting device according to the present application, which is applied to a silicon rod extracting apparatus according to an embodiment of the present application.

Fig. 19 is a schematic structural view of a wire cutting unit in the wire cutting device according to an embodiment of the present invention.

Fig. 20 is a schematic view of the middle cutting wheel and the transition wheel beside the middle cutting wheel in one embodiment of the wire cutting device.

Fig. 21 shows a schematic view of a part of the configuration of a silicon rod processing apparatus according to the present application as a silicon rod truncating apparatus in an embodiment.

Fig. 22 shows a schematic view of a part of the configuration of a silicon rod processing apparatus in an embodiment, which is a silicon rod slicing and grinding machine.

Fig. 23 is a schematic structural diagram of a wire cutting apparatus according to an embodiment of the present invention.

Fig. 24 is a schematic structural view of a transition wheel and a support of the wire cutting apparatus according to an embodiment of the present invention.

Fig. 25 is an enlarged schematic view at C in fig. 23.

Fig. 26 is an enlarged schematic view at D in fig. 17.

Fig. 27 is a top view of a wire cutting apparatus of the present application in one embodiment.

Fig. 28 is a side view of a wire cutting apparatus of the present application in one embodiment.

Fig. 29 is an enlarged schematic view of fig. 28 at E.

Fig. 30 is a schematic view showing the structure of the flaw-piece discharging device of the present application, which is applied to a silicon rod extracting apparatus in one embodiment. Fig. 31 is a schematic structural view of the flaw-piece discharging device of the present application in one embodiment.

Fig. 32 is a schematic view of the structure of the flaw-piece discharging device of the present application in an embodiment of the flaw-piece jacking mechanism.

Figure 33 is a schematic diagram of the construction of a flaw-piece elevator unit in one embodiment of the present application.

Figure 34 shows a schematic view of a clamping assembly of the present application for a flaw-piece discharge apparatus in one embodiment.

Figure 35 is a cross-sectional view of a clamping assembly of the present application for a flaw-piece discharge apparatus in one embodiment.

Figure 36 shows a schematic cross-sectional view of a clamping assembly of another embodiment of the present application of the flaw-piece discharge apparatus.

Figures 37a-37e show schematic views of different states of a flaw-piece discharge apparatus for carrying out flaw-piece transfer in one embodiment.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first wire slot may be referred to as a second wire slot, and similarly, a second wire slot may be referred to as a first wire slot, without departing from the scope of the various described embodiments. The first and second wire slots are both described as one wire slot, but they are not the same wire slot unless the context clearly dictates otherwise. Similar situations also include a first wire cutting unit and a second wire cutting unit, or a first cutting wheel set and a second cutting wheel set.

Crystalline silicon is usually processed into a silicon wafer form in industrial production and then used for product manufacturing, wherein originally obtained silicon rods comprise a monocrystalline silicon rod and a polycrystalline silicon rod, the monocrystalline silicon rod is a rod-shaped monocrystalline silicon grown from a melt by using a czochralski method or a suspension zone melting method, for example, a monocrystalline silicon rod with a length specification of 5000mm or 5360mm, or a monocrystalline silicon rod with a length of about 800mm, etc., which are commonly used in silicon rod processing, and the polycrystalline silicon is a silicon rod obtained by precipitating silicon on the surface of a silicon core wire by using a precipitation technology such as a chemical vapor deposition technology.

The existing silicon wafer manufacturing process generally comprises the steps of firstly pulling a polycrystalline silicon brittle material into a single crystal silicon rod, and then squaring by using a squarer; at the moment, the cutting mechanism feeds along the length direction of the silicon rod and cuts four planes which are parallel in pairs along the circumferential direction of the silicon rod, so that the cross section of the silicon rod is in a similar rectangle shape; and after the evolution is finished, slicing the silicon rod after evolution along the length direction by adopting a multi-line slicing machine to obtain the required silicon wafer.

In the operation of evolution to the silicon rod, need will treat cutting silicon rod (promptly the silicon rod that has not already undergone the evolution) and load the predetermined position that bears on the silicon rod evolution equipment to in cooperation with the wire-electrode cutting device and carry out the evolution cutting with predetermined specification to the silicon rod, after the evolution is accomplished, need will cut the silicon rod and transport the bearing structure who leaves the frame so that silicon rod evolution equipment can continue to cut the processing and treat cutting silicon rod.

The application provides a silicon rod loading and unloading device for silicon rod squaring equipment, the silicon rod squaring equipment comprises a base, a silicon rod bearing structure and a wire cutting device, wherein the silicon rod bearing structure is used for bearing a vertically placed silicon rod; the silicon rod handling device includes: the first support is hung on the base through a mounting frame; the silicon rod clamp is arranged on the first support and used for clamping a silicon rod to be cut or a cut silicon rod; and the shifting mechanism is used for driving the first support and the silicon rod clamp thereon to shift on the mounting frame along at least one direction, so that the silicon rod clamp moves to a first preset position to clamp the silicon rod to be cut or the cut silicon rod and moves the clamped silicon rod to be cut or the cut silicon rod to a second preset position.

Here, the first predetermined position and the second predetermined position are limited to fixed positions or areas established in the established coordinate system, and in the example provided in the present application, by determining a transfer path of the handling apparatus in handling, a starting position of a first support in the silicon rod handling apparatus in the transfer path is taken as a first predetermined position and an end position of the first support is taken as a second predetermined position in accordance with a time sequence of the transfer. When the silicon rod loading and unloading device carries out a feeding process, the position of the silicon rod clamp for clamping the silicon rod to be cut is a first preset position, and the moving mechanism moves to move the silicon rod to be cut to the position above the bearing surface of the silicon rod bearing structure so as to place the silicon rod to be cut on the silicon rod bearing structure and take the position as a second preset position; on the contrary, when the silicon rod handling device performs a blanking process of transferring the cut silicon rod after the cutting out from the base, the first support is located at the position adjacent to the silicon rod carrying structure to hold the cut silicon rod as an initial position, that is, a first predetermined position, and the position where the cut silicon rod is transferred away from the base by the silicon rod clamp and released is a second predetermined position.

Referring to fig. 1, a schematic structural view of a silicon rod handling device according to an embodiment of the present disclosure is shown. As shown, the first bracket 31 is hung on the base by a mounting frame 33. The first support 31 may serve as a support structure for the silicon rod holder 32, and the first support 31 is movably disposed on the mounting frame 33 and is movable in at least one direction by the displacement mechanism, thereby moving the silicon rod to be cut or the cut silicon rod held by the silicon rod holder 32.

The mounting frame 33 is arranged above the machine base, where the mounting frame 33 may be used to determine the path and range span along which the first support 31 is moved along the mounting frame 33, in some embodiments, as in the example shown in fig. 1, the mounting frame 33 is arranged above the silicon rod carrying features of the handling area in the silicon rod processing platform of the machine base, while the length range of the mounting frame 33 in the first direction is larger than the handling area, or the end point of the length of the mounting frame 33 in the first direction is located outside the silicon rod carrying features of the handling area, so that the first support 31, when moving along the mounting frame 33, may be moved to the position adjacent to any silicon rod carrying feature of the handling area to position a silicon rod to be cut on the corresponding silicon rod carrying feature or to transfer a cut silicon rod on the silicon rod carrying feature away from the handling area. The loading and unloading area is an area for loading and unloading on a silicon rod processing platform of the silicon rod squaring device. For example, in some examples, the mounting frame 33 is disposed parallel to a wire cutting support of the silicon rod squaring apparatus to take full advantage of the equipment space left above the machine base.

The silicon rod handling device 3 may be mounted on a base of the silicon rod extraction apparatus via a mounting frame 33, and in some examples, the silicon rod handling device 3 may also be detachable as a separate component from the silicon rod extraction apparatus, for example as a separate sales device. For example, the mounting frame 33 and the silicon rod squaring device are detachably connected, and the mounting frame 33, the first support 31 and the silicon rod clamp 32 may be disposed on the silicon rod squaring device; for another example, the first support 31 and the mounting frame 33 are detachably connected, and the first support 31 and the silicon rod clamp 32 may be disposed on a silicon rod squaring device including the mounting frame 33 or a hoisting frame.

The silicon rod holder 32 is provided on the first support 31, and here, the silicon rod holder 32 includes a silicon rod holder that contacts a surface of a silicon rod and performs a holding or releasing action. In some examples, the silicon rod holder 32 comprises a silicon rod holding member, and in this example, the holding surface of the silicon rod holding member may be configured to have a height to ensure that the contact area of the silicon rod holding member with the side surface of the silicon rod placed vertically in the holding state can be held.

Referring to fig. 2a, a schematic view of a first support 31 and a silicon rod clamp of the silicon rod handling device of the present application is shown in one example. As shown in fig. 2a, any one of the silicon rod clamping members on the first support 31 includes a first clamping arm 321 and a second clamping arm 322 disposed opposite to each other, and a clamping arm driving mechanism 320 for driving the first clamping arm 321 and the first clamping arm 321 to open and close. It should be understood that the first clamping arm 321 and the second clamping arm 322 may be arranged in a mirror image manner or in a symmetrical manner, and when the first clamping arm 321 and the second clamping arm 322 perform a closing action, they can be used to approach and clamp the silicon rod; when the first clamping arm 321 and the second clamping arm 322 perform an opening action, the silicon rod can be released.

In some embodiments, the first and second clamp arms have clamp arcs and clamp planes. Here, the silicon rod clamping member may be configured to clamp a silicon rod to be cut or a cut silicon rod, and in order to vertically place the clamped silicon rod on the silicon rod supporting structure or clamp the vertically placed silicon rod from the silicon rod supporting structure, the first clamp arm and the first clamp arm clamp the side surface of the silicon rod through opening and closing actions, that is, the silicon rod is vertical in a clamping state. Correspondingly, the first clamping arm and the first clamping arm are provided with clamping arc surfaces adapted to the arc surfaces of the silicon rods to be cut and clamping planes adapted to the planes of the side surfaces of the cut silicon rods.

The clamping arc surfaces of the first clamping arm and the second clamping arm are not limited to arc surfaces for contacting silicon rods, and in some implementations, reference is made to fig. 2a to 3b, which are shown as side views and bottom views of the silicon rod clamping member of the present application in different clamping states, wherein fig. 2a and 2b are schematic perspective views and bottom views of the silicon rod clamping member clamping a silicon rod to be cut having an arc-shaped side surface, and fig. 3a and 3b are schematic perspective views and bottom views of the silicon rod clamping member clamping a cut silicon rod. As shown in the figure, a clamping arc surface and a clamping plane are symmetrically arranged on the first clamping arm and the second clamping arm.

As shown in fig. 3a and 3b, the clamping arc surface may be a contact plane which is disposed in different directions according to the curvature of the surface of the silicon rod, and in the view shown in fig. 3b, the planes in different directions on a single clamping arm are symmetrical to the diameter of the cross section of the silicon rod, so that the pressures applied to the silicon rod by the first clamping arm 321 and the second clamping arm 322 during clamping meet at the center of the cross section of the silicon rod, so as to prevent the extension lines of the resultant force of the pressures applied to the silicon rod in the clamped state from being outside the clamping arc surface and causing the silicon rod to have a tendency to separate from the silicon rod clamping member.

In certain implementation manners, the clamping arc surfaces of the first clamping arm and the second clamping arm exceed an arc of one fourth of the side surface of the silicon rod to be cut, and a clamping contact surface formed during clamping exceeds one half of the arc of the side surface of the silicon rod; moreover, a buffer cushion can be further arranged on the clamping arc surface to avoid damaging the surface of the silicon rod in a clamping state. The buffer cushion is made of elastic rubber material, or silica gel or other materials with elastic deformation, damping characteristics or buffering characteristics, so as to prevent the surface of the silicon rod to be cut or the cut silicon rod from being scratched or cracked during clamping and transporting.

In some examples, the clamp arm drive mechanism comprises: an opening and closing gear, a rack, and a driving source (not shown); the driving source is connected with the gear driving piece and used for driving the gear driving piece to move.

In one implementation, the gear driving member is a rack, the rack is located between the first clamping arm and the second clamping arm, two outer side surfaces of the clamping arms facing two sides in the rack are respectively provided with toothed patterns corresponding to the engagement of the opening and closing gears on the first clamping arm and the second clamping arm, and the driving source can be, for example, a driving motor or an air cylinder. Thus, according to the above implementation manner, in practical application, when clamping of the clamping arm needs to be realized, the rack serving as the gear driving part is driven by the driving motor or the air cylinder serving as the driving source to move upwards, the opening and closing gears meshed at two sides are driven by the rack to perform outward rotation, and the opening and closing gears drive the clamping arm (the opening and closing gears can be connected with the clamping arm through the rotating shaft) to perform downward movement in the outward rotation process so as to be switched from a loosening state to a clamping state; on the contrary, when the clamping arm needs to be loosened, the driving motor (or the air cylinder) serving as a driving source drives the rack serving as a gear driving part to move downwards, the rack drives the opening and closing gears meshed at two sides to do internal rotation, and the opening and closing gears drive the clamping arm (the opening and closing gears are connected with the clamping arm through the rotating shaft) to do lifting motion in the internal rotation process so as to change from the clamping state to the loosening state. Of course, the above is only an example, and is not intended to limit the working state of the silicon rod clamping member, and actually, the above-mentioned "up", "outward rotation", "downward", "inward rotation", "upward", and "loose" and "clamped" state changes may be changed according to the structure and operation manner of the clamping arm, and the configuration of the clamping arm driving mechanism.

In another implementation, please refer to fig. 4, which is a schematic structural view of a silicon rod clamping member of the silicon rod handling device of the present application in one embodiment. As shown, the clamp arm drive mechanism 320 includes: a first rack 3201, a second rack 3202, a clamping cylinder 3203, and a transmission gear 3204; the first rack 3201 is linked with the first clamping arm, the second rack 3202 is linked with the second clamping arm, and the transmission gear 3204 is meshed with the first rack 3201 and the second rack 3202, and is used for driving the first clamping arm and the second clamping arm to move oppositely to perform a closing action when rotating in a forward direction, and driving the first clamping arm and the second clamping arm to move backwards to perform an opening action when rotating in a reverse direction. Based on the basic rule of external meshing between gears or between gears and racks, the first rack 3201 moves in the reverse direction of the linear velocity of the upper side tooth part of the transmission gear 3204 when the transmission gear 3204 rotates; the second rack 3202 moves in a reverse direction of a linear velocity of a lower tooth portion of the transmission gear 3204 when the transmission gear 3204 rotates. The first rack 3201 and the second rack 3202, which are symmetrical about the center of the gear when the driving gear 3204 rotates, necessarily satisfy the relationship of opposite linear velocity directions, i.e., exhibit movements approaching each other or moving away from each other. For example, when the clamping cylinder 3203 pushes the first rack 3201 or the second rack 3202 to move so as to drive the transmission gear 3204 to rotate, when the transmission gear 3204 is in the forward rotation state, the first rack 3201 and the second rack 3202 approach each other to drive the first clamping arm and the second clamping arm to approach each other to perform a closing action; when the transmission gear 3204 is in a reverse rotation state, the first rack 3201 and the second rack 3202 are away from each other to drive the first clamping arm and the second clamping arm away from each other to perform an opening action.

In yet another implementation, the clamp arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack is linked with the first clamping arm, the second rack is linked with the second clamping arm, the driving gear is connected with a power output shaft (not shown) of the driving motor and meshed with the first rack and the second rack, and the driving gear is used for driving the first clamping arm and the second clamping arm to move oppositely to execute closing action when rotating forwards and driving the first clamping arm and the second clamping arm to move backwards to execute opening action when rotating reversely. The first rack and the second rack can be meshed with two sides of the driving gear, so that linear velocity directions of the first rack and the second rack are opposite when the driving gear rotates, the driving gear is driven to rotate by the driving motor, the first rack and the second rack move oppositely to drive the first clamping arm and the second clamping arm to move oppositely to execute closing action when the driving gear rotates positively, and the first rack and the second rack move oppositely to drive the first clamping arm and the second clamping arm to move oppositely to execute opening action when the driving gear is driven to rotate reversely.

In some examples, the silicon rod clamping members of the silicon rod clamp are fixedly arranged on the first support in the lifting direction and are used for clamping silicon rods with the same specification or within a preset specification range (for example, the length is 500mm to 800 mm). In certain examples, multiple sets of silicon rod holders may be provided on the first support to ensure that silicon rods that may be held by the silicon rod handling device encompass various length specifications.

Here, the single-crystal round silicon rods are formed by cutting the long silicon rods from the beginning, and the difference in size between the single-crystal round silicon rods is necessarily different, and since the silicon rod holder is used to hold the single-crystal round silicon rods in a standing state or cut silicon rods after being opened, the effect of the difference in size is mainly reflected in the difference in length of the single-crystal round silicon rods, and whether the silicon rod holder in the silicon rod holder can hold the single-crystal round silicon rods.

In order to reduce or even eliminate the risk that the silicon rod clamping means may not be able to clamp a silicon rod, the silicon rod clamp may have different designs.

In certain examples, the silicon rod clamp comprises at least two silicon rod clamps, wherein two silicon rod clamps are arranged on the first support at a distance. For example, in the embodiment shown in fig. 2a and 3a, the main body of the first support 31 is vertical, and two silicon rod clamping members in the silicon rod clamp are arranged on the first support 31 at intervals up and down. In a specific implementation manner, the silicon rod clamping members may be disposed on the first support 31 via a clamping member mounting seat, and in some examples, the clamping member mounting seat is movably disposed on the first support 31 for adjusting a distance between the silicon rod clamping members and a clamping position of a silicon rod or a silicon rod clamping member disposed at an interval. For example, in the illustrated embodiment, the first support 31 is provided with a lifting rail, and the clamp mounting seat may be provided as a slider movably provided on the lifting rail, so that the first support 31 can move up and down. With this arrangement, the distance between the different silicon rod holders can be adjusted, so that silicon rods of different specifications can be held on the basis of a smaller number of, for example, two, silicon rod holders.

In certain examples, the silicon rod clamp further comprises a lifting drive mechanism, and at least one of the at least two silicon rod clamps is driven by the lifting drive mechanism in a lifting motion along the first support. For example, when the silicon rod clamp comprises two silicon rod clamping parts, one of the silicon rod clamping parts can be fixed on the first support, and the other silicon rod clamping part is movably arranged on the first support and driven by the lifting driving mechanism to move up and down along the first support; for another example, two silicon rod clamping parts in the silicon rod clamp can be movably arranged on the first support and can move up and down along the first support under the driving of the lifting driving mechanism.

In some examples, the lift drive mechanism includes: a drive chain and at least one locking device; the silicon rod clamping device comprises a transmission chain, a chain wheel driving source, at least one locking device and at least one locking device, wherein the transmission chain is wound on two transmission chain wheels which are arranged up and down, at least one transmission chain wheel in the two transmission chain wheels is in shaft connection with the chain wheel driving source, and the at least one locking device is arranged on at least one silicon rod clamping piece and used for converting two states of locking and moving between the at least one silicon rod clamping piece and the transmission chain.

The at least one locking device corresponds to at least one silicon rod holder, for example, when the locking device is one, i.e., is disposed on one silicon rod holder, and when the locking device is two, the locking device is disposed on two silicon rod holders, and each locking device is used for controlling a locking or moving state between one silicon rod holder and the drive chain, so as to realize a state switching of the silicon rod holders in compliance with the drive chain or stopped at a preset height on the first support.

Fig. 5 is a schematic structural view of a silicon rod handling device according to an embodiment of the present disclosure. The lifting driving mechanism 323 is provided with a transmission chain 3231, the transmission chain 3231 may be configured as an endless chain (in the embodiment shown in fig. 5) or an open sprocket with an end point, at least one of the transmission sprockets 3232 wound around is driven to rotate by a sprocket driving source 3233, such as a driving motor, thereby driving the transmission chain 3231 engaged with the transmission sprocket 3232 to move, a moving direction of the transmission chain 3231 is determined by positions of the transmission sprockets 3232 disposed up and down, for example, when the transmission sprockets 3232 disposed up and down are located on the same vertical line, the transmission chain 3231 between the two transmission sprockets 3232 moves in the lifting direction.

Please refer to fig. 6, which is a simplified diagram of a part of the structure of the lift driving mechanism according to an embodiment of the present application. In certain embodiments, the locking device 3234 comprises: the silicon rod clamping device comprises a locking chain wheel 32341 and a locking mechanism 32340, the locking chain wheel 32341 is rotatably arranged on the silicon rod clamping device and is meshed with the transmission chain 3231, and the locking mechanism 32340 is arranged on the silicon rod clamping device and is used for locking the locking chain wheel 32341 to make the locking chain wheel 32341 static relative to the transmission chain 3231, so that the silicon rod clamping device connected with the locking chain wheel 32341 is switched from an active state to a locking state with the transmission chain 3231. Here, the locking sprocket 32341 may be connected to the silicon rod holder via a sprocket rotation shaft, and in a resting state of the locking mechanism 32340, the locking sprocket 32341 is rotated about the sprocket rotation shaft by the engaged driving chain 3231; when the locking mechanism 32340 is in an operating state, the locking mechanism 32340 restricts the rotation of the locking sprocket 32341 to apply a force to the locking sprocket 32341 and the silicon rod holding member to move in the lifting direction by the movement of the driving chain 3231 in the lifting direction, so that the silicon rod holding member can be driven by the driving chain 3231 to move up and down along the first support in a state where the locking sprocket 32341 is stationary with respect to the movement of the driving chain. The locking mechanism 32340 can limit the rotation of the locking sprocket 32341, for example, by clamping the teeth of the locking sprocket 32341.

Please refer to fig. 7a and 7b, which are schematic structural diagrams illustrating different locking states of the lift driving mechanism of the present application in one embodiment. In some embodiments, as shown in the figures, the locking mechanism 32340 includes a locking cylinder 32342 and a locking portion 32343, the locking portion 32343 is connected to a telescopic end of the locking cylinder 32342, and enters the teeth of the locking sprocket 32341 to lock the locking sprocket 32341 under the driving of the locking cylinder 32342.

In one embodiment, the detailed structure of the locking mechanism 32340 is as follows: the silicon rod clamping device comprises a locking cylinder 32342 fixedly installed on a silicon rod clamping part, an expansion rod of the locking cylinder 32342 can expand and contract along the radial direction of a locking chain wheel 32341, a locking part 32343 is fixed on the end part of the expansion rod of the locking cylinder 32342, the outer contour of the locking part 32343 is a rectangular block structure, a bolt is arranged on one side, close to the locking chain wheel 32341, of the locking part 32343, and when the locking part 32343 is driven by the locking cylinder 32342 to extend into the locking chain wheel 32341, the locking part 32343 is clamped to the locking chain wheel 32341, so that relative rotation between the locking part 32343 and a transmission chain 3231 is not generated (the state is shown in fig. 7 b). At this time, the silicon rod holder connected to the locking mechanism 32340 is moved up and down in synchronization with the driving chain 3231. After the silicon rod clamping member is lifted to a preset height, the locking portion 32343 is retracted to restore the locking sprocket 32341 to a rotatable state (shown in fig. 7 a) engaged with the transmission chain 3231, and the silicon rod clamping member loses the force in the lifting direction transmitted by the locking sprocket 32341, so that the silicon rod clamping member is stabilized at the preset height.

Simultaneously, in the specific implementation in-process, because locking portion is after getting into the locking sprocket, the effort that it received from the locking sprocket is great, leads to the telescopic link of locking cylinder to produce deformation at long-time atress in-process easily, influences the life of locking cylinder. In order to solve this problem, in some examples, a holding portion is fixedly disposed on the silicon rod holder, the holding portion is composed of two pressing plates, is disposed on both sides of the locking portion, and forms a sliding channel parallel to the telescopic direction of the locking cylinder with the silicon rod holder, and the locking portion is slidably disposed in the sliding channel. When the locking part is subjected to a large acting force from the locking chain wheel and the shape of the telescopic rod of the locking cylinder needs to be changed, the retaining part is pressed outside the locking part, and a certain stabilizing effect can be achieved.

In other implementations, the retaining portion 3235 can also be a rectangular block disposed along the moving track of the locking portion, and a sliding slot is disposed in the rectangular block, and the locking portion is slidably disposed in the sliding slot and moves along the radial direction of the locking sprocket.

In some cases, the drive chain 3231 may be shaken during the driving process, which results in disengagement between the drive chain 3231 and the locking sprocket 32341, so that the silicon rod holder and the drive chain 3231 are always in an active state. In order to eliminate the possibility of this, in some embodiments, a detachment prevention mechanism 3235 is further provided in the elevating driving mechanism 323, and in the embodiment shown in fig. 5, the detachment prevention mechanism 3235 is a U-shaped structure, two parallel sides of which are fixed to the silicon rod holding member to synchronously elevate and descend along with the silicon rod holding member, and a groove bottom of the detachment prevention mechanism 3235 at the bottom of the U-shaped structure is adjacent to the transmission chain 3231. When the drive chain 3231 is shaky about to disengage from the locking sprocket 32341, the groove bottom of the disengagement preventing mechanism 3235 inevitably applies a force to the drive chain 3231 in the radial direction of the locking sprocket 32341, thereby preventing the drive chain 3231 from disengaging from the locking sprocket 32341.

Here, switching between a locking state in which the silicon rod holder moves synchronously with the transmission chain 3231 or a relative movement state between the silicon rod holder and the transmission chain 3231 can be achieved based on the locking device 3234, in an actual scene, the locking device 3234 locks the silicon rod holder and the transmission chain 3231 based on a preset height adjustment of the silicon rod holder, and after the silicon rod holder is driven by the transmission chain 3231 to rise to the preset height, the locking device 3234 restores the movement state between the silicon rod holder and the transmission chain 3231, so that the silicon rod holder can be stabilized at the preset height position of the first support 31. Of course, the movable range of the silicon rod holder is related to the first support 31, and the length specification range of the silicon rod which can be held by the silicon rod clamp is increased by the movably arranged silicon rod holder.

Referring to fig. 1 and 5, the first support 31 and the silicon rod clamp 32 disposed on the first support 31 may be displaced on the mounting frame 30 in at least one direction by a displacement mechanism 33, so that the silicon rod clamp 32 clamps the silicon rod from a first predetermined position and then transfers the silicon rod to a second predetermined position.

In some embodiments, the displacement mechanism 33 comprises a first direction displacement mechanism, which comprises a first direction guide 3310 disposed on the mounting frame 30 and a first driving device (not shown) for driving the first bracket 31 to displace along the first direction guide on the mounting frame 30. The first bracket is connected to the mounting frame 30 based on a first slider 3311 fitted to the first direction guide 3310 to form a degree of freedom of movement 3310 along the first direction guide.

Here, the first bracket 31 is hung on the base through the mounting frame 30, and can move along the mounting frame 30 above the base under the driving of the first driving device. In practical applications, the first guide rail 3310 is disposed on the mounting frame 30 to lift the first support 31, the first guide rail 3310 may be disposed to cross two ends of the base in the first direction, or the length of the first guide rail 3310 may cover each silicon rod supporting structure in the loading/unloading zone, so that the first support 31 disposed on the first guide rail 3310 may be driven by the first driving device to move along the first guide rail 3310 to an adjacent position of each silicon rod supporting structure in the loading/unloading zone. In some examples, the silicon rod carrying structures of the silicon rod processing platform loading and unloading region are disposed on the same straight line in a first direction, and the first direction guide 3310 may be disposed above a straight line connecting the silicon rod carrying structures, so that the first frame 31 is moved above the silicon rod carrying structure supporting part to clamp a cut silicon rod carried on the silicon rod carrying structure or to place a silicon rod to be cut on the silicon rod carrying structure.

The first driving device is, for example, a traveling motor, the first bracket may be connected to the first direction guide rail through a traveling lead screw, and the traveling lead screw is laid on the first direction guide rail and is simultaneously connected to the traveling motor, so that the first bracket may be driven by the traveling motor to move along the first direction guide rail. In some examples, the first driving device may also be a driving motor that drives the first support to move by a ball screw, and the application is not limited thereto.

The first support 31 can move along the mounting frame 30, so that loading and unloading can be achieved in the equipment space above the base, and when the silicon rod squaring equipment is in an idle state, the first support 31 can move above the base to achieve storage, so that inconvenience of operation caused by the fact that the equipment occupies too large space in process circulation is reduced, and then efficiency of process circulation in silicon rod processing can be increased.

In some embodiments, the displacement mechanism further includes a second direction displacement mechanism, the second direction displacement mechanism includes a second direction guide rail and a second driving device, the second direction guide rail is used for arranging the first bracket, and the second driving device is used for driving the first bracket to move along the second direction guide rail. The second driving device is, for example, a traveling motor, and drives the first support to move along the second-direction guide rail through a traveling lead screw, and of course, the second driving device may also be set to be another device capable of pushing the first frame to move, for example, the first frame is driven to move through a chain conveying mechanism, which is not limited in the present application.

With continuing reference to fig. 1 and 5, the first bracket 31 is disposed on the first direction guide 3310 of the mounting frame via the second direction guide 3320, here, the first bracket 31 may be connected to the second direction guide 3320 by, for example, a second slider 3321, the first support 31 can be driven by the first driving device to move along the first direction, namely the length direction of the machine base, meanwhile, the silicon rod clamp 32 can also be driven by a second driving device (not shown) to move along the second direction guide 3320 in a second direction, the moving range of the first support 31 and the silicon rod clamp 32 in space is increased, the silicon rod transfer device is suitable for transferring the silicon rod between a first preset position and a second preset position which have different spatial position relations, for example, when the first and second predetermined positions are spaced apart in the second direction, the silicon rod clamp 32 may be moved along the second direction guide 3320 to reach the target position.

In a scene, when the first preset position is a position on the outer side of the base where a silicon rod to be cut is placed, the second preset position is a supporting position of the silicon rod bearing structure, the first support moves to a straight line, wherein a connecting line of the first support and the first preset position is a second direction, under the driving of the first driving device, and then the first support approaches to the first preset position under the driving of the second driving device; of course, the second driving device may move to a straight line in the first direction between the first bracket and the first preset position under the driving of the second driving device, and then the first driving device drives the first bracket to move to the first preset position; it should be noted that the first driving device and the second driving device are independent, and therefore, the moving path of the first support and the silicon rod clamp may also be a multi-segment broken line, for example, the first support and the silicon rod clamp move along a certain distance in a first direction, then move along a second direction, and move along the first direction again to reach a preset position, the moving directions are only examples of some achievable moving paths, and the first support only needs to be moved to the preset position; meanwhile, in an actual scene, the moving path can be changed along with the arrangement of the equipment and the direction of the moving guide rail of the moving mechanism. Similarly, after the first support reaches the first preset position, a moving path from the first preset position to the second preset position may also be set based on a moving range determined by the shifting mechanism, and when the moving range package can cover the first preset position and the second preset position, the transfer may be achieved.

Here, the movement path has a plurality of selectable modes, but based on the setting of the silicon rod handling device of the present application, the movement path transfers the silicon rod through a straight line path or a broken line path, and simultaneously, the equipment space above the machine base is utilized for transferring and can be used as the accommodating space of the silicon rod handling device, so that the occupation of the space outside the machine base of the silicon rod squaring equipment can be reduced during transferring, and meanwhile, the silicon rod handling device can be integrally arranged with the silicon rod squaring equipment, so that the procedure of equipment calling of the silicon rod handling device is omitted, and the transferring process is simpler.

Please refer to fig. 8a to 8d, which are schematic structural views of the silicon rod handling device of the present application in different transfer states.

In an embodiment of the present application, the process of clamping the silicon rod to be cut by the silicon rod handling device is as follows:

the silicon rod clamping part is moved along the mounting frame 30 by following the first support 31 under the driving of the first direction shifting mechanism, and the silicon rod clamping part and the first support 31 can be driven by a first driving device for example to move along a first direction guide rail arranged on the mounting frame 30; meanwhile, in some scenarios, the first support 31 and the silicon rod holder may be driven by a second direction shift mechanism, for example, moved along a second direction guide rail under the drive of a second driving device; by means of the first displacement mechanism or/and the second displacement mechanism, the silicon rod clamping member follows the first support 31 to approach the silicon rod to be cut at the first predetermined position (in the state shown in fig. 8 a); furthermore, during the movement of the silicon rod holder following the first support, the silicon rod holder may control the first and second clamp arms of the silicon rod holder to perform an opening or closing action based on the movement state (or movement position) of the silicon rod holder, for example: before reaching first preset position, the drive gear of silicon rod holder reverses under the motor drives, makes first arm lock and second arm lock separate to the centre gripping space between the arm lock be greater than the silicon rod diameter or with have the clearance in order to form the accommodation space who treats the cutting silicon rod between the silicon rod, work as first support 31 drives the silicon rod holder and moves when treating the accommodation space that the cutting silicon rod is located between first arm lock and second arm lock, drive gear corotation is in order to control first arm lock and second arm lock are close to each other promptly and are close to each other and treat the centre gripping silicon rod, first arm lock and second arm lock contact and stop the relative motion when pressing from both sides the silicon rod.

The silicon rod clamping member is kept in a clamping state after clamping the silicon rod, and according to a preset silicon rod placing position, the first support 31 and the silicon rod clamping member are correspondingly driven by the first direction shifting mechanism or/and the second direction shifting mechanism to transfer the silicon rod along a preset path, and after the clamped silicon rod is conveyed to a second preset position (in a state shown in fig. 8 b), the first clamping arm and the second clamping arm perform an opening action to release the silicon rod, wherein the second preset position is, for example, a position right above a bearing surface for bearing the silicon rod in the silicon rod bearing structure, where the silicon rod to be clamped is to be cut.

In the embodiment shown in fig. 8a and 8b, the silicon rod holding member performs the process of loading the silicon rod to be cut into the silicon rod carrying structure, it being understood that, when the transport of a silicon rod to be cut is completed (in the state shown in fig. 8 b), the silicon rod holding member follows the first support and is driven by the first direction shifting mechanism or/and the second direction shifting mechanism to return to the first predetermined position (in the state shown in fig. 8 a) so as to continue to perform the loading transport of the next silicon rod to be cut; after the silicon rod loading and unloading device has loaded the silicon rods to be cut in the corresponding cutting operation, for example, in the silicon rod cutting apparatus shown in fig. 8a or fig. 8b, after the silicon rod loading and unloading device has loaded the corresponding silicon rods to be cut on the multiple silicon rod carrying structures in the loading and unloading area on the machine base, the first support 31 and the silicon rod clamping member may be driven by the first direction shifting mechanism or/and the second direction shifting mechanism to return to an initial position, for example, a waiting position of the silicon rod loading and unloading device in a non-working state, and in an actual scene, the initial position may be set based on the layout of the silicon rod cutting apparatus, for example, the initial position may be set at the end of the mounting frame 30 in the example shown in fig. 8a or fig. 8 b.

In some examples, when the silicon rod loading and unloading device performs the unloading process for the cut silicon rod, similarly, the silicon rod clamp and the first support 31 move along the mounting frame 30 in compliance with the driving of the shifting mechanism, and stop moving (in the state shown in fig. 8 c) at the position adjacent to the silicon rod carrying structure carrying the cut silicon rod, i.e. at the first predetermined position, and the first clamping arm and the second clamping arm approach each other, i.e. approach each other to the silicon rod to be clamped, and stop moving towards each other when contacting and clamping the silicon rod; the silicon rod clamp and the first support 31 move along a straight line or a broken line under the driving of the first direction shift mechanism and the second direction shift mechanism according to a second predetermined position to transfer the cut silicon rod out of the processing platform of the machine base and to transfer the cut silicon rod to a second predetermined position for blanking (in a state shown in fig. 8 d). After the unloading operation is finished, the first support 31 and the silicon rod clamping member may return to the initial positions.

The application also provides silicon rod squaring equipment which comprises a base, a silicon rod bearing structure, a linear cutting device and a silicon rod loading and unloading device, wherein the silicon rod loading and unloading device is hung on the base, and the silicon rod loading and unloading device is provided with one of the embodiments shown in the figures 1 to 8 d. The silicon rod loading and unloading device is used for clamping a silicon rod to be cut or a cut silicon rod and transferring the clamped silicon rod to be cut or the cut silicon rod to a preset position.

In some examples, the wire cutting device comprises a liftable wire cutting support and a wire cutting unit arranged on the wire cutting support, wherein the wire cutting unit is provided with a cutting wire saw, so that the cutting wire saw can be driven by the lifting motion of the wire cutting support to cut the silicon rod vertically placed on the silicon rod bearing structure. The silicon rod to be cut needs to be placed in a loading and unloading area of the silicon rod squaring equipment before cutting, the cut silicon rod is timely transported out after cutting is completed so as to carry out line production on squaring of different silicon rods, and the silicon rod loading and unloading device can transfer the silicon rod to be transported from the first preset position to the second preset position so as to cooperate with the line cutting device to cut different silicon rods.

The silicon rod handling device is hung on the base, the silicon rod clamp realizes the conversion from a first preset position to a second preset position through the shifting mechanism, in some scenes, the object placing area of the silicon rod to be cut and the area where the cut silicon rod is placed are far away from the base, for example, the silicon rod to be cut needs to be transported to the first preset position, and then the silicon rod to be cut is transported to the silicon rod bearing structure through the silicon rod handling device; for example, after the silicon rod is cut by the cutting wire saw, the silicon rod handling device transfers the cut silicon rod from the silicon rod carrying structure to the second predetermined position, and then transfers the cut silicon rod at the second predetermined position to a predetermined placement area of the cut silicon rod or to a next process device.

Here, the first predetermined position and the second predetermined position are not limited to fixed positions or areas established in the established coordinate system, and in the example provided in the present application, by determining a transfer path of the handling apparatus in handling, a starting position of a first rack in the silicon rod handling apparatus in the transfer path is taken as a first predetermined position and an end position of the first rack is taken as a second predetermined position in accordance with a time sequence of transfer. When the silicon rod loading and unloading device carries out a feeding process, the position of the silicon rod clamp for clamping the silicon rod to be cut is a first preset position, and the moving mechanism moves to move the silicon rod to be cut to the position above the bearing surface of the silicon rod bearing structure so as to place the silicon rod to be cut on the silicon rod bearing structure and take the position as a second preset position; on the contrary, when the silicon rod handling device performs a blanking process of transferring the cut silicon rod after the cutting out from the base, the first support is located at the position adjacent to the silicon rod carrying structure to hold the cut silicon rod as an initial position, that is, a first predetermined position, and the position where the cut silicon rod is transferred away from the base by the silicon rod clamp and released is a second predetermined position.

In some examples, the silicon rod squaring device further comprises a silicon rod conveying device, the silicon rod conveying device comprises a feeding and transferring part and a feeding driving source, wherein the feeding and transferring part is used for conveying the silicon rod to be cut, and the feeding driving source is used for driving the feeding and transferring part to move so as to drive the silicon rod to be cut to move.

The feeding and transferring part is driven by the feeding driving source to transfer the borne silicon rod to be cut to the first preset position, and the silicon rod loading and unloading device can realize the transfer of the silicon rod. In certain examples, the end of the loading transfer part is arranged at the first predetermined position where the silicon rod handling device performs the loading process.

Referring to fig. 9, a schematic structural view of a silicon rod conveying device of a silicon rod processing apparatus according to an embodiment of the present invention is shown. In some examples, the feeding and transferring part 41 includes a carrying part 411 for carrying a silicon rod to be cut and a chain conveying mechanism 412; the carrying portion 411 has two rows of rollers disposed oppositely, and the chain conveying mechanism 412 includes a conveying chain 4121 and sprockets 4122 disposed at least at two ends of the conveying chain 4121 and engaged with the conveying chain 4121. Here, the bearing part 411 is a part for supporting the silicon rod, and the silicon rod to be cut is contacted through the rollers arranged oppositely, so that the silicon rod is horizontally transported. At least one of the sprockets 4122 engaged with the conveying chain is used as a driving sprocket and connected to a sprocket driving source, for example, the driving sprocket 4122 is coupled to a power output shaft of a motor to rotate the conveying chain 4121.

In some examples, the feeding and transferring part 41 can convey a long distance, and the corresponding conveying chain 4121 can be long, in order to prevent the conveying chain 4121 from loosening, disengaging from the sprocket 4122, and the like, the chain conveying mechanism 412 is provided with a plurality of sprockets 4122, and the plurality of sprockets 4122 can be arranged at equal intervals, for example, to ensure the tension at each position of the conveying chain 4121.

In some examples, the feeding and transferring part further comprises at least one elastic push rod structure connected with the conveying chain and used for pushing the silicon rod to be cut to move along the feeding and transferring part.

Please refer to fig. 9 and 10 in combination, wherein fig. 10 is a schematic structural diagram of the elastic push rod structure 413 in an embodiment. As shown, the resilient pushrod structure 413 includes a pushrod 4131, a torsion spring 4132. The elastic push rod structure 413 is arranged on the conveying chain 4121 and abuts against the end surface of the silicon rod when the conveying chain 4121 of the feeding and transferring part moves forwards (in the direction of the arrow shown in fig. 9), so as to cooperate with the transferring part to move the abutted silicon rod to a preset position, and avoid an obstacle when the conveying chain 4121 moves backwards (in the direction opposite to the arrow shown in fig. 9), namely, the silicon rod to be cut in the scene; the torsion spring 4132 is disposed below the push rod 4131 to cooperate with the rotation of the push rod 4131.

Here, the push rod 4131 includes a swing rod as a main body, a roller provided at a distal end of the swing rod for contacting the silicon rod to be cut, and a rotating shaft at a proximal end of the swing rod, and the swing rod is rotatable along the rotating shaft; the torsion spring 4132 is sleeved on the rotating shaft to provide a torque for positioning the swing rod at a certain angle, for example, when the swing rod is not acted by an external force, the torsion spring 4132 can be stabilized at the upright position of the swing rod. The elastic push rod structure 413 further comprises a supporting base 4133 fixedly connected to the conveying chain 4121 and used for arranging the push rod 4131 and the spring, the supporting base 4133 further comprises a limit baffle, as shown in the figure, when the swinging rod rotates counterclockwise, the swinging rod abuts against the limit baffle to reach a maximum rotation angle, in the process that the elastic push rod structure 413 integrally follows the advancing movement of the conveying chain 4121, the roller at the distal end of the swinging rod contacts the end surface of the silicon rod to be cut to generate a tendency of rotating counterclockwise relative to the rotating shaft, and after the swinging rod abuts against the limit baffle, the rotation is stopped, and the push rod 4131 can generate a thrust force for the silicon rod to be cut based on the limit action of the limit baffle, so as to push the silicon rod to be cut to move along the bearing part in the advancing direction.

Referring to fig. 11, a partial structure of an example of a silicon rod conveying apparatus according to the present application is shown. As shown in the figure, in a specific implementation manner, the carrying portion 411 includes two vertical plates 4111 disposed on two opposite sides of the conveying chain 4121, two rows of rollers 4112 are disposed on the two vertical plates 4111, it should be understood that the silicon rod to be cut is in point contact with the rollers 4112, and in some examples, the two rows of rollers 4112 are rotatably disposed on the vertical plates 4111 above the conveying chain 4121. The elastic push rod structure moves along with the conveying chain 4121, in the process of forward movement of the conveying chain 4121, the push rod abuts against the end face of the silicon rod to be cut, and then thrust for the silicon rod to be cut to move along the axial direction of the silicon rod can be provided, through the arrangement that the bearing part 411 comprising the roller 4112 is matched with the elastic push rod structure, when the silicon rod to be cut moves along the bearing part 411, the thrust only needs to overcome rolling friction with the roller 4112, and the resistance needed to be overcome in the transmission of the silicon rod is small.

In some examples, the feeding and transferring part comprises a bearing part and a conveyor belt structure, for example, and the elastic push rod structure is fixedly arranged on the conveyor belt and moves along with the conveyor belt so as to abut against the end surface of the silicon rod to be cut when the conveyor belt moves forwards to drive the silicon rod to be cut to move along the forward direction.

Of course, according to the requirement of the transfer direction in the silicon rod loading process in an actual scene, in some examples, the elastic push rod structure may also be configured to abut against the end surface of the silicon rod in the process of conforming to the retraction motion of the conveying chain or the conveying belt, so as to convey the belt-cut silicon rod to the first predetermined position in the loading process.

In certain examples, the silicon rod transfer device further includes a feeding transfer part, and a feeding drive source. The unloading transport portion is used for conveying the silicon rod that has cut, the unloading driving source is used for driving the motion of unloading transport portion in order to drive the silicon rod that has cut and remove. In this case, the starting end of the discharge transfer section can be arranged, for example, at the second predetermined position during the discharge of the silicon rod handling device, and the cut silicon rod is transferred from the silicon rod carrying structure to the discharge transfer section by the silicon rod handling device, so that the cut silicon rod is transferred by the silicon rod transport device to the next process position or to the placement region of the cut silicon rod.

Referring to fig. 12, a schematic structural view of a silicon rod conveying apparatus according to an embodiment of the present application is shown. In certain examples, the blanking transfer portion 42 is a conveyor mechanism. It should be understood that the cut silicon rod is a cuboid with a plane side surface after the cut silicon rod is cut, and the cut silicon rod is horizontally placed on the conveying belt, so that the cut silicon rod can be conveyed by means of friction formed on the surface of the conveying belt by the self weight of the cut silicon rod. Here, the blanking driving source is, for example, a driving motor, and drives at least one synchronous pulley in the conveyor belt mechanism to rotate so as to rotate the conveyor belt.

In some examples, the silicon rod conveying device further comprises a turning device for turning the carried silicon rod to be cut from a horizontal state to a vertical state and turning the carried cut silicon rod from the vertical state to the horizontal state.

The silicon rod handling device in the silicon rod squaring device can be used for clamping a vertically placed silicon rod to be cut or a cut silicon rod, and the overturning device 43 can be used for overturning the silicon rod to be cut from a horizontal state to a vertical state so as to enable the silicon rod handling device to carry out loading and conveying of the silicon rod to be cut, or can be used for overturning the cut silicon rod conveyed from the silicon rod bearing structure to the silicon rod transferring device from the vertical state to the horizontal state so as to realize subsequent conveying of the cut silicon rod.

Turning device 43 docks with the end of material loading transfer portion or the initiating terminal of unloading transfer portion, in some examples, material loading transfer portion sets up at the frame homonymy with unloading transfer portion to make silicon rod handling device removes at the frame homonymy and can reach material loading transfer portion and unloading transfer portion. Here, the turning device 43 is provided on a linear movement mechanism 44 to move from the feeding transfer part to the abutting connection of the discharging transfer part, i.e., the turning device 43 is movable between the feeding transfer part and the discharging transfer part.

Referring to fig. 8c and fig. 12, the feeding transfer portion and the discharging transfer portion are disposed on the same side of the base and are disposed in parallel, the turnover device 43 is disposed on the linear motion mechanism 44 laid in the second direction, the linear motion mechanism 44 includes, for example, a linear guide rail, a traveling motor, and a traveling lead screw in the second direction, the traveling lead screw is connected to the linear guide rail and the turnover device 43, and the turnover device 43 moves along the linear guide rail in the second direction under the driving of the traveling motor, so that the feeding transfer portion and the discharging transfer portion share the same turnover device 43. For example, in an actual scene, after the horizontally placed silicon rod to be cut is turned to be vertical by the turning device 43 at the feeding transfer part, the silicon rod to be cut can move to the butt-joint feeding transfer part along the linear guide rail in the second direction, so as to turn the vertically placed silicon rod to be cut into a horizontal state.

Of course, in actual scene, material loading transportation portion and unloading transportation portion also can set up in the both sides of frame, for example set up the loading district of material loading when the silicon rod processing platform that is provided with silicon rod bearing structure sets up on translation mechanism with frame one side, and the silicon rod is removed the cutting back and is moved to the uninstallation district towards one side translation of keeping away from the loading district when being driven to the square to cut the silicon rod, material loading transportation portion corresponds respectively promptly with unloading transportation portion loading district and uninstallation district.

In some examples, as shown in fig. 12, the turning device 43 comprises a turning table 431, and the turning table 431 is provided with a turning motor for driving the turning table 431 to rotate. Here, the turning stage 431 includes: the overturning mechanism comprises an overturning part and an overturning rotating shaft, wherein the overturning rotating shaft is arranged on the overturning part and is connected to an overturning motor in a shaft mode, so that the overturning part is driven by the overturning motor to rotate by a preset angle; the overturning part is used for bearing a silicon rod to be cut or a cut silicon rod, and the silicon rod to be cut or the silicon rod to be cut is always attached to the overturning part through clamping, adsorption, limiting and other actions. In a specific implementation manner, the turning part includes a lifting seat disposed on the bearing plate of the turning part and a pressing block or a pressing plate disposed on the lifting seat, and in other implementation manners, the turning part may also include a clamping arm or a hoop as a limiting structure.

In the view shown in fig. 12, the turning rotating shaft is arranged on the right side of the turning part, and when the turning device corresponds to the feeding and transferring part, the turning part is driven by the turning motor to rotate clockwise by 90 degrees around the turning rotating shaft so as to turn the borne silicon rod to be cut into a vertical placement; when the turnover device corresponds to the blanking transfer part, the turnover part rotates anticlockwise for 90 degrees around the turnover rotating shaft under the driving of the turnover motor so as to turn the borne cut silicon rod to be placed horizontally.

Therefore, according to the silicon rod squaring device, the silicon rod to be cut is conveyed to the first preset position through the silicon rod conveying device, the silicon rod loading and unloading device can move along the installation frame above the base through the shifting mechanism to reach the first preset position and can move along the installation frame to convey the silicon rod to be cut to the silicon rod bearing structure, the silicon rod conveying device and the silicon rod loading and unloading device are matched with the wire cutting device to convey and cut the silicon rod, circulation among different processes is automatic, the labor cost can be reduced, and the silicon rod is prevented from being collided and damaged in the conveying circulation; furthermore, the transfer path of the silicon rod handling device can be a straight line or a broken line path, and equipment space is reserved for placing and setting the silicon rod movement device on the ground in a hoisting setting mode, and the silicon rod squaring equipment can realize automatic process circulation in silicon rod squaring operation through occupying small equipment space.

The existing single crystal silicon rod is generally a cylindrical structure, the existing squaring equipment is generally arranged on a silicon rod bearing structure by depending on the gravity of the silicon rod, and when the silicon rod is cut by a wire cutting device, the cutting line can cause the silicon rod to shake in the cutting process along the length direction of the silicon rod, so that the cutting surface is not flat, and the quality of finished products is poor. Therefore, there is a need for a silicon rod squaring device, which can ensure that the silicon rod stably stands on the silicon rod bearing structure during the cutting process, and the silicon rod mentioned in the present application is a single crystal silicon rod. The application discloses silicon rod closing device and be provided with silicon rod closing device's silicon rod evolution equipment, but silicon rod closing device compresses tightly the top of single crystal silicon rod when cutting the single crystal silicon rod on the silicon rod bearing structure on the wire cutting device, makes the stable stand of silicon rod on the silicon rod bearing structure, guarantees the steady of silicon rod when cutting the operation, has guaranteed the cutting quality of silicon rod.

The silicon rod pressing device can be used in silicon rod squaring equipment, and can be detachably arranged in the silicon rod squaring equipment as an independent unit so as to be matched with silicon rod squaring operation in the silicon rod squaring equipment and press a silicon rod in the squaring and cutting processes, so that the silicon rod is in a stable state in the cutting processes; of course, it should be understood that in certain embodiments, the silicon rod pressing device may also be provided in the silicon rod squaring apparatus as an integrated structure.

Referring to fig. 13, which is a schematic structural view of the silicon rod pressing device in one embodiment, as shown in the figure, the silicon rod pressing device is applied to a silicon rod squaring apparatus, and the silicon rod squaring apparatus includes a base 10, a silicon rod carrying structure (not shown), and a wire cutting device; the silicon rod pressing device comprises a pressing support 61 and a plurality of mutually independent pressing components 60, wherein the pressing support 60 is movably arranged on the cutting frame 20, the mutually independent pressing components 60 are respectively arranged on the pressing support 61 and are used for pressing the top of a silicon rod to be cut borne by the silicon rod bearing structure, and each pressing component 60 comprises a pressing head 601 and a driving mechanism 602 for driving the pressing head 601 to move up and down relative to the pressing support 61.

The base 10 is provided as a main component of the silicon rod squaring device of the present application, and is used for providing a squaring operation platform, and in one example, the size and the weight of the base 10 are both large so as to provide a larger installation surface and firmer overall stability.

The silicon rod bearing structure is arranged on the silicon rod processing platform and used for bearing a vertically placed silicon rod to be cut.

At least one wire cutting unit 21 is arranged on the wire cutting device, wherein a cutting wheel, a transition wheel and a cutting wire wound between the cutting wheel and the transition wheel are arranged in the wire cutting unit, and therefore, the wire cutting unit 21 forms a cutting wire saw for cutting the silicon rod.

The silicon rod pressing device comprises a pressing support 61 and a pressing assembly 60 which is arranged on the pressing support 61 and corresponds to the silicon rod bearing structure located in the cutting area. In one example, a slide block matched with the lifting guide rail 22 is fixed on the pressing bracket 61, the pressing bracket 61 is arranged on the cutting frame in a lifting and descending manner through matching the slide block with the lifting guide rail 22 and is positioned above the wire cutting device, and the pressing assembly 60 is arranged on the pressing bracket 61 and can be lifted and descended along with the pressing bracket 61 to release or press the silicon rod to be cut on the silicon rod bearing structure in the cutting area.

Influenced by the manufacturing process, the heights of the silicon rods to be cut positioned on the silicon rod bearing structures in the cutting area are not completely consistent, and the pressing assemblies 60 descend along with the pressing bracket 61, so that each pressing assembly 60 cannot be pressed tightly on the silicon rod to be cut borne by the corresponding silicon rod bearing structure. In the silicon rod pressing device provided by the present application, a plurality of mutually independent pressing assemblies 60 are provided on the pressing support 61, each pressing assembly 60 includes a pressing head 601 and a driving mechanism 602 for driving the pressing head 601 to move up and down along the pressing support 61, that is, each pressing assembly 60 has a degree of freedom following the movement of the pressing support 61 along the cutting frame and a degree of freedom of movement of the pressing support 61 up and down relative to the pressing support 61.

Each pressing component 60 may be configured to perform a pressing operation on a silicon rod that is vertically placed on a silicon rod supporting structure, in an actual scenario, the silicon rod pressing device may adjust the overall lifting position of the pressing bracket 61 and each pressing component 60 disposed on the pressing bracket 61, and after the distance between the pressing head 601 of the pressing component 60 and the upper end surface of the silicon rod to be cut is within a preset range, adjust the lifting amplitude of the corresponding pressing head 601 based on the height of the upper end surface of each silicon rod to be cut on the silicon rod supporting structure, so that the pressing head 601 contacts and presses the silicon rod to be cut.

In some embodiments, the wire cutting unit 21 of the wire cutting device is movably disposed on the cutting frame 20 through a lifting mechanism, the lifting mechanism includes a lifting guide rail 22 and a lifting motor, and the pressing support 61 of the silicon rod pressing device is movably disposed on the cutting frame 20 through the lifting guide rail 22. That is, here, the lifting and lowering pressing device and the wire cutting unit 21 may share a lifting and lowering guide rail 22 to move in a lifting and lowering direction, and the lifting and lowering guide rail 22 is disposed on the cutting frame 20.

In order to simplify the structure of the silicon rod squaring apparatus of the present application and reduce the manufacturing cost of the apparatus, in one embodiment, the silicon rod pressing means is attached to the mounting beam 214 for supporting the wire cutting unit 21 by its own weight and is movable up and down along the lifting guide 22 following the mounting beam 214. The lifting motor drives the mounting beam 214 to drive the wire cutting unit 21 to descend along the lifting guide rail 22, the silicon rod pressing device is attached to the mounting beam 214 and also descends along the lifting guide rail 22 to the top of the silicon rod to be cut, which is borne by the silicon rod bearing structure located in the cutting area, the driving structure in the pressing assembly 60 drives the pressing head 601 to move up and down to press the corresponding silicon rod to be cut, and the mounting beam 214 is driven by the first driving mechanism 602 to descend with the wire cutting unit 21 to perform the cutting operation of the silicon rod to be cut.

In certain embodiments, the wire cutting unit and the silicon rod pressing device are respectively provided with a lifting driving device, and the wire cutting unit can be driven by a lifting motor arranged on a mounting beam carrying the wire cutting unit so as to follow the lifting movement of the mounting beam; and a pressing bracket in the silicon rod pressing device moves along a lifting guide rail of the cutting frame under the driving of a lifting driving device arranged on the pressing bracket.

In one example, the silicon rod squaring device provided with the silicon rod pressing device comprises a first lifting driving mechanism and a second lifting driving mechanism, wherein the first lifting driving mechanism is used for driving the linear cutting unit to move along a lifting guide rail; and the second lifting driving mechanism is used for driving the silicon rod pressing device to do lifting motion along the lifting guide rail. At this time, the silicon rod pressing device is not overlapped on the mounting beam by means of gravity, but is driven by a second lifting driving mechanism to do lifting motion along the lifting guide rail, and the second lifting driving mechanism is set to be an air cylinder assembly or a screw rod assembly driven by a motor. In practical application, the first lifting driving mechanism drives the mounting beam to carry the wire-electrode cutting unit to descend, when the second lifting driving mechanism drives the silicon rod pressing device to descend to a preset position, the second lifting driving mechanism stops driving the silicon rod pressing device to enable the silicon rod pressing device to be positioned at the preset position to press the silicon rod to be cut, the first lifting driving mechanism continues driving the mounting beam to carry the wire-electrode cutting unit to descend to complete cutting of the silicon rod to be cut, after cutting operation of the silicon rod to be cut is completed, the first lifting driving mechanism drives the mounting beam to carry the wire-electrode cutting unit to ascend, and the second lifting driving mechanism drives the silicon rod pressing device to ascend.

In some embodiments, the wire cutting unit in the wire cutting device is movably arranged on the cutting frame through a first lifting mechanism, and the silicon rod pressing device is movably arranged on the cutting frame through a second lifting mechanism.

In certain embodiments, the first lift mechanism comprises a first lift rail and a first drive motor, and the second lift mechanism comprises a second lift rail and a second drive motor.

The first lifting guide rail and the second lifting guide rail are respectively arranged in the vertical direction, namely the plumb line direction, the first lifting guide rail and the second lifting guide rail are arranged on two sides of the cutting frame, the wire cutting unit is arranged on the mounting beam, two ends of the mounting beam are respectively connected to the first lifting guide rails on the cutting frame on two sides of the base, the wire cutting unit is driven by the first driving motor to move in the lifting direction, and the cutting wire section in the wire cutting unit moves in the lifting direction along with the first lifting guide rails, so that the silicon rod can be cut and processed under the control of the first driving motor; two ends of a pressing support of the silicon rod pressing device are arranged on second lifting guide rails on two sides of the cutting frame, and the pressing support carries the pressing component to move along the lifting guide rails under the driving of a second driving motor, so that the pressing head of the pressing component can be pressed to the top of the silicon rod.

In some embodiments, a rail locking mechanism is provided on the hold-down bracket. For example, in order to prevent the silicon rod pressing device from continuously following the mounting beam to damage the silicon rod to be cut, a guide rail locking mechanism is arranged on the pressing bracket of the silicon rod pressing device; for another example, in order to prevent the silicon rod pressing device from being unstable at a preset height when moving along the lifting guide rail or the second lifting guide rail for arranging the pressing support under the action of the second driving motor, the pressing support is provided with a guide rail locking mechanism.

The guide rail locking mechanism can be used for positioning the silicon rod pressing device at a preset position on the lifting guide rail (or the second lifting guide rail), for example, the preset position is that the pressing component in the silicon rod pressing device is positioned 0-5 cm above the corresponding silicon rod to be cut, but only the pressing component is positioned above the corresponding silicon rod to be cut, and the pressing head in the pressing component can be pressed on the top surface of the corresponding silicon rod to be cut when driven to descend.

In an implementation mode, the guide rail locking mechanism comprises a locking clamping block and an air cylinder, the locking clamping block is arranged on the pressing support, the air cylinder is used for providing acting force for clamping the lifting guide rail or the second lifting guide rail for the locking clamping block, the locking clamping block is stressed to abut against the lifting guide rail or the second lifting guide rail connected with the pressing support in the cylinder pushing-out state, and the locking clamping block keeps relatively static with the guide rail abutted against after abutting against the lifting guide rail or the second lifting guide rail based on the acting force in the cylinder pushing-out state.

Referring to fig. 14a, 14B and 14c, fig. 14a is a schematic view illustrating a structure of a silicon rod pressing device 6 according to an embodiment of the present invention, and fig. 14B and 14c are enlarged schematic views illustrating a portion B of fig. 14a of the silicon rod pressing device 6 in different motion states. As shown, the rail locking mechanism 62 is, for example, a pneumatic rail locking mechanism 62 shown in the figure, and as shown in fig. 14a, the silicon rod pressing device 6 is arranged on the lifting rail 22, thereby realizing movement in the lifting direction to press the silicon rod. As shown in fig. 14b or 14c, the pneumatic rail locking mechanism 62 in this embodiment includes a locking clamp 621 cooperating with the lifting rail 22, a cylinder 622 and a spring 623 for driving the locking clamp 621 to act, wherein the locking clamp 621 and the lifting rail 22 are respectively provided with racks in the lifting direction, i.e. along the rail direction, the locking clamp 621 is provided on a pressing bracket in the silicon rod pressing device 6, in a moving state, the silicon rod pressing device 6 descends along the mounting beam (in a state shown in fig. 14 b), at this time, the cylinder 622 is in a rest state, the racks between the locking clamp 621 and the lifting rail 22 are in a separated state by the elastic force of the spring 623, thereby, the silicon rod pressing device 6 can move along the lifting rail 22, and when reaching a predetermined position, the cylinder 622 drives the locking clamp 621 on the pressing bracket to move, here, the pushing action of the cylinder 622 overcomes the elastic force of the spring 623, so that the locking clamp block 621 grips the lifting rail 22 to position the silicon rod pressing device 6 at a predetermined position (in a state shown in fig. 14 c), and the locking clamp block 621 engages with the rack of the lifting rail 22, thereby fixing the silicon rod pressing device 6 on the lifting rail 22 to position the silicon rod pressing device 6 at the predetermined position. The pressing components in the silicon rod pressing device 6 press the corresponding silicon rods to be cut, the mounting beam drives the movable wire cutting unit to descend continuously to complete the cutting of the silicon rods to be cut, after the cutting operation of the silicon rods to be cut is completed, when the mounting beam is driven by the first driving mechanism to drive the movable wire cutting unit to ascend to the position where the silicon rod pressing device 6 is located, the air cylinder 622 drives the locking clamp block 621 on the pressing bracket to loosen the lifting guide rail 22 so that the silicon rod pressing device 6 continues to be attached to the mounting beam to ascend (in a state shown in fig. 14 b).

In some embodiments, the pressing bracket 61 is provided with a pair of rail clamps (in the embodiment shown in fig. 13), which can be disposed at two ends of the pressing bracket 61 to connect the pressing bracket 61 to the lifting rail 22 or the second lifting rail, and when the lifting rail 22 or the second lifting rail on two sides of the cutting frame 20 is a double rail, the number of the rail clamps 221 can be 4, and the pressing bracket 61 is connected to the double rail on two sides respectively. In a practical scenario, the pressing bracket 61 may be attached to the cutting frame 20 to move along the lifting rail 22 or move along the second lifting rail under the action of the second driving motor, and after reaching a predetermined position, the rail clamp 221 presses the rail to stabilize the pressing bracket 61 at a predetermined height.

The plurality of mutually independent pressing assemblies arranged on the pressing support can move along the lifting guide rail under the driving of the pressing support, and meanwhile, the pressing head of each lifting assembly can move up and down along the lifting support under the driving of the driving mechanism.

In some embodiments, the driving mechanism comprises a power structure and a guide rail, and the pressing head is linked with the power structure and controlled by the power structure to move up and down along the guide rail.

Please refer to fig. 13 and fig. 15 in combination, wherein fig. 15 is an enlarged schematic view of a portion a in fig. 13. As shown in the figure, a plurality of pressing assemblies 60 are arranged on the pressing bracket 61, and a plurality of silicon rod carrying structures of the cutting area are respectively arranged corresponding to the silicon rod cutting direction, and a pressing head 601 and a driving mechanism 602 are arranged in each pressing assembly 60. The driving mechanism 602 includes a guide rail 6022 provided in the vertical direction on the pressing bracket 61, and a power mechanism 6021 as a driving source for vertically moving the pressing head 601, and the pressing head 601 can move along the guide rail 6022 by the power mechanism 6021.

In some embodiments, the motive structure 6021 comprises: the hydraulic cylinder or the hydraulic pump and the extensible member, wherein the extensible member is connected with the cylinder or the hydraulic pump, and the pressing head 601 is arranged at the bottom of the extensible member.

In a specific implementation manner, the telescopic part moves in the lifting direction under the propelling action of a cylinder, for example, the telescopic part is connected to a piston rod of the cylinder, the pressing head 601 is arranged at the bottom of the telescopic part (i.e., the end surface of the telescopic part facing the silicon rod bearing structure in the cutting area), and the cylinder drives the telescopic part to carry the pressing head 601 to perform the lifting motion so as to release or press the silicon rod to be cut on the silicon rod bearing structure in the cutting area.

In another specific implementation manner, the telescopic member is connected to a hydraulic pump, for example, the telescopic member is a rod body connected to a piston of the hydraulic cylinder or a lift cylinder connected to the hydraulic pump, and the telescopic member can be driven by the hydraulic pump to move up and down along the guide rail 6022, and drives the pressing head 601 at the bottom of the telescopic member to move up and down to adjust the distance from the pressing head 601 to the end surface of the silicon rod to be cut.

In another specific implementation manner, the driving mechanism includes a guide rail and a lifting motor (not shown), the guide rail is disposed on the pressing bracket along the lifting direction, and the pressing head is driven by the lifting motor to move up and down relative to the pressing bracket so as to adjust the distance from the pressing head to the top of the silicon rod to be cut.

In some embodiments, the power structure comprises a lifting motor and a telescopic member, wherein the telescopic member is connected with the lifting motor, and the compressing head is arranged at the bottom of the telescopic member. The telescopic part is, for example, a connecting rod of a lifting motor and the pressing head, the lifting motor is, for example, a traveling motor which can move along the guide rail, and the telescopic part drives the pressing head to move up and down under the movement of the traveling motor, so as to adjust the distance from the pressing head to the end surface of the silicon rod to be cut; and the extension piece is an electric push rod driven by a lifting motor, the extension end of the electric push rod is connected to the pressing head, and the lifting motor drives the pressing head to move up and down.

In some embodiments, the compression head is connected to the drive mechanism by an extension arm.

With continued reference to fig. 15, in one specific implementation, a proximal end of the extension arm 6011 is connected to the driving mechanism 602, and a distal end thereof is connected to the pressing head 601, so that the extension arm 6011 drives the distal pressing head 601 to move up and down relative to the pressing bracket under the driving of the driving mechanism 602. In practical scenarios, the extension arm 6011 may be connected to, for example, a telescopic member of the power structure 6021; as another example, the extension arm 6011 is coupled at its distal end to a slide that is movable along the guide track 6022, the slide being driven in motion by a lift motor.

The extension arm 6011 may also be configured to be length-adjustable, and the distal end of the extension arm 6011 is a free end during length adjustment; here, the guide rail in each pressing assembly 60 is arranged on the side of the silicon rod carrier structure such that the guide rail 6022 and the direction of extension thereof are outside the corresponding silicon rod to be cut, for example, the guide rail 6022 is shown on the right side of the silicon rod carrier structure in the view of fig. 1, and the distal end of the extension arm 6011 extends to the left side such that the pressing head 601 is located directly above the end face of the silicon rod to be cut.

The extension arm 6011 with the adjustable length is connected with the pressing head 601, so that the situation that the pressing head 601 is not positioned at the center of the silicon rod to be cut, the pressing effect is poor, and a moment with an overturning effect is generated can be avoided; meanwhile, the length adjustment of the extension arm 6011 is easy to implement, the adjustment of the silicon rod pressing position can be achieved by small-sized part movement, and interference on other silicon rod pressing devices or other structures or parts in the silicon rod squaring equipment is avoided in the adjustment process. The extension arm 6011 is, for example, a telescopic rod provided with a telescopic driving device. In some examples, a linear guide rail may be disposed on the extension arm 6011, and the pressing head 601 is disposed on the linear guide rail, so that an effect that the length of the extension arm 6011 is adjustable can be equivalently achieved, so as to ensure that the pressing head 601 presses the silicon rod at the center of the end face of the silicon rod to be cut.

In some examples, the compression head is a rotary compression head.

In some examples, in a silicon rod squaring apparatus provided with the silicon rod pressing device, the silicon rod bearing structure is provided with a rotating mechanism which can drive a silicon rod to be cut on the silicon rod bearing structure to rotate so as to adjust the surface to be cut. In order to cooperate with the rotation mechanism of the silicon rod carrying means, in one implementation the pressing head is connected to the drive means via a rotation shaft (not shown). For example, a bearing (not shown) is arranged at the bottom of a telescopic part connected to the cylinder, the pressing head is provided with a rotating shaft matched with the bearing, the pressing head is rotatably arranged on the bearing of the telescopic part through the rotating shaft, so that the silicon rod bearing structure drives the silicon rod to be cut to rotate when the pressing head presses the silicon rod to be cut, and the pressing head can also be matched with the silicon rod to be cut to rotate.

In some examples, each of the holding-down heads is rotatably disposed at a distal end of the extension arm, and the holding-down head may be connected to the extension arm by a rotating shaft disposed in a third direction, i.e., a lifting direction, along which the holding-down head is rotatable while the silicon rod is being rotated by the silicon rod supporting structure in a state in which the holding-down head holds down the silicon rod to be cut.

In some examples, for better protection of the silicon rod to be cut, a buffer pad (not shown) may be arranged between the pressing head and the silicon rod to be cut, and the buffer pad is fixed on a pressing surface of the pressing head (the pressing surface is the lower surface of the pressing head).

In some embodiments, the bottom of the pressing head is further provided with a detection device (not shown) for detecting the contact state of the pressing head with the silicon rod to be cut. In one implementation mode, the detection device comprises a pressure sensor which is arranged on the lower surface of the pressing head and used for contacting the silicon rod to be cut. The pressure sensor is used for detecting the pressure value so as to determine that the pressing force borne by the silicon rod to be cut is within a preset range.

In some embodiments, the compression head moves up and down along the compression bracket with a lifting amplitude of 200 mm to 400 mm. In the squaring process, the silicon rods to be cut may have different length specifications, the silicon rods to be cut are silicon rod segments obtained by cutting off rod-shaped single crystal silicon rods grown from a melt by a czochralski method or a suspension zone melting method, and a certain height difference may exist between different silicon rod segments, and the silicon rod segments are in a state shown in fig. 13.

In a specific implementation manner, for example, the length of the guide track may be set to 200 mm to 400 mm, or the telescopic distance of the telescopic member may be set to 200 mm to 400 mm. Therefore, the height difference of the pressing heads in the pressing components arranged on the same pressing support can reach 200-400 mm, the silicon rod pressing device can press the silicon rods to be cut on the silicon rod bearing structure in the cutting area, the silicon rods to be cut are not required to be loaded and cut after being grouped based on the same length, and the squaring process is simpler.

In an actual scene, when the height difference between the silicon rods to be cut is greater than 400 mm, the silicon rods to be cut can be grouped based on the length and then loaded and cut, for example, in the silicon rod cutting device shown in fig. 1, 4 silicon rod bearing structures correspond to a cutting area, the silicon rods to be cut can be divided into four groups, the length difference between the silicon rods to be cut in each group is enabled to be less than 400 mm, and the silicon rod pressing device can be used for pressing each group of silicon rods to be cut. Because each group of silicon rods to be cut can have length difference, accurate measurement is not needed when the length is determined, and the squaring processing flow of the silicon rods with different length specifications can be simplified.

The silicon rod pressing device provided by the application can be matched with a linear cutting device arranged in a silicon rod squaring device in a cooperative manner, the silicon rod pressing device and the linear cutting device can share a lifting guide rail or respectively move along a lifting guide rail, the silicon rod pressing device is simply arranged above a silicon rod to be cut by means of an installation beam in the linear cutting device, or a second driving mechanism is arranged on the silicon rod pressing device to drive the silicon rod pressing device to move along the lifting guide rail in the lifting direction; meanwhile, each lifting component in the silicon rod pressing device can move up and down along the pressing support so as to be suitable for pressing silicon rods to be cut with different specifications; before the cutting of the evolution, the silicon rod pressing device presses the top of the silicon rod to be cut, the silicon rod is determined to be stably and vertically placed on the silicon rod bearing structure, the condition that the silicon rod shakes, moves and even topples due to disturbance in the subsequent cutting process is effectively reduced or avoided, and the quality of finished products processed by the evolution is improved.

The application also provides silicon rod squaring equipment which comprises a machine base, a silicon rod bearing structure, a wire cutting device and a silicon rod pressing device according to any one embodiment of the embodiments shown in the figures 13 to 15.

The base is provided with a processing platform, and the silicon rod bearing structure is arranged on the silicon rod processing platform and used for bearing a vertically placed silicon rod. The linear cutting device comprises a cutting frame arranged on the base and a linear cutting unit movably arranged on the cutting frame; wherein, the wire-electrode cutting unit includes cutting wheel, transition wheel and line of cut, the line of cut twine in order the cutting wheel forms an at least cutting coping saw with transition wheel, the cutting coping saw can be used for treating the cutting silicon rod and carry out the evolution cutting.

Here, in the silicon rod squaring apparatus provided by the present application, the silicon rod pressing device may cooperate with the wire cutting device, and is configured to press the top of the silicon rod, that is, the upper end surface of the silicon rod, when the wire cutting device cuts the silicon rod carried by the silicon rod carrying structure, so as to ensure that the silicon rod is stably and vertically placed on the silicon rod carrying structure during the cutting process, thereby avoiding situations such as poor cutting quality, silicon rod toppling and the like caused by silicon rod displacement.

In the silicon rod processing technology, the wire slicing technology is adopted for a plurality of processes of silicon rod processing, for example, cutting, squaring, and slicing of a silicon rod.

The wire cutting technology is an advanced silicon material processing technology in the world at present, and the principle of the wire cutting technology is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of wire cutting is achieved. During the cutting process, the steel wire or diamond wire is guided by the wire guide wheel, a wire saw or a wire net is formed on the cutting roller, and the workpiece to be processed is fed by the ascending and descending of the workbench or the ascending and descending of the wire saw or the wire net. Under the action of a pressure pump, a cooling water automatic spraying device assembled on the equipment sprays cold water to cutting parts of the steel wire or the diamond wire and the workpiece, and the steel wire or the diamond wire reciprocates to cut the material to be processed into a plurality of pieces at one time. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the linear cutting technology has the advantages of high efficiency, high productivity, high precision and the like.

In the technical field of silicon rod processing, a polycrystalline silicon brittle material is generally firstly pulled into a single crystal silicon rod, the originally obtained single crystal silicon rod is cut off to obtain a silicon rod cut-off section under a predetermined length specification, and then a squarer is adopted for squaring; at the moment, the cutting mechanism feeds along the length direction of the silicon rod and cuts four planes which are parallel in pairs along the circumferential direction of the silicon rod, so that the cross section of the silicon rod is in a similar rectangle shape; and after the evolution is finished, slicing the silicon rod after evolution along the length direction by adopting a multi-line slicing machine to obtain the required silicon wafer.

Here, a plurality of links in silicon rod processing need to be accomplished with the help of the wire cutting device, and the steel wire of high-speed operation drives the cutting edge material that adheres to the steel wire or directly adopts the diamond wire to rub the work piece of treating processing to reach the purpose of wire-electrode cutting. Generally, a plurality of cutting wheels and transition wheels are arranged in a multi-wire cutting device, and a plurality of cutting wire saws are formed by sequentially winding cutting wires on a wire groove of each cutting wheel and a wire groove of each transition wheel corresponding to the cutting wheel, so that the silicon rod to be cut is cut by the plurality of cutting wire saws. After long-time use, the wire casing on the cutting wheel can produce wearing and tearing, influences the cutting effect, consequently needs to change the wire casing trench of cutting wheel, usually, for guaranteeing to cut the silicon rod for predetermined specification, still need adjust the displacement of cutting wheel after trading the groove.

As described in the background art, in the related wire cutting device, the positional relationship between the plurality of cutting wheels after being mounted is not easily changed, and after one of the plurality of cutting wheels is worn, the cutting wheel or the other component needs to be adjusted to perform the entire groove replacement, and the component at the adjusted position needs to be further calibrated, so that the operation is complicated and the efficiency is low.

In view of the above, the present application also provides a wire cutting device of a silicon rod processing apparatus, including: the base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; the wire cutting device includes: the cutting frame is arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

The wire cutting device can realize the switching of line of cut between the different cutting grooves of cutting wheel based on roll adjustment mechanism, or the position of adjustment cutting coping saw is in order to change cutting position (or processing specification) for the silicon rod again, uses the silicon rod processing equipment of wire cutting device can be silicon rod evolution equipment, silicon rod and cut equipment, silicon rod surely grind integrative equipment etc. should understand, the wire cutting device realizes changing the groove or adjusting the cutting coping saw position by roll adjustment mechanism only need realize with certain structure and the wire winding mode of wire cutting device itself, and does not regard as the restriction with the concrete type of silicon rod processing equipment.

In the examples provided herein, the cutting wire saw is a line segment in a certain position area of the cutting wire that can be used for feeding the silicon rod, and it should be understood that the cutting wire is in high-speed operation in the cutting process, and the position of the cutting wire saw is generally determined by the winding manner of the cutting wheel and the cutting wire.

In the following embodiments, the wire cutting device of the present application is applied to a silicon rod extracting apparatus as an example, but is not limited to the application scenario of the wire cutting device of the present application.

Referring to fig. 16 and 17 in combination, fig. 16 is a schematic structural diagram of a wire cutting device according to an embodiment of the present disclosure, and fig. 17 is a schematic structural diagram of a wire cutting device according to an embodiment of the present disclosure applied to a silicon rod extracting apparatus. As shown, the wire cutting apparatus includes a cutting frame 20, at least one wire cutting unit 21, and at least one distance adjusting mechanism 23.

Wherein the cutting frame 20 is disposed on the machine base 10, in some embodiments, the cutting frame 20 is disposed on both ends of the machine base 10 to ensure that the cutting wire saws formed on the wire cutting units 21 mounted on the cutting frame 20 can cover different processing stations, for example, in the example shown in fig. 2, the cutting frame 20 is a cylinder disposed on both ends of the machine base 10, a plurality of silicon rod carrying structures are disposed on the machine base 10 in the silicon rod squaring apparatus, and the span of the wire cutting units 21 includes each silicon rod carrying structure in the cutting area.

The at least one linear cutting unit 21 is movably arranged on the cutting frame 20; the wire cutting unit 21 includes a plurality of cutting wheels 211 and cutting wires 213 sequentially arranged along a first direction. In some implementations, as shown in fig. 2, the wire-cutting unit 21 is disposed on the cutting frame 20 by a wire-cutting support 24, the wire-cutting support 24 is disposed on the cutting frame 20 and includes a guide rail disposed along the second direction, and the wire-cutting unit 21 is disposed on the guide rail of the wire-cutting support 24 to form a degree of freedom for movement along the second direction; of course, the wire cutting support 24 may also be configured with a guide slot in the second direction, a slide bar in the second direction, or other limiting structure or guiding structure in the second direction for disposing the at least one wire cutting unit 21, which is not limited in this application.

It should be understood that the plurality of cutting wheels 211 need to be attached to a carrier provided by the wire cutting unit 21, in some examples, the wire cutting unit 21 includes a first-direction mounting beam 214 therein, two ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially disposed on each mounting beam 214. That is, the wire cutting unit 21 is composed of a plurality of cutting wheels 211 arranged in the same direction (or the same straight line), a cutting wire 213, and a bearing structure of the cutting wheels 211.

In other embodiments, the plurality of cutting wheels 211 in the wire cutting unit 21 are mounted on the cutting frame 20 through a bracket, a connection plate, or a mounting frame, and the carrier provided by the wire cutting unit 21 for mounting the plurality of cutting wheels 211 may be in various forms, which is not limited in this application.

In some examples, when a plurality of wire cutting units 21 are provided in the wire cutting device, different wire cutting units 21 are respectively located on different straight lines, and two wire cutting units 21 shown in fig. 2 are respectively parallel, in some examples, the extending directions of different wire cutting units 21 may also be intersecting.

It should be noted that in the embodiments of the wire cutting device provided in the present application, the first direction is a direction in which the plurality of cutting wheels in the wire cutting unit are disposed, for example, a mounting beam direction of the wire cutting unit in some examples, and a cutting wire saw formed by winding the cutting wire around the cutting wheels is also the first direction; the second direction is orthogonal to the first direction, and the at least one distance adjusting mechanism drives the at least one wire cutting unit to move along the second direction, namely, the cutting wire saw in the wire cutting unit moves along the orthogonal direction.

It should be understood that the wire cutting apparatus may perform the cutting process on the silicon rod based on the elevating movement of the wire cutting unit 21 along the cutting frame 20, and the control of the cutting specification is performed by adjusting the relative position between the cutting wire saw and the silicon rod in the second direction. With reference to fig. 16 and 17, when the silicon rod is placed on the silicon rod support structure and the position of the silicon rod is fixed, the cutting position of at least one cutting wire saw in the at least one wire cutting unit 21 can be adjusted by moving the cutting wire saw in the second direction by the pitch adjusting mechanism 23, so that the cutting amount of the silicon rod can be controlled.

In some examples, the at least one wire cutting unit further comprises at least one transition wheel, each transition wheel having at least two wire grooves; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

In some implementations, please refer to fig. 16 and 17, which take one wire cutting unit 21 of the wire cutting apparatus as an example for description, the wire cutting unit 21 includes at least one transition wheel 212, and the at least one transition wheel 212 is used for guiding the direction or adjusting the tension of the cutting wire 213 wound around different cutting wheels 211. The at least one transition wheel 212 may be disposed on a carrier carrying a plurality of cutting wheels 211, such as a mounting beam 214 shown in fig. 17, the distance adjustment mechanism 23 may be configured to drive the carrier to move along the second direction, and the at least one transition wheel 212 and the plurality of cutting wheels 211 jointly follow the carrier to move along the second direction, in this state, the at least one transition wheel 212 and the plurality of cutting wheels 211 are relatively stationary, that is, the positional relationship between the transition wheel 212 and the cutting wheels 211 is not changed. When the pitch adjusting mechanism 23 is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit 21, the cutting position adjustment can be achieved by the cutting wire saw being in a fixed positional relationship with respect to the cutting wheel 211 and the transition wheel 212, i.e. only moving in the second direction.

In some embodiments, the plurality of cutting wheels 211 belonging to the same wire-cutting unit 21 are provided on a mounting beam 214 arranged in the first direction, and the at least one transition wheel 212 is provided on the mounting beam 214 by a bracket. Here, the distance adjustment mechanism 23 may be configured to be connected to the mounting beam 214 to drive the plurality of cutting wheels 211 carried by the mounting beam 214 to move in the second direction, and the bracket follows the mounting beam 214 and drives the at least one transition wheel 212 to move in the second direction, so that the at least one transition wheel 212 and the plurality of cutting wheels 211 in the wire cutting unit 21 are kept stationary.

The at least one transition wheel 212 has at least two wire grooves, and when the at least one distance adjusting mechanism 23 is used to change the position of the cutting wire 213 wound around the cutting wire grooves of the plurality of cutting wheels 211 in the at least one wire cutting unit 21, the position of the cutting wire 213 on the wire groove corresponding to the at least one transition wheel 212 is changed, so that the cutting wire wound around the transition wheel and the wire wheel after groove change is still located in a plumb surface. In practical situations, the winding method usually adopted needs to make the cutting line between the transition wheel and the cutting wheel be located in the plumb surface. It will be appreciated that when the cutting line slot for winding the cutting line is out of the same plane as the wire guide slot after the slot change, the cutting line has a component force in the second direction on the transition wheel and the cutting wheel, which is not conducive to efficient operation of the cutting line. In this case, the transition wheel 212 is provided as at least two wire grooves, which can be used to adjust the direction of the cutting line 213 after the groove change.

Each cutting wheel 211 is provided with at least two cutting wire grooves, different cutting wire grooves are parallel to each other, the projection of the cutting wire groove plane on the horizontal plane is along a first direction, and the different cutting wire grooves have a cutting offset in a second direction, when the cutting wire 213 is changed to the position of the wire groove wound on the cutting wheel 211, the cutting wire 213 has a displacement in the second direction relative to the cutting wheel 211, it should be understood that, because the transition wheel 212 and the cutting wheel 211 are relatively static, the position of the wire groove wound on the transition wheel 212 of the cutting wire 213 is also changed if the cutting wire saw wound on the transition wheel and the wire guide wheel is still in a plumb plane after the position of the wire groove of the cutting wheel 211 is changed.

Each transition wheel 212 is provided with at least two wire grooves which are parallel to each other, the projection of the plane of the wire grooves on the horizontal plane is along the first direction, transition offset of the second direction is formed among different wire grooves, and based on the transition offset, the wire grooves of the cutting wires 213 in the transition wheels 212 can be changed, so that the cutting wire saw which winds the transition wheels and the wire wheels after groove changing adjustment is still located in a plumb surface.

In some implementations, the transition offset between adjacent wire grooves in the transition wheel 212 is equal to the cutting offset between adjacent cutting wire grooves in the cutting wheel 211, so as to change the grooves of the cutting wire 213 according to a predetermined position. In this example, the cutting wheel 211 and the wire wheel may be disposed in the wire cutting unit 21 in a form of one-to-one correspondence of the wire grooves and the cutting wire grooves (i.e., the cutting wire grooves are coplanar with the wire grooves), and the number of the wire grooves of the transition wheel 212 may be equal to or different from the number of the cutting wheel 211.

In different silicon rod processing devices, the cutting wheel 211 and the transition wheel 212 in the wire cutting unit 21 can be arranged in different position relationships, and different winding manners can be configured.

In some embodiments, the plurality of cutting wheels belonging to the same wire-cutting unit form at least two cutting wheel groups in a pairwise manner, a transition wheel is further arranged between two adjacent cutting wheels in the two adjacent cutting wheel groups, the transition wheel has at least two wire grooves, and the cuts are sequentially wound on the cutting wheels and the transition wheel to form a cutting wire saw between the two cutting wheels in each cutting wheel group, wherein the cutting wire penetrates out from the cutting wire groove of the next cutting wheel in the previous cutting wheel group when wound on the two adjacent cutting wheels in the two adjacent cutting wheel groups and penetrates into the cutting wire groove of the previous cutting wheel in the next cutting wheel group after passing through the wire groove of the transition wheel; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

Referring to fig. 18 and 19, fig. 18 is a schematic structural view illustrating a wire cutting device according to an embodiment of the present invention applied to a silicon rod extracting apparatus, and fig. 19 is a schematic structural view illustrating a wire cutting unit of the wire cutting device according to an embodiment. As shown in the figure, 4 cutting wheel sets are arranged in the wire cutting unit of the wire cutting device. A transition wheel 212 is arranged between two adjacent cutting wheel sets, wherein a cutting line 213 is sequentially wound on the cutting wheel 211 and the transition wheel 212 to form a cutting wire saw on the two cutting wheels 211 of each cutting wheel set, wherein the cutting line 213 passes through the cutting wire groove of the last cutting wheel 211 in the previous cutting wheel set when being wound on the two adjacent cutting wheels 211 in the two adjacent cutting wheel sets, and passes through the cutting wire groove of the last cutting wheel 211 in the next cutting wheel set after passing through the transition wheel 212. Here, the same transition wheel 212 is shared between every two adjacent cutting wheel sets for guiding, so that the length of the cutting line 213 for tension adjustment and guiding can be reduced, the length proportion of the cutting line 213 for forming a cutting wire saw in the cutting line 213 is increased, the utilization rate of the cutting line 213 is improved while the wire winding mode is simplified, and the production cost is reduced.

Referring to fig. 18 and 19, each cutting wire saw may cut the silicon rod on one silicon rod supporting structure 11, it should be understood that the position distance between the cutting wheels 211 arranged in the first direction is changed, and the silicon rod supporting structure 11 corresponding to any cutting wire saw may also be 2, 3, 4, etc., in a specific implementation manner, for example, the distance between the two cutting wheels 211 in each cutting wheel set in the first direction is increased, or the distance between the silicon rod supporting structures 11 in the first direction is decreased, so that the two cutting wheels 211 in the cutting wheel set in the second direction are respectively located at two ends of 2, 3, or 4 silicon rod supporting structures 11; when the lifting device drives the wire cutting units to move up and down, each cutting wire saw can simultaneously cut the silicon rods placed on the corresponding silicon rod bearing structures 11. In one embodiment, to prevent the cutting wires from being too long and causing uneven tension in the cutting wire 213, the number of the silicon rod supporting structures 11 corresponding to each cutting wire may be selected according to actual conditions, so as to stabilize the processing quality.

In some embodiments, the plurality of cutting wheels belonging to the same wire-cutting unit comprises a head cutting wheel, a tail cutting wheel, and at least one intermediate cutting wheel located between the head cutting wheel and the tail cutting wheel, a transition wheel is further provided beside the at least one intermediate cutting wheel, the transition wheel has at least two wire guide grooves, the cutting wire is sequentially wound on the cutting wheel and the transition wheel to form a cutting wire saw on any two adjacent cutting wheels, wherein when the cutting wire is wound on the intermediate cutting wheel, the cutting wire is threaded out from one of the at least two cutting wire grooves on the intermediate cutting wheel and is threaded through the other of the at least two cutting wire grooves on the intermediate cutting wheel after the transition wheel by side, so that a cutting offset is provided between any two adjacent cutting wire saws in the second direction, the cutting offset corresponds to the spacing between two associated cutting wire slots; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

Fig. 20 is a schematic structural view of a middle cutting wheel and a transition wheel disposed beside the middle cutting wheel in an embodiment of the wire cutting apparatus of the present application. In the winding manner adopted by the wire cutting unit 21 in this example, when the cutting wire 213 winds the cutting wheel set in the wire cutting unit 21, each middle cutting wheel 211 undergoes two windings, and the head and tail cutting wheels 211 undergo at least one winding in combination with fig. 17 and 20. When the cutting wire 213 is wound around the middle cutting wheel 211, the cutting wire 213 is threaded out from a first cutting wire slot 2111 of the at least two cutting wire slots on the middle cutting wheel 211 and then threaded into a second cutting wire slot 2112 of the at least two cutting wire slots on the middle cutting wheel 211 via the transition wheel 212 beside (in the embodiment shown in fig. 20, the upper side of the cutting wheel 211), so that any two adjacent cutting wires have a cutting offset in the first direction, and the cutting offset corresponds to the distance between the first cutting wire slot 2111 and the second cutting wire slot 2112.

In some implementations, for each intermediate cutting wheel and a transition wheel disposed beside the intermediate cutting wheel, a line connecting the axis of the transition wheel and the axis of the cutting wheel is parallel to the plumb line. Under the condition, the lengths of the cutting lines on the two sides of the transition wheel are equal or approximately equal, and the stress states are approximately the same in the cutting process, so that the problems that the local or single side of the cutting lines on the two sides of the transition wheel is continuously stressed excessively or the tension is insufficient are solved.

In one example, as shown in fig. 20, here, the transition wheel 212 is disposed right above the cutting wheel, the cutting line 213 is threaded out from the first cutting line slot 2111 of the cutting wheel 211 and guided via the transition wheel 212 to be wound back to the second cutting line slot 2112 of the cutting wheel 211, and projections of the cutting lines 213 on both sides of the transition wheel 212 on the plane in the plumb direction are formed as line segments of equal length. In this example, the cutting wire saw is formed as a tangent line below the cutting wire slot of the cutting wheel 211.

In another example, the transition wheel may also be disposed right below the cutting wheel, that is, a connecting line between the transition wheel and the axis of the cutting wheel is a plumb line. The cutting wire is wound from the first cutting wire groove of the cutting wheel downwards to the transition wheel and is guided by the transition wheel to penetrate upwards from the second cutting wire groove of the cutting wheel, in this example, the formed cutting wire saw is a cutting wire above the cutting wire groove of the cutting wheel.

It should be understood that the side is mainly used to determine the corresponding relationship between the middle cutting wheel and the transition wheel, and not a specific position and orientation, for example, the side may also be a left side, a right side, an upper side, a lower side, an oblique side, etc. of the cutting wheel, and the present application is not limited thereto. Specifically, the arrangement mode of the plurality of cutting wheels, the middle cutting wheel and the cutting lines in the linear cutting unit can adopt the mode described in Chinese patent application CN2020204403178 (the name of the invention is silicon rod squaring equipment).

In the foregoing examples, although the relative position relationship between the cutting wheel and the transition wheel and the winding manner of the cutting wire are different, the plurality of cutting wheels in the wire cutting unit can be moved in the second direction by the at least one distance adjusting mechanism to realize the cutting position adjustment or the groove changing of the cutting wire saw.

With continuing reference to fig. 16, in the foregoing examples, it has been described that each cutting wheel 211 belonging to the same wire cutting unit can be driven by the distance adjusting mechanism 23 to move along the second direction, so that the cutting wire saw formed between the cutting wheels 211 moves along the second direction, and thus the cutting position of the cutting wire saw can be adjusted; when the wire cutting unit further comprises the transition wheel 212, when the at least one distance adjusting mechanism 23 drives the plurality of cutting wheels 211 in the at least one wire cutting unit to move along the second direction, the transition wheel 212 and the cutting wheel 211 are kept relatively stationary, and the cutting position of the cutting wire saw can be adjusted by moving the corresponding cutting wire saw along the second direction.

When the at least one distance adjusting mechanism 23 is used to change the cutting line to wind around the cutting line slots of the plurality of cutting wheels 211 in the at least one line cutting unit 21, in an actual scene, the cutting line slots corresponding to the cutting lines before and after slot replacement can be predetermined, for example, the position of the cutting line before slot replacement is the cutting line slot a1, the cutting line after slot replacement is wound around the cutting line slot a2, and a displacement amount of the plurality of cutting wheels 211 in the line cutting unit driven by the at least one distance adjusting mechanism 23 to move in the second direction is determined based on a cutting offset between the cutting line slot a1 and the cutting line slot a2, that is, the displacement amount is set as the cutting offset between the cutting line slot a1 and the cutting line slot a2, and thus the replacement of the cutting line from the cutting line slot a1 to the cutting line slot a2 can be achieved; it should be noted that the at least one distance adjusting mechanism 23 drives the plurality of cutting wheels 211 in the wire cutting unit to move in the second direction in a direction in which the cutting wire groove a2 points to the cutting wire groove a1, and after the groove is changed, the cutting position of the cutting wire saw in space is not changed, so that the step of further calibrating the positions of the cutting wheels 211 or other components is omitted, that is, the silicon rod can be cut according to the preset cutting amount, and the groove changing process is simplified.

To further illustrate the implementation manner of the at least one distance adjusting mechanism for moving the plurality of cutting wheels in the linear cutting unit along the second direction, the present application provides the following embodiments. In some examples, when the number of the wire cutting units in the wire cutting is different, the specific form of the at least one distance adjusting mechanism can be changed correspondingly.

In one embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the screw rod is arranged along the second direction and is in threaded connection with the single-wire cutting unit; and the driving source is used for driving the screw rod to rotate.

The single-wire cutting unit is a wire cutting unit, the single-wire cutting unit in the wire cutting device comprises a plurality of cutting wheels arranged along a first direction, the cutting wire is wound on the plurality of cutting wheels to form at least one cutting wire saw, and the at least one cutting wire saw is arranged along the same straight line direction. The screw rod of the distance adjusting mechanism is provided with a far end and a near end, in a specific implementation mode, for example, the near end of the screw rod can be connected to a driving source and driven by the driving source to rotate, the far end of the screw rod is connected to the single-wire cutting unit through threads, the screw rod can rotate based on the transmission of the driving source and converts the rotation of the screw rod into axial displacement through threaded connection by virtue of the connection mode of the two ends of the screw rod, and the axial displacement direction is the setting direction of the screw rod, namely a second direction; the single-wire cutting unit can be displaced in the second direction by driving the screw rod to rotate by the driving source in the distance adjusting mechanism, and the single-wire cutting unit can be moved forward or backward in the second direction by driving the screw rod to rotate in different rotating directions.

In another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: a telescopic member arranged along a second direction and associated with the single wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the second direction. Here, the extensible member can set up to body of rod structure and body of rod extending direction be the second direction, the extensible member can be along its extending direction concertina movement under the drive of driving source, extensible member one end can be connected to the driving source, the telescopic free end is associated the single wire cutting unit, can drive under the driving source effect the single wire cutting removes in the second direction. The extensible member is for example electric telescopic handle, if the connecting rod for being connected to the cylinder taper rod again, the driving source can be regarded as to the cylinder, and this application does not do the restriction. The telescopic rod can be connected to the single-wire cutting unit in a linear manner or indirectly, for example, directly connected to a single-wire cutting unit mounting beam or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that the expansion or contraction of the bellows may correspond to the advancement or retraction of the single-wire cutting unit in the second direction.

Here, in the embodiments provided in the present application, the association may be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above embodiments, the telescopic rod may associate the wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation of the association is not limited thereto, but is intended to realize a transmission in the second direction.

In yet another embodiment, the wire cutting device comprises a single wire cutting unit; the roll adjustment mechanism includes: the rack is arranged on the single-wire cutting unit along a second direction; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving gear rotates under the driving of the driving source, the rack meshed with the driving gear correspondingly moves along the rack step direction, in this example, the rack is matched with the driving gear, the rotating motion driven by the driving source can be converted into line conveying along the rack direction, and the rack is arranged on the single-line cutting unit along the second direction, so that the single-line cutting unit can be driven to move along the second direction. Meanwhile, the rotating direction of the transmission gear is controlled and switched by the driving source, namely, the single-wire cutting unit can switch the displacement direction of advancing or retreating along the second direction.

In the foregoing embodiments, the distance adjusting mechanism may be provided in one or more, for example, when the span of the single-wire cutting unit in the first direction is large, and when it is difficult to drive the plurality of cutting wheels in the single-wire cutting unit to move in the second direction by providing one distance adjusting mechanism, a plurality of distance adjusting mechanisms may be provided to drive, for example, distance adjusting structures may be provided at both ends of the single-wire cutting unit in the first direction respectively or a plurality of distance adjusting mechanisms may be provided at equal intervals in the first direction, where a plurality of distance adjusting mechanisms on the single-wire cutting unit may cooperate with each other to ensure that the plurality of distance adjusting mechanisms drive the plurality of wire cutting wheels of the single-wire cutting unit to move in the second direction by the same displacement amount (magnitude and direction).

In an embodiment, the wire cutting device comprises a first wire cutting unit and a second wire cutting unit which are oppositely arranged along a second direction, at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move along the second direction, and the distance between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit is adjusted or a cutting wire is changed to wind around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

In some embodiments, the wire cutting device includes two wire cutting units such as a first wire cutting unit and a second wire cutting unit, for example, as shown in fig. 16, the first wire cutting unit 21a and the second wire cutting unit 21b are disposed in parallel with each other along a first direction, and the cutting wires in the first wire cutting unit 21a and the second wire cutting unit 21b are also parallel. In a practical scenario, the wire cutting device may be used, for example, in a silicon rod squaring apparatus, wherein a silicon rod on each silicon rod carrying structure in the silicon rod squaring apparatus corresponds to the cutting wire saws of the first cutting unit and the second cutting unit in the cutting area, and then two parallel sections can be formed on the surface of the silicon rod by one lifting cutting. Here, the cutting amount of the silicon rod may be controlled by adjusting the distance between the first wire cutting unit 21a and the second wire cutting unit 21b in the second direction.

The at least one distance adjusting mechanism 23 may be configured to be connected to the first wire cutting unit 21a or the second wire cutting unit 21b, and also or simultaneously associated with the first wire cutting unit 21a and the second wire cutting unit 21b, so as to drive the plurality of cutting wheels 211 in the connected or associated first wire cutting unit 21a or/and second wire cutting unit 21b to move along the second direction, and achieve adjustment of the cutting position of at least one wire saw in the connected or associated first wire cutting unit 21a or/and second wire cutting unit 21b, or change of the cutting wire slots of the plurality of cutting wheels 211 in the connected or associated first wire cutting unit 21a or/and second wire cutting unit 21 b.

In one embodiment, the pitch adjustment mechanism comprises: the screw rod is arranged along a second direction and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate. The manner in which the lead screw and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the second direction is similar to that in the foregoing embodiment, and the first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism may be regarded as a single wire cutting unit, which is not described herein again. It should be understood that the arrangement of the pitch adjustment mechanism on any one wire cutting unit can realize the increase and decrease of the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit, and the wire cutting device can cut silicon rods into different specifications.

In another embodiment, the pitch adjustment mechanism comprises: a telescoping member disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the second direction. Here, the first cutting unit or the second cutting unit provided with the distance adjusting mechanism may be regarded as a single-wire cutting unit, and specific implementation manners may refer to the foregoing embodiments, and details are not described here.

In yet another embodiment, the pitch adjustment mechanism comprises: a rack in a second direction and associated with the first wire cutting unit or the second wire cutting unit; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving source can control the rack to linearly move along the rack direction through the transmission gear and the rack which are meshed with each other, and the first linear cutting unit or the second linear cutting unit which is related to the rack can drive the plurality of cutting wheels to move along the second direction through the rack.

In one embodiment, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along a second direction and is in threaded connection with the first wire cutting unit and the second wire cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the second direction in a facing way or in a back-to-back way. In one embodiment, as shown in fig. 16, the bidirectional screw 231 is a dual-threaded screw, two ends of the bidirectional screw 231 are respectively provided with threads with opposite thread directions, the driving source 232 can be disposed at either end of the bidirectional screw 231 to drive the bidirectional screw 231 to rotate along the axis of the screw 231, and the two ends of the bidirectional screw 231 move along the axial direction of the screw 231, which is the second direction of the bidirectional screw 231, when the bidirectional screw 231 rotates under the driving of the driving source 232. The first wire cutting unit 21a and the second wire cutting unit 21b can move toward or away from each other by the driving source 232.

In one embodiment, the pitch adjustment mechanism comprises: a first rack in a second direction and associated with the first wire cutting unit; a second rack in a second direction and associated with the second wire cutting unit; the transmission gear is meshed with the first rack and the second rack; and the driving source is used for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move in opposite directions or move in opposite directions along a second direction.

In an embodiment, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, and the transmission gear is connected to a power output shaft of a driving source, such as a servo motor, and is engaged with the first rack and the second rack, so as to drive the first wire cutting unit and the second wire cutting unit to move in opposite directions to perform a closing motion when rotating in a forward direction, and drive the first wire cutting unit and the second wire cutting unit to move in a reverse direction when rotating in a reverse direction. The first rack and the second rack can be meshed with two sides of the transmission gear, so that linear velocity directions of the first rack and the second rack are opposite when the transmission gear rotates, the transmission gear is driven to rotate by the driving motor, the first rack and the second rack move oppositely when the transmission gear rotates positively to drive the first wire cutting unit and the second wire cutting unit to move oppositely, and the first rack and the second rack move oppositely to drive the first wire cutting unit and the second wire cutting unit to move oppositely when the transmission gear is driven to rotate reversely. Here, the transmission gear may be connected to a power take-off shaft of the drive source, or may be indirectly connected to the power take-off shaft, for example, connected to a rotating portion connected to the power take-off shaft.

Here, one or more pitch adjusting mechanisms may be disposed in the wire cutting device, each pitch adjusting mechanism is connected to the first wire cutting unit and the second wire cutting unit, and the number of the pitch adjusting mechanisms may be determined comprehensively based on the driving power requirement, the force applied to the lead screw, the smoothness of movement of the plurality of cutting wheels in the driving wire cutting unit, and the equipment space of the wire cutting device, for example, when the span of the first wire cutting unit and the second wire cutting unit in the first direction is small, the cutting position of the cutting wire saw in the cutting unit can be adjusted or the cutting wire can be switched in the groove by using only one pitch adjusting mechanism, and then a pitch adjusting mechanism may be disposed in the wire cutting device to drive the first wire cutting unit and the second wire cutting unit to move toward or away from each other in the second direction; for another example, when the span of the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit needs to be driven by a large power and needs to meet the requirement that the power is within the stress intensity range of the transmission connecting component such as the screw rod or the rack, a plurality of distance adjusting mechanisms can be arranged in the wire cutting device, and the plurality of distance adjusting mechanisms cooperate with each other to ensure that the plurality of distance adjusting mechanisms drive the plurality of wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move in the second direction in opposite directions or away from each other with the same displacement (size and direction).

In some embodiments, the pitch mechanism is a servo motor provided to the at least one wire cutting unit. In an actual scene, a servo motor is arranged on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the second direction. The linear cutting unit can predetermine the cutting offset of the groove or the adjustment amount of the cutting position of the cutting line, and the plurality of cutting wheels in the linear cutting unit are driven to move along the second direction by the preset displacement amount through the accurate positioning function of the servo motor. For example, a single-wire cutting unit is arranged in the wire cutting device, and a servo motor is arranged on the single-wire cutting unit to drive the single-wire cutting unit to move along a second direction; for another example, the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit is driven by a corresponding servo motor to relatively independently move along a second direction. In some examples, the servo motor may be replaced by a traveling motor and a traveling screw, and the wire cutting unit may be driven by the traveling motor to move on the wire cutting support in the second direction.

Here, the application provides a silicon rod processing equipment's wire cut electrical discharge machining device, wherein include an at least roll adjustment mechanism and locate at least one cutting unit under the roll adjustment mechanism effect, can drive a plurality of cutting wheels of at least one cutting unit in the wire cut electrical discharge machining device remove along the second direction, around in at least one cutting wire saw that a plurality of cutting wheels formed can change the cutting position in the second direction under the roll adjustment mechanism effect from this, or, based on a plurality of cutting wheels remove convertible cutting line in the second direction and around in the wire casing position of a plurality of cutting wheels, based on the process that roll adjustment mechanism realized cutting line position conversion or traded the groove is simple and easy, easily realizes and the simple operation, is favorable to improving operating efficiency.

The present application also provides, in another aspect, a silicon rod processing apparatus including a base, a silicon rod carrying structure, and a wire cutting device. The base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; the linear cutting device comprises a cutting frame arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

In certain embodiments, the silicon rod processing apparatus is a silicon rod squaring apparatus, and the silicon rod carrying device is a silicon rod carrying structure.

Here, one or more silicon rod carrying structures may be disposed on the silicon rod processing platform, each silicon rod carrying structure may be configured to carry a single silicon rod, and correspondingly, the number of the silicon rod carrying structures in the cutting area on the silicon rod processing platform may correspond to the number of the cutting wire saws in the wire cutting unit of the wire cutting device, for example, in the embodiment shown in fig. 17 or fig. 18, a plurality of silicon rod carrying structures 11 are disposed in the cutting area of the silicon rod processing platform, and a plurality of cutting wire saws are included in the wire cutting unit 21 in the wire cutting device to respectively correspond to the plurality of silicon rod carrying structures 11.

Taking the example of the silicon rod processing apparatus shown in fig. 17 as an example of a silicon rod extracting apparatus, in some embodiments, the silicon rod processing platform is disposed on the machine base 10 via a table switching mechanism, which may be, for example, a rotating mechanism or a translating mechanism.

The rotating mechanism may include, for example, a rotating shaft coupled to the silicon rod processing platform and a rotation driving unit that drives the rotating shaft to rotate to drive the silicon rod processing platform to rotate.

The translation mechanism may include, for example, a translation guide, a slider, and a translation drive unit. The silicon rod processing device comprises a base, a translation guide rail, a sliding block, a translation driving unit and a screw rod assembly, wherein the translation guide rail is laid on the base, the sliding block is arranged at the bottom of the silicon rod processing platform and is matched with the translation guide rail to provide translation guide for the silicon rod processing platform, the translation driving unit is used for driving the silicon rod processing platform to move along the translation guide rail so that a silicon rod bearing structure on the silicon rod processing platform is switched between a cutting area and a loading and unloading area, and the translation driving unit can adopt an air cylinder assembly or a screw rod assembly driven by a motor. In other embodiments, the translation mechanism may also be in a gear transmission manner, specifically, the translation mechanism includes a translation rack and a rotating gear driven by a motor and adapted to the translation rack, the translation rack is disposed at the bottom of the silicon rod processing platform, and may be, for example, at least one rack having a certain length, in order to enable the silicon rod processing platform to move stably, each rack is adapted with at least two rotating gears disposed at an interval, and the motor drives the rotating gear to rotate, so as to drive the silicon rod processing platform to move, so that the silicon rod bearing structure located on the silicon rod processing platform is switched between the cutting area and the loading and unloading area.

In some examples, when the worktable converting mechanism is a translation mechanism, the position of the silicon rod carried by the silicon rod carrying structure in the second direction can be controlled by the translation mechanism, and the cutting amount of the silicon rod can be determined by the position of the silicon rod determined by the translation mechanism and the position of the cutting wire saw determined by the distance adjusting mechanism of the wire cutting device; for example, when be equipped with first wire-electrode cutting unit and second wire-electrode cutting unit in the wire-electrode cutting device, be equipped with in first wire-electrode cutting unit or the second wire-electrode cutting unit the roll adjustment mechanism, when roll adjustment mechanism adjusts behind the cutting position of at least one wire-electrode cutting saw in first wire-electrode cutting unit or the second wire-electrode cutting unit, translation mechanism can be based on the cutting wire saw position after the adjustment with silicon rod position adjustment to the silicon rod axle center is located the symmetry line of the cutting wire saw of first wire-electrode cutting unit and second wire-electrode cutting unit, because the silicon rod cross-section is usually quasi-circular, makes the cutting wire saw of first wire-electrode cutting unit and second wire-electrode cutting unit apart from the distance of silicon rod cross-section centre of a circle equal, then the specification of two relative sections that form on the silicon rod surface is roughly the same after the cutting process.

The silicon rod squaring device may be, for example, the silicon rod squaring device in the embodiment shown in fig. 17 or fig. 18, and may of course be other types of silicon rod squaring devices, for example, a single-wire cutting unit may be arranged in the wire cutting device of the silicon rod squaring device; for another example, the cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring apparatus is one segment, and certainly, the cutting wire saw may also be two segments, three segments, four segments, and the like, which is not limited in this application, and correspondingly, the number of the silicon rod bearing structures on the silicon rod processing platform may be correspondingly changed; for another example, the number of the silicon rod carrying structures corresponding to each cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring apparatus may be one, two, three, or the like.

It should be understood that when the silicon rod squaring apparatus is provided with the wire cutting device according to any one of the embodiments shown in fig. 16 to 20, the cutting position of the cutting wire saw can be adjusted by the silicon rod squaring apparatus based on the at least one distance adjusting mechanism during the squaring process to determine the cutting amount of the silicon rod, or after the wire groove is worn out in the long-term cutting process of the cutting wheel of the silicon rod squaring apparatus, the position of the wire groove of the cutting wire can be changed based on the at least one distance adjusting mechanism to ensure the processing accuracy of the silicon rod squaring apparatus in the continuous squaring process.

In certain embodiments, when the silicon rod processing apparatus is a silicon rod cutter, the silicon rod cutter comprises a base, a silicon rod carrying device, and a wire cutting device.

The base is provided with a silicon rod processing platform, and the silicon rod bearing device is arranged on the silicon rod processing platform. The silicon rod carrier device can be used, for example, for horizontally carrying a silicon rod to be cut; the linear cutting device comprises a cutting frame arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit. The feeding cutting of the silicon rod to be cut can be realized by the lifting motion of the wire cutting unit in the wire cutting device relative to the cutting frame.

In some examples, a plurality of parallel linear cutting units are arranged in the linear cutting device of the silicon rod cutting machine, and the plurality of parallel linear cutting units move up and down along the cutting frame, so that the silicon rod to be cut can be cut into a plurality of silicon rod sections in one cutting. And adjusting the cutting position of at least one cutting wire saw in the wire cutting unit in the second direction based on at least one distance adjusting mechanism of the wire cutting device, so that the silicon rod to be cut can be cut into silicon rod sections with different length specifications. In an implementation manner, the arrangement manner of the wire-cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device may refer to the arrangement manner disclosed in chinese patent CN105196433B, and of course, the wire-cutting device of the silicon rod cutting machine includes the at least one distance adjusting mechanism therein to adjust the cutting position of the at least one wire saw in the at least one wire-cutting unit of the silicon rod cutting machine or change the cutting line to wind around the cutting line grooves of the plurality of cutting wheels in the at least one wire-cutting unit.

In some examples, the silicon rod cutting machine is, for example, a double silicon rod cutting device, wherein a first processing station and a second processing station are provided in a silicon rod carrying device of the silicon rod cutting machine to correspondingly carry a first silicon rod to be cut and a second silicon rod to be cut, respectively. Referring to fig. 21, a schematic structural view of a wire cutting apparatus of the silicon rod clipper in one embodiment is shown. In this example, the wire-cut support 24 is disposed on the cutting frame 20, at least one wire-cut unit 21 is disposed on each of two sides of the wire-cut support 24 along the first direction, and the at least one wire-cut unit 21 on each of two sides of the wire-cut support 24 can cut the silicon rod to be cut at the first processing station and the second processing station. The wire cutting unit 21 is provided with a plurality of cutting wheels 211, a cutting wire 213 wound around the cutting wheels 211, and a transition wheel 212 in some examples of the wire cutting unit 21. Wherein the cutting wheel 211 has at least two cutting grooves, and the transition wheel 212 has at least two wire guide grooves. Here, any side of the wire-cutting support 24 further includes the at least one distance adjusting mechanism (not shown), and the distance adjusting mechanism may be, for example, the distance adjusting mechanism described in any implementation manner of the embodiment shown in fig. 16 to 20, for example, connected to the first wire-cutting unit or the second wire-cutting unit by a lead screw, or connected to the first wire-cutting unit and the second wire-cutting unit by a bidirectional lead screw, or the distance adjusting mechanism is a servo motor, and so on, which is not described herein again. Thus, the pitch adjusting mechanism can adjust the cutting position of at least one wire saw in the at least one wire cutting unit 21 or change the cutting line 213 around the cutting line grooves of the plurality of cutting wheels 211 in the at least one wire cutting unit 21.

When the distance adjusting mechanism is used for adjusting the position of the at least one cutting wire saw or changing the position of the cutting wire 213 around the cutting wire groove in the cutting wheel 211, the transition wheel 212 in the wire cutting unit 21 and the cutting wheel 211 are kept relatively static; when the distance adjusting mechanism is used for adjusting the position of the cutting wire saw, the distance adjusting mechanism can drive the cutting wheel 211 and the transition wheel 212 on the wire cutting unit 21 to move along the second direction, and the cutting wire saw is unchanged in position relation to the cutting wheel 211 and the transition wheel 212, that is, only moves along the second direction, so that the cutting position adjustment can be realized; when the distance adjusting mechanism is used for changing the position of the wire groove of the cutting wire 213 wound in the cutting wheel 211, the position of the wire groove used for winding the cutting wire 213 in the transition wheel 212 is also changed correspondingly, so that the wire groove used for winding the cutting wire 213 after the groove of the cutting wire 213 is changed and the cutting wire groove are still in the same plane.

In some embodiments, the wire-cutting units 21 on both sides of the wire-cutting support 24 may also form at least one pair of wire-cutting units 21, for example, the wire-cutting units 21 on both sides of the wire-cutting support 24 are correspondingly connected to form at least one pair of wire-cutting units 21, the pair of wire-cutting units 21 are located on the same straight line in the first direction, in this case, the plurality of cutting wheels 211 in the pair of wire-cutting units 21 can be driven to move in the second direction based on the same distance adjustment mechanism, and of course, the pair of wire-cutting units 21 can also be driven by the plurality of distance adjustment mechanisms cooperatively.

Of course, the specific form of the silicon rod cutting machine is not limited to the foregoing embodiments, for example, each cutting wire of the silicon rod cutting machine can cut and cut a plurality of silicon rods simultaneously based on the relationship between the arrangement position of the silicon rods on the silicon rod bearing device and the positions of the cutting wires; for another example, the wire cutting device of the silicon rod cutting machine only comprises a section of cutting wire saw, and the section of cutting wire saw is used for cutting a silicon rod cut in one cutting operation when a single or a plurality of silicon rods are cut; the present application is not limited thereto, and it should be noted that the wire-cutting device of the silicon rod cutting machine includes at least one distance adjusting mechanism, which is used to drive a plurality of cutting wheels in at least one wire-cutting unit of the wire-cutting device to move along the second direction, so as to adjust the cutting position of at least one wire-cutting saw in the at least one wire-cutting unit, or change the cutting line to wind around the cutting line grooves of the plurality of cutting wheels in the at least one wire-cutting unit.

In certain embodiments, the silicon rod processing apparatus is a silicon rod slicing and grinding all-in-one machine. The silicon rod cutting and grinding all-in-one machine comprises a machine base, a silicon rod bearing device, a wire cutting device and a grinding device.

The machine base is provided with a silicon rod processing platform, and in the silicon rod cutting and grinding all-in-one machine, the silicon rod processing platform can be set to be a processing area for executing different processing functions, for example, the silicon rod processing platform consists of a cutting station and a grinding station. The silicon rod bearing device is used for bearing a silicon rod to be processed. The linear cutting device comprises a cutting frame arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

Fig. 22 is a schematic structural view of a silicon rod slicing and grinding integrated machine according to an embodiment of the present disclosure. In this example, as shown in fig. 22, the silicon rod slicing and grinding all-in-one machine includes a base having a silicon rod processing platform; the linear cutting device is arranged on the base and is used for cutting the silicon rod on a first processing position of the silicon rod processing platform in a first direction and cutting the silicon rod on a second processing position of the silicon rod processing platform in a second direction to form a square silicon rod; the grinding device is arranged on the base and is used for grinding and chamfering the square silicon rod on a third processing position of the silicon rod processing platform; and the silicon rod conversion device is arranged on the silicon rod processing platform and used for converting the silicon rod in a first processing position, a second processing position and a third processing position.

Here, the wire cutting apparatus includes: the cutting device comprises a cutting frame 20, a wire cutting support 24, a first cutting unit group and a second cutting unit group, wherein the first cutting unit group and the second cutting unit group are used for cutting the silicon rod in a first processing area and a second processing area respectively.

In the present embodiment, since the wire cutting support 24 is provided for configuring the first cutting unit group and the second cutting unit group, that is, the first cutting unit group and the second cutting unit group share the wire cutting support 24. Thus, in the present embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 of the wire cutting apparatus are disposed in a centered position between the first processing position and the second processing position. On the other hand, the wire cutting support 24 is specially designed. As shown in FIG. 22, the wire cutting holder 24 in this embodiment may include a holder body and first and second holder wings located on opposite lateral sides of the holder body. In some embodiments, the main support body in the wire cut support 24 is disposed at 45 ° to the X or Y axis, the first support flank is disposed at 145 ° to the main support body and is disposed along the Y axis, and the second support flank is disposed at 145 ° to the main support body and is disposed along the X axis.

In some embodiments, the first cutting unit group may comprise at least four first cutting wheels 211a, and the four first cutting wheels 211a may be combined into a pair of first cutting wheel groups, i.e., one first cutting wheel group formed by oppositely disposing two first cutting wheels 211a along the X-axis, and one pair of first cutting wheel groups formed by two first cutting wheel groups along the Y-axis, i.e., two parallel line cutting units 21 arranged along the X-direction. The cutting lines 213 are sequentially wound around each first cutting wheel set in the first cutting unit set to form a cutting wire net. In practical applications, the cutting line 213 sequentially winds around the four first cutting wheels 211a in the first cutting unit group to form two cutting wires, which are arranged along the X-axis direction and parallel to each other to form a cutting wire net. Specifically, the cutting line 213 forms one cutting wire saw around the two first cutting wheels 211a arranged in the X-axis direction in one first cutting wheel group, and the cutting line 213 forms another cutting wire saw around the two first cutting wheels 211a arranged in the X-axis direction in the other first cutting wheel group. In this way, the two parallel cutting wires cooperate to form a first wire web that is "in the shape of a letter" in the X-axis direction.

Similarly, the second cutting unit group may include at least four second cutting wheels 211b, two second cutting wheels 211b are oppositely disposed along the Y axis to form a second cutting wheel group, and two second cutting wheel groups along the X axis form a pair of second cutting wheel groups, that is, two parallel linear cutting units 21 arranged along the Y direction are formed; in practical applications, the cutting line 213 sequentially winds around the four second cutting wheels 211b in the second cutting unit group to form two cutting wires, which are arranged along the Y-axis direction and parallel to each other, and the two cutting wires parallel to each other cooperate to form a second cutting wire web in a shape like a Chinese character ═ Y along the Y-axis direction.

In certain examples, the silicon rod transfer device is provided in a central region of the silicon rod processing platform for transferring a silicon rod between a waiting zone, a first processing zone, a second processing zone, and a third processing zone on the silicon rod processing platform. In an embodiment, a silicon rod transfer device is rotatably disposed on the silicon rod processing platform, and the silicon rod transfer device may further include: the conveying body is in a disc shape, a square disc shape or other similar shapes; a silicon rod positioning mechanism (namely a silicon rod bearing device) arranged on the conveying body and used for positioning the silicon rod; and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioning mechanism to position the silicon rod conversion position. In some examples, the silicon rod positioning mechanism further includes a rotating structure for rotating the silicon rod carried on the silicon rod positioning mechanism along the axis of the silicon rod to adjust the cutting surface of the silicon rod.

After the silicon rod to be cut is placed and positioned on the silicon rod positioning mechanism, the silicon rod to be cut is cut at a first processing position by a first cutting wire net which is arranged in the wire cutting device and is shaped like a Chinese character ═ in the X-axis direction to form two axis sections in the X-axis direction; then, the conversion driving mechanism drives the conveying body to drive the silicon rod positioning mechanism to position the silicon rod to a second processing position, and a second cutting wire net which is shaped like a Chinese character 'ji' along the Y-axis direction in the wire cutting device is used for cutting to form two axial tangent planes along the Y-axis direction, namely, a cut silicon rod with a quasi-rectangular cross section is formed; the cut silicon rod can also be transferred to a third processing area for subsequent grinding operation.

In the foregoing examples of the silicon rod cutting and grinding all-in-one machine, the wire cutting device further includes at least one distance adjusting mechanism (not shown), and in one embodiment, the first cutting unit group at the first processing location and the second cutting unit group at the second processing location include at least one distance adjusting mechanism, which is disposed on at least one wire cutting unit in the corresponding cutting unit group, and is configured to drive the plurality of cutting wheels in the at least one cutting wheel group of the at least one wire cutting unit to move along the second direction.

Here, the first direction and the second direction are defined based on a carrier coordinate system of the wire-cut unit, and therefore, when the directions of the plurality of wire-cut units in the silicon rod processing apparatus (in this example, the silicon rod slicing and grinding all-in-one machine) are different, the first directions respectively corresponding to the plurality of wire-cuts are not the same direction in the external space; correspondingly, the second direction is orthogonal to the first direction, and therefore the driving movement direction performed by the at least one pitch adjustment mechanism is an orthogonal direction with respect to the driven wire cutting unit. For example, in the first cutting unit group, the wire cutting units and the cutting wire saw are arranged along an X-axis direction, the first direction in the first cutting unit group is an X-axis direction, and the second direction in the first cutting unit group is a Y-axis direction; in the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y-axis direction, the first direction in the second cutting unit group is the Y-axis direction, and the second direction is the X-axis direction.

Taking the first cutting unit group as an example, the first cutting unit group includes two wire cutting units, the distance adjustment mechanism may be, for example, associated with a first wire cutting unit or a second wire cutting unit of the two wire cutting units, or associated with the first wire cutting unit and the second wire cutting unit at the same time, the distance adjustment mechanism may be, for example, the distance adjustment mechanism described in any implementation manner of the embodiments shown in fig. 16 to 20, for example, connected with the first wire cutting unit or the second wire cutting unit by a lead screw, or connected with the first wire cutting unit and the second wire cutting unit by a bidirectional lead screw, or the distance adjustment mechanism is a servo motor, and details thereof are not repeated herein.

In the first cutting unit group, when the at least one distance adjusting mechanism drives the plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit to move along the second direction, the first wire cutting unit or/and the second wire cutting unit may move along the first support flank, that is, along the second direction (Y-axis direction) in the first cutting unit group, for example; the wire cutting device can be used for adjusting the cutting position of at least one wire saw in the first wire cutting unit or/and the second wire cutting unit or changing the cutting wire to wind the cutting wire grooves of a plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit.

The second cutting unit group and the first cutting unit group are similar in structure form, and the main difference is that the arrangement position and the arrangement direction in the silicon rod cutting and grinding all-in-one machine are different; however, in the second cutting unit group, the structure and function of the at least one distance adjusting mechanism for driving the plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit to move along the second direction are similar to those of the first cutting unit group, and details are not repeated here.

It should be understood that in some embodiments, the positional relationship between the first processing region and the second processing region may be changed, for example, the first processing region and the second processing region may be configured such that the silicon rod transfer device rotates 60 ° while carrying the silicon rod to switch between the two processing regions, and the directions of the wire cutting units in the corresponding first cutting unit group and second cutting unit group may also be changed, in this case, the first directions of the wire cutting units in the first cutting unit group and the second cutting unit group are changed, respectively, but the cutting wire saw position adjustment or slot changing may still be realized by at least one distance adjusting mechanism in the cutting unit group; in certain embodiments, the silicon rod slicing and grinding all-in-one machine comprises, for example, only a single-wire cutting unit at different processing stations; in some embodiments, the silicon rod cutting and grinding all-in-one machine is provided with only one station for cutting, for example, in a specific implementation mode, a cutting wire net shaped like a Chinese character 'ri' can be arranged in the station for cutting, and a silicon rod positioning mechanism drives a silicon rod to rotate 90 degrees to perform cutting again; the silicon rod cutting and grinding all-in-one machine has various deformation forms, and the application is not limited.

Generally, in the related wire cutting device, the positional relationship between the cutting wheels is not easily changed after the cutting wheels are installed, and after one of the cutting wheels is worn, the cutting wheel or other parts are required to be adjusted to perform the whole groove replacement, and the parts at the adjusted positions are required to be further calibrated, so that the operation is complicated and the efficiency is low.

The application also provides a linear cutting device of the silicon rod processing equipment, wherein the silicon rod processing equipment comprises a base and a cutting device, wherein the base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; the wire cutting device includes: the cutting frame is arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; at least one transition wheel, each transition wheel having a wire guide groove; the cutting wire is wound on the plurality of cutting wheels and the transition wheel in sequence to form at least one cutting wire saw; and the at least one shifting mechanism is used for driving the at least one transition wheel to move along the second direction so as to enable the current wire groove which is cut and wound in the at least one transition wheel to move from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

It should be understood that in the wire cutting device, the cutting edge material attached to the steel wire is driven by the steel wire running at a high speed or the diamond wire is directly adopted to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by the transition wheel, a wire saw or a wire net is formed on the cutting wheel, and the workpiece to be processed is fed by the ascending and descending of the workbench or the ascending and descending of the wire saw or the wire net. In long-term cutting operation, the cutting line groove of the cutting wheel and the wire guide groove of the transition wheel are inevitably worn, so that the positioning precision of the cutting line is influenced, and the requirement of groove replacement is further increased.

In the following embodiments provided by the present application, the wire cutting device includes at least one wire cutting unit, in the wire cutting unit, the plurality of cutting wheels are arranged along a first direction, that is, a plane where the cutting wire slots of the plurality of cutting wheels are located is parallel to the first direction, and for any cutting wheel in the plurality of cutting wheels, a second direction offset is provided between different cutting wire slots; the at least one shifting mechanism can be used for driving the at least one transition wheel to move along the second direction relative to the wire cutting unit, namely, the current wire groove which is cut and wound in the transition wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

Here, the first wire groove (also referred to as a first cutting wire groove in this application) and the second wire groove (also referred to as a second cutting wire groove in this application) are used to refer to the cutting wire grooves of the cutting wheel corresponding to the cut and wound wire grooves before and after the shift mechanism driving movement in the at least one transition wheel, respectively, the number of the cutting wire grooves of the cutting wheel is not limited to two, and meanwhile, the first wire groove and the second wire groove are not necessarily adjacent cutting wire grooves on the cutting wheel, but only different cutting wire grooves.

The silicon rod processing equipment to which the wire cutting device is applied may be silicon rod extracting equipment, silicon rod cutting and grinding integrated equipment, and the like.

Referring to fig. 23 and 17 in combination, fig. 23 is a schematic structural view of a wire cutting device according to an embodiment of the present disclosure, and fig. 17 is a schematic structural view of a wire cutting device according to an embodiment of the present disclosure applied to a silicon rod squaring apparatus. As shown, the wire cutting apparatus includes a cutting frame 20, and at least one wire cutting unit 21.

Wherein the cutting frame 20 is disposed on the base, in some embodiments, the cutting frame 20 is disposed on two ends of the base to ensure that the cutting wire saw formed on the wire cutting unit 21 mounted on the cutting frame 20 can cover different processing stations, for example, in the example shown in fig. 2, the cutting frame 20 is a cylinder disposed on two ends of the base, a plurality of silicon rod bearing structures are disposed on the base in the silicon rod squaring apparatus, and the span of the wire cutting unit 21 includes each silicon rod bearing structure in the cutting area.

The wire cutting unit 21 includes a plurality of cutting wheels 211, at least one transition wheel 212, a cutting wire 213, and at least one displacement mechanism 215.

It should be understood that the plurality of cutting wheels 211 need to be attached to a carrier provided by the wire cutting unit 21, in some examples, the wire cutting unit 21 includes a first-direction mounting beam 214 therein, two ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially disposed on each mounting beam 214. That is, the linear cutting unit 21 is composed of a plurality of cutting wheels 211, cutting lines 213 and a bearing structure of the cutting wheels 211 arranged along the same direction (or the same straight line); the direction in which the plurality of cutting wheels 211 are arranged along the mounting beam 214 is the direction (i.e. the first direction) in which the wheel surfaces (or the planes in which the cutting line grooves are located) of the cutting wheels 211 are along the mounting beam 214.

In some examples, when a plurality of wire cutting units 21 are provided in the wire cutting device, different wire cutting units 21 are respectively located on different straight lines, and two wire cutting units 21 shown in fig. 23 are respectively parallel, in some examples, the extending directions of different wire cutting units 21 may also be intersecting.

It should be noted that in the embodiments of the wire cutting device provided in the present application, the first direction is a direction in which the plurality of cutting wheels 211 in the wire cutting unit 21 are disposed, for example, a direction of the mounting beam 214 of the wire cutting unit 21 in some examples, and a cutting wire saw formed by the cutting wire 213 wound around the cutting wheels 211 is also the first direction; the second direction is orthogonal to the first direction, and the at least one pitch adjusting mechanism drives the at least one wire cutting unit 21 to move in the second direction, i.e., the cutting wire saw in the wire cutting unit 21 moves in the orthogonal direction.

The at least one transition wheel 212 serves to achieve directional guidance or tensioning of the cutting line 213 around the different cutting wheels 211.

In some implementations, taking a wire cutting unit 21 as an example for illustration, the wire cutting unit 21 includes at least one transition wheel 212, and the at least one transition wheel 212 is movably disposed on a carrier carrying a plurality of cutting wheels 211.

It should be understood that the plurality of cutting wheels 211 need to be attached to a carrier provided by the wire cutting unit 21, and in some embodiments, the plurality of cutting wheels 211 belonging to the same wire cutting unit 21 are provided on a mounting beam 214 arranged in the first direction. The two ends of the mounting beam 214 can be movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, the one-line cutting unit 21 is composed of a plurality of cutting wheels 211 provided in the same direction (or the same straight line), a cutting line 213, and a mounting beam 214 on which the cutting wheels 211 are provided. In other embodiments, the plurality of cutting wheels 211 in the wire cutting unit 21 are disposed on the cutting frame 20 through a mounting frame, a connecting plate, or a frame, and the carrier provided by the wire cutting unit 21 for disposing the plurality of cutting wheels 211 may be in different forms, which is not limited in this application.

In the embodiment shown in fig. 17, a plurality of cutting wheels 211 in the same linear cutting unit 21 are disposed on a mounting beam 214, the mounting beam 214 is disposed along a first direction and moves relative to the mounting beam 214 along a second direction under the driving of the at least one shifting mechanism 215, the at least one transition wheel 212 moves relative to the plurality of cutting wheels 211 in the linear cutting unit 21 along the second direction, and the displacement of the transition wheel 212 is controlled by the at least one shifting mechanism 215, so that the current wire groove cut and wound in the at least one transition wheel 212 moves from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction. In an actual scene, the position of the cutting line slot corresponding to the wire slot of the at least one transition wheel 212 is changed, so that the slot of the cutting line 213 on the cutting wheel 211 can be changed without adjusting the transition wheel 212, and the slot changing operation can be effectively simplified.

Here, the groove changing process may be performed without changing the wire groove around which the cutting wire 213 is wound, and in some examples, the transition wheel 212 is a single wire groove transition wheel 212.

In one embodiment, the at least one transition wheel is detachably arranged on the wire cutting unit. The transition wheel can be arranged as a replaceable transition wheel, for example, the wheel shaft corresponding to the transition wheel is arranged on the wire cutting unit, the wheel surface of the transition wheel is detachably sleeved on the wheel shaft corresponding to the transition wheel, in an actual scene, in order to reduce production cost, the wheel surface of the transition wheel can be arranged as a consumable transition wheel made of a plastic material, and after the transition wheel is worn in use, the transition wheel can be detached and replaced with a new transition wheel, so that the operations of installation, positioning, calibration and the like during groove alternation of the transition wheel can be omitted, and the equipment maintenance of the wire cutting device is simpler and easier; certainly, the transition wheel also can be set up on the transition wheel support of line cutting unit for whole detachable, the material of passing the transition wheel still can be rubber and similar material, and this application does not do the restriction. Here, when the transition wheel is a consumable transition wheel, the transition wheel may be provided as a single wire groove transition wheel.

Of course, in other examples, the transition wheel may also be provided as a transition wheel having at least two wire grooves. Here, the number of the wire grooves in the transition wheel may be determined based on the positional relationship between the transition wheel and the cutting wheel and the winding manner of the cutting wire.

When each transition wheel is provided with at least two wire grooves, the at least two wire grooves are parallel to each other, in one example, the wire guide wheels are arranged such that the projection of the plane of the wire grooves on the horizontal plane is along a first direction, and transition offsets of a second direction are provided between different wire grooves. In some implementations, a transition offset between adjacent wire slots in the transition wheel is equal to a cutting offset between adjacent cutting wire slots in the cutting wheel; in this example, the cutting wheel and the wire guide wheel may be arranged in the wire cutting unit in a form of one-to-one correspondence of the wire grooves and the cutting wire grooves (the correspondence is that the cutting wire grooves and the wire grooves are coplanar), and the number of the wire grooves of the transition wheel may be equal to or different from the number of the cutting wheels.

Here, the wire cutting unit may be provided in various forms based on the selection of the structural form of the transition wheel, such as the number of wire grooves, the positional relationship of the transition wheel and the cutting wheel, and the winding manner of the cutting wire, for example, the present application provides the following embodiments for applying the wire cutting unit to the silicon rod squaring apparatus:

In some embodiments, the plurality of cutting wheels belonging to the same wire-cutting unit form at least two cutting wheel groups in a pairwise manner, a transition wheel is arranged between two adjacent cutting wheels in the two adjacent cutting wheel groups, and the cutting wire is sequentially wound on the cutting wheels and the transition wheel to form a cutting wire saw between the two cutting wheels in each cutting wheel group, wherein the cutting wire is threaded out from the cutting wire groove of the last cutting wheel in the previous cutting wheel group when wound on the two adjacent cutting wheels in the two adjacent cutting wheel groups and is threaded into the cutting wire groove of the previous cutting wheel in the next cutting wheel group after passing through the wire groove of the transition wheel.

Referring to fig. 18 and 19, fig. 18 is a schematic structural view illustrating a wire cutting device according to an embodiment of the present invention applied to a silicon rod extracting apparatus, and fig. 19 is a schematic structural view illustrating a wire cutting unit of the wire cutting device according to an embodiment. As shown, 4 cutting wheel sets are provided in the wire cutting unit 21 of the wire cutting device. A transition wheel 212 is arranged between two adjacent cutting wheel sets, wherein a cutting line 213 is sequentially wound on the cutting wheel 211 and the transition wheel 212 to form a cutting wire saw on the two cutting wheels 211 of each cutting wheel set, wherein the cutting line 213 passes through the cutting wire groove of the last cutting wheel 211 in the previous cutting wheel set when being wound on the two adjacent cutting wheels 211 in the two adjacent cutting wheel sets, and passes through the cutting wire groove of the last cutting wheel 211 in the next cutting wheel set after passing through the transition wheel 212. Here, the same transition wheel 212 is shared between every two adjacent cutting wheel sets for guiding, so that the length of the cutting line 213 for tension adjustment and guiding can be reduced, the length proportion of the cutting line 213 for forming a cutting wire saw in the cutting line 213 is increased, the utilization rate of the cutting line 213 is improved while the wire winding mode is simplified, and the production cost is reduced.

Based on the position relationship between the cutting wheel 211 and the silicon rod carrying structure in each cutting wheel set, any one cutting wire saw can be used for cutting the silicon rods corresponding to 1 (as shown in the embodiment shown in fig. 18), 2, 3, 4, etc. silicon rod carrying structures.

In other embodiments, as shown in fig. 2, the plurality of cutting wheels 211 belonging to the same wire-cutting unit 21 includes a leading cutting wheel 211, a trailing cutting wheel 211, and at least one intermediate cutting wheel 211 located between the leading cutting wheel 211 and the trailing cutting wheel 211, a transition wheel 212 is further provided beside the at least one intermediate cutting wheel 211, the transition wheel 212 has at least two wire grooves, and the cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form one cutting wire saw on any two adjacent cutting wheels 211, wherein the cutting wire 213 passes through one of the at least two cutting wire grooves on the intermediate cutting wheel 211 and passes through another one of the at least two cutting wire grooves on the intermediate cutting wheel 211 after passing through the transition wheel 212 beside, when being wound around the intermediate cutting wheel 211, so that any two adjacent cutting wire saws have a cutting offset in the second direction, the cutting offset corresponds to the spacing between the two associated cutting line slots.

The transition wheel and the at least one shifting mechanism can be directly connected or indirectly connected.

In some embodiments, each of the transition wheels is disposed on a support that carries the transition wheel with it by the at least one displacement mechanism to move in the second direction.

In one embodiment, a support for carrying a transition wheel is arranged in the wire cutting unit, the support is movably arranged on a mounting beam of the wire cutting unit, the support is driven by the at least one displacement mechanism to move along the second direction, and the transition wheel arranged on the support moves along the second direction relative to the mounting beam along with the support.

Fig. 24 is a schematic structural view of a transition wheel and a support of the wire cutting apparatus according to an embodiment of the present invention. As shown in the figure, the bracket 2121 for disposing the transition wheel 212 may be configured as a triangular bracket or a truss structure, for example, although the bracket 2121 may also be configured as another structure, such as a vertical bearing plate, etc., the transition wheel 212 may be rotatably disposed on the bracket 2121, and when the at least one displacement mechanism drives the bracket 2121 to move along the second direction, the transition wheel 212 carried by the bracket 2121 may be driven to move along with the movement.

In some embodiments, the at least one transition wheel is configured with mutually independent displacement mechanisms, and each transition wheel is driven by a corresponding displacement mechanism to move along the second direction; or, the brackets of the at least one transition wheel are connected together through a connecting beam, and the connecting beam drives the at least one transition wheel to move along the second direction through the at least one displacement mechanism.

Here, each of the at least one transition wheel may be configured with a shifting mechanism, for example, to independently drive the corresponding transition wheel to move in the second direction, and the shifting mechanism may be connected to the transition wheel bracket; for another example, the supports of the at least one transition wheel are connected together through a connection beam, the specific form of the connection beam is not limited by a beam structure, for example, the connection beam may be a beam body, a truss structure, a frame structure, or the like, the connection beam only needs to connect the supports of different transition wheels in the wire cutting unit, and the at least one displacement mechanism drives the connection beam to move along the second direction, that is, each transition wheel relatively fixed by the connection beam and the corresponding support thereof can move along the second direction along the connection beam.

In some embodiments, the shifting mechanism is configured to drive the at least one transition wheel to move in the second direction, and the shifting mechanism is configured to movably dispose the at least one transition wheel in the wire cutting unit.

In some examples, the displacement mechanism comprises: a shift guide rail arranged along a second direction; and the power source is used for driving the at least one transition wheel to move along the displacement guide rail.

Please refer to fig. 25, which is an enlarged structural diagram of C in fig. 23. Referring to fig. 23 and 25, as shown, the shift guide 2151 may be disposed on the mounting beam, for example, and is used to bear the transition wheel 212, so that the transition wheel 212 moves along the guide under the driving of the power source; or a connecting beam 2122 for carrying the transition wheel support 2121 or connecting each transition wheel support 2121, and correspondingly, the power source can drive the support 2121 or the connecting beam 2122 of the transition wheel 212. In a specific implementation manner, the transition wheel 212, the bracket 2121 or the connecting beam 2122 may be disposed on the displacement guide rail 2151 through a sliding block, for example, and under the action of a power source, the transition wheel 212, the bracket 2121 or the connecting beam 2122 carried on the displacement guide rail 2151 may be displaced in the second direction under the limiting action of the displacement guide rail 2151.

It should be noted that, in the embodiments provided in the present application, when each of the at least one transition wheel is configured with a shifting mechanism to independently drive the corresponding transition wheel to move in the second direction, the shifting guide rail in the shifting mechanism corresponds to one transition wheel, and the power source corresponds to the transition wheel provided on the driving shifting guide rail; when the support of at least one transition wheel is connected together through the tie-beam, the guide rail that shifts corresponds the tie-beam, the quantity of guide rail that shifts can be one, two, three etc. in the actual scene, can be based on the tie-beam span length and tie-beam and the factors such as the gross weight of transition wheel of bearing of crossing that the tie-beam span length synthesizes the guide rail quantity that sets up of confirming.

In certain embodiments, the power source is a cylinder assembly comprising a cylinder or hydraulic pump, and a telescoping rod; wherein the telescopic rod is connected to the bracket of the transition wheel or the connection beam.

The telescopic rod is arranged along the second direction, one end of the telescopic rod is connected to the air cylinder or the hydraulic pump, the other end, namely the free end, is connected to the bracket of the transition wheel or the connecting beam, the free end of the telescopic rod moves in a telescopic manner under the driving of the air cylinder or the hydraulic pump, namely, the free end moves in the second direction, so that the bracket of the transition wheel or the connecting beam connected with the free end is driven to move in the second direction, the position of the wire guide groove of the transition wheel corresponding to the bracket of the transition wheel or the connecting beam moves in the second direction relative to the cutting wire groove, and the current wire guide groove wound by cutting in the corresponding transition wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction by controlling the displacement of the free end of the telescopic rod.

In some embodiments, the power source comprises: a screw rod and a driving source; wherein the lead screw is connected to the bracket of the transition wheel or the connection beam.

In one implementation mode, the screw rod is arranged in the second direction, one end of the screw rod is connected with the driving source to rotate along a screw rod shaft under the driving of the driving source, the other end of the screw rod is connected to the transition wheel bracket or the connecting beam through threads, the screw rod converts the rotation driven by the driving source into linear motion along the arrangement direction of the screw rod in a threaded connection mode, and the transition wheel bracket or the connecting beam moves along the displacement guide rail through screw rod transmission.

In another implementation manner, one end of the screw rod is connected to the driving source, the other end of the screw rod is connected to the transition wheel bracket or the connecting beam, the screw rod moves along the second direction under the driving of the driving source, for example, the screw rod is connected to a cylinder piston rod, and if the screw rod is connected to other mechanisms capable of generating linear motion, the screw rod linearly moves along the second direction under the driving of the driving source and drives the connected transition wheel bracket or the connecting beam to generate displacement in the second direction.

The at least one transition wheel can move along the second direction under the action of the at least one shifting mechanism, and the current wire groove cut and wound in the at least one transition wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction by controlling the moving distance of the at least one transition wheel, so that the groove switching of the cutting wheel can be carried out, the transition rotation groove and the calibration are not needed in the groove switching process, and the groove switching process is simplified.

In an actual cutting operation, after the groove changing operation is performed, the cutting wire is moved from the first groove to the second groove, the position of the cutting wire saw in the second direction is changed, and the position of the cutting wire saw is generally adjusted according to the processing requirement, so as to process the silicon rod according to the preset cutting amount. To simplify this process, the present application further provides the following embodiments:

in some embodiments, the wire cutting apparatus further comprises: the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

The wire cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the at least one distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or the processing specification) relative to the silicon rod.

In some implementations, please refer to fig. 26, which is an enlarged schematic view of fig. 17 at D. As shown in the drawings, the wire-cutting unit 21 may be disposed on the cutting frame 20 by a wire-cutting support 24, the wire-cutting support 24 is disposed on the cutting frame 20 and includes a guide rail disposed along the second direction, and the wire-cutting unit 21 is disposed on the guide rail of the wire-cutting support 24 to form a degree of freedom for movement along the second direction; of course, the wire cutting support 24 may also be configured with a guide slot in the second direction, a slide bar in the second direction, or other limiting structure or guiding structure in the second direction for disposing the at least one wire cutting unit 21, which is not limited in this application. The at least one distance adjustment mechanism 23 adjusts the position of the wire-cutting unit 21 in the second direction on the wire-cutting support 24.

It should be understood that the wire cutting apparatus may perform the cutting process on the silicon rod based on the elevating movement of the wire cutting unit 21 along the cutting frame 20, and the control of the cutting specification is performed by adjusting the relative position between the cutting wire saw and the silicon rod in the second direction. With reference to fig. 17 and 26, when the silicon rod is placed on the silicon rod support structure, the position is fixed, and the cutting position of at least one wire saw in the at least one wire cutting unit 21 can be adjusted by moving the cutting wire saw in the second direction by the pitch adjusting mechanism 23, so that the cutting amount of the silicon rod can be controlled. Or, by adjusting the position of the cutting wheel carried by the wire cutting unit 21 along the second direction, the cutting wire can be switched, and the position of the cutting wire saw in the second direction before and after the switching of the cutting wire can be controlled to be unchanged.

In certain embodiments, the wire cutting device comprises a single wire cutting unit, the pitch adjustment mechanism comprising: the screw rod is arranged along the second direction and is in threaded connection with the single-wire cutting unit; and the driving source is used for driving the screw rod to rotate.

In certain embodiments, the wire cutting device comprises a first wire cutting unit and a second wire cutting unit oppositely arranged in a second direction, at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move in the second direction, so as to adjust the wire saw spacing between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit, or change the cutting wire around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.

In some embodiments, the wire cutting device comprises two wire cutting units, such as a first wire cutting unit and a second wire cutting unit, for example, as shown in fig. 23, the first wire cutting unit and the second wire cutting unit are arranged in parallel with each other along a first direction, and the cutting wires in the first wire cutting unit and the second wire cutting unit are also parallel. In a practical scenario, the wire cutting device may be used, for example, in a silicon rod squaring apparatus, wherein a silicon rod on each silicon rod carrying structure in the silicon rod squaring apparatus corresponds to the cutting wire saws of the first cutting unit and the second cutting unit in the cutting area, and then two parallel sections can be formed on the surface of the silicon rod by one lifting cutting. Here, the cutting amount of the silicon rod may be controlled by adjusting the distance between the first wire cutting unit and the second wire cutting unit in the second direction.

The at least one distance adjusting mechanism can be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit to drive the plurality of cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit to move along the second direction, and realize adjustment of the cutting position of at least one wire saw in the connected or associated first wire cutting unit or/and second wire cutting unit, or transformation of the cutting wire grooves of the plurality of cutting wheels in the connected or associated first wire cutting unit or/and second wire cutting unit.

In yet another embodiment, the pitch adjustment mechanism comprises: a rack in a second direction and associated with the first wire cutting unit or the second wire cutting unit; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate. The driving source can control the rack to linearly move along the rack direction through the transmission gear and the rack which are meshed with each other, and the first wire cutting unit or the second wire cutting unit which is related to the rack can be driven by the rack to move along the second direction.

In one embodiment, the pitch adjustment mechanism comprises: the bidirectional screw rod is arranged along a second direction and is in threaded connection with the first wire cutting unit and the second wire cutting unit; and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the second direction in a facing way or in a back-to-back way. In one embodiment, the bidirectional screw is a double-threaded screw, the two ends of the bidirectional screw are respectively provided with threads with opposite thread directions, the driving source can be disposed at either end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft, and by means of the threads with opposite thread directions at the two ends of the bidirectional screw, when the bidirectional screw is driven to rotate by the driving source, the motion at the two ends of the bidirectional screw is converted into axial linear motion with opposite directions, and the axial direction is the second direction of the bidirectional screw. Under the drive of the driving source, the first wire cutting unit and the second wire cutting unit can move towards or away from each other.

In an embodiment, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, and the transmission gear is connected to a power output shaft (not shown) of a driving source such as a servo motor, and is engaged with the first rack and the second rack, so as to drive the first wire cutting unit and the second wire cutting unit to move in opposite directions to perform a closing motion when rotating in a forward direction, and drive the first wire cutting unit and the second wire cutting unit to move in opposite directions when rotating in a reverse direction. The first rack and the second rack can be meshed with two sides of the transmission gear, so that linear velocity directions of the first rack and the second rack are opposite when the transmission gear rotates, the transmission gear is driven to rotate by the driving motor, the first rack and the second rack move oppositely when the transmission gear rotates positively to drive the first wire cutting unit and the second wire cutting unit to move oppositely, and the first rack and the second rack move oppositely to drive the first wire cutting unit and the second wire cutting unit to move oppositely when the transmission gear is driven to rotate reversely. Here, the transmission gear may be connected to a power take-off shaft of the drive source, or may be indirectly connected to the power take-off shaft, for example, connected to a rotating portion connected to the power take-off shaft.

In an actual scene, one or more distance adjusting mechanisms may be disposed in the wire cutting device, each distance adjusting mechanism is connected to the first wire cutting unit and the second wire cutting unit, and the number of the distance adjusting mechanisms may be determined based on the driving power requirement, the stress state of a transmission mechanism such as a lead screw, the smoothness of movement of a plurality of cutting wheels in the driving wire cutting unit, and the equipment space of the wire cutting device, for example, when the span of the first wire cutting unit and the second wire cutting unit in the first direction is small, the cutting position of the cutting wire saw in the cutting unit can be adjusted or the cutting wire can be slotted by using only one distance adjusting mechanism, and then a distance adjusting mechanism may be disposed in the wire cutting device to drive the first wire cutting unit and the second wire cutting unit to move towards or away from each other along the second direction; for another example, when the span of the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit needs to be driven by a large power and needs to meet the requirement that the power is within the stress intensity range of the transmission connecting component such as the screw rod or the rack, a plurality of distance adjusting mechanisms can be arranged in the wire cutting device, and the plurality of distance adjusting mechanisms cooperate with each other to ensure that the plurality of distance adjusting mechanisms drive the plurality of wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move in the second direction in opposite directions or away from each other with the same displacement (size and direction).

In some embodiments, the at least one distance adjusting mechanism drives the lower wire cutting unit to move along the second direction, and the at least one transition wheel and the plurality of cutting wheels jointly follow the mounting beam to move along the second direction, in this state, the at least one transition wheel and the plurality of cutting wheels are relatively static, that is, the position relationship between the transition wheel and the cutting wheels is not changed. When the distance adjusting mechanism is used for adjusting the cutting position of at least one wire saw in the at least one wire cutting unit, the cutting position adjustment can be realized only by moving along the second direction, and the positional relationship of the cutting wire saw relative to the cutting wheel and the transition wheel is not changed.

Referring to fig. 27, 28 and 29, fig. 27 is a top view, fig. 28 is a side view and fig. 29 is an enlarged view of the wire cutting device of the present application in one embodiment.

Referring to fig. 27 and 28 in combination, in some embodiments, when the at least one distance-adjusting mechanism drives the wire-cutting unit 21 to move along the second direction, the at least one transition wheel 212 and the plurality of cutting wheels 211 jointly follow the movement of the mounting beam 214 along the second direction (in the direction of the arrow shown in fig. 27), and at the same time, the at least one shifting mechanism 215 drives the at least one transition wheel 212 or the connecting beam 2122 for connecting the transition wheel bracket 2121 to move along the shifting guide rail along the second direction (in the direction of the arrow shown above the bracket 2121 in fig. 28), even if the at least one transition wheel 212 moves along the second direction relative to the mounting beam 214, so that the current wire groove wound by cutting in the at least one transition wheel 212 moves from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction, referring to fig. 29, when the transition wheel 212 moves in the second direction relative to the cutting wheel 211, the wire groove of the transition wheel 212 can be switched to correspond to a different cutting wire groove. In this state, the distance that the distance-adjusting mechanism drives the wire-cutting unit 21 to move along the second direction is controlled to be equal to and opposite to the distance that the at least one shifting mechanism 215 drives the at least one transition wheel 212 to move along the second direction, so that groove switching of the cutting wire 213 relative to the cutting wheel 211 can be realized, and the spatial positions of the cutting wire 213 before and after groove switching are not changed, that is, the silicon rod cutting can be continued according to the cutting specification of the silicon rod preset before groove switching after groove switching, and in this example, groove switching adjustment of the transition wheel 212 and position calibration operations of the cutting wire 213 and the cutting wheel 211 can be omitted in the groove switching process.

In an actual scene, the cutting line grooves corresponding to the front and rear cutting lines after the groove replacement can be determined in advance, for example, the position of the cutting line before the groove replacement is the cutting line groove a1, the cutting line after the groove replacement is wound around the cutting line groove a2, and the displacement of the plurality of cutting wheels in the driving line cutting unit of the at least one distance adjustment mechanism in the second direction is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set to the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement can be used to replace the cutting line groove a1 for the cutting line to the cutting line groove a 2; it should be noted that the direction in which the plurality of cutting wheels in the wire cutting unit are driven by the at least one distance adjusting mechanism to move in the second direction is the direction in which the cutting wire groove a2 points to the cutting wire groove a 1; meanwhile, the shifting mechanism drives the at least one transition wheel to move relative to the linear cutting unit along a second direction, the moving distance is the cutting offset between the cutting line groove a1 and the cutting line groove a2, the shifting direction of the at least one transition wheel relative to the linear cutting unit is the direction in which the cutting line groove a1 points to the cutting line groove a2, and the position of the at least one transition wheel in the second direction in space (for example, with the stand as a reference) is unchanged before and after the shifting; here, the cutting position of the cutting wire saw in space is unchanged after the groove is replaced, so that the silicon rod can be cut according to the preset cutting amount without the step of further calibrating the position of the cutting wheel or other components, and the groove replacing process is simplified.

Here, the present application provides a wire cutting device of a silicon rod processing apparatus, wherein the wire cutting unit comprises at least one shifting mechanism therein for driving the at least one transition wheel to move along the second direction, so that the current wire groove of the at least one transition wheel, which is wound by cutting, moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. The wire cutting device provided by the application can be used for changing the groove without adjusting the groove position of the cutting wire wound around the wire groove by the at least one shifting mechanism, and the operations of adjusting, calibrating and the like of the transition wheel can be omitted after the groove is changed; meanwhile, the transition wheel can be replaced by a single-groove transition wheel, in an actual scene, the transition wheel can be set as a replaceable consumable transition wheel, and the transition wheel can be directly replaced after the wire groove of the transition wheel is worn, so that the maintenance process of the equipment worn due to cutting is simplified.

The present application further provides a silicon rod processing device, which comprises a machine base, a silicon rod carrying structure, and a wire cutting device according to any one of the implementations of the embodiments shown in fig. 23 to 29. The machine base is provided with a silicon rod processing platform, and the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut.

The translation mechanism may include, for example, a translation guide, a slider, and a translation drive unit. The silicon rod processing platform is arranged on the base, the sliding block is arranged at the bottom of the silicon rod processing platform and matched with the translation guide rail to provide translation guide for the silicon rod processing platform, and the translation driving unit is used for driving the silicon rod processing platform to move along the translation guide rail so as to enable the silicon rod bearing structure to be switched between the cutting area and the loading and unloading area; in other embodiments, the translation mechanism may also adopt a gear transmission manner, specifically, the translation mechanism includes a translation rack and a rotating gear driven by a motor and adapted to the translation rack, the translation rack is disposed at the bottom of the silicon rod processing platform, and may be, for example, at least one rack having a certain length, in order to enable the silicon rod processing platform to move stably, each rack is adapted with at least two rotating gears disposed at an interval, and the motor drives the rotating gear to rotate, so as to drive the silicon rod bearing structure located on the silicon rod processing platform to switch between the cutting area and the loading and unloading area.

The silicon rod squaring equipment is provided with the wire cutting device in any one of the embodiments shown in fig. 23 to 29, and after the cutting wire grooves are abraded due to the squaring operation of the cutting wheels in the silicon rod squaring equipment, the shifting mechanism can be used for omitting the calibration of the transition rotation groove and the transition wheel in the groove changing process, so that the groove changing process is simpler; in some embodiments provided in fig. 23 to 29, at least one distance adjusting mechanism may be further provided in the wire-cutting device of the silicon rod squaring apparatus, the cutting position of the cutting wire saw may be adjusted to determine the cutting amount of the silicon rod based on the at least one distance adjusting mechanism, or the position of the wire groove of the cutting wire may be changed based on the at least one distance adjusting mechanism after the wire groove of the cutting wheel of the silicon rod squaring apparatus is worn during a long-term cutting operation, so as to ensure the processing precision of the silicon rod squaring apparatus during the continued squaring operation, and in the case that the at least one distance adjusting mechanism cooperates with the at least one shifting mechanism, the silicon rod squaring apparatus does not need to adjust the guide groove for winding the cutting wire in the transition wheel when changing the wire groove, and the cutting wire saw after changing the groove may maintain the same position as that before changing the groove in the second direction, so that the process of replacing the groove is simplified.

The base is provided with a silicon rod processing platform, and the silicon rod bearing device is arranged on the silicon rod processing platform. Here, the silicon rod carrying device may be used, for example, for horizontally carrying a silicon rod to be cut, and the wire cutting device includes: the cutting frame is arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; at least one transition wheel, each transition wheel having a wire guide groove; the cutting wire is wound on the plurality of cutting wheels and the transition wheel in sequence to form at least one cutting wire saw; and the at least one shifting mechanism is used for driving the at least one transition wheel to move along the second direction so as to enable the current wire groove which is cut and wound in the at least one transition wheel to move from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. The linear cutting unit moves up and down relative to the cutting frame, so that feeding and cutting of the silicon rod to be cut can be realized.

In some examples, a plurality of parallel linear cutting units are arranged in the linear cutting device of the silicon rod cutting machine, and the plurality of parallel linear cutting units move up and down along the cutting frame, so that the silicon rod to be cut can be cut into a plurality of silicon rod sections in one cutting. The cutting wire groove of at least one cutting wire saw in the wire cutting unit in the cutting wheel can be adjusted based on at least one shifting mechanism of the wire cutting device, so that the cutting wheel abraded in the cutting operation can be continuously used after the cutting wire groove is replaced, and meanwhile, the groove replacement process can be realized without adjusting the position of a wire guide groove of the cutting wire on a transition wheel.

In one embodiment, the arrangement manner of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device may refer to the arrangement manner disclosed in chinese patent CN105196433B, and of course, the at least one shifting mechanism is included in the wire cutting device of the silicon rod cutting machine and is used for driving the at least one transition wheel to move along the second direction, so that the current wire groove cut and wound in the at least one transition wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

In some examples, the silicon rod cutting machine is, for example, a double silicon rod cutting device, wherein a first processing station and a second processing station are provided in a silicon rod carrying device of the silicon rod cutting machine to correspondingly carry a first silicon rod to be cut and a second silicon rod to be cut, respectively. Referring to fig. 21, a schematic structural view of a wire cutting apparatus of the silicon rod clipper in one embodiment is shown. In this example, the wire-cut support 24 is disposed on the cutting frame 20, at least one wire-cut unit 21 is disposed on each of two sides of the wire-cut support 24 along the first direction, and the at least one wire-cut unit 21 on each of two sides of the wire-cut support 24 can cut the silicon rod to be cut at the first processing station and the second processing station. Here, the wire cutting unit 21 of the wire cutting support 24 includes a cutting wheel 211, a transition wheel 212, a cutting wire 213 wound around the cutting wheel 211, and at least one displacement mechanism; wherein the cutting wheel 211 has at least two cutting wire slots thereon, and the at least one shifting mechanism is configured to drive the at least one transition wheel 212 to move along the second direction, so that the current wire slot of the at least one transition wheel 212, which is wound by cutting, moves from the first wire slot corresponding to the cutting wheel 211 to the second wire slot corresponding to the cutting wheel 211 in the second direction. Based on the at least one shifting mechanism, the relative position between the transition wheel 212 and the cutting wheel 211 in the linear cutting unit of the silicon rod cutting machine in the second direction can be adjusted, and the wire grooves of the transition wheel can be aligned to different cutting wire grooves in the cutting wheel under the driving of the at least one shifting mechanism. In an actual scenario, when the cutting line is changed for the cutting wheel 211, the wire groove for winding the cutting line 213 before and after the groove change and the cutting line groove are aligned in the second direction without changing the wire groove of the cutting line 213 wound in the transition wheel 212.

The form of the at least one displacement mechanism may also be referred to herein as the displacement mechanism described in any of the embodiments shown in fig. 23-29.

In some embodiments, the wire-cutting units 21 on both sides of the wire-cutting support 24 may also be combined into at least one pair of wire-cutting units 21, for example, the wire-cutting units 21 on both sides of the wire-cutting support 24 are correspondingly connected to form at least one pair of wire-cutting units 21, the pair of wire-cutting units 21 are located on the same straight line in the first direction, in this case, the transition wheels 212 on one pair of wire-cutting units 21 can be driven to move in the second direction based on the same displacement mechanism, for example, when the brackets of the transition wheels 212 of one pair of wire-cutting units 21 are connected together by the connecting beam; of course, the pair of line cutting units 21 may be driven by a plurality of displacement mechanisms in cooperation, or each of the transition wheels 212 may be driven by a displacement mechanism independent of each other.

Here, the specific form of the displacement mechanism may refer to the implementation provided in the embodiment shown in fig. 23 to fig. 29, and is not described herein again. In some examples, the wire cutting unit may further include a distance adjusting mechanism as described in the embodiments provided in the embodiments shown in fig. 23 to 29; in this case, the distance adjustment mechanism and the displacement mechanism cooperate with each other to perform a positional adjustment of the cutting wire saw or to change the way in which the cutting wire is wound around the cutting wire groove in the cutting wheel, as described in the embodiments of fig. 23 to 29.

Of course, the specific form of the silicon rod cutting machine is not limited to the foregoing embodiments, for example, each cutting wire of the silicon rod cutting machine can cut and cut a plurality of silicon rods simultaneously based on the relationship between the arrangement position of the silicon rods on the silicon rod bearing device and the positions of the cutting wires; for another example, the wire cutting device of the silicon rod cutting machine only comprises a section of cutting wire saw, and the section of cutting wire saw is used for cutting a silicon rod cut in one cutting operation when a single or a plurality of silicon rods are cut; the present application is not limited, and it should be noted that the wire-cutting device of the silicon rod clipper includes the shift mechanism according to any one of the embodiments shown in fig. 23 to 29 to adjust the position of the transition wheel in the wire-cutting device in the second direction with respect to the cutting wheel.

The machine base is provided with a silicon rod processing platform, and the silicon rod processing platform can be set as a processing area for executing different processing functions in the silicon rod cutting and grinding integrated machine, for example, the silicon rod processing platform consists of a cutting station and a grinding station; the silicon rod bearing device is used for bearing a silicon rod to be processed; the wire cutting device includes: the cutting frame is arranged on the base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves; at least one transition wheel, each transition wheel having a wire guide groove; the cutting wire is wound on the plurality of cutting wheels and the transition wheel in sequence to form at least one cutting wire saw; and the at least one shifting mechanism is used for driving the at least one transition wheel to move along the second direction so as to enable the current wire groove which is cut and wound in the at least one transition wheel to move from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

In the present embodiment, since the wire cutting support 24 is provided with the first cutting unit and the second cutting unit, that is, the first cutting unit and the second cutting unit share the wire cutting support 24. Thus, in the present embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 of the wire cutting apparatus are disposed in a centered position between the first processing position and the second processing position. On the other hand, the wire cutting support 24 is specially designed. As shown in FIG. 22, the wire cutting holder 24 in this embodiment may include a holder body and first and second holder wings located on opposite lateral sides of the holder body. In some embodiments, the main support body in the wire cut support 24 is disposed at 45 ° to the X or Y axis, the first support flank is disposed at 145 ° to the main support body and is disposed along the Y axis, and the second support flank is disposed at 145 ° to the main support body and is disposed along the X axis.

In some embodiments, the first cutting unit group may include at least four first cutting wheels 211a and two first transition wheels, and the four first cutting wheels 211a may be combined into a pair of first cutting wheel groups, that is, one first cutting wheel group is formed by oppositely arranging the two first cutting wheels 211a along the X-axis, and the pair of first cutting wheel groups is formed by oppositely arranging the two first cutting wheel groups along the Y-axis. The cutting lines 213 sequentially wind around each of the first cutting wheels 211a in the first cutting unit group to form a cutting line net. In practical applications, the cutting line 213 sequentially winds around the four first cutting wheels 211a in the first cutting unit group to form two cutting wires, which are arranged along the X-axis direction and parallel to each other to form a cutting wire net. Specifically, two parallel cutting wire saws are matched to form a first cutting wire net which is shaped like a Chinese character 'ri' along the X-axis direction; meanwhile, when the cutting line 213 winds around the first cutting wheel set, the cutting line 213 winds around the first transition wheel to perform direction change or tension adjustment of the cutting line 213, where the first transition wheel is parallel to the cutting wheel 211 of the corresponding first cutting wheel set, that is, both are parallel to the first direction. A line cutting unit is formed by oppositely arranging two first cutting wheels 211a, a cutting line 213 wound therein and a first transition wheel along the X-axis, in this embodiment, two line cutting units 21 are formed in the first cutting unit group in parallel.

Similarly, the second cutting unit group may at least include four second cutting wheels 211b and two second transition wheels, wherein two second cutting wheels 211b are oppositely disposed along the Y axis to form a second cutting wheel group, and two second cutting wheel groups along the X axis form a pair of second cutting wheel groups; in practical applications, the cutting line 213 sequentially winds around the four second cutting wheels 211b in the second cutting unit group to form two cutting wire saws, the two cutting wire saws are arranged along the Y-axis direction and are parallel to each other, and the two parallel cutting wire saws are matched to form a second cutting wire web which is in a shape of a Chinese character ═ shape along the Y-axis direction; meanwhile, when the cutting line 213 winds around the second cutting wheel set, the cutting line 213 winds around the second transition wheel to perform direction change or tension adjustment of the cutting line 213, and here, the second transition wheel is parallel to the cutting wheel 211 of the corresponding second cutting wheel set, that is, both are parallel to the first direction. A line cutting unit is formed by oppositely arranging two first cutting wheels 211a, a cutting line 213 wound therein and a second transition wheel along the Y-axis, in this embodiment, two line cutting units 21 are formed in the second cutting unit group in parallel.

It should be noted that the first direction and the second direction are defined based on a carrier coordinate system of the wire-cut unit, and therefore, when the directions of the plurality of wire-cut units in the silicon rod processing apparatus (in this example, the silicon rod slicing and grinding all-in-one machine) are different, the first directions respectively corresponding to the plurality of wire-cuts are not the same direction in the external space; correspondingly, the second direction is orthogonal to the first direction, and therefore the direction of movement performed by the at least one displacement mechanism to drive the at least one transition wheel is orthogonal with respect to the driven wire cutting unit. For example, in the first cutting unit group, the wire cutting units and the cutting wire saw are arranged along an X-axis direction, the first direction in the first cutting unit group is an X-axis direction, and the second direction in the first cutting unit group is a Y-axis direction; in the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y-axis direction, the first direction in the second cutting unit group is the Y-axis direction, and the second direction is the X-axis direction.

In the first cutting unit group and the second cutting unit group, the number of the cutting wheels and the number of the transition wheels in any one of the linear cutting units can be correspondingly changed, for example, the number of the cutting wheels in one linear cutting unit can also be three, four, etc., and the number of the transition wheels can also be two or more.

In the foregoing examples of the silicon rod slicing and grinding all-in-one machine, each of the cutting wheels of the wire cutting unit has at least two cutting wire grooves, and here, at least one shifting mechanism is further included in any one of the wire cutting units of the wire cutting device for driving the at least one transition wheel to move in the second direction, so that the current wire groove cut and wound in the at least one transition wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. Under the arrangement, the transition wheel can be a single wire groove transition wheel or a multi-wire groove transition wheel, and the groove changing of the cutting line on the cutting wheel can be realized without changing the position of the wire groove of the cutting line wound around the transition wheel based on the driving action of the at least one shifting mechanism. When the cutting line groove is abraded due to the fact that the cutting wheel in the linear cutting unit of the first cutting unit group or the second cutting unit group performs the squaring operation, the cutting line is replaced by the shifting mechanism to wind the cutting line groove position of the cutting wheel, the cutting wheel can be reused, and the relative position of the cutting line and the transition wheel does not need to be adjusted in the groove replacing process through the shifting mechanism. Here, the arrangement of the displacement mechanism may refer to the displacement mechanism as described in any one of the implementations of the embodiments shown in fig. 23 to 29.

In the silicon rod grinding all-in-one machine, the first processing location and the second processing location include two parallel wire cutting units, in some examples, the first processing location and the second processing location further include at least one distance adjusting mechanism, the distance adjusting mechanism may be, for example, associated with a first wire cutting unit or a second wire cutting unit of the two wire cutting units, or associated with the first wire cutting unit and the second wire cutting unit at the same time, and the distance adjusting mechanism may be, for example, set as the distance adjusting mechanism described in any implementation manner of the embodiments shown in fig. 23 to fig. 29, for example, connected with the first wire cutting unit or the second wire cutting unit by a lead screw, connected with the first wire cutting unit and the second wire cutting unit by a bidirectional lead screw, or set as a servo motor, and the like, which will not be described herein again.

When the at least one distance adjusting mechanism drives the plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit to move along the second direction, the first wire cutting unit or/and the second wire cutting unit may move along the first support flank, that is, along the second direction (Y-axis direction) in the first cutting unit group, for example; the cutting wire groove can be used for adjusting the cutting position of at least one wire saw in the first wire cutting unit or/and the second wire cutting unit or changing the cutting wire to wind around a plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit; the at least one distance adjusting mechanism is matched with the at least one shifting mechanism in the wire cutting unit, groove changing can be achieved under the condition that a wire groove used for winding a cutting wire in the transition wheel is not required to be changed, and meanwhile, the position of the cutting wire saw in the second direction is unchanged before and after groove changing.

The second cutting unit group and the first cutting unit group are similar in structure form, and the main difference is that the arrangement position and the arrangement direction in the silicon rod cutting and grinding all-in-one machine are different; however, the structures and functions of the at least one displacement mechanism and the at least one distance adjusting mechanism in the second cutting unit group are similar to those of the at least one displacement mechanism and the at least one distance adjusting mechanism in the first cutting unit group, and are not repeated herein.

It should be understood that in some embodiments, the positional relationship between the first processing region and the second processing region may be changed, for example, the first processing region and the second processing region may be configured such that the silicon rod transfer device rotates 60 ° while carrying the silicon rod to switch between the two processing regions, and the directions of the wire cutting units in the corresponding first cutting unit group and second cutting unit group may also be changed, in this case, the first directions of the wire cutting units in the first cutting unit group and the second cutting unit group are respectively changed, but the position adjustment of the transition wheel relative to the cutting wheel in the second direction can still be realized by the at least one shifting mechanism in any of the embodiments shown in fig. 23 to 29; in certain embodiments, the silicon rod slicing and grinding all-in-one machine comprises, for example, only a single-wire cutting unit at different processing stations; in some embodiments, the silicon rod cutting and grinding all-in-one machine is provided with only one station for cutting, for example, in a specific implementation mode, a cutting wire net shaped like a Chinese character 'ri' can be arranged in the station for cutting, and after the silicon rod is cut by lifting and descending once through the cutting wire net, the silicon rod is driven by the silicon rod positioning mechanism to rotate 90 degrees for cutting again; the silicon rod cutting and grinding all-in-one machine has various deformation forms, and the application is not limited.

In the silicon rod evolution operation, the silicon rod can form the flaw-piece after the evolution cutting, therefore, need unload the flaw-piece that forms earlier, current flaw-piece uninstallation mode still mostly breaks away from the flaw-piece in the silicon rod that has been cut and removes it from silicon rod evolution equipment by operating personnel manual operation, not only inefficiency, and can make the flaw-piece collide and increase the risk of cut silicon rod damage with the silicon rod that has been cut in handling. Therefore, there is a need for a silicon rod squaring apparatus and a flaw-piece discharging device applied to the same, which can timely discharge flaw-pieces and improve the operation efficiency.

Moreover, can occupy certain equipment space based on the needs of transporting the boundary leather from the cutting area to boundary leather uninstallation district in boundary leather discharge apparatus, through confirming boundary leather discharge apparatus's structure and transfer route, the simple and easy degree of boundary leather discharge apparatus's equipment overall arrangement, transfer efficiency etc. are also different, here, this application provides a boundary leather discharge apparatus, be provided with the boundary leather fixture that is used for transporting the boundary leather among the boundary leather discharge apparatus, the boundary leather is transported to boundary leather fixture accessible swing arm pivoted mode, also can rotate through the swing arm under the state of not transporting and accomodate boundary leather fixture for boundary leather discharge apparatus occupies equipment space and reduces, and transfer route simplifies simultaneously, and transfer efficiency improves.

In the embodiments provided in the application, a flaw-piece discharging device applied to a silicon rod squaring device is provided, the silicon rod squaring device comprises a base, a wire cutting device and a silicon rod bearing structure, the silicon rod bearing structure is used for bearing a vertically placed silicon rod, the wire cutting device comprises a liftable wire cutting support and a wire cutting unit arranged on the wire cutting support, a cutting wire saw is arranged in the wire cutting unit, and the cutting wire saw is used for cutting the silicon rod to form a cut silicon rod and a flaw-piece; the flaw-piece discharge device comprises: a flaw-piece lifting unit for lifting the flaw-piece so that the flaw-piece tip protrudes out of the cut silicon rod; a flaw-piece centre gripping unit for carrying out flaw-piece centre gripping and transportation, flaw-piece centre gripping unit includes: the support column is arranged on the base; the first mounting part is arranged on the support column; at least a set of flaw-piece fixture is connected to through the swing arm first installation department, is used for the centre gripping the flaw-piece and promotion the flaw-piece breaks away from the cutting silicon rod to and controlled rotate in order to with around swing arm pivot the flaw-piece is transported to the flaw-piece uninstallation district.

Referring to fig. 30 and 31, fig. 30 is a schematic structural view of the edge strip discharging device of the present application applied to a silicon rod extracting apparatus in an embodiment, and fig. 31 is a schematic structural view of the edge strip discharging device of the present application in an embodiment. As shown in the figure, silicon rod bearing structure 11 has in the silicon rod evolution equipment, can be used to bear the silicon rod of vertical place, after cutting the coping saw cutting silicon rod among the wire-electrode cutting device, the flaw-piece that forms relies on the limiting displacement who bears structure 11 with the silicon rod in self action of gravity to continue to stop on silicon rod bearing structure 11 and near cutting the silicon rod, consequently need make the flaw-piece that forms after the cutting take place relative displacement with cutting the silicon rod, through the crisscross bulge centre gripping flaw-piece that forms of displacement, follow-up flaw-piece transportation that carries on, this application the flaw-piece hoisting unit be used for promoting the flaw-piece so that the flaw-piece top protrusion has cut the silicon rod.

In some examples, the supporting surface of the silicon rod bearing structure in the silicon rod squaring device provided with the flaw-piece discharging device is a planar structure, so that the flaw-piece formed after cutting is possibly in risk of falling or overturning and the like due to no corresponding support; in some embodiments, the flaw-piece discharging device further comprises a flaw-piece jacking mechanism for jacking a flaw-piece formed after the silicon rod to be cut is subjected to the squaring and cutting, and the flaw-piece lifting unit lifts the mechanism supported by the flaw-piece jacking mechanism. It should be noted that the edge skin jacking mechanism may also be a component of the silicon rod squaring apparatus, or the edge skin jacking mechanism is not a necessary mechanism in the edge skin unloading device or the silicon rod squaring apparatus.

In one embodiment, referring to fig. 32, which is a schematic structural view of the edge skin jacking mechanism in one embodiment, as shown in the figure, the edge skin jacking mechanism 53 comprises a supporting member, and the supporting member comprises a base 531 connected to one side surface of the silicon rod carrying structure 11 and a jacking portion 532 extending upwards from the base 531. The base 531 may also be configured as a flat plate structure, a curved plate structure or other special-shaped structures adapted to the side surface of the silicon rod supporting structure 11, which is not limited in this application. The jacking portions 532 are two jacking pillars arranged at two sides of the base 531, the extending heights of the jacking pillars are consistent with the height of the bearing surface of the silicon rod bearing structure 11, and in practice, the jacking portions 532 may also be top plates or ejector rods extending upwards from the base 531. When the wire cutting device performs cutting on the silicon rod to be cut on the silicon rod bearing structure 11, the corresponding flaw piece can be supported by the supporting piece, so that the situation that the cutting line segment in the wire cutting device is broken when penetrating out of the silicon rod to be cut is effectively prevented, and the flaw piece can be prevented from falling and overturning.

In another embodiment, the flaw-piece jacking mechanism includes a movable support member and a locking control member. In this embodiment, the movable supporting member includes a movable base connected to one side surface of the silicon rod carrying structure, a supporting portion extending upward from the movable base, and a power generating structure for providing the supporting portion to move up and down. In one embodiment, the movable base may be, for example, a planar plate structure adapted to a side surface of the silicon rod carrying structure, but not limited thereto, and the movable base may also be, for example, a curved plate structure or other special-shaped structure. The top support part is at least two top rods extending upwards from the movable base, but not limited to this, and the top support part may also be a top plate or a top pillar extending upwards from the movable base, for example. The power generating structure comprises two support legs arranged on the movable base and two springs respectively sleeved on the two support legs, but not limited thereto, and the power generating structure can also adopt structures such as a torsion spring, an elastic sheet and the like. The support legs and the connected ejector rods can move up and down relative to the silicon rod bearing structure by utilizing the elasticity of the springs. In this embodiment, the locking control member is used for controlling the movable supporting member in a locking state when the movable supporting member abuts against the bottom of the silicon rod to be cut. In an initial state, the ejector rod is exposed on the bearing surface of the silicon rod bearing structure under the action of the support legs and the springs, when a silicon rod to be cut is placed, the ejector rod overcomes the elasticity of the springs to move downwards after being pressed by the silicon rod to be cut until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing structure, at the moment, the electromagnetic lock serving as the locking control piece is electrified, and the electromagnetic lock tightly adsorbs the movable base in the movable bearing piece through strong magnetic force generated by an electromagnetic generating principle, so that the ejector rod is controlled in a locking state. When the linear cutting device carries out evolution cutting on the silicon rod to be cut, which is born by the silicon rod bearing structure corresponding to the cutting area in the silicon rod conversion device, the movable bearing piece in the locking state can prop and support the corresponding flaw strip, the situation that the cutting wire net in the linear cutting unit is broken when penetrating out the silicon rod to be cut can be effectively prevented, and the flaw strip can be prevented from falling, overturning and the like.

The edge lifting unit and the edge clamping unit can be used for projecting the edge on the silicon rod bearing structure to cut the silicon rod and transferring the silicon rod.

In some examples, the flaw-piece lifting unit includes a lifting member that is movable in a lifting manner, and the lifting member is controlled to support the flaw-piece to lift the flaw-piece.

In one example, the flaw-piece lifting unit is arranged on the base through a lifting guide rail, and after the flaw-piece is formed through cutting, the flaw-piece lifting unit is controlled to lift to the bottom of the silicon rod bearing structure and lift the flaw-piece from the bottom of the flaw-piece so that the flaw-piece protrudes out of the cut silicon rod.

In another example, the flaw-piece lifting unit performs lifting motion by attaching to a lifting wire-cutting support of the wire-cutting device, please refer to fig. 33, which is a schematic structural diagram of the flaw-piece lifting unit 51 of the flaw-piece discharging device of the present application in an embodiment, the flaw-piece lifting unit 51 includes a lifting piece 511 disposed on the wire-cutting support, the lifting piece is driven by a telescopic component 512 to perform telescopic motion, and the lifting piece 511 is controlled to perform stretching motion and then supports the bottom of the flaw-piece to lift the flaw-piece.

In an embodiment, the jacking member 511 includes a support plate and a support plate, the support plate extends upwards from the bottom of the support plate, further, the support plate may be an arc-shaped plate adapted to the arc-shaped surface of the flaw-piece, when the support plate is supported on the flaw-piece, the support plate can be in full contact with the arc-shaped surface of the flaw-piece, the contact portion between the support plate and the flaw-piece is smooth, or a cushion pad is added to the inner surface of the support plate, which is in contact with the flaw-piece. The supporting plate is used for supporting the bottom of the side leather, and further the supporting plate can be an arched plate matched with the bottom surface of the side leather. In other embodiments, the chord edge of the arched plate as the bearing plate can be additionally provided with a convex block to increase the contact area with the bottom surface of the side skin.

In an embodiment, the telescopic member 512 is, for example, an air cylinder with a telescopic rod, wherein the telescopic rod can be connected to the supporting plate in the lifting member 511 through a connecting structure, and the air cylinder can drive the telescopic rod to drive the lifting member 511 to perform telescopic motion. Here, the telescopic motion of the jacking piece 511 includes the contraction and extension motion of the jacking piece 511, in an actual scene, the contraction motion of the jacking piece 511 is that the cylinder drives the telescopic rod to contract so as to drive the jacking piece 511 to be away from the boundary leather, and the extension motion of the jacking piece 511 specifically means that the cylinder drives the telescopic rod to extend so as to drive the jacking piece 511 to be close to the boundary leather. Of course, the aforementioned telescopic component 512 may also adopt other implementation manners, for example, the telescopic component 512 may also be, for example, a servo motor with a lead screw, the lead screw is connected to the jacking component 511, and the lead screw is driven by the servo motor to rotate so as to drive the jacking component 511 connected to the lead screw to make telescopic motion, for example, the lead screw is driven to rotate forward to drive the jacking component 511 to make contraction motion, and the lead screw is driven to rotate backward to drive the jacking component 511 to make extension motion, or the lead screw is driven to rotate forward to drive the jacking component 511 to make extension motion and the lead screw is driven to rotate backward to drive the jacking component 511 to make contraction motion.

In practical application, in an initial state, the telescopic rod drives the jacking piece 511 to be in a contraction state, the wire cutting unit is driven to descend along with the wire cutting support so that the cutting line formed by each cutting line segment in the wire cutting unit performs squaring cutting on the silicon rod to be cut positioned in the cutting area until the cutting line segment penetrates through the silicon rod to be cut, one-time complete cutting of the silicon rod to be cut is completed and a flaw-piece is formed, at this time, the flaw-piece lifting mechanism descends to the bottom along with the wire cutting support, the cylinder drives the telescopic rod to extend so as to drive the jacking piece 511 to be close to the flaw-piece until a butting plate in the jacking piece 511 is in contact with the flaw-piece and butting is realized, subsequently, the wire cutting unit is driven to ascend along with the wire cutting support, the flaw-piece lifting mechanism ascends along with the wire cutting support to drive the flaw-piece to generate ascending displacement relative to the silicon rod which is subjected to one-time cutting, so that the top end of the flaw-piece protrudes out of the silicon rod to be cut, when the top end of the flaw-piece meets the set conditions compared with the protruding part of the silicon rod to be cut, the linear cutting support can be controlled to stop rising, so that the top end of the flaw-piece can be used as a force application part for grabbing, the flaw-piece is grabbed and unloaded, then the cylinder drives the telescopic rod to contract to drive the jacking piece 511 to return to the initial state, and meanwhile, the linear cutting support is controlled to drive the linear cutting unit and the flaw-piece lifting mechanism to continuously rise above the silicon rod to be cut so as to be ready for executing next cutting operation.

In some examples, the leather lifting unit comprises an adsorption piece capable of telescopic movement, and the adsorption piece is controlled to abut against the leather after stretching movement so as to lift the leather.

In an implementation, the flaw-piece hoist mechanism can include the absorption piece and the drive the telescopic part that the absorption piece made telescopic motion, the absorption piece is controlled by the telescopic part and leans on in the flaw-piece and adsorb the flaw-piece. The adsorption piece further comprises an abutting plate and an adsorption element. The abutting plate can be an arc-shaped plate matched with the arc-shaped surface of the edge leather, and can be fully contacted with the arc-shaped surface of the edge leather when the abutting plate abuts against the edge leather. The suction element may be, for example, a vacuum cup, and a plurality of vacuum cups may be arranged on a contact surface of the abutment plate to be in contact with the flaw-piece. The telescopic component can be, for example, an air cylinder with a telescopic rod or a servo motor with a screw rod, taking the air cylinder with a telescopic rod as an example, the telescopic rod can be connected with the abutting plate in the jacking piece through a connecting structure, the air cylinder can drive the telescopic rod to contract to drive the abutting plate to be away from the flaw-piece, and the air cylinder can drive the telescopic rod to extend to drive the abutting plate to be close to the flaw-piece and to be adsorbed to the flaw-piece by the adsorbing element after the abutting plate is contacted with the flaw-piece. Subsequently, the wire cutting support is driven to rise, the flaw-piece lifting mechanism and the wire cutting device lift along with the wire cutting support, and the flaw-piece lifting mechanism can drive the flaw-piece to move upwards relative to the cut silicon rod by utilizing the adsorption force, so that the top end of the flaw-piece protrudes out of the silicon rod which is subjected to the primary cutting operation.

It should be noted that, in some examples, the silicon rod squaring apparatus is provided with a plurality of cutting wheel sets to simultaneously cut a plurality of silicon rods to be cut, so that a plurality of flaw-piece lifting mechanisms are provided on the wire cutting support corresponding to the plurality of cutting wheel sets to simultaneously perform flaw-piece discharging on the plurality of silicon rods that have undergone cutting operation. Under the condition that the wire cutting device comprises a wire cutting unit, the wire cutting device is pressed down once to form a flaw-piece, and a flaw-piece lifting mechanism is arranged above a pair of cutting wheels corresponding to each silicon rod bearing structure on the wire cutting support so as to timely unload the flaw-piece formed in the cutting operation. Under the condition that two linear cutting units are arranged in the linear cutting device, two edge skins are formed by one-time pressing and cutting of the linear cutting device, two edge skin lifting mechanisms are arranged on the linear cutting support corresponding to the upper part of each silicon rod bearing structure so as to lift the edge skin formed in the cutting operation to protrude the cut silicon rods, and therefore timely discharging of the edge skin is achieved.

After the projecting portion of the flaw-piece relative to the cut silicon rod is formed by the flaw-piece lifting unit, the flaw-piece clamping unit continues to displace the flaw-piece based on the projecting portion so as to clamp the flaw-piece and transfer the flaw-piece to the unloading area.

Referring to fig. 30 and 31, as shown in fig. 30, the flaw-piece clamping unit 52 includes a supporting column 521 disposed on the silicon rod squaring apparatus base 10, and the supporting column 521 is, for example, at least one illustrated guide pillar disposed in a first direction. The supporting column 521 is provided with a first mounting portion 522 and a flaw-piece clamping mechanism 523 connected to the first mounting portion 522. In the illustrated example, the support column 521 is disposed in the middle of the first direction of the silicon rod squaring apparatus so as to reduce the distance from the edge skin clamping mechanism 523 to the edge skin, and of course, the position where the support column 521 is disposed is not limited thereto.

The first mounting portion 522 is disposed on the supporting column 521, and the first mounting portion 522 can serve as a switching portion between the bark clamping mechanism 523 and the supporting column 521, in some examples, the first mounting portion 522 is, for example, a bearing block movably disposed or fixedly disposed on the supporting column 521.

The at least one set of flaw-piece clamping mechanism 523 is connected to the first mounting portion 522 by a swing arm 524. In some examples, the first mounting portion 522 is fixed at a predetermined height of the support column 521, such as the top of the support column 521, to ensure that the flaw-piece clamping mechanism 523 coupled to the first mounting portion 522 can lift the flaw-piece off of the cut silicon rod after clamping the flaw-piece.

In other examples, the flaw-piece discharging device further includes a first lifting driving device (not shown) for driving the first mounting portion 522 to move up and down on the supporting column 521. Here, based on the first lifting drive device controls the first installation part 522 to move along the support column 521, the flaw-piece clamping mechanism 523 connected to the first installation part 522 can be driven to move up and down in space, the flaw-piece clamping mechanism 523 can clamp and lift the flaw-piece, for example, after the flaw-piece is formed by cutting, the first lifting drive device drives the first installation part 522 to descend so that the flaw-piece clamping mechanism 523 contacts and clamps the flaw-piece protruding out of the cut silicon rod, and the first lifting drive device can further drive the flaw-piece clamping mechanism 523 in a clamping state to ascend so that the flaw-piece is separated from the cut silicon rod.

The flaw-piece fixture 523 is a component for clamping and transferring the flaw-piece, the at least one group of flaw-piece fixture 523 is connected to the first installation part 522 through the swing arm 524, wherein the swing arm 524 has a near end and a far end, the swing arm 524 is arranged at the near end of the first installation part 522, and the flaw-piece fixture 523 is arranged at the far end of the swing arm 524 and is also an extension end.

The flaw-piece clamping mechanism 523 is controlled to rotate around the swing arm rotating shaft 525, in some examples, the group of flaw-piece clamping mechanisms 523 are the flaw-piece clamping mechanisms 523 which are respectively arranged at the extending ends of different swing arms 524 which are commonly used for the same swing arm rotating shaft 525, as shown in fig. 30, the group of flaw-piece clamping mechanisms 523 comprise two flaw-piece clamping mechanisms 523, each flaw-piece clamping mechanism 523 is arranged at the extending end of one swing arm 524, and the near ends of the different swing arms 524 in the group of flaw-piece clamping mechanisms 523 are connected to the same swing arm rotating shaft 525. Here, the different swing arms 524 connected to the swing arm rotating shafts 525 corresponding to the set of the flaw-piece clamping mechanisms 523 may have equal lengths (as shown in fig. 30), and of course, may have different lengths; in an actual scenario, the included angle between the different swing arms 524, the length of the swing arm 524, and the position of the swing arm rotating shaft 525 may be determined based on the position of the silicon rod carrying structure 11, where the position of the flaw-piece on the horizontal plane is determined by the positions of the silicon rod carrying structure 11 and the cutting wire saw, it should be understood that one flaw-piece clamping mechanism 523 may be used to clamp the flaw-piece formed after the silicon rod on one silicon rod carrying structure 11 is cut, when the set of flaw-piece clamping mechanisms 523 includes a plurality of flaw-piece clamping mechanisms 523, each flaw-piece clamping mechanism 523 corresponds to the silicon rod on one silicon rod carrying structure 11, that is, the position of the swing arm rotating shaft 525, the length of the swing arm 524, and the included angle between the swing arms 524 may be determined based on the position of the silicon rod carrying structure 11 (or the position of the silicon rod placed vertically), for example, the position of the swing arm rotating shaft 525 when the flaw-piece is preset based on the first installation part, and the angle between the length of each swing arm 524 and the swing arm 524 may be determined based on the connecting line between the swing arm rotating shaft 525 and the different silicon rod carrying structure 11 .

For example, as shown in fig. 30, each set of the flaw-piece clamping mechanisms 523 clamps and transfers the flaw-pieces formed by cut silicon rods on the two silicon rod carrying structures 11 based on the silicon rod carrying structures 11 on the silicon rod extracting apparatus being arranged at equal intervals, the swing arm rotating shafts 525 are located on the midperpendicular planes of the two silicon rod carrying structures 11 when the flaw-pieces are lifted from the silicon rod carrying structures 11, and the corresponding two swing arms 524 connected with the swing arm rotating shafts 525 are equal in length.

In some examples, each of the at least one set of the flaw-piece clamping mechanisms includes at least one flaw-piece clamping mechanism, i.e., the flaw-piece clamping mechanisms included in the silicon rod unloading device may be one set, two sets, three sets, four sets, etc.; wherein, the number of the flaw-piece clamping mechanisms in the group of flaw-piece clamping mechanisms can be one, two, three and the like.

In the example shown in fig. 30, four silicon rod carrying structures are provided in the cutting zone below the wire cutting device, each group of the flaw-piece clamping mechanisms includes two flaw-piece clamping mechanisms, and the groups of the flaw-piece clamping mechanisms respectively located at two sides of the first mounting portion respectively carry out flaw-piece removal on cut silicon rods on the two silicon rod carrying structures at the left side and the right side of the machine base in the drawing. In some examples, the support column may be disposed at a midpoint of the length direction of the base, that is, a projection of the first mounting portion on a horizontal plane is located in the middle of the base, and the set of the flaw-piece clamping mechanisms on two opposite sides may be symmetrically disposed.

In some examples, the swing arm rotating shaft 525 further includes a rotation driving device (not shown) for driving the flaw-piece clamping mechanism 523 connected to the swing arm extending end of the swing arm rotating shaft 525 to rotate a predetermined angle after clamping the flaw-piece and driving the flaw-piece to be separated from the cut silicon rod, so as to transfer the flaw-piece to a flaw-piece unloading area. In one implementation, the swing arm shaft 525 is connected to a power output shaft of a driving motor, and the driving motor controls the swing arm shaft 525 to rotate, so as to drive the swing arm connected to the swing arm shaft 525 to rotate by a certain angle, and the flaw-piece clamping mechanism 523 at the extending end of the swing arm transfers to the flaw-piece unloading area through an arc path formed by the forward rotation.

The flaw-piece clamping mechanism 523 can rotate around the swing arm rotating shaft 525, and through the space above the machine base 10, when flaw-piece transfer is not needed, for example, when silicon rod squaring equipment is in a stop state, the flaw-piece clamping mechanism 523 can be accommodated above the machine base 10 based on the rotation of the swing arm rotating shaft 525, so that the equipment space can be saved; furthermore, the flaw-piece clamping mechanism 523 has a rotational degree of freedom based on the rotation of the swing arm rotating shaft 525, and the flaw-piece transfer through the arc path can reduce the transfer distance compared with the linear path, thereby increasing the transfer efficiency of the flaw-piece.

In some examples, when the swing arm rotating shafts 525 are disposed on two opposite sides of the first mounting portion 522, the swing arm rotating shafts 525 on the two sides have opposite rotation directions in the state of the flaw-piece transportation, for example, in the state shown in fig. 30, the projections of the flaw-piece clamping mechanisms 523 on the two sides of the first mounting portion 522 on the horizontal plane are located on the silicon rod carrying structure 11, the direction of the group of flaw-piece clamping mechanisms 523 rotating around the swing arm rotating shafts 525 in the transportation is shown by the left arrow in fig. 30, the rotation direction is followed within a certain angle range, and the flaw-piece clamping mechanisms 523 are far away from the machine base; correspondingly, the direction of the group of the flaw-piece clamping mechanisms 523 on the right side in the drawing rotates around the swing arm rotating shaft 525 in the transfer process is shown by an arrow on the right side in fig. 30, the rotating direction is met within a certain angle range, and the flaw-piece clamping mechanisms 523 are far away from the machine base. Of course, the bark clamp 523 on both sides of the first mounting portion 522 may rotate relatively independently, for example, each group of bark clamp 523 is configured with a rotation driving device corresponding to the swing arm rotating shaft 525, and the direction in which the bark clamp 523 rotates around the corresponding swing arm rotating shaft 525 is not limited thereto, and the manner described herein includes: based on the position of the swing arm rotating shaft 525, the rotating direction of the flaw-piece clamping mechanism 523 corresponding to the swing arm rotating shaft 525 is a direction far away from the first mounting portion 522 (or the supporting column) when the flaw-piece is transferred.

In some embodiments, the first mount further comprises at least one movement mechanism providing movement in at least one direction for setting the swing arm pivot.

The flaw-piece clamping mechanism connected to the swing arm of the swing arm rotating shaft and the extending end of the swing arm can move along at least one direction provided by the at least one moving mechanism along the swing arm rotating shaft. Therefore, the moving freedom degree of the flaw-piece clamping mechanism can be increased to extend the moving range, so that the flaw-piece can be transferred to the unloading area within the moving range of the flaw-piece clamping mechanism; meanwhile, the first installation part and at least one moving mechanism included by the first installation part are positioned above the machine base, so that the space of the equipment can be saved.

In some examples, a set of the leather clamping mechanisms is arranged on two opposite sides of the first mounting part respectively through a swing arm rotating shaft. As shown in fig. 30 or 31, two sides of the first mounting portion 522 are respectively provided with a moving mechanism 5221, the illustrated embodiment is shown as a linear moving mechanism, the linear moving mechanism includes a linear guide rail 52211, the linear guide rail 52211 is arranged along the width direction of the silicon rod squaring apparatus, and the swing arm rotating shaft 525 can move along the linear guide rail 52211 to drive a corresponding group of bark clamping mechanisms to be far away from or close to the silicon rod carrying structure 11. In some examples, the moving mechanism 5221 further comprises a moving driving device, such as a traveling motor, disposed on the rotating shaft 525 of the swing arm, and the traveling motor may be connected to the linear guide 52211 through a traveling screw, for example, so as to drive the rotating shaft 525 of the swing arm to move along the linear guide 52211 by the traveling motor.

In one embodiment, as shown in fig. 31, the moving mechanism 5221 comprises a linear guide 52211 and a moving driving device, wherein the moving driving device comprises a telescopic rod 52212 and a driving source arranged along the direction of the linear guide 52211. In this example, the linear guide 52211 is provided to the first mounting portion 522 and arranged in the width direction of the housing; the extension rod 52212 is disposed in a collinear manner with the linear guide 52211, the extension rod 52212 has a distal end and a proximal end, wherein the proximal end of the extension rod 52212 is connected to the driving source, the distal end of the extension rod 52212 is connected to the swing arm rotating shaft 525, and the distal end of the extension rod 52212 is driven by the driving source to move axially along the extension rod 52212 so as to drive the swing arm rotating shaft 525 to move along the linear guide 52211.

In other implementation manners, the telescopic rod can be replaced by a screw rod in threaded connection with the swing arm rotating shaft, and the screw rod rotates along the screw rod shaft under the action of a driving source to be converted into linear motion along the axial direction of the screw rod at the swing arm rotating shaft; and the swing arm rotating shaft is driven by a servo motor to move along a linear guide rail, and the application is not limited.

In certain examples, each of the at least one set of flaw-piece clamping mechanisms comprises: the clamping assembly is used for clamping or releasing the top end of the side skin; and the second lifting driving structure is used for driving the clamping assembly to move up and down.

With continued reference to fig. 31, as shown, the bark clamp 523 includes a second elevating driving structure 5232 and a clamp assembly 5231 disposed at the bottom of the second elevating driving structure 5232. In an embodiment, the second lifting driving structure 5232 is used to drive the clamping assembly 5231 to move up and down, and the second lifting driving structure 5232 can be, for example, a lifting cylinder with a lifting rod, the lifting rod is connected to the clamping assembly 5231, and the lifting cylinder can be used to control the lifting rod to extend and retract to drive the clamping assembly 5231 to move up and down, but not limited thereto. For example, the second lifting driving structure 5232 can also be a screw assembly driven by a motor, the screw assembly is connected to the clamping assembly 5231, and the motor drives the screw assembly to lift to drive the clamping assembly 5231 to move up and down.

The clamping assembly is the location for clamping the hem, and in some examples, the clamping assembly includes a cover and a retractable clamp. The cover body is used for covering and locates the boundary leather, the telescopic holder is located cover internal, the holder with form between the cover body main part and supply the centre gripping space of boundary leather.

Referring to fig. 34 and 35 in combination, fig. 34 is a schematic structural view of a clamping assembly of the present invention in one embodiment of a flaw-piece discharging apparatus, and fig. 35 is a schematic sectional view of the clamping assembly of the present invention in one embodiment of the apparatus. As shown, the holding assembly 5231 comprises a cover 52311 and a retractable holding member 52312, the retractable holding member 52312 is disposed inside the cover 52311, and a holding space for holding the edging is formed between the holding member 52312 and the cover 52311. In an embodiment, the cover body 52311 is used for covering the edge leather, the size of the cover body 52311 which can be covered is slightly larger than the cross-sectional circle of the silicon rod to be cut, and the cover body 52311 is configured as a closed or non-closed circular cover, but not limited thereto.

In some examples, the top of the body of the cover 52311 has an opening for the flaw-piece to be lifted to protrude out of the cover 52311, it is understood that when the flaw-piece protrudes out of the cover 52311, the contact area between the retaining member 52312 and the flaw-piece, which is engaged with the cover 52311 for retaining, is maximized, which can be used to ensure the stability of the retaining member 5231 for retaining the flaw-piece.

In some examples, the inner wall of the housing 52311 is provided with a nylon castellated strip 523111 for contacting the clamped flaw-piece, so that the friction between the outer side of the flaw-piece and the housing 52311 is increased to facilitate lifting of the flaw-piece.

The structure of the clamping assembly is not limited to this, and in other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the flaw-piece is formed between the clamping member and the arc-shaped plate.

In some examples, the clamping member is a movable press block controlled by a cylinder, and the movable press block is connected with the cylinder through a rotating arm.

In some examples, the rotating arm has a first rotating shaft, a first cantilever and a first connecting portion located in the middle of the first cantilever, wherein the proximal end of the first cantilever is connected to the first rotating shaft, the distal end of the first cantilever is connected to the movable pressing block, and the first connecting portion is connected to the piston rod of the cylinder.

In one embodiment, as shown in fig. 35, a base 523112 for carrying the clamping member is disposed inside the housing 52311, the base 523112 carries the clamping member extending into the recessed area between the cut silicon rod and the flaw piece, the cylinder 52324 is fixed on the side wall of the base 523112 and has a piston rod, the first rotating shaft 52322 of the rotating arm is hinged to a supporting base fixed on the bottom of the base 523112 so that the second cantilever can rotate around the first rotating shaft 52322, the first rotating shaft 52322 is disposed at the proximal end of the first cantilever 52321, the movable pressing block 523121 is fixedly connected to the distal end of the first cantilever 52321, the first connecting portion 52323 located between the proximal end and the distal end of the first cantilever 52321 is hinged to the piston rod of the cylinder 52324, the cylinder 52324 pushes the piston rod to move telescopically to drive the first cantilever 52321 to rotate around the first rotating shaft 52322, that is, the first rotating shaft 52322 is used as a fulcrum, the piston rod of the cylinder 52324 is the point of action of force, and the first cantilever 52321 is stressed by the lever, so that the movable pressing block 523121 at the far end of the first cantilever 52321 can be driven to move, and the movable pressing block 523121 at the far end of the first cantilever 52321 is close to or far away from the cover 52311 in the process that the first cantilever 52321 rotates around the first rotating shaft 52322, so that the clamping space between the movable pressing block 523121 and the cover 52311 can be adjusted.

It should be understood that the first suspension arm 52321 is only required to form a lever with a fulcrum, the movable pressing piece 523121 connected to the distal end of the first suspension arm 52321 can be far away from or close to the housing 52311 by the rotation of the first suspension arm 52321, in the example shown in fig. 35, the first rotation shaft 52322 as the force application point of the first suspension arm 52321 is located at the proximal end of the suspension arm, the first connecting part 52323 as the force application point of the transmission cylinder piston rod is located in the middle of the first suspension arm 52321, and in the example shown in fig. 35, when the cylinder piston rod is contracted, the proximal end of the first suspension arm 52321 is applied with an upward lifting force, the distal end of the first suspension arm 52321 moves upward and makes the movable pressing piece 523121 far away from the housing 52311 to increase the clamping space, and in this state, the clamped hem can be released. When the flaw-piece needs to be clamped, the cylinder 52324 drives the piston rod to extend, so as to drive the proximal end of the first cantilever 52321 to move downwards around the first rotating shaft 52322, the proximal end of the first cantilever 52321 descends around the first rotating shaft 52322 to drive the movable pressing block 523121 to be close to the cover 52311 and abut against the flaw-piece, and the piston rod of the cylinder keeps extending, so that the flaw-piece can be maintained in a clamped state.

In some examples, the first connecting portion may also be connected to a screw assembly or a telescopic rod driven by a motor, so as to drive the first cantilever to rotate around the first rotating shaft, thereby realizing the compression or release of the movable pressing block on the flaw-piece.

In some embodiments, the rotating arm has a second cantilever, a second connecting portion, and a second rotating shaft located in the middle of the second cantilever, wherein the second connecting portion is disposed at the proximal end of the second cantilever and connected to the piston rod of the cylinder, and the distal end of the second cantilever is connected to the movable pressing block.

Referring to fig. 36, a cross-sectional view of another embodiment of the clamping assembly is shown. As shown in the figure, a base 523112 for carrying the clamping member 52312 is disposed inside the cover 52311, the base 523112 carries the clamping member 52312 to protrude into the recessed area between the cut silicon rod and the bark, the cylinder 52334 is fixed on the side wall of the base 523112 and has a piston rod, the second rotating shaft 52332 of the rotating arm is hinged to a support base fixed at the bottom of the base 523112 so that the second suspension arm 52331 can rotate around the second rotating shaft 52332, the movable pressing block 523121 is fixedly connected to the distal end of the second suspension arm 52331, the proximal end of the second suspension arm 52331 of the rotating arm is hinged to the piston rod of the cylinder 52334, the cylinder 52334 pushes the piston rod to extend and retract to drive the second suspension arm 52331 to rotate around the second rotating shaft 52332, that is, the piston rod of the cylinder 52334 is a force application point, that is the movable pressing block 523121 at the distal end of the second suspension arm 52331 can be driven to move, when the second arm 52331 rotates around the second rotation shaft 52332, the movable pressing block 523121 at the distal end of the second arm 52331 approaches or leaves the cover 52311, so that the clamping space between the movable pressing block 523121 and the cover 52311 can be adjusted.

It should be understood that the second suspension arm 52331 only needs to form a lever with a fulcrum, the movable pressing piece 523121 connected to the distal end of the second suspension arm 52331 can be far away from or close to the cover 52311 by the rotation of the second suspension arm 52331, in the example shown in fig. 36, the second connecting portion 52333 connected to the piston rod of the cylinder, which is set as the force-applying point of the second suspension arm 52331, is located at the proximal end of the suspension arm, and the second rotating shaft 52332 serving as the fulcrum is arranged in the middle of the suspension arm, and when the piston rod of the cylinder is contracted, the proximal end of the second suspension arm 52331 is subjected to an upward lifting force, the distal end of the second suspension arm 52331 moves downward and makes the movable pressing piece 523121 close to the cover 52311 so as to press the edge leather against the cover 52311 (in the direction of the arrow in fig. 36). When the release of the flaw-piece is needed, the cylinder 52334 drives the piston rod to extend, so as to drive the proximal end of the second cantilever 52331 to move downwards around the second rotating shaft 52332, the proximal end of the second cantilever 52331 rises around the second rotating shaft 52332 to drive the movable pressing block 523121 to be away from the cover body 52311, namely, the movable pressing block returns to the initial state, and the clamping space between the movable pressing block 523121 and the cover body 52311 is increased, so that the flaw-piece is released conveniently.

Here, it should be understood that the contraction and extension movements of the cylinder piston rod are different corresponding to the state where the movable pressing piece 523121 releases or presses the flaw-piece, based on the direction in which the cylinder piston rod is connected to the second connection part 52333, for example, in the embodiment shown in fig. 36, the cylinder piston rod is connected above the proximal end of the second cantilever 52331, and the movable pressing piece 523121 is driven to press the flaw-piece by the contraction of the piston rod; in other examples, when the cylinder rod is attached to the second boom 52331 below the proximal end thereof, the cylinder rod extends to lift the proximal end of the second boom 52331 upward and rotate upward, thereby causing movable mass 523121 to approach and compress the flaw-piece during the downward movement.

In some examples, the second connecting portion may also be connected to a screw assembly or a telescopic rod driven by a motor, so as to drive the second cantilever to rotate around the second rotating shaft, thereby compressing or releasing the movable pressing block on the flaw-piece.

It should be noted that the number of the clamping members in the flaw-piece clamping mechanism can be changed correspondingly based on the form of the wire cutting device in the silicon rod extracting device, for example, when the wire cutting device of the silicon rod extracting device is provided with a single-wire cutting unit, the cutting operation of the silicon rod to be cut based on the cutting wire saw formed in the single-wire cutting unit needs to be performed four times of single-axial-surface cutting steps, and in this embodiment, the number of the clamping members is set to be one. The first uniaxial face cutting is executed to form a flaw-piece, the flaw-piece is clamped by a clamping piece and then is transferred away by one or more of the first lifting driving structure, the second lifting driving structure, the shifting mechanism and the swing arm rotating shaft, the cutting surface of the silicon rod to be cut is adjusted again (for example, the silicon rod bearing structure rotates for 90 degrees around the axis of the silicon rod), the second uniaxial face cutting is executed, the flaw-piece is formed again, the clamping and the transferring are repeatedly carried out, and the description is omitted. In other embodiments, each wire cutting device comprises two wire cutting units, wherein two wire cutting units form two relatively parallel cutting wires, and wherein two parallel axial surfaces are cut in one cutting operation, in which embodiment the clamping members are arranged in two opposite positions. The cutting of two parallel axial planes is carried out for the first time to form two edges, the two edges formed on the corresponding positions are clamped and conveyed to an unloading area by utilizing two clamping pieces, the cutting surface of the silicon rod to be cut is adjusted again (for example, the silicon rod bearing structure rotates for 90 degrees around the axis of the silicon rod), the cutting is carried out for the second time to form two parallel axial planes and form two edges, and the two edges formed on the corresponding positions are clamped, clamped and conveyed out by utilizing the two clamping pieces again.

In some examples, to avoid the movable pressure pieces from contacting the edging, wearing and damaging each other during long-term clamping, in some embodiments, the movable pressure pieces are provided with a cushion for contacting the edging. The buffer pad is made of elastic rubber material, or silica gel or other materials with elastic deformation, damping property or buffering property, so as to prevent the surface of the edge skin from being scratched or cracked during clamping and transportation.

In some examples, the flaw-piece discharging device further comprises a flaw-piece barrel arranged in the flaw-piece discharging area. In some implementations, the opening of the side leather tube can be designed to be large or to be a horn opening, so that the side leather can be conveniently placed in an unobstructed manner, and the height of the arm of the side leather tube is also high, so that the placed side leather can be ensured not to overturn and the like. So, by the centre gripping transfer unit moves the flaw-piece by the cutting district to a flaw-piece section of thick bamboo, then can be followed the flaw-piece by operating personnel take out in the flaw-piece section of thick bamboo.

To facilitate understanding of the edge strip clamping and transferring process performed by the edge strip discharging device of the present application, please refer to fig. 37a to 37e, which are schematic diagrams illustrating different states of the edge strip transferring performed by the edge strip discharging device of the present application in an embodiment of a silicon rod squaring apparatus.

Here, the flaw-piece clamping mechanism rotates around the swing arm rotating shaft through the swing arm by a preset angle and then transfers the flaw-piece to the flaw-piece unloading area, the preset angle can be determined based on the position of the flaw-piece unloading area, as shown in fig. 37a to 37e, in an actual scene of performing flaw-piece clamping and transferring, when the flaw-piece is formed by cutting, the flaw-piece clamping mechanism 523 is driven by the first driving device to descend to the end surface of the silicon rod (in the state shown in fig. 37 a) in compliance with the first mounting part 522 by the first driving device, the flaw-piece is protruded out of the silicon rod end surface by the flaw-piece lifting unit, the flaw-piece clamping mechanism 523 can clamp the flaw-piece, the movable pressing block in the clamping assembly abuts against the flaw-piece to the cover body or the arc-shaped plate, and then the first driving device drives each flaw-piece clamping mechanism 523 connected to the mounting part to ascend (in the state shown in fig. 37 b) to lift and separate the flaw-piece from the cut silicon rod; the rotation driving device drives the flaw-piece clamping mechanism 523 to rotate by a preset angle, here, as shown in fig. 37c, a group of flaw-piece clamping mechanisms 523 is respectively arranged at two sides of the first installation part 522, wherein each group of the flaw-piece clamping mechanisms 523 is driven by the corresponding rotary driving device to rotate 120 degrees in the direction away from the first mounting part 522 so as to reach the position above the flaw-piece unloading area, then the flaw-piece clamping mechanism 523 is driven to descend by the first lifting driving device along with the first installation part 522, the movable pressing block in the clamping component is far away from the flaw-piece to increase the clamping space, the clamped flaw-piece is placed in a flaw-piece collecting device of a flaw-piece unloading area, such as the flaw-piece barrel (in a state shown in figure 37 d), after the discharging of the flaw-piece is completed, the flaw-piece clamping mechanism 523 is driven to ascend along with the first mounting part 522 and rotates a certain angle to return to the waiting position (in a state shown in fig. 37 e); after a new flaw-piece is formed by cutting, the transportation process is repeated, and the flaw-piece can be unloaded again. Of course, it should be understood that the above-mentioned processes can also be performed by the second lifting/lowering driving mechanism 523, or by both the first lifting/lowering driving mechanism and the second lifting/lowering driving mechanism.

In one embodiment, the flaw-piece discharging device comprises a flaw-piece conveying structure, the flaw-piece conveying structure is arranged in the flaw-piece discharging area and is used for conveying the flaw-pieces operated by the flaw-piece clamping mechanism, and in one implementation mode, the flaw-piece conveying structure can be a conveying belt. It should be understood that the flaw-piece unloading area is an area where the flaw-pieces are unloaded in the silicon rod squaring device, and specifically, the flaw-piece unloading area is an area corresponding to the lower side of the silicon rod squaring device after the flaw-pieces are conveyed away from the cutting area by the flaw-piece clamping mechanism. In actual operation, the flaw-piece is transferred from the cutting area to the flaw-piece unloading area by the flaw-piece clamping mechanism, and a clamping assembly in the flaw-piece clamping mechanism is loosened to release the flaw-piece to a conveying belt serving as a flaw-piece conveying structure, so that the flaw-piece is conveyed out by the conveying belt.

Of course, the discharging of the flaw-piece formed after the cutting of the silicon rod to be cut is not limited thereto. For example, in other embodiments, the flaw-piece discharge device may include both a flaw-piece drum and a flaw-piece conveying structure, wherein the flaw-piece conveying structure may be, for example, a conveyor belt, and the flaw-piece drum is disposed adjacent to the starting end of the conveyor belt (e.g., the flaw-piece drum is located beside or directly above the starting end of the conveyor belt, etc.). The barrel opening of the side leather barrel can be designed to be large or be a horn opening, so that the side leather can be conveniently placed in the barrel without obstacles, and the height of the barrel arm of the side leather barrel is also high, so that the placed side leather cannot overturn and the like. In practical application, the edge leather tube can be in a turnover design, and each edge leather in the edge leather tube can be smoothly transferred to the conveying belt by turning over the edge leather tube. For example, the bottom of the edge leather tube is provided with a turnover driving mechanism, and the turnover driving mechanism may include a turnover plate, a rotating shaft, and a turnover driving source (e.g., a turnover motor or a turnover cylinder). Therefore, after the flaw-piece is transferred into the flaw-piece cylinder from the cutting area by the flaw-piece clamping mechanism, the flaw-piece in the flaw-piece cylinder is driven to be transferred onto the conveying belt by the turnover of the flaw-piece cylinder, and the flaw-piece is conveyed out by the conveying belt.

Here, the application provides a flaw-piece discharge apparatus for silicon rod evolution equipment, flaw-piece discharge apparatus can accomodate in the space of silicon rod evolution equipment frame top in order to save the whole equipment space that occupies of silicon rod evolution equipment at idle state, and below the flaw-piece centre gripping transport state leather clamping mechanism accessible swing arm is rotatory in order to transport the flaw-piece of centre gripping to the flaw-piece uninstallation district around the swing arm pivot, shortens the transfer route from this, simultaneously, can set up the silicon rod bearing structure one-to-one of multiunit flaw-piece fixture and silicon rod evolution equipment in the flaw-piece uninstallation apparatus to improve the efficiency of flaw-piece centre gripping transportation, reduce the time cost.

The application also provides silicon rod squaring equipment which comprises a base; the silicon rod bearing structure is used for bearing a vertically placed silicon rod; the wire cutting device is arranged above the at least two silicon rod bearing structures and comprises a plurality of cutting wheels and a cutting wire wound on the plurality of cutting wheels to form at least one cutting wire saw; a flaw-piece discharge apparatus as described in any one of the embodiments shown in figures 30 to 37 e.

The base is arranged as a main body part of the silicon rod squaring device and used for providing a squaring operation platform, and preferably, the size and the weight of the base are both large so as to provide a larger mounting surface and firmer overall stability.

The silicon rod bearing structures are used for bearing vertically placed silicon rods, each silicon rod bearing structure is provided with a rotating mechanism, and the rotating mechanisms are used for driving the silicon rods placed on the silicon rod bearing structures to rotate so as to adjust a surface to be cut. In an exemplary embodiment, the rotating mechanism is configured as a rotating turntable located at the bottom of the silicon rod carrying structure, and the rotating turntable is controlled by a driving device (not shown), which may be, for example, a servo motor for driving the rotating turntable to rotate, but is not limited thereto. In an alternative embodiment, the rotating mechanism may be of a lifting type, that is, the rotating turntable at the bottom of the silicon rod bearing structure is controlled to perform a telescopic action to drive the silicon rod bearing structure to perform a lifting motion, so as to adjust the height of the silicon rod to be cut on the silicon rod bearing structure.

The wire cutting device comprises a cutting frame and a liftable wire cutting support erected on the cutting frame, a plurality of cutting wheels are arranged on the wire cutting support, and the cutting wheels are wound on the cutting lines of at least one cutting wire saw, so that the cutting wire saw is driven to lift and feed a silicon rod arranged on a silicon rod bearing structure to cut the silicon rod during lifting motion of the wire cutting support.

The flaw-piece discharging device and the linear cutting device in the silicon rod squaring equipment can be operated in a matched mode, the flaw-piece discharging device lifts and protrudes out of the cut silicon rod and clamps and transports the cut silicon rod after the linear cutting device cuts the silicon rod to form a flaw-piece, wherein a flaw-piece clamping mechanism in the flaw-piece discharging device can rotate around a rotating shaft of a swing arm through the swing arm to transport the clamped flaw-piece to a flaw-piece unloading area, so that the transportation path is shortened, meanwhile, a plurality of groups of flaw-piece clamping mechanisms can be arranged in the flaw-piece unloading device and correspond to silicon rod bearing structures of the silicon rod squaring equipment one by one, the efficiency of flaw-piece clamping and transporting is improved, the time cost is reduced, the cut silicon rod is unloaded after the flaw-piece is transported and placed, the silicon rod squaring equipment can continue to perform squaring operation on the silicon rod to be cut, and the flaw-piece transporting in the squaring process is completed by the flaw-piece discharging device so that the degree of automation is improved, the labor cost is reduced and the processing efficiency is improved.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. A wire cutting device of a silicon rod processing apparatus, characterized by comprising: the base is provided with a silicon rod processing platform; the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut; the wire cutting device includes:

the cutting frame is arranged on the base;

at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes:

the cutting device comprises a plurality of cutting wheels, a cutting device and a control device, wherein the cutting wheels are sequentially arranged along a first direction, and each cutting wheel is provided with at least two cutting wire grooves;

the cutting wire is wound on the plurality of cutting wheels in sequence to form at least one cutting wire saw; the distance adjusting mechanism is arranged on the at least one wire cutting unit and used for driving the plurality of cutting wheels in the at least one wire cutting unit to move along the second direction so as to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit or change the cutting line to wind the cutting line grooves of the plurality of cutting wheels in the at least one wire cutting unit.

2. The wire cutting device of a silicon rod processing apparatus as set forth in claim 1, wherein the at least one wire cutting unit further comprises at least one transition wheel, each transition wheel having at least two wire grooves; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

3. The wire cutting device of the silicon rod processing apparatus as set forth in claim 1, wherein the plurality of cutting wheels belonging to the same wire cutting unit form at least two cutting wheel groups in pairwise fashion, and a transition wheel is further provided between two adjacent cutting wheels of the two adjacent cutting wheel groups, the transition wheel having at least two wire grooves, the cuts being sequentially wound around the cutting wheels and the transition wheel to form a cutting wire saw between the two cutting wheels of each cutting wheel group, wherein the cutting wire, when wound around two adjacent cutting wheels of the two adjacent cutting wheel groups, is passed out from the cutting wire groove of a succeeding cutting wheel of a preceding cutting wheel group and is passed through the wire groove of the transition wheel and then into the cutting wire groove of a preceding cutting wheel of a succeeding cutting wheel group; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

4. The wire cutting device of silicon rod processing apparatus as set forth in claim 1, wherein the plurality of cutting wheels belonging to the same wire cutting unit includes a leading cutting wheel, a trailing cutting wheel, and at least one intermediate cutting wheel located therebetween, a transition wheel is further provided beside the at least one intermediate cutting wheel, the transition wheel having at least two wire grooves, the cutting wire being sequentially wound around the cutting wheel and the transition wheel to form one cutting wire saw on any adjacent two cutting wheels, wherein the cutting wire, when wound around the intermediate cutting wheel, is passed out from one of the at least two cutting wire grooves on the intermediate cutting wheel and is passed through by another one of the at least two cutting wire grooves on the intermediate cutting wheel after passing through the lateral transition wheel, such that there is a cutting offset between any adjacent two cutting wire saws in the second direction, the cutting offset corresponds to the spacing between two associated cutting wire slots; when the plurality of cutting wheels in the at least one wire cutting unit are driven by the at least one distance adjusting mechanism to move along the second direction, at least one transition wheel in the at least one wire cutting unit and the plurality of cutting wheels are kept relatively static.

5. The wire cutting device of a silicon rod processing apparatus as set forth in any one of claims 2 to 4, wherein a plurality of cutting wheels belonging to the same wire cutting unit are provided on a mounting beam disposed in the first direction, and the at least one transition wheel is provided on the cutting wheel carrier via a bracket.

6. The wire cutting device of the silicon rod processing apparatus as set forth in claim 1, comprising a single wire cutting unit; the roll adjustment mechanism includes: the screw rod is arranged along the second direction and is in threaded connection with the single-wire cutting unit; and the driving source is used for driving the screw rod to rotate.

7. The wire cutting device of the silicon rod processing apparatus as set forth in claim 1, comprising a single wire cutting unit; the roll adjustment mechanism includes: a telescopic member arranged along a second direction and associated with the single wire cutting unit; and the driving source is used for driving the telescopic piece to do telescopic motion along the second direction.

8. The wire cutting device of the silicon rod processing apparatus as set forth in claim 1, comprising a single wire cutting unit; the roll adjustment mechanism includes: the rack is arranged on the single-wire cutting unit along a second direction; the transmission gear is meshed with the rack; and the driving source is used for driving the transmission gear to rotate.

9. The wire cutting device of a silicon rod processing apparatus as set forth in claim 1, comprising a first wire cutting unit and a second wire cutting unit disposed opposite to each other in a second direction, wherein at least one of the first wire cutting unit and the second wire cutting unit is moved in the second direction by the at least one distance adjusting mechanism for adjusting a wire saw pitch between at least one cutting wire saw of the first wire cutting unit and at least one cutting wire saw of the second wire cutting unit, or changing a cutting wire around a cutting wire groove of the plurality of cutting wheels of the first wire cutting unit and/or a cutting wire groove of the plurality of cutting wheels of the second wire cutting unit.

10. The wire cutting device of a silicon rod processing apparatus as set forth in claim 9, wherein the pitch adjustment mechanism comprises:

the screw rod is arranged along a second direction and is in threaded connection with the first wire cutting unit or the second wire cutting unit; and the driving source is used for driving the screw rod to rotate.

11. The wire cutting device of a silicon rod processing apparatus as set forth in claim 9, wherein the pitch adjustment mechanism comprises:

a telescoping member disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit;

And the driving source is used for driving the telescopic piece to do telescopic motion along the second direction.

12. The wire cutting device of a silicon rod processing apparatus as set forth in claim 9, wherein the pitch adjustment mechanism comprises:

a rack in a second direction and associated with the first wire cutting unit or the second wire cutting unit;

the transmission gear is meshed with the rack;

and the driving source is used for driving the transmission gear to rotate.

13. The wire cutting device of a silicon rod processing apparatus as set forth in claim 9, wherein the pitch adjustment mechanism comprises:

the bidirectional screw rod is arranged along a second direction and is in threaded connection with the first wire cutting unit and the second wire cutting unit;

and the driving source is used for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move in the second direction in a facing way or in a back-to-back way.

14. The wire cutting device of a silicon rod processing apparatus as set forth in claim 9, wherein the pitch adjustment mechanism comprises:

a first rack in a second direction and associated with the first wire cutting unit;

a second rack in a second direction and associated with the second wire cutting unit;

The transmission gear is meshed with the first rack and the second rack;

and the driving source is used for driving the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move in opposite directions or move in opposite directions along a second direction.

15. A silicon rod processing apparatus, comprising:

the base is provided with a silicon rod processing platform;

the silicon rod bearing device is arranged on the silicon rod processing platform and used for bearing a silicon rod to be cut;

a wire cutting apparatus as claimed in any one of claims 1 to 14.

16. The silicon rod processing apparatus as recited in claim 15, wherein the silicon rod processing apparatus is a silicon rod squarer, a silicon rod clipper, or a silicon rod slicing and grinding all-in-one machine.