CN205915542U - Silicon bulk cutting machine and workstation thereof - Google Patents
Silicon bulk cutting machine and workstation thereof Download PDFInfo
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- CN205915542U CN205915542U CN201620945268.7U CN201620945268U CN205915542U CN 205915542 U CN205915542 U CN 205915542U CN 201620945268 U CN201620945268 U CN 201620945268U CN 205915542 U CN205915542 U CN 205915542U
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Abstract
The utility model discloses a silicon bulk cutting machine and workstation thereof, this workstation includes: two at least station platforms that set up side by side for the bearing silicon bulk, the station platform includes the platform base and locates the silicon bulk bearing platform on the platform base, station transformation device connects in at least two station platforms for drive two at least station platform movement so that two at least station platform transfer station position. The utility model discloses two at least station platforms in the workstation of silicon bulk cutting machine pass through station transformation device and change station position, can realize the automation and the accurate conversion of station platform for line cutting device can realize cutting in turn to the silicon bulk of cutting treated that loads on at least two station platforms, guarantee that many batches of silicon bulks can cut the operation in order, has solved and has cut the inefficiency among the prior art, inconvenient scheduling problem is changed to the workstation.
Description
Technical field
This utility model is related to a kind of multi-wire cutting technology, more particularly to a kind of silicon ingot cutting machine and its workbench.
Background technology
Line cutting technology is evolution process technology more advanced in the world at present, and its principle is by high-speed motion
Diamond wire rubs to workpiece to be processed (for example: silicon ingot, sapphire or other quasiconductor hard brittle materials), the side's of cutting out ingot, from
And reach cutting purpose.In the cutting process to workpiece, the guiding by guide roller for the diamond wire, main line roller forms one
Gauze, and workpiece to be processed realizes the feeding of workpiece by the rise and fall of workbench or the rise and fall of diamond wire, in pressure
In the presence of power pump, cooling water is sprayed to the cutting of diamond wire and workpiece by the cooling water automatic spraying device being assemblied on equipment
Position, is moved back and forth by diamond wire and produces cutting, the hard brittle materials such as quasiconductor are once cut into polylith simultaneously.Wire cutting skill
Art has the advantages that efficiency high, production capacity height, high precision compared with cutting with traditional knife saw piece, grinding wheel and inner circle.
But, current silicon ingot intercept unit yet suffers from deficiency, and for example current linear cutting equipment once can only be to one
Individual thing to be cut is cut, and can only repeatedly execute repeatedly to process multiple workpiece, efficiency is very low.In addition, required section
The quantity of disconnected workpiece to be processed is many, and conversion of the storage of workpiece to be processed and carrying and workbench etc. is a great problem, exists
The problems such as efficiency is low, potential safety hazard is big.
Utility model content
In view of the shortcoming of prior art described above, the purpose of this utility model be to provide a kind of silicon ingot cutting machine and
Its workbench, for solving the problems such as cutting efficiency in prior art is low, workbench conversion is inconvenient.
For achieving the above object and other purposes, this utility model provides a kind of work of silicon ingot cutting machine on the one hand
Platform, comprising:
At least two station platforms being set up in parallel, for support silicon ingot;Described station platform includes: platform base, if
On described platform base, for support silicon ingot silicon ingot supporting table;
Station conversion device, is connected to station platform described at least two, for driving station platform described at least two
Motion is so that station platform conversion station position described at least two.
Alternatively, described silicon ingot supporting table is provided with the detent mechanism for positioning silicon ingot, and described detent mechanism includes fixed
Support bar on described silicon ingot supporting table, level connection joint in the fix bar of described support bar and are fixed in described fix bar
And for pressing on the press part at silicon ingot top.
Alternatively, described station conversion device includes being respectively arranged at the opposite end of station platform described at least two
Two rotating mechanisms, described rotating mechanism includes: pedestal, positioned at one end of described station platform;Described pedestal is provided with driving
Gear and the driving power source for driving described driving gear;Be in transmission connection plate, is provided with power transmission shaft;Described power transmission shaft relative
It is respectively arranged at two ends with the first travelling gear and the second travelling gear, described first travelling gear is engaged with described driving gear;Extremely
Few two rotary shafts, are connect with the described platform base axle in station platform described at least two respectively;Described rotary shaft is provided with
The rotate gear engaging with described second travelling gear.
Alternatively, described rotating mechanism also includes: at least two accessory drive wheels, rotates corresponding to described at least two
Axle;Described accessory drive wheel be located between described rotary shaft and described second travelling gear and with described rotary shaft and described second
Travelling gear is meshed.
Alternatively, described rotating mechanism also includes: angular transducer or position sensor, for described in detection at least two
The rotational angle of station platform or location variation.
The workbench of this utility model silicon ingot cutting machine has at least two station platforms, and at least two station platforms can lead to
Cross station conversion device and conversion station position, enable station platform automatically and accurate conversion is so that wire-electrode cutting device
Can the silicon ingot to be cut being loaded at least two station platforms be realized replacing cutting it is ensured that many batches of silicon ingots can enter in order
Row cutting operation, solves the problems such as cutting efficiency in prior art is low, workbench conversion is inconvenient.
This utility model provides a kind of silicon ingot cutting machine on the other hand, comprising:
Support;
Workbench on described support;And
On described support and liftably located at the wire-electrode cutting device of the top of described workbench, described wire cutting dress
Put including with the silicon ingot supporting table corresponding wire cutting unit in described station platform, for cutting institute on described silicon ingot supporting table
The silicon ingot of support.
Alternatively, described in above described silicon ingot supporting table, the position of corresponding described silicon ingot head or afterbody arranges one
Wire cutting unit;Described silicon ingot supporting table is additionally provided with rotating mechanism, and described silicon ingot supporting table is under the driving of described rotating mechanism
Rotate in the horizontal plane so that the position end to end of described silicon ingot supporting table institute support silicon ingot is exchanged.
Alternatively, above described silicon ingot supporting table, corresponding described silicon ingot position end to end is respectively provided with a described line
Cutter unit.
Alternatively, described wire cutting unit includes cutting roll stand and is symmetricly set in described cutting roll stand bottom at least
Two cutting rollers, are provided with line of cut between cutting roller described at least two;Described silicon ingot is corresponded to end to end on described silicon ingot supporting table
Both sides offer the cutting wire casing corresponding with described line of cut respectively.
Alternatively, described silicon ingot supporting table is provided with the detent mechanism for fixing silicon ingot to be cut.
Silicon ingot cutting machine of the present utility model, on the one hand, this workbench includes at least two station platforms being set up in parallel,
Multiplexing's bit platform can support silicon ingot more to be cut, can be simultaneously by multiple silicon ingots to be cut by wire-electrode cutting device
Head and/or afterbody are excised, and cutting speed, soon it can also be ensured that the cut quality of facet, has been cut without trimming, separately
On the one hand, the station platform described at least two in this workbench by station conversion device conversion station position, enable
The automatic and accurate conversion of station platform is so that wire-electrode cutting device can be to be cut at least two station platforms to being loaded into
Silicon ingot realize replace cutting it is ensured that many batches of silicon ingots can carry out cutting operation in order, solve cutting efficiency in prior art
Lowly, the problems such as workbench conversion inconvenience.
Brief description
Fig. 1 is this utility model silicon ingot cutting machine axonometric chart in one embodiment.
Fig. 2 is this utility model silicon ingot cutting machine leftschematic diagram in one embodiment.
Fig. 3 is the enlarged diagram of workbench in Fig. 2.
Fig. 4 is the enlarged diagram of the first station platform in Fig. 2.
Fig. 5 is flow chart in silicon ingot cutting application for this utility model silicon ingot cutting machine.
Fig. 6 is flow chart in first embodiment for the Fig. 5.
Fig. 7 is Fig. 5 flow chart in the second embodiment.
Specific embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.This utility model can also be by addition
Different specific embodiments is carried out or applies, and the every details in this specification based on different viewpoints and can also be answered
With carrying out various modifications and changes under without departing from spirit of the present utility model.
It should be noted that structure depicted in this specification institute accompanying drawings, ratio, size etc., all only in order to coordinate
Content disclosed in bright book, so that those skilled in the art understands and reads, being not limited to this utility model can implement
Qualificationss, therefore do not have technical essential meaning, the adjustment of the modification of any structure, the change of proportionate relationship or size,
Under not affecting this utility model effect that can be generated by and the purpose that can reach, all should still fall to disclosed in this utility model
Technology contents obtain and can cover in the range of.Meanwhile, in this specification cited as " on ", D score, "left", "right", " in
Between " and " one " etc. term, be merely convenient to describe understands, and is not used to limit the enforceable scope of this utility model, its
Being altered or modified of relativeness, under no essence change technology contents, when being also considered as the enforceable category of this utility model.
This utility model provides a kind of silicon ingot cutting machine, comprising: support;Workbench on described support, described work
Station is rotated by station conversion device and is provided with least two station platforms, and each described station platform is provided with for holding
The silicon ingot supporting table of support silicon ingot;On described support and liftably located at the wire-electrode cutting device of the top of described workbench,
Described wire-electrode cutting device includes and the silicon ingot supporting table corresponding wire cutting unit in described station platform, for cutting described silicon
The silicon ingot of institute's support on ingot supporting table.
Refer to Fig. 1 and Fig. 2, wherein, Fig. 1 is that this utility model silicon ingot cutting machine oblique side in one embodiment is illustrated
Figure, Fig. 2 is this utility model silicon ingot cutting machine leftschematic diagram in one embodiment.It should be noted that, this utility model
Silicon ingot cutting machine is for cutting to the head of silicon ingot (polysilicon silicon ingot or monocrystal silicon silicon ingot) and/or afterbody,
But in fact, not being limited with silicon ingot, this workpiece to be cut can also be for example: polycrystalline silicon rod, sapphire silicon rod etc., should all belong to
In protection domain of the present utility model.
As depicted in figs. 1 and 2, silicon ingot cutting machine of the present utility model, comprising: support 10, the work on support 10
Platform 20, and the wire-electrode cutting device 30 on support 10.
Hereinafter above-mentioned part is described in detail.
Workbench 20, on support 10, rotated by a station conversion device be provided with the first station platform 210 with
Second station platform 220.First station platform 210 is identical with the second station platform 220 structure, and arbitrary station platform all includes putting down
Platform base, arranges multiple silicon ingot supporting tables on platform base, spaced arrangement (different phase between multiple silicon ingot supporting tables
Spacing between adjacent two silicon ingot supporting tables is not construed as limiting, and can be at equal intervals can also unequal-interval), silicon ingot supporting table
For support silicon ingot to be cut 90.Specifically, the first station platform 210 includes platform base 211, on platform base 211
It is provided with multiple silicon ingot supporting tables 213, the second station platform 220 includes platform base 222, is provided with platform base 222
Multiple silicon ingot supporting tables 224.
Wire-electrode cutting device 30, by a frame 120 on support 10 and can by an elevating mechanism 40 up and down
Top located at workbench 20.Wire-electrode cutting device 30 includes being connected to the wire cutting peace of frame 120 by elevating mechanism 40 lifting
Fill support 310 and be installed on the multiple wire cutting units in wire cutting mounting bracket 310, for cutting silicon ingot 90 to be cut
320.Especially, in the present embodiment: the quantity of wire cutting unit 320 in wire-electrode cutting device 30 and silicon ingot supporting table 213
(224) quantity is consistent, and especially, wire cutting unit 320 is located at the top of silicon ingot supporting table 213 (224) and corresponding silicon ingot 90
Head position.Further, wire cutting mounting bracket 310 is the frame structure built by cross bar and montant, and wire cutting fills
Put and be connected with each other by cross bar between the multiple wire cutting units 320 in 30.Elevating mechanism 40 includes slide rail 411 and slide block
413, specifically, the opposite sides in frame 120 is vertically provided with slide rail 411, the back side of wire cutting mounting bracket 310 respectively
(that is, on the cross bar in wire cutting mounting bracket 310) is provided with slide block 413, slide block 413 offers and is slidedly arranged on for slide block 413
The chute of slide rail 411.Using elevating mechanism 40, slide block 413 can be driven to move up and down on slide rail 411, and then drive many
Individual wire cutting unit 320 together moves up and down, to complete cutting to the upper silicon ingot 90 to be cut of silicon ingot supporting table 213 (224)
Cut work.In conjunction with shown in Fig. 2, wire cutting unit 320 include being connected to wire cutting mounting bracket 310 cutting roll stand 321 and
It is symmetricly set in two cutting rollers 322 of cutting roll stand 321 bottom, between two cutting rollers 322, be provided with line of cut 323.Specifically
Ground, cutting roll stand 321 includes being in transmission connection in the horizontal frame 5111 of elevating mechanism 40 and is symmetricly set in horizontal frame
The vertical framework 5112 of two of 5111 bottoms, two cutting rollers 322 are respectively arranged on two vertical frameworks 5112.It is highly preferred that
Two vertical frameworks 5112 are respectively arranged on the two bottom sides of horizontal frame 5111, so, two vertical frameworks 5112 and horizontal pane
Frame 5111 is spliced to form undercut font cutting roll stand.Preferably, cutting roll stand 321 also can arrange corresponding directive wheel and tension force
Wheel etc., for realizing guiding and the tension adjustment of line of cut 323.
Refering to shown in Fig. 3, Fig. 3 is the enlarged diagram of workbench in Fig. 2.In conjunction with Fig. 1 and Fig. 3, the first station platform 210
Rotated by station conversion device with the second station platform 220 with conversion station position.Described station conversion device includes point
It is not arranged at two rotating mechanisms 50 of the opposite end of station platform described at least two.
Rotating mechanism 50 includes: pedestal 510, and be in transmission connection plate 520, and rotary shaft 531,532.
Pedestal 510 is located at one end of workbench 20 and is fixed on support 10, and pedestal 510 is provided with driving gear 511 He
For driving the driving power source of driving gear 511.In one embodiment, described driving power source may be, for example, drive motor or
Servomotor.
The zone line of plate 520 of being in transmission connection is provided with power transmission shaft 521, and the opposite end of power transmission shaft 521 is respectively equipped with first
Travelling gear 523 and the second travelling gear 525, the first travelling gear 523 is engaged with the driving gear 511 on pedestal 510.
At least two rotary shafts, the two ends of any one rotary shaft respectively axle be connected to described in be in transmission connection plate 520 and corresponding
Platform base in one station platform.Specifically: one end axle of the first rotary shaft 531 is connected to the one end of the plate 520 that is in transmission connection,
The other end axle of the first rotary shaft 531 is connected to the end of the platform base 211 in the first station platform 210, the first rotary shaft 531
It is provided with the first rotate gear 533 engaging with the second travelling gear 525 being in transmission connection on plate 520.Second rotary shaft 532
One end axle is connected to the other end of the plate 520 that is in transmission connection, and the other end axle of the second rotary shaft 532 is connected in the second station platform 220
Platform base 222 end, the second rotary shaft 532 is provided with and engaged with the second travelling gear 525 being in transmission connection on plate 520
The second rotate gear 534.Preferably, the distance of the first rotary shaft 531 and power transmission shaft 521 and the second rotary shaft 532 and transmission
The distance of axle 521 is identical.Further, for making the first station platform 210 more stable with the second station platform 220 change
Station position, rotating mechanism 50 additionally provides two accessory drive wheels, and wherein, the first accessory drive wheel 535 is located at the first rotation
It is meshed between axle 531 and the second travelling gear 525 and respectively with the first rotary shaft 531 and the second travelling gear 525, second is auxiliary
Help drive 536 be located between the second rotary shaft 532 and the second travelling gear 525 and respectively with the second rotary shaft 532 and second
Travelling gear 525 is meshed.
In actual applications, the driving power source drive driving gear 511 in rotating mechanism 50 rotates, by driving gear
First travelling gear 523 of 511 drive power transmission shaft 521 first ends rotates, so, second driving cog at power transmission shaft 521 second end
Wheel 525 in response to the first travelling gear 523 synchronous axial system, the first travelling gear 523 respectively pass through the first accessory drive wheel 535 He
Second accessory drive wheel 536 and drive the first rotary shaft 531 and the second rotary shaft 532 to rotate, thus, take advantage of a situation drive the first station
Platform 210 and the second station platform 220 are rotated clockwise or counterclockwise using power transmission shaft 521 as center of rotation, change position,
Realize the conversion of station position.More specifically, in the present embodiment, workbench 20 includes two work platformses, and (the first station is put down
Platform 210 and the second station platform 220), therefore, the rotating shaft 112 of rotating mechanism 50 rotates 180 °, and the plate 113 that is in transmission connection drives the
One station platform 210 and the second station platform 220 also rotate 180 ° it is possible to complete the first station platform 210 and the second station
The exchange of the position of platform 220, realizes to silicon ingot 90 to be cut and the second station being loaded on the first station platform 210
The effect that silicon ingot 90 to be cut on platform 220 is alternately cut.
Certainly, in the present embodiment, for making the essence of the first station platform 210 and the second station platform 220 rotational angle
Really property, rotating mechanism 50 may also include angular transducer or position sensor (not shown in the drawings), for detection the
The rotational angle of one station platform 210 and the second station platform 220 or location variation.For example, angular transducer or position pass
The rotational angle of sensor real-time detection the first station platform 210 and the second station platform 220 or location variation, once detect
The rotational angle of the first station platform 210 and the second station platform 220 or location variation reach preset value and (with rotational angle are
Example, preset value may be set to 180 °) when, that is, notify to drive power source to quit work.
Please continue to refer to Fig. 4, it is silicon ingot supporting table 213 and rotating mechanism in the first station platform 210 in Fig. 2
Enlarged diagram.In conjunction with Fig. 1 to Fig. 4, each silicon ingot supporting table 213 (224) has the support space for 1~4 silicon ingot of support
(the upper support of in the diagram, shown silicon ingot supporting table 213 (224) has 2 silicon ingots 90).In addition, on silicon ingot supporting table 213 (224)
It is provided with the detent mechanism for fixing silicon ingot 90 to be cut, described detent mechanism includes being fixedly arranged on silicon ingot supporting table 213 (224)
On support bar 331, level connection joint in support bar 331 fix bar 333 and be fixed in fix bar 333 and be located to be cut
Silicon ingot 90 top press part 335, press part 335 is preferably elastic press, and the bottom of described elastic press presses on to be cut
The top of the silicon ingot 90 cutting.Described detent mechanism silicon ingot 90 to be cut can be positioned it is ensured that cutting during,
The position of silicon ingot 90 to be cut will not be moved it is ensured that the precision cut.Furthermore it is preferred that in the present embodiment, because needing
The head of silicon ingot 90 and afterbody are all cut, therefore, the upper correspondence of silicon ingot supporting table 213 (224) silicon ingot 90 to be cut
Both sides end to end offer cutting wire casing 310 respectively, and the width that cutting wire casing 310 has certain depth and notch is greater than and cuts
The line footpath of secant 323, so, line of cut 323 cut away completely silicon ingot 90 end to end after can fall into cutting wire casing 310 in,
The effect of protection line of cut 323 while realizing silicon ingot 90 cut-out end to end, can be played, it is to avoid line of cut 323 and silicon ingot hold
Saddle 213 (224) produces friction and damages.
As it was previously stated, wire cutting unit 320 is in the top of silicon ingot supporting table 213 (224) and the head of corresponding silicon ingot 90
The position in portion, therefore, wire cutting unit 320 can directly cut the head of silicon ingot 90, therefore, for making wire cutting unit 320 also
Back-end crop process can be carried out to the silicon ingot 90 on silicon ingot supporting table 213 (224), silicon ingot supporting table 213 (224) is additionally provided with whirler
Structure, silicon ingot supporting table 213 (224) can rotate 180 ° so that silicon ingot holds under the driving of described rotating mechanism in the horizontal plane
The position end to end of the silicon ingot 90 to be cut on saddle 213 (224) is exchanged.Further, described rotating mechanism includes rotary shaft
610th, support is in the support plate 620 of silicon ingot supporting table 213 (224) bottom, the axle between rotary shaft 610 and support plate 620
Bearing assembly 630 and for spacing banking stop 640 is carried out to support plate 620.In actual applications, rotary shaft 610 rotating band
Dynamic support plate 620 rotates, by support plate 620 drive silicon ingot supporting table 213 (224) rotate in the horizontal plane 180 ° so that
The position end to end of the silicon ingot 90 to be cut on silicon ingot supporting table 213 (224) is exchanged, and can again by stir banking stop 640
Support plate 620 is carried out spacing so that support plate 620 cannot be rotated further by.
By upper, silicon ingot cutting machine of the present utility model, workbench 20 includes by a station conversion device rotating and setting
It is equipped with the first station platform 210 and the second station platform 220, wire-electrode cutting device 30 includes and the first station platform 210 and
Silicon ingot supporting table 213 (224) quantity identical wire cutting unit 320 in two station platforms 220, each wire cutting unit
Line of cut 323 in 320 corresponds to the cutting wire casing 310 of silicon ingot supporting table 213 front end in the first station platform 210 (it is assumed that the
One station platform 210 is in cutting work station area, and the second station platform 220 is located at the station area that awaits orders).It is assumed that it is to be cut
Silicon ingot 90 is intended to execution cutting operation end to end, then when being excised end to end to silicon ingot 90 to be cut, implements at first
In mode: decline multiple wire cutting units 320 by elevating mechanism 40 is synchronous, by first below wire cutting unit 320
The head excision of the silicon ingot 90 to be cut on station platform 210, then rise synchronous for multiple wire cutting units 320 to reset;
Rotate the first station platform 210 and the second station platform 220 using station conversion device, by the first station platform 210 and second
The position of station platform 220 is changed, and (the first station platform 210 is converted to positioned at station of awaiting orders by positioned at cutting work station area
Area, and the second station platform 220 is converted to positioned at cutting work station area by being located at the station area that awaits orders), meanwhile, using rotating mechanism 60
Silicon ingot supporting table 213 on first station platform 210 and silicon ingot 90 to be cut thereon are rotated 180 ° so that the first station
Exchange end to end by position for silicon ingot 90 to be cut on platform 210;Decline multiple wire cutting units by elevating mechanism 40 is synchronous
320, by the head excision of the silicon ingot 90 to be cut on the second station platform 220 of wire cutting unit 320 lower section, then will
Multiple wire cutting units 320 are synchronous to be risen to reset;First station platform 210 and the second station are rotated by station conversion device
Platform 220, the position of the second station platform 220 and the first station platform 210 is changed (the first station platform 210 is by position
In awaiting orders, station area is converted to positioned at cutting work station area, and the second station platform 220 is located at by being converted to positioned at cutting work station area
Await orders station area), meanwhile, using rotating mechanism 60 by the silicon ingot supporting table 224 on the second station platform 220 and thereon to be cut
The silicon ingot 90 that cuts rotate 180 ° so that the silicon ingot 90 to be cut on the second station platform 220 position is exchanged end to end;Using lifting
Mechanism 40 is synchronous to decline multiple wire cutting units 320, by the first station platform 210 of wire cutting unit 320 lower section
The afterbody excision of silicon ingot 90 to be cut, then rise synchronous for multiple wire cutting units 320 to reset;Using station conversion device
Rotate the first station platform 210 and the second station platform 220, by the position of the first station platform 210 and the second station platform 220
Changed (the first station platform 210 is converted to positioned at the station area that awaits orders by positioned at cutting work station area, and the second station platform
220 are converted to positioned at cutting work station area by being located at the station area that awaits orders), unloading the first station platform 210 completes what head and the tail cut
Silicon ingot 90 simultaneously loads newly batch of silicon ingot 90 to be cut, meanwhile, declines multiple wire cutting units using elevating mechanism 40 is synchronous
320, by the afterbody excision of the silicon ingot 90 to be cut on the second station platform 220 of wire cutting unit 320 lower section, then will
Multiple wire cutting units 320 are synchronous to be risen to reset;Rotate the first station platform 210 and the second station using station conversion device
Platform 220, the position of the second station platform 220 and the first station platform 210 is changed (the first station platform 210 is by position
In awaiting orders, station area is converted to positioned at cutting work station area, and the second station platform 220 is located at by being converted to positioned at cutting work station area
Await orders station area), unload the silicon ingot 90 completing to cut from beginning to end on the second station platform 220 and more renew batch of silicon to be cut
Ingot 90, meanwhile, is pointed to the new of the first station platform 210 support below wire cutting unit 320 using wire cutting unit 320
Silicon ingot 90 carries out cutting operation.And in second embodiment: decline multiple wire cutting lists by elevating mechanism 40 is synchronous
Unit 320, by the head excision of the silicon ingot 90 to be cut on the first station platform 210 of wire cutting unit 320 lower section, then
Rise synchronous for multiple wire cutting units 320 to reset;Using rotating mechanism 60 by the silicon ingot support on the first station platform 210
Platform 213 and silicon ingot 90 to be cut thereon rotate 180 ° so that the silicon ingot 90 to be cut on the first station platform 210 end to end
Position is exchanged;Decline multiple wire cutting units 320 using elevating mechanism 40 is synchronous, by positioned at the of wire cutting unit 320 lower section
The afterbody excision of the silicon ingot 90 to be cut on one station platform 210, then rise synchronous for multiple wire cutting units 320 with multiple
Position;Rotate the first station platform 210 and the second station platform 220 using station conversion device, by the first station platform 210 and the
The position of two station platforms 220 is changed, and (the first station platform 210 is converted to positioned at station of awaiting orders by positioned at cutting work station area
Area, and the second station platform 220 is converted to positioned at cutting work station area by being located at the station area that awaits orders);Synchronous by elevating mechanism 40
Decline multiple wire cutting units 320, by the silicon to be cut on the second station platform 220 of wire cutting unit 320 lower section
The head excision of ingot 90, then rise synchronous for multiple wire cutting units 320 to reset;Using rotating mechanism 60, second station is put down
Silicon ingot supporting table 224 on platform 220 and silicon ingot 90 to be cut thereon rotate 180 ° so that on the second station platform 220
Silicon ingot 90 to be cut is exchanged end to end by position;Decline multiple wire cutting units 320 using elevating mechanism 40 is synchronous, will cut positioned at line
Cut the afterbody excision of the silicon ingot 90 to be cut on the second station platform 220 of unit 320 lower section, then by multiple wire cutting units
320 synchronous rise resetting (it should be noted that, during the silicon ingot 90 on the second station platform 220 is cut end to end,
For being located at the first station platform 210 in the station area that awaits orders, unloading the first station platform 210 completes the silicon that head and the tail cut
Ingot 90 simultaneously loads newly batch of silicon ingot 90 to be cut);First station platform 210 and the second work are rotated by station conversion device
Bit platform 220, the position of the second station platform 220 and the first station platform 210 is changed (the first station platform 210 by
It is located at the station area that awaits orders to be converted to positioned at cutting work station area, and the second station platform 220 is converted to position by positioned at cutting work station area
In the station area that awaits orders), carry out the cutting operation of subsequent cycle.
Need to remark additionally: above-mentioned described silicon ingot cutting machine is only a preferred embodiment, but is not limited thereto,
This utility model silicon ingot cutting machine still can make other variations.For example: in another embodiment, wire cutting in wire-electrode cutting device 30
The quantity of unit 320 is consistent with the quantity of silicon ingot supporting table 213 (224), and, wire cutting unit 320 is located at silicon ingot supporting table 213
(224) top and the position of the afterbody of corresponding silicon ingot 90.For making the wire cutting unit 320 can also be to silicon ingot supporting table 213
(224) silicon ingot 90 on carries out back-end crop process, and silicon ingot supporting table 213 (224) is additionally provided with rotating mechanism, silicon ingot supporting table 213
(224) 180 ° can be rotated under the driving of described rotating mechanism in the horizontal plane so that on silicon ingot supporting table 213 (224)
The position end to end of silicon ingot 90 to be cut is exchanged.As can be seen here, in this another embodiment, cutting on line unit cuts silicon ingot
In application, it is the afterbody of the first silicon ingot 90 upper to be cut of cutting silicon ingot supporting table 213 (224), then cuts silicon ingot to be cut
90 head.And in another embodiment, the quantity of the wire cutting unit 320 in wire-electrode cutting device 30 is silicon ingot supporting table 213
(224) twice of quantity, i.e. for each silicon ingot supporting table 213 (224), be all configured with two wire cutting units 320,
Two wire cutting units 320 are located at the top of silicon ingot supporting table 213 (224) and correspond to the position of head and the tail of silicon ingot 90 respectively
The position in portion.So, in this another embodiment, on the one hand, rotating mechanism 60 need not be configured for silicon ingot supporting table 213 (224),
Simplify design complexities;On the other hand, it is only necessary to execution declines multiple wire cuttings in the application of cutting on line unit cutting silicon ingot
Unit the one-stop operation cut can complete the head to silicon ingot 90 and afterbody is excised it will be apparent that being lifted cutting effect simultaneously
The effect of rate.
Silicon ingot cutting machine of the present utility model and its workbench, on the one hand, this workbench includes at least two being set up in parallel
Individual station platform, multiplexing's bit platform can support silicon ingot more to be cut, can be treated multiple by wire-electrode cutting device simultaneously
The head of silicon ingot of cutting and/or afterbody are excised, and cutting speed it can also be ensured that the cut quality of facet, is cut soon
Complete without trimming, on the other hand, work changed by the station platform described at least two in this workbench by station conversion device
Position position, enable station platform automatically and accurate conversion is so that wire-electrode cutting device can be to being loaded at least two stations
Silicon ingot to be cut on platform is realized replacing cutting it is ensured that many batches of silicon ingots can carry out cutting operation in order, solves existing
The problems such as in technology, cutting efficiency is low, workbench conversion is inconvenient.
Refer to Fig. 5, Fig. 5 is flow chart in silicon ingot cutting application for this utility model silicon ingot cutting machine.As Fig. 5 institute
Show, this utility model silicon ingot cutting machine cuts application in silicon ingot, comprising:
Step s11: silicon ingot cutting machine is provided, loads to be cut at least two station platforms in silicon ingot cutting machine
Silicon ingot, described for one of work platformses described at least two work platformses are changed to cutting work station area.
In the present embodiment, this silicon ingot cutting machine has workbench and is located at the wire-electrode cutting device above workbench.
Described workbench includes the first station platform and the second station platform, on described first station platform and described second station platform
It is equipped with multiple silicon ingot supporting tables of the silicon ingot to be cut for support, described first station platform and described second station platform
Can be rotated with conversion station position by station conversion device, specifically, will can be by described by station conversion device
One station platform or described second station platform switch between station area in cutting work station area and awaiting orders.Each described silicon ingot
Support can there is 1~3 silicon ingot to be cut, described silicon ingot supporting table is provided with for fixing silicon ingot to be cut on supporting table
Detent mechanism, can be positioned to silicon ingot to be cut it is ensured that during cutting, the position of silicon ingot to be cut will not
It is moved it is ensured that the precision cut.Wire-electrode cutting device includes multiple wire cutting units, corresponding to described first station platform
In silicon ingot supporting table or the silicon ingot supporting table in described second station platform, described wire cutting unit includes cutting roller and winding
Line of cut in cutting roller.
Step s13: cutting work station area is pointed to by the wire cutting unit in the wire-electrode cutting device in silicon ingot cutting machine
On described silicon ingot supporting table in one described work platforms, the silicon ingot of institute's support carries out cutting operation.
In the present embodiment, by the wire cutting unit of wire-electrode cutting device, the head-tail that carries out of silicon ingot to be cut is cut
Cut.
Step s15: drive station platform motion described at least two so that at least two institutes using station conversion device
State station platform conversion station position, described work platformses being initially positioned at cutting work station area are changed to station of awaiting orders
Area, described work platformses of other in station platform described at least two are changed to cutting work station area to be cut.
In the present embodiment, the workbench that described silicon ingot cutting machine provides includes the first station platform and the second station is put down
Platform, the first station platform and the second station platform are by station conversion device in cutting work station area with await orders to enter between station area
Row conversion.
Refering to Fig. 6, Fig. 6 is flow chart in first embodiment for the Fig. 5.In this first embodiment, with this silicon ingot
Cutting application is corresponding to be silicon ingot cutting machine in above-mentioned first embodiment, importantly, above described silicon ingot supporting table
The position of corresponding described silicon ingot head arranges a wire cutting unit, and described silicon ingot supporting table is provided with rotating mechanism, described silicon ingot
Supporting table rotates 180 ° so that the position of the head-tail of silicon ingot to be cut under the driving of described rotating mechanism in the horizontal plane
Exchange.
In conjunction with Fig. 1 and such as Fig. 6, the flow process in first embodiment includes:
Step s201: silicon ingot to be cut is loaded into each silicon ingot support of the first station platform and the second station platform
On platform.Here, silicon ingot to be cut is loaded into and the silicon to be cut using detent mechanism fixation is also included on silicon ingot supporting table
Ingot, i.e. the press part in detent mechanism is pressed on the top of silicon ingot to be cut.After step s201, it is assumed that: the
One station platform is in cutting work station area and is located at the underface of wire-electrode cutting device center line cutter unit, and the second station platform is
It is located at the station area that awaits orders.
Step s203: synchronously decline the multiple wire cutting units in wire-electrode cutting device by elevating mechanism, by the first station
The head excision of the silicon ingot to be cut on platform, then by multiple wire cutting units, synchronously rising resets by elevating mechanism.
Step s205: the first station platform and the second station platform are rotated by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s205, the first station platform and the second station platform are rotated by station conversion device, by the first work
Bit platform is swapped with the position of the second station platform, and specifically, in station conversion device, the driving in rotating mechanism is moved
Power source drives driving gear to rotate, and is rotated by the first travelling gear that driving gear drives power transmission shaft first end, so, power transmission shaft
Second travelling gear at the second end synchronous axial system in response to the first travelling gear, the first travelling gear passes through the first auxiliary respectively and passes
Driving wheel and the second accessory drive wheel and drive the first rotary shaft and the second rotary shaft to rotate, thus, drive first station of taking advantage of a situation is put down
Platform and the second station platform are rotated clockwise or counterclockwise using power transmission shaft as center of rotation, change position, realize station position
The conversion put, the first station platform is changed to the station area that awaits orders by cutting work station area, by the second station platform by station of awaiting orders
Area is converted to cutting work station area.
Step s207: synchronously decline the multiple wire cutting units in wire-electrode cutting device by elevating mechanism, by the second station
The head excision of the silicon ingot to be cut on platform, then by multiple wire cutting units, synchronously rising resets by elevating mechanism.
It should be noted that, during execution step s205 and step s207, actually also include: utilize rotating mechanism
Each silicon ingot supporting table on first work platformses is rotated 180 ° in the horizontal plane, so that each on the first work platformses
On silicon ingot supporting table, the position end to end of the silicon ingot of institute's support is exchanged.Hold in this silicon ingot step s205 that position is exchanged end to end
Row is it is also possible to execute in step s207, and is not construed as limiting.
Step s209: the first station platform and the second station platform are rotated by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s209, the first station platform and the second station platform are rotated by station conversion device, by the first work
Bit platform is swapped with the position of the second station platform, and specifically, in station conversion device, the driving in rotating mechanism is moved
Power source drives driving gear to rotate, and is rotated by the first travelling gear that driving gear drives power transmission shaft first end, so, power transmission shaft
Second travelling gear at the second end synchronous axial system in response to the first travelling gear, the first travelling gear passes through the first auxiliary respectively and passes
Driving wheel and the second accessory drive wheel and drive the first rotary shaft and the second rotary shaft to rotate, thus, drive first station of taking advantage of a situation is put down
Platform and the second station platform are rotated clockwise or counterclockwise using power transmission shaft as center of rotation, change position, realize station position
The conversion put, the first station platform is changed to cutting work station area by the station area that awaits orders, by the second station platform by cutting work station
Area is converted to the station area that awaits orders.
Step s211: synchronously decline the multiple wire cutting units in wire-electrode cutting device by elevating mechanism, by the first station
The afterbody excision of the silicon ingot to be cut on platform, then by multiple wire cutting units, synchronously rising resets by elevating mechanism.
It should be noted that, during execution step s209 and step s211, actually also include: utilize rotating mechanism
Each silicon ingot supporting table on second work platformses is rotated 180 ° in the horizontal plane, so that each on the second work platformses
On silicon ingot supporting table, the position end to end of the silicon ingot of institute's support is exchanged.Hold in this silicon ingot step s209 that position is exchanged end to end
Row is it is also possible to execute in step s211, and is not construed as limiting.
Step s213: the first station platform and the second station platform are rotated by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s213, the first station platform and the second station platform are rotated by station conversion device, by the first work
Bit platform is swapped with the position of the second station platform, and specifically, in station conversion device, the driving in rotating mechanism is moved
Power source drives driving gear to rotate, and is rotated by the first travelling gear that driving gear drives power transmission shaft first end, so, power transmission shaft
Second travelling gear at the second end synchronous axial system in response to the first travelling gear, the first travelling gear passes through the first auxiliary respectively and passes
Driving wheel and the second accessory drive wheel and drive the first rotary shaft and the second rotary shaft to rotate, thus, drive first station of taking advantage of a situation is put down
Platform and the second station platform are rotated clockwise or counterclockwise using power transmission shaft as center of rotation, change position, realize station position
The conversion put, the first station platform is changed to the station area that awaits orders by cutting work station area, by the second station platform by station of awaiting orders
Area is converted to cutting work station area.
Step s215: multiple wire cutting units are synchronously declined by elevating mechanism, will be to be cut on the second station platform
Silicon ingot afterbody excision, then by elevating mechanism, multiple wire cutting units are synchronously risen and reset;Unload the first station to put down
The silicon ingot that cuts end to end is completed on platform and loads newly batch of silicon ingot to be cut.
Step s217: the first station platform and the second station platform are rotated by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s217, the first station platform and the second station platform are rotated by station conversion device, by the first work
Bit platform is swapped with the position of the second station platform, and specifically, in station conversion device, the driving in rotating mechanism is moved
Power source drives driving gear to rotate, and is rotated by the first travelling gear that driving gear drives power transmission shaft first end, so, power transmission shaft
Second travelling gear at the second end synchronous axial system in response to the first travelling gear, the first travelling gear passes through the first auxiliary respectively and passes
Driving wheel and the second accessory drive wheel and drive the first rotary shaft and the second rotary shaft to rotate, thus, drive first station of taking advantage of a situation is put down
Platform and the second station platform are rotated clockwise or counterclockwise using power transmission shaft as center of rotation, change position, realize station position
The conversion put, the first station platform is changed to cutting work station area by the station area that awaits orders, by the second station platform by cutting work station
Area is converted to the station area that awaits orders.
After step s217, unload the silicon ingot completing to cut end to end on the second station platform and load newly batch of to be cut
The silicon ingot cutting, and the silicon ingot to be cut reloaded on the first station platform can start the cutting operation of a new round.
In addition, in the preamble, we mention, and in this utility model silicon ingot cutting machine in another embodiment, wire cutting fills
The quantity of wire cutting unit in putting is consistent with the quantity of silicon ingot supporting table, and, wire cutting unit is located at the upper of silicon ingot supporting table
The position of the afterbody of side and corresponding silicon ingot.Therefore, for the step of the silicon ingot cutting operation of silicon ingot cutting machine in this another embodiment
Rapid flow process is basically identical with the steps flow chart in Fig. 6, and it differs only in cutting process, is first to cut silicon ingot supporting table
The afterbody of upper silicon ingot to be cut, then the head cutting silicon ingot to be cut.
Refering to Fig. 7, Fig. 7 is Fig. 5 flow chart in the second embodiment.In this another embodiment, wire-electrode cutting device
In wire cutting unit quantity be silicon ingot supporting table quantity twice, i.e. for each silicon ingot supporting table, wire cutting fills
Put all correspondences and be configured with two wire cutting units, two wire cutting units are positioned at the top of this silicon ingot supporting table and right respectively
Answer the position of the head of silicon ingot and the position of afterbody.In addition, joining compared to the lower section of the silicon ingot supporting table in first embodiment
It is equipped with rotating mechanism, in the second embodiment, rotating mechanism need not be configured for silicon ingot supporting table.
As shown in fig. 7, flow process in the second embodiment includes:
Step s301: silicon ingot to be cut is loaded into each silicon ingot support of the first station platform and the second station platform
On platform.Here, silicon ingot to be cut is loaded into and the silicon to be cut using detent mechanism fixation is also included on silicon ingot supporting table
Ingot, i.e. the press part in detent mechanism is pressed on the top of silicon ingot to be cut.After step s201, it is assumed that: the
One station platform is in cutting work station area and is located at the underface of wire-electrode cutting device center line cutter unit, and the second station platform is
It is located at the station area that awaits orders.
Step s303: multiple wire cutting units are synchronously declined by elevating mechanism, will be to be cut on the first station platform
The head-tail of silicon ingot excise simultaneously, then by elevating mechanism, multiple wire cutting units are synchronously risen and reset.
Step s305: the first station platform and the second station platform are rotated by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s305, the position of the first station platform and the second station platform is swapped and refers specifically to
One station platform is changed to the station area that awaits orders by cutting work station area, and the second station platform is converted to cutting work by the station area that awaits orders
Position area.
Step s307: multiple wire cutting units are synchronously declined by elevating mechanism, will be to be cut on the second station platform
The head-tail of silicon ingot excise simultaneously, then by elevating mechanism, multiple wire cutting units are synchronously risen and reset;Unloading first
The silicon ingot that cuts end to end is completed on station platform and more renews batch of silicon ingot to be cut.
Step s309, rotates the first station platform and the second station platform by station conversion device, the first station is put down
Platform is swapped with the position of the second station platform.
In step s309, the position of the first station platform and the second station platform is swapped and refers specifically to
One station platform is changed to cutting work station area by the station area that awaits orders, and the second station platform is converted to, by cutting work station area, work of awaiting orders
Position area.
After step s309, unload the silicon ingot completing to cut end to end on the second station platform and load newly batch of to be cut
The silicon ingot cutting, and the silicon ingot to be cut reloaded on the first station platform can start the cutting operation of a new round.
This utility model silicon ingot cutting machine, is applied in silicon ingot cutting operation, can once simultaneously by wire-electrode cutting device
The head of multiple silicon ingots to be cut and/or afterbody are carried out cutting operation, silicon ingot cutting quantity is many, and cutting speed is fast, also may be used
Ensure the cut quality of silicon ingot facet, especially, including at least two station platforms, in cutting process, turned by station
Changing device rotates at least two station platforms so that the conversion station position of at least two station platforms, so that each work
The silicon ingot to be cut being loaded on bit platform can carry out cutting operation in the way of poll it is ensured that many batches of silicon ingots can enter in order
Row cutting operation, provides the timeliness of cutting significantly, solves low, workbench conversion inconvenience of cutting efficiency in prior art etc.
Problem.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for limiting this practicality
Type.Any person skilled in the art all can be carried out to above-described embodiment without prejudice under spirit and the scope of the present utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in this utility model
All equivalent modifications being completed under god and technological thought or change, must be covered by claim of the present utility model.
Claims (10)
1. a kind of workbench of silicon ingot cutting machine is it is characterised in that include:
At least two station platforms being set up in parallel, for support silicon ingot;Described station platform includes: platform base, located at institute
State on platform base, be used for the silicon ingot supporting table of support silicon ingot;
Station conversion device, is connected to station platform described at least two, for driving station platform motion described at least two
So that station platform conversion station position described at least two.
2. silicon ingot cutting machine according to claim 1 workbench it is characterised in that described silicon ingot supporting table be provided with for
The detent mechanism of positioning silicon ingot, support bar that described detent mechanism includes being fixedly arranged on described silicon ingot supporting table, level connection joint in
The fix bar of described support bar and be fixed in described fix bar and for pressing on the press part at silicon ingot top.
3. the workbench of silicon ingot cutting machine according to claim 1 is it is characterised in that described station conversion device includes point
It is not arranged at two rotating mechanisms of the opposite end of station platform described at least two, described rotating mechanism includes:
Pedestal, positioned at one end of described station platform;Described pedestal is provided with driving gear and is used for driving described driving gear
Driving power source;
Be in transmission connection plate, is provided with power transmission shaft;The opposite end of described power transmission shaft is respectively equipped with the first travelling gear and the second transmission
Gear, described first travelling gear is engaged with described driving gear;And
At least two rotary shafts, are connect with the described platform base axle in station platform described at least two respectively;Described rotary shaft
It is provided with the rotate gear engaging with described second travelling gear.
4. the workbench of silicon ingot cutting machine according to claim 3 is it is characterised in that described rotating mechanism also includes: extremely
Few two accessory drive wheels, corresponding to rotary shaft described at least two;Described accessory drive wheel be located at described rotary shaft with described
It is meshed between second travelling gear and with described rotary shaft and described second travelling gear.
5. the workbench of the silicon ingot cutting machine according to claim 3 or 4 is it is characterised in that described rotating mechanism also includes:
Angular transducer or position sensor, for the rotational angle of station platform or location variation described in detection at least two.
6. a kind of silicon ingot cutting machine is it is characterised in that include:
Support;
Workbench on described support, as any one of claim 1 to 5;And
On described support and liftably located at the wire-electrode cutting device of the top of described workbench, described wire-electrode cutting device bag
Include and the silicon ingot supporting table corresponding wire cutting unit in described station platform, for cutting institute's support on described silicon ingot supporting table
Silicon ingot.
7. silicon ingot cutting machine according to claim 6 it is characterised in that:
Above described silicon ingot supporting table, the position of corresponding described silicon ingot head or afterbody arranges a described wire cutting unit;
And
Described silicon ingot supporting table is additionally provided with rotating mechanism, and described silicon ingot supporting table is under the driving of described rotating mechanism in horizontal plane
Interior rotation is so that the position end to end of described silicon ingot supporting table institute support silicon ingot is exchanged.
8. silicon ingot cutting machine according to claim 6 is it is characterised in that correspond to described above described silicon ingot supporting table
Silicon ingot position end to end is respectively provided with a described wire cutting unit.
9. the silicon ingot cutting machine according to claim 7 or 8 it is characterised in that
Described wire cutting unit includes at least two cutting rollers cutting roll stand and being symmetricly set in described cutting roll stand bottom,
It is provided with line of cut between cutting roller described at least two;
On described silicon ingot supporting table, corresponding described silicon ingot both sides end to end offer the cutting corresponding with described line of cut respectively
Wire casing.
10. silicon ingot cutting machine according to claim 6 is it is characterised in that described silicon ingot supporting table is provided with for fixing
The detent mechanism of silicon ingot to be cut.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106182479A (en) * | 2016-08-25 | 2016-12-07 | 上海日进机床有限公司 | The workbench of silicon ingot cutting machine, silicon ingot cutting machine and silicon ingot cutting method |
WO2021254082A1 (en) * | 2020-06-15 | 2021-12-23 | 天通日进精密技术有限公司 | Wire cutting device and silicon rod processing equipment |
-
2016
- 2016-08-25 CN CN201620945268.7U patent/CN205915542U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106182479A (en) * | 2016-08-25 | 2016-12-07 | 上海日进机床有限公司 | The workbench of silicon ingot cutting machine, silicon ingot cutting machine and silicon ingot cutting method |
CN106182479B (en) * | 2016-08-25 | 2019-08-13 | 天通日进精密技术有限公司 | Workbench, silicon ingot cutting machine and the silicon ingot cutting method of silicon ingot cutting machine |
WO2021254082A1 (en) * | 2020-06-15 | 2021-12-23 | 天通日进精密技术有限公司 | Wire cutting device and silicon rod processing equipment |
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Effective date of registration: 20180529 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |