CN208215715U - Silicon ingot excavation machine - Google Patents

Abstract

The application discloses a kind of silicon ingot excavation machine, including the first cutter device and the second cutter device, the first cutting operation is implemented to polycrystal silicon ingot to form the first silicon cube according to the crystal orientation of polycrystal silicon ingot using the first cutter device, the second cutting operation is implemented to the first silicon cube to form the second silicon cube according to the crystal orientation of the first silicon cube using the second cutter device.Relative to the relevant technologies, silicon ingot excavation machine disclosed in the present application, the automation evolution operation of silicon ingot can be not only completed in the case of removing from and cutting cutting gauze, improve silicon ingot evolution efficiency, even more in evolution operation, the crystal orientation situation of silicon ingot is fully considered, so that evolution may make to form the second silicon cube and there can be more preferably performance.

Description

Silicon ingot excavation machine

Technical field

This application involves silicon ingots to cut field, more particularly to a kind of silicon ingot excavation machine.

Background technique

When manufacturing various semiconductor devices or photovoltaic device, by half comprising hard brittle materials such as silicon, sapphire or ceramics Conductor work piece cut is the structure of specification.Since semiconductor workpiece cutting is the important procedure for restricting subsequent finished product, thus It is also higher and higher to its job requirements.Currently, multi-wire cutting technology is since with high production efficiency, operating cost is low, operation is smart The features such as high is spent, is widely used in the semiconductor workpiece cutting production of industry.

The production process of existing silicon wafer, by taking polysilicon product as an example, generally, rough flow chart can include: first make Evolution operation is carried out to first grade silicon ingot (large scale silicon ingot) with silicon ingot excavation machine to form time grade silicon ingot (small size silicon ingot)；Evolution After, it reuses silicon ingot shear and truncation processing is carried out to form polycrystalline silicon rod to secondary grade silicon ingot；Again to each polycrystalline silicon rod Corresponding grinding operation (such as: flour milling, chamfering, barreling etc.) is carried out, so that the surface shaping of polycrystalline silicon rod reaches corresponding flat Whole degree and size tolerance requirements；It is subsequent to reuse slicer slice operation is carried out to polycrystalline silicon rod, then obtain polysilicon chip.

It is related to silicon ingot evolution in the related technology aforementioned, common multi-thread evolution equipment uses the side of cross gauze composition Silicon ingot is cut into multiple silico briquettes from top to bottom by shape grid.Although such cutting mode can an excision forming, it is complicated Winding mode and slower feed velocity, the winding mode that greatly affected the cutting efficiency of equipment and complexity also greatly consume Pass the service life of cutting wheel and diamond wire.In addition, silicon can not be directly taken out after silicon ingot is cut into multiple silico briquettes Block, generally, it is necessary to after cutting gauze, will cutting rack rise playback after could take out silico briquette, subsequent, must there is operator Member's wiring again, wiring difficulty is big again for equipment, and the operating time is long, and extreme influence working efficiency causes enterprise at high cost.

Utility model content

In view of the missing of the relevant technologies described above, the purpose of the application is to disclose a kind of silicon ingot excavation machine, for solving Certainly in the related technology silicon ingot evolution cutting operation inefficiency the problems such as.

To achieve the above object and other purposes, the first aspect of the application disclose a kind of silicon ingot excavation machine, comprising: first Cutter device, comprising: the first workbench, for carrying polycrystal silicon ingot；First cutter unit has multiple first cutting line segments； Wherein, multiple first cutting line segments in first cutter unit are for the crystal orientation according to the polycrystal silicon ingot and to described more Crystal silicon ingot implements the first cutting operation, forms multiple first silicon cubes；Second cutter device is adjacent to the first cutting dress It sets, comprising: the second workbench, for carrying the first silicon cube；Second cutter unit has multiple second cutting line segments；Wherein, Multiple second cutting line segments in second cutter unit are for the crystal orientation according to the first silicon cube and to described first Silicon cube implements the second cutting operation, forms multiple second silicon cubes.

Silicon ingot excavation machine disclosed in the present application, including the first cutter device and the second cutter device, wherein cut using first Device is cut according to the crystal orientation of polycrystal silicon ingot and the first cutting operation is implemented to form the first silicon cube to polycrystal silicon ingot, utilizes second Cutter device implements the second cutting operation to the first silicon cube according to the crystal orientation of the first silicon cube to form the second silicon cube.Phase For the relevant technologies, silicon ingot excavation machine disclosed in the present application not only can complete silicon ingot in the case of removing from and cutting cutting gauze Automation evolution operation, improve silicon ingot evolution efficiency, even more in evolution operation, fully considered the crystal orientation shape of silicon ingot Condition, so that evolution may make to form the second silicon cube and can have more preferably performance.

In the certain embodiments of the application first aspect, first cutter unit has multiple the be oppositely arranged One cutting wheel group and the first cutting line, first cutting line are sequentially around in each first in the multiple first cutting wheel group Cutting wheel forms multiple first cutting line segments.

In the certain embodiments of the application first aspect, in first workbench and first cutter unit At least one is arranged to can be mobile relative to another one.

In the certain embodiments of the application first aspect, first cutter unit is set to first workbench Top；First cutter unit includes the left cutting rack and right cutting rack being oppositely arranged, the left cutting rack and the right cut It cuts and is equipped with multiple first cutting wheels on frame, in first cutting wheel on the left cutting rack of same position and right cutting rack One the first cutting wheel forms a first cutting wheel group；First workbench is equipped with corresponding with multiple first cutting line segments Multiple first cutting seams.

In the certain embodiments of the application first aspect, in first workbench and first cutter unit At least one is equipped with lift drive mechanism.

In the certain embodiments of the application first aspect, second cutter unit has multiple the be oppositely arranged Two cutting wheel groups and the second cutting line, second cutting line are sequentially around in each second in the multiple second cutting wheel group Cutting wheel forms multiple second cutting line segments.

In the certain embodiments of the application first aspect, in second workbench and second cutter unit At least one is arranged to can be mobile relative to another one.

In the certain embodiments of the application first aspect, second cutter unit is located at second workbench Side；Second cutter unit includes the upper cutting rack being oppositely arranged and lower cutting rack, the upper cutting rack and lower cutting rack On be equipped with multiple second cutting wheels, one on second cutting wheel on the upper cutting rack of same position and lower cutting rack Second cutting wheel forms a second cutting wheel group；The workbench is equipped with and multiple second cutting line segments corresponding multiple second Cutting seam.

In the certain embodiments of the application first aspect, in second workbench and second cutter unit At least one be equipped with translational drive mechanism.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes silicon ingot revolving platform, is located at Between first cutter device and second cutter device, for carrying multiple first silicon cubes.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes workpiece transporter, is used In multiple first silicon cubes are transported to silicon ingot revolving platform by the first workbench.

In the certain embodiments of the application first aspect, the workpiece transporter includes: workpiece picking and placing unit；It moves Motivation structure, for driving the workpiece picking and placing unit mobile, with using the workpiece picking and placing unit by multiple first silicon cubes by First workbench is transported to silicon ingot revolving platform.

In the certain embodiments of the application first aspect, the mobile mechanism includes: along the first workbench to silicon The traveling mobile unit of ingot revolving platform；Lifting moving unit；Telescopic moving unit；Mobile control unit is moved with the traveling Unit, the lifting moving unit and telescopic moving unit connection, are used for: being believed according to the position of multiple first silicon cubes It ceases and controls the lifting moving unit and the telescopic moving unit and drive the workpiece picking and placing unit movement multiple to extract First silicon cube controls after the traveling mobile unit drives the workpiece picking and placing unit to be moved to silicon ingot revolving platform described in control Lifting moving unit and the telescopic moving unit drive the workpiece picking and placing unit mobile to put multiple first silicon cubes In on silicon ingot revolving platform.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes that trimming leather jacket is set, and is used for The flaw-piece removal that the silicon ingot is generated after the first cutting operation.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes being set to the silicon ingot to have enough to meet the need Workpiece tilting device between platform and second cutter device, for giving the first silicon cube on the silicon ingot revolving platform It overturns and is transported to second workbench.

In the certain embodiments of the application first aspect, the Workpiece tilting device includes: bracket；Axis is connected to described The clamping piece of bracket, for clamping the first silicon cube；The overturning driving being connected between the bracket and the clamping piece Mechanism, for driving the clamping piece and its first clamped silicon cube to make flip-flop movement.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes feeding transfer device, is used In silicon ingot is transferred on first workbench by feeding area.

In the certain embodiments of the application first aspect, the feeding transfer device includes: loading guide, is layed in Between feeding area and first workbench；Transfer bed is set on the loading guide.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes charging positioning device, institute Stating charging positioning device includes: side surface positioning device, the side set on the feeding area；Position adjusts component, is set to the shifting It send on the table top of platform to be contacted with the silicon ingot carried.

In the certain embodiments of the application first aspect, it is universal ball end or circle rotation that the position, which adjusts component, Formula adjusts head.

In the certain embodiments of the application first aspect, the silicon ingot excavation machine further includes material containing vehicle, is used for institute It states and is transported to after silicon ingot is delivered to feeding area on the transfer bed of the feeding transfer device.

Detailed description of the invention

Fig. 1 is shown as schematic perspective view of the silicon ingot excavation machine under a certain visual angle in one embodiment of the application.

Fig. 2 is shown as schematic perspective view of the silicon ingot excavation machine under another visual angle in one embodiment of the application.

Fig. 3 is shown as the side view of silicon ingot excavation machine in one embodiment of the application.

Fig. 4 is shown as the top view of silicon ingot excavation machine in one embodiment of the application.

Fig. 5 is shown as the structural schematic diagram of Workpiece tilting device.

Fig. 6 is shown as silicon ingot excavation machine in one embodiment of the application and is implementing the flow diagram in the operation of silicon ingot evolution.

Specific embodiment

Presently filed embodiment is illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book understands other advantages and effect of the application easily.

In the following description, with reference to attached drawing, attached drawing describes several embodiments of the application.It should be appreciated that also can be used Other embodiments, and can be carried out without departing substantially from spirit and scope mechanical composition, structure, electrically with And operational change.Following detailed description should not be considered limiting, and the range of embodiments herein Only limited by the claims for the patent announced.Term used herein is merely to describe specific embodiment, and be not It is intended to limit the application.The term of space correlation, for example, "upper", "lower", "left", "right", " following ", " lower section ", " lower part ", " top ", " top " etc. can be used in the text in order to an elements or features and another element or spy shown in explanatory diagram The relationship of sign.

Although term first, second etc. are used to describe various elements herein in some instances, these elements It should not be limited by these terms.These terms are only used to distinguish an element with another element.For example, first turn It can be referred to as the second steering swing to swinging, and similarly, the second steering, which is swung, can be referred to as the first steering swing, and The range of various described embodiments is not departed from.

In relevant silicon ingot evolution operation, there are silicon ingot evolution operating efficiency is low and the shape because not considering silicon ingot crystal orientation Condition and the problems such as make the silico briquette poor performance after evolution.Therefore, to those skilled in the art, it is necessary to research and develop one Kind silicon ingot excavation machine reduces the overall cost of silicon ingot evolution in order to improve the cutting operation efficiency of silicon ingot evolution, and can make Obtaining the silico briquette that evolution is formed has preferable performance.

It should be noted that the application silicon ingot excavation machine can be applied in the evolution operation of silicon ingot.Existing silicon ingot is generally Rectangular parallelepiped structure, by silicon ingot excavation machine to silicon ingot carry out evolution cutting so that silicon ingot formed after evolution cutting process it is several A smaller silico briquette (or referred to as silicon rod), and the silico briquette (or silicon rod) formed is whole also in rectangular parallelepiped structure.

Referring to FIG. 1 to FIG. 4, wherein, Fig. 1 is shown as in one embodiment of the application silicon ingot excavation machine under a certain visual angle Schematic perspective view, Fig. 2 are shown as stereochemical structure signal of the silicon ingot excavation machine under another visual angle in one embodiment of the application Figure, Fig. 3 are shown as the side view of silicon ingot excavation machine in one embodiment of the application, and Fig. 4 is shown as silicon ingot in one embodiment of the application The top view of excavation machine.

In Fig. 1 to Fig. 4 illustrated embodiment, the silicon ingot excavation machine include: base 1 and on base 1 first Cutter device 2 and the second cutter device 3.

Base 1 is the main element of silicon ingot excavation machine.Preferably, the volume and weight of base 1 are larger, it is bigger to provide Mounting surface and more firm complete machine stable degree.In actual application, base 1 may include pedestal and the installation on pedestal Structure, the mounting structure can such as installation frame, including installation column and installation crossbeam etc..According to evolution process, base 1 can Sequentially it is equipped with the functional areas such as the first cutting area and the second cutting area.

First cutter device is used to implement the first cutting operation to silicon ingot, forms the first silicon cube.In the present embodiment, sharp The first cutting operation can be implemented to silicon ingot according to the crystal orientation of silicon ingot with the first cutter device, for example, the first cutter device is suitable The crystal orientation of silicon ingot cut.

In the present embodiment, the first cutter device 2 may include the first workbench 21 and the first cutter unit 23.First work Platform 21 has the multiple first cutting wheel groups being oppositely arranged and the first cutting line for carrying silicon ingot 10, the first cutter unit 23, First cutting line, which is sequentially around in each first cutting wheel 233 in the multiple first cutting wheel group and forms multiple first, to be cut Secant section 234, wherein multiple first cutting line segments 234 in the first cutter unit 23 are right for the crystal orientation according to silicon ingot 10 Silicon ingot 10 implements the first cutting operation, forms multiple first silicon cubes.In practical applications, in the mistake for implementing the first cutting operation Cheng Zhong is to contact silicon by the first cutting line segment 234 by the relative displacement of multiple first cutting line segments 234 and silicon ingot to be cut Ingot simultaneously cuts silicon ingot 10 during relative displacement.Therefore, in the silicon ingot excavation machine of the application, the first workbench 21 and first At least one of cutter unit 23 is arranged to can be mobile relative to another one.That is, in one embodiment, the first workbench 21 To be fixedly installed, and the first cutter unit 23 is set as to move relative to the first workbench 21.In another embodiment, First cutter unit 23 is fixed setting, and the first workbench 21 is set as to move relative to the first cutter unit 23.Again In a kind of embodiment, the first workbench 21 is movable setting, and the first cutter unit 23 is also movable setting, the first cutting Unit 23 and the first workbench 21 are mutually shifted.

As shown in Figures 1 to 4, in the present embodiment, the first cutter unit 23 is set to the top of the first workbench 21.It is described First cutter unit includes the left cutting rack 231 (cutting rack before alternatively referred to as) being oppositely arranged and right cutting rack 232 is (alternatively referred to as Cutting rack afterwards), left cutting rack 231 and right cutting rack 232 along X to being oppositely arranged, the left cutting rack 231 and the right cutting rack Multiple first cutting wheels 233 are equipped on 232, first cutting wheel on the left cutting rack 231 of same position is cut with right cut First cutting wheel on frame 232 forms a first cutting wheel group, is sequentially around in the multiple first by the first cutting line Each first cutting wheel 233 in cutting wheel group forms multiple first cutting line segments 234.In practical applications, the first cutting line It is sequentially around in each first cutting wheel 233 and forms multiple first cuttings line segments 234 and under type realization such as specifically can be used: assuming that left Multiple first cutting wheels 233 being arranged on cutting rack 231 can be respectively designated as F₁、F₂、F₃、……、F_n-1、F_n, right cutting rack 232 Multiple first cutting wheels 233 of upper setting can be respectively designated as R₁、R₂、R₃、……、R_n-1、R_n, wherein the first cutting wheel F₁With One cutting wheel R₁Form a first cutting wheel group, the first cutting wheel F₂With the first cutting wheel R₂Form first cutting wheel Group ... ..., the first cutting wheel F_nWith the first cutting wheel R_nForm a first cutting wheel group.First cutting line is single continuous Cutting line, when by the first cutting line winding, with the first cutting wheel F from the left cutting rack₁For beginning, the first cutting line It can be according to F₁、R₁、R₂、F₂、F₃、R₃、……、F_n-1、R_n-1、R_n、F_nWinding sequence sequentially wind.In addition, from the foregoing, it will be observed that first Cutting wheel F₁With the first cutting wheel R₁Form a first cutting wheel group, the first cutting wheel F₂With the first cutting wheel R₂Composition one First cutting wheel group ... ..., the first cutting wheel F_nWith the first cutting wheel R_nA first cutting wheel group is formed, therefore, the of winding One cutting line is just oppositely arranged multiple first cutting wheel groups by (such as left and right directions) in transverse direction and forms multiple first cuttings Line segment 234, and each first cutting line segment 234 is to be oppositely arranged in left-right direction.In addition, two neighboring first cutting line What the line spacing between section 234 was determined by the spacing between two neighboring first cutting wheel group.If arbitrary neighborhood two first are cut The spacing cut between wheel group is identical, then, the line spacing between all two neighboring first cutting line segments 234 is all the same.But simultaneously It is not limited, in other alternative embodiments, for example, the line spacing between each first cutting line segment 234 can be according to silicon ingot Evolution requires and is set as unequal.In this way, this multiple first cutting line segment 234 is alternatively arranged and is parallel to each other, can be formed First cutting gauze.Optionally, the first cutting line may be, for example, diamond wire.

Since the first cutter unit 23 is set to the top of the first workbench 21, the first workbench 21 and the first cutting At least one of unit 23 is equipped with lift drive mechanism.In the present embodiment, the first cutter unit 23 is equipped with elevator drive machine Structure.The lift drive mechanism can further comprise: riser guide, lifting slider and lifting driving source, wherein the lifting (in the present embodiment, the lifting direction is Z-direction) can be arranged along lifting direction in guide rail, such as along the installation of installation frame Column setting, the lifting slider are set on two cutting racks and match with the riser guide.To make the first cutting list The stability of first 23 lifting and translocatings, can configure two riser guides, the two riser guides are located at corresponding cutting rack Opposite sides.The lifting driving source then may include the ball-screw and servo motor being arranged along the vertical direction, ball-screw tool There are high-precision, invertibity and efficient feature, in this way, passing through the cooperation of servo motor and ball-screw, it is ensured that the first cutting The precision of the lifting and translocating in the vertical direction of unit 23.Certainly, the lifting driving source can also make other selections, for example, In certain embodiments, the lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein described (in the present embodiment, the lifting rack rails is arranged along Z-direction), the driving gear and institute is arranged along vertical mode in lifting rack rails Lifting rack rails engagement is stated, the lifting driving motor is for driving the driving gear.In this way, by the lifting driving source, Two cutting racks in the first cutter unit can be driven to carry out lifting and translocating in the vertical direction along the riser guide.

Particularly, in some embodiments, in two cutting racks being oppositely arranged in first cutter unit extremely Few one can be made to be biased to movement relative to another one.By taking the first cutter unit 23 in schema as an example, the left cutting rack of left and right settings At least one of 231 and right cutting rack 232 can be made to be biased to movement.In specific implementation, the left cutting rack 231 and right cut Cutting at least one of frame 232 can realize that deviation is mobile (that is, the relatively right cutting rack of left cutting rack 231 by offset driving mechanism 232, which make to be biased to move perhaps right cutting rack 232, makees to be biased to movement or left cutting rack 231 and right cut relative to left cutting rack 231 Cutting frame 232 can be biased to move).Using above-mentioned offset driving mechanism, it can be achieved that by the left cutting rack 231 being oppositely arranged and right cut It cuts at least one of frame 232 to be designed as to be biased to move relative to another one, so that left cutting rack 231 and right cutting rack 232 It is (spacing and right cutting rack 232 and silicon ingot 10 between left cutting rack 231 and silicon ingot 10 setting up and down for silicon ingot 10 Between spacing it is not identical, that is, be set around in the first cutting wheel group it is multiple first cutting line segments 234 and silicon ingot cutting angle In the acute angle or obtuse angle of on-right angle), so that the part being located under in any first cutting line segment 234 is cut in cutting operation Secant section first contacts silicon ingot 10 in upper part cutting line segment than being located at, then cutting line segment 234 from silicon ingot subsequent first It when 10 outlet, is then located in the first cutting line segment 234 in upper part cutting line segment than being located at the part cutting line under Silicon ingot 10 is left and outlet after section, in this way, 10 surface of silicon ingot of the part cutting line segment outlet under can prevent, avoid at least It is the reduction of the situation for chipping occur, the surface of silicon ingot 10 is farthest protected, improves the cut quality of silicon ingot 10.Into one Step ground can require according to cutting technique in practical applications and adjust mutual setting up and down, the example of two cutting racks in due course Such as, cutting technique require in require silicon ingot 10 top (or bottom) cutting surfaces cutting requirement it is higher, then will be relative to Lower and relative to the bottom of workpiece to be cut (or top) cutting is arranged in the cutting wheel group at the top (or bottom) of silicon ingot 10 Wheel group is arranged upper.Further more, since the cutting angle of the first cutting line segment 234 and silicon ingot 10 is in the acute angle or obtuse angle of on-right angle, First cutting line segment 234 not will receive the frontal compression of silicon ingot 10, slows down the damage of the first cutting line, extends the first cutting The service life of line.

In addition, in some embodiments, in two cutting racks being oppositely arranged in first cutter unit at least One can make separate or close movement relative to another one.By taking the first cutter unit 23 as an example, the left cutting rack 231 of left and right settings It can make separate or close movement at least one of right cutting rack 232.In specific implementation, the left cutting rack 231 It can be realized by coil holder driving mechanism at least one of right cutting rack 232 far from or close to (that is, left cutting rack 231 is opposite Right cutting rack 232 makees the relatively left cutting rack 231 of separate or close perhaps right cutting rack 232 and makees separate or close or left cut to cut Frame 231 and right cutting rack 232 can be separate or close).Using above-mentioned coil holder driving mechanism, it can be achieved that the left cut that will be oppositely arranged It cuts at least one of frame 231 and right cutting rack 232 to be designed as to be biased to move relative to another one, so that left cutting rack 231 Spacing between right cutting rack 232 changes, the Cutting Length for cutting line segments 234 so as to adjust multiple first, so as to The silicon ingot 10 of different specification size is adapted to, and makes the Cutting Length of the first cutting line segment 234 suitable with 10 phase of silicon ingot to be cut With (avoiding the first cutting line segment 234 too long or too short), cutting efficiency and cut quality are improved.

Certainly, for the first cutter unit 23, on two cutting racks or base 1 also settable corresponding conducting wire, winding, Silk, tension mechanism etc. are arranged, for realizing the guiding of the first cutting line, tension adjustment and winding, row's silk etc., about conducting wire, volume Around, row's silk, the setting such as tension mechanism, details are not described herein.

First workbench 21 be it is horizontally disposed, be used for horizontal bearing silicon ingot 10.In the present embodiment, as previously mentioned, first Cutter unit 23 is set to the top of the first workbench 21, and the first workbench 21 and 23 OQ t of the first cutter unit are mobile, because This, to enable the first cutter unit 23 to be cut along the crystal orientation of silicon ingot 10, when 21 horizontal bearing silicon ingot of the first workbench When 10, the crystal orientation of silicon ingot 10 be should be and the consistent vertical direction of lifting moving.In the present embodiment, the crystal orientation of silicon ingot 10 can be such as It is the normal normal (that is, along direction of bottom surface to the top surface of silicon ingot 10) along the bottom surface of silicon ingot 10, therefore, when the first work When 21 horizontal bearing silicon ingot 10 of platform, the bottom surface of silicon ingot 10 is resisted against the first workbench 21.

In addition, the first workbench 21 is equipped with corresponding multiple with the first cuttings line segments 234 multiple in the first cutter unit 23 First cutting seam 211.In practical applications, the first cutting seam 211 is notching construction, the width with certain depth and notch Degree is greater than the line footpath of the first cutting line segment 234, in this way, the first cutting line segment 234 can be fallen into after cutting out silicon ingot 10 completely In first cutting seam 211, while realizing that silicon ingot 10 is cut, protection the first cutting line segment 234 can be played the role of, avoid the One cutting line section 234 and the first workbench 21 generate friction and damage.

When using the first cutter device 2 to silicon ingot 10 implement the first cutting operation when, first by the first workbench 21 carrying to The silicon ingot 10 of cutting, so that the crystal orientation of silicon ingot 10 to be cut is to drive with the consistent vertical direction of lifting moving, recycling lifting Motivation structure declines the first cutter unit 23, by multiple first cutting line segments 234 in the first cutter unit 23 during decline Start cutting after touching silicon ingot 10 until completely through (crystal orientation of multiple first cutting line segments 234 along silicon ingot 10 of silicon ingot 10 Silicon ingot 10 is implemented to cut), multiple first silicon cubes 11 are formed, at this point, multiple first cutting line segments 234 stay in accordingly It is subsequent in first cutting seam 211, to which the multiple first silicon cubes 11 formed are transferred out of the first workbench 21 and then are passed through Lift drive mechanism rises the first cutter unit to reset.

To make on the first workbench 21 of 10 feeding of silicon ingot to be cut to the first cutter device 2, the application silicon ingot Excavation machine further includes material containing vehicle 4 and feeding transfer device 5.

Material containing vehicle 4 is used for the delivery of silicon ingot 10 to feeding area.In the present embodiment, material containing vehicle 4 may be, for example, AGV (Automated Guided Vehicle) trolley, AGV trolley are equipped with electricity magnetically or optically equal homing guidances device, can be along setting Fixed guide path traveling, is able to achieve unmanned carrying.

Feeding transfer device 5 is used to silicon ingot 10 being transferred to the first workbench 21 by feeding area.In the present embodiment, on Expect transfer device 5 more can include: loading guide 51 and the transfer bed 53 on loading guide 51.

Loading guide 51 is layed in the feeding area and first cutting area, and (the first workbench 21 is located at the first cutting Area) between, specifically, loading guide 51 is layed in the lower section of the feeding area and the first workbench 21 and is arranged along Y-direction.It is full Movement of the laying and transfer bed 53 of sufficient loading guide 51 on loading guide 51, the first workbench 21 are hollow design, In certain embodiments, the first workbench 21 may include be oppositely arranged two mounting structures (loading guide 51 i.e. be located at two Between mounting structures), two mounting structures all have a supporting part, so that belonging to two supports of two mounting structures Portion may make up one for carrying the support face of silicon ingot 10.In addition, being so that transfer bed 53 can realize stably translational in loading guide 51, double Guide Rail Designs can be used in loading guide 51, that is, use two loading guides 51, the two loading guides 51 are arranged parallel.

Transfer bed 53 can carry silicon ingot 10.In the present embodiment, transfer bed 53 can also configure hoisting mechanism, for be lifted or Decline the silicon ingot 10 of carrying.

Before by 10 feeding of silicon ingot to the first workbench 21, can also position correction be carried out to silicon ingot 10.For this purpose, the application Silicon ingot excavation machine further includes charging positioning device, and the charging positioning device includes that side surface positioning device 61 and position adjust component (not showing in the drawings).Side surface positioning device 61 is set to the side of the feeding area.In the present embodiment, side surface positioning device 61 include two supporting beams, movable several ejections towards the feeding area middle section of setting in each supporting beam Structure.The position adjusts component and is set on the table top of transfer bed 53 to contact with the silicon ingot 10 carried.In the present embodiment, It is that universal ball end or machine with rotary circular adjust head that the position, which adjusts component,.In some embodiments, in the platform of transfer bed 53 Settable multiple universal ball ends or machine with rotary circular adjust head on face.For example, five ten thousand can be arranged on the table top of transfer bed 53 To bulb, wherein four universal ball ends are uniformly distributed, constitute the four of a regular figure (such as: square, rectangle, diamond shape etc.) A angle, another universal ball end are then located at center.

When implementing the feeding operation of silicon ingot 10, first silicon ingot 10 is delivered to feeding area by material containing vehicle 4；Again by transfer bed 53 Feeding area is moved to along loading guide 51 and (above process can also be such that transfer bed first positioned at the lower section of silicon ingot 10 53 are moved to feeding area along loading guide 51, then are delivered silicon ingot 10 to feeding area by material containing vehicle 4 and silicon ingot 10 is located at The top of transfer bed 53)；Transfer bed 53 is lifted using hoisting mechanism, touches silicon ingot 10 until jacking silicon ingot 10；Utilize feeding Positioning device carries out positioning calibration to silicon ingot, by side surface positioning device according to predetermined amount driving ejecting structure ejection, by the top Structure ejection silicon ingot 10 out, the opposite transfer bed under the ejection of ejecting structure and under the assistance of position adjusting component of silicon ingot 10 53 movements, to adjust position；The first workbench 21 of the first cutting area is moved to along loading guide by transfer bed 53；Transfer Platform 53 is declined using hoisting mechanism, is driven silicon ingot 10 to decline and is placed on the first workbench 21, completes the feeding of silicon ingot 10 simultaneously First cutting operation is implemented to silicon ingot 10 using the first cutter device 2.

After using material containing vehicle 4 and feeding transfer device 5 by 10 feeding of silicon ingot to the first workbench 21 to be cut, First cutting operation is implemented to silicon ingot 10 using the first cutter device 2, that is, implement the first cutting along the crystal orientation of silicon ingot 10 Operation forms multiple first silicon cubes 11.

The application silicon ingot excavation machine further includes silicon ingot revolving platform 7 and workpiece transporter 8, wherein workpiece transporter 8 is used In multiple first silicon cubes 11 are transported on silicon ingot revolving platform 7 by the first workbench 21.

Silicon ingot revolving platform 7 can turnover area between the first cutter device 2 and the second cutter device 3, it is more for carrying A first silicon cube 11.In the present embodiment, silicon ingot revolving platform 7 is i.e. as between the first cutter device 2 and the second cutter device 3 Turnover device, using silicon ingot revolving platform 7, it is right by the first cutter device 2 temporarily to dispose before being sent into the second cutter device Silicon ingot 10 implements the multiple first silicon cubes 11 formed after the first cutting operation.

Workpiece transporter 8 is set between the first cutter device 2 and silicon ingot revolving platform 7, is used for multiple first silicon cubes 11 are transported on silicon ingot revolving platform 7 by the first workbench 21.In the present embodiment, workpiece transporter 8 is more can include: workpiece takes Put unit and mobile mechanism, wherein the mobile mechanism is for driving the workpiece picking and placing unit mobile, to utilize the workpiece Multiple first silicon cubes 11 are transported to silicon ingot revolving platform 7 by the first workbench 21 by picking and placing unit.

The workpiece picking and placing unit is for picking and placing multiple first silicon cubes 11.In the present embodiment, the workpiece picks and places single Member may include two extracting pieces being oppositely arranged, and two extracting pieces can be linked together by a connection structure.Each The extracting piece is substantially L-shaped, it may include a support portion and the supporting part set on the support plate bottom, two be oppositely arranged A extracting piece can surround a support space.

The mobile mechanism is more can include: along the traveling mobile unit of the first workbench to silicon ingot revolving platform, lifting is moved Moving cell, telescopic moving unit and mobile control unit.Wherein, the mobile control unit and the traveling mobile unit, The lifting moving unit and telescopic moving unit connection execute corresponding movement for controlling each mobile unit. The control that the mobile control unit executes can include: the lifting is controlled according to the location information of multiple first silicon cubes 11 Mobile unit and the telescopic moving unit drive the workpiece picking and placing unit mobile to extract multiple first silicon cubes 11；Control The traveling mobile unit controlled after driving the workpiece picking and placing unit to be moved to silicon ingot revolving platform 7 the lifting moving unit and The telescopic moving unit drives the workpiece picking and placing unit mobile multiple first silicon cubes 11 are placed in silicon ingot revolving platform 7 On.

The location information according to multiple first silicon cubes 11 and control the lifting moving unit and the flexible shifting Moving cell drives the workpiece picking and placing unit mobile to extract multiple first silicon cubes 11, specifically can include: ensure the workpiece Two extracting pieces in picking and placing unit are located at the outside of multiple first silicon cubes 11, if it is not, stretching as described in so first control Mobile unit drives two extracting pieces in the workpiece picking and placing unit to be moved outwardly (far from the first silicon cube 11), so that described Extracting piece is located at the outside of multiple first silicon cubes 11, that is, the extracting piece will not interfere with multiple first silicon cubes 11；Control The lifting moving unit drives two extracting piece declines until the supporting part of the extracting piece will be lower than multiple first silicon cubes 11 bottom；Controlling the telescopic moving unit drives two extracting pieces to be moved inwardly (close to the first silicon cube 11) until described The supporting part of extracting piece and multiple first silicon cubes 11 have satisfactory overlapping region, generally, the branch of the extracting piece The side for holding portion and multiple first silicon cubes 11 has a gap, to avoid the support portion because directly contacting or colliding multiple the One silicon cube 11 and generate damage；Controlling the lifting moving unit drives two extracting pieces to rise until the extracting piece is held The contact of support portion and support live the bottom of multiple first silicon cubes 11, continue to control two extracting pieces of the lifting moving unit drive Rise, rises so that two extracting pieces extract multiple first silicon cubes 11 and be detached from the first workbench 21.

The control traveling mobile unit controls institute after driving the workpiece picking and placing unit to be moved to silicon ingot revolving platform 7 Stating lifting moving unit and the telescopic moving unit drives the workpiece picking and placing unit mobile with by multiple first silicon cubes 11 It is placed on silicon ingot revolving platform 7, specifically can include: control the traveling mobile unit and drive the workpiece picking and placing unit and its mention The multiple first silicon cubes 11 taken are moved in turnover area the top for corresponding to silicon ingot revolving platform 7；Control the lifting moving unit It drives two extracting piece declines to arrive silicon ingot revolving platform 7 until multiple first silicon cubes 11 contradict, continues to control the lifting moving Unit drives two extracting piece declines, and the bottom of supporting part and multiple first silicon cubes 11 in two extracting pieces is detached from, at this point, Multiple first silicon cubes are placed on silicon ingot revolving platform 7 completely；Controlling the telescopic moving unit drives the workpiece to pick and place Two extracting pieces in unit are moved outwardly (far from the first silicon cube 11), so that the extracting piece is located at multiple first silicon cubes 11 outside, that is, the extracting piece will not interfere with multiple first silicon cubes 11；It controls the lifting moving unit and drives two Extracting piece rises.

In practical applications, the traveling mobile unit may include traveling guide rail, traveling sliding block and traveling driving source, In, the traveling guide rail can be horizontally disposed with along direction of travel and (be arranged along Y-direction), such as set along the installation crossbeam of installation frame It sets, the traveling sliding block is set to the bottom of the connection structure of the workpiece picking and placing unit and matches with the traveling guide rail. The stability shifted to make the workpiece picking and placing unit advance can configure two traveling guide rails, the two traveling guide rails difference On two installation crossbeams being oppositely arranged.In some embodiments, the traveling driving source then may include along traveling side To the ball-screw and servo motor of setting.In some embodiments, the traveling driving source may include traveling rack rails, driving Gear and traveling driving motor, wherein the traveling rack rails is arranged and (is arranged along Y-direction) along direction of travel, the driving gear It is engaged with the traveling rack rails, the traveling driving motor is for driving the driving gear.

The telescopic moving unit may include telescopic rail, flexible sliding block and flexible driving source, wherein described stretch is led Rail can (i.e. along X to setting) horizontally disposed along telescopic direction in the bottom of the connection structure of the workpiece picking and placing unit, it is described to stretch Contracting sliding block is set on the first mounting surface of an exchanging structure and matches with the telescopic rail, wherein the exchanging structure can For example, triangle exchanging structure.For the stability for making the flexible displacement of the workpiece picking and placing unit, match for each extracting piece Two telescopic rails are set, the two telescopic rails are located at the opposite sides of the connection structure.In some embodiments, The flexible driving source then may include the ball-screw and servo motor along telescopic direction setting.In some embodiments, institute Stating flexible driving source may include flexible rack rails, driving gear and telescopic drive motor, wherein the flexible rack rails is along telescopic direction Setting (i.e. along X to setting), the driving gear is engaged with the flexible rack rails, described in the telescopic drive motor is used to driving Drive gear.

The lifting moving unit may include riser guide, lifting slider and lifting driving source, wherein the lifting is led Rail can be vertically arranged along lifting direction and (be arranged along Z-direction) the second mounting surface of exchanging structure in the workpiece picking and placing unit On, the lifting slider is set in the extracting piece and matches with the riser guide, wherein the exchanging structure can example For example triangle exchanging structure.For the stability for making the workpiece picking and placing unit lifting and translocating, configured for each extracting piece Two riser guides, the two riser guides are located at the opposite sides of the exchanging structure.In some embodiments, institute Stating lifting driving source then may include the ball-screw and servo motor along the setting of lifting direction.In some embodiments, described Lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein the lifting rack rails is set along lifting direction It sets and (is arranged along Z-direction), the driving gear is engaged with the lifting rack rails, and the lifting driving motor is for driving the drive Moving gear.

In this way, multiple first silicon cubes 11 can be transported to silicon ingot week by the first workbench 21 using workpiece transporter 8 On turntable 7.

The application silicon ingot excavation machine may also include trimming leather jacket and set 71, for generating silicon ingot 10 after the first cutting operation Flaw-piece removal.Silicon ingot is being implemented using the first cutter device 2 silicon ingot 10 can be cut into multiple the in first cutting operation One silicon cube 11, wherein the two sides of silicon ingot 10 just will form flaw-piece, each flaw-piece contains a side of silicon ingot 10.Institute Stating flaw-piece can collect and recycle again.

In the present embodiment, trimming leather jacket, which sets 71, can include at least sucker, and the flaw-piece is sucked using the sucker and incites somebody to action It is transferred out.In some embodiments, the trimming leather jacket of the application silicon ingot excavation machine configuration, which sets 71, can be set to the first cutting Between area and turnover area, after implementing the first cutting operation to silicon ingot using the first cutter device 2, it can be set first with trimming leather jacket The first neighbouring flaw-piece 111 (the first flaw-piece 11 is located at the front end of silicon ingot, adjacent to the sucker) is sucked simultaneously sucker in 71 It is transferred out, multiple first silicon cubes 11 are transported to silicon ingot week by the first workbench 21 by workpiece transporter 8 to be utilized (the second flaw-piece 112 is located at the rear end of silicon ingot, through turning on turntable 7 and then using the sucker by the second neighbouring flaw-piece 112 After fortune, the second flaw-piece 112 is adjacent to the sucker) it is sucked and is transferred out.In some embodiments, the application silicon ingot Excavation machine is configurable to can configure two suckers, the two suckers are located at the rear and front end of the first cutting area, when utilizing first After cutter device 2 implements the first cutting operation to silicon ingot, so that it may using the two sucker suckers respectively by corresponding first flaw-piece 111 and second flaw-piece 112 be sucked and be transferred out.In some embodiments, the application silicon ingot excavation machine is configurable can Configure two suckers, the two suckers are located at the rear and front end in the area Zhou Zhuan, when using workpiece transporter 8 by multiple first After silicon cube 11 is transported on silicon ingot revolving platform 7 by the first workbench 21, so that it may respectively will be right using the two sucker suckers The first flaw-piece 111 and the second flaw-piece 112 answered are sucked and are transferred out.

In some embodiments, the trimming leather jacket, which is set, may also include flaw-piece structure for conveying, the flaw-piece structure for conveying It may be, for example, flaw-piece conveyer belt, in this way, flaw-piece can be discharged to the flaw-piece conveyer belt after flaw-piece is sucked in the sucker, by The flaw-piece is transferred out by the flaw-piece conveyer belt.

In some embodiments, the trimming leather jacket, which is set, may also include scrap-collecting box, and the scrap-collecting box is located at Outside base, in this way, flaw-piece can be delivered to after flaw-piece is sucked in the sucker in the scrap-collecting box of outside.

In some embodiments, the trimming leather jacket, which is set, may also include flaw-piece structure for conveying and scrap-collecting box, wherein The scrap-collecting box is located at outside base, and the flaw-piece structure for conveying is between the sucker and the scrap-collecting box, institute Stating flaw-piece structure for conveying may be, for example, flaw-piece conveyer belt, in this way, can discharge flaw-piece to described after flaw-piece is sucked in the sucker On flaw-piece conveyer belt, the flaw-piece is transferred in the scrap-collecting box by the flaw-piece conveyer belt.

Second cutter device is used to implement the second cutting operation to the first silicon cube, forms the second silicon cube.In this implementation In example, the second cutting operation, example can be implemented to the first silicon cube according to the crystal orientation of the first silicon cube using the second cutter device Such as, the second cutter device is cut along the crystal orientation of the first silicon cube.

In the present embodiment, the second cutter device 3 may include the second workbench 31 and the second cutter unit 33.Second work Platform 31 is located at the second cutting area, and for carrying the first silicon cube 11, the second cutter unit 33 has multiple second be oppositely arranged Cutting wheel group and the second cutting line, what second cutting line was sequentially around in the multiple second cutting wheel group each second cuts It cuts wheel 333 and forms multiple second cutting line segments 334, wherein multiple second cutting line segments 334 in the second cutter unit 33 are used for Second cutting operation is implemented to the first silicon cube 11 according to the crystal orientation of the first silicon cube 11, forms multiple second silicon cubes.? It is by multiple second cutting line segments 334 and to be cut first during implementing the second cutting operation in practical application The relative displacement of silicon cube 11 contacts the first silicon cube 11 by the second cutting line segment 334 and cuts first during relative displacement Silicon cube 11.Therefore, in the application silicon ingot excavation machine, at least one of the second workbench 31 and the second cutter unit 33 are set Being set to can be mobile relative to another one.That is, in one embodiment, the second workbench 31 is fixed setting, and the second cutting is single Member 33 is set as to move relative to the second workbench 31.In another embodiment, the second cutter unit 33 is that fixation is set It sets, and the second workbench 31 is set as to move relative to the second cutter unit 33.In yet another embodiment, the second work Platform 31 is movable setting, and the second cutter unit 33 is also movable setting, 31 phase of the second cutter unit 33 and the second workbench It is mutually mobile.

In the present embodiment, the second cutter unit 33 is set to the side of the second workbench 31.Second cutter unit 33 includes The upper cutting rack 331 and lower cutting rack 332 being oppositely arranged are equipped on the upper cutting rack 331 and the lower cutting rack multiple Second cutting wheel 333, second cutting wheel on the upper cutting rack 331 of same position are cut with one second on lower cutting rack Wheel one the second cutting wheel group of composition is cut, each second in the multiple second cutting wheel group is sequentially around in by the second cutting line Cutting wheel 333 forms multiple second cutting line segments 334.In practical applications, the second cutting line is sequentially around in each second cutting Wheel 333, which forms multiple second cutting line segments 334, specifically can be used under type realization such as: assuming that is be arranged on upper cutting rack 331 is more A second cutting wheel 333 can be respectively designated as U₁、U₂、U₃、……、U_n-1、U_n, multiple second be arranged on lower cutting rack 332 cut L can be respectively designated as by cutting wheel 333₁、L₂、L₃、……、L_n-1、L_n, wherein the second cutting wheel U₁With the second cutting wheel L₁Composition one Second cutting wheel group, the second cutting wheel U₂With the second cutting wheel L₂Form a second cutting wheel group ... ..., the second cutting wheel U_n With the second cutting wheel L_nForm a second cutting wheel group.Second cutting line is single continuous cutting line, by the second cutting When line winding, with the second cutting wheel U from the upper cutting rack 331₁For beginning, the second cutting line can be according to U₁、L₁、L₂、U₂、 U₃、L₃、……、U_n-1、L_n-1、L_n、U_nWinding sequence sequentially wind.In addition, from the foregoing, it will be observed that the second cutting wheel U₁With the second cutting Take turns L₁Form a second cutting wheel group, the second cutting wheel U₂With the second cutting wheel L₂A second cutting wheel group ... ... is formed, Second cutting wheel U_nWith the second cutting wheel L_nA second cutting wheel group is formed, therefore, the second cutting line of winding is just by vertically Direction (such as up and down direction) is oppositely arranged multiple second cutting wheel groups and forms multiple second cuttings line segments 334, and each the Two cutting line segments 334 are to be oppositely arranged along the vertical direction.In addition, the line spacing between two neighboring second cutting line segment 334 It is determined by the spacing between two neighboring second cutting wheel group.If the spacing phase between two the second cutting wheel groups of arbitrary neighborhood Together, then, the line spacing between all two neighboring second cutting line segments 334 is all the same.But be not limited thereto, other can It selects in embodiment, for example, the line spacing between each second cutting line segment 334 can require according to the first silicon cube evolution and is arranged It is unequal.In this way, this multiple second cutting line segment 334 is alternatively arranged and is parallel to each other, the second cutting gauze can be formed.It can Selection of land, the second cutting line may be, for example, diamond wire.

Since the second cutter unit 33 is set to the side of the second workbench 31, the second workbench 31 and the second cutting At least one of unit 33 is equipped with translational drive mechanism.In the present embodiment, the second workbench 31 is equipped with translational drive mechanism. The translational drive mechanism can further comprise: translating rails, translator slider and driven in translation source, wherein the translation is led Rail can be arranged along translation direction and (be arranged along Y-direction), and the translator slider is set on two cutting racks and leads with the translation Rail matches.For the stability for making the translation displacement of the second workbench 31, it can configure two translating rails, the two translating rails It is located at the opposite sides of corresponding second workbench 31.The driven in translation source then may include the rolling along translation direction setting Ballscrew and servo motor, ball-screw have the characteristics that high-precision, invertibity and efficient, in this way, by servo motor with The cooperation of ball-screw, it is ensured that the second workbench 31 translates the precision of displacement in a transverse direction.Certainly, the driven in translation Source can also make other selections, for example, in some embodiments, the driven in translation source may include translation rack rails, driving gear And pan drive motor, wherein the translation rack rails is arranged and (is arranged along Y-direction) along translation direction, the driving gear and institute Translation rack rails engagement is stated, the pan drive motor is for driving the driving gear.In this way, by the driven in translation source, Two cutting racks in the second cutter unit can be driven to carry out translation displacement in a transverse direction along the translating rails.

Particularly, in some embodiments, in two cutting racks being oppositely arranged in second cutter unit extremely Few one can be made to be biased to movement relative to another one.By taking the second cutter unit 33 as an example, upper cutting rack 331 setting up and down and incision Cutting at least one of frame 332 can make to be biased to movement.In specific implementation, in the upper cutting rack 331 and lower cutting rack 332 At least one can be realized by offset driving mechanism be biased to it is mobile (that is, upper cutting rack 331 descends cutting rack 332 to be biased to relatively Mobile perhaps lower cutting rack 332 makees to be biased to movement or upper cutting rack 331 relative to upper cutting rack 331 and lower cutting rack 332 is equal It can be biased to move).Using above-mentioned offset driving mechanism, it can be achieved that by the upper cutting rack 331 being oppositely arranged and lower cutting rack 332 At least one be designed as can relative to another one be biased to move so that upper cutting rack 331 and lower cutting rack 332 are relative to first It is front and back setting (spacing and lower cutting rack 332 and first between upper cutting rack 331 and the first silicon cube 11 for silicon cube 11 Spacing between silicon cube 11 is not identical, that is, multiple second cutting line segments 334 and the first silicon being set around in the second cutting wheel group The cutting angle of cube 11 is in the acute angle or obtuse angle of on-right angle), thus in cutting operation, in any second cutting line segment 334 Line segment is cut positioned at preceding part and first contacts the first silicon cube 11 than being located at posterior part cutting line segment, then subsequent Second cutting line segment 334 from when the first silicon 11 outlet of cube, be then in the second cutting line segment 334 be located at posterior part cutting line Section is than leaving the first silicon cube 11 and outlet after being located at preceding part cutting line segment, in this way, line segment is cut in preceding part 11 surface of the first silicon cube of outlet can prevent, avoid at least reducing the situation for chipping occur, farthest protect The surface of first silicon cube 11 improves the cut quality of the first silicon cube 11.Further, in practical applications, Ke Yigen Required according to cutting technique and adjust the mutual front and back setting of two cutting racks in due course, for example, cutting technique require in require the The cutting requirement of the cutting surfaces of the front (or rear portion) of one silicon cube 11 is higher, then by the front relative to the first silicon cube 11 The cutting wheel group at (or rear portion) is arranged in preceding and is arranged relative to the cutting wheel group of the rear portion of workpiece to be cut (or front) rear. Further more, since the cutting angle of the second cutting line segment 334 and the first silicon cube 11 is in the acute angle or obtuse angle of on-right angle, the second cutting Line segment 334 not will receive the frontal compression of the first silicon cube 11, slow down the damage of the second cutting line, extend the second cutting line Service life.

In addition, in some embodiments, in two cutting racks being oppositely arranged in second cutter unit at least One can make separate or close movement relative to another one.By taking the second cutter unit 33 as an example, upper cutting rack 331 setting up and down It can make separate or close movement at least one of lower cutting rack 332.In specific implementation, the upper cutting rack 331 It can be realized by coil holder driving mechanism at least one of lower cutting rack 332 far from or close to (that is, upper cutting rack 331 is opposite Lower cutting rack 332 makees the relatively upper cutting rack 331 of separate or close perhaps lower cutting rack 332 and makees separate or close or upper cutting Frame 331 and lower cutting rack 332 can be separate or close).Using above-mentioned coil holder driving mechanism, it can be achieved that will be oppositely arranged on cut It cuts at least one of frame 331 and lower cutting rack 332 to be designed as to be biased to move relative to another one, so that upper cutting rack 331 Spacing between lower cutting rack 332 changes, the Cutting Length for cutting line segments 334 so as to adjust multiple second, so as to The first silicon cube 11 of different specification size is adapted to, and makes the Cutting Length and to be cut first of the second cutting line segment 334 Silicon cube 11 is adapted and (avoids the second cutting line segment 334 too long or too short), improves cutting efficiency and cut quality.

Certainly, for the second cutter unit 33, on two cutting racks or base 1 also settable corresponding conducting wire, winding, Silk, tension mechanism etc. are arranged, for realizing the guiding of the second cutting line, tension adjustment and winding, row's silk etc., about conducting wire, volume Around, row's silk, the setting such as tension mechanism, details are not described herein.

Second workbench 31 be it is horizontally disposed, be used for the first silicon of horizontal bearing cube 11.In the present embodiment, such as preceding institute It states, the second cutter unit 33 is set to the side of the second workbench 31,33 relative translation of the second workbench 31 and the second cutter unit It is mobile, therefore, to enable the second cutter unit 33 to be cut along the crystal orientation of the first silicon cube 11, when the second workbench 31 When horizontal bearing the first silicon cube 11, the crystal orientation of the first silicon cube 11 should be and be moved in translation consistent horizontal direction.

Second workbench 31 is equipped with to be cut with the second cutting line segments 334 corresponding multiple second multiple in the second cutter unit 33 Slot 311.In practical applications, the second workbench 31 includes parallel arrangement of multiple bearing assemblies, the two neighboring carrying Cutting gap is installed between component as the second cutting seam 311, the width of the cutting gap is greater than the second cutting line segment 334 line footpath.In this way, the second cutter device 3, when implementing the second cutting operation to the first silicon cube 11, second cuts line segment 334 can cut the first silicon cube 11 in the case of falling into the second cutting seam 311, realize the cutting of the first silicon cube 11 While, protection the second cutting line segment 334 can be played the role of, the second cutting line segment 334 and the second workbench 31 is avoided to generate It rubs and damages.

When implementing the second cutting operation to the first silicon cube 11 using the second cutter device 3, first by the second workbench 31 The first silicon cube 11 to be cut is carried, so that the first silicon cube 11 to be cut from crystal orientation is and is moved in translation consistent level Direction is driving multiple second cutting line segments of second workbench 31 towards the second cutter unit 33 using translational drive mechanism 334 is mobile, and multiple second cuttings line segments 334 correspond to respective second cutting seam 311 and enter 31 inside of the second workbench and right The the first silicon cube 11 carried on second workbench 31 carries out cutting until (multiple second cuttings of completely cut off first silicon cube 11 Line segment 334 is implemented to cut along the crystal orientation of the first silicon cube 11 to the first silicon cube 11), multiple second silicon cubes 12 are formed, after It is continuous, to which the multiple second silicon cubes 12 formed are transferred out of the second workbench 31 and then pass through translational drive mechanism for second Workbench 31 makees the translation far from the second cutter unit 33 to reset.Wherein, during implementing the second cutting operation, second is cut Secant section 334 is always positioned in the second cutting seam 311.

As previously mentioned, can implement the first cutting according to the crystal orientation of silicon ingot 10 using the first cutter device 2 to silicon ingot 10 and make Industry, for example, the first cutter device 2 is cut along the crystal orientation of silicon ingot 10.Specifically, in the present embodiment, silicon ingot 10 Crystal orientation be, for example, along silicon ingot 10 bottom surface normal normal (that is, along direction of bottom surface to the top surface of silicon ingot 10), therefore, Silicon ingot 10 is on the first workbench 21 for being placed in the first cutter device 2 in a manner of the contact of bottom surface (that is, the first workbench 21 is held Hold in the palm the ground of silicon ingot 10), multiple first cuttings line segments 234 in the first cutter device 2 are from top to bottom along the crystalline substance of silicon ingot 10 To what is cut.Second workbench 31 and the second cutter unit 33 are arranged to relative translation in second cutter device 3, therefore, It remains to cut the first silicon cube 11 along the crystal orientation of the first silicon cube 11 to realize, certainly will need to the first silicon cube 11 carry out overturning operation.In the application silicon ingot excavation machine, work is additionally provided between silicon ingot revolving platform 7 and the second cutter device 3 Part turnover device 9.Using Workpiece tilting device 9, can the first silicon cube 11 on silicon ingot revolving platform 7 be overturn and is transported to Second workbench 31.

As shown in figure 5, being shown as the structural schematic diagram of Workpiece tilting device.In conjunction with Fig. 3 and Fig. 5, Workpiece tilting device 9 is wrapped It includes: bracket 91, clamping piece 93 and turnover driving mechanism 95.

Bracket 91 is set on the mounting structure of base 1, such as on the installation crossbeam of installation frame.In addition, bracket 91 Lifting moving can be realized by a lift drive mechanism.Bracket 91 can also be realized by a translational drive mechanism and is moved in translation.

93 axis of clamping piece is connected to bracket 91, for clamping the first silicon cube 11.In the present embodiment, clamping piece 93 can more wrap Include clamping ontology 931 and opposite two clamping parts 933,935 being set on clamping ontology 931.In some embodiments, two At least one of clamping part 933,935 is movable design, that is, at least one of two clamping parts 933,935 are arranged to It can be mobile relative to another one.In this way, the clamping spacing between adjustable two clamping parts 933,935, to adapt to different first silicon The size of cube 11.Such as, it will be assumed that adjacent to that 933 (example of clamping part of bracket 91 in two clamping parts 933,935 Such as, it can will be known as the first clamping part adjacent to bracket 91 clamping part 933, will be far from another clamping part in bracket 91 935 are known as the second clamping part) it is set as movable.In some embodiments, at least one in two clamping parts 933,935 Person is equipped with extension type element.Such as, it will be assumed that adjacent to that clamping part of bracket 91 in two clamping parts 933,935 933 (for example, can will adjacent to bracket 91 clamping part 933 be known as the first clamping part, will be far from bracket 91 another Clamping part 935 is known as the second clamping part) it is equipped with the grip block with telescoping mechanism, the telescoping mechanism may be, for example, with piston The cylinder or oil cylinder of bar, the grip block are implemented flexible under the driving of the telescoping mechanism.

Turnover driving mechanism 95 is connected between bracket 91 and clamping piece 93, for driving clamping piece 93 and its clamped The first silicon cube 11 make flip-flop movement.In the present embodiment, turnover driving mechanism 95 can such as air cylinder structure or cylinder structure, The cylinder body of the air cylinder structure or cylinder structure is to be articulated with bracket 91, and the piston rod of the air cylinder structure or cylinder structure is hinge It is connected to the clamping ontology 931 of clamping piece 93.

It should be noted that being moved in translation to meet Workpiece tilting device 9 can clamp to each on silicon ingot revolving platform 7 First silicon cube 11, silicon ingot revolving platform 7 may be, for example, hollow design, and in some embodiments, silicon ingot revolving platform 7 may include phase To two mounting structures (Workpiece tilting device 9 is located between two mounting structures) of setting, two mounting structures are all had One supporting part, so that two supporting parts for belonging to two mounting structures may make up one for carrying the first silicon cube 11 Support face.

When implementing overturning operation to the first silicon cube 11 using Workpiece tilting device 9, specifically can include: firstly, according to The position of first silicon cube 11 to be flipped on silicon ingot revolving platform 7, driving arm 91 is mobile, so that clamping piece 93 is close to be flipped The first silicon cube 11 and clamping piece 93 in be away from a clamping part 935 of bracket 91 and be located at the first silicon cube 11 to be flipped Lower section.Above-mentioned steps are more can include: the decline movement of driving arm 91, so that being away from the second folder of bracket 91 in clamping piece 93 Hold the lower section that portion 935 is located at the first silicon cube 11 to be flipped, the bottom surface of the second clamping part 935 and the first silicon cube 11 has one Gap；Driving arm 91 is moved in translation, so that clamping of the clamping piece 93 in the first silicon cube 11 to be flipped, clamping piece 93 The side of ontology 931 and the first silicon cube 11 has a gap, to avoid clamping ontology 931 because directly contacting or colliding the first silicon Cube 11 and generate damage.Alternatively, driving arm 91 is moved in translation, so that clamping piece 93 is close to the first silicon cube to be flipped 11, the side of the clamping ontology 931 in clamping piece 93 and the first silicon cube 11 has a gap, to avoid clamp ontology 931 because It directly contacts or collides the first silicon cube 11 and generate damage；The decline movement of driving arm 91, so that being away from clamping piece 93 Second clamping part 935 of bracket 91 is located at the lower section of the first silicon cube 11 to be flipped, the second clamping part 935 and the first silicon cube 11 bottom surface has a gap.Then, driving arm 91 rises movement, so that being away from the second folder of bracket 91 in clamping piece 93 Hold the bottom surface that portion 935 touches the first silicon cube 11；Drive 933 direction of the first clamping part in clamping piece 93 adjacent to bracket 91 Second clamping part 935 moves so that the first clamping part 933 contacts and press on the top surface of the first silicon cube 11, utilizes the first folder The cooperation for holding portion 933 and the second clamping part 935 is clamped the first silicon cube 11.Then, driving is used as turnover driving mechanism 95 air cylinder structure or cylinder structure overturns clamping piece 93 and its first clamped silicon cube 11, in the present embodiment, overturning Angle is, for example, 90 °.Finally, still can be by the movement of driving arm 91 (translational movement and lifting moving), by the first silicon of overturning Cube 11 is transported on the second workbench 31；It is subsequent, clamping piece is discharged, driving arm 91 playbacks.Thus, it can be seen that utilizing Workpiece tilting device 9 is transported to the second workbench 31 after the first silicon cube 11 on silicon ingot revolving platform 7 being overturn 90 °, so that First silicon cube 11 is changed to horizontal direction (that is, crystal orientation is by original by original vertical direction along bottom surface to top surface after 90 ° of overturning First vertical direction is changed to horizontal direction).

When the first silicon cube 11 on silicon ingot revolving platform 7 is overturn using Workpiece tilting device 9 and is transported to second After workbench 31, i.e., second cutting operation is implemented to the first silicon cube 11 using the second cutter device 3, that is, along first The crystal orientation of silicon cube 11 implements the second cutting operation, forms multiple second silicon cubes 12.

The application silicon ingot excavation machine, including the first cutter device and the second cutter device, wherein utilize the first cutter device The first cutting operation is implemented to form the first silicon cube to polycrystal silicon ingot according to the crystal orientation of polycrystal silicon ingot, is filled using the second cutting It sets according to the crystal orientation of the first silicon cube and the second cutting operation is implemented to form the second silicon cube to the first silicon cube.Relative to phase Pass technology, silicon ingot excavation machine disclosed in the present application not only can complete the automatic of silicon ingot in the case of removing from and cutting cutting gauze The side's of melting operation improves silicon ingot evolution efficiency, even more in evolution operation, has fully considered the crystal orientation situation of silicon ingot, thus Evolution may make to form the second silicon cube and there can be more preferably performance, for example, can reduce the second silicon cube generates cracking etc. Risk.

The whole flow process for being applied to the operation of silicon ingot evolution below for the silicon ingot excavation machine in Fig. 1 to Fig. 4 carries out specifically It is bright, it should be noted that, herein, the crystal orientation of silicon ingot 10 is, for example, the normal normal along the bottom surface of silicon ingot 10 (that is, along silicon ingot The direction of 10 bottom surface to top surface).

Silicon ingot 10 is delivered to feeding area, at this point, the bottom surface of silicon ingot 10 againsts material containing vehicle 4 by material containing vehicle 4.

Transfer bed 53 by being located at feeding area rises and jacking silicon ingot 10, at this point, silicon ingot 10 is detached from material containing vehicle 4.

Positioning calibration is carried out to silicon ingot using charging positioning device, drives ejection knot according to predetermined amount by side surface positioning device Structure ejection, by the ejecting structure ejection silicon ingot 10, silicon ingot 10 is under the ejection of ejecting structure and the position adjusts component Lower opposite transfer bed 53 is assisted to act, to adjust position.

Silicon ingot 10 is transferred to 21 top of the first workbench by transfer bed 53, transfer bed 53 declines so that silicon ingot 10 to be placed in On first workbench 21, the bottom surface of silicon ingot 10 againsts the first workbench 21, and the crystal orientation of silicon ingot 10 is upper and lower vertical direction.

First cutting operation is implemented to silicon ingot 10 using the first cutter device 2, specifically, declines the first cutter unit 23, Cutting being touched during decline after silicon ingot 10 by multiple first cuttings line segments 234 in the first cutter unit 23 until Completely through silicon ingot 10 (multiple first cutting line segments 234 are implemented to cut along the crystal orientation of silicon ingot 10 to silicon ingot 10), formed multiple First silicon cube 11, at this point, multiple first cutting line segments 234 stay in corresponding first cutting seam 211.

It is set using the trimming leather jacket between the first cutting area and turnover area by neighbouring the first flaw-piece (the first flaw-piece position In the front end of silicon ingot 10) it is transferred out.

Multiple first silicon cubes 11 are transported on silicon ingot revolving platform 7 by the first workbench 21 using workpiece transporter 8.

In the first cutting area, rises the first cutter unit 23 to reset, the next of feeding area will be located at by transfer bed 53 Silicon ingot 10 is transferred on the first workbench 21；In turnover area, the trimming leather jacket between the first cutting area and turnover area is utilized It sets and is transferred out neighbouring the second flaw-piece (rear end that the second flaw-piece is located at silicon ingot 10)；In the second cutting area, turned over using workpiece At least one first silicon cube 11 on silicon ingot revolving platform 7 is overturn and is transported to the second workbench 31 by rotary device 9 On.

In the second cutting area, second cutting operation is implemented to the first silicon cube 11 using the second cutter device 3, specifically, The multiple second cutting line segments 334 for driving the second workbench 31 towards the second cutter unit 33 are mobile, multiple second cutting line segments 334, which correspond to respective second cutting seam 311, enters 31 inside of the second workbench and to first carried on the second workbench 31 Silicon cube 11 carries out cutting up to (multiple second cuttings line segments 334 are along the first silicon cube 11 for completely cut off first silicon cube 11 Crystal orientation the first silicon cube 11 is implemented to cut), form multiple second silicon cubes 12.In the first cutting area, the first cutting is utilized Device 2 implements the first cutting operation to next silicon ingot 10, specifically, declines the first cutter unit 23, by the first cutter unit Multiple first cuttings line segments 234 in 23 touched during decline start cutting after next silicon ingot 10 until completely through Next silicon ingot 10 (cut the implementation of next silicon ingot 10 along the crystal orientation of next silicon ingot 10 by multiple first cutting line segments 234 Cut), multiple first silicon cubes 11 are formed, at this point, multiple first cutting line segments 234 stay in corresponding first cutting seam 211 It is interior.

It is subsequent by multiple second silicon cubes 12 of formation by unloading and transferring away on the second workbench 31, it continues with At least one first silicon cube 11 on silicon ingot revolving platform 7 is overturn and is transported to the second work by Workpiece tilting device 9 On platform 31, so that the second cutter device 3 implements the second cutting operation to the first silicon cube 11.

From the foregoing, it will be observed that using the application silicon ingot excavation machine, not only may make silicon ingot in the first time cutting of evolution operation and It is to be cut along the crystal orientation of silicon ingot in second cutting, it can be ensured that the product quality that evolution is formed can reduce by second Silicon cube generates the risks such as cracking, while relative to the prior art for implementing evolution to silicon ingot using the double-deck cutting gauze, can exempt from It goes to cut cutting gauze and the problems such as by manually threading again.Further more, the application silicon ingot excavation machine, the first cutter device and second Cutter device can realize automation and pipelining, substantially increase the efficiency of silicon ingot evolution.

Referring to Fig. 6, being shown as in one embodiment of the application silicon ingot excavation machine in implementing the operation of silicon ingot evolution.Such as figure Shown in 6, the silicon ingot excavation machine can comprise the following steps that in implementation silicon ingot evolution operation

Silicon ingot is placed on the first workbench by step S101.

Step S103 implements first to the silicon ingot on the first workbench according to the crystal orientation of silicon ingot using the first cutter unit Cutting operation forms multiple first silicon cubes.In step s 103, using the first cutter unit according to the crystal orientation of the silicon ingot and First cutting operation is implemented to the silicon ingot on the first workbench, comprising: utilize the opposite of the first cutter unit and the first workbench It is mobile, it is cut by multiple first cutting line segments in the first cutter unit along the crystal orientation of silicon ingot, forms multiple first silicon Cube.

First silicon cube is transported on the second workbench by step S105.In the present embodiment, on the one hand, cut second It cuts in device, is that the second cutting operation is implemented to one or more first silicon cubes, therefore, step S105 is more can include: first The multiple first silicon cube is transported on a silicon ingot revolving platform, then chooses from the silicon ingot revolving platform one or more the One silicon cube is simultaneously transported on the second workbench.On the other hand, if the second cutter unit and second in the second cutter device The relative movement direction of the first cutter unit and the first workbench is not in the relative movement direction of workbench and the first cutter device If consistent, then before the first silicon cube is transported on the second workbench, further includes: will be on the silicon ingot revolving platform First silicon cube is overturn.

Step S107, using the second cutter unit according to the crystal orientation of the first silicon cube and to the first silicon on the second workbench Cube implements the second cutting operation, forms multiple second silicon cubes.In step s 107, using the second cutter unit according to first The crystal orientation of silicon cube and the second cutting operation is implemented to the first silicon cube on the second workbench, comprising: it is single using the second cutting The relative movement of member and the second workbench, by multiple second cutting line segments in the second cutter unit along the crystalline substance of the first silicon cube To being cut, multiple second silicon cubes are formed.

From the foregoing, it will be observed that during implementing the operation of silicon ingot evolution, first by the first cutter device according to the crystalline substance of polycrystal silicon ingot Implement the first cutting operation to and to polycrystal silicon ingot, forms the first silicon cube, then by the second cutter device according to the first silicon cube Crystal orientation and to the first silicon cube implement the second cutting operation, formed the second silicon cube, in this way, not only can remove from cut cutting The automation evolution operation that silicon ingot is completed in the case of gauze, improves silicon ingot evolution efficiency, even more in evolution operation, sufficiently The crystal orientation situation of silicon ingot is considered, to may make evolution to form the second silicon cube and there can be more preferably performance, for example, can It reduces the second silicon cube and generates the risks such as cracking.

The principles and effects of the application are only illustrated in above-described embodiment, not for limitation the application.It is any ripe Know the personage of this technology all can without prejudice to spirit herein and under the scope of, carry out modifications and changes to above-described embodiment.Cause This, those of ordinary skill in the art is complete without departing from spirit disclosed herein and institute under technical idea such as At all equivalent modifications or change, should be covered by claims hereof.

Claims (21)

1. a kind of silicon ingot excavation machine characterized by comprising

First cutter device, comprising: the first workbench, for carrying silicon ingot；First cutter unit has multiple first cutting lines Section；Wherein, multiple first cutting line segments in first cutter unit are for the crystal orientation according to the silicon ingot and to the silicon Ingot implements the first cutting operation, forms multiple first silicon cubes；And

Second cutter device is adjacent to first cutter device, comprising: the second workbench, for carrying the first silicon cube；The Two cutter units have multiple second cutting line segments；Wherein, multiple second cutting line segments in second cutter unit are used for The second cutting operation is implemented to the first silicon cube according to the crystal orientation of the first silicon cube, forms multiple second silicon sides Body.

2. silicon ingot excavation machine according to claim 1, which is characterized in that first cutter unit, which has, to be oppositely arranged Multiple first cutting wheel groups and the first cutting line, first cutting line are sequentially around in each in the multiple first cutting wheel group A first cutting wheel forms multiple first cutting line segments.

3. silicon ingot excavation machine according to claim 2, which is characterized in that first workbench and first cutting are single At least one of member is arranged to can be mobile relative to another one.

4. silicon ingot excavation machine according to claim 2, which is characterized in that first cutter unit is set to first work Make the top of platform；First cutter unit includes the left cutting rack and right cutting rack being oppositely arranged, the left cutting rack and institute It states and is equipped with multiple first cutting wheels on right cutting rack, first cutting wheel on the left cutting rack of same position is cut with right cut First cutting wheel on frame forms a first cutting wheel group；First workbench is equipped with and multiple first cutting line segments Corresponding multiple first cutting seams.

5. silicon ingot excavation machine according to claim 4, which is characterized in that first workbench and first cutting are single At least one of member is equipped with lift drive mechanism.

6. silicon ingot excavation machine according to claim 1, which is characterized in that second cutter unit, which has, to be oppositely arranged Multiple second cutting wheel groups and the second cutting line, second cutting line are sequentially around in each in the multiple second cutting wheel group A second cutting wheel forms multiple second cutting line segments.

7. silicon ingot excavation machine according to claim 6, which is characterized in that second workbench and second cutting are single At least one of member is arranged to can be mobile relative to another one.

8. silicon ingot excavation machine according to claim 6, which is characterized in that second cutter unit is located at second work Make the side of platform；Second cutter unit includes the upper cutting rack being oppositely arranged and lower cutting rack, and the upper cutting rack is under Multiple second cutting wheels are equipped on cutting rack, in second cutting wheel on the upper cutting rack of same position and lower cutting rack Second cutting wheel form a second cutting wheel group；The workbench is equipped with corresponding more with multiple second cutting line segments A second cutting seam.

9. silicon ingot excavation machine according to claim 8, which is characterized in that in second workbench and second cutting At least one of unit is equipped with translational drive mechanism.

10. silicon ingot excavation machine according to claim 1, which is characterized in that further include silicon ingot revolving platform, be located at described first Between cutter device and second cutter device, for carrying multiple first silicon cubes.

11. silicon ingot excavation machine according to claim 10, which is characterized in that further include workpiece transporter, being used for will be more A first silicon cube is transported to silicon ingot revolving platform by the first workbench.

12. silicon ingot excavation machine according to claim 11, which is characterized in that the workpiece transporter includes:

Workpiece picking and placing unit；And

Mobile mechanism, for driving the workpiece picking and placing unit mobile, to utilize the workpiece picking and placing unit by multiple first silicon Cube is transported to silicon ingot revolving platform by the first workbench.

13. silicon ingot excavation machine according to claim 12, which is characterized in that the mobile mechanism includes:

Along the traveling mobile unit of the first workbench to silicon ingot revolving platform；

Lifting moving unit；

Telescopic moving unit；And

Mobile control unit is connect with the traveling mobile unit, the lifting moving unit and the telescopic moving unit, For: the lifting moving unit is controlled according to the location information of multiple first silicon cubes and the telescopic moving unit drives The workpiece picking and placing unit is mobile to extract multiple first silicon cubes, controls the traveling mobile unit and the workpiece is driven to pick and place Unit controls the lifting moving unit after being moved to silicon ingot revolving platform and the telescopic moving unit drives the workpiece to pick and place Unit is mobile multiple first silicon cubes to be placed on silicon ingot revolving platform.

14. silicon ingot excavation machine according to claim 1, which is characterized in that further include that trimming leather jacket is set, be used for the silicon The flaw-piece removal that ingot generates after the first cutting operation.

15. silicon ingot excavation machine according to claim 10, which is characterized in that further include being set to the silicon ingot revolving platform and institute The Workpiece tilting device between the second cutter device is stated, for being overturn simultaneously the first silicon cube on the silicon ingot revolving platform It is transported to second workbench.

16. silicon ingot excavation machine according to claim 15, which is characterized in that the Workpiece tilting device includes:

Bracket；

Axis is connected to the clamping piece of the bracket, for clamping the first silicon cube；

The turnover driving mechanism being connected between the bracket and the clamping piece, for driving the clamping piece and its clamped The first silicon cube make flip-flop movement.

17. silicon ingot excavation machine according to claim 1, which is characterized in that further include feeding transfer device, be used for silicon ingot It is transferred on first workbench by feeding area.

18. silicon ingot excavation machine according to claim 17, which is characterized in that the feeding transfer device includes:

Loading guide is layed between feeding area and first workbench；And

Transfer bed is set on the loading guide.

19. silicon ingot excavation machine according to claim 18, which is characterized in that it further include charging positioning device, the feeding Positioning device includes:

Side surface positioning device, the side set on the feeding area；And

Position adjusts component, to contact with the silicon ingot carried on the table top of the transfer bed.

20. silicon ingot excavation machine according to claim 19, which is characterized in that the position adjust component be universal ball end or Machine with rotary circular adjusts head.

21. silicon ingot excavation machine according to claim 18, which is characterized in that further include material containing vehicle, be used for the silicon ingot It is transported on the transfer bed of the feeding transfer device behind delivery to feeding area.