CN210060835U - Combined grinding wheel - Google Patents

Abstract

The utility model discloses a combined grinding wheel, include: the grinding wheel comprises a fine grinding wheel body, a coarse grinding wheel body and a cutting wheel body which are axially distributed in a step shape; a fine grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the fine grinding wheel body; a rough grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the rough grinding wheel body; and a cutting sand ring is arranged on the rim of the cutting sand wheel body. The utility model discloses need frequently the tool changing to cause error accumulation and the problem of inefficiency in can the above-mentioned semiconductor crystal bar course of working of effectual solution.

Description

Combined grinding wheel

Technical Field

The utility model relates to a semiconductor processing field, especially a combination emery wheel.

Background

The rolling and slotting of the semiconductor crystal bar are very important one-step processing steps in the semiconductor processing process. Before the semiconductor crystal bar is processed, whether the semiconductor crystal bar can be accurately positioned greatly influences the utilization rate of the semiconductor crystal bar in the subsequent rounding process. The existing semiconductor rounding grooving machine adopts a horizontal processing mode, the X-axis state and the Y-axis state of a semiconductor crystal bar are often required to be calibrated when the semiconductor crystal bar is accurately positioned in the processing mode, the operation of the accurate mode is complex, and the efficiency is low.

Meanwhile, in the process of rounding and grooving the semiconductor crystal bar by using the conventional semiconductor crystal bar rounding and grooving machine, the rough rolling, the fine rolling and the grooving of the semiconductor crystal bar always need to adopt processing cutters in one-to-one correspondence, so that the processing needs to be stopped in the processing process to carry out corresponding cutter changing treatment, the cutter changing can cause low processing efficiency, errors are easily accumulated in the cutter changing process, the material waste or the further increase of the processing errors is caused, and the inconvenience is brought to subsequent processing.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a can effectively simplify and wait to process semiconductor crystal bar positioning operation and need not the tool changing and can accomplish semiconductor crystal bar thick roll, smart roll, the vertical rounding groover of semiconductor crystal bar of fluting processing in order to promote machining efficiency and reduce machining error.

In order to solve the problem, the utility model provides a collect multiple functions in the combined grinding wheel of an organic whole, need frequent tool changing to cause error accumulation and the problem of inefficiency in can the above-mentioned semiconductor crystal bar course of working of effectual solution through this combined grinding wheel.

To achieve the above and other related objects, a composite grinding wheel includes: the grinding wheel comprises a fine grinding wheel body, a coarse grinding wheel body and a cutting wheel body which are axially distributed in a step shape; a fine grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the fine grinding wheel body; a rough grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the rough grinding wheel body; and a cutting sand ring is arranged on the rim of the cutting sand wheel body.

The utility model discloses the further improvement of combination emery wheel lies in, can dismantle the connection through the bolt between finish grinding wheel body, corase grind emery wheel body, the abrasive cut-off wheel body.

The combined grinding wheel of the utility model is further improved in that the cutting grinding wheel is provided with a first positioning ring and a second positioning ring; the rough grinding wheel body is provided with a first positioning step which can be embedded into the first positioning ring; and a second positioning step which can be embedded into the second positioning ring is arranged on the fine grinding wheel body.

The utility model discloses the further improvement of combination emery wheel lies in, the fine grinding circle, the corase grind circle all are equipped with a plurality of chip grooves that are spoke form respectively on the emery ring.

The utility model discloses the further improvement of combination emery wheel lies in, the grinding main part in finish grinding circle, corase grind emery circle, the cutting emery circle is diamond dust.

Drawings

Fig. 1 is a schematic perspective view of the present invention with a protective cover;

FIG. 2 is a schematic perspective view of the present invention with the protective cover removed;

FIG. 3 is a schematic view of the present invention from another perspective with the shield removed;

fig. 4 is a front view of the present invention;

fig. 5 is a left side view of the present invention;

fig. 6 is a top view of the present invention;

FIG. 7 is a schematic view of the vertical fixture;

FIG. 8 is a schematic view of another perspective of the vertical fixture;

FIG. 9 is a schematic view showing a state in which a semiconductor ingot is clamped on a vertical fixture;

FIG. 10 is a top view of a semiconductor ingot clamped in a vertical fixture;

FIG. 11 is a schematic view of the jaw adjustment arrangement;

FIG. 12 is a rear view of the jaw adjustment arrangement;

FIG. 13 is a schematic view showing a state in which a semiconductor ingot is held on a transfer device;

FIG. 14 is a schematic view of another view of the semiconductor ingot being clamped to the transfer device;

FIG. 15 is a schematic view of the construction of the composite grinding wheel;

FIG. 16 is a cross-sectional view of the composite grinding wheel;

fig. 17a to 17c are schematic sectional views of the composite grinding wheel and schematic views of the relative position of the composite grinding wheel with respect to the semiconductor ingot when the composite grinding wheel is applied to the semiconductor ingot.

Reference numerals: 1000. the device comprises a base 2000, a loading platform 2100, a turnover mechanism 2110, a bracket 2200, a rotating wheel set 2300, a fixing device 2310, a pressing rod 2320, a rotating cylinder 3000, a vertical positioning device 3100, a second frame 3110, a longitudinal sliding rail 3200, a vertical fixing device 3210, an upper clamping device 3211, a first tool rest 3211a, a longitudinal sliding groove 3211b, a horizontal sliding groove 3212, a clamping jaw 3212 a.V-shaped groove 3212b, a horizontal sliding groove 3213, a clamping jaw driving device 3213a, a first driving unit 3213b, a transmission rack 3213c, a transmission gear 3214, a pressing block 3215, an opposite-shooting sensor 3216, an outer diameter measuring device 3220, a lower clamping device 3221, a second tool rest 3300, a clamping jaw adjusting device 3310, a lifting device 3311, a driving motor 3312, a first speed reducer 333, a transmission chain 3320, a locking device 3321, a locking sprocket 3322, a locking mechanism 3323, a locking cylinder 3324, a locking part 3326, a maintaining part 3326, a crystal orientation deviation preventing mechanism 4000 and the device comprises an instrument 5000, a grinding device 5100, a magic head lifting device 5200, a grinding wheel driving motor 5300, a combined grinding wheel 5310, a fine grinding wheel body 5311, a first positioning step 5320, a coarse grinding wheel body 5321, a second positioning step 5330, a cutting grinding wheel body 5331, a first positioning ring 5332, a second positioning ring 5340, a magic grinding ring 5350, a coarse grinding ring 5360, a cutting grinding ring 5370, a chip groove 6000, a discharging platform 7000, a transfer device 7100, an XY plane driving device 7110, an X-axis sliding platform 7120, a Y-axis sliding platform 7200, a first rack 7300, a universal bearing table 7400, a pressing device 7410, a pressing disc 7420, a rotary driving 7430, a servo motor 7432, a second speed reducer 7433, a lead screw 7434, a pressing arm beam 8000, a safety shield 7500, an adjusting platform 7510, a Y-axis adjusting table 7520, an X-axis adjusting table 7530, an adjusting 9000 and a semiconductor crystal bar.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 to 6, the utility model discloses a vertical rounding groover of semiconductor crystal bar, including frame 1000, then along being provided with material loading platform 2000, vertical positioner 3000, crystal orientation locater 4000, grinding device 5000, the platform 6000 and with the transportation of semiconductor crystal bar in each workspace and drive semiconductor crystal bar pivoted transfer device 7000 when the rounding according to the preface along the X axle direction on the frame.

Referring to fig. 2 and 3, the loading platform includes a turnover mechanism 2100, which is hinged to the machine base and is driven by a hydraulic cylinder (not shown) to perform a 90 ° turnover. Meanwhile, two rows of rotating wheel sets 2200 extending in the X-axis direction are provided on the turnover mechanism 2100 so as to introduce the semiconductor ingot 9000 into the loading platform. Two fixing devices 2300 are arranged beside the turnover mechanism, each fixing device comprises a pressing rod 2310 and a rotary cylinder 2320 fixed on the turnover mechanism 2100, the rotary cylinders drive the pressing rods to rotate above the turnover mechanism 2100 during loading, and drive the pressing rods to retract and rotate the pressing rods in place to abut against the semiconductor crystal bars 9000 to fix the semiconductor crystal bars on the loading platform, and a bracket 2110 is further arranged below the turnover mechanism and used for supporting the erected semiconductor crystal bars to prevent the semiconductor crystal bars from falling from the loading platform 2000 and limiting the lowest limit of the lower end faces of the semiconductor crystal bars after the semiconductor crystal bars are erected, preferably, a semicircular notch is formed in the bracket to facilitate supporting of the transfer device 7000 on the lower end faces of the semiconductor crystal bars 9000 during transferring.

After the semiconductor crystal bar is turned over by 90 degrees, the transferring device 7000 moves to the loading platform to clamp the two ends of the semiconductor crystal bar, and meanwhile, the fixing device 2300 in the loading platform 2000 returns to the initial position to release the semiconductor crystal bar. Then the semiconductor crystal bar 9000 is taken away from the feeding platform; the feeding platform is turned by 90 degrees and returns to the initial position.

Referring to fig. 2, 3, 13 and 14; the transfer device 7000 includes an XY plane driving device 7100 capable of performing horizontal movement in the XY plane on the base, which consists of an X axis sliding table 7110 slidably connected to the base 1000 and movable in the X axis direction on the base, and a Y axis sliding table 7120 disposed on the X axis sliding table and movable in the Y axis direction. The first frame 7200 is fixed to a Y-axis slide table, and its precise coordinates in the XY plane are adjusted by the XY plane drive 7100. The universal plummer 7300 is rotatably disposed at the bottom of the first frame 7100. Meanwhile, in the embodiment, there is a large damping between the gimbal adjusting portion and the body of the gimbal table (i.e. the gimbal adjusting portion must be deflected to adapt to the end face angle of the semiconductor crystal bar only under the weight of the semiconductor crystal bar, and cannot rotate relatively between the semiconductor crystal bar and the gimbal table body when rotating with the semiconductor crystal bar).

A pressing device 7400 is arranged on the upper part of the universal bearing platform for clamping the semiconductor crystal rod 9000 which is positioned on the universal bearing platform 7200. The compressing device has the detailed structure that: a pressing plate 7410 which is arranged above the universal bearing platform and also has the function of end face universal adjustment, the pressing plate and the lower universal bearing platform share the same axis, and the semiconductor inlet is driven to rotate by a rotary drive 7420 connected with the pressing plate. At the same time, the rotary drive is fixed to a clamping mechanism 7430 that can be raised and lowered in the Z-axis direction, so as to clamp and fix the semiconductor ingot 9000. In particular embodiments, the rotational drive may be a servo motor, a stepper motor, or the like.

In detail, the pressing mechanism includes a pressing driving mechanism 7430 fixedly disposed on the top of the first frame 7200, the pressing driving mechanism is composed of a servo motor 7431 and a second speed reducer 7432, a screw rod 7433 rotating with the output shaft is fixedly connected to the output shaft of the second speed reducer, and the screw rod is disposed longitudinally. Meanwhile, a pressing arm beam 7434 is horizontally arranged on the first frame 7200, one end of the pressing arm beam 7434 is in threaded connection with the screw rod and can realize accurate up-and-down movement under the driving of the rotating screw rod, and the upper surface fixed at one end is fixedly provided with a rotary drive 7420 and drives a pressing disc 7410 fixedly connected with the rotary drive 7420 to synchronously lift. In this embodiment, preferably, in order to ensure that the pressing arm beam does not rotate in the process of being driven by the screw rod, the pressing arm beam and the first frame are in a form of a sliding groove and a sliding rail.

In practical use, the universal bearing platform and the pressing plate are inevitably under the condition of insufficient concentricity in the installation process, and in order to improve the condition so that the universal bearing platform 7300 and the pressing plate 7410 can be kept to rotate coaxially at any time when in use, the bottom of the universal bearing platform is provided with an adjusting platform 7500. This regulation platform includes: a Y-axis adjusting table 7510 which is connected with the bottom of the first frame in a sliding way through a T-shaped sliding chute and is used for adjusting the relative position of the Y-axis adjusting table and the first frame in the Y-axis direction; and an X-axis adjusting stage 7520 slidably mounted on the Y-axis adjusting stage 7510, the X-axis adjusting stage and the Y-axis adjusting stage are also slidably connected through a T-shaped groove, and the X-axis sliding stage can perform adjustment of the position in the X-axis direction on the Y-axis sliding stage. And at least four adjusting screws 7530 are arranged at the bottom of the first frame and are respectively arranged around the adjusting platform, and the adjusting screws are screwed in a rotating mode to change the shaft elongation, so that positioning adjustment of the X-axis sliding table and the Y-axis sliding table is achieved.

As is known, when a semiconductor crystal bar is cut off, due to the problems of the process and the processing mode, the verticality of the end faces at the two ends of the semiconductor crystal bar and the central axis of the semiconductor crystal bar is inevitably insufficient, so that the transfer device is inevitably deflected in the Z-axis direction when the semiconductor crystal bar is clamped. Therefore, before the semiconductor crystal bar is rounded, in order to improve the utilization rate of the semiconductor crystal bar, accurate positioning in the Z-axis direction is necessarily carried out on the semiconductor crystal bar.

As described above, after the semiconductor crystal ingot 9000 is taken away from the loading platform by the transfer device 7000, the semiconductor crystal ingot is sent to the vertical positioning device by adjusting the position of the XY plane driving device 7100, and the vertical positioning device positions the semiconductor crystal ingot 9000 immediately.

As shown in fig. 2, 3, and 7 to 10, the vertical positioning device 3000 includes: a second frame 3100, a vertical fixing means 3200 and a jaw adjusting means 3300. The second frame is fixedly arranged on the base 1000, and the vertical fixing device comprises an upper clamping device 3210 and a lower clamping device 3220 which can be driven by the clamping jaw adjusting device to respectively and independently lift.

In detail, the upper clamping device comprises a first blade carrier 3211 slidingly coupled to the second frame 3100. The first tool rest is in a concave shape, and an opening of the first tool rest faces the transfer device so as to facilitate the entering of the semiconductor crystal bar. Two clamping jaws 3212 for positioning and clamping the semiconductor crystal bar and two opposite sensors 3215 for measuring the position of the upper end face of the semiconductor crystal bar are oppositely arranged on the cantilevers at two sides of the notch of the first cutter frame. In order to more accurately position the semiconductor ingot and make it more coaxial with the rotating shafts of the universal loading platform and the pressing plate in the transfer device 7000 after positioning, the opposite sides of the two clamping jaws are provided with a V-shaped groove 3212a for guiding the semiconductor ingot to approach the center of the two clamping jaws. Preferably, two oblique sides of the V-shaped groove 3212a are symmetrically arranged, and an included angle between the two oblique sides and the groove bottom of the V-shaped groove ranges from 120 ° to 150 °. The optimal selection of the angle is 135 degrees, and the included angle between the two bevel edges is 90 degrees, so that four radial thrusts which are mutually ninety degrees and balanced can be uniformly applied to the periphery of the semiconductor crystal bar, and the positioning precision of the semiconductor crystal bar is improved. At the same time, a jaw drive 3213 is fixedly mounted on the first tool carrier, and can drive the two jaws connected thereto to perform a synchronous relative movement, i.e., a synchronous opening or a synchronous closing. In the embodiment, the correlation sensor is used for measuring the height of a subsequent semiconductor crystal bar and detecting whether the semiconductor crystal bar enters the vertical positioning device;

the lower clamping means 3220 comprises a second tool carrier 3221 which is slidably connected to the second machine frame 3100 and is arranged horizontally below the first tool carrier, and which is likewise embodied in the form of a "concave" shape with its opening facing the transfer device 7000. Two clamping jaws 3212 for positioning and clamping the semiconductor crystal bar and two opposite correlation sensors 3215 for measuring the position of the upper end face of the semiconductor crystal bar are also oppositely arranged on the two extending cantilevers of the second tool rest. And a clamping jaw driving device 3213 is also arranged on the second tool rest and used for driving the two clamping jaws to open or close synchronously. In the embodiment, the correlation sensor is used for detecting whether the semiconductor crystal bar enters the vertical positioning device.

In this embodiment, after the semiconductor crystal bar is transferred to the position by the transfer device, the upper clamping device is lifted, the coordinate value of the upper end of the semiconductor crystal bar is measured by the correlation sensor, and the length of the semiconductor crystal bar is converted by the measured data to determine the next clamping position for positioning and fixing the semiconductor crystal bar at the upper clamping position.

When the length of the semiconductor crystal bar is measured and the clamping positions of the upper clamping device and the lower clamping device are determined, the upper clamping device 3210 and the lower clamping device 3220 work, and the two clamping jaws 3212 of the upper clamping device and the lower clamping device are synchronously closed. When the semiconductor crystal bar is folded to a certain position, one clamping jaw in the upper clamping device and one clamping jaw in the lower clamping device are necessarily in contact with the inclined plane on one side of the semiconductor crystal bar in advance and exert a continuous radial thrust on the contact position, and the semiconductor crystal bar is slowly corrected along with the continuous folding of the clamping jaw groups in the upper clamping device and the lower clamping device until the clamping jaws in the upper clamping device and the lower clamping device are combined to the right position (namely four inclined planes in the two clamping jaws are all clamped on the side elevation of the semiconductor crystal bar), and at the moment, the Z-axis of the central line axis of the semiconductor crystal bar is accurately positioned.

On the basis of this embodiment, in order to prevent the clamping jaw set 3212 from damaging the semiconductor ingot when closing in the positioning and calibrating process, two inclined surfaces of the clamping jaw 3212a are respectively designed with a pressing block 3214, and the pressing block is made of polyurethane. (polyurethane has great rigidity, can not take place great deformation under the extrusion of clamping jaw group and semiconductor crystal bar to influence the positioning calibration precision of semiconductor crystal bar, and can produce great frictional force between polyurethane and the semiconductor crystal bar, the vertical fixing device that makes can be better fixed semiconductor crystal bar, prevent phenomenons such as its emergence slip.

As shown in fig. 7 and 12, in the present embodiment, the jaw driving device 3213 includes: a first driving unit 3213a (in an embodiment, the first driving unit may be a driving device having an axial expansion function, such as an expansion cylinder or a hydraulic cylinder). Taking a telescopic cylinder as an example, the end of a telescopic rod of the telescopic cylinder is fixedly connected with one of the two clamping jaws 3212, the clamping jaw is used as a driving clamping jaw, and cylinder bodies of the telescopic cylinder are respectively fixed on the corresponding first knife rest 3211 and second knife rest 3221. Meanwhile, the two clamping jaws are horizontally provided with a transmission rack 3213b, and a transmission gear 3213c which is respectively meshed with the two transmission racks is arranged between the two transmission racks. When the clamping group is required to be clamped and folded, the telescopic rod of the telescopic cylinder extends out to drive the clamping jaw connected with the telescopic cylinder to be close to the other clamping jaw, and the clamping jaw serving as a driving clamping jaw drives the other driven clamping jaw 3212 to be close to the driving clamping jaw through the transmission of the two transmission racks and the transmission gear so as to realize the synchronous folding of the clamping jaw group. And when two clamping jaws need to be opened, only reverse operation is needed, namely, the telescopic rod of the telescopic cylinder is retracted, and the operation can be completed. In this embodiment, it is preferable that the driving rack 3213b and the driving gear have helical teeth structures in order to ensure the stability of the driving.

On the basis of the above embodiments, preferably, in order to ensure the stability of the upper clamping device 3210 and the lower clamping device 3220 during the lifting on the second frame 3100, at least one longitudinal sliding rail 3110 is longitudinally arranged on the second frame, and the first blade holder 3211 and the second blade holder 3221 are respectively provided with a longitudinal sliding groove 3211a adapted to the first blade holder 3211;

further, in order to ensure the stability of the clamping jaw 3212 on the first tool rest and the second tool rest and prevent the clamping jaw from being deformed due to the overweight of the semiconductor ingot, at least one horizontal sliding rail 3211b is horizontally arranged on the first tool rest 3211 and the second tool rest 3221, and a horizontal sliding groove 3212b matched with the horizontal sliding rail is arranged on the clamping jaw 3212.

The lifting functions of the upper clamping device 3210 and the lower clamping device 3220 required for measuring the length of the semiconductor crystal bar in the positioning process of the semiconductor crystal bar are realized by the clamping jaw adjusting device 3300.

As shown in fig. 11 and 12, the jaw adjusting device 3300 includes: an elevating device 3310 and a locking device 3320.

Wherein, the detailed structure of the lifting device is that a driving motor 3311 arranged on the top of the second frame 3100, a first speed reducer 3312 connected with the driving motor; a longitudinally arranged driving chain 3313, which is wound around two chain wheels distributed up and down. The upper chain wheel of the two chain wheels is fixed on the shaft end of the output shaft of the first speed reducer, and the lower chain wheel is rotatably fixed at the bottom of the second frame 3100. In particular embodiments, the drive motor 3311 may be a stepper motor, a servo motor, or the like, implementing precision gearing.

The locking device 3320 includes a locking sprocket 3321 rotatably mounted on the second blade support 3221 and a locking mechanism 3322 engaged with the drive chain. The locking mechanism is also fixed on the second tool rest and controls the relative state between the locking sprocket and the transmission chain by combining with and separating from the locking sprocket (namely, the locking sprocket is locked on the transmission chain or the locking sprocket can rotate relative to the transmission chain).

In a specific embodiment, the detailed structure of the locking mechanism 3322 is as follows: including a fixed mounting locking cylinder 3323 on the second knife rest, the telescopic link of this locking cylinder can be followed locking sprocket's radial flexible, be fixed with locking portion 3324 simultaneously on the tip of the telescopic link of locking cylinder, this locking portion external profile is the rectangular block structure, be provided with a bolt near locking sprocket one side in this locking portion, when locking portion is driven by locking cylinder and is stretched into locking sprocket, locking sprocket card locking sprocket, make it no longer produce relative rotation between with drive chain. At this time, the lower clamping device is synchronously lifted along with the transmission chain.

Meanwhile, in the specific implementation process, after the locking part 3324 enters the locking chain wheel, the acting force applied by the locking chain wheel is large, so that the telescopic rod of the locking cylinder is easy to deform in the long-time stress process, and the service life of the locking cylinder is influenced. In order to solve this problem, a holding portion 3325 is further fixedly disposed on the second tool holder 3221, the holding portion is composed of two pressing plates, and is disposed on two sides of the locking portion, and a sliding channel parallel to the telescopic direction of the locking cylinder is formed between the holding portion and the second tool holder, and the locking portion is slidably disposed in the sliding channel. When the locking part is subjected to a large acting force from the locking chain wheel and the shape of the telescopic rod of the locking cylinder is required to be changed, the holding part is pressed above the locking part, and a stabilizing effect is achieved.

In other implementations, the holding portion 3325 may also be a rectangular block disposed along the moving track of the locking portion, and a sliding groove is disposed in the rectangular block, and the locking portion is slidably disposed in the sliding groove and moves along the radial direction of the locking sprocket.

Further, it is known that, in some cases, the drive chain may wobble during the drive, causing disengagement between the drive chain and the locking sprocket, thereby causing disengagement between the lower clamping device and the drive chain. In order to eliminate the possibility of this occurring. The locking mechanism is also provided with a separation-preventing mechanism 3326 which is of a U-shaped structure, two parallel side edges of the separation-preventing mechanism are fixed on the second tool rest 3221 so that the separation-preventing mechanism can be lifted synchronously with the lower clamping device, and the bottom of the separation-preventing mechanism 3326 at the bottom is close to the transmission chain. When the transmission chain shakes and is about to be disengaged from the locking chain wheel, the groove bottom of the disengagement preventing mechanism necessarily applies acting force to the transmission chain in the radial direction of the locking chain wheel, so that the transmission chain is prevented from disengaging from the locking chain wheel.

From the above, after the semiconductor ingot is clamped and positioned by the upper clamping device 3210 and the lower clamping device 3220, the pressing device 7400 in the transfer device 7000 rises to be out of contact with the upper end surface of the semiconductor ingot, then the semiconductor ingot is integrally lifted to a certain distance away from the surface of the universal bearing platform 7300 under the action of the vertical positioning device, and then the semiconductor ingot is driven by the vertical positioning device to rapidly fall onto the universal bearing platform, so that a large impact force is generated on the universal adjusting part in the universal bearing platform, the universal adjusting part is forced to perform angle conversion adapted to the oblique angle of the lower end surface of the semiconductor ingot, and finally, the pressing disc in the pressing device is forced to perform strong pressure under the action of the pressing driving device, and the universal adjusting part of the pressing disc also performs angle conversion adapted to the oblique angle of the upper end surface of the semiconductor ingot. At this time, the transfer device finishes clamping the semiconductor crystal bar 9000, and the next semiconductor grinding operation can be performed.

As shown in fig. 3 and 15, the grinding apparatus 5000 includes: the grinding wheel device comprises a magic head lifting device 5100 fixedly arranged on the base 1000, a grinding wheel driving motor 5200 which is fixed on the magic head lifting device and realizes the lifting function under the driving of the magic head lifting device, and a combined grinding wheel 5300 which is fixedly arranged on the output end of the grinding wheel driving motor and is lifted together with the output end. In the embodiment, the combined grinding wheel has the functions of coarse grinding, fine grinding and grooving; when the semiconductor crystal bar needs to be subjected to the real-time coarse grinding and accurate grinding operation, the relative position between the semiconductor crystal bar and the combined grinding wheel 5300 is adjusted through the transfer device 7000, so that the rotating semiconductor crystal bar is contacted with the coarse grinding working area and the accurate grinding working area in the combined grinding wheel which rotates and moves up and down, and the grinding operation of the combined grinding wheel 5300 on the outer side wall of the semiconductor crystal bar 9000 is achieved.

When the groove needs to be cut, the semi-conductor crystal bar after rough grinding and accurate grinding is transferred to the radial positioning instrument 4000 to measure the internal crystal phase structure, the semi-conductor crystal bar is rotated to the position of the required groove after measurement, and then the longitudinal groove cutting operation is carried out through the rotating combined grinding wheel.

Specifically, as shown in fig. 17a to 17c, in order to provide the combined grinding wheel with the above-described functions of rough grinding, finish grinding, and grooving, as shown in fig. 15 and 16, the combined grinding wheel 5300 includes a finish grinding wheel body 5310, a rough grinding wheel body 5320, and a cut grinding wheel body 5330, which have diameters sequentially increased. Wherein, finish grinding wheel body and finish grinding wheel body are all installed on the cutting wheel body, and finish grinding wheel body axial salient in the corase grind wheel body, and the three is the echelonment and arranges. And the cutting grinding wheel body is fixedly connected with the output end of the grinding wheel driving motor. Meanwhile, one surface of the fine grinding wheel and one surface of the rough grinding wheel facing the semiconductor crystal bar are respectively provided with a fine grinding ring 5340 and a rough grinding ring 5350 which correspond to each other; and a cutting sand ring 5360 is provided on the rim of the cutting wheel body.

In the practical use process, because the hardness of the semiconductor crystal bar 9000 is higher, the detachable connection between the middle fine grinding wheel body 5310 and the cutting wheel body 5330 of the combined grinding wheel and between the rough grinding wheel body 5320 and the cutting wheel body 5330 can be easily realized through bolts. Thereby facilitating the replacement of the seriously worn part by workers in the using process. Meanwhile, the combined grinding wheel is integrally and detachably mounted on the output end of the grinding wheel drive motor 5200.

On the basis of the above embodiment, in order to ensure the concentricity of the finish grinding wheel body, the rough grinding wheel body and the cutting wheel body after being assembled together in the combined grinding wheel, a first positioning ring 5331 and a second positioning ring 5332 are respectively arranged on one surface of the joint of the cutting wheel body and the finish grinding wheel body and the rough grinding wheel body. The two positioning rings are both concavely arranged on the cutting grinding wheel body and are concentrically arranged with the cutting grinding wheel body. Meanwhile, one side, facing the cutting grinding wheel body, of the fine grinding wheel body is provided with a first positioning step 5311 which is concentric with the fine grinding wheel body, and during installation, the first positioning step is nested in the first positioning ring so as to guarantee concentricity between the fine grinding wheel body and the cutting grinding wheel body. And the rough grinding wheel body is provided with a second positioning step 5321 concentric with the rough grinding wheel body on one side facing the cutting wheel body, and the second positioning step is nested in a second positioning ring during installation so as to ensure the concentricity of the rough grinding wheel body and the cutting wheel body. Meanwhile, the structure is also beneficial to quick alignment of parts replaced by workers. In the embodiment, the first positioning ring and the first positioning step; the outline of the second positioning ring and the outline of the second positioning step are circular, but the outline of the combination is not limited to a circle, and may be a regular polygon or the like.

On the basis of the above embodiment, the fine grinding ring 5340 and the rough grinding ring 5350 are both provided with a plurality of spoke-shaped chip grooves 5370, so that the abraded waste materials for grinding the semiconductor crystal bar by the combined grinding wheel can be rapidly discharged from the chip grooves, and the situation that the waste materials cannot be rapidly discharged and are retained between the semiconductor crystal bar and the combined grinding wheel to reduce the grinding precision is prevented. Preferably, the chip grooves are U-shaped grooves.

In addition to the above embodiments, the effective component of the fine grinding whetstone 5340, the rough grinding whetstone 5350, and the cutting whetstone 5360 for grinding the semiconductor wafer 9000 is silicon carbide.

In the actual grinding process, in order to prevent the occurrence of a negative and positive surface on the surface of the semiconductor crystal bar (a plurality of combined grinding wheels are simultaneously generated in the grinding process of the semiconductor crystal bar), a certain included angle exists between the combined grinding wheel 5300 and the axis of the semiconductor crystal bar.

Further, when the outer surface of the semiconductor crystal bar is ground, the whole utilization rate of the semiconductor crystal bar is improved in order to improve the grinding precision. After the vertical positioning device finishes positioning the semiconductor crystal bar and the transferring device finishes clamping, the vertical positioning device can also measure the outer diameter of the semiconductor crystal bar.

The measuring operation can be performed by the outer diameter measuring devices 3216 respectively installed on the upper and lower clamping devices 3210 and 3220. The outer diameter measuring device is arranged along the radial direction of the semiconductor crystal bar, when the semiconductor crystal bar needs to be measured, the transfer device rotates the semiconductor crystal bar, the outer diameter measuring device 3216 measures the outer diameter value of the semiconductor crystal bar by contacting the periphery of the semiconductor crystal bar, and sends the value to the PLC control unit, and the PLC control unit converts the required feed amount according to the measured outer diameter data of the semiconductor crystal bar.

After the grinding and cutting of the semiconductor crystal bar are completed, the transfer device transfers the semiconductor to the unloading platform, and the unloading platform 6000 receives the semiconductor crystal bar 9000 and then unloads the semiconductor crystal bar onto the material conveying trolley.

The structure of the unloading platform is the same as that of the loading platform, and the unloading process is the cash returning operation of the loading process.

And simultaneously the utility model discloses the outside still is provided with in order inciting somebody to action the utility model discloses whole confined safety guard 8000 for protect outside staff, but then be provided with a plurality of open closed observation doors on the safety guard.

Claims (5)

1. A composite grinding wheel, comprising: the grinding wheel comprises a fine grinding wheel body, a coarse grinding wheel body and a cutting wheel body which are axially distributed in a step shape; a fine grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the fine grinding wheel body; a rough grinding ring is arranged on the outer ring of one side, facing the semiconductor crystal bar, of the rough grinding wheel body; and a cutting sand ring is arranged on the rim of the cutting sand wheel body.

2. The unitized wheel of claim 1, wherein: the accurate grinding wheel body, the rough grinding wheel body and the cutting wheel body are detachably connected through bolts.

3. The unitized wheel of claim 1, wherein: the cutting grinding wheel is provided with a first positioning ring and a second positioning ring; the rough grinding wheel body is provided with a first positioning step which can be embedded into the first positioning ring; and a second positioning step which can be embedded into the second positioning ring is arranged on the fine grinding wheel body.

4. The unitized wheel of claim 1, wherein: the fine grinding ring and the coarse grinding ring are respectively provided with a plurality of chip grooves in a spoke shape.

5. The unitized wheel of claim 1, wherein: and the grinding main bodies of the fine grinding ring, the rough grinding ring and the cutting sand ring are carborundum.

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