CN108858841B - Silicon crystal cutting machine - Google Patents
Silicon crystal cutting machine Download PDFInfo
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- CN108858841B CN108858841B CN201810691784.5A CN201810691784A CN108858841B CN 108858841 B CN108858841 B CN 108858841B CN 201810691784 A CN201810691784 A CN 201810691784A CN 108858841 B CN108858841 B CN 108858841B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 256
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 129
- 239000010703 silicon Substances 0.000 title claims abstract description 129
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 239000013078 crystal Substances 0.000 title claims abstract description 88
- 230000007246 mechanism Effects 0.000 claims abstract description 154
- 238000006073 displacement reaction Methods 0.000 claims description 54
- 230000033001 locomotion Effects 0.000 claims description 27
- 229910003460 diamond Inorganic materials 0.000 claims description 21
- 239000010432 diamond Substances 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000002265 prevention Effects 0.000 claims description 14
- 238000007599 discharging Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 5
- 238000003754 machining Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 229920005591 polysilicon Polymers 0.000 description 10
- 238000012545 processing Methods 0.000 description 8
- 230000003139 buffering effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a silicon crystal cutting machine, which comprises a base, a frame, a lifting mechanism and a clamping cutting unit, wherein the lifting mechanism is arranged on the base; the clamping and cutting unit comprises a double-station rotary workbench and an edge breakage preventing cutting device, wherein the double-station rotary workbench is arranged on the base, and the edge breakage preventing cutting device is arranged above the rotary workbench; the lifting mechanism is arranged on the cross beam of the frame and is used for driving the wire saw cutting mechanism to cut the silicon crystal bar. According to the double-station rotary workbench, the positions of the two clamping stations on the workbench are exchanged, bar cutting and feeding and discharging are performed simultaneously, the cutting area does not need to wait for feeding and discharging time, and the production efficiency is improved; and prevent cutting device that breaks limit combines the design with wire saw cutting mechanism and clamping jaw mechanism, and clamping jaw mechanism grips the barred body of silicon crystal bar kerf both sides in cutting process, can play the fixed action of cutting to the silicon crystal bar, can also prevent that "breaking limit" from appearing in the cutting terminal surface, and silicon crystal cutting machine machining efficiency is high, silicon crystal quality is good, and market competition is strong.
Description
Technical Field
The invention relates to the technical field of cutting of hard and brittle materials, in particular to a silicon crystal cutting machine.
Background
The silicon crystal is widely used in the photovoltaic industry, the global demand for the silicon crystal is rapidly increased, and the silicon crystal has a large market prospect due to the market supply and demand. Therefore, the progress of the processing technology of the crystalline silicon bar stock is the core competitiveness of the enterprise development.
At present, the silicon crystal material cutting machine sold in the market mainly has the following two problems to be solved:
first, edge chipping is liable to occur. Besides the unstable operation of the wire saw cutting mechanism for cutting, the main reason is that when the silicon crystal bar is cut, the two cutting end faces can bear an outward acting force, the acting force is the self gravity of the silicon crystal bar to be cut off or the vibration force generated by wire saw cutting, when the silicon crystal bar is to be cut through, the silicon crystal bar is split due to the fact that the acting force cannot be born, and therefore burrs are formed at the bottom edges of the cutting faces of the silicon crystal bar. At present, the silicon crystal bar cutting machine is provided with a special clamp on a workbench, so that the whole silicon crystal bar material is supported by the workbench before and after cutting, and the cutting end face is prevented from being subjected to outward acting force. The problem of 'edge breakage' is solved by adopting the method, the used clamp has complex structure, complex operation action and poor universality, and when the workbench needs to move or do rotary motion, the common clamp cannot adapt to the workbench at all.
Secondly, bar clamping cutting efficiency is low. The existing cutting machine needs to carry out silicon crystal bar feeding work on a workbench, then feeds bar stock to a processing position, and finally carries out wire saw cutting to process the silicon crystal bar stock. However, by adopting the operation mode, when feeding and feeding conveying processes are carried out, the wire saw cutting mechanism needs to wait for the installation time of the bar stock, the working efficiency is lower, and the labor cost is higher.
Disclosure of Invention
Therefore, a silicon crystal cutting machine is needed to solve the problems of complex operation, high use cost, low processing efficiency and poor universality of the prior art that an independent clamp is arranged on a workbench to fix a silicon crystal bar.
In order to achieve the above object, the present inventors provide a silicon wafer cutting machine, which includes a base, a frame, a lifting mechanism, and a clamping cutting unit;
the frame is arranged on the base;
the clamping and cutting unit comprises a double-station rotary workbench and an edge breakage preventing cutting device, the double-station rotary workbench is arranged on the base, and the edge breakage preventing cutting device is arranged above the rotary workbench;
the edge breakage prevention cutting device comprises a wire saw cutting mechanism, a clamping jaw mechanism and a sliding mechanism;
The wire saw cutting mechanism comprises a cutting panel, a guide wheel assembly and a diamond wire saw, wherein the guide wheel assembly is arranged on the cutting panel, the diamond wire saw is arranged in a wire groove of the guide wheel assembly, the diamond wire saw can move under the driving of the guide wheel assembly, and a abdication groove is formed in the cutting panel;
the clamping jaw mechanism comprises clamping jaw units symmetrically arranged on two sides of the abdication groove, the clamping jaw units comprise a first linear reciprocating device, a positioning clamping jaw, a balancing clamping jaw and a displacement clamping jaw, the balancing clamping jaw and the displacement clamping jaw are both arranged on the positioning clamping jaw, the balancing clamping jaw and the displacement clamping jaw are provided with abutting surfaces facing to a silicon crystal bar to be cut, the balancing clamping jaw and the displacement clamping jaw are respectively arranged on two sides of the diamond wire saw below the abdication groove, and one end of a telescopic rod of the linear reciprocating device is fixed with the positioning clamping jaw;
the sliding mechanism comprises sliding units symmetrically arranged on two sides of the abdication groove, the sliding units comprise vertical sliding rails and vertical sliding blocks, the vertical sliding rails are fixed on cutting panels on two sides of the abdication groove, the vertical sliding blocks can slide up and down along the vertical sliding rails, and the linear reciprocating device is fixed on the vertical sliding blocks;
The lifting mechanism is arranged on the cross beam of the frame and is used for driving the wire saw cutting mechanism to cut the silicon crystal bar.
As a preferable structure of the present invention, the double-station rotary table includes a table, a rotary mechanism, and a driving mechanism;
the workbench is provided with two clamping stations which are symmetrically arranged at two sides of the workbench;
the rotary mechanism comprises a rotary main shaft, a bearing and a rotary gear, wherein the bearing and the rotary gear are sleeved outside the rotary main shaft;
the driving mechanism comprises a telescopic mechanism and a transmission rack, the transmission rack is meshed with the rotary gear, the telescopic end of the telescopic mechanism is fixed with the transmission rack, and the telescopic length of the telescopic end is one half of the circumference of the rotary gear;
the workbench is fixedly connected with the rotary main shaft.
As a preferable structure of the double-station rotary table, the double-station rotary table further comprises a positioning buffer mechanism, the positioning buffer mechanism comprises a rotary positioning block and buffer rods, the rotary positioning block is fixed on a rotary main shaft, the rotary positioning block is linked with the rotary main shaft, the two buffer rods are symmetrically arranged along the rotary main shaft, the buffer rods are positioned on a path of movement of the rotary positioning block, and when a telescopic end of the telescopic mechanism moves to a maximum stroke and a minimum stroke, the two buffer rods are respectively abutted against the rotary positioning block.
As an preferable structure of the invention, the double-station rotary table further comprises an electromagnetic locking mechanism, the electromagnetic locking mechanism comprises a mounting frame and electromagnetic locking rods, the electromagnetic locking rods comprise electromagnets and adjusting rods, the adjusting rods are fixed on the mounting frame, the electromagnets are arranged at one ends of the adjusting rods, the number of the electromagnetic locking rods is two, the two electromagnetic locking rods are positioned on the moving path of the rotary positioning blocks, and when the telescopic end of the telescopic mechanism moves to the maximum stroke and the minimum stroke, the electromagnets of the two electromagnetic locking rods are respectively abutted against the rotary positioning blocks.
As an optimized structure of the invention, the clamping jaw unit further comprises a second linear reciprocating device, the second linear reciprocating device is fixed with the side wall of the balance clamping jaw, and the positioning clamping jaw is provided with a balance clamping jaw limiting groove for driving the balance clamping jaw to move left and right in the balance clamping jaw limiting groove.
As an optimal structure of the invention, the positioning clamping jaw is also provided with a displacement clamping jaw limiting groove, the clamping jaw unit also comprises a third linear reciprocating device, the third linear reciprocating device is arranged on the side wall of the positioning clamping jaw, and a telescopic rod of the third linear reciprocating device is fixed with the displacement clamping jaw and is used for driving the displacement clamping jaw to move back and forth in the displacement clamping jaw limiting groove.
As an optimized structure of the invention, the clamping and cutting unit comprises a first edge breakage preventing cutting device and a second edge breakage preventing cutting device, and the first edge breakage preventing cutting device and the second edge breakage preventing cutting device are arranged above the double-station rotary workbench side by side and are respectively used for cutting two ends of the silicon crystal bar on the clamping station.
As a preferable structure of the invention, the cutting machine further comprises a cutting frame, the edge collapse preventing cutting device is fixed on the cutting frame, the lifting mechanism comprises a left upright lifting assembly and a right upright lifting assembly, two ends of the cutting frame are respectively fixed with lifting parts of the left upright lifting assembly and the right upright lifting assembly, and lifting parts of the left upright lifting assembly and the right upright lifting assembly synchronously move.
As a preferable structure of the invention, the clamping and cutting unit further comprises a transverse displacement mechanism, the transverse displacement mechanism comprises a first servo motor, a first ball screw, a second servo motor and a second ball screw, bearings are sleeved outside nuts on the first ball screw and the second ball screw, cutting panels of the first edge breakage prevention cutting device and the second edge breakage prevention cutting device are respectively connected with the bearings sleeved outside the nuts of the first ball screw and the second ball screw, the first servo motor is used for driving the nuts on the first ball screw to rotate, and the second servo motor is used for driving the nuts on the second ball screw to rotate.
As a preferable structure of the invention, at least two clamping and cutting units are arranged on the base uniformly side by side.
Compared with the prior art, the technical scheme has the following advantages: the double-station rotary workbench designed in the silicon crystal cutting machine realizes the position exchange of the two clamping stations on the workbench, so that when one station performs cutting work, the feeding and discharging operation of the other station is not hindered, the bar cutting and feeding and discharging are performed simultaneously, the cutting area does not need to wait for feeding and discharging time, and the production efficiency is greatly improved; the edge breakage prevention cutting device in the cutting machine combines the wire saw cutting mechanism and the clamping jaw mechanism, the displacement of the wire saw cutting mechanism is fully utilized, an independent clamping jaw moving mechanism is not required to be designed, the clamping jaw mechanism is arranged in a cutting area at the yielding groove of the cutting panel, the clamping jaw mechanism clamps the rod bodies on two sides of the silicon crystal rod cutting joint in the cutting process, the cutting fixing effect on the silicon crystal rod can be achieved, the silicon crystal rod can be prevented from being broken when being cut off, the situation that the edge breakage occurs on the cutting end face is avoided, the operation action of the edge breakage prevention cutting device is simple, the application range is wide, the cutting efficiency of the silicon crystal cutting machine is high, the quality of the processed silicon crystal is good, and the market competitiveness is strong.
Drawings
FIG. 1 is a schematic diagram showing a front view of a silicon wafer cutter according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a portion of a silicon wafer cutter according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a portion of a silicon wafer cutter according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing an oblique view of an embodiment of an edge breakage preventing device in a silicon wafer cutter according to the present invention;
FIG. 5 is a schematic diagram showing a front view of another embodiment of an edge breakage prevention device in a silicon wafer cutter according to the present invention;
FIG. 6 is a schematic perspective view of the jaw unit and the sliding unit of the anti-tipping cutting device according to the present embodiment;
FIG. 7 is a schematic top view of the jaw unit and the sliding unit of the anti-edge breakage cutting device according to the present embodiment;
FIG. 8 is a schematic top view showing a state change of a jaw mechanism of the edge breakage preventing cutting device in use according to the present embodiment;
FIG. 9 is a schematic diagram showing a perspective view of one embodiment of a dual-station rotary table in a silicon wafer cutter according to the present invention;
FIG. 10 is a schematic view of a portion of a dual-station rotary table of a silicon wafer cutter according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a dual-station rotary table in a silicon wafer cutter according to another embodiment of the present invention;
FIG. 12 is a schematic diagram showing a second front view of another embodiment of a dual-station rotary table in a silicon wafer cutter according to the present invention;
FIG. 13 is a schematic cross-sectional view of a portion of a dual-station rotary table in a silicon wafer cutting machine in a top view;
fig. 14 is a schematic perspective view of an embodiment of a rack fixing seat in this embodiment.
Reference numerals illustrate:
100. a base;
200. a frame;
310. a left upright post lifting assembly;
320. a right column lifting assembly;
400. a double-station rotary workbench;
410. a work table; 411. a clamping station;
420. a slewing mechanism; 421. rotating the main shaft; 422. a bearing; 423; a rotary gear; 424. rotating the shaft sleeve; 425. an upper bearing cap; 426. a lower bearing cap;
430. a driving mechanism; 431. a telescoping mechanism; 432. a drive rack;
440. rotating the positioning block;
450. a buffer rod; 451. a limit screw; 452. a spring; 453. a push rod; 454. an adjusting nut;
460. a work bench;
470. a rack fixing seat; 471. a rack slide rail; 472. a buffer rod receiving hole;
480. an electromagnetic locking mechanism; 481. a mounting frame; 482. an electromagnetic locking rod;
490. a clamping mechanism;
500. edge breakage preventing cutting device;
510. A wire saw cutting mechanism; 511. cutting the panel; 512. guide wheel assembly 513, diamond wire saw; 514. a relief groove;
520. a jaw unit; 521. a first linear reciprocating device; 522. positioning clamping jaws; 523. balancing the clamping jaw; 524. a displacement jaw; 525. a second linear reciprocating means; 526. balance clamping jaw limit grooves; 527. a displacement clamping jaw limit groove; 528. a third linear reciprocating means;
530. a sliding unit; 531. a vertical slide rail; 532. moving the slide block;
600. a lateral displacement mechanism;
610. a first servo motor;
620. a second servo motor;
630. a ball screw; 631. a nut; 632. 632, bearings;
700. a cutting frame;
800. silicon crystal square bar.
Detailed Description
In order to describe the technical content, constructional features, achieved objects and effects of the technical solution in detail, the following description is made in connection with the specific embodiments in conjunction with the accompanying drawings.
The silicon wafer cutting machine is suitable for cutting silicon wafer rods and silicon square rods. The silicon wafer rod is a single silicon crystal rod, and the silicon crystal square rod is a multi-silicon crystal rod, a square rod after the single silicon crystal rod is opened and the like. In the actual use process, the clamping station of the silicon crystal cutting and middle double-station rotary workbench and the clamping jaw mechanism of the edge breakage preventing cutting device select different structures (the two structures are matched), so that the silicon crystal cutting device can adapt to the cutting processing of silicon crystal bars with different shapes.
If the position clamping station of the double-station rotary workbench, the balance clamping jaw in the clamping jaw mechanism and the abutting surface of the displacement clamping jaw and the silicon crystal bar are vertical planes, the cutting machine is used for the silicon crystal square bar; if the abutting surface of the structure and the silicon crystal bar is a V-shaped or arc-shaped surface, the cutting machine is applicable to the silicon crystal square round bar. The selection of an adapted clamping member according to the cross-sectional shape of the silicon ingot to be cut is common knowledge in the art, and thus will not be described in detail.
The present invention will be described in detail below by taking a silicon wafer dicing machine for dicing a square bar of silicon wafers as an example.
Please refer to fig. 1 to 14. The invention provides a silicon crystal cutting machine which comprises a base 100, a frame 200, a lifting mechanism and a clamping cutting unit.
The frame 200 is disposed on the base 100, and the frame 200 is matched with the base 100 to serve as a supporting frame of the cutting machine, and is used for installing and carrying other components.
The clamping and cutting unit is used as a clamping and fixing and cutting mechanism of the silicon crystal square bar 800. Specifically, the clamping cutting unit comprises a double-station rotary table 400 and an edge breakage preventing cutting device 500, the double-station rotary table 400 is arranged on the base 100, the edge breakage preventing cutting device 500 is arranged above the rotary table 410, and the two clamping stations 411 on the double-station rotary table 400 can realize position interchange, so that one station does not interfere with feeding and discharging operations of the other station when cutting, bar cutting and feeding and discharging are performed simultaneously, a cutting area does not need to wait for feeding and discharging time, and production efficiency is greatly improved.
Referring to fig. 1, 4 and 5, the edge breakage preventing cutting device 500 is configured to cut the square silicon rod 800 and clamp and fix the square silicon rod 800 to prevent edge breakage. Specifically, the edge breakage preventing cutting device 500 includes a wire saw cutting mechanism 510, a clamping jaw mechanism, and a sliding mechanism.
The wire saw cutting mechanism 510 specifically performs a cutting process on the square silicon boule 800, including slicing and slicing the square silicon boule 800. Specifically, the wire saw cutting mechanism 510 includes a cutting panel 511, a guide wheel assembly 512 and a diamond wire saw 513, the guide wheel assembly 512 is mounted on the cutting panel 511, the diamond wire saw 513 is disposed in a wire slot of the guide wheel assembly 512, the diamond wire saw 513 can move under the driving of the guide wheel assembly 512, and a relief groove 514 is disposed on the cutting panel 511. Further, the guide wheel assembly 512 includes a main driving wheel assembly and a driven wheel, the driving wheel assembly includes a driving motor and a driving wheel, the driving wheel is connected to an output shaft of the driving motor, the driving motor drives the driven wheel to rotate, the diamond wire saw 513 is arranged in a wire slot of the driving wheel and the driven wheel, and the guide wheel assembly 512 drives the diamond wire saw 513 to move. The relief groove 514 is used as a cutting area, so that when the wire saw cutting mechanism 510 cuts the square silicon rod 800, the cutting of the square silicon rod 800 is not blocked by the cutting panel 511, and the diamond wire saw 513 can completely cut off the square silicon rod 800 in the radial direction.
Referring to fig. 8, the clamping jaw mechanism is used for clamping and fixing a silicon crystal square bar 800 being cut, so as to prevent edge breakage of the cutting end face. Specifically, the clamping jaw mechanism includes clamping jaw units 520 symmetrically disposed on two sides of the yielding groove 514, the clamping jaw units 520 include a first linear reciprocating device 521, a positioning clamping jaw 522, a balancing clamping jaw 523 and a displacement clamping jaw 524, the balancing clamping jaw 523 and the displacement clamping jaw 524 are both mounted on the positioning clamping jaw 522, the balancing clamping jaw 523 and the displacement clamping jaw 524 have abutting surfaces facing to a silicon crystal bar to be cut, the balancing clamping jaw 523 and the displacement clamping jaw 524 are respectively disposed on two sides of the diamond wire saw 513 below the yielding groove 514, and one end of a telescopic rod of the linear reciprocating device is fixed with the positioning clamping jaw 522. Referring to fig. 8A, when the cutting operation of the square silicon rod 800 is not performed or just begins to cut, the clamping jaw mechanism is separated from the polysilicon rod, and after the clamping jaw mechanism is disposed in the cutting area of the cutting panel 511, when the radial cutting depth of the square silicon rod 800 reaches about two thirds, referring to fig. 8B, the linear reciprocating device pushes the positioning clamping jaw 522 to drive the abutment plane of the balance clamping jaw 523 and the displacement clamping jaw 524 mounted on the positioning clamping jaw 522 to contact with the square silicon rod 800, so as to clamp the square silicon rod 800, thereby overcoming the action force generated at the cutting end face to the outer side of the end face and preventing edge breakage. Preferably, the balance clamping jaw 523 and the displacement clamping jaw 524 are respectively positioned at two sides of the diamond wire saw 513 below the abdication groove 514, so that the balance clamping jaw 523 clamps the rest part of the square silicon crystal bar 800, the displacement clamping jaw 524 clamps the cut part of the square silicon crystal bar 800, and the outward acting force generated by two sections of bars on the cutting end face is ensured to prevent the cutting end face from being broken. Of course, the first linear reciprocating device 521 is disposed on the clamping jaw units 520 on the left and right sides of the yielding groove 514, so that the user can control the two linear reciprocating devices through the unified starting switch, thereby realizing synchronous driving of the clamping jaw units 520, and the synchronous control technology is mature and will not be described herein.
Referring to fig. 4 to 6, the sliding mechanism is used as a connecting member between the cutting panel 511 and the clamping jaw, so that the clamping jaw mechanism can slide up and down along the cutting panel 511. Specifically, the sliding mechanism includes sliding units 530 symmetrically disposed on two sides of the abdicating groove 514, the sliding units 530 include a vertical sliding rail 531 and a vertical sliding block, the vertical sliding rail 531 is fixed on the cutting panel 511 on two sides of the abdicating groove 514, the vertical sliding block can slide up and down along the vertical sliding rail 531, and the linear reciprocating device is fixed on the vertical sliding block. In the cutting process of the square silicon crystal rod 800, the left and right clamping jaw units 520 respectively abut against the side walls of the polysilicon rod, after the clamping jaw mechanisms clamp the square silicon crystal rod 800, the square silicon crystal rod 800 is not cut off, at this time, the wire saw cutting mechanism 510 still needs to move downwards, but the position of the polysilicon rod is fixed, and in order to ensure the normal cutting operation, a sliding mechanism needs to be arranged to enable the wire saw cutting mechanism 510 to move downwards, and the position of the clamping jaw mechanisms remains unchanged.
The lifting mechanism is used for driving the wire saw cutting mechanism 510 to descend to cut the silicon crystal square bar 800, and driving the wire saw cutting mechanism 510 to lift to finish retracting. Specifically, the lifting mechanism is mounted on the beam of the frame 200, and the lifting mechanism is used for driving the wire saw cutting mechanism 510 to cut the silicon crystal bar.
The double-station rotary workbench designed in the silicon crystal cutting machine realizes the position exchange of the two clamping stations on the workbench, so that when one station performs cutting work, the feeding and discharging operation of the other station is not hindered, the bar cutting and feeding and discharging are performed simultaneously, the cutting area does not need to wait for feeding and discharging time, and the production efficiency is greatly improved; the edge breakage prevention cutting device in the cutting machine combines the wire saw cutting mechanism and the clamping jaw mechanism, the displacement of the wire saw cutting mechanism is fully utilized, an independent clamping jaw moving mechanism is not required to be designed, the clamping jaw mechanism is arranged in a cutting area at the abdicating groove of the cutting panel, the clamping jaw mechanism clamps the rod bodies on two sides of the cutting joint of the silicon crystal square rod in the cutting process, the cutting fixing effect on the silicon crystal square rod can be achieved, the silicon crystal square rod can be prevented from being broken when the silicon crystal square rod is to be cut off, the situation that the edge breakage occurs on the cutting end face is avoided, the edge breakage prevention cutting device is simple in operation action and wide in application range, the silicon crystal cutting machine is high in cutting efficiency, good in processed silicon crystal quality and strong in market competitiveness.
Referring to fig. 9 and 12, as a preferred embodiment of the present invention, the dual-station rotary table 400 includes a table 410, a rotary mechanism 420, and a driving mechanism 430.
The workbench 410 serves as a clamping platform of the square silicon crystal rod 800, and the square silicon crystal rod 800 is fixed on the workbench 410 for cutting processing. Specifically, the workbench 410 has two clamping stations 411, and the clamping stations 411 are symmetrically disposed on two sides of the workbench 410. The two clamping stations 411 are arranged on the workbench 410, so that the workbench 410 can realize simultaneous cutting and feeding and discharging without causing interference. Preferably, the two clamping stations 411 are respectively located at two sides of the working platform 410, and the working positions of the two working platforms 410 can be interchanged by rotating 180 degrees.
The rotation mechanism 420 is used for driving the workbench 410 to perform rotation motion, so that the two clamping stations 411 are exchanged, so that when one station performs cutting, the feeding and discharging operations of the other station are not hindered, the cut bar is taken down and put on the bar to be cut, the bar cutting and feeding and discharging are performed simultaneously, and the cutting area does not need to wait for feeding and discharging time. Specifically, the rotation mechanism 420 includes a rotation main shaft 421, a bearing 422 and a rotation gear 423, where the bearing 422 and the rotation gear 423 are both sleeved outside the rotation main shaft 421. Preferably, the rotary spindle 421 and the workbench 410 are detachably connected, so that maintenance or replacement of the rotary spindle 421 and the workbench is facilitated. The workbench 410 may be sleeved outside the rotary spindle 421, or the workbench 410 may be fixed at the top end of the rotary spindle 421. In some other embodiments, the swing mechanism 420 further includes a rotating shaft sleeve 424, an upper bearing cap 425 and a lower bearing cap 426, wherein the rotating shaft sleeve 424 is sleeved on the outer portion of the rotating spindle 421, the lower bearing cap 426 is disposed at the bottom end of the rotating spindle 421, and the upper bearing cap 425 is sleeved on the rotating spindle 421 below the working table 410. The rotating shaft sleeve 424 plays a role in protecting the rotating spindle 421, and simultaneously facilitates the rotation of the rotating spindle 421. The upper and lower bearing caps 426 seal the upper and lower portions of the rotary spindle 421 to prevent leakage of lubricant and prevent cutting dust of the square silicon crystal bar 800 from falling into the same to affect rotation of the rotary spindle 421.
The driving mechanism 430 provides driving force for driving the swing mechanism 420 and the table 410 to rotate. Specifically, the driving mechanism 430 includes a telescopic mechanism 431 and a transmission rack 432, the transmission rack 432 is meshed with the rotary gear 423, a telescopic end of the telescopic mechanism 431 is fixed to the transmission rack 432, and a telescopic length of the telescopic end is one half of a circumference of the rotary gear 423. In this embodiment, the telescopic mechanism 431 performs a linear reciprocating motion, the telescopic mechanism 431 has a telescopic rod connected to a driving rack 432, and the telescopic end moving along with the telescopic rod drives the driving rack 432 fixed to the telescopic rod to perform a linear motion, and the rotary gear 423 meshed with the driving rack 432 converts the linear motion of the driving rack 432 into a rotary motion to drive the rotary spindle 421 to rotate. As shown in fig. 10 and 11, fig. 10 and 11 are schematic front views of the device when the telescopic end moves to the minimum stroke and the maximum stroke, respectively, and the working areas of the clamping stations 411 are interchanged. Preferably, the telescopic length of the telescopic end, that is, the linear movement distance of the telescopic end for linear reciprocating movement is half of the circumference of the rotary gear 423, so that the telescopic end is controlled to move to the maximum stroke or the minimum stroke, the rotary spindle 421 and the workbench 410 rotate 180 degrees, and the exchange of the two clamping stations 411 of the workbench 410 is realized, that is, the two workbenches 410 perform the rotation in position in the cutting area and the loading and unloading area. Specifically, the telescopic mechanism 431 may be an air cylinder or a hydraulic cylinder. The adoption of the driving mechanism 430 replaces the traditional mode of using a servo motor, a speed reducer and a worm gear to realize rotary motion, the production and manufacturing cost of the device is greatly reduced, the market competitiveness of the product is greatly improved, and the applicability is wider.
In the embodiment shown in fig. 9 to 12, the dual-station rotary table 400 further includes a positioning buffer mechanism, where the positioning buffer mechanism is used to determine whether the rotary spindle 421 is in place when rotating 180 ° and buffer the impact force driven by the rotary spindle 421 when the rotary spindle 421 rotates in place. Specifically, the positioning and buffering mechanism includes a rotary positioning block 440 and a buffering rod 450, the rotary positioning block 440 is fixed on the rotary spindle 421, the rotary positioning block 440 is linked with the rotary spindle 421, the two buffering rods 450 are symmetrically arranged along the rotary spindle 421, the buffering rods 450 are located on the moving path of the rotary positioning block 440, and when the telescopic end of the telescopic mechanism 431 moves to the maximum stroke and the minimum stroke, the two buffering rods 450 respectively abut against the rotary positioning block 440. That is, when the rotation positioning block 440 rotates 180 ° clockwise or 180 ° counterclockwise in this structure, the rotation positioning block 440 contacts the buffer rod 450, and the buffer rod 450 is used to buffer the impact force generated during the movement of the rotation positioning block 440, so as to prevent the large noise generated by the vibration. With this structure, when the telescopic mechanism 431 performs linear telescopic motion, the telescopic end pushes the rack to drive the rotary gear 423 to rotate, thereby driving the rotary positioning block 440 to rotate, when the telescopic end is ejected out to reach the maximum stroke, the rotary positioning block 440 contacts the buffer rod 450 first, when the rotary positioning block 440 contacts the buffer rod 450, the rotary spindle 421 is described to rotate in place, in order to avoid the impact generated by the cylinder pushing to the maximum stroke or shrinking to the minimum stroke with the rotary positioning block 440, the buffer rod 450 is used for flexible contact, so as to avoid impact vibration, reduce equipment abrasion, and prolong the service life of the double-station rotary workbench 400.
Referring to fig. 13, in a specific embodiment, the buffer rod 450 includes a limit screw 451, a spring 452 and a push rod 453, where the limit screw 451 has a receiving cavity, the spring 452 is disposed in the receiving cavity, one end of the push rod 453 abuts against the spring 452, and the other end of the push rod 453 may abut against the rotational positioning block 440. In the use process of the double-station rotary table 400, the rotary positioning block 440 is first contacted with the ejector rod 453 of the buffer rod 450, and the ejector rod 453 compresses the spring 452 to weaken the impact force of the rotary positioning block 440 by using the elastic buffer force of the spring 452. In certain preferred embodiments, the buffer rod 450 further includes an adjustment nut 454, the adjustment nut 454 is sleeved outside the stop screw 451, and the adjustment nut 454 is in threaded engagement with the stop screw 451. The adjusting nut 631 is arranged to cooperate with the limiting screw 451 to adjust the position of the entire buffer rod 450, specifically, the limiting screw 451 is rotated to adjust the front and rear positions of the limiting screw 451 relative to the adjusting nut 631, so as to ensure that the rotary positioning block 440 can contact the ejector rod 453 of the buffer rod 450, so that the entire buffer rod 450 plays a role in weakening the impact force of the rotary positioning block 440.
Referring to fig. 9 and 14, as a preferred embodiment of the present invention, the driving mechanism 430 further includes a rack fixing seat 470, wherein the rack fixing seat 470 serves to protect the transmission rack 432 and the rotation gear 423, and further a movement path is preset for the transmission rack 432 through the rack fixing seat 470, so that the linear movement of the transmission rack 432 is more accurate and smooth. Specifically, the rack fixing seat 470 is sleeved outside the rotating gear 423, the rack fixing seat 470 is not in contact with the rotating gear 423, the rack fixing seat 470 is provided with a rack sliding rail 471, the transmission rack 432 is located in the rack sliding rail 471, and the transmission rack 432 is meshed with the rotating gear 423 located inside the rack fixing seat 470.
As a preferred embodiment of the present invention, the rotary positioning block 440 is located inside the rack fixing seat 470, a buffer rod accommodating hole 472 is formed on a side wall of the rack fixing seat 470, and the adjusting nut 454 of the buffer rod 450 is fixed on the buffer rod accommodating hole 472. In this embodiment, the rack fixing base 470 can also protect the rotary positioning block 440, and ensure the aesthetic appearance of the whole structure, and the rack fixing base 470 also serves as a supporting and mounting structure of the buffer rod 450, so as to facilitate the mounting and fixing of the buffer rod 450. In some embodiments, the dual-station rotary table 400 further includes a working platform 460, where the working platform 460 is used as a mounting support mechanism for the whole mechanism, and the working platform 460 lifts the rotary mechanism 420 to a certain height, so as to facilitate the rotary motion.
As a preferred embodiment of the present invention, the dual-station rotary table 400 further includes an electromagnetic locking mechanism 480, where the electromagnetic locking mechanism 480 is used for positioning and locking the rotary spindle 421 after the clamping station 411 moves to a specified position, so as to prevent the table 410 from shaking during the cutting operation of the square silicon crystal bar 800, resulting in edge breakage or even waviness of the cutting surface of the square silicon crystal bar 800, especially when the telescopic mechanism 431 uses a cylinder, the rotary spindle 421 is easy to shake due to the instability of the air source, and thus the electromagnetic locking mechanism 480 is very necessary. Specifically, the electromagnetic locking mechanism 480 includes a mounting frame 481 and electromagnetic locking bars 482, the electromagnetic locking bars 482 include an electromagnet and an adjusting bar, the adjusting bar is fixed on the mounting frame 481, the electromagnet is disposed at one end of the adjusting bar, the electromagnetic locking bars 482 are two, the two electromagnetic locking bars 482 are located on a path of movement of the rotating positioning block 440, and when the telescopic end of the telescopic mechanism 431 moves to a maximum stroke and a minimum stroke, the electromagnets of the two electromagnetic locking bars 482 respectively abut against the rotating positioning block 440. In this embodiment, the adjusting rod can adjust the position of the electromagnet according to the actual use condition, so that the electromagnet can contact with the rotary positioning block 440, when the telescopic end of the telescopic mechanism 431 moves to the maximum stroke and the minimum stroke, the silicon crystal square bar 800 fixed on one clamping station 411 needs to be cut, and the other clamping station 411 needs to be subjected to feeding and discharging operations, at this time, the workbench 410 needs to be stable, then the electromagnet is electrified to enable the electromagnet to attract the rotary positioning block 440, the rotary spindle 421 is prevented from shaking, and when the clamping station 411 needs to be switched, the electromagnet is powered off to demagnetize, so that the rotary spindle 421 can normally perform rotary motion. Preferably, in this embodiment, the buffer rod 450 is arranged to prevent the rotary positioning block 440 from causing a large impact to the electromagnet and abrasion to the electromagnet, so that the ejector rod 453 of the buffer rod 450 slightly exceeds the electromagnet, and the rotary positioning block 440 can contact the ejector rod 453 first to play a role in buffering. Preferably, the adjusting rod comprises a straight rod part and an adjusting nut 454 sleeved on the straight rod part, the adjusting nut 454 is fixed on the mounting frame 481, the straight rod part is rotated to change the position of the straight rod part relative to the adjusting nut 454, and finally the setting position of the electromagnet is changed.
Referring to fig. 9 to 11, as a preferred embodiment of the present invention, a clamping mechanism 490 is further disposed on the clamping station 411 of the dual-station rotary table 400, the clamping mechanism 490 is disposed on a side plate of the clamping station 411, and the clamping mechanism 490 is used for a silicon ingot to be cut. Depending on the clamping station 411 and the clamping mechanism 490, the dual-station rotary table 400 can clamp both round single crystal silicon rods and square polysilicon rods. In the embodiment shown in fig. 9, the clamping station 411 is provided with a square groove, which is suitable for clamping a square polysilicon rod, the clamping mechanism 490 is a telescopic cylinder arranged at the side edge of the clamping station 411, the telescopic rod of the telescopic cylinder faces the side wall of the polysilicon rod, the width of the clamping station 411 is controlled by controlling the telescopic rod, so that the clamping of the silicon crystal rod is realized, and the structural adaptability is stronger.
Referring to fig. 6 and 7, as a preferred embodiment of the present invention, the jaw unit 520 further includes a second linear reciprocating device 525, the second linear reciprocating device 525 is fixed to a side wall of the balancing jaw 523, and the positioning jaw 522 is provided with a balancing jaw limiting groove 526 for driving the balancing jaw 523 to move left and right in the balancing jaw limiting groove 526. The arrangement of the clamping jaw limit grooves limits the movement space and the movement path of the balance clamping jaw 523, and the installation of the balance clamping jaw 523 is more convenient. In this embodiment, the displacement jaw 524 and the balance jaw 523 are respectively driven by the first linear reciprocating device 521 and the second linear reciprocating device 525 to approach the side wall of the square silicon crystal rod 800, so as to clamp the polysilicon rod. The specific displacement clamping jaw 524 is also mounted on the positioning clamping jaw 522, and the first linear reciprocating device 521 pushes the positioning clamping jaw 522 to drive the side surface of the displacement clamping jaw 524 to contact against the plane polysilicon rod, so that the positioning clamping jaw 522 and the displacement clamping jaw 524 are linked in the direction of approaching the polysilicon rod, namely in the left-right movement direction. The clamping jaw unit 520 is configured in such a way that the displacement clamping jaw 524 and the balance clamping jaw 523 can move independently, so that on one hand, the displacement clamping jaw 524 can drive the cut silicon crystal bar material to move in other embodiments, and on the other hand, if the second linear reciprocating device 525 fails, the situation that the edge breakage occurs on the cutting end face can be reduced to a great extent by clamping the silicon crystal square bar 800 to be cut by using the displacement clamping jaw 524 independently.
In the embodiment shown in fig. 6 and 7, the positioning jaw 522 is further provided with a displacement jaw limiting groove 527, the jaw unit 520 further includes a third linear reciprocating device 528, the third linear reciprocating device 528 is disposed on a side wall of the positioning jaw 522, and a telescopic rod of the third linear reciprocating device 528 is fixed to the displacement jaw 524, so as to drive the displacement jaw 524 to move back and forth in the displacement jaw limiting groove 527. As shown in fig. 8C, in the present embodiment, after the silicon ingot 800 is cut, the third linear reciprocating device 528 drives the displacement jaw 524 to move back and forth along the axial direction of the silicon ingot 800 in the displacement jaw limiting groove 527, the third linear reciprocating device 528 and the first linear reciprocating device 521310 drive the movement direction of the displacement jaw 524 to be perpendicular to each other, and the third linear reciprocating device 528 acts to move the cut silicon ingot from above the diamond wire saw 513, so as to prevent the displacement jaw 524 from loosening the silicon ingot and dropping to break the diamond wire saw 513, thereby protecting the diamond wire saw 513. In a specific embodiment, the linear reciprocating device is any one of a cylinder, a hydraulic cylinder or a linear motor, and preferably, the linear reciprocating device can adopt a double-shaft cylinder or a double-shaft hydraulic cylinder, so that the thrust applied by the linear reciprocating device is more stable.
In a preferred embodiment, a guiding shaft is disposed in the displacement jaw limiting groove 527, and a sliding shaft sleeve is sleeved outside the guiding shaft and is fixed with the displacement jaw 524. In this embodiment, the third linear reciprocating device 528 drives the displacement jaw 524 to clamp the cut silicon crystal square bar 800 to move along the guiding shaft, and the guiding shaft is arranged to preset the movement path of the displacement jaw 524, so that the movement is more stable.
Referring to fig. 1, as a preferred embodiment of the present invention, the clamping and cutting unit includes a first edge breakage preventing cutting device 500 and a second edge breakage preventing cutting device 500, where the first edge breakage preventing cutting device 500 and the second edge breakage preventing cutting device 500 are arranged above the dual-station rotary table 400 side by side, and are respectively used for cutting two ends of the silicon ingot on the clamping station 411. In this embodiment, the clamping and cutting unit is provided with two edge breakage preventing cutting devices 500, so that both ends of the silicon crystal square bar 800 clamped on the clamping station 411 on the double-station rotary work can be cut simultaneously, so as to improve the cutting efficiency of the silicon crystal bar. Specifically, the wire saw cutting mechanism 510 in the edge chipping prevention cutting device 500 is an annular wire saw cutting mechanism or a wire saw cutting mechanism 510. Either the annular wire saw cutting mechanism 510 shown in fig. 5 or the wire saw cutting mechanism 510 shown in fig. 4 can be used as a cutting actuator for a polysilicon rod, and the two cutting operation mechanisms are relatively mature in technology and will not be described herein. Preferably, the wire saw cutting mechanism 510 in the clamping cutting unit can adopt an annular wire saw cutting mechanism 510, and the annular diamond wire saw 513 cutting mechanism 510 runs stably and fast when cutting work is performed, so that the cutting efficiency is high, and the quality is good.
In the embodiment shown in fig. 2 and 3, as a preferred embodiment of the present invention, the cutting machine further includes a cutting frame 700, the edge breakage preventing cutting device 500 is fixed to the cutting frame 700, the lifting mechanism includes a left upright lifting assembly 310 and a right upright lifting assembly 320, both ends of the cutting frame 700 are respectively fixed to lifting portions of the left upright lifting assembly 310 and the right upright lifting assembly 320, and the lifting portions of the left upright lifting assembly 310 and the right upright lifting assembly 320 move synchronously. In this embodiment, the two edge breakage preventing cutting devices 500 are both fixed on the cutting surface, and then driven to raise or lower by the lifting mechanism, so as to realize synchronous cutting of the silicon crystal square bar 800. In some embodiments, the left column lifting assembly 310 and the right column lifting assembly 320 may be linear motors, which are synchronously telescopic to drive the cutting deck 700 to perform lifting motion. In other embodiments, the left column lifting assembly 310 and the right column lifting assembly 320 may be ball screws, and the beam of the frame 200 is further provided with a double output shaft motor, and the double output shaft motor may uniformly drive the screws of the left ball screw and the right ball screw to rotate through the transmission of the transmission member, so as to drive the nuts 631 on both sides to move up and down simultaneously, and further drive the cutting frame 700 fixedly connected with the nuts 631 to lift. Specifically, the support is the portal frame, the portal frame is including setting up in the longmen stand and the top crossbeam of left and right sides, and the longmen stand encloses font's longmen structure with the top crossbeam, the cutting frame is as the middle part crossbeam of portal frame for installation prevents collapsing limit cutting device 500, and under the drive of left stand lifting unit 310 and right stand lifting unit 320 that sets up along left and right sides longmen stand, carries out the up-and-down motion, realizes the cutting to the silicon crystal bar.
Referring to fig. 2, as a preferred embodiment of the present invention, the clamping and cutting unit further includes a lateral displacement mechanism 600, where the lateral displacement mechanism 600 includes a first servo motor 610, a first ball screw, a second servo motor 620, and a second ball screw 630, bearings 632 are sleeved outside nuts 631 on the first ball screw and the second ball screw, the cutting panels 511 of the first edge breakage prevention cutting device 500 and the second edge breakage prevention cutting device 500 are respectively connected to the bearings 632 sleeved outside nuts 631 of the first ball screw and the second ball screw 630, the first servo motor 610 is used for driving the nuts 631 on the first ball screw 630 to rotate, and the second servo motor 620 is used for driving the nuts 631 on the second ball screw 630 to rotate. In this embodiment, the edge breakage preventing cutting device 500 may further perform lateral movement in the left-right direction, so that the silicon crystal bar clamped by the clamping jaw mechanism after cutting may be moved to a specified blanking area, so as to facilitate recovery processing of the cut bar. Specifically, the first servo motor 610 drives the screw nut 631 to rotate, so that the screw nut 631 moves left and right along the screw, and in order to ensure that the screw nut 631 rotates and the first edge breakage preventing cutting device 500 does not rotate, a bearing 632 is sleeved outside the nut 631 on the first ball screw. Similarly, the second servo motor 620 drives the second edge breakage preventing cutting device 500 to move left and right through the second ball screw. In actual use, it is necessary that the first edge breakage preventing cutting device 500 and the second edge breakage preventing cutting device move in opposite directions, which can be achieved by the opposite rotation directions of the first servo motor 610 and the second servo motor 620. In the preferred embodiment shown in fig. 2, the first ball screw and the second ball screw 630 may share the same screw, as long as the two anti-chipping cutting devices are kept moving in opposite directions, respectively.
As a preferred embodiment of the present invention, there are at least two clamping and cutting units, and the clamping and cutting units are uniformly arranged on the base 100 side by side. The at least two clamping and cutting units are arranged, so that the cutting processing of the silicon crystal bar stock with multiple stations can be realized at the same time, and the cutting processing efficiency is further improved. As shown in fig. 1, the three clamping and cutting units comprise three double-station rotary tables 400 and six edge breakage preventing cutting devices 500, so that six end faces of three silicon crystal bars can be cut simultaneously, the cutting efficiency is high, and the market competitiveness is strong.
It should be noted that, although the foregoing embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concepts of the present invention, alterations and modifications to the embodiments described herein, or equivalent structures or equivalent flow transformations made by the present description and drawings, apply the above technical solution, directly or indirectly, to other relevant technical fields, all of which are included in the scope of the invention.
Claims (10)
1. The silicon crystal cutting machine is characterized by comprising a base, a frame, a lifting mechanism and a clamping cutting unit;
The frame is arranged on the base;
the clamping and cutting unit comprises a double-station rotary workbench and an edge breakage preventing cutting device, the double-station rotary workbench is arranged on the base, and the edge breakage preventing cutting device is arranged above the rotary workbench;
the edge breakage prevention cutting device comprises a wire saw cutting mechanism, a clamping jaw mechanism and a sliding mechanism;
the wire saw cutting mechanism comprises a cutting panel, a guide wheel assembly and a diamond wire saw, wherein the guide wheel assembly is arranged on the cutting panel, the diamond wire saw is arranged in a wire groove of the guide wheel assembly, the diamond wire saw can move under the driving of the guide wheel assembly, and a abdication groove is formed in the cutting panel;
the clamping jaw mechanism comprises clamping jaw units symmetrically arranged on two sides of the abdication groove, the clamping jaw units comprise a first linear reciprocating device, a positioning clamping jaw, a balancing clamping jaw and a displacement clamping jaw, the balancing clamping jaw and the displacement clamping jaw are both arranged on the positioning clamping jaw, the balancing clamping jaw and the displacement clamping jaw are provided with abutting surfaces facing to a silicon crystal bar to be cut, the balancing clamping jaw and the displacement clamping jaw are respectively arranged on two sides of the diamond wire saw below the abdication groove, and one end of a telescopic rod of the linear reciprocating device is fixed with the positioning clamping jaw;
The sliding mechanism comprises sliding units symmetrically arranged on two sides of the abdication groove, the sliding units comprise vertical sliding rails and vertical sliding blocks, the vertical sliding rails are fixed on cutting panels on two sides of the abdication groove, the vertical sliding blocks can slide up and down along the vertical sliding rails, and the linear reciprocating device is fixed on the vertical sliding blocks;
the lifting mechanism is arranged on the cross beam of the frame and is used for driving the wire saw cutting mechanism to cut the silicon crystal bar.
2. The silicon wafer cutting machine of claim 1, wherein the dual-station rotary table comprises a table, a rotary mechanism, and a drive mechanism;
the workbench is provided with two clamping stations which are symmetrically arranged at two sides of the workbench;
the rotary mechanism comprises a rotary main shaft, a bearing and a rotary gear, wherein the bearing and the rotary gear are sleeved outside the rotary main shaft;
the driving mechanism comprises a telescopic mechanism and a transmission rack, the transmission rack is meshed with the rotary gear, the telescopic end of the telescopic mechanism is fixed with the transmission rack, and the telescopic length of the telescopic end is one half of the circumference of the rotary gear;
the workbench is fixedly connected with the rotary main shaft.
3. The silicon crystal cutting machine according to claim 2, wherein the double-station rotary table further comprises a positioning buffer mechanism, the positioning buffer mechanism comprises a rotary positioning block and buffer rods, the rotary positioning block is fixed on the rotary spindle, the rotary positioning block is linked with the rotary spindle, the two buffer rods are symmetrically arranged along the rotary spindle, the buffer rods are located on a path of movement of the rotary positioning block, and when a telescopic end of the telescopic mechanism moves to a maximum stroke and a minimum stroke, the two buffer rods are respectively abutted against the rotary positioning block.
4. The silicon crystal cutting machine according to claim 2, wherein the double-station rotary table further comprises an electromagnetic locking mechanism, the electromagnetic locking mechanism comprises a mounting frame and an electromagnetic locking rod, the electromagnetic locking rod comprises an electromagnet and an adjusting rod, the adjusting rod is fixed on the mounting frame, the electromagnet is arranged at one end of the adjusting rod, the number of the electromagnetic locking rods is two, the two electromagnetic locking rods are located on the moving path of the rotary positioning block, and when the telescopic end of the telescopic mechanism moves to the maximum stroke and the minimum stroke, the electromagnets of the two electromagnetic locking rods are respectively abutted against the rotary positioning block.
5. The silicon wafer cutting machine according to claim 1, wherein the clamping jaw unit further comprises a second linear reciprocating device, a balance clamping jaw limiting groove is formed in the positioning clamping jaw, and the second linear reciprocating device is fixed with the side wall of the balance clamping jaw and used for driving the balance clamping jaw to move left and right in the balance clamping jaw limiting groove.
6. The silicon wafer cutting machine according to claim 5, wherein the positioning clamping jaw is further provided with a displacement clamping jaw limiting groove, the clamping jaw unit further comprises a third linear reciprocating device, the third linear reciprocating device is arranged on the side wall of the positioning clamping jaw, and a telescopic rod of the third linear reciprocating device is fixed with the displacement clamping jaw and used for driving the displacement clamping jaw to move back and forth in the displacement clamping jaw limiting groove.
7. The silicon crystal cutting machine according to claim 1, wherein the clamping and cutting unit comprises a first edge breakage preventing cutting device and a second edge breakage preventing cutting device, and the first edge breakage preventing cutting device and the second edge breakage preventing cutting device are arranged above the double-station rotary table side by side and are respectively used for cutting two ends of the silicon crystal bar on the clamping station.
8. The silicon wafer cutting machine according to claim 7, further comprising a cutting frame, wherein the edge breakage preventing cutting device is fixed on the cutting frame, the lifting mechanism comprises a left upright lifting assembly and a right upright lifting assembly, two ends of the cutting frame are respectively fixed with lifting parts of the left upright lifting assembly and the right upright lifting assembly, and lifting parts of the left upright lifting assembly and the right upright lifting assembly synchronously move.
9. The silicon wafer cutting machine according to claim 7, wherein the clamping and cutting unit further comprises a transverse displacement mechanism, the transverse displacement mechanism comprises a first servo motor, a first ball screw, a second servo motor and a second ball screw, bearings are sleeved outside nuts on the first ball screw and the second ball screw, cutting panels of the first edge breakage prevention cutting device and the second edge breakage prevention cutting device are respectively connected with the bearings sleeved outside the nuts of the first ball screw and the second ball screw, the first servo motor is used for driving the nuts on the first ball screw to rotate, and the second servo motor is used for driving the nuts on the second ball screw to rotate.
10. The silicon wafer cutting machine according to any one of claims 1 to 9, wherein the number of the clamping and cutting units is at least two, and the clamping and cutting units are uniformly arranged on the base side by side.
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| CN201810691784.5A CN108858841B (en) | 2018-06-28 | 2018-06-28 | Silicon crystal cutting machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109648476B (en) * | 2019-01-31 | 2024-05-31 | 青岛高测科技股份有限公司 | Clamping device capable of clamping round bar and square bar |
| CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
| CN113290722B (en) * | 2021-06-22 | 2023-08-18 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
| CN115972417A (en) * | 2023-02-15 | 2023-04-18 | 山东新升光电科技有限责任公司 | Intelligent single line equipment based on crystal processing |
| CN117341076B (en) * | 2023-12-05 | 2024-02-23 | 江苏宁美新能源有限公司 | Edge cutting equipment for photovoltaic module processing and working method thereof |
| CN117584300B (en) * | 2023-12-07 | 2024-05-24 | 池州首开新材料有限公司 | Monocrystalline silicon piece cutting equipment and cutting method thereof |
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