CN114474441A

CN114474441A - Silicon rod cutting equipment and system

Info

Publication number: CN114474441A
Application number: CN202110954024.0A
Authority: CN
Inventors: 王新辉; 周波; 戴鑫辉; 李林
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-05-13

Abstract

The embodiment of the application provides a silicon rod cutting equipment and system, wherein, silicon rod cutting equipment includes: the wire cutting machine comprises a base, a main frame, a bearing table and a wire cutting device; a cutting space is formed between the top plate and the base of the main frame; the bearing platform is used for bearing the silicon rod; the linear cutting device and the bearing table can relatively slide along the horizontal direction; the wire cutting device comprises two first cutting wire wheel sets and at least three second cutting wire wheel sets, cutting wires wound on the first cutting wire wheel sets are parallel to each other respectively, and the wire cutting device is used for cutting the silicon rod along the first cutting wires; the cutting lines wound on the second cutting line wheel sets are parallel to each other and are used for cutting the silicon rod along a second cutting plane; the second section is vertical to the first section to obtain at least two small silicon rods with rectangular sections and the edge skin material. The silicon rod cutting equipment and the silicon rod cutting system provided by the embodiment of the application can solve the technical problem existing in the traditional scheme that small silicon wafers are cut through large silicon wafers.

Description

Silicon rod cutting equipment and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to silicon rod cutting equipment and a system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 micrometers or 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In a traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer firstly and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer, but in the laser scribing process, damage and defect states can be generated on the cross section of the small silicon wafer, and the conversion efficiency of a finally processed heterojunction battery is seriously influenced.

The size of the silicon rod is larger and larger at present, from 166mm to 182mm, then to 210mm, and may reach 230mm or even 250mm in the future, the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is required to be too high and is easy to break.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides silicon rod cutting equipment and a silicon rod cutting system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting apparatus comprising:

a base;

the main frame is arranged on the base, and a cutting space is formed between a top plate of the main frame and the base;

the bearing table is arranged on the main rack and used for bearing a silicon rod;

the wire cutting device is arranged on the base; the linear cutting device and the bearing table can relatively slide along the horizontal direction; the wire cutting device comprises two first cutting wire wheel sets and at least three second cutting wire wheel sets, cutting wires wound on the first cutting wire wheel sets are parallel to each other respectively, and the wire cutting device is used for cutting the silicon rod along the first cutting wires; the cutting lines wound on the second cutting line wheel sets are parallel to each other and are used for cutting the silicon rod along a second cutting plane; the second section is vertical to the first section to obtain at least two small silicon rods with rectangular sections and the edge skin material.

According to a second aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising:

the cutting equipment is used for cutting the silicon rod to obtain at least two small silicon rods with rectangular sections and edge leather;

the grinding equipment is used for grinding the small silicon rod;

the edge leather cutting equipment is used for cutting the edge leather;

and/or the slicing equipment is used for slicing the small silicon rod.

In the embodiment, the silicon rod is synchronously cut by the two first cutting surfaces and the at least three second cutting surfaces, so that at least two small silicon rods with smaller cross sectional areas are directly obtained, the cutting steps are fewer, the efficiency is higher, and the small silicon rods are subsequently cut to directly obtain small silicon wafers meeting the size requirements of the silicon wafers for preparing small heterojunction batteries without the step of laser scribing, so that the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

fig. 3 is a schematic view of a structure for cutting edge cladding in a silicon rod cutting method according to an embodiment of the present application;

fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 5 is a schematic view of a wire cutting device in the cutting apparatus shown in FIG. 4;

FIG. 6 is a schematic view illustrating a structure of the silicon rod cut by the wire cutting device in the cutting apparatus shown in FIG. 4;

fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 8 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 9 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 10 is a first structural schematic view of a wire cutting device in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 11 is a second structural schematic view of a wire cutting device in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 12 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 13 is a cross-sectional view of a clamping mechanism in a cutting device provided in accordance with an embodiment of the present application;

fig. 14 is a schematic structural diagram of another carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 15 is a cross-sectional view of a cutting reel in the cutting apparatus provided in the embodiments of the present application;

fig. 16 is a first schematic structural diagram illustrating a clamping device of the cutting apparatus according to the embodiment of the present application gripping the edge leather;

fig. 17 is a second schematic structural view illustrating that a clamping device of the cutting apparatus provided in the embodiment of the present application grabs the edge leather;

FIG. 18 is a schematic structural view of a silicon rod grinding apparatus provided in an embodiment of the present application;

FIG. 19 is a schematic structural view of the grinding apparatus shown in FIG. 18, in which small silicon rods are clamped on the sliding table device;

fig. 20 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 18;

fig. 21 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 18.

Reference numerals:

a 1-silicon rod; a 4-small silicon rods; a 5-small raw material pieces; a 6-offcut; a 61-arc top; a 62-corner; a 63-flaw-piece bar;

b 1-first section; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface;

1-a base;

2-a bearing platform; 211-1-a main load bearing portion; 211-2-an auxiliary carrier; 221-a limiting mechanism; 23-a clamping mechanism; 321-a clamp drive member mechanism; 232-telescopic rod; 233-clamping head; 251-flat plate type abutting plates; 252-L-shaped abutment plates; 261-preset opening;

301-main support; 302-reel support; 31-a cutting reel; 311-wire chase; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 424-headgear clip; 425-tailstock chuck; 426-grinding the fixed seat; 427-a collet; 431-grinding head;

51-a fixture; 52-a jaw; 521-a mounting part; 522-jaw body.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting device, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

The cutting device that this embodiment provided includes: the wire cutting machine comprises a base, a main frame, a bearing table and a wire cutting device. The cutting machine comprises a base, a main rack, a cutting mechanism and a cutting mechanism, wherein the main rack is arranged on the base, and a cutting space is formed between a top plate of the main rack and the base; the bearing table is arranged on the main rack and used for bearing the silicon rod; the linear cutting device is arranged on the base; the linear cutting device and the bearing table can relatively slide along the horizontal direction; the wire cutting device comprises two first cutting wire wheel sets and at least three second cutting wire wheel sets, cutting wires wound on the first cutting wire wheel sets are parallel to each other respectively, and the wire cutting device is used for cutting the silicon rod along the first cutting wires; the cutting lines wound on the second cutting line wheel sets are parallel to each other and are used for cutting the silicon rod along a second cutting plane; the second section is vertical to the first section to obtain at least two small silicon rods with rectangular sections and the edge skin material.

For the purpose of describing the cutting device in detail, the present embodiment further provides a cutting method as follows:

fig. 1 is a flowchart of a silicon rod cutting method according to an embodiment of the present disclosure, and fig. 2 is a schematic view of a silicon rod cutting method according to an embodiment of the present disclosure. As shown in fig. 1 and fig. 2, the cutting method provided in this embodiment includes:

step 101, limiting the silicon rod on cutting equipment.

Step 102, synchronously cutting the silicon rod by using a first cut surface and a second cut surface which are parallel to the length direction of the silicon rod, wherein the number of the first cut surfaces is two, and the two first cut surfaces are parallel; the number of the second sections is at least three, and the at least three second sections are mutually parallel; the second section is perpendicular to the first section to obtain at least two small silicon rods and a rim material with a plane and a cambered surface.

In this embodiment, the silicon rod is a single crystal silicon rod, and has a cylindrical shape, and the length direction of the silicon rod is the central line direction of the cylindrical shape, which may also be referred to as the axial direction.

The two first cut surfaces b1 are parallel and can be symmetrically arranged at two sides of the central line of the silicon rod a1, and the edge skin material at the top and the edge skin material at the bottom of the silicon rod are cut off. At least three second tangent planes b2 are parallel and distributed at intervals, the second tangent plane b2 is vertical to the first tangent plane b1, and the second tangent planes b2 at two sides cut off the edge leather at the left side and the edge leather at the right side. Silicon rod a1 is cut synchronously through two first cut surfaces b1 and at least three second cut surfaces b2, and at least two small silicon rods a4, as well as a left side leather, a right side leather, a top side leather and a bottom side leather are obtained.

The left and right side leather materials are provided with a plane and an arc surface, and the arc surface is connected with the plane. The top and bottom edge leather materials are provided with two vertical planes and arc surfaces connected between the two vertical planes.

In the traditional scheme, a cylindrical silicon rod is cut into a square rod with a rectangular cross section, then the square rod is cut to obtain a large silicon wafer with a large size, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, the silicon rod is cut by the two first cutting surfaces and the at least three second cutting surfaces in the step 102, so that at least two small silicon rods a4 with smaller cross-sectional areas are directly obtained, the cutting steps are fewer, the efficiency is higher, and the small silicon rods a4 are subsequently cut to directly obtain small silicon wafers meeting the size requirements of the silicon wafers for preparing small heterojunction batteries, so that the step of laser scribing is not needed, the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

The cutting step of the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the above technical solution, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground. Referring to the above steps, the small silicon rod a4 having a rectangular cross section and four surfaces parallel to the longitudinal direction thereof as side surfaces was obtained. After obtaining the small silicon rod a4, four side surfaces of the small silicon rod a4 were ground, and then the edge angle between two adjacent side surfaces in the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces, resulting in a ground small silicon rod a 4'.

The side face of the small silicon rod is ground, so that the surface of the small silicon rod is smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming is not needed in a laser scribing mode, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods are ground to form a chamfer surface, so that the cutting line can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

In the scheme, when the number of the second cut surfaces b2 is three, two second cut surfaces positioned at the outer side are symmetrically arranged at two sides of the central line of the silicon rod, and the ratio of the cross sectional areas of the obtained two small silicon rods a4 is 1:1-1: 6. The number and specific cutting position of the third cut surface b3 can be determined according to the size of the small silicon rod a4 and the size of the small silicon wafer to be produced, so as to meet the preparation requirements of small batteries with different specifications and sizes. In the present embodiment, the number of the second cut surfaces b2 is three, and the second cut surface b2 located in the middle passes through the center line of the silicon rod a1, so that the cross-sectional areas of the two small silicon rods s4 are equal.

One implementation is as follows: the number of the second cut surfaces b2 is three, the distance between the two second cut surfaces b2 positioned at the outer side is equal to the distance between the two first cut surfaces b1, and the length-width ratio of the cross section of the obtained small silicon rod a4 is 2: 1.

Furthermore, the cut leftwards and rightwards side edge leather materials can be cut, so that a silicon rod with a smaller cross section area can be obtained and utilized, and the waste of raw materials is reduced.

Fig. 3 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application. As shown in FIG. 3, a third cut surface b3 parallel to the length direction of the edge skin is used to cut the edge skin a6, and the third cut surface b3 is parallel to the bottom surface of the edge skin a6, so as to cut the arc-shaped top a61 of the edge skin.

Cutting the edge leather a6 by a fourth cut surface b4 parallel to the length direction of the edge leather, wherein the fourth cut surface b4 is vertical to the bottom surface of the edge leather a 6; the number of the fourth cut surfaces b4 is two, and the four cut surfaces b4 are symmetrically arranged on two sides of the flaw-piece material a6 to cut off corner portions a62 on two sides of the flaw-piece material a6, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

The sequence of cutting off the arc-shaped top a61 and the corner a62 of the edge leather can be interchanged, namely: the arc-shaped top part a61 can be cut off firstly, and then the corner part a62 can be cut off; the corner a62 may be cut off first, and then the arc top a61 may be cut off.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod is cut by applying the cutting method.

Fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application. As shown in fig. 4, the cutting apparatus includes: base 1, main frame 301, plummer 2 and wire cutting device. The main frame 301 is disposed on the base 1, the main frame 301 includes a top plate and a leg connected between the top plate and the base, and a certain gap is left between the top plate and the base to form a cutting space. The bearing table and the linear cutting device are both positioned in the cutting space for cutting operation.

The silicon rod a1 is disposed on the susceptor 2 in a horizontal direction. Means for fixing and limiting the silicon rod a1 may be further provided on the carrier table 2 to limit the movement of the silicon rod a1 during cutting.

The wire cutting device and the carrier 2 can move relatively in the horizontal direction, specifically, along the length direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1 or the vertical base 11, and the linear cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the wire wheel support moves relative to the bearing table 2 under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed, and the bearing table 2 moves relative to the linear cutting device under the driving action of the bearing table driving mechanism.

Specifically, a sliding guide extending horizontally is provided on the main frame 301 or the base 1, and the wire cutting device and the sliding guide can be matched to move horizontally, or the plummer and the sliding guide can be matched to move horizontally.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wound on the cutting wire wheel set is used for forming a first section and a second section to cut the silicon rod.

In a specific implementation manner, fig. 5 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 4, and fig. 6 is a schematic structural view of a silicon rod cut by the wire cutting device in the cutting apparatus shown in fig. 4. As shown in fig. 4 to 6, the carrier 2 is fixedly disposed in the middle of the lower surface of the top plate of the main frame, the silicon rod a1 is horizontally disposed on the carrier 2, and the two ends of the carrier 2 are respectively provided with a limiting mechanism and a tightening mechanism for tightening the silicon rod a1 from the two ends.

The base 1 is provided with sliding guides, for example: two sliding rails are arranged on the upper surface of the base 1 in parallel. The wire cutting device includes: a reel support 302 and a cutting reel 31. The reel support 302 is matched with the slide rail and moves along the slide rail under the driving action of the support driver.

Be provided with first cutting line wheelset and second cutting line wheelset on the line wheel support 302, wherein, first cutting line wheelset includes: cutting wheels 31-1, 31-2, 31-3 and 31-4; the second cutting line wheel set comprises: 31-5, 31-6, 31-7, 31-8, 31-9 and 31-10.

From the view point of fig. 5 and 6 only, the cutting wheels 31-1, 31-2 are at the same height, and the cutting wheels 31-3, 31-4 are at the same height and below the cutting wheels 31-1, 31-2. Annular cutting lines are wound on the cutting line wheels 31-1 and 31-2 and used as first cutting lines to cut the silicon rod; the cutting wire wheels 31-3, 31-4 are wound with annular cutting wires and used as another first cutting surface for cutting the silicon rod. The cutting wire wheels 31-1 and 31-3 are respectively arranged on the wire wheel bracket 302, or the cutting wire wheels and the wire wheel bracket can be arranged on the same rotating shaft. The cutting wire wheels 31-2 and 31-4 are respectively arranged on the wire wheel bracket 302, or the cutting wire wheels and the wire wheel bracket can be arranged on the same rotating shaft.

The cutting wire wheels 31-5 and 31-6 are arranged up and down to form a pair of wire wheels, the cutting wire wheels 31-7 and 31-8 are arranged up and down to form a pair of wire wheels, and the cutting wire wheels 31-9 and 31-10 are arranged up and down to form a pair of wire wheels. The three pairs of wire wheels are arranged side by side, the annular cutting lines wound on the cutting wire wheels 31-5 and 31-6 are used as second tangent planes, the annular cutting lines wound on the cutting wire wheels 31-57 and 31-8 are used as second tangent planes positioned in the middle, and the annular cutting lines wound on the cutting wire wheels 31-9 and 31-10 are used as another second tangent plane to cut the silicon rod. The cutting wheels 31-5, 31-7, 31-9 can be arranged on the same rotating shaft. Or 31-5 and 31-9 are respectively arranged on the reel supports 302, and 31-7 can be arranged on the same rotating shaft with 31-5 or 31-9.

It will be appreciated that the set of cutting lines comprises at least two cutting drums, wherein the two cutting drums are coplanar and the annular cutting line is wound around the two cutting drums. Further, the cutting string wheel set further comprises: tension pulley and action wheel, annular line of cut still around locating on tension pulley and the action wheel, the output at the line wheel driver is connected to the action wheel, drives the action wheel through the line wheel driver and rotates, and then drives the line of cut and rotate around each line wheel.

Spaces for silicon rods to pass through are reserved in the middle of the regions where the cutting wire wheels are arranged, and the silicon rods are cut through the cutting wires in the process that the wire wheel supports and the silicon rods move relatively.

As shown in fig. 5 and 6, in the two groups of cutting reels arranged on the left and the right, the reels can be fixed to the reel supports 302 on the side surfaces through rotating shafts. The left side and the right side of the reel bracket 302 respectively protrude outwards to form a space for accommodating the cutting reel. Alternatively, the cutting wire wheels 31-1 and 31-3 can be arranged on the same rotating shaft to rotate synchronously and driven by the same driver. The cutting wire wheels 31-2 and 31-4 can be arranged on the same rotating shaft to rotate synchronously and are driven by the same driver.

Of the three groups of cutting wire wheels which are arranged up and down, the left and right groups of wire wheels can be fixed on the wire wheel bracket 302 on the side surface through a rotating shaft, and the middle wire wheel can be arranged on the same rotating shaft with the left wire wheel or can be arranged on the same rotating shaft with the right wire wheel. For example: the cutting wire wheels 31-5 and 31-7 are arranged on the same rotating shaft to rotate synchronously. The rotating shaft is connected with the driving motor in a mode of direct connection driving, belt transmission, chain transmission or gear transmission, so that the driving motor drives the rotating shaft to rotate, and further drives the cutting wire wheel 31 to rotate. The wire wheels positioned below in each group are connected in the same way.

The bearing table is provided with a limiting mechanism, one end of the limiting mechanism is fixed to the bearing table, and the other end of the limiting mechanism is provided with a plurality of limiting parts which respectively abut against one ends of the small silicon rods and the side cladding to be cut. The quantity of pressing from both sides tight head is a plurality of, supports respectively to waiting to cut the other end that forms little silicon rod and limit cladding, and the both ends of every little silicon rod and limit cladding are equipped with respectively and press from both sides tight head and stop gear to press from both sides tight little silicon rod and limit cladding through stop gear and clamp head.

The clamping mechanism includes: the silicon rod clamping device comprises a clamping driving mechanism, a telescopic rod and a clamping head, wherein the rod is horizontally arranged between the clamping driving mechanism and the clamping head, and the telescopic rod extends out relative to the clamping driving mechanism and pushes the clamping head and a limiting mechanism to clamp the silicon rod from two ends. One end of the limiting mechanism is fixed to the bearing table, and the other end of the limiting mechanism is bifurcated into at least two limiting parts which are respectively abutted against one end of the small silicon rod to be cut. The number of the clamping heads is at least two, and the clamping heads are respectively propped against the other end of the small silicon rod to be cut. The number of the clamping heads is the same as that of the small silicon rods to be formed, so that the clamping heads and the limiting mechanism are tightly propped against the end part of each small silicon rod.

Furthermore, a limit leather material stopping mechanism can be arranged on the bearing table and is abutted against the periphery of the silicon rod for tightly pushing the limit leather material to avoid falling. When the offcuts need to be unloaded, the stop mechanisms are opened in sequence to unload the corresponding offcuts.

Fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Different from the above solution, in the cutting device shown in fig. 7, the reel bracket 302 is fixed on the base 1. The lower surface of the top plate of the main frame is provided with a slide rail, the bearing table 2 is matched with the slide rail and horizontally slides along the slide rail under the driving action of the bearing table driving mechanism, and then the silicon rod is driven to horizontally move relative to the wire wheel support.

Fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the scheme is that: in the cutting apparatus shown in fig. 8, the linear cutting device further includes, in a manner of long linear cutting: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single long wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used for uniformly winding the cutting wire on the wire winding mechanism 36 or the wire releasing mechanism 34.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the pay-off mechanism 34 also functions as a take-up mechanism 36, and the take-up mechanism 36 also functions as the pay-off mechanism 34 to reciprocate the cutting wire 31.

The cutting wire mentioned in this embodiment is a diamond wire, and is used for cutting a single crystal silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers from large silicon wafers in the prior art are overcome.

The length L of the small silicon rod is greater than the width W and the height H thereof, and the longitudinal direction of the small silicon rod is understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are cut simultaneously, so that the efficiency is higher.

In some embodiments of the present application, the method further comprises the steps of trimming the leather: and cutting the four pieces of edge leather in a direction with the section parallel to the axis of the silicon rod, wherein each piece of edge leather can be cut to obtain an outer edge leather and at least one middle edge leather. The outer side leather and the middle side leather are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the application, the thicknesses of the outer side edge leather and the middle edge leather are equal or different, so that the processing requirements of different subsequent products are met.

This embodiment also provides a device for cutting edge cladding material, as shown in fig. 9, the cutting device includes: the wire cutting machine comprises a base 1, a bearing table 2 and a wire cutting device, wherein the bearing table 2 and the wire cutting device move relatively, the bearing table 2 can move relative to the base, and the wire cutting device can also move relative to the base. The edge leather can be horizontally placed on the bearing table 2 or vertically placed on the bearing table. The wire cutting device may be an annular cutting wire, or a single long wire, as described above.

The wire cutting apparatus includes a gate-shaped reel holder 302 on which a plurality of sets of cutting reels 32 are disposed. Fig. 9 is provided with four stations, and four edge leather materials can be cut simultaneously. For one of the stations, the cutting device comprises a group of cutting wire wheels, at least two cutting wire wheels 32 are arranged horizontally or vertically, and cutting wires arranged on the two cutting wire wheels 32 are wound to form a tangent plane along horizontal extension or vertical extension so as to cut off the arc-shaped top or the corner of the edge leather. Fig. 10 shows the horizontal arrangement. When one station comprises two groups of cutting wire wheels, two corner parts of the edge leather can be cut off simultaneously by winding the cutting wires arranged on the two groups of cutting wire wheels. Figure 11 shows a view of two sets of cutting wheels.

For the above-mentioned plummer 2, this embodiment further provides a specific implementation manner: fig. 12 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application. Fig. 12 shows four stations for cutting four trimmings at the same time. For one of the stations, the carrier 2 has a preset opening 261, giving way to the cutting line. The preset opening 261 divides the front end of the bearing table into a main bearing part 211-1 and an auxiliary bearing part 211-2, and the main bearing part 211-1 and the auxiliary bearing part 211-2 are used for bearing the to-be-cut edge leather which is horizontally placed together.

When the edge leather material is required to be cut, the edge leather material is fixed on the bearing table in a flat mode, and at the moment, the edge leather material is located on the main bearing part, the auxiliary bearing part and the two preset openings. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the preset opening, and cutting is started from one end face of the edge leather until the end face of the other end is cut.

It can be understood that after the corner part of the edge leather is cut off, the edge leather side with the corner part cut off can be placed on the bearing table in the process of cutting off the arc-shaped top, and the bearing table does not need to be provided with a preset opening.

Fig. 13 is a cross-sectional view of a clamping mechanism in a cutting device provided in an embodiment of the present application. As shown in fig. 12 and 13, the carrier table is further provided with a limiting mechanism 221 and a clamping mechanism 23. The clamping mechanism comprises a clamping driving mechanism 231, an expansion link 232 and a clamping head 233, one end of the expansion link is fixed on the side face of the clamping driving mechanism, and the other end of the expansion link, which can expand and contract, is fixed on the clamping head and the clamping head 233 is arranged opposite to the limiting mechanism. The clamping driving mechanism is used for driving the telescopic rod to stretch and adjust the distance between the clamping head 233 and the limiting mechanism 221 so as to place the edge leather between the clamping head and the limiting mechanism, and the limiting mechanism 221 and the clamping head 233 are used for being pushed against the end faces of the two ends of the edge leather to fix the edge leather.

Further, the bearing device further comprises: and the flat-plate-type abutting plate 251 is fixedly arranged on the upper surfaces of the main bearing part 211-1 and the auxiliary bearing part 211-2, the upper surface of the main bearing part 211-1 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the main bearing part, and the upper surface of the auxiliary bearing part 211-2 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the auxiliary bearing part.

The flat plate type abutting plate 251 is a full-length flat plate type abutting plate, and one flat plate type abutting plate is fixed on each of the main bearing part 211-1 and the auxiliary bearing part 211-2. Or at least two flat plate type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

The carrier table is made of rigid material in order to support the edge leather and the components mounted thereon. The edge skin material of the brittle and hard material is brittle and hard. In order to avoid hard-to-hard contact between the edge skin material of the brittle and hard material and the bearing platform of the rigid material, an elastic flat-plate type abutting plate is arranged. When the bottom surface of the edge leather material with the arc-shaped end surface is placed on the elastic flat plate type leaning plate, the buffer is provided for the edge leather material, and the protection effect is achieved on the edge leather material.

Fig. 14 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application. As shown in FIG. 14, the L-shaped abutment plate 252 is fixed to at least the upper surface of one of the sub-bearing portions 211-2, the lateral arm of the L-shaped abutment plate 252 is fixed to the upper surface of the sub-bearing portion 211-2, and the sub-bearing portion 211-2 is flush with the end of the lateral arm of the L-shaped abutment plate fixed thereto. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be adapted. The L-shaped abutting plate can stably bear the edge leather with two adjacent vertical planes.

Fig. 15 is a cross-sectional view of a cutting reel in the cutting device provided by the embodiment of the application. As shown in fig. 15, the embodiment provides a structure of a cutting reel, a plurality of wire slots 311 arranged in parallel are arranged at the outer edge of the cutting reel, a cutting wire 32 is embedded in one of the wire slots 311, the cutting wire 32 is limited in the wire slot 311, and the cutting wire is prevented from being separated from the cutting reel in the rotating process. In addition, because the sliding friction exists between the cutting line and the wire groove 311, a lot of diamonds are distributed on the cutting line, so that the wire groove is seriously worn. After one wire groove is worn, other wire grooves can be directly used, the cutting wire wheel does not need to be frequently replaced, the maintenance is convenient, and the material and the maintenance cost are saved.

Fig. 16 is a first structural schematic view of the clamping device in the cutting apparatus provided in the embodiment of the present application gripping the edge leather, and fig. 17 is a second structural schematic view of the clamping device in the cutting apparatus provided in the embodiment of the present application gripping the edge leather. As shown in fig. 16 and 17, the cutting apparatus provided in this embodiment further includes a clamping device for grabbing the offcut material, and placing the offcut material on the carrier or leaving the carrier.

Specifically, the clamping device includes: the clamping device comprises a fixing piece 51 and two oppositely arranged clamping jaws 52, wherein at least one clamping jaw 52 is slidably arranged on the lower bottom surface of the fixing piece 51, so that the distance between the two clamping jaws 52 can be adjusted to adapt to the edge leather materials with different widths.

When the edge leather needs to be clamped, adjusting the distance between the two clamping jaws to be larger than the width of the edge leather, and moving the position of the clamping device to enable the two clamping jaws to be respectively positioned at two sides of the width direction of the edge leather; and then, adjusting the distance between the two clamping jaws to be smaller until the width direction of the edge leather is clamped. The cutting equipment that this application embodiment provided, realization that can be convenient through clamping device carries out the centre gripping to the side cladding, provides the advantage for the removal of side cladding.

Specifically, the holding jaw 52 includes: a vertical mounting plate 521 and a jaw body 522. At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed to the inner surface of the mounting plate 521. The jaws themselves are not of unitary construction, but are formed as two separate pieces of mounting plate and jaw body. The vertical mounting plate is a mounting base of the clamping jaw body and is a base on which the clamping jaw can move. Two independent parts of mounting panel and clamping jaw body, at the in-process of clamping jaw body centre gripping raw material stick, the wearing and tearing of clamping jaw body are very serious, only need to change clamping jaw body can, the mounting panel need not be changed.

Use the cutting equipment of the limit cladding of this application, can realize the cutting of the limit cladding that the terminal surface is the arc. The cutting process comprises the steps of firstly, cutting corner parts at two ends of the edge leather to form the edge leather with the end surface in a rectangular and arc combined shape; then, the arc on the top of the edge leather with the end face in the shape of the combination of the rectangle and the arc is cut to form a rectangular rod with the end face in the rectangle.

Before cutting the corners of the edge leather material, after the edge leather material is placed on the bearing device, laser marking positioning is firstly carried out through the laser positioning device, and the edge leather material is guaranteed to be placed at a proper and correct position. A bottom sensing device is fixed on the bearing table 2, whether the side leather is installed in place or not is detected, and only after all detection conditions are met, the clamping mechanism can move to tightly push the side leather and tightly compress and fix the side leather together with the limiting mechanism.

Before the cutting device cuts the arc top, the flaw-piece material is placed on the bearing device, then the material inductive switch is triggered, and the flaw-piece material is detected to be placed in position. At the moment, the laser positioner and the lateral sensing device fixed on the auxiliary bearing part of the bearing device are used for marking and positioning the leather materials, so that the leather materials are placed at the correct position, and the leather materials are positioned under all detection conditions. And starting the clamping mechanism to start extending movement, and finishing the positioning and clamping process of the edge leather.

As shown in fig. 9, a laser alignment device 38 and a spray lubrication device 39 are also included.

The laser alignment device is arranged above the flaw-piece cutting table, so that the function of accurately installing and feeding the flaw-piece is realized. Set up a plurality of laser generator on the laser alignment device, install before the boundary material cutting bed at the boundary material, laser generator opens the linear laser of formation, projects on load-carrying device. When the edge leather is installed on the bearing device, alignment is firstly carried out through linear laser, so that a rectangular block made of brittle and hard materials is formed after cutting and is just the size needed. Wherein, the position and the distance of each laser generator can be adjusted, and are specifically determined according to different flaw-piece material specifications.

The specific working process of the laser alignment device is as follows: and finding out the center line of the two wheels by using a tool or a measuring tool (a vernier caliper or a steel plate ruler). And adjusting the position of the focused laser marker to enable the laser emitted by the laser marker to be aligned to the middle line of the two wheels, and fixing the laser marker. Finding out the center line position on the edge leather material and marking. And adjusting the position of the edge leather material during feeding to enable the central line of the edge leather material to be aligned with the laser emitted by the laser line marker.

Spray lubricating arrangement and constantly spray cutting fluid toward vertical buddha's warrior attendant line in cutting process, promote the quality after the cutting of boundary leather material. The spraying and lubricating device is normally required to be installed above the edge leather cutting table, cutting liquid is continuously sprayed to the vertical diamond wire in the cutting process, the cutting liquid can vertically and directly flow to the position point of the edge leather to be cut, and the purpose of cooling and lubricating is achieved.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied, the tight mechanism in top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod together with stop gear.

Further, a position detection device is adopted for detecting the position of the silicon rod, and the cutting wire wheel is controlled to move to the target cutting position according to the position of the silicon rod. The position of the silicon rod is detected through the position detection device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the target cutting position to cut the silicon rod.

The apparatus structure for cutting edge cladding material provided by this embodiment may also be applied to cutting the silicon rod, for example: the line wheel structure, the detection device, the induction system, the spray lubrication system, the laser alignment system and the like can be used for the equipment.

Further, the embodiment also provides a grinding device for grinding the small silicon rod in the above steps. As shown in fig. 18 to 21, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. Wherein, the feeding assembly 42 is arranged in the feeding area 401, and the small silicon rods to be ground are assembled on the feeding assembly 42 from the feeding area 401, and then delivered to the grinding area 402. The grinding assembly 43 is disposed in the grinding region 402 for grinding the surface and/or corners of the small silicon rod.

Taking grinding of the small silicon rod a4 as an example, fig. 19 and 20 show the implementation of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is as follows: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; alternatively, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Taking the second scheme as an example: the small silicon rod a4 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 with respect to the slide table is adjusted to clamp the small silicon rod a 4. The small silicon rod a4 is moved to the mold area 402 by the moving slide table to be ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged in opposite directions, the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the small silicon rod a4 from both ends.

As shown in fig. 21, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rods for 45 degrees, and grinding the edges and corners of the small silicon rods; and then the other three edges and corners are ground by sequentially rotating 90 degrees.

The grinding unit 43 is provided with a grinding wheel for grinding the small silicon rod a 4. The grinding wheels comprise a rough grinding wheel and a fine grinding wheel, and the rough grinding and the fine grinding are respectively carried out on the small silicon rod a 4.

In the above-described embodiment, the small silicon rod is ground, typically by grinding its side surface, and in special cases also by grinding its end surface.

The present embodiment also provides a silicon rod cutting system, including: the cutting equipment is provided with two groups of first cutting line wheel sets and at least three groups of cutting line wheel sets and is used for synchronously cutting the silicon rods by using the first cutting surface and the second cutting surface to obtain at least two small silicon rods; grinding equipment for grinding the small silicon rod; and slicing equipment for slicing the small silicon rod. The cutting device can further comprise a cutting device for cutting the edge leather. And cutting the silicon rod by each cutting device according to the assembly line operation to obtain small silicon wafers.

Claims

1. A silicon rod cutting apparatus, comprising:

a base;

2. The cutting apparatus of claim 1, further comprising: the bearing table is fixed to the lower surface of the main frame;

the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to a sliding rail arranged on the surface of the base under the driving action of the bracket driving mechanism; the cutting line wheel set is arranged on the wire wheel support.

3. The cutting apparatus according to claim 1, wherein the wire cutting device comprises: a wire wheel bracket; the wire wheel bracket is fixedly arranged on the base; the cutting wire wheel set is arranged on the wire wheel bracket;

the bearing table slides relative to the base under the driving action of the bearing table driving mechanism.

4. The cutting apparatus according to claim 2 or 3, characterized in that each set of cutting line wheels comprises at least two cutting reels, wherein the two cutting reels are coplanar and form a first or a second tangent plane around the annular cutting line provided on the two cutting reels.

5. The cutting apparatus of claim 4, wherein a set of cutting line wheels further comprises: a tension pulley and a driving pulley; the annular cutting line is still around locating tension pulley and action wheel, and the action wheel is connected to the output of line wheel driver.

6. The cutting apparatus according to claim 2 or 3, wherein the wire cutting device further comprises: the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the pay-off mechanism and the take-up mechanism.

7. The cutting equipment according to claim 2 or 3, wherein the bearing table is provided with a clamping mechanism and a limiting mechanism which are respectively positioned at two ends of the silicon rod; the clamping mechanism includes: the silicon rod clamping device comprises a clamping driving mechanism, a telescopic rod and a clamping head, wherein the telescopic rod is horizontally arranged between the clamping driving mechanism and the clamping head, and the telescopic rod extends out relative to the clamping driving mechanism and pushes the clamping head and a limiting mechanism to clamp the silicon rod from two ends.

8. The cutting apparatus according to claim 7, wherein one end of the limiting mechanism is fixed to the bearing platform, and the other end is bifurcated into at least two limiting parts which respectively abut against one end of the small silicon rod to be cut and formed;

the number of the clamping heads is at least two, and the clamping heads are respectively propped against the other end of the small silicon rod to be cut.

9. The cutting apparatus according to claim 2 or 3, further comprising: and the position detection device is used for detecting the position of the silicon rod and controlling the cutting wire wheel to move to the target cutting position according to the position of the silicon rod.

10. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any of claims 1 to 9, for cutting silicon rods to obtain at least two small silicon rods with rectangular cross sections and a boundary material;

the grinding equipment is used for grinding the small silicon rod;

the edge leather cutting equipment is used for cutting the edge leather;

and/or the slicing equipment is used for slicing the small silicon rod.

11. The silicon rod cutting system as recited in claim 10, wherein the edge trim cutting apparatus comprises:

a base;

the bearing table is arranged on the base and used for bearing the edge leather;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the edge leather; the wire cutting device comprises at least one cutting wire wheel set, and cutting lines wound on the cutting wire wheel sets are used for cutting arc tops or corner parts of the side leather materials to obtain the side leather silicon rods with rectangular sections.