CN216506049U

CN216506049U - Silicon rod cutting equipment and system

Info

Publication number: CN216506049U
Application number: CN202121953471.6U
Authority: CN
Inventors: 薛俊兵; 李林; 周波; 陈明一
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-05-13
Anticipated expiration: 2031-08-19

Abstract

The embodiment of the application provides a silicon rod cutting equipment and system, wherein, equipment includes: a base; the bearing table is arranged on the base and used for bearing a silicon rod; the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises four cutting wire wheel sets, cutting wires wound on the cutting wire wheel sets are parallel to each other, and the cutting wire wheel sets are used for cutting the silicon rod along a first tangent plane; the two first cut surfaces are positioned on one side of the central line of the silicon rod, and the other two first cut surfaces are positioned on the other side of the central line of the silicon rod, so that a square rod, two first-class edge leather materials with two planes and an arc surface connected between the two planes, and two second-class edge leather materials with a plane and an arc surface connected with the plane are obtained.

Description

Silicon rod cutting equipment and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to silicon rod cutting equipment and a system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 micrometers or 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a square rod, then cutting the square rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer.

The silicon rods are larger and larger in size from 166mm to 182mm, then to 210mm, and may reach 230mm or even 250mm in the future, so that the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is too high in requirement and extremely easy to break.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides silicon rod cutting equipment and a silicon rod cutting system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting apparatus comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises four cutting wire wheel sets, cutting wires wound on the cutting wire wheel sets are parallel to each other, and the cutting wire wheel sets are used for cutting the silicon rod along a first tangent plane; the two first tangent planes are positioned on one side of the central line of the silicon rod, and the other two first tangent planes are positioned on the other side of the central line of the silicon rod, so that a square rod, two first-class edge leather materials with two planes and an arc surface connected between the two planes and two second-class edge leather materials with a plane and an arc surface connected with the plane are obtained.

According to a second aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising:

the cutting equipment is used for cutting the silicon rod to obtain a square rod;

the square rod cutting equipment is used for cutting the square rod to obtain a small silicon rod;

the grinding equipment is used for grinding the small silicon rod;

and/or the slicing equipment is used for slicing the small silicon rod.

This application embodiment sets up the plummer on the base and is used for bearing the weight of the silicon rod, and the line cutting device is provided with four cutting line wheelsets for cutting the silicon rod, directly obtaining the square rod, two first class limit cladding that have two planes and meet the cambered surface between two planes and have a plane and two second class limit cladding of the cambered surface that meets with this plane, also cut the side cladding when the cutting obtains the square rod, and its efficiency is higher.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

FIG. 3 is a schematic view of another silicon rod slicing method provided in the examples of the present application for slicing a silicon rod;

fig. 4 is a schematic structural diagram illustrating a cutting process performed on a first type of edge skin material in a silicon rod cutting method according to an embodiment of the present disclosure;

fig. 5 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 6 is a schematic structural view of a wire cutting device in a silicon rod cutting apparatus according to an embodiment of the present application;

FIG. 7 is a schematic view illustrating a structure of the cutting device shown in FIG. 6 for cutting the silicon rod;

fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 9 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 10 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 11 is a schematic structural view of still another silicon rod cutting apparatus provided in the embodiments of the present application;

fig. 12 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 13 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 14 is a schematic view illustrating a structure in which a wire cutting device cuts a middle bar in the cutting apparatus of FIG. 13;

fig. 15 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 16 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 15;

fig. 17 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 18 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 19 is a schematic view of still another silicon rod cutting apparatus according to an embodiment of the present application;

fig. 20 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 21 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 22 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 23 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 24 is a schematic structural view of a silicon rod grinding apparatus provided in an embodiment of the present application;

FIG. 25 is a schematic structural view of a square bar clamped on a slide table device in the grinding apparatus shown in FIG. 24;

fig. 26 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 24;

fig. 27 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 24.

Reference numerals are as follows:

a 1-silicon rod; a 2-middle rod; a 3-square bar; a 4-small silicon rods; a 5-small raw material pieces; a 6-first class offcut; a 61-class II trimmings; a 62-corner; a 63-flaw-piece bar;

b 1-first cut plane; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface;

1-a base; 11-a vertical base; 12-a stage drive mechanism;

2-a bearing platform;

302-reel support; 302-1-wire wheel mounting seat; 31-a cutting wire wheel; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 424-headgear clip; 425-tailstock chuck; 426-grinding the fixed seat; 427-a collet; 431-grinding head.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting device, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

The cutting device that this embodiment provided includes: base, plummer and wire cutting device. The bearing table is arranged on the base and used for bearing the silicon rod; the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises four cutting wire wheel sets; the four cutting line wheel sets are divided into two groups, and the cutting lines wound on each cutting line wheel set are used for cutting the silicon rod along the first cutting line; the four sections are parallel to each other and divided into two groups, and each group comprises two first sections; the two groups of first tangent planes are respectively arranged at two sides of the central line of the silicon rod to obtain a square rod, two first-class edge leather materials with two planes and an arc surface connected between the two planes, and two second-class edge leather materials with a plane and an arc surface connected with the plane.

Based on the above cutting device, the embodiment further provides a cutting method as follows:

fig. 1 is a flowchart of a silicon rod cutting method according to an embodiment of the present disclosure, and fig. 2 is a schematic view of a silicon rod cutting method according to an embodiment of the present disclosure. As shown in fig. 1 and fig. 2, the cutting method provided in this embodiment includes:

step 101, cutting the silicon rod by four first cutting surfaces parallel to the length direction of the silicon rod, wherein the four first cutting surfaces are parallel to each other and divided into two groups, and each group comprises two first cutting surfaces; the two groups of first tangent planes are respectively arranged at two sides of the central line of the silicon rod to obtain a middle rod with two planes and two cambered surfaces, two first-class boundary leather materials with two planes and the cambered surfaces connected between the two planes, and two second-class boundary leather materials with one plane and the cambered surfaces connected with the plane.

In this embodiment, the silicon rod is a single crystal silicon rod, and has a cylindrical shape, and the length direction of the silicon rod is the central line direction of the cylindrical shape, which may also be referred to as the axial direction.

Cutting the silicon rod a1 by four parallel first cut surfaces b1, wherein the four first cut surfaces b1 are parallel to each other and are divided into two groups, and each group comprises two first cut surfaces b 1; the two groups of first tangential surfaces b1 are symmetrically arranged on two sides of the central line of the silicon rod a 1. As shown in fig. 2, the uppermost first section b1 cuts off the second type of rim strip a61, and the second type of rim strip a61 has a plane and an arc surface connected to the plane. The first cut surface b1 below the first cut surface b cuts off the first class of edge leather a6 at the top, the first class of edge leather a6 is provided with two planes with different widths, and two sides of the two planes are connected through an arc surface.

The two first cut surfaces b1 located at the lower part are similar, and the first type of edge leather and the second type of edge leather at the bottom are cut off to obtain a middle rod a 2. The intermediate rod a2 has two parallel planes and an arc surface connected between the two parallel planes.

The first type of trim a6 and the second type of trim a61 together correspond to trim cut by conventional means. That is to say, have cut away the arc top of limit cladding and limit cladding simultaneously through above two first tangent planes b1, follow-up only need can obtain the small-edge cladding stick that the cross-section is the rectangle with two bights excision of first class limit cladding to the limit cladding utilizes, reduces the raw materials extravagant, realizes cutting the limit cladding simultaneously at the in-process of butt, has improved cutting efficiency.

102, cutting the intermediate rod by four second cutting surfaces parallel to the length direction of the silicon rod, wherein the four second cutting surfaces are parallel to each other and divided into two groups, and each group comprises two second cutting surfaces; the two groups of second tangent planes are symmetrically arranged on two sides of the central line of the silicon rod to obtain a square rod with a rectangular cross section, two first-class side cladding materials with two planes and an arc surface connected between the two planes, and two second-class side cladding materials with a plane and an arc surface connected with the plane.

Similar to step 101, the middle rod a2 is cut using four second cut planes b2, the second cut planes b2 being perpendicular to the first cut planes b 1. Two first-type flaw-piece a6 and second-type flaw-piece a61 and a square rod a3 are obtained.

103, cutting the square bar by a third section parallel to the length direction of the square bar, wherein the third section is parallel to the first section or the second section; the number of the third section is at least one, so as to obtain at least two small silicon rods.

The third cut b3 is parallel to the first cut b1 or the second cut b2, and cuts the square rod a 3. The number of the third cut surfaces b3 is at least one, for example: when the number of the third cut surfaces b3 is one, two small silicon rods a4 are obtained; when the number of the third cut surfaces b3 is two, three small silicon rods a4 are obtained.

In the conventional scheme, after the square bar is obtained in step 102, the square bar is cut to obtain a large silicon wafer with a large size, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, after the square rod a3 is obtained in step 102, the square rod a3 is further cut along the length direction to obtain the small silicon rod a4 with a smaller cross-sectional area, and then the small silicon rod a4 is cut to directly obtain a small silicon wafer meeting the silicon wafer size requirement for preparing a small heterojunction battery, so that the step of laser scribing is not needed, the product quality of the small silicon wafer is improved, and the conversion efficiency of the heterojunction battery is further ensured.

The step of cutting the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the above technical solution, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground.

One implementation is as follows: as shown in fig. 2, the small silicon rod a4 obtained by the above-described steps has a rectangular cross section, and four surfaces parallel to the longitudinal direction are side surfaces. After obtaining the small silicon rod a4, four side surfaces of the small silicon rod a4 were ground, and then the edge angle between two adjacent side surfaces in the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces, resulting in a ground small silicon rod a 4'.

The side face of the small silicon rod a4 is ground to make the surface smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming by a laser scribing mode is not needed, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods a4 are ground to form chamfered surfaces, so that the cutting lines can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

The other realization mode is as follows: fig. 3 is a schematic view of another silicon rod cutting method provided in the embodiment of the present application for cutting a silicon rod. As shown in fig. 3, the square bar a3 obtained through the above steps has a rectangular cross section, and four surfaces parallel to the longitudinal direction are side surfaces. After the square rod a3 was obtained, four side surfaces of the square rod a3 were ground, and then corners between two adjacent side surfaces of the square rod a3 were ground to form chamfered surfaces between the two side surfaces, resulting in a ground square rod a 3'.

Then, step 103 is executed, the square rod a 3' is cut by the third cut surface b3, and the small silicon rod a4 is obtained. The side surfaces opposite to each other between the small silicon rods a4 are the surfaces formed after the cutting of the third cut surface b3, and the surfaces are ground. Then, the edge angle between the opposite side surfaces and the adjacent side surfaces between the small silicon rods a4 was ground to form a chamfered surface between the two side surfaces, resulting in ground small silicon rods a 4'.

Taking the example of cutting two small silicon rods a4 by a third cut surface b3, the opposite surfaces of the two small silicon rods a4 are ground to improve the smoothness of the surfaces. Then, the edge angle between the surface and the upper and lower surfaces of the small silicon rod a4 was ground to form a chamfered surface. The technical effect of the grinding is as described above.

In the above embodiment, when the number of the third cut surfaces b3 is one, the ratio of the cross-sectional areas of the two small silicon rods a4 obtained is 1:1 to 1: 6. The number of the third cuts b3 and the specific cutting positions can be determined according to the size of the square rod a3 and the size of the small silicon wafers to be produced, so as to meet the preparation requirements of small cells with different specifications. In this embodiment, the number of the third cut surfaces b3 is one, and the cross-sectional areas of the two small silicon rods s4 passing through the center line of the square rod s3 are equal.

One implementation is as follows: the distance between the two second cut surfaces b2 on the inner side and the center line of the silicon rod is equal to the distance between the two first cut surfaces b1 on the inner side and the center line of the silicon rod, so that the square rod a3 with a square section is obtained.

Furthermore, the first-type offcut a6 obtained by cutting in the

steps

101 and 102 can be cut to obtain an offcut rod with a smaller cross section, and the offcut rod can be utilized to reduce the waste of raw materials.

Fig. 4 is a schematic structural diagram illustrating a cutting process performed on a first type of offcut in the silicon rod cutting method according to the embodiment of the present application. As shown in fig. 4, the first offcut a6 was cut with a fourth cut surface b4 parallel to the length direction of the silicon rod, and the fourth cut surface b4 was perpendicular to the plane of the first offcut a6, so that the corner portion a62 of the first offcut a6 was cut, and an offcut rod a63 having a rectangular cross section was obtained.

In a specific embodiment, the number of the fourth cutting surfaces b4 is two, and the fourth cutting surfaces b4 are symmetrically arranged on two sides of the first-type flaw-piece material a6 to synchronously cut off corner portions a62 on the two sides, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod is cut by applying the cutting method.

Fig. 5 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application. As shown in fig. 5, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 and wire cutting device all set up on base 1.

The carrying table 2 is used for carrying the silicon rod a1, the silicon rod a1 is placed on the carrying table 2, and a part for fixing and limiting the silicon rod a1 can be further arranged on the carrying table 2 so as to limit the silicon rod a1 to move in the cutting process. The silicon rod a1 can be flatly placed on the bearing platform 2, and also can be vertically placed on the bearing platform 2, specifically, the silicon rod a1 is flatly placed on the bearing platform 2, and the length direction of the silicon rod a1 extends along the horizontal direction; the silicon rod a1 is placed vertically on the susceptor 2, and the length direction of the silicon rod a1 extends in the vertical direction. When the silicon rod a1 is placed in different manners, the configuration and cutting manner of the wire cutting apparatus are also different.

The wire cutting device and the carrier 2 can be moved relatively in the longitudinal direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the wire wheel support moves relative to the main support under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed on the base 1, and the bearing table 2 moves relative to the linear cutting device under the driving action of the driving mechanism.

The wire cutting device comprises four first cutting wire wheel sets or four second cutting wire wheel sets. The four first cutting wire wheels are divided into two groups, and the cutting wires wound on the two cutting wire wheels are used for cutting the silicon rod along the first cutting wires; the four second cutting wire wheel groups are divided into two groups, and each group comprises at least four cutting wire wheels; and the cutting lines wound on the two cutting line wheels are used for cutting the silicon rod along the second section.

Specifically, the cutting equipment is provided with a first cutting line wheel set and used for cutting the silicon rod along a first cutting line to obtain an intermediate rod, then the intermediate rod rotates 90 degrees along the axis of the intermediate rod, and then the first cutting line wheel set is used for cutting along a second cutting line.

Or two cutting devices are adopted, a first cutting line wheel set and a second cutting line wheel set are respectively arranged, after the middle rod is obtained by cutting through the first cutting line wheel set in one cutting device, the middle rod is moved to the other cutting device, and the middle rod is cut through the second cutting line wheel set to obtain the square rod.

Fig. 6 is a schematic structural view of a wire cutting device in a silicon rod cutting apparatus according to an embodiment of the present application, and fig. 7 is a schematic structural view of the cutting device shown in fig. 6 cutting a silicon rod. As shown in fig. 5 to 7, the susceptor 2 is provided on the base 1, and the silicon rod a1 is placed on the susceptor 2 in a horizontal direction. An annular cutting line is wound on a cutting wire wheel in the wire cutting device, and the cutting wire wheel horizontally moves to cut the silicon rod a 1. Specifically, the wire cutting apparatus includes: the wire wheel support 302 and the support driving mechanism are arranged on the base 1, a slide rail extending horizontally is arranged on the base 1, the wire wheel support 302 horizontally moves along the slide rail under the driving action of the support driving mechanism, and the moving direction of the wire wheel support is the same as the length direction of the silicon rod a 1. The reel support 302 is a door-shaped support, and two leg portions of the reel support are matched with the sliding rail.

The cutting reel 31 is arranged on the reel bracket 302. Each group of cutting line wheel set comprises at least two cutting line wheels, wherein the two cutting line wheels are coplanar and form a first tangent plane by winding annular cutting lines arranged on the two cutting line wheels.

A specific implementation, as shown in fig. 5 and fig. 6 for view angle: two stations are arranged on the reel support 302 and used for cutting two silicon rods. And two groups of cutting wire wheel sets are arranged at one station and are arranged up and down so as to cut the top and the bottom of the silicon rod. Taking the following group of cutting line wheel sets as an example, the cutting line wheel set comprises four cutting line wheels 31, and the rotation center of the cutting line wheels is arranged along the vertical direction, namely: the cutting reel 31 rotates horizontally. The cutting wire wheel 31 is fixed on the wire wheel bracket 302 through an L-shaped wire wheel mounting seat 302-1.

Of the four cutting wire wheels 31, two cutting wire wheels 31 with the same height form a pair, and the height of one pair of cutting wire wheels is higher than that of the other pair of cutting wire wheels. The distance between the two higher cutting wheels 31 is smaller than the distance between the two lower cutting wheels 31. The annular cutting line 32 wound on the two higher cutting line wheels 31-a extends along the horizontal direction to form a first section; the annular cutting line 32 wound on the two lower cutting wheels 31-b extends along the horizontal direction to form another first cutting surface for cutting off the second type of edge leather. The first type of boundary leather is also obtained by matching the two first tangent planes.

The upper pair of cutting wheels 31-a and the lower pair are vertically staggered, so that during the cutting process, the silicon rod is firstly cut by the cutting wires 32 wound on one pair of cutting wheels, and then the silicon rod is cut by the cutting wires 32 wound on the other pair of cutting wheels.

The upper cutting wheel and the lower cutting wheel are symmetrically arranged, and the step 101 is executed by forming four first tangent planes by adjusting the position of each cutting wheel 31.

The cutting wire wheel forming a first tangent plane is wound with an annular cutting wire, the annular cutting wire is also wound on the tension wheel and the driving wheel, and the driving wheel is connected to the output end of the wire wheel driver.

In the cutting process, two cutting devices can be adopted, wherein the cutting line wheel set in one cutting device is used as a first cutting line wheel set, and the silicon rod is cut by the first cutting line to obtain an intermediate rod. And then, conveying the intermediate rod to another cutting device, wherein a cutting line wheel set in the device is used as a second cutting line wheel set, and cutting the intermediate rod by using a second cutting surface to obtain a square rod.

Or one cutting device is provided with two cutting stations which are respectively provided with a first cutting line wheel set and a second cutting line wheel set, and after the silicon rod is cut on the first station through the first cutting line wheel set to obtain the middle rod, the middle rod is moved to the second station and cut through the second cutting line wheel set to obtain the square rod.

Alternatively, one cutting device is provided with both the first cutting wire wheel set and the second cutting wire wheel set. The silicon rod is cut through the first cutting wire wheel group to obtain an intermediate rod, and then the intermediate rod is cut through the second cutting wire wheel group to obtain a square rod.

Fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. As shown in fig. 8, fig. 8 shows another cutting apparatus, the wire cutting device is fixed on the base 1. The plummer 2 horizontally moves along the slide rail arranged on the base 1, and then drives the silicon rod a1 horizontally moves thereon, and cuts the silicon rod by the wire cutting device.

Plummer 2 accessible plummer actuating mechanism drive removes, plummer actuating mechanism can include: driving motor, drive mechanism, lead screw and nut. The transmission mechanism is connected between the driving motor and the lead screw, and transmits the torque obtained by the driving motor to the lead screw to drive the lead screw to rotate. The nut is fixedly connected with the bearing platform 2, and the screw rod is matched with the nut to convert the rotating torque into the linear motion of the bearing platform 2.

Fig. 9 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. As shown in fig. 9, the difference from the apparatus shown in fig. 5 and 8 is that the cutting apparatus shown in fig. 9 employs a long wire cutting method. The wire cutting apparatus further includes: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single long wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used for uniformly winding the cutting wire on the wire winding mechanism 36 or the wire releasing mechanism 34.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the pay-off mechanism 34 also functions as a take-up mechanism 36, and the take-up mechanism 36 also functions as the pay-off mechanism 34 to reciprocate the cutting wire 31.

Fig. 10 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the apparatus shown in fig. 5 is that: the equipment shown in fig. 10 further comprises a vertical base 11, and the vertical base 11 is vertically fixed on the base 1. The vertical base 11 is provided with a slide rail extending vertically. The wire cutting device moves vertically along the slide rail. The bearing table 2 is arranged on the base 1 and extends vertically. The upper part and the lower part of the plummer 2 are respectively provided with a limiting mechanism and a jacking mechanism, the silicon rod a1 is vertically arranged between the limiting mechanism and the jacking mechanism, and the silicon rod a1 is clamped and fixed through the limiting mechanism and the jacking mechanism. The implementation manner of the linear cutting device can refer to the above contents, and the silicon rod is cut by specifically adopting the annular cutting line.

Further, the cutting apparatus further comprises: the silicon rod cutting device comprises a sleeve capable of moving vertically and a boundary leather clamping jaw, wherein the sleeve is used for being sleeved on the outer side of a silicon rod, the boundary leather clamping jaw is inserted between a boundary leather material and the cut silicon rod from the top, and a clamping force is applied to the boundary leather material by the boundary leather clamping jaw and the sleeve. The edge leather clamping jaws and the sleeve clamp the edge leather and move the edge leather to an edge leather recovery area.

Fig. 11 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference with the apparatus shown in fig. 10 is that the wire cutting device in fig. 11 is fixed to a vertical base 11, on which a vertically extending slide rail is provided, relative to which the carrier 2 is vertically movable.

Fig. 12 is a schematic view of a still another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the apparatus shown in fig. 10 and 11 is that the cutting apparatus shown in fig. 12 employs a long wire cutting method. The wire cutting apparatus further includes: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used for uniformly winding the cutting wire on the wire winding mechanism 36 or the wire releasing mechanism 34.

Fig. 13 is a schematic structural view of another silicon rod cutting apparatus according to an embodiment of the present application, and fig. 14 is a schematic structural view of a wire cutting device cutting an intermediate rod in the cutting apparatus shown in fig. 13. As shown in fig. 13 and 14, the cutting apparatus is a horizontal type cutting means in which the intermediate bar a2 is horizontally placed on the carrier table 2. The portal-shaped reel holder 302 can be horizontally moved with respect to the base 1, or the carrier 2 can be horizontally moved with respect to the base 1.

The cutting wire wheels 31 are arranged on the wire wheel support 302, and the cutting wire wheels 31 are staggered up and down and staggered left and right at preset positions so that the cutting wires wound on the pair of cutting wire wheels 31 form a second tangent plane. Four cutting lines are formed from left to right to cut the intermediate bar a2 with four second cutting planes.

The middle rod can be cut by adopting an annular cutting line or a long-line cutting line, and the specific implementation mode can refer to the content.

The cutting equipment provided by the above is used for cutting the silicon rod by the first cutting surface and the second cutting surface, and also can be used for cutting the silicon rod by the third cutting surface. Alternatively, the present embodiment also provides several specific cutting devices for cutting the square bar.

Fig. 15 is a schematic structural view of another silicon rod cutting apparatus according to an embodiment of the present application, and fig. 16 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 15. As shown in fig. 15 and 16, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 is fixed to be set up on base 1, and square stick a3 level is placed on plummer 2, and the both ends of plummer 2 are provided with stop gear and jacking mechanism respectively, follow the tight square stick a3 in both ends top.

The wire cutting device includes: a reel support 302 and a cutting reel 31. The reel support 302 is a door-shaped support, two leg portions of the reel support are arranged on the base 1 in a sliding mode, and the reel support 302 can move along the length direction of the square rod. The cutting wire wheel 31 is fixed on the wire wheel bracket 302 through a wire wheel mounting seat 302-1. At least one group of cutting wire wheels 31 can be arranged on the wire wheel bracket 302 and used for cutting at least one square rod. Each group comprises at least two cutting wire wheels 31 which are arranged along the horizontal direction, and the cutting wires 32 are wound on the two cutting wire wheels 31 along the horizontal direction to form a loop to cut the square rods, so that the small silicon rods are obtained.

Fig. 17 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application. The difference from fig. 15 is that: in the cutting device shown in fig. 17, the reel bracket 302 is fixed on the base 1, and the plummer 2 slides along the slide rail arranged on the base 1, so as to drive the square bar to move relative to the cutting reel.

Fig. 18 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 17 is that: the cutting apparatus shown in fig. 18 cuts the square bar using a long wire cutting method. Specifically, set up paying out machine structure 34, admission mechanism 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission mechanism 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single line is around locating between paying out machine structure 35, admission mechanism 36, winding displacement mechanism 35 and the line of cut wheelset.

Fig. 19 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 18 is that in the cutting device shown in fig. 19, the reel bracket 302 is fixed on the base 1, and the bearing platform 2 slides along the slide rail arranged on the base 1, so as to drive the square bar to move relative to the cutting reel.

Fig. 20 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Fig. 20 shows a vertical cutting mode, namely: the base 1 comprises a horizontal base and a vertical base, the bearing platform 2 is fixed on the horizontal base, and the square rod a3 is vertically arranged on the bearing platform 2. The top and the bottom of the bearing platform 2 are respectively provided with a limiting mechanism and a jacking mechanism which jack the square rod a3 from the upper end and the lower end. The vertical base is provided with a slide rail extending vertically, and the reel bracket 302 can vertically move along the slide rail. The wire wheel support 302 is provided with cutting wire wheels 31, and the cutting wires 32 are wound on at least two cutting wire wheels 31 along the horizontal direction to form a third tangent plane for cutting the square rod, so that a small silicon rod is obtained.

Fig. 21 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 20 is that in the cutting apparatus provided in fig. 21, the reel bracket 302 is fixed on the base 1, and the plummer 2 slides along the slide rail arranged on the vertical base, so as to drive the square bar to move relative to the cutting reel.

Fig. 22 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 21 is that the cutting apparatus shown in fig. 22 cuts the square bar using a long wire cutting method. Specifically, set up paying out machine structure 34, admission machine structure 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission machine structure 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single line is around locating between paying out machine structure 35, admission machine structure 36, winding displacement mechanism 35 and the line of cut wheelset.

Fig. 23 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 22 is that in the cutting apparatus provided in fig. 23, the reel bracket 302 is fixed on the base 1, and the plummer 2 slides along the slide rail arranged on the vertical base, so as to drive the square rod to move relative to the cutting reel.

The cutting device can also be used for cutting edge leather, for example: in the apparatus shown in fig. 13, in the case where only two sets of cutting reels are used, the edges and corners of the trimmings are cut off around the cutting lines provided on the cutting reels 31.

The cutting wire mentioned in this embodiment is a diamond wire, and is used for cutting a single crystal silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers from large silicon wafers in the prior art are overcome. The edge leather is directly cut in the process of cutting, the step of specially cutting the arc-shaped top of the edge leather is omitted, and the cutting efficiency is improved.

The length L of the small silicon rod is larger than the width W and the height H, and the longitudinal direction of the square rod or the small silicon rod is understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the step of "cutting the square rod" and the step of "cutting the small silicon rod" may be performed simultaneously or separately according to the form and arrangement position of the cutting reel.

When the step of "cutting the square bar" and the step of "cutting the silicon rod" are separately performed, the step of "cutting the square bar" is performed first, and then the step of "cutting the silicon rod" is performed.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are simultaneously sliced, so that the efficiency is higher.

In some embodiments of the present application, the method further comprises the steps of trimming the leather: and cutting the four first-class edge leather materials except the square rods obtained by the step of cutting the square rods in a direction that the section is parallel to the axis of the silicon rod, wherein the edge leather materials are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the present application, the step of "cutting the square rod" and the step of "cutting the edge of the skin material" may be performed simultaneously and before the step of "cutting the silicon rod" according to the form and the arrangement position of the cutting wire wheel.

In some embodiments of the application, the thicknesses of the first type of edge leather and the second type of edge leather are equal or different, so that the processing requirements of different subsequent products are met.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied, the tight mechanism in top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod together with stop gear.

Further, the position of the silicon rod is detected through the sensing device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the preset cutting position to cut the silicon rod.

Further, the present embodiment also provides a grinding apparatus for grinding the square rod or the small silicon rod in the above steps. As shown in fig. 24 to 27, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. The feeding assembly 42 is disposed in the feeding area 401, and a square rod or a small silicon rod to be ground is assembled on the feeding assembly 42 from the feeding area 401 and then delivered to the grinding area 402. The grinding assembly 43 is disposed in the grinding region 402 for grinding the surface and/or corners of a square or small silicon rod.

Taking grinding of the square bar a3 as an example, fig. 25 and 26 show the implementation of the loading assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is as follows: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; alternatively, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Taking the second scheme as an example: the square rod a3 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 relative to the sliding table is adjusted to clamp the square rod a 3. The square bar a3 is moved to the model area 402 by moving the slide table and ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged opposite to each other, the square rod a3 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the square rod a3 from both ends.

As shown in fig. 27, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rods for 45 degrees, and grinding the edges and corners of the small silicon rods; and then the other three edges and corners are ground by sequentially rotating 90 degrees.

The grinding unit 43 is provided with a grinding wheel for grinding the square bar a 3. The grinding wheels include a rough grinding wheel and a finish grinding wheel, which perform rough grinding and finish grinding, respectively, on the square bar a 3.

In another implementation, the square bar a3 is vertically arranged on the base, the top clamping head is adopted to clamp the square bar a3 downwards, and the square bar a3 is ground through the grinding assemblies positioned on the left side and the right side of the square bar a 3. The base is rotatable to grind adjacent sides after one side of the square bar a3 is ground and rotated 90.

In the above-described embodiment, the square or small silicon rod is ground, typically by grinding the side surface thereof, and in special cases also by grinding the end surface thereof.

The present embodiment also provides a silicon rod cutting system, including: the silicon rod cutting equipment is used for cutting the silicon rod to obtain a square rod; the square rod cutting equipment is used for cutting the square rod to obtain a small silicon rod; the grinding equipment is used for grinding the small silicon rod; and/or the slicing equipment is used for slicing the small silicon rod. Furthermore, equipment for cutting the corner part of the leather material can be adopted.

Claims

1. A silicon rod cutting apparatus, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises four cutting wire wheel sets, cutting wires wound on the cutting wire wheel sets are parallel to each other, and the cutting wire wheel sets are used for cutting the silicon rod along a first tangent plane; the two first cut surfaces are positioned on one side of the central line of the silicon rod, and the other two first cut surfaces are positioned on the other side of the central line of the silicon rod, so that a square rod, two first-class edge leather materials with two planes and an arc surface connected between the two planes, and two second-class edge leather materials with a plane and an arc surface connected with the plane are obtained.

2. The cutting apparatus of claim 1, wherein the carrier is fixedly disposed on a base;

the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to the base under the driving action of the bracket driving mechanism; the cutting line wheel set is arranged on the wire wheel support.

3. The cutting apparatus according to claim 1, wherein the wire cutting device comprises: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket is fixedly arranged on the base; the cutting wire wheel set is arranged on the wire wheel bracket;

the bearing table is arranged on the base in a sliding mode.

4. The cutting apparatus according to claim 2 or 3, characterized in that each group of cutting line wheel sets comprises at least two cutting wire wheels, wherein the two cutting wire wheels are coplanar and form a first tangent plane around the annular cutting line provided thereon.

5. The cutting apparatus of claim 4, wherein a set of cutting line wheels further comprises: a tension pulley and a driving pulley; the annular cutting line is still around locating tension pulley and action wheel, and the action wheel is connected to the output of line wheel driver.

6. The cutting apparatus according to claim 2 or 3, wherein the wire cutting device further comprises: the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the pay-off mechanism and the take-up mechanism.

7. A cutting apparatus according to claim 2 or 3, wherein the cutting reel is mounted to the reel support by a reel mounting;

the wire wheel mounting seat is L-shaped, one end of the wire wheel mounting seat is fixed to the wire wheel support, and the other end of the wire wheel mounting seat is provided with the cutting wire wheel.

8. A cutting apparatus according to claim 2 or 3, characterized in that the distance between two cutting reels in one set of cutting reel sets is greater than the distance between two cutting reels in an adjacent set of cutting reel sets.

9. The cutting device according to claim 2 or 3, characterized in that a horizontally extending slide rail is arranged on the base, along which the reel support or the carrier table slides horizontally;

alternatively, the cutting apparatus further comprises: the vertical base is vertically arranged on the base; the vertical base is provided with a slide rail which extends vertically, and the wire wheel bracket or the bearing table slides vertically along the slide rail.

10. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any of claims 1 to 9, for cutting silicon rods to obtain square rods;

the grinding equipment is used for grinding the small silicon rod;

and/or the slicing equipment is used for slicing the small silicon rod.

11. The silicon rod cutting system as recited in claim 10, wherein the square rod cutting apparatus comprises:

a base;

the bearing table is arranged on the base and used for bearing the square rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the square rod; the wire cutting device comprises at least one cutting wire wheel set, and cutting wires wound on the cutting wire wheel set are used for cutting square rods to obtain at least two small silicon rods with rectangular sections.