WO2024002159A1

WO2024002159A1 - Silicon rod cutting apparatus and cutting control method

Info

Publication number: WO2024002159A1
Application number: PCT/CN2023/103184
Authority: WO
Inventors: 陈明一; 薛俊兵; 苏赓; 马飞
Original assignee: 青岛高测科技股份有限公司
Priority date: 2022-07-01
Filing date: 2023-06-28
Publication date: 2024-01-04

Abstract

A silicon rod cutting apparatus and a cutting control method. The silicon rod cutting apparatus comprises: a base (1); a silicon rod bearing device (2) provided on the base (1); a wire-based cutting device (3) provided on the base (1), wherein the wire-based cutting device (3) and the silicon rod bearing device (2) can move relative to each other, and in the relative movement process, a cutting wire (6) wound on the wire-based cutting device (3) cuts a silicon rod (7); and a centering device (5) provided on the silicon rod bearing device (2), wherein at least one pair of centering jaws (535) in the centering device (5) extend to two sides of the silicon rod (7) and are used for pushing the silicon rod (7) to move to a target cutting position corresponding to the cutting wire (6). The silicon rod cutting apparatus and the cutting control method can realize the centering of the silicon rod, so as to cut, by means of the cutting wire, the silicon rod into small silicon rods having a smaller cross-sectional area.

Description

Silicon rod cutting equipment and cutting control method

Technical field

The present application relates to hard and brittle material cutting technology, and in particular to a silicon rod cutting equipment and cutting control method.

Background technique

With the development of heterojunction cells, the demand for small silicon wafers is increasing. In the traditional solution, cylindrical single crystal silicon rods are usually cut into square rods first, then the square rods are cut into large silicon wafers, and then laser technology is used to scribe and cut the large silicon wafers into small silicon wafers. However, laser The dicing process will cause damage and defective states in the cross-section of the small silicon wafer, seriously affecting the conversion efficiency of the final processed heterojunction battery.

Contents of the invention

The embodiment of the present application provides a silicon rod cutting equipment and a cutting control method.

According to a first aspect of the embodiment of the present application, a silicon rod cutting device is provided, including:

Machine base;

A silicon rod carrying device is arranged on the machine base;

A wire cutting device is arranged on the machine base; the wire cutting device and the silicon rod carrying device can move relatively; during the relative movement, the cutting wire wound on the wire cutting device cuts the silicon rod;

The centering device is provided on the silicon rod carrying device. At least one pair of centering claws in the centering device extends to both sides of the silicon rod and is used to push the silicon rod to move to the target cutting position corresponding to the cutting line.

According to a second aspect of the embodiment of the present application, a cutting control method is provided, including:

Control the loading mechanism to load the centering tool onto the carrying platform of the cutting equipment;

Control the centering mechanism to move the centering tooling and conduct centering tests;

When the test completion instruction is obtained, the loading mechanism is controlled to load the silicon rod to be cut onto the carrying platform;

Control the centering mechanism to center the silicon rod;

The cutting line in the cutting equipment is controlled to move relative to the silicon rod to cut the silicon rod along the length direction of the silicon rod to obtain two small silicon rods. The cross-sectional area of the small silicon rod is smaller than the cross-sectional area of the silicon rod.

In the technical solution provided by the embodiment of the present application, the silicon rod carrying device, the wire cutting device and the centering device are also arranged on the machine base; the wire cutting device and the silicon rod carrying device can move relative to each other; during the relative movement, the wire cutting device The cutting line wound around the device cuts the silicon rod; the centering device is installed on the silicon rod carrying device, and at least one pair of centering jaws in the centering device extends to both sides of the silicon rod to push the silicon rod and move it to the target cutting position corresponding to the cutting line, and then keep the relative position between the silicon rod and the silicon rod carrying device fixed, and cut the relative silicon rod to obtain two small silicon rods with smaller cross-sectional areas, and then directly Slice small silicon rods to obtain smaller silicon wafers. Traditional laser scribing is no longer used to avoid damage to the silicon wafers and ensure the quality of the silicon wafers.

Description of drawings

The drawings described here are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application. In the attached picture:

Figure 1 is a schematic structural diagram of a cutting device provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of the cutting equipment provided by the embodiment of the present application without the wire cutting device;

Figure 3 is a schematic structural diagram of cutting a silicon rod into small silicon rods;

Figure 4 is a schematic structural diagram of the silicon rod carrying device in the cutting equipment provided by the embodiment of the present application;

Figure 5 is a schematic structural diagram of the cutting equipment provided by the embodiment of the present application and equipped with a spray device;

Figure 6 is a schematic structural diagram of the cutting equipment provided by the embodiment of the present application without the platform support;

Figure 7 is a schematic structural diagram of a wire cutting device provided on the base of the cutting equipment provided by the embodiment of the present application;

Figure 8 is a schematic structural diagram of the wire cutting device in the cutting equipment provided by the embodiment of the present application;

Figure 9 is a schematic diagram of the wire retracting and unwinding mechanism, wire arrangement mechanism and tension mechanism in the cutting equipment provided by the embodiment of the present application;

Figure 10 is a schematic structural diagram of the silicon rod centering device provided by the embodiment of the present application;

Figure 11 is a schematic structural diagram of the silicon rod centering mechanism provided by the embodiment of the present application;

Figure 12 is a partial cross-sectional view of the silicon rod centering mechanism provided by the embodiment of the present application;

Figure 13 is a schematic structural diagram of the cooperation between the centering support and the clamping jaw connection block of the silicon rod centering mechanism provided by the embodiment of the present application;

Figure 14 is a schematic structural diagram of another silicon rod centering mechanism provided by an embodiment of the present application;

Figure 15 is a partial cross-sectional view of the silicon rod centering mechanism shown in Figure 14;

Figure 16 is a flow chart of a control method for cutting silicon rods provided by an embodiment of the present application;

Figure 17 is a schematic structural diagram of the centering tool provided by the embodiment of the present application;

Figure 18 is a schematic structural diagram of the centering tool provided by the embodiment of the present application applied to cutting equipment;

Figure 19 is a schematic diagram for determining the length of the silicon rod in the embodiment of the present application.

Reference signs:
1-machine base;
2-Silicon rod carrying device; 21-Loading platform; 211-Support support; 22-Silicon rod guide block; 23-Nylon support block;
3-wire cutting device; 31-cutting bracket; 32-retracting and unwinding mechanism; 321-retracting and unwinding motor; 322-bearing seat; 323-retracting and unwinding roller; 33-
Cable arrangement mechanism; 331-cable arrangement module; 332-cable arrangement connection plate; 333-cable arrangement wheel; 334-balance block; 34-tension mechanism; 341-tension motor; 342-tension arm; 343-tension wheel; 35 - Passing wire wheel; 36 - Cutting wire wheel;
4-Motion drive mechanism;
5-centering device; 51-centering support seat; 52-centering adjustment plate; 53-centering mechanism; 531-centering support; 532-centering cylinder; 533-
Centering drive rod; 534-centering guide rod; 5341-limit sleeve; 535-centering clamp; 5351-clamp connecting block; 5352-clamp arm; 536-buffer block; 537-first protective sheet metal ; 538-Second protective sheet metal; 539-organ shield; 5310-centering screw; 5311-centering screw nut; 5312-centering motor; 5313-centering base; 5314-centering guide rail; 5315-pair Middle slider; 5316-driving wheel; 5317-driven wheel; 5318-synchronous belt; 5319-protective cover; 54-centering adjustment component; 55-centering tooling; 551-tooling base plate; 5511-base plate notch; 5512-datum surface; 5513-substrate through hole; 552-Tooling test piece; 5521-Seam; 5522-Protruding part;
56-rod length detection component;
6-cutting line;
7-Silicon rod;
8-Spray device.

Detailed ways

In the traditional solution, cylindrical single crystal silicon rods are first cut into square rods, and then the square rods are cut into large silicon wafers, and then laser technology is used to scribe and cut the large silicon wafers to form small silicon wafers. However, laser scribing The process will cause damage and defective states in the cross-section of the small silicon wafer, seriously affecting the conversion efficiency of the final processed heterojunction battery.

This embodiment provides a cutting method. After obtaining a square rod, cut the square rod along the length direction of the square rod to obtain a small silicon rod with a smaller cross-sectional area, and then slice the small silicon rod to directly obtain a smaller silicon rod. Small silicon wafers eliminate the need for laser scribing and avoid damage to the surface of the small silicon wafers. One of the cutting methods can be cut from the center line of the silicon rod. The square rod is cut into two small silicon rods with equal cross-sectional areas. The small silicon wafers obtained after slicing are of the same size, which is convenient for storage and transportation. This cutting process requires very high alignment accuracy between the wire cutting device and the silicon rod. The cutting line must pass through the center line of the square rod.

This embodiment provides a cutting device for cutting silicon rods. The silicon rod can be a single crystal silicon rod or a polycrystalline silicon rod. This cutting equipment is specifically used to cut silicon rods along the length direction of the silicon rods to cut the silicon rods into small silicon rods with smaller cross-sectional areas. It is especially suitable for cutting square rods with rectangular cross-sections to match The above cutting method.

As shown in Figures 1 and 2, the cutting equipment provided in this embodiment includes: a machine base 1, a silicon rod carrying device 2, a wire cutting device 3, a motion driving mechanism 4 and a centering device 5. Among them, the machine base 1 serves as a basic structure for installing and carrying other components. The silicon rod carrying device 2, the wire cutting device 3, the motion driving mechanism 4 and the centering device 5 are all arranged on the machine base 1.

The wire cutting device 4 and the silicon rod carrying device 2 can move relative to each other. During the relative movement, the cutting wire wound around the wire cutting device 3 cuts the silicon rod 7 . In the embodiment, the silicon rod carrying device 2 can be stationary and the wire cutting device 4 moves relative to the machine base 1; or the wire cutting device 4 can be stationary and the silicon rod carrying device 2 moves relative to the machine base 1. This embodiment is described by taking the movement of the silicon rod carrying device 2 relative to the machine base 1 as an example.

The centering device 5 is arranged on the silicon rod carrying device 2. The centering device 5 is provided with at least one pair of centering clamps. The centering clamps extend to both sides of the silicon rod 7 and are used to push the silicon rod 7 to move to and cut. The target cutting position corresponding to the line. After that, the silicon rod 7 remains stationary at this position, and the silicon rod carrying device 2 is driven to move, and the silicon rod is cut through the cutting line to obtain two small silicon rods with smaller cross-sectional areas.

As shown in Figure 3, taking a square rod with a rectangular cross-section as an example, cut the square rod along the length direction of the square rod to obtain two small silicon rods with smaller cross-sectional areas.

In the technical solution provided by this embodiment, the silicon rod carrying device, the wire cutting device and the centering device are also arranged on the machine base; the wire cutting device and the silicon rod carrying device can move relative to each other; during the relative movement, the wire cutting device The cutting wire wound around the silicon rod is used to cut the silicon rod; the centering device is arranged on the silicon rod carrying device, and at least one pair of centering jaws in the centering device extends to both sides of the silicon rod to push the silicon rod and move it to The target cutting position corresponding to the cutting line, and then keep the relative position between the silicon rod and the silicon rod carrying device fixed, and cut the relative silicon rod to obtain two small silicon rods with smaller cross-sectional areas, and then directly align them Small silicon rods are sliced to obtain smaller silicon wafers, no longer Traditional laser scribing is used to avoid damage to the silicon wafer and ensure the quality of the silicon wafer.

On the basis of the above technical solution, when the centering claw in the centering device 5 pushes the square bar to the target cutting position when the center line of the square bar is aligned with the cutting line, the cutting line can pass through the center line of the square bar. Cut to obtain two small silicon rods with equal cross-sectional areas. For example: the two centering jaws in a pair have the same moving stroke and moving speed, which can push the silicon rod to move until the center line of the silicon rod along the length direction is aligned with the cutting line.

Based on the above solution, this embodiment provides a specific implementation of the cutting equipment: the silicon rod carrying device 2 moves in the horizontal direction relative to the machine base 1 , and the length direction of the silicon rod 7 extends in the horizontal direction. The silicon rod 7 is cut by vertically extending cutting lines.

As shown in FIG. 4 , the silicon rod carrying device 2 specifically includes: a carrying platform 21 and at least one set of platform supports 2 extending in the horizontal direction from one side of the carrying platform 21 . A set of platform supports 211 includes two platform supports 211 arranged side by side. There is a line-passing space between the two platform supports 211, and the cutting line can pass through the line-passing space. The silicon rod 7 is placed on the two platform supports 211, and the length direction of the silicon rod 7 is the same as the length direction of the platform supports 211.

In this embodiment, the length direction of the silicon rod, the centerline direction of the silicon rod, and the moving direction of the silicon rod carrying device 2 are the same, which is called the second direction. The second direction is parallel to the horizontal plane; the width direction of the silicon rod is called the first direction. direction, the first direction is parallel to the horizontal plane and perpendicular to the second direction. When the silicon rod carrying device 2 moves in the second direction, the vertical cutting line enters the line-passing space from one end of the platform support 211 and cuts the silicon rod 7 .

The above-mentioned platform supports 211 can be used as a group to cut a silicon rod to achieve single-station cutting. Alternatively, the platform supports 211 can also be divided into two groups, and the two groups of platform supports 211 are arranged side by side. Each group of platform supports 211 carries a silicon rod, and can cut two silicon rods at the same time to achieve dual-station cutting. Alternatively, the platform supports 211 can also be provided in three or more groups to achieve cutting with more than three stations.

The silicon rod carrying device 2 can be driven in a variety of ways, for example, by driving a motor to drive a screw extending along the second direction to rotate, and the screw is threadedly matched with the carrying platform 21 to drive the carrying platform 21 to move along the second direction. Cutting feed. The bearing platform 21 can also be driven to move through an electric slide, gear drive, belt drive, cylinder drive, etc.

The silicon rod can be placed on the platform support 211 manually or by a robot. Silicon rod guide blocks 22 are provided on the tops of both sides of the two platform supports 211 that are further apart. There are multiple silicon rod guide blocks 22 arranged at intervals along the length direction of the platform support 211 . The silicon rod guide blocks 22 are used to limit the position of the silicon rod, and the silicon rod is placed between two opposite silicon rod guide blocks 22 . The inner side of the silicon rod guide block 22 is a slope for guiding the silicon rod to fall. The silicon rod guide block 22 can be made of buffer material such as nylon to avoid scratching the silicon rod and protect it.

In addition, a plurality of nylon support blocks 23 are arranged at intervals on the top surface of the platform support 211, and the silicon rods are placed on the nylon support blocks 23. The nylon support block 23 can protect the silicon rod and avoid scratching the surface of the silicon rod.

Further, as shown in Figure 5, a spray device 8 is also used to spray cutting fluid on the cutting line to lubricate the cutting line and wash away impurities such as silicon powder attached to the cutting line to reduce the need for cutting silicon rods. surface wear and improve cutting quality. Specifically, the spray device 8 is fixed on the cutting bracket 31, above the cutting wire wheel, and sprays cutting fluid to the cutting line.

This embodiment provides a specific implementation of the wire cutting device 3:

As shown in Figures 6 to 9, the wire cutting device 3 includes: a cutting bracket 31, two sets of wire retracting and unwinding mechanisms 32, two sets of tension mechanisms 34 and a cutting wire wheel set. Two sets of wire retracting and unwinding mechanisms 32 are fixed on the machine base 1, respectively located on both sides of the cutting bracket 31, and are used to provide power for high-speed movement of the cutting wire. Two sets of tension mechanisms 34 are provided on the cutting bracket 31 , respectively located on both sides of the cutting bracket 31 . The cutting wire wheel set includes two cutting wire wheels 36 with parallel center lines.

The cutting wire 6 is unwound from a wire retracting and unwinding mechanism 32 and then wound around a tension mechanism 34 , two cutting wire wheels 36 in the cutting wire wheel group, another tension mechanism 34 and another wire retracting and unwinding mechanism 32 .

Furthermore, a wire arrangement mechanism 33 is also used, which is arranged beside the wire retracting and unwinding mechanism 32. After the cutting wire extends from the wire retracting and unwinding mechanism 32, it first passes through the wire arranging mechanism 33, and then passes through the tension mechanism 34. The wire arrangement mechanism 33 is used to guide the cutting wire to be evenly wound on the wire retracting and unwinding mechanism 32 .

Furthermore, a wire passing mechanism is also used to be arranged on the cutting bracket 31 . The cutting wire passing through the tension mechanism 34 and the cutting wire wheel set is wound around the wire passing mechanism.

A specific implementation mode: during the operation of the two wire retracting and unwinding mechanisms 32, one of them serves as the wire retracting mechanism and the other serves as the wire retracting mechanism. During the reciprocating movement of the cutting line, the wire retracting and unwinding mechanism 32 alternately performs wire retracting and unwinding. The pay-off and take-up mechanism 32 specifically includes: a pay-off and take-up motor 321, a bearing seat 322 and a pay-off and take-up roller 323. Among them, the bearing seat 322 is fixed to the machine base 1 and has a bearing inside. The output shaft of the take-up and pay-off motor 321 is connected to the take-up and pay-off roller 323 and passes through the inner ring of the bearing. The retracting and unwinding motor 321 is used to drive the retracting and unwinding roller 323 to reciprocate and release and store the cutting wire.

The cable arrangement device 33 includes: a cable arrangement module 331, a cable arrangement connection plate 332, a cable arrangement wheel 333 and a balance block 334. The cable connection plate 332 can reciprocate driven by the cable module 331. The cable wheel 333 is provided on the cable connection plate 332 and reciprocates with the cable connection plate 332 within the length range of the cable retracting and unwinding roller 323. The cutting wires wound on the take-up and pay-off roller 323 are released sequentially, or all the cutting wires are wound on the take-up and pay-off roller 323 . The balance block is arranged on the cable connection plate 332 and is in the opposite direction to the cable wheel 333. The cable wheel 333 and the balance block 334 can rotate on the fixed axis. Adjusting the position of the balance block 334 can realize the cable arrangement wheel 333 and the balance block. 334 is stable and balanced to ensure that the arranging wheel 333 does not shake during the reciprocating motion. The arranging wheel 333 is equipped with a tension monitoring sensor for detecting the tension of the cutting wire.

The tension mechanism 34 includes: a tension motor 341, a tension arm 342 and a tension wheel 343. The tension wheel 343 is rotatably connected to one end of the tension arm 342 , and the other end of the tension arm 342 is connected to the tension motor 341 . The cutting wire is wound around the tension wheel 343, and the tension motor 341 drives the tension arm 342 to swing, providing a stable swinging moment to ensure that the cutting wire always has stable additional tension during the entire cutting process.

Furthermore, it also includes a plurality of wire passing wheels 35, and the cutting wire is wound around the wire passing wheels 35. The wire passing wheel 35 can be used to support the cutting line to ensure that the cutting line has a certain tension, and can also be used to change the direction of the cutting line.

One implementation is as follows: a wire take-up area and a wire pay-off area are respectively formed on the left and right sides of the cutting bracket 31, and a wire take-up and pay-off mechanism 32, a wire arrangement mechanism 33 and a tension mechanism 34 are provided in the wire take-up area and the wire pay-off area. A cutting area is formed below the cutting bracket 31, and the wire passing wheel 35 and the cutting wire wheel 36 are located in the cutting area.

A cutting wheel set is provided in the cutting area of the cutting bracket 31, and the number of cutting wheel sets may be one set, two sets, or three or more sets. This embodiment takes two sets of cutting wheel sets as an example. The two cutting wire wheels 36 in the cutting wheel set are arranged one above the other, and the cutting line between the two cutting wire wheels 36 extends vertically. After the cutting wire 6 is drawn out from the retracting and unwinding roller 323, the wire arrangement wheel 333 and the tension wheel 343 on one side, it passes through the two wire passing wheels 35, the two cutting wire wheels 36 and the two wire passing wheels 35 at the bottom in sequence. It is wound around the other two cutting wire wheels 36, passes through the two wire passing wheels 35, and then passes through the other side tension wheel 343 and the wire arrangement wheel 333 to be stored in the take-up and pay-off roller 323.

The cutting line between the two cutting wire wheels 36 forms a wire saw for cutting the silicon rod. Two wire saws are used to cut two silicon rods at the same time to achieve dual-station cutting and improve cutting efficiency. In a set of cutting wheel sets, the upper cutting wire wheel 36 is arranged on the cutting bracket 31 , and the lower cutting wire wheel 36 is arranged on the machine base 1 .

Based on the above technical solution, the centering device 5 is arranged below a set of platform supports 211, and the centering claws extend upward from both sides of a set of platform supports to both sides of the silicon rod 7 for pushing the silicon rod. 7 moves horizontally in the first direction.

As shown in FIG. 4 and FIG. 10 , the silicon rod centering device provided in this embodiment includes: a centering support seat 51 , a centering mechanism 53 and a centering adjustment assembly 54 . The centering support base 51 is the basic structure, and the centering mechanism 53 and the centering adjustment assembly 54 are installed on the centering support base 51 . The centering support base 51 can be installed on the base of the cutting equipment.

The centering mechanism 53 is provided on the centering support base 51 . The centering mechanism 53 has at least one pair of centering jaws corresponding to the silicon rod. The pair of centering jaws can move closer to or farther away from each other so that the silicon rod moves to the middle position of the pair of centering jaws. The moving direction of a pair of centering clamping jaws toward or away from each other is defined as a first direction, and the first direction is perpendicular to the center line of the silicon rod.

The centering adjustment component 54 is used to adjust the position of the centering mechanism 53, and can drive the centering mechanism 53 to move along the direction of movement of the silicon rod, so as to accurately move the centering mechanism 53 into position. Due to the influence of the size and production error of the centering mechanism 53 itself, the centering mechanism 53 may not be installed in place at one time. The centering mechanism 53 can be moved into place through the centering adjustment assembly 54 to ensure that the centering mechanism 53 is accurately positioned. Precision in centering silicon rods.

The technical solution provided by this embodiment is to provide a centering mechanism and a centering adjustment assembly on the centering support seat, wherein the centering adjustment assembly is used to adjust the position of the centering mechanism, and the centering mechanism has at least one pair of centering jaws. , a pair of centering clamps can move closer or farther away from each other to push the silicon rod to move to the middle position of the pair of centering clamps to achieve centering of the silicon rod to cut the silicon rod into two small silicon rods with smaller cross-sectional areas rods, and then directly slice the small silicon rods to obtain smaller silicon wafers. Traditional laser scribing is no longer used to avoid damage to the silicon wafers and ensure the quality of the silicon wafers.

Further, when the moving speed and moving distance of a pair of centering jaws are the same, the cutting line cuts through the center line of the silicon rod, and then cuts the silicon rod into two small silicon rods with equal cross-sectional areas.

When the length of the silicon rod is short, a centering mechanism 53 is used, whose centering claws extend to the middle of both sides of the silicon rod and push the silicon rod to move the silicon rod into place.

When the length of the silicon rod is long, two, three or more centering mechanisms 53 can be used, which are arranged at intervals along the length of the silicon rod. They can center the silicon rod from the front end, the rear end, or from the middle. The rod exerts a pushing force so that the centerline of the silicon rod does not shift during movement.

In this embodiment, two centering mechanisms 53 are arranged at intervals along the length direction of the silicon rod to apply pushing force to the front and rear parts of the silicon rod respectively.

There may be two centering adjustment assemblies 54 , each of which is provided on the side of the centering mechanism 53 and used to push the corresponding centering mechanism 53 to move along the first direction.

Further, a centering adjustment plate 52 is provided on the top of the centering support base 51 . The centering adjustment plate 52 can move along the first direction relative to the centering support base 51 and be locked after moving into position. For example, it can be fixed to the centering support base 51 through fasteners. The centering adjustment assembly 54 is used to apply force to the centering adjustment plate 52 to move it in the first direction. The centering mechanism 53 is fixed on the centering adjustment plate 52 and moves together with the centering adjustment plate 52 .

Based on the above solution, the two centering mechanisms 53 are both arranged on the centering adjustment plate 52 , and the centering adjustment plate 52 is pushed to move by the centering adjustment assembly 54 , so that the two centering mechanisms 53 move together with the centering adjustment plate 52 , there is no need to adjust the position of the centering mechanism 53 separately, thereby reducing the adjustment steps and processes, thereby improving production efficiency.

The centering adjustment component 54 can cooperate with the centering mechanism 53 in various ways. For example, one implementation method is: the centering adjustment assembly 54 includes: a centering adjustment block and an adjustment bolt. The centering adjustment block is fixed on the centering support base 51 . The centering adjustment block has a position extending along the first direction. of threaded holes. The adjusting bolt is screwed into the threaded hole, and the length of the adjusting bolt relative to the centering adjusting block can be adjusted by rotating the adjusting bolt. The tail end of the adjustment bolt abuts against the centering adjustment plate or is fixedly connected to the centering adjustment plate. By rotating the adjustment bolt, the centering adjustment plate can be pushed to move in the first direction.

As for the connection method between the centering adjustment plate 52 and the centering support seat 51, for example, one implementation method is: opening a long hole extending along the first direction in the centering support seat 51, and the centering adjustment plate 52 is fixed to the centering support seat 51 by bolts. inside the long hole. When the bolts are loosened, the centering adjustment plate 52 can move in the first direction relative to the centering support seat 51 . After the movement is in place, the bolts are tightened to fix the centering adjustment plate 52 to the centering support seat 51 .

The centering device is arranged below the platform support 211 and uses two centering mechanisms 53 arranged at intervals along the length direction of the silicon rod. The two centering claws 535 in the centering mechanism 53 extend upward to both sides of the silicon rod 7 . Before cutting, first place the silicon rod 7 on the platform support 211, and then drive the two centering clamps 535 close to each other. When one of the centering clamps 535 contacts the side of the silicon rod 7 and pushes the silicon rod 7 force to push the silicon rod 7 to move in the first direction until both sides of the silicon rod 7 are in contact with the centering jaws 535, then the silicon rod 7 moves into place. At this position, the cutting line can pass through the center line of the silicon rod. Make the cut.

Based on the above technical solution, a rod length detection component 56 is used, which is arranged on the centering adjustment plate 52 and can be located between the two centering mechanisms 53 . The rod length detection component 56 extends upward to the bottom of the silicon rod 7 and is used to detect the current position of the silicon rod 7 and calculate the length of the silicon rod 7 according to the distance moved by the silicon rod 7 during the cutting process.

Based on the above solution, this embodiment provides an implementation method of the centering mechanism 53:

As shown in FIGS. 11 to 13 , the silicon rod centering mechanism provided in this embodiment includes: a centering support 531 , a centering driving member, a centering driving rod 533 and a centering clamp 535 .

Among them, the centering support 531 is the basic structure and is used to install and support various components. The centering driving member is arranged on the centering support 531 . The centering driving member may be an electric cylinder, a hydraulic cylinder or a pneumatic cylinder, etc. In this embodiment, the centering driving member is specifically a centering cylinder 532 .

The number of centering drive rods 533 is at least one pair, and one pair includes two centering drive rods 533 .

The number of centering jaws is at least one pair, and one pair includes two centering jaws 535 . When a pair of centering jaws 535 is used, two of the centering jaws 535 are respectively disposed at both ends of the centering support 531 along the first direction. A centering drive rod 533 is connected to a centering jaw 535, and the two centering jaws 535 can move toward each other or in opposite directions synchronously; alternatively, two centering drive rods 533 and one centering jaw can also be used. 535 connects two other centering drive rods 533 to another centering jaw 535 to drive one centering jaw 535 to move through the two centering drive rods 533 .

When two pairs of centering jaws 535 are used, the two pairs of centering jaws 535 are respectively disposed at both ends of the centering support 531 along the first direction. Directionally spaced arrangement. The centering jaws 535 located at the same end are connected to the same centering drive rod 535 to drive the two pairs of centering jaws 535 to move through the centering drive rod.

Alternatively, more than three pairs of centering jaws can be used, which can be set up with reference to the above two pairs.

Specifically, taking a pair of centering jaws 535 as an example, the centering drive rod 533 extends along a first direction. The first direction is the moving direction of the centering jaws 535 and is perpendicular to the center line of the silicon rod. The air cylinder 532 is located in the middle, and the centering jaws 535 are located on both sides. One end of the centering drive rod 533 is connected to the air cylinder 532, and the other end is connected to the centering jaws 535.

The centering cylinder 532 can drive the centering driving rod 533 to move in the first direction relative to the centering support 531, and drive the centering clamp 535 to move synchronously. The centering cylinder 532 drives the two centering jaws 535 to move the same distance at the same speed.

Before the cutting equipment cuts the silicon rod, the centering jaws 535 are driven by the centering cylinder 532 to move toward each other, pushing the silicon rod to move to The middle position means that the center line of the silicon rod is aligned with the cutting line. For example: assuming that the first direction is the left-right direction, if the initial position of the silicon rod is to the left, the centering clamp 535 on the left side first contacts the silicon rod and pushes the silicon rod to move to the right until it moves to the centering clamp on the right side. The claws 535 make contact and reach the neutral position.

The technical solution provided by this embodiment is to arrange the centering driving member on the centering support, and centering clamps are provided on both sides of the centering support; one end of the centering drive rod is connected to the centering clamp, and the other end of the centering drive rod is connected to the centering clamp. Connected to the centering drive part, the centering drive drives the centering drive rod to move relative to the centering support, and drives the centering jaws to move synchronously, so that the two centering jaws in a pair are close to each other. Push the silicon rod to the middle position and align it with the cutting line to facilitate subsequent cutting of the silicon rod into two small silicon rods with the same cross-section.

One implementation method: the centering support 531 is provided with an accommodation space inside. The centering driving part is arranged in the accommodation space.

The centering driving rod 533 is passed through the centering support 531 , one end of which penetrates into the accommodation space and is connected to the centering cylinder 532 , and the other end is exposed from the centering support 531 and is connected to the centering jaw 535 . The centering drive rod 533 and the centering support 531 move relative to each other, and the centering support 531 plays a guiding role in the movement process.

On the basis of the above technical solution, two centering guide rods 534 are also used to connect with the two centering clamping claws 535 in one-to-one correspondence. Specifically, the centering guide rod 534 extends along the first direction and is movably provided on the centering support 531 . One end of the centering guide rod 534 is connected to the centering claw 535 . One implementation is: the centering guide rod 534 is passed through the centering support 531 .

When the centering cylinder 532 drives the centering jaw 535 to move, it is easily affected by the friction force, gravity and other effects of the contact parts, causing the movement trajectory of the centering jaw 535 to deviate from the first direction, causing the two centering jaws to deviate from the first direction. 535 cannot be vertically contacted with both sides of the silicon rod. The centering guide rod 534 is connected between the centering jaw 535 and the centering support 531 to guide the movement of the centering jaw 535 to avoid deviation from the first direction, so that the two centering jaws 535 vertically contact each other. Connected to both sides of the silicon rod to improve alignment accuracy.

Based on the above technical solution, this embodiment provides a specific implementation of the silicon rod centering mechanism: the centering jaw 535 specifically includes: a jaw connecting block 5351 and a jaw arm 5352. The clamping jaw connecting block 5351 is connected to the centering drive rod 533. The clamping jaw arm 5352 is provided on the clamping jaw connecting block 5351. The clamping jaw arm 5352 extends toward the silicon rod. The end of the clamping jaw arm 5352 is located on the side of the silicon rod for centering. silicon rod for alignment.

One embodiment: the clamping arm 5352 is arranged on the top of the clamping connecting block 5351. The clamping arm 5352 extends upward until the top of the clamping arm 5352 is located on the side of the silicon rod for aligning the upper silicon rod.

Alternatively, the clamping jaw arm 5352 can also be provided at the bottom of the clamping jaw connecting block 5351, extending downward to the side of the silicon rod, for aligning the silicon rod below.

Further, a buffer block 536 is provided on the side of the clamping arm 5352 facing the silicon rod. The buffer block 536 is used to directly contact the surface of the silicon rod to avoid scratching the surface of the silicon rod, so as to protect the silicon rod. The buffer block 536 can be made of soft materials such as nylon, felt, rubber, and silicone.

An implementation method of the above-mentioned centering support 531: the centering support 531 is a box-shaped structure with an internal cavity, and the centering cylinder 532 is provided in the internal cavity. The number of the centering cylinder 532 can be one or two. When there is one, the centering cylinder 532 can be connected to the centering drive rod 533 respectively through the connecting rod transmission structure, and one centering cylinder 532 drives the two centering drive rods 533 to move toward or away from each other. When the number of centering cylinders 532 is two, one centering cylinder 532 is connected to one centering drive rod 533, and the strokes of the two centering drive rods 533 are consistent to drive the centering jaw 535 to move the same distance for centering. .

The two side walls of the centering support 531 perpendicular to the first direction are provided with drive rod holes for the centering drive rod 533 to pass through and centering guide rods. 534 through the guide rod hole. The drive rod through hole is located above the guide rod through hole, and the center lines of the two centering drive rods 533 are arranged side by side; the center lines of the two centering guide rods 534 are arranged side by side.

Specifically, four perforations are provided on both side walls of the centering support 531, arranged in two rows and two columns. The upper two perforations are used to pass through the centering drive rod 533, and the lower two perforations are used to pass through the centering drive rod 533. Middle guide rod 534. Viewed from one side of the centering support 531, the centering drive rod 533 corresponding to the centering jaw on that side penetrates into the upper left hole, and the centering guide rod 534 penetrates into the lower right hole. The centering drive rod 533 corresponding to the centering jaw on the other side passes through the upper right hole, and the centering guide rod 534 passes through the lower left hole. In this way, the centering driving rod and the centering guide rod corresponding to one centering jaw are arranged along the diagonal of the centering support 531. The distance between them is larger, which can further improve the stability and stability of the movement process. accuracy.

Furthermore, there are relatively moving parts in the centering mechanism. In order to protect the moving parts, protective sheet metal, organ guards, etc. are used to cover the outside to prevent water, foreign matter, dust, etc. from entering the centering support and affecting the centering. Normal movement of the drive rod and centering guide rod.

Specifically, an organ shield 539 is used to connect between the centering support 531 and the centering claw 535 to seal the space between the centering support 531 and the centering claw 535 . The opening and shrinking directions of the organ guard 539 are arranged along the first direction. When the centering jaws 535 move outward, the accordion guard 539 stretches open; when the centering jaws 535 move inward, the accordion guard 539 contracts. The organ guard 539 can prevent water, foreign matter, dust, etc. from entering, and does not affect the normal movement of the centering jaw 535.

Furthermore, a limit sleeve 5341 is set on the end of the centering guide rod 534 close to the centering clamp 535 to limit the stroke of the centering cylinder and prevent the centering cylinder from crushing the organ guard 539 .

Further, a protective sheet metal (referred to as the first protective sheet metal 537 ) is laid above the centering support 531 and connected between the two organ shields 539 to provide protection from above. During the application process, the first protective sheet metal 537 will come into contact with the upper parts of the cutting equipment. The first protective sheet metal 537 has a certain strength and wear resistance, and can protect the centering support 531 and reduce wear.

Further, a second protective sheet metal 538 is used to surround the outside of the clamping jaw connecting block 5351, and is protected by the clamping jaw connecting block 5352 to reduce wear and extend its service life.

In order to facilitate a clearer understanding of the technical solution of the present application, the centering process of the silicon rod centering mechanism of the present application is explained below:

After the silicon rod is placed on the bearing platform of the cutting equipment, the silicon rod is located between the two centering clamping jaws and does not contact the two centering clamping jaws. The centering drive part in the centering mechanism is controlled to work, driving at least one pair of centering drive rods to move inward, and driving the two centering jaws to approach each other. One of the centering jaws first contacts the silicon rod and pushes the silicon rod toward the direction of the other clamping jaw until both centering jaws contact and clamp the silicon rod.

The centering drive component drives the two centering jaws to move the same distance at the same fixed speed, and can move the silicon rod to the middle position of the two centering jaws to achieve alignment. In the subsequent cutting process, the cutting line can be cut through the center line of the silicon rod to cut the silicon rod into two small silicon rods with equal cross-sectional areas.

Taking a square rod with a rectangular cross-section as an example, if the cutting line passes through the center line of the square rod, the square rod can be cut in half to obtain two small silicon rods with equal cross-sectional areas.

As shown in Figures 14 and 15, this embodiment provides another implementation of the centering mechanism: the silicon rod centering mechanism includes: a centering screw 5310, a centering driver, a centering nut 5311, and a centering clip. claw.

The centering screw 5310 extends along the first direction, and the number of centering screw mothers 5311 is two. The centering screw mothers 5311 are threadedly matched with the centering screw 5310 .

At least one pair of centering jaws 535 is used, one pair includes two centering jaws 535 , and the two centering jaws are respectively provided at both ends of the centering screw 5310 . The centering screw nut 5311 is connected to the centering jaws on the corresponding side, and a pair of centering jaws can move toward or away from each other synchronously. The first direction is the movement direction of the centering jaw.

When two pairs of centering jaws 535 are used, the two pairs are spaced apart perpendicular to the first direction. The two pairs of centering jaws 535 located on the same side are connected to the same centering nut 5311. It is also possible to use three or more pairs of centering jaws 535 and set them up with reference to two pairs.

The centering driving member may be a motor, a hydraulic cylinder or a pneumatic cylinder, etc. In this embodiment, the centering driving member is specifically a centering motor 5312. The centering motor 5312 is connected to the centering screw 5310 and is used to drive the centering screw 5310 to rotate. When the centering screw 5310 rotates, a pair of centering screw nuts 5311 move in opposite directions.

This embodiment takes a pair of centering jaws as an example. One centering jaw 535 is connected to a centering nut 5311 to move synchronously with the centering nut 5311 relative to the centering screw 5310 . The centering jaws extend toward the direction of the silicon rod, and the two centering jaws are used to push against the silicon rod from both sides to achieve alignment of the silicon rod. The centering motor 5312 drives the two centering jaws to move the same distance at the same speed through the centering screw 5310.

Before the cutting equipment cuts the silicon rod, the centering motor 5312 drives the centering jaws to move toward each other, pushing the silicon rod to move to the neutral position, that is, the center line of the silicon rod is aligned with the cutting line. For example: assuming that the first direction is left and right, if the initial position of the silicon rod is to the left, the centering jaw on the left side will first contact the silicon rod, and push the silicon rod to move to the right until it contacts the centering jaw on the right side. , reaches the middle position.

The technical solution provided by this embodiment uses two centering screw nuts to match the threads of the centering screw. The centering screw nuts are connected to the centering jaws on the corresponding side, and the centering screw is driven to rotate through the centering driving part. The two centering wire mothers drive at least one pair of corresponding centering clamps to move in opposite directions at the same time. When the centering clamps are close to each other, they push the silicon rod to move to the middle position and align it with the cutting line to facilitate the subsequent cutting of the silicon rod. The rod is cut into two small silicon rods with the same cross-section.

The number of the above-mentioned centering screw 5310 may be one. The two ends of the centering screw 5310 are respectively provided with external threads. The external threads at the two ends rotate in opposite directions and are threaded with a centering screw nut respectively. When the centering screw 5310 rotates, the two centering screw nuts 5310 move in opposite directions.

Alternatively, two centering screws 5310 may also be used, and one centering screw 5310 is threaded with a centering screw nut 5311. One motor and a connecting rod mechanism can be used to drive the two centering screws 5310 to rotate, or two motors can be used to drive the two centering screws 5310 to rotate respectively.

Furthermore, a guide structure can also be used to guide the centering nut 5311 during its movement. One implementation method is to use a centering base 5313, and a centering guide rail 5314 extending along the first direction is provided on the centering base 5313. Two centering slide blocks 5315 are used to slidingly connect with the centering guide rail 5314.

The centering nut 5311 is fixedly connected to the centering slide block 5315. Then the centering slider 5315 restricts the centering nut 5311 to move only in the first direction. In addition, the above functions can also be realized by matching the centering chute and the centering slide block.

The above-mentioned centering motor 5312 can be directly connected to the centering screw 5310, or can be connected to the centering screw 5310 through a transmission mechanism.

One implementation manner is: the center line of the centering motor 5312 and the center line of the centering screw 5310 are parallel and arranged side by side. As shown in the view angle of Figure 2, the first direction is the left-right direction of Figure 2, the centering motor 5312 is located next to the threaded section at the left end of the centering screw 5310, and the output shaft extends to the left. The extension direction of the transmission mechanism is perpendicular to the first direction, and is connected to the left end of the centering screw 5310 and the left end of the centering motor 5312.

The transmission mechanism is used to transmit driving force between the centering screw 5310 and the centering motor 5312. This embodiment provides a specific method: transmission The driving mechanism includes: driving wheel 5316, driven wheel 5317 and synchronous belt 5318. Among them, the driving wheel 5316 is connected with the output shaft of the centering motor 5312, and the output shaft of the centering motor 5312 drives the driving wheel 5316 to rotate synchronously. The driven wheel 5317 is connected to the centering screw 5310 and rotates synchronously with the centering screw 5310. The synchronous belt 5318 is sleeved on the driving wheel 5316 and the driven wheel 5317 to transmit the rotational torque of the driving wheel 5316 to the driven wheel 5317, and then drives the centering screw 5310 to rotate through the driven wheel 5317.

In addition to the above solution, the transmission mechanism can also adopt a gear transmission mechanism, etc.

Based on the above technical solution, in order to protect the above-mentioned centering screw 5310 and other moving parts, a protective cover 5319 can be used to cover the outside of the centering screw, the centering driving part and the centering screw mother. The protective cover 5319 may be sheet metal and is used to prevent water, dust, impurities, etc. from entering the area surrounded by the protective cover 5319. Sheet metal has a certain degree of strength and wear resistance, which can protect the structure in contact with it and reduce wear.

One way is to use two sets of protective covers 5319 to cover the outer sides of the two sets of centering screw mothers 5311 and centering slide blocks 5315 respectively. Further, an organ guard 539 is connected between the two groups of protective covers 5319 to seal the space between the two groups of protective covers 5319. The opening and shrinking directions of the organ guard 539 are arranged along the first direction. When the centering jaws move outward, the accordion guard 539 stretches open; when the centering jaws move inward, the accordion guard 539 contracts. The organ guard 539 can prevent water, foreign matter, dust, etc. from entering, and does not affect the normal movement of the centering jaw.

Based on the above technical solution, this embodiment provides a specific implementation method of the centering jaw: the centering jaw specifically includes: a clamping jaw connecting block 5351 and a clamping jaw arm 5352. The clamping jaw connecting block 5351 is connected to the protective cover 5319, and the protective cover 5319 is fixedly connected to the centering nut 5311. The clamping arm 5352 is connected to the clamping connecting block 5315. The clamping arm 5352 extends toward the direction of the silicon rod. The end of the clamping arm 5352 is located on the side of the silicon rod and is used for aligning the silicon rod.

One embodiment: the clamping jaw connecting block 5351 is connected to the top of the protective cover 5319, and the clamping jaw arm 5352 extends upward until the top of the clamping jaw arm 5352 is located on the side of the silicon rod for aligning the upper silicon rod.

Alternatively, the clamping arm 5352 can also extend downward to the side of the silicon rod for aligning the silicon rod below. A buffer block 536 is provided on the side of the clamping arm 5352 facing the silicon rod. The buffer block 536 is used to directly contact the surface of the silicon rod to avoid scratching the surface of the silicon rod, so as to protect the silicon rod. The buffer block 536 can be made of soft materials such as nylon, felt, rubber, and silicone.

After the silicon rod is placed on the carrying platform of the cutting equipment, the silicon rod is located between a pair of centering jaws and does not contact the two centering jaws. The centering drive part in the centering mechanism is controlled to work, driving the centering screw to rotate, and driving the two centering jaws of a pair to approach each other through the centering screw mother. One of the centering jaws first contacts the silicon rod and pushes the silicon rod toward the direction of the other clamping jaw until both centering jaws contact and clamp the silicon rod.

After placing the silicon rod on the silicon rod carrying device, the position of the silicon rod needs to be adjusted so that the position to be cut is aligned with the cutting line. For example: align the center line of the silicon rod with the cutting line. The adjustment of the position of the silicon rod can be performed through the centering mechanism in the cutting equipment. However, due to factors such as the size deviation of the centering mechanism itself or the installation error of the centering mechanism on the cutting equipment, the centering operation after the centering mechanism is performed will result. , unable to accurately move the silicon rod to the target position. Therefore, an alignment test is required before cutting.

Based on the above cutting equipment, this embodiment provides a control method for cutting silicon rods. As shown in Figure 16, the cutting control method includes:

Step 10. Control the loading mechanism to load the centering tool onto the bearing platform of the cutting equipment.

The centering tooling can be placed on the load-bearing platform through manual control of the loading mechanism or automatic loading by a robot.

Step 20: Control the centering mechanism to move the centering tool and perform an alignment test.

The cutting equipment is equipped with a centering mechanism, which is used to push the centering tool to the position to be tested. Then perform a centering test to test whether the centering tool is aligned with the cutting line at this position. If aligned, a test completion command will be generated.

Step 30: When the test completion instruction is obtained, the loading mechanism is controlled to load the silicon rod to be cut onto the carrying platform.

When the test completion instruction is obtained, the centering tooling is first removed from the load-bearing platform, and then the loading mechanism is controlled to load the silicon rod to be cut onto the load-bearing platform.

Step 40: Control the centering mechanism to center the silicon rod.

Use the same operation as step 20 to push the silicon rod to the position to be cut through the centering mechanism. After the above step 20, the centering operation of the centering mechanism meets the cutting requirements, and the silicon rod at the position to be cut is aligned with the cutting line.

Step 50: Control the relative movement between the cutting line in the cutting equipment and the silicon rod to cut the silicon rod along the length direction of the silicon rod.

Two small silicon rods are obtained, the cross-sectional area of the small silicon rods is smaller than the cross-sectional area of the silicon rods.

For example: the carrying platform can be controlled to move in the direction of the cutting line, and the silicon rod can be cut through the cutting line to obtain two small silicon rods. Subsequently, the small silicon rods can be directly sliced to obtain smaller silicon rods without the need for laser scribing. Alternatively, the wire cutting device can also be controlled to move relative to the carrying platform.

In the above scheme, the loading mechanism is controlled to load the centering tooling onto the carrying platform of the cutting equipment; the centering mechanism is controlled to move the centering tooling and perform a centering test; when the test completion instruction is obtained, the loading mechanism is controlled to load the centering tool to be cut. The silicon rod is loaded onto the carrying platform; the centering mechanism is controlled to center the silicon rod; the cutting line in the cutting equipment is controlled to move relative to the silicon rod to cut the silicon rod along the length of the silicon rod to obtain two small Silicon rods, the cross-sectional area of small silicon rods is smaller than the cross-sectional area of silicon rods. Subsequently, the small silicon rods can be directly sliced to directly obtain small silicon rods with smaller sizes. Laser scribing is no longer required, which avoids scratches on the surface of the silicon wafer, improves the quality of heterojunction cells, and ensures its conversion efficiency.

In the above step 20, the centering mechanism is controlled to move the centering tool and the centering test is performed, which specifically includes: when it is recognized that the centering tool is located on the load-bearing platform, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position where the centering tool is to be moved. The test position; when it is recognized that the test position where the centering tool is located is aligned with the cutting line, a test completion command is generated.

There is an identification device near the load-bearing platform to identify whether the alignment tooling is placed on the load-bearing platform. When it is recognized that there is a centering tool on the load-bearing platform, the centering mechanism is controlled to start and drive the centering tool to move along the first direction to the position to be tested.

The first direction is a horizontal direction perpendicular to the center line of the silicon rod, that is, the first direction is perpendicular to the cutting feed direction of the cutting equipment. For example: the carrying platform and the wire cutting device move relatively in the horizontal direction to cut the silicon rod, and the feeding direction is the same as the direction of the center line of the silicon rod, that is, the second direction. The first direction is perpendicular to the second direction. Assuming that the second direction is the front-to-back direction, the first direction is the left-to-right direction.

The position to be measured is the target position to which the centering tool can push the silicon rod to move. For example, the position to be measured is the center position of the centering mechanism, that is, the center line of the centering tool coincides with the center line of the centering mechanism.

At the position to be measured where the centering tool is located, identify whether the cutting line and the centering tool are aligned. When it is recognized that the cutting line is aligned with the centering tooling, a test completion command is generated. It shows that the centering mechanism can subsequently move the silicon rod to the target position so that it can be aligned with the cutting line to meet the cutting requirements.

To identify whether the cutting line and the centering tool are aligned, for example, laser alignment can be used, using the principle of laser propagation along a straight line to monitor whether the cutting line and the marking point on the centering tool are in the same straight line. If they are in the same straight line, then Show alignment. For example: on alignment tooling Set up a laser transmitter to emit laser from the marked point along the center line of the alignment tooling. If the laser shines on the cutting line, it indicates alignment.

Based on the above technical solution, after controlling the centering mechanism to drive the centering tool to move in the first direction to the position to be tested, it also includes:

Control the movement of the carrying platform so that the cutting wire wound on the wire cutting device and the centering tool are close to each other along the second direction. The second direction is perpendicular to the first direction, and the second direction is the length direction of the silicon rod.

Among them, it is recognized that the position to be measured where the centering tool is located is aligned with the cutting line in the cutting equipment, specifically, it is recognized that the cutting line enters the seam of the centering tool.

Specifically, a seam is set on the centering tool, and the centering mechanism drives the centering tool to move. The goal is to move the centering tool until the seam is aligned with the cutting line. If the seam and the cutting line are aligned after the centering mechanism drives the centering tool to move, it indicates that the current centering mechanism's pushing operation of the centering tool meets the requirements, and the test is completed. If the seam and the cutting line are not aligned after the centering mechanism drives the centering tool to move, it means that the current centering mechanism's pushing operation of the centering tool does not meet the requirements, and the centering mechanism needs to be adjusted.

Specifically, when it is recognized that the position to be measured where the centering tool is located is not aligned with the cutting line in the cutting equipment, the position of the centering mechanism along the first direction is adjusted, and then the adjusted centering mechanism is controlled to drive the centering tool along the first direction. Move to the position to be tested in one direction, that is, adjust the position of the centering mechanism and then perform the centering operation again, driving the centering tool to move to the position to be tested. Adjust the position of the centering mechanism along the first direction repeatedly until the centering mechanism drives the centering tool to move to the point where the seam and the cutting line are aligned.

Further, after it is recognized that the position to be measured where the centering tool is located is aligned with the cutting line in the cutting equipment, it also includes: controlling the wire cutting device or the carrying platform to move back to the initial position and waiting for subsequent cutting of the silicon rod. Specifically: when it is recognized that the silicon rod is located on the carrying platform, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be cut, so that the cutting wire wound on the wire cutting device can cut the silicon rod.

In the above steps, controlling the centering mechanism to drive the centering tool to move to the position to be measured along the first direction specifically includes: controlling the two centering jaws in the centering mechanism to approach each other along the first direction, and moving the centering jaws from both sides. Push the silicon rod sideways to move in the first direction until the silicon rod contacts the two centering jaws and reaches the position to be measured.

Assume that the distance between the seam and both sides of the centering tool is equal, that is, the seam is located on the center line of the centering tool. If the two centering jaws move at the same speed and have the same movement stroke, the centering tool will move to the position to be measured, and the cutting line will align with the seam of the centering mechanism. The subsequent cutting line can be aligned with the center line of the silicon rod to obtain two small silicon rods with equal cross-sectional areas.

Based on the above technical solutions, the identification of alignment tooling can be done through infrared, photoelectric sensors, image acquisition and other methods. In this embodiment, the rod length detection component is used for identification. The rod length detection component is located beside the centering mechanism and below the bearing platform; the rod length detection component extends upward to the bottom of the centering tool. Specifically, the detection signal of the rod length detection component installed on the bearing platform is first obtained, and then the centering tooling is identified through the detection signal. The rod length detection component can be an infrared sensor, a light sensor, etc. When the centering tool is placed on the carrying device, the rod length detection component is detected under the centering tool.

Further, during the movement of the load-bearing platform, it also includes: measuring the walking straightness of the centering tooling. Specifically, a dial indicator is used on the left datum plane and the right datum plane of the centering tooling to measure the running straightness of the centering tooling. The running straightness must be less than the preset value.

In addition, during the process of cutting the silicon rod through the cutting line, the duration of the moving feed of the bearing platform, the moving speed of the bearing platform, and the distance between the rod length detection component and the cutting line before cutting are also obtained, and then based on The duration, the moving speed of the carrying platform and the distance between the rod length detection component and the cutting line before cutting determine the length of the silicon rod.

Further, before the carrying platform moves, the distance between the rod length detection component and the cutting line is obtained;

During the movement of the bearing platform towards the cutting line, it also includes: obtaining the duration of the moving feed of the bearing platform and the moving speed of the bearing platform; and then detecting the distance between the component and the cutting line, the duration and movement based on the rod length. The speed determines the length of the silicon rod.

Based on the above solution, this embodiment also provides a centering tool. As shown in Figures 17 and 18, the centering tool 55 of this embodiment includes: a tool substrate 551 and a tool test piece 552. Among them, the tooling substrate 551 has a plate-like structure, and the tooling test piece 552 is disposed on the tooling substrate 551 . One end of the tooling test piece 552 is provided with a seam 5521 for accommodating the cutting line. There is a preset distance between the seam 5521 and the reference plane of the tooling substrate 551. The reference surface is the side of the tooling substrate 551 that is parallel to the depth direction of the seam 5521. . The width of the seam 5521 is greater than or equal to the diameter of the cutting line, and the cutting line may specifically be a diamond wire.

The centering tool 55 can be placed on the bearing device of the cutting equipment. The centering mechanism exerts thrust on the centering tool 55 from both sides so that the centering tool 55 moves relative to the bearing device. When the movement reaches the preset position, if the seam 5521 is aligned with the cutting line in the cutting equipment, so that the carrying device and the wire cutting device move relative to each other. If the cutting line can enter the seam 5521, it means that the centering tool 55 can meet the centering requirements and the silicon rod can be moved during the actual production process. Reach the preset position and cut as required through the cutting line.

The preset distance between the seam 5521 and the reference surface of the tooling substrate 551 can be determined according to the position where the cutting line cuts the silicon rod. The reference surface is the side of the tooling substrate 551 that is parallel to the depth direction of the seam 5521 .

For example, if the distance between the cutting surface of the silicon rod cut by the cutting line and one side of the silicon rod is 100 mm, then the preset distance between the seam 5521 and one side of the tooling substrate 551 is also set to 100 mm. Then during the test process, when the centering tooling is pushed into place by the centering mechanism, if the cutting line can enter the seam 5521, then the relative position between the current cutting line on the surface and the centering test piece meets the requirements, and the future cutting surface can be in the predetermined position. Cut the silicon rod at the set 100mm position.

The above solution uses a centering tooling to simulate silicon rods to test the centering mechanism. The centering tooling includes a tooling substrate and a tooling test piece. The tooling test piece is set on the tooling substrate, and one end of the tooling test piece is provided with a line to accommodate the cutting line. There is a preset distance between the seam and the reference plane of the tooling base plate. The reference plane is the side of the tooling base plate that is parallel to the depth direction of the seam.

Based on the above technical solution, the end of the tooling test piece 552 can extend out of the tooling substrate 551 so that the cutting line can enter the seam, and the tooling substrate 551 will not interfere with the cutting line.

Or, in another solution, a substrate notch 5511 for the cutting line to pass through is provided on one end surface of the tooling substrate 551 , and the substrate notch 5511 extends from the end surface of the tooling substrate 551 to the seam 5521 of the tooling test piece 552 . Then, the tooling test piece 552 is placed in the middle of the tooling substrate 551, and the cutting line first enters the substrate notch 5511, and then enters the seam 5521.

One way is that the extending direction of the seam 5521 is parallel to the cutting line and perpendicular to the surface of the tooling substrate 551 . So that the cutting line enters the seam 5521 along the direction perpendicular to the tooling substrate 551 . Alternatively, the direction of the seam 5521 can also be set according to the angle or direction in which the cutting line cuts the silicon rod. For example, if the cutting line is set at an angle and the angle between the cutting line and the tooling substrate 551 is an acute angle, then the seam 5521 is also set at an angle. .

For the method of cutting the cutting line through the center line of the silicon rod, the two side surfaces of the tooling substrate 551 adjacent to the end face with the substrate notch are used as the reference plane 5512, and the distance between the seam 5521 and the two reference planes 5512 is equal. That is: the seam 5521 is located in the middle of the two reference planes 5512.

A specific method is that the tooling substrate 551 is a rectangular plate, the substrate notch 5511 is provided on the end surface of the tooling substrate 551 extending in the width direction, and the substrate notch 5511 extends along the length direction of the tooling substrate 551 . The two sides extending along the length direction of the tooling base plate 551 are used as the reference Face 5512. The upper and lower surfaces of the tooling substrate 551 are both flat and placed horizontally on the carrying device.

The tooling test piece 552 extends in a direction perpendicular to the tooling substrate 551 . The top and bottom ends of the tool test piece 552 are respectively provided with protruding portions 5522 protruding toward the cutting line direction, and the seams 5521 are provided on the protruding portions 5522. Specifically, the upper protruding portion 5522 and the lower protruding portion 5522 are both provided with seams 5521, and the cutting line can simultaneously enter the seams 5521 of the two protruding portions 5522. This setting can prevent the seam 5521 from being too long, and the cutting line will inevitably be affected by vibration during movement. If one end cannot smoothly enter the seam 5521, the test accuracy will be affected. On the other hand, there are seams 5521 at the top and bottom. As long as the cutting line can enter the upper and lower seams, it means that the relative position of the cutting line and the seam meets the requirements, and then it is known that the centering mechanism has passed the test.

The tooling test piece 552 and the tooling substrate 551 may have an integrated structure. Alternatively, the tooling test piece 552 is fixed on the tooling substrate 551 by welding, pressing, clamping, etc. For example, the tooling substrate 551 is provided with a test piece installation slot or a test piece installation hole, and the tooling test piece is inserted into and fixed in the test piece installation slot or test piece installation hole.

Furthermore, the tooling substrate 551 is also provided with at least two substrate through holes 5513 extending through its thickness, and each substrate through hole 5513 is spaced apart along the length direction of the tooling substrate 551 . On the one hand, the substrate through hole 5513 plays a role in reducing weight, and on the other hand, it forms a hollow structure to facilitate the exposure of the detection device at the bottom of the carrying device for observation and detection.

Based on the above-mentioned centering tooling and centering device, this embodiment provides a specific implementation method of the silicon rod cutting control method:

Step 1: Place the centering tool 55 on the platform support 211;

Step 2, control the start of the centering mechanism 5 to bring the centering jaws 535 closer to each other until the centering tool 55 moves to the position to be tested, and then release the centering jaws 535;

Step 3, control the carrying device to move in the direction of the wire cutting device 3, and identify whether the cutting line can enter the seam of the centering tool 55;

If it enters the seam of the centering tool 55, perform step 5;

If it cannot enter the seam of the centering tool 55, proceed to step 4.

Step 4: Adjust the position of the centering mechanism 55 along the first direction according to the position deviation between the seam and the cutting line;

Then repeat steps 2 and 3.

Each time the position of the centering mechanism 55 is adjusted, the centering mechanism 55 is fixed to prevent the centering mechanism 55 from moving during the detection process.

Step 5, and control the carrying device to move to the initial position.

Step 6: Remove the centering tooling 55.

Step 7: Place the silicon rod on the bearing platform 211.

Step 8: Control the centering mechanism 5 to start to bring the centering jaws 535 closer to each other until the silicon rods are moved to the position to be cut, and then release the centering jaws 535.

Step 9: Control the carrying device to move in the direction of the wire cutting device 3 to cut the silicon rod through the cutting wire.

Furthermore, during the execution of step 3 above, a dial indicator is also used to measure the left datum plane or the right datum plane of the centering tool 55 to measure the running straightness of the centering tool 55 . Specifically, the dial indicator is fixed on the machine base 1, and the dial indicator head is set on the left datum plane or the right datum plane of the tooling. In the process of the bearing platform driving the centering tool 55 to move, changes in the dial indicator are identified to determine the walking straightness of the centering tool 55. When the straightness is less than the preset value, it indicates that it is qualified. If the straightness is greater than the preset value, adjust the deflection angle of the centering mechanism 2 relative to the second direction, and repeat steps 2 and 3 after adjustment until the straightness meets the requirements.

For the two sets of centering mechanisms 55, adjust them in the same way.

In the above content, the length of the silicon rod is determined based on the duration, the moving speed of the carrying platform and the distance between the rod length detection component and the cutting line before cutting, as shown in Figure 19.

The rod length detection component 56 is a travel switch. Before cutting and feeding, the distance S between the rod length detection component 56 and the cutting line is fixed, and the distance L between the rod length detection component 56 and the front end of the silicon rod can be measured. When the silicon rod is placed on the carrying platform, the rod length detection component 56 is triggered and sends a switch signal. During the cutting and feeding process, the silicon rod moves to the right end in the figure. After a certain period of time, the silicon rod leaves the rod length detection component 56 and the trigger signal of the rod length detection component 56 disappears. The length of the silicon rod can be calculated based on the feed speed v of the carrying platform, the cutting time t, and the above distances S and L. Rod length x=v*t+SL.

Claims

A silicon rod cutting equipment, characterized by including:

Machine base;

A silicon rod carrying device is arranged on the machine base;

A wire cutting device is arranged on the machine base; the wire cutting device and the silicon rod carrying device can move relatively; during the relative movement, the cutting wire wound on the wire cutting device cuts the silicon rod;

The centering device is provided on the silicon rod carrying device. At least one pair of centering claws in the centering device extends to both sides of the silicon rod and is used to push the silicon rod to move to the target cutting position corresponding to the cutting line.
The silicon rod cutting equipment according to claim 1, characterized in that the moving stroke and moving speed of two centering jaws of a pair of centering jaws are the same, and are used to push the silicon rod to move to the length direction of the silicon rod. The center line is aligned with the cutting line so that the cutting line passes through the center line of the silicon rod and is cut to obtain two small silicon rods with equal cross-sectional areas.
The silicon rod cutting equipment according to claim 2, wherein the silicon rod is a square rod with a rectangular cross section.
The silicon rod cutting equipment according to claim 1, characterized in that the silicon rod carrying device moves relative to the machine base in a horizontal direction, and the length direction of the silicon rod extends in the horizontal direction.
The silicon rod cutting equipment according to claim 4, characterized in that the silicon rod bearing device includes: a bearing platform and at least one set of platform supports extending in the horizontal direction from one side of the bearing platform; one set of platform supports includes two There are two platform supports arranged side by side, with a passing space between the two platform supports. The silicon rod is placed on the two platform supports. The length direction of the silicon rod is the same as the length direction of the platform support.
The silicon rod cutting equipment according to claim 5, characterized in that the centering device is arranged below a set of platform supports, and the centering jaws extend upward from both sides of the set of platform supports to both sides of the silicon rod. side, used to push the silicon rod to move horizontally along the width direction of the silicon rod.
The silicon rod cutting equipment according to claim 5, characterized in that the centering device includes:

The centering support seat is set below a set of platform supports;

A centering mechanism is provided on the centering support base; the centering mechanism has at least one pair of centering jaws, which extend to both sides of the silicon rod; the pair of centering jaws can be close to or away from each other , when close to each other, the silicon rod can be pushed to move to the middle position of a pair of centering jaws;

The centering adjustment component is provided on the centering support seat and is used to adjust the position of the centering mechanism.
The silicon rod cutting equipment according to claim 7, further comprising:

The centering adjustment plate is arranged on the top of the centering support base; the centering adjustment plate can move along the first direction relative to the centering support base, and is fixed to the centering support base through fasteners after moving into place; the centering adjustment plate The mechanism is fixed on the centering adjustment plate; the centering adjustment component is used to apply a force to the centering adjustment plate to move in a first direction; the first direction is the same as the moving direction of the centering jaws toward or away from each other.
The silicon rod cutting equipment according to claim 8, characterized in that the number of the centering mechanisms is two, and they are arranged on the centering adjustment plate at intervals along a direction perpendicular to the first direction.
The silicon rod cutting equipment according to claim 9, further comprising:

The rod length detection component is arranged on the centering adjustment plate and is located between the two centering mechanisms; the rod length detection component extends upward to the bottom of the silicon rod.
The silicon rod cutting equipment according to claim 7, characterized in that the centering mechanism includes:

centering support;

At least one pair of centering drive rods; the centering drive rods extend along the first direction and are arranged on the centering support;

The centering drive member is provided on the centering support; the centering drive member is connected to one end of each centering drive rod, and the centering drive member can drive the centering drive rod along the first direction relative to the centering The support moves;

At least one pair of centering jaws are respectively provided at both ends of the centering support along the first direction; the centering jaws are respectively connected to the other end of the driving rod to move synchronously with the centering driving rod; the pair The middle clamping jaw extends toward the direction of the silicon rod, and a pair of centering clamping jaws are used to push against the silicon rod from both sides to achieve alignment.
The silicon rod cutting equipment according to claim 11, characterized in that the centering support is provided with a receiving space, and the centering driving member is located in the receiving space; the centering driving rod is passed through the centering support. On the centering drive rod, the end that penetrates into the accommodation space is connected to the centering drive part, and the end of the centering drive part that extends out of the centering support is connected to the centering clamp.
The silicon rod cutting equipment according to claim 14, characterized in that the centering mechanism further includes:

The centering guide rod extends along the first direction and is movably provided on the centering support; one end of the guide rod is connected to the centering clamp.
The silicon rod cutting equipment according to claim 11, characterized in that the centering jaws include:

Clamp connecting block, connected to the centering drive rod;

The clamping jaw arm is provided on the clamping jaw connecting block; the clamping jaw arm extends toward the silicon rod to the side of the silicon rod.
The silicon rod cutting equipment according to claim 13, characterized in that, the two side walls of the centering support perpendicular to the first direction are provided with drive rod perforations for the centering drive rod to pass through and centering guides. Guide rod perforations through which the rod passes;

The drive rod through hole is located above the guide rod through hole, and the center lines of the two centered drive rods are arranged side by side; the center lines of the two centered guide rods are arranged side by side.
The silicon rod cutting equipment according to claim 5, characterized in that there are two sets of said platform supports, arranged side by side; the wire cutting device can simultaneously cut the silicon rods on the two sets of platform supports.
A control method for cutting silicon rods applied to the cutting equipment of any one of claims 1 to 16, characterized in that it includes:

Control the loading mechanism to load the centering tool onto the carrying platform of the cutting equipment;

Control the centering mechanism to move the centering tooling and conduct centering tests;

When the test completion instruction is obtained, the loading mechanism is controlled to load the silicon rod to be cut onto the carrying platform;

Control the centering mechanism to center the silicon rod;

The cutting line in the cutting equipment is controlled to move relative to the silicon rod to cut the silicon rod along the length direction of the silicon rod to obtain two small silicon rods. The cross-sectional area of the small silicon rod is smaller than the cross-sectional area of the silicon rod.
The control method according to claim 17, characterized in that the relative movement between the cutting line and the silicon rod in the cutting equipment is controlled, specifically:

Control the bearing platform to move toward the cutting line.
The control method according to claim 18, characterized in that the carrying platform is provided with a rod length detection component; the method further includes:

Before the carrying platform moves, obtain the distance between the rod length detection component and the cutting line;

During the movement of the bearing platform towards the cutting line, it also includes: obtaining the duration of the moving feed of the bearing platform and the moving speed of the bearing platform;

The length of the silicon rod is determined according to the distance between the rod length detection component and the cutting line, the duration and the moving speed.
The control method according to claim 17, characterized in that controlling the centering mechanism to move the centering tool and performing a centering test includes:

When it is recognized that the centering tool is located on the bearing platform, the centering mechanism is controlled to drive the centering tool to move to the position to be measured along a first direction; the first direction is perpendicular to the cutting feed direction of the cutting equipment;

When it is recognized that the position to be tested where the centering tool is located is aligned with the cutting line, a test completion command is generated.
The control method according to claim 20, characterized in that after controlling the centering mechanism to drive the centering tool to move along the first direction to the position to be measured, it further includes:

Control the movement of the carrying platform so that the cutting wire wound on the wire cutting device and the centering tool are close to each other along the second direction; the second direction is perpendicular to the first direction, and the second direction is the length direction of the silicon rod;

It is recognized that the position to be measured where the centering tool is located is aligned with the cutting line in the cutting equipment. Specifically, it is recognized that the cutting line enters the seam of the centering tool.
The control method according to claim 20, characterized in that controlling the centering mechanism to drive the centering tool to move along the first direction to the position to be tested includes:

At least one pair of centering clamps in the centering mechanism is controlled to approach each other along the first direction, and the centering clamps push the silicon rod from both sides to move in the first direction until the silicon rod is in contact with the two centering clamps in the pair. The claws make contact and reach the position to be measured.
The control method according to claim 22, further comprising:

Obtain the detection signal of the rod length detection component installed on the carrying platform;

The centering tooling is identified through the detection signal.
The control method according to claim 23, wherein the rod length detection component is located beside the centering mechanism and below the bearing platform; the rod length detection component extends upward to below the centering tool.
The control method according to claim 20, further comprising:

When it is recognized that the position to be measured where the centering tool is located is not aligned with the cutting line in the cutting equipment,

Adjust the position of the centering mechanism along the first direction;

The adjusted centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be measured.
The control method according to claim 17, characterized in that the centering mechanism includes: a centering drive member, a centering drive rod and a centering clamp; the centering drive rod extends along the first direction and is connected to the centering Between the drive element and the centering jaw;

Control two centering jaws of at least one pair of centering jaws in the centering mechanism to approach each other along the first direction, specifically as follows:

The centering driving part is controlled to work, driving the centering driving rod to move in the first direction and driving the centering jaws to move in the first direction, and the two centering jaws in a pair move in opposite directions.
The control method according to claim 26, characterized in that the two centering jaws move synchronously and have the same movement stroke to obtain two small silicon rods with equal cross-sectional areas.