WO2021022844A1 - Silicon rod cutting-grinding integrated machine, and silicon rod cutting-grinding method - Google Patents

Abstract

A silicon rod cutting-grinding integrated machine, and a silicon rod (100, 200) cutting-grinding method. The silicon rod cutting-grinding integrated machine comprises: a base (1), a cutting apparatus (2), a grinding apparatus (3), and a silicon rod conversion apparatus (4). The silicon rod conversion apparatus (4) orderly and seamlessly transfers a silicon rod (100, 200) among multiple processing apparatuses, the circular silicon rod (100) is subjected to two fold cuttings by means of the cutting apparatus (2) to form a square silicon rod (200), and the square silicon rod (200) subjected to squaring cutting is subjected to grinding by means of the grinding apparatus (3), so that integrated operations of the multiple processes of squaring and grinding of the silicon rod (100, 200) are completed.

Description

Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method Technical field

This application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method.

Background technique

At present, with the society's attention and openness to the use of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut and processed by a multi-wire saw after pulling or casting a silicon ingot.

The current production process of silicon wafers takes monocrystalline silicon products as an example. Generally, the general operation procedures can include: first use a silicon rod cutting machine to cut the original long silicon rods to form multiple short silicon rods; the cutting is completed After that, a silicon rod squarer was used to square the cut short silicon rods to form a single crystal silicon rod; then the single crystal silicon rods were subjected to surface grinding and chamfering operations to make the single crystal silicon rods The surface shaping meets the corresponding flatness and dimensional tolerance requirements; subsequently, the single crystal silicon rod is sliced using a slicer to obtain the single crystal silicon wafer.

However, under normal circumstances, in related technologies, the operations required for each process operation (such as cutting square, grinding, chamfering, etc.) are arranged independently, and the corresponding processing devices are scattered in different production units or production workshops. Or in different production areas of the production workshop, the conversion of workpieces that perform different process operations requires transportation and deployment, and pretreatment may be required before each process operation is performed. In this way, the process is complicated, inefficient, and easily affects the silicon rod. The quality of processing operations requires more manpower or transfer equipment, which poses a major safety hazard. In addition, there are many flow links between operating equipment in each process, which increases the risk of damage to the workpiece during the transfer of the workpiece, and is prone to non-production factors. The unqualified products reduce the qualified rate of products and the unreasonable losses caused by the existing processing methods. It is a major improvement issue faced by various companies.

Summary of the invention

In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a silicon ingot cutting and grinding integrated machine and a silicon ingot cutting and grinding method, which are used to solve the inefficiency between various processes and silicon ingot processing in the related art. Problems such as poor job results.

In order to achieve the above and other related purposes, the present application discloses an integrated silicon rod cutting and grinding machine, which includes: a machine base with a silicon rod processing table; a cutting device for positioning the silicon rod processing table on the first processing position The silicon rod is first folded and cut and the silicon rod on the second processing zone of the silicon rod processing table is cut by the second folded face to form a square silicon rod; the first folded face cutting and the second Any one of the two-fold surface cutting refers to the cutting of two orthogonal side surfaces of the silicon rod; the surface grinding device is used for cutting the square shape on the third processing position of the silicon rod processing table. Surface grinding and chamfering of silicon rods; and a silicon rod conversion device arranged on the silicon rod processing table for converting the silicon rods at the first processing location, the second processing location, and the third processing location .

The silicon rod cutting and grinding integrated machine disclosed in this application integrates a cutting device and a grinding device. The silicon rod conversion device can be used to transfer the silicon rods between the various processing devices in an orderly and seamless manner. The rod is folded and cut twice to form a square silicon rod, and the square silicon rod after square-cutting is ground by a grinding device, thereby completing the integrated operation of the square-cutting and grinding of the silicon rod, improving production efficiency and The quality of product processing operations.

In some embodiments of the first aspect of the present application, the cutting device includes: a first cutting device provided at a first processing position of the silicon rod processing platform and a second processing device provided on the silicon rod processing platform Location of the second cutting device.

In some implementations of the first aspect of the present application, the first cutting device includes: a first cutting frame; a first cutting support, movably raised and lowered on the first cutting frame; and a first cutting unit provided in the first cutting frame. The first cutting support; the first cutting unit includes a first wire frame provided on the first cutting support, a plurality of first cutting wheels provided on the first wire frame, and a first A cutting line, the first cutting line is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments.

In some embodiments of the first aspect of the present application, the first cutting device further includes a first edge skin unloading device for cutting the silicon rod by the first cutting device after the first folding The formed edges are discharged.

In some embodiments of the first aspect of the present application, the second cutting device includes: a second cutting frame; a second cutting support, movably raised and lowered on the first cutting frame; and a second cutting unit provided in the The second cutting support; the second cutting unit includes a second wire frame provided on the second cutting support, a plurality of second cutting wheels provided on the second wire frame, and a second cutting The second cutting line is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments.

In some embodiments of the first aspect of the present application, the second cutting device further includes a second edge skin unloading device for cutting the silicon rod by the second cutting device after the second folding The formed edges are discharged.

In some embodiments of the first aspect of the present application, the cutting device includes: a cutting frame; a cutting support, movably raised and lowered on the cutting frame; the cutting support includes a support main body and a main body located on the support The first support side wings and the second support side wings on opposite sides; the first cutting unit is provided on the first side of the cutting support; the first cutting unit includes the side wings provided on the first support And a plurality of first cutting wheels and a first cutting line on the support body, the first cutting line is arranged around the plurality of first cutting wheels in sequence to form two orthogonal first cutting line segments; The second cutting unit is arranged on the second side of the cutting support; the second cutting unit includes a plurality of second cutting wheels arranged on the side wings of the second support and the support body, and a first Two cutting lines, the second cutting lines are sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments.

In some embodiments of the first aspect of the present application, the first cutting line and the second cutting line are the same cutting line, and the cutting support is further provided with the first cutting unit and the Between the second cutting units, guide wheels for the cutting line to be wound around.

In some embodiments of the first aspect of the present application, the first cutting unit further includes a first edge skin unloading device for cutting the silicon rod by the first cutting unit after the first folding The formed edge skin is discharged; the second cutting unit further includes a second edge skin unloading device, which is used to discharge the edge skin formed after the second cutting unit performs the second folding and cutting of the silicon rod Unloading.

In some embodiments of the first aspect of the present application, when the first cutting unit performs the first bend cutting of the silicon rod, the intersection of the two orthogonal first cutting line segments is located in the cross section of the silicon rod When the second cutting unit performs the second bend cutting of the silicon rod, the intersection of the two orthogonal second cutting line segments is located in the cross section of the silicon rod.

In some embodiments of the first aspect of the present application, the grinding device includes: a grinding surface support provided on the machine base; at least a pair of abrasive tools are oppositely provided on the grinding surface support; The at least one pair of grinding tools move up and down relative to the grinding surface support for grinding and chamfering the square silicon rod.

In some embodiments of the first aspect of the present application, the abrasive tool includes: a spindle; at least one grinding wheel is arranged on the working end of the spindle.

In some embodiments of the first aspect of the present application, the grinding tool includes: a rotating chassis; a double-headed spindle is arranged on the rotating chassis, and at least one rough grinding wheel is provided at the first end of the Two ends are provided with at least one fine grinding wheel; a drive motor is used to drive the rotating chassis to rotate so that the first end and the second end of the double-headed main shaft are interchanged.

In some embodiments of the first aspect of the present application, the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are distributed at 120° between each other. The rotation angle range of the device is ±240°.

In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device, which is adjacent to the silicon rod processing platform The waiting area is used to transfer the silicon rods to be processed to the waiting area of the silicon rod processing platform or to transfer the processed silicon rods in the waiting area from the silicon rod processing platform.

In some embodiments of the first aspect of the present application, the silicon rod transfer device includes: a transfer base, which is slidably arranged on the base through a sliding mechanism; a silicon rod platform, which is movably arranged on the transfer base, The silicon rod is arranged in the lateral direction; the silicon rod fastening mechanism is arranged on the silicon rod platform and is used to fasten the silicon rod during the transfer process of the silicon rod; the platform turning mechanism is used to drive the silicon rod The rod platform is turned relative to the transfer base, so that the silicon rod is placed upright on the silicon rod transfer device.

In some implementations of the first aspect of the present application, the integrated silicon rod cutting and grinding machine further includes a positioning detection device for edge detection and center positioning of the silicon rods located in the waiting area.

In some embodiments of the first aspect of the present application, the positioning detection device includes: a ridgeline detection unit, including a contact detection mechanism, a rotation mechanism, and an electrical connection with the contact detection mechanism and the rotation mechanism. The detection controller, the contact detection structure is used to send an on-off signal to the detection controller by contacting with the ridgeline of the silicon rod, and the rotation mechanism is used to adjust the silicon according to the control of the detection controller. The position of the rod; an axis adjustment unit for positioning the axis of the silicon rod in the center of the pretreatment zone, including a clamping mechanism for forming a clamp for clamping the silicon rod And the center of the clamping space coincides with the center of the pretreatment zone.

In some embodiments of the first aspect of the present application, the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are distributed at 90° adjacent to each other, and the silicon rod conversion The rotation angle range of the device is ±270°.

In some embodiments of the first aspect of the present application, the silicon rod conversion device includes: a conveying body; a silicon rod positioning mechanism arranged on the conveying body for positioning the silicon rod; a conversion drive mechanism , Used to drive the conveying body to rotate to drive the silicon rods positioned by the silicon rod positioning mechanism to switch between various processing positions.

The second aspect of the present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. There are a first processing location, a second processing location, and a third processing location. The silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method includes the following steps:

The silicon rod conversion device is caused to convert the first silicon rod to the first processing area, and the cutting device is caused to perform the first bend cutting of the first silicon rod in the first processing area; the first bend cutting refers to the Cut the two orthogonal sides of the silicon rod;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod to the first processing position, so that the cutting device can perform the second processing The first silicon rod in the location is subjected to a second folding cutting and the second silicon rod in the first processing position is subjected to a first folding cutting; the second folding cutting refers to two positive cuts of the silicon rod Cut the cross side;

The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing area to the third processing area, to convert the second silicon rod from the first processing area to the second processing area, and to convert the third silicon rod from the first processing area to the second processing area. The rod is converted to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to perform the grinding and chamfering on the second silicon rod in the second processing area. The second folding cutting and the first folding cutting of the third silicon rod at the first processing location;

The silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the first processing position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod The rod is converted from the first processing area to the second processing area, the first silicon rod is unloaded from the first processing area and the fourth silicon rod is loaded, so that the cutting device performs the first folding of the fourth silicon rod on the first processing area Cutting. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing zone, and the cutting device is made to cut the third silicon rod in the second processing zone for the second folding.

The silicon rod cutting and grinding method applied to the silicon rod cutting and grinding integrated machine disclosed in this application can enable the silicon rod conversion device to transfer the silicon rods between the various processing devices in an orderly and seamless manner, and make the cutting device to Folding and cutting twice to form a square silicon ingot and the grinding device to grind the square silicon ingot after square rooting, so as to complete the multi-process integrated operation of square rooting and grinding of silicon ingot, improving production efficiency and products The quality of processing operations.

In some embodiments of the second aspect of the present application, the first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 120° between each other; When the sequence of the second processing zone and the third processing zone is defined as a positive direction, the first preset angle for rotating the silicon rod conversion device is a forward rotation of 120°, and the silicon rod conversion device is rotated The second preset angle is 120° in the forward direction or 240° in the reverse direction.

The third aspect of the present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. With a waiting area, a first processing area, a second processing area, and a third processing area, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device, characterized in that the silicon rod The cutting method includes the following steps:

Loading the first silicon rod in the waiting area, and preprocessing the first silicon rod;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the waiting area to the first processing area, and the cutting device is caused to perform the first folding cutting of the first silicon rod on the first processing area. In the stage, the second silicon rod is loaded in a waiting area to pre-process the second silicon rod; the first folded face cutting refers to cutting two orthogonal sides of the silicon rod;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod from the waiting position to the first processing position, so that the cutting device is The first silicon rod in the second processing area is subjected to second folding cutting and the second silicon rod in the first processing position is subjected to first folding cutting. At this stage, the third silicon rod is loaded in the waiting area. The third silicon rod is pretreated; the second folded face cutting refers to cutting two orthogonal sides of the silicon rod;

The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, the second silicon rod from the first processing position to the second processing position, and the third silicon rod The rod is switched from the waiting area to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to grind and chamfer the second silicon rod in the second processing area. Performing the second folding cutting of the silicon rod and performing the first folding cutting of the third silicon rod at the first processing area, and at the same time, loading the fourth silicon rod in the waiting area to preprocess the fourth silicon rod;

The silicon rod conversion device is rotated by a second preset angle to convert the first silicon rod from the third processing position to the waiting position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod from the The first processing area is converted to the second processing area, the fourth silicon rod is converted from the waiting area to the first processing area, the first silicon rod is unloaded from the waiting area and the fifth silicon rod is loaded, and the fifth silicon rod is processed Pretreatment. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to cut the third silicon rod in the second processing area. And performing the first folding cutting on the fourth silicon rod in the first processing area.

The silicon rod cutting and grinding method applied to the silicon rod cutting and grinding integrated machine disclosed in this application can enable the silicon rod conversion device to transfer the silicon rods between the various processing devices in an orderly and seamless manner, and make the cutting device to Folding and cutting twice to form a square silicon ingot and the grinding device to grind the square silicon ingot after square rooting, so as to complete the multi-process integrated operation of square rooting and grinding of silicon ingot, improving production efficiency and products The quality of processing operations.

In some embodiments of the third aspect of the present application, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° among each other; When the sequence of the location, the first processing location, the second processing location, and the third processing location is defined as a positive direction, the first preset angle for rotating the silicon rod conversion device is a forward rotation of 90°. The second preset angle of rotating the silicon rod conversion device is 90° in the forward direction or 270° in the reverse direction.

Description of the drawings

FIG. 1 shows a schematic diagram of a three-dimensional structure of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application.

Fig. 2 shows a top view of the integrated silicon rod cutting and grinding machine in an embodiment of the present application.

Fig. 3 is a partial enlarged view of part B of Fig. 1.

FIG. 4 shows a schematic structural diagram of a cutting device in an integrated silicon rod cutting and grinding machine of the present application in an embodiment.

Figure 5 shows the intersection of the first cutting line when the first cutting unit performs the first bend cutting of the silicon rod and the second cutting line when the second cutting unit performs the second bend cutting of the silicon rod is located in the cross section of the silicon rod Internal cross-sectional schematic

Figure 6 shows the intersection of the first cutting line when the first cutting unit performs the first bend cutting of the silicon rod and the second cutting line when the second cutting unit performs the second bend cutting of the silicon rod is located on the cross section of the silicon rod Schematic cross section on the circumference.

Figures 7 to 14 show the structure diagrams of the silicon rod cutting and grinding integrated machine of the present application in each step of the silicon rod cutting and grinding method.

FIG. 15 shows a schematic diagram of a three-dimensional structure of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application.

Fig. 16 shows a top view of the integrated silicon rod cutting and grinding machine in an embodiment of the present application.

Fig. 17 is a partial enlarged view of part A of Fig. 15.

FIG. 18 shows a schematic diagram of the structure of a cutting device in an integrated silicon rod cutting and grinding machine of this application in an embodiment.

Figure 19 shows the intersection of the first cutting line when the first cutting unit performs side-cutting of the silicon rod in the first direction and the second cutting line when the second cutting unit performs side-cutting of the silicon rod in the second direction is located on the cross section of the silicon rod Schematic cross-section of the interior.

Figure 20 shows that the intersection of the first cutting line when the first cutting unit performs side-cutting of the silicon rod in the first direction and the second cutting line when the second cutting unit performs side-cutting of the silicon rod in the second direction is located on the cross section of the silicon rod Schematic cross section on the circumference.

Figures 21 to 27 show schematic structural diagrams of the silicon rod cutting and grinding integrated machine of the present application in each step of the silicon rod cutting and grinding method.

detailed description

The following specific examples illustrate the implementation of this application. Those familiar with this technology can easily understand other advantages and effects of this application from the content disclosed in this specification.

In the following description, referring to the drawings, the drawings describe several embodiments of the present application. It should be understood that other embodiments can also be used, and mechanical, structural, electrical, and operational changes can be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patent. The terms used here are only for describing specific embodiments, and are not intended to limit the application. Space-related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., can be used in the text for ease of explanation The relationship between one element or feature shown in the figure and another element or feature.

Although the terms first, second, etc. are used herein to describe various elements or parameters in some examples, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter. For example, the first direction may be referred to as the second direction, and similarly, the second direction may be referred to as the first direction without departing from the scope of the various described embodiments.

Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to also include the plural forms, unless the context dictates to the contrary. It should be further understood that the terms "comprising" and "including" indicate the existence of the described features, steps, operations, elements, components, items, types, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, components, items, categories, and/or groups. The terms "or" and "and/or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . An exception to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

In the related processing technology for silicon rods, several processes such as square cutting, surface grinding, and chamfering are involved.

Generally, most of the existing silicon rods have a cylindrical structure. The silicon rods are square-cut by the silicon rod square-cutting equipment, so that the cross-section of the silicon rods after square-cutting is similar to rectangular (including square-like), while the processed silicon The rod has a rectangular parallelepiped shape as a whole (may also include a cube-like shape).

Taking a single crystal silicon rod as an example, the formation process of a single crystal silicon rod may include: first using a silicon rod cutting machine to cut the original long silicon rod to form a multi-segment short silicon rod; after the cutting is completed, use the silicon rod to open the square The machine performs square extraction on the cut short silicon rods to form single crystal silicon rods with a rectangular cross-section. Among them, the use of a silicon rod cutting machine to cut the original long silicon rods to form multiple short silicon rods can refer to, for example, CN105856445A, CN105946127A, and CN105196433A. For the specific implementation of forming a single crystal silicon rod with a rectangular cross-section after the short silicon rods are squared, please refer to CN105818285A and other patent publications. However, the formation process of the single crystal silicon rod is not limited to the aforementioned technology. In an alternative example, the formation process of the single crystal silicon rod may also include: first use a full silicon rod squarer to open the original long silicon rod. A long single crystal silicon rod with a rectangular cross-section is formed; after the square root is completed, a silicon rod cutting machine is used to cut the long single crystal silicon rod after the square cut to form a short crystal silicon rod. Among them, the above-mentioned method of using a full silicon rod squarer to square the original long silicon rod to form a rectangular-like long single crystal silicon rod can refer to patent publications such as CN106003443A.

After the square-cutting equipment is used to cut the cylindrical monocrystalline silicon rods to form rectangular-like silicon rods, the grinding equipment can be used to grind and chamfer the rectangular-like silicon rods.

The inventor of the present application found that in the related processing technology for silicon rods, the processing devices involved in square extraction and grinding (such as grinding, chamfering, etc.) are dispersed and arranged independently of each other, and perform different process operations. The conversion of silicon rods requires handling, deployment and preprocessing before processing, which has problems such as complicated procedures and low efficiency.

In view of this, this application proposes a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Through equipment transformation, multiple processing devices are integrated in one equipment, which can automatically realize the square cutting and grinding of silicon rods ( Such as grinding, chamfering, etc.), seamless connection between various processing operations, saving labor costs and improving production efficiency, and improving the quality of silicon rod processing operations.

Please refer to FIGS. 1 to 2. In which, FIG. 1 shows a schematic diagram of a three-dimensional structure of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application, and FIG. 2 shows an example of an integrated silicon rod cutting and grinding machine according to the present application. Top view.

In this embodiment, the integrated silicon rod cutting and grinding machine of the present application is used to perform square cutting and grinding operations on silicon rods. Here, the silicon rod is a single crystal silicon rod, but it is not limited thereto. For example, polysilicon rods should also belong to the scope of protection of this application.

As shown in the figure, the silicon rod squaring equipment disclosed in the present application includes: a base 1, a cutting device 2, a grinding device 3, and a silicon rod conversion device 4. The base 1 has a silicon rod processing platform. The cutting device 2 is set on the machine base 1, and is used to perform the first bend cutting of the silicon rods on the first processing position of the silicon rod processing platform and the silicon rods on the second processing area of the silicon rod processing platform. The rod undergoes a second folding and cutting to form a square silicon rod. The grinding device 3 is arranged on the machine base 1 and is used for grinding and chamfering the square silicon rod on the third processing position of the silicon rod processing platform.

As the main part of the silicon rod multi-station processing machine of the present application, the base 1 has a silicon rod processing platform, wherein the silicon rod processing platform can be divided into a plurality of functional areas according to the specific operation content of the silicon rod processing operation. Specifically, in the embodiment shown in FIG. 1 and FIG. 2, the silicon rod processing platform at least includes a waiting area, a first processing area, a second processing area, and a third processing area.

The silicon rod conversion device 4 is arranged in the center area of the silicon rod processing platform, and is used to place the silicon rod 100 on the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. Convert between. In one embodiment, the silicon rod conversion device 4 is rotatably arranged on the silicon rod processing platform, and the silicon rod conversion device 4 may further include: a conveying body 41 in the shape of a disc, a square disc or other similar shapes; The silicon rod positioning mechanism 43 on the conveying body 41 is used to position the silicon rods; the conversion driving mechanism is used to drive the conveying body 41 to rotate to drive the silicon rod positioning mechanism 43 to switch positions.

As mentioned above, the silicon rod processing platform in this embodiment includes a waiting area, a first processing area, a second processing area, and a third processing area. In order to be compatible with these functional areas, the conveyor body 41 The number of silicon rod positioning mechanisms 43 can be set to four, and each silicon rod positioning mechanism 43 can position at least one silicon rod. Further, the angles set between the four silicon rod positioning mechanisms 43 are also consistent with the angle distribution between the four functional areas. In this way, when a certain silicon rod positioning mechanism 43 corresponds to a certain functional location, inevitably, the other three silicon rod positioning mechanisms 43 also correspond to the other three functional locations respectively. In this way, in the pipeline operation, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism 43 and the silicon rod positioning mechanism 43 corresponds to the functional location, these silicon rods are located in the corresponding one. Corresponding processing operations are performed in a functional area. For example, silicon rods located in the waiting area can be pre-processed, silicon rods located in the first processing area can be processed first, and silicon rods located in the second processing area can be processed For the second processing operation, the silicon rod located in the third processing area can perform the third processing operation. In an optional embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° among each other. Therefore, correspondingly , The four silicon rod positioning mechanisms 43 on the conveying body 41 are also distributed at 90° between two. Of course, the number of the silicon rod positioning mechanisms 43 can be changed according to actual requirements and is not limited to this. For example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotating carrier 431, a rotating pressing device 433, a lifting drive device (not labeled in the figure), and a rotating drive device (not labeled in the figure).

The rotating bearing platform 431 is set on the conveying body 41 in the silicon rod conversion device 4, and is used to carry the silicon rod 100 (200) and make the silicon rod 100 (200) stand upright, that is, the bottom of the silicon rod 100 (200) is located On the rotating carrier 431. In this embodiment, the rotating stage 431 rotates when the conveying body 41 in the silicon rod conversion device 4 rotates. In some embodiments, the rotating bearing platform 431 can also be designed to be rotatable. For example, the rotating bearing platform 431 has a rotating shaft relative to the conveying body 41 to realize the rotation movement. In this way, when the rotating bearing platform 431 supports the silicon rod 100 ( After 200), the rotating carrier 431 and the silicon rod 100 (200) on it can rotate together. Further, the contact surface of the rotating bearing platform 431 for contacting with the silicon rod is damped to provide a certain friction force that can drive the silicon rod. The rotating bearing platform 431 is adapted to the silicon rod 100 (200). In some embodiments, the rotating bearing platform 431 may be a circular bearing platform or a square bearing platform adapted to the cross-sectional size of the silicon rod 100 (200).

The rotary pressing device 433 is relatively disposed above the rotary bearing platform 431, and is used to press the top of the silicon rod 100 (200) to compress the silicon rod 100 (200). The rotary pressing device 433 may further include a movable support and a pressing movable block provided at the bottom of the support. The support is movably arranged on a central mounting frame, which is located in the central area of the conveying body 41 and rotates along with the conveying body 41. The top pressure movable block is adapted to the silicon rod 100 (200). In an optional embodiment, the top pressure movable block may be a circular cake-shaped pressure piece that is adapted to the cross-sectional size of the silicon rod 100 (200). Block or square pressing block, etc. Furthermore, the pressing movable block in the rotary pressing device 433 is pivotally connected to the support and can rotate relative to the support.

It can be seen from the foregoing that the rotating bearing platform 431 is designed to be capable of rotating motion and the pressing movable block in the rotary pressing device 433 is pivotally connected to the support. Therefore, the rotating bearing platform 431 or the pressing movable block Can be linked to a rotary drive device. In one situation, when the rotating bearing platform 431 is linked to a rotation driving device, the rotating bearing platform 431 is used as the active rotating part and the pressing movable block is used as the driven rotating part; in another case, when When the pressing movable block is linked to a rotation driving device, the pressing movable block is used as the active rotating part and the rotating bearing platform 431 is used as the driven rotating part.

In practical applications, the rotary pressing device 433 can cooperate with the rotary bearing platform 431 underneath. Specifically, after the silicon rod 100 (200) is placed vertically on the rotary bearing platform 431, the lifting drive device drives the The support moves downward along the central mounting frame until the pressing movable block on the support presses against the top of the silicon rod 100 (200). Afterwards, when the silicon rod 100 (200) needs to be rotated, the rotating bearing platform 431 or the pressing movable block is driven by the rotation driving device to rotate, and the rotating bearing platform 431, the silicon rod 100 (200), and the top The frictional force between the movable blocks drives the silicon rod 100 (200) to rotate together, so as to realize the adjustment of the working surface or the working area of the silicon rod 100 (200), so that the adjusted work of the silicon rod 100 Surface or work area for processing operations. The rotation speed and rotation angle of the silicon rod 100 (200) can be controlled by a rotation driving device. In terms of specific implementation, the lifting drive device may be, for example, an air cylinder or a lifting motor, and the rotation drive device may be, for example, a rotating motor.

Furthermore, it can be seen from the above that, in some cases, the rotating bearing platform 431 or the pressing movable block can be controlled by a rotating drive device to rotate to drive the silicon rod 100 (200) to rotate to change the working surface or working area. Sometimes, when the silicon rod 100 (200) rotates to the required working surface or working area, it needs to stop and be positioned to accept the processing operation of the processing device in the corresponding functional zone. Therefore, in this application, the silicon rod positioning mechanism can also be equipped with a locking mechanism if necessary. In one implementation, a loading platform locking mechanism (not shown in the figure) can be arranged at the bottom of the central mounting frame and adjacent to the rotating bearing platform 431, and the loading platform locking mechanism can include a locking pin and Locking cylinder connected with locking pin. In practical applications, when the rotary bearing platform 431 needs to be locked, the locking cylinder in the bearing platform locking mechanism drives the locking pin to extend and act on the bottom or neck of the rotary bearing platform 431 to ensure that the rotary bearing platform 431 is stable Do not move; when the silicon rod needs to be rotated to change the working surface or working area, the locking cylinder in the loading platform locking mechanism drives the locking pin to contract, unlocking the rotating bearing platform 431, so that the rotating bearing platform 431 can Rotate.

The conveying body 41 is controlled by the drive of the conversion drive mechanism to rotate, and the silicon rod positioning mechanism 43 on the conveying body 41 and the silicon rod 100 (200) positioned by the silicon rod positioning mechanism 43 are realized by the rotation of the conveying body 41. Convert between different functional areas.

In some embodiments, the conversion driving mechanism further includes: a conversion toothed belt, which is arranged on the peripheral side of the conveying body 41; a driving motor and a linkage structure connected to the driving motor and driven by the driving motor; On the rod processing platform, the linkage structure includes a rotating gear meshed with the conversion toothed belt. In this way, the rotating gear drives the conveying body 41 to rotate under the drive of the drive motor to drive the silicon rod positioning mechanism 43 and the silicon rod 100 (200) on it to transfer to other functional areas to complete the transportation. The drive motor may be a servo Motor.

In some embodiments, the silicon rod conversion device 4 may further include a locking mechanism (not shown in the drawings) for locking the conveying body 41. For example, the locking mechanism may include a locking bolt and a locking cylinder connected to the locking bolt, wherein the number of locking bolts may be multiple, evenly distributed on the edge of the conveying body 41 (for example, the number of locking bolts It is four, evenly distributed at a 90° angle). In practical applications, when the silicon rod needs to be converted from one processing area to another processing area, the locking cylinder drives the locking pin to contract and unlock the disc shape Or a circular conveying body, so that the conveying body 41 can rotate; when the silicon rod is converted, that is, after the silicon rod is converted from a certain processing position to a target processing position, the locking cylinder in the locking mechanism drives the lock The stop pin extends and acts on the conveying body 41 to lock the conveying body 41.

As mentioned earlier, the silicon rods located in the waiting area can be pretreated. The silicon rod cutting and grinding integrated machine of the present application also includes a silicon rod transfer device 6, which is adjacent to the waiting area of the silicon rod processing platform, and is used to transfer the silicon rod 100 (200) to be processed to the silicon rod processing platform. The waiting area or the processed silicon rods in the waiting area are transferred out of the silicon rod processing platform.

Please refer to Figure 3, which is shown as a partial enlarged view of part B of Figure 1. As shown in FIG. 3, the silicon rod transfer device 6 further includes: a transfer base 61, a silicon rod platform 63, and a platform turning mechanism.

As mentioned above, the silicon rod transfer device is used to transfer the silicon rod 100 to be processed to the waiting area of the silicon rod processing platform or to transfer the processed silicon rod 200 in the waiting area out of the silicon rod processing platform, wherein , The cross section of the silicon rod 100 is circular, and the cross section of the silicon rod 200 is square.

In some embodiments, a first silicon rod transfer device dedicated to transferring round silicon rods 100 and a second silicon rod transfer device dedicated to transferring square silicon rods 200 are provided.

In some embodiments, a silicon rod transfer device that can be used in common with the round silicon rod 100 and the square silicon rod 200 is provided.

Now take one of the silicon rod transfer devices in FIG. 3 as an example.

The transfer base 61 is slidably arranged on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least two directions. For example, the sliding mechanism includes a support portion 621, a conversion portion 623, a first direction sliding unit provided between the support portion 621 and the conversion portion 623, and a second direction slide unit provided between the conversion portion 623 and the transfer base 61 A sliding unit, wherein the first-direction sliding unit may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction drive source, the second The direction sliding unit may include a second direction slide rail, a second direction slider or slide bar corresponding to the second direction slide rail, and a second direction drive source.

Wherein, the first slide rail, the first direction slide block or the slide bar, the second slide rail, the second direction slide block or the slide bar are arranged in a horizontal state, and the first direction drive source and the second direction drive Any of the sources may include: a sliding rack and a rotating gear (not shown in the figure) meshing with the sliding rack and a sliding drive motor. Taking the first direction sliding unit as an example, the first driving source can drive the conversion part 623 and the transfer base 61 thereon to slide along the first direction through the first direction slider or slide bar and the first direction slide rail. . Taking the second direction sliding unit as an example, the second driving source can drive the transfer base 61 to slide along the second direction through the second direction slider or slide bar and the second direction slide rail.

In some examples, the first direction may be, for example, the left-right direction (that is, the X-axis direction in FIGS. 2 and 3), and the second direction may be, for example, the front-rear direction (that is, the Y-axis direction in FIGS. 2 and 3). Axis direction).

The silicon rod platform 63 is movably arranged on the transfer base 61 and is used for laterally (ie, horizontally) positioning the silicon rod 100 (200). In this embodiment, the silicon ingot platform 63 is a plate-like structure or a frame structure, and at least one silicon ingot support bracket is provided at the front and rear ends of the silicon ingot platform 63 to support the silicon ingot 100 (200). The front and rear ends of the silicon rod 100 (200) can be arranged horizontally. At the same time, stop structures may also be provided on the left and right sides of the silicon rod platform to restrict the movement of the silicon rod 100 (200) in the left and right directions.

We know that in the subsequent processing operations, the silicon rod 100 needs to be converted from the horizontal state (horizontal placement) to the upright state (upright placement). Therefore, in this application, a silicon rod fastening mechanism can also be provided for Tighten the silicon rod during the silicon rod transfer process (not shown in the diagram). In some embodiments, the silicon rod fastening mechanism may include a fastening claw and a fastening motor or a fastening cylinder that controls the fastening claw. Further, the silicon rod fastening mechanism includes at least two pairs of fastening claws, at least two pairs of fastening claws are respectively corresponding to the aforementioned two silicon rod supporting brackets, that is, a pair of fastening claws are corresponding The two fastening claws of a pair of fastening claws are arranged oppositely on the left and right sides of the silicon rod supporting bracket. Each fastening claw is equipped with a fastening motor or fastening cylinder. In practical applications, when the silicon rod 100 (200) lies on the silicon rod platform, the fastening motor or the fastening cylinder drives the respective fastening claws toward the silicon rod 100 (200) on the silicon rod platform. In this way, Through the cooperation of at least two pairs of fastening claws, the overall fastening of the silicon rod 100 (200) is achieved. Preferably, a buffer member can be provided at the pressing position where the fastening claw contacts the silicon rod 100 (200) to avoid or reduce damage to the silicon rod 100 (200).

In order to convert the silicon rod 100 from the horizontal state (horizontal placement) to the upright state (upright placement), the silicon rod transfer device 6 further includes a platform turning mechanism. The platform turning mechanism is used to drive the silicon rod platform 63 to turn relative to the transfer base 61 so that the silicon rod 100 (200) is placed upright on the silicon rod conversion device 4. In this embodiment, the platform turning mechanism includes: a mounting frame, a moving frame, a turning cylinder or turning motor, a turning rack, and a turning gear. The mounting frame is fixed on the transfer base. In some embodiments, the mounting frame is a plate structure or a frame structure. The mobile frame is movably erected above the mounting frame. In some embodiments, the movable frame is a hollow plate structure or frame structure. Further, the left and right opposite sides of the movable rack adjacent to the silicon rod conversion device 4 are respectively provided with turning racks, and correspondingly, the left and right sides of the turning end adjacent to the silicon rod conversion device 4 in the silicon rod platform 63 are opposite to each other. Both sides are respectively provided with flip gears, and the flip gears are on and meshed with the corresponding flip racks. The turning cylinder or turning motor is used to drive the moving frame to move relative to the mounting frame. Taking the turning cylinder as an example, the turning cylinder as a whole is arranged in the hollow area of the movable frame. Specifically, the cylinder body (for example, including a cylinder tube and a piston) in the turning cylinder is provided on the mounting frame, The piston rod in the turning cylinder is connected to the moving frame. In practical applications, the silicon rod platform is turned from a horizontal state to an upright state: the cylinder is turned, the piston rod stretches and pushes the movable frame, so that the movable frame moves relative to the mounting frame under the push, and the flip rack on the movable frame also Following the movement of the movable frame, the flip gear on the silicon ingot platform meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon ingot platform to flip, and finally realizes the flipping of the silicon ingot platform from a horizontal state to an upright state. The silicon rod platform is turned from the upright state to the horizontal state: the turning cylinder acts, the piston rod shrinks and pulls the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the turning rack on the moving frame also moves with the moving frame. The flip gear on the silicon ingot platform meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon ingot platform to flip, and finally realizes the flip of the silicon ingot platform from an upright state to a horizontal state.

What needs to be added is: In addition, in order to make the movable frame move smoothly and steadily relative to the mounting frame, there are slide rails on the left and right sides of the mounting frame, while the left and right sides of the bottom of the movable frame are provided with slide rails Slider or slider. Of course, the above is only an exemplary description and is not intended to limit the present invention. For example, in other embodiments, the sliding rail can be modified on the movable frame and the slider or the sliding bar can be modified on the mounting frame. In addition, in order to avoid or reduce the impact damage of the silicon ingot platform to the moving frame, mounting frame or inverting cylinder or turning motor during the turning process (for example, when the silicon ingot platform is turned from an upright state to a horizontal state), it can be moved further Relatively convex buffers are provided on the rack or the mounting rack.

The silicon rod transfer device 6 may also include a lifting mechanism. The lifting mechanism is arranged on the silicon rod platform and is used for lifting and lowering the silicon rod 100 (200) after being turned over. In this embodiment, the lifting mechanism may include a sliding rail or a sliding rod and a lifting motor or a lifting cylinder. In order to realize the lifting movement of the silicon rod 100 (200), the silicon rod supporting bracket is passed through a sliding rail or a sliding rod. The rod is set on the silicon rod platform (the silicon rod fastening mechanism is installed and connected to the silicon rod supporting bracket), and the lifting motor or the lifting cylinder controls the silicon rod supporting bracket (together with the silicon rod fastening mechanism) to move up and down, thereby Drive the silicon rod 100 (200) to achieve lifting. Still taking the lifting cylinder as an example, the whole lifting cylinder is arranged in the middle of the silicon ingot platform. Specifically, the cylinder body (for example, including the cylinder and the piston) in the lifting cylinder is arranged on the silicon ingot platform, and the piston rod in the lifting cylinder It is connected to the silicon rod supporting bracket. In practical applications, the lifting cylinder is actuated, the piston rod stretches (extends or contracts) and pushes (pushes or pulls) the silicon rod bearing bracket, so that the silicon rod bearing bracket moves up and down relative to the mounting frame under the push and pull. The silicon rod 100 (200) on the supporting bracket also moves up and down following the silicon rod supporting bracket.

The aforementioned silicon rod transfer device 6 is only an exemplary description, but not limited to this, and the silicon rod transfer device can still be changed in other ways.

In some embodiments, the silicon rod transfer device may include: a reversing carrier, a silicon rod holder provided on the reversing carrier, and a reversing drive mechanism for driving the reversing carrier for reversing movement .

The reversing carrier is the main device used to set other types of components in the silicon rod transfer device. The other types of components may mainly include silicon rod clamps, but are not limited to this. Other components may also be mechanical structures, for example , Electrical control system and numerical control equipment, etc. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a supporting structure arranged between the base and the top frame. In addition, another important function of the reversing carrier is to support the reversing conversion of the silicon rod fixture through reversing movement. The reversing carrier can, for example, make a reversing movement by a reversing drive mechanism. By using the reversing drive mechanism, the reversing carrier can be driven to make a reversing movement so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfers it from the loading and unloading area to the corresponding waiting area, Or, clamp the processed silicon rod 200 corresponding to the waiting area and transfer it from the waiting area to the loading and unloading area.

In a specific implementation manner, the reversing drive mechanism for realizing the reversing movement of the reversing carrier may include a rotating shaft and a rotating motor, and the reversing carrier is connected to the mounting infrastructure under it through the rotating shaft. When the steering movement is implemented, the rotating motor is started, and the rotating shaft is driven to rotate to drive the reversing carrier to rotate to realize the reversing movement. The aforementioned driving rotation shaft rotation can be designed as a one-way rotation or a two-way rotation, the one-way rotation can be, for example, a one-way clockwise rotation or a one-way counterclockwise rotation, and the two-way rotation can be, for example, a clockwise rotation. And turn counterclockwise. In addition, the angle at which the drive rotation shaft rotates can be set according to the actual structure of the silicon rod transfer device. Furthermore, the base in the reversing carrier can adopt a circular disc structure, a rectangular disc or an elliptical disc, and its central position is connected to the rotating shaft, but the shape of the base is not limited to this. In other embodiments, the base can also adopt other shape.

A silicon rod clamp is arranged on the reversing carrier for clamping the corresponding silicon rod. For example, in some embodiments, a silicon rod holder is provided on a certain mounting surface of the reversing carrier, and the silicon rod holder may include at least two silicon rod holders, wherein at least two silicon rod holders Set for the interval. The silicon rod holder in the silicon rod holder can be used to hold round silicon rods (that is, silicon rods to be processed) and square silicon rods (that is, processed silicon rods). In this way, by driving the reversing carrier for reversing movement, the silicon rod fixture on the reversing carrier is switched between the loading and unloading area and the waiting area to transfer the silicon rods to be processed and between the waiting area and the loading and unloading area. Transfer the processed silicon rods. In practical applications, the rotation angle of the reversing vehicle for reversing movement is determined by the positional relationship between the loading and unloading area and the waiting area. In some embodiments, the loading and unloading area and the waiting area are arranged oppositely, and the silicon rod transfer device is located between the two. Therefore, the reversing carrier is driven by the reversing drive mechanism to rotate at an angle of 180°. In some embodiments, the loading and unloading area and the waiting area are arranged at an angle of 90 degrees, and the reversing carrier is driven by the reversing drive mechanism to rotate at an angle of 90 degrees. However, in any case, there are no specific restrictions on the positional relationship between the loading and unloading area and the waiting area. Their setting sequence and mutual setting angle can still be changed, as long as there is no unnecessary change between each station. In the case of interference, the direction and angle of rotation of the reversing vehicle will also be adjusted adaptively.

In some embodiments, both the silicon rods to be processed or the processed silicon rods are placed upright. Therefore, at least two silicon rod clamping members in the silicon rod clamp are arranged vertically and spaced apart. Any silicon rod clamping member may further include: a clamping arm mounting seat and two clamping arms, wherein the clamping arm mounting seat is arranged on the reversing carrier, and at least two clamping arms are movably arranged on the clamping arm mounting seat . The two clamping arms are arranged symmetrically, and the two clamping arms can form a clamping space for clamping a single wafer silicon rod or a silicon cube. In addition, the use of silicon rod holders can also have the function of centering adjustment. Under normal circumstances, when the clamping arms of the silicon rod holder are in the clamping state, the center of the clamping space formed by the two clamping arms coincides with the centers of the silicon rods to be processed and the processed silicon rods. Therefore, when the silicon rod holder is used to clamp the upright silicon rod to be processed or the processed silicon rod, the two clamping arms in the silicon rod holder shrink, and the clamping arm abuts against the processed silicon rod. Silicon rods or processed silicon rods. In the process of the clamping arm shrinking and clamping the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamping arms on both sides and faces the central area of the clamping space Move until the silicon rod to be processed or the processed silicon rod is clamped by the two clamping arms in the silicon rod holder. At this time, the center of the silicon rod to be processed or the processed silicon rod can be located on the silicon rod. The center of the clamping space of the rod holder.

In order to enable at least two clamping arms in the silicon rod clamping piece to smoothly and firmly clamp the silicon rods to be processed or processed silicon rods of different sizes and specifications, each of the clamping arms in the silicon rod clamping piece At least one is an adjustable design. Take two clamping arms as an example, at least one of the two clamping arms is movable design (one or two of the two clamping arms are movable design), so that the clamping distance between the two clamping arms can be adjusted .

In addition, the silicon rod holder in the silicon rod transfer device of the present application can have other changes. For example, the silicon rod transfer device may be equipped with two silicon rod clamps, and the two silicon rod clamps may be respectively arranged on two opposite mounting surfaces of the reversing carrier. Moreover, the two silicon rod holders can be the same or different. In an embodiment where the two silicon rod furniture are the same, the two silicon rod holders are used to clamp round silicon rods and square silicon rods. In an embodiment where the two silicon rod furniture are different, one of the two silicon rod clamps is used to clamp round silicon rods, and the other silicon rod clamp is used to clamp square silicon rods.

Furthermore, the silicon rod transfer device 6 in the present application can further provide movement in at least one direction. For example, the silicon rod transfer device may further include an advance and retreat mechanism in the front and rear direction, and the advance and retreat mechanism may include: an advance and retreat guide rail and an advance and retreat motor, wherein the advance and retreat guide rail is arranged in the front and rear direction, and the base of the reversing carrier can pass through the slider The pillow is on the forward and retreat guide rail, so when the position of the reversing carrier needs to be adjusted, the forward and retreat motor drives the reversing carrier to advance and retreat along the forward and retreat guide rail.

The integrated silicon rod cutting and grinding machine of the present application also includes a positioning detection device. In this embodiment, the positioning detection device (not shown in the figure) is used for edge detection and center positioning of the silicon rod 100 located in the waiting area.

The positioning detection device further includes: a ridge detection unit and an axis adjustment unit.

In some embodiments, the ridge line detection unit includes a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism, and the contact detection structure is used for The on-off signal is sent to the detection controller by contacting the ridgeline of the silicon rod, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller.

The number of the silicon rod positioning mechanisms 43 can be changed according to actual requirements and is not limited to this. For example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include a rotating bearing platform 431.

In some embodiments, the axis adjustment unit is used to position the axis of the silicon rod 100 in the center of the pretreatment zone, and includes a clamping mechanism for clamping the silicon The clamping space of the rod and the center of the clamping space coincide with the center of the pretreatment zone.

In a specific implementation manner, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

In view of the circular cross-section of the silicon rod, in some examples, the clamping piece is a circular workpiece holder as a whole, and the clamping arms constituting the clamping piece are two symmetrically designed, and a single clamping arm is designed as It has an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single clamping arm should exceed one-fourth of the arc of the silicon rod 100, so that the arc-shaped clamping of the clamping piece composed of two clamping arms The holding surface should exceed one half of the arc of the silicon rod 100. Of course, an additional buffer pad can be added to the curved clamping surface of the clamping arm to avoid damage to the surface of the silicon rod during the process of clamping the silicon rod, which has a good effect of protecting the silicon rod. Under normal circumstances, when the clamping arms in the clamping member are in the clamping state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when the clamping piece is used to clamp the silicon rod 100 placed upright in the area to be processed, the two clamping arms in the clamping piece shrink, and the arc-shaped clamping surface in the clamping arm abuts against the silicon rod. . In the process of the clamping arm shrinking and clamping the silicon rod 100, the silicon rod 100 is pushed by the two clamping arms on both sides and moves toward the central area of the clamping space until the silicon rod 100 is clamped by the clamping arm in the clamping piece At this time, the center of the silicon rod 100 can be located at the center of the clamping space of the clamping member.

After the silicon rod 100 to be processed is transferred to the waiting area of the silicon rod processing platform by the silicon rod transfer device 6 and preprocessed, the silicon rod conversion device 4 can convert the silicon rod from the waiting area to other processing locations.

The cutting device 2 is set on the machine base 1, and is used to perform the first bend cutting of the silicon rod 100 on the first processing position of the silicon rod processing platform and the silicon rod 100 on the second processing position of the silicon rod processing platform. The second folding surface is cut to form a square silicon rod. Wherein, any one of the first folded face cutting and the second folded face cutting in the embodiment of the present application refers to cutting two orthogonal side faces of the silicon rod, that is, the first One-folding cutting and second-folding cutting are to form two orthogonal sides on the silicon rod after the cutting is completed. For example, after the first folding cutting, the silicon rod forms two orthogonal sides, and then performing the second Two-fold cutting, the cross-section of the silicon rod forms a similar rectangle.

Please refer to FIG. 4, which shows a schematic structural diagram of an embodiment of the cutting device in the integrated silicon rod cutting and grinding machine of the present application. In the silicon rod cutting and grinding integrated machine shown in FIGS. 1, 2 and 4, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

The cutting frame 21 is arranged on the machine base 1. In this embodiment, the cutting frame 21 is a columnar structure or a frame structure, which serves as a support body of the cutting device 2 and can provide support for other components in the cutting device 2.

The cutting support 22 can be set on the cutting frame 21 so as to be lifted and lowered by a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22 by a lifting motor, a lifting rail, and a lifting slide, wherein the lifting rail is vertically arranged on the cutting frame 21 Above, the lifting slider is arranged on the back of the cutting support 22 and is matched with the lifting guide rail. In order to make the cutting support 22 achieve a stable lifting installation structure on the machine base 1, a double guide rail design can be adopted, that is, two Two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the cutting support 22 can be moved up and down relative to the cutting frame 21 and the base 1 by means of the lifting guide rail and the lifting slider.

In this embodiment, since the cutting support 22 can be configured with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Therefore, in this embodiment, on the one hand, the cutting frame 21 and the cutting support 22 in the cutting device 2 are arranged in a middle position between the first processing position and the second processing position. On the other hand, the cutting support 22 is specially designed. As shown in FIGS. 1 to 4, the cutting support 22 in this embodiment may include a support main body 221 and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221.

The first cutting unit 23 is arranged on the first side of the cutting support 22 and is used to perform the first bend cutting of the silicon rod 100 on the first processing position of the silicon rod processing platform.

In this embodiment, as described above, the cutting support 22 includes a support main body 221 and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221. Therefore, the first cutting unit 23 is installed at the first support side 223 of the cutting support 22. Specifically, the first cutting unit 23 includes a first wire frame 231 arranged on the side wing 223 of the first support, a plurality of first cutting wheels 233 arranged on the first wire frame 231, and a first cutting line 235. A cutting line 235 is sequentially wound around the plurality of first cutting wheels 233 to form two orthogonal first cutting line segments.

In practical applications, the first cutting unit 23 may include at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into two orthogonal first cutting wheel sets, that is, the Two first cutting wheels are arranged opposite to each other to form a first cutting wheel group. The two first cutting wheel groups along the N axis form a pair of first cutting wheel groups, where the M axis is orthogonal to the N axis. Specifically, the first cutting unit 23 includes two orthogonal first cutting wheel sets, wherein one first cutting wheel set includes two first cutting wheels 233 arranged front and rear (along the M axis), and the other first cutting wheel set The wheel set includes two first cutting wheels 233 arranged front and rear (along the N axis).

The first cutting line 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting line web. In practical applications, the first cutting line 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two first cutting line segments orthogonal to each other to form a first cutting line network. Specifically, the first cutting line 235 is wound around two first cutting wheels 233 arranged front and back (along the M axis) in a first cutting wheel set to form a first cutting line segment, and the first cutting line 235 is wound around another Two first cutting wheels 233 arranged front and back (along the N axis) in a first cutting wheel group form another second cutting line segment. In this way, the two orthogonal first cutting line segments cooperate to form a first cutting line network in the shape of "Γ".

Of course, the first cutting unit 23 is not limited to the embodiment shown in FIGS. 1 to 4, and other changes can still be made in other embodiments.

In addition, in this embodiment, the first cutting unit 23 may further include at least one of the following components: a wire wheel arranged on the first wire frame 231 and/or the first support side 223, used to realize the first cutting The guide of the wire 235; the tension wheel provided on the first wire frame 231 and/or the first support side 223 for adjusting the tension of the first cutting wire 235; and the wire storage drum provided on the machine base 1 (The wire storage barrel may further include a pay-off barrel and a wire take-up barrel) for storing and storing the first cutting line.

The second cutting unit 25 is arranged on the second side of the cutting support 22 and is used to perform a second bend cutting of the silicon rod 100 on the second processing position of the silicon rod processing platform.

In this embodiment, as mentioned above, the cutting support 22 includes a support main body 221 and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221. Therefore, the second cutting unit 25 is installed at the side wing 225 of the second support of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire frame 251 arranged on the side wing 225 of the second support, a plurality of second cutting wheels 253 arranged on the second wire frame 251, and a second cutting line 255. The wire 255 is sequentially wound around the plurality of second cutting wheels 253 to form two orthogonal second cutting line segments.

In practical applications, the second cutting unit 25 may include at least four second cutting wheels 253, and these four second cutting wheels 253 can be combined into two orthogonal second cutting wheel sets, that is, the Two second cutting wheels are arranged opposite to each other to form a second cutting wheel group. The two second cutting wheel groups along the N axis form a pair of second cutting wheel groups, where the M axis is orthogonal to the N axis. Specifically, the second cutting unit 25 includes two orthogonal second cutting wheel sets, wherein one second cutting wheel set includes two second cutting wheels 253 arranged front and rear (along the M axis), and the other second cutting wheel set The wheel set includes two second cutting wheels 253 arranged front and rear (along the N axis).

The second cutting line 255 is sequentially wound around each of the second cutting wheels 253 in the second cutting unit 25 to form a second cutting line web. In practical applications, the second cutting line 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two second cutting line segments orthogonal to each other to form a second cutting line network. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged front and rear (along the M axis) in a second cutting wheel group to form a second cutting line segment, and the second cutting line 255 is wound around another Two second cutting wheels 253 arranged front and rear (along the N axis) in a second cutting wheel group form another second cutting line segment. In this way, the two orthogonal second cutting line segments cooperate to form a second cutting line network in the shape of "Γ".

Of course, the second cutting unit 25 is not limited to the embodiments shown in FIGS. 1 to 4, and other changes can still be made in other embodiments.

In addition, in this embodiment, the second cutting unit 25 may further include at least one of the following components: a wire wheel arranged on the second wire frame 251 and/or the second support wing 225 for realizing the second cutting line 255 guide; set on the second wire frame 251 and/or the second support wing 225 on the tension wheel, used to adjust the tension of the second cutting line 255; and, set on the machine base 1 (the The wire storage barrel may further include a pay-off barrel and a wire take-up barrel) for storing and storing the second cutting line.

Furthermore, for the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25.

In some embodiments, the first cutting unit 23 and the second cutting unit 25 are two independent cutting units, the first cutting line 235 in the first cutting unit 23 and the second cutting line in the second cutting unit 25 255 can be two independent cutting lines.

In some embodiments, the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 may be the same cutting line. In this case, the common cutting line is sequentially wound around the plurality of first cutting wheels 233 in the first cutting unit 23 to form a first cutting line web, and then transferred to the second cutting unit next to it in order. The plurality of second cutting wheels 253 arranged in the second cutting unit 25 form a second cutting wire net. Therefore, in this embodiment, the cutting support 22 is also provided with one or more guide wheels located between the first cutting unit 23 and the second cutting unit 25 for the common cutting line to be wound around. Specifically, in the embodiment shown in FIG. 4, in the cutting support 22, the support body 221 located between the first cutting unit 23 and the second cutting unit 25 is provided with a winding for the common cutting line. Guide wheel 26. The first cutting unit 23 and the second cutting unit 25 share the same cutting line, which can simplify the structure of the cutting unit (for example, omit a set of pay-off and take-up reels), have good integrity, and simplify the winding process. Improve efficiency and better control the wire tension of the two cutting units.

When the cutting device 2 in the embodiment shown in FIG. 2 is used to cut the silicon rods on the first processing area and the second processing area of the silicon rod processing platform, the cutting support 22 is driven to descend relative to the cutting frame 21 , The first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the silicon rods on the corresponding first processing location and the silicon rods on the second processing location, where the first cutting The unit 23 performs the first bend cutting of the silicon rod in the first processing area (the first cutting unit 23 is provided with a first cutting wire net in the shape of "Γ"), and the second cutting unit 25 performs the first folding cutting on the second processing area The second fold-face cutting is performed on the silicon rods (the second cutting unit 25 is provided with a second cutting wire net in the shape of "Γ"). It can be seen that, in this embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22. By driving the common cutting support 22 to move up and down, the The first cutting unit 23 and the second cutting unit 25 respectively perform the first folding cutting of the silicon rod in the first processing area and the second folding cutting of the silicon rod in the second processing area at the same time. The cutting device 2 has a simple structure and convenient control as a whole, and can improve the efficiency and quality of silicon rod cutting.

It should be noted that, in this embodiment, the first cutting line 235 when the first cutting unit 23 performs the first bend cutting of the silicon rod 100 and the second cutting unit 25 performs the second bend cutting of the silicon rod 100 The intersection of the second cutting line 255 is located in the cross-section of the silicon rod 100 (including the case where the intersection is located on the circumference of the cross-section), so that the square silicon rod is formed with the largest possible cross-section (the surface area of the silicon wafer obtained after subsequent slicing is larger Large), and can reduce material loss in subsequent grinding (such as grinding and chamfering, etc.) and improve the utilization of silicon materials. Please refer to Figures 5 and 6, where Figure 5 shows the first cutting line when the first cutting unit performs the first bend cutting of the silicon rod and the first cutting line when the second cutting unit performs the second bend cutting of the silicon rod. The intersection of the two cutting lines is a schematic cross-sectional view inside the cross section of the silicon rod. Figure 6 shows the first cutting line and the second cutting unit performing the second folding of the silicon rod when the first cutting unit performs the first bend cutting of the silicon rod The cross-sectional schematic diagram where the intersection of the second cutting line during face cutting is located on the cross-sectional circumference of the silicon rod, where 101 shown in FIG. 5 and FIG. 6 is the edge formed by cutting the silicon rod.

Through the above-mentioned cutting device 2, the silicon rod 100 is subjected to the first cutting operation (the first cutting unit 23 performs the first folding cutting of the silicon rod 100) and the second cutting operation (the second cutting unit 25 performs the first cutting operation on the silicon rod 100). After the second folding and cutting), a square silicon rod (that is, a silicon rod having a rectangular shape) is formed.

In this embodiment, according to the foregoing knowledge, the silicon rod will form a side crust after square-cutting. In order not to hinder the rise of the wire cutting device, the side crust needs to be discharged in time. For the unloading of the side crust, the general side crust Most of the unloading methods are manually operated by the operator to separate the edge skin from the prescribed silicon rod and move it out of the silicon rod formulation equipment. This is not only inefficient, but also causes the edge skin to interact with the prescribed silicon during the handling process. The rod collision increases the risk of damage to the prescribed silicon rod. In view of this, the integrated silicon rod cutting and grinding machine of the present application also includes an edge skin unloading device, which is used to discharge the edge skin formed after the wire cutting device performs square cutting on the silicon rod. That is, in some embodiments, The first cutting unit further includes a first edge skin unloading device for unloading the edge skin formed after the first cutting unit performs the first folding and cutting of the silicon rod; the second cutting The unit also includes a second edge skin unloading device for unloading the edge skin formed after the second cutting unit performs the second folding and cutting of the silicon rod.

Since the first side skin unloading device and the second side skin unloading device have the same structure, here, only the first side skin unloading device is taken as an example for description.

Generally, the first side skin unloading device may include a side skin lifting mechanism for lifting the side skin so that the top end of the side skin protrudes from the cut silicon rod. The side skin lifting mechanism includes a jacking member arranged on the first wire frame in the first cutting unit, the jacking member can be driven by a telescopic member to make a telescopic movement, and the jacking member is controlled to extend After exercise, hold the bottom of the side skin to lift the side skin.

In some embodiments, the jacking member includes an abutment plate and a support plate, the abutment plate extends upward from the bottom of the support plate, and further, the abutment plate may be a The arc-shaped plate adapted to the arc-shaped surface of the side skin can fully contact with the arc-shaped surface of the side skin when the abutment plate abuts against the side skin, and the contact position of the abutment plate and the side skin is A sleek design or a cushioning pad should be added to the inner surface of the abutment plate that contacts the side skin. The supporting plate is used to support the bottom of the side skin, and further, the supporting plate can be an arcuate plate that matches the bottom surface of the side skin. In other embodiments, the chord side of the arcuate plate as the supporting plate can be additionally provided with bumps to increase the contact area with the bottom surface of the side skin.

In some embodiments, the telescopic component may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the supporting plate in the jacking member through a connecting structure, and the air cylinder may drive the telescopic rod. The rod drives the jacking piece to make a telescopic movement. Here, the telescopic movement of the jacking member includes the contraction movement of the jacking member and the extension movement of the jacking member, wherein the contraction movement of the jacking member specifically refers to the air cylinder driving the telescopic movement. The rod shrinks to drive the jacking member away from the side skin, and the stretching movement of the jacking member specifically refers to the air cylinder driving the telescopic rod to extend to drive the jacking member to approach the side skin. Of course, the aforementioned telescopic component can also be implemented in other ways. For example, the telescopic component can also be, for example, a servo motor with a lead screw, which is connected to the jacking member and is driven by the servo motor. The lead screw rotates to drive the connected jacking member to make a telescopic movement, for example, driving the lead screw to rotate in a forward direction to drive the jacking member to make a contraction movement and driving the lead screw to rotate in a reverse direction to drive the jacking member Or, drive the screw to rotate in the forward direction to drive the jacking member to extend and drive the lead screw to rotate in the reverse direction to drive the jacking member to perform contraction. Regarding the specific structure and implementation of the first side skin unloading device, refer to patent publications such as CN208148230U.

In practical applications, in the initial state, the telescopic rod drives the jacking member to be in a contracted state, and the first cutting unit is driven to descend with the cutting support so that the first cutting line segment in the first cutting unit is positioned at the first The silicon rod in the processing area is cut by the first folding surface until the first cutting line penetrates the silicon rod, and the first folding surface cutting of the silicon rod is completed and the edge skin is formed. At this time, the edge skin lifting mechanism has followed the first wire frame Down to the bottom, the air cylinder drives the telescopic rod to extend to drive the jacking member close to the side skin until the abutment plate in the jacking member contacts the side skin and achieves abutment. A cutting unit is driven to follow the cutting support to rise, and the side skin lifting mechanism follows the cutting support to rise, driving the side skin to rise relative to the silicon rod that has been cut once, so that the top of the side skin protrudes from the silicon rod. Compared with the protruding part of the silicon rod, when the top of the silicon rod meets the set conditions, the cutting support can be controlled to stop rising. In this way, the top of the edge skin can be used as a force point for grasping, so that the edge skin can be grasped and discharged. Then, the air cylinder drives the telescopic rod to contract to drive the jacking member back to the initial state while controlling the cutting support to drive the first cutting unit and the edge lifting mechanism to continue to rise above the silicon rod to prepare for the next cutting operation.

In other embodiments, the side skin lifting mechanism may include a suction member and a telescopic member that drives the suction member to expand and contract. The suction member is controlled by the telescopic member to abut the side skin and adsorb the side. skin. The suction member may further include an abutting plate and a suction element. The abutment plate may be, for example, an arc-shaped plate that fits with the arc-shaped surface of the edge skin, and when the abutment plate is against the edge skin, it can interact with the arc-shaped surface of the edge skin. Full contact. The suction element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the abutment plate to be in contact with the edge skin. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking a cylinder with a telescopic rod as an example, the telescopic rod can be connected to the jacking member through a connecting structure. Connected to the backing plate, the air cylinder can drive the telescopic rod to shrink to drive the abutment plate away from the side skin, and the air cylinder can drive the telescopic rod to extend to drive the abutment plate close to the side skin and After the abutment plate is in contact with the edge skin, the suction element adsorbs the edge skin. Subsequently, the cutting support is driven to rise, the side skin lifting mechanism and the first cutting unit follow the cutting support to rise, and the side skin lifting mechanism uses the adsorption force to drive the side skin to rise and shift relative to the silicon rod, so that the side The top of the skin protrudes from the silicon rod.

In addition, the edge skin unloading device may further include a clamping and transferring unit, which is arranged above the machine base, and is used to clamp the top end of the edge skin and pull the edge skin to release the silicon rod and to remove the edge. The skin is transferred to the side skin discharge area.

In some embodiments, the clamping and transferring unit may include a moving mechanism that provides movement in at least one direction and a side leather clamping mechanism, and the side leather clamping mechanism is connected to the moving mechanism and is driven in at least one direction. mobile.

The edge skin clamping mechanism may include a lifting drive structure and a clamping assembly arranged at the bottom of the lifting drive structure.

Wherein, the lifting drive structure is used to drive the clamping assembly for lifting movement, the lifting drive structure may be, for example, a lifting cylinder with a lifting rod, the lifting rod is connected to the clamping assembly, and the lifting cylinder can be used to control the The lifting rod telescopes to drive the clamping assembly to move up and down, but it is not limited to this. For example, the lifting drive structure may also be a screw assembly driven by a motor, the screw assembly is connected to the clamping assembly, and the motor drives the screw assembly to lift to drive the clamping assembly to move up and down.

The clamping assembly may include a cover body and a retractable clamping member, the retractable clamping member is provided inside the cover body, and a clamping place is formed between the clamping member and the cover body. The clamping space of the side skin. In an embodiment, the cover body is used to cover the edge skin, the coverable size of the cover body is slightly larger than the cross-sectional circle of the silicon rod to be cut, and the cover body is set as a closed or non-closed circular cover , But not limited to this.

The structure of the clamping assembly is not limited to this. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, between the clamping member and the arc-shaped plate A clamping space for clamping the edge skin is formed.

In the silicon rod cutting and grinding integrated machine shown in FIGS. 1 and 2, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, it is not limited to this. In other embodiments, the cutting device of the integrated silicon rod cutting and grinding machine of the present application can still be changed in other ways.

In some embodiments, the cutting device may include a first cutting device arranged in a first processing position of the silicon ingot processing platform and a second cutting device arranged in a second processing position of the silicon ingot processing platform , Wherein the first cutting device and the second cutting device are two independent devices.

The first cutting device includes: a first cutting frame, a first cutting support, and a first cutting unit.

The first cutting is installed on the machine base. The first cutting frame is a columnar structure or a frame structure, which serves as a support body of the first cutting device and can provide support for other components in the first cutting device.

The first cutting support is movably raised and lowered on the first cutting frame. In some embodiments, the first cutting support can be movably raised and lowered on the first cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the first cutting support by a lifting motor, a lifting rail, a lifting slider, etc., wherein the lifting rail is vertically arranged on the first cutting frame, and the lifting The sliding block is arranged on the back of the first cutting support and is matched with the lifting guide rail. In order to make the first cutting support to achieve a stable lifting installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are used. The two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the first cutting support can be moved up and down relative to the first cutting frame and the machine base by means of the lifting rail and the lifting sliding block.

The first cutting unit may include at least four first cutting wheels, and the four first cutting wheels can be combined into two orthogonal first cutting wheel sets, that is, two first cutting wheels are arranged oppositely along the M axis A first cutting wheel group is formed, and a pair of first cutting wheel groups are formed by two first cutting wheel groups along the N axis, wherein the M axis is orthogonal to the N axis. Specifically, the first cutting unit includes two orthogonal first cutting wheel sets, wherein one first cutting wheel set includes two first cutting wheels arranged front and back (along the M axis), and the other first cutting wheel set It includes two first cutting wheels arranged front and rear (along the N axis).

The first cutting line is sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting line web. In practical applications, the first cutting line is sequentially wound around the four first cutting wheels in the first cutting unit to form two first cutting line segments orthogonal to each other to form a first cutting line net. Specifically, the first cutting line is wound around two first cutting wheels (along the M axis) arranged in a first cutting wheel group to form a first cutting line segment, and the first cutting line is wound around another first cutting wheel. The two first cutting wheels arranged front and rear (along the N axis) in the cutting wheel group form another second cutting line segment. In this way, the two orthogonal first cutting line segments cooperate to form a first cutting line network in the shape of "Γ".

Of course, in some embodiments, the position, direction, and number of the first cutting wheel and the first cutting line segment in the first cutting unit can also be changed in other ways.

The second cutting device includes: a second cutting frame, a second cutting support, and a second cutting unit.

The second cutting is erected on the machine base. The second cutting frame is a columnar structure or a frame structure, which serves as a support body of the second cutting device and can provide support for other components in the second cutting device.

The second cutting support is movably raised and lowered on the second cutting frame. In some embodiments, the second cutting support can be movably raised and lowered on the second cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the second cutting support by a lifting motor, a lifting rail, a lifting slider, etc., wherein the lifting rail is vertically arranged on the second cutting frame, and the lifting The sliding block is arranged on the back of the second cutting support and is matched with the lifting guide rail. In order to make the second cutting support a stable lifting installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are used. The two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the second cutting support can be moved up and down relative to the first cutting frame and the machine base by means of the lifting rail and the lifting sliding block.

The second cutting unit may include at least four second cutting wheels, and these four second cutting wheels can be combined into two orthogonal second cutting wheel sets, that is, two second cutting wheels are arranged oppositely along the M axis A second cutting wheel group is formed, and a pair of second cutting wheel groups are formed by two second cutting wheel groups along the N axis, where the M axis is orthogonal to the N axis. Specifically, the second cutting unit includes two orthogonal second cutting wheel sets, where one first cutting wheel set includes two second cutting wheels arranged front and back (along the M axis), and the other first cutting wheel set Including two second cutting wheels arranged front and rear (along the N axis).

The second cutting line is sequentially wound around each second cutting wheel in the second cutting unit to form a second cutting line web. In practical applications, the second cutting line is sequentially wound around the four second cutting wheels in the second cutting unit to form two second cutting line segments orthogonal to each other to form a second cutting line network. Specifically, the second cutting line is wound around two second cutting wheels 253 arranged front and back (along the M axis) in a second cutting wheel group to form a second cutting line segment, and the second cutting line is wound around the other first cutting wheel. Two second cutting wheels arranged in the front and rear (along the N axis) in the two cutting wheel groups form another second cutting line segment. In this way, the two orthogonal second cutting line segments cooperate to form a second cutting line network in the shape of "Γ".

Of course, in some embodiments, the position, direction, and number of the second cutting wheel and the second cutting line segment in the second cutting unit can also be changed in other ways.

The grinding device 3 is arranged on the machine base 1 and is used for grinding the square silicon rods on the third processing area of the silicon rod processing platform that have been square-cut. In this embodiment, the grinding operation includes surface grinding and chamfering.

The grinding device 3 has an accommodating space for receiving the silicon rods that have been converted from the second processing area to the third processing area by the silicon rod conversion device 4. The grinding device 3 mainly includes a grinding frame 31 and at least a pair of abrasive tools 33. The at least one pair of abrasive tools 33 are oppositely arranged on the grinding frame 31 and used for squaring the silicon that is located at the third processing zone. The rod performs grinding operations.

In this embodiment, the cross-section of the silicon rod that has been square-cut is square (the silicon rod is a rectangular-like body as a whole), and has four vertical cut surfaces and four connecting edge surfaces. Therefore, the grinding tools 33 are at least oppositely arranged. One pair, there is an accommodating space for accommodating silicon rods 200 between the two. After the silicon rods 200 are converted to the third processing position and located in the accommodating space between the at least one pile of abrasive tools 33, the at least one pair The abrasive tool 33 can contact a pair of opposite vertical cut surfaces or a pair of connecting edge surfaces in the silicon rod 200, and then move up and down to grind.

Wherein, the grinding frame 31 can be slidably installed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least one direction. For example, the sliding mechanism can realize the sliding movement of the grinding frame 31 in the first direction (as shown in FIG. 2 along the X-axis direction). Specifically, the sliding mechanism may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction drive source. The first direction driving source may be, for example, a driving motor.

The grinding tool 33 can be slidably arranged on the grinding frame 31 through a sliding mechanism.

In some embodiments, at least a pair of abrasive tools 33 in the grinding device 3 are independently arranged. Taking a pair of abrasive tools 33 as an example, the two abrasive tools 33 are slidably disposed on the grinding frame 31 through respective sliding mechanisms, wherein the sliding mechanisms can realize sliding in at least two directions. Specifically, the sliding mechanism may include a first-direction sliding unit and a second sliding unit, wherein the first-direction sliding unit is a lifting and sliding unit, and includes a lifting guide rail provided on the grinding frame 31, A lifting slide or sliding bar and a lifting drive source are arranged on a movable mounting frame. The lifting driving source may be, for example, a driving motor. The second direction sliding unit includes a second direction guide rail (the second direction is the Y-axis direction as shown in FIG. 2) provided on the movable mounting frame, and a second direction provided on the abrasive tool 33 Slider or slider, and second direction drive source. The second direction driving source may be, for example, a driving motor.

In some embodiments, at least a pair of abrasive tools 33 in the grinding device 3 are arranged in combination. Taking a pair of abrasive tools 33 as an example, the two abrasive tools 33 are slidably arranged on the grinding frame 31 through a sliding mechanism, wherein the sliding mechanism can realize sliding movement in at least two directions. Specifically, the sliding mechanism may include a first-direction sliding unit and a second sliding unit, wherein the first-direction sliding unit is a lifting and sliding unit, and includes a lifting guide rail provided on the grinding frame 31, A lifting slide or sliding bar and a lifting drive source are arranged on a common movable mounting frame. The lifting driving source may be, for example, a driving motor. The two abrasive tools 33 are slidably mounted on the common movable mounting frame through a second direction sliding unit, and the second direction sliding unit includes a second direction guide rail (so The second direction is the Y-axis direction as shown in FIG. 2), the second-direction slider or slider provided on the abrasive tool 33, and the second-direction drive source. The second direction driving source may be, for example, a driving motor.

In this embodiment, the grinding frame 31 can be slidably installed on the machine base 1 through a sliding mechanism to realize the advance and retreat of the grinding frame 31, that is, close to the silicon rod or far away from the silicon rod. The abrasive tool 33 can be slid on the grinding frame 31 through a first direction sliding mechanism to realize the lifting of the abrasive tool 33, and the abrasive tool 33 can also be slidably mounted on the grinding frame 31 through a second direction sliding mechanism to realize the abrasive tool 33 The advance and retreat, that is, close to the silicon rod or far away from the silicon rod, control the grinding amount of the silicon rod.

In some embodiments, the abrasive tool may include a spindle and at least one grinding wheel, wherein at least one grinding wheel is disposed at the working end of the spindle.

In particular, as shown in FIG. 2, in this embodiment, each grinding tool 33 in the grinding device 3 has a double-head structure. Specifically, each grinding tool includes: a rotating chassis; a double-headed spindle 332 arranged on the rotating chassis, the first end of the double-headed spindle 332 is provided with a rough grinding wheel 331, and the second end of the double-headed spindle 332 is provided with Fine grinding wheel 333; a driving motor for driving the rotating chassis to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed spindle 332 can be exchanged. In practical applications, during grinding, the rough grinding wheel 331 of the double-headed spindle 332 in the at least one pair of grinding tools 33 in the grinding device 3 is used to rough grinding the silicon rod 200 that has been square-cut, and then drive to rotate The type chassis is rotated so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed spindle 332 can be exchanged. The square is completed by using at least one pair of grinding tools 33 in the grinding device 3 The cut silicon rod 200 is subjected to a fine grinding operation. Wherein, the rough grinding operation may include rough grinding the vertical cut surface of the silicon rod 200 that has been square-cut and rough chamfering the connecting edge surface, and the fine grinding operation may include rough-cutting the silicon rod 200 that has been square-cut. The vertical cut surface of the rod 200 is finely ground and the connecting edge surface is finely chamfered.

Take the rough grinding of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: first use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 The silicon rod 200 is positioned and adjusted to make the grinding frame 31 move in the first direction (that is, along the X-axis direction) toward the silicon rod 200 relative to the base 1, so that the silicon rod 200 is located between the two grinding tools 33 of the pair of grinding tools 33 That is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the grinding device 3; the abrasive tool 33 relative to the grinding frame 31 along the second direction (ie along the Y axis) ) Feed, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to coarsely grind the first pair of vertical sections in the silicon rod 200; driven by the rotating bearing table 431 in the silicon rod positioning mechanism 43 The silicon rod 200 is rotated 90° in the forward (or reverse) direction, so that the second pair of vertical sections in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3. The rough grinding wheel 331 in the grinding tool 33 is rotated and the grinding wheel 331 is driven. The tool 33 moves up and down to coarsely grind the second pair of vertical cut surfaces in the silicon rod 200.

The rough grinding operation of any pair of vertical cut surfaces may include, for example, providing a feed rate and driving the rough grinding wheels 331 in the pair of grinding tools 33 to move from top to bottom to grind a pair of vertical cut surfaces of the silicon rod; After grinding the rough grinding wheel 331 to the bottom of the silicon rod and passing through the silicon rod, it stays at the lower limit, and then increases the feed rate to drive a pair of rough grinding wheels 331 to move from bottom to top to grind the silicon rod; a pair of rough grinding After the wheel 331 grinds to the top of the silicon rod and passes through the silicon rod, it stays at the upper limit and continues to increase the feed amount, driving a pair of rough grinding wheels 331 to move from top to bottom to grind the silicon rod; in this way, grinding, increase the feed Reverse grinding, increase the feed rate, and after repeated several times, a pair of vertical cut surfaces of the silicon rod can be ground to the preset size.

Take the rough chamfering of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: initially, when the silicon rod conversion device 4 transfers the silicon rod 200 to the first processing location, the vertical cut surface of the silicon rod 200 corresponds to For the pair of abrasive tools 33 in the grinding device 3, therefore, the positioning and adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may include, for example, driving the silicon rod 200 to rotate forward (or reverse) by 45°, so that the silicon rod 200 The first pair of connecting edge surfaces corresponds to a pair of abrasive tools 33 in the grinding device 3; the grinding frame 31 is moved toward the silicon rod 200 relative to the base 1 in the first direction (that is, along the X-axis direction), so that the silicon rod 200 Located between the two abrasive tools 33 of the pair of abrasive tools 33, that is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the polishing device 3; The amount of feed is fed along the second direction (that is, along the Y-axis direction). The rough grinding wheel 331 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform the first pair of connecting edge surfaces in the silicon rod 200. Sub-rough cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 5°, the coarse grinding wheel 331 in the grinding tool 33 is rotated and the grinding tool 33 is driven up and down to align the first pair of connecting edge faces in the silicon rod 200 Carry out the second rough cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate 80° in the forward direction, so that the second pair of connecting edges in the silicon rod 200 corresponds to the pair of abrasive tools 33 in the grinding device 3, and rotates The rough grinding wheel 331 in the grinding tool 33 drives the grinding tool 33 to move up and down to perform the first rough cutting of the second pair of connecting edge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forward 5 °, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform a second rough cutting on the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 Rotate the rough grinding wheel 331 in the grinding tool 33 by 5°, and drive the grinding tool 33 to move up and down to perform the third rough cutting on the second pair of connecting ridges in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon The rod 200 rotates 80° in the forward direction, rotates the rough grinding wheel 331 in the abrasive tool 33 and drives the abrasive tool 33 to move up and down to perform a third rough cut on the first pair of connecting edge faces in the silicon rod 200.

It should be noted that in the rough chamfering operation of the connecting edge surface, the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate by a corresponding angle, for example: the first silicon rod positioning mechanism 53 drives the first silicon rod 101 Forward rotation of 5° is not the only way to achieve it. In other optional embodiments, the adjustment angle can be adapted, for example, 3° to 7°, including 3°, 4°, 5°, 6°, 7° or For other angles, correspondingly, when the first silicon rod 101 is driven by the first silicon rod positioning mechanism 53 to rotate 80° in the forward direction, the angle is adjusted adaptively.

Take the fine grinding of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: first use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 The silicon rod 200 is positioned and adjusted to make the grinding frame 31 move in the first direction (that is, along the X-axis direction) toward the silicon rod 200 relative to the base 1, so that the silicon rod 200 is located between the two grinding tools 33 of the pair of grinding tools 33 That is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the grinding device 3; the abrasive tool 33 relative to the grinding frame 31 along the second direction (ie along the Y axis) ) Feed, rotate the fine grinding wheel 333 in the abrasive tool 33 and drive the abrasive tool 33 to move up and down to finely grind the first pair of vertical sections in the silicon rod 200; driven by the rotating bearing table 431 in the silicon rod positioning mechanism 43 The silicon rod 200 is rotated 90° in the forward (or reverse) direction, so that the second pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3. The fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding wheel 333 is driven. The tool 33 moves up and down to fine grind the second pair of vertical sections in the silicon rod 200.

Wherein, the finishing operation of any pair of vertical cut surfaces may include, for example, providing a feed rate and driving the fine grinding wheel 333 in a pair of abrasive tools 33 to move from top to bottom to grind a pair of vertical cut surfaces of the silicon rod; After grinding the fine grinding wheel 333 to the bottom of the silicon rod and passing through the silicon rod, it stays at the lower limit, and then increases the feed rate to drive a pair of fine grinding wheels 333 to move from bottom to top to grind the silicon rod; a pair of fine grinding wheels After the wheel 333 grinds to the top of the silicon rod and passes through the silicon rod, it stays at the upper limit and continues to increase the feed amount, driving a pair of fine grinding wheels 333 to move from top to bottom to grind the silicon rod; thus, grinding, increase the feed Reverse grinding, increase the feed rate, and after repeated several times, a pair of vertical cut surfaces of the silicon rod can be ground to the preset size.

Take the fine chamfering of the vertical cut surface of the silicon rod 200 that has been squared as an example: initially, when the silicon rod conversion device 4 transfers the silicon rod 200 to the first processing area, the vertical cut surface of the silicon rod 200 corresponds to For the pair of abrasive tools 33 in the grinding device 3, therefore, the positioning and adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may include, for example, driving the silicon rod 200 to rotate forward (or reverse) by 45°, so that the silicon rod 200 The first pair of connecting edge surfaces corresponds to a pair of abrasive tools 33 in the grinding device 3; the grinding frame 31 is moved toward the silicon rod 200 relative to the base 1 in the first direction (that is, along the X-axis direction), so that the silicon rod 200 Located between the two abrasive tools 33 of the pair of abrasive tools 33, that is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the polishing device 3; The amount of feed is fed along the second direction (that is, along the Y-axis direction). The fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform the first pair of connecting edge surfaces in the silicon rod 200. Second precision cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 5°, the fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to align the first pair of connecting edges in the silicon rod 200 Carry out the second fine cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate 80° in the forward direction, so that the second pair of connecting edges in the silicon rod 200 corresponds to the pair of abrasive tools 33 in the grinding device 3, and rotates The fine grinding wheel 333 in the grinding tool 33 drives the grinding tool 33 to move up and down to perform the first fine cutting of the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forward 5 °, rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform the second fine cutting of the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 Rotate 5° to rotate the fine grinding wheel 333 in the abrasive tool 33 and drive the abrasive tool 33 to move up and down to perform the third fine-cutting on the second pair of connecting edge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon The rod 200 rotates 80° in the forward direction, rotates the fine grinding wheel 333 in the abrasive tool 33 and drives the abrasive tool 33 to move up and down to perform the third fine cutting on the first pair of connecting edge faces in the silicon rod 200.

It should be noted that the foregoing is only an exemplary description, and is not intended to limit the scope of protection of the present application. For example, in the description of the grinding operation as a grinding device, the surface grinding operation of the silicon rod is performed first and then the polycrystalline silicon rod is reversed. The corner operation is not limited to this. In other embodiments, it is also feasible to perform the chamfering operation of the silicon rod first and then the surface grinding operation of the silicon rod, which should still fall within the protection scope of this application.

Subsequently, after the silicon rod 200 is polished by the polishing device 3, the silicon rod conversion device 4 converts the silicon rod 200 from the third processing position to the waiting position, and the silicon rod loading and unloading device removes the processed silicon rod from the silicon rod. The waiting area of the rod processing platform is unloaded. Of course, before unloading the silicon rod 200, if necessary, in the waiting area, the silicon rod 200 after the processing operation can be inspected by the inspection device, for example, a flatness detector is used to inspect the flatness of the silicon rod. Using the flatness tester, on the one hand, the flatness of the silicon rod 200 can be inspected to check whether the silicon rod meets the product requirements after each processing operation, so as to determine the effect of each processing operation; The plane flatness detection of 200 can also indirectly obtain the wear status of the processed parts in each processing device, so as to facilitate real-time calibration or correction, and even repair or replacement.

Furthermore, in the integrated cutting and grinding machine of the present application, in an optional embodiment, a silicon rod cleaning device may also be included. The silicon rod cleaning device can be arranged on the machine base for cleaning and cleaning silicon rods. Regarding the silicon rod cleaning device, generally, after the silicon rod undergoes the above processing operations, the cutting debris generated during the operation will adhere to the surface of the silicon rod. Therefore, when necessary, the silicon rod needs to be cleaned as necessary. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning fluid spraying device matched with the cleaning brush head. During cleaning, the cleaning fluid spraying device sprays the cleaning fluid against the silicon rod, and at the same time, The motor-driven cleaning brush head acts on the silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid may be pure water, for example, and the cleaning brush head may be, for example, a rotary brush head.

In addition, the cutting-grinding integrated machine of this application, in particular, needs to be pointed out that if the cutting-grinding integrated machine adds or reduces the corresponding processing equipment, then the functional area on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body The number and their positional relationship need to be adjusted accordingly.

In some embodiments, it is assumed that the silicon rod multi-station processing machine eliminates the waiting area, and the silicon rod conversion device also reduces a silicon rod positioning mechanism correspondingly. Further, preferably, the angles set between the three silicon rod positioning mechanisms are also consistent with the angle distribution between the three functional regions. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional location, the other two silicon rod positioning mechanisms also correspond to the other two functional locations respectively. In this way, in the pipeline operation, at any time, when each silicon rod positioning mechanism can position a silicon rod and the silicon rod positioning mechanism corresponds to a functional location, these silicon rods are located in a corresponding functional location. Corresponding processing operations are being carried out. In an optional embodiment, the three functional areas on the silicon rod processing platform are distributed at 120° between each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the conveying body are two by two. The space is also distributed at 120°.

In addition, the cutting-grinding integrated machine of this application, in particular, needs to be pointed out that if the cutting-grinding integrated machine is equipped with a corresponding processing operation device, then the functional area on the silicon rod processing platform and the number of silicon rod positioning mechanisms on the conveying body The positional relationship needs to be adjusted accordingly. Assuming that a processing device is added to the silicon ingot multi-station processing machine, a functional area will be added to the silicon ingot processing platform and a silicon ingot positioning mechanism is also added to the silicon ingot conversion device. Further, preferably, the angles set between the five silicon rod positioning mechanisms are also consistent with the angle distribution between the five functional regions. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional location, the other four silicon rod positioning mechanisms also correspond to the other four functional locations respectively. In this way, in the pipeline operation, at any time, when each silicon rod positioning mechanism is positioned with a silicon rod and the silicon rod positioning mechanism corresponds to a functional location, these silicon rods are located in a corresponding functional location. Corresponding processing operations are being carried out. In an alternative embodiment, the five functional areas on the silicon rod processing platform are distributed at 72° in pairs. Therefore, correspondingly, the four silicon rod positioning mechanisms on the conveying body are two by two. The space is also distributed at 72°.

The silicon rod cutting and grinding integrated machine disclosed in this application integrates a cutting device and a grinding device. The silicon rod conversion device can be used to transfer the silicon rods between the various processing devices in an orderly and seamless manner. The rod is square-cut to form a square silicon rod, and the square silicon rod after square-cutting is ground by a grinding device, thereby completing the multi-process integrated operation of silicon rod square-cutting and grinding, improving production efficiency and product processing The quality of the job.

The application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine.

In some embodiments, as shown in FIG. 2, the integrated silicon rod cutting and grinding machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area, a first processing area, and a second processing area. Location, and a third processing location, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device, the waiting location, the first processing location, the second processing location, and the second processing location of the silicon rod processing platform The three processing areas are distributed at 90° between each other. In this embodiment, it is assumed that the direction according to the sequence of the waiting location, the first processing location, the second processing location, and the third processing location is defined as a positive direction.

The silicon rod cutting and grinding method of this application may at least include the following steps:

Step S101, loading the first silicon rod in the waiting area, and preprocessing the first silicon rod. In this embodiment, in step S101, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the waiting area of the silicon rod processing platform.

For details, please refer to FIGS. 7 and 8, the silicon rod transfer device 6 may be used to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform. For the specific method of transferring the first silicon rod 100 to be processed to the waiting area of the silicon rod platform by the silicon rod transfer device 6, please refer to the foregoing description, which will not be repeated here.

In addition, the pre-processing may include using a positioning detection device to perform edge line detection and center positioning of the first silicon rod located at the waiting area.

In step S103, the silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the waiting area to the first processing area, and the cutting device is caused to perform the first folding cutting of the first silicon rod in the first processing area At this stage, the second silicon rod is loaded in the waiting area and the second silicon rod is pretreated.

In step S103, since the waiting area is 90° with respect to the first processing area, the first predetermined angle for rotating the silicon rod conversion device is to make the silicon rod conversion device rotate 90° forward. .

For details, please refer to FIGS. 8 and 9 to make the silicon rod conversion device 4 rotate 90° in the forward direction (that is, the clockwise arrow in FIG. 8) to convert the first silicon rod 100 to be processed from the waiting position in FIG. 8 to FIG. 9 The first processing location in.

In this way, the cutting device 2 in the embodiment shown in FIG. 9 can be used to cut the first silicon rod 100 at the first processing location.

When the cutting device 2 in the embodiment shown in FIG. 9 is used to cut the first silicon rod 100 in the first processing position, in conjunction with FIG. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and one of the cutting supports 22 The first cutting unit 23 on the side performs the first bend cutting of the first silicon rod 100 at the first processing location (the first cutting unit 23 is provided with a first cutting wire net in the shape of "Γ").

As for loading the second silicon rod 102 in the waiting area and preprocessing the second silicon rod 102, please refer to the description of the first silicon rod 100 in step S101, which will not be repeated here.

Step S105, the silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod from the waiting position to the first processing position, so that the cutting device Perform the second bend cutting of the first silicon rod on the second processing area and perform the first bend cut of the second silicon rod on the first processing area. At this stage, load the third silicon rod in the waiting area. The third silicon rod is pretreated by the location.

In step S105, since the waiting area, the first processing area, and the second processing area of the silicon rod processing platform are sequentially different by 90°, the first predetermined angle for rotating the silicon rod conversion device is The silicon rod conversion device rotates 90° in the forward direction.

For details, please refer to FIGS. 9 and 10, the silicon rod conversion device 4 is rotated 90° in the forward direction (ie, the clockwise arrow in FIG. 9), and the first silicon rod 100 is converted from the first processing position to the second processing position and the second processing position is changed. The two silicon rods 102 are converted from the waiting position to the first processing position.

In this way, the cutting device 2 in the embodiment shown in FIG. 10 can be used to cut the first silicon rod 100 on the second processing location of the silicon rod processing platform and the second silicon rod 102 on the first processing location.

When the cutting device 2 in the embodiment shown in FIG. 10 is used to cut the second silicon rod 102 at the first processing area of the silicon rod processing platform and the second silicon rod 100 at the first processing area, in conjunction with FIG. 1, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the second silicon rod 102 and the second processing on the corresponding first processing location. The first silicon rod 100 at the location is cut, wherein the first cutting unit 23 performs the first folding cutting of the second silicon rod 102 at the first processing location (the first cutting unit 23 is provided with a "Γ" shape The second cutting unit 25 performs the second folding cutting of the first silicon rod 100 in the second processing position (the second cutting unit 25 is provided with a second cutting line in the shape of "Γ" network). Among them, it should be noted that before the second cutting unit 25 is used to perform the second folding cutting of the first silicon rod 100 at the second processing position, due to the aforementioned folding cutting problem, the silicon rod conversion device 6 is also required. The silicon rod positioning mechanism in the middle drives the first silicon rod to rotate 180° in the forward or reverse direction to adjust the cutting surface. In this way, the first silicon rod 100 located in the second processing area is cut by the second cutting unit 25 to form a square silicon rod as a whole.

As for loading the third silicon rod 104 in the waiting area to preprocess the third silicon rod 104, please refer to the description of the first silicon rod 100 in step S101, which will not be repeated here.

Step S107, the silicon rod conversion device is made to rotate the first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, to convert the second silicon rod from the first processing position to the second processing position, and to change The third silicon rod is switched from the waiting area to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to grind and chamfer the first silicon rod in the third processing area. The second silicon rod in the first processing area is subjected to the second folding cutting and the first folding cutting is performed on the third silicon rod in the first processing area. At the same time, the fourth silicon rod is loaded in the waiting area to pre-process the fourth silicon rod deal with.

In step S107, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are sequentially different from each other by 90°, the first preset that causes the silicon rod conversion device to rotate Set the angle to make the silicon rod conversion device rotate 90° in the forward direction

For details, please refer to FIGS. 10 to 12, the silicon rod conversion device 4 is rotated 90° in the forward direction (that is, the clockwise arrow in FIG. 10), the first silicon rod 100 is converted from the second processing position to the third processing position, and the The two silicon rods 102 are converted from the first processing location to the second processing location, and the third silicon rods 104 are converted from the waiting location to the first processing location. In particular, Fig. 11 shows the intermediate process of Fig. 10 and Fig. 12, that is, shows that the silicon rod conversion device in the silicon rod cutting and grinding integrated machine in Fig. 10 is rotated in the forward direction (that is, the clockwise arrow in Fig. 10) by 45° Schematic diagram of the state.

In this way, the grinding device 3 in the embodiment shown in FIG. 12 can be used to perform grinding operations on the first silicon rod 100 on the third processing position of the silicon rod processing platform. For the specific manner of using the grinding device 3 to perform the grinding operation on the first silicon rod 100 on the third processing position of the silicon rod processing platform, please refer to the foregoing description, and will not be repeated here.

At the same time, the cutting device 2 in the embodiment shown in FIG. 12 can be used to cut the third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location of the silicon rod processing platform.

When the cutting device 2 in the embodiment shown in FIG. 12 is used to cut the third silicon rod 104 on the first processing area and the second silicon rod 102 on the second processing area of the silicon rod processing platform, in conjunction with FIG. 1, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the third silicon rod 104 and the second processing position on the corresponding first processing area. The second silicon rod 102 at the location is cut, wherein the first cutting unit 23 performs the first folding cutting of the third silicon rod 104 at the first processing location (the first cutting unit 23 is provided with a "Γ" shape The second cutting unit 25 performs the second folding cutting of the second silicon rod 102 at the second processing position (the second cutting unit 25 is provided with a second cutting line in the shape of "Γ" network). Among them, it should be noted that before using the second cutting unit 25 to perform the second bend cutting of the second silicon rod 102 at the second processing position, due to the aforementioned bevel cutting problem, the silicon rod conversion device 6 is also required. The silicon rod positioning mechanism 43 in the middle drives the second silicon rod 102 to rotate 180° in the forward or reverse direction to adjust the cutting surface. In this way, the second silicon rod 102 located in the second processing area is cut by the second folding unit 25 to form a square silicon rod as a whole.

As for the pretreatment of the fourth silicon rod 106 by loading the fourth silicon rod 106 in the waiting area, please refer to the description of the first silicon rod 100 in step S101, which will not be repeated here.

Step S109, the silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the waiting position, the second silicon rod from the second processing position to the third processing position, and the third The silicon rod is converted from the first processing area to the second processing area, the fourth silicon rod is converted from the waiting area to the first processing area, the first silicon rod is unloaded from the waiting area and the fifth silicon rod is loaded. The silicon rod is pretreated. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to perform the second operation on the third silicon rod in the second processing area. Folding cutting and first folding cutting of the fourth silicon rod in the first processing area.

In step S109, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are sequentially different from each other by 90°, the first preset that causes the silicon rod conversion device to rotate The angle is to make the silicon rod conversion device rotate 90° in the forward direction or 270° in the reverse direction. Among them, making the silicon rod conversion device rotate 270° in the reverse direction can make the silicon rod conversion device return to the initial position and release the cable entangled during the forward rotation.

For details, please refer to FIGS. 12 and 13 to make the silicon rod conversion device 4 rotate 270° in the reverse direction (ie, the counterclockwise arrow in FIG. 10), to convert the first silicon rod 100 from the third processing position to the waiting position, and to change the second silicon rod 102 is converted from the second processing location to the third processing location, the third silicon rod 104 is converted from the first processing location to the second processing location, and the fourth silicon rod 106 is converted from the waiting location to the first processing location.

In this way, the silicon rod transfer device 6 can be used to transfer the processed first silicon rod 100 in the waiting area from the silicon rod processing platform, and transfer the fifth silicon rod 108 to be processed to the silicon rod processing platform The waiting area (as shown in Figure 14).

At the same time, the grinding device 3 in the embodiment shown in FIG. 13 can be used to perform grinding operations on the second silicon rod 102 on the third processing position of the silicon rod processing platform. For the specific manner of using the grinding device 3 to perform the grinding operation on the second silicon rod 102 on the third processing position of the silicon rod processing platform, please refer to the foregoing description, which will not be repeated here.

At the same time, the cutting device 2 in the embodiment shown in FIG. 13 can be used to cut the fourth silicon rod 106 at the first processing position and the third silicon rod 104 at the second processing position of the silicon rod processing platform.

When the cutting device 2 in the embodiment shown in FIG. 13 is used to cut the fourth silicon rod 106 on the first processing location of the silicon rod processing platform and the third silicon rod 104 on the second processing location, in conjunction with FIG. 1, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the fourth silicon rod 106 and the second processing on the corresponding first processing area. The third silicon rod 104 at the location is cut, wherein the first cutting unit 23 performs the first folding cutting of the fourth silicon rod 106 at the first processing location (the first cutting unit 23 is provided with a "Γ" shape The second cutting unit 25 performs the second folding cutting of the third silicon rod 104 at the second processing position (the second cutting unit 25 is provided with a second cutting line in the shape of "Γ" network). Among them, it should be noted that before the second cutting unit 25 is used to perform the second bend cutting of the third silicon rod 104 at the second processing position, due to the aforementioned bend cutting problem, the silicon rod conversion device 4 is also required. The silicon rod positioning mechanism 43 drives the third silicon rod 104 to rotate 180° in the forward or reverse direction to adjust the cutting surface. In this way, the third silicon rod 104 located in the second processing area is cut by the second cutting unit 25 to form a square silicon rod as a whole.

In some embodiments, the integrated silicon rod cutting and grinding machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing zone, a second processing zone, and a third processing zone. The silicon rod cutting and grinding integrated machine also includes a cutting device, a grinding device, and a silicon rod conversion device. The first processing position, the second processing position and the third processing position of the silicon rod processing platform are 120° between each other. distributed. In this embodiment, it is assumed that the direction according to the sequence of the first processing location, the second processing location and the third processing location is defined as a positive direction.

The silicon rod cutting and grinding method of this application may at least include the following steps:

In step S201, the first silicon rod is loaded in the first processing area, and the cutting device is caused to perform the first folding cutting of the first silicon rod in the first processing area.

In this embodiment, in step S201, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the first processing position of the silicon rod processing platform.

When the cutting device is used to cut the first silicon rod in the first processing area, the cutting support is driven to descend relative to the cutting frame, and the first cutting units on the left and right sides of the cutting support are used to cut the first silicon in the first processing area. The rod performs first folding cutting (the first cutting unit is provided with a first cutting wire net in the shape of "Γ").

In step S203, the silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod to the first processing position, so that the cutting device can The first silicon rod in the second processing area is subjected to second folding cutting and the second silicon rod in the first processing position is subjected to first folding cutting.

In step S203, since the waiting area is 120° from the first processing area to which it belongs, the first predetermined angle for rotating the silicon rod conversion device is to make the silicon rod conversion device rotate forward by 120° .

When the cutting device is used to cut the second silicon rod on the first processing area and the second silicon rod on the first processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame, and the cutting support The first cutting unit and the second cutting unit on the side simultaneously cut the second silicon rod in the corresponding first processing area and the first silicon rod in the second processing area, wherein the first cutting unit cuts the first silicon rod in the first processing area. The second silicon rod on the upper side performs the first bend cutting (the first cutting unit is provided with a first cutting wire mesh in the shape of "Γ"), and the second cutting unit performs the first cut on the first silicon rod on the second processing area. Two-fold cutting (the second cutting unit is provided with a second cutting wire net in the shape of "Γ"). Among them, it should be noted that before using the second cutting unit to perform the second bend cutting of the first silicon rod at the second processing location, due to the aforementioned bevel cutting problem, the silicon rod conversion device must also be used. The rod positioning mechanism drives the first silicon rod to rotate 180° in the forward or reverse direction to adjust the cutting surface.

Step S205, the silicon rod conversion device is made to rotate the first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, to convert the second silicon rod from the first processing position to the second processing position, and to change The third silicon rod is converted to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod on the third processing area. At this stage, the cutting device is made to grind and chamfer the second silicon rod on the second processing area. The silicon rod is subjected to second folding cutting and the third silicon rod in the first processing area is subjected to first folding cutting.

In step S205, since the first processing location, the second processing location, and the second processing location of the silicon rod processing platform are sequentially different by 90°, the first predetermined angle for rotating the silicon rod conversion device is It is to make the silicon rod conversion device rotate 90° in the forward direction.

The grinding device can be used for grinding the first silicon rod on the third processing zone of the silicon rod processing platform.

When the cutting device is used to cut the third silicon rod on the first processing area and the second silicon rod on the second processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame. The first cutting unit and the second cutting unit on the side simultaneously cut the third silicon rod in the corresponding first processing area and the second silicon rod in the second processing area, wherein the first cutting unit cuts the first processing area The third silicon rod on the upper side performs the first bend cutting (the first cutting unit is provided with a first cutting wire net in the shape of "Γ"), and the second cutting unit performs the first cut on the second silicon rod on the second processing area. Two-fold cutting (the second cutting unit is provided with a second cutting wire net in the shape of "Γ"). Among them, it should be noted that before using the second cutting unit to perform the second folding cutting of the second silicon rod at the second processing location, due to the aforementioned folding cutting problem, the silicon rod conversion device needs to be used. The rod positioning mechanism drives the second silicon rod to rotate 90° forward or reverse to adjust the cutting surface.

In step S207, the silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the first processing position, the second silicon rod from the second processing position to the third processing position, and The third silicon rod is converted from the first processing area to the second processing area, the first silicon rod is unloaded from the first processing area and the fourth silicon rod is loaded, so that the cutting device performs the first processing on the fourth silicon rod in the first processing area. A folded surface cutting. At this stage, the grinding device is made to grind and chamfer the second silicon rod on the third processing area, and the cutting device is made to perform the second folding on the third silicon rod on the second processing area. Surface cutting.

In step S207, since the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are sequentially different by 120°, the first predetermined angle for rotating the silicon rod conversion device is It is to make the silicon rod conversion device rotate 120° in the forward direction or 240° in the reverse direction. Among them, making the silicon rod conversion device rotate 240° in the reverse direction can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation.

In step S207, the silicon rod transfer device may be used to transfer the processed first silicon rod in the first processing location out of the silicon rod processing platform, and transfer the fourth silicon rod to be processed to the silicon rod The waiting area of the processing platform.

The grinding device can be used to perform grinding operations on the second silicon rod on the third processing position of the silicon rod processing platform.

When the cutting device is used to cut the fourth silicon rod on the first processing area and the third silicon rod on the second processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame, and the left and right sides of the cutting support The first cutting unit and the second cutting unit on the side simultaneously cut the fourth silicon rod in the corresponding first processing area and the third silicon rod in the second processing area, wherein the first cutting unit cuts the first processing area The fourth silicon rod on the upper side performs the first folding cutting (the first cutting unit is provided with a first cutting wire mesh in the shape of "Γ"), and the second cutting unit performs the first fold cutting on the third silicon rod on the second processing area. Two-fold cutting (the second cutting unit 25 is provided with a second cutting wire net in the shape of "Γ"). Among them, it should be noted that before using the second cutting unit to perform the second bend cutting of the third silicon rod at the second processing location, due to the aforementioned problem of bevel cutting, the silicon rod conversion device must be used. The rod positioning mechanism 43 drives the third silicon rod to rotate 90° in a forward or reverse direction to adjust the cutting surface.

The silicon rod cutting and grinding method disclosed in the present application can transfer silicon rods in an orderly and seamless manner between various processing devices, and at the same time perform square cutting of silicon rods to form square silicon rods and split square cuts The subsequent square silicon rods are ground to complete the multi-process integrated operation of silicon rod extraction and grinding, improving production efficiency and product processing quality.

This application also proposes a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Through equipment transformation, multiple processing devices are integrated in one equipment, which can automatically realize the square cutting and grinding of silicon rods (such as surface grinding). , Chamfering, etc.), seamless connection between various processing operations, saving labor costs and improving production efficiency, and improving the quality of silicon rod processing operations.

Please refer to FIGS. 15 to 16, where FIG. 15 shows a schematic diagram of a three-dimensional structure of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application, and FIG. 16 shows an example of an integrated silicon rod cutting and grinding machine according to the present application. Top view.

In this embodiment, the integrated silicon rod cutting and grinding machine of the present application is used to perform square cutting and grinding operations on silicon rods. Here, the silicon rod is a single crystal silicon rod, but it is not limited thereto. For example, polysilicon rods should also belong to the scope of protection of this application.

As shown in the figure, the silicon rod squaring equipment disclosed in the present application includes: a base 1, a cutting device 2, a grinding device 3, and a silicon rod conversion device 4. The base 1 has a silicon rod processing platform. The cutting device 2 is arranged on the machine base 1, and is used to perform side-cutting in the first direction on the silicon rods on the first processing area of the silicon rod processing platform and to cut the silicon rods on the second processing area of the silicon rod processing platform. The rod is side-cut in the second direction to form a square silicon rod. The grinding device 3 is arranged on the machine base 1 and is used for grinding and chamfering the square silicon rod on the third processing position of the silicon rod processing platform.

It should be understood that, in the embodiments of the present application, the side cutting in the first direction on the silicon rod and the side cutting in the second direction on the silicon rod are for cutting the silicon rod to form the first direction. The side surface and the side surface of the silicon rod are cut to form the second direction. After the side cutting in the first direction and the side cutting in the second direction are completed, the silicon rod is processed into a rectangular cross section.

As the main part of the silicon rod multi-station processing machine of the present application, the base 1 has a silicon rod processing platform, wherein the silicon rod processing platform can be divided into a plurality of functional areas according to the specific operation content of the silicon rod processing operation. Specifically, in the embodiment shown in FIG. 15 and FIG. 16, the silicon rod processing platform at least includes a waiting area, a first processing area, a second processing area, and a third processing area.

The silicon rod conversion device 4 is arranged in the center area of the silicon rod processing platform, and is used to place the silicon rod 100 on the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. Convert between. In one embodiment, the silicon rod conversion device 4 is rotatably arranged on the silicon rod processing platform, and the silicon rod conversion device 4 may further include: a conveying body 41 in the shape of a disc, a square disc or other similar shapes; The silicon rod positioning mechanism 43 on the conveying body 41 is used to position the silicon rods; the conversion driving mechanism is used to drive the conveying body 41 to rotate to drive the silicon rod positioning mechanism 43 to switch positions.

As mentioned above, the silicon rod processing platform in this embodiment includes a waiting area, a first processing area, a second processing area, and a third processing area. In order to be compatible with these functional areas, the conveyor body 41 The number of silicon rod positioning mechanisms 43 can be set to four, and each silicon rod positioning mechanism 43 can position at least one silicon rod. Further, the angles set between the four silicon rod positioning mechanisms 43 are also consistent with the angle distribution between the four functional areas. In this way, when a certain silicon rod positioning mechanism 43 corresponds to a certain functional location, inevitably, the other three silicon rod positioning mechanisms 43 also correspond to the other three functional locations respectively. In this way, in the pipeline operation, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism 43 and the silicon rod positioning mechanism 43 corresponds to the functional location, these silicon rods are located in the corresponding one. Corresponding processing operations are performed in a functional area. For example, silicon rods located in the waiting area can be pre-processed, silicon rods located in the first processing area can be processed first, and silicon rods located in the second processing area can be processed For the second processing operation, the silicon rod located in the third processing area can perform the third processing operation. In an optional embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° among each other. Therefore, correspondingly , The four silicon rod positioning mechanisms 43 on the conveying body 41 are also distributed at 90° between two. Of course, the number of the silicon rod positioning mechanisms 43 can be changed according to actual requirements and is not limited to this. For example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotating carrier 431, a rotating pressing device 433, a lifting drive device (not labeled in the figure), and a rotating drive device (not labeled in the figure).

The rotating bearing platform 431 is set on the conveying body 41 in the silicon rod conversion device 4, and is used to carry the silicon rod 100 (200) and make the silicon rod 100 (200) stand upright, that is, the bottom of the silicon rod 100 (200) is located On the rotating carrier 431. In this embodiment, the rotating stage 431 rotates when the conveying body 41 in the silicon rod conversion device 4 rotates. In some embodiments, the rotating bearing platform 431 can also be designed to be rotatable. For example, the rotating bearing platform 431 has a rotating shaft relative to the conveying body 41 to realize the rotation movement. In this way, when the rotating bearing platform 431 supports the silicon rod 100 ( After 200), the rotating carrier 431 and the silicon rod 100 (200) on it can rotate together. Further, the contact surface of the rotating bearing platform 431 for contacting with the silicon rod is damped to provide a certain friction force that can drive the silicon rod. The rotating bearing platform 431 is adapted to the silicon rod 100 (200). In some embodiments, the rotating bearing platform 431 may be a circular bearing platform or a square bearing platform adapted to the cross-sectional size of the silicon rod 100 (200).

The rotary pressing device 433 is relatively disposed above the rotary bearing platform 431, and is used to press the top of the silicon rod 100 (200) to compress the silicon rod 100 (200). The rotary pressing device 433 may further include a movable support and a pressing movable block provided at the bottom of the support. The support is movably arranged on a central mounting frame, which is located in the central area of the conveying body 41 and rotates along with the conveying body 41. The top pressure movable block is adapted to the silicon rod 100 (200). In an optional embodiment, the top pressure movable block may be a circular cake-shaped pressure piece that is adapted to the cross-sectional size of the silicon rod 100 (200). Block or square pressed block. Furthermore, the pressing movable block in the rotary pressing device 433 is pivotally connected to the support and can rotate relative to the support.

It can be seen from the foregoing that the rotating bearing platform 431 is designed to be capable of rotating motion and the pressing movable block in the rotary pressing device 433 is pivotally connected to the support. Therefore, the rotating bearing platform 431 or the pressing movable block Can be linked to a rotary drive device. In one situation, when the rotating bearing platform 431 is linked to a rotation driving device, the rotating bearing platform 431 is used as the active rotating part and the pressing movable block is used as the driven rotating part; in another case, when When the pressing movable block is linked to a rotation driving device, the pressing movable block is used as the active rotating part and the rotating bearing platform 431 is used as the driven rotating part.

In practical applications, the rotary pressing device 433 can cooperate with the rotary bearing platform 431 underneath. Specifically, after the silicon rod 100 (200) is placed vertically on the rotary bearing platform 431, the lifting drive device drives the The support moves downward along the central mounting frame until the pressing movable block on the support presses against the top of the silicon rod 100 (200). Afterwards, when the silicon rod 100 (200) needs to be rotated, the rotating bearing platform 431 or the pressing movable block is driven by the rotation driving device to rotate, and the rotating bearing platform 431, the silicon rod 100 (200), and the top The frictional force between the movable blocks drives the silicon rod 100 (200) to rotate together, so as to realize the adjustment of the working surface or the working area of the silicon rod 100 (200), so that the adjusted work of the silicon rod 100 Surface or work area for processing operations. The rotation speed and rotation angle of the silicon rod 100 (200) can be controlled by a rotation driving device. In terms of specific implementation, the lifting drive device may be, for example, an air cylinder or a lifting motor, and the rotation drive device may be, for example, a rotating motor.

Furthermore, it can be seen from the above that, in some cases, the rotating bearing platform 431 or the pressing movable block can be controlled by a rotating drive device to rotate to drive the silicon rod 100 (200) to rotate to change the working surface or working area. Sometimes, when the silicon rod 100 (200) rotates to the required working surface or working area, it needs to stop and be positioned to accept the processing operation of the processing device in the corresponding functional zone. Therefore, in this application, the silicon rod positioning mechanism can also be equipped with a locking mechanism if necessary. In one implementation, a loading platform locking mechanism (not shown in the figure) can be arranged at the bottom of the central mounting frame and adjacent to the rotating bearing platform 431, and the loading platform locking mechanism can include a locking pin and Locking cylinder connected with locking pin. In practical applications, when the rotary bearing platform 431 needs to be locked, the locking cylinder in the bearing platform locking mechanism drives the locking pin to extend and act on the bottom or neck of the rotary bearing platform 431 to ensure that the rotary bearing platform 431 is stable Do not move; when the silicon rod needs to be rotated to change the working surface or working area, the locking cylinder in the loading platform locking mechanism drives the locking pin to contract, unlocking the rotating bearing platform 431, so that the rotating bearing platform 431 can Rotate.

The conveying body 41 is controlled by the drive of the conversion drive mechanism to rotate, and the silicon rod positioning mechanism 43 on the conveying body 41 and the silicon rod 100 (200) positioned by the silicon rod positioning mechanism 43 are realized by the rotation of the conveying body 41. Convert between different functional areas.

In some embodiments, the conversion driving mechanism further includes: a conversion toothed belt, which is arranged on the peripheral side of the conveying body 41; a driving motor and a linkage structure connected to the driving motor and driven by the driving motor; On the rod processing platform, the linkage structure includes a rotating gear meshed with the conversion toothed belt. In this way, the rotating gear drives the conveying body 41 to rotate under the drive of the drive motor to drive the silicon rod positioning mechanism 43 and the silicon rod 100 (200) on it to transfer to other functional areas to complete the transportation. The drive motor may be a servo Motor.

In some embodiments, the silicon rod conversion device 4 may further include a locking mechanism (not shown in the drawings) for locking the conveying body 41. For example, the locking mechanism may include a locking bolt and a locking cylinder connected to the locking bolt, wherein the number of locking bolts may be multiple, evenly distributed on the edge of the conveying body 41 (for example, the number of locking bolts It is four, evenly distributed at a 90° angle). In practical applications, when the silicon rod needs to be converted from one processing area to another processing area, the locking cylinder drives the locking pin to contract and unlock the disc shape Or a circular conveying body, so that the conveying body 41 can rotate; when the silicon rod is converted, that is, after the silicon rod is converted from a certain processing position to a target processing position, the locking cylinder in the locking mechanism drives the lock The stop pin extends and acts on the conveying body 41 to lock the conveying body 41.

As mentioned earlier, the silicon rods located in the waiting area can be pretreated. The silicon rod cutting and grinding integrated machine of the present application also includes a silicon rod transfer device 6, which is adjacent to the waiting area of the silicon rod processing platform, and is used to transfer the silicon rod 100 (200) to be processed to the silicon rod processing platform. The waiting area or the processed silicon rods in the waiting area are transferred out of the silicon rod processing platform.

Please refer to FIG. 17, which is shown as a partial enlarged view of part A of FIG. 15. As shown in Fig. 17, the silicon rod transfer device 6 further includes: a transfer base 61, a silicon rod platform 63, and a platform turning mechanism.

The transfer base 61 is slidably arranged on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least two directions. For example, the sliding mechanism includes a support portion 621, a conversion portion 623, a first direction sliding unit provided between the support portion 621 and the conversion portion 623, and a second direction slide unit provided between the conversion portion 623 and the transfer base 61 A sliding unit, wherein the first-direction sliding unit may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction drive source, the second The direction sliding unit may include a second direction slide rail, a second direction slider or slide bar corresponding to the second direction slide rail, and a second direction drive source.

Wherein, the first slide rail, the first direction slide block or the slide bar, the second slide rail, the second direction slide block or the slide bar are arranged in a horizontal state, and the first direction drive source and the second direction drive Any of the sources may include: a sliding rack and a rotating gear (not shown in the figure) meshing with the sliding rack and a sliding drive motor. With the sliding unit in the first direction, the first driving source can drive the conversion portion 623 and the transfer base 61 thereon to slide along the first direction through the first direction slider or slide bar and the first direction slide rail. In the second direction sliding unit, the second driving source can drive the transfer base 61 to slide along the second direction through the second direction slider or sliding bar and the second direction sliding rail.

In some examples, the first direction may be, for example, the left-right direction (that is, the X-axis direction in FIGS. 16 and 17), and the second direction may be, for example, the front-rear direction (that is, the Y-axis direction in FIGS. 16 and 17). Axis direction).

The silicon rod platform 63 is movably arranged on the transfer base 61 and is used for laterally (ie, horizontally) positioning the silicon rod 100 (200). In this embodiment, the silicon ingot platform 63 is a plate-like structure or a frame structure, and at least one silicon ingot support bracket is provided at the front and rear ends of the silicon ingot platform 63 to support the silicon ingot 100 (200). The front and rear ends of the silicon rod 100 (200) can be arranged horizontally. At the same time, stop structures may also be provided on the left and right sides of the silicon rod platform to restrict the movement of the silicon rod 100 (200) in the left and right directions.

We know that in the subsequent processing operations, the silicon rod 100 needs to be converted from the horizontal state (horizontal placement) to the upright state (upright placement). Therefore, in this application, a silicon rod fastening mechanism can also be provided for Tighten the silicon rod during the silicon rod transfer process (not shown in the diagram). In some embodiments, the silicon rod fastening mechanism may include a fastening claw and a fastening motor or a fastening cylinder that controls the fastening claw. Further, the silicon rod fastening mechanism includes at least two pairs of fastening claws, at least two pairs of fastening claws are respectively corresponding to the aforementioned two silicon rod supporting brackets, that is, a pair of fastening claws are corresponding The two fastening claws of a pair of fastening claws are arranged oppositely on the left and right sides of the silicon rod supporting bracket. Each fastening claw is equipped with a fastening motor or fastening cylinder. In practical applications, when the silicon rod 100 (200) lies on the silicon rod platform, the fastening motor or the fastening cylinder drives the respective fastening claws toward the silicon rod 100 (200) on the silicon rod platform. In this way, A plurality of at least two pairs of fastening claws cooperate to realize the overall fastening of the silicon rod 100 (200). Preferably, a buffer member can be provided at the pressing position where the fastening claw contacts the silicon rod 100 (200) to avoid or reduce damage to the silicon rod 100 (200).

In order to convert the silicon rod 100 from the horizontal state (horizontal placement) to the upright state (upright placement), the silicon rod transfer device 6 further includes a platform turning mechanism. The platform turning mechanism is used to drive the silicon rod platform 63 to turn relative to the transfer base 61 so that the silicon rod 100 (200) is placed upright on the silicon rod conversion device 4. In this embodiment, the platform turning mechanism includes: a mounting frame, a moving frame, a turning cylinder or turning motor, a turning rack, and a turning gear. The mounting frame is fixed on the transfer base. In some embodiments, the mounting frame is a plate structure or a frame structure. The mobile frame is movably erected above the mounting frame. In some embodiments, the movable frame is a hollow plate structure or frame structure. Further, the left and right opposite sides of the movable rack adjacent to the silicon rod conversion device 4 are respectively provided with turning racks, and correspondingly, the left and right sides of the turning end adjacent to the silicon rod conversion device 4 in the silicon rod platform 63 are opposite to each other. Both sides are respectively provided with flip gears, and the flip gears are on and meshed with the corresponding flip racks. The turning cylinder or turning motor is used to drive the movable frame to move relative to the mounting frame. Taking the turning cylinder as an example, the turning cylinder as a whole is arranged in the hollow area of the movable frame. Specifically, the cylinder body (for example, including a cylinder tube and a piston) in the turning cylinder is provided on the mounting frame, The piston rod in the turning cylinder is connected to the moving frame. In practical applications, the silicon rod platform is turned from a horizontal state to an upright state: the cylinder is turned, the piston rod stretches and pushes the movable frame, so that the movable frame moves relative to the mounting frame under the push, and the flip rack on the movable frame also Following the movement of the movable frame, the flip gear on the silicon ingot platform meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon ingot platform to flip, and finally realizes the flipping of the silicon ingot platform from a horizontal state to an upright state. The silicon rod platform is turned from the upright state to the horizontal state: the turning cylinder acts, the piston rod shrinks and pulls the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the turning rack on the moving frame also moves with the moving frame. The flip gear on the silicon ingot platform meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon ingot platform to flip, and finally realizes the flip of the silicon ingot platform from an upright state to a horizontal state.

What needs to be added is: In addition, in order to make the movable frame move smoothly and steadily relative to the mounting frame, there are slide rails on the left and right sides of the mounting frame, while the left and right sides of the bottom of the movable frame are provided with slide rails Slider or slider. Of course, the above is only an exemplary description and is not intended to limit the present invention. For example, in other embodiments, the sliding rail can be modified on the movable frame and the slider or the sliding bar can be modified on the mounting frame. In addition, in order to avoid or reduce the impact damage of the silicon ingot platform to the moving frame, mounting frame or inverting cylinder or turning motor during the turning process (for example, when the silicon ingot platform is turned from an upright state to a horizontal state), it can be moved further Relatively convex buffers are provided on the rack or the mounting rack.

The silicon rod transfer device 6 may also include a lifting mechanism. The lifting mechanism is arranged on the silicon rod platform and is used for lifting and lowering the silicon rod 100 (200) after being turned over. In this embodiment, the lifting mechanism may include a sliding rail or a sliding rod and a lifting motor or a lifting cylinder. In order to realize the lifting movement of the silicon rod 100 (200), the silicon rod supporting bracket is passed through a sliding rail or a sliding rod. The rod is set on the silicon rod platform (the silicon rod fastening mechanism is installed and connected to the silicon rod supporting bracket), and the lifting motor or the lifting cylinder controls the silicon rod supporting bracket (together with the silicon rod fastening mechanism) to move up and down, thereby Drive the silicon rod 100 (200) to achieve lifting. Still taking the lifting cylinder as an example, the whole lifting cylinder is arranged in the middle of the silicon ingot platform. Specifically, the cylinder body (for example, including the cylinder and the piston) in the lifting cylinder is arranged on the silicon ingot platform, and the piston rod in the lifting cylinder It is connected to the silicon rod supporting bracket. In practical applications, the lifting cylinder is actuated, the piston rod stretches (extends or contracts) and pushes (pushes or pulls) the silicon rod bearing bracket, so that the silicon rod bearing bracket moves up and down relative to the mounting frame under the push and pull. The silicon rod 100 (200) on the supporting bracket also moves up and down following the silicon rod supporting bracket.

The aforementioned silicon rod transfer device 6 is only an exemplary description, but not limited to this, and the silicon rod transfer device can still be changed in other ways.

In some embodiments, the silicon rod transfer device may include: a reversing carrier, a silicon rod holder provided on the reversing carrier, and a reversing drive mechanism for driving the reversing carrier for reversing movement .

The reversing carrier is the main device used to set other types of components in the silicon rod transfer device. The other types of components may mainly include silicon rod clamps, but are not limited to this. Other components may also be mechanical structures, for example , Electrical control system and numerical control equipment, etc. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a support structure arranged between the base and the top frame. In addition, another important function of the reversing carrier is to support the reversing conversion of the silicon rod fixture through reversing movement. The reversing carrier can, for example, make a reversing movement by a reversing drive mechanism. By using the reversing drive mechanism, the reversing carrier can be driven to make a reversing movement so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfers it from the loading and unloading area to the corresponding waiting area, Or, clamp the processed silicon rod 200 corresponding to the waiting area and transfer it from the waiting area to the loading and unloading area.

In a specific implementation manner, the reversing drive mechanism for realizing the reversing movement of the reversing carrier may include a rotating shaft and a rotating motor, and the reversing carrier is connected to the mounting infrastructure under it through the rotating shaft. When the steering movement is implemented, the rotating motor is started, and the rotating shaft is driven to rotate to drive the reversing carrier to rotate to realize the reversing movement. The aforementioned driving rotation shaft rotation can be designed as a one-way rotation or a two-way rotation, the one-way rotation can be, for example, a one-way clockwise rotation or a one-way counterclockwise rotation, and the two-way rotation can be, for example, a clockwise rotation. And turn counterclockwise. In addition, the angle at which the drive rotation shaft rotates can be set according to the actual structure of the silicon rod transfer device. Furthermore, the base in the reversing carrier can adopt a circular disc structure, a rectangular disc or an elliptical disc, and its central position is connected to the rotating shaft, but the shape of the base is not limited to this. In other embodiments, the base can also adopt other shape.

A silicon rod clamp is arranged on the reversing carrier for clamping the corresponding silicon rod. For example, in some embodiments, a silicon rod holder is provided on a certain mounting surface of the reversing carrier, and the silicon rod holder may include at least two silicon rod holders, wherein at least two silicon rod holders Set for the interval. The silicon rod holder in the silicon rod holder can be used to hold round silicon rods (that is, silicon rods to be processed) and square silicon rods (that is, processed silicon rods). In this way, by driving the reversing carrier for reversing movement, the silicon rod fixture on the reversing carrier is switched between the loading and unloading area and the waiting area to transfer the silicon rods to be processed and between the waiting area and the loading and unloading area. Transfer the processed silicon rods. In practical applications, the rotation angle of the reversing vehicle for reversing movement is determined by the positional relationship between the loading and unloading area and the waiting area. In some embodiments, the loading and unloading area and the waiting area are arranged oppositely, and the silicon rod transfer device is located between the two. Therefore, the reversing carrier is driven by the reversing drive mechanism to rotate at an angle of 180°. In some embodiments, the loading and unloading area and the waiting area are arranged at an angle of 90 degrees, and the reversing carrier is driven by the reversing drive mechanism to rotate at an angle of 90 degrees. However, in any case, there are no specific restrictions on the positional relationship between the loading and unloading area and the waiting area. Their setting sequence and mutual setting angle can still be changed, as long as there is no unnecessary change between each station. In the case of interference, the direction and angle of rotation of the reversing vehicle will also be adjusted adaptively.

In some embodiments, both the silicon rods to be processed or the processed silicon rods are placed upright. Therefore, at least two silicon rod clamping members in the silicon rod clamp are arranged vertically and spaced apart. Any silicon rod clamping member may further include: a clamping arm mounting seat and two clamping arms, wherein the clamping arm mounting seat is arranged on the reversing carrier, and at least two clamping arms are movably arranged on the clamping arm mounting seat . The two clamping arms are arranged symmetrically, and the two clamping arms can form a clamping space for clamping a single wafer silicon rod or a silicon cube. In addition, the use of the silicon rod holder can also have the function of centering adjustment. In general, when the clamping arms of the silicon rod holder are clamped, the center of the clamping space formed by the two clamping arms coincides with the centers of the silicon rods to be processed and the processed silicon rods. Therefore, when the silicon rod holder is used to clamp the upright silicon rod to be processed or the processed silicon rod, the two clamping arms in the silicon rod holder shrink, and the clamping arm abuts against the processed silicon rod. Silicon rods or processed silicon rods. In the process of the clamping arm shrinking and clamping the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamping arms on both sides and faces the central area of the clamping space Move until the silicon rod to be processed or the processed silicon rod is clamped by the two clamping arms in the silicon rod holder. At this time, the center of the silicon rod to be processed or the processed silicon rod can be located on the silicon rod. The center of the clamping space of the rod holder.

In order to enable at least two clamping arms in the silicon rod clamping piece to smoothly and firmly clamp the silicon rods to be processed or processed silicon rods of different sizes and specifications, each of the clamping arms in the silicon rod clamping piece At least one is an adjustable design. Take two clamping arms as an example, at least one of the two clamping arms is movable design (one or two of the two clamping arms are movable design), so that the clamping distance between the two clamping arms can be adjusted .

In addition, the silicon rod holder in the silicon rod transfer device of the present application can have other changes. For example, the silicon rod transfer device may be equipped with two silicon rod clamps, and the two silicon rod clamps may be respectively arranged on two opposite mounting surfaces of the reversing carrier. Moreover, the two silicon rod holders can be the same or different. In an embodiment where the two silicon rod furniture are the same, the two silicon rod holders are used to clamp round silicon rods and square silicon rods. In an embodiment where the two silicon rod furniture are different, one of the two silicon rod clamps is used to clamp round silicon rods, and the other silicon rod clamp is used to clamp square silicon rods.

Furthermore, the silicon rod transfer device 6 in the present application can further provide movement in at least one direction. For example, the silicon rod transfer device may further include an advance and retreat mechanism in the front and rear direction, and the advance and retreat mechanism may include: an advance and retreat guide rail and an advance and retreat motor, wherein the advance and retreat guide rail is arranged in the front and rear direction, and the base of the reversing carrier can pass through the slider The pillow is on the forward and retreat guide rail, so when the position of the reversing carrier needs to be adjusted, the forward and retreat motor drives the reversing carrier to advance and retreat along the forward and retreat guide rail.

The integrated silicon rod cutting and grinding machine of the present application also includes a positioning detection device. In this embodiment, the positioning detection device (not shown in the figure) is used for edge detection and center positioning of the silicon rod 100 located in the waiting area.

The positioning detection device further includes: a ridge detection unit and an axis adjustment unit.

In some embodiments, the ridge line detection unit includes a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism, and the contact detection structure is used for The on-off signal is sent to the detection controller by contacting the ridgeline of the silicon rod, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller.

The number of the silicon rod positioning mechanisms 43 can be changed according to actual requirements and is not limited to this. For example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include a rotating bearing platform 431.

In some embodiments, the axis adjustment unit is used to position the axis of the silicon rod 100 in the center of the pretreatment zone, and includes a clamping mechanism for clamping the silicon The clamping space of the rod and the center of the clamping space coincide with the center of the pretreatment zone.

In a specific implementation manner, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

In view of the circular cross-section of the silicon rod, in some examples, the clamping piece is a circular workpiece holder as a whole, and the clamping arms constituting the clamping piece are two symmetrically designed, and a single clamping arm is designed as It has an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single clamping arm should exceed one-fourth of the arc of the silicon rod 100, so that the arc-shaped clamping of the clamping piece composed of two clamping arms The holding surface should exceed one half of the arc of the silicon rod 100. Of course, an additional buffer pad can be added to the curved clamping surface of the clamping arm to avoid damage to the surface of the silicon rod during the process of clamping the silicon rod, which has a good effect of protecting the silicon rod. Under normal circumstances, when the clamping arms in the clamping member are in the clamping state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when the clamping piece is used to clamp the silicon rod 100 placed upright in the area to be processed, the two clamping arms in the clamping piece shrink, and the arc-shaped clamping surface in the clamping arm abuts against the silicon rod. . In the process of the clamping arm shrinking and clamping the silicon rod 100, the silicon rod 100 is pushed by the two clamping arms on both sides and moves toward the central area of the clamping space until the silicon rod 100 is clamped by the clamping arm in the clamping piece At this time, the center of the silicon rod 100 can be located at the center of the clamping space of the clamping member.

After the silicon rod 100 to be processed is transferred to the waiting area of the silicon rod processing platform by the silicon rod transfer device 6 and preprocessed, the silicon rod conversion device 4 can convert the silicon rod from the waiting area to other processing locations.

The cutting device 2 is arranged on the machine base 1, and is used to perform side cutting in the first direction on the silicon rod 100 on the first processing area of the silicon ingot processing platform and to perform side cutting on the silicon rod 100 on the second processing area of the silicon ingot processing platform. Cut the side in the second direction to form a square silicon rod.

Please refer to FIG. 18, which shows a schematic structural diagram of a cutting device in an integrated silicon rod cutting and grinding machine of the present application. In the silicon rod cutting and grinding integrated machine as shown in FIGS. 15, 16 and 18, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

The cutting frame 21 is arranged on the machine base 1. In this embodiment, the cutting frame 21 is a columnar structure or a frame structure, which serves as a support body of the cutting device 2 and can provide support for other components in the cutting device 2.

The cutting support 22 can be set on the cutting frame 21 so as to be lifted and lowered by a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22 by a lifting motor, a lifting rail, and a lifting slide, wherein the lifting rail is vertically arranged on the cutting frame 21 Above, the lifting slider is arranged on the back of the cutting support 22 and is matched with the lifting guide rail. In order to make the cutting support 22 achieve a stable lifting installation structure on the machine base 1, a double guide rail design can be adopted, that is, two Two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the cutting support 22 can be moved up and down relative to the cutting frame 21 and the base 1 by means of the lifting guide rail and the lifting slider.

In this embodiment, since the cutting support 22 can be configured with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Therefore, in this embodiment, on the one hand, the cutting frame 21 and the cutting support 22 in the cutting device 2 are arranged in a middle position between the first processing position and the second processing position. On the other hand, the cutting support 22 is specially designed. As shown in Figures 15 to 18, the cutting support 22 in this embodiment may include a support main body 221, and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221, wherein, The included angle between the first seat wing 223 and the seat body 221 is an obtuse angle, and the included angle between the second seat wing 225 and the seat body 221 is an obtuse angle, so that the first seat wing 223 and the second seat The seat side wings 225 are arranged vertically, that is, the first seat side wings 223 are arranged along the Y axis and the second seat side wings 225 are arranged along the X axis. For example, in some embodiments, the support main body 221 of the cutting support 22 is arranged at 45° to the X-axis or Y-axis, and the first support side wing 223 and the support main body 221 are arranged at an angle of 145°. To be arranged along the Y axis, the second support side wing 225 and the support body 221 form an included angle of 145° and are arranged along the X axis.

The first cutting unit 23 is arranged on the first side of the cutting support 22 and is used to perform side-cutting in the first direction on the silicon rod 100 on the first processing position of the silicon rod processing platform.

In this embodiment, as described above, the cutting support 22 includes a support main body 221 and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221. Therefore, the first cutting unit 23 is installed at the first support side 223 of the cutting support 22. Specifically, the first cutting unit 23 includes a first wire frame 231 arranged on the side wing 223 of the first support, a plurality of first cutting wheels 233 arranged on the first wire frame 231, and a first cutting line 235. A cutting line 235 is sequentially wound around the plurality of first cutting wheels 233 to form a first cutting line segment arranged in a first direction. In this embodiment, the first direction is the X-axis direction.

In practical applications, the first cutting unit 23 may include at least four first cutting wheels 233, and these four first cutting wheels 233 may be combined into a pair of first cutting wheel sets, that is, from being along the first direction (ie along the X-axis direction) Two first cutting wheels are arranged opposite to form a first cutting wheel group, and two first cutting wheel groups arranged in the second direction (that is, along the Y-axis direction) form a pair of first cutting wheel groups . Specifically, the first cutting unit 23 includes a pair of first cutting wheel sets, and the pair of first cutting wheel sets may include two first cutting wheel sets, which are along the second direction (ie Along the Y-axis direction) are arranged on the left and right sides of the first wire frame 231, in which a first cutting wheel set is located on the left side of the first wire frame 231 and includes a set along the first direction (that is, along the X-axis direction). Two first cutting wheels 233, the other first cutting wheel set is located on the right side of the first wire frame 231 and includes two first cutting wheels 233 arranged along the first direction (that is, along the X-axis direction).

The first cutting line 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting line web. In practical applications, the first cutting line 235 is sequentially arranged around the four first cutting wheels 233 in the first cutting unit 23 to form two first cutting line segments, and the two first cutting line segments are arranged along the X axis They are parallel to each other to form the first cutting wire net. Specifically, the first cutting line 235 is wound around two first cutting wheels 233 arranged in a first direction (that is, along the X-axis direction) in a first cutting wheel set to form a first cutting line segment. 235 is wound around two first cutting wheels 233 arranged in the first direction (ie along the X-axis direction) in another first cutting wheel group to form another first cutting line segment. In this way, the two first cutting line segments that are parallel to each other cooperate to form a first cutting line net in the shape of "=" along the first direction (that is, along the X-axis direction).

Of course, the first cutting unit 23 is not limited to the embodiments shown in FIGS. 15 to 17, and other changes can still be made in other embodiments.

In some embodiments, the first cutting unit 23 may include at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into a pair of first cutting wheel sets, that is, arranged oppositely along the Y axis The two first cutting wheels form a first cutting wheel set, and the two first cutting wheel sets along the X axis form a pair of first cutting wheel sets. Specifically, the first cutting unit 23 includes a pair of first cutting wheel sets, and the pair of first cutting wheel sets may include two first cutting wheel sets, and the two first cutting wheel sets are along the first direction (ie Along the X-axis direction) are arranged on the front and rear sides of the first wire frame 231, wherein a first cutting wheel set is located on the front side of the first wire frame 231 and includes a set along the second direction (ie along the Y-axis direction). Two first cutting wheels 233, the other first cutting wheel set is located on the rear side of the first wire frame 231 and includes two first cutting wheels 233 arranged along the second direction (ie along the Y-axis direction). The first cutting line 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting line web. In practical applications, the first cutting line 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two first cutting line segments, and the two first cutting line segments are along the second direction. (That is, along the Y-axis direction) are arranged and parallel to each other to form the first cutting wire net. Specifically, the first cutting line 235 is wound around two first cutting wheels 233 arranged in the second direction (that is, along the Y-axis direction) in a first cutting wheel set to form a first cutting line segment. 235 is wound around two first cutting wheels 233 arranged in the second direction (that is, along the Y-axis direction) in another first cutting wheel set to form another first cutting line segment. In this way, the two first cutting line segments that are parallel to each other cooperate to form a first cutting line net in the shape of "=" along the second direction (ie, along the Y-axis direction).

In some embodiments, the number of first cutting wheels 233 and first cutting line segments in the first cutting unit 23 can also be changed in other ways. For example, the first cutting unit includes two first cutting wheels, and the two first cutting wheels are arranged oppositely along the first direction (that is, along the X-axis direction) or along the second direction (that is, along the Y-axis direction), The first cutting line is sequentially wound around the two first cutting wheels in the first cutting unit to form a line along the first direction (that is, along the X axis direction) or along the second direction (that is, along the Y axis direction). The first cutting line segment in the shape of "one" serves as the first cutting line net.

In addition, in this embodiment, the first cutting unit 23 may further include at least one of the following components: a wire wheel arranged on the first wire frame 231 and/or the first support side 223, used to realize the first cutting The guide of the wire 235; the tension wheel provided on the first wire frame 231 and/or the first support side 223 for adjusting the tension of the first cutting wire 235; and the wire storage drum provided on the machine base 1 (The wire storage barrel may further include a pay-off barrel and a wire take-up barrel) for storing and storing the first cutting line.

The second cutting unit 25 is arranged on the second side of the cutting support 22 and is used to perform side-cutting of the silicon rod 100 in the second processing position of the silicon rod processing platform in the second direction.

In this embodiment, as mentioned above, the cutting support 22 includes a support main body 221 and a first support side 223 and a second support side 225 located on opposite sides of the support main body 221. Therefore, the second cutting unit 25 is installed at the side wing 225 of the second support of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire frame 251 arranged on the side wing 225 of the second support, a plurality of second cutting wheels 253 arranged on the second wire frame 251, and a second cutting line 255. The wire 255 is sequentially wound around the plurality of second cutting wheels 253 to form a second cutting line segment arranged in the second direction. In this embodiment, the second direction is the Y-axis direction.

In practical applications, the second cutting unit 25 may include at least four second cutting wheels 253, and these four second cutting wheels 253 can be combined into a pair of second cutting wheel sets, that is, from the (Y-axis direction) two second cutting wheels are arranged oppositely to form a second cutting wheel group, and the two second cutting wheel groups along the first direction (that is, along the X-axis direction) form a pair of second cutting wheel groups. Specifically, the second cutting unit 25 includes a pair of second cutting wheel sets, and the pair of second cutting wheel sets may include two second cutting wheel sets that are along the first direction (ie Along the X-axis direction) are arranged on the left and right sides of the second wire frame 251, wherein a second cutting wheel set is located on the left side of the second wire frame 251 and includes two sets arranged along the second direction (ie along the Y-axis direction). The second cutting wheel 253, the other second cutting wheel set is located on the right side of the second wire frame 251 and includes two second cutting wheels 253 arranged along the second direction (that is, along the Y-axis direction).

The second cutting line 255 is sequentially wound around each of the second cutting wheels 253 in the second cutting unit 25 to form a second cutting line web. In practical applications, the second cutting line 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two second cutting line segments, and the two second cutting line segments are along the second direction. (That is, along the Y-axis direction) are arranged and parallel to each other to form a second cutting wire net. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged in the second direction (that is, along the Y-axis direction) in a second cutting wheel set to form a second cutting line segment. 255 is wound around two second cutting wheels 253 arranged in the second direction (that is, along the Y axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, the two parallel second cutting line segments cooperate to form a second cutting line net in the shape of "=" along the second direction (that is, along the Y-axis direction).

Of course, the second cutting unit 25 is not limited to the embodiments shown in FIGS. 15 to 17, and other changes can still be made in other embodiments.

In some embodiments, the second cutting unit 25 may include at least four second cutting wheels 253, and the four second cutting wheels 253 may be combined into a pair of second cutting wheel sets, that is, from the first direction (ie (Along the X axis direction) two second cutting wheels are arranged oppositely to form a second cutting wheel group, and the two second cutting wheel groups along the second direction (ie along the Y axis direction) form a pair of second cutting wheel groups . Specifically, the second cutting unit 25 includes a pair of second cutting wheel sets, and the pair of second cutting wheel sets may include two second cutting wheel sets that are along the second direction (ie Along the Y-axis direction) are arranged on the front and rear sides of the second wire frame 251, wherein a second cutting wheel set is located on the front side of the second wire frame 251 and includes two sets along the first direction (ie along the X-axis direction). The second cutting wheel 253, another second cutting wheel set is located on the rear side of the second wire frame 251 and includes two second cutting wheels 253 arranged along the first direction (ie along the X axis direction). The second cutting line 255 is sequentially wound around each of the second cutting wheels 253 in the second cutting unit 25 to form a second cutting line web. In practical applications, the second cutting line 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two second cutting line segments, and the two second cutting line segments are along the first direction. (That is, along the X-axis direction) are arranged and parallel to each other to form a second cutting wire net. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged along the first direction (that is, along the X-axis direction) in a second cutting wheel set to form a second cutting line segment. 255 is arranged around two second cutting wheels 253 arranged in the first direction (ie along the X axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, the two parallel second cutting line segments cooperate to form a second cutting line net in the shape of "=" along the first direction (that is, along the X-axis direction).

In some embodiments, the number of second cutting wheels 253 and second cutting line segments in the second cutting unit 25 can also be changed in other ways. For example, the second cutting unit includes two second cutting wheels, and the two second cutting wheels are arranged oppositely along the second direction (that is, along the Y-axis direction) or along the first direction (that is, along the X-axis direction), The second cutting line is arranged around the two second cutting wheels in the second cutting unit in sequence to form a line along the second direction (that is, along the Y axis direction) or along the first direction (that is, along the X axis direction). The second cutting line segment in the shape of "one" serves as the second cutting line net.

In addition, in this embodiment, the second cutting unit 25 may further include at least one of the following components: a wire wheel arranged on the second wire frame 251 and/or the second support wing 225 for realizing the second cutting line 255 guide; set on the second wire frame 251 and/or the second support wing 225 on the tension wheel, used to adjust the tension of the second cutting line 255; and, set on the machine base 1 (the The wire storage barrel may further include a pay-off barrel and a wire take-up barrel) for storing and storing the second cutting line.

Furthermore, for the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25.

In some embodiments, the first cutting unit 23 and the second cutting unit 25 are two independent cutting units, the first cutting line 235 in the first cutting unit 23 and the second cutting line in the second cutting unit 25 255 can be two independent cutting lines.

In some embodiments, the first cutting line 235 in the first cutting unit 23 and the second cutting line in the second cutting unit 25 may be the same cutting line. In this case, the common cutting line is sequentially wound around the plurality of first cutting wheels 233 in the first cutting unit 23 to form a first cutting line web, and then transferred to the second cutting unit next to it in order. The plurality of second cutting wheels 253 arranged in the second cutting unit 25 form a second cutting wire net. Therefore, in this embodiment, the cutting support 22 is also provided with one or more guide wheels located between the first cutting unit 23 and the second cutting unit 25 for the common cutting line to be wound around. Specifically, in the embodiment shown in FIG. 16, in the cutting support 22, the support body 221 located between the first cutting unit 23 and the second cutting unit 25 is provided with a winding for the common cutting line. Guide wheel 26. The first cutting unit 23 and the second cutting unit 25 share the same cutting line, which can simplify the structure of the cutting unit (for example, omit a set of pay-off and take-up reels), have good integrity, and simplify the winding process. Improve efficiency and better control the wire tension of the two cutting units.

When the cutting device 2 in the embodiment shown in FIG. 16 is used to cut the silicon rods on the first processing area and the second processing area of the silicon rod processing platform, the cutting support 22 is driven to descend relative to the cutting frame 21 , The first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the silicon rods on the corresponding first processing location and the silicon rods on the second processing location, where the first cutting The unit 23 cuts the silicon rod in the first processing area along the side in the first direction (that is, along the X-axis direction) (the first cutting unit 23 is provided with a first cutting line network in the shape of "=" along the X-axis direction. ), the second cutting unit 25 performs side cutting along the second direction (ie along the Y axis direction) of the silicon rod on the second processing location (the second cutting unit 25 is provided with a "=" shape along the Y axis The second cutting wire mesh). Of course, in other embodiments, if the first cutting unit 23 is provided with a first cutting wire net in the shape of "=" in the second direction (that is, along the Y axis direction), the first cutting unit 23 performs the first processing The silicon rods in the location are cut along the side of the second direction (that is, along the Y-axis direction). Similarly, if the second cutting unit 25 is provided with a "="-shaped first direction (that is, along the X-axis direction) When the wire mesh is cut, the first cutting unit 23 cuts the silicon rod in the first processing area along the first direction (that is, along the X-axis direction). It can be seen that, in this embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22. By driving the common cutting support 22 to move up and down, the The first cutting unit 23 and the second cutting unit 25 respectively perform side-cutting of the silicon rods in the first processing area in the first direction (that is, along the X-axis direction) and the silicon rods in the second processing area at the same time. Perform a side cut in the second direction (ie along the Y axis direction). The cutting device 2 has a simple structure and convenient control as a whole, and can improve the efficiency and quality of silicon rod cutting.

It should be noted that, in this embodiment, the first cutting line 235 when the first cutting unit 23 performs side-cutting on the silicon rod 100 in the first direction and the second cutting unit 25 performs side-cutting on the silicon rod 100 in the second direction. The intersection of the second cutting line 255 is located in the cross-section of the silicon rod 100 (including the case where the intersection is located on the circumference of the cross-section), so that the square silicon rod is formed with the largest possible cross-section (the surface area of the silicon wafer obtained after subsequent slicing is larger Large), and can reduce material loss in subsequent grinding (such as grinding and chamfering, etc.) and improve the utilization of silicon materials. Please refer to FIGS. 19 and 20, where FIG. 19 shows the first cutting line when the first cutting unit performs side-cutting of the silicon rod in the first direction and the first cutting line when the second cutting unit performs side-cutting of the silicon rod in the second direction. The intersection of the two cutting lines is a schematic cross-sectional view inside the cross-section of the silicon rod. Figure 20 shows the first cutting line and the second cutting unit when the first cutting unit cuts the silicon rod in the first direction. A schematic cross-sectional view where the intersection of the second cutting line during side cutting is located on the cross-sectional circumference of the silicon rod, where 101 shown in FIGS. 19 and 20 is the edge skin formed after cutting the silicon rod.

Through the above-mentioned cutting device 2, the first cutting operation (first-direction side-cutting of the silicon rod 100 by the first cutting unit 23) and the second cutting operation (the second cutting unit 25 for the silicon rod 100 are performed on the silicon rod 100) After cutting the side in the second direction), a square silicon rod (that is, a silicon rod having a rectangular shape) is formed.

In this embodiment, according to the foregoing knowledge, the silicon rod will form a side crust after square-cutting. In order not to hinder the rise of the wire cutting device, the side crust needs to be discharged in time. For the unloading of the side crust, the general side crust Most of the unloading methods are manually operated by the operator to separate the edge skin from the prescribed silicon rod and move it out of the silicon rod formulation equipment. This is not only inefficient, but also causes the edge skin to interact with the prescribed silicon during the handling process. The rod collision increases the risk of damage to the prescribed silicon rod. In view of this, the integrated silicon rod cutting and grinding machine of the present application also includes an edge skin unloading device, which is used to discharge the edge skin formed after the wire cutting device performs square cutting on the silicon rod, that is, in this embodiment, The first cutting unit also includes a first edge skin unloading device for unloading the edge skin formed after the first cutting unit performs side-cutting of the silicon rod in the first direction; the second cutting The unit also includes a second side skin unloading device, which is used to discharge the side skin formed after the second cutting unit performs side-cutting of the silicon rod in the second direction.

Since the first side skin unloading device and the second side skin unloading device have the same structure, here, only the first side skin unloading device is taken as an example for description.

Generally, the first side skin unloading device may include a side skin lifting mechanism for lifting the side skin so that the top end of the side skin protrudes from the cut silicon rod. The side skin lifting mechanism includes a jacking member arranged on the first wire frame in the first cutting unit, the jacking member can be driven by a telescopic member to make a telescopic movement, and the jacking member is controlled to extend After exercise, hold the bottom of the side skin to lift the side skin.

In some embodiments, the jacking member includes an abutment plate and a support plate, the abutment plate extends upward from the bottom of the support plate, and further, the abutment plate may be a The arc-shaped plate adapted to the arc-shaped surface of the side skin can fully contact with the arc-shaped surface of the side skin when the abutment plate abuts against the side skin, and the contact position of the abutment plate and the side skin is A sleek design or a cushioning pad should be added to the inner surface of the abutment plate that contacts the side skin. The supporting plate is used to support the bottom of the side skin, and further, the supporting plate can be an arcuate plate that matches the bottom surface of the side skin. In other embodiments, the chord side of the arcuate plate as the supporting plate can be additionally provided with bumps to increase the contact area with the bottom surface of the side skin.

In some embodiments, the telescopic component may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the supporting plate in the jacking member through a connecting structure, and the air cylinder may drive the telescopic rod. The rod drives the jacking piece to make a telescopic movement. Here, the telescopic movement of the jacking member includes the contraction movement of the jacking member and the extension movement of the jacking member, wherein the contraction movement of the jacking member specifically refers to the air cylinder driving the telescopic movement. The rod shrinks to drive the jacking member away from the side skin, and the stretching movement of the jacking member specifically refers to the air cylinder driving the telescopic rod to extend to drive the jacking member to approach the side skin. Of course, the aforementioned telescopic component can also be implemented in other ways. For example, the telescopic component can also be, for example, a servo motor with a lead screw, which is connected to the jacking member and is driven by the servo motor. The lead screw rotates to drive the connected jacking member to make a telescopic movement, for example, driving the lead screw to rotate in a forward direction to drive the jacking member to make a contraction movement and driving the lead screw to rotate in a reverse direction to drive the jacking member Or, drive the screw to rotate in the forward direction to drive the jacking member to extend and drive the lead screw to rotate in the reverse direction to drive the jacking member to perform contraction. Regarding the specific structure and implementation of the first side skin unloading device, refer to patent publications such as CN208148230U.

In practical applications, in the initial state, the telescopic rod drives the jacking member to be in a contracted state, and the first cutting unit is driven to descend with the cutting support so that the first cutting line segment in the first cutting unit is positioned at the first The silicon rod in the processing area is cut sideways in the first direction until the first cutting line segment penetrates the silicon rod to complete the first direction side cutting of the silicon rod and form a side skin. At this time, the side skin lifting mechanism has followed the first wire frame Down to the bottom, the air cylinder drives the telescopic rod to extend to drive the jacking member close to the side skin until the abutment plate in the jacking member contacts the side skin and achieves abutment. A cutting unit is driven to follow the cutting support to rise, and the side skin lifting mechanism follows the cutting support to rise, driving the side skin to rise relative to the silicon rod that has been cut once, so that the top of the side skin protrudes from the silicon rod. Compared with the protruding part of the silicon rod, when the top of the silicon rod meets the set conditions, the cutting support can be controlled to stop rising. In this way, the top of the edge skin can be used as a force point for grasping, so that the edge skin can be grasped and discharged. Then, the air cylinder drives the telescopic rod to contract to drive the jacking member back to the initial state while controlling the cutting support to drive the first cutting unit and the edge lifting mechanism to continue to rise above the silicon rod to prepare for the next cutting operation.

In other embodiments, the side skin lifting mechanism may include a suction member and a telescopic member that drives the suction member to expand and contract. The suction member is controlled by the telescopic member to abut the side skin and adsorb the side. skin. The suction member may further include an abutting plate and a suction element. The abutment plate may be, for example, an arc-shaped plate that fits with the arc-shaped surface of the edge skin, and when the abutment plate is against the edge skin, it can interact with the arc-shaped surface of the edge skin. Full contact. The suction element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the abutment plate to be in contact with the edge skin. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking a cylinder with a telescopic rod as an example, the telescopic rod can be connected to the jacking member through a connecting structure. Connected to the backing plate, the air cylinder can drive the telescopic rod to shrink to drive the abutment plate away from the side skin, and the air cylinder can drive the telescopic rod to extend to drive the abutment plate close to the side skin and After the abutment plate is in contact with the edge skin, the suction element adsorbs the edge skin. Subsequently, the cutting support is driven to rise, the side skin lifting mechanism and the first cutting unit follow the cutting support to rise, and the side skin lifting mechanism uses the adsorption force to drive the side skin to rise and shift relative to the silicon rod, so that the side The top of the skin protrudes from the silicon rod.

In addition, the edge skin unloading device may further include a clamping and transferring unit, which is arranged above the machine base, and is used to clamp the top end of the edge skin and pull the edge skin to release the silicon rod and to remove the edge. The skin is transferred to the side skin discharge area.

In some embodiments, the clamping and transferring unit may include a moving mechanism that provides movement in at least one direction and a side leather clamping mechanism, and the side leather clamping mechanism is connected to the moving mechanism and is driven in at least one direction. mobile.

The edge skin clamping mechanism may include a lifting drive structure and a clamping assembly arranged at the bottom of the lifting drive structure.

Wherein, the lifting drive structure is used to drive the clamping assembly for lifting movement, the lifting drive structure may be, for example, a lifting cylinder with a lifting rod, the lifting rod is connected to the clamping assembly, and the lifting cylinder can be used to control the The lifting rod telescopes to drive the clamping assembly to move up and down, but it is not limited to this. For example, the lifting drive structure may also be a screw assembly driven by a motor, the screw assembly is connected to the clamping assembly, and the motor is used to drive the screw assembly up and down to drive the clamping assembly to move up and down.

The clamping assembly may include a cover body and a retractable clamping member, the retractable clamping member is provided inside the cover body, and a clamping place is formed between the clamping member and the cover body. The clamping space of the side skin. In an embodiment, the cover body is used to cover the edge skin, the coverable size of the cover body is slightly larger than the cross-sectional circle of the silicon rod to be cut, and the cover body is set as a closed or non-closed circular cover , But not limited to this.

The structure of the clamping assembly is not limited to this. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, between the clamping member and the arc-shaped plate A clamping space for clamping the edge skin is formed.

In the silicon rod cutting and grinding integrated machine shown in FIGS. 15 and 16, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, it is not limited to this. In other embodiments, the cutting device of the integrated silicon rod cutting and grinding machine of the present application can still be changed in other ways.

In some embodiments, the cutting device may include a first cutting device arranged in a first processing position of the silicon ingot processing platform and a second cutting device arranged in a second processing position of the silicon ingot processing platform , Wherein the first cutting device and the second cutting device are two independent devices.

The first cutting device includes: a first cutting frame, a first cutting support, and a first cutting unit.

The first cutting is installed on the machine base. The first cutting frame is a columnar structure or a frame structure, which serves as a support body of the first cutting device and can provide support for other components in the first cutting device.

The first cutting support is movably raised and lowered on the first cutting frame. In some embodiments, the first cutting support can be movably raised and lowered on the first cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the first cutting support by a lifting motor, a lifting rail, a lifting slider, etc., wherein the lifting rail is vertically arranged on the first cutting frame, and the lifting The sliding block is arranged on the back of the first cutting support and is matched with the lifting guide rail. In order to make the first cutting support to achieve a stable lifting installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are used. The two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the first cutting support can be moved up and down relative to the first cutting frame and the machine base by means of the lifting rail and the lifting sliding block.

The first cutting unit may include at least four first cutting wheels, and these four first cutting wheels may be combined into a pair of first cutting wheel sets, that is, two first cutting wheels are arranged oppositely along the first direction (that is, along the X-axis direction). A cutting wheel forms a first cutting wheel group, and two first cutting wheel groups arranged in the second direction (that is, along the Y-axis direction) form a pair of first cutting wheel groups. Specifically, the first cutting unit includes a pair of first cutting wheel sets, the pair of first cutting wheel sets may include two first cutting wheel sets, and the two first cutting wheel sets are along the second direction (that is, along the Y axis direction) are arranged on the left and right sides of the first wire frame, wherein a first cutting wheel set is located on the left side of the first wire frame and includes two first cutting wheels arranged along the first direction (that is, along the X axis direction). One cutting wheel and the other first cutting wheel set are located on the right side of the first wire frame and include two first cutting wheels arranged along the first direction (that is, along the X-axis direction). The first cutting line is sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting line web. In practical applications, the first cutting line is sequentially wound around the four first cutting wheels in the first cutting unit to form two first cutting line segments. The two first cutting line segments are along the first direction (ie along the X-axis direction) are arranged and parallel to each other to form the first cutting wire net. Specifically, the first cutting line is wound around two first cutting wheels arranged in a first direction (that is, along the X-axis direction) in a first cutting wheel set to form a first cutting line segment, and the first cutting line is wound Another first cutting line segment is formed after the two first cutting wheels arranged along the first direction (that is, along the X-axis direction) in another first cutting wheel group. In this way, the two first cutting line segments that are parallel to each other cooperate to form a first cutting line net in the shape of "=" along the first direction (that is, along the X-axis direction).

Of course, in some embodiments, the position, direction, and number of the first cutting wheel and the first cutting line segment in the first cutting unit can also be changed in other ways.

The second cutting device includes: a second cutting frame, a second cutting support, and a second cutting unit.

The second cutting is erected on the machine base. The second cutting frame is a columnar structure or a frame structure, which serves as a support body of the second cutting device and can provide support for other components in the second cutting device.

The second cutting support is movably raised and lowered on the second cutting frame. In some embodiments, the second cutting support can be movably raised and lowered on the second cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the second cutting support by a lifting motor, a lifting rail, a lifting slider, etc., wherein the lifting rail is vertically arranged on the second cutting frame, and the lifting The sliding block is arranged on the back of the second cutting support and is matched with the lifting guide rail. In order to make the second cutting support a stable lifting installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are used. The two lifting rails are arranged in parallel. Driven by the lifting motor (the lifting motor may be, for example, a servo motor), the second cutting support can be moved up and down relative to the second cutting frame and the machine base by means of the lifting rail and the lifting sliding block.

The second cutting unit may include at least four second cutting wheels, and the four second cutting wheels may be combined into a pair of second cutting wheel sets, that is, two cutting wheels are arranged opposite to each other in the second direction (that is, along the Y-axis direction). Two second cutting wheels form a second cutting wheel group, and two second cutting wheel groups arranged along the first direction (that is, along the X-axis direction) form a pair of second cutting wheel groups. Specifically, the second cutting unit includes a pair of second cutting wheel sets, and the pair of second cutting wheel sets may include two second cutting wheel sets, and the two second cutting wheel sets are along the first direction (ie along X-axis direction) are arranged on the left and right sides of the second wire frame. One second cutting wheel set is located on the left side of the second wire frame and includes two second cutting wheels arranged along the second direction (ie along the Y axis direction). The other second cutting wheel group is located on the right side of the second wire frame and includes two second cutting wheels arranged along the second direction (ie along the Y-axis direction). The second cutting line is sequentially wound around each second cutting wheel in the second cutting unit to form a second cutting line web. In practical applications, the second cutting line is sequentially wound around the four second cutting wheels in the second cutting unit to form two second cutting line segments. The two second cutting line segments are along the second direction (ie along the Y axis direction) are arranged and parallel to each other to form a second cutting wire net. Specifically, the second cutting line is wound around two second cutting wheels arranged in the second direction (that is, along the Y-axis direction) in a second cutting wheel set to form a second cutting line segment, and the second cutting line is wound Another second cutting line segment is formed after the two second cutting wheels arranged in the second direction (that is, along the Y axis direction) in another second cutting wheel group. In this way, the two parallel second cutting line segments cooperate to form a second cutting line net in the shape of "=" in the second direction (that is, along the Y-axis direction).

Of course, in some embodiments, the position, direction, and number of the second cutting wheel and the second cutting line segment in the second cutting unit can also be changed in other ways.

The grinding device 3 is arranged on the machine base 1 and is used for grinding the square silicon rods on the third processing area of the silicon rod processing platform that have been square-cut. In this embodiment, the grinding operation includes surface grinding and chamfering.

The grinding device 3 has an accommodating space for receiving the silicon rods that have been converted from the second processing area to the third processing area by the silicon rod conversion device 4. The grinding device 3 mainly includes a grinding frame 31 and at least a pair of abrasive tools 33. The at least one pair of abrasive tools 33 are oppositely arranged on the grinding frame 31 and used for squaring the silicon that is located at the third processing zone. The rod performs grinding operations.

In this embodiment, the cross-section of the silicon rod that has been square-cut is square (the silicon rod is a rectangular-like body as a whole), and has four vertical cut surfaces and four connecting edge surfaces. Therefore, the grinding tools 33 are at least oppositely arranged. One pair, there is an accommodating space for accommodating silicon rods 200 between the two. After the silicon rods 200 are converted to the third processing position and located in the accommodating space between the at least one pile of abrasive tools 33, the at least one pair The abrasive tool 33 can contact a pair of opposite vertical cut surfaces or a pair of connecting edge surfaces in the silicon rod 200, and then move up and down to grind.

Wherein, the grinding frame 31 can be slidably installed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least one direction. For example, the sliding mechanism can realize the sliding movement of the grinding frame 31 in the first direction (that is, along the X-axis direction). Specifically, the sliding mechanism may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction drive source. The first direction driving source may be, for example, a driving motor.

The grinding tool 33 can be slidably arranged on the grinding frame 31 through a sliding mechanism.

In some embodiments, at least a pair of abrasive tools 33 in the grinding device 3 are independently arranged. Taking a pair of abrasive tools 33 as an example, the two abrasive tools 33 are slidably disposed on the grinding frame 31 through respective sliding mechanisms, wherein the sliding mechanisms can realize sliding in at least two directions. Specifically, the sliding mechanism may include a first sliding unit and a second sliding unit, wherein the first sliding unit is a lifting sliding unit, including a lifting rail provided on the grinding frame 31, A lifting slider or sliding bar on a movable mounting frame and a lifting driving source. The lifting driving source may be, for example, a driving motor. The second sliding unit includes a second-direction guide rail (the second direction is the Y-axis direction as shown in FIG. 16) provided on the movable mounting frame, and a second-direction slide provided on the abrasive tool 33 Block or slider, and a second direction drive source. The second direction driving source may be, for example, a driving motor.

In some embodiments, at least a pair of abrasive tools 33 in the grinding device 3 are arranged in combination. Taking a pair of abrasive tools 33 as an example, the two abrasive tools 33 are slidably arranged on the grinding frame 31 through a sliding mechanism, wherein the sliding mechanism can realize sliding movement in at least two directions. Specifically, the sliding mechanism may include a first sliding unit and a second sliding unit, wherein the first sliding unit is a lifting sliding unit, including a lifting rail provided on the grinding frame 31, A lifting slide or sliding bar on a shared movable mounting frame and a lifting drive source. The lifting driving source may be, for example, a driving motor. The two abrasive tools 33 are slidably mounted on the common movable mounting frame through a second sliding unit, and the second sliding unit includes a second direction guide rail (the first The two directions are the Y-axis direction as shown in FIG. 16), the second-direction slider or slider provided on the abrasive tool 33, and the second-direction drive source. The second direction driving source may be, for example, a driving motor.

In this embodiment, the grinding frame 31 can be slidably installed on the machine base 1 through a sliding mechanism to realize the advance and retreat of the grinding frame 31, that is, close to the silicon rod or far away from the silicon rod. The grinding tool 33 can be slid on the grinding frame 31 through the first sliding unit to realize the lifting of the grinding tool 33, and the grinding tool 33 can also be slidably mounted on the grinding frame 31 through the second sliding unit to realize the advance and retreat of the grinding tool 33 , That is, close to the silicon rod or far away from the silicon rod, control the amount of grinding of the silicon rod.

In some embodiments, the abrasive tool may include a spindle and at least one grinding wheel, wherein at least one grinding wheel is disposed at the working end of the spindle.

In particular, as shown in FIG. 16, in this embodiment, each abrasive tool 33 in the polishing device 3 has a double-head structure. Specifically, each grinding tool includes: a rotating chassis; a double-headed spindle 332 arranged on the rotating chassis, the first end of the double-headed spindle 332 is provided with a rough grinding wheel 331, and the second end of the double-headed spindle 332 is provided with Fine grinding wheel 333; a driving motor for driving the rotating chassis to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed spindle 332 can be exchanged. In practical applications, during grinding, the rough grinding wheel 331 of the double-headed spindle 332 in the at least one pair of grinding tools 33 in the grinding device 3 is used to rough grinding the silicon rod 200 that has been square-cut, and then drive to rotate The type chassis is rotated so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed spindle 332 can be exchanged. The square is completed by using at least one pair of grinding tools 33 in the grinding device 3 The cut silicon rod 200 is subjected to a fine grinding operation. Wherein, the rough grinding operation may include rough grinding the vertical cut surface of the silicon rod 200 that has been square-cut and rough chamfering the connecting edge surface, and the fine grinding operation may include rough-cutting the silicon rod 200 that has been square-cut. The vertical cut surface of the rod 200 is finely ground and the connecting edge surface is finely chamfered.

Take the rough grinding of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: first use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 The silicon rod 200 is positioned and adjusted to make the grinding frame 31 move in the first direction (that is, along the X-axis direction) toward the silicon rod 200 relative to the base 1, so that the silicon rod 200 is located between the two grinding tools 33 of the pair of grinding tools 33 That is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the grinding device 3; the abrasive tool 33 relative to the grinding frame 31 along the second direction (ie along the Y axis) ) Feed, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to coarsely grind the first pair of vertical sections in the silicon rod 200; driven by the rotating bearing table 431 in the silicon rod positioning mechanism 43 The silicon rod 200 is rotated 90° in the forward (or reverse) direction, so that the second pair of vertical sections in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3. The rough grinding wheel 331 in the grinding tool 33 is rotated and the grinding wheel 331 is driven. The tool 33 moves up and down to coarsely grind the second pair of vertical cut surfaces in the silicon rod 200.

The rough grinding operation of any pair of vertical cut surfaces may include, for example, providing a feed rate and driving the rough grinding wheels 331 in the pair of grinding tools 33 to move from top to bottom to grind a pair of vertical cut surfaces of the silicon rod; After grinding the rough grinding wheel 331 to the bottom of the silicon rod and passing through the silicon rod, it stays at the lower limit, and then increases the feed rate to drive a pair of rough grinding wheels 331 to move from bottom to top to grind the silicon rod; a pair of rough grinding After the wheel 331 grinds to the top of the silicon rod and passes through the silicon rod, it stays at the upper limit and continues to increase the feed amount, driving a pair of rough grinding wheels 331 to move from top to bottom to grind the silicon rod; in this way, grinding, increase the feed Reverse grinding, increase the feed rate, and after repeated several times, a pair of vertical cut surfaces of the silicon rod can be ground to the preset size.

Take the rough chamfering of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: initially, when the silicon rod conversion device 4 transfers the silicon rod 200 to the first processing location, the vertical cut surface of the silicon rod 200 corresponds to For the pair of abrasive tools 33 in the grinding device 3, therefore, the positioning and adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may include, for example, driving the silicon rod 200 to rotate forward (or reverse) by 45°, so that the silicon rod 200 The first pair of connecting edge surfaces corresponds to a pair of abrasive tools 33 in the grinding device 3; the grinding frame 31 is moved toward the silicon rod 200 relative to the base 1 in the first direction (that is, along the X-axis direction), so that the silicon rod 200 Located between the two abrasive tools 33 of the pair of abrasive tools 33, that is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the polishing device 3; The amount of feed is fed along the second direction (that is, along the Y-axis direction). The rough grinding wheel 331 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform the first pair of connecting edge surfaces in the silicon rod 200. Sub-rough cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 5°, the coarse grinding wheel 331 in the grinding tool 33 is rotated and the grinding tool 33 is driven up and down to align the first pair of connecting edge faces in the silicon rod 200 Carry out the second rough cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate 80° in the forward direction, so that the second pair of connecting edges in the silicon rod 200 corresponds to the pair of abrasive tools 33 in the grinding device 3, and rotates The rough grinding wheel 331 in the grinding tool 33 drives the grinding tool 33 to move up and down to perform the first rough cutting of the second pair of connecting edge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forward 5 °, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform a second rough cutting on the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 Rotate the rough grinding wheel 331 in the grinding tool 33 by 5°, and drive the grinding tool 33 to move up and down to perform the third rough cutting on the second pair of connecting ridges in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon The rod 200 rotates 80° in the forward direction, rotates the rough grinding wheel 331 in the abrasive tool 33 and drives the abrasive tool 33 to move up and down to perform a third rough cut on the first pair of connecting edge faces in the silicon rod 200.

It should be noted that in the rough chamfering operation of the connecting edge surface, the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate by a corresponding angle, for example: the first silicon rod positioning mechanism 53 drives the first silicon rod 101 Forward rotation of 5° is not the only way to achieve it. In other optional embodiments, the adjustment angle can be adapted, for example, 3° to 7°, including 3°, 4°, 5°, 6°, 7° or For other angles, correspondingly, when the first silicon rod 101 is driven by the first silicon rod positioning mechanism 53 to rotate 80° in the forward direction, the angle is adjusted adaptively.

Take the fine grinding of the vertical cut surface of the silicon rod 200 that has been square-cut as an example: first use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 The silicon rod 200 is positioned and adjusted to make the grinding frame 31 move in the first direction (that is, along the X-axis direction) toward the silicon rod 200 relative to the base 1, so that the silicon rod 200 is located between the two grinding tools 33 of the pair of grinding tools 33 That is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the grinding device 3; the abrasive tool 33 relative to the grinding frame 31 along the second direction (ie along the Y axis) ) Feed, rotate the fine grinding wheel 333 in the abrasive tool 33 and drive the abrasive tool 33 to move up and down to finely grind the first pair of vertical sections in the silicon rod 200; driven by the rotating bearing table 431 in the silicon rod positioning mechanism 43 The silicon rod 200 is rotated 90° in the forward (or reverse) direction, so that the second pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3. The fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding wheel 333 is driven. The tool 33 moves up and down to fine grind the second pair of vertical sections in the silicon rod 200.

Wherein, the finishing operation of any pair of vertical cut surfaces may include, for example, providing a feed rate and driving the fine grinding wheel 333 in a pair of abrasive tools 33 to move from top to bottom to grind a pair of vertical cut surfaces of the silicon rod; After grinding the fine grinding wheel 333 to the bottom of the silicon rod and passing through the silicon rod, it stays at the lower limit, and then increases the feed rate to drive a pair of fine grinding wheels 333 to move from bottom to top to grind the silicon rod; a pair of fine grinding wheels After the wheel 333 grinds to the top of the silicon rod and passes through the silicon rod, it stays at the upper limit and continues to increase the feed amount, driving a pair of fine grinding wheels 333 to move from top to bottom to grind the silicon rod; thus, grinding, increase the feed Reverse grinding, increase the feed rate, and after repeated several times, a pair of vertical cut surfaces of the silicon rod can be ground to the preset size.

Take the fine chamfering of the vertical cut surface of the silicon rod 200 that has been squared as an example: initially, when the silicon rod conversion device 4 transfers the silicon rod 200 to the first processing area, the vertical cut surface of the silicon rod 200 corresponds to For the pair of abrasive tools 33 in the grinding device 3, therefore, the positioning and adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may include, for example, driving the silicon rod 200 to rotate forward (or reverse) by 45°, so that the silicon rod 200 The first pair of connecting edge surfaces corresponds to a pair of abrasive tools 33 in the grinding device 3; the grinding frame 31 is moved toward the silicon rod 200 relative to the base 1 in the first direction (that is, along the X-axis direction), so that the silicon rod 200 Located between the two abrasive tools 33 of the pair of abrasive tools 33, that is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to the pair of abrasive tools 33 in the polishing device 3; The amount of feed is fed along the second direction (that is, along the Y-axis direction). The fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform the first pair of connecting edge surfaces in the silicon rod 200. Second precision cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 5°, the fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to align the first pair of connecting edges in the silicon rod 200 Carry out the second fine cutting; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate 80° in the forward direction, so that the second pair of connecting edges in the silicon rod 200 corresponds to the pair of abrasive tools 33 in the grinding device 3, and rotates The fine grinding wheel 333 in the grinding tool 33 drives the grinding tool 33 to move up and down to perform the first fine cutting of the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forward 5 °, rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform the second fine cutting of the second pair of connecting ridge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 Rotate 5° to rotate the fine grinding wheel 333 in the abrasive tool 33 and drive the abrasive tool 33 to move up and down to perform the third fine-cutting on the second pair of connecting edge faces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon The rod 200 rotates 80° in the forward direction, rotates the fine grinding wheel 333 in the abrasive tool 33 and drives the abrasive tool 33 to move up and down to perform the third fine cutting on the first pair of connecting edge faces in the silicon rod 200.

It should be noted that the foregoing is only an exemplary description, and is not intended to limit the scope of protection of the present application. For example, in the description of the grinding operation as a grinding device, the surface grinding operation of the silicon rod is performed first and then the polycrystalline silicon rod is reversed. The corner operation is not limited to this. In other embodiments, it is also feasible to perform the chamfering operation of the silicon rod first and then the surface grinding operation of the silicon rod, which should still fall within the protection scope of this application.

Subsequently, after the silicon rod 200 is polished by the polishing device 3, the silicon rod conversion device 4 converts the silicon rod 200 from the third processing position to the waiting position, and the silicon rod loading and unloading device removes the processed silicon rod from the silicon rod. The waiting area of the rod processing platform is unloaded. Of course, before unloading the silicon rod 200, if necessary, in the waiting area, the silicon rod 200 after the processing operation can be inspected by the inspection device, for example, a flatness detector is used to inspect the flatness of the silicon rod. Using the flatness tester, on the one hand, the flatness of the silicon rod 200 can be inspected to check whether the silicon rod meets the product requirements after each processing operation, so as to determine the effect of each processing operation; The plane flatness detection of 200 can also indirectly obtain the wear status of the processed parts in each processing device, so as to facilitate real-time calibration or correction, and even repair or replacement.

Furthermore, in the integrated cutting and grinding machine of the present application, in an optional embodiment, a silicon rod cleaning device may also be included. The silicon rod cleaning device can be arranged on the machine base for cleaning and cleaning silicon rods. Regarding the silicon rod cleaning device, generally, after the silicon rod undergoes the above processing operations, the cutting debris generated during the operation will adhere to the surface of the silicon rod. Therefore, when necessary, the silicon rod needs to be cleaned as necessary. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning fluid spraying device matched with the cleaning brush head. During cleaning, the cleaning fluid spraying device sprays the cleaning fluid against the silicon rod, and at the same time, The motor-driven cleaning brush head acts on the silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid may be pure water, for example, and the cleaning brush head may be, for example, a rotary brush head.

In addition, the cutting-grinding integrated machine of this application, in particular, needs to be pointed out that if the cutting-grinding integrated machine adds or reduces the corresponding processing equipment, then the functional area on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body The number and their positional relationship need to be adjusted accordingly.

In some embodiments, it is assumed that the silicon rod multi-station processing machine eliminates the waiting area, and the silicon rod conversion device also reduces a silicon rod positioning mechanism correspondingly. Further, preferably, the angles set between the three silicon rod positioning mechanisms are also consistent with the angle distribution between the three functional regions. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional location, the other two silicon rod positioning mechanisms also correspond to the other two functional locations respectively. In this way, in the pipeline operation, at any time, when each silicon rod positioning mechanism is positioned with a silicon rod and the silicon rod positioning mechanism corresponds to a functional location, these silicon rods are located in a corresponding functional location. Corresponding processing operations are being carried out. In an optional embodiment, the three functional areas on the silicon rod processing platform are distributed at 120° between each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the conveying body are two by two. The space is also distributed at 120°.

In addition, the cutting-grinding integrated machine of this application, in particular, needs to be pointed out that if the cutting-grinding integrated machine is equipped with a corresponding processing operation device, then the functional area on the silicon rod processing platform and the number of silicon rod positioning mechanisms on the conveying body The positional relationship needs to be adjusted accordingly. Assuming that a processing device is added to the silicon ingot multi-station processing machine, a functional area will be added to the silicon ingot processing platform and a silicon ingot positioning mechanism is also added to the silicon ingot conversion device. Further, preferably, the angles set between the five silicon rod positioning mechanisms are also consistent with the angle distribution between the five functional regions. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional location, the other four silicon rod positioning mechanisms also correspond to the other four functional locations respectively. In this way, in the pipeline operation, at any time, when each silicon rod positioning mechanism is positioned with a silicon rod and the silicon rod positioning mechanism corresponds to a functional location, these silicon rods are located in a corresponding functional location. Corresponding processing operations are being carried out. In an alternative embodiment, the five functional areas on the silicon rod processing platform are distributed at 72° in pairs. Therefore, correspondingly, the four silicon rod positioning mechanisms on the conveying body are two by two. The space is also distributed at 72°.

The silicon rod cutting and grinding integrated machine disclosed in this application integrates a cutting device and a grinding device. The silicon rod conversion device can be used to transfer the silicon rods between the various processing devices in an orderly and seamless manner. The rod is cut twice on the side to form a square silicon rod, and the square silicon rod after the square-cutting is ground by a grinding device, so as to complete the multi-process integrated operation of silicon rod square-cutting and grinding, and improve production efficiency and products The quality of processing operations.

The application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine.

In some embodiments, as shown in FIG. 16, the integrated silicon rod cutting and grinding machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a waiting area, a first processing area, and a second processing area. Location, and a third processing location, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device, the waiting location, the first processing location, the second processing location, and the second processing location of the silicon rod processing platform The three processing areas are distributed at 90° between each other. In this embodiment, it is assumed that the direction according to the sequence of the waiting location, the first processing location, the second processing location, and the third processing location is defined as a positive direction.

The silicon rod cutting and grinding method of this application may at least include the following steps:

Step S101, loading the first silicon rod in the waiting area, and preprocessing the first silicon rod. In this embodiment, in step S101, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the waiting area of the silicon rod processing platform.

For details, please refer to FIGS. 21 and 22. The silicon rod transfer device 6 may be used to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform. For the specific method of transferring the first silicon rod 100 to be processed to the waiting area of the silicon rod platform by the silicon rod transfer device 6, please refer to the foregoing description, which will not be repeated here.

In addition, the pre-processing may include using a positioning detection device to perform edge line detection and center positioning of the first silicon rod located at the waiting area.

In step S103, the silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the waiting area to the first processing area, and the cutting device is caused to perform side-cutting in the first direction on the first silicon rod in the first processing area At this stage, the second silicon rod is loaded in the waiting area and the second silicon rod is pretreated.

In step S103, since the waiting area is 90° with respect to the first processing area, the first predetermined angle for rotating the silicon rod conversion device is to make the silicon rod conversion device rotate 90° forward. .

For details, please refer to FIGS. 22 and 23, the silicon rod conversion device 4 is rotated 90° in the forward direction (ie, the clockwise arrow in FIG. 22), and the first silicon rod 100 to be processed is converted from the waiting position in FIG. 22 to FIG. 23 The first processing location in.

In this way, the cutting device 2 in the embodiment shown in FIG. 23 can be used to cut the first silicon rod 100 at the first processing location.

When the cutting device 2 in the embodiment shown in FIG. 23 is used to cut the first silicon rod 100 in the first processing area, in conjunction with FIG. 15, the cutting support 22 is driven to descend relative to the cutting frame 21, and the cutting support 22 is The first cutting unit 23 on one side cuts the first silicon rod 100 in the first processing area along the X-axis direction (the first cutting unit is provided with a first cutting line in the shape of "=" along the X-axis network).

As for loading the second silicon rod 102 in the waiting area and pre-processing the second silicon rod 102, please refer to the description of the first silicon rod 100 in step S101, which will not be repeated here.

Step S105, the silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod from the waiting position to the first processing position, so that the cutting device Perform side cutting in the second direction on the first silicon rod in the second processing area and perform side cutting in the first direction on the second silicon rod in the first processing area. At this stage, load the third silicon rod in the waiting area. Location and pretreatment of the third silicon rod.

In step S105, since the waiting area, the first processing area, and the second processing area of the silicon rod processing platform are sequentially different by 90°, the first predetermined angle for rotating the silicon rod conversion device is The silicon rod conversion device rotates 90° in the forward direction.

For details, please refer to FIGS. 23 and 24, the silicon rod conversion device 4 is rotated 90° in the forward direction (ie, the clockwise arrow in FIG. 23), and the first silicon rod 100 is converted from the first processing position to the second processing position and the second processing position is changed. The two silicon rods 102 are converted from the waiting position to the first processing position.

In this way, the cutting device 2 in the embodiment shown in FIG. 24 can be used to cut the first silicon rod 100 on the second processing position of the silicon rod processing platform and the second silicon rod 102 on the first processing position.

When the cutting device 2 in the embodiment shown in FIG. 24 is used to cut the first silicon rod 100 on the second processing area of the silicon rod processing platform and the second silicon rod 102 on the first processing area, in conjunction with FIG. 1, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the second silicon rod 102 and the second processing on the corresponding first processing location. The first silicon rod 100 at the location is cut, wherein the first cutting unit 23 performs side cutting along the X-axis direction on the second silicon rod 102 at the first processing location (the first cutting unit 23 is provided along the X-axis direction The first cutting wire mesh in the shape of "="), the second cutting unit 25 performs side-cutting along the Y axis on the first silicon rod 100 in the second processing position (the second cutting unit 25 is provided along the Y axis The second cutting wire net with the direction of "=""). It should be noted that before the second cutting unit 25 is used to cut the first silicon rod 100 in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, a silicon rod conversion device is also required The silicon rod positioning mechanism 43 in 4 drives the first silicon rod 100 to rotate 90° forward or backward to adjust the cutting surface. In this way, after the first silicon rod 100 located in the second processing area is cut along the Y-axis direction by the second cutting unit 25, a square silicon rod is formed as a whole.

As for loading the third silicon rod 104 in the waiting area and preprocessing the third silicon rod 104, please refer to the description of the first silicon rod 100 in step S101, which will not be repeated here.

Step S107, the silicon rod conversion device is made to rotate the first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, to convert the second silicon rod from the first processing position to the second processing position, and to change The third silicon rod is switched from the waiting area to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to grind and chamfer the first silicon rod in the third processing area. The second silicon rod is cut in the second direction and the third silicon rod in the first processing area is cut in the first direction. At the same time, the fourth silicon rod is loaded in the waiting area and the fourth silicon rod is Pretreatment.

In step S107, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are sequentially different from each other by 90°, the first preset that causes the silicon rod conversion device to rotate Set the angle to make the silicon rod conversion device rotate 90° in the forward direction

For details, please refer to Figures 24 and 25. The silicon rod conversion device 4 is rotated 90° in the forward direction (ie, the clockwise arrow in Figure 24) to convert the first silicon rod 100 from the second processing position to the third processing position, and The two silicon rods 102 are converted from the first processing location to the second processing location, and the third silicon rods 104 are converted from the waiting location to the first processing location.

In this way, the grinding device 3 in the embodiment shown in FIG. 25 can be used to perform grinding operations on the first silicon rod 100 on the third processing position of the silicon rod processing platform. For the specific manner of using the grinding device 3 to perform the grinding operation on the first silicon rod 100 on the third processing position of the silicon rod processing platform, please refer to the foregoing description, and will not be repeated here.

At the same time, the cutting device 2 in the embodiment shown in FIG. 25 can be used to cut the third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location of the silicon rod processing platform.

When the cutting device 2 in the embodiment shown in FIG. 25 is used to cut the third silicon rod 104 on the first processing area and the second silicon rod 102 on the second processing area of the silicon rod processing platform, in conjunction with FIG. 15, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the third silicon rod 104 and the second processing position on the corresponding first processing area. The second silicon rod 102 at the location is cut, wherein the first cutting unit 23 performs side cutting along the X-axis direction on the third silicon rod 104 at the first processing location (the first cutting unit 23 is provided along the X-axis direction). The first cutting wire mesh in the shape of "="), the second cutting unit 25 performs side-cutting along the Y axis on the second silicon rod 102 in the second processing area (the second cutting unit 25 is provided along the Y axis The second cutting wire net with the direction of "=""). Among them, it should be noted that before the second cutting unit 25 is used to cut the second silicon rod 102 in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, a silicon rod conversion device is also needed. The silicon rod positioning mechanism 43 in 4 drives the second silicon rod 102 to rotate 90° forward or backward to adjust the cutting surface. In this way, after the second silicon rod 102 located in the second processing area is cut along the Y-axis direction by the second cutting unit 25, a square silicon rod is formed as a whole.

As for loading the fourth silicon rod 106 in the waiting area and preprocessing the fourth silicon rod 106, please refer to the description of the first silicon rod 100 in step S101, which is not repeated here.

Step S109, the silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the waiting position, the second silicon rod from the second processing position to the third processing position, and the third The silicon rod is converted from the first processing area to the second processing area, the fourth silicon rod is converted from the waiting area to the first processing area, the first silicon rod is unloaded from the waiting area and the fifth silicon rod is loaded. The silicon rod is pretreated. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to perform the second operation on the third silicon rod in the second processing area. Directional side cutting and first directional side cutting of the fourth silicon rod in the first processing area.

In step S109, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are sequentially different from each other by 90°, the first preset that causes the silicon rod conversion device to rotate The angle is to make the silicon rod conversion device rotate 90° in the forward direction or 270° in the reverse direction. Among them, making the silicon rod conversion device rotate 270° in the reverse direction can make the silicon rod conversion device return to the initial position and release the cable entangled during the forward rotation.

For details, please refer to FIGS. 25 and 26, the silicon rod conversion device 4 is rotated in the reverse direction (ie, the counterclockwise arrow in FIG. 24) by 270° to convert the first silicon rod 100 from the third processing position to the waiting position, and the second silicon rod 102 is converted from the second processing location to the third processing location, the third silicon rod 104 is converted from the first processing location to the second processing location, and the fourth silicon rod 106 is converted from the waiting location to the first processing location.

In this way, the silicon rod transfer device 6 can be used to transfer the processed first silicon rod 100 in the waiting area from the silicon rod processing platform, and transfer the fifth silicon rod 108 to be processed to the silicon rod processing platform The waiting area (as shown in Figure 27).

At the same time, the grinding device 3 in the embodiment shown in FIG. 26 may be used to perform grinding operations on the second silicon rod 102 on the third processing position of the silicon rod processing platform. For the specific manner of using the grinding device 3 to perform the grinding operation on the second silicon rod 102 on the third processing position of the silicon rod processing platform, please refer to the foregoing description, which will not be repeated here.

At the same time, the cutting device 2 in the embodiment shown in FIG. 26 can be used to cut the fourth silicon rod 106 on the first processing location of the silicon rod processing platform and the third silicon rod 104 on the second processing location.

When the cutting device 2 in the embodiment shown in FIG. 26 is used to cut the fourth silicon rod 106 on the first processing location of the silicon rod processing platform and the third silicon rod 104 on the second processing location, in conjunction with FIG. 1, The cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously process the fourth silicon rod 106 and the second processing on the corresponding first processing area. The third silicon rod 104 on the location is cut, wherein the first cutting unit 23 performs side cutting along the X-axis direction on the fourth silicon rod 106 on the first processing location (the first cutting unit 23 is provided along the X-axis direction The first cutting wire mesh in the shape of "="), the second cutting unit 25 performs side-cutting along the Y axis on the third silicon rod 104 in the second processing position (the second cutting unit 25 is provided along the Y axis The second cutting wire net with the direction of "=""). Among them, it should be noted that before the second cutting unit 25 is used to cut the third silicon rod 104 in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, a silicon rod conversion device is needed. The silicon rod positioning mechanism 43 in 4 drives the third silicon rod 104 to rotate 90° forward or reverse to adjust the cutting surface. In this way, after the third silicon rod 104 located in the second processing area is cut along the Y-axis direction by the second cutting unit 25, a square silicon rod is formed as a whole.

In some embodiments, the integrated silicon rod cutting and grinding machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing zone, a second processing zone, and a third processing zone. The silicon rod cutting and grinding integrated machine also includes a cutting device, a grinding device, and a silicon rod conversion device. The first processing position, the second processing position and the third processing position of the silicon rod processing platform are 120° between each other. distributed. In this embodiment, it is assumed that the direction according to the sequence of the first processing location, the second processing location and the third processing location is defined as a positive direction.

The silicon rod cutting and grinding method of this application may at least include the following steps:

In step S201, the first silicon rod is loaded in the first processing area, and the cutting device is caused to perform side-cutting in the first direction on the first silicon rod in the first processing area.

In this embodiment, in step S201, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the first processing position of the silicon rod processing platform.

When the cutting device is used to cut the first silicon rod in the first processing area, the cutting support is driven to descend relative to the cutting frame, and the first cutting units on the left and right sides of the cutting support are used to cut the first silicon in the first processing area. The rod performs side cutting along the X-axis direction (the first cutting unit is provided with a first cutting wire net in the shape of "=" along the X-axis direction).

In step S203, the silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod to the first processing position, so that the cutting device can The first silicon rod in the second processing area is subjected to side cutting in the second direction and the second silicon rod in the first processing area is subjected to side cutting in the first direction.

In step S203, since the waiting area is 120° from the first processing area to which it belongs, the first predetermined angle for rotating the silicon rod conversion device is to make the silicon rod conversion device rotate forward by 120° .

When the cutting device is used to cut the second silicon rod on the first processing area and the second silicon rod on the first processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame, and the cutting support The first cutting unit and the second cutting unit on the side simultaneously cut the second silicon rod in the corresponding first processing area and the first silicon rod in the second processing area, wherein the first cutting unit cuts the first silicon rod in the first processing area. The second silicon rod on the upper side cuts along the X-axis direction (the first cutting unit is provided with a first cutting wire net in the shape of "=" along the X-axis direction), and the second cutting unit cuts on the side of the second processing zone The first silicon rod performs side cutting along the Y-axis direction (the second cutting unit 25 is provided with a second cutting wire net in the shape of "=" along the Y-axis direction). Among them, it should be noted that before using the second cutting unit to cut the side of the first silicon rod in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, it is also necessary to use the silicon rod conversion device The silicon rod positioning mechanism drives the first silicon rod to rotate 90° forward or reverse to adjust the cutting surface.

Step S205, the silicon rod conversion device is made to rotate the first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, to convert the second silicon rod from the first processing position to the second processing position, and to change The third silicon rod is converted to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod on the third processing area. At this stage, the cutting device is made to grind and chamfer the second silicon rod on the second processing area. The silicon rod is subjected to side cutting in the second direction and the third silicon rod in the first processing area is subjected to side cutting in the first direction.

In step S205, since the first processing location, the second processing location, and the second processing location of the silicon rod processing platform are sequentially different by 90°, the first predetermined angle for rotating the silicon rod conversion device is It is to make the silicon rod conversion device rotate 90° in the forward direction.

The grinding device can be used for grinding the first silicon rod on the third processing zone of the silicon rod processing platform.

When the cutting device is used to cut the third silicon rod on the first processing area and the second silicon rod on the second processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame. The first cutting unit and the second cutting unit on the side simultaneously cut the third silicon rod in the corresponding first processing area and the second silicon rod in the second processing area, wherein the first cutting unit cuts the first processing area The third silicon rod on the upper side cuts along the X-axis direction (the first cutting unit is provided with a first cutting wire net in the shape of "=" along the X-axis direction), and the second cutting unit cuts the The second silicon rod performs side cutting along the Y-axis direction (the second cutting unit is provided with a second cutting wire net in the shape of "=" along the Y-axis direction). Among them, it should be noted that before using the second cutting unit to cut the second silicon rod in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, it is also necessary to use the silicon rod conversion device The silicon rod positioning mechanism drives the second silicon rod to rotate 90° forward or backward to adjust the cutting surface.

In step S207, the silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the first processing position, the second silicon rod from the second processing position to the third processing position, and The third silicon rod is converted from the first processing area to the second processing area, the first silicon rod is unloaded from the first processing area and the fourth silicon rod is loaded, so that the cutting device performs the first processing on the fourth silicon rod in the first processing area. Side cutting in one direction. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to perform the second direction on the third silicon rod in the second processing area. Side cutting.

In step S207, since the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are sequentially different by 120°, the first predetermined angle for rotating the silicon rod conversion device is It is to make the silicon rod conversion device rotate 120° in the forward direction or 240° in the reverse direction. Among them, making the silicon rod conversion device rotate 240° in the reverse direction can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation.

In step S207, the silicon rod transfer device may be used to transfer the processed first silicon rod in the first processing location out of the silicon rod processing platform, and transfer the fourth silicon rod to be processed to the silicon rod The waiting area of the processing platform.

The grinding device can be used to perform grinding operations on the second silicon rod on the third processing position of the silicon rod processing platform.

When the cutting device is used to cut the fourth silicon rod on the first processing area and the third silicon rod on the second processing area of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame, and the left and right sides of the cutting support The first cutting unit and the second cutting unit on the side simultaneously cut the fourth silicon rod in the corresponding first processing area and the third silicon rod in the second processing area, wherein the first cutting unit cuts the first processing area The fourth silicon rod on the upper side cuts along the X-axis direction (the first cutting unit is provided with a first cutting wire net in the shape of "=" along the X-axis direction), and the second cutting unit cuts on the second processing area The third silicon rod performs side cutting along the Y-axis direction (the second cutting unit 25 is provided with a second cutting wire net in the shape of "=" along the Y-axis direction). Among them, it should be noted that before using the second cutting unit to cut the third silicon rod in the second processing area along the Y-axis direction, due to the aforementioned side cutting problem, it is also necessary to use the silicon rod conversion device The silicon rod positioning mechanism 43 drives the third silicon rod to rotate 90° forward or reverse to adjust the cutting surface.

The silicon rod cutting and grinding method disclosed in the present application can transfer the silicon rods in an orderly and seamless manner between various processing devices, and simultaneously cut the silicon rods twice to form square silicon rods and split squares. The cut square silicon rods are ground to complete the multi-process integrated operation of silicon rod extraction and grinding, which improves production efficiency and the quality of product processing operations.

Based on the above examples, this application provides the following embodiments. In the following description, the various embodiments are represented by serial numbers. For example, the numbers 1, 2, 3, 4... can respectively represent embodiment 1, embodiment 2, and embodiment. 3. Example 4.... Here, this application provides:

1. An integrated silicon rod cutting and grinding machine, characterized in that it comprises:

Base with silicon rod processing platform;

The cutting device is arranged on the machine base and is used to perform side-cutting in the first direction on the silicon rods on the first processing position of the silicon rod processing platform and to cut the silicon rods on the second processing position of the silicon rod processing platform. The silicon rod is side-cut in the second direction to form a square silicon rod; wherein the second direction is perpendicular or parallel to the first direction;

A grinding device, arranged on the machine base, for grinding and chamfering the square silicon rod on the third processing position of the silicon rod processing platform; and

The silicon rod conversion device is arranged on the silicon rod processing platform and is used for converting the silicon rod in the first processing position, the second processing position and the third processing position.

2. The silicon rod cutting and grinding integrated machine according to embodiment 1, wherein the cutting device comprises: a first cutting device provided at a first processing position of the silicon rod processing platform and a first cutting device provided on the silicon rod processing platform. The second cutting device of the second processing zone of the rod processing platform.

3. The integrated silicon rod cutting and grinding machine according to embodiment 2, wherein the first cutting device comprises:

First cutting frame

The first cutting support is movably raised and lowered on the first cutting frame;

The first cutting unit is provided on the first cutting support; the first cutting unit includes a first wire frame provided on the first cutting support, and a plurality of wires provided on the first wire frame. A first cutting wheel and a first cutting line, the first cutting line is arranged around the plurality of first cutting wheels in sequence to form a first cutting line segment arranged in a first direction.

4. The silicon rod cutting and grinding integrated machine according to embodiment 3, characterized in that the first cutting device further comprises a first edge skin unloading device, which is used to apply the first cutting device to the silicon rod The edge crust formed after the side cutting in the first direction is discharged.

5. The integrated silicon rod cutting and grinding machine according to embodiment 3, wherein the second cutting device comprises:

The second cutting frame;

The second cutting support is movably raised and lowered on the second cutting frame;

The second cutting unit is provided on the second cutting support; the second cutting unit includes a second wire frame provided on the second cutting support, and a plurality of first wire frames provided on the second wire frame Two cutting wheels, and a second cutting line, the second cutting line is sequentially wound around the plurality of second cutting wheels to form a second cutting line segment arranged in a second direction.

6. The silicon rod cutting and grinding integrated machine according to embodiment 5, characterized in that, the second cutting device further includes a second edge skin unloading device, which is used to apply the second cutting device to the silicon rod The edges formed by side cutting in the second direction are discharged.

7. The silicon rod cutting and grinding integrated machine according to embodiment 1, characterized in that the cutting device comprises:

Cutting frame

A cutting support, movably raised and lowered on the cutting frame; the cutting support includes a support main body and a first support side wing and a second support side wing located on opposite sides of the support main body;

The first cutting unit is arranged on the first side of the cutting support; the first cutting unit includes a first wire frame arranged on the side wing of the first support in the cutting support, and is arranged on the first side of the cutting support. A plurality of first cutting wheels on a wire frame and a first cutting line, the first cutting line being arranged around the plurality of first cutting wheels in sequence to form a first cutting line segment arranged in a first direction;

The second cutting unit is arranged on the second side of the cutting support; the second cutting unit includes a second wire frame arranged on the side wing of the second support in the cutting support, and is arranged on the second wire A plurality of second cutting wheels on the frame and a second cutting line are arranged around the plurality of second cutting wheels in sequence to form a second cutting line segment arranged in a second direction.

8. The silicon rod cutting and grinding integrated machine according to embodiment 7, wherein the first cutting line and the second cutting line are the same cutting line, and the cutting support is also provided with A guide wheel between the first cutting unit and the second cutting unit for the cutting line to be wound around.

9. The silicon rod cutting and grinding integrated machine according to embodiment 7, characterized in that, the first cutting unit further includes a first edge skin unloading device, which is used to apply the first cutting unit to the silicon rod The edge skins formed after the side cutting in the first direction are discharged; the second cutting unit further includes a second edge skin unloading device for performing the second cutting unit on the silicon rods in the second direction The edges formed after cutting are discharged.

10. The silicon rod cutting and grinding integrated machine according to embodiment 5 or 7, characterized in that the cutting line when the first cutting unit performs side-cutting of the silicon rod in the first direction and the second cutting unit The intersection of the cutting lines when the silicon rod is side-cut in the second direction is located in the cross section of the silicon rod.

11. The silicon rod cutting and grinding integrated machine according to embodiment 1, wherein the grinding device comprises:

The grinding surface support is arranged on the machine base;

At least a pair of abrasive tools are arranged oppositely on the grinding surface support; the at least one pair of abrasive tools can move up and down relative to the grinding surface support for grinding and chamfering the square silicon rod .

12. The silicon rod cutting and grinding integrated machine according to embodiment 11, characterized in that the grinding tool comprises:

Spindle; and

At least one grinding wheel is arranged on the working end of the main shaft.

13. The silicon rod cutting and grinding integrated machine according to embodiment 11, characterized in that the grinding tool comprises:

Rotating chassis;

The double-headed main shaft is arranged on the rotating chassis, the first end of which is provided with at least one coarse grinding wheel, and the second end of which is provided with at least one fine grinding wheel;

The driving motor is used to drive the rotating chassis to rotate so that the first end and the second end of the double-headed main shaft can exchange positions.

14. The silicon rod cutting and grinding integrated machine according to embodiment 1, characterized in that, the first processing position, the second processing position and the third processing position of the silicon rod processing platform are 120° between each other. Distribution, the rotation angle range of the silicon rod conversion device is ±240°.

15. The silicon rod cutting and grinding integrated machine according to embodiment 1, characterized in that the silicon rod processing platform is also provided with a waiting area, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device, which is adjacent to The waiting area of the silicon rod processing platform is used to transfer silicon rods to be processed to the waiting area of the silicon rod processing platform or to transfer processed silicon rods on the waiting area out of the silicon rod processing platform.

16. The integrated silicon rod cutting and grinding machine according to embodiment 15, wherein the silicon rod transfer device comprises:

The transfer base is slidably installed on the base through a sliding mechanism;

A silicon rod platform, movably arranged on the transfer base, and used for laterally positioning the silicon rod;

A silicon rod fastening mechanism, which is provided on the silicon rod platform, and is used to fasten the silicon rod during the transfer process of the silicon rod; and

The platform turning mechanism is used to drive the silicon rod platform to turn relative to the transfer base, so that the silicon rod is placed upright on the silicon rod transfer device.

17. The integrated silicon rod cutting and grinding machine according to embodiment 15, characterized in that the integrated silicon rod cutting and grinding machine further comprises a positioning detection device for detecting the ridgelines of the silicon rods located in the waiting area And center positioning.

18. The silicon rod cutting and grinding integrated machine according to embodiment 17, wherein the positioning detection device comprises:

The ridge line detection unit includes a contact type detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact type detection mechanism and the rotation mechanism. The contact type detection structure is used to pass through the edge of the silicon rod. Line contact to send an on-off signal to the detection controller, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller; and

The axis adjustment unit is used to position the axis of the silicon rod in the center of the pretreatment zone, and includes a clamping mechanism for forming a clamping space for clamping the silicon rod and The center of the clamping space coincides with the center of the pretreatment zone.

19. The silicon rod cutting and grinding integrated machine according to embodiment 15, characterized in that the waiting area, the first processing area, the second processing area and the third processing area of the silicon rod processing platform are adjacent to each other. It is distributed at 90°, and the rotation angle range of the silicon rod conversion device is ±270°.

20. The silicon rod cutting and grinding integrated machine according to embodiment 14 or 19, wherein the silicon rod conversion device comprises:

Convey the body;

A silicon rod positioning mechanism, which is arranged on the conveying body and is used for positioning the silicon rod; and

The conversion drive mechanism is used to drive the conveying body to rotate to drive the silicon rods positioned by the silicon rod positioning mechanism to switch between various processing locations.

21. A silicon rod cutting and grinding method, applied to a silicon rod cutting and grinding integrated machine, the silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing Zone, second processing zone, and third processing zone, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device, characterized in that the silicon rod cutting and grinding method includes the following steps:

Enabling the silicon rod conversion device to convert the first silicon rod to the first processing area, and causing the cutting device to perform side-cutting in the first direction on the first silicon rod in the first processing area;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod to the first processing position, so that the cutting device can perform the second processing Performing side cutting in the second direction on the first silicon rod at the location and performing side cutting in the first direction on the second silicon rod at the first processing location;

The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing area to the third processing area, to convert the second silicon rod from the first processing area to the second processing area, and to convert the third silicon rod from the first processing area to the second processing area. The rod is converted to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to perform the grinding and chamfering on the second silicon rod in the second processing area. Side cutting in the second direction and performing side cutting in the first direction on the third silicon rod in the first processing location;

The silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the first processing position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod The rod is converted from the first processing area to the second processing area, the first silicon rod is unloaded from the first processing area and the fourth silicon rod is loaded, so that the cutting device performs the first direction side view of the fourth silicon rod on the first processing area Cutting. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to cut the third silicon rod in the second processing area in the second direction.

22. The silicon rod cutting and grinding method according to embodiment 21, characterized in that the first processing position, the second processing position and the third processing position on the silicon rod processing platform are distributed at 120° among each other; When the direction according to the sequence of the first processing location, the second processing location and the third processing location is defined as a positive direction, the first predetermined angle for rotating the silicon rod conversion device is a forward rotation of 120°, The second preset angle for rotating the silicon rod conversion device is 120° in the forward direction or 240° in the reverse direction.

23. A silicon rod cutting and grinding method, applied to a silicon rod cutting and grinding integrated machine, the silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a waiting area , A first processing location, a second processing location, and a third processing location, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device and a silicon rod conversion device, characterized in that the silicon rod cutting and grinding method includes The following steps:

Loading the first silicon rod in the waiting area, and preprocessing the first silicon rod;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the waiting area to the first processing area, and the cutting device is made to perform side-cutting in the first direction on the first silicon rod in the first processing area. In the stage, the second silicon rod is loaded in the waiting area and the second silicon rod is pretreated;

The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod from the waiting position to the first processing position, so that the cutting device is The first silicon rod in the second processing area is cut in the second direction and the second silicon rod in the first processing area is cut in the first direction. At this stage, the third silicon rod is loaded in the waiting area and Preprocessing the third silicon rod;

The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, the second silicon rod from the first processing position to the second processing position, and the third silicon rod The rod is switched from the waiting area to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to grind and chamfer the second silicon rod in the second processing area. Performing side cutting in the second direction on the silicon rod and performing side cutting in the first direction on the third silicon rod in the first processing area; meanwhile, loading the fourth silicon rod in the waiting area and preprocessing the fourth silicon rod;

The silicon rod conversion device is rotated by a second preset angle to convert the first silicon rod from the third processing position to the waiting position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod from the The first processing area is converted to the second processing area, the fourth silicon rod is converted from the waiting area to the first processing area, the first silicon rod is unloaded from the waiting area and the fifth silicon rod is loaded, and the fifth silicon rod is processed Pretreatment. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to cut the third silicon rod in the second processing area in the second direction. And performing side cutting in the first direction on the fourth silicon rod at the first processing location.

24. The silicon rod cutting and grinding method according to embodiment 23, wherein the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are 90° °distribution; when the direction according to the sequence of the waiting area, the first processing area, the second processing area and the third processing area is defined as a positive direction, the first predetermined angle for rotating the silicon rod conversion device is a positive direction Rotating 90°, the second preset angle of rotating the silicon rod conversion device is 90° in the forward direction or 270° in the reverse direction.

The foregoing embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes made by persons with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims (24)

A silicon rod cutting and grinding integrated machine, which is characterized in that it comprises: Base with silicon rod processing table; The cutting device is used for performing first folding cutting of the silicon rods on the first processing position of the silicon rod processing table and performing second folding cutting of the silicon rods on the second processing position of the silicon rod processing table , Forming a square silicon rod; any one of the first folded face cutting and the second folded face cutting refers to cutting two orthogonal side faces of the silicon rod; A surface grinding device for grinding and chamfering the square silicon rod on the third processing position of the silicon rod processing table; and The silicon rod conversion device is arranged on the silicon rod processing table, and is used for converting the silicon rod in the first processing position, the second processing position and the third processing position. The silicon rod cutting and grinding integrated machine according to claim 1, wherein the cutting device comprises: a first cutting device provided at a first processing position of the silicon rod processing table and a first cutting device provided at the silicon rod processing table. The second cutting device in the second processing zone of the table. The silicon rod cutting and grinding integrated machine according to claim 2, wherein the first cutting device comprises: First cutting frame The first cutting support is movably raised and lowered on the first cutting frame; The first cutting unit is provided on the first cutting support; the first cutting unit includes a first wire frame provided on the first cutting support, and a plurality of wires provided on the first wire frame. A first cutting wheel and a first cutting line, the first cutting line is arranged around the plurality of first cutting wheels in sequence to form two orthogonal first cutting line segments. The silicon rod cutting and grinding integrated machine according to claim 3, wherein the first cutting device further comprises a first edge skin unloading device for performing the first cutting device on the silicon rod. The edge skin formed after a folded surface is cut is discharged. The silicon rod cutting and grinding integrated machine according to claim 3, wherein the second cutting device comprises: The second cutting frame; The second cutting support is movably raised and lowered on the first cutting frame; The second cutting unit is provided on the second cutting support; the second cutting unit includes a second wire frame provided on the second cutting support, and a plurality of first wire frames provided on the second wire frame Two cutting wheels, and a second cutting line, the second cutting line is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments. The silicon rod cutting and grinding integrated machine according to claim 5, wherein the second cutting device further comprises a second edge skin unloading device for performing the second cutting device on the silicon rod. The edge skin formed after the two-fold surface is cut is discharged. The silicon rod cutting and grinding integrated machine according to claim 1, wherein the cutting device comprises: Cutting frame A cutting support, movably raised and lowered on the cutting frame; the cutting support includes a support main body and a first support side wing and a second support side wing located on opposite sides of the support main body; The first cutting unit is arranged on the first side of the cutting support; the first cutting unit includes a plurality of first cutting wheels and a first cutting wheel arranged on the side wings of the first support and the support body A cutting line, the first cutting line is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments; The second cutting unit is arranged on the second side of the cutting support; the second cutting unit includes a plurality of second cutting wheels arranged on the side wings of the second support and the support body, and a first Two cutting lines, the second cutting lines are sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments. The silicon rod cutting and grinding integrated machine according to claim 7, wherein the first cutting line and the second cutting line are the same cutting line, and the support body is further provided with A guide wheel between the cutting unit and the second cutting unit for the cutting line to be wound around. The silicon rod cutting and grinding integrated machine according to claim 7, wherein the first cutting unit further comprises a first edge skin unloading device for performing the first cutting unit on the silicon rod. The edge skin formed after a folded surface cutting is discharged; the second cutting unit further includes a second edge skin discharge device, which is used to perform the second folded surface cutting of the silicon rod by the second cutting unit The formed edges are discharged. The silicon rod cutting and grinding integrated machine according to claim 7, wherein when the first cutting unit performs the first bend cutting of the silicon rod, the intersection of two orthogonal first cutting line segments is located at the In the cross section of the silicon rod, the intersection of two orthogonal second cutting line segments is located in the cross section of the silicon rod when the second cutting unit performs the second bend cutting of the silicon rod. The silicon rod cutting and grinding integrated machine according to claim 1, wherein the surface grinding device comprises: The grinding surface support is arranged on the machine base; At least one pair of grinding wheel components are oppositely arranged on the grinding surface support; the at least one pair of grinding wheel components move up and down relative to the grinding surface support for grinding and chamfering the square silicon rod . The silicon rod cutting and grinding integrated machine according to claim 11, wherein the grinding wheel assembly comprises: Spindle; and At least one grinding wheel is arranged on the working end of the main shaft. The silicon rod cutting and grinding integrated machine according to claim 11, wherein the grinding wheel assembly comprises: Rotating chassis; The double-headed main shaft is arranged on the rotating chassis, the first end of which is provided with at least one coarse grinding wheel, and the second end of which is provided with at least one fine grinding wheel; The driving motor is used to drive the rotating chassis to rotate so that the first end and the second end of the double-headed main shaft can exchange positions. The silicon rod cutting and grinding integrated machine according to claim 1, wherein the first processing area, the second processing area and the third processing area of the silicon rod processing table are distributed at 120° between each other adjacent to each other. The rotation angle range of the silicon rod conversion device is ±240°. The silicon rod cutting and grinding integrated machine according to claim 1, wherein the silicon rod processing table is further provided with a pretreatment zone, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device, which is adjacent to the The pretreatment location of the silicon rod processing table is used to transfer the silicon rods to be processed to the pretreatment location of the silicon rod processing table or transfer the processed silicon rods on the pretreatment location out of the silicon Rod processing station. The silicon rod cutting and grinding integrated machine according to claim 15, wherein the silicon rod transfer device comprises: The transfer base is slidably installed on the base through a sliding mechanism; A silicon rod platform, movably arranged on the transfer base, and used for laterally positioning the silicon rod; A silicon rod fastening mechanism, which is provided on the silicon rod platform, and is used to fasten the silicon rod during the transfer process of the silicon rod; and The platform turning mechanism is used to drive the silicon rod platform to turn relative to the transfer base, so that the silicon rod is placed upright on the silicon rod transfer device. The silicon rod cutting and grinding integrated machine according to claim 15, wherein the silicon rod cutting and grinding integrated machine further comprises a positioning detection device, and the positioning detection device is provided in a pretreatment zone of the silicon rod processing table, Used for edge detection and center positioning of the silicon rod. The silicon rod cutting and grinding integrated machine according to claim 17, wherein the positioning detection device comprises: The ridge line detection unit includes a contact type detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact type detection mechanism and the rotation mechanism. The contact type detection structure is used to pass through the edge of the silicon rod. Line contact to send an on-off signal to the detection controller, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller; and The axis adjustment unit is used to position the axis of the silicon rod in the center of the pretreatment zone, and includes a clamping mechanism driven by a lifting mechanism to move up and down, and the clamping mechanism is used to form and clamp the The clamping space of the silicon rod and the center of the clamping space coincide with the center of the pretreatment zone. The silicon rod cutting and grinding integrated machine according to claim 15, wherein the first processing zone, the second processing zone and the third processing zone of the silicon ingot processing table are distributed at 90° between each other adjacent to each other. The rotation angle range of the silicon rod conversion device is ±270°. The silicon rod cutting and grinding integrated machine according to claim 14 or 19, wherein the silicon rod conversion device comprises: Convey the body; A silicon rod positioning mechanism, which is arranged on the conveying body and is used for positioning the silicon rod; and The conversion drive mechanism is used to drive the conveying body to rotate to drive the silicon rods positioned by the silicon rod positioning mechanism to switch between various processing locations. A silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with a first processing position, For the second processing zone and the third processing zone, the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device and a silicon rod conversion device, characterized in that the silicon rod cutting and grinding method includes the following steps: The silicon rod conversion device is caused to convert the first silicon rod to the first processing area, and the cutting device is caused to perform the first bend cutting of the first silicon rod in the first processing area; the first bend cutting refers to the Cut the two orthogonal sides of the silicon rod; The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod to the first processing position, so that the cutting device can perform the second processing The first silicon rod in the location is subjected to a second folding cutting and the second silicon rod in the first processing position is subjected to a first folding cutting; the second folding cutting refers to two positive cuts of the silicon rod Cut the cross side; The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing area to the third processing area, to convert the second silicon rod from the first processing area to the second processing area, and to convert the third silicon rod from the first processing area to the second processing area. The rod is converted to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to perform the grinding and chamfering on the second silicon rod in the second processing area. The second folding cutting and the first folding cutting of the third silicon rod at the first processing location; The silicon rod conversion device is rotated by a second predetermined angle to convert the first silicon rod from the third processing position to the first processing position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod The rod is converted from the first processing area to the second processing area, the first silicon rod is unloaded from the first processing area and the fourth silicon rod is loaded, so that the cutting device performs the first folding of the fourth silicon rod on the first processing area Cutting. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing zone, and the cutting device is made to cut the third silicon rod in the second processing zone for the second folding. The silicon rod cutting and grinding method according to claim 21, wherein the first processing location, the second processing location and the third processing location on the silicon rod processing platform are distributed at 120° between two; When the sequence of the first processing location, the second processing location and the third processing location is defined as a positive direction, the first predetermined angle for rotating the silicon rod conversion device is a forward rotation of 120°, and the silicon The second preset angle of rotation of the rod conversion device is 120° in the forward direction or 240° in the reverse direction. A silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area and a second A processing location, a second processing location, and a third processing location. The silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device, wherein the silicon rod cutting and grinding method includes the following steps : Loading the first silicon rod in the waiting area, and preprocessing the first silicon rod; The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the waiting area to the first processing area, and the cutting device is caused to perform the first folding cutting of the first silicon rod on the first processing area. In the stage, the second silicon rod is loaded in a waiting area to pre-process the second silicon rod; the first folded face cutting refers to cutting two orthogonal sides of the silicon rod; The silicon rod conversion device is rotated by a first predetermined angle to convert the first silicon rod from the first processing position to the second processing position and the second silicon rod from the waiting position to the first processing position, so that the cutting device is The first silicon rod in the second processing area is subjected to second folding cutting and the second silicon rod in the first processing position is subjected to first folding cutting. At this stage, the third silicon rod is loaded in the waiting area. The third silicon rod is pretreated; the second folded face cutting refers to cutting two orthogonal sides of the silicon rod; The silicon rod conversion device is rotated at a first predetermined angle to convert the first silicon rod from the second processing position to the third processing position, the second silicon rod from the first processing position to the second processing position, and the third silicon rod The rod is switched from the waiting area to the first processing area, and the grinding device is made to grind and chamfer the first silicon rod in the third processing area. At this stage, the cutting device is made to grind and chamfer the second silicon rod in the second processing area. Performing the second folding cutting of the silicon rod and performing the first folding cutting of the third silicon rod at the first processing area, and at the same time, loading the fourth silicon rod in the waiting area to preprocess the fourth silicon rod; The silicon rod conversion device is rotated by a second preset angle to convert the first silicon rod from the third processing position to the waiting position, the second silicon rod from the second processing position to the third processing position, and the third silicon rod from the The first processing area is converted to the second processing area, the fourth silicon rod is converted from the waiting area to the first processing area, the first silicon rod is unloaded from the waiting area and the fifth silicon rod is loaded, and the fifth silicon rod is processed Pretreatment. At this stage, the grinding device is made to grind and chamfer the second silicon rod in the third processing area, and the cutting device is made to cut the third silicon rod in the second processing area. And performing the first folding cutting on the fourth silicon rod in the first processing area. The silicon rod cutting and grinding method according to claim 23, wherein the waiting area, the first processing area, the second processing area and the third processing area on the silicon rod processing platform are distributed at 90° among each other. ; When the direction according to the order of the waiting area, the first processing area, the second processing area and the third processing area is defined as a positive direction, the first predetermined angle at which the silicon rod conversion device rotates is a positive rotation 90 °, the second preset angle of rotating the silicon rod conversion device is 90° in the forward direction or 270° in the reverse direction.

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