JP2015018953A - Light emitting chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting chip which improves the light extraction efficiency and has a new structure.SOLUTION: A light emitting chip (12) of the invention includes: a chip (14) including a sapphire base (141) and a light emitting layer formed on a surface (141a) of the sapphire base and located on a surface (14a) of the chip; and translucent members (15) which are bonded to a rear surface (141b) of the sapphire base by a translucent resin (16) which transmits an outgoing beam from the light emitting layer. The translucent members transmit the outgoing beam from the light emitting layer. The multiple translucent members are laminated.

Description

  The present invention relates to a light emitting chip including a chip on which a light emitting layer is formed.

  Light emitting devices including LEDs (Light Emitting Diodes), LDs (Laser Diodes), and the like have been put into practical use. These light emitting devices usually include a light emitting chip having a chip formed with a light emitting layer that emits light when a voltage is applied. In the manufacture of such a chip, first, an epitaxial layer (crystal layer) is grown as a light emitting layer in each region partitioned by the grid-like division lines on the crystal growth base. Then, the chip | tip for each light emitting chip is formed by dividing | segmenting the base for crystal growth along the division | segmentation scheduled line, and dividing it into pieces.

  In a light-emitting chip, when a light-emitting layer emitting green or blue light is an InGaN-based chip, sapphire is generally used as a base for crystal growth, and an n-type GaN semiconductor layer and an InGaN light emitting layer are sequentially formed on this sapphire base. The p-type GaN semiconductor layer is epitaxially grown. Then, an external extraction electrode is formed on each of the n-type GaN semiconductor layer and the p-type GaN semiconductor layer.

  The back surface side (sapphire base side) of the chip is fixed to the lead frame, and the front surface side (light emitting layer side) of the chip is covered with a lens member to form a light emitting diode. In such a light emitting diode, improvement in luminance is considered as an important issue, and various methods for improving the light extraction efficiency have been proposed (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 4-10670

  By the way, light generated in the light emitting layer by application of voltage is mainly emitted from two main surfaces (front surface and back surface) of the laminate including the light emitting layer. For example, light emitted from the surface of the laminate (main surface on the lens member side) is extracted outside the light emitting diode through the lens member and the like. On the other hand, the light emitted from the back surface of the laminate (the main surface on the sapphire base side) propagates through the sapphire base, and a part of the light is reflected and laminated at the interface between the sapphire base and the lead frame. Return to the body.

  For example, when a thin sapphire base is used for the chip for the purpose of improving workability during cutting, the distance between the back surface of the laminate and the interface between the sapphire base and the lead frame is shortened. In this case, the ratio of the light that is reflected at the interface between the sapphire base and the lead frame and returns to the stacked body is higher than that when the sapphire base is thick. Since the stacked body absorbs light, when the ratio of light returning to the stacked body increases in this way, the light extraction efficiency of the light emitting diode decreases.

  The present invention has been made in view of such a point, and an object thereof is to provide a light-emitting chip having a new configuration capable of enhancing light extraction efficiency.

  The light-emitting chip of the present invention comprises at least a chip having a light-emitting layer on the surface and a light-transmitting member that transmits light emitted from the light-emitting layer, and a plurality of light-transmitting members are stacked to form the back surface of the chip. It is characterized in that it is attached with a translucent resin.

  According to this configuration, since a plurality of laminated translucent members are attached to the back surface of the chip, the ratio of the light reflected from the back surface of the chip and returning to the light emitting layer is kept low, and the light emitted from the translucent member Can be increased, and the light extraction efficiency can be increased. In addition, since a plurality of light-transmitting members are stacked, the luminance of the light-emitting chip can be adjusted by changing the number of the light-transmitting members by adjusting the number of the light-transmitting members.

  In the light emitting chip of the present invention, the base of the chip may be sapphire, and the light emitting layer may be composed of a GaN semiconductor layer. According to this configuration, the light extraction efficiency can be increased in a light emitting chip that emits blue or green light. In addition, even if the base is made thin, the thin base can be used without reducing the light extraction efficiency because reflected light can be incident on a position outside the light emitting layer depending on the thickness of the translucent member. The workability of the thin crystal growth base can be maintained.

  ADVANTAGE OF THE INVENTION According to this invention, the light emitting chip of the new structure which can improve the extraction efficiency of light can be provided.

2 is a perspective view schematically showing a configuration example of a light emitting diode according to Embodiment 1. FIG. FIG. 3 is a schematic cross-sectional view showing how light is emitted from the light-emitting diode according to the first embodiment. It is a cross-sectional schematic diagram which shows a mode that the light in the light emitting diode which concerns on a comparison structure is discharge | released. 4A is a perspective view schematically showing a configuration example of the light-emitting diode according to Embodiment 2, and FIG. 4B is a schematic cross-sectional view of the light-emitting diode according to Embodiment 2. FIG. FIG. 5A is a schematic cross-sectional view of Example 1, and FIG. 5B is a graph showing the measurement results of luminance in Example 1, Comparative Examples 1-1 and 1-2. 6A is a schematic cross-sectional view of Example 2, and FIG. 6B is a graph showing the measurement results of luminance in Example 2 and Comparative Examples 2-1 and 2-2.

(Embodiment 1)
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of the light emitting diode according to the first embodiment, and FIG. 2 is a cross section showing a state in which light is emitted from the light emitting chip of the light emitting diode according to the first embodiment. It is a schematic diagram. As shown in FIG. 1, the light emitting diode 1 includes a lead frame 11 as a base and a light emitting chip 12 supported and fixed to the lead frame 11.

  The lead frame 11 is made of a material such as metal in a columnar shape, and two lead members 111a and 111b having conductivity are provided on the back surface corresponding to one bottom surface. The lead members 111a and 111b are insulated from each other and function as a positive electrode and a negative electrode of the light emitting diode 1, respectively. The lead members 111a and 111b are connected to an external power source (not shown) through wiring (not shown) or the like.

  On the surface 11a corresponding to the other bottom surface of the lead frame 11, two connection terminals 112a and 112b that are insulated from each other are arranged at a predetermined interval. The connection terminal 112 a and the lead member 111 a are connected inside the lead frame 11. Further, the connection terminal 112 b and the lead member 111 b are connected inside the lead frame 11. For this reason, the potentials of the connection terminals 112a and 112b are approximately the same as the potentials of the lead members 111a and 111b, respectively.

  The light emitting chip 12 is the surface 11a of the lead frame 11, and is disposed between the connection terminal 112a and the connection terminal 112b. As shown in FIG. 2, the light emitting chip 12 includes a chip 14 and a translucent member 15 attached to the back surface 14 b of the chip 14 with a translucent resin 16. The chip 14 includes a sapphire base 141 having a rectangular planar shape and a stacked body 142 provided on the surface 141 a of the sapphire base 141. The stacked body 142 includes a plurality of semiconductor layers (GaN semiconductor layers) formed using a GaN-based semiconductor material.

  The stacked body 142 includes an n-type semiconductor layer (for example, an n-type GaN layer) in which electrons are a majority carrier, a semiconductor layer (for example, an InGaN layer) that is a light-emitting layer, and a p-type semiconductor layer (for example, a hole is in majority carriers). , P-type GaN layer) are sequentially epitaxially grown. The sapphire base 141 is formed with two electrodes (not shown) that are connected to the n-type semiconductor layer and the p-type semiconductor layer and apply a voltage to the stacked body 142. Note that these electrodes may be included in the stacked body 142.

  The translucent member 15 is made of glass (for example, soda glass, borosilicate glass, or the like), resin, or the like, and is formed of a material that transmits light emitted from the light emitting layer. A plurality of translucent members 15 (two in the present embodiment) are provided, and are laminated by being bonded via a translucent resin (not shown). The area of the front surface 15 a of each translucent member 15 is larger than the area of the back surface 141 b of the sapphire base 141. The translucent member 15 preferably has a thickness equal to or greater than that of the sapphire base 141. The back surface 15b of the translucent member 15 on the lead frame 11 side (the lower side in FIG. 2) is bonded to the front surface 11a of the lead frame 11 with a resin (not shown), and this resin is the same as the translucent resin 16. It is made of the material. In addition, in this Embodiment, although each translucent member 15 formed the same planar shape and thickness, you may laminate | stack the translucent member 15 from which they differ. The number of translucent members 15 is not limited to two and may be three or more.

  The translucent resin 16 is made of a resin material such as a die bonding agent that transmits light emitted from the light emitting layer. The translucent resin 16 is provided on the entire back surface 14b of the chip 14 so that the back surface 14b of the chip 14 and the chip 14 side (see FIG. 2 and the surface 15a of the translucent member 15 located on the upper side.

  The two connection terminals 112a and 112b provided on the lead frame 11 are connected to the two electrodes of the light emitting chip 12 via conductive lead wires 17a and 17b, respectively. Thereby, the voltage of the power source connected to the lead members 111a and 111b is applied to the stacked body 142. When a voltage is applied to the stacked body 142, electrons flow from the n-type semiconductor layer and holes flow from the p-type semiconductor layer to the semiconductor layer serving as the light-emitting layer. As a result, recombination of electrons and holes occurs in the semiconductor layer serving as the light emitting layer, and light having a predetermined wavelength is emitted. In the present embodiment, since the semiconductor layer to be the light emitting layer is formed using a GaN-based semiconductor material, blue or green light corresponding to the band gap of the GaN-based semiconductor material is emitted.

  A dome-shaped lens member 18 that covers the surface 14 a side of the chip 14 is attached to the outer peripheral edge of the lead frame 11 on the surface 11 a side. The lens member 18 is formed of a material such as a resin having a predetermined refractive index, and refracts the light emitted from the stacked body 142 of the chip 14 and guides it in a predetermined direction outside the light emitting diode 1. As described above, the light emitted from the chip 14 is extracted to the outside of the light emitting diode 1 through the lens member 18.

  Next, the brightness improvement effect of the light-emitting diode 1 according to Embodiment 1 will be described with reference to the light-emitting diode according to the comparative structure in FIG. FIG. 3 is a schematic cross-sectional view illustrating a state in which light is emitted from the light emitting chip of the light emitting diode according to the comparative structure for comparison with the first embodiment. The light-emitting diode according to the comparative structure has the same configuration as that of the light-emitting diode 1 according to Embodiment 1 except that the light-transmitting member 15 is a single sheet. That is, in the light-emitting chip 22 according to the comparative structure, the chip 24 including the sapphire base 241 having a rectangular planar shape and the laminate 242 provided on the surface 241 a of the sapphire base 241 is transmitted by the translucent resin 26. Bonded to the light member 25.

  As shown in FIG. 2, in the light emitting chip 12 according to the first embodiment, the light generated in the semiconductor layer serving as the light emitting layer is mainly the surface 142a of the stacked body 142 (that is, the surface 14a of the light emitting chip 14), And from the back surface 142b. Light (for example, the optical path A1) emitted from the surface 142a of the multilayer body 142 is extracted outside the light emitting diode 1 through the lens member 18 (see FIG. 1) and the like as described above. On the other hand, for example, light emitted from the back surface 142b of the multilayer body 142 and propagating through the optical path A2 is incident on the back surface 14b of the light emitting chip, which is an interface between the sapphire base 141 and the translucent member 15, and It passes through the translucent member 15 (optical path A3). The light propagating in the optical path A3 is reflected by the surface 11a of the lead frame 11 (optical path A4), enters the side surface of the translucent member 15, and is emitted to the outside.

  On the other hand, as shown in FIG. 3, the optical paths B1 and B2 of the light emitting chip 22 according to the comparative structure are the same as the optical paths A1 and A2 of the light emitting chip 12 according to the first embodiment. The optical path A3 transmits through the two translucent members 15, whereas the optical path B3 in the comparative structure has one transmitting translucent member 25. The light propagating through the optical path B3 is reflected by the surface 11a of the lead frame 11 and propagates through the optical path B4. The light propagating through the optical path B4 passes through the single translucent member 25, then passes through the sapphire base 241, enters the stacked body 242, and is absorbed, and thus cannot be extracted outside.

  As described above, according to the light-emitting diode 1 according to Embodiment 1, the light that is emitted from the multilayer body 142 and propagates in the same manner as the optical path A2 is transmitted by the two translucent members 15 in the optical paths A3 and A4. It can be propagated to the outside and taken out. Here, the light propagating through the optical path A3 has two translucent members 15 as compared with the light propagating through the optical path B3 of the comparative structure, so that the position incident on the surface 11a of the lead frame 11 is translucent. It can be closer to the outer periphery of the sex member 15. Therefore, in the light propagated through the optical paths A3 and A4, the ratio of the light returning to the stacked body 142 can be suppressed lower than the light propagated through the optical paths B3 and B4 of the comparative structure. Thereby, the ratio of the light emitted from the translucent member 15 can be increased, the light extraction efficiency can be increased, and the luminance can be improved. Further, in the light emitting chip 12 according to the first embodiment, the luminance of the light emitting chip 12 can be adjusted by changing the number of laminated light-transmitting members 15.

  In addition, since a sapphire base is hard and processing is not easy, it is desirable to improve workability using a thin sapphire base. In the light emitting diode 1 described above, even if the sapphire base 141 is thinned, the light extraction efficiency can be maintained high by the translucent member 15. That is, there is no need to sacrifice the workability by increasing the thickness of the sapphire base 141 in order to maintain the light extraction efficiency.

(Embodiment 2)
The second embodiment will be described below. Note that, in the second embodiment, the same reference numerals are given to components common to the first embodiment, and description thereof is omitted. 4A is a perspective view schematically showing a configuration example of the light-emitting diode according to Embodiment 2, and FIG. 4B is a schematic cross-sectional view of the light-emitting diode according to Embodiment 2. FIG. As shown in FIGS. 4A and 4B, the light emitting diode 3 according to the second embodiment is formed by supporting and fixing the light emitting chip 12 on a mounting surface 32 formed on the bottom surface of the recess 31 of the package 30. On the mounting surface 32, two connection electrodes 32a and 32b that are insulated from each other are arranged at a predetermined interval.

  Similar to the light emitting chip 12 of the first embodiment, the light emitting chip 12 of the second embodiment includes the chip 14 bonded with the translucent resin 16 and a plurality of translucent members 15 that are stacked. The direction is fixed in a state reversed with respect to the first embodiment. The electrodes (not shown) provided on the surface 14a of the chip 14 in the second embodiment are formed by protruding terminals called bumps, and the surface 14a of the chip 14 is supported and fixed to the mounting surface 32 so that the connection is achieved. The light emitting chip 12 is flip-chip mounted by being connected to the electrodes 32a and 32b.

  Next, an experiment conducted for confirming the luminance improvement effect of the light emitting diode according to the above embodiment will be described. In this experiment, the light-emitting diode 5 having the configuration shown in FIG. The light-emitting diode 5 according to the first embodiment includes a package 50, two translucent members 55 bonded to the recesses 51 of the package 50 via a translucent resin (not shown), and a translucent member 55. The chip 54 is bonded with a light resin (not shown). Comparative Example 1-1 has a configuration in which the two translucent members 55 of Example 1 are all omitted, and Comparative Example 1-2 has a configuration in which the translucent member 55 in Example 1 is changed to one. did. In this experiment, a light-emitting diode 5a having the configuration shown in FIG. The light emitting diode 5a of Example 2 was configured such that the inside of the recess 51 in the light emitting diode 5 of FIG. As the sealing resin 56, OE-6550 (refractive index 1.54, transparency 100% (at 450 nm)) manufactured by Toray Dow Corning Co., Ltd. was used. Comparative Example 2-1 has a configuration in which all of the two translucent members 55 of Example 2 are omitted, and Comparative Example 2-2 has a configuration in which the translucent member 55 in Example 2 is changed to one. did.

  In each example and each comparative example, the translucent member 55 was made of glass having a front and back surface area (vertical × horizontal) of 0.8 mm × 0.8 mm and a thickness of 150 μm. In Examples 1 and 2, the two translucent members 55 were bonded with a translucent resin.

  In each of the examples and the comparative examples, a chip 54 having the same specification as that of the chip 14 of the first embodiment (see FIG. 2) was used. Specifically, the chip 54 is obtained by dividing a 2-inch wafer (manufactured by Tekcore) into chips, and on the sapphire base whose front and back areas (vertical x horizontal) are 7.975 mm x 7.725 mm, A laminated body including a light emitting layer made of a GaN semiconductor layer was formed. Moreover, in all of each Example and each comparative example, the translucent resin (not shown) used the die-bonding agent (made by Shin-Etsu Chemical, KER-M2) which permeate | transmits light.

  In this experiment, the luminance of the light emitting diodes of the examples and the comparative examples was measured. Specifically, the total value of the intensity (power) of all light emitted from each light emitting diode was measured (total radiant flux measurement, measuring instrument: manufactured by Technolog, LX4651C), and a reference example (100%) And converted into luminance. 5B and 6B are graphs showing the measurement results. 5B and 6B, the vertical axis represents the total radiant flux (mW) or luminance (%) of each light-emitting diode.

  As shown in FIG. 5B, the brightness of Example 1 is 11.5% higher than that of Comparative Example 1-1 that is the reference (100%), and the brightness is 2.6% higher than that of Comparative Example 1-2. The light extraction efficiency can be increased. Further, as shown in FIG. 6B, the brightness of Example 2 is increased by 5.7% compared to Comparative Example 2-1 serving as the reference (100%), and the brightness is 1.9 compared with Comparative Example 2-2. %, And the light extraction efficiency can be increased. From the above conditions of each example and each comparative example and the results of FIGS. 5B and 6B, it was confirmed that the luminance of the light emitting diode increases as the number of translucent members 55 increases.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above embodiment, the chip 14 using the sapphire base and the GaN-based semiconductor material is exemplified, but the crystal growth base and the semiconductor material are implemented such as using a GaN substrate as the crystal growth base. The form is not limited. In order to improve the workability, the crystal growth base such as the sapphire base is preferably thinned, but the crystal growth base is not necessarily thin.

  In the above-described embodiment, the stacked body 142 in which the n-type semiconductor layer, the light-emitting semiconductor layer, and the p-type semiconductor layer are sequentially provided is illustrated; however, the structure of the stacked body 142 is not limited thereto. The stacked body 142 only needs to be configured so that light can be emitted by recombination of electrons and holes.

  The chip 14 may be a chip that emits infrared light (AlGaAs, GaAsP, or the like). In this case, the translucent member 15 is formed of a material that transmits infrared light, so that the above-described embodiment can be achieved. Similar effects can be obtained. Further, when the chip 14 emits ultraviolet light and the translucent member 15 is formed of a material that transmits ultraviolet light, the same effect as the above-described embodiment can be obtained.

  The present invention is useful for increasing the light extraction efficiency of a light emitting chip including a chip on which a light emitting layer is formed.

DESCRIPTION OF SYMBOLS 1 Light emitting diode 12 Light emitting chip 14 Chip 141 Sapphire base 15 Translucent member 16 Translucent resin

Claims (2)

A chip having a light emitting layer on the surface, and a translucent member that transmits light emitted from the light emitting layer; and
A light-emitting chip, wherein a plurality of the light-transmitting members are laminated and attached to the back surface of the chip with a light-transmitting resin.   The light emitting chip according to claim 1, wherein the base of the chip is sapphire, and the light emitting layer is made of a GaN semiconductor layer.

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