JP2010092992A - Tape extending device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape extending device capable of preventing an extension tape from being broken owing to burrs caused in an annular frame. <P>SOLUTION: The tape extending device 1 that has the annular frame 5 fixed to one surface of the extension tape 4 and breaks works 2 stuck on the extension tape 4 inside an opening portion 5b formed in the annular frame 5 includes the annular frame 5 which has an opening 5b and is fixed to one surface of the extension tape 4, a cover plate 7 and a mounting plate 11 for holding the annular frame 5, and a tape extension drum 16 that extends the extension tape 4 by moving the works 2 relatively to the annular frame 5 in a direction perpendicular to work surfaces, an annular projection 13 which protrudes toward one surface of the extension tape 4 inside the opening 5b of the annular frame 5 being formed in the cover plate 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a tape stretching device, and more particularly to a tape stretching device that breaks a workpiece attached to the surface of a stretched tape.

  2. Description of the Related Art Conventionally, as a tape stretching device that breaks a workpiece attached to the surface of a stretched tape, a device that breaks an adhesive film attached to a semiconductor wafer together with a semiconductor wafer as a workpiece is known (for example, a patent) Reference 1). A semiconductor wafer used in the tape stretching apparatus has a low-strength altered layer continuously formed along a grid-like division line by laser processing, and an adhesive film for die bonding is stuck on the back surface. The semiconductor wafer to which the adhesive film is attached is attached to an extension tape stretched so as to cover the opening of the annular frame through the adhesive film, and the annular frame is fixed to the mounting surface of the tape extension device. By this, it is set in the tape extending device.

Then, the tape extending device moves the extending drum positioned below the mounting surface relative to the semiconductor wafer in the vertical direction so that the end of the extending drum is connected to the outer peripheral edge of the semiconductor wafer and the opening edge of the annular frame. The semiconductor wafer and the adhesive film affixed to the semiconductor wafer are simultaneously broken along the deteriorated layer by abutting against the annular area of the extension tape located between the two parts and extending the extension tape in the radial direction. is doing.
JP 2007-27250 A

  However, in the tape stretching device described above, the annular frame is formed by punching a metal plate, laser cutting, resin molding, or the like, so that burrs may occur at the corners of the opening of the annular frame. There was a problem that the stretched tape was damaged by the burr during stretching.

  The present invention has been made in view of such a point, and an object of the present invention is to provide a tape stretching device that can prevent breakage of a stretched tape due to burrs generated in an annular frame.

  The tape stretching device of the present invention is a tape stretching device in which an annular frame is fixed to one surface of the stretching tape, and the work attached to the stretching tape is broken inside the opening formed in the annular frame. A frame holding part for holding the annular frame, and a tape extending part for extending the extending tape by moving the work relative to the annular frame in a direction perpendicular to the work surface, The frame holding part has a protruding part that protrudes toward the one surface of the elongated tape, inside the opening of the annular frame.

  According to this configuration, even when the annular frame and the workpiece move relative to each other in the direction in which the extension tape is pressed against the annular frame, one surface of the extension tape inside the opening of the annular frame abuts the protrusion. Therefore, it is suppressed that the corner | angular part of the opening part of an annular frame bites into an expansion | extension tape. Therefore, even if the burr | flash has generate | occur | produced in the corner | angular part of the opening part of a cyclic | annular flame | frame, damage to an extending | stretching tape can be prevented.

  In the tape extending apparatus according to the present invention, the protrusion is an annular protrusion that extends annularly along an opening edge of the annular frame.

  According to this configuration, since the elongated tape is brought into contact with the annular protrusion along the opening edge of the annular frame, the corner of the opening of the annular frame bites into the elongated tape over the entire circumference of the opening. And the breakage of the stretched tape can be prevented.

  In the tape extending apparatus according to the present invention, the protrusion is a plurality of protrusions arranged at substantially equal intervals along the opening edge of the annular frame.

  According to this configuration, since the extension tape comes into contact with a plurality of protrusions arranged at substantially equal intervals along the opening edge of the annular frame, the corners of the opening of the annular frame bite into the extension tape. Is suppressed over the entire circumference of the opening, and breakage of the elongated tape can be prevented. Moreover, since the contact area is smaller than when the elongated tape is annularly abutted, the elongated tape can be easily pulled away from the protrusion after the fracture processing.

  Moreover, the present invention is characterized in that, in the tape extending device, the tip of the protruding portion is formed in a curved surface shape.

  According to this configuration, it is possible to prevent the extension tape from being damaged by the contact between the extension tape and the protrusion.

  Moreover, the present invention is characterized in that, in the tape extending device, the tip of the projecting portion is located on the same plane as the attaching surface attached to the extending tape of the annular frame.

  According to this configuration, when the tip of the projecting portion is in a position that does not reach the attaching surface of the annular frame, the extension tape is affected by the burr generated at the corner of the opening portion of the annular frame, and When the tip is beyond the attachment surface of the annular frame, the extension tape is peeled off from the annular frame, so the tip of the protrusion is positioned on the same plane as the attachment surface of the annular frame. While suppressing the influence of the burr | flash on a tape to the minimum, peeling from the cyclic | annular frame of an extending | stretching tape can be prevented.

  According to the present invention, in the tape extension device, the frame holding portion is sandwiched between a placement portion on which the placement surface on which the annular frame is placed and the placement surface. A cover part that is fixed by indentation, and an urging member held by the cover part, wherein the protruding part is supported by the cover part so as to be movable in the protruding direction via the urging member; A first projecting portion that abuts on the placement surface; and a second projecting portion that is the same length as the projecting length of the first projecting portion and abuts against one surface of the elongated tape. To do.

  According to this configuration, when the tip of the first protrusion comes into contact with the placement surface of the placement part, the protrusion moves and the positions of the tip of the first protrusion and the tip of the second protrusion are located. Are adjusted on the same plane as the mounting surface. Therefore, regardless of the thickness of the annular frame, the position of the tip of the second protrusion can be adjusted on the same plane as the placement surface. At this time, when the thickness of the extension tape is negligible with respect to the thickness of the annular frame, the end of the second protrusion is positioned on the substantially same plane as the attachment surface of the annular frame. While suppressing the influence of the burr | flash on a tape to the minimum, peeling from the cyclic | annular frame of an extending | stretching tape can be prevented.

  In the tape extending apparatus according to the present invention, a protrusion length adjusting mechanism for adjusting a protrusion length is provided in at least one of the first protrusion and the second protrusion. .

  According to this configuration, the contact position between the extending tape and the second protrusion can be finely adjusted by adjusting the protrusion length of at least one of the first protrusion and the second protrusion. Therefore, the contact position between the extension tape and the second protrusion can be adjusted according to the size of the burr generated at the corner of the opening of the annular frame. Moreover, even if it is a case where the thickness of an extending | stretching tape is a grade which cannot be disregarded with respect to the thickness of an annular frame, the front-end | tip of a 2nd protrusion part can be located on the same plane as the sticking surface of an annular frame.

  According to the present invention, it is possible to prevent the elongation tape from being damaged by the burr generated in the annular frame.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, before describing the tape stretching apparatus according to the first embodiment of the present invention, a semiconductor wafer to be broken will be briefly described. FIG. 1 is a perspective view of a semiconductor wafer attached to an elongated tape.

  As shown in FIG. 1, the semiconductor wafer 2 is formed in a substantially disc shape, and is partitioned into a plurality of regions by division lines arranged in a lattice pattern on the surface, and ICs, LSIs are formed in the partitioned regions. A device 2a such as is formed. In addition, a low-strength altered layer 2b is formed in the semiconductor wafer 2 along the planned division line by laser processing. This laser processing is performed by aligning a condensing point inside the semiconductor wafer 2 and irradiating the semiconductor wafer 2 with a pulsed laser beam having a wavelength that is transmissive to the semiconductor wafer 2 along the division line. Thus, the altered layer 2b is formed.

  In this way, the adhesive film 3 for die bonding is attached to the back surface of the semiconductor wafer 2 having the altered layer 2b formed therein. The adhesive film 3 is formed into a film shape having a thickness of about 20 to 100 μm with an epoxy resin or the like, and is bonded to the back surface of the semiconductor wafer 2 by being thermocompression bonded to the back surface of the semiconductor wafer 2.

  The semiconductor wafer 2 is attached to the surface of the stretched tape 4 stretched so as to cover the opening 5b of the annular frame 5 with the adhesive film 3 interposed therebetween. The stretched tape 4 is a polyolefin sheet having a thickness of about 80 μm to 120 μm, and is formed of a stretchable material. The annular frame 5 is formed in an annular shape by punching a metal plate, and an annular portion 5a to which the extension tape 4 is attached is held by a tape extension device 1 described later. The annular frame 5 is formed with a pair of positioning pin holes 5c at positions facing each other across the opening 5b.

  When the annular frame 5 is set in the tape stretching device 1, the stretching tape 4 is stretched, and an external force is applied to the semiconductor wafer 2 along the planned dividing line whose strength has been lowered by the altered layer 2b. And the adhesive film 3 is simultaneously broken.

  In the present embodiment, the present invention is applied to a configuration in which the semiconductor wafer 2 is individually divided by laser processing. However, the present invention is not limited to this configuration. For example, the present invention is cut by a blade. You may apply to the structure which affixes the adhesive film 3 on the semiconductor wafer 2 divided | segmented separately by the process, and divides | segments this adhesive film 3 according to the semiconductor wafer 2 separately.

  Further, in the present embodiment, an example in which the adhesive film 3 is attached to the semiconductor wafer 2 as a workpiece will be described. However, the present invention is not limited to this configuration, and the semiconductor product package, ceramic, glass, The workpiece may be sapphire, a silicon-based substrate, various electrical components, or various processed materials that require micron-order accuracy.

  Next, with reference to FIG. 2 and FIG. 3, the tape extending | stretching apparatus based on the 1st Embodiment of this invention is demonstrated. FIG. 2 is a perspective view of the tape extending apparatus according to the embodiment of the present invention. FIG. 3 is a diagram for explaining the operation of the tape stretching apparatus.

  As shown in FIG. 2, the tape extending device 1 includes a mounting table 6 on which the annular frame 5 is mounted, a cover plate 7 that is positioned above the mounting table 6 and holds the annular frame 5 together with the mounting table 6, A tape extending portion 8 is provided which is positioned inside the mounting table 6 and extends the extending tape 4 while the annular frame 5 is held on the mounting table 6 and the cover plate 7.

  The mounting table 6 moves the semiconductor wafer 2 up and down via the annular frame 5, and is positioned at the four corners of the mounting plate 11 and the mounting plate 11 having a rectangular shape in top view on which the mounting surface 11 a is formed, It is comprised from the four raising / lowering cylinders 12 which raise / lower the mounting plate 11 from the downward direction. The mounting plate 11 has a circular opening 11b formed in the center, and the opening 11b is formed in a size that allows the extension drum 16 of the tape extension part 8 to be described later to be inserted.

  In addition, a pair of positioning pins 11c are formed to protrude upward from the mounting surface 11a at positions facing each other across the opening 11b of the mounting plate 11, and a pair of the annular frame 5 is formed on the pair of pins 11c. When the pin hole 5c is inserted, the annular frame 5 is placed in a state of being positioned in the front-rear and left-right directions with respect to the placement surface 11a. As described above, the annular frame 5 is placed on the placement surface 11a in a positioned state, whereby the semiconductor wafer 2 is positioned at the center of the opening 11b.

  The four elevating cylinders 12 are constituted by air cylinders or the like, and elevate the mounting plate 11 between a lowered position where the annular frame 5 is attached and detached and an elevated position where the annular frame 5 contacts the cover plate 7. Yes.

  As shown in FIG. 3A, the cover plate 7 is in contact with the annular frame 5 and holds the annular frame 5 together with the mounting plate 11, and is fixed to an outer frame (not shown). The cover plate 7 includes an upper wall portion 7b having a rectangular shape when viewed from above, and four side wall portions 7d that respectively fall downward from four sides of the upper wall portion 7b. It is formed in a size that allows entry. A circular opening 7a is formed at the center of the upper wall portion 7b of the cover plate 7. The opening 7a is large enough to allow the semiconductor wafer 2 attached to the extension drum 16 and the extension tape 4 to be inserted. Is formed.

  Further, the opening 7 a of the cover plate 7 is formed to be smaller than the opening 11 b of the mounting plate 11. When the annular frame 5 is mounted on the mounting plate 11, the opening edge of the cover plate 7 is The annular frame 5 is positioned between the opening edge and the outer peripheral edge of the semiconductor wafer 2.

  Further, the cover plate 7 is formed with an annular protrusion 13 as a protrusion protruding downward from the lower surface 7c of the upper wall 7b along the opening edge, and the protrusion length of the annular protrusion 13 is annular. It corresponds to the thickness of the frame 5. Thus, since the protrusion length of the annular protrusion 13 matches the thickness of the annular frame 5, the annular frame 5 is adhered to the elongated tape 4 when the annular frame 5 is held. It is located on the same plane as the surface 5d.

  The tip of the annular protrusion 13 is formed in a hemispherical shape in cross section, and damage to the elongated tape 4 at the tip is prevented (see FIG. 4). In the present embodiment, the tip of the annular protrusion 13 is hemispherical in cross-section, but the shape is not limited to this shape as long as it has a curved shape contacting the surface of the elongated tape 4.

  The tape extending portion 8 extends the extending tape 4 stretched on the annular frame 5 and includes an extending drum 16 that comes into contact with the extending tape 4 from below and an extending cylinder 15 that raises and lowers the extending drum 16. ing. The extension drum 16 is formed in a cylindrical shape, and a plurality of rolling contact rollers 22 are provided at the upper end portion in the circumferential direction. The plurality of rolling rollers 22 are in rolling contact with the back surface of the extension tape 4 to reduce friction when the extension tape 4 is extended. A suction portion 23 is formed inside the extension drum 16, and this suction portion 23 partially sucks and fixes the extension tape 4 when returning the slackness of the extension tape 4 after the semiconductor wafer 2 is broken. .

  The extension cylinder 15 is composed of an air cylinder or the like, and is between a reference position located below the placement plate 11 and an extension position through which the extension tape 4 is extended through the opening 5b of the placement plate 11. The elongating drum 16 is moved up and down.

  With reference to FIG. 3, the breaking operation of the semiconductor wafer by the tape stretching apparatus will be described. FIGS. 3A and 3B are diagrams for explaining the operation of the tape extending device. FIG. 3A is an initial state in which the annular frame is placed on the placement plate, and FIG. 3B is a view in which the annular frame is held by the placement plate and the cover plate. The state (c) shows the extended state in which the extended tape is extended by the extension drum.

  As shown in FIG. 3A, the annular frame 5 supporting the semiconductor wafer 2 and the like is placed on the placement surface 11a of the placement plate 11 in a positioned state. At this time, the mounting plate 11 is located at the lowered position, and the extension drum 16 is located at the reference position. From this state, the mounting plate 11 is raised toward the raised position by the four lifting cylinders 12.

  As shown in FIG. 3B, when the mounting plate 11 is raised to the raised position by the four lifting cylinders 12, the annular frame 5 is placed on the mounting surface 11 a of the mounting plate 11 and the upper wall 7 b of the cover plate 7. The lower surface 7c is sandwiched from above and below. At this time, an annular region between the inner peripheral edge portion of the annular frame 5 and the outer peripheral edge portion of the semiconductor wafer 2 on the surface of the extension tape 4 approaches the annular protrusion 13 of the cover plate 7. From this state, the extension drum 16 is raised toward the extension position by the extension cylinder 15.

  As shown in FIG. 3 (c), when the extension drum 16 is raised to the extension position by the extension cylinder 15, the rolling roller 22 of the extension drum 16 is brought into contact with the back surface of the extension tape 4 so that the extension tape 4 radiates. The annular region of the elongated tape 4 is brought into contact with the annular protrusion 13. At this time, the ascending speed of the stretching drum 16 when the rolling roller 22 is in rolling contact with the stretching tape 4 is 50 mm / s or more, and a tensile force acts on the stretching tape 4 rapidly. As a result, a low-strength altered layer is formed along the planned dividing line inside the semiconductor wafer 2, so that the semiconductor wafer 2 is broken into individual semiconductor chips along the altered layer 2b. The adhesive film 3 attached to the back surface of the semiconductor wafer 2 is also broken along the outer peripheral edge of the semiconductor chip.

  Further, as shown in FIG. 4A, since the thickness of the annular frame 5 and the protruding length of the annular protrusion 13 are the same, the tip of the annular protrusion 13 is flush with the attaching surface 5d of the annular frame 5. The extension tape 4 is prevented from biting into the corners between the adhering surface 5d and the inner peripheral surface 5e of the annular frame 5, and the influence of the burr 5f on the extension tape 4 is minimized to prevent the damage. At the same time, it becomes possible to prevent peeling of the elongated tape 4 from the annular frame 5.

  For example, as shown in FIG. 4B, when the tip of the annular protrusion 13 is positioned above the attachment surface 5d of the annular frame 5, the attachment surface 5d and the inner peripheral surface 5e of the annular frame 5 are used. The stretched tape 4 may be damaged by the burr 5f generated at the corner. As shown in FIG. 4C, when the tip of the annular protrusion 13 is positioned below the attachment surface 5 d of the annular frame 5, the stretchable tape 4 is peeled from the annular frame 5.

  When the semiconductor wafer 2 and the adhesive film 3 are broken into a plurality of semiconductor chips, the four lifting cylinders 12 and the extension cylinders 15 lower the placement plate 11 and the extension drum 16 to the lowered position and the reference position, respectively. Thereafter, in the state where the broken semiconductor chips are scattered in the state of being adsorbed by the adsorbing portion 23 of the extension drum 16, the slack portion on the annular frame 5 side is heated and recovered, and is delivered to the next process.

  As described above, according to the tape stretching device 1 according to the present embodiment, when the stretching drum 16 is raised to stretch the stretching tape 4, the opening edge of the annular frame 5 on the surface of the stretching tape 4 and the semiconductor wafer 2 is contacted from above by the annular protrusion 13, the corners of the mounting surface 11 a and the inner peripheral surface 5 e of the annular frame 5 may bite into the elongated tape 4. It is suppressed. Therefore, even if burrs 5f are generated at the corners of the annular frame 5, it is possible to prevent the stretched tape 4 from being damaged.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. The tape extending apparatus according to the second embodiment of the present invention is different from the above-described tape extending apparatus according to the first embodiment only in that the protrusion is movable. Therefore, the same configuration will be described using the same reference numerals as those in the first embodiment, and only differences will be described. FIG. 5 is a partial cross-sectional view of a tape stretching apparatus according to the second embodiment of the present invention.

  As shown in FIG. 5A, in the tape extending device 31 according to the second embodiment of the present invention, an annular groove 35c is formed in the upper wall 35a of the cover plate 35. The annular groove 35c is recessed upward from the lower surface 35b. An annular contact portion 35d is provided in the annular groove 35c via a plurality of support columns 35e so as to cover the annular groove 35c. A movable projection 37 is accommodated in the space defined by the annular groove 35c and the contact portion 35d, and the movable projection 37 is attached downward by an urging spring 38 held by the support column 35e. It is housed in a squeezed state.

  The movable protrusion 37 is formed in an annular shape, and an outer peripheral protrusion 37a protrudes downward from the outer edge, and an inner peripheral protrusion 37b protrudes downward from the inner edge. The protruding length of the outer peripheral protrusion 37a and the protruding length of the inner peripheral protrusion 37b are formed to be the same length, and when the tip of the outer peripheral protrusion 37a comes into contact with the mounting surface 11a of the mounting plate 11, The tip of the circumferential protrusion 37b is positioned at the same height as the placement surface 11a. Also, two gaps 35f and 35g are formed concentrically between the inner peripheral surface of the annular groove 35c and the outer peripheral surface of the contact portion 35d, and the movable protrusion 37 is accommodated in the annular groove 35c. The outer peripheral protrusion 37a protrudes from the gap 35f, and the inner peripheral protrusion 37b protrudes from the gap 35g.

  Then, from the initial state shown in FIG. 5A, the mounting plate 11 is raised toward the raised position by the four lifting cylinders 12. As shown in FIG. 5 (b), when the mounting plate 11 is raised to the raised position by the four lifting cylinders 12, the annular frame 5 is moved to the mounting surface 11 a of the mounting plate 11 and the lower surface 35 b of the cover plate 35. Is sandwiched from above and below. At this time, the outer peripheral protrusion 37a is pushed up to the mounting surface 11a of the mounting plate 11 against the urging force of the urging spring 38, and the tip of the outer peripheral protrusion 37a and the tip of the inner peripheral protrusion 37b are placed. Located on the same plane as the surface 11a, the annular region of the elongated tape 4 approaches the inner peripheral projection 37b.

  From this state, when the extension drum 16 is raised to the extension position by the extension cylinder 15, the rolling roller 22 of the extension drum 16 rolls against the back surface of the extension tape 4, and the extension tape 4 is extended in the radial direction. The annular region of the elongated tape 4 is brought into contact with the inner peripheral protrusion 37b. At the same time as the semiconductor wafer 2 is broken into individual semiconductor chips, the adhesive film 3 is also broken along the outer peripheral edge of the semiconductor chip. At this time, the urging force of the urging spring 38 is larger than the tension when the extension tape 4 is extended, and the inner peripheral protrusion 37b is not pushed into the extension tape 4 and moved upward.

  As described above, according to the tape extending device 31 according to the present embodiment, the distal end of the outer peripheral protrusion 37a and the inner periphery of the outer peripheral protrusion 37a are brought into contact with the mounting surface 11a of the mounting plate 11 by the front end of the outer peripheral protrusion 37a. The position of the tip of the protrusion 37b is adjusted on the same plane as the placement surface 11a. Therefore, the position of the tip of the inner peripheral projection 37b can be adjusted on the same plane as the placement surface 11a regardless of the thickness of the annular frame 5. At this time, when the thickness of the elongated tape 4 is negligible with respect to the thickness of the annular frame 5, the tip of the inner peripheral projection 37 b is positioned substantially on the same plane as the attaching surface 5 d of the annular frame 5. Therefore, the influence of the burr 5f on the stretched tape 4 can be minimized, and the stretched tape 4 can be prevented from being peeled off from the annular frame 5.

  In the second embodiment described above, the protrusion length of the outer peripheral protrusion 37a and the protrusion length of the inner peripheral protrusion 37b are the same, and the inner periphery is on the same plane as the mounting surface 11a of the mounting plate 11. Although the tip of the protrusion 37b is positioned, as shown in FIG. 6, the protrusion length adjusting mechanism 41 is provided on the outer periphery protrusion 37a, and the tip of the inner periphery protrusion 37b with respect to the tip of the outer periphery protrusion 37a. You may make it finely adjust the height of.

  The protrusion length adjusting mechanism 41 is configured such that the tip of the outer peripheral protrusion 37a can be finely adjusted in the protrusion direction by a plurality of screw parts 42, and the protrusion length of the outer peripheral protrusion 37a is finely adjusted by the plurality of screw parts 42. Thus, the height of the tip of the inner peripheral projection 37b is adjusted. Therefore, the contact position of the inner peripheral protrusion 37b can be finely adjusted according to the size of the burr 5f generated at the corner of the opening 5b of the annular frame 5. Even when the thickness of the elongated tape 4 is not negligible with respect to the thickness of the annular frame 5, the tip of the inner peripheral projection 37 b is positioned on the same plane as the attaching surface 5 d of the annular frame 5. be able to.

  In this case, the protrusion length adjusting mechanism 41 may be provided on the inner peripheral protrusion 37b instead of the outer peripheral protrusion 37a, or the protrusion length adjusting mechanism 41 may be provided on both the outer peripheral protrusion 37a and the inner peripheral protrusion 37b. You may do it.

  Further, in each of the above-described embodiments, the projecting portions are formed in an annular shape along the opening edge portions of the cover plates 7 and 35, but are substantially equidistant along the opening edge portions of the cover plates 7 and 35. It is good also as a structure which arrange | positions a several protrusion part or a circular arc-shaped protrusion part. Even in such a configuration, the corner of the opening 5b of the annular frame 5 is prevented from biting into the elongated tape 4 over the entire circumference of the opening 5b, and damage to the elongated tape 4 can be prevented. . Moreover, since the contact area with the extending | stretching tape 4 becomes small compared with the structure which forms a protrusion part cyclically | annularly, the extending | stretching tape 4 can be made easy to pull away after a fracture process.

  In each of the above-described embodiments, it is preferable that at least the tip of the protrusion is formed of a material having high peelability such as a fluorine-based resin. Thereby, the extending | stretching tape 4 can be made easy to pull away after a fracture | rupture process.

  In each of the above-described embodiments, the annular frame 5 is held between the cover plates 7 and 35 and the mounting plate 11, and the cover plates 7 and 35 and the mounting plate 11 are fixed and extended. The extension tape 4 is extended by raising the drum 16. However, the extension tape 4 is extended by lowering the cover plates 7 and 35 and the mounting plate 11 with the extension drum 16 fixed. Alternatively, the extension tape 4 may be extended by lowering the cover plates 7 and 35 and the placement plate 11 and raising the extension drum 16.

  The embodiment disclosed this time is illustrative in all respects and is not limited to this embodiment. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims for patent.

  As described above, the present invention has an effect of preventing the elongation tape from being damaged by the burr generated in the annular frame, and in particular, the tape elongation that breaks the work adhered to the surface of the elongation tape. Useful for equipment.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the tape expansion | extension apparatus which concerns on this invention, and is a perspective view of the semiconductor wafer stuck on the expansion | extension tape. It is a figure which shows 1st Embodiment of the tape expansion | extension apparatus which concerns on this invention, and is a perspective view of a tape expansion | extension apparatus. It is a figure which shows 1st Embodiment of the tape expansion | extension apparatus which concerns on this invention, and is operation | movement explanatory drawing of a tape expansion | extension apparatus. It is a figure which shows 1st Embodiment of the tape expansion | extension apparatus which concerns on this invention, and is a figure which shows the positional relationship of the front-end | tip of an annular protrusion, and an expansion | extension tape. It is a figure which shows 2nd Embodiment of the tape expansion | extension apparatus which concerns on this invention, and is a fragmentary sectional view of a tape expansion | extension apparatus. It is a figure which shows the modification of 2nd Embodiment of the tape expansion | extension apparatus which concerns on this invention.

Explanation of symbols

1 Tape stretcher 2 Semiconductor wafer (work)
3 Adhesive film (work)
4 Stretch tape 5 Annular frame 5b Opening 5d Adhering surface 5f Burr 6 Mounting table (frame holding part)
7, 35 Cover plate (frame holding part, cover part)
8 Tape extension part (mounting part)
11 mounting plate 11a mounting surface 13 annular protrusion (protrusion)
16 Elongating drum 35c Annular groove 35d Contact part 35e Support pillar 35f, 35g Gap 37 Movable protrusion 37a Outer peripheral protrusion (first protrusion)
37b Inner peripheral protrusion (second protrusion)
38 Biasing spring (Biasing member)
41 Projection length adjustment mechanism 42 Screw part

Claims (7)

An annular frame is fixed to one surface of the stretching tape, and a tape stretching device that breaks a workpiece attached to the stretching tape inside an opening formed in the annular frame,
A frame holding portion for holding the annular frame;
A tape extension part for extending the extension tape by moving the workpiece relative to the annular frame in a direction perpendicular to the workpiece surface;
The tape holding device according to claim 1, wherein the frame holding portion has a protruding portion that protrudes toward the one surface of the extending tape inside the opening of the annular frame.   The tape extending device according to claim 1, wherein the protrusion is an annular protrusion that extends annularly along an opening edge of the annular frame.   The tape extending device according to claim 1, wherein the protrusions are a plurality of protrusions arranged at substantially equal intervals along the opening edge of the annular frame.   The tape extending device according to any one of claims 1 to 3, wherein a tip of the protruding portion is formed in a curved shape.   The tape extending device according to any one of claims 1 to 4, wherein a tip of the projecting portion is located on the same plane as an attaching surface attached to the extending tape of the annular frame. . The frame holding portion includes a placement portion on which a placement surface on which the annular frame is placed, a cover portion that sandwiches and fixes the annular frame between the placement surface, and the cover portion And a biasing member held by
The protruding portion is supported by the cover portion so as to be movable in the protruding direction via the biasing member, and has the same length as the first protruding portion that contacts the placement surface, and the protruding length of the first protruding portion. The tape extending device according to any one of claims 1 to 5, further comprising a second protruding portion that is long and abuts against one surface of the extending tape.   The tape extending device according to claim 6, wherein a protrusion length adjusting mechanism for adjusting a protrusion length is provided on at least one of the first protrusion and the second protrusion.

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