CN112122825B - Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug - Google Patents
Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug Download PDFInfo
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- CN112122825B CN112122825B CN202010825652.4A CN202010825652A CN112122825B CN 112122825 B CN112122825 B CN 112122825B CN 202010825652 A CN202010825652 A CN 202010825652A CN 112122825 B CN112122825 B CN 112122825B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug, which comprises the following steps: mixing an isocyanate silane coupling agent and the graphene nanosheet water dispersion, and stirring for reaction to obtain a modified graphene nanosheet treating solution; uniformly spraying the obtained modified graphene nanosheet treating solution on the surface of a preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug substrate; and (3) uniformly spraying the soldering flux on the surface of the pretreated preformed soldering lug base material, and drying to obtain the 5G communication tin base band coating halogen-free preformed soldering lug. The halogen-free preformed soldering lug with the coating, prepared by the invention, has higher welding uniformity and lower voidage, is suitable for processing a 5G substrate, and is beneficial to improving the yield and reliability of 5G products.
Description
Technical Field
The invention relates to the technical field of preformed soldering lugs, in particular to a preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug.
Background
With the rapid development of communication technology, especially the gradual popularization and application of 5G technology, large-substrate high-power components have been widely used, and the packaging process has a very important influence on the performance and reliability of the 5G substrate. In the packaging process of the substrate, soldering is an important process. In the traditional process, solder paste is adopted for reflow soldering, a large amount of organic solvent in the solder paste volatilizes in the soldering process to generate a large amount of gas, and finally a cavity is formed, the cavity rate can reach more than 40%, the electric conductivity and the heat conductivity of a substrate are seriously influenced, the problems of product failure, poor reliability and the like are easily caused, the efficiency is low, the yield is low, the cost is high, and the technical requirements of 5G products cannot be met. The preformed soldering lug is a novel soldering material, comprises a preformed tin-based thin sheet and a soldering flux coating on the surface of the thin sheet, and has the advantages of high accuracy, low soldering voidage and little soldering flux residue. In order to improve the yield and reliability of 5G products, it has become a current research trend to develop a pre-formed solder tab with higher soldering uniformity and lower void ratio suitable for 5G substrates.
Disclosure of Invention
Based on the problems in the prior art, the invention provides a preparation method of a 5G communication tin-based coating halogen-free preformed soldering lug.
The invention is realized by the following technical scheme:
a preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug comprises the following steps:
(1) mixing an isocyanate silane coupling agent and the graphene nanosheet water dispersion, and stirring for reaction for 12-24h to obtain a modified graphene nanosheet treating solution;
(2) uniformly spraying the modified graphene nanosheet treating solution obtained in the step (1) on the surface of a tin-based preformed soldering lug substrate, and drying to obtain a pretreated tin-based preformed soldering lug substrate;
(3) uniformly spraying soldering flux on the surface of the pretreated tin-based preformed soldering lug substrate, and drying to obtain the 5G communication tin-based strip coating halogen-free preformed soldering lug;
the soldering flux comprises the following raw materials in parts by weight: 30-40 parts of rosin, 5-10 parts of epoxidized soybean oil, 6-8 parts of an activating agent, 0-1 part of a surfactant and 20-30 parts of a solvent.
The rosin is prepared from water white rosin and maleic rosin in a weight ratio of 1: (3-4); the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to a weight ratio of 1: (0.5-1): (1-2): (0.5-1); the surfactant is at least one of Tween 80, span 60 and fatty alcohol-polyoxyethylene ether AEO-9; the solvent is at least one of ethanol, isopropanol and ethylene glycol monomethyl ether.
The silane coupling agent is isocyanate silane coupling agent, preferably isocyanate propyl triethoxy silane.
The weight ratio of the silane coupling agent to the graphene nanosheet aqueous dispersion is (1-2): 10.
the solid content of the graphene nanosheet aqueous dispersion is 1-2%.
The weight ratio of the modified graphene nanosheet treating fluid to the tin-based preformed soldering lug base material is (2-4): 100.
the weight ratio of the soldering flux to the pretreated tin-based preformed soldering tin substrate is (1-2): 100.
in the step (3), the drying conditions are as follows: drying at 15-25 deg.C for 3-5 hr, and drying at 65-75 deg.C for 2-3 hr.
In the step (2), the drying temperature is 25-45 ℃ and the drying time is 5-12 h.
The tin-based preformed soldering lug base material is a gold-tin alloy foil, and the chemical composition of the tin-based preformed soldering lug base material is Au80Sn 20.
The 5G communication tin base band coating halogen-free preformed soldering lug is prepared by the preparation method.
The invention has the following beneficial effects:
the method comprises the steps of carrying out coating treatment on the surface of a preformed soldering lug substrate by adopting a secondary coating method, wherein a silane coupling agent and graphene nanosheet aqueous dispersion are mixed, stirred and reacted to bond the silane coupling agent and graphene nanosheet surface active groups, spraying the silane coupling agent and graphene nanosheet surface active groups on the surface of a tin-based preformed soldering lug substrate, uniformly fixing the graphene nanosheets on the surface of the substrate under the action of the coupling agent, then carrying out spraying treatment by using a soldering flux with proper components, and coating a soldering flux coating on the surface of the substrate to obtain the preformed soldering lug with a coating. The first coating layer formed by the graphene nanosheet-silane coupling agent can play a role in bridging, the wetting and spreading speed and the spreading uniformity of the soldering flux on the surface of the preformed soldering lug substrate are improved, the soldering flux coating with consistent thickness and uniform composition can be formed after curing, the heating uniformity of the soldering flux coating is improved, the residues of the soldering flux are reduced, and the voidage is reduced; meanwhile, the coating layer can also improve the heat conduction performance of the soldering flux coating during welding, gas can escape uniformly and quickly, and bubbles are prevented from being left during air exhaust, so that the formation of cavities is reduced. Furthermore, the invention also selects proper soldering flux components, wherein the rosin obtained by compounding water white rosin and maleic rosin according to a proper proportion is used as a film forming base material, the succinic acid, the citric acid, the ethylenediamine and the triethanolamine are compounded according to a proper proportion to obtain an activating agent so as to prevent the base material from being oxidized during welding, the surfactant and the solvent improve the compatibility of each component and adjust the viscosity, and the epoxidized soybean oil used as the film forming auxiliary agent can play a role in adjusting the viscosity and the fluidity on one hand and improving the distribution uniformity of the soldering flux on the surface of the base material on the other hand, when the first coating layer adopts the isocyanate silane coupling agent, the epoxy soybean oil can play a role in reacting with isocyanate groups in the first coating layer, so that the interaction between the graphene and the soldering flux coating and the tin-based nanosheet pre-formed soldering flux base material is enhanced, and the formation of defects between the soldering flux base material and the coating is reduced, thereby further reducing the void ratio during welding. The halogen-free preformed soldering lug with the coating, prepared by the invention, has higher welding uniformity and lower voidage, can reduce the voidage to below 3 percent, is suitable for processing a 5G substrate, and is beneficial to improving the yield and the reliability of a 5G product.
Detailed Description
The technical solution of the present invention will be described in detail by specific examples.
Example 1
A preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug comprises the following steps:
(1) mixing isocyanate propyl triethoxysilane and graphene nanosheet water dispersion with the solid content of 1% in a weight ratio of 1: 10, stirring and reacting for 12 hours after mixing to obtain modified graphene nanosheet treating fluid;
(2) uniformly spraying the modified graphene nanosheet treating solution obtained in the step (1) on the surface of a tin-based preformed soldering lug base material, and drying at 25 ℃ for 12 hours to obtain a pretreated tin-based preformed soldering lug base material, wherein the weight ratio of the modified graphene nanosheet treating solution to the tin-based preformed soldering lug base material is 2: 100, respectively;
(3) uniformly spraying the soldering flux on the surface of the pretreated tin-based preformed soldering lug base material, drying at 15 ℃ for 5h, and then drying at 65 ℃ for 3h to obtain the 5G communication tin base band coating halogen-free preformed soldering lug, wherein the weight ratio of the soldering flux to the pretreated tin-based preformed soldering lug base material is 1: 100, respectively;
the soldering flux comprises the following raw materials in parts by weight: 30 parts of rosin, 5 parts of epoxidized soybean oil, 6 parts of an activating agent and 20 parts of ethanol; wherein the rosin is prepared from water white rosin and maleic rosin according to the weight ratio of 1: 3, preparing a composition; the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to the weight ratio of 1: 0.5: 1: 0.5.
The tin-based pre-formed solder pad base material is a gold-tin alloy foil with the chemical composition of Au80Sn 20.
Example 2
A preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug comprises the following steps:
(1) mixing isocyanate propyl triethoxysilane and graphene nanosheet water dispersion with the solid content of 2% in a weight ratio of 2: 10, stirring and reacting for 24 hours to obtain modified graphene nanosheet treating fluid;
(2) uniformly spraying the modified graphene nanosheet treating solution obtained in the step (1) on the surface of a tin-based preformed soldering lug base material, and drying at 45 ℃ for 5 hours to obtain a pretreated tin-based preformed soldering lug base material, wherein the weight ratio of the modified graphene nanosheet treating solution to the tin-based preformed soldering lug base material is 4: 100, respectively;
(3) uniformly spraying the soldering flux on the surface of the pretreated tin-based preformed soldering lug base material, drying at 25 ℃ for 3h, and then drying at 75 ℃ for 2h to obtain the 5G communication tin base band coating halogen-free preformed soldering lug, wherein the weight ratio of the soldering flux to the pretreated tin-based preformed soldering lug base material is 2: 100, respectively;
the soldering flux comprises the following raw materials in parts by weight: 40 parts of rosin, 10 parts of epoxidized soybean oil, 8 parts of an activating agent, 801 parts of tween and 30 parts of isopropanol; wherein the rosin is prepared from water white rosin and maleic rosin according to the weight ratio of 1: 4, preparing a composition; the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to the weight ratio of 1: 1: 2: 1.
The tin-based pre-formed solder pad base material is a gold-tin alloy foil with the chemical composition of Au80Sn 20.
Example 3
A preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug comprises the following steps:
(1) mixing isocyanate propyl triethoxysilane and graphene nanosheet water dispersion with the solid content of 1.5% according to the weight ratio of 1.8: 10, stirring and reacting for 16 hours to obtain modified graphene nanosheet treating fluid;
(2) uniformly spraying the modified graphene nanosheet treating solution obtained in the step (1) on the surface of a tin-based preformed soldering lug base material, and drying at 30 ℃ for 10 hours to obtain a pretreated tin-based preformed soldering lug base material, wherein the weight ratio of the modified graphene nanosheet treating solution to the tin-based preformed soldering lug base material is 3: 100, respectively;
(3) uniformly spraying the soldering flux on the surface of the pretreated tin-based preformed soldering lug base material, drying at 20 ℃ for 4h, and then drying at 70 ℃ for 2.5h to obtain the 5G communication tin-based preformed soldering lug without halogen, wherein the weight ratio of the soldering flux to the pretreated tin-based preformed soldering lug base material is 1.5: 100, respectively;
the soldering flux comprises the following raw materials in parts by weight: 35 parts of rosin, 8 parts of epoxidized soybean oil, 7 parts of an activating agent, 90.5 parts of fatty alcohol-polyoxyethylene ether AEO-and 24.5 parts of ethylene glycol monomethyl ether; wherein the rosin is prepared from water white rosin and maleic rosin according to the weight ratio of 1: 3.5; the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to the weight ratio of 1: 0.75: 1.5: 0.75 composition.
The tin-based pre-formed solder pad base material is a gold-tin alloy foil with the chemical composition of Au80Sn 20.
Comparative example 1
A method for preparing a tin-based tape coated halogen-free preformed solder lug comprises the following steps:
uniformly spraying the soldering flux on the surface of a tin-based preformed soldering lug substrate, drying for 4h at 20 ℃, and then drying for 2.5h at 70 ℃ to obtain the 5G communication tin base band coating halogen-free preformed soldering lug, wherein the weight ratio of the soldering flux to the tin-based preformed soldering lug substrate is 1.5: 100, respectively;
the soldering flux comprises the following raw materials in parts by weight: 35 parts of rosin, 8 parts of epoxidized soybean oil, 7 parts of an activating agent, 90.5 parts of fatty alcohol-polyoxyethylene ether AEO-and 24.5 parts of ethylene glycol monomethyl ether; wherein the rosin is prepared from water white rosin and maleic rosin according to the weight ratio of 1: 3.5; the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to the weight ratio of 1: 0.75: 1.5: 0.75 composition.
The tin-based pre-formed solder pad base material is a gold-tin alloy foil with the chemical composition of Au80Sn 20.
The chips were reflow-soldered using the preformed solder pads obtained in examples 1 to 3 and comparative example 1, and subjected to a void ratio test using an X-ray probe method, wherein the void ratio is (S)1-S2)/S1In the formula S1For the solderable area of the chip, S2Is the actual bonding area of the chip. The void fraction test results are shown in table 1:
TABLE 1 voidage test results
| Example 1 | Example 2 | Example 3 | Comparative example 1 | |
| Void ratio (%) | 0.45 | 0.41 | 0.38 | 1.02 |
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A preparation method of a 5G communication tin base band coating halogen-free preformed soldering lug is characterized by comprising the following steps:
(1) mixing a silane coupling agent and the graphene nanosheet aqueous dispersion, and stirring for reaction for 12-24h to obtain a modified graphene nanosheet treating solution;
(2) uniformly spraying the modified graphene nanosheet treating solution obtained in the step (1) on the surface of a tin-based preformed soldering lug substrate, and drying to obtain a pretreated tin-based preformed soldering lug substrate;
(3) uniformly spraying soldering flux on the surface of the pretreated tin-based preformed soldering lug substrate, and drying to obtain the 5G communication tin-based strip coating halogen-free preformed soldering lug;
the soldering flux comprises the following raw materials in parts by weight: 30-40 parts of rosin, 5-10 parts of epoxidized soybean oil, 6-8 parts of an activating agent, 0-1 part of a surfactant and 20-30 parts of a solvent.
2. The method of claim 1, wherein the rosin is a mixture of water white rosin and maleic rosin in a weight ratio of 1: (3-4); the activating agent is prepared from succinic acid, citric acid, ethylenediamine and triethanolamine according to a weight ratio of 1: (0.5-1): (1-2): (0.5-1); the surfactant is at least one of Tween 80, span 60 and fatty alcohol-polyoxyethylene ether AEO-9; the solvent is at least one of ethanol, isopropanol and ethylene glycol monomethyl ether.
3. The method of claim 1, wherein the silane coupling agent is an isocyanatosilane coupling agent.
4. The method for preparing the 5G communication tin-based coated halogen-free preformed solder flake according to claim 1, wherein the weight ratio of the silane coupling agent to the graphene nano-flake aqueous dispersion is (1-2): 10.
5. the method for preparing the 5G communication tin-based coated halogen-free preformed solder flake according to claim 1, wherein the solid content of the graphene nano flake aqueous dispersion is 1-2%.
6. The preparation method of the 5G communication tin-based coated halogen-free preformed solder lug as claimed in claim 1, wherein the weight ratio of the modified graphene nanosheet treating solution to the tin-based preformed solder lug substrate is (2-4): 100.
7. the method for preparing the 5G communication tin-based coated halogen-free preformed soldering terminal as claimed in claim 1, wherein the weight ratio of the soldering flux to the pretreated tin-based preformed soldering terminal substrate is (1-2): 100.
8. the method for preparing a 5G telecommunications tin-based coated halogen-free preformed solder flake according to claim 1, wherein the drying in step (3) is performed under the following conditions: drying at 15-25 deg.C for 3-5 hr, and drying at 65-75 deg.C for 2-3 hr.
9. The method for preparing a 5G telecommunications tin-based coated halogen-free preformed solder fillet as claimed in claim 1, wherein the drying temperature in the step (2) is 25-45 ℃ and the drying time is 5-12 h.
10. A 5G telecommunications tin base band coated halogen-free preformed solder flake, characterized in that it is prepared by the process of any of claims 1-9 for preparing a 5G telecommunications tin base band coated halogen-free preformed solder flake.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1309322C (en) * | 1988-01-29 | 1992-10-27 | Paul Emile Fortin | Process for improving the corrosion resistance of brazing sheet |
| CN103056556A (en) * | 2012-03-20 | 2013-04-24 | 浙江亚通焊材有限公司 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
| CN103521953A (en) * | 2013-10-25 | 2014-01-22 | 广州汉源新材料有限公司 | Coating process for preformed soldering lug soldering flux |
| CN106695158A (en) * | 2016-12-28 | 2017-05-24 | 北京康普锡威科技有限公司 | Soft solder containing graphene and preparation method of soft solder |
| CN107999994A (en) * | 2017-11-22 | 2018-05-08 | 深圳市福英达工业技术有限公司 | Micrometer/nanometer granule enhancement type composite solder and preparation method thereof |
| CN110666267A (en) * | 2019-10-11 | 2020-01-10 | 江苏科技大学 | Tin soldering point alloying forming method |
-
2020
- 2020-08-17 CN CN202010825652.4A patent/CN112122825B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1309322C (en) * | 1988-01-29 | 1992-10-27 | Paul Emile Fortin | Process for improving the corrosion resistance of brazing sheet |
| CN103056556A (en) * | 2012-03-20 | 2013-04-24 | 浙江亚通焊材有限公司 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
| CN103521953A (en) * | 2013-10-25 | 2014-01-22 | 广州汉源新材料有限公司 | Coating process for preformed soldering lug soldering flux |
| CN106695158A (en) * | 2016-12-28 | 2017-05-24 | 北京康普锡威科技有限公司 | Soft solder containing graphene and preparation method of soft solder |
| CN107999994A (en) * | 2017-11-22 | 2018-05-08 | 深圳市福英达工业技术有限公司 | Micrometer/nanometer granule enhancement type composite solder and preparation method thereof |
| CN110666267A (en) * | 2019-10-11 | 2020-01-10 | 江苏科技大学 | Tin soldering point alloying forming method |
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