CN116900553B - Preparation method of lead-free composite soldering paste with high spreading rate - Google Patents
Preparation method of lead-free composite soldering paste with high spreading rate Download PDFInfo
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- CN116900553B CN116900553B CN202310861551.6A CN202310861551A CN116900553B CN 116900553 B CN116900553 B CN 116900553B CN 202310861551 A CN202310861551 A CN 202310861551A CN 116900553 B CN116900553 B CN 116900553B
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- 238000005476 soldering Methods 0.000 title claims abstract description 96
- 239000002131 composite material Substances 0.000 title claims abstract description 31
- 230000007480 spreading Effects 0.000 title claims abstract description 23
- 238000003892 spreading Methods 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 58
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims abstract description 45
- 230000004907 flux Effects 0.000 claims abstract description 44
- 238000006243 chemical reaction Methods 0.000 claims abstract description 38
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 29
- DTGDMPJDZKDHEP-UHFFFAOYSA-N 4-ethenylbicyclo[4.2.0]octa-1(6),2,4-triene Chemical compound C=CC1=CC=C2CCC2=C1 DTGDMPJDZKDHEP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000002156 mixing Methods 0.000 claims abstract description 22
- QBFNGLBSVFKILI-UHFFFAOYSA-N 4-ethenylbenzaldehyde Chemical compound C=CC1=CC=C(C=O)C=C1 QBFNGLBSVFKILI-UHFFFAOYSA-N 0.000 claims abstract description 20
- LJXQPZWIHJMPQQ-UHFFFAOYSA-N pyrimidin-2-amine Chemical compound NC1=NC=CC=N1 LJXQPZWIHJMPQQ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 12
- 238000004132 cross linking Methods 0.000 claims abstract description 5
- 239000000376 reactant Substances 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 50
- 239000002904 solvent Substances 0.000 claims description 29
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 24
- 239000013543 active substance Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000004094 surface-active agent Substances 0.000 claims description 21
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 20
- 239000000654 additive Substances 0.000 claims description 19
- 230000000996 additive effect Effects 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000013008 thixotropic agent Substances 0.000 claims description 19
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- 229910045601 alloy Inorganic materials 0.000 claims description 15
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- 238000000034 method Methods 0.000 claims description 15
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- 238000005303 weighing Methods 0.000 claims description 13
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 12
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- -1 alcohol amine Chemical class 0.000 claims description 12
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- 238000001816 cooling Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims description 10
- 229960000583 acetic acid Drugs 0.000 claims description 10
- 239000012362 glacial acetic acid Substances 0.000 claims description 10
- 239000003906 humectant Substances 0.000 claims description 10
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- 239000007788 liquid Substances 0.000 claims description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical group OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 5
- 239000012964 benzotriazole Substances 0.000 claims description 5
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 5
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 5
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229920001030 Polyethylene Glycol 4000 Polymers 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 3
- QGVQVNIIRBPOAM-UHFFFAOYSA-N dodecyl naphthalene-1-sulfonate;sodium Chemical compound [Na].C1=CC=C2C(S(=O)(=O)OCCCCCCCCCCCC)=CC=CC2=C1 QGVQVNIIRBPOAM-UHFFFAOYSA-N 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 claims description 3
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000001630 malic acid Substances 0.000 claims description 2
- 235000011090 malic acid Nutrition 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 29
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 150000004753 Schiff bases Chemical class 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 125000000714 pyrimidinyl group Chemical group 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002262 Schiff base Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910007116 SnPb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 125000003172 aldehyde group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 125000001047 cyclobutenyl group Chemical class C1(=CCC1)* 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical group CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910006592 α-Sn Inorganic materials 0.000 description 1
- 229910006640 β-Sn Inorganic materials 0.000 description 1
- 229910006632 β—Sn Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention relates to the field of soldering paste, in particular to a preparation method of lead-free composite soldering paste with high spreading rate, which comprises the following steps: (1) preparing a modified benzocyclobutene resin: s1, taking 4-vinyl benzaldehyde and 2-aminopyrimidine as reactants, and carrying out a combination reaction to obtain an intermediate reaction product; s2, carrying out a crosslinking reaction on the 4-vinylbenzocyclobutene and the intermediate reaction product obtained in the S1 to obtain modified benzocyclobutene resin; (2) preparing soldering flux; (3) preparing lead-free composite solder paste: and uniformly mixing the soldering flux and the soldering powder to obtain the lead-free composite soldering paste. After the soldering flux prepared by the invention is combined with soldering tin powder, the obtained soldering tin paste is environment-friendly, nontoxic, high in stability, strong in thermal stability and good in wettability, and the strength and the spreading rate of a soldered spot are improved greatly compared with those of the existing soldering tin paste.
Description
Technical Field
The invention relates to the field of soldering paste, in particular to a preparation method of lead-free composite soldering paste with high spreading rate.
Background
In the 70 th century, the surface mounting technology (Surface Mount Assembly, abbreviated as SMT) refers to a technology of printing and coating solder paste on a printed circuit board pad, accurately attaching a surface mounted component to the solder paste-coated pad, heating the circuit board according to a specific reflow temperature profile, melting the solder paste, cooling and solidifying the alloy components, and forming a solder joint between the component and the printed circuit board to realize metallurgical connection.
Solder paste is a new type of solder material that has been developed with SMT. Solder paste is a complex system, and the related scientific knowledge is very wide, such as comprehensive knowledge of metalology, powder, fluid mechanics, organic chemistry, physical chemistry and the like. The performance of the solder paste is determined by the solder powder and the soldering flux, the rheological property and the weldability of the solder paste are affected by the components, proportion, particle size distribution, surface oxide and the like of the alloy powder, and the preparation and the performance of the solder paste are greatly affected by the interaction rule among the components in the soldering flux. Thus, research into solder powders and fluxes is critical to solder paste preparation and development.
In the field of electronic packaging, sn-Pb solder is favored because of the characteristics of low cost, good wettability, excellent soldering performance and the like. The common SnPb solder is mainly SnPb eutectic or near-eutectic alloy, has a melting point of about 183 ℃, and is suitable for electronic components with lower working temperature. Research shows that Pb can reduce the surface tension of molten solder and improve the wettability of the solder; the addition of Pb can also prevent the transformation from beta-Sn to alpha-Sn, so that the failure of the electronic product due to overlarge volume change can be avoided. However, with the development of Sn-Pb solder application and the improvement of people's health and environmental awareness, many researchers find that Pb is a heavy metal element with strong toxicity, and causes serious damage to human health. In order to solve the threat of Pb pollution to human and environmental safety, related instructions of lead inhibition are sequentially introduced from countries around the world, people search for substitutes of Sn-Pb solder, and research of lead-free alloy solder is paid attention to the world.
The solder paste is composed of solder powder and soldering flux, the lead-free solder paste can be divided into high-temperature solder paste, medium-temperature solder paste and low-temperature solder paste according to the melting temperature of the solder powder, the high-temperature solder paste is represented by Sn-Cu and Sn-Ag-Cu, the medium-temperature solder paste is represented by Sn-Zn, and the low-temperature solder paste is represented by Sn-Bi. With the rapid advancement of leadless process, the traditional tin-lead solder paste brings a series of problems in the application and conversion process of the lead-free solder paste. First, high melting point solders necessarily require a flux to match, and oxidation resistance at high temperatures is also improved compared to conventional fluxes. Secondly, with the development of the solder paste in the halogen-free direction, the solderability and wettability of the soldering flux in the existing halogen-free solder paste are insufficient, so that the spreading rate is low.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention aims to provide a preparation method of lead-free composite solder paste with high spreading rate.
The aim of the invention is realized by adopting the following technical scheme:
a preparation method of lead-free composite solder paste with high spreading rate comprises the following steps:
(1) Preparing modified benzocyclobutene resin:
s1, taking 4-vinyl benzaldehyde and 2-aminopyrimidine as reactants, and carrying out a combination reaction to obtain an intermediate reaction product;
s2, carrying out a crosslinking reaction on the 4-vinylbenzocyclobutene and the intermediate reaction product obtained in the S1 to obtain modified benzocyclobutene resin;
(2) Preparing a soldering flux:
weighing an active agent, a surfactant, a film forming agent, modified benzocyclobutene resin, a thixotropic agent, a trace additive and a solvent according to parts by weight, and uniformly mixing and stirring to obtain a soldering flux;
(3) Preparing lead-free composite solder paste:
and uniformly mixing the soldering flux and the soldering powder to obtain the lead-free composite soldering paste.
Preferably, in step (1), the preparation process of S1 includes:
weighing 4-vinyl benzaldehyde, 2-aminopyrimidine and solvent xylene, mixing into a reaction flask, fully and uniformly stirring at room temperature, then dropwise adding a few drops of glacial acetic acid, heating to 90-110 ℃ in an oil bath pot, stirring at a speed of 200-400rpm for 3-5h, continuously dividing water during the reaction, removing the solvent after the reaction is finished, and drying to obtain an intermediate reaction product.
More preferably, in S1, the mass ratio of 4-vinylbenzaldehyde, 2-aminopyrimidine and xylene is 1.32:1.19-1.42:20-40.
More preferably, in the step S1, the addition mass of glacial acetic acid is 2% -6% of the mass of 4-vinylbenzaldehyde.
Preferably, in step (1), the preparation process of S2 includes:
and (3) weighing the intermediate reaction product, mixing the intermediate reaction product into tetrahydrofuran, fully and uniformly stirring at room temperature, introducing nitrogen as a shielding gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating to 60-70 ℃ in a water bath, stirring at a speed of 300-500rpm for reaction for 2-4 hours, and removing and drying after the reaction is finished to obtain the modified benzocyclobutene resin.
More preferably, in S2, the mass ratio of the 4-vinylbenzocyclobutene, the intermediate reaction product and the tetrahydrofuran is 1.43-2.86:1:25-50.
More preferably, in the step S2, the addition mass of the initiator azodiisobutyronitrile is 1-5% of the mass of the 4-vinylbenzocyclobutene.
Preferably, in the step (2), the soldering flux comprises the following components in parts by weight:
5-8 parts of active agent, 0.3-1.2 parts of surfactant, 0.5-1 part of film forming agent, 12-23 parts of modified benzocyclobutene resin, 3-7 parts of thixotropic agent, 0.1-0.3 part of trace additive and 50-70 parts of solvent.
Preferably, the active agent is mixed by organic acid and alcohol amine according to a mass ratio of 5-8:1, wherein the organic acid comprises at least one of adipic acid, azelaic acid, sebacic acid, malic acid and salicylic acid, and the alcohol amine is triethanolamine.
Preferably, the surfactant is an aromatic surfactant and comprises one or more of sodium dodecyl benzene sulfonate, sodium dodecyl naphthalene sulfonate, polyoxyethylene nonylphenol ether, polyoxyethylene nonylphenol polyether-3 phosphate and polyoxyethylene nonylphenol ether sodium sulfonate.
Preferably, the film forming agent is polyethylene glycol, including one or more of PEG-1000, PEG-2000, and PEG-4000.
Preferably, the thixotropic agent is polyoxyethylene-40 hydrogenated castor oil or a polyamide wax.
Preferably, the trace additive comprises a corrosion inhibitor and a humectant, wherein the corrosion inhibitor is benzotriazole, and the humectant is glycerol.
Preferably, the solvent is obtained by mixing tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether and methoxy polyethylene glycol (MPEG-400) according to the mass ratio of 6-8:2-4:1.
Preferably, in the step (2), the preparation process of the soldering flux specifically includes:
preparing a clean container, sequentially adding a solvent, an active agent, a surfactant and a trace additive into the container, placing the container at 50-60 ℃, stirring the container at a speed of 500-600rpm until the container is uniform, then heating the container to 80-90 ℃, sequentially adding a film forming agent and a modified benzocyclobutene resin, stirring the container at a speed of 600-800rpm until the container is uniform, finally adding a thixotropic agent, heating the container to 100-120 ℃, stirring the container until the container is completely uniform, placing the container in a cold water bath, cooling the container to room temperature, continuously stirring the container during cooling to obtain uniform viscous liquid, and storing the viscous liquid at 4 ℃.
Preferably, in the step (3), the mass ratio of the soldering tin powder to the soldering flux is 8.8-9.2:1.8-2.2.
Preferably, the soldering tin powder is a Sn-Ag-Cu alloy, wherein the Sn-Ag-Cu alloy comprises, in mass ratio: ag:1.4% -3.6%, cu:0.3% -1.5%, and the balance Sn.
Preferably, in the step (3), the soldering flux and the soldering tin powder are mixed in a mode of gradually adding the soldering tin powder into the soldering flux, the soldering tin powder is continuously stirred during the adding period, and the soldering tin powder is continuously stirred until being uniform after being fully added, so that the soldering tin paste is obtained.
The beneficial effects of the invention are as follows:
1. the invention prepares the lead-free composite soldering paste with high spreading rate by improving the soldering flux in the soldering paste, wherein the soldering powder adopts lead-free alloy, namely Sn-Ag-Cu alloy, and has high temperature stability and excellent mechanical property. The modified benzocyclobutene resin needle is used for replacing rosin resin materials in the existing soldering flux, and the prepared soldering flux is combined with soldering tin powder, so that the obtained soldering paste is environment-friendly, nontoxic, high in stability, strong in thermal stability and good in wettability, and the strength and the spreading rate of a soldered welding spot are improved greatly compared with those of the existing soldering paste.
2. In the case of using rosin resin as flux resin, the content of the active agent is selected to increase the spreading rate of the solder paste, but the increase of the content of the active agent not only results in more remarkable post-soldering residue of the solder paste, but also is limited in the increase of the spreading rate of the solder paste. The modified cyclobutene resin prepared by the method is used for replacing rosin resin, has enough activity without excessively increasing the content of an active agent, can effectively reduce the surface tension of a welded material, and improves the spreading rate of solder paste.
3. The prepared modified benzocyclobutene resin is used as the resin of the soldering flux, so that a good effect is achieved. The preparation process of the modified benzocyclobutene resin comprises the following steps: firstly, carrying out aldehyde-amine condensation reaction on 4-vinyl benzaldehyde containing double bonds and aldehyde groups and 2-aminopyrimidine containing amino groups and pyrimidine groups, and forming Schiff base through the combination reaction of the aldehyde groups and the amino groups, so as to obtain an intermediate reaction product containing double bonds, schiff base and pyrimidine groups; and then carrying out cross-linking polymerization reaction on the double bond-containing 4-vinylbenzocyclobutene and an intermediate reaction product to finally prepare the modified benzocyclobutene resin.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic illustration of the specific application of the composite solder paste prepared in example 1 and comparative examples 1-3 of the present invention; wherein A represents example 1, B represents comparative example 1, C represents comparative example 2, and D represents comparative example 3.
Detailed Description
The technical scheme of the invention is described below through specific examples. It is to be understood that the mention of one or more method steps of the present invention does not exclude the presence of other method steps before and after the combination step or that other method steps may be interposed between these explicitly mentioned steps; it should also be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. Moreover, unless otherwise indicated, the numbering of the method steps is merely a convenient tool for identifying the method steps and is not intended to limit the order of arrangement of the method steps or to limit the scope of the invention in which the invention may be practiced, as such changes or modifications in their relative relationships may be regarded as within the scope of the invention without substantial modification to the technical matter.
In order to better understand the above technical solution, exemplary embodiments of the present invention are described in more detail below. While exemplary embodiments of the invention are shown, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The most widely used rosin resin in the market at present, but the rosin resin has poor heat stability and insufficient wettability, so the requirement of the market on solder paste can not be met. The benzocyclobutene resin has excellent electrical insulation property and film forming property, and also has higher thermal stability and chemical stability, so that the benzocyclobutene resin can be widely applied in the technical field of electronics, but as a soldering flux, the wettability and weldability of a single benzocyclobutene resin cannot meet the application requirements. In order to improve the performance of benzocyclobutene resin and make the benzocyclobutene resin more suitable for being used as resin of soldering paste, the invention uses 4-vinylbenzaldehyde and 2-aminopyrimidine to carry out cross-linking polymerization on the reaction product of 4-vinylbenzocyclobutene monomer to obtain a benzocyclobutene compound containing pyrimidine groups and Schiff base groups, namely modified benzocyclobutene resin, which is used for replacing rosin resin in soldering paste, has better wettability and strong weldability, and welded welding spots have higher strength and better thermal stability, and can make the soldering paste less easily oxidized.
The invention is further described with reference to the following examples.
Compared with the traditional benzocyclobutene resin, the modified benzocyclobutene resin has better wettability, strong weldability and good cleaning effect, and has higher strength and high-temperature stability, thereby ensuring the protection of metals under the high-temperature condition and simultaneously ensuring that solder paste is less prone to being oxidized.
Example 1
A preparation method of lead-free composite solder paste with high spreading rate comprises the following steps:
(1) Preparing modified benzocyclobutene resin:
s1, weighing 4-vinyl benzaldehyde, 2-aminopyrimidine and solvent xylene, mixing into a reaction flask, fully and uniformly stirring at room temperature, dropwise adding a plurality of drops of glacial acetic acid, heating to 100 ℃ in an oil bath, stirring at a speed of 300rpm for reaction for 4 hours, continuously dividing water during the reaction, removing the solvent after the reaction is finished, and drying to obtain an intermediate reaction product;
wherein the mass ratio of the 4-vinylbenzaldehyde to the 2-aminopyrimidine to the dimethylbenzene is 1.32:1.35:30, and the addition mass of the glacial acetic acid is 4% of the mass of the 4-vinylbenzaldehyde.
S2, weighing an intermediate reaction product, mixing the intermediate reaction product into tetrahydrofuran, fully and uniformly stirring at room temperature, introducing nitrogen as a protective gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating to 65 ℃ in a water bath, stirring at a speed of 400rpm for reaction for 3 hours, and removing and drying after the reaction is finished to obtain the modified benzocyclobutene resin;
wherein the mass ratio of the 4-vinylbenzocyclobutene to the intermediate reaction product to the tetrahydrofuran is 2.15:1:35, and the addition mass of the initiator azodiisobutyronitrile is 3% of the mass of the 4-vinylbenzocyclobutene.
(2) Preparing a soldering flux:
the soldering flux comprises the following components in parts by weight:
6 parts of an active agent, 0.8 part of a surfactant, 0.6 part of a film forming agent, 18 parts of a modified benzocyclobutene resin, 4 parts of a thixotropic agent, 0.2 part of a trace additive and 60 parts of a solvent.
Wherein the active agent is adipic acid and triethanolamine which are mixed according to a mass ratio of 6:1; the surfactant is sodium dodecyl benzene sulfonate; the film forming agent is polyethylene glycol PEG-2000; the thixotropic agent is polyoxyethylene-40 hydrogenated castor oil; the trace additive comprises a corrosion inhibitor and a humectant, wherein the corrosion inhibitor is benzotriazole, and the humectant is glycerol; the solvent is tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether and methoxy polyethylene glycol (MPEG-400) which are mixed according to the mass ratio of 7:3:1.
Preparing a clean container, sequentially adding a solvent, an active agent, a surfactant and a trace additive into the container, placing the container at 60 ℃, stirring the container at 600rpm until the mixture is uniform, then heating the container to 90 ℃, sequentially adding a film forming agent and a modified benzocyclobutene resin, stirring the container at 700rpm until the mixture is uniform, finally adding a thixotropic agent, heating the container to 110 ℃, stirring the mixture until the mixture is uniform, placing the container in a cold water bath, cooling the container to room temperature, continuously stirring the container during cooling to obtain uniform viscous liquid, and storing the uniform viscous liquid at 4 ℃.
(3) Preparing lead-free composite solder paste:
gradually adding soldering tin powder into the soldering flux, mixing, continuously stirring during the adding period of the soldering tin powder, and continuously stirring until the soldering tin powder is uniform after all the soldering tin powder is added, wherein the mass ratio of the soldering tin powder to the soldering flux is 9:2, thus obtaining the lead-free composite soldering paste; wherein the soldering tin powder is Sn-Ag-Cu alloy, and the Sn-Ag-Cu alloy comprises the following components in percentage by mass: ag:2.8%, cu:1.2%, and the balance Sn.
Example 2
A preparation method of lead-free composite solder paste with high spreading rate comprises the following steps:
(1) Preparing modified benzocyclobutene resin:
s1, weighing 4-vinyl benzaldehyde, 2-aminopyrimidine and solvent xylene, mixing into a reaction flask, fully and uniformly stirring at room temperature, dropwise adding a plurality of drops of glacial acetic acid, heating to 90 ℃ in an oil bath, stirring at a speed of 200rpm for reaction for 3 hours, continuously dividing water during the reaction, removing the solvent after the reaction is finished, and drying to obtain an intermediate reaction product;
wherein the mass ratio of the 4-vinylbenzaldehyde to the 2-aminopyrimidine to the dimethylbenzene is 1.32:1.19:20, and the addition mass of the glacial acetic acid is 2% of the mass of the 4-vinylbenzaldehyde.
S2, weighing an intermediate reaction product, mixing the intermediate reaction product into tetrahydrofuran, fully and uniformly stirring at room temperature, introducing nitrogen as a protective gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating to 60 ℃ in a water bath, stirring at a speed of 300rpm for 2 hours, and removing and drying after the reaction is finished to obtain the modified benzocyclobutene resin;
wherein the mass ratio of the 4-vinylbenzocyclobutene to the intermediate reaction product to the tetrahydrofuran is 1.43:1:25, and the addition mass of the initiator azodiisobutyronitrile is 1% of the mass of the 4-vinylbenzocyclobutene.
(2) Preparing a soldering flux:
the soldering flux comprises the following components in parts by weight:
5 parts of an active agent, 0.3 part of a surfactant, 0.5 part of a film forming agent, 12 parts of a modified benzocyclobutene resin, 3 parts of a thixotropic agent, 0.1 part of a trace additive and 50 parts of a solvent.
Wherein the active agent is azelaic acid and triethanolamine which are mixed according to the mass ratio of 5:1; the surfactant is sodium dodecyl naphthalene sulfonate; the film forming agent is polyethylene glycol PEG-1000; the thixotropic agent is polyamide wax; the trace additive comprises a corrosion inhibitor and a humectant, wherein the corrosion inhibitor is benzotriazole, and the humectant is glycerol; the solvent is tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether and methoxy polyethylene glycol (MPEG-400) which are mixed according to the mass ratio of 6:2:1.
Preparing a clean container, sequentially adding a solvent, an active agent, a surfactant and a trace additive into the container, placing the container at 50 ℃, stirring the container at a speed of 500rpm until the mixture is uniform, then heating the container to 80 ℃, sequentially adding a film forming agent and a modified benzocyclobutene resin, stirring the container at a speed of 600rpm until the mixture is uniform, finally adding a thixotropic agent, heating the container to 100 ℃, stirring the mixture until the mixture is uniform, placing the container in a cold water bath, cooling the container to room temperature, continuously stirring the container during cooling to obtain uniform viscous liquid, and storing the uniform viscous liquid at 4 ℃.
(3) Preparing lead-free composite solder paste:
gradually adding soldering tin powder into the soldering flux, mixing, continuously stirring during the adding period of the soldering tin powder, continuously stirring until the soldering tin powder is uniform after all the soldering tin powder is added, wherein the mass ratio of the soldering tin powder to the soldering flux is 8.8:2.2, and obtaining the lead-free composite soldering paste; wherein the soldering tin powder is Sn-Ag-Cu alloy, and the Sn-Ag-Cu alloy comprises the following components in percentage by mass: ag:1.4%, cu:1.5%, and the balance Sn.
Example 3
A preparation method of lead-free composite solder paste with high spreading rate comprises the following steps:
(1) Preparing modified benzocyclobutene resin:
s1, weighing 4-vinyl benzaldehyde, 2-aminopyrimidine and solvent xylene, mixing into a reaction flask, fully and uniformly stirring at room temperature, dropwise adding a plurality of drops of glacial acetic acid, heating to 110 ℃ in an oil bath, stirring at 400rpm for reaction for 5 hours, continuously dividing water during the reaction, removing the solvent after the reaction is finished, and drying to obtain an intermediate reaction product;
wherein the mass ratio of the 4-vinylbenzaldehyde to the 2-aminopyrimidine to the dimethylbenzene is 1.32:1.42:40, and the addition mass of the glacial acetic acid is 6% of the mass of the 4-vinylbenzaldehyde.
S2, weighing an intermediate reaction product, mixing the intermediate reaction product into tetrahydrofuran, fully and uniformly stirring at room temperature, introducing nitrogen as a protective gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating to 70 ℃ in a water bath, stirring at a speed of 500rpm for reaction for 4 hours, and removing and drying after the reaction is finished to obtain the modified benzocyclobutene resin;
wherein the mass ratio of the 4-vinylbenzocyclobutene to the intermediate reaction product to the tetrahydrofuran is 2.86:1:50, and the addition mass of the initiator azodiisobutyronitrile is 5% of the mass of the 4-vinylbenzocyclobutene.
(2) Preparing a soldering flux:
the soldering flux comprises the following components in parts by weight:
8 parts of an active agent, 1.2 parts of a surfactant, 1 part of a film forming agent, 23 parts of a modified benzocyclobutene resin, 7 parts of a thixotropic agent, 0.3 part of a trace additive and 70 parts of a solvent.
Wherein the active agent is mixing sebacic acid and triethanolamine according to a mass ratio of 8:1; the surfactant is nonylphenol polyoxyethylene ether; the film forming agent is polyethylene glycol PEG-4000; the thixotropic agent is polyoxyethylene-40 hydrogenated castor oil; the trace additive comprises a corrosion inhibitor and a humectant, wherein the corrosion inhibitor is benzotriazole, and the humectant is glycerol; the solvent is tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether and methoxy polyethylene glycol (MPEG-400) which are mixed according to the mass ratio of 8:4:1.
Preparing a clean container, sequentially adding a solvent, an active agent, a surfactant and a trace additive into the container, placing the container at 60 ℃, stirring the container at 600rpm until the mixture is uniform, then heating the container to 90 ℃, sequentially adding a film forming agent and a modified benzocyclobutene resin, stirring the container at 800rpm until the mixture is uniform, finally adding a thixotropic agent, heating the container to 120 ℃, stirring the mixture until the mixture is uniform, placing the container in a cold water bath, cooling the container to room temperature, continuously stirring the container during cooling to obtain uniform viscous liquid, and storing the uniform viscous liquid at 4 ℃.
(3) Preparing lead-free composite solder paste:
gradually adding soldering tin powder into the soldering flux, mixing, continuously stirring during the adding period of the soldering tin powder, continuously stirring until the soldering tin powder is uniform after all the soldering tin powder is added, wherein the mass ratio of the soldering tin powder to the soldering flux is 9.2:1.8, and obtaining the lead-free composite soldering paste; wherein the soldering tin powder is Sn-Ag-Cu alloy, and the Sn-Ag-Cu alloy comprises the following components in percentage by mass: ag:3.6%, cu:0.3%, and the balance Sn.
Comparative example 1
A method for preparing a composite solder paste, similar to example 1, differs in that: the modified benzocyclobutene resin was replaced with a commercially available rosin resin (138 rosin resin), and the other portions were the same as in example 1.
Namely, the soldering flux comprises the following components in parts by weight:
8 parts of an active agent, 1.2 parts of a surfactant, 1 part of a film forming agent, 23 parts of rosin resin, 7 parts of a thixotropic agent, 0.3 part of a trace additive and 70 parts of a solvent.
Comparative example 2
A method for preparing a composite solder paste, similar to example 1, differs in that: the modified benzocyclobutene resin was replaced with a commercially available benzocyclobutene resin (manufacturer: kelamal, specification: 98%), and the other portions were the same as in example 1.
Namely, the soldering flux comprises the following components in parts by weight:
8 parts of an active agent, 1.2 parts of a surfactant, 1 part of a film forming agent, 23 parts of benzocyclobutene resin, 7 parts of a thixotropic agent, 0.3 part of a trace additive and 70 parts of a solvent.
Comparative example 3
A method for preparing a composite solder paste, similar to example 1, differs in that: the modified benzocyclobutene resin was prepared in the same manner as in example 1.
The preparation process of the modified benzocyclobutene resin comprises the following steps:
weighing styrene, mixing the styrene into tetrahydrofuran, fully and uniformly stirring the mixture at room temperature, introducing nitrogen as a shielding gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating the mixture to 70 ℃ in a water bath, stirring the mixture at a speed of 500rpm for reaction for 4 hours, and removing and drying the mixture after the reaction is finished to obtain the modified benzocyclobutene resin;
wherein the mass ratio of the 4-vinylbenzocyclobutene to the styrene to the tetrahydrofuran is 2.86:1:50, and the addition mass of the initiator azodiisobutyronitrile is 5% of the mass of the 4-vinylbenzocyclobutene.
Experimental example
The solder pastes prepared in example 1 and comparative examples 1 to 3 were subjected to respective tests after application, and the test results of the expansion ratio (i.e., spreading ratio), melting temperature, breaking strength, and shearing strength were shown in table 1, referring to standard "lead-free solder test method" of SJ/T11390-2009, and the test results of the solder bead test, viscosity, and corrosion of the steel sheet were shown in japanese standard jis.z.3284.
Table 1 shows the following:
table 1 results of solder paste Performance test obtained by different methods
As can be seen from Table 1, the solder paste prepared in the embodiment 1 of the invention has stronger comprehensive performance, the expansion rate (i.e. the spreading rate) can reach 92.7%, the melting temperature reaches 228 ℃, the solder bead detection can reach 1 level, the breaking strength and the shearing strength of the welding spot can both have better performance, and in addition, the viscosity and the corrosion of the steel plate can reach the standards, so that the novel solder paste prepared in the embodiment 1 of the invention has better application prospect than the traditional solder paste in the market.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (5)
1. The preparation method of the lead-free composite soldering paste with high spreading rate is characterized by comprising the following steps of:
(1) Preparing modified benzocyclobutene resin:
s1, taking 4-vinyl benzaldehyde and 2-aminopyrimidine as reactants, and carrying out a combination reaction to obtain an intermediate reaction product;
s2, carrying out a crosslinking reaction on the 4-vinylbenzocyclobutene and the intermediate reaction product obtained in the S1 to obtain modified benzocyclobutene resin;
(2) Preparing a soldering flux:
weighing an active agent, a surfactant, a film forming agent, modified benzocyclobutene resin, a thixotropic agent, a trace additive and a solvent according to parts by weight, and uniformly mixing and stirring to obtain a soldering flux;
(3) Preparing lead-free composite solder paste:
uniformly mixing the soldering flux and the soldering powder to obtain lead-free composite soldering paste;
in step (1), the preparation process of S1 includes:
weighing 4-vinyl benzaldehyde, 2-aminopyrimidine and solvent xylene, mixing into a reaction flask, fully and uniformly stirring at room temperature, then dropwise adding a few drops of glacial acetic acid, heating to 90-110 ℃ in an oil bath pot, stirring at a speed of 200-400rpm for reaction for 3-5 hours, continuously dividing water during the reaction, removing the solvent after the reaction is finished, and drying to obtain an intermediate reaction product; wherein the mass ratio of the 4-vinyl benzaldehyde to the 2-aminopyrimidine to the dimethylbenzene is 1.32:1.19-1.42:20-40; the addition mass of the glacial acetic acid is 2% -6% of the mass of the 4-vinyl benzaldehyde;
in the step (1), the preparation process of the S2 comprises the following steps:
weighing intermediate reaction products, mixing the intermediate reaction products into tetrahydrofuran, fully and uniformly stirring the mixture at room temperature, introducing nitrogen as a shielding gas, sequentially adding 4-vinylbenzocyclobutene and an initiator azodiisobutyronitrile, heating the mixture to 60-70 ℃ in a water bath, stirring the mixture at a speed of 300-500rpm for reaction for 2-4 hours, and removing and drying the mixture after the reaction is finished to obtain the modified benzocyclobutene resin; wherein the mass ratio of the 4-vinylbenzocyclobutene to the intermediate reaction product to the tetrahydrofuran is 1.43-2.86:1:25-50; the adding mass of the initiator azodiisobutyronitrile is 1-5% of the mass of the 4-vinyl benzocyclobutene;
in the step (2), the soldering flux comprises the following components in parts by weight:
5-8 parts of active agent, 0.3-1.2 parts of surfactant, 0.5-1 part of film forming agent, 12-23 parts of modified benzocyclobutene resin, 3-7 parts of thixotropic agent, 0.1-0.3 part of trace additive and 50-70 parts of solvent.
2. The preparation method of the lead-free composite solder paste with high spreading rate according to claim 1, wherein the active agent is mixed by organic acid and alcohol amine according to a mass ratio of 5-8:1, wherein the organic acid comprises at least one of adipic acid, azelaic acid, sebacic acid, malic acid and salicylic acid, and the alcohol amine is triethanolamine;
the surfactant is an aromatic surfactant and comprises one or more of sodium dodecyl benzene sulfonate, sodium dodecyl naphthalene sulfonate, polyoxyethylene nonylphenol ether, polyoxyethylene nonylphenol polyether-3 phosphate and polyoxyethylene nonylphenol ether sodium sulfonate;
the film forming agent is polyethylene glycol and comprises one or more of PEG-1000, PEG-2000 and PEG-4000;
the thixotropic agent is polyoxyethylene-40 hydrogenated castor oil or polyamide wax;
the trace additive comprises a corrosion inhibitor and a humectant, wherein the corrosion inhibitor is benzotriazole, and the humectant is glycerol;
the solvent is obtained by mixing tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether and methoxy polyethylene glycol according to the mass ratio of 6-8:2-4:1.
3. The method for preparing the lead-free composite solder paste with high spreading rate according to claim 1, wherein in the step (2), the preparation process of the soldering flux specifically comprises the following steps:
preparing a clean container, sequentially adding a solvent, an active agent, a surfactant and a trace additive into the container, placing the container at 50-60 ℃, stirring the container at a speed of 500-600rpm until the container is uniform, then heating the container to 80-90 ℃, sequentially adding a film forming agent and a modified benzocyclobutene resin, stirring the container at a speed of 600-800rpm until the container is uniform, finally adding a thixotropic agent, heating the container to 100-120 ℃, stirring the container until the container is completely uniform, placing the container in a cold water bath, cooling the container to room temperature, continuously stirring the container during cooling to obtain uniform viscous liquid, and storing the viscous liquid at 4 ℃.
4. The method for preparing lead-free composite solder paste with high spreading rate according to claim 1, wherein in the step (3), the mass ratio of the soldering powder to the soldering flux is 8.8-9.2:1.8-2.2.
5. The preparation method of the lead-free composite solder paste with high spreading rate according to claim 1, wherein the solder powder is Sn-Ag-Cu alloy, and the Sn-Ag-Cu alloy comprises the following components in percentage by mass: ag:1.4% -3.6%, cu:0.3% -1.5%, and the balance Sn.
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