CN114986013B - Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof - Google Patents

Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof Download PDF

Info

Publication number
CN114986013B
CN114986013B CN202210582133.9A CN202210582133A CN114986013B CN 114986013 B CN114986013 B CN 114986013B CN 202210582133 A CN202210582133 A CN 202210582133A CN 114986013 B CN114986013 B CN 114986013B
Authority
CN
China
Prior art keywords
percent
galvanized steel
mixture
solder paste
steel sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210582133.9A
Other languages
Chinese (zh)
Other versions
CN114986013A (en
Inventor
何欢
武信
方舒
秦俊虎
熊晓娇
柳丽敏
钱斌
卢红波
张欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yunnan Tin New Material Co ltd
Original Assignee
Yunnan Tin Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yunnan Tin Material Co ltd filed Critical Yunnan Tin Material Co ltd
Priority to CN202210582133.9A priority Critical patent/CN114986013B/en
Publication of CN114986013A publication Critical patent/CN114986013A/en
Application granted granted Critical
Publication of CN114986013B publication Critical patent/CN114986013B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A low-residue high-activity tin paste for galvanized steel sheets and a preparation method thereof, wherein the mass ratio of tin-based solder powder in the tin paste is 86-90%, and the mass ratio of soldering flux is 10-14%; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20 to 30 percent of rosin, 0.2 to 0.8 percent of amine halogen salt, 8 to 13 percent of organic acid, 1 to 2 percent of corrosion inhibitor, 2 to 4 percent of antioxidant, 3 to 6 percent of thixotropic agent, 8 to 15 percent of tackifying coating agent and the balance of organic solvent. The invention adopts organic acid and unique amine halogen salt to match, the acid part of the amine halogen salt is hydrofluoric acid, the removal capability of the solder paste on oxide films on the surface of the galvanized steel sheet is obviously improved, and the solder paste has excellent wettability on the galvanized steel sheet. And the amine halogen salt is decomposed and volatilized in the welding process, so that residues after welding have good reliability.

Description

Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof
Technical Field
The invention relates to the technical field of solder paste for welding and a preparation method thereof, in particular to solder paste for welding a galvanized steel sheet and a preparation method thereof.
Technical Field
The solder paste plays a key role in the welding of electronic products, and plays a role in both electrical connection and physical welding. There are many structural members in the field of household appliances, such as copper plates and galvanized steel plates, and particularly, heat sinks in electronic products. Because of the higher and higher cost of copper, galvanized steel plates are gradually used in industry to replace high-cost copper plates, although the heat conduction performance of the galvanized steel plates is slightly poorer than that of the copper plates, the price of the galvanized steel plates is far lower than that of the copper plates, and the galvanized steel plates can be used for perfectly replacing the copper plates in most industries with no particularly high heat dissipation requirements. The copper oxide film on the surface of the copper plate is easy to remove by the active substances in the soldering flux, but the surface oxide film of the galvanized steel plate is very compact, the active substances of common tin paste are difficult to remove the metal oxide on the surface of the galvanized steel plate, so that the welding effect is poor, particularly the uniformity of welding spots is poor, the welding spots of the part with lighter oxidation can reach the standard, but the welding spots of the part with serious oxidation are easy to unweld, and the welding is poor.
The strength and heat conduction efficiency of the galvanized steel sheet after welding are determined by good welding spots, and at present, some connecting modes of galvanized steel sheet devices or structures are connected by extrusion, so that the connecting modes are low in efficiency and low in connecting reliability, and because oxide films exist on the surfaces of two galvanized steel sheets, the oxide films still exist between two structural members after extrusion connection, and oxides between the two structural members can be increased along with the time, so that the performance and the service life of a product are greatly influenced. However, in order to ensure enough activity during welding, the solder paste for galvanized steel sheets adopted at present has the characteristic of large residue, and the product reliability is affected by the large residue. And the zinc-plated steel plate device or structural member is welded by adopting the low-residue high-activity solder paste, so that firm and reliable connection can be realized, the performance of the product is obviously improved, and the service life is prolonged.
Aiming at the tin paste for welding the galvanized steel sheet, chinese patent publication No. CN103084756A discloses a spot-coating type halogen-free tin paste for the galvanized steel sheet, the spot-coating type halogen-free tin paste is low Wen Xigao, the welding of the galvanized steel sheet is researched from two aspects of a soldering flux and a tin powder alloy, the soldering flux realizes activity by matching organic acid and amine, and the soldering flux is matched with a tin bismuth series low-temperature alloy for use, but is not applicable to a tin silver copper series alloy.
The Chinese patent with publication number of CN102513736A discloses a solder paste, which can be used for welding galvanized steel sheets, the active agent of the soldering flux mainly provides activity by organic phosphoric acid, the soldering flux has certain corrosiveness after welding, the soldering flux needs to be removed by wiping or solvent cleaning, the cleaning operation is troublesome, and the soldering flux is difficult to clean thoroughly.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a low-residue high-activity tin paste for galvanized steel sheets by improving the components of soldering flux, and also provides a preparation method of the tin paste.
The invention aims at realizing the following technical scheme:
the solder paste for the galvanized steel sheet with low residue and high activity comprises 86-90% of tin-based solder powder and 10-14% of soldering flux by mass; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20 to 30 percent of rosin, 0.2 to 0.8 percent of amine halogen salt, 8 to 13 percent of organic acid, 1 to 2 percent of corrosion inhibitor, 2 to 4 percent of antioxidant, 3 to 6 percent of thixotropic agent, 8 to 15 percent of tackifying coating agent and the balance of organic solvent.
Further, the rosin is a mixture of KE311 rosin and esterified rosin in a mass ratio of 1:1.
Further, the amine halogen salt is N-methyldiethanolamine hydrofluoric acid salt.
Further, the organic acid is two or three of p-hydroxybenzoic acid, picolinic acid and dimethylolbutyric acid.
Further, the corrosion inhibitor is a mixture of 2-mercaptobenzothiazole and 2-methylimidazoline.
Further, the antioxidant is a mixture of an antioxidant DLTP and an antioxidant G245.
Further, the thixotropic agent is a mixture of slip-ZHS and polyamide wax 6650.
Further, the tackifying coating agent is Isman Regalite R1100.
Further, the organic solvent is a mixture of two or three of tetraethylene glycol methyl ether, diethylene glycol diethyl ether and pentaethylene glycol monomethyl ether.
The preparation method of the solder paste for the low-residue high-activity galvanized steel sheet comprises the following steps:
(1) Adding a tackifying coating agent, amine halogen salt and part of organic solvent into a reaction kettle, heating to 60-70 ℃ to dissolve the amine halogen salt into the organic solvent, fully coating the amine halogen salt in the tackifying coating agent, and then cooling to obtain a mixture A;
(2) Adding rosin, a corrosion inhibitor, organic acid, a thixotropic agent, an antioxidant and the rest part of solvent into a reaction kettle, heating to 150-160 ℃ until the rosin, the corrosion inhibitor, the organic acid, the thixotropic agent and the antioxidant are completely dissolved to become a clear solution, pouring the clear solution into a container, and placing the container into a cold storage at 2-10 ℃ for cooling to obtain a mixture B;
(3) Uniformly stirring the mixture A and the mixture B at normal temperature to obtain soldering flux;
(4) And mixing the soldering flux with the soldering powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
The invention starts from the improvement of the soldering flux formula, and is based on the preparation of the lead-free SnAgCu series high-temperature solder paste for the low-residue high-activity galvanized steel sheet, wherein the active agent is provided by the organic acid and the amine halogen salt, the decomposition temperature of the amine halogen salt is lower, and the halogen can be completely volatilized at the end of welding, so that the activity during welding and the low corrosiveness of residues after welding are ensured.
At least compared with the prior art, the invention has the following advantages:
(1) The N-methyldiethanolamine hydrofluoric acid salt adopted by the invention has good activity, has excellent cleaning capability on oxide films on the surfaces of galvanized steel sheets, and has lower boiling point, so that residues after welding have good reliability.
(2) The solder paste disclosed by the invention has the characteristics of low rosin content and less residues after welding.
(3) The invention uses the Isman Regalite R1100 as the tackifying coating agent, which can slow down the chemical reaction between the soldering flux and the tin powder, so that the tin paste has good storage performance.
The invention is improved and researched aiming at the phenomenon that the solder paste for the existing galvanized steel sheet has poor weldability and a large amount of residues, and the common solder paste is difficult to effectively weld the surface of the galvanized steel sheet due to the compact metal oxide film on the surface of the galvanized steel sheet and the large difference of the surface oxidation degree of different galvanized steel sheets. The invention adopts organic acid and unique amine halogen salt to match, the acid part of the amine halogen salt is hydrofluoric acid, the removal capability of the solder paste on oxide films on the surface of the galvanized steel sheet is obviously improved, and the solder paste has excellent wettability on the galvanized steel sheet. And the amine halogen salt is decomposed and volatilized in the welding process, so that residues after welding have good reliability.
Detailed Description
The following describes the present invention in further detail with reference to specific examples, but the scope of the present invention is not limited to the examples.
Example 1
The solder paste for the galvanized steel sheet with low residue and high activity comprises 89% of tin-based solder powder and 11% of soldering flux by mass; wherein the tin-based solder powder is SnAg3.0Cu0.5 powder.
The soldering flux in the solder paste is calculated by weight percentage, and the components are as follows: 13G of KE311 rosin, 13G of esterified rosin, 0.2G of N-methyldiethanolamine hydrofluoric acid salt, 6G of p-hydroxybenzoic acid, 7G of picolinic acid, 0.5G of 2-mercaptobenzothiazole, 0.5G of 2-methylimidazoline, 2G of antioxidant DLTP, 1.5G of antioxidant G245, 2G of Slipacks-ZHS, 6650G of polyamide wax, 1100 10G of Isomann Regalite R, 20G of tetraethyleneglycol methyl ether and 22.3G of diethylene glycol diethyl ether.
The preparation method of the solder paste comprises the following steps:
(1) Adding 1100 10g of Isman Regalite R, 0.2g of N-methyldiethanolamine hydrofluoric acid salt and 20g of tetraethylene glycol methyl ether into a reaction kettle, heating to 60 ℃ to dissolve the N-methyldiethanolamine hydrofluoric acid salt into an organic solvent, fully coating the N-methyldiethanolamine hydrofluoric acid salt into Regalite R1100, and cooling to obtain a mixture A;
(2) 13G of KE311 rosin, 13G of esterified rosin, 6G of p-hydroxybenzoic acid, 7G of picolinic acid, 0.5G of 2-mercaptobenzothiazole, 0.5G of 2-methylimidazoline, 2G of antioxidant DLTP, 245.5G of antioxidant G, 2G of slipackage-ZHS, 6650G of polyamide wax and 22.3G of diethylene glycol diethyl ether are added into a reaction kettle, heated to 155 ℃ until the mixture is completely dissolved to become a clear solution, poured into a container and placed into a refrigeration house at 2-10 ℃ for cooling to obtain a mixture B;
(3) And uniformly stirring the mixture A and the mixture B at normal temperature to obtain a soldering flux, and then mixing the soldering flux with SnAg3.0Cu0.5 powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
Example 2
The solder paste for the galvanized steel sheet is low in residue and high in activity, wherein the mass ratio of tin-based solder powder in the solder paste is 86%, and the mass ratio of soldering flux is 14%; wherein the tin-based solder powder is SnAg3.0Cu0.5 powder.
The soldering flux in the solder paste is calculated by weight percentage, and the weight ratio of each component is as follows: KE311 rosin 15G, esterified rosin 15G, N-methyldiethanolamine hydrofluoric acid 0.8G, p-hydroxybenzoic acid 4G, dimethylolbutyric acid 4G, 2-mercaptobenzothiazole 1G, 2-methylimidazoline 0.5G, antioxidant DLTP 1G, antioxidant G245G, slipackage-ZHS 2G, polyamide wax 6650 1G, isman Regalite R1100 8G, tetraethylene glycol methyl ether 20G, and pentaethylene glycol monomethyl ether 26.7G.
The preparation method of the solder paste comprises the following steps:
(1) Adding 1100 g of Isman Regalite R, 0.8g of N-methyldiethanolamine hydrofluoric acid salt and 20g of tetraethylene glycol methyl ether into a reaction kettle, heating to 65 ℃ to dissolve the N-methyldiethanolamine hydrofluoric acid salt into an organic solvent, fully coating the N-methyldiethanolamine hydrofluoric acid salt into the Regalite R1100, and cooling to obtain a mixture A;
(2) Adding 15G of KE311 rosin, 15G of esterified rosin, 4G of p-hydroxybenzoic acid, 4G of dihydroxymethylbutyric acid, 1G of 2-mercaptobenzothiazole, 0.5G of 2-methylimidazoline, 1G of antioxidant DLTP, 245G of antioxidant G, 2G of slip packages-ZHS, 6650G of polyamide wax and 26.7G of pentaethylene glycol monomethyl ether into a reaction kettle, heating to 160 ℃ until the mixture is completely dissolved to become a clear solution, pouring the clear solution into a container, and cooling the container in a refrigerator at 2-10 ℃ to obtain a mixture B;
(3) And uniformly stirring the mixture A and the mixture B at normal temperature to obtain a soldering flux, and then mixing the soldering flux with SnAg3.0Cu0.5 powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
Example 3
The solder paste for the galvanized steel sheet is low in residue and high in activity, wherein the mass ratio of tin-based solder powder in the solder paste is 90%, and the mass ratio of soldering flux is 10%; wherein the tin-based solder powder is SnAg0.3Cu0.7 powder.
The soldering flux in the solder paste is calculated by weight percentage, and the weight ratio of each component is as follows: 10G of KE311 rosin, 10G of esterified rosin, 0.4G of N-methyldiethanolamine hydrofluoric acid salt, 4G of p-hydroxybenzoic acid, 2G of picolinic acid, 3G of dimethylolbutyric acid, 1G of 2-mercaptobenzothiazole, 1G of 2-methylimidazoline, 2G of antioxidant DLTP, 245G of antioxidant G2G, 4G of Slipacks-ZHS, 6650G of polyamide wax, 1100 15G of Isman Regalite R, 23G of diethylene glycol diethyl ether, 10G of diethylene glycol diethyl ether and 10.6G of pentaethylene glycol monomethyl ether.
The preparation method of the solder paste comprises the following steps:
(1) Adding 1100 15g of Isman Regalite R, 0.4g of N-methyldiethanolamine hydrofluoric acid salt and 23g of diethylene glycol diethyl ether into a reaction kettle, heating to 70 ℃ to dissolve the N-methyldiethanolamine hydrofluoric acid salt into an organic solvent, fully coating the N-methyldiethanolamine hydrofluoric acid salt into Regalite R1100, and cooling to obtain a mixture A;
(2) 10G of KE311 rosin, 10G of esterified rosin, 4G of p-hydroxybenzoic acid, 2G of picolinic acid, 3G of dihydroxymethylbutyric acid, 1G of 2-mercaptobenzothiazole, 1G of 2-methylimidazoline, 2G of antioxidant DLTP, 245G of antioxidant G2G, 4G of slipackage-ZHS, 6650G of polyamide wax, 10G of diethylene glycol diethyl ether and 10.6G of pentaethylene glycol monomethyl ether are added into a reaction kettle, heated to 150 ℃ until the mixture is completely dissolved to become a clear solution, poured into a container, and placed into a refrigerator at 2-10 ℃ for cooling to obtain a mixture B;
(3) And uniformly stirring the mixture A and the mixture B at normal temperature to obtain a soldering flux, and then mixing the soldering flux with SnAg0.3Cu0.7 powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
Example 4
The solder paste for the galvanized steel sheet is low in residue and high in activity, wherein the mass ratio of tin-based solder powder in the solder paste is 88%, and the mass ratio of soldering flux is 12%; wherein the tin-based solder powder is SnAg0.3Cu0.7 powder.
The soldering flux in the solder paste is calculated by weight percentage, and the weight ratio of each component is as follows: KE311 rosin 39G, esterified rosin 39G, N-methyldiethanolamine hydrofluoric acid salt 1.5G, picolinic acid 12G, dimethylolbutyric acid 15G, 2-mercaptobenzothiazole 2G, 2-methylimidazoline 2.5G, antioxidant DLTP 6G, antioxidant G245.5G, slipackage-ZHS 10G, polyamide wax 6650G, isman Regalite R1100 33G, diethylene glycol diethyl ether 40G, pentaethylene glycol monomethyl ether 67.5G, tetraethylene glycol methyl ether 20G.
The preparation method of the solder paste comprises the following steps:
(1) Adding 1100 33g of Isman Regalite R, 1.5g of N-methyldiethanolamine hydrofluoric acid salt, 40g of diethylene glycol diethyl ether and 20g of tetraethylene glycol methyl ether into a reaction kettle, heating to 70 ℃, dissolving the N-methyldiethanolamine hydrofluoric acid salt in an organic solvent, fully coating the N-methyldiethanolamine hydrofluoric acid salt in Regalite R1100, and cooling to obtain a mixture A;
(2) Adding 39G of KE311 rosin, 39G of esterified rosin, 12G of picolinic acid, 15G of dimethylol butyric acid, 2G of 2-mercaptobenzothiazole, 2.5G of 2-methylimidazoline, 6G of antioxidant DLTP, 245.5G of antioxidant G, 10G of slipackage-ZHS, 6650G of polyamide wax and 67.5G of pentaethylene glycol monomethyl ether into a reaction kettle, heating to 160 ℃ until the mixture is completely dissolved to become a clear solution, pouring the clear solution into a container, and cooling the container in a refrigerator at 2-10 ℃ to obtain a mixture B;
(3) And uniformly stirring the mixture A and the mixture B at normal temperature to obtain a soldering flux, and then mixing the soldering flux with SnAg0.3Cu0.7 powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
The solder pastes prepared in the above four examples were tested and the results are shown in table 1.
Table 1 performance test table for each example
Figure BDA0003662369220000051
As can be seen from Table 1, the solder paste of the present invention has the characteristics of low residue and high activity, wherein the wettability on the galvanized steel sheet is good, and the post-welding residual quantity rate is less than 50% of the total mass of the soldering flux. Copper corrosion testing was performed at 40 c and 93% rh for 10 days and found no significant corrosion in all four examples.
The solder paste is suitable for welding galvanized steel sheet structures and parts in various industries such as electronic appliances, household appliances and the like, and particularly has good effect on welding small galvanized steel sheet type radiators and the like.

Claims (3)

1. The low-residue high-activity tin paste for the galvanized steel sheet is characterized in that the mass ratio of tin-based solder powder in the tin paste is 86-90%, and the mass ratio of soldering flux is 10-14%; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20 to 30 percent of rosin, 0.2 to 0.8 percent of amine halogen salt, 8 to 13 percent of organic acid, 1 to 2 percent of corrosion inhibitor, 2 to 4 percent of antioxidant, 3 to 6 percent of thixotropic agent, 8 to 15 percent of tackifying coating agent and the balance of organic solvent;
the rosin is a mixture of KE311 rosin and esterified rosin in a mass ratio of 1:1;
the amine halogen salt is N-methyldiethanolamine hydrofluoric acid salt;
the organic acid is two or three of p-hydroxybenzoic acid, picolinic acid and dimethylolbutyric acid;
the antioxidant is a mixture of an antioxidant DLTP and an antioxidant G245;
the thixotropic agent is a mixture of slip-ZHS and polyamide wax 6650;
the tackifying coating agent is Isman Regalite R1100;
the organic solvent is a mixture of two or three of tetraethylene glycol methyl ether, diethylene glycol diethyl ether and pentaethylene glycol monomethyl ether.
2. The low-residue high-activity solder paste for galvanized steel sheets according to claim 1, wherein the corrosion inhibitor is a mixture of 2-mercaptobenzothiazole and 2-methylimidazoline.
3. The method for preparing the solder paste for the low-residue high-activity galvanized steel sheet as claimed in claim 1 or 2, which is characterized by comprising the following steps:
(1) Adding a tackifying coating agent, amine halogen salt and part of organic solvent into a reaction kettle, heating to 60-70 ℃ to dissolve the amine halogen salt into the organic solvent, fully coating the amine halogen salt in the tackifying coating agent, and then cooling to obtain a mixture A;
(2) Adding rosin, a corrosion inhibitor, organic acid, a thixotropic agent, an antioxidant and the rest part of solvent into a reaction kettle, heating to 150-160 ℃ until the rosin, the corrosion inhibitor, the organic acid, the thixotropic agent and the antioxidant are completely dissolved to become a clear solution, pouring the clear solution into a container, and placing the container into a cold storage at 2-10 ℃ for cooling to obtain a mixture B;
(3) Uniformly stirring the mixture A and the mixture B at normal temperature to obtain soldering flux;
(4) And mixing the soldering flux with the soldering powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
CN202210582133.9A 2022-05-25 2022-05-25 Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof Active CN114986013B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210582133.9A CN114986013B (en) 2022-05-25 2022-05-25 Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210582133.9A CN114986013B (en) 2022-05-25 2022-05-25 Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof

Publications (2)

Publication Number Publication Date
CN114986013A CN114986013A (en) 2022-09-02
CN114986013B true CN114986013B (en) 2023-05-23

Family

ID=83028305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210582133.9A Active CN114986013B (en) 2022-05-25 2022-05-25 Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114986013B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465427B (en) * 2009-01-27 2014-12-21 Arakawa Chem Ind Flux composition for use with lead-free solder, lead-free solder composition and rosin-containing solder
WO2010113833A1 (en) * 2009-03-30 2010-10-07 荒川化学工業株式会社 Flux composition for lead-free solder, and lead-free solder composition
CN110877171B (en) * 2019-11-11 2021-03-30 华南理工大学 Soldering flux for solder wire and preparation method thereof
CN111745323B (en) * 2020-07-01 2022-03-25 云南锡业锡材有限公司 Low-solid-content soldering flux for pressure hot-melt solder paste spot coating and preparation method thereof
CN114273820B (en) * 2021-12-30 2023-05-23 云南锡业锡材有限公司 High-lead soldering paste soldering flux and preparation method thereof

Also Published As

Publication number Publication date
CN114986013A (en) 2022-09-02

Similar Documents

Publication Publication Date Title
CN104607826B (en) Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method
CN101695796B (en) Halogen-free lead-free soldering paste for radiator and preparation method thereof
CN104858571B (en) A kind of stannum bismuth system lead-free tin cream halogen-free flux and preparation method thereof
CN107009043B (en) Low-residue high-storage-stability low-temperature aluminum solder paste and preparation method thereof
CN101966632B (en) Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof
CN107088716B (en) Environment-friendly low-temperature residue-free solder paste and preparation method thereof
CN107160052B (en) A kind of high performance low temperature solder lead-free tin cream and preparation method thereof
CN102489897B (en) Low-temperature lead-free soldering flux for tin-bismuth series
CN101695794A (en) Halogen-free tin-bismuth-copper soldering paste and preparation method thereof
CN102728967B (en) Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder
CN102357746A (en) Low-content modified rosin halogen-free soldering flux for lead-free solder wires
CN110202295B (en) Low-temperature aluminum soft soldering paste and preparation method thereof
CN103042319A (en) Water-base halogen-free no-clean scaling powder used for lead-free solder
CN103111773A (en) Scaling powder for lead-free solder paste
CN111318832B (en) Low-temperature lead-free soldering paste and preparation method thereof
CN104942480A (en) Solid state scaling powder for stainless steel soldering and preparing method
CN110202293B (en) High-performance halogen-free lead-free soldering paste and preparation method thereof
CN114986013B (en) Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof
CN104625483B (en) A kind of aluminum soft soldering tin cream of low-residual low corrosion and preparation method thereof
CN111482733B (en) Anti-oxidation soldering flux for tinned copper strip coating and preparation method thereof
CN109877484B (en) No-clean and no-residue soldering paste and preparation method thereof
CN112621007A (en) Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof
CN103028867A (en) Flux composition and method of soldering
CN102922179A (en) Halogenless soldering flux for tin and bismuth low-temperature solder wire and preparation method thereof
CN116900553B (en) Preparation method of lead-free composite soldering paste with high spreading rate

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 650501 No.2, Yunjing Road, information industry base, Kunming Economic and Technological Development Zone, Yunnan Province

Patentee after: YUNNAN TIN NEW MATERIAL Co.,Ltd.

Address before: 650501 No.2, Yunjing Road, information industry base, Kunming Economic and Technological Development Zone, Yunnan Province

Patentee before: YUNNAN TIN MATERIAL Co.,Ltd.