CN114986013A - Low-residue high-activity tin paste for galvanized steel sheet and preparation method thereof - Google Patents
Low-residue high-activity tin paste for galvanized steel sheet and preparation method thereof Download PDFInfo
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- CN114986013A CN114986013A CN202210582133.9A CN202210582133A CN114986013A CN 114986013 A CN114986013 A CN 114986013A CN 202210582133 A CN202210582133 A CN 202210582133A CN 114986013 A CN114986013 A CN 114986013A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
A tin paste with low residue and high activity for a galvanized steel sheet and a preparation method thereof are disclosed, wherein the mass ratio of tin-based solder powder in the tin paste accounts for 86-90%, and the mass ratio of soldering flux accounts for 10-14%; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20-30% of rosin, 0.2-0.8% of amine halogen salt, 8-13% of organic acid, 1-2% of corrosion inhibitor, 2-4% of antioxidant, 3-6% of thixotropic agent, 8-15% of tackifying coating agent and the balance of organic solvent. According to the invention, the organic acid and the unique amine halogen salt are matched, and the hydrochloric acid part of the amine halogen is hydrofluoric acid, so that the removal capability of the tin paste on the surface oxide film of the galvanized steel plate is obviously improved, and the tin paste has excellent wettability on the galvanized steel plate. And the amine halogen salt is decomposed and volatilized in the welding process, so that the residues after welding have good reliability.
Description
Technical Field
The invention relates to the technical field of solder paste for welding and a preparation method thereof, in particular to solder paste for welding a galvanized steel plate and a preparation method thereof.
Technical Field
The solder paste plays a key role in the welding of electronic products, and plays both an electrical connection role and a physical welding role. In the field of household appliances, materials such as copper plates, galvanized steel plates and the like are used as structural members, and particularly, heat radiators in electronic products are used. Because the cost of copper is higher and higher, galvanized steel sheets are gradually used in the industry to replace high-cost copper sheets, although the heat conduction performance of the galvanized steel sheets is slightly inferior to that of the copper sheets, the price of the galvanized steel sheets is far lower than that of the copper sheets, and the galvanized steel sheets can be used for perfectly replacing the copper sheets in most industries which are not particularly high in heat dissipation requirements. Because the solderability of the copper plate is good, the copper oxide film on the surface is easily removed by active substances in the soldering flux, but the oxide film on the surface of the galvanized steel plate is very compact, the active substances of the common tin paste are difficult to remove metal oxides on the surface of the common tin paste, so that the soldering effect is poor, particularly the uniformity of soldering points is poor, the soldering points at the parts with light oxidation can reach the standard, but the soldering points at the parts with heavy oxidation are easy to remove, and the poor soldering is caused.
The good solder joint has decided galvanized steel sheet intensity and heat conduction efficiency after the welding, also there is the connected mode of part galvanized steel sheet device or structure to adopt the extrusion to connect at present, the efficiency of this kind of connected mode is lower, and the reliability of connecting is not high moreover, this is because the surface of two kinds of galvanized steel sheets has the oxide film, the oxide film still exists between two structures after the extrusion is connected, and along with the lapse of time, the oxide between two structures can increase, has great influence to the performance and the life of product. However, in order to ensure sufficient activity during welding, the currently used solder paste for galvanized steel sheets generally has the characteristic of many residues, and the reliability of products is also influenced by the many residues. And the galvanized steel sheet device or the structural member can be firmly and reliably connected by adopting the low-residue high-activity solder paste, so that the performance of the product is obviously improved, and the service life is prolonged.
Aiming at solder paste for welding galvanized steel sheets, Chinese patent with publication number CN103084756A discloses a spot-coating halogen-free solder paste for galvanized steel sheets, which researches the welding of galvanized steel sheets from two aspects of soldering flux and tin powder alloy, the soldering flux realizes activity by matching organic acid and amine, and is matched with tin-bismuth series low-temperature alloy for use, but is not suitable for tin-silver-copper series alloy.
Chinese patent publication No. CN102513736A discloses a solder paste, which is mentioned that the solder paste can also be used for soldering galvanized steel sheets, and the active agent of the flux is mainly provided with an organic phosphoric acid, and has a certain corrosivity after soldering, and needs to be removed by wiping or solvent cleaning after soldering, and the cleaning operation is troublesome and difficult to clean thoroughly.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide the solder paste for the galvanized steel sheet with low residue and high activity by improving the components of the soldering flux, and also provides a preparation method of the solder paste.
The purpose of the invention is realized by the following technical scheme:
the solder paste for the galvanized steel sheet is low in residual and high in activity, wherein the mass ratio of tin-based solder powder in the solder paste is 86-90%, and the mass ratio of soldering flux in the solder paste is 10-14%; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20-30% of rosin, 0.2-0.8% of amine halogen salt, 8-13% of organic acid, 1-2% of corrosion inhibitor, 2-4% of antioxidant, 3-6% of thixotropic agent, 8-15% of tackifying coating agent and the balance of organic solvent.
Further, the rosin is a mixture of KE311 rosin and esterified rosin in a mass ratio of 1: 1.
Further, the amine halogen salt is N-methyldiethanolamine hydrofluoride.
Further, the organic acid is two or three of p-hydroxybenzoic acid, picolinic acid and dimethylolbutyric acid.
Furthermore, the corrosion inhibitor is a mixture of 2-mercaptobenzothiazole and 2-methylimidazoline.
Further, the antioxidant is a mixture of an antioxidant DLTP and an antioxidant G245.
Further, the thixotropic agent is a mixture of slipack-ZHS and polyamide wax 6650.
Further, the tackifying coating agent is Istman Regalite R1100.
Further, the organic solvent is a mixture of two or three of tetraethylene glycol methyl ether, diethylene glycol diethyl ether and pentaethylene glycol monomethyl ether.
The preparation method of the low-residue high-activity solder paste for the galvanized steel sheet comprises the following steps:
(1) adding the tackifying coating agent, amine halogen salt and part of organic solvent into a reaction kettle, heating to 60-70 ℃, dissolving the amine halogen salt in the reaction kettle into the organic solvent, completely coating the amine halogen salt in the tackifying coating agent, and cooling to obtain a mixture A;
(2) adding rosin, a corrosion inhibitor, an organic acid, a thixotropic agent, an antioxidant and the rest of solvent into a reaction kettle, heating to 150-160 ℃ until the rosin, the corrosion inhibitor, the organic acid, the thixotropic agent, the antioxidant and the rest of solvent are completely dissolved to become clear solution, pouring the clear solution into a container, and placing the container in a refrigeration house at 2-10 ℃ for cooling to obtain a mixture B;
(3) uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux;
(4) and mixing the soldering flux with the soldering tin powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
The invention starts from the improvement of a soldering flux formula and aims at preparing the lead-free SnAgCu series high-temperature tin paste for the galvanized steel sheet with low residue and high activity, wherein an active agent is provided by organic acid and amine halogen salt together, the decomposition temperature of the amine halogen salt is lower, and the halogen can be completely volatilized when the welding is finished, so that the activity during the welding and the low corrosivity of residues after the welding are ensured.
Compared with the prior art at least, the invention has the following advantages:
(1) the N-methyldiethanolamine hydrofluoride salt adopted by the invention has good activity, has excellent capacity of removing an oxide film on the surface of a galvanized steel plate, and has lower boiling point, so that the residues after welding have good reliability.
(2) The solder paste has low rosin content and has the characteristic of less residues after welding.
(3) The invention uses Istman Regalite R1100 as the tackifying coating agent, can slow down the chemical reaction of the soldering flux and the tin powder, and leads the tin paste to have good storage performance.
The invention improves and researches the phenomenon that the existing solder paste for the galvanized steel sheet has poor weldability and more residues, and because the surface of the galvanized steel sheet has a compact metal oxide film and the surface oxidation degrees of different galvanized steel sheets are greatly different, the common solder paste is difficult to effectively weld the galvanized steel sheet. According to the invention, the organic acid and the unique amine halogen salt are matched, and the hydrochloric acid part of the amine halogen is hydrofluoric acid, so that the removal capability of the tin paste on the surface oxide film of the galvanized steel plate is obviously improved, and the tin paste has excellent wettability on the galvanized steel plate. And the amine halogen salt is decomposed and volatilized in the welding process, so that the residues after welding have good reliability.
Detailed Description
The present invention will be further described with reference to specific examples, but the scope of the present invention is not limited to the examples.
Example 1
A tin paste for a galvanized steel sheet with low residue and high activity, wherein the mass ratio of tin-based solder powder in the tin paste accounts for 89%, and the mass ratio of soldering flux accounts for 11%; wherein the tin-based solder powder is SnAg3.0Cu0.5 powder.
The soldering flux in the solder paste comprises the following components in percentage by weight: KE311 rosin 13g, esterified rosin 13g, N-methyldiethanolamine hydrofluoride salt 0.2g, p-hydroxybenzoic acid 6g, picolinic acid 7g, 2-mercaptobenzothiazole 0.5g, 2-methylimidazoline 0.5g, antioxidant DLTP 2g, antioxidant G2451.5g, Slipacks-ZHS 2g, polyamide wax 66502 g, Islaman Regalite R110010 g, tetraethyleneglycol methyl ether 20g and diethylene glycol diethyl ether 22.3 g.
The preparation method of the solder paste comprises the following steps:
(1) adding Istman Regalite R110010 g, N-methyldiethanolamine hydrofluoride salt 0.2g and tetraethylene glycol methyl ether 20g into a reaction kettle, heating to 60 ℃, dissolving the N-methyldiethanolamine hydrofluoride salt in the reaction kettle into an organic solvent, completely coating the N-methyldiethanolamine hydrofluoride salt in the Regalite R1100, and cooling to obtain a mixture A;
(2) adding 13g of KE311 rosin, 13g of esterified rosin, 6g of p-hydroxybenzoic acid, 7g of picolinic acid, 0.5g of 2-mercaptobenzothiazole, 0.5g of 2-methylimidazoline, 2g of antioxidant DLTP, 5g of antioxidant G2451, 2g of Slipacks-ZHS, 66502 g of polyamide wax and 22.3g of diethylene glycol diethyl ether into a reaction kettle, heating to 155 ℃ until the components are completely dissolved to obtain a clear solution, pouring the clear solution into a container, and placing the container in a refrigerator at 2-10 ℃ for cooling to obtain a mixture B;
(3) and uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux, and mixing the soldering flux with SnAg3.0Cu0.5 powder to obtain the low-residue high-activity tin paste for the galvanized steel plate.
Example 2
The solder paste for the galvanized steel sheet with low residue and high activity comprises 86 mass percent of tin-based solder powder and 14 mass percent of soldering flux; wherein the tin-based brazing filler metal powder is SnAg3.0Cu0.5 powder.
The soldering flux in the solder paste comprises the following components in percentage by weight: KE311 rosin 15G, esterified rosin 15G, N-methyldiethanolamine hydrofluoride salt 0.8G, p-hydroxybenzoic acid 4G, dimethylolbutyric acid 4G, 2-mercaptobenzothiazole 1G, 2-methylimidazoline 0.5G, antioxidant DLTP 1G, antioxidant G2451G, Slipacks-ZHS 2G, polyamide wax 66501G, Islaman Relite R11008G, tetraethylene glycol monomethyl ether 20G, and pentaethylene glycol monomethyl ether 26.7G.
The preparation method of the solder paste comprises the following steps:
(1) adding Istman Regalite R11008 g, N-methyldiethanolamine hydrofluoride salt 0.8g and tetraethylene glycol methyl ether 20g into a reaction kettle, heating to 65 ℃, dissolving the N-methyldiethanolamine hydrofluoride salt in the reaction kettle into an organic solvent, completely coating the N-methyldiethanolamine hydrofluoride salt in the Regalite R1100, and cooling to obtain a mixture A;
(2) adding 15G of KE311 rosin, 15G of esterified rosin, 4G of p-hydroxybenzoic acid, 4G of dimethylolbutyric acid, 1G of 2-mercaptobenzothiazole, 0.5G of 2-methylimidazoline, 1G of antioxidant DLTP, 2451G of antioxidant, 2G of slips-ZHS, 66501G of polyamide wax and 26.7G of pentaethylene glycol monomethyl ether into a reaction kettle, heating to 160 ℃ until the substances are completely dissolved to form a clear solution, pouring the clear solution into a container, and placing the container in a refrigerator at 2-10 ℃ for cooling to obtain a mixture B;
(3) and uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux, and mixing the soldering flux with SnAg3.0Cu0.5 powder to obtain the low-residue high-activity tin paste for the galvanized steel plate.
Example 3
The solder paste for the galvanized steel sheet with low residue and high activity comprises 90 mass percent of tin-based solder powder and 10 mass percent of soldering flux; wherein the tin-based brazing filler metal powder is SnAg0.3Cu0.7 powder.
The soldering flux in the solder paste comprises the following components in percentage by weight: KE311 rosin 10G, esterified rosin 10G, N-methyldiethanolamine hydrofluoride salt 0.4G, p-hydroxybenzoic acid 4G, picolinic acid 2G, dimethylol butyric acid 3G, 2-mercaptobenzothiazole 1G, 2-methylimidazoline 1G, antioxidant DLTP 2G, antioxidant G2452G, Slipacks-ZHS4G, polyamide wax 66502G, Isaman Regalite R110015G, diethylene glycol diethyl ether 23G, diethylene glycol diethyl ether 10G, and pentaethylene glycol monomethyl ether 10.6G.
The preparation method of the solder paste comprises the following steps:
(1) adding Isyman Regalite R110015 g, N-methyldiethanolamine hydrofluoride 0.4g and diethylene glycol diethyl ether 23g into a reaction kettle, heating to 70 ℃, dissolving the N-methyldiethanolamine hydrofluoride in the reaction kettle into an organic solvent, completely coating the N-methyldiethanolamine hydrofluoride in the Regalite R1100, and then cooling to obtain a mixture A;
(2) adding 10G of KE311 rosin, 10G of esterified rosin, 4G of p-hydroxybenzoic acid, 2G of picolinic acid, 3G of dimethylolbutyric acid, 1G of 2-mercaptobenzothiazole, 1G of 2-methylimidazoline, 2G of antioxidant DLTP, 2452G of antioxidant, Slipacks-ZHS4G, 66502G of polyamide wax, 10G of diethylene glycol diethyl ether and 10.6G of pentaethylene glycol monomethyl ether into a reaction kettle, heating to 150 ℃ until the mixture is completely dissolved to become a clear solution, pouring the clear solution into a container, and placing the container in a cold storage at 2-10 ℃ for cooling to obtain a mixture B;
(3) and uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux, and mixing the soldering flux with SnAg0.3Cu0.7 powder to obtain the low-residue high-activity solder paste for the galvanized steel plate.
Example 4
The solder paste for the galvanized steel sheet with low residue and high activity comprises 88 mass percent of tin-based solder powder and 12 mass percent of soldering flux; wherein the tin-based brazing filler metal powder is SnAg0.3Cu0.7 powder.
The soldering flux in the solder paste comprises the following components in percentage by weight: KE311 rosin 39g, esterified rosin 39g, N-methyldiethanolamine hydrofluoride salt 1.5g, picolinic acid 12g, dimethylolbutyric acid 15g, 2-mercaptobenzothiazole 2g, 2-methylimidazoline 2.5g, antioxidant DLTP 6g, antioxidant G2454.5 g, Slipacks-ZHS 10g, polyamide wax 66508 g, Islam Regalite R110033 g, diethylene glycol diethyl ether 40g, pentaethylene glycol monomethyl ether 67.5g, and tetraethylene glycol methyl ether 20 g.
The preparation method of the solder paste comprises the following steps:
(1) adding Istman Regalite R110033 g, 1.5g of N-methyldiethanolamine hydrofluoride, 40g of diethylene glycol diethyl ether and 20g of tetraethylene glycol methyl ether into a reaction kettle, heating to 70 ℃, dissolving the N-methyldiethanolamine hydrofluoride in an organic solvent, completely coating the N-methyldiethanolamine hydrofluoride in the Regalite R1100, and cooling to obtain a mixture A;
(2) adding 39g of KE311 rosin, 39g of esterified rosin, 12g of picolinic acid, 15g of dimethylolbutyric acid, 2g of 2-mercaptobenzothiazole, 2.5g of 2-methylimidazoline, 6g of antioxidant DLTP, 5g of antioxidant G2454, 10g of Slipacks-ZHS, 66508 g of polyamide wax and 67.5g of pentaethylene glycol monomethyl ether into a reaction kettle, heating to 160 ℃ until the substances are completely dissolved to obtain a clear solution, pouring the clear solution into a container, and placing the container in a cold storage at the temperature of 2-10 ℃ for cooling to obtain a mixture B;
(3) and uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux, and then mixing the soldering flux with SnAg0.3Cu0.7 powder to obtain the low-residue high-activity solder paste for the galvanized steel plate.
The solder pastes prepared in the four examples were tested and the results are shown in Table 1.
Table 1 table for testing performance of each example
As can be seen from Table 1, the solder paste of the present invention has low residue and high activity, wherein the wettability on the galvanized steel sheet is good and the percentage of the residue after soldering is less than 50% of the total mass of the flux. The copper plate corrosion test was carried out at 40 ℃ and 93% RH for 10 days, and it was found that no significant corrosion was observed in any of the four examples.
The solder paste is suitable for welding galvanized steel sheet structures and components in the industries of various electronic appliances, household appliances and the like, and particularly has a good effect on welding small galvanized steel sheet radiators and the like.
Claims (10)
1. The low-residue high-activity solder paste for the galvanized steel sheet is characterized in that the mass ratio of tin-based solder powder in the solder paste accounts for 86-90%, and the mass ratio of soldering flux accounts for 10-14%; the soldering flux in the solder paste comprises the following raw materials in percentage by weight: 20-30% of rosin, 0.2-0.8% of amine halogen salt, 8-13% of organic acid, 1-2% of corrosion inhibitor, 2-4% of antioxidant, 3-6% of thixotropic agent, 8-15% of tackifying coating agent and the balance of organic solvent.
2. The solder paste for the galvanized steel sheet with low residue and high activity as claimed in claim 1, wherein the rosin is a mixture of KE311 rosin and esterified rosin in a mass ratio of 1: 1.
3. The solder paste for a zinc-plated steel sheet having low residue and high activity as claimed in claim 1, wherein said amine halogen salt is N-methyldiethanolamine hydrofluoride salt.
4. The solder paste for a zinc-plated steel sheet having low residue and high activity according to claim 1, wherein the organic acid is two or three of p-hydroxybenzoic acid, picolinic acid and dimethylolbutyric acid.
5. The solder paste for a zinc-plated steel sheet having low residue and high activity as claimed in claim 1, wherein the corrosion inhibitor is a mixture of 2-mercaptobenzothiazole and 2-methylimidazoline.
6. The solder paste for a galvanized steel sheet with low residue and high activity as claimed in claim 1, wherein the antioxidant is a mixture of antioxidant DLTP and antioxidant G245.
7. The solder paste as claimed in claim 1, wherein the thixotropic agent is a mixture of Slipacks-ZHS and polyamide wax 6650.
8. The solder paste for a galvanized steel sheet with low residue and high activity as claimed in claim 1, wherein the viscosity-increasing coating agent is Istmann Regalite R1100.
9. The solder paste for a zinc-plated steel sheet having low residual and high activity as claimed in claim 1, wherein the organic solvent is a mixture of two or three of tetraethylene glycol methyl ether, diethylene glycol diethyl ether and pentaethylene glycol monomethyl ether.
10. The method for preparing the solder paste for the galvanized steel sheet with low residue and high activity according to claim 1, characterized by comprising the following steps:
(1) adding the tackifying coating agent, amine halogen salt and part of organic solvent into a reaction kettle, heating to 60-70 ℃, dissolving the amine halogen salt in the reaction kettle into the organic solvent, completely coating the amine halogen salt in the tackifying coating agent, and cooling to obtain a mixture A;
(2) adding rosin, a corrosion inhibitor, an organic acid, a thixotropic agent, an antioxidant and the rest of solvent into a reaction kettle, heating to 150-160 ℃ until the rosin, the corrosion inhibitor, the organic acid, the thixotropic agent, the antioxidant and the rest of solvent are completely dissolved to become clear solution, pouring the clear solution into a container, and placing the container in a refrigeration house at 2-10 ℃ for cooling to obtain a mixture B;
(3) uniformly stirring the mixture A and the mixture B at normal temperature to obtain the soldering flux;
(4) and mixing the soldering flux with the soldering tin powder to obtain the low-residue high-activity solder paste for the galvanized steel sheet.
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| CN202210582133.9A CN114986013B (en) | 2022-05-25 | 2022-05-25 | Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof |
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| CN202210582133.9A CN114986013B (en) | 2022-05-25 | 2022-05-25 | Low-residue high-activity solder paste for galvanized steel sheet and preparation method thereof |
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|---|---|---|---|---|
| CN102281988A (en) * | 2009-01-27 | 2011-12-14 | 荒川化学工业株式会社 | Flux composition for lead-free solder, lead-free solder composition, and resin flux cored solder |
| CN102369083A (en) * | 2009-03-30 | 2012-03-07 | 荒川化学工业株式会社 | Flux composition for lead-free solder, and lead-free solder composition |
| CN110877171A (en) * | 2019-11-11 | 2020-03-13 | 华南理工大学 | Soldering flux for solder wire and preparation method thereof |
| CN111745323A (en) * | 2020-07-01 | 2020-10-09 | 云南锡业锡材有限公司 | Low-solid-content soldering flux for pressure hot-melt solder paste spot coating and preparation method thereof |
| CN114273820A (en) * | 2021-12-30 | 2022-04-05 | 云南锡业锡材有限公司 | High-lead soldering tin paste soldering flux and preparation method thereof |
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2022
- 2022-05-25 CN CN202210582133.9A patent/CN114986013B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281988A (en) * | 2009-01-27 | 2011-12-14 | 荒川化学工业株式会社 | Flux composition for lead-free solder, lead-free solder composition, and resin flux cored solder |
| CN102369083A (en) * | 2009-03-30 | 2012-03-07 | 荒川化学工业株式会社 | Flux composition for lead-free solder, and lead-free solder composition |
| CN110877171A (en) * | 2019-11-11 | 2020-03-13 | 华南理工大学 | Soldering flux for solder wire and preparation method thereof |
| CN111745323A (en) * | 2020-07-01 | 2020-10-09 | 云南锡业锡材有限公司 | Low-solid-content soldering flux for pressure hot-melt solder paste spot coating and preparation method thereof |
| CN114273820A (en) * | 2021-12-30 | 2022-04-05 | 云南锡业锡材有限公司 | High-lead soldering tin paste soldering flux and preparation method thereof |
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| CN114986013B (en) | 2023-05-23 |
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