CN103846572A - Novel cleaning-free flux - Google Patents
Novel cleaning-free flux Download PDFInfo
- Publication number
- CN103846572A CN103846572A CN201410096794.6A CN201410096794A CN103846572A CN 103846572 A CN103846572 A CN 103846572A CN 201410096794 A CN201410096794 A CN 201410096794A CN 103846572 A CN103846572 A CN 103846572A
- Authority
- CN
- China
- Prior art keywords
- novel cleaning
- scaling powder
- free
- cleaning
- free flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a novel cleaning-free flux. The flux comprises the following components in percentage by mass: 80% of solvent, 10% to 30% of activating agent, 5% to 20% of filming agent, and 5% to 10% of anti-oxidizing thermal stabilizing agent, wherein the activating agent comprises the following components in percentage by mass: 50% of adipic acid, 30% of sebacic acid, and 20% of benzotriazole. By adopting the method, the cleaning-free flux has the advantages that the smoke is little, the pungent odor is little, the tin applying speed is high, the metal welding surface is clean, the wettability is better, the safety and environment-friendly effects are realized, the toxicity and harm are avoided, the safety in use is realized, and the like; the broad market prospect is obtained in the popularizing of the novel cleaning-free flux.
Description
Technical field
The present invention relates to chemical field, particularly relate to a kind of novel cleaning-free scaling powder.
Background technology
Chemical industry, full name chemical industry, very close with the mankind's productive life relation, in the modern life, almost all be unable to do without chemical products whenever and wherever possible, chemical products are permeated in industry-by-industry and fields such as household, agricultural, industry, wherein scaling powder is widely used in industrial welding, the existing scaling powder surfactants that contain halogen that adopt more, although help, weldering is effective, cost is low, and long-time use is easily created in metal surface and leaves the problems such as residue, complex procedures, contaminated environment, destruction atmosphere.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of novel cleaning-free scaling powder, by adopting halogen-free novel active agent to be added in scaling powder, help that weldering ability is good, foam performance is good, moistureproof anti-electric, nontoxic non-corrosiveness, noresidue, safety and environmental protection, operation be simple and easy, on novel cleaning-free scaling powder universal, has market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of novel cleaning-free scaling powder, the mass percent of formula comprises:
Solvent 80%,
Activator 10 ~ 30%,
Film forming agent 5 ~ 20%,
Antioxidizing thermal stabilizer 5 ~ 10%,
The mass percent of described activator comprises adipic acid 50%, SA 30% and benzotriazole 20%.
In a preferred embodiment of the present invention, the mass percent of described solvent comprises ethanol 40%, isobutanol 30% and ethylene glycol monobutyl ether 30%.
In a preferred embodiment of the present invention, described film forming agent is fluorine-silicon modified acrylic resin.
In a preferred embodiment of the present invention, described antioxidizing thermal stabilizer is hydroquinones.
The invention has the beneficial effects as follows: the novel cleaning-free scaling powder of the present invention have low cigarette, pungent little, the upper tin speed of taste fast, keep that metal welding junction is clean, wetability is good, safety and environmental protection, nontoxic, use the advantages such as safety, on novel cleaning-free scaling powder universal, have market prospects widely.
The specific embodiment
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of novel cleaning-free scaling powder, the mass percent of formula comprises:
Solvent 80%,
Activator 10 ~ 30%,
Film forming agent 5 ~ 20%,
Antioxidizing thermal stabilizer 5 ~ 10%,
The mass percent of described activator comprises adipic acid 50%, SA 30% and benzotriazole 20%, generally can adopt the mixture of organic acid and organic amine as activator, experimental results show that the activator of above-mentioned composition proportion has excellent activation and stability.
Preferably, the mass percent of described solvent comprises ethanol 40%, isobutanol 30% and ethylene glycol monobutyl ether 30%, generally can select the mixture of high-boiling point alcohol and low-boiling point alcohol as solvent, and melting is effective, good heat resistance, chemical stability are good.
Preferably, described film forming agent is fluorine-silicon modified acrylic resin, has the advantages such as non-corrosiveness, moistureproof and waterproof, good electric property.
Preferably, described antioxidizing thermal stabilizer is hydroquinones, and the benzotriazole in activator also has auxiliaring effect to protection and stabilization in addition.
The beneficial effect of the novel cleaning-free scaling powder of the present invention is:
One, by adopting mass percent to comprise that adipic acid 50%, SA 30% and benzotriazole 20%, as activator, have excellent activation and stability;
Two,, by adopting fluorine-silicon modified acrylic resin as film forming agent, there is the advantages such as non-corrosiveness, moistureproof and waterproof, good electric property;
Three, with respect to general novel cleaning-free scaling powder, the antioxidizing thermal stabilizer of the novel cleaning-free scaling powder is here hydroquinones, has effectively played effect anti-oxidant and protection.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a novel cleaning-free scaling powder, is characterized in that, the mass percent of formula comprises:
Solvent 80%,
Activator 10 ~ 30%,
Film forming agent 5 ~ 20%,
Antioxidizing thermal stabilizer 5 ~ 10%,
The mass percent of described activator comprises adipic acid 50%, SA 30% and benzotriazole 20%.
2. novel cleaning-free scaling powder according to claim 1, is characterized in that, the mass percent of described solvent comprises ethanol 40%, isobutanol 30% and ethylene glycol monobutyl ether 30%.
3. novel cleaning-free scaling powder according to claim 1, is characterized in that, described film forming agent is fluorine-silicon modified acrylic resin.
4. novel cleaning-free scaling powder according to claim 1, is characterized in that, described antioxidizing thermal stabilizer is hydroquinones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096794.6A CN103846572A (en) | 2014-03-17 | 2014-03-17 | Novel cleaning-free flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096794.6A CN103846572A (en) | 2014-03-17 | 2014-03-17 | Novel cleaning-free flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103846572A true CN103846572A (en) | 2014-06-11 |
Family
ID=50854950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410096794.6A Pending CN103846572A (en) | 2014-03-17 | 2014-03-17 | Novel cleaning-free flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103846572A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107855683A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | A kind of scaling powder for welding elevator guide shoe |
| CN108393611A (en) * | 2018-04-25 | 2018-08-14 | 苏州锐耐洁电子科技新材料有限公司 | A kind of electronics scaling powder |
| CN108941977A (en) * | 2018-08-31 | 2018-12-07 | 安徽红桥金属制造有限公司 | A kind of efficient scaling powder of wear-resisting electric welding machine free of cleaning |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180690A (en) * | 1984-02-29 | 1985-09-14 | Nippon Genma:Kk | Cream solder |
| JPH02175094A (en) * | 1988-12-27 | 1990-07-06 | Showa Denko Kk | Cream solder |
| CN1209374A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| JP2002283097A (en) * | 2001-03-23 | 2002-10-02 | Tamura Kaken Co Ltd | Solder paste composition and reflow soldering method |
| CN1836825A (en) * | 2006-04-21 | 2006-09-27 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN101412166A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free scaling powder |
| CN102366862A (en) * | 2011-09-21 | 2012-03-07 | 修建东 | Halogen-free soldering flux with low solid content and preparation method thereof |
-
2014
- 2014-03-17 CN CN201410096794.6A patent/CN103846572A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180690A (en) * | 1984-02-29 | 1985-09-14 | Nippon Genma:Kk | Cream solder |
| JPH02175094A (en) * | 1988-12-27 | 1990-07-06 | Showa Denko Kk | Cream solder |
| CN1209374A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| JP2002283097A (en) * | 2001-03-23 | 2002-10-02 | Tamura Kaken Co Ltd | Solder paste composition and reflow soldering method |
| CN1836825A (en) * | 2006-04-21 | 2006-09-27 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN101412166A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free scaling powder |
| CN102366862A (en) * | 2011-09-21 | 2012-03-07 | 修建东 | Halogen-free soldering flux with low solid content and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 朱大伟，董慧茹等: "免清洗助焊剂", 《精细与专用化学品》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107855683A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | A kind of scaling powder for welding elevator guide shoe |
| CN108393611A (en) * | 2018-04-25 | 2018-08-14 | 苏州锐耐洁电子科技新材料有限公司 | A kind of electronics scaling powder |
| CN108941977A (en) * | 2018-08-31 | 2018-12-07 | 安徽红桥金属制造有限公司 | A kind of efficient scaling powder of wear-resisting electric welding machine free of cleaning |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140611 |