CN103302421A - No-clean soldering flux and tinol thereof - Google Patents
No-clean soldering flux and tinol thereof Download PDFInfo
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- CN103302421A CN103302421A CN 201310251952 CN201310251952A CN103302421A CN 103302421 A CN103302421 A CN 103302421A CN 201310251952 CN201310251952 CN 201310251952 CN 201310251952 A CN201310251952 A CN 201310251952A CN 103302421 A CN103302421 A CN 103302421A
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Abstract
The invention discloses a no-clean soldering flux and tinol thereof. The soldering flux comprises the following ingredients by mass percentage: 1.5-3% of active agent, 55-65% of solvent, 1-1.5% of surfactant, 30-35% of film former and 1-2% of stabilizing agent. The tinol comprises the soldering flux. With the adoption of the mode, the contradiction between weldability and corrosivity of the tinol can be solved, the welding property of the tinol is improved, and the soldering flux has the characteristics of no corrosion, low solid residue and longer storage life.
Description
Technical field
The present invention relates to the tinol field, particularly relate to a kind of no-clean scaling powder and tinol thereof.
Background technology
Tinol role in whole welding process of using in the microelectronics assembling is very important, and the performance of tinol will directly influence welding quality.And scaling powder is as the auxiliary material in the tinol, and the good weldering performance that helps not only can be provided, and can also directly influence printing performance and the storage life of tinol.Therefore, the quality of scaling powder directly influences whole technical process and the product quality of microelectronics assembling.
At present, traditional scaling powder is the abietyl scaling powder, though it can provide the good weldering performance that helps, such scaling powder mostly is high solids content, postwelding residual many, outward appearance is not good enough; Some abietyl scaling powder even also contain halogen, make the residue of postwelding that bigger corrosivity be arranged, must utilize fluorochlorohydrocarbon to clean, and fluorochlorohydrocarbon has hypotoxicity, can damage the ozone layer, do not meet modern environmental requirement, this just need develop a kind of scaling powder of exempting to clean, and replaces traditional abietyl scaling powder.
Summary of the invention
The technical problem that the present invention mainly solves is: at the deficiencies in the prior art, a kind of no-clean scaling powder and tinol thereof are provided, can solve the contradiction of tinol between weldability and corrosivity, improve the welding performance of tinol, have and do not have corrosion, the solid residue amount is few, the characteristics that storage life is long.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of no-clean scaling powder is provided, comprises the following ingredients of forming by mass percentage:
Activating agent 1.5-3%;
Solvent 55-65%;
Surfactant 1-1.5%;
Film forming agent 30-35%;
Stabilizing agent 1-2%.
In a preferred embodiment of the present invention, described activating agent comprises organic acid, organic amine and water-white rosin.
In a preferred embodiment of the present invention, described solvent comprises ethanol, ethylene glycol, glycerine and ethylene glycol monobutyl ether.
In a preferred embodiment of the present invention, described film forming agent comprises acrylic resin.
In a preferred embodiment of the present invention, described stabilizing agent comprises copper inhibitor.
A kind of tinol that uses above-mentioned no-clean scaling powder comprises solder powder and above-mentioned scaling powder, and described solder powder is Sn-Ag-Cu series solder powder, and its mass fraction is 80-90%, and the mass fraction of described scaling powder is 10-20%.
The invention has the beneficial effects as follows: the present invention has disclosed a kind of no-clean scaling powder and tinol thereof, by the reasonable apolegamy to the scaling powder raw material, make scaling powder reach the requirement of exempting to clean, and solved the contradiction of tinol between weldability and corrosivity, improved the welding performance of tinol, be that tinol has the nothing corrosion, the solid residue amount is few, the characteristics that storage life is long.
The specific embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
The embodiment of the invention comprises:
A kind of no-clean scaling powder comprises the following ingredients of forming by mass percentage:
Activating agent 1.5-3%; Wherein, described activating agent comprises organic acid, organic amine and water-white rosin, in the present embodiment, the mass fraction of described activating agent is preferably 3%, and wherein organic acid is malic acid or anhydrous citric acid, and content is 1%, organic amine is triethanolamine, and content is 0.5%, and the content of water-white rosin is 1.5%;
Solvent 55-65%; Wherein, described solvent comprises ethanol, ethylene glycol, glycerine and ethylene glycol monobutyl ether, and in the present embodiment, the mass fraction of described solvent is preferably 60%, and its each components in proportions is ethanol: ethylene glycol: glycerine: ethylene glycol monobutyl ether=2:4:3:1;
Surfactant 1-1.5%; In the present embodiment, select the OP series of surfactants for use, its mass fraction is preferably 1%;
Film forming agent 30-35%; Wherein, described film forming agent comprises acrylic resin, and in the present embodiment, the mass fraction of described film forming agent is preferably 34.5%, and wherein acrylic resin content is 34%, and has added 0.5% ester gum, is used for preventing the tinol layering;
Stabilizing agent 1-2%; Wherein, described stabilizing agent comprises copper inhibitor, in the present embodiment, the mass fraction of described stabilizing agent is preferably 1.5%, and wherein copper inhibitor is selected benzotriazole for use, and its content is 1.4-1.5%, and the hydroquinones of interpolation 0-0.1%, for increasing non-oxidizability and the heat endurance of scaling powder.
A kind of tinol that uses above-mentioned no-clean scaling powder comprises solder powder and above-mentioned scaling powder, and described solder powder is Sn-Ag-Cu series solder powder, and its mass fraction is 80-90%, is preferably 84%, and the mass fraction of described scaling powder is 10-20%, is preferably 16%.
The present invention has disclosed a kind of no-clean scaling powder and tinol thereof, by the reasonable apolegamy to the scaling powder raw material, make scaling powder reach the requirement of exempting to clean, and solved the contradiction of tinol between weldability and corrosivity, improved the welding performance of tinol, be that tinol has the nothing corrosion, the solid residue amount is few, the characteristics that storage life is long.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. a no-clean scaling powder is characterized in that, comprises the following ingredients of forming by mass percentage: activating agent 1.5-3%;
Solvent 55-65%;
Surfactant 1-1.5%;
Film forming agent 30-35%;
Stabilizing agent 1-2%.
2. no-clean scaling powder according to claim 1 is characterized in that, described activating agent comprises organic acid, organic amine and water-white rosin.
3. no-clean scaling powder according to claim 1 is characterized in that, described solvent comprises ethanol, ethylene glycol, glycerine and ethylene glycol monobutyl ether.
4. no-clean scaling powder according to claim 1 is characterized in that, described film forming agent comprises acrylic resin.
5. no-clean scaling powder according to claim 1 is characterized in that, described stabilizing agent comprises copper inhibitor.
6. tinol that uses the described no-clean scaling powder of claim 1, it is characterized in that, comprise the described scaling powder of solder powder and claim 1, described solder powder is Sn-Ag-Cu series solder powder, its mass fraction is 80-90%, and the mass fraction of described scaling powder is 10-20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201310251952 CN103302421A (en) | 2013-06-24 | 2013-06-24 | No-clean soldering flux and tinol thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310251952 CN103302421A (en) | 2013-06-24 | 2013-06-24 | No-clean soldering flux and tinol thereof |
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| CN103302421A true CN103302421A (en) | 2013-09-18 |
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| CN 201310251952 Pending CN103302421A (en) | 2013-06-24 | 2013-06-24 | No-clean soldering flux and tinol thereof |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103537822A (en) * | 2013-10-25 | 2014-01-29 | 广州汉源新材料有限公司 | High-concentration scaling powder for pre-forming soldering lug spraying |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN104084711A (en) * | 2014-06-20 | 2014-10-08 | 宁国新博能电子有限公司 | Lead-free soldering aid paste |
| CN104275561A (en) * | 2014-09-17 | 2015-01-14 | 明光市锐创电气有限公司 | Environment-friendly lead-free soldering-aiding paste |
| CN106002101A (en) * | 2016-06-21 | 2016-10-12 | 金锢电气有限公司 | Production method of copper aluminium conducting bar |
| CN106078091A (en) * | 2016-06-21 | 2016-11-09 | 金锢电气有限公司 | A kind of production technology of copper aluminum conducting block |
| CN106392380A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | No-clean flux high in welding passing rate |
| CN106392381A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | High-quality soldering paste |
| CN107175427A (en) * | 2017-06-02 | 2017-09-19 | 苏州龙腾万里化工科技有限公司 | A kind of nontoxic scaling powder agent |
| CN107598407A (en) * | 2017-11-09 | 2018-01-19 | 湖州高恒电梯配件有限公司 | A kind of heap welding method |
| CN107855683A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | A kind of scaling powder for welding elevator guide shoe |
| CN107855677A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | The welding method of elevator guide shoe plate |
| CN111531292A (en) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN114986019A (en) * | 2022-07-19 | 2022-09-02 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
-
2013
- 2013-06-24 CN CN 201310251952 patent/CN103302421A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103537822A (en) * | 2013-10-25 | 2014-01-29 | 广州汉源新材料有限公司 | High-concentration scaling powder for pre-forming soldering lug spraying |
| WO2015058456A1 (en) * | 2013-10-25 | 2015-04-30 | 广州汉源新材料有限公司 | High-concentration scaling powder for being sprayed on pre-formed soldering lug |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN104084711A (en) * | 2014-06-20 | 2014-10-08 | 宁国新博能电子有限公司 | Lead-free soldering aid paste |
| CN104084711B (en) * | 2014-06-20 | 2016-12-28 | 青岛申达众创技术服务有限公司 | A kind of Pb-free solder weld-aiding cream |
| CN104275561A (en) * | 2014-09-17 | 2015-01-14 | 明光市锐创电气有限公司 | Environment-friendly lead-free soldering-aiding paste |
| CN106002101A (en) * | 2016-06-21 | 2016-10-12 | 金锢电气有限公司 | Production method of copper aluminium conducting bar |
| CN106078091A (en) * | 2016-06-21 | 2016-11-09 | 金锢电气有限公司 | A kind of production technology of copper aluminum conducting block |
| CN106392380A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | No-clean flux high in welding passing rate |
| CN106392381A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | High-quality soldering paste |
| CN107175427A (en) * | 2017-06-02 | 2017-09-19 | 苏州龙腾万里化工科技有限公司 | A kind of nontoxic scaling powder agent |
| CN107598407A (en) * | 2017-11-09 | 2018-01-19 | 湖州高恒电梯配件有限公司 | A kind of heap welding method |
| CN107855683A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | A kind of scaling powder for welding elevator guide shoe |
| CN107855677A (en) * | 2017-11-09 | 2018-03-30 | 湖州高恒电梯配件有限公司 | The welding method of elevator guide shoe plate |
| CN111531292A (en) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN114986019A (en) * | 2022-07-19 | 2022-09-02 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
| CN114986019B (en) * | 2022-07-19 | 2023-09-29 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
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Application publication date: 20130918 |