CN102398122B - Aqueous cleaning low-temperature welding paste and preparation method thereof - Google Patents
Aqueous cleaning low-temperature welding paste and preparation method thereof Download PDFInfo
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- 238000004140 cleaning Methods 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title abstract description 28
- 238000003466 welding Methods 0.000 title abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 65
- 239000000843 powder Substances 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 12
- 239000000080 wetting agent Substances 0.000 claims abstract description 12
- 239000013543 active substance Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 38
- 230000004907 flux Effects 0.000 claims description 30
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- 229910000679 solder Inorganic materials 0.000 claims description 17
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- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 229960003237 betaine Drugs 0.000 claims description 14
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical group OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 13
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- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 13
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 13
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 13
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- 239000000600 sorbitol Substances 0.000 claims description 13
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- 235000013871 bee wax Nutrition 0.000 claims description 4
- 239000012166 beeswax Substances 0.000 claims description 4
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 3
- MRUAUOIMASANKQ-UHFFFAOYSA-N cocamidopropyl betaine Chemical compound CCCCCCCCCCCC(=O)NCCC[N+](C)(C)CC([O-])=O MRUAUOIMASANKQ-UHFFFAOYSA-N 0.000 claims description 3
- 229940073507 cocamidopropyl betaine Drugs 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 16
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- 239000000956 alloy Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 14
- 229910052736 halogen Inorganic materials 0.000 abstract description 5
- 150000002367 halogens Chemical class 0.000 abstract description 5
- 235000011187 glycerol Nutrition 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000009972 noncorrosive effect Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
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- 238000007127 saponification reaction Methods 0.000 description 1
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Abstract
The invention discloses aqueous cleaning low-temperature welding paste and a preparation method thereof. The welding paste comprises the following components in percentage by weight: 85 to 90 percent of soldering alloy powder, and 10 to 15 percent of scaling powder, wherein the soldering alloy powder consists of the following components in percentage by weight: 36 to 44 percent of Pb, 18 to 22 percent of Bi and the balance of Sn; and the scaling powder is formed by mixing 2 to 10 weight percent of active agent, 1 to 10 weight percent of pasting agent, 20 to 30 weight percent of wetting agent, 2 to 10 weight percent of thixotropic agent, and 50 to 70 weight percent of solvent and the total percentage of all components is 100 percent. The welding paste is suitable for various welding processes, is high in welding speed, does not damage components, does not contain halogen and does not have corrosiveness, and residues are few after welding.
Description
Technical Field
The invention belongs to the technical field of electronics and chemical industry, and particularly relates to water-cleaning low-temperature soldering paste and a preparation method thereof.
Background
The soft soldering paste required by electronic components and assembly processes is mostly rosin halogen type, after welding is finished, the soldering paste needs to be cleaned by a special cleaning agent, namely a chlorofluorocarbon solvent, if the soldering paste is not cleaned completely, the electronic components and circuits can be corroded, the welding quality is difficult to guarantee, and the environment can be polluted. In the 20 th century and the 80 th century, foreign advanced industrial countries began to develop water-based cleaning solder paste for soldering highly reliable electronic components to satisfy commercial and military applications. The soldering paste used in the domestic electronic packaging and assembling industry mainly depends on import, is rosin halogen type, has long supply period and restricted fixed quantity, and the welding quality of electronic components can not be ensured.
Disclosure of Invention
The invention aims to provide a water-cleaning low-temperature soldering paste which is suitable for various welding processes, does not contain halogen, is non-corrosive and has less residues after welding.
The invention also aims to provide a preparation method of the water-cleaning low-temperature soldering paste.
In order to achieve the purpose, the invention adopts the following design scheme:
a water-cleaning low-temperature soldering paste comprises the following components in percentage by weight:
85 to 90 percent of soldering tin alloy powder;
10-15% of soldering flux;
the total amount of the components is 100 percent.
The solder alloy powder comprises 36-44 wt% of Pb, 18-22 wt% of Bi and the balance of Sn, wherein the total amount of the components is 100%;
wherein the soldering flux is formed by mixing 2 to 10 weight percent of active agent, 1 to 10 weight percent of paste forming agent, 20 to 30 weight percent of wetting agent, 2 to 10 weight percent of thixotropic agent and 50 to 70 weight percent of solvent;
the active agent is at least one of malic acid, glycolic acid, amino acid, tartaric acid, erucic acid and itaconic acid;
the paste is at least one of hydroxyethyl cellulose, polyethanol 2000, polyethanol 4000 and polyethanol 6000;
the wetting agent is at least one of dimethyl alkyl betaine and cocamidopropyl betaine;
the thixotropic agent is at least one of hydrogenated castor oil, modified hydrogenated castor oil and beeswax;
the solvent is at least one of sorbitol, glycerol, ethylene glycol, butanediol, 2-butoxyethanol, diethylene glycol diethyl ether and dipropylene glycol.
A method of preparing a water-washable low-temperature solder paste, the method comprising the steps of:
step 1: melting of solder alloy
Taking 36% of Pb, 2% of Bi and the balance Sn according to the weight percentage, respectively, and mixing and smelting the components to obtain an alloy, wherein the total amount of the components is 100%;
step 2: preparation of solder alloy powder
Adopting an atomization method, taking nitrogen as atomization gas, putting the alloy prepared in the step 1 under the conditions that the pressure is 0.5-1.0 MPa and the temperature is 380-420 ℃, atomizing to prepare alloy powder, and screening the alloy powder to prepare the soldering tin alloy powder with the granularity of 25-50 um;
and step 3: flux preparation
According to the weight percentage, respectively taking 2-10% of active agent, 1-10% of paste forming agent, 20-30% of wetting agent, 2-10% of thixotropic agent and 50-70% of solvent, adding the active agent, the paste forming agent, the wetting agent and the thixotropic agent into the solvent, heating and stirring the components until the components are completely dissolved, uniformly mixing the components, and standing the components to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 85-90% of the soldering tin alloy powder prepared in the step (2) and 10-15% of the soldering flux prepared in the step (3) according to weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
The water-cleaning low-temperature soldering paste has scientific design, reasonable proportion and simple preparation process, and is suitable for various welding processes. The soldering paste does not contain halogen, is non-corrosive, has few residues after welding, can be cleaned by water without saponification, and has high insulation resistance after cleaning.
The invention has the advantages that:
1. the water-cleaned low-temperature soldering paste manufactured by the method is suitable for various welding processes, including electronic components, surface-mounted components and electronic circuit assembly special welding processes.
2. The water-cleaning low-temperature soldering paste manufactured by the method has low melting point and high soldering speed, shortens the soldering time of electronic components with poor heat resistance, and is not easy to damage the components.
3. The water-cleaned low-temperature soldering paste manufactured by the method has good welding manufacturability, good wettability and fluidity, few welding seam defects and high reliability.
4. The water-cleaned low-temperature soldering paste manufactured by the method after welding and cleaning has high insulation resistance, and the use safety of electronic products is ensured.
5. The water-cleaned low-temperature soldering paste manufactured by the method has simple post-welding cleaning process, can clean residues after welding by using cold water or warm water, and has low cost, no corrosion, no toxicity and no pollution.
Detailed Description
The water-cleaning low-temperature solder paste and the preparation method thereof according to the present invention will be further described with reference to the examples of the specific ingredient calculation.
Example 1:
step 1: melting of solder alloy
Taking 36-44% of Pb, 18-22% of Bi and the balance Sn according to the weight percentage, respectively, and mixing and smelting the components to obtain an alloy, wherein the total amount of each component is 100%;
step 2: preparation of solder alloy powder
Adopting an atomization method, taking nitrogen as atomization gas, putting the alloy prepared in the step 1 under the conditions that the pressure is 0.5 MPa-1.0 MPa and the temperature is 380-420 ℃, atomizing to prepare alloy powder, and screening the alloy powder to prepare the soldering tin alloy powder with the granularity of 25-50 um;
and step 3: flux preparation
According to the weight percentage, respectively taking 6% of malic acid, 4% of hydroxyethyl cellulose, 20% of dimethyl alkyl betaine, 5% of hydrogenated castor oil, 55% of glycerol and 10% of sorbitol, wherein the total amount of all the components is 100%, adding the malic acid, the hydroxyethyl cellulose, the dimethyl alkyl betaine, the hydrogenated castor oil and the sorbitol into the glycerol, heating to 60-70 ℃, stirring, mixing uniformly after complete dissolution, and standing to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 85% of the soldering tin alloy powder prepared in the step (2) and 15% of the soldering flux prepared in the step (3) according to the weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
Example 2:
step 1 and step 2 are different from those in example 1 in that: step 3, preparation of soldering flux and step 4 of preparation of soldering paste.
According to the weight percentage, respectively taking 8% of malic acid, 3% of hydroxyethyl cellulose, 20% of dimethyl alkyl betaine, 4% of hydrogenated castor oil, 55% of glycerol and 10% of sorbitol, wherein the total amount of all the components is 100%, adding the malic acid, the hydroxyethyl cellulose, the dimethyl alkyl betaine, the hydrogenated castor oil and the sorbitol into the glycerol, heating and stirring, mixing uniformly after completely dissolving, and standing to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 88% of the soldering tin alloy powder prepared in the step (2) and 12% of the soldering flux prepared in the step (3) according to the weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
Example 3:
step 1 and step 2 are different from those in example 1 in that: step 3, preparation of soldering flux and step 4 of preparation of soldering paste.
And step 3: flux preparation
According to the weight percentage, respectively taking 7% of malic acid, 6% of hydroxyethyl cellulose, 20% of dimethyl alkyl betaine, 4% of hydrogenated castor oil, 55% of glycerol and 8% of sorbitol, wherein the total amount of all the components is 100%, adding the malic acid, the hydroxyethyl cellulose, the dimethyl alkyl betaine, the hydrogenated castor oil and the sorbitol into the glycerol, heating and stirring, mixing uniformly after completely dissolving, and standing to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 87% of the soldering tin alloy powder prepared in the step (2) and 13% of the soldering flux prepared in the step (3) according to the weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
Example 4:
step 1 and step 2 are different from those in example 1 in that: step 3, preparation of soldering flux and step 4 of preparation of soldering paste.
And step 3: flux preparation
According to the weight percentage, respectively taking 2% of malic acid, 8% of hydroxyethyl cellulose, 30% of dimethyl alkyl betaine, 10% of hydrogenated castor oil, 45% of glycerol and 5% of sorbitol, wherein the total amount of all the components is 100%, adding the malic acid, the hydroxyethyl cellulose, the dimethyl alkyl betaine, the hydrogenated castor oil and the sorbitol into the glycerol, heating and stirring, mixing uniformly after completely dissolving, and standing to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 90% of the soldering tin alloy powder prepared in the step (2) and 10% of the soldering flux prepared in the step (3) according to the weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
Example 5:
step 1 and step 2 are different from those in example 1 in that: step 3, preparation of soldering flux and step 4 of preparation of soldering paste.
And step 3: flux preparation
According to the weight percentage, respectively taking 10% of malic acid, 10% of hydroxyethyl cellulose, 10% of dimethyl alkyl betaine, 8% of hydrogenated castor oil, 54% of glycerol and 8% of sorbitol, wherein the total amount of all the components is 100%, adding the malic acid, the hydroxyethyl cellulose, the dimethyl alkyl betaine, the hydrogenated castor oil and the sorbitol into the glycerol, heating and stirring, mixing uniformly after completely dissolving, and standing to prepare the soldering flux;
and 4, step 4: solder paste preparation
And (3) respectively taking 86% of the soldering tin alloy powder prepared in the step (2) and 14% of the soldering flux prepared in the step (3) according to the weight percentage, and uniformly mixing to obtain the water-cleaned low-temperature soldering paste.
In the above embodiments, only the embodiment of the present invention of washing the low temperature solder paste portion with water is given, and in the above technical solution of the present invention: the active agent malic acid can be replaced by glycolic acid, amino acid, tartaric acid, erucic acid and itaconic acid, or the combination of more than two of the active agents, one or more of them, the total amount of them should be 2-10% of the weight percentage in the flux material. The paste-forming hydroxyethyl cellulose can also be replaced by polyethanol 2000, polyethanol 4000 and polyethanol 6000, or the combination of more than two paste-forming celluloses, one or more than two, the total amount of which accounts for 1-10 wt% of the soldering flux material. The wetting agent dimethyl alkyl betaine can be replaced by cocoamidopropyl betaine, or the two wetting agents are combined, one or two of the two wetting agents, and the total amount of the two wetting agents accounts for 20 to 30 weight percent of the soldering flux material. The thixotropic agent hydrogenated castor oil can also be replaced by modified hydrogenated castor oil and beeswax, or a combination of two or more of the thixotropic agents, one or more of the thixotropic agents, the total amount of the thixotropic agents and the beeswax is 2-10 wt% of the soldering flux material. In the above embodiment, the present invention uses two solvents, glycerin and sorbitol, which are preferably used together, but of course, only one of these solvents may be used, and one of ethylene glycol, butylene glycol, 2-butoxyethanol, diethylene glycol diethyl ether and dipropylene glycol may be used, or two or more of these solvents may be used in combination, and the total amount of these solvents, whether one or more, should be 50% to 70% by weight of the flux material. It is not shown here that the above description includes technical solutions which should be regarded as illustrative rather than limiting the scope of the present invention.
Claims (2)
1. A water-cleaning low-temperature solder paste is characterized in that: the components and the weight percentage thereof are as follows
85 to 90 percent of soldering tin alloy powder; 10-15% of soldering flux; wherein,
the soldering tin alloy powder consists of 36 to 44 weight percent of Pb, 18 to 22 weight percent of Bi and the balance of Sn, and the total amount of all the components is 100 percent;
the soldering flux is prepared from the following raw materials in percentage by weight: 2 to 10 percent of active agent, 1 to 10 percent of paste forming agent, 20 to 30 percent of wetting agent, 2 to 10 percent of thixotropic agent and 50 to 70 percent of solvent, wherein the total amount of all the components is 100 percent, and the active agent is malic acid; the paste is hydroxyethyl cellulose; the thixotropic agent is at least one of hydrogenated castor oil, modified hydrogenated castor oil and beeswax; the solvent is at least one of sorbitol and glycerol; the wetting agent is at least one of dimethyl alkyl betaine and cocamidopropyl betaine.
2. The water-washed low-temperature solder paste according to claim 1, characterized in that: the wetting agent is dimethyl alkyl betaine; the thixotropic agent is hydrogenated castor oil.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102780103A CN102398122B (en) | 2010-09-08 | 2010-09-08 | Aqueous cleaning low-temperature welding paste and preparation method thereof |
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| CN2010102780103A CN102398122B (en) | 2010-09-08 | 2010-09-08 | Aqueous cleaning low-temperature welding paste and preparation method thereof |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6027655B2 (en) * | 2014-08-29 | 2016-11-16 | 株式会社タムラ製作所 | Soldering flux and solder paste |
| CN105127611A (en) * | 2015-09-28 | 2015-12-09 | 苏州龙腾万里化工科技有限公司 | Low-temperature solder paste |
| CN107297582B (en) * | 2016-12-29 | 2019-08-27 | 北京有色金属与稀土应用研究所 | A kind of lead base high temperature soldering paste free of cleaning and preparation method thereof |
| CN108161271B (en) * | 2017-12-27 | 2021-06-01 | 北京康普锡威科技有限公司 | SnPbBiSb series low-temperature reinforced solder and preparation method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333196A (en) * | 1986-07-28 | 1988-02-12 | Sony Corp | Flux for cream solder |
| JPH11170086A (en) * | 1997-12-11 | 1999-06-29 | Yuho Chem Kk | Water soluble flux |
| KR100765146B1 (en) * | 2006-06-15 | 2007-10-12 | 배상준 | Solder paste and method of forming solder bumps using the same |
| JP5122791B2 (en) * | 2006-09-22 | 2013-01-16 | 石川金属株式会社 | Soldering flux and solder paste with solder |
| CN101327555B (en) * | 2008-07-31 | 2010-04-14 | 昆明三利特科技有限责任公司 | Water-washing type heat-resisting soft solder paste |
| CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
| CN101380699B (en) * | 2008-10-20 | 2011-12-14 | 西安理工大学 | Pig tin series leadless alloy soldering paste and preparation method thereof |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
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