CN102398122A - Aqueous cleaning low-temperature welding paste and preparation method thereof - Google Patents
Aqueous cleaning low-temperature welding paste and preparation method thereof Download PDFInfo
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- CN102398122A CN102398122A CN2010102780103A CN201010278010A CN102398122A CN 102398122 A CN102398122 A CN 102398122A CN 2010102780103 A CN2010102780103 A CN 2010102780103A CN 201010278010 A CN201010278010 A CN 201010278010A CN 102398122 A CN102398122 A CN 102398122A
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Abstract
The invention discloses aqueous cleaning low-temperature welding paste and a preparation method thereof. The welding paste comprises the following components in percentage by weight: 85 to 90 percent of soldering alloy powder, and 10 to 15 percent of scaling powder, wherein the soldering alloy powder consists of the following components in percentage by weight: 36 to 44 percent of Pb, 18 to 22 percent of Bi and the balance of Sn; and the scaling powder is formed by mixing 2 to 10 weight percent of active agent, 1 to 10 weight percent of pasting agent, 20 to 30 weight percent of wetting agent, 2 to 10 weight percent of thixotropic agent, and 50 to 70 weight percent of solvent and the total percentage of all components is 100 percent. The welding paste is suitable for various welding processes, is high in welding speed, does not damage components, does not contain halogen and does not have corrosiveness, and residues are few after welding.
Description
Technical field
The invention belongs to electronics, chemical industry technical field, relate in particular to a kind of water and clean low temperature soldering paste and preparation method thereof.
Background technology
The needed solder cream of electronic devices and components and packaging technology is the rosin halogen-type mostly; After welding is accomplished; Need that cleaning agent---the chloro-fluoro-carbon kind solvent cleans with special-purpose,, can cause the corrosion of electronic devices and components and circuit if clean untotally; Welding quality is difficult to guarantee, also pollutes the environment simultaneously.Rise the eighties in 20th century, and external industrially-advanced country begins to develop water and cleans soldering paste, is used for the welding of highly reliable electronic devices and components, to satisfy commercial, military use.The main dependence on import of solder cream that domestic Electronic Packaging and assembling industry are used, and be the rosin halogen-type, delivery cycle is long, and order quantity is restricted, and the welding quality of electronic devices and components can not get assurance.
Summary of the invention
The purpose of this invention is to provide a kind of water and clean the low temperature soldering paste, this soldering paste multiple welding procedure that can suit, not halogen-containing, non-corrosiveness, the postwelding residue is few.
Another object of the present invention provides the preparation method that this water cleans the low temperature soldering paste.
For realizing above-mentioned purpose, the present invention takes following design:
A kind of water cleans the low temperature soldering paste, and is composed of the following components by weight percentage:
Soldering alloy powder 85%～90%;
Scaling powder 10%～15%;
Said components total amount 100%.
Soldering alloy powder wherein, by weight percentage, the Pb by 36%～44%, 18%～22% Bi and surplus Sn form, said components total amount 100%;
Scaling powder wherein, by weight percentage, the activating agent by 2%～10%, 1%～10% paste making agent, 20%～30% wetting agent, 2%～10% thixotropic agent, 50%～70% solvent form;
Said activating agent is at least a in malic acid, glycolic, amino acid, tartaric acid, erucic acid, the itaconic acid;
Said paste making agent is hydroxyethylcellulose, gather ethanol 2000, gather ethanol 4000, gather at least a in the ethanol 6000;
Said wetting agent is at least a in dimethyl alkyl betaine, the cocoamidopropyl betaine;
Said thixotropic agent is at least a in rilanit special, modified hydrogenated castor oil and the beeswax;
Said solvent is at least a in D-sorbite, glycerine, ethylene glycol, butanediol, butoxy ethanol, diethyl carbitol, the DPG.
A kind of method for preparing water cleaning low temperature soldering paste, this method comprises the steps:
Step 1: soldering alloy melting
By weight percentage, get 36% Pb, 2% Bi and surplus Sn respectively, said components total amount 100% is mixed each component, and melting gets alloy;
Step 2: soldering alloy powder preparation
Adopt atomization, as atomization gas, it is 0.5MPa～1.0MPa that the alloy that step 1 is made places pressure with nitrogen; Temperature is under 380 ℃～420 ℃ the condition, and atomizing makes alloy powder, with this alloy powder; Through screening, make the soldering alloy powder of granularity at 25um～50um;
Step 3: scaling powder preparation
By weight percentage, get 2%～10% activating agent, 1%～10% paste making agent, 20%～30% wetting agent, 2%～10% thixotropic agent, 50%～70% solvent respectively, each component total amount 100%; Activating agent, paste making agent, wetting agent, thixotropic agent are added in the solvent; Heated and stirred after treating to dissolve fully, mixes; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 85%～90% that makes and the scaling powder 10%～15% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
It is simple that water of the present invention cleans low temperature soldering paste design science, reasonable mixture ratio, preparation technology, and multiple welding procedure can suit.This soldering paste is not halogen-containing, non-corrosiveness, and the postwelding residue is few, and the available water that need not saponification cleans, and it is high to clean the back insulaion resistance.
Advantage of the present invention is:
1, the water of the inventive method manufacturing cleans the suitable multiple welding procedure of low temperature soldering paste, comprises that electronic devices and components, Surface Mount Component, and electronic circuit dress join special welding procedure.
2, the water cleaning low temperature soldering paste fusing point of the inventive method manufacturing is low, and speed of welding is fast, has shortened the weld interval to the electronic devices and components of poor heat resistance, not the easy damaged components and parts.
3, the welding procedure property of the water cleaning low temperature soldering paste of the inventive method manufacturing is good, has good wetability, flowability, and weld defect is few, and reliability is high.
4, it is high that the water that the inventive method after welding is cleaned is made cleans low temperature soldering paste insulaion resistance, guaranteed the safe in utilization of electronic product.
5, the water that uses the inventive method to make cleans the low temperature soldering paste, and the postwelding cleaning is simple, and with cold water or the clean postwelding residue of the equal ability of warm water, low, the no burn into of cost is nontoxic, pollution-free.
The specific embodiment
To combine the embodiment of concrete burdening calculation that water cleaning low temperature soldering paste of the present invention and preparation method thereof is further described below.
Embodiment 1:
Step 1: soldering alloy melting
By weight percentage, get 36%～44% Pb, 18%～22% Bi and surplus Sn respectively, each component total amount 100% is mixed each component, and melting gets alloy;
Step 2: soldering alloy powder preparation
Adopt atomization, as atomization gas, the alloy that step 1 is made places pressure position 0.5MPa～1.0MPa with nitrogen; Temperature is under 380 ℃～420 ℃ the condition, and atomizing makes alloy powder, with this alloy powder; Through screening, make the soldering alloy powder of granularity at 25um～50um;
Step 3: scaling powder preparation
By weight percentage, get 6% malic acid, 4% hydroxyethylcellulose, 20% dimethyl alkyl betaine, 5% rilanit special, 55% glycerine, 10% D-sorbite respectively, each component total amount 100%; Malic acid, hydroxyethylcellulose, dimethyl alkyl betaine, rilanit special, D-sorbite are added in the glycerine; Be heated to 60 ℃～70 ℃ stirrings, after treating to dissolve fully, mix; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 85% that makes and the scaling powder 15% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
Embodiment 2:
Step 1, step 2 are with embodiment 1, and difference is: the preparation of the preparation of step 3 scaling powder and step 4 soldering paste.
By weight percentage, get 8% malic acid, 3% hydroxyethylcellulose, 20% dimethyl alkyl betaine, 4% rilanit special, 55% glycerine, 10% D-sorbite respectively, each component total amount 100%; Malic acid, hydroxyethylcellulose, dimethyl alkyl betaine, rilanit special, D-sorbite are added in the glycerine; Heated and stirred after treating to dissolve fully, mixes; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 88% that makes and the scaling powder 12% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
Embodiment 3:
Step 1, step 2 are with embodiment 1, and difference is: the preparation of the preparation of step 3 scaling powder and step 4 soldering paste.
Step 3: scaling powder preparation
By weight percentage, get 7% malic acid, 6% hydroxyethylcellulose, 20% dimethyl alkyl betaine, 4% rilanit special, 55% glycerine, 8% D-sorbite respectively, each component total amount 100%; Malic acid, hydroxyethylcellulose, dimethyl alkyl betaine, rilanit special, D-sorbite are added in the glycerine; Heated and stirred after treating to dissolve fully, mixes; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 87% that makes and the scaling powder 13% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
Embodiment 4:
Step 1, step 2 are with embodiment 1, and difference is: the preparation of the preparation of step 3 scaling powder and step 4 soldering paste.
Step 3: scaling powder preparation
By weight percentage, get 2% malic acid, 8% hydroxyethylcellulose, 30% dimethyl alkyl betaine, 10% rilanit special, 45% glycerine, 5% D-sorbite respectively, each component total amount 100%; Malic acid, hydroxyethylcellulose, dimethyl alkyl betaine, rilanit special, D-sorbite are added in the glycerine; Heated and stirred after treating to dissolve fully, mixes; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 90% that makes and the scaling powder 10% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
Embodiment 5:
Step 1, step 2 are with embodiment 1, and difference is: the preparation of the preparation of step 3 scaling powder and step 4 soldering paste.
Step 3: scaling powder preparation
By weight percentage, get 10% malic acid, 10% hydroxyethylcellulose, 10% dimethyl alkyl betaine, 8% rilanit special, 54% glycerine, 8% D-sorbite respectively, each component total amount 100%; Malic acid, hydroxyethylcellulose, dimethyl alkyl betaine, rilanit special, D-sorbite are added in the glycerine; Heated and stirred after treating to dissolve fully, mixes; Leave standstill, make scaling powder;
Step 4: soldering paste preparation
By weight percentage, get step 2 soldering alloy powder 86% that makes and the scaling powder 14% that step 3 makes respectively, mix, promptly make water and clean the low temperature soldering paste.
Only enumerate the embodiment that water of the present invention cleans low temperature soldering paste part in the foregoing description; In the technical scheme of the invention described above: described activating agent malic acid can also be substituted by glycolic, amino acid, tartaric acid, erucic acid, itaconic acid; Or with the two or more combination of above-mentioned activating agent; No matter be a kind of or multiple, it is 2%～10% percentage by weight that their total amount should account in flux material.Described paste making agent hydroxyethylcellulose can also be by gathering ethanol 2000, gather ethanol 4000, gathering ethanol 6000 and substitute; Or with the two or more combination of above-mentioned paste making agent; No matter be a kind of or multiple, it is 1%～10% percentage by weight that their total amount should account in flux material.Described wetting agent dimethyl alkyl betaine can be substituted by cocoamidopropyl betaine, or with the combination of above-mentioned two kinds of wetting agents, no matter is a kind of or two kinds, and it is 20%～30% percentage by weight that their total amount should account in flux material.Described thixotropic agent rilanit special can also be substituted by modified hydrogenated castor oil and beeswax, or with the two or more combination of above-mentioned thixotropic agent, no matter is a kind of or multiple, and it is 2%～10% percentage by weight that their total amount should account in flux material.In the foregoing description, the present invention has adopted two kinds of solvent glycerin and D-sorbite, and the effect that these two kinds of solvents use simultaneously is preferable; Certainly; Also can be only a kind of with wherein, a kind of in ethylene glycol, butanediol, butoxy ethanol, diethyl carbitol, the DPG also, or two or more combinations in all these solvents are used; No matter be a kind of or multiple, it is 50%～70% percentage by weight that their total amount should account in flux material.Enumerate no longer one by one here, so the above technical scheme that explanation comprised should be regarded as exemplary, but not in order to limit the protection domain that the present invention applies for a patent.
Claims (7)
1. a water cleans the low temperature soldering paste, and it is characterized in that: its component and percentage by weight thereof do
Soldering alloy powder 85%～90%; Scaling powder 10%～15%; Wherein,
Described soldering alloy powder, by weight percentage, the Pb by 36%～44%, 18%～22% Bi and surplus Sn form, each component total amount 100%;
Described scaling powder; By weight percentage; Processed by following raw material: 2%～10% activating agent, 1%～10% paste making agent, 20%～30% wetting agent, 2%～10% thixotropic agent, 50%～70% solvent form each component total amount 100%.
2. water according to claim 1 cleans the low temperature soldering paste, it is characterized in that: described activating agent is at least a in malic acid, glycolic, amino acid, tartaric acid, erucic acid and the itaconic acid; Described paste making agent is hydroxyethylcellulose, gather ethanol 2000, gather ethanol 4000 and gather at least a in the ethanol 6000; Described wetting agent is at least a in dimethyl alkyl betaine and the cocoamidopropyl betaine; Described thixotropic agent is at least a in rilanit special, modified hydrogenated castor oil and the beeswax; Described solvent is at least a in D-sorbite, glycerine, ethylene glycol, butanediol, butoxy ethanol, diethyl carbitol and the DPG.
3. water according to claim 1 cleans the low temperature soldering paste, and it is characterized in that: described activating agent is a malic acid; Described paste making agent is a hydroxyethylcellulose; Described wetting agent is the dimethyl alkyl betaine; Described thixotropic agent is a rilanit special.
4. clean the low temperature soldering paste according to claim 1 or 3 described water, it is characterized in that: described solvent is glycerine and D-sorbite.
5. one kind prepares the method that the described water of claim 1 cleans the low temperature soldering paste, and this method comprises the following steps:
1) by weight percentage, get 36%～44% Pb, 18%～22% Bi and surplus Sn respectively, said components total amount 100% is mixed each component, and melting gets alloy;
2) adopt atomization, as atomization gas, the alloy that step 1 is made places under 380 ℃～420 ℃ temperature and the 0.5MPa～1.0MPa level pressure power condition with nitrogen, and atomizing makes the soldering alloy powder of granularity at 25um～50um;
3) by weight percentage, get 2%～10% activating agent, 1%～10% paste making agent, 20%～30% wetting agent, 2%～10% thixotropic agent, 50%～70% solvent respectively, each component total amount 100%; Activating agent, paste making agent, wetting agent and thixotropic agent are added in the solvent; Be heated to 60 ℃～70 ℃ stirrings, after treating to dissolve fully, mix; Leave standstill, make scaling powder;
4) by weight percentage, get step 2 soldering alloy powder 85%～90% that makes and the scaling powder 10%～15% that step 3 makes respectively, to mixing, promptly make water and clean the low temperature soldering paste after dissolving fully.
6. water according to claim 5 cleans the preparation method of low temperature soldering paste, it is characterized in that: described activating agent is at least a in malic acid, glycolic, amino acid, tartaric acid, erucic acid and the itaconic acid; Described paste making agent is hydroxyethylcellulose, gather ethanol 2000, gather ethanol 4000 and gather at least a in the ethanol 6000; Described wetting agent is at least a in dimethyl alkyl betaine and the cocoamidopropyl betaine; Described thixotropic agent is at least a in rilanit special, modified hydrogenated castor oil and the beeswax; Described solvent is at least a in D-sorbite, glycerine, ethylene glycol, butanediol, butoxy ethanol, diethyl carbitol and the DPG.
7. water according to claim 5 cleans the preparation method of low temperature soldering paste, and it is characterized in that: described solvent is glycerine and D-sorbite.
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| CN2010102780103A CN102398122B (en) | 2010-09-08 | 2010-09-08 | Aqueous cleaning low-temperature welding paste and preparation method thereof |
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| CN105127611A (en) * | 2015-09-28 | 2015-12-09 | 苏州龙腾万里化工科技有限公司 | Low-temperature solder paste |
| CN105382445A (en) * | 2014-08-29 | 2016-03-09 | 株式会社田村制作所 | Soft soldering flux and solder paste |
| CN107297582A (en) * | 2016-12-29 | 2017-10-27 | 北京有色金属与稀土应用研究所 | A kind of No clean lead base high temperature soldering paste and preparation method thereof |
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
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| CN107297582A (en) * | 2016-12-29 | 2017-10-27 | 北京有色金属与稀土应用研究所 | A kind of No clean lead base high temperature soldering paste and preparation method thereof |
| CN107297582B (en) * | 2016-12-29 | 2019-08-27 | 北京有色金属与稀土应用研究所 | A kind of lead base high temperature soldering paste free of cleaning and preparation method thereof |
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
| CN108161271B (en) * | 2017-12-27 | 2021-06-01 | 北京康普锡威科技有限公司 | SnPbBiSb series low-temperature reinforced solder and preparation method thereof |
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