CN102764939B - Alcohol-soluble copper soldering paste - Google Patents
Alcohol-soluble copper soldering paste Download PDFInfo
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- CN102764939B CN102764939B CN201210247812.7A CN201210247812A CN102764939B CN 102764939 B CN102764939 B CN 102764939B CN 201210247812 A CN201210247812 A CN 201210247812A CN 102764939 B CN102764939 B CN 102764939B
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- alcohol
- soldering paste
- soldering
- brazing
- copper
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Abstract
The invention discloses an alcohol-soluble copper soldering paste. The soldering paste comprises the following components in percentage by weight: a) 50-86% of copper-based alloy soldering material powder, b) 0-25% of boride and boride composite soldering flux, c) 3-10% of alcohol-soluble polymer compound bonding agent, d) 10-30% of alcohol solvents and e) 0.05-1% of auxiliary additive. The bonding agent used for copper soldering paste provided by the invention is a non-toxic or slightly toxic alcohol-soluble polymer compound, the solvent is an alcohol environment-friendly solvent, the soldering paste has alcohol solubility, and has water solubility at the same time; water is used for cleaning, an organic solvent is not required to clean, pollution is not caused to human and environment production, and environment friendliness is realized. The copper soldering paste provided by the invention has moderate viscosity, favorable cloth coating property and reliable soldering quality, and is mainly applied to flame soldering of construction elements of materials such as copper, a copper alloy and stainless steel and soldering in a protection atmosphere furnace.
Description
Technical field
The present invention relates to a kind of brazing material, particularly a kind of alcohol dissolubility brazing cream.
Background technology
Along with growing to even greater heights to the cry of environmental protection in the whole world, welding material is constantly towards environment-friendly and green type future development, to reduce the pollution to environment and the harm to human health.The brazing cream that current each field is used is still taking oil-soluble soldering paste as main, and this is mainly because oil-soluble soldering paste has its unique premium properties, as good soft and moist property, stability, screening characteristics etc.But, due to the adhesive employing in oil-soluble soldering paste is oil-soluble macromolecular compound and hydro carbons or esters solvent, the discharge of oil-soluble soldering paste inevitable VOC in production and use procedure, for example, the equipment, apparatus, the skin that contact and be stained with soldering paste cannot clean up by water, must clean with the larger aromatic hydrocarbon solvent of toxicity, easily to causing the pollution of environment.
Summary of the invention
The present invention is directed to the drawback that above-mentioned oil-soluble soldering paste exists, develop a kind of alcohol dissolubility soldering paste of environment-friendly type.
The technical solution used in the present invention is: a kind of alcohol dissolubility brazing cream, is characterized in that the constituent of soldering paste and percentage by weight are: a) copper base solder powder, 50 ~ 86%; B) the compound brazing flux of boride and fluoride, 0 ~ 25%; C) alcohol solubleness high molecular compound class adhesive, 3 ~ 10%; D) alcohols solvent, 10 ~ 30%; E) auxiliary addition agent 0.05 ~ 1%.Wherein said soldering paste constituent alcohol solubleness high molecular compound class adhesive selects to have one or more combinations in the polyethylene glycol, PVP PVP-K30, cellulosic ether, alcohol soluble acrylic resin, alcohol dissolubility rosin of alcohol solubleness high molecular compound 800 ~ 1000.
What the copper base solder powder of soldering paste constituent of the present invention adopted is aerosolization spherical powder, and powder size is 40 ~ 100 μ m, and brazing filler metal alloy system is selected from least one in pure Cu, Cu-5P-9Ni-5Sn, Cu-25Ni-2.5Si-0.2B, Cu-20Ag-36Zn-1Ni.
Alcohol dissolubility brazing cream of the present invention, contains the compound brazing flux of boride and fluoride, and described compound brazing flux is copper hard soldering FB102 or FB103.
This soldering paste adopts alcohols solvent to make the solvent of soldering paste binding agent alcohol solubleness high molecular compound, and described solvent is selected from one or more combinations in ethanol, n-butanol, propane diols, ethylene glycol.
This soldering paste, by adding the auxiliary addition agents such as thixotropic agent, anticorrisive agent, emollients, further improves soldering paste combination property, and soldering paste has good soft and moist property, coating, stability, solderability.
Soldering paste according to claim 1, it is characterized in that described soldering paste constituent e) auxiliary addition agent comprise thixotropic agent, anticorrisive agent and emollients.
Described thixotropic agent is one or both combinations in polyvinyl alcohol, polyacrylic acid, rilanit special.
Described anticorrisive agent is one or both combinations in Sodium Benzoate, sorbierite.
One in described emollients polysiloxanes dimethyl silicone polymer, ethyl silicon oil, Glycerin, mixed triester with caprylic acid capric acid.
The preparation process of this soldering paste is:
1. take required various materials by predetermined soldering paste composition with proportioning.
2. binding agent and solvent are knocked down in the agitator with heater, heat and stir material, temperature of charge is controlled in 120 DEG C, is constantly stirred to material and dissolves completely and be transparence thick liquid adherent, and adherent is retained in agitator and is incubated in 120 DEG C.
3. the solder powder weighing up and brazing flux powder are knocked down in above-mentioned agitator, be stirred to after uniform mixture, add the auxiliary addition agent weighing up to continue to stir material 20 ~ 30 minutes, can make soldering paste finished product.
Beneficial effect of the present invention is: brazing cream of the present invention adhesive used is the alcohol solubleness high molecular compound of nontoxic or micro-poison, solvent is alcohols environmentally friendly solvent, soldering paste has alcohol dissolubility, have water-soluble simultaneously, the equipment, apparatus, the skin that in production and use procedure, contact and be stained with this soldering paste, water can clean up, without with an organic solvent cleaning, can not pollute the mankind and production of environment, be conducive to environmental protection.By the reasonable combination of the each constituent of soldering paste and accurate proportioning, so that soldering paste has good soft and moist property, coating, stability and braze ability, can also conveniently adjust soldering paste viscosity to adapt to different application scenarios and weather simultaneously.Brazing cream of the present invention has moderate viscosity, good coating, reliable brazing quality, is mainly used in gas brazing, the protective atmosphere furnace brazing of the material members such as copper, copper alloy, carbon steel, stainless steel.Its advantage is that the coating of this soldering paste is very convenient flexible, can soldering paste be coated in to weldment position to be brazed by point gum machine, not perplexed by irregular and complicated of weld shape, in addition, in soldering paste, contain brazing flux, remove brushing scaling powder operation from, can increase substantially welding production efficiency.
Detailed description of the invention
Alcohol dissolubility brazing cream of the present invention can be selected any solder powder component of doing in soldering paste in pure Cu or Cu-5P-9Ni-5Sn, Cu-25Ni-2.5Si-0.2B, Cu-20Ag-36Zn-1Ni, to prepare several alcohol dissolubility series brazing cream that is applicable to different brazing temperatures, different soldering materials, solder powder used is aerosolization spherical powder, powder particle surface is smooth, particle size range 40 ~ 100 μ m.The preparation process of this soldering paste is:
1. take required various materials by predetermined soldering paste composition with proportioning.
2. binding agent and solvent are knocked down in the agitator with heater, heat and stir material, temperature of charge is controlled in 120 DEG C, is constantly stirred to material and dissolves completely and be transparence thick liquid adherent, and adherent is retained in agitator and is incubated in 120 DEG C.
3. the solder powder weighing up and brazing flux powder are knocked down in above-mentioned agitator, be stirred to after uniform mixture, add the auxiliary addition agent weighing up to continue to stir material 20 ~ 30 minutes, can make soldering paste finished product.
Embodiment 1
A) copper base solder powder: pure Cu powder, accounts for 85% of soldering paste gross weight;
B) the compound brazing flux of boride and fluoride: content is 0;
C) alcohol solubleness high molecular compound class adhesive: account for 3% of soldering paste gross weight, wherein alcohol soluble acrylic resin account for adhesive gross weight 60%, polyethylene glycol PEG-800 accounts for 40% of adhesive gross weight;
D) alcohols solvent: account for 11.5% of soldering paste gross weight.Wherein ethanol, ethylene glycol respectively account for 50% of solvent gross weight;
E) auxiliary addition agent: account for 0.5% of soldering paste gross weight, wherein thixotropic agent polyvinyl alcohol account for auxiliary addition agent gross weight 35%, anticorrisive agent accounts for 45% of auxiliary addition agent gross weight, wherein Sodium Benzoate, sorbierite respectively account for anticorrisive agent gross weight 50%, emollients dimethyl siloxane accounts for 20% of auxiliary addition agent gross weight.
Embodiment 2
A) copper base solder powder: Cu-5P-9Ni-5Sn powder, accounts for 63% of soldering paste gross weight;
B) the compound brazing flux of boride and fluoride: copper hard soldering FB102, accounts for 15% of soldering paste gross weight;
C) alcohol solubleness high molecular compound class adhesive: account for 5% of soldering paste gross weight, wherein PVP PVP-K30 account for adhesive gross weight 40%, polyethylene glycol PEG-1500 accounts for 60% of adhesive gross weight;
D) alcohols solvent: account for 16.8% of soldering paste gross weight.Wherein ethanol, ethylene glycol respectively account for 50% of solvent gross weight;
E) auxiliary addition agent: account for 0.2% of soldering paste gross weight, wherein thixotropic agent polyvinyl alcohol account for auxiliary addition agent gross weight 35%, anticorrisive agent sorbierite account for auxiliary addition agent gross weight 35%, emollients ethyl silicon oil accounts for 30% of auxiliary addition agent gross weight.
Embodiment 3
A) copper base solder powder: Cu-25Ni-2.5Si-0.2B powder, accounts for 60% of soldering paste gross weight;
B) the compound brazing flux of boride and fluoride: copper hard soldering FB102, accounts for 15% of soldering paste gross weight;
C) alcohol solubleness high molecular compound class adhesive: alcohol dissolubility rosin, accounts for 6.2 of soldering paste gross weight; .
D) alcohols solvent: account for 18% of soldering paste gross weight.Wherein ethanol, n-butanol respectively account for 50% of solvent gross weight;
E) auxiliary addition agent: account for 0.8% of soldering paste gross weight, wherein: thixotropic agent accounts for 40% of auxiliary addition agent gross weight, thixotropic agent consist of hydrogenated castor 70%(weight ratio), oily polyvinyl alcohol 30%(weight ratio).Preservative sodium benzoate account for auxiliary addition agent gross weight 24%, emollients ethyl silicon oil accounts for 36% of auxiliary addition agent gross weight.
Embodiment 4
A) copper base solder powder: Cu-20Ag-36Zn-1Ni powder, accounts for 62% of soldering paste gross weight;
B) the compound brazing flux of boride and fluoride: copper hard soldering FB103, accounts for 16% of soldering paste gross weight;
C) alcohol solubleness high molecular compound class adhesive: cellulosic ether, accounts for 3% of soldering paste gross weight;
D) alcohols solvent: propane diols, accounts for 18% of soldering paste gross weight;
E) auxiliary addition agent: account for 1% of soldering paste gross weight, wherein thixotropic agent polyacrylic acid account for auxiliary addition agent gross weight 25%, anticorrisive agent sorbierite account for auxiliary addition agent gross weight 40%, emollients Glycerin, mixed triester with caprylic acid capric acid accounts for 35% of auxiliary addition agent gross weight.
The foregoing is only preferential embodiment of the present invention, as long as within the technical scheme that realizes the object of the invention with basic identical means all belongs to protection scope of the present invention.
Claims (8)
1. an alcohol dissolubility brazing cream, is characterized in that the constituent of soldering paste and percentage by weight are: a) copper base solder powder, 50～86%; B) the compound brazing flux of boride and fluoride, 0～25%; C) alcohol solubleness high molecular compound class adhesive, 3～10%; D) alcohols solvent, 10～30%; E) auxiliary addition agent 0.05～1%; The alcohol solubleness high molecular compound class adhesive of wherein said soldering paste constituent selects to have one or more combinations in the polyethylene glycol, PVP PVP-K30, cellulosic ether, alcohol soluble acrylic resin, alcohol dissolubility rosin of alcohol solubleness high molecular compound molecular weight 800～1000.
2. a kind of alcohol dissolubility brazing cream according to claim 1, it is characterized in that described soldering paste constituent a) copper base solder powder be aerosolization spherical powder, granularity is 40～100 μ m, and brazing filler metal alloy system is selected from least one in pure Cu, Cu-5P-9Ni-5Sn, Cu-25Ni-2.5Si-0.2B, Cu-20Ag-36Zn-1Ni.
3. a kind of alcohol dissolubility brazing cream according to claim 1, is characterized in that b) boride and the compound brazing flux of fluoride are copper hard soldering FB102 or FB103 to described soldering paste constituent.
4. a kind of alcohol dissolubility brazing cream according to claim 1, it is characterized in that described soldering paste constituent d) alcohols solvent be one or both combinations in ethanol, n-butanol, propane diols, ethylene glycol.
5. a kind of alcohol dissolubility brazing cream according to claim 1, it is characterized in that described soldering paste constituent e) auxiliary addition agent comprise thixotropic agent, anticorrisive agent, emollients.
6. a kind of alcohol dissolubility brazing cream according to claim 5, is characterized in that described thixotropic agent is one or both combinations in polyvinyl alcohol, polyacrylic acid, rilanit special.
7. a kind of alcohol dissolubility brazing cream according to claim 5, is characterized in that described anticorrisive agent is one or both combinations in Sodium Benzoate, sorbierite.
8. a kind of alcohol dissolubility brazing cream according to claim 5, is characterized in that described emollients is the one in polysiloxanes dimethyl silicone polymer, ethyl silicon oil, Glycerin, mixed triester with caprylic acid capric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210247812.7A CN102764939B (en) | 2012-07-18 | 2012-07-18 | Alcohol-soluble copper soldering paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210247812.7A CN102764939B (en) | 2012-07-18 | 2012-07-18 | Alcohol-soluble copper soldering paste |
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| Publication Number | Publication Date |
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| CN102764939A CN102764939A (en) | 2012-11-07 |
| CN102764939B true CN102764939B (en) | 2014-08-20 |
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| CN201210247812.7A Expired - Fee Related CN102764939B (en) | 2012-07-18 | 2012-07-18 | Alcohol-soluble copper soldering paste |
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|---|---|---|---|---|
| WO2014089072A2 (en) * | 2012-12-03 | 2014-06-12 | Holtec International, Inc. | Brazing compositions and uses thereof |
| US11504814B2 (en) | 2011-04-25 | 2022-11-22 | Holtec International | Air cooled condenser and related methods |
| CN102909494B (en) * | 2012-11-19 | 2015-05-06 | 高金菊 | Binder of copper-based solder |
| CN104625477B (en) * | 2014-12-29 | 2016-08-17 | 湖南天佑科技有限公司 | A kind of passive from growing high stainless mastic of hot automatic welding and preparation method thereof and using method |
| CN105171276A (en) * | 2015-09-15 | 2015-12-23 | 铜陵新鑫焊材有限公司 | Preparation method for copper-based soldering paste |
| CN105552165B (en) * | 2015-12-16 | 2017-11-24 | 张家港市东大工业技术研究院 | A kind of spraying manufacture method of photovoltaic welding belt |
| CN107052616A (en) * | 2016-11-30 | 2017-08-18 | 安徽华众焊业有限公司 | Soldering copper soldering paste |
| CN106514044A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Copper-based brazing paste |
| CN106736010A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Copper zinc solder paste |
| CN106736024A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle silver-free copper-based soldering paste of temperature and preparation method thereof |
| CN106736025A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle temperature silverless Cu-base soldering material and preparation method thereof |
| CN106825998B (en) * | 2017-02-28 | 2019-04-05 | 哈尔滨工业大学深圳研究生院 | A kind of non-oxidation Nanometer Copper soldering paste and preparation method thereof as high-power chip encapsulation |
| CN112658428A (en) * | 2020-12-15 | 2021-04-16 | 西安飞机工业（集团）有限责任公司 | Copper conduit flame brazing protective coating and protection method |
| CN113560766B (en) * | 2021-09-08 | 2024-01-30 | 烟台艾邦电子材料有限公司 | Solder paste special for weldable stainless steel |
| CN113878264B (en) * | 2021-11-10 | 2023-01-31 | 湖南盛华源材料科技有限公司 | Brazing flux paste for hard alloy-tool steel cutter and preparation method thereof |
| CN114571137A (en) * | 2022-05-09 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing paste, copper-based pre-alloy and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3171734A (en) * | 1963-09-24 | 1965-03-02 | Powder Melting Corp | Brazing compositions having polyvinyl alcohol as a binder |
| GB1131375A (en) * | 1967-05-12 | 1968-10-23 | Standard Telephones Cables Ltd | Copper brazing paste |
| CN1029207C (en) * | 1991-03-14 | 1995-07-05 | 中国有色金属工业总公司昆明贵金属研究所 | Copper basis soldering paste and brazing method for copper ornaments |
| CN1586795A (en) * | 2004-08-31 | 2005-03-02 | 广州有色金属研究院 | Copper welding paste for automatic brazing and its preparing method |
| CN101780606A (en) * | 2009-12-23 | 2010-07-21 | 深圳市唯特偶化工开发实业有限公司 | Washing-free lead-free halogen-free tin soldering paste |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233119A (en) * | 1997-02-18 | 1998-09-02 | Mitsuboshi Belting Ltd | Copper conductor paste and substrate printed therewith |
-
2012
- 2012-07-18 CN CN201210247812.7A patent/CN102764939B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3171734A (en) * | 1963-09-24 | 1965-03-02 | Powder Melting Corp | Brazing compositions having polyvinyl alcohol as a binder |
| GB1131375A (en) * | 1967-05-12 | 1968-10-23 | Standard Telephones Cables Ltd | Copper brazing paste |
| CN1029207C (en) * | 1991-03-14 | 1995-07-05 | 中国有色金属工业总公司昆明贵金属研究所 | Copper basis soldering paste and brazing method for copper ornaments |
| CN1586795A (en) * | 2004-08-31 | 2005-03-02 | 广州有色金属研究院 | Copper welding paste for automatic brazing and its preparing method |
| CN101780606A (en) * | 2009-12-23 | 2010-07-21 | 深圳市唯特偶化工开发实业有限公司 | Washing-free lead-free halogen-free tin soldering paste |
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| CN102764939A (en) | 2012-11-07 |
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Owner name: JIANGMEN YINGSHENG WELDING MATERIAL TECHNOLOGY CO. Free format text: FORMER OWNER: XIONG JIN Effective date: 20150714 |
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Effective date of registration: 20150714 Address after: 529000 Jiangmen City, Guangdong Province Patentee after: Jiangmen Yingsheng welding Mstar Technology Ltd Address before: 529000 Guangdong province Jiangmen Duruan Yao Village Industrial Zone B block No. 8-9 Patentee before: Xiong Jin |
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