CN103817459A - Novel resin scaling powder - Google Patents
Novel resin scaling powder Download PDFInfo
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- CN103817459A CN103817459A CN201410096760.7A CN201410096760A CN103817459A CN 103817459 A CN103817459 A CN 103817459A CN 201410096760 A CN201410096760 A CN 201410096760A CN 103817459 A CN103817459 A CN 103817459A
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- Prior art keywords
- scaling powder
- new type
- mass percent
- type resin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
The invention discloses a novel resin scaling powder. The novel resin scaling powder comprises, by mass, 80 percent of mixed organic solvent, 10 percent of active agent, 5 percent of filmogen and 5 percent of cosolvent. The proportion of ethyl alcohol to ethylene glycol to glycerol to ethylene glycol monobutyl ether of the mixed organic solvent is 2: 8: 8:1. By means of the method, the novel resin scaling powder has the advantages of being low in smoke emission, weak in pungent smell, high in tin plating speed, capable of keeping cleanliness of a metal solder side, good in wettability, safe, friendly to the environment, non-toxic, uninjurious, safe in using and the like, and has wide market prospects in popularization.
Description
Technical field
The present invention relates to chemical field, particularly relate to a kind of new type resin scaling powder.
Background technology
Chemical industry, full name chemical industry, very close with the mankind's productive life relation, in the modern life, almost all be unable to do without chemical products whenever and wherever possible, chemical products are permeated in industry-by-industry and fields such as household, agricultural, industry, wherein scaling powder is widely used in industrial welding, the existing scaling powder surfactants that contain halogen that adopt more, although help, weldering is effective, cost is low, and long-time use is easily created in metal surface and leaves the problems such as residue, complex procedures, contaminated environment, destruction atmosphere.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of new type resin scaling powder, by adopting low colophony type cleaning-free scaling powder to replace halogen-containing scaling powder in the past, help that weldering ability is good, good, the nontoxic non-corrosiveness of foam performance, noresidue, safety and environmental protection, operation be simple and easy, on new type resin scaling powder universal, has market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of new type resin scaling powder, the mass percent of formula comprises:
Mixed organic solvents 80%,
Activating agent 10%,
Film forming agent 5%,
Cosolvent 5%,
The composition of described mixed organic solvents comprises that quality proportioning is the ethanol of 2:8:8:1: ethylene glycol: glycerine: butyl glycol ether.
In a preferred embodiment of the present invention, the mass percent of described activating agent comprises benzoic acid 40%, phthalic acid 30%, diphenyl acetic acid 30%.
In a preferred embodiment of the present invention, the mass percent of described film forming agent comprises 50% acrylic resin and 50% butadiene resin.
In a preferred embodiment of the present invention, the mass percent of described cosolvent comprises 20% Sodium Benzoate, 20% sodium salicylate and 60% p-aminobenzoic acid.
The invention has the beneficial effects as follows: new type resin scaling powder of the present invention have low cigarette, pungent little, the upper tin speed of taste fast, keep that metal welding junction is clean, wetability is good, safety and environmental protection, nontoxic, use the advantages such as safety, on new type resin scaling powder universal, have market prospects widely.
The specific embodiment
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of new type resin scaling powder, the mass percent of formula comprises:
Mixed organic solvents 80%,
Activating agent 10%,
Film forming agent 5%,
Cosolvent 5%,
The composition of described mixed organic solvents comprises that quality proportioning is the ethanol of 2:8:8:1: ethylene glycol: glycerine: butyl glycol ether, experiment shows that the mixed organic solvents protection of said ratio is effective, viscosity is low, easy to use.
Preferably, the mass percent of described activating agent comprises benzoic acid 40%, phthalic acid 30%, diphenyl acetic acid 30%, generally can adopt aliphatic dibasic acid, aromatic acid or amino acid as bioactive agent composition, for increasing the activity of organic accelerator, make it to give full play to usefulness.
Preferably, the mass percent of described film forming agent comprises 50% acrylic resin and 50% butadiene resin, generally can adopt hydrocarbon, alcohol, fat as film forming agent composition, has the characteristics such as flexibility, ductility, elasticity, rub resistance and resistance to water.
Preferably, the mass percent of described cosolvent comprises 20% Sodium Benzoate, 20% sodium salicylate and 60% p-aminobenzoic acid, the solubility for increasing solvent in solution.
The beneficial effect of new type resin scaling powder of the present invention is:
One, by adopting composition to comprise that quality proportioning is the ethanol of 2:8:8:1: ethylene glycol: glycerine: butyl glycol ether is as mixed organic solvents, protect effective, viscosity is low, easy to use;
Two, by adopting mass percent to comprise that benzoic acid 40%, phthalic acid 30%, diphenyl acetic acid 30%, as activating agent, have increased the activity of organic accelerator, make it to give full play to usefulness;
Three, with respect to general new type resin scaling powder, the mass percent of the cosolvent of the new type resin scaling powder here comprises 20% Sodium Benzoate, 20% sodium salicylate and 60% p-aminobenzoic acid, has increased the solubility of solvent in solution.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a new type resin scaling powder, is characterized in that, the mass percent of formula comprises:
Mixed organic solvents 80%,
Activating agent 10%,
Film forming agent 5%,
Cosolvent 5%,
The composition of described mixed organic solvents comprises that quality proportioning is the ethanol of 2:8:8:1: ethylene glycol: glycerine: butyl glycol ether.
2. new type resin scaling powder according to claim 1, is characterized in that, the mass percent of described activating agent comprises benzoic acid 40%, phthalic acid 30%, diphenyl acetic acid 30%.
3. new type resin scaling powder according to claim 1, is characterized in that, the mass percent of described film forming agent comprises 50% acrylic resin and 50% butadiene resin.
4. new type resin scaling powder according to claim 1, is characterized in that, the mass percent of described cosolvent comprises 20% Sodium Benzoate, 20% sodium salicylate and 60% p-aminobenzoic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096760.7A CN103817459A (en) | 2014-03-17 | 2014-03-17 | Novel resin scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096760.7A CN103817459A (en) | 2014-03-17 | 2014-03-17 | Novel resin scaling powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103817459A true CN103817459A (en) | 2014-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410096760.7A Pending CN103817459A (en) | 2014-03-17 | 2014-03-17 | Novel resin scaling powder |
Country Status (1)
| Country | Link |
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| CN (1) | CN103817459A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722957A (en) * | 2015-04-09 | 2015-06-24 | 河南师范大学 | Environment-friendly spraying type welding anti-splattering agent and preparation method thereof |
| CN105537804A (en) * | 2016-02-22 | 2016-05-04 | 苏州锐耐洁电子科技新材料有限公司 | Low-rosin washing-free flux |
| CN105537805A (en) * | 2016-03-07 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | No-clean scaling powder |
| CN112658530A (en) * | 2020-12-16 | 2021-04-16 | 湖北省哈福生物化学有限公司 | Low-temperature soldering flux component and preparation process thereof |
| CN113084394A (en) * | 2021-04-16 | 2021-07-09 | 湖南东安县特种焊材有限公司 | Non-corrosive soldering flux and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000844A1 (en) * | 1984-07-20 | 1986-02-13 | Ytkemiska Institutet | Fluxing agent and soldering process |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| JP2005153020A (en) * | 2003-11-07 | 2005-06-16 | Shinko Alcoa Yuso Kizai Kk | Aluminum alloy brazing material, method for manufacturing the same, and method for manufacturing aluminum alloy heat exchanger |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN103358053A (en) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | Preparation method of environmental-friendly halogen-free smokeless soldering flux |
-
2014
- 2014-03-17 CN CN201410096760.7A patent/CN103817459A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000844A1 (en) * | 1984-07-20 | 1986-02-13 | Ytkemiska Institutet | Fluxing agent and soldering process |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| JP2005153020A (en) * | 2003-11-07 | 2005-06-16 | Shinko Alcoa Yuso Kizai Kk | Aluminum alloy brazing material, method for manufacturing the same, and method for manufacturing aluminum alloy heat exchanger |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN103358053A (en) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | Preparation method of environmental-friendly halogen-free smokeless soldering flux |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722957A (en) * | 2015-04-09 | 2015-06-24 | 河南师范大学 | Environment-friendly spraying type welding anti-splattering agent and preparation method thereof |
| CN104722957B (en) * | 2015-04-09 | 2016-11-30 | 河南师范大学 | A kind of environment-friendly spray coating type splash-proof welding agent and preparation method thereof |
| CN105537804A (en) * | 2016-02-22 | 2016-05-04 | 苏州锐耐洁电子科技新材料有限公司 | Low-rosin washing-free flux |
| CN105537805A (en) * | 2016-03-07 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | No-clean scaling powder |
| CN112658530A (en) * | 2020-12-16 | 2021-04-16 | 湖北省哈福生物化学有限公司 | Low-temperature soldering flux component and preparation process thereof |
| CN113084394A (en) * | 2021-04-16 | 2021-07-09 | 湖南东安县特种焊材有限公司 | Non-corrosive soldering flux and preparation method thereof |
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Application publication date: 20140528 |