CN105127611A - Low-temperature solder paste - Google Patents
Low-temperature solder paste Download PDFInfo
- Publication number
- CN105127611A CN105127611A CN201510622726.3A CN201510622726A CN105127611A CN 105127611 A CN105127611 A CN 105127611A CN 201510622726 A CN201510622726 A CN 201510622726A CN 105127611 A CN105127611 A CN 105127611A
- Authority
- CN
- China
- Prior art keywords
- tin cream
- low
- low temperature
- solder paste
- temperature solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a low-temperature solder paste. The low-temperature solder paste comprises the following ingredients: 8-10 parts of tin powder, 8-10 parts of lead powder, 8-10 parts of a tin-bismuth alloy, 1-2 parts of bismuth powder and 1 part of a flux. According to the technical scheme, the low-temperature solder paste has the advantages of being uniform in dispersion, easy in welding, low in melting point, long in service life, stable in performance, wide in source, safe to use, and broad in market prospect of popularization.
Description
Technical field
The present invention relates to electrophile field, particularly relate to a kind of low temperature tin cream.
Background technology
Tin cream is widely used in field of industrial production, tin cream has certain viscosity at normal temperatures, can be bonded at commitment positions by the beginning of electronic devices and components, under welding temperature, along with the volatilization of solvent and portions additive, welded components and parts are formed permanent connection together with printed circuit pad solder.
Wherein low temperature tin cream refers to that fusing point is the tin cream of 138 degrees Celsius, is mainly applicable to the welding that electron plate can not bear more than 200 DEG C high temperature, however existing low temperature tin cream generally have dispersion uneven, be not easy the shortcomings such as tin, be unfavorable for permanent use.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of low temperature tin cream, by adopting the powdered granule Homogeneous phase mixing of various metals and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering be easy, fusing point is low, long service life, stable performance, wide material sources, use safety, low temperature tin cream universal on have market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of low temperature tin cream, composition proportion comprises:
Glass putty 8-10 part,
Lead powder 8-10 part,
Sn-bi alloy 8-10 part,
Bismuth meal 1-2 part,
Scaling powder 1 part.
In a preferred embodiment of the present invention, the particle size range of described glass putty, lead powder, bismuth meal is 25-30 micron.
In a preferred embodiment of the present invention, the particle size range of described sn-bi alloy is 35-45 micron.
In a preferred embodiment of the present invention, described scaling powder comprises activator, thixotropic agent, resin and solvent.
The invention has the beneficial effects as follows: low temperature tin cream of the present invention have be uniformly dispersed, the advantage such as upper weldering is easy, fusing point is low, long service life, stable performance, wide material sources, use safety, low temperature tin cream universal on have market prospects widely.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of low temperature tin cream, composition proportion comprises:
Glass putty 8-10 part,
Lead powder 8-10 part,
Sn-bi alloy 8-10 part,
Bismuth meal 1-2 part,
Scaling powder 1 part, wherein adds the fusing point that bismuth effectively reduces tin cream, reaches 138 DEG C in tin, lead, can be widely used in the welding that electron plate can not bear more than 200 DEG C, wide material sources, use safety.
Preferably, the particle size range of described glass putty, lead powder, bismuth meal is 25-30 micron.
Preferably, the particle size range of described sn-bi alloy is 35-45 micron, adopts the powdered granule Homogeneous phase mixing of various metals and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering easily, long service life, stable performance.
Preferably, described scaling powder comprises activator, thixotropic agent, resin and solvent, wherein activator effectively can be removed the oxidation material of welding position, reduce the surface tension of tin cream, thixotropic agent effectively can regulate the viscosity of tin cream and printing performance, effectively prevent from occurring the situations such as hangover, adhesion in welding, resin be mainly used in improving tin cream adhesiveness, prevent from reoxidizing, appropriate solvent adds the service life can played in the whipping process of tin cream and regulate uniform effect, effectively improve tin cream.
The beneficial effect of low temperature tin cream of the present invention is:
One, in tin, lead, adding by adopting the fusing point that bismuth effectively reduces tin cream, reaching 138 DEG C, the welding that electron plate can not bear more than 200 DEG C can be widely used in, wide material sources, use safety;
Two, by adopting the powdered granule Homogeneous phase mixing of various metals and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering easily, long service life, stable performance.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a low temperature tin cream, is characterized in that, composition proportion comprises:
Glass putty 8-10 part,
Lead powder 8-10 part,
Sn-bi alloy 8-10 part,
Bismuth meal 1-2 part,
Scaling powder 1 part.
2. low temperature tin cream according to claim 1, is characterized in that, the particle size range of described glass putty, lead powder, bismuth meal is 25-30 micron.
3. low temperature tin cream according to claim 1, is characterized in that, the particle size range of described sn-bi alloy is 35-45 micron.
4. low temperature tin cream according to claim 1, is characterized in that, described scaling powder comprises activator, thixotropic agent, resin and solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622726.3A CN105127611A (en) | 2015-09-28 | 2015-09-28 | Low-temperature solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622726.3A CN105127611A (en) | 2015-09-28 | 2015-09-28 | Low-temperature solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105127611A true CN105127611A (en) | 2015-12-09 |
Family
ID=54713360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510622726.3A Pending CN105127611A (en) | 2015-09-28 | 2015-09-28 | Low-temperature solder paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105127611A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108620764A (en) * | 2017-03-24 | 2018-10-09 | 苏州昭舜物联科技有限公司 | Low temperature solder connects with soldering paste and preparation method |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491562A (en) * | 1982-06-11 | 1985-01-01 | Hitachi, Ltd. | Thermal fatigue resistant low-melting point solder alloys |
| JPS60141396A (en) * | 1983-12-29 | 1985-07-26 | Hitachi Ltd | Low-temperature solder alloy |
| JPH0924486A (en) * | 1995-07-13 | 1997-01-28 | Toshiba Corp | Low melting point alloy and cream solder using its powder |
| EP0770449A1 (en) * | 1995-10-30 | 1997-05-02 | AT&T Corp. | Low temperature solder alloy and articles comprising the alloy |
| US5871690A (en) * | 1997-09-29 | 1999-02-16 | Ford Motor Company | Low-temperature solder compositions |
| US6214131B1 (en) * | 1998-10-29 | 2001-04-10 | Agilent Technologies, Inc. | Mixed solder pastes for low-temperature soldering process |
| US20020012607A1 (en) * | 2000-05-24 | 2002-01-31 | Corbin Stephen F. | Variable melting point solders and brazes |
| CN101069938A (en) * | 2006-05-10 | 2007-11-14 | 北京有色金属研究总院 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
| CN102398122A (en) * | 2010-09-08 | 2012-04-04 | 北京有色金属与稀土应用研究所 | Aqueous cleaning low-temperature welding paste and preparation method thereof |
| CN104827198A (en) * | 2015-04-28 | 2015-08-12 | 苏州永创达电子有限公司 | Soldering tin paste |
| CN104907737A (en) * | 2015-07-02 | 2015-09-16 | 苏州永创达电子有限公司 | Novel cleaning-free soldering flux |
-
2015
- 2015-09-28 CN CN201510622726.3A patent/CN105127611A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491562A (en) * | 1982-06-11 | 1985-01-01 | Hitachi, Ltd. | Thermal fatigue resistant low-melting point solder alloys |
| JPS60141396A (en) * | 1983-12-29 | 1985-07-26 | Hitachi Ltd | Low-temperature solder alloy |
| JPH0924486A (en) * | 1995-07-13 | 1997-01-28 | Toshiba Corp | Low melting point alloy and cream solder using its powder |
| EP0770449A1 (en) * | 1995-10-30 | 1997-05-02 | AT&T Corp. | Low temperature solder alloy and articles comprising the alloy |
| US5871690A (en) * | 1997-09-29 | 1999-02-16 | Ford Motor Company | Low-temperature solder compositions |
| US6214131B1 (en) * | 1998-10-29 | 2001-04-10 | Agilent Technologies, Inc. | Mixed solder pastes for low-temperature soldering process |
| US20020012607A1 (en) * | 2000-05-24 | 2002-01-31 | Corbin Stephen F. | Variable melting point solders and brazes |
| CN101069938A (en) * | 2006-05-10 | 2007-11-14 | 北京有色金属研究总院 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
| CN102398122A (en) * | 2010-09-08 | 2012-04-04 | 北京有色金属与稀土应用研究所 | Aqueous cleaning low-temperature welding paste and preparation method thereof |
| CN104827198A (en) * | 2015-04-28 | 2015-08-12 | 苏州永创达电子有限公司 | Soldering tin paste |
| CN104907737A (en) * | 2015-07-02 | 2015-09-16 | 苏州永创达电子有限公司 | Novel cleaning-free soldering flux |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108620764A (en) * | 2017-03-24 | 2018-10-09 | 苏州昭舜物联科技有限公司 | Low temperature solder connects with soldering paste and preparation method |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |
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| RJ01 | Rejection of invention patent application after publication |