CN1209374A - Low solid-material content cleaning-free scaling powder - Google Patents
Low solid-material content cleaning-free scaling powder Download PDFInfo
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- CN1209374A CN1209374A CN 97106056 CN97106056A CN1209374A CN 1209374 A CN1209374 A CN 1209374A CN 97106056 CN97106056 CN 97106056 CN 97106056 A CN97106056 A CN 97106056A CN 1209374 A CN1209374 A CN 1209374A
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- scaling powder
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- benzotriazole
- low solid
- acid
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Abstract
The scaling powder is made up by using adipic acid, decanedioic acid, surfactant, benzotriazole, monostearin, butylcellosolve, butyl acetate, emulsifier OP-10, faste penetrant OT, ethyl alcohol and isopropanol as raw material through general conventional preparation process. Said invented scaling powder possesses the advantages of good weldability, low solid content, no residue after welding, low ionic dirtiness, no corrosion, good dryness and high surface insulativity.
Description
The present invention relates to a kind of soldering and connect scaling powder, particularly a kind of no-clean scaling powder of low-solid content.
In recent decades, in electronic product production soldering technical process, the abietic resin that general many uses mainly are made up of activating agent, additive and the organic solvent of rosin, resin, halide is a scaling powder.Though this scaling powder solderability is good, cost is low,, the residual object height of postwelding.Its residue contains chlorion, can progressively cause problems such as electrical insulation properties decline and short circuit migration.Addressing this problem, must be that flux residue is cleaned to the abietic resin in the electronics printed board, not only can increase production cost, and cleaning tree botany bar gum is that the residual cleaning agent of solder flux mainly is the dichlorodifluoromethan compound.This compound is the loss material of atmospheric ozone layer, the row that belong to forbidding and be eliminated.Therefore, along with developing rapidly and demand of electron surface package technique, the no-clean scaling powder of novel low-solid content just arises at the historic moment.
No-clean scaling powder run-of-the-mill of the prior art is relatively poor, and solderability is low, and aridity is poor, and solid content is higher, and postwelding still has residual, and the price comparison costliness, and certain toxicity and smell are arranged, and existing welding equipment can not be general.
Task of the present invention provides a kind of high-quality low-solid content scaling powder, this scaling powder solderability is good, and easily dry, solid content is low, the postwelding noresidue, do not have corrosion, electrical insulation properties is good, and price is low, avirulence and smell, existing welding equipment is general, only increases equipment component slightly and gets final product, thereby overcome the above-mentioned defective of existing in prior technology.
Task of the present invention is realized by following technical scheme:
One, the prescription of low solid-material content cleaning-free scaling powder of the present invention, raw material total amount are in 1000 weight portions, and various raw materials and weight portion are:
Adipic acid 13-15
Decanedioic acid 6-8
Carbon fluorine ion surfactant 5-6
Quickly penetrating agent OT 4-6
OP-10 5-10
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.1-1
Ethylene glycol monobutyl ether 20-80
Ethyl acetate 10-50
Ethanol 250-350
The isopropyl alcohol surplus
Preferred each raw material and weight portion are:
Adipic acid 13-15
Decanedioic acid 6-8
Carbon fluorine ion surfactant 5-6
Quickly penetrating agent OT 4-6
OP-10 6-8
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.3-0.6
Ethylene glycol monobutyl ether 35-55
Ethyl acetate 30-40
Ethanol 300-350
The isopropyl alcohol surplus
Two, the production of low solid-material content cleaning-free scaling powder of the present invention can be adopted general conventional production method, and its processing step is as follows:
(1) adipic acid, decanedioic acid, benzotriazole, single stearic acid glycerine lipoprotein are added in the ethanol, add isopropyl alcohol, co-solvent ethylene gylcol monobutyl ether, ethyl acetate, emulsifier op-10, quickly penetrating agent OT again, and carbon fluorine ion surfactant;
(2) under 60-80 ℃ of temperature conditions, stir, make raw material fully dissolve mixing;
(3) filter;
(4) precipitation;
(5) get the supernatant packing, promptly obtain the present invention and exempt to clean the product of being welded into that help.
Low solid-material content cleaning-free scaling powder of the present invention now has been applied to electronics printed board soldering technologies such as large-sized solor projection TV set, colour television set and black and white television set, and wetability is good on PCB, the rate of spread 〉=85%, and coating is even, and solderability is good; Solid content is low, and general＜3.5% can reach about 1.8%, and the postwelding surface clean is not stayed the residuals of any PCB of diminishing and electronic devices and components, need not to clean and can satisfy U.S. army mark MIL-P-28809A to the ion cleanliness requirement; Ionic pollution degree＜1.0ugNacl/cm
2, usually at 0.5ugNacl/cm
2About; Aridity is good, does not have corrosion, surface insulation resistance height, before and after the welding and surface insulation resistance 〉=3.0 * 10 of humiture Alternating Test
11Ω, every technical performance index is better than the specification requirement of Ministry of Electronics Industry's no-clean scaling powder tentative standard, reaches advanced world standards.In addition, avirulence, odorlessness, its price is low, is equivalent to 1/3rd of import like product price basically, and during use, existing welding equipment can be general, do not need to change, and only acquires a little and get final product.
Embodiment 1:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 1
Quickly penetrating agent OT 2
OP-10 10
Adipic acid 10
Decanedioic acid 8
Benzotriazole 1
Single stearic acid glycerine lipoprotein 0.1
Ethylene glycol monobutyl ether 55
Ethyl acetate 20
Ethanol 250
Isopropyl alcohol 642.9
The production method processing step
(1) ethanol is poured into enamel reaction still, adipic acid, decanedioic acid, benzotriazole and single stearic acid glycerine lipoprotein are added in the ethanol, add isopropyl alcohol and co-solvent ethylene gylcol monobutyl ether, ethyl acetate, emulsifier op-10, quickly penetrating agent OT and carbon fluorine ion surfactant again;
(2) under 60 ℃ of temperature conditions, stirred 30 minutes substantially, raw material is fully dissolved;
(3) after raw material fully dissolves, filter with 400 order screen packs;
(4) filtered fluid is inserted in the molten device of plastics, precipitate 24 hours;
(5) get the good supernatant of precipitation,, promptly make no-clean scaling powder of the present invention through packing.
The above-mentioned no-clean scaling powder that makes is colourless, and clear has no irritating odor, proportion 0.806g/ml, solid content 1.8%, ionic pollution degree＜0.5ugNacl/cm
2, the rate of spread 85%, postwelding insulaion resistance 4 * 10
11Ω, corrosivity, aridity are qualified.
Embodiment 2:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 4
Quickly penetrating agent OT 2
OP-10 7
Adipic acid 15
Decanedioic acid 5
Benzotriazole 1.5
Single stearic acid glycerine lipoprotein 0.5
Ethylene glycol monobutyl ether 30
Ethyl acetate 10
Ethanol 300
Isopropyl alcohol 625
The production method processing step is with embodiment 1, and wherein temperature is 70 ℃ in the step (2), and the sedimentation time is 30 hours in the step (4).
The no-clean scaling powder that this example makes, colourless, clear has no irritating odor, proportion 0.8082g/ml, solid content 2.0%, ionic pollution degree＜0.7ugNacl/cm
2, the rate of spread 86%, postwelding insulaion resistance 3.5 * 10
11Ω, corrosivity, aridity are qualified.
Embodiment 3:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 10
Quickly penetrating agent OT 2
OP-10 5
Adipic acid 20
Decanedioic acid 5
Benzotriazole 2
Single stearic acid glycerine lipoprotein 1
Ethylene glycol monobutyl ether 20
Ethyl acetate 40
Ethanol 350
Isopropyl alcohol 545
The production method processing step is with embodiment 1, and wherein temperature is 80 ℃ in the step (2), and the sedimentation time is 36 hours in the step (4).
The no-clean scaling powder that this embodiment makes, colourless, clear has no irritating odor, proportion 0.8162g/ml, solid content 2.5%, ionic pollution degree＜1.0ugNacl/cm
2, the rate of spread 89%, postwelding insulaion resistance 3.0 * 10
11Ω, corrosivity, aridity are qualified.
Claims (2)
1, a kind of low solid-material content cleaning-free scaling powder is characterized in that its prescription, and the raw material total amount is in 1000 weight portions, and each raw material and weight portion are:
Adipic acid 10-20
Decanedioic acid 5-10
Carbon fluorine ion surfactant 1-10
Quickly penetrating agent OT 2-10
OP-10 5-10
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.1-1
Ethylene glycol monobutyl ether 20-80
Ethyl acetate 10-50
Ethanol 250-350
The isopropyl alcohol surplus
2, scaling powder according to claim 1 is characterized in that each raw material and weight portion are:
Adipic acid 13-15
Decanedioic acid 6-8
Carbon fluorine ion surfactant 5-6
Quickly penetrating agent OT 4-6
OP-10 6-8
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.3-0.6
Ethylene glycol monobutyl ether 35-55
Ethyl acetate 30-40
Ethanol 300-350
The isopropyl alcohol surplus
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97106056A CN1087995C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97106056A CN1087995C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1209374A true CN1209374A (en) | 1999-03-03 |
| CN1087995C CN1087995C (en) | 2002-07-24 |
Family
ID=5168333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97106056A Expired - Fee Related CN1087995C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1087995C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| CN102049633A (en) * | 2010-07-13 | 2011-05-11 | 横店集团浙江英洛华电声有限公司 | Loudspeaker voice coil wire welding soldering flux and preparation method thereof |
| CN103846572A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel cleaning-free flux |
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN104384752A (en) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | Soldering flux applied to sensor |
| CN108274158A (en) * | 2018-02-02 | 2018-07-13 | 安阳师范学院 | No-clean scaling powder and preparation method thereof |
| CN110549036A (en) * | 2018-06-03 | 2019-12-10 | 湖北鹏林新材料科技有限公司 | Organic soldering flux and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
| DD278530A1 (en) * | 1988-12-23 | 1990-05-09 | Robotron Elektronik | RESIN FREE SOFT LOT FLUID |
| CN1042809C (en) * | 1994-04-06 | 1999-04-07 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| CN1049169C (en) * | 1995-03-16 | 2000-02-09 | 雒社教 | Cleaning-free scaling powder |
-
1997
- 1997-08-22 CN CN97106056A patent/CN1087995C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN102049633A (en) * | 2010-07-13 | 2011-05-11 | 横店集团浙江英洛华电声有限公司 | Loudspeaker voice coil wire welding soldering flux and preparation method thereof |
| CN102049633B (en) * | 2010-07-13 | 2012-07-04 | 横店集团浙江英洛华电声有限公司 | Loudspeaker voice coil wire welding soldering flux and preparation method thereof |
| CN103846572A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel cleaning-free flux |
| CN104384752A (en) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | Soldering flux applied to sensor |
| CN104384752B (en) * | 2014-09-23 | 2016-06-08 | 明光旭升科技有限公司 | A kind of soldering flux being applied to sensor |
| CN108274158A (en) * | 2018-02-02 | 2018-07-13 | 安阳师范学院 | No-clean scaling powder and preparation method thereof |
| CN110549036A (en) * | 2018-06-03 | 2019-12-10 | 湖北鹏林新材料科技有限公司 | Organic soldering flux and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1087995C (en) | 2002-07-24 |
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