CN1087996C - Low solid-material content cleaning-free scaling powder - Google Patents
Low solid-material content cleaning-free scaling powder Download PDFInfo
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- CN1087996C CN1087996C CN97106057A CN97106057A CN1087996C CN 1087996 C CN1087996 C CN 1087996C CN 97106057 A CN97106057 A CN 97106057A CN 97106057 A CN97106057 A CN 97106057A CN 1087996 C CN1087996 C CN 1087996C
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Abstract
The present invention relates to soldering flux with low solid content, which is mainly composed of adipic acid, butanedioic acid, surfactant, benzotriazole, monostearin, ethylene glycol monobutyl ether, butyl acetate, ethanol and isopropanol as raw materials. The present invention is prepared by a general conventional production technology. The soldering flux of the present invention has the advantages of high solderability, low solid content, no residues after soldering, low degree of contamination of ions, no corrosion, high degree of dryness, high degree of surface insulation, and low cost. All technical performance indexes of the present invention exceed the technical requirements of the soldering flux monitoring standard of the electronic industry.
Description
Technical field: the present invention relates to a kind of soldering and connect scaling powder, particularly a kind of no-clean scaling powder of low-solid content.
Background technology: in recent decades, in electronic product production soldering technical process, the abietic resin that general many uses are made up of activating agent, additive and the organic solvent of rosin, resin, halide is a scaling powder.Though this scaling powder solderability is good, cost is low,, the residual object height of postwelding.Its residue contains the chlorine particle, can go on foot problems such as causing electrical insulation properties decline and short circuit migration.Addressing this problem, must be that flux residue is cleaned to the abietic resin in the electronics printed board, not only can increase production cost, and to clean abietic resin be that the cleaning agent of flux residue mainly is the dichlorodifluoromethan compound.This compound is the loss material of atmospheric ozone layer, the row that belong to forbidding and be eliminated.Therefore, along with developing rapidly and demand of electron surface package technique, the no-clean scaling powder of novel low-solid content just arises at the historic moment.No-clean scaling powder run-of-the-mill of the prior art is relatively poor, and solderability is low, and aridity is poor, the solid content height, and postwelding still has residual, and the price comparison costliness, and certain toxicity and smell are arranged, and existing welding equipment is not general yet.
Summary of the invention: task of the present invention provides a kind of high-quality low-solid content scaling powder, this scaling powder solderability is good, easily dry, solid content is low, the postwelding noresidue, there is not corrosion, electrical insulation properties is good, avirulence and smell, and existing welding equipment is general, only increase equipment component slightly and get final product, thereby overcome the above-mentioned defective of existing in prior technology.Its technical scheme is: one, the prescription of scaling powder of the present invention, raw material total amount are in 1000 weight portions, and various raw materials and weight portion are:
Adipic acid 15-25
Succinic acid 3-10
Carbon fluorine ion surfactant 1-10
U.S. Tuo Masi amphoteric surfactant 6-10
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.1-1
Ethylene glycol monobutyl ether 20-80
Ethyl acetate 10-50
Ethanol 200-300
The isopropyl alcohol surplus
Preferred each raw material and weight portion are:
Adipic acid 18-22
Succinic acid 5-8
Carbon fluorine ion surfactant 2-5
U.S. Tuo Masi amphoteric surfactant 6-8
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.4-0.6
Ethylene glycol monobutyl ether 30-50
Ethyl acetate 20-30
Ethanol 250-280
The isopropyl alcohol surplus
Two, the production of low solid-material content cleaning-free scaling powder of the present invention can be adopted general conventional production method, and its processing step is as follows:
(1) adipic acid, succinic acid, benzotriazole, single stearic acid glycerine lipoprotein are added in the ethanol, add isopropyl alcohol, co-solvent ethylene gylcol monobutyl ether, ethyl acetate and carbon chlorion surfactant and U.S. Tuo Masi amphoteric surfactant again;
(2) under 60-80 ℃ of temperature conditions, stir, make raw material fully dissolve mixing;
(3) filter;
(4) precipitation:
(5) get the supernatant packing, promptly obtain the present invention and exempt to clean the product of being welded into that help.
Low solid-material content cleaning-free scaling powder of the present invention now has been applied to electronics printed board soldering technologies such as large-sized solor projection TV set, colour television set and black and white television set, and wetability is good on PCB, the rate of spread 〉=85%, and coating is even, and solderability is good; Solid content is low, and general＜3.5% can reach about 1.8%,
The postwelding surface clean is not stayed the residuals of any PCB of diminishing and electronic devices and components, need not to clean can satisfy U.S. army mark MIL-P-28809A to ion cleanliness requirement: ionic pollution degree＜1.0ugNacl/cm
2, usually at 0.5ugNacl/cm
2About; Aridity is good, does not have corrosion, surface insulation resistance height, before and after the welding and surface insulation resistance 〉=3.86 * 10 of humiture Alternating Test
11Ω, every technical performance index is better than the specification requirement of Ministry of Electronics Industry's no-clean scaling powder tentative standard, reaches advanced world standards.In addition, avirulence, odorlessness, its price is low, is equivalent to 1/3rd of import like product price basically, and during use, existing welding equipment can be general, do not need to change, and only acquires a little and get final product.
The specific embodiment: embodiment 1:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 1
U.S. Tuo Masi amphoteric surfactant 8
Adipic acid 15
Succinic acid 5
Benzotriazole 1
Single stearic acid glycerine lipoprotein 0.1
Ethylene glycol monobutyl ether 20
Ethyl acetate 10
Ethanol 200
Isopropyl alcohol 739.9
The production method processing step
(1) ethanol is poured into enamel reaction still, adipic acid, succinic acid, benzotriazole and single stearic acid glycerine lipoprotein are added in the ethanol, add isopropyl alcohol and co-solvent ethylene gylcol monobutyl ether, ethyl acetate and carbon fluorine ion surfactant, U.S. Tuo Masi amphoteric surfactant again;
(2) under 60 ℃ of temperature conditions, stirred 30 minutes substantially, raw material is fully dissolved;
(3) after raw material fully dissolves, filter with 400 order screen packs;
(4) filtered fluid is inserted in the molten device of plastics, precipitate 24 hours;
(5) get the good supernatant of precipitation,, promptly make no-clean scaling powder of the present invention through packing.
The above-mentioned no-clean scaling powder clear that makes, little yellow has no irritating odor, proportion 0.8058g/ml, solid content 2.0%, ionic pollution degree＜0.5ugNacl/cm
2, the rate of spread 85%, postwelding insulaion resistance 4.2 * 10
11Ω, corrosivity, aridity are qualified.
Embodiment 2:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 5
U.S. Tuo Masi amphoteric surfactant 10
Adipic acid 18
Succinic acid 6
Benzotriazole 1.5
Single stearic acid glycerine lipoprotein 0.5
Ethylene glycol monobutyl ether 50
Ethyl acetate 20
Ethanol 250
Isopropyl alcohol 639
The production method processing step is with embodiment 1, and wherein temperature is 70 ℃ in the step (2), and the sedimentation time is 30 hours in the step (4).
The no-clean scaling powder that this example makes, little yellow, clear has no irritating odor, proportion 0.810g/ml, solid content 2.4%, ionic pollution degree＜0.5ugNacl/cm
2, the rate of spread 87%, postwelding insulaion resistance 4.6 * 10
11Ω, corrosivity, aridity are qualified.
Embodiment 3:
Composition of raw materials (Kg)
Carbon fluorine ion surfactant 10
U.S. Tuo Masi amphoteric surfactant 5
Adipic acid 25
Succinic acid 8
Benzotriazole 2
Single stearic acid glycerine lipoprotein 1
Ethylene glycol monobutyl ether 80
Ethyl acetate 50
Ethanol 300
Isopropyl alcohol 519
The production method processing step is with embodiment 1, and wherein temperature is 80 ℃ in the step (2), and the sedimentation time is 36 hours in the step (4).
The no-clean scaling powder that this embodiment makes, little yellow, clear has no irritating odor, proportion 0.8310g/ml, solid content 3.3%, ionic pollution degree＜1.0ugNacl/cm
2, the rate of spread 90%, postwelding insulaion resistance 3.90 * 10
11Ω, corrosivity, aridity are qualified.
Claims (2)
1, a kind of low solid-material content cleaning-free scaling powder is characterized in that its prescription, and the raw material total amount is in 1000 weight portions, and each raw material and weight portion are:
Adipic acid 15-25
Succinic acid 3-10
Carbon fluorine ion surfactant 1-10
U.S. Tuo Masi amphoteric surfactant 6-10
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.1-1
Ethylene glycol monobutyl ether 20-80
Ethyl acetate 10-50
Ethanol 200-300
The isopropyl alcohol surplus
2, scaling powder according to claim 1 is characterized in that each raw material and weight portion are:
Adipic acid 18-22
Succinic acid 5-8
Carbon fluorine ion surfactant 2-5
U.S. Tuo Masi amphoteric surfactant 6-8
Benzotriazole 1-2
Single stearic acid glycerine lipoprotein 0.4-0.6
Ethylene glycol monobutyl ether 30-50
Ethyl acetate 20-30
Ethanol 250-280
The isopropyl alcohol surplus
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97106057A CN1087996C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97106057A CN1087996C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1209375A CN1209375A (en) | 1999-03-03 |
| CN1087996C true CN1087996C (en) | 2002-07-24 |
Family
ID=5168334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97106057A Expired - Fee Related CN1087996C (en) | 1997-08-22 | 1997-08-22 | Low solid-material content cleaning-free scaling powder |
Country Status (1)
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| CN (1) | CN1087996C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104439588B (en) * | 2013-09-24 | 2016-09-28 | 黄山市祁门鼎峰电子有限公司 | A kind of nitrogen-free welding procedure of rectifier bridge pin |
| CN108274158A (en) * | 2018-02-02 | 2018-07-13 | 安阳师范学院 | No-clean scaling powder and preparation method thereof |
| CN113547253A (en) * | 2020-04-23 | 2021-10-26 | 海太半导体（无锡）有限公司 | Soldering flux capable of catalyzing at low temperature |
| CN114535865A (en) * | 2020-11-26 | 2022-05-27 | 海太半导体（无锡）有限公司 | Soldering paste for flip chip |
| CN114535866A (en) * | 2020-11-26 | 2022-05-27 | 海太半导体（无锡）有限公司 | Soldering flux capable of catalyzing at low temperature |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
| DD278530A1 (en) * | 1988-12-23 | 1990-05-09 | Robotron Elektronik | RESIN FREE SOFT LOT FLUID |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
-
1997
- 1997-08-22 CN CN97106057A patent/CN1087996C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
| DD278530A1 (en) * | 1988-12-23 | 1990-05-09 | Robotron Elektronik | RESIN FREE SOFT LOT FLUID |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
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| Publication number | Publication date |
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| CN1209375A (en) | 1999-03-03 |
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