CN113547253A - Soldering flux capable of catalyzing at low temperature - Google Patents
Soldering flux capable of catalyzing at low temperature Download PDFInfo
- Publication number
- CN113547253A CN113547253A CN202010324551.9A CN202010324551A CN113547253A CN 113547253 A CN113547253 A CN 113547253A CN 202010324551 A CN202010324551 A CN 202010324551A CN 113547253 A CN113547253 A CN 113547253A
- Authority
- CN
- China
- Prior art keywords
- parts
- surfactant
- triethanolamine
- soldering flux
- ethanol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 21
- 238000005476 soldering Methods 0.000 title abstract description 19
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004094 surface-active agent Substances 0.000 claims abstract description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 17
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000001361 adipic acid Substances 0.000 claims abstract description 11
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 11
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 230000003197 catalytic effect Effects 0.000 claims abstract description 6
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 5
- -1 15-20 parts Chemical compound 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000001384 succinic acid Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000007524 organic acids Chemical group 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
The invention discloses a soldering flux which can be catalyzed at low temperature, comprising succinic acid, adipic acid, triethanolamine, a surfactant and ethanol; the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows: succinic acid, 200-300 parts, adipic acid, 15-20 parts, triethanolamine, 50-100 parts, surfactant, 10-15 parts, and ethanol, 300-400 parts, wherein the addition of triethanolamine lowers the catalytic point temperature of the soldering flux, thereby greatly reducing the heat energy consumption of the injection molding engineering.
Description
Technical Field
The invention belongs to the field of soldering tin, and particularly relates to a soldering flux capable of being catalyzed at a low temperature.
Background
During ball planting engineering, the existing welding needs to be carried out at 220-250 ℃, the soldering flux can play a role, the balls are melted and welded, the overall heat energy consumption of the engineering is very high, and the danger coefficient is very high.
Since the surface of the metal workpiece to be welded is contaminated with oxides, dust, and the like, which inhibit the mutual diffusion of the metal of the workpiece base and the solder in an atomic state, it is necessary to remove the oxides and the like to clean the surface and expose the metal base, but the atoms on the surface of the metal base to be cleaned are immediately oxidized in the atmosphere, and the oxidation speed is higher at the welding temperature. The flux is added during the soldering process to help provide metal surfaces without oxide layers and to maintain the oxide-free state of these surfaces until the solder and metal surfaces complete the soldering process. Meanwhile, the chemical action of the flux is utilized to combine with the oxide on the surface of the welded metal to form a liquid-state table object at the welding temperature, so that the metal atoms on the surface of the welded metal part and the atoms of the molten solder are diffused mutually to achieve the purpose of soldering connection. The flux also promotes solder flow and spreading during soldering, and affects the balance of the solder surface tension in the direction of solder spreading by reducing surface irregularities.
In addition to chemical activity, an ideal flux also needs to have good thermal stability, adhesion, spreading force, electrolytic activity, environmental stability, chemical functional groups and their reaction characteristics, rheological characteristics, adaptability to general cleaning solutions and equipment, and the like. The above functions of the flux are achieved by the action of the components such as an activator, a solvent, a surfactant, etc. therein.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a low-temperature catalytic soldering flux.
The technical problem to be solved by the invention is to provide the soldering flux which can be catalyzed at low temperature.
The purpose of the invention can be realized by the following technical scheme:
a low-temperature catalytic soldering flux comprises succinic acid, adipic acid, triethanolamine, a surfactant and ethanol;
the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows:
the succinic acid is 200-300, and the content of the succinic acid is 200-300,
15-20 parts of adipic acid, namely,
50-100 parts of triethanolamine, namely triethanolamine,
10-15 parts of a surface active agent,
ethanol 300-.
The invention has the beneficial effects that:
the addition of triethanolamine reduces the temperature of the catalytic point of the soldering flux, thereby greatly reducing the heat energy consumption of the injection molding engineering.
Detailed Description
The technical scheme of the invention is further described as follows:
a low-temperature catalytic soldering flux comprises succinic acid, adipic acid, triethanolamine, a surfactant and ethanol;
the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows:
succinic acid, 200-
The weight ratio of adipic acid, 15-20,
50-100 parts of triethanolamine, namely triethanolamine,
surfactant, 10-15
Ethanol 300-.
The low-temperature soldering flux is organic acid active substance soldering flux, the main active substances of the low-temperature soldering flux are succinic acid and a small amount of adipic acid, triethanolamine is used as an acid-base regulator, and a fluorocarbon surfactant is added.
Succinic acid, colorless crystals, melting point 185 deg.C, boiling point 235 deg.C (decomposed into anhydride).
Adipic acid: boiling point 265 deg.C, melting point 151 deg.C, 153 deg.C
Triethanolamine: the molecular formula is as follows: n (CH 2OH)3 physicochemical properties: colorless and viscous liquid at normal temperature, slightly ammoniacal smell, and easily soluble in water and ethanol. Copper, aluminum and alloys thereof can be corroded. Liquids and vapors corrode the skin and eyes. Can react with various acids to generate ester and amide salts. The boiling point is 360.0 ℃, the melting point is 21.2 ℃, and the surfactant also has the function of physical and chemical properties.
Although some compounded organic acid activator is added, because triethanolamine is added to adjust the pH value, after various substances are mixed, part of the substances react, and the substances have the activity of acid only at a certain temperature.
According to the main material properties, the welding temperature can be reduced, and the main active materials of succinic acid and adipic acid which do not participate in the reaction can volatilize. The triethanolamine is not completely volatilized, and the whole residual components are alkaline.
Finally, it should be noted that:
the method may be carried out and its application may be carried out by those skilled in the art with reference to the disclosure herein, and it is expressly intended that all such alternatives and modifications as would be apparent to those skilled in the art are deemed to be included within the invention. While the method and application of the present invention have been described in terms of preferred embodiments, it will be apparent to those of ordinary skill in the art that variations and modifications in the method and application of the invention as described herein may be made and equivalents employed without departing from the spirit and scope of the invention.
Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that: modifications and equivalents may be made thereto without departing from the spirit and scope of the invention, and the appended claims are intended to cover such modifications and equivalents as fall within the true spirit and scope of the invention.
Claims (2)
1. A low-temperature catalytic flux is characterized in that: comprises succinic acid, adipic acid, triethanolamine, surfactant and ethanol;
the total amount of the raw materials is 1000 parts by weight, and the raw materials comprise the following components in parts by weight:
succinic acid, 200-
The weight ratio of adipic acid, 15-20,
50-100 parts of triethanolamine, namely triethanolamine,
surfactant, 10-15
Ethanol 300-.
2. The flux of claim 1, wherein: the surfactant is a fluorocarbon surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324551.9A CN113547253A (en) | 2020-04-23 | 2020-04-23 | Soldering flux capable of catalyzing at low temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324551.9A CN113547253A (en) | 2020-04-23 | 2020-04-23 | Soldering flux capable of catalyzing at low temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113547253A true CN113547253A (en) | 2021-10-26 |
Family
ID=78100952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010324551.9A Pending CN113547253A (en) | 2020-04-23 | 2020-04-23 | Soldering flux capable of catalyzing at low temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113547253A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9219903D0 (en) * | 1990-05-04 | 1992-11-04 | Delco Electronics Corp | Low-residue soldering flux |
| CN1209375A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| CN102114582A (en) * | 2009-12-30 | 2011-07-06 | 郑建国 | Water-soluble flux based on ceramic condenser soldering |
| CN103785973A (en) * | 2014-02-20 | 2014-05-14 | 苏州龙腾万里化工科技有限公司 | Scaling powder for low-temperature halogen-free low-solid-content lead-free tin soldering |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
| CN107378313A (en) * | 2017-08-01 | 2017-11-24 | 东莞市盟纬电子有限公司 | A kind of low-solid content is without rosin halogen-free scaling powder and preparation method thereof |
| CN108817731A (en) * | 2018-07-04 | 2018-11-16 | 中原工学院 | A kind of low temperature, Halogen, low-solid content modified rosin type scaling powder and preparation method |
| CN109940311A (en) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | A kind of low-temperature catalyzed scaling powder |
-
2020
- 2020-04-23 CN CN202010324551.9A patent/CN113547253A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9219903D0 (en) * | 1990-05-04 | 1992-11-04 | Delco Electronics Corp | Low-residue soldering flux |
| CN1209375A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| CN102114582A (en) * | 2009-12-30 | 2011-07-06 | 郑建国 | Water-soluble flux based on ceramic condenser soldering |
| CN103785973A (en) * | 2014-02-20 | 2014-05-14 | 苏州龙腾万里化工科技有限公司 | Scaling powder for low-temperature halogen-free low-solid-content lead-free tin soldering |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
| CN107378313A (en) * | 2017-08-01 | 2017-11-24 | 东莞市盟纬电子有限公司 | A kind of low-solid content is without rosin halogen-free scaling powder and preparation method thereof |
| CN109940311A (en) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | A kind of low-temperature catalyzed scaling powder |
| CN108817731A (en) * | 2018-07-04 | 2018-11-16 | 中原工学院 | A kind of low temperature, Halogen, low-solid content modified rosin type scaling powder and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211026 |
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| RJ01 | Rejection of invention patent application after publication |