US4708751A - Halogen-free foam fluxes - Google Patents
Halogen-free foam fluxes Download PDFInfo
- Publication number
- US4708751A US4708751A US06/790,618 US79061885A US4708751A US 4708751 A US4708751 A US 4708751A US 79061885 A US79061885 A US 79061885A US 4708751 A US4708751 A US 4708751A
- Authority
- US
- United States
- Prior art keywords
- weight
- foaming agent
- fluxes
- foam
- rosin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
Description
______________________________________ Adipic acid 1.5% by weight Sebacic acid 0.5% by weight Polyethyleneglycol monolaurate 1.2% by weight Rosin 0.8% by weight Total contents of solids and foaming agent 4.0% by weight Propanol-2 50.0% by weight Ethanol 46.0% by weight ______________________________________
______________________________________ Succinic acid 1.6% by weight Sebacic acid 0.6% by weight Polyethoxyalkanol 1.5% by weight Rosin 1.0% by weight Total contents of solids and foaming agent 5.7% by weight Propanol-2 45.0% by weight Ethanol 44.3% by weight Ethoxyethanol 5.0% by weight ______________________________________
______________________________________ Adipic acid 1.2% by weight Suberic acid 0.8% by weight Hexylene glycol 1.6% by weight Rosin 0.4% by weight Total contents of solids and foaming agent 4.0% by weight Propanol-2 80.0% by weight n-Propanol 16.0% by weight ______________________________________
______________________________________ Adipic acid 1.0% by weight Suberic acid 1.0% by weight Polyethylene glycol 200 1.3% by weight Rosin 0.7% by weight Total contents of solids and foaming agent 4.0% by weight Propanol-2 75.0% by weight n-Propanol 16.0% by weight 2-(2-n-Butoxyethoxy)ethanol 5.0% by weight ______________________________________
______________________________________ Adipic acid 1.6% by weight Sebacic acid 0.4% by weight Polyethoxyalkanol 1.5% by weight Polywax 2000 (a polyethyleneoxide wax) 0.5% by weight Total contents of solids and foaming agent 4.0% by weight Propanol-2 75.0% by weight Ethoxyethanol 7.5% by weight Ethanol 13.5% by weight ______________________________________
______________________________________ Citric acid 2.0% by weight Fumaric acid 0.5% by weight Polyethyleneglycol monolaurate 1.0% by weight Oxide wax A (a polyoxyalkylene wax) 1.5% by weight Total contents of solids and foaming agent 5.0% by weight n-Propanol 40.0% by weight Ethyleneglycol 15.0% by weight 2-Butoxyethanol 10.0% by weight Propanol-2 30.0% by weight ______________________________________
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3445624 | 1984-12-14 | ||
DE3445624 | 1984-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
US4708751A true US4708751A (en) | 1987-11-24 |
Family
ID=6252769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/790,618 Expired - Lifetime US4708751A (en) | 1984-12-14 | 1985-10-23 | Halogen-free foam fluxes |
Country Status (5)
Country | Link |
---|---|
US (1) | US4708751A (en) |
EP (1) | EP0184825B1 (en) |
JP (1) | JPS61144294A (en) |
AT (1) | ATE62435T1 (en) |
DE (1) | DE3582482D1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4838478A (en) * | 1987-04-23 | 1989-06-13 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free flux mixture and use thereof |
US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
WO1992005008A1 (en) * | 1990-09-17 | 1992-04-02 | Motorola, Inc. | Method of cleaning printed circuit boards using water |
US5198038A (en) * | 1990-05-15 | 1993-03-30 | Hughes Aircraft Company | Foaming flux for automatic soldering process |
US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5334260A (en) * | 1993-02-05 | 1994-08-02 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
WO1994017950A1 (en) * | 1993-02-05 | 1994-08-18 | Krystyna Stefanowski | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5452840A (en) * | 1990-05-15 | 1995-09-26 | Hughes Aircraft Company | Water-soluble soldering flux |
US5549239A (en) * | 1992-02-12 | 1996-08-27 | Norsk Hydro A.S | Method of providing particle retaining metal surfaces and flux retaining metal components |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
EP0974419A2 (en) * | 1998-07-24 | 2000-01-26 | Oatey Company | Water soluble fluxes and methods of using the same |
CN1087996C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
CN1087995C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
US6752309B1 (en) | 1999-07-22 | 2004-06-22 | Oatey Co. | Water soluble fluxes and methods of using the same |
US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6254595A (en) * | 1985-09-03 | 1987-03-10 | Uchihashi Kinzoku Kogyo Kk | Flux |
BE1002430A3 (en) * | 1988-02-16 | 1991-02-05 | Interflux Electronics Bv Met B | Soldering flux |
DE4402758A1 (en) * | 1994-01-31 | 1995-08-03 | Moedinger Volker | Method for applying fluxing agent to PCBs |
US8814522B2 (en) | 2007-06-15 | 2014-08-26 | Cymer, Llc | Cross-flow fan impeller for a transversley excited, pulsed, gas discharge laser |
JP6310027B2 (en) * | 2015-09-30 | 2018-04-11 | 株式会社タムラ製作所 | Flux composition for soldering, method for producing solar cell module, and method for producing electronic substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4042731A (en) * | 1975-11-06 | 1977-08-16 | E. I. Du Pont De Nemours And Company | Foaming agents for galvanizing fluxes |
US4216035A (en) * | 1977-12-23 | 1980-08-05 | International Business Machines Corporation | Removable protective coating and process of using same |
US4278479A (en) * | 1980-06-18 | 1981-07-14 | Hughes Aircraft Company | Organic acid activated liquid solder flux |
US4428780A (en) * | 1983-02-07 | 1984-01-31 | Lake Chemical Co. | Solutions for use in bonding plates of storage batteries to connecting systems |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3723191A (en) * | 1971-03-09 | 1973-03-27 | Philips Corp | Soldering flux composition |
CH596935A5 (en) * | 1975-09-10 | 1978-03-31 | Standard Telephon & Radio Ag | Flux for use in soldering e.g. printed circuits |
DE2828197A1 (en) * | 1978-06-27 | 1980-01-03 | Winchester Electronics Gmbh | Halogen free colophonium based soft solder flux - also contains satd. aliphatic di:carboxylic acid, di:ethanolamine and water-miscible alkanol |
DE2921827B2 (en) * | 1979-05-29 | 1981-06-04 | Winchester Electronics Gmbh, 7100 Heilbronn | Halogen-free flux for soft soldering based on rosin |
CH653939A5 (en) * | 1982-04-07 | 1986-01-31 | Landis & Gyr Ag | METHOD FOR MACHINING SOFT SOLDERING OF HEAVY METALS USING A FLUID. |
-
1985
- 1985-10-23 US US06/790,618 patent/US4708751A/en not_active Expired - Lifetime
- 1985-11-19 JP JP60257899A patent/JPS61144294A/en active Granted
- 1985-12-10 AT AT85115738T patent/ATE62435T1/en not_active IP Right Cessation
- 1985-12-10 DE DE8585115738T patent/DE3582482D1/en not_active Expired - Lifetime
- 1985-12-10 EP EP85115738A patent/EP0184825B1/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4042731A (en) * | 1975-11-06 | 1977-08-16 | E. I. Du Pont De Nemours And Company | Foaming agents for galvanizing fluxes |
US4216035A (en) * | 1977-12-23 | 1980-08-05 | International Business Machines Corporation | Removable protective coating and process of using same |
US4278479A (en) * | 1980-06-18 | 1981-07-14 | Hughes Aircraft Company | Organic acid activated liquid solder flux |
US4428780A (en) * | 1983-02-07 | 1984-01-31 | Lake Chemical Co. | Solutions for use in bonding plates of storage batteries to connecting systems |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4838478A (en) * | 1987-04-23 | 1989-06-13 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free flux mixture and use thereof |
US5198038A (en) * | 1990-05-15 | 1993-03-30 | Hughes Aircraft Company | Foaming flux for automatic soldering process |
US5452840A (en) * | 1990-05-15 | 1995-09-26 | Hughes Aircraft Company | Water-soluble soldering flux |
US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
WO1992005008A1 (en) * | 1990-09-17 | 1992-04-02 | Motorola, Inc. | Method of cleaning printed circuit boards using water |
US5549239A (en) * | 1992-02-12 | 1996-08-27 | Norsk Hydro A.S | Method of providing particle retaining metal surfaces and flux retaining metal components |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
WO1994011148A1 (en) * | 1992-11-19 | 1994-05-26 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
WO1994017950A1 (en) * | 1993-02-05 | 1994-08-18 | Krystyna Stefanowski | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5334260A (en) * | 1993-02-05 | 1994-08-02 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
CN1087996C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
CN1087995C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
EP0974419A2 (en) * | 1998-07-24 | 2000-01-26 | Oatey Company | Water soluble fluxes and methods of using the same |
EP0974419A3 (en) * | 1998-07-24 | 2003-10-15 | Oatey Company | Water soluble fluxes and methods of using the same |
US6752309B1 (en) | 1999-07-22 | 2004-06-22 | Oatey Co. | Water soluble fluxes and methods of using the same |
US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
Also Published As
Publication number | Publication date |
---|---|
EP0184825B1 (en) | 1991-04-10 |
JPS61144294A (en) | 1986-07-01 |
EP0184825A2 (en) | 1986-06-18 |
EP0184825A3 (en) | 1988-08-10 |
DE3582482D1 (en) | 1991-05-16 |
ATE62435T1 (en) | 1991-04-15 |
JPH0149599B2 (en) | 1989-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ALPHA GRILLO-LOTSYSTEME GMBH BUSCHSTRASSE 95, 4100 Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:FROEBEL, GERD;STANG, HANS W.;REEL/FRAME:004472/0167 Effective date: 19851016 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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Year of fee payment: 4 |
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FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FPAY | Fee payment |
Year of fee payment: 8 |
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AS | Assignment |
Owner name: ALPHA METALS LOTSYSTEME GMBH, GERMANY Free format text: CHANGE OF NAME;ASSIGNOR:ALPHA-GRILLO LOTSYSTEME GMBH;REEL/FRAME:007927/0931 Effective date: 19950602 |
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FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FPAY | Fee payment |
Year of fee payment: 12 |