CN1049169C - Cleaning-free scaling powder - Google Patents
Cleaning-free scaling powder Download PDFInfo
- Publication number
- CN1049169C CN1049169C CN95102236A CN95102236A CN1049169C CN 1049169 C CN1049169 C CN 1049169C CN 95102236 A CN95102236 A CN 95102236A CN 95102236 A CN95102236 A CN 95102236A CN 1049169 C CN1049169 C CN 1049169C
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- organic
- soldering flux
- cleaning
- carbon atoms
- flux
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Abstract
The present invention relates to a cleaning-free soldering flux. The cleaning-free soldering flux is liquid soldering flux which is made by quantitatively mixing deionized water, organic monoalcohol of which the contained number of carbon atoms is smaller than 5, organic dibasic acid or hydroxylated organic acid, polyatomic organic alcohol containing 3 to 7 carbon atoms, water-soluble polymer, alkyl phosphate containing 3 to 8 carbon atoms, or surfactant F501. The detected result shows that the main technical indexes of the soldering flux, such as the rate of expansion, the halogen containing amount, the ion contamination degree, the copper corrosion test, etc., conform to the standards issued by the ministry in the department of electronic industry. The tried result shows that the present invention has the advantages that no penetrating odor volatilizes during soldering, printed circuit boards do not need to be cleaned after soldered, the soldering quality is high, etc.
Description
The invention belongs to the selection technical field of soldering paste composition.
At present at the most abietyl solder flux that adopt of the used solder flux of the welding procedure of printed circuit board and electronic component, this solder flux has certain corrosivity to electronic component, directly has influence on the quality of electronic product, during welding, because rosin at high temperature volatilizees, smell is very big, influences health of operators, after the welding, on printed wiring board, leave over rosin residue down, also need clean, increased operation.Once the someone invented the NCF rinse-free flux, but because of contain camphor in its component, smell is very big during welding, still have the vestige of solder flux after the welding, this product belongs to inflammable thing again, transports very difficult, and the cost height, selling price is expensive, makes that this solder flux can not be by wide popularization and application.
The objective of the invention is to overcome the shortcoming of above-mentioned solder flux, provide a kind of and help that the weldering performance is good, welding the time does not have the pernicious gas volatilization, the no vestige in welding back, low, the low-cost liquid flux of cost.
For achieving the above object, the solution that the present invention adopts is that the component with following proportioning is the rinse-free flux that mixed raw material becomes:
Deionized water 20～35%
Contain the following organic single alcohol 60～75% of 5 C
Organic dibasic acid or hydroxylating organic acid 0.5～5%
Contain polynary organic pure 0.1～03% of 3 to 7 C
The polyhydric alcohol polymer 0.1～03% that contains 2 to 3 C
The straight chain alkylphosphonate or the surfactant F501 0.1～0.5% that contain 3 to 8 C
In above-mentioned proportioning, organic dibasic acid or hydroxylating organic acid with contain the straight chain alkylphosphonate of 3 to 8 C or the weight ratio of surfactant F501 is 5～20: 1.
The present invention detects through electronics industry proprietary material quality monitoring inspection center of Ministry of Machine-building and Electronics Industry, its rate of spread, halogen-containing amount, ionic pollution degree, the key technical indexes such as copper corrosion test reach Ministry of Electronics Industry's tentative standard, and it is on probation through No.20 Inst., Minstry of Electronics Industry, the present invention compares with the NCF rinse-free flux with rosin flux, the cleannes of printed board have been improved, the solder joint qualification rate reaches 99%, do not volatilize penetrating odor during welding, solder joint is full, have and exempt to clean, have no irritating odor, advantages such as welding quality is good can extensively be promoted the use of in electronics industry enterprise.
The inventor has provided used raw material and the proportioning thereof of first embodiment of the invention (is example for 100 kilograms with production product of the present invention):
Deionized water 24.2kg
Isopropyl alcohol 70kg
Ketoglutaric acid 5kg
Glycerine 0.2kg
Polyvinyl alcohol 10 0.2kg
Surfactant 501 0.4kg
Its preparation technology is:
Stainless steel cauldron is cleaned airing.Press the proportioning weighing of each component of present embodiment, earlier deionized water, isopropyl alcohol are joined in the reactor, again other raw material are joined in the reactor successively, with the stainless steel mixer be stirred well to solution be transparent even till, left standstill 4 hours, through packing after the assay was approved.
The inventor has provided used raw material and the proportioning thereof of second embodiment of the invention (is example with production product l00 of the present invention kilogram):
Deionized water 30.5kg
Ethanol 65kg
Camphoric acid 3.5kg
Glycerine 0.2kg
Polyethylene glycol 10 0.4kg
Dioctylphosphoric acid ester 0.4kg
Its preparation technology and first embodiment are identical.
The inventor adopts the rinse-free flux of first embodiment of the invention preparation to entrust electronics industry proprietary material quality monitoring inspection center of Ministry of Machine-building and Electronics Industry to detect by the GB9491-88 standard, and testing result is as follows:
Solid contents (%) 3.28
Halogen-containing amount (%)＜0.01
Hydrotrope resistivity (Ω cm) 3.1 * 10
4
The rate of spread (%) 81.28
Ionic pollution degree (NaCl amount μ g/cm
2) 0.61
Outward appearance has similar Radix Glycyrrhizae flavor, colourless, transparent, even, free from admixture, nothing
Precipitation, no foreign matter
Copper corrosion test is qualified
Insulaion resistance (Ω) 3.31 * 10 before the weldering
9
Postwelding insulaion resistance (Ω) 8.02 * 10
10
The inventor adopts the rinse-free flux of first embodiment of the invention preparation to entrust No.20 Inst., Minstry of Electronics Industry to try out, and operating position is as follows:
Adopt DCB2f-250 type induction electromagnetic pump wave-soldering unit, weld totally 3000 of five kinds of specifications of two batches of B ultrasonic machine printed circuit boards, various density all have, wherein 566 solder joints of logic card integrated circuit, 144 solder joints such as discrete component plug, seat have 710 solder joints.More than 200 of dual platen transitional pores, minimum spacing is 1mm.More than 200 of channel plate discrete components, 495 of solder joints, more than 100 of transitional pores.Display board, power panel, three kinds of printed boards of drive plate, the pad size all has, and density is general, more than totally 300 of components and parts, connector more than 20 individual totally 800 solder joints.Five kinds of printed boards have 2005 solder joints, and more than 450 of transitional pores add up to 2455 solder joints, welding 600 cover, totally 1473000 solder joints.Have no irritating odor during welding, need not clean printed wiring board after the welding, the qualification rate of solder joint reaches 99%.
Claims (1)
1. rinse-free flux is characterized in that it is that component with following proportioning is the liquid flux that mixed raw material becomes:
Deionized water 20～35%
Contain the following organic single alcohol 60～75% of 5 C
Organic dibasic acid or hydroxylating organic acid 0.5～5%
Contain polynary organic pure 0.1～0.5% of 3 to 7 C
The polyhydric alcohol polymer 0.1～0.5% that contains 2 to 3 C
The straight chain alkylphosphonate or the surfactant F501 0.1～0.5% that contain 3 to 8 C
In above-mentioned proportioning, organic dibasic acid or hydroxylating organic acid with contain the straight chain alkylphosphonate of 3 to 8 C or the weight ratio of surfactant F501 is 5～20: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95102236A CN1049169C (en) | 1995-03-16 | 1995-03-16 | Cleaning-free scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95102236A CN1049169C (en) | 1995-03-16 | 1995-03-16 | Cleaning-free scaling powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1131076A CN1131076A (en) | 1996-09-18 |
| CN1049169C true CN1049169C (en) | 2000-02-09 |
Family
ID=5074238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95102236A Expired - Fee Related CN1049169C (en) | 1995-03-16 | 1995-03-16 | Cleaning-free scaling powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1049169C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325223C (en) * | 2003-04-25 | 2007-07-11 | 李�荣 | Soldering flux in use for iron weldment |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087996C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| CN1087995C (en) * | 1997-08-22 | 2002-07-24 | 李圣波 | Low solid-material content cleaning-free scaling powder |
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| CN100352598C (en) * | 2003-07-03 | 2007-12-05 | 梁树华 | Wash-free film forming water-based type welding flux |
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| CN101352789B (en) * | 2008-09-12 | 2011-01-12 | 上海华实纳米材料有限公司 | Non-halogen scaling powder for leadless solder |
| US8554579B2 (en) | 2008-10-13 | 2013-10-08 | Fht, Inc. | Management, reporting and benchmarking of medication preparation |
| CN101890596A (en) * | 2010-07-23 | 2010-11-24 | 深圳市亿铖达工业有限公司 | Low-carbon environmentally-friendly water-based soldering flux |
| EP3453377A1 (en) | 2012-10-26 | 2019-03-13 | Baxter Corporation Englewood | Improved work station for medical dose preparation system |
| EP3346444B1 (en) | 2012-10-26 | 2020-09-23 | Baxter Corporation Englewood | Improved image acquisition for medical dose preparation system |
| US11367533B2 (en) | 2014-06-30 | 2022-06-21 | Baxter Corporation Englewood | Managed medical information exchange |
| US11575673B2 (en) | 2014-09-30 | 2023-02-07 | Baxter Corporation Englewood | Central user management in a distributed healthcare information management system |
| US11107574B2 (en) | 2014-09-30 | 2021-08-31 | Baxter Corporation Englewood | Management of medication preparation with formulary management |
| SG11201704359VA (en) | 2014-12-05 | 2017-06-29 | Baxter Corp Englewood | Dose preparation data analytics |
| JP2018507487A (en) | 2015-03-03 | 2018-03-15 | バクスター・コーポレーション・イングルウッドＢａｘｔｅｒ Ｃｏｒｐｏｒａｔｉｏｎ Ｅｎｇｌｅｗｏｏｄ | Pharmacy workflow management with alert integration |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0413312A1 (en) * | 1989-08-16 | 1991-02-20 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| WO1994011148A1 (en) * | 1992-11-19 | 1994-05-26 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| EP0619162A2 (en) * | 1993-04-05 | 1994-10-12 | Takeda Chemical Industries, Ltd. | Soldering flux |
-
1995
- 1995-03-16 CN CN95102236A patent/CN1049169C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0413312A1 (en) * | 1989-08-16 | 1991-02-20 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| WO1994011148A1 (en) * | 1992-11-19 | 1994-05-26 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| CN1088865A (en) * | 1992-11-19 | 1994-07-06 | 弗赖伊金属公司 | No-clean flux and method of use thereof |
| EP0619162A2 (en) * | 1993-04-05 | 1994-10-12 | Takeda Chemical Industries, Ltd. | Soldering flux |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325223C (en) * | 2003-04-25 | 2007-07-11 | 李�荣 | Soldering flux in use for iron weldment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1131076A (en) | 1996-09-18 |
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